LG 55LB6500-UM Schematic
Internal Use Only
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
LED TV
SERVICE MANUAL
CHASSIS : LA42B
MODEL : 55LB6500 55LB6500-UM
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL68045202(1401-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION .............................................................. 13
EXPLODED VIEW .................................................................................. 24
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
1. Application range
1) This spec sheet is applied all of the 32”, 42”, 47”, 50”, 55”,
60”, 65”, 70” LED TV with LA42A/B chassis.
2) Not included spec and each product spec in this spec sheet
apply correspondin gly to the fol lowing each country
standard and requirement of Buyer
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 20 ºC ± 5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Market Input voltage Frequency Remark
USA 110~240V 50/60Hz Standard Voltage of each
product is marked by
models
4) Specification and performance of each parts are followed
ea ch drawing and s pe cificatio n b y p art number in
accordance with BOM
5) The receiver must be operated for about 20 minutes prior to
the adjustment
.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, CE, IEC specification
- EMC: FCC, ICES, CE, IEC specification
- Wireless : Wireless HD Specification (Option)
Only for training and service purposes
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4. General Specification
No Item Specication Remark
1 Receiving System ATSC / NTSC-M / 64 QAM / 256 QAM
2 Available Channel 1) VHF : 02~13
3 Input Voltage 1AC 100 ~ 240V@ 50/60Hz AC 120V, 50/60Hz on the label (USA)
4 Input Voltage AC 220 - 240V ~ 60Hz
5 Aspect Ratio 16:9
6 Tuning System FS
7 LCD Module LC550DUH-PGF1 FHD 55.0INCH
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
1920X1080 450CD COLOR 72% 16/9
1300:1 120Hz Inverter N LED 3D(FPR)
W/O T-con, 72.4W, 8bit, 10000K, 178/178
8ms LG Display Co., Ltd.
LC550EUH-LGF1 FHD 55.0INCH
1920X1080 450CD COLOR 72% 16/9
1300:1 120Hz Inverter N LED 3D(FPR)
68.1W, 8Bit, 10000K, 178/178, 8ms LG
Display Co., Ltd.
HC700CUF-VHHD1 FHD 70INCH
1920X1080 400CD COLOR 72% 16/9
5000:1 120Hz - - - TBD HEESUNG ELECTRONICS LTD.
LC600DUF-FGF1 FHD 60INCH
1920X1080 450CD COLOR 68% 16/9
1600:1 240Hz(T) Inverter N LED 3D(FPR)
W/T-con 83.2W 8Bit 10000k 178/178
6ms(GTG)_HS_PJ(Dark Titan) LG Display
Co., Ltd.
LC420DUH-FGP1 FHD 42.0INCH
1920X1080 300CD COLOR 68% 16/9
1600:1 120Hz Inverter N LED 3D(FPR)
W.O/T-con 41W 8Bit 10000k 178/178
6ms(GTG)_nOTS LG Display Co., Ltd.
T420HVJ01.0 FHD 42INCH 1920X1080
300CD COLOR 72% 16/9 3000:1 - - - TBD AU OPTRONICS CORP
LC470DUH-FGP1 FHD 47INCH
1920X1080 300CD COLOR 68% 16/9
1600:1 120Hz Inverter N LED 3D(FPR)
W.O/T-con 50.8W 8Bit 10000k 178/178
6ms(GTG)_nOTS LG Display Co., Ltd.
LC550DUH-FGA2 FHD 55.0INCH
1920X1080 300CD COLOR 68% 16/9
1600:1 120Hz Inverter N LED 2D
W.O/T-con 64.2W 8Bit 10000k 178/178
6ms(GTG)_HS(Light Silver) LG Display
Co., Ltd.
LGD LC550DUH-PGF1 55LB7200-UB
LGD 55LB8700-UA
Sharp HC700CUF-VHHD1
HC700CUF-VHHD2
LGD LC600DUF-FGF1 60LB7100-UT
LGD LC420DUH-FGP1 42LB6500-UM
AUO T420HVJ01.1 42LB6500-UM
LGD LC470DUH-FGP1 47LB6500-UM
LGD LC550DUH-FGA2 55LB6300-UQ
70LB7100-UC
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
No Item Specication Remark
10 Operating Environ-
ment
11 Storage Environ-
ment
LC550DUH-FGP1 FHD 55.0INCH
1920X1080 330CD COLOR 68% 16/9
1600:1 120Hz Inverter N LED 3D(FPR)
W.O/T-con 64.2W 8Bit 10000k 178/178
6ms(GTG)_HS LG Display Co., Ltd.
LC650DUF-FGF1 FHD 65INCH
1920X1080 450CD COLOR 68% 16/9
1600:1 240Hz(T) Inverter N LED 3D(FPR)
W/T-con 117.2W 8Bit 10000k 178/178
6ms(GTG)_HS_PJ(Dark Titan) LG Display
Co., Ltd.
1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
LGD LC550DUH-FGP1 55LB6500-UM
LGD LC650DUF-FGF1 65LB7100-UC, 65LB7100-UB
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Supported video resolutions
5.1. Component 2D input(Y, CB/PB, CR/PR)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.50 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.0 SDTV 480P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 33.75 60.00 74.25 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 67.50 60 148.50 HDTV 1080P
10. 1920*1080 67.432 59.94 148.352 HDTV 1080P
5.2. Component 3D input(Y, CB/PB, CR/PR)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock 3D input proposed mode Proposed
1. 1280*720 45.00 60.00 74.25 2D to 3D,Side by Side, Top and Bottom HDTV 720P
2. 1280*720 44.96 59.94 74.176 2D to 3D,Side by Side, Top and Bottom HDTV 720P
3. 1920*1080 33.75 60.00 74.25 2D to 3D,Side by Side, Top and Bottom HDTV 1080I
4. 1920*1080 33.72 59.94 74.176 2D to 3D,Side by Side, Top and Bottom HDTV 1080I
5.3. HDMI Input (PC/DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC
1 640*350 31.468 70.09 25.17 EGA X
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
6 1152*864 54.348 60.053 80.002 VESA O
7 1360*768 47.712 60.015 85.50 VESA (WXGA) X
8 1280*1024 63.981 60.020 108.00 VESA (SXGA) O
9 1920*1080 67.5 60 148.5 HDTV 1080P O
DTV
1 720*480 31.50 60 27.027 SDTV 480P
2 720*480 31.469 59.94 27.00 SDTV 480P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 44.96 59.94 74.176 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I
6 1920*1080 33.72 59.94 74.176 HDTV 1080I
7 1920*1080 67.500 60 148.50 HDTV 1080P
8 1920*1080 67.43 59.94 148.352 HDTV 1080P
9 1920*1080 27.000 24.000 74.25 HDTV 1080P
10 1920*1080 26.97 23.97 74.176 HDTV 1080P
11 1920*1080 33.75 30.000 74.25 HDTV 1080P
12 1920*1080 33.716 29.976 74.176 HDTV 1080P
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.4. 3D HDMI Input(1.4b)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1. 720*480p 63 59.94 / 60 54.00 F/P,L/A
31.5 27.00 T/B,S/S,S/S Full
2. 1280*720p 90.00 59.94 / 60 148.5 F/P, L/A
44.96 / 45 74.17/74.25 S/S, T&B, S/S Full
3. 1920*1080i 67.432 / 67.5 59.94 / 60 148.35/148.5 F/P, F/A
33.75 74.25 S/S, T&B, S/S Full
4. 1920*1080p 54 23.976 / 24 148.5 F/P, L/A
26.973 / 27 23.976 / 24 74.175/74.25 S/S, T&B, S/S Full
5. 1920*1080p 33.716 / 33.75 29.97 / 30.00 74.175/74.25 S/S, T&B, S/S Full
67.50 30.00 148.5 F/P, L/A
60.00 S/S, T&B
5.5. 3D HDMI-PC Input
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1. 1024*768 48.363 60.004 65.000 2D to 3D, S/S, T&B
2. 1360*768 47.712 60.015 85.500
3. 1920*1080 67.50 60.00 148.50 2D to 3D, S/S, T&B, C/B, R/I, C/I
5.6. HDMI Input(1.3)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1. 720*480p 63 59.94 / 60 54.00 2D to 3D, S/S, T&B, C/B, R/I, C/I
31.5 27.00
2. 1280*720p 90.00 59.94 / 60 148.5
44.96 / 45 74.17/74.25
3. 1920*1080i 67.432 / 67.5 59.94 / 60 148.35/148.5 2D to 3D, S/S, T&B
33.75 74.25
4. 1920*1080p 54 23.976 / 24 148.5 2D to 3D, S/S, T&B, C/B, R/I, C/I
26.973 / 27 23.976 / 24 74.175/74.25
5. 1920*1080p 33.716 / 33.75 29.97 / 30.00 74.175/74.25
Only for training and service purposes
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.7. USB/DLNA Input
5.7.1. 3D Auto detection
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1920*1080 33.75 30.000 74.25 Side-by-side, Top-and-Bottom
Checkerboard, Row Interleaving,
Column Interleaving, Frame Sequentia
(Photo : Side-by-side,
Top-and-Bottom)
5.7.2. 3D Manual(Movie)
No. Resolution H-freq(kHz) V-freq.(kHz) 3D input proposed mode
1 Under 704*480 - - 2D to 3D
2 Over 704*480i 2D to 3D,Side-by-side ,
Top-and-Bottom
3 Over 704*480p 50/60 2D to 3D,Side-by-side ,
Top-and-Bottom
Checkerboard,
Row Interleaving,
Column Interleaving,
Frame Sequential
4 Over 704*480p Others 2D to 3D,Side-by-side ,
Top-and-Bottom
Checkerboard,
Row Interleaving,
Column Interleaving
HDTV 1080P
5.7.3. 3D Manual(Photo)
No. Resolution H-freq(kHz) V-freq.(kHz) 3D input proposed mode
1 Under 320*240 - - 2D to 3D
2 Over 320*240 2D to 3D,Side-by-side ,
Top-and-Bottom
Only for training and service purposes
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.8. Miracast/Widi Input
5.8.1. 3D Manual
No. Resolution H-freq(kHz) V-freq.(kHz) 3D input proposed mode
1 1024*768p - 30/60 2D to 3D,Side-by-side ,
2 1280*720p
3 1920*1080p
4 Others - 2D to 3D
Top-and-Bottom
5.8.2. RF 3D Input(DTV)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode
1 1280*720 45.000 60 74.25 HDTV 720P 2D to 3D, Side by Side, Top & Bottom
2 1920*1080 33.75 60 74.25 HDTV 1080I 2D to 3D, Side by Side, Top & Bottom
5.9. 2D to 3D Conversion(RF 3D Input(DTV))
No INPUT Freq Resolution
1 Digital TV / Analog TV 2D Support freq 2D Support resolution
2 HDMI 2D Support freq 2D Support resolution
3 Component 2D Support freq 2D Support resolution
4 Composite 2D Support freq 2D Support resolution
5 USB 2D Support freq 2D Support resolution
No Side by Side Top & Bottom Checkerboard Single Frame
Sequential
1
Frame Packing 2D to 3D
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA42B Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
4. MAIN PCBA Adjustments
4.1. ADC Calibration
- An ADC cali bra tion is not necessary because MA IN SoC
(LGExxxx) is already calibrated from IC Maker
- If it needs to adjust manually, refer to appendix.
4.2. MAC Address, ESN Key and Widevine
Key download
4.2.1. Equipment & Condition
1) Play file: keydownload.exe
4.2.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process
- US, C anada m odels : DETEC T -> M AC_ WR IT E ->
WIDEVINE_WRITE
- Korea, Mexico m odels: DET ECT -> MAC_WRI TE ->
WIDEVINE_WRITE
4) Play : START
5) Check of result: Ready, Test, OK or NG
4.2.4. Communication Port connection
1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
Port
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment : ADC adjustment is OTP (Auto ADC)
(2) EDID download : HDMI
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
3.3. Appendix
(1) Tool option menu, USB Download (S/W Update, Option and
Service only)
(2) Manual adjustment for ADC calibration and White balance.
(3) Shipment conditions, Channel pre-set
4.2.5. Download
1) US, Canada models (14Y LCD TV + MAC + Widevine +
ESN Key + DTCP Key + HDCP1.4 and HDCP2.0)
4.2.6. Inspection
- In INSTART menu, check these keys.
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.3. LAN port Inspection (Ping Test)
4.3.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
- IP number: 12.12.2.2
4.3.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) Connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) Remove LAN CABLE
Step 1) Step 3) Check ‘OK’ Signal
4.4. EDID Download
4.4.1 Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.4.3. EDID DATA
4.4.3.1. 2D_8bit_PCM(US) _ xvYCC : off
HDMI EDID 2D_8bit_PCM(US)_xvYCC : off
▪Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by S/W or Input
mode.
ⓐ Product ID
HEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
ⓑ Serial No: Controlled on production line.
ⓒ Month, Year: Controlled on production line:
ex) Monthly : ‘01’ -> ‘01’
Year : ‘2014’ -> ‘18’
ⓓ Model Name(Hex): LGTV
Chassis MODEL NAME(HEX)
LA42B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
4.4.2 Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust remocon
Only for training and service purposes
- 14 -
ⓔ Checksum(LG TV): Changeable by total EDID data.
ⓔ1 ⓔ2 ⓔ3
HDMI1 E7 49 X
HDMI2 E7 39 X
HDMI3 E7 29 X
ⓕ Vendor Specific(HDMI)
INPUT MODEL NAME(HEX)
HDMI1 67 03 0C 00 10 00 80 1E
HDMI2 67 03 0C 00 20 00 80 1E
HDMI3 67 03 0C 00 30 00 80 1E
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.4.3.2. 2D_10bit_PCM(US) _ xvYCC : off
4.4.3.3. 3D_8bit_PCM(US) _ xvYCC : off
HDMI EDID 2D_10bit_PCM(US)_xvYCC : off
▪Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by S/W or Input
mode.
ⓐ Product ID
HEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
ⓑ Serial No: Controlled on production line.
ⓒ Month, Year: Controlled on production line:
ex) Monthly : ‘01’ -> ‘01’
Year : ‘2014’ -> ‘18’
ⓓ Model Name(Hex): LGTV
Chassis MODEL NAME(HEX)
LA42B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
HDMI EDID 3D_8bit_PCM(US)_xvYCC : off
▪Reference
- HDMI1 ~ HDMI4
- In the data of EDID, bellows may be different by S/W or Input
mode.
ⓐ Product ID
HEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
ⓑ Serial No: Controlled on production line.
ⓒ Month, Year: Controlled on production line:
ex) Monthly : ‘01’ -> ‘01’
Year : ‘2014’ -> ‘18
ⓓ Model Name(Hex): LGTV
Chassis MODEL NAME(HEX)
LA42B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
ⓔ Checksum(LG TV): Changeable by total EDID data.
ⓔ1 ⓔ2 ⓔ3
HDMI1 E7 02 X
HDMI2 E7 F2 X
HDMI3 E7 E2 X
ⓕ Vendor Specific(HDMI)
INPUT MODEL NAME(HEX)
HDMI1 67 03 0C 00 10 00 B8 2D
HDMI2 67 03 0C 00 20 00 B8 2D
HDMI3 67 03 0C 00 30 00 B8 2D
ⓔ Checksum(LG TV): Changeable by total EDID data.
ⓔ1 ⓔ2 ⓔ3
HDMI1 E7 FC X
HDMI2 E7 EC X
HDMI3 E7 DC X
HDMI4
E7 CC X
(LB87 only)
ⓕ Vendor Specific(HDMI)
INPUT MODEL NAME(HEX)
HDMI1 78 03 0C 00 10 00 80 1E 20 CO 0E 01 4F 00
FE 08 10 06 10 18 10 28 10 38 10
HDMI2 78 03 0C 00 20 00 80 1E 20 CO 0E 01 4F 00
FE 08 10 06 10 18 10 28 10 38 10
HDMI3 78 03 0C 00 30 00 80 1E 20 CO 0E 01 4F 00
FE 08 10 06 10 18 10 28 10 38 10
HDMI4
(LB87 Only)
78 03 0C 00 30 00 80 1E 20 CO 0E 01 4F 00
FE 08 10 06 10 18 10 28 10 38 10
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.4.3.4. 3D_10bit_PCM(US) _ xvYCC : off
HDMI EDID 3D_10bit_PCM(US)_xvYCC : off
▪Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by S/W or Input
mode.
ⓐ Product ID
HEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
ⓑ Serial No: Controlled on production line.
ⓒ Month, Year: Controlled on production line:
ex) Monthly : ‘01’ -> ‘01’
Year : ‘2014’ -> ‘18
ⓓ Model Name(Hex): LGTV
Chassis MODEL NAME(HEX)
LA42B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
ⓔ Checksum(LG TV): Changeable by total EDID data.
ⓔ1 ⓔ2 ⓔ3
HDMI1 E7 B5 X
HDMI2 E7 A5 X
HDMI3 E7 95 X
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON sta tus during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Vi deo Signal Generat or MS PG-925F 720p/ 204-Gray
(Model: 217, Pattern: 49)
※ Color Analyzer Matrix should be calibrated using CS-1000
5.1.3. Equipment connection
ⓕ Vendor Specific(HDMI)
INPUT MODEL NAME(HEX)
HDMI1 78 03 0C 00 10 00 B8 2D 20 C0 0E 01 4F 00 FE
08 10 06 10 18 10 28 10 38 10
HDMI2 78 03 0C 00 20 00 B8 2D 20 C0 0E 01 4F 00 FE
08 10 06 10 18 10 28 10 38 10
HDMI3 78 03 0C 00 30 00 B8 2D 20 C0 0E 01 4F 00 FE
08 10 06 10 18 10 28 10 38 10
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMD DATA ID
Explanation
Wb 00 00 Begin White Balance adj.
Wb 00 ff End White Balance adj.
(internal pattern disappears )
(2) Adjustment Map
Adj. item Command
(lower caseASCII)
CMD1 CMD2 MIN MAX
Cool R Gain j g 00 C0
G Gain j h 00 C0
B Gain j i 00 C0
Medium R Gain j a 00 C0
G Gain j b 00 C0
B Gain j c 00 C0
Warm R Gain j d 00 C0
G Gain j e 00 C0
B Gain j f 00 C0
Data Range
(Hex.)
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.1.5.2. Manual adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C à 9. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 206 Gray internal pa ttern will be
displayed.
(4) Adjust Cool modes
(i) Fix the one of R/G/B gain to 192 (default data) an d
decrease the others.
( If G gain is adjusted over 172 and R and B gain less than
192 , Adjust is O.K.)
(ii) If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain.
(iii) If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255 or
B gain is 255
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B
gain to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
5.1.6. Reference (White Balance Adj. coordinate and
color temperature)
(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
5.1.7. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 204 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode
Cool 0.271 0.270 13,000K 0.0000
Medium 0.286 0.289 9,300K 0.0000
Warm 0.313 0.329 6,500K 0.0000
Coordinate
X Y
Temp △uv
Only for training and service purposes
- 17 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
▪ S ta ndard colo r coo rd ina te an d tem pe rat ur e usi ng
CA-210(CH-14) – by aging time
(1) Normal line in Korea (From January to February) : LGD
(LB5xxx, LB6xxx, LB7xxx, LB8xxx Series models)
Cool Medium Warm
Aging time
GP4
(Min)
X Y X Y X Y
271 270 286 289 313 329
1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346
4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
▪ S ta ndard colo r coo rd ina te an d tem pe rat ur e usi ng
CA-210(CH-14) – by aging time
(2) Normal line in Korea (From March to December) : LGD
(LB5xxx, LB6xxx, LB7xxx, LB8xxx Series models)
Normal line in Mexico : LGD (LB5xxx, LB6xxx, LB7xxx,
LB8xxx Series models)
Cool Medium Warm
Aging time
GP4
(Min)
X Y X Y X Y
271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
(3) O/S Module(AUO, INX, Sharp, CSOT, BOE)
cool med warm
x y x y x y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
5.2. Option selection per country
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: LA42B Chassis applied to CANADA and
MEXICO
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu
(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX.
Selection is done using +, - KEY
5.2.3. Tool Option inspection
▪ Press Adj. key on the Adj. R/C, then select Tool option
Model Tool 1 Tool 2 Tool 3 Tool 4 Tool 5 Tool 6 Tool 7 Area
65LB7100-UC33641 4114 25475 64582 43686 2426 33579 22282
65LB7100-
70LB7100-
60LB7100-
55LB7200-
42LB6500-
UM(AUO)
42LB6500-
UM(LGD)
47LB6500-
50LB6500-
55LB6500-
60LB6500-
42LB6300-
47LB6300-
55LB6300-
60LB6300-
65LB6300-
55LB8700-
33641 4114 25475 64582 43686 2426 33579 22282
UB
39786 4114 25475 64582 43686 2394 43819 22282
UC
33640 4114 25475 64582 43686 2394 35627 22282
UT
UB
UM
UM
UM
UP
UQ
UQ
UQ
US
UA
UA
134 4114 25475 64582 48038 2394 39723 22282
4258 4370 33667 64582 2726 2474 47915 22282
162 4370 33667 64582 11174 2474 47915 22282
165 4370 33667 64582 11174 2426 47915 22282
166 4370 33155 64582 11174 2394 47915 22282
259 4379 33155 64582 9126 2427 47915 22282
70 4627 25236 64774 43434 2377 33291 22282
22282
22282
22282
22282
22282
22282
Only for training and service purposes
* Tool option can be reconstructed by Software
- 18 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.3. Local Dimming Inspection
1
6
11
2
7123
8134
9
14
51015
direction
(1) Press ‘TILT” key of the Ad j. R/C and ch eck movi ng
patterns. The black bar patterns moves from top to bottom.
If a local dimming function does not work, a whole screen
shows full white.
5.4. Magic Motion remote controller Check
5.4.1. Test equipment
▪ RF-remot e controller for check, IR-KEY-CODE remote
controller.
▪ Check AA battery before test. A recommendation is that a
tester change battery every lots.
5.4.2. Test
(1) Make pairing with TV set by pressing “Start key(Wheel
key)” on RCU.
(2) Check a cursor on screen by pressing ‘Wheel key” of RCU
(3) Stop paring with TV set by pressing “Back+ Home” key of
RCU
<Local dimming for 55LB8700-UA> <Local dimming for 42LB67/68/69/7200-U*>
<Local dimming for 47LB67/68/69/73/7500-U*>
<Local dimming for 50/55/60LB67/68/69/72/73/7500-U*>
5.4.3. Applied models
Chassis Model Name Magic RF receiver
LA42A 55LB8700-UA Built-in
LA42B 55LB7200-U*
5.5. Wi-Fi MAC Address Check
5.5.1. Using RS232 Command
Transmission [A][l][][Set ID][][20][Cr] [O][K][x] or [N][G]
60/65/70LB7100-U*
42/47/50/55/60LB500-U*
42/47/55/60/65LB6300-U*
32LN570B-UH
47/55LN5790-UH
47/55LA6450-UA
Command Set ACK
Built-in
5.5.2. Check the menu on in-start
<Local dimming for 65LB67/68/69/7200-U*> <Local dimming for 60LB7100-U*>
<Local dimming for 65LB7100-U*> <Local dimming for 70LB7100-U*>
Only for training and service purposes
- 19 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.6. 3D pattern test (Only for 3D models)
5.6.1. Test equipment
(1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4
support)
(2) Pattern: HDMI mode (model No. 872, pattern No. 83)
5.7. HDMI ARC Function Inspection
5.7.1. Test equipment
- Optic Receiver Speaker
- MSHG-600 (SW: 1220 ↑)
- HDMI Cable (for 1.4 version)
5.6.2. Test method
(1) Input 3D test signal as Fig.1.
(2) Press ‘OK” key as a 3D input OSD is shown.
(3) Check pattern as Fig2 without 3D glasses. (3D mode
without 3D glasses)
Fig.2 Fig.3
<OK in 3D mode without 3D glasses> <NG in 3D mode without 3D glasses>
5.7.2. Test method
(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
(2) Check the sound from the TV Set
(3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
5.6.3. 3D Inner pattern
(1). Using RS232 Command
Command Set ACK
Transmission [A][I][ ][Set ID][ ][72][Cr] [O][K][x] or [N][G][x]
(2) It support internal 3D pattern without ‘MASTER’ equipment.
Except that one, other method is same when use the
‘MASTER’ equipment
* Remark: Inspect in Power Only Mode and check SW version
in a master equipment
Only for training and service purposes
- 20 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.8. HDMI MHL Function Inspection
5.8.1. Test method
(1) Insert the HDMI Cable to the HDMI MHL port from the
master equipment, HDMI3, HDMI4 (Only LB86, LB87)
(2) Check the Green LED of Tester, and TV Display.
5.9. EYE-Q Green Function Inspection
Step 1) Turn on the TV..
Step 2) Press ' EY E button' o n t he adjustm en t remote -
controller.
Step 3) Cover 'Eye Q sensor' on the front of set with your
hands, hold it for 6 seconds.
Step 4) Check "the Sensor Data" on the screen, make certain
that Data is below 10. If Data isn’t below 10 in 6
seconds, Eye Q sensor would be bad. You should
change Eye Q sensor.
Step 5) Uncover your hands from Eye Q sensor, hold it for 6
seconds.
Step 6) Check "Back Light(xxx)" on the screen, check data
increase . You should change Eye Q sensor.
6. Camera Port Inspection
(1) Objective : To check how it connects between Camera and
PCBA normally, and their Function
(2) Test Method : This Inspection is available only Power-Only
Status
i) Push Camera Up.
ii) Camera’s Preview picture apeears on TV Set.
iii) Push Camera Down
6.1. Ship-out mode check (In-stop)
▪ after final inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
7.2. Specification
No Item Min Typ Max Unit Remark
1 Audio
practical
max Output,
L/R
(Distortion=10%
max Output)
9.0
8.5
13.5
10.4
10.0
8.9
15.0
11.0
12.0
9.9WVrms
18.0
12.0WVrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)
ALL MODEL
(Except LB86,LB87)
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)
Only LB86,LB87
Only for training and service purposes
- 21 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
8. GND and HI-POT Test
8.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
8.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically.
9. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring.
8.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Only for training and service purposes
- 22 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
10. Optional adjustments
10.1. Manual White balance Adjustment
10.1.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Po wer ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern
10.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Vi deo Sig nal Generator MSP G-925F 720p/216 -Gray
(Model: 217, Pattern: 78)
10.1.3. Adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►).
When KEY(►) is pressed 216 Gray internal pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
Only for training and service purposes
- 23 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
400
410
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
900
121
521
540
LV1
530
350
AT1
120
AG1
200
A10
Set + Stand
Only for training and service purposes
- 24 -
A22
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
System Configuration
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Clock for M14-A0
MAIN Clock(24Mhz)
LOADCAP_ATSC_PCB
10pF
C101
C102
LOADCAP_ATSC_PCB
System Clock for Analog block(24Mhz)
PLL SET[1:0] : internal pull up
"00" : CPU(1200Mhz),M0 / M1 DDR(792,792 Mhz)
"01" : CPU(1056Mhz),M0 / M1 DDR(672,672 Mhz)
"10" : CPU(1056Mhz),M0 / M1 DDR(792,792 Mhz)
"11" : CPU( 960Mhz),M0 / M1 DDR(792,792 Mhz)
OP MODE[1:0]
"00" : Normal Mode
"01/10/11" : Internal Test mode
+3.3V_NORMAL
R101 3.3K
R102 3.3K
Extenal test only
+3.3V_NORMAL
+3.3V_TUNER
R148
3.3K
R146
3.3K
KR_PIP_NOT
KR_PIP_NOT
1.5K
1.5K
KR_PIP
R146-*1
KR_PIP
R148-*1
10pF
Extenal test only
OPT
OPT
R149
2
3
OPT
R103 3.3K
R104 3.3K
OPT
3.3K
X-TAL_1
GND_1
1
4
X-TAL_2
GND_2
OPM1
OPM0
X101
24MHz
R118
PLLSET1
PLLSET0
+3.3V_TUNER
R150
3.3K
R155
1.2K
KR_PIP_NOT
KR_PIP_NOT
3.3K
KR_PIP
KR_PIP
R155-*1
1M
R180
560
LOADCAP_DVB_PCB
C101-*1
6.8pF
50V
+3.3V_NORMAL
INSTANT boot MODE
"1 : Instant boot
"0 : normal
3.3K
R121
(internal pull down)
OPT
INSTANT_MODE0
+3.3V_NORMAL
R158
R157
R156
3.3K
R156-*1
3.3K
1.2K
XTAL_IN
XTAL_OUT
LOADCAP_DVB_PCB
C102-*1
6.8pF
50V
INSTANT_BOOT
I2C PULL UP
R159
3.3K
3.3K
R160
3.3K
R161
+3.3V_NORMAL
3.3K
R127
OPT
3.3K
R128
BOOT_MODE0
I2C
I2C_1 : AMP
I2C_2 : T-CON,L/DIMING
I2C_3 : MICOM
I2C_4 : S/Demod,T2/Demod, LNB
I2C_5 : NVRAM
I2C_6 : TUNER_MOPLL(T/C,ATV)
R162
3.3K
3.3K
IC103
AT24C256C-SSHL-T
A0
1
A1
2
A2
3
GND
4
NVRAM_ATMEL
BOOT MODE
"0 : EMMC
"1 : TEST MODE
BOOT_MODE
I2C_SDA1
I2C_SCL1
I2C_SDA_MICOM_SOC
I2C_SCL_MICOM_SOC
I2C_SDA2
I2C_SCL2
I2C_SDA4
I2C_SCL4
I2C_SDA5
I2C_SCL5
I2C_SDA6
I2C_SCL6
NVRAM
VCC
8
WP
7
SCL
6
SDA
5
+3.3V_NORMAL
C107
0.1uF
16V
Write Protection
- Low : Normal Operation
- High : Write Protection
R143 33
R144 33
IC103-*1
M24256-BRMN6TP
E0
VCC
1
8
WC
E1
7
2
SCL
E2
6
3
SDA
VSS
5
4
NVRAM_ST
I2C_SCL5
I2C_SDA5
I2C_SCL_MICOM_SOC
I2C_SDA_MICOM_SOC
LOCAL DIMMING I2C CONTROL
+3.3V_NORMAL
OPT
OPT
R105
3.3K
R106
3.3K
LED_SCL
LED_SDA
SOC_RESET
FORCED_JTAG_0
P102
12507WS-04L
1
2
3
4
5
+3.3V_NORMAL
R163
10K
OPT
C104
0.1uF
16V
L/DIM0_VS
L/DIM0_SCLK
L/DIM0_MOSI
IRB_SPI_MOSI/TDO1
IRB_SPI_MISO/TDI1
M_REMOTE_RX
M_REMOTE_TX
1/16W
33
AR100
I2C_SCL4
I2C_SDA4
I2C_SCL6
I2C_SDA6
PWM_DIM2
PWM_DIM
EMMC_CLK
EMMC_CMD
EMMC_RST
EMMC_DATA[0-7]
OPT
XTAL_IN
XTAL_OUT
BOOT_MODE
PLLSET0
PLLSET1
TCK0
TDI0
TRST_N1
IRB_SPI_SS/TMS1
IRB_SPI_CK/TCK1
I2C_SCL1
I2C_SDA1
I2C_SCL2
I2C_SDA2
I2C_SCL5
I2C_SDA5
33
R107
33
R108
OPM0
OPM1
R178 33
OPT
R182 10K
R183 10K
R184 10K
R185 10K
SOC_RX
SOC_TX
EMMC_DATA[7]
EMMC_DATA[6]
EMMC_DATA[5]
EMMC_DATA[4]
EMMC_DATA[3]
EMMC_DATA[2]
EMMC_DATA[1]
EMMC_DATA[0]
12505WS-10A00
JTAG_CPU
B23
A23
R169
AG21
33
AJ18
AB8
AC8
AD8
AE8
AR101
AG30
AG28
AG29
AH29
AJ27
AH27
AG26
AH26
AJ12
AJ13
AH12
AG12
AH23
AG22
AH11
AG11
AG10
AH22
AJ22
AH10
AJ10
AG23
AH24
Y7
Y6
W7
W6
W5
AH7
AJ7
AG8
AH8
AH9
AG9
AJ9
AC6
AC7
AD7
AB7
G32
G33
G31
D31
F33
F32
E32
F31
D33
D32
E31
33
R179
10K
1/16W
5%
Jtag-0 I/F
+3.3V_NORMAL
P103
1
2
3
4
5
6
7
8
9
10
11
IC101
LG1311
XIN_MAIN
XO_MAIN
PORES_N
BOOT_MODE
PLLSET0
PLLSET1
OPM0
OPM1
L_VSOUT_LD/TRST0_N
DIM0_SCLK/TMS0
DIM1_SCLK/TCK0
DIM1_MOSI/TDI0
DIM0_MOSI/TDO0
SPI_CS0
SPI_SCLK0
SPI_DO0
SPI_DI0/TRST1_N
SPI_CS1/TMS1
SPI_SCLK1/TCK1
SPI_DO1/TDO1
SPI_DI1/TDI1
EXT_INTR0
EXT_INTR1
EXT_INTR2
EXT_INTR3
UART0_RXD
UART0_TXD
UART1_RXD
UART1_TXD
UART1_RTS_N
UART1_CTS_N
SCL0
SDA0
SCL1
SDA1
SCL2
SDA2
SCL3
SDA3
SCL4
SDA4
SCL5
SDA5
PWM0
PWM1
PWM2
PWM_IN
EMMC_CLK
EMMC_CMD
EMMC_RESETN
EMMC_DATA7
EMMC_DATA6
EMMC_DATA5
EMMC_DATA4
EMMC_DATA3
EMMC_DATA2
EMMC_DATA1
EMMC_DATA0
USB2_0_DP0
USB2_0_DM0
USB2_0_TXRTUNE
USB2_1_DP0
USB2_1_DM0
USB2_1_TXRTUNE
USB3_DP0
USB3_DM0
USB3_TXP0
USB3_TXM0
USB3_RXP0
USB3_RXM0
USB3_RESREF0
USB3_DP1
USB3_DM1
USB3_TXP1
USB3_TXM1
USB3_RXP1
USB3_RXM1
USB3_RESREF1
HUB_PORT_OVER0
HUB_VBUS_CTRL0
EB_CS3
EB_CS2
EB_CS1
EB_CS0
EB_WE_N
EB_OE_N
EB_WAIT
EB_BE_N1
EB_BE_N0
CAM_CD1_N
CAM_CD2_N
CAM_CE1_N
CAM_CE2_N
CAM_IREQ_N
CAM_RESET
CAM_INPACK_N
CAM_VCCEN_N
CAM_WAIT_N
CAM_REG_N
EB_ADDR0
EB_ADDR1
EB_ADDR2
EB_ADDR3
EB_ADDR4
EB_ADDR5
EB_ADDR6
EB_ADDR7
EB_ADDR8
EB_ADDR9
EB_ADDR10
EB_ADDR11
EB_ADDR12
EB_ADDR13
EB_ADDR14
EB_ADDR15
EB_DATA0
EB_DATA1
EB_DATA2
EB_DATA3
EB_DATA4
EB_DATA5
EB_DATA6
EB_DATA7
L/DIM0_VS
TDI0
L/DIM0_MOSI
L/DIM0_SCLK
TCK0
SOC_RESET
FORCED_JTAG_0
AN9
AM9
AN8
H32
J31
H33
N31
N32
P33
P32
M32
M33
P31
K33
K32
L32
L31
K31
J32
M31
W28
W29
H28
J30
J28
J29
G30
F30
H29
G29
G28
P28
P27
U28
R29
V27
T28
T29
R28
U27
N29
K30
E30
M30
N28
M28
M29
L29
K29
K28
L28
D30
EB_ADDR[10]
F29
EB_ADDR[11]
C32
EB_ADDR[12]
C33
EB_ADDR[13]
C31
EB_ADDR[14]
B33
B32
A32
B31
A31
A30
B30
C30
C29
(TRST0_N)
(TDO0)
(TMS0)
R1712001%
R1722001%
R1732001%
R1742001%
/USB_OCD1
/USB_OCD2
/USB_OCD3
EB_BE_N1
EB_BE_N0
CAM_CD1_N
CAM_CD2_N
CAM_IREQ_N
CAM_INPACK_N
CAM_WAIT_N
EB_ADDR[0]
EB_ADDR[1]
EB_ADDR[2]
EB_ADDR[3]
EB_ADDR[4]
EB_ADDR[5]
EB_ADDR[6]
EB_ADDR[7]
EB_ADDR[8]
EB_ADDR[9]
EB_DATA[0]
EB_DATA[1]
EB_DATA[2]
EB_DATA[3]
EB_DATA[4]
EB_DATA[5]
EB_DATA[6]
EB_DATA[7]
12505WS-10A00
WIFI_DP
WIFI_DM
USB_DP3
USB_DM3
USB_DP1
USB_DM1
USB_DP2
USB_DM2
USB_CTL1
USB_CTL2
USB_CTL3
EB_WE_N
EB_OE_N
/PCM_CE1
/PCM_CE2
PCM_RESET
PCM_5V_CTL
CAM_REG_N
Jtag-1 I/F
+3.3V_NORMAL
P104
OPT
1
2
3
4
5
6
7
8
9
10
11
EB_ADDR[0-14]
TP102
EB_DATA[0-7]
TP103
PAGE 1
TP104
TP105
TP106
TP107
TP108
TP109
TP110
TP111
TP112
TP113
TP114
TP115
TP116
TP117
EB_ADDR[0-14]
EB_DATA[0-7]
EB_WE_N
EB_OE_N
EB_BE_N1
EB_BE_N0
CAM_CD1_N
CAM_CD2_N
/PCM_CE1
/PCM_CE2
CAM_IREQ_N
PCM_RESET
CAM_INPACK_N
PCM_5V_CTL
CAM_WAIT_N
CAM_REG_N
TRST_N1
IRB_SPI_MISO/TDI1
IRB_SPI_MOSI/TDO1
IRB_SPI_SS/TMS1
IRB_SPI_CK/TCK1
SOC_RESET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-Peripheral
MID_LG1311
M14 Symbol A
2013.04.04
1
31
PAGE 2
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
FE_DEMOD1_TS_DATA[0-7]
TPI_ERR
AMP_RESET_N
TP226
TP227
FE_DEMOD3_TS_SYNC
FE_DEMOD3_TS_DATA
TPI_DATA[0-7]
Near AMP
C200
1000pF
50V
R231
4.7K
TP228
FE_DEMOD1_TS_CLK
FE_DEMOD1_TS_SYNC
FE_DEMOD1_TS_VAL
FE_DEMOD1_TS_ERROR
FE_DEMOD3_TS_CLK
FE_DEMOD3_TS_VAL
SC_DET
R226
100
1/16W
5%
LED_SDA
INSTANT_BOOT
LED_SCL
CAM_SLIDE_DET
CAM_TRIGGER_DET
/RST_HUB
IC101
LG1311
AH30
TP_DVB_CLK
AH32
TP_DVB_SOP
AH31
TP_DVB_VAL
AH33
TP_DVB_ERR
FE_DEMOD1_TS_DATA[7]
FE_DEMOD1_TS_DATA[6]
FE_DEMOD1_TS_DATA[5]
FE_DEMOD1_TS_DATA[4]
FE_DEMOD1_TS_DATA[3]
FE_DEMOD1_TS_DATA[2]
FE_DEMOD1_TS_DATA[1]
FE_DEMOD1_TS_DATA[0]
FE_DEMOD2_TS_CLK
FE_DEMOD2_TS_SYNC
FE_DEMOD2_TS_VAL
FE_DEMOD2_TS_ERROR
FE_DEMOD2_TS_DATA
TPI_CLK
TPI_SOP
TPI_VAL
SC_DET
/RST_PHY
2D/3D_CTL
/TU_RESET1
/TU_RESET2
BT_RESET
HP_DET
OPT
OPC_EN
DEBUG
BIT0
/RST_HUB
COMP1_DET
IR_B_RESET
BIT1
BIT2
BIT3
BIT4
BIT5
BIT6
BIT7
TPI_ERR
TPI_DATA[0]
TPI_DATA[1]
TPI_DATA[2]
TPI_DATA[3]
TPI_DATA[4]
TPI_DATA[5]
TPI_DATA[6]
TPI_DATA[7]
MODEL_OPT_11
TP225
RF_SWITCH_CTL
R224
33
CAM_SLIDE_DET
CAM_TRIGGER_DET
MODEL_OPT_12
AV1_CVBS_DET
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10 EPI_LOCK8/6
AM33
TP_DVB_DATA7
AL32
TP_DVB_DATA6
AL33
TP_DVB_DATA5
AK32
TP_DVB_DATA4
AK33
TP_DVB_DATA3
AK31
TP_DVB_DATA2
AJ30
TP_DVB_DATA1
AJ31
TP_DVB_DATA0
AL31
STPI0_CLK
AN32
STPI0_SOP
AM32
STPI0_VAL
AN31
STPI0_ERR
AM31
STPI0_DATA
AH28
STPI1_CLK
AJ28
STPI1_SOP
AK30
STPI1_VAL
AJ29
STPI1_ERR
AG27
STPI1_DATA
A28
TPI_CLK
B28
TPI_SOP
B29
TPI_VAL
C28
TPI_ERR
A27
TPI_DATA0
B27
TPI_DATA1
C27
TPI_DATA2
B26
TPI_DATA3
C26
TPI_DATA4
B25
TPI_DATA5
A25
TPI_DATA6
C25
TPI_DATA7
AG13
GPIO31
AJ19
GPIO30
AG14
GPIO29
AG15
GPIO28
AJ15
GPIO27
AH19
GPIO26
AH18
GPIO25
AG19
GPIO24
AH5
GPIO23
AJ5
GPIO22
AJ6
GPIO21
AH6
GPIO20
AG6
AG24
AH16
AJ21
AH21
AG16
AJ24
AH17
AG17
AH13
AH15
AG18
AH14
AJ16
AH20
GPIO19
AG5
GPIO18
AF7
GPIO17
AG7
GPIO16
GPIO15
GPIO14
V29
GPIO13
GPIO12
GPIO11
V28
GPIO10
GPIO9
GPIO8
GPIO7
GPIO6
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
GPIO0
R225
OPT
33
TPIO_CLK
TPIO_SOP
TPIO_VAL
TPIO_ERR
TPIO_DATA0
TPIO_DATA1
TPIO_DATA2
TPIO_DATA3
TPIO_DATA4
TPIO_DATA5
TPIO_DATA6
TPIO_DATA7
EPI_SOE
EPI_MCLK
EPI_GCLK
EPI_EO
EPI_VST
TX_0N
TX_0P
TX_1N
TX_1P
TX_2N
TX_2P
TX_3N
TX_3P
TX_4N
TX_4P
TX_5N
TX_5P
TX_6N
TX_6P
TX_7N
TX_7P
TX_8N
TX_8P
TX_9N
TX_9P
TX_10N
TX_10P
TX_11N
TX_11P
TX_12N
TX_12P
TX_13N
TX_13P
TX_14N
TX_14P
TX_15N
TX_15P
TX_16N
TX_16P
TX_17N
TX_17P
TX_18N
TX_18P
TX_19N
TX_19P
TX_20N
TX_20P
TX_21N
TX_21P
TX_22N
TX_22P
TX_23N
TX_23P
TX_LOCKN
D28
E29
E28
F28
D27
E27
F27
E26
F26
E25
D25
F25
AA5
AB5
AA7
AA6
AB6
AK8
AL8
AK7
AL7
AM6
AN6
AK6
AL6
AK5
AL5
AN4
AN3
AM2
AM1
AM4
AM3
AL4
AL3
AK2
AK1
AK4
AK3
AJ4
AJ3
AH2
AH1
AH4
AH3
AG4
AG3
AF2
AF1
AF4
AF3
AE4
AE3
AD2
AD1
AD4
AD3
AC4
AC3
AB2
AB1
AB4
AB3
AA4
AA3
AM8
TPO_CLK
TPO_SOP
TPO_VAL
TPO_ERR
TPO_DATA[0]
TPO_DATA[1]
TPO_DATA[2]
TPO_DATA[3]
TPO_DATA[4]
TPO_DATA[5]
TPO_DATA[6]
TPO_DATA[7]
EPI_SOE
MCLK_SOC
GCLK_SOC
EO_SOC
GST_SOC
TXB4N/TX0N
TXB4P/TX0P
TXB3N/TX1NFE_DEMOD3_TS_ERROR
TXB3P/TX1P
TXBCLKN/TX2N
TXBCLKP/TX2P
TXB2N/TX3N
TXB2P/TX3P
TXB1N/TX4N
TXB1P/TX4P
TXB0N/TX5N
TXB0P/TX5P
TXD4N/TX12N
TXD4P/TX12P
TXD3N/TX13N
TXD3P/TX13P
TXDCLKN/TX14N
TXDCLKP/TX14P
TXD2N/TX15N
TXD2P/TX15P
TXD1N/TX16N
TXD1P/TX16P
TXD0N/TX17N
TXD0P/TX17P
TPO_DATA[0-7]
TXA4N/TX6N
TXA4P/TX6P
TXA3N/TX7N
TXA3P/TX7P
TXACLKN/TX8N
TXACLKP/TX8P
TXA2N/TX9N
TXA2P/TX9P
TXA1N/TX10N
TXA1P/TX10P
TXA0N/TX11N
TXA0P/TX11P
TXC4N/TX18N
TXC4P/TX18P
TXC3N/TX19N
TXC3P/TX19P
TXCCLKN/TX20N
TXCCLKP/TX20P
TXC2N/TX21N
TXC2P/TX21P
TXC1N/TX22N
TXC1P/TX22P
TXC0N/TX23N
TXC0P/TX23P
TPO_ERR
EPI_SOE
+3.3V_NORMAL
BIT0_1
R201 10K
BIT0_0
R202 10K
BIT [0/1]
0 / 0
0 / 1
1 / 0
1 / 1
TAIWAN/COLOM
CHINA/HONGKONG
ASIA/AFRICA
EU/CIS
BIT1_1
R203 10K
BIT1_0
R204 10K
ATSC
N/AMERICA
KOREA
S/AMERCIA
Model Option
BIT3_1
BIT2_1
R205 10K
R207 10K
BIT0
BIT1
BIT3_0
BIT2_0
R206 10K
R208 10K
JP
JAPAN
BIT4_1
R209 10K
BIT4_0
R210 10K
BIT5_1
R211 10K
BIT5_0
R212 10K
BIT2
BIT3
BIT4
BIT5
BACK-END OPTIONAREA OPTION
BIT[2/3/4/5]DVB
0 / 0 / 0 / 0
0 / 0 / 0 / 1
0 / 0 / 1 / 0
0 / 0 / 1 / 1
0 / 1 / 0 / 0
0 / 1 / 0 / 1
0 / 1 / 1 / 0
0 / 1 / 1 / 1
1 / 0 / 0 / 0
1 / 0 / 0 / 1
1 / 0 / 1 / 0
1 / 0 / 1 / 1
1 / 1 / 0 / 0
1 / 1 / 0 / 1
1 / 1 / 1 / 0
1 / 1 / 1 / 1
BIT6_1
R213 10K
BIT [6/7]
BIT7_1
R215 10K
0 / 0
0 / 1
1 / 0
1 / 1
EU/CIS
T/C
T2/C/S2/ATV_EXT
T2/C
T2/C/S2/ATV_SOC
BIT6
BIT7
BIT6_0
BIT7_0
R214 10K
R216 10K
TYPE
EPI FHD, 120Hz, V14 (8 lane)
EPI FHD, 120Hz, v14_32inch (6 lane)
EPI FHD, 120Hz, V13 (6 lane)
EPI FHD, 120Hz, V12 (6 lane)
EPI FHD, 60Hz, V14_32 inch (6lane)
LVDS FHD, 120Hz
LVDS FHD, 60Hz
LVDS HD, 60Hz
LVDS FHD, 60Hz, CP BOX
LVDS HD, 60Hz SMALL SMART
Vby1 FHD, 120Hz
LVDS FHD, 120Hz OLED
FRC
FHD
PANEL TYPE
OLED
AJJA
T/C
T2/C/ATV_EXT
T2/C/ATV_SOC
T2/C/S2
DDR3_DDP
R219 10K
R217 10K
DDR3_1.5GB
DDR3_2GB
R220 10K
R218 10K
DDR3_NON_DDP
TAIWAN/COL
T/C
T2/C PIP
T2/C
DDR_3G
R221 10K
R222 10K
NON_DDR_3G
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
MODEL_OPT_11
MODEL_OPT_12
BRAZILKOREA
ISDB PIP
ISDB
ATV_SOC
ATV_EXT
OPT
R227 10K
NORTH AMERICA
ATSC PIP
ATV_SOC
ATV_EXT
OPT
R229 10K
CHINA/HONG
Default Default
ATSC PIP
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
OPT
OPT
R230 10K
R228 10K
DDR3
DDR3
FOR UD
LOW
NON_DDP
NON_DDR3 3G
HIGH
DDP
1.5GB
2GB
DDR3 3G
JAPAN
MODEL_OPT_11
MODEL_OPT_12
FE_DEMOD2_TS_CLK
FE_DEMOD2_TS_SYNC
FE_DEMOD2_TS_VAL
FE_DEMOD2_TS_ERROR
FE_DEMOD2_TS_DATA
FE_DEMOD3_TS_CLK
FE_DEMOD3_TS_SYNC
FE_DEMOD3_TS_VAL
FE_DEMOD3_TS_ERROR
FE_DEMOD3_TS_DATA
TPI_DATA[0-7]
TPI_CLK
TPI_SOP
TPI_VAL
TPO_DATA[0-7]
TPO_CLK
TPO_SOP
TPO_VAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
M14-Display In/Out
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TP202
TP203
TP204
TP205
TP206
TP207
TP208
TP209
TP210
TP211
TP212
TP213
TP214
TP215
TP221
TP218
TP219
TP220
DEBUG
+3.3V_NORMAL
SW201
JTP-1127WEM
12
3
4
For ISP
R223
3.3K
MID_LG1311
M14 Symbol B
2013.04.04
2
31
PLACE AT JACK SIDE
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Place JACK Side
AV1_CVBS/COMP1_Y Circuit was moved to 34Page
COMP1_Pb
COMP1_Pr
TU_CVBS
COMP1/AV1/DVI_L_IN
COMP1/AV1/DVI_R_IN
C303
150pF
50V
OPT
1005
75
1%
R318
1005
1%
75
R326
Place SOC Side
33
R333
R335 33
TU_ALL_2178B
R329 100
AUDIO IN
R309 27K
R310 27K
C316 4.7uF
1%
C317 4.7uF
1%
C322 0.047uF
C324 0.047uF
C318 0.047uF
R322 10K
1%
R323 10K
1%
TU_ALL_2178B
COMP2_PB_IN_SOC
COMP2_PR_IN_SOC
TU_CVBS_SOC
AUAD_L_CH3_IN
AUAD_R_CH3_IN
COMP
TP308
TP310
TP311
TP312
TP313
TP314
TP315
TP316
TP317
TP302
TP303
TP304
TP305
TP306
TP307
SC_CVBS_IN_SOC
SC_FB_SOC
SC_ID_SOC
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_Y_IN_SOC_SOY
COMP1_PR_IN_SOC
AUAD_L_CH2_IN
AUAD_R_CH2_IN
SMARTCARD_DATA/SD_EMMC_CLK
SMARTCARD_VCC/SD_EMMC_CMD
SMARTCARD_DET/SD_EMMC_DATA[3]
SMARTCARD_RST/SD_EMMC_DATA[2]
SMARTCARD_PWR_SEL/SD_EMMC_DATA[1]
SMARTCARD_CLK/SD_EMMC_DATA[0]
TP318
TP319
TP320
Placed as close as possible to LG1311
Tuner IF Filter
ADC_I_INN
ADC_I_INP
TU_ALL_IntDemod
To ADC
TU_ALL_IntDemod
R344
51
R345
51
TU_ALL_IntDemod
C332
0.01uF
C331
22pF
TU_ALL_IntDemod
0.01uF
TU_ALL_IntDemod
Placed as close as possible to IC101
R37 4
51K
AUAD_L_REF
1%
R37 8
47K
1%
C313
4.7uF
10V
AUAD_R_REF
DDR3 VENDOR OPTION
+3.3V_NORMAL
C333
R38 0
1%
R38 1
51K
47K
1%
SCART_LOUT_SOC
SCART_ROUT_SOC
DTV/MNT_V_OUT_SOC
IF_N
L303
OPT
IF_P
AVDD25
L307
120-ohm
C354
10uF
10V
C353
4.7uF
10V
SOC_CVBS_OUT
SCART_LOUT_SOC
SCART_ROUT_SOC
TUNER_SIF
IF_AGC
AUD_MASTER_CLK
AUD_LRCH
AUD_SCK
AUD_LRCK
MAIN I2S_I/F
OPT
INT_ADEMOD
R11022
390
INT_ADEMOD
DTV/MNT_V_OUT_SOC
AVDD25
EU
C334
0.01uF
50V
C335
22pF
OPT
TU_ALL_2178B
C312 0.1uF
C309
1000pF
50V
C338
0.1uF
OPT
Close to IC101
INT_ADEMOD
R11023
390
INT_ADEMOD
C11009
68pF
50V
OPT
EU
C336
0.01uF
EU
50V
R351 22K
SPDIF_OUT
C337
33pF
OPT
TU_ALL_IntDemod
R350
470
SOC_CVBS_OUT
C11010
68pF
50V
R356
R353 0
C339
100pF
50V
COMP1_Y_IN_SOC_SOY
COMP2_Y_IN_SOC_SOY
R357 68
R358 68
R359 68
BLM15BD121SN1
R354 0
R355 0
EU
AUAD_L_CH2_IN
AUAD_R_CH2_IN
R352 22K
AUAD_L_CH3_IN
AUAD_R_CH3_IN
C340
22pF
OPT
I2S_AMP
ADC_I_INP
ADC_I_INN
C11011
TU_CVBS_SOC
SC_CVBS_IN_SOC
AV1_CVBS_IN_SOC
C343 0.047uF
68
EU
SC_ID_SOC
SC_FB_SOC
COMP1_Y_IN_SOC
COMP1_PB_IN_SOC
COMP1_PR_IN_SOC
COMP2_Y_IN_SOC
COMP2_PB_IN_SOC
COMP2_PR_IN_SOC
L304
BLM15BD121SN1
EU
EU
AUDA_OUTL
AUDA_OUTR
AUAD_R_REF
AUAD_L_REF
R360 33
R365 100
R366 100
C342
22pF
OPT
R368 100
R369
GOOGLE
R367 0
INT_ADEMOD
0.1uF
16V
0.047uF
C344
C345 0.047uF
C346 0.047uF
C349
0.1uF
L305
16V
10uF 10VC347
C348 2.2uF
10V
100
GOOGLE
R371 0
C351 0.1uF
C352 0.1uF
GOOGLE
R370 0
AL27
AK26
AM27
AL26
AN27
AL25
AM25
AN23
AL22
AK21
AK22
AL24
AK23
AL23
AK24
AL21
AM23
AN25
AM21
AN21
AK16
AL16
AL19
AK19
AN19
AM19
AN17
AM17
AL17
AK17
AK20
AL20
AK18
AL18
AN15
AM15
AN11
AK11
AK10
AL10
AL11
AM11
AK29
AL29
AM29
AK27
AL30
AK28
AL28
AN29
AD5
AE5
AE7
AE6
AD6
IC101
LG1311
CVBS_IN1
CVBS_IN2
CVBS_IN3
CVBS_VCM
BUF_OUT1
SC1_SID
SC1_FB
SOY1_IN
Y1_IN
PB1_IN
PR1_IN
SOY2_IN
Y2_IN
PB2_IN
PR2_IN
ADC1_COM
ADC2_COM
ADC3_COM
AVSS25_COMP_REF
AVDD25_COMP_REF
AUDA_SCART_OUTL
AUDA_SCART_OUTR
AUAD_L_CH1_IN
AUAD_R_CH1_IN
AUAD_L_CH2_IN
AUAD_R_CH2_IN
AUAD_L_CH3_IN
AUAD_R_CH3_IN
AUAD_L_CH4_IN
AUAD_R_CH4_IN
AUDA_OUTL
AUDA_OUTR
AUAD_L_REF
AUAD_R_REF
AUD_VBG_EXT
IEC958OUT
AUDCLK_OUT
DAC_LRCH
DAC_SLRCH
DAC_CLFCH
DAC_SCK
DAC_LRCK
PCMI3LRCH
PCMI3LRCK
PCMI3SCK
AUDCLK_IN
FRC_LRSYNC
AAD_ADC_SIF
AAD_ADC_SIFM
IFAGC
DMD_DAC_OUT
DMD_SIF_OUT
DMD_ADC_INP
DMD_ADC_INN
DMD_ADC_INCOM
SD_CLK
SD_CMD
SD_CD_N
SD_WP_N
SD_DATA3
SD_DATA2
SD_DATA1
SD_DATA0
RMII_REF_CLK
RMII_CRS_DV
RMII_MDIO
RMII_MDC
RMII_TXEN
RMII_TXD1
RMII_TXD0
RMII_RXD1
RMII_RXD0
HDMI_1_SCL
HDMI_1_SDA
HDMI_1_HPD
HDMI_1_5V_DET
HDMI_1_ARC
HDMI_1_RX_0
HDMI_1_RX_0B
HDMI_1_RX_1
HDMI_1_RX_1B
HDMI_1_RX_2
HDMI_1_RX_2B
HDMI_1_RX_C
HDMI_1_RX_CB
HDMI_2_SCL
HDMI_2_SDA
HDMI_2_HPD
HDMI_2_5V_DET
HDMI_2_RX_0
HDMI_2_RX_0B
HDMI_2_RX_1
HDMI_2_RX_1B
HDMI_2_RX_2
HDMI_2_RX_2B
HDMI_2_RX_C
HDMI_2_RX_CB
HDMI_3_SCL
HDMI_3_SDA
HDMI_3_HPD
HDMI_3_5V_DET
HDMI_3_RX_0
HDMI_3_RX_0B
HDMI_3_RX_1
HDMI_3_RX_1B
HDMI_3_RX_2
HDMI_3_RX_2B
HDMI_3_RX_C
HDMI_3_RX_CB
HDMI_4_SCL
HDMI_4_SDA
HDMI_4_CBUS_HPD
HDMI_4_CD_SENSE
HDMI_4_5V_DET
HDMI_4_RX_0
HDMI_4_RX_0B
HDMI_4_RX_1
HDMI_4_RX_1B
HDMI_4_RX_2
HDMI_4_RX_2B
HDMI_4_RX_C
HDMI_4_RX_CB
E22
D22
F22
F24
D24
E24
F23
E23
AK14
AK12
AL12
AK13
AL13
AM13
AN13
AL14
AK15
AE27
AF28
AE29
AF27
AE28
AF33
AF32
AE31
AE30
AD31
AD30
AF31
AF30
AD28
AD29
AC27
AD27
AC31
AC30
AB33
AB32
AA31
AA30
AD32
AD33
AB28
AB27
AB29
AC28
Y32
Y33
W31
W30
V33
V32
Y31
Y30
Y27
AA28
Y28
AA29
AA27
T31
T30
T32
T33
R31
R30
U31
U30
PAGE 3
SMARTCARD_CLK/SD_EMMC_DATA[0]
SMARTCARD_RST/SD_EMMC_DATA[2]
SMARTCARD_VCC/SD_EMMC_CMD
SMARTCARD_PWR_SEL/SD_EMMC_DATA[1]
DDR3_OPT1
DDR3_OPT2
SMARTCARD_DET/SD_EMMC_DATA[3]
SMARTCARD_DATA/SD_EMMC_CLK
EPHY_REFCLK
EPHY_CRS_DV
EPHY_MDIO
EPHY_MDC
EPHY_EN
EPHY_TXD1
EPHY_TXD0
R520733
EPHY_RXD1
R520633
EPHY_RXD0
DDC_SCL_1
DDC_SDA_1
HDMI_HPD_1
SPDIF_OUT_ARC
D0+_HDMI1
D0-_HDMI1
D1+_HDMI1
D1-_HDMI1
D2+_HDMI1
D2-_HDMI1
CK+_HDMI1
CK-_HDMI1
DDC_SCL_2
DDC_SDA_2
HDMI_HPD_2
D0+_HDMI2
D0-_HDMI2
D1+_HDMI2
D1-_HDMI2
D2+_HDMI2
D2-_HDMI2
CK+_HDMI2
CK-_HDMI2
DDC_SCL_3
DDC_SDA_3
HDMI_HPD_3
5V_HDMI_3_SOC
D0+_HDMI3
D0-_HDMI3
D1+_HDMI3
D1-_HDMI3
D2+_HDMI3
D2-_HDMI3
CK+_HDMI3
CK-_HDMI3
DDC_SCL_4
DDC_SDA_4
HDMI_HPD_4
MHL_DET
D0+_HDMI4
D0-_HDMI4
D1+_HDMI4
D1-_HDMI4
D2+_HDMI4
D2-_HDMI4
CK+_HDMI4
CK-_HDMI4
5V_HDMI_1
R372
10
C356
1uF
10V
5V_HDMI_2
R373
10
C357
1uF
10V
5V_HDMI_4
R375
10
C359
1uF
10V
R376
5.1K
R377
5.1K
R379
5.1K
HP_OUT
L308
BLM18PG121SN1D
HP_LOUT_AMP
BLM18PG121SN1D
HP_ROUT_AMP
HP_OUT
L309
HP_OUT
C365
0.22uF
10V
HP_OUT
C366
0.22uF
10V
HP_LOUT
HP_ROUT
Place at JACK SIDE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-AV In/Out
HP_LOUT_MAIN
HP_ROUT_MAIN
4.7K
4.7K
R384
R382
OPT
OPT
R383 4.7K
R385 4.7K
AUDIO OUT
R303
22K
R304
22K
R311 0
C305
0.01uF
50V
R312 0
C306
0.01uF
50V
DDR3_OPT1
DDR3_OPT2
AUDA_OUTL
AUDA_OUTR
DDC_SCL_3
DDC_SDA_3
HDMI_HPD_3
5V_HDMI_3_SOC
D0+_HDMI3
D0-_HDMI3
D1+_HDMI3
D1-_HDMI3
D2+_HDMI3
D2-_HDMI3
CK+_HDMI3
CK-_HDMI3
MID_LG1311
M14 Symbol C
TP321
TP322
TP323
TP324
TP325
TP326
TP327
TP328
TP329
TP330
TP331
TP332
2013.04.04
3
31
PAGE 4
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC101
LG1311
M0_DDR_VREF1
M0_DDR_VREF2
M0_DDR_U_CLKP
M0_DDR_U_CLKN
M0_DDR_D_CLKP
M0_DDR_D_CLKN
M0_DDR_RESET_N
M0_DDR_DQS_P0
M0_DDR_DQS_N0
M0_DDR_DQS_P1
M0_DDR_DQS_N1
M0_DDR_DQS_P2
M0_DDR_DQS_N2
M0_DDR_DQS_P3
M0_DDR_DQS_N3
M0_DDR_ZQCAL
M0_DDR_A0
M0_DDR_A1
M0_DDR_A2
M0_DDR_A3
M0_DDR_A4
M0_DDR_A5
M0_DDR_A6
M0_DDR_A7
M0_DDR_A8
M0_DDR_A9
M0_DDR_A10
M0_DDR_A11
M0_DDR_A12
M0_DDR_A13
M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0
M0_DDR_BA1
M0_DDR_BA2
M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN
M0_DDR_CASN
M0_DDR_WEN
M0_DDR_DM0
M0_DDR_DM1
M0_DDR_DM2
M0_DDR_DM3
M0_DDR_DQ0
M0_DDR_DQ1
M0_DDR_DQ2
M0_DDR_DQ3
M0_DDR_DQ4
M0_DDR_DQ5
M0_DDR_DQ6
M0_DDR_DQ7
M0_DDR_DQ8
M0_DDR_DQ9
M0_DDR_DQ10
M0_DDR_DQ11
M0_DDR_DQ12
M0_DDR_DQ13
M0_DDR_DQ14
M0_DDR_DQ15
M0_DDR_DQ16
M0_DDR_DQ17
M0_DDR_DQ18
M0_DDR_DQ19
M0_DDR_DQ20
M0_DDR_DQ21
M0_DDR_DQ22
M0_DDR_DQ23
M0_DDR_DQ24
M0_DDR_DQ25
M0_DDR_DQ26
M0_DDR_DQ27
M0_DDR_DQ28
M0_DDR_DQ29
M0_DDR_DQ30
M0_DDR_DQ31
VREF_M0_0
A22
A3
E13
E11
E15
E17
D8
D16
D9
E16
E9
E14
D7
D10
D11
D14
E10
E12
D17
E8
D13
C8
B8
C17
B17
D12
E19
D19
D18
E18
D15
B18
C18
B16
A16
B9
C9
B7
A7
A15
A18
A6
A9
B20
B13
C21
C14
A21
A13
B21
C13
B14
B19
C15
C20
C16
A19
B15
C19
B11
C5
C12
B4
A12
A4
B12
C4
B5
B10
C6
C11
C7
A10
B6
C10
E7
VREF_M0_1
R401 240
M0_DDR_A0
M0_DDR_A1
M0_DDR_A2
M0_DDR_A3
M0_DDR_A4
M0_DDR_A5
M0_DDR_A6
M0_DDR_A7
M0_DDR_A8
M0_DDR_A9
M0_DDR_A10
M0_DDR_A11
M0_DDR_A12
M0_DDR_A13
M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0
M0_DDR_BA1
M0_DDR_BA2
M0_U_CLK
M0_U_CLKN
M0_D_CLK
M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN
M0_DDR_CASN
M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS0
M0_DDR_DQS_N0
M0_DDR_DQS1
M0_DDR_DQS_N1
M0_DDR_DQS2
M0_DDR_DQS_N2
M0_DDR_DQS3
M0_DDR_DQS_N3
M0_DDR_DM0
M0_DDR_DM1
M0_DDR_DM2
M0_DDR_DM3
M0_DDR_DQ0
M0_DDR_DQ1
M0_DDR_DQ2
M0_DDR_DQ3
M0_DDR_DQ4
M0_DDR_DQ5
M0_DDR_DQ6
M0_DDR_DQ7
M0_DDR_DQ8
M0_DDR_DQ9
M0_DDR_DQ10
M0_DDR_DQ11
M0_DDR_DQ12
M0_DDR_DQ13
M0_DDR_DQ14
M0_DDR_DQ15
M0_DDR_DQ16
M0_DDR_DQ17
M0_DDR_DQ18
M0_DDR_DQ19
M0_DDR_DQ20
M0_DDR_DQ21
M0_DDR_DQ22
M0_DDR_DQ23
M0_DDR_DQ24
M0_DDR_DQ25
M0_DDR_DQ26
M0_DDR_DQ27
M0_DDR_DQ28
M0_DDR_DQ29
M0_DDR_DQ30
M0_DDR_DQ31
1%
+1.5V_DDR
R402
R403
+1.5V_DDR
OPT
+1.5V_DDR
R406
R407
+1.5V_DDR
R408
R409
VREF_M0_0
1K 1%
1K 1%
C401
R404
10K
100
R40 5
M0_DDR_VREFCA
1K 1%
1K 1%
M0_DDR_VREFDQ
1K 1%
0.1uF
1K 1%
C403
0.1uF
M0_DDR_RESET_N
M0_D_CLK
M0_D_CLKN
C402
0.1uF
M0_DDR_CKE
+1.5V_DDR
+1.5V_DDR
R411
R412
+1.5V_DDR
R413
R414
VREF_M0_1
R415
1K 1%
R416
1K 1%
R417
10K
M0_U_CLK
100
R41 0
M0_U_CLKN
M0_1_DDR_VREFCA
1K 1%
C406
0.1uF
1K 1%
M0_1_DDR_VREFDQ
1K 1%
0.1uF
1K 1%
C407
C408
0.1uF
M0_DDR_A0
M0_DDR_A1
M0_DDR_A2
M0_DDR_A3
M0_DDR_A4
M0_DDR_A5
M0_DDR_A6
M0_DDR_A7
M0_DDR_A8
M0_DDR_A9
M0_DDR_A10
M0_DDR_A11
M0_DDR_A12
M0_DDR_A13
M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0
M0_DDR_BA1
M0_DDR_BA2
M0_D_CLK
M0_D_CLKN
M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN
M0_DDR_CASN
M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS0
M0_DDR_DQS_N0
M0_DDR_DQS1
M0_DDR_DQS_N1
M0_DDR_DM0
M0_DDR_DM1
M0_DDR_DQ0
M0_DDR_DQ1
M0_DDR_DQ2
M0_DDR_DQ3
M0_DDR_DQ4
M0_DDR_DQ5
M0_DDR_DQ6
M0_DDR_DQ7
M0_DDR_DQ8
M0_DDR_DQ9
M0_DDR_DQ10
M0_DDR_DQ11
M0_DDR_DQ12
M0_DDR_DQ13
M0_DDR_DQ14
M0_DDR_DQ15
IC401
H5TQ4G63AFR-PBC
DDR3
N3
P7
P3
N2
P8
P2
R8
R2
T8
R3
L7
R7
N7
T3
T7
M7
M2
N8
M3
J7
K7
K9
L2
K1
J3
K3
L3
T2
F3
G3
C7
B7
E7
D3
E3
F7
F2
F8
H3
H8
G2
H7
D7
C3
C8
C2
A7
A2
B8
A3
4Gbit
A0
(x16)
A1
DDR_512MB_HYNIX_1600_29n
A2
A3
A4
A5
A6
A7
A8
A9
A10/AP
A11
A12/BC
A13
A14
A15
BA0
BA1
BA2
CK
CK
CKE
CS
ODT
RAS
CAS
WE
RESET
DQSL
DQSL
DQSU
DQSU
DML
DMU
DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7
DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7
VREFCA
VREFDQ
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
NC_1
NC_2
NC_3
NC_4
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9
ZQ
M0_DDR_VREFCA
M0_DDR_VREFDQ
M8
H1
R418
L8
240
1%
B2
D9
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
+1.5V_DDR
IC401-*1
MT41K256M16HA-125:E
DDR_512MB_MICRON
N3
A0
VREFCA
P7
A1
P3
A2
N2
A3
VREFDQ
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
VDD_1
A9
L7
VDD_2
A10/AP
R7
VDD_3
A11
N7
VDD_4
A12/BC
T3
A13
VDD_5
VDD_6
M7
NC_5
VDD_7
VDD_8
M2
BA0
VDD_9
N8
BA1
M3
BA2
VDDQ_1
J7
CK
VDDQ_2
K7
CK
VDDQ_3
K9
CKE
VDDQ_4
VDDQ_5
L2
CS
VDDQ_6
K1
ODT
VDDQ_7
J3
RAS
VDDQ_8
K3
CAS
VDDQ_9
L3
WE
NC_1
T2
RESET
NC_2
NC_3
NC_4
F3
DQSL
G3
DQSL
C7
DQSU
VSS_1
B7
DQSU
VSS_2
VSS_3
E7
DML
VSS_4
D3
DMU
VSS_5
VSS_6
E3
DQ0
VSS_7
F7
DQ1
VSS_8
F2
DQ2
VSS_9
F8
DQ3
VSS_10
H3
DQ4
VSS_11
H8
DQ5
VSS_12
G2
DQ6
H7
DQ7
VSSQ_1
D7
DQ8
VSSQ_2
C3
DQ9
VSSQ_3
C8
DQ10
VSSQ_4
C2
DQ11
VSSQ_5
A7
DQ12
VSSQ_6
A2
DQ13
VSSQ_7
B8
DQ14
VSSQ_8
A3
DQ15
VSSQ_9
C413 1uF
C414 1uF
M8
H1
L8
ZQ
B2
D9
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
T7
A14
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
M0_DDR_A0
M0_DDR_A1
M0_DDR_A2
M0_DDR_A3
M0_DDR_A4
M0_DDR_A5
M0_DDR_A6
M0_DDR_A7
M0_DDR_A8
M0_DDR_A9
M0_DDR_A10
M0_DDR_A11
M0_DDR_A12
M0_DDR_A13
M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0M0_D_CLKN
M0_DDR_BA1
M0_DDR_BA2
M0_U_CLK
M0_U_CLKN
M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN
M0_DDR_CASN
M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS2
M0_DDR_DQS_N2
M0_DDR_DQS3
M0_DDR_DQS_N3
M0_DDR_DM2
M0_DDR_DM3
M0_DDR_DQ16
M0_DDR_DQ17
M0_DDR_DQ18
M0_DDR_DQ19
M0_DDR_DQ20
M0_DDR_DQ21
M0_DDR_DQ22
M0_DDR_DQ23
M0_DDR_DQ24
M0_DDR_DQ25
M0_DDR_DQ26
M0_DDR_DQ27
M0_DDR_DQ28
M0_DDR_DQ29
M0_DDR_DQ30
M0_DDR_DQ31
MT41K256M16HA-125:E
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQ0
F7
DQ1
F2
DQ2
F8
DQ3
H3
DQ4
H8
DQ5
G2
DQ6
H7
DQ7
D7
DQ8
C3
DQ9
C8
DQ10
C2
DQ11
A7
DQ12
A2
DQ13
B8
DQ14
A3
DQ15
IC402-*1
DDR_512MB_MICRON
IC402
H5TQ4G63AFR-PBC
DDR3
N3
4Gbit
A0
P7
(x16)
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
A14
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
M0_1_DDR_VREFCA
VREFCA
VREFDQ
ZQ
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
NC_1
NC_2
NC_3
NC_4
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9
M8
H1
L8
B2
D9
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
M0_1_DDR_VREFDQ
+1.5V_DDR
R419
240
1%
C429
C430
1uF
1uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
M14 DDR3-M0
2013.04.04
4
31
PAGE 5
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC101
LG1311
M1_DDR_U_CLKP
M1_DDR_U_CLKN
M1_DDR_D_CLKP
M1_DDR_D_CLKN
M1_DDR_RESET_N
M1_DDR_DQS_P0
M1_DDR_DQS_N0
M1_DDR_DQS_P1
M1_DDR_DQS_N1
M1_DDR_DQS_P2
M1_DDR_DQS_N2
M1_DDR_DQS_P3
M1_DDR_DQS_N3
M1_DDR_VREF1
M1_DDR_VREF2
M1_DDR_A0
M1_DDR_A1
M1_DDR_A2
M1_DDR_A3
M1_DDR_A4
M1_DDR_A5
M1_DDR_A6
M1_DDR_A7
M1_DDR_A8
M1_DDR_A9
M1_DDR_A10
M1_DDR_A11
M1_DDR_A12
M1_DDR_A13
M1_DDR_A14
M1_DDR_A15
M1_DDR_BA0
M1_DDR_BA1
M1_DDR_BA2
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN
M1_DDR_CASN
M1_DDR_WEN
M1_DDR_DM0
M1_DDR_DM1
M1_DDR_DM2
M1_DDR_DM3
M1_DDR_DQ0
M1_DDR_DQ1
M1_DDR_DQ2
M1_DDR_DQ3
M1_DDR_DQ4
M1_DDR_DQ5
M1_DDR_DQ6
M1_DDR_DQ7
M1_DDR_DQ8
M1_DDR_DQ9
M1_DDR_DQ10
M1_DDR_DQ11
M1_DDR_DQ12
M1_DDR_DQ13
M1_DDR_DQ14
M1_DDR_DQ15
M1_DDR_DQ16
M1_DDR_DQ17
M1_DDR_DQ18
M1_DDR_DQ19
M1_DDR_DQ20
M1_DDR_DQ21
M1_DDR_DQ22
M1_DDR_DQ23
M1_DDR_DQ24
M1_DDR_DQ25
M1_DDR_DQ26
M1_DDR_DQ27
M1_DDR_DQ28
M1_DDR_DQ29
M1_DDR_DQ30
M1_DDR_DQ31
M1_DDR_ZQCAL
VREF_M1_0
A2
Y1
M5
N5
K5
H5
T4
H4
R4
J5
T5
L5
U4
P4
P5
K4
R5
N4
G4
U5
L4
R3
R2
F3
F2
M4
F5
E4
F4
G5
J4
E2
E3
G2
G1
P2
P3
T2
T1
H1
E1
U1
P1
C2
K2
B3
J3
B1
K1
B2
K3
J2
D2
H3
C3
G3
D1
H2
D3
M2
V3
L3
W2
L1
W1
L2
W3
V2
N2
U3
M3
T3
N1
U2
N3
E5
R501
VREF_M1_1
M1_DDR_A0
M1_DDR_A1
M1_DDR_A2
M1_DDR_A3
M1_DDR_A4
M1_DDR_A5
M1_DDR_A6
M1_DDR_A7
M1_DDR_A8
M1_DDR_A9
M1_DDR_A10
M1_DDR_A11
M1_DDR_A12
M1_DDR_A13
M1_DDR_A14
M1_DDR_A15
M1_DDR_BA0
M1_DDR_BA1
M1_DDR_BA2
M1_U_CLK
M1_U_CLKN
M1_D_CLK
M1_D_CLKN
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN
M1_DDR_CASN
M1_DDR_WEN
M1_DDR_RESET_N
M1_DDR_DQS_N0
M1_DDR_DQS1
M1_DDR_DQS_N1
M1_DDR_DQS2
M1_DDR_DQS_N2
M1_DDR_DQS3
M1_DDR_DQS_N3
M1_DDR_DM0
M1_DDR_DM2
M1_DDR_DM3
M1_DDR_DQ0
M1_DDR_DQ1
M1_DDR_DQ2
M1_DDR_DQ3
M1_DDR_DQ4
M1_DDR_DQ5
M1_DDR_DQ6
M1_DDR_DQ7
M1_DDR_DQ8
M1_DDR_DQ9
M1_DDR_DQ10
M1_DDR_DQ11
M1_DDR_DQ12
M1_DDR_DQ13
M1_DDR_DQ14
M1_DDR_DQ15
M1_DDR_DQ16
M1_DDR_DQ17
M1_DDR_DQ18
M1_DDR_DQ19
M1_DDR_DQ20
M1_DDR_DQ21
M1_DDR_DQ22
M1_DDR_DQ23
M1_DDR_DQ24
M1_DDR_DQ25
M1_DDR_DQ26
M1_DDR_DQ27
M1_DDR_DQ28
M1_DDR_DQ29
M1_DDR_DQ30
M1_DDR_DQ31
240
1%
+1.5V_DDR
R508
R509
+1.5V_DDR
OPT
+1.5V_DDR
R504
R505
+1.5V_DDR
R506
R507
VREF_M1_0
1K 1%
C501
1K 1%
R502
10K
100
R50 3
M1_DDR_VREFCA
1K 1%
C502
0.1uF
1K 1%
M1_DDR_VREFDQ
1K 1%
0.1uF
1K 1%
C503
0.1uF
M1_DDR_RESET_N
M1_D_CLK
M1_D_CLKN
+1.5V_DDR
M1_DDR_CKE
+1.5V_DDR
+1.5V_DDR
VREF_M1_1
R515
1K 1%
R516
1K 1%
100
R51 0
M1_1_DDR_VREFCA
R511
1K 1%
R512
1K 1%
M1_1_DDR_VREFDQ
R513
1K 1%
0.1uF
R514
1K 1%
C508
C506
R517
10K
M1_U_CLK
M1_U_CLKN
C507
0.1uF
0.1uF
M1_DDR_RASNM1_DDR_DQS0
M1_DDR_CASN
M1_DDR_RESET_N
M1_DDR_DQS0
M1_DDR_DQS_N0
M1_DDR_DQS1M1_DDR_DM1
M1_DDR_DQS_N1
M1_DDR_DM0
M1_DDR_DM1
M1_DDR_DQ10
M1_DDR_DQ11
M1_DDR_DQ12
M1_DDR_DQ13
M1_DDR_DQ14
M1_DDR_DQ15
M1_DDR_A0
M1_DDR_A1
M1_DDR_A2
M1_DDR_A3
M1_DDR_A4
M1_DDR_A5
M1_DDR_A6
M1_DDR_A7
M1_DDR_A8
M1_DDR_A9
M1_DDR_A10
M1_DDR_A11
M1_DDR_A12
M1_DDR_A13
M1_DDR_A14
M1_DDR_A15
M1_DDR_BA0
M1_DDR_BA1
M1_DDR_BA2
M1_D_CLK
M1_D_CLKN
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_WEN
M1_DDR_DQ0
M1_DDR_DQ1
M1_DDR_DQ2
M1_DDR_DQ3
M1_DDR_DQ4
M1_DDR_DQ5
M1_DDR_DQ6
M1_DDR_DQ7
M1_DDR_DQ8
M1_DDR_DQ9
IC501
H5TQ4G63AFR-PBC
N3
DDR3
A0
P7
4Gbit
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
IC501-*1
MT41K256M16HA-125:E
DDR_512MB_MICRON
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQ0
F7
DQ1
F2
DQ2
F8
DQ3
H3
DQ4
H8
DQ5
G2
DQ6
H7
DQ7
D7
DQ8
C3
DQ9
C8
DQ10
C2
DQ11
A7
DQ12
A2
DQ13
B8
DQ14
A3
DQ15
VREFCA
VREFDQ
ZQ
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
NC_1
NC_2
NC_3
NC_4
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9
IC502-*3
MT41K128M16JT-125:K
DDR_256MB_MICRON
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQ0
F7
DQ1
F2
DQ2
F8
DQ3
H3
DQ4
H8
DQ5
G2
DQ6
H7
DQ7
D7
DQ8
C3
DQ9
C8
DQ10
C2
DQ11
A7
DQ12
A2
DQ13
B8
DQ14
A3
DQ15
+1.5V_DDR
M8
H1
L8
B2
D9
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
M1_1_DDR_VREFCA
R519
+1.5V_DDR
C540
C541 1uF
M1_1_DDR_VREFDQ
240
1uF
DDR3 1.5V bypass Cap
: Place these caps near Memory
+1.5V_DDR
M1_DDR_VREFCA
R518
1uF
M1_DDR_VREFDQ
240
DDR3 1.5V bypass Cap
: Place these caps near Memory
H5TQ2G63FFR-PBC
DDR_256MB_HYNIX_1600_29n
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
IC501-*2
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
IC502-*1
MT41K256M16HA-125:E
DDR_512MB_MICRON
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQ0
F7
DQ1
F2
DQ2
F8
DQ3
H3
DQ4
H8
DQ5
G2
DQ6
H7
DQ7
D7
DQ8
C3
DQ9
C8
DQ10
C2
DQ11
A7
DQ12
A2
DQ13
B8
DQ14
A3
DQ15
VREFCA
VREFDQ
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
NC_1
NC_2
NC_3
NC_4
A14
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9
+1.5V_DDR
M8
H1
L8
ZQ
B2
D9
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
T7
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
C524
C525 1uF
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
NC_1
NC_2
NC_3
NC_4
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
A14
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
1_2Gbit : T7(NC_6)
4Gbit : T7(A14)
M1_DDR_A0
M1_DDR_A1
M1_DDR_A2
M1_DDR_A3
M1_DDR_A4
M1_DDR_A5
M1_DDR_A6
M1_DDR_A7
M1_DDR_A8
M1_DDR_A9
M1_DDR_A10
M1_DDR_A11
M1_DDR_A12
M1_DDR_A13
M1_DDR_A14
M1_DDR_A15
M1_DDR_BA0
M1_DDR_BA1
M1_DDR_BA2
M1_U_CLK
M1_U_CLKN
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN
M1_DDR_CASN
M1_DDR_WEN
M1_DDR_RESET_N
M1_DDR_DQS2
M1_DDR_DQS_N2
M1_DDR_DQS3
M1_DDR_DQS_N3
M1_DDR_DM2
M1_DDR_DM3
M1_DDR_DQ16
M1_DDR_DQ17
M1_DDR_DQ18
M1_DDR_DQ19
M1_DDR_DQ20
M1_DDR_DQ21
M1_DDR_DQ22
M1_DDR_DQ23
M1_DDR_DQ24
M1_DDR_DQ25
M1_DDR_DQ26
M1_DDR_DQ27
M1_DDR_DQ28
M1_DDR_DQ29
M1_DDR_DQ30
M1_DDR_DQ31
IC502-*2
H5TQ2G63FFR-PBC
DDR_256MB_HYNIX_1600_29n
N3
M8
A0
VREFCA
P7
A1
P3
A2
N2
H1
A3
VREFDQ
P8
A4
P2
A5
R8
L8
A6
ZQ
R2
A7
T8
A8
B2
R3
VDD_1
A9
D9
L7
VDD_2
A10/AP
G7
R7
VDD_3
A11
N7
K2
VDD_4
A12/BC
T3
K8
A13
VDD_5
N1
VDD_6
M7
N9
NC_5
VDD_7
R1
VDD_8
M2
R9
BA0
VDD_9
N8
BA1
M3
BA2
A1
VDDQ_1
J7
A8
CK
VDDQ_2
K7
C1
CK
VDDQ_3
K9
C9
CKE
VDDQ_4
D2
VDDQ_5
L2
E9
CS
VDDQ_6
K1
F1
ODT
VDDQ_7
J3
H2
RAS
VDDQ_8
K3
H9
CAS
VDDQ_9
L3
WE
J1
NC_1
T2
J9
RESET
NC_2
L1
NC_3
L9
NC_4
F3
T7
DQSL
NC_6
G3
DQSL
C7
A9
DQSU
VSS_1
B7
B3
DQSU
VSS_2
E1
VSS_3
E7
G8
DML
VSS_4
D3
J2
DMU
VSS_5
J8
VSS_6
E3
M1
DQL0
VSS_7
F7
M9
DQL1
VSS_8
F2
P1
DQL2
VSS_9
F8
P9
DQL3
VSS_10
H3
T1
DQL4
VSS_11
H8
T9
DQL5
VSS_12
G2
DQL6
H7
DQL7
B1
VSSQ_1
D7
B9
DQU0
VSSQ_2
C3
D1
DQU1
VSSQ_3
C8
D8
DQU2
VSSQ_4
C2
E2
DQU3
VSSQ_5
A7
E8
DQU4
VSSQ_6
A2
F9
DQU5
VSSQ_7
B8
G1
DQU6
VSSQ_8
A3
G9
DQU7
VSSQ_9
IC502
H5TQ4G63AFR-PBC
N3
DDR3
A0
P7
4Gbit
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
IC501-*3
MT41K128M16JT-125:K
DDR_256MB_MICRON
N3
M8
A0
VREFCA
P7
A1
P3
A2
N2
H1
A3
VREFDQ
P8
A4
P2
A5
R8
L8
A6
ZQ
R2
A7
T8
A8
B2
R3
VDD_1
A9
D9
L7
VDD_2
A10/AP
G7
R7
VDD_3
A11
N7
K2
VDD_4
A12/BC
T3
K8
A13
VDD_5
N1
VDD_6
M7
N9
NC_5
VDD_7
R1
VDD_8
M2
R9
BA0
VDD_9
N8
BA1
M3
BA2
A1
VDDQ_1
J7
A8
CK
VDDQ_2
K7
C1
CK
VDDQ_3
K9
C9
CKE
VDDQ_4
D2
VDDQ_5
L2
E9
CS
VDDQ_6
K1
F1
ODT
VDDQ_7
J3
H2
RAS
VDDQ_8
K3
H9
CAS
VDDQ_9
L3
WE
J1
NC_1
T2
J9
RESET
NC_2
L1
NC_3
L9
NC_4
F3
T7
DQSL
NC_6
G3
DQSL
C7
A9
DQSU
VSS_1
B7
B3
DQSU
VSS_2
E1
VSS_3
E7
G8
DML
VSS_4
D3
J2
DMU
VSS_5
J8
VSS_6
E3
M1
DQ0
VSS_7
F7
M9
DQ1
VSS_8
F2
P1
DQ2
VSS_9
F8
P9
DQ3
VSS_10
H3
T1
DQ4
VSS_11
H8
T9
DQ5
VSS_12
G2
DQ6
H7
DQ7
B1
VSSQ_1
D7
B9
DQ8
VSSQ_2
C3
D1
DQ9
VSSQ_3
C8
D8
DQ10
VSSQ_4
C2
E2
DQ11
VSSQ_5
A7
E8
DQ12
VSSQ_6
A2
F9
DQ13
VSSQ_7
B8
G1
DQ14
VSSQ_8
A3
G9
DQ15
VSSQ_9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_LG1311
M14 DDR3-M1
2013.04.04
5
31
PAGE 6
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
VDD3V3_HDMI
AVDD33
C637
0.1uF
16V
+1.5V_DDR
TP5207
+1.5V_DDR
TP5208
AVDD25_C4TX
AVDD25
AVDD25_AUD
GND JIG POINT
DVDD33
JP601
AA23
AC12
AC13
AC14
AC15
AC11
AF22
AA11
AC18
AC19
AC20
AC21
AC22
AC23
AC17
AB23
L18
L21
L22
L23
M23
T11
Y23
P23
R23
T23
U23
V23
F10
F11
F12
F13
F14
F15
F16
F17
V11
W11
Y11
G19
H19
H20
JP602
F9
G6
H6
J6
K6
L6
M6
N6
P6
R6
IC101
LG1311
DVDD33_1
DVDD33_2
DVDD33_3
DVDD33_4
DVDD33_5
DVDD33_6
DVDD33_7
DVDD33_8
DVDD33_9
DVDD33_10
DVDD33_11
DVDD33_12
AVDD33_BT_USB
AVDD33_USB_1
AVDD33_USB_2
AVDD33_HDMI_1
AVDD33_HDMI_2
AVDD33_HDMI_3
AVDD33_CVBS
DVDD15_M0_1
DVDD15_M0_2
DVDD15_M0_3
DVDD15_M0_4
DVDD15_M0_5
DVDD15_M0_6
DVDD15_M0_7
DVDD15_M0_8
DVDD15_M0_9
DVDD15_M1_1
DVDD15_M1_2
DVDD15_M1_3
DVDD15_M1_4
DVDD15_M1_5
DVDD15_M1_6
DVDD15_M1_7
DVDD15_M1_8
DVDD15_M1_9
AVDD25_C4TX_1
AVDD25_C4TX_2
AVDD25_C4TX_3
AVDD25_C4TX_4
AVDD25_COMP_1
AVDD25_COMP_2
AVDD25_CVBS_1
AVDD25_CVBS_2
AVDD25_DMD
AVDD25_AAD
DVDD25_XTAL
AVDD25_DR3PLL
SP_VQPS
AVDD25_AUD
AVDD25_APLL
JP604
JP603
DVDD11_1
DVDD11_2
DVDD11_3
DVDD11_4
DVDD11_5
DVDD11_6
DVDD11_7
DVDD11_8
DVDD11_9
DVDD11_10
DVDD11_11
DVDD11_12
DVDD11_13
DVDD11_14
DVDD11_15
DVDD11_16
DVDD11_17
DVDD11_18
DVDD11_19
DVDD11_20
DVDD11_21
DVDD11_22
DVDD11_23
DVDD11_24
DVDD11_25
DVDD11_26
DVDD11_27
DVDD11_28
DVDD11_29
DVDD11_30
DVDD11_31
DVDD11_32
DVDD11_33
DVDD11_34
DVDD11_35
DVDD11_36
DVDD11_37
DVDD11_38
DVDD11_39
DVDD11_40
DVDD11_41
DVDD11_42
DVDD11_43
DVDD11_44
DVDD11_45
DVDD11_46
DVDD11_47
DVDD11_48
DVDD11_49
DVDD11_50
DVDD11_51
AVDD11_APLL
AVDD11_COMP_LLPLL
AVDD11_C4TX_1
AVDD11_C4TX_2
AVDD11_C4TX_3
AVDD11_C4TX_4
DVDD11_XTAL
DVDD11_DR3PLL
DVDD11_CVBSPLL
AVDD11_DMD_1
AVDD11_DMD_2
DVDD18_EMMC_1
DVDD18_EMMC_2
+1.1V_VDD
M20
M21
N13
N14
N15
N16
N17
N18
P20
P21
R13
R14
R15
R16
R17
R18
R19
R20
R21
T13
T20
T21
U14
U15
U16
U17
U18
U19
U20
U21
V13
V20
V21
W13
W14
W15
W16
W17
W18
W19
Y13
Y20
Y21
AA13
AA14
AA15
AA17
AA18
AA19
AA20
AA21
AB21
AB19
V12
W12
Y12
AA12
G18
H18
AF23
AF24
AF25
L26
M26
TP5209
+1.1V_VDD
AVDD11_DMD
TP5210
DVDD18_EMMC
+3.3V_Bypass Cap
+3.3V_NORMAL
L601
BLM18PG121SN1D
C601
4.7uF
+2.5V_Bypass Cap
+2.5V_NORMAL
L602
BLM18PG121SN1D
C602
4.7uF
+2.5V_NORMAL
AVDD25_AUD
L603
BLM18PG121SN1D
C603
4.7uF
DVDD33
10V
AVDD25
10V
10V
C604
4.7uF
C605
4.7uF
C606
4.7uF
B22
B24
C22
C23
C24
D4
D5
D6
D20
D21
E6
E20
E21
F6
F7
F8
F18
F19
F20
F21
G7
G8
G9
G10
G11
G12
G13
G14
G15
G16
G17
G20
G21
G22
G23
G24
G25
G26
G27
H7
H8
H9
H10
H11
H12
H13
H14
H15
H16
H17
H21
H22
H23
H24
H25
H26
H27
H31
J7
J8
J26
J27
K7
K8
K26
K27
L7
L8
L11
L12
L13
L14
L15
L16
L17
L19
L20
L27
M7
M8
M11
M12
M13
M14
M15
M16
M17
M18
M19
M22
M27
N7
N8
N11
N12
N19
N20
N21
N22
N23
N26
N27
N30
P7
P8
P11
P12
P13
P14
P15
P16
P17
P18
IC101
LG1311
GND_1
GND_2
GND_3
GND_4
GND_5
GND_6
GND_7
GND_8
GND_9
GND_10
GND_11
GND_12
GND_13
GND_14
GND_15
GND_16
GND_17
GND_18
GND_19
GND_20
GND_21
GND_22
GND_23
GND_24
GND_25
GND_26
GND_27
GND_28
GND_29
GND_30
GND_31
GND_32
GND_33
GND_34
GND_35
GND_36
GND_37
GND_38
GND_39
GND_40
GND_41
GND_42
GND_43
GND_44
GND_45
GND_46
GND_47
GND_48
GND_49
GND_50
GND_51
GND_52
GND_53
GND_54
GND_55
GND_56
GND_57
GND_58
GND_59
GND_60
GND_61
GND_62
GND_63
GND_64
GND_65
GND_66
GND_67
GND_68
GND_69
GND_70
GND_71
GND_72
GND_73
GND_74
GND_75
GND_76
GND_77
GND_78
GND_79
GND_80
GND_81
GND_82
GND_83
GND_84
GND_85
GND_86
GND_87
GND_88
GND_89
GND_90
GND_91
GND_92
GND_93
GND_94
GND_95
GND_96
GND_97
GND_98
GND_99
GND_100
GND_101
GND_102
GND_103
GND_104
GND_105
GND_106
GND_107
GND_108
GND_109
GND_110
GND_111
GND_112
GND_113
GND_114
GND_115
GND_116
GND_117
GND_118
GND_119
GND_120
GND_121
GND_122
GND_123
GND_124
GND_125
GND_126
GND_127
GND_128
GND_129
GND_130
GND_131
GND_132
GND_133
GND_134
GND_135
GND_136
GND_137
GND_138
GND_139
GND_140
GND_141
GND_142
GND_143
GND_144
GND_145
GND_146
GND_147
GND_148
GND_149
GND_150
GND_151
GND_152
GND_153
GND_154
GND_155
GND_156
GND_157
GND_158
GND_159
GND_160
GND_161
GND_162
GND_163
GND_164
GND_165
GND_166
GND_167
GND_168
GND_169
GND_170
GND_171
GND_172
GND_173
GND_174
GND_175
GND_176
GND_177
GND_178
GND_179
GND_180
GND_181
GND_182
GND_183
GND_184
GND_185
GND_186
GND_187
GND_188
GND_189
GND_190
GND_191
GND_192
GND_193
GND_194
GND_195
GND_196
GND_197
GND_198
GND_199
GND_200
GND_201
GND_202
GND_203
GND_204
GND_205
GND_206
GND_207
GND_208
GND_209
GND_210
GND_211
GND_212
GND_213
GND_214
GND_215
GND_216
GND_217
GND_218
GND_219
GND_220
GND_221
GND_222
GND_223
GND_224
GND_225
GND_226
P19
P22
P26
P30
R7
R8
R11
R12
R22
R26
R27
T6
T7
T8
T12
T14
T15
T16
T17
T18
T19
T22
T26
T27
U6
U7
U8
U11
U12
U13
U22
U26
V4
V5
V6
V7
V8
V14
V15
V16
V17
V18
V19
V22
V26
V30
V31
W4
W8
W20
W21
W22
W23
W26
W27
Y2
Y3
Y4
Y8
Y14
Y15
Y16
Y17
Y18
Y19
Y22
Y26
AA8
AA16
AA22
AA26
AB11
AB12
AB13
AB14
AB15
AB16
AB17
AB18
AB20
AB22
AB26
AB30
AB31
AC16
AC26
AD26
AE26
AF6
AF8
AF9
AF10
AF11
AF12
AF13
AF14
AF15
AF16
AF17
AF18
AF19
AF20
AF21
AF26
AG20
AG25
AG31
AH25
AJ25
AK9
AK25
AL9
AL15
+1.1V_Bypass Cap
+3.3V_NORMAL
C607
0.1uF
16V
10V
L606
BLM18PG121SN1D
C614
4.7uF
AVDD33
10V
C615
0.1uF
16V
AFE 3CH Power
+2.5V_NORMAL
C608
0.1uF
10V
16V
C609
0.1uF
10V
16V
AVDD25_C4TX
L604
BLM18PG121SN1D
C610
0.1uF
16V
C613
4.7uF
10V
C616
0.1uF
16V
+1.1V_VDD
C618
C617
4.7uF
4.7uF
10V
+1.1V_VDD
BLM18PG121SN1D
10V
L607
C619
4.7uF
10V
AVDD11_DMD
C622
4.7uF
10V
C620
4.7uF
10V
C625
0.1uF
C623
4.7uF
16V
C626
0.1uF
10V
16V
0.1uF
0.1uF
16V
16V
C628
C627
+1.5V_Bypass Cap
+1.5V_DDR
OPT
C631
+1.5V_DDR
C629
22uF
10V
OPT
C630
22uF
10V
0.1uF
16V
C632
0.1uF
16V
C633
0.1uF
16V
C634
0.1uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
MID_LG1311
VCC & GND
2013.04.04
6
31
Loading...