LG 55LB5900-UV Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LA43B

MODEL : 55LB5900 55LB5900-UV

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL67988318(1405-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 4

ADJUSTMENT INSTRUCTION .............................................................. 11

TROUBLE SHOOTING ............................................................................ 17

BLOCK DIAGRAM .................................................................................. 22

EXPLODED VIEW .................................................................................. 25

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This spec sheet is applied LCD TV with LA43B/M chassis

2. Test condition

Each part is tested as below without special notice.

1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage

Market Input voltage Frequency Remark

USA 100~240V 50/60Hz Standard Voltage of each

product is marked by models

4) Specification and performance of each parts are followed ea ch drawing and s pe cificatio n b y p art number in accordance with BOM

5) The receiver must be operated for about 20 minutes prior to the adjustment

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

Safety : UL, CSA, IEC specification EMC: FCC, ICES, IEC specification

Only for training and service purposes

- 6 -

4. General Specification

No Item Specication Result Remark

1. Receiving System ATSC / NTSC-M / 64 & 256 QAM

2. Available Channel 1) VHF : 02~13

2) UHF : 14~69

3) DTV : 02-69

4) CATV : 01~135

5) CADTV : 01~135

3. Input Voltage AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz (N.America)

4. Market NORTH AMERICA

5. Screen Size 42/49 inch Wide (1920 × 1080) FHD + 60Hz All models without HD models

60 Inch Wide (1920X1080) FHD + M120Hz

32 inch Wide (1366 × 768) HD + 60Hz

6. Aspect Ratio 16:9

7. Tuning System FS

8. Module POLA HC600DUF-VHHS1 HC600DUF-VHHS2

LC550DUE-FGA3 LC550DUE-FGA4

T550HVF04.1 T550HVF04.2

HC550DUN-VSHS1 HC550DUN-VSHS2

LC500DUE-FGA3 LC500DUE-FGA4

NC500DUN-VXBP1 NC500DUN-VXBP2

LC470DUE-FGA3 LC470DUE-FGA4

LC420DUE-FGP2 LGD 42LB6200-Ux

9. Operating Environment 1) Temp : 0 ~ 40 deg

2) Humidity : ~ 80 %

10. Storage Environment 1) Temp : -20 ~ 60 deg

2) Humidity : ~ 85 %

HS (Sharp Panel) 60LB6000-Ux

60LB5900-Ux

LGD 55LB6000-Ux

55LB5900-Ux

AUO 55LB6000-Ux.xxxJxxx

55LB5900-Ux.xxxJxxx

HS (CSOT Panel) 55LB6000-Ux.xxxCxxx

55LB5900-Ux.xxxCxxx

LGD 50LB6000-Ux.xxxWxxx

50LB5900-Ux.xxxWxxx

INX 50LB6000-Ux.xxxJxxx

50LB5900-Ux.xxxJxxx

LGD 47LB6000-Ux

47LB5900-Ux

Only for training and service purposes

- 7 -

5. Supported video resolutions

5.1. Component input(Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

1 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I

2 720*480 15.73 59.94 13.50 SDTV ,DVD 480I

3 720*480 31.50 60.00 27.027 SDTV 480P

4 720*480 31.47 59.94 27.00 SDTV 480P

5 1280*720 45.00 60.00 74.25 HDTV 720P

6 1280*720 44.96 59.94 74.176 HDTV 720P

7 1920*1080 33.75 60.00 74.25 HDTV 1080I

8 1920*1080 33.72 59.94 74.176 HDTV 1080I

9 1920*1080 67.50 60.00 148.50 HDTV 1080P

10 1920*1080 67.432 59.94 148.352 HDTV 1080P

11 1920*1080 27.00 24.00 74.25 HDTV 1080P

12 1920*1080 26.97 23.94 74.176 HDTV 1080P

13 1920*1080 33.75 30.00 74.25 HDTV 1080P

14 1920*1080 33.71 29.97 74.176 HDTV 1080P

5.2. HDMI Input (DTV / PC)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

DTV

1 720*480 31.500 60.000 27.027 SDTV 480P

2 720*480 31.470 59.940 27.000 SDTV 480P

3 1280*720 45.000 60.000 74.250 HDTV 720P

4 1280*720 44.960 59.940 74.176 HDTV 720P

5 1920*1080 33.750 60.000 74.250 HDTV 1080I

6 1920*1080 33.720 59.940 74.176 HDTV 1080I

7 1920*1080 67.500 60.000 148.500 HDTV 1080P

8 1920*1080 67.4320 59.940 148.352 HDTV 1080P

9 1920*1080 27.000 24.000 74.250 HDTV 1080P

10 1920*1080 26.970 23.976 74.176 HDTV 1080P

11 1920*1080 33.750 30.000 74.250 HDTV 1080P

12 1920*1080 33.710 29.970 74.176 HDTV 1080P

1 640*350 31.468 70.09 25.17 EGA X

2 720*400 31.469 70.08 28.32 DOS O

3 640*480 31.469 59.94 25.17 VESA(VGA) O

4 800*600 37.879 60.31 40.00 VESA(SVGA) O

5 1024*768 48.363 60.00 65.00 VESA(XGA) O

6 1152*864 54.348 60.053 VESA O

7 1280*1024 63.981 60.020 108.0 VESA (SXGA) O Full HD model Only

8 1360*768 47.712 60.015 85.50 VESA (WXGA) O

9 1920*1080 67.50 60.00 148.5 HDTV 1080P O Full HD model Only

Only for training and service purposes

- 8 -

6. 3D Mode ('LB6200' models)

6.1. RF Input(DTV)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1 1920*1080 45.00 60.00 74.25 HDTV 1080I Side by Side, Top & Bottom

2 1280*720 45.00 60.00 74.25 HDTV 720P Side by Side, Top & Bottom

6.2. HDMI Input

(a) HDMI Input(1.4a)

- When connect the cable on TV or change the input mode, 3D display on automatically

- Display OSD information => 1920x2205 [1080p 24], 1280x1470 [720p 60]

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1280*720 89.9 / 90 59.94/60 148.35/148.50 HDTV 720P Frame packing (720 60p)

2 1280*720 45 60 74.25 HDTV 720P Side by Side(half), Top & Bottom

3 1920*1080 53.95 / 54 23.98 / 24 148.35/148.50 HDTV 1080P Frame packing (1080 24p)

4 1920*1080 67.5 60 148.50 HDTV 1080P Side by Side(half), Top & bottom

5 1920*1080 33.7 60 74.25 HDTV 1080i Side by Side(half), Top & Bottom

6 1920*1080 27 24 74.25 HDTV 1080P Side by Side(half), Top & Bottom

7 1920*1080 33.7 30 74.25 HDTV 1080P Side by Side(half), Top &Bottom

(b) HDMI Input(1.3)

- Connect the HDMI cable & receiving the HDMI signal

- Press “3D” key of remote control & select 3D format below.

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1280*720 45.00 60.00 74.25 HDTV 720P Side by Side, Top & Bottom

2 1920*1080 33.75 60.00 74.25 HDTV 1080I Side by Side, Top & Bottom

3 1920*1080 27.00 24.00 74.25 HDTV 1080P Side by Side, Top & Bottom

4 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side, Top & Bottom

5 1920*1080 67.50 60.00 148.5 HDTV 1080P Side by Side, Top & Bottom,

Single Frame Sequential

6.3. USB Input

(a) Movie

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side, Top & Bottom

(b) MPO Picture 3D : when selecting the MPO le, Automatically 3D on

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side

Only for training and service purposes

- 9 -

6.4. 2D to 3D Mode

6.5. DLNA

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side, Top & Bottom

6.6. Remark: 3D Input mode

No 2D to 3D Top & Bottom Side by Side Single Frame Sequential Frame Packing

Only for training and service purposes

- 10 -

ADJUSTMENT INSTRUCTION

1. Application

This spec. sheet applies to LA43B/M Chassis applied LED TV all models manufactured in TV factory

2. Specification

(1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation

transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of

25 ±5 ºC of temperature and 65±10% of relative humidity if

there is no specific designation (4) The input voltage of the receiver must keep 100~240V,

50/60Hz (5) At first Worker must turn on the SET by using Power Only

key. (6) The receiver must be operated for about 5 minutes prior to

the adjustment when module is in the circumstance of over

ºC

In case of keeping module is in the circumstance of 0°C, it

should be placed in the circumstance of above 15°C for 2

hours In case of keeping module is in the circumstance of below

-20°C, it should be placed in the circumstance of above

15°C for 3 hours.

※ Caution When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area

3. Adjustment items

3.1. Main PCBA Adjustments

(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p (2) EDID download: HDMI and RGB-PC

■ Above adjustment items can be also performed in Final

Assembly if needed. Adjustment items in both PCBA and final assembly tages can be checked by using the INSTART Menu(1.ADJUST CHECK)

Component 1080p and RGB-PC Adjust will be calculated by

480i adjust value.

3.2. Final assembly adjustment

(1) White Balance adjustment (2) RS-232C functionality check (3) Factory Option setting per destination (4) Shipment mode setting (In-Stop) (5) GND and HI-POT test

4. MAIN PCBA Adjustments

4.1. ADC Calibration

4.1.1. Overview

▪ ADC adjustment is needed to find the optimum black level and

gain in Analog-to-Digital device and to compensate RGB deviation

4.1.2. Equipment & Condition

(1) Protocol: RS-232C (2) Inner Pattern

- Resolution : 1080p(Comp) / 1024*768(RGB)

- Pattern : Horizontal 100% Color Bar Pattern

- Pattern level : 0.7±0.1 Vp-p

4.1.3. Adjustment

4.1.3.1. Adjustment method

- Connect to Jig by using RS-232(USB), adjust Component

※ Manual adj (If needed in Final Assembly)

- Required equipment : Adjustment R/C

- Enter Service Mode by pushing “ADJ” key,

- Start ‘OTP’ ADC Type by pushing ‘►’ key at [7. ADC Calibration]

※ In L13 case, Adjust ADC(OTP) is automatically ‘OK’

4.1.3.2. Adj. protocol (only Internal patten)

Protocol CMD 1 CMD 2 Data 1 Data 2 Remark

Enter adj mode

Start ADC adj

4.2. EDID Download

4.2.1. Overview

▪ It is a VESA regulation. A PC or a MNT will display an

optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.

4.2.2. Equipment

▪ Since embedded EDID data is used, EDID download JIG,

HDMI cable and D-sub cable are not need.

▪ Adjust by using remote controller

a a 00 00 When transfer

the ‘Mode In’,Carry the command.

a d 00 10 Automatically

adjustment (Use internal pattern)

3.3. Appendix

(1) Shipment conditions (2) Tool option menu (3) USB Download (S/W Update, Option and Service only) (4) Preset CH Information

Only for training and service purposes

- 11 -

4.2.3. Download method

1) Press Adj. key on the Adj. R/C,

2) Select EDID D/L menu.

3) By pressing Enter key, EDID download will begin

4) If Download is successful, OK is display, but If Download is

failure, NG is displayed.

5) If Download is failure, Re-try downloads.

※ Caution) When EDID Download, must remove RGB/HDMI

Cable.

4.2.4. EDID DATA

5. Final Assembly Adjustment

5.1. White Balance Adjustment

5.1.1. Overview

5.1.1.1. W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel’s W/B deviation (2) How-it-works: When R/G/B gain in the OSD is at 192, it

means the panel is at its Full Dynamic Range.

● Case : Cool Mode

- To adjust the white balance without the saturation, G gain

should be adjust at least 172 and change the others (R,B Gain)

▪ When R or B gain is over 255, G gain can be adjust below

172)

● Case : Medium / Warm Mode

- To adjust the white balance without the saturation, Fix the

one of R/G/B gain to 192 (default data) and decrease the others.

(3) Adj. condition: normal temperature

- Surrounding Temperature: 25±5 °C

- Warm-up time: About 5 Min

- Surrounding Humidity: 20% ~ 80%

- Before White balance adjustment, Keep power on status,

don’t power off

Only for training and service purposes

5.1.1.2. Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark surrounding.

(2) Probe location: Color Analyzer (CA-210) probe should be

within 10cm and perpendicular of the module surface (80°~ 100°) (3) Aging time

- After Aging Start, Keep the Power ON sta tus during 5

Minutes.

- In case of LCD, Back-light on should be checked using no

signal or Full-white pattern.

- 12 -

5.1.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)

(2) Adj. Computer (During auto adj., RS-232C protocol is

needed) (3) Adjust Remocon (4) Vi deo Signal Generat or MS PG-925F 720p/ 204-Gray

(Model: 217, Pattern: 49)

→ Only when internal pattern is not available

※ Color Analyzer Matrix should be calibrated using CS-1000

5.1.3. Equipment connection

5.1.4. Adjustment Command (Protocol)

(1) RS-232C Command used during auto-adj.

RS-232C COMMAND

CMD DATA ID

Wb 00 00 Begin White Balance adj.

Wb 00 ff End White Balance adj.

(internal pattern disappears )

(2) Adjustment Map

Adj. item Command

(lower caseASCII)

CMD1 CMD2 MIN MAX

Cool R Gain j g 00 C0

G Gain j h 00 C0

B Gain j i 00 C0

Medium R Gain j a 00 C0

G Gain j b 00 C0

B Gain j c 00 C0

Warm R Gain j d 00 C0

G Gain j e 00 C0

B Gain j f 00 C0

Explanation

Data Range (Hex.)

5.1.5. Adjustment method

5.1.5.1. Auto WB calibration (1) Set TV in ADJ mode using P-ONLY key (or POWER ON

key)

(2) Place optical probe on the center of the display

- It need to check probe condition of zero calibration before

adjustment. (3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message,

check adjustment status of pre-set mode (Cool, Medium,

Warm) (6) Remove probe and RS-232C cable.

▪ W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need

5.1.5.2. Manual adjustment (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface..

(3) Press ADJ key → EZ adjust using adj. R/C → 8. White-

Balance then press the cursor to the right (KEY►).

(When KEY(►) is pressed 204 Gray(80IRE) internal

pattern will be displayed)

(4-a) Adjust modes (Cool) : Fix the G gain at least 172 and

change the others (R/B Gain).

▪ If R or B gain is over 255, G gain can be adjust below 172.

(4-b) Adjust two modes ( Medium / Warm) : Fix the one of

R/G/B gain to 192 (default data) and decrease the others.

※ CASE : Cool mode First adjust the coordinate far away from the target value(x, y).B (1) x, y >target (2) x, y< target (3) x >target , y< target (4) x < target , y >target

- Every 4 case have to t y value by adjusting B Gain and

then t x value by adjusting R-Gain

- In this case, increasing/decreasing of B Gain and R Gain

can be adjusted.

► How to adjust

(1) Fix G gain at least 172 : Adjust R, B Gain ( In Case of

Mostly Blue Gain Saturation )

(2) When R or B Gain > 255, Release Fixed G Gain and

Readjust

※ CASE : Medium / Warm mode First adjust the coordinate far away from the target value(x, y). (1) x, y >target i) Decrease the R, G. (2) x, y< target i) First decrease the B gain, ii) Decrease the one of the others. (3) x >target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G

Only for training and service purposes

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