Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to LA49B Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
▪ ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate RGB
deviation.
▪ ADC adjustment is OTP (Auto ADC)
4.2.5. EDID DATA
4.2.5.1. North America (PCM)
4.2.5.1.1. FHD Model
■ HDMI 1-FHD-8BIT (C/S : E708)
EDID Block 0, Bytes 0-127 [00H-7FH]
4.2. EDID Download
4.2.1. Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
(1) Since EDID data is embedded, EDID download JIG, HDMI
cable is not need.
(2) Adjust by using remote controller
4.2.3. Download method (using DFT)
※ PC(for communication through RS-232C), UART baud rate:
115200 bps
Command : aa 00 00 (Start Factory mode)
Command : ae 00 10 (Download All EDID)
Command : aa 00 90 (End of Factory mode)
4.2.4. Download method (using Service Remocon)
(1) Press Adj. key on the Adj. R/C.
(2) Select EDID D/L menu.
(3) By pressing Enter key, EDID download will begin
(4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
(5) If Download is failure, Re-try downloads.
※Caution : Wh en EDID Download, must remove HDMI
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 ºC
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
※ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
5.1.5.2. Manual adj. method
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 204 Gray(80IRE) internal
pattern will be displayed)
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
※ CASE
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
► How to adjust
(1) Fix G gain at least 172
Adjust R, B Gain (In Case of Mostly Blue Gain Saturation)
(2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically
6.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
* USB S/W Download (option, Service only)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
7.2. Specification
NoItemMinTypMaxUnitRemark
1Audio practical
max Output, L/R
(Distortion=10%
max Output)
4.5
6.0
9.0
8.5
5.0
6.3
10.9
9.3
6.0
6.9WVrms
12.0
9.8WVrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker
(8Ω Impedance)
LB55 Series
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker
(8Ω Impedance)
LB56 Series
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In thi s case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
※After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safet y parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
FROM LIPS or POWER B/D
RL_ON_Buffer
R202
10K
5.5V
VA200
OPT
C205
4.7uF
50V
OPT
C203
4.7uF
16V
RL_ON_Buffer
MMBT3906(NXP)
Q200
3
1
2
RL_ON_Direct
R203
0
CB2012PK501T
MLB-201209-0120P-N2
C206
0.1uF
50V
MLB-201209-0120P-N2
C204
0.1uF
16V
OPT
VA201
ICVS0518150FR_
L201
L202
L200
R207
OPT
33K
+3.5V_ST
R200
10K
RL_ON
R201
10K
RL_ON_Direct
+3.5V_ST
C200
5V
ZD200
SEMTECH_3.3V_TVS
+24V
+12V
C202
1uF
10uF
10V
10V
+1.8V_DDR
+3.3V_NORMAL
IC200
AZ1117EH-ADJTRG1
C201
10uF
6.3V
IN
OUT
ADJ/GND
R2
Vout=1.25*(1+R2/R1)
R1
1%
R204
2.7K
1%
R205
1.2K
PWR ON
3.5V
3.5V
GND
24V
GND
12V
12V
GND
+1.8V_DDR
P200
SMAW200-H18S5
1
3
5
7
9
11
13
15
17
R206
1
C207
10uF
6.3V
19
ZD201
2.5V
PANEL_Vcc
+12V
C210
10uF
16V
Q203
MMBT3904(NXP)
Q204-*1
R217
12K
R216
1.8K
C
Q202
MMBT3904(NXP)
E
FET_12V_DIODES
PMV48XP
S
FET_3.3V_NXP
G
C209
4.7uF
10V
L203
UBW2012-121F
OPT
C208
0.1uF
25V
+3.3V_NORMAL
R209
R208
1K
100
C
DRV ON
2
PDIM#1
4
3.5V
6
PDMI#2
8
24V
10
GND
12
12V
14
NC
16
GND
18
.
E
R210
10K
B
Q201
MMBT3904(NXP)
+3.5V_ST
R211
10K
PWM_DIM
PWM_DIM2
INV_CTL
+3.3V_Normal
PANEL_CTL
+3.5V_ST
POWER_ON/OFF
Vgs=8.15V
R213
10K
R212
R215
R214
4.7K
B
Vgs=3.04V
10K
10K
C
E
B
S
Q205-*1
FET_12V_NXP
Q205
DMP2130L
S
G
D
FET_3.3V_DIODES
Q204
DMP2130L
S
G
PMV48XP
G
D
D
D
PANEL_VCC
OPT
R219
R223
3.3K
3.3K
+3.3V_NORMAL
L204
PZ1608U121-2R0TF
C211
0.1uF
16V
C214
10uF
6.3V
OPT
ZD202
5V
Power_DET
C222
0.1uF
16V
+1.15V_VDDC
OPT
C221
0.1uF
C220
0.1uF
16V
OPT
16V
+1.15V_VDDC
OPT
ZD203
2.5V
C224
22uF
6.3V
+3.5V_ST
OPT
C226
10uF
6.3V
C225
22uF
6.3V
+12V
R230
2.7K
1%
R229
1.2K
1%
CB2012PK501T
L206
C228
270pF
50V
C229
10uF
10V
+3.5V_ST
OPT
R233
0
R23 2
20K
R23 1
47K
0.1uF
1%
1%
C230
16V
L207
3.6uH
R1
R2
RESET_IC_DIODES
APX803D29
VCC
3
GND
CI_RESET_IC_ROHM
IC204-*1
BD48K28G
VDD
3
C231
0.1uF
16V
+3.5V_ST --> 3.375V --> 3.46V
+12V --> 3.58V --> 3.82V (3.68V)
SOC_RESET_PD_IC
R235
300
POWER_DET_RESET
TPS5432DDAR
1
2
THERMAL
3
3A
4
+3.5V_ST
9
R236
4.7K
8
7
6
5
R234
100K
IC204
1
1
GND
IC203
1000pF
50V
2
C237
RESET
2
VOUT
BOOT
VIN
PH
GND
C232
0.1uF
[EP]GND
SS
EN
COMP
VSENSE
POWER_DET
C234
0.01uF
R237
2.7K
C233
0.039uF
50V
50V
1%
SOC_RESET_+3.5V
R235-*1
100
R238
C236
0.33uF
16V
C235
390pF
50V
10K
Vout=0.808*(1+R1/R2)
+5V_USB & MHL W/ OCP
+12V
C215
10uF
16V
R222
100K
OPT
MHL_5V_EN
USB1_CTL
+3.3V_NORMAL
OPT
R218
4.7K
16K(1.6A)->14K(1.8A)
R220
4.7K
C212
100pF
50V
AR200
C213
4700pF
50V
OPT
R221
0
+3.3V_NORMAL
10K
1/16W
COMP
ROSC
EN_SW2
EN_SW1
[EP]GND
EN
1
2
SS
3
4
5
6
VIN_1
VIN_2
PGOOD
V7V
22
23
24
THERMAL
25
IC201
TPS65282REGR
4A
7
9
8
RLIM11AGND
FAULT2
FAULT1
SW_OUT2
USB1_OCD
/MHL_OCP_DET
C216
10uF
16V
21
10
R224
15K
PGND_2
OPT
R225
100K
20
PGND_1
19
BST
18
LX_2
17
LX_1
16
FB
15
SW_IN_2
14
SW_IN_1
13
12
+5V_USB
SW_OUT1
D200
MBR230LSFT1G
30V
C217
10uF
10V
Vout=0.8*(1+R1/R2)
C218
L205
0.047uF
4.7uH
25V
5V_HDMI
AVDD_5V_MHL
R226
10
C219
10uF
16V
R227
3.3K
R1
R228
18K
R2
C223
82pF
50V
1%
1%
+5V_NORMAL
C227
22uF
16V
MHL_CD_SENSE
MHL_OCP_EN
CI_GateIC_Toshiba
IC202-*1
TC7SZ08FU_TOSHIBA
IN_B
1
IN_A
2
GND
3
74LVC1G08GW
B
1
A
2
GND
3
GateIC_STC
IC202
VCC
5
OUT_Y
4
+3.3V_NORMAL
5
4
VCC
Y
MHL_5V_EN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_NON_OS
POWER
13/08/13
2 of 6
Page 26
AUDIO AMP(TI)/LVDS/IR
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14-NON-OS
LVDS/S_AMP/IR
13/08/13
3 of 6
SPK_L-
Page 27
EXTERNAL INTERFACE
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
AV/COMPONENT
JK401
PPJ245N2-01
[RD2]E-LUG
6E
R405
75 5%
comp-shape=2012
R404
75 5%
comp-shape=2012
R403
75 1%
comp-shape=3216
OPT
IC400
1
2
3
4
5
6
7
8
OPT
C402
1000pF
50V
OPT
C401
1000pF
50V
C1+
V+
C1-
C2+
C2-
V-
DOUT2
RIN2
VR403
R402
OPT
VR401
OPT
OPT
VR400
DOUT1
ROUT1
ROUT2
RIN1
DIN1
DIN2
VA402
VCC
GND
470K
R401
470K
OPT
VR402
OPT
ICVS0518150FR_
OPT
VA401
ICVS0518150FR_
VA400
ICVS0518150FR_
MAX3232CDR
16
15
14
13
12
11
10
9
EAN41348201
5E
4E
5D
4C
5C
7C
5B
4A
5A
6A
UART For DEBUG
JK400
KJA-PH-1-0177
6 M6
1 M1
3 M3_DETECT
4 M4
5 M5_GND
OPT
R400
0
[RD2]O-SPRING
[RD2]CONTACT
[WH]O-SPRING
[RD1]CONTACT
[RD1]O-SPRING
[RD1]E-LUG-S
[BL]O-SPRING
[GN/YL]CONTACT
[GN/YL]O-SPRING
[GN/YL]E-LUG
1/16W
5%
PM_TXD
PM_RXD
+3.5V_ST
C400
0.1uF
AR400
100
1/16W
P400
12507WS-04L
1
2
3
4
5
ZD404
ZD405
ZD402
ZD403
ZD401
ZD400
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R406
10K
C406
0.1uF
0.1uF
0.1uF
0.1uF
R409
10K
C405
C404
C403
R408
12K
R407
12K
+3.3V_NORMAL
AR401
10K
1/16W
COMP_R_IN
COMP_L_IN
COMP_DET
COMP_Pr+
COMP_Pb+
AV_DET
COMP_Y+
CVBS_OUT
USB(SIDE)
SPDIF OPTIC JACK
3AU 04S-3 05-Z C-(LG )
P401
USB DOWN STR EAM
+3.3V_NORMAL
CVBS_OUT
R410
75
1234
5
SPDIF_OUT
HDMI_1(REAR)
OPT
R416
10K
C
R417
5V_DET_HDMI_1
JK404
SHIELD
20
19
18
17
16
15
14
13
12
11
CK+
10
EAG59023302
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
CVBS_OUT
IC401
MM1756DURE
VCC
6
PS
5
OUT
4
OPT
ZD406
5V
1
2
3
C407
22uF
10V
+3.3V_NORMAL
OPT
IN
GND
BIAS
C409
22uF
10V
RCLAMP0502BA
OPT
D400
C408
1uF
10V
ESD Ready
CVBS_OUT
C411
0.1uF
CVBS_OUT
C410
4.7uF
OPT
C413
5pF
50V
SPDIF
C412
68pF
50V
CVBS_OUT
C415
0.1uF
+5V_USB
OPT
C414
5pF
50V
GND
VCC
VINPUT
DTV/MNT_VOUT
SPDIF
JK402
JST1223-001
1
2
3
4
SIDE_USB_DM
SIDE_USB_DP
Fiber Optic
FIX_POLE
HDMI_2(SIDE)
GND
JK403
BODY_SHIELD
20
19
18
17
16
15
14
13
12
11
10
EAG62611204
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI
OPT
VR404
OPT
VR405
R411
2.7K
R412
1K
R414
4.7K
43
43
43
43
VR407
OPT
5V_DET_HDMI_2
R413
2.7K
VR406
OPT
MMBT3904(NXP)
OPT
VR409
L401
DLP11SA900HL2L
HDMI_REAR_EMI_FILTER
21
L402
DLP11SA900HL2L
HDMI_REAR_EMI_FILTER
21
L403
DLP11SA900HL2L
HDMI_REAR_EMI_FILTER
21
L404
DLP11SA900HL2L
HDMI_REAR_EMI_FILTER
21
OPT
VR408
R415
4.7K
VR410
OPT
Q400
OPT
VR411
COMP/USB/SPDIF
10K
B
E
R419
33
1/16W
5%
+5V_NORMAL +3.5V_ST
AR402
4.7K
OPT
VR412
OPT
D405
IP4283CZ10-TBA
1
2
3
4
56
1
2
3
4
56
D404
IP4283CZ10-TBA
C416
0.047uF
25V
1/16W
10
9
8
7
10
9
8
7
R418
300K
MHL Spec
A2CA1
MMBD6100
D401
OPT
+5V_NORMAL
OPT
VR413
IP4283CZ10-TBA
IP4283CZ10-TBA
R420
4.7K
OPT
VR414
OPT
D403
1
2
3
4
56
1
2
3
4
56
D402
OPT
JP422
2013.08.13L14-NON-OS
HPD1
R421
4.7K
10
9
8
7
10
9
8
7
HPD2
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
MHL_CD_SENSE
JP424
JP423
6
DDC_SDA_2
DDC_SCL_2
JP425
DDC_SDA_1
DDC_SCL_1
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
Page 28
TUNER for ATSC W/O Isolator
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3.3V_NORMAL -> 3.3V_TU
+3.3V_NORMAL
OPT
C507
0.1uF
16V
PZ1608U121-2R0TF
OPT
C508
22uF
6.3V
L500
C509
22uF
6.3V
+3.3V_TU
OPT
C510
0.1uF
16V
+3.3V_TU
AR500
33
1/16W
OPT
C501
TU500
TDSS-H701F
NC_1
1
NC_2
2
SCL
3
SDA
4
+B1[3.3V]
5
NC_3
6
NC_4
7
NC_5
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
SHIELD
A1
A1
R501
33
R500
1/16W
33
5%
1/16W
5%
Close to the tuner
B1
B1
12
15pF
50V
IF_P_MSTAR
IF_N_MSTAR
C504
15pF
50V
+3.3V_TU
C500
100pF
50V
close to the tuner pin
C503
0.1uF
16V
should be guarded by ground
C502
0.1uF
16V
C505
20pF
50V
R502
1.8K
OPT
C506
20pF
50V
R503
1.8K
IF_AGC_MAIN
TU_SCL
TU_SDA
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14-NON-OS2013.08.13
TUNER
5
Page 29
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