LG 55LB5500-UZ, 55LB5550-UY Schematic

Page 1
Internal Use Only
North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com
LED TV
CHASSIS : LA49B
MODEL : 55LB5500/55LB5550
55LB5500-UZ/55LB5550-UY
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL68259702(1406-REV01)
Page 2
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING ............................................................................ 16
BLOCK DIAGRAM .................................................................................. 22
EXPLODED VIEW .................................................................................. 23
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 3
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 4
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent poten­tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electri­cally shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 5
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 6
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This spec sheet is applied LED TV with LA49Bchassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Market Input voltage Frequency Remark
USA 110~240V 50/60Hz Standard Voltage of each
product is marked by models
4) Specification and performance of each parts are followed ea ch drawing and s pe cificatio n b y p art number in accordance with BOM
5) The receiver must be operated for about 20 minutes prior to the adjustment
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
4. General Specification
No Item Specication Result Remark
1. Receiving System 1) ATSC / NTSC-M / 64 QAM / 256 QAM
2. Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3. Input Voltage AC 110V, 60HZ Mark : 110V, 60Hz (N.America)
4. Market NORTH AMERICA
5. Screen Size 32/42 inch Wide (1920 × 1080) FHD + 60Hz 32LB5600-UZ 39LB5600-UZ 42LB5500-UZ 42LB5600-UZ 49LB5500-UZ 55LB5500-UZ
32 inch Wide (1366 × 768) HD + 60Hz 32LB550B-UZ
32LB560B-UZ
6. Aspect Ratio 16:9
7. Tuning System FS
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 7
No Item Specication Result Remark
8. Module DIRECT L LC320DUE-FGA3 LGD 32LB5600-UZ
DIRECT L LC320DXE-FGA3 LGD 32LB560B-UZ
DIRECT L LC320DXE-FGA5 LGD 32LB550B-UZ
DIRECT L NC320DXN-VSBP1 Sharp 32LB560B-UZ
DIRECT L NC320DXN-VSBP3 Sharp 32LB550B-UZ
DIRECT L NC390DUN-VXBP1 INX 39LB5600-UZ
DIRECT L LC420DUE-FGA3 LGD 42LB5600-UZ
DIRECT L LC420DUE-FGA5 LGD 42LB5500-UZ
DIRECT L T420HVF07.1 AUO 42LB5600-UZ
DIRECT L LC490DUE-FGA5 LGD 49LB5500-UZ
DIRECT L LC550DUE-FGA5 LGD 55LB5500-UZ
DIRECT L HC550DUN-ABHR1 BOE 55LB5500-UZ
9. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
5. Supported video resolutions
5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 59.94 13.50 SDTV ,DVD 480I
2. 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I
3. 720*480 31.47 59.94 27.00 SDTV 480P
4. 720*480 31.50 60.00 27.027 SDTV 480P
5. 1280*720 44.96 59.94 74.176 HDTV 720P
6. 1280*720 45.00 60.00 74.25 HDTV 720P
7. 1920*1080 33.72 59.94 74.176 HDTV 1080I
8. 1920*1080 33.75 60.00 74.25 HDTV 1080I
9. 1920*1080 26.97 23.976 74.176 HDTV 1080P
10. 1920*1080 27.00 24.00 74.25 HDTV 1080P
11. 1920*1080 33.71 29.97 74.176 HDTV 1080P
12. 1920*1080 33.75 30.00 74.25 HDTV 1080P
13. 1920*1080 67.432 59.94 148.352 HDTV 1080P
14. 1920*1080 67.50 60.00 148.50 HDTV 1080P
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 8
5.2. HDMI Input (DTV/PC)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed Remark
DTV
1 720*480 15.73 59.94 Spec-Out.
2 720*480 15.73 60.00
3 720*480 31.47 59.94 27.00 SDTV 480P
4 720*480 31.50 60.00 27.027 SDTV 480P
5 1280*720 44.96 59.94 74.176 HDTV 720P
6 1280*720 45.00 60.00 74.25 HDTV 720P
7 1920*1080 33.72 59.94 74.176 HDTV 1080I
8 1920*1080 33.75 60.00 74.25 HDTV 1080I
9 1920*1080 26.97 23.976 74.176 HDTV 1080P
10 1920*1080 27.00 24.00 74.25 HDTV 1080P
11 1920*1080 33.71 29.97 74.176 HDTV 1080P
12 1920*1080 33.75 30.00 74.25 HDTV 1080P
13 1920*1080 67.432 59.94 148.352 HDTV 1080P
14 1920*1080 67.50 60.00 148.50 HDTV 1080P
PC DDC
1 640*350 31.468 70.09 25.17 EGA X
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
6 1360*768 47.712 60.015 85.50 VESA (WXGA) O
7 1152*864 54.348 60.053 80.002 VESA O
8 1280*1024 63.981 60.020 108.0 VESA (SXGA) O Full HD model Only
9 1920*1080 67.50 60.00 148.5 HDTV 1080P O Full HD model Only
(Just Display)
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 9
ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA49B Chassis applied LED TV all models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation (4) The input voltage of the receiver must keep 100~240V,
50/60Hz (5) At first Worker must turn on the SET by using Power Only
key. (6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment : ADC adjustment is OTP (Auto ADC) (2) EDID download : HDMI
4. MAIN PCBA Adjustments
* Download (1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message If display “Error”, Check connect computer, jig, and set. (3) Click “Connect” tab. If display “Can’t ”, Check connect
computer, jig, and set.
(3)
(1)
(2)
(4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”
OK
Please Check the Speed : To use speed between from 200KHz to 400KHz
(4)
filexxx.bin
■ Above adjustment items can be also performed in Final
Assembly if needed.
Both Board-level and Final assembly adjustment items can
be check using In-Start Menu (1.Adjust Check).
3.2. Final assembly adjustment
(1) White Balance adjustment (2) RS-232C functionality check (3) Factory Option setting per destination (4) Shipment mode setting (In-Stop) (5) GND and HI-POT test (6) AUDIO output check (7) EYE-Q function check
3.3. Appendix
(1) Shipment conditions (2) Tool option menu (3) USB Download (S/W Update, Option and Service only) (4) Preset CH Information
Only for training and service purposes
(5) Click “Auto” tab and set as below. (6) Click “Run”. (7) After downloading, check “OK” message.
(5)
(6)
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(7) ……….OK
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 10
4.1. ADC Adjustment
4.1.1. Overview
▪ ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate RGB deviation.
▪ ADC adjustment is OTP (Auto ADC)
4.2.5. EDID DATA
4.2.5.1. North America (PCM)
4.2.5.1.1. FHD Model
■ HDMI 1-FHD-8BIT (C/S : E708)
EDID Block 0, Bytes 0-127 [00H-7FH]
4.2. EDID Download
4.2.1. Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
(1) Since EDID data is embedded, EDID download JIG, HDMI
cable is not need.
(2) Adjust by using remote controller
4.2.3. Download method (using DFT)
※ PC(for communication through RS-232C), UART baud rate:
115200 bps Command : aa 00 00 (Start Factory mode) Command : ae 00 10 (Download All EDID) Command : aa 00 90 (End of Factory mode)
4.2.4. Download method (using Service Remocon)
(1) Press Adj. key on the Adj. R/C. (2) Select EDID D/L menu. (3) By pressing Enter key, EDID download will begin (4) If Download is successful, OK is display, but If Download is
failure, NG is displayed. (5) If Download is failure, Re-try downloads. ※Caution : Wh en EDID Download, must remove HDMI
Cable.
(6) EDID Write confirmation
EDID D/L (PCM) HDMI1 : OK HDMI2 : OK
4.2.5. Models for EDID Data
2D
North
America
(PCM)
HD / 8bit
HDMI 2ea
32LB550B-UZ 32LB560B-UZ
FHD / 8bit HDMI 2ea
32LB5600-UZ 39LB5600-UZ 42LB5500-UZ 42LB5600-UZ 49LB5500-UZ 55LB5500-UZ
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 18 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80 30 | 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 | 45 00 40 84 63 00 00 1E 66 21 50 B0 51 00 1B 30 50 | 40 70 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A 60 | 3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 E7
EDID Block 1, Bytes 128-255 [80H-FFH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 02 03 19 F1 48 90 22 20 05 04 03 02 01 23 09 57 10 | 07 67 03 0C 00 10 00 80 1E 02 3A 80 18 71 38 2D 20 | 40 58 2C 04 05 40 84 63 00 00 1E 01 1D 80 18 71 30 | 1C 16 20 58 2C 25 00 40 84 63 00 00 9E 01 1D 00 40 | 72 51 D0 1E 20 6E 28 55 00 40 84 63 00 00 1E 8C 50 | 0A D0 8A 20 E0 2D 10 10 3E 96 00 40 84 63 00 00 60 | 18 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 70 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 08
■ HDMI 2-FHD-8BIT (C/S : E7F8)
EDID Block 0, Bytes 0-127 [00H-7FH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 18 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80 30 | 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 | 45 00 40 84 63 00 00 1E 66 21 50 B0 51 00 1B 30 50 | 40 70 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A 60 | 3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 E7
EDID Block 1, Bytes 128-255 [80H-FFH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 02 03 19 F1 48 90 22 20 05 04 03 02 01 23 09 57 10 | 07 67 03 0C 00 20 00 80 1E 02 3A 80 18 71 38 2D 20 | 40 58 2C 04 05 40 84 63 00 00 1E 01 1D 80 18 71 30 | 1C 16 20 58 2C 25 00 40 84 63 00 00 9E 01 1D 00 40 | 72 51 D0 1E 20 6E 28 55 00 40 84 63 00 00 1E 8C 50 | 0A D0 8A 20 E0 2D 10 10 3E 96 00 40 84 63 00 00 60 | 18 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 70 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 F8
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 11
4.2.5.1.2. HD Model
■ HDMI 1-HD (C/S : 6F08)
EDID Block 0, Bytes 0-127 [00H-7FH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 18 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 01 01 30 | 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70 40 | 36 00 40 84 63 00 00 1E 64 19 00 40 41 00 26 30 50 | 18 88 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A 60 | 3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 6F
EDID Block 1, Bytes 128-255 [80H-FFH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 02 03 19 F1 48 10 22 20 05 84 03 02 01 23 09 57 10 | 07 67 03 0C 00 10 00 80 1E 02 3A 80 18 71 38 2D 20 | 40 58 2C 04 05 40 84 63 00 00 1E 01 1D 80 18 71 30 | 1C 16 20 58 2C 25 00 40 84 63 00 00 9E 01 1D 00 40 | 72 51 D0 1E 20 6E 28 55 00 40 84 63 00 00 1E 8C 50 | 0A D0 8A 20 E0 2D 10 10 3E 96 00 40 84 63 00 00 60 | 18 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 70 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 08
■ HDMI 2-HD (C/S : 6FF8)
EDID Block 0, Bytes 0-127 [00H-7FH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 18 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 01 01 30 | 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70 40 | 36 00 40 84 63 00 00 1E 64 19 00 40 41 00 26 30 50 | 18 88 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A 60 | 3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 6F
EDID Block 1, Bytes 128-255 [80H-FFH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 02 03 19 F1 48 10 22 20 05 84 03 02 01 23 09 57 10 | 07 67 03 0C 00 20 00 80 1E 02 3A 80 18 71 38 2D 20 | 40 58 2C 04 05 40 84 63 00 00 1E 01 1D 80 18 71 30 | 1C 16 20 58 2C 25 00 40 84 63 00 00 9E 01 1D 00 40 | 72 51 D0 1E 20 6E 28 55 00 40 84 63 00 00 1E 8C 50 | 0A D0 8A 20 E0 2D 10 10 3E 96 00 40 84 63 00 00 60 | 18 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 70 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 F8
4.2.5.2. AC3 EDID Data
4.2.5.2.1. FHD Model
■ HDMI 1-FHD-8BIT (C/S : E796)
EDID Block 0, Bytes 0-127 [00H-7FH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 18 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80 30 | 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 | 45 00 40 84 63 00 00 1E 66 21 50 B0 51 00 1B 30 50 | 40 70 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A 60 | 3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 E7
EDID Block 1, Bytes 128-255 [80H-FFH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 02 03 1C F1 48 90 22 20 05 04 03 02 01 26 15 07 10 | 50 09 57 07 67 03 0C 00 10 00 80 1E 02 3A 80 18 20 | 71 38 2D 40 58 2C 04 05 40 84 63 00 00 1E 01 1D 30 | 80 18 71 1C 16 20 58 2C 25 00 40 84 63 00 00 9E 40 | 01 1D 00 72 51 D0 1E 20 6E 28 55 00 40 84 63 00 50 | 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 40 84 60 | 63 00 00 18 00 00 00 00 00 00 00 00 00 00 00 00 70 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 96
■ HDMI 2-FHD-8BIT (C/S : E786)
EDID Block 0, Bytes 0-127 [00H-7FH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 18 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80 30 | 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 | 45 00 40 84 63 00 00 1E 66 21 50 B0 51 00 1B 30 50 | 40 70 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A 60 | 3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 E7
EDID Block 1, Bytes 128-255 [80H-FFH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 02 03 1C F1 48 90 22 20 05 04 03 02 01 26 15 07 10 | 50 09 57 07 67 03 0C 00 20 00 80 1E 02 3A 80 18 20 | 71 38 2D 40 58 2C 04 05 40 84 63 00 00 1E 01 1D 30 | 80 18 71 1C 16 20 58 2C 25 00 40 84 63 00 00 9E 40 | 01 1D 00 72 51 D0 1E 20 6E 28 55 00 40 84 63 00 50 | 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 40 84 60 | 63 00 00 18 00 00 00 00 00 00 00 00 00 00 00 00 70 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 86
Only for training and service purposes
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Page 12
4.2.5.2.2. HD Model
■ HDMI 1-HD (C/S : 6F96)
EDID Block 0, Bytes 0-127 [00H-7FH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 18 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 01 01 30 | 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70 40 | 36 00 40 84 63 00 00 1E 64 19 00 40 41 00 26 30 50 | 18 88 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A 60 | 3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 6F
EDID Block 1, Bytes 128-255 [80H-FFH]
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel’s W/B deviation (2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 ºC
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 02 03 1C F1 48 10 22 20 05 84 03 02 01 26 15 07 10 | 50 09 57 07 67 03 0C 00 10 00 80 1E 02 3A 80 18 20 | 71 38 2D 40 58 2C 04 05 40 84 63 00 00 1E 01 1D 30 | 80 18 71 1C 16 20 58 2C 25 00 40 84 63 00 00 9E 40 | 01 1D 00 72 51 D0 1E 20 6E 28 55 00 40 84 63 00 50 | 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 40 84 60 | 63 00 00 18 00 00 00 00 00 00 00 00 00 00 00 00 70 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 96
■ HDMI 2-HD (C/S : 6F86)
EDID Block 0, Bytes 0-127 [00H-7FH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 | 01 18 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 | 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 01 01 30 | 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70 40 | 36 00 40 84 63 00 00 1E 64 19 00 40 41 00 26 30 50 | 18 88 36 00 40 84 63 00 00 1E 00 00 00 FD 00 3A 60 | 3E 1E 53 10 00 0A 20 20 20 20 20 20 00 00 00 FC 70 | 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 01 6F
EDID Block 1, Bytes 128-255 [80H-FFH]
0 1 2 3 4 5 6 7 8 9 A B C D E F
----------------------------------------------------------------------------­ 0 | 02 03 1C F1 48 10 22 20 05 84 03 02 01 26 15 07 10 | 50 09 57 07 67 03 0C 00 20 00 80 1E 02 3A 80 18 20 | 71 38 2D 40 58 2C 04 05 40 84 63 00 00 1E 01 1D 30 | 80 18 71 1C 16 20 58 2C 25 00 40 84 63 00 00 9E 40 | 01 1D 00 72 51 D0 1E 20 6E 28 55 00 40 84 63 00 50 | 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 40 84 60 | 63 00 00 18 00 00 00 00 00 00 00 00 00 00 00 00 70 | 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 86
5.1.1.2. Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface (80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON sta tus during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer(D uring auto adj., RS-232C protocol is
needed) (3) Adjust Remocon (4) Vi deo Signal Generat or MS PG-925F 720p/ 204-Gray
(Model:217, Pattern:49)
→ Only when internal pattern is not available
※ Color Anal yzer Ma trix sh ould be calibrate d using
CS-1000
4.3. Tool Option Input
- Input Model Tool Option according to BOM
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 13
5.1.3. Equipment connection
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj
RS-232C COMMAND
CMD DATA ID
Wb 00 00 Begin White Balance adj.
Wb 00 ff End White Balance adj.
(internal pattern disappears )
(2) Adjustment Map
Command
Adj. item
Cool R Gain j g 00 C0 172
G Gain j h 00 C0 172
B Gain j i 00 C0 192
R Cut 128
G Cut 128
B Cut 128
Medium R Gain j a 00 C0 192
G Gain j b 00 C0 192
B Gain j c 00 C0 192
R Cut 128
G Cut 128
B Cut 128
Warm R Gain j d 00 C0 192
G Gain j e 00 C0 192
B Gain j f 00 C0 172
R Cut 128
G Cut 128
B Cut 128
(lower case ASCII)
CMD1 CMD2 MIN MAX
Explanation
Data Range
(Hex.)
Default
(Decimal)
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration (1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment. (3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm) (6) Remove probe and RS-232C cable. ※ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
5.1.5.2. Manual adj. method (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 204 Gray(80IRE) internal
pattern will be displayed)
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
※ CASE First adjust the coordinate far away from the target value(x, y). (1) x, y > target i) Decrease the R, G. (2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. (3) x >target , y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
► How to adjust
(1) Fix G gain at least 172 Adjust R, B Gain (In Case of Mostly Blue Gain Saturation) (2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※ CASE Medium / Warm First adjust the coordinate far away from the target value(x, y). (1) x, y > target i) Decrease the R, G. (2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. (3) x > target , y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 14
5.1.6. Reference (White Balance Adj. coordinate and color
temperature)
▪ Luminance: 204 Gray, 80IRE
**(normal line) Model : For LGD (LB56xx, LB55xx)
▪ S tan d ard col o r co ord i nat e an d te m per a tur e us i ng
CA-210(CH-14) – by aging time
Cool Medium Warm
H/R Time(Min)
1 0-2 281 285 296 304 323 344
2 3-5 280 284 295 303 322 343
3 6-9 279 282 294 301 321 341
4 10-19 277 279 292 288 319 338
5 20-35 275 275 290 294 317 334
6 36-49 273 273 288 292 315 332
7 50-79 272 272 287 291 314 331
8 80-119 271 270 286 289 313 329
9 Over 120 271 270 286 289 313 329
x y x x y x
271 270 286 289 313 329
5.2. Option selection per country
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: LA32B Chassis applied to CANADA and
MEXICO
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu
(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX. Selection is done using +, - KEY (3) Using DFT(Auto) ※ PC (for communication through RS-232C) -> UART Baud
rate : 115200 bps
Command : ah 00 00 DATA(Area Number(hexadecimal))
ITEM DATA(Area Number) AREA
AREA OPTION1 0 USA
1 CANADA
2 MEXICO
**(aging chamber) Model : For LGD (LB56xx, LB55xx)
▪ Sta nda rd col or c oo r di n ate a nd t emp era tur e usi ng
CA-210(CH-14) – by aging time
Cool Medium Warm
H/R Time(Min)
1 0-5 280 285 295 304 319 340
2 6-10 276 280 291 299 315 335
3 11-20 272 275 287 294 311 330
4 21-30 269 272 284 291 308 327
5 31-40 267 268 282 287 306 323
6 41-50 266 265 281 284 305 320
7 51-80 265 263 280 282 304 318
8 81-119 264 261 279 280 303 316
9 Over 120 264 260 279 279 303 315
x y x x y x
271 270 286 289 313 329
** For INX,AUO,SHARP,CSOT Module.( In the case of , the color
temperature spec of cool mode is 13000K)
H/R Time(Min)
spec 271 270 286 289 313 329 329
target 276 277 291 296 318 336 340
Cool Medium Warm
x y x x y x
5.2.3. Tool Option inspection
▪ Press Adj. key on the Adj. R/C, then select Tool option
Model Module
32LB550B-UZ LGD 784 13314 41036 20544
32LB560B-UZ SHARP 13074 9218 41036 20544
32LB550B-UZ SHARP 13074 13314 41036 20544
42LB5500-UZ LGD 1552 5126 41036 24640
42LB5500-UZ AUO 9744 5126 41036 24640
42LB5600-UZ LGD 1552 1030 41036 24640
42LB5600-UZ AUO 9744 1030 41036 24640
39LB5600-UZ INX 17682 1030 41036 24640
49LB5500-UZ LGD 2064 5126 41036 24640
55LB5500-UZ LGD 2576 5126 41036 24640
55LB5500-UZ BOE 23058 5126 41036 24640
32LB550B-UZ BOE 21266 13314 41036 24640
32LB5600-UZ LGD 784 1026 41036 24640
32LB560B-UZ LGD 784 9218 41036 20544
Tool
option1
Tool
option2
Tool
option3
option4
※ Tool option can be reconstructed by Software
5.3. Ship-out mode check (In-stop)
- After final inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode
Tool
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 15
6. GND and HI-POT Test
6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically
6.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA (2) TEST time: 1 second (3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms
* USB S/W Download (option, Service only)
(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low, it didn't work. But your downloaded version is High, USB data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation (2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
7.2. Specification
No Item Min Typ Max Unit Remark
1 Audio practical
max Output, L/R (Distortion=10% max Output)
4.5
6.0
9.0
8.5
5.0
6.3
10.9
9.3
6.0
6.9WVrms
12.0
9.8WVrms
(1) Measurement condition
- EQ/AVL/Clear Voice: Off (2) Speaker
(8Ω Impedance)
LB55 Series
(1) Measurement condition
- EQ/AVL/Clear Voice: Off (2) Speaker
(8Ω Impedance)
LB56 Series
(5) After updating is complete, The TV will restart automatically. (6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In thi s case, you have to channel recover. If all channel data is cleared, you didn't have a DTV/ATV test on production line.
※After downloading, TOOL OPTION setting is needed again. (1) Push "IN-START" key in service remote controller. (2) Select "Tool Option 1" and Push “OK” button. (3) Punch in the number. (Each model has their number.)
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 16
TROUBLE SHOOTING
1. Power-up boot check
Check stand-by Voltage.
P401 3, 5, 6pin : +3.5V_ST
Check 18pin Power connector
Main B/D 3.5V Line
Short Check
Check X201 clock
24 M Hz
Replace X201
Check P401 PWR_ON.
1pin : 3.3V
Replace Ms tar(IC101) or Main board
Check Multi Voltage
P401 9, 10pin : 24V
/ 13, 14, 15pin:12V
Replace Power Board
Check DRV ON Control
P401 2 pin : High
Check Power Board
Check IC402/3/4 Output Voltage
IC402 : 2.5V IC403 : 1.5V
IC404 : 1.15V
Q403 : 3.3V
Replace IC402, IC403, IC404, Q403
Re-download software.
Check stand-by Voltage
L401, L404 : +3.5V
Replace L401, L404
Check LVDS Power Voltage
Q409 : 12V
Replace Q409
Check Ms tar LVDS Output
Replace Ms tar(IC101) or Main Board
Change Module
ok
ok
ok
ok
ok
ok
ok
ok
okNo
No
ok
Replace Power board.
ok
No
No
No
No
No
No
No
No
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 17
2. Digital/Analog TV Video
Check RF Cable & Signal
Check Tuner 3.3V Power
L3703
Replace L3703
Check Tuner 1.8V Power
IC3703 2 pin : 1.8V
Check IF_P/ N Signal
TU3700 10/11 Pin
Replace IC3703
Check Mstar LVDS Output
Replace Mstar(IC101) or Main Board.
ok
ok
ok
ok
No
No
No
No
Bad Tuner. Replace Tuner.
3. AV Video
Check input signal form at.
Is it supported?
Check AV Cable for damage
for damage or open conductor
Check JK1701, CVBS Signal Line
R1707
ok
ok
ok
No
Replace Jack
ok
Check CVBS_DET Signal
Replace R1713
No
Check Mstar LVDS Output
Replace Mstar(IC101) or Main Board.
No
Only for training and service purposes
- 17 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 18
4. Component Video
Check input signal form at.
Is it supported?
Check Component Cable
for damage or open conductor.
Check JK1701
Y/ PB/PR signal Line
ok
ok
ok
No
Replace Jack
Check COMP_DET Signa l
Replace R1712 or R1713
No
Check Mstar LVDS Output
Replace Mstar(IC101) or Main Board.
ok
No
5. HDMI V ideo
Check input signal form at.
Is it supported?
Check HDMI Cable conductors for damage or open conductor.
Check EDID
R810, R811, R815, R816 I2C Signal
Check JK800, JK801
ok
ok
ok
No
No
Replace the def ective IC or re-download EDID data
ok
Replace Jack
Check HDMI Signal
Check other set If no problem, check s ignal line
ok
No
Check Mstar LVDS Output
Replace Mstar(IC101) or Main Board.
ok
No
Replace Main Board
No
Check HDMI_DET (HPD)
No
Replace R808, R809, Q800, R803, R814
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 19
6. MHL Video
Check input signal form at.
Is it supported?
Check MHL Cable conductors
for damage or open conductor.
Check MHL Signal (R214, R215)
Check JK801
ok
ok
ok
No
No
Replace the def ective IC or re-download EDID data
ok
Replace Jack
Check MHL Signal
Check other set If no problem, check s ignal line
ok
No
Check Mstar LVDS Output
Replace Mstar(IC101) or Main Board.
ok
No
Replace Main Board
No
Check CD_Sense, Cbus, Vb us
No
Replace R817, C800
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 20
7. All Source Audio
Check the TV Speaker Menu
(M enu -> Audio -> TV Speaker)
On
ok
ok
Check Output Signal P5600
1, 2, 3, 4 pin .
Replace Audio AMP IC(IC5600)
ok
No
Check Connector & P5600
Replace connector if found to be dam aged.
ok
No
Check speaker resistance
and connector damage.
Replace speaker.
ok
No
Off
Toggle the Men u
Check AMP IC(IC5600) Power
24V, 3.3V
No
Replace Amp IC(IC5600)
Check Mstar I2S Output
IC5600 20,21,22 Pin
No
Check signal line. Or replace Mstar(IC101)
Check Mstar AUDIO_MASTER_CLK
R148
No
Replace Mstar(IC101) or Main Board.
ok
Check AMP I2C Line
R140, R141
No
Check signal line. Or replace Mstar(IC101)
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 21
8. Digital/Analog TV Audio
Check RF Cable & Signal
Follow procedure
‘7. All source audio’
trouble shooting guide.
ok
Check Tuner 3.3V Power
L3703
Replace L3703
Check Tuner 1.8V Power
IC3703 2 pin : 1.8V
Check IF_P/ N Signal
TU3700 10/11 Pin
Replace IC3703
ok
ok
ok
No
No
No
Bad Tuner. Replace Tuner.
9. AV Audio
Check AV Cable for dam age
for damage or open conductor
Check JK1702 Signal Line
R1714,R1715
ok
ok
No
Replace Jack
Follow procedure
‘7. All source audio’
trouble shooting guide.
10. Component Audio
Check Component Cable
for damage or open conductor.
Check JK1702 Signal Line
R1714,R1715
ok
ok
No
Replace Jack
Follow procedure
‘7. All source audio’
trouble shooting guide.
Only for training and service purposes
- 21 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 22
172mV
540mV
M1L
RS-232C(Phone jack)
DEMOD
X-tal
(24MHz)
Serial Flash
8M x 8bit
DDR2
64Mbit
IF
AV/COMP
(Hybrid)
Y(CVBS)/Cb/Cr
AV/COMP/DVI
L/R
L/R
HDMI
TMDS/DDC
Video
Front
End
Audio
Front
End
HDMI
RX
LVDS out
HD/ FHD
HD/SD
Video
Encoder
TAS5733
(Digital AMP)
I2S
MCLK
Audio
DSP
H/P out L/R
UART
RX/TX
Air/Cable
On board
USB
USB2.0
LVD S
Con.HDFHD
IF(ATSC)
Analog
Demod
IF(NTSC)
EEPROM
64K x 8bit
H/P
SPDIF
BLOCK DIAGRAM
Only for training and service purposes
- 22 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 23
400
410
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safet y parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
350
900
521
540
LV1
530
820
121
200T
*Option
200
120
A10
A2
Set + Stand
Only for training and service purposes
- 23 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Page 24
<SOC_RESET>
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
OPT R103 470
+3.5V_ST
OPT
C100
4.7uF 10V
<HW_OPTION>
+3.3V_NORMAL
FHD
R102
4.7K
HD
R101
4.7K
NVRAM_ATMEL
IC100-*1
AT24C512C-SSHD-T
A0
1
A1
2
A2
3
GND
4
EEPROM(512KB)
NVRAM_ROHM
BR24G512FJ-3
A0
1
A1
2
A2
3
GND
4
IC100
POWER_DET_RESET
C101
4.7uF 10V
R104 470K
MODEL_OPT
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
OPT C102 8pF
C103
0.1uF 16V
C105
0.1uF 16V
SOC_RESET
AR100 33 1/16W
OPT C104 8pF
+3.5V_ST
R106
2.2K
LED_RED
+1.15V_VDDC
DDC_SCL_1 DDC_SDA_1
COMP_DET
5V_DET_HDMI_2
MHL_CD_SENSE
DDC_SDA_2 DDC_SCL_2
AVDD_5V_MHL
R107
2.2K
I2C_SCL I2C_SDA
AVDD_MOD
KEY1 KEY2
DDR_DATA
AV_DET
HPD2
AR103 100 1/16W
Closed to SoC as possible
R111 1K
R110 1K
AR102 100 1/16W
R109 1K
R108 10K
AR101 100 1/16W
+1.15V_VDDC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
R128 10
R129 10
DM_P1 DP_P1
AVDD_MOD_4 SAR0/GPIO75 SAR1/GPIO74 SAR2/GPIO73
VDDC_3
VDDIO_DATA
GPIO54 DDCDD_CL DDCDD_DA DDCDA_CL DDCDA_DA
MHL_DET/GPIO86
DDCDB_DA DDCDB_CL
HOTPLUG_B
AVDD_5V_MHL
GND_EFUSE
VDDC_4
RXCN_D
RXCP_D
RX0N_D
RX0P_D
RX1N_D
RX1P_D
RX2N_D
RX2P_D
RXCN_B
RXCP_B
RX0N_B
RX0P_B
125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156
E-PAD
SIDE_USB_DM
SIDE_USB_DP
DM_P0
DP_P0
123
124
1
+3.5V_ST
PM_RXD
OPT
AR104
AR106331/16W
TEST
118
PM_TXD
ARC/GPIO87
DDCA_DA
DDCA_CK
116
117
SPI_CK
115
SOC_RESET
IR
POWER_DET
AR105
4.7K
1/16W
Closed to SoC as possible
100
1/16W
RESET
122
CEC
IRIN
INT/GPIO64/I2S_OUT_MCK
119
120
121
LGE8220(MSD8220LBM)
157
THERMAL
5
6
SPI_SCK
/SPI_CS
SPI_CZ
113
114
SPI_SDO
SPI_SDI
AR107 33
1/16W
SPI_DO
SPI_DI
112
111
PWM_DIM
PWM_DIM2
T120
R115 1K
R112 1K
<Chip config.>
4.7K AR108
1/16W
HPD1
R114
5V_DET_HDMI_1
10K
GPIO0/TCON0
HOTPLUG_D
HOTPLUG_A
PWM1/GPIO14
PWM0/GPIO15
107
108
109
110
15
16
17
/FLASH_WP
I2C_SDA
I2C_SCL
GPIO3/TCON3
GPIO2/TCON2
GPIO1/TCON1
103
104
105
106
IC102
[M1L]
20
21
22
RL_ON
PANEL_CTL
INV_CTL
POWER_ON/OFF
R117
10K
GPIO4/TCON4
102
23
Closed to SoC as possible
GPIO8/TCON8
GPIO7/TCON7
GPIO6/TCON6
GPIO5/TCON5
99
100
101
24
AMP_RESET
AMP_MUTE
MODEL_OPT
AR111331/16W
AR110
100
1/16W
GPIO10/TCON10
GPIO9/TCON9
LVSYNC/GPIO16/RLV0-/GPIO16
95
96
97
98
27
28
30
AMP_SDA
USB1_CTL
USB1_OCD
AMP_SCL
MHL_OCP_EN
/MHL_OCP_DET
RXB3+
RXB3-
AR112 100 1/16W
R_ODD[4]/LVB1+/RLV3(CLK)+/EPI6+
R_ODD[5]/LVB1-/RLV3(CLK)-/EPI6-
R_ODD[6]/LVB0+/RLV2+/EPI7+
R_ODD[7]/LVB0-/RLV2-/EPI7-
LCK/GPIO19/RLV1+/GPIO19
LDE/GPIO18/RLV1-/GPIO18
LHSYNC/GPIO17/RLV0+/GPIO17
88
89
90
91
92
93
94
31
32
33
34
RXBCK-
RXBCK+
AVDD_MOD
AVDD_MOD_3
87
RXB2+
R_ODD[1]/LVBCLK-/RLV5-/EPI4-
R_ODD[2]/LVB2+/RLV4+/EPI5+
R_ODD[3]/LVB2-/RLV4-/EPI5-
84
85
86
<MAIN SoC Vcc>
RXB1+
RXB2-
G_ODD[7]/LVB3-/RLV6-/EPI3-
R_ODD[0]/LVBCLK+/RLV5+/EPI4+
82
83
42
RXB0-
RXB1-
RXB0+
+1.8V_DDR
G_ODD[4]/LVB4+/LLV0+/EPI2+
G_ODD[5]/LVB4-/LLV0-/EPI2-
G_ODD[6]/LVB3+/RLV6+/EPI3+
79
80
81
44
45
G_ODD[3]/LVA0-/LLV1-/EPI1-
78
G_ODD[2]/LVA0+/LLV1+/EPI1+
77
G_ODD[1]/LVA1-/LLV2-/EPI0-
76
G_ODD[0]/LVA1+/LLV2+/EPI0+
75
B_ODD[7]/LVA2-/LLV3(CLK)-
74
B_ODD[6]/LVA2+/LLV3(CLK)+
73
B_ODD[5]/LVACLK-/LLV4-
72
B_ODD[4]/LVACLK+/LLV4+
71
B_ODD[3]/LVA3-/LLV5-
70
B_ODD[2]/LVA3+/LLV5+
69
B_ODD[1]/LVA4-/LLV6-
68
B_ODD[0]/LVA4+/LLV6+
67
GPIO53/I2S_OUT_SD
66
GPIO52/I2S_OUT_BCK
65
GPIO51/I2S_OUT_MCK
64
GPIO50/I2S_OUT_WS
63
GPIO49/SPDIF_OUT
62
GPIO47
61
GPIO46/MHL_VBUS
60
GPIO45/I2C_SCLM/UART_RX1
59
GPIO44/I2C_SDAM/UART_TX1
58
VDDC_2
57
VDDIO_CMD
56
AVDD_MOD_2
55
XOUT
54
XIN
53
AVDD3P3_DMPLL
52
AVDD3P3_DADC
51
VIFM
50
VIFP
49
IFAGC
48
LINEOUTR0
47
46
L102
PZ1608U121-2R0TF
+3.5V_ST
+1.15V_VDDC
L101
PZ1608U121-2R0TF
C118
10uF
6.3V
C120
10uF
6.3V
C121 10uF
6.3V
DDR_CMD
R122 0
R123 0
C126
1uF 10V
C119
0.1uF 16V
C127
1uF 10V
OPT
C125
0.1uF
16V
C124
0.1uF 16V
C131
0.1uF 16V
C129
0.1uF 16V
+1.8V_DDR
C132
0.1uF 16V
C130
0.1uF 16V
C137
0.1uF 16V
L104
PZ1608U121-2R0TF
SPDIF R126
100
+1.15V_VDDC
DDR_CMD
AVDD_MOD
AVDD_DMPLL
AVDD_DADC
C123
0.1uF 16V
OPT C128 100pF
C139
C140
0.1uF
0.1uF
16V
16V
C138
0.1uF 16V
DDR_DATA
C135
10uF
6.3V
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
AUD_LRCH
AUD_SCK
AUD_MASTER_CLK
AUD_LRCK
SPDIF_OUT
VCOM_SDA
VCOM_SCL
TU_SCL
TU_SDA
R127 1M
Closed to SoC
OPT C134
100pF
Closed to SoC
AVDD_MOD
C136
0.1uF 16V
X100
24MHz
IF_N_MSTAR
IF_P_MSTAR
OPT C141
0.1uF 16V
C143 15pF
C142 15pF
+3.5V_ST
L105
PZ1608U121-2R0TF
C147
0.1uF 16V
L108
PZ1608U121-2R0TF
C146
0.1uF 16V
L107
PZ1608U121-2R0TF
C145
0.1uF 16V
L106
PZ1608U121-2R0TF
C144
0.1uF 16V
Closed to Main SoC Each Pin
AVDD_DADC
AVDD_AU33
AVDD_DMPLL
AVDD_VIDEO
8
7
6
5
+3.5V_ST
VCC
HOLD
SCLK
SI/SIO0
SERIAL FLASH(64MB)
OPT
R105
4.7K
R100
/SPI_CS
10K
/FLASH_WP
SPI_SDO
SFLASH_MXIC
IC101
MX25L6406EM2I-12G
CS
1
SO/SIO1
2
WP
3
GND
4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C106
0.1uF 16V
SPI_SCK
SPI_SDI
DO[IO1]
WP[IO2]
GND
SFLASH_WINBOND
IC101-*1
W25Q64FVSSIG
CS
1
2
3
4
VCC
8
%HOLD[IO3]
7
CLK
6
DI[IO0]
5
RX1N_B2RX1P_B3RX2N_B4RX2P_B
AVDD_MOD_1
D1-_HDMI2
D1+_HDMI2
D2+_HDMI2
D2-_HDMI2
AVDD_MOD
RXCN_A7RXCP_A8RX0N_A9RX0P_A10RX1N_A11RX1P_A12RX2N_A13RX2P_A14HSYNC0
BIN0P
GIN0P18GIN0M19RIN0P
SOGIN0
BIN1P
VSYNC0
SOGIN1
AVDD3P3_ADC
25V
50V
C107 0.047uF
C108 1000pF
R113 33
AR109 33
COMP_Pb+
AVDD_VIDEO
GIN1P25GIN1M26RIN1P
C109 0.047uF
COMP_Y+
25V
25V
C110 0.047uF
R118 68
VSYNC1
25V
C111 0.047uF
R119 33
COMP_Pr+
VCOM
CVBS129CVBS0
25V
C112 0.047uF
C113 0.047uF
R121 180
R120 150
COMP_Y+
VDDC_1
CVBS_OUT1
AVDD_AU33
25V
AVDD_AU33
+1.15V_VDDC
DTV/MNT_VOUT
AUR035AUL036AUR137AUL138AUR239AUL240AUR341AUL3
10V
10V
C114 2.2uF
C115 2.2uF
COMP_R_IN
COMP_L_IN
VAG43VRM
C116
0.1uF 16V
C117 10uF
6.3V
LINEOUTL3
LINEOUTR3
LINEOUTL0
L100
PZ1608U121-2R0TF
+3.3V_NORMAL
MAIN
C122
0.1uF 16V
L103
PZ1608U121-2R0TF
R124 10K
R125 100
Close to MSTAR
C133
0.047uF 25V
IF_AGC_MAIN
2013-08-13L14-NON-OS
1
8
Page 25
L14 K-TASK POWER BLOCK
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
FROM LIPS or POWER B/D
RL_ON_Buffer
R202
10K
5.5V
VA200
OPT
C205
4.7uF 50V
OPT
C203
4.7uF
16V
RL_ON_Buffer
MMBT3906(NXP)
Q200
3
1
2
RL_ON_Direct
R203
0
CB2012PK501T
MLB-201209-0120P-N2
C206
0.1uF 50V
MLB-201209-0120P-N2
C204
0.1uF 16V
OPT
VA201
ICVS0518150FR_
L201
L202
L200
R207
OPT 33K
+3.5V_ST
R200 10K
RL_ON
R201
10K
RL_ON_Direct
+3.5V_ST
C200
5V
ZD200
SEMTECH_3.3V_TVS
+24V
+12V
C202
1uF
10uF
10V
10V
+1.8V_DDR
+3.3V_NORMAL
IC200
AZ1117EH-ADJTRG1
C201 10uF
6.3V
IN
OUT
ADJ/GND
R2
Vout=1.25*(1+R2/R1)
R1
1%
R204
2.7K
1%
R205
1.2K
PWR ON
3.5V
3.5V GND 24V GND 12V 12V GND
+1.8V_DDR
P200
SMAW200-H18S5
1 3 5 7 9 11 13 15 17
R206 1
C207 10uF
6.3V
19
ZD201
2.5V
PANEL_Vcc
+12V
C210 10uF
16V
Q203 MMBT3904(NXP)
Q204-*1
R217 12K
R216
1.8K
C
Q202 MMBT3904(NXP)
E
FET_12V_DIODES
PMV48XP
S
FET_3.3V_NXP
G
C209
4.7uF 10V
L203
UBW2012-121F
OPT
C208
0.1uF 25V
+3.3V_NORMAL
R209
R208
1K
100
C
DRV ON
2
PDIM#1
4
3.5V
6
PDMI#2
8
24V
10
GND
12
12V
14
NC
16
GND
18
.
E
R210 10K
B
Q201
MMBT3904(NXP)
+3.5V_ST
R211
10K
PWM_DIM
PWM_DIM2
INV_CTL
+3.3V_Normal
PANEL_CTL
+3.5V_ST
POWER_ON/OFF
Vgs=8.15V
R213
10K
R212
R215
R214
4.7K
B
Vgs=3.04V
10K
10K
C
E
B
S
Q205-*1
FET_12V_NXP
Q205
DMP2130L
S
G
D
FET_3.3V_DIODES
Q204
DMP2130L
S
G
PMV48XP
G
D
D
D
PANEL_VCC
OPT
R219
R223
3.3K
3.3K
+3.3V_NORMAL
L204
PZ1608U121-2R0TF
C211
0.1uF
16V
C214 10uF
6.3V
OPT
ZD202
5V
Power_DET
C222
0.1uF 16V
+1.15V_VDDC
OPT
C221
0.1uF
C220
0.1uF
16V
OPT
16V
+1.15V_VDDC
OPT
ZD203
2.5V
C224 22uF
6.3V
+3.5V_ST
OPT C226 10uF
6.3V
C225 22uF
6.3V
+12V
R230
2.7K 1%
R229
1.2K 1%
CB2012PK501T
L206
C228 270pF
50V
C229 10uF
10V
+3.5V_ST
OPT
R233
0
R23 2
20K
R23 1
47K
0.1uF
1%
1%
C230
16V
L207
3.6uH
R1
R2
RESET_IC_DIODES
APX803D29
VCC
3
GND
CI_RESET_IC_ROHM
IC204-*1 BD48K28G
VDD
3
C231
0.1uF 16V
+3.5V_ST --> 3.375V --> 3.46V
+12V --> 3.58V --> 3.82V (3.68V)
SOC_RESET_PD_IC
R235 300
POWER_DET_RESET
TPS5432DDAR
1
2
THERMAL
3
3A
4
+3.5V_ST
9
R236
4.7K
8
7
6
5
R234 100K
IC204
1
1
GND
IC203
1000pF 50V
2
C237
RESET
2
VOUT
BOOT
VIN
PH
GND
C232
0.1uF
[EP]GND
SS
EN
COMP
VSENSE
POWER_DET
C234
0.01uF
R237
2.7K
C233
0.039uF 50V
50V
1%
SOC_RESET_+3.5V
R235-*1
100
R238
C236
0.33uF 16V
C235
390pF
50V
10K
Vout=0.808*(1+R1/R2)
+5V_USB & MHL W/ OCP
+12V
C215 10uF 16V
R222 100K
OPT
MHL_5V_EN
USB1_CTL
+3.3V_NORMAL
OPT
R218
4.7K
16K(1.6A)->14K(1.8A)
R220
4.7K
C212
100pF
50V
AR200
C213
4700pF
50V
OPT
R221 0
+3.3V_NORMAL
10K
1/16W
COMP
ROSC
EN_SW2
EN_SW1
[EP]GND
EN
1
2
SS
3
4
5
6
VIN_1
VIN_2
PGOOD
V7V
22
23
24
THERMAL
25
IC201
TPS65282REGR
4A
7
9
8
RLIM11AGND
FAULT2
FAULT1
SW_OUT2
USB1_OCD
/MHL_OCP_DET
C216 10uF 16V
21
10
R224 15K
PGND_2
OPT R225 100K
20
PGND_1
19
BST
18
LX_2
17
LX_1
16
FB
15
SW_IN_2
14
SW_IN_1
13
12
+5V_USB
SW_OUT1
D200
MBR230LSFT1G
30V
C217 10uF
10V
Vout=0.8*(1+R1/R2)
C218
L205
0.047uF
4.7uH
25V
5V_HDMI
AVDD_5V_MHL
R226
10
C219 10uF 16V
R227
3.3K
R1
R228
18K
R2
C223 82pF 50V
1%
1%
+5V_NORMAL
C227 22uF 16V
MHL_CD_SENSE
MHL_OCP_EN
CI_GateIC_Toshiba
IC202-*1
TC7SZ08FU_TOSHIBA
IN_B
1
IN_A
2
GND
3
74LVC1G08GW
B
1
A
2
GND
3
GateIC_STC
IC202
VCC
5
OUT_Y
4
+3.3V_NORMAL
5
4
VCC
Y
MHL_5V_EN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_NON_OS
POWER
13/08/13
2 of 6
Page 26
AUDIO AMP(TI)/LVDS/IR
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
[51Pin LVDS Connector] (For FHD 60Hz)
FHD
P300
FI-RE51S-HF-J-R1500
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
FHD
R300
26
0
27
28
29
30
31
32
33
34
35
36
37
38
39
40
AR300 0
41
1/16W
42
43
44
45
46
47
48
49
50
51
52
FHD
VCOM_SDA_M
VCOM_SCL_M
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
LVDS_SEL
+3.3V_NORMAL
OPT R302
3.3K
OPT R301
10K
PANEL_VCC
FHD L300
UBW2012-121F
FHD
OPT
C301
C300
0.1uF
10uF
16V
16V
[30Pin LVDS Connector] (For HD 60Hz_Normal)
HD
P301
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
AUDIO AMP(TI)
R303
0
1/16W
Separate DGND AND AVSS
Need to Check.
AMP_MUTE
POWER_DET
AMP_SDA
AMP_SCL
VCOM_SCL_M
VCOM_SDA_M
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
OPT
R304
0
LVDS_SEL
+3.3V_NORMAL
+3.3V_NORMAL
R305
4.7K
+3.3V_NORMAL
OPT R307
3.3K
OPT R306 10K
+24V
AUD_MASTER_CLK
OPT
C302
1000pF
50V
AR301
4.7K
1/16W
OPT C303 10uF 16V
L301
120OHM
AMP_RESET
PANEL_VCC
+24V_AMP
AUD_LRCK
AUD_SCK
AUD_LRCH
HD
L302 120OHM UBW2012-121F
HD
C306
0.1uF 16V
C305
0.1uF 50V
+3.3V_NORMAL
V-COM I2C
This parts are Located on AVSS area.
C304
0.1uF 16V
C308
0.1uF 16V
C307
0.1uF 16V
R313
R312
18K 1%
0.047uF
2.2K
+3.3V_NORMAL
V_COM R316
2K
AR302 0
R315
470
C315
0.047uF
VR_ANA
11
12
25
RESET26STEST
C314
2200pF
PLL_FLTM
PLL_FLTP
10
IC300
TAS5733
27
DVDD28DVSS
C313
0.1uF 16V
1/16W
V_COM
50V
29
GND
NC_28PBTL9AVSS
7
30
AGND31VREG
C318
0.033uF 50V
32
GVDD_OUT
C316 1uF 25V
VCOM_SCL_M VCOM_SCL VCOM_SDA_M
C312
4700pF
C310
4700pF
C309
R314 470
AVDD
MCLK
OSC_RES
DVSSO
VR_DIG
PDN
LRCLK
SCLK SDIN
SDA SCL
+3.3V_NORMAL
C311
0.1uF 16V
13 14 15 16 17 18 19 20 21 22 23 24
A_SEL_FAULT
OPT
ZD300
5V
PVDD_AB_1
PVDD_AB_2
BST_A5NC_16SSTIMER
2
3
4
THE RMAL
49
33
34
BST_D
PVDD_CD_135PVDD_CD_2
C317
0.033uF 50V
OUT_A
1 48 47 46 45 44 43 42 41 40 39 38 37
36
OUT_D
V_COM R317 2K
C320
0.1uF 50V
[EP] PGND_AB_2 PGND_AB_1 OUT_B NC_6 NC_5 BST_B BST_C NC_4 NC_3 OUT_C PGND_CD_2 PGND_CD_1
+24V_AMP
C319
0.1uF 50V
VCOM_SDA
+24V_AMP
C321 10uF 35V
C322 10uF 35V
R321181/16W
R320181/16W
C326
0.033uF 50V
C325
0.033uF 50V
R319181/16W
R318181/16W
C328 330pF 50V
C327 330pF 50V
C324 330pF 50V
C323 330pF 50V
IR
+3.5V_ST
AR303
10K
+3.5V_ST
L305
L306
10.0uH
L303
1/16W
PZ1608U121-2R0TF
LED_RED
C330
0.47uF 50V
C329
0.47uF 50V
L307
VR301
C335
0.1uF
VR302
OPT
16V
C334
0.1uF 50V
C333
0.1uF 50V
C332
0.1uF 50V
C331
0.1uF 50V
OPT
C338
0.1uF 16V
OPT
C337
0.1uF 16V
C336 1000pF 50V
OPT
VR300
IR
+3.5V_ST
OPT
R322
3.3K
C339
100pF
OPT
VR303
50V
IR_8PIN
P302
12507WR-08L
1
2
3
4
5
6
7
8
9
IR_10PIN
P303
12507WR-10L
1
2
3
4
5
6
7
8
9
10
11
Close to Speaker
SPK_L+
OPT C343 2200pF 50V
SPEAKER_L
OPT C342 2200pF 50V
OPT C341 2200pF 50V
OPT C340 2200pF 50V
SPK_L-
SPK_R+
SPEAKER_R
SPK_R-
SPK_L+
SPK_L-
SPK_R+
SPK_R-
P304
4
3
2
1
KEY1
KEY2
10.0uH
1%
1%
NRS6045T100MMGK
NRS6045T100MMGK
L304
10.0uH
NRS6045T100MMGK
1%
1%
10.0uH
NRS6045T100MMGK
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14-NON-OS
LVDS/S_AMP/IR
13/08/13
3 of 6
SPK_L-
Page 27
EXTERNAL INTERFACE
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
AV/COMPONENT
JK401
PPJ245N2-01
[RD2]E-LUG
6E
R405 75 5%
comp-shape=2012
R404
75 5% comp-shape=2012
R403 75 1% comp-shape=3216
OPT
IC400
1
2
3
4
5
6
7
8
OPT C402 1000pF 50V
OPT C401
1000pF 50V
C1+
V+
C1-
C2+
C2-
V-
DOUT2
RIN2
VR403
R402
OPT
VR401
OPT
OPT
VR400
DOUT1
ROUT1
ROUT2
RIN1
DIN1
DIN2
VA402
VCC
GND
470K
R401 470K
OPT
VR402
OPT
ICVS0518150FR_
OPT
VA401
ICVS0518150FR_
VA400
ICVS0518150FR_
MAX3232CDR
16
15
14
13
12
11
10
9
EAN41348201
5E
4E
5D
4C
5C
7C
5B
4A
5A
6A
UART For DEBUG
JK400
KJA-PH-1-0177
6 M6
1 M1
3 M3_DETECT
4 M4
5 M5_GND
OPT R400
0
[RD2]O-SPRING
[RD2]CONTACT
[WH]O-SPRING
[RD1]CONTACT
[RD1]O-SPRING
[RD1]E-LUG-S
[BL]O-SPRING
[GN/YL]CONTACT
[GN/YL]O-SPRING
[GN/YL]E-LUG
1/16W
5%
PM_TXD
PM_RXD
+3.5V_ST
C400
0.1uF
AR400 100 1/16W
P400
12507WS-04L
1
2
3
4
5
ZD404
ZD405
ZD402
ZD403
ZD401
ZD400
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R406 10K
C406
0.1uF
0.1uF
0.1uF
0.1uF
R409 10K
C405
C404
C403
R408 12K
R407 12K
+3.3V_NORMAL
AR401
10K
1/16W
COMP_R_IN
COMP_L_IN
COMP_DET
COMP_Pr+
COMP_Pb+
AV_DET
COMP_Y+
CVBS_OUT
USB(SIDE)
SPDIF OPTIC JACK
3AU 04S-3 05-Z C-(LG )
P401
USB DOWN STR EAM
+3.3V_NORMAL
CVBS_OUT
R410
75
1234
5
SPDIF_OUT
HDMI_1(REAR)
OPT R416
10K
C
R417
5V_DET_HDMI_1
JK404
SHIELD
20
19
18
17
16
15
14
13
12
11
CK+
10
EAG59023302
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
CVBS_OUT
IC401
MM1756DURE
VCC
6
PS
5
OUT
4
OPT ZD406 5V
1
2
3
C407 22uF 10V
+3.3V_NORMAL
OPT
IN
GND
BIAS
C409 22uF 10V
RCLAMP0502BA
OPT
D400
C408 1uF 10V
ESD Ready
CVBS_OUT
C411
0.1uF
CVBS_OUT
C410
4.7uF
OPT C413 5pF 50V
SPDIF
C412 68pF 50V
CVBS_OUT
C415
0.1uF
+5V_USB
OPT C414 5pF 50V
GND
VCC
VINPUT
DTV/MNT_VOUT
SPDIF
JK402
JST1223-001
1
2
3
4
SIDE_USB_DM
SIDE_USB_DP
Fiber Optic
FIX_POLE
HDMI_2(SIDE)
GND
JK403
BODY_SHIELD
20
19
18
17
16
15
14
13
12
11
10
EAG62611204
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI
OPT
VR404
OPT
VR405
R411
2.7K
R412
1K
R414
4.7K
4 3
4 3
4 3
4 3
VR407
OPT
5V_DET_HDMI_2
R413
2.7K
VR406 OPT
MMBT3904(NXP)
OPT VR409
L401 DLP11SA900HL2L HDMI_REAR_EMI_FILTER
21
L402 DLP11SA900HL2L HDMI_REAR_EMI_FILTER
21
L403 DLP11SA900HL2L HDMI_REAR_EMI_FILTER
21
L404 DLP11SA900HL2L HDMI_REAR_EMI_FILTER
21
OPT
VR408
R415
4.7K
VR410 OPT
Q400
OPT
VR411
COMP/USB/SPDIF
10K
B
E
R419 33
1/16W 5%
+5V_NORMAL +3.5V_ST
AR402
4.7K
OPT
VR412
OPT
D405
IP4283CZ10-TBA
1
2
3
4
5 6
1
2
3
4
5 6
D404
IP4283CZ10-TBA
C416
0.047uF
25V
1/16W
10
9
8
7
10
9
8
7
R418 300K
MHL Spec
A2CA1
MMBD6100 D401
OPT
+5V_NORMAL
OPT
VR413
IP4283CZ10-TBA
IP4283CZ10-TBA
R420
4.7K
OPT
VR414
OPT
D403
1
2
3
4
5 6
1
2
3
4
5 6
D402
OPT
JP422
2013.08.13L14-NON-OS
HPD1
R421
4.7K
10
9
8
7
10
9
8
7
HPD2
CK-_HDMI2 CK+_HDMI2
D0-_HDMI2 D0+_HDMI2
D1-_HDMI2 D1+_HDMI2
D2-_HDMI2 D2+_HDMI2
MHL_CD_SENSE
JP424
JP423
6
DDC_SDA_2
DDC_SCL_2
JP425
DDC_SDA_1
DDC_SCL_1
CK-_HDMI1 CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1 D1+_HDMI1
D2-_HDMI1 D2+_HDMI1
Page 28
TUNER for ATSC W/O Isolator
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
3.3V_NORMAL -> 3.3V_TU
+3.3V_NORMAL
OPT
C507
0.1uF 16V
PZ1608U121-2R0TF
OPT C508 22uF
6.3V
L500
C509 22uF
6.3V
+3.3V_TU
OPT
C510
0.1uF 16V
+3.3V_TU
AR500 33 1/16W
OPT
C501
TU500 TDSS-H701F
NC_1
1
NC_2
2
SCL
3
SDA
4
+B1[3.3V]
5
NC_3
6
NC_4
7
NC_5
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
SHIELD
A1
A1
R501 33
R500
1/16W
33
5%
1/16W 5%
Close to the tuner
B1
B1
12
15pF 50V
IF_P_MSTAR IF_N_MSTAR
C504 15pF 50V
+3.3V_TU
C500 100pF 50V
close to the tuner pin
C503
0.1uF 16V
should be guarded by ground
C502
0.1uF 16V
C505 20pF 50V
R502
1.8K
OPT
C506 20pF 50V
R503
1.8K
IF_AGC_MAIN
TU_SCL TU_SDA
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils Signal to Signal Width = 12mils Ground Width >= 24mils
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14-NON-OS 2013.08.13
TUNER
5
Page 29
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