Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to LA34D Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
4. MAIN PCBA Adjustments
4.1. ADC Calibration
- An ADC cali bra tion is not necessary because MA IN SoC
(LGExxxx) is already calibrated from IC Maker
- If it needs to adjust manually, refer to appendix.
4.2. MAC Address, ESN Key and Widevine
Key download
4.2.1. Equipment & Condition
1) Play file: keydownload.exe
4.2.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process
- US, C anada m odels : DETEC T -> M AC_ WR IT E ->
WIDEVINE_WRITE
- Korea, Mexico m odels: DET ECT -> MAC_WRI TE ->
WIDEVINE_WRITE
4) Play : START
5) Check of result: Ready, Test, OK or NG
6) Printer out (MAC Address Label)
4.2.4. Communication Port connection
1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
- Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly tages can be checked by using the INSTART
Menu -> 1.ADJUST CHECK
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
3.3. Appendix
(1) Tool option menu, USB Download (S/W Update, Option and
Service only)
(2) Manual adjustment for ADC calibration and White balance.
(3) Shipment conditions, Channel pre-set
4.2.5. Download
1) US, Canada models (13Y LCD TV + MAC + Widevine +
ESN Key + DTCP Key + HDCP1.4 and HDCP2.0)
(1) Objective : To check PCBA’s CAMERA Port.
(2) How-it-works
i) Connect the PCBA like below Picture.
ii) Send specific RS-232C Command for displaying Camera
Preview.
* CAMERA need to be status of Slide up.
(3) RS-232C Command
RS-232C COMMAND
CMDDATAID
Ai0023Camera Function Start.
Ai0024Camera Function End.
Explanation
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON sta tus during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Vi deo Signal Generat or MS PG-925F 720p/ 204-Gray
(Model: 217, Pattern: 49)
※ Color Analyzer Matrix should be calibrated using CS-1000
5.1.3. Equipment connection
Color Analyzer
Probe
RS-232C
※
Signal Source
※If TV internal pattern is used, not needed
Pattern Generator
RS-232C
Computer
RS-232C
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMDDATAID
Wb0000Begin White Balance adj.
Wb00ffEnd White Balance adj.
(internal pattern disappears )
(2) Adjustment Map
Adj. item Command
(lower caseASCII)
CMD1CMD2MINMAX
CoolR Gainjg00C0
G Gainjh00C0
B Gainji00C0
MediumR Gainja00C0
G Gainjb00C0
B Gainjc00C0
WarmR Gainjd00C0
G Gainje00C0
B Gainjf00C0
Explanation
Data Range
(Hex.)
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.1.5.2. LED White balance table
(1) Cool Mode
- Purpose : Especial ly G-ga in fix ad just leads to the
luminance enhancement. Adjust the color temperature to
reduce the deviation of the module color temperature.
- Prin ciple : To adju st the white bala nce witho ut the
saturation, Adjust the G gain more than 172 ( If R gain or G
gain is more than 255 , G gain can adjust less than 172 )
and change the others ( R/B Gain ).
- Adjustment mode : mode – Cool
(2) Medium / Warm Mode
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Prin ciple : To adju st the white bala nce witho ut the
saturation, Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Two modes – Medium / Warm
5.1.6. Reference (White Balance Adj. coordinate and
color temperature)
(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and temperature using CS-1000
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-NC4_H001-HD
2012-11-14
H13 D CHIP
Page 23
LG1154A
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
BSD-NC4_H002-HD
2012-12-24
MAIN POWER
Page 24
Place JACK Side
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
AV1_CVBS_IN
SC_CVBS_IN
SC_CVBS_IN_SOY
COMP1_Pb
COMP1_Pr
SCART_Lout
SCART_Rout
HP_LOUT_MAIN
HP_ROUT_MAIN
TU_CVBS
SC_FB
SC_ID
NON_EU
R422-*1
COMP1_Y
5.5V
D404
0
SCART_FB_DIRECT
SC_B
SC_G
SC_R
D403
D401
5.5V
5.5V
Near Place Scart AMP
C6006
1uF 25V
C6001
SC_L_IN
SC_R_IN
COMP1/AV1/DVI_L_IN
COMP1/AV1/DVI_R_IN
+12V
R430
R445
L408
C405
150pF
50V
L409
C408
150pF
50V
EU
C402
150pF
50V
OPT
SCART_FB_DIRECT
R423100
10K
EU
R435
R422
75
10pF
10pF
C473
C472
50V
50V
OPT
OPT
D406
C430
5.5V
EU
EU
10K
1uF25V
R60 06
EU
EU
10K
R6005
EU
EU
R408
100K
R403
100K
EU
C403
2.2uF
10V
EU
EU
R404
100K
R409
100K
R6450
100
C400
0.01uF
22K
R6451
C401
0.01uF
22K
1uH
1uH
EU
EU
2.7K
10pF
C474
50V
OPT
10pF
C431
50V
SCART_AMP_R_FB
EU
C406
2.2uF
10V
100
+3.3V_NORMAL
R4641K1/16W
R465
390
1/16W
C410
R410
150pF
75
1%
C462
R411
150pF
75
EU
EU
1%
NON_EU
R436
R436-*1
0
75
75
1%
1%
EU
R414
R412
10pF
10pF
C470
50V
50V
SCART_AMP_L_FB
SCART_Lout_SOC
SCART_Rout_SOC
CLK_54M_VTT
1%
C404
0.01uF
50V
1%
DAC_START_PULLDOWN
R466821/16W
1%
75
EU
EU
1%
R416
75
75
75
1%
1%
1%
R417
R415
R413
AUDA_OUTL
AUDA_OUTR
FOR EMI
R424
R425
R427
R428
R429
1%
R41827K
1%
R41927K
1%
R42027K
1%
R42127K
SC_FB
Clock for H13A
MAIN Clock(24Mhz)
10pF
C426
10pF
C427
Place SOC Side
R434
C424 0.047uF
100
R433
C425 0.047uF
100
SC_CVBS_IN_SOY
R432
C423 0.047uF
100
C417 0.047uF
33
C418 0.047uF
33
C428 1000pF
C419 0.047uF
33
C420 0.047uF
33
C421 0.047uF
33
C429 1000pF
C422 0.047uF
33
R431
AUDIO IN
C4324.7uF
R43710K 1%
C4334.7uF
R43810K 1%
C4344.7uF
R43910K 1%
C4354.7uF
R44010K 1%
+3.3V_NORMAL
R446
4.7K
R401
470
1/16W
5%
R4061K
SCART_FB_BUFFER
SCART_FB_BUFFER
C
B
E
1/16W
1%
SCART_FB_BUFFER
X-TAL_1
GND_1
1
2
4
3
GND_2
X-TAL_2
AV1_CVBS_IN_SOC
SC_CVBS_IN_SOC
TU_CVBS_SOC
SC_FB_SOC
SC_ID_SOC
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_Y_IN_SOC_SOY
COMP1_PR_IN_SOC
COMP2_PB_IN_SOC
COMP2_Y_IN_SOC
COMP2_Y_IN_SOC_SOY
COMP2_PR_IN_SOC
SC_FB_BUF
MMBT3904(NXP)
Q400
SCART_FB_BUFFER
R441
X400
24MHz
AUAD_L_CH3_IN
AUAD_R_CH3_IN
AUAD_L_CH2_IN
AUAD_R_CH2_IN
Tuner IF Filter
1M
COMP1_Y_IN_SOC_SOY
COMP2_Y_IN_SOC_SOY
HP_LOUT_AMP
XIN_SUB
XOUT_SUB
XIN_SUB
XOUT_SUB
XTAL_SEL[0]
XTAL_SEL[1]
SOC_RESET
OPM[0]
OPM[1]
H13A_SCL
H13A_SDA
AV1_CVBS_IN_SOC
SC_CVBS_IN_SOC
TU_CVBS_SOC
DTV/MNT_V_OUT_SOC
OPT
Placed as close as possible to SOC
REFT
REFB
R44768
R44868
R44968
SC_ID_SOC
SC_FB_SOC
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_PR_IN_SOC
COMP2_PB_IN_SOC
COMP2_Y_IN_SOC
COMP2_PR_IN_SOC
+3.3V_NORMAL
VCC
PS
OUT
DTV/MNT_V_OUT
ADC_I_INN
To ADC
ADC_I_INP
HP_OUT
L400
BLM18PG121SN1D
HP_OUT
C407
0.22uF
10V
Place at JACK SIDE
P17
IN
1
GND
2
BIAS
3
0.01uF
0.01uF
BLM18PG121SN1D
HP_ROUT_AMP
C437
C438
P18
J17
N18
D18
M18
M17
E3
K3
K2
A8
B8
U13
V14
V15
V13
U15
U14
U7
V6
V7
U10
V12
T5
T6
U8
V8
V9
U9
V10
U11
V11
U12
EU
4.7uF
C413
L406
OPT
HP_OUT
L401
R453330
C443 0.047uF
68
R450
C439
100pF
50V
C440 0.047uF
C441 0.047uF
C442 0.047uF
IC400
MM1756DURE
6
5
4
R443
51
C436
22pF
R444
51
Placed as close as possible to IC100
HP_LOUT
OP MODE Setting
& Select XTAL Input
OP MODE[0:1] : SW[2:1]
00 => Normal Operaiton Mode
/T32 Debug Mode
01 => Internal Test Purpose
10 => Internal Test Purpose
11 => Internal Test Purpose
XTAL SEL[1:0] : SW[4:3]
00 => Xtal Input
01 => CLK 24M from H13D
10 => XTAL Bypass from H13D
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-NC4_H004-HD
2012-11-13
MAIN AUDIO/VIDEO
Page 25
IC100
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
DDR3 1.5V bypass Cap - Place these caps near Memory
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-NC4_H005-HD
2012-09-14
MAIN DDR
Page 26
PCM_RESET
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
CI
CI_TS_DATA[3]
CI_TS_DATA[2]
CI_TS_DATA[1]
CI_TS_DATA[0]
AR700
100
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TPI_DATA[3]
TPI_DATA[2]
TPI_DATA[1]
TPI_DATA[0]
BSD-NC4_H007-HD
2012-10-20
PCMCIA
Page 27
RL_ON
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LG1154
POWER
BSD-NC4_H023-HD
2012-12-07
Page 28
Renesas MICOM
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
For Debug
+3.5V_ST
MICOM_DEBUG
P3000
12507WS-04L
5
1
2
3
4
Don’t remove R3014,
not making float P40
R3016 1K
R3014 10K
MICOM_DEBUG
MICOM_DEBUG
MICOM_RESET
GP4 High/MID Power SEQUENCE
POWER_ON/OFF!
POWER_ON/OFF2_1
POWER_ON/OFF2_2
POWER_ON/OFF2_3
POWER_ON/OFF2_4
SOC_RESET
MICOM MODEL OPTION
MICOM MODEL OPTION
+3.5V_ST
MODEL_OPT_0
MODEL_OPT_1
R3007-*2
22K
R3007-*1
56K
MICOM_GED
MICOM_H13
R3002 10K
R3003 10K
MICOM_M13
R3000 10K
R3001 10K
MICOM_NON_GED
R3006 10K
MICOM_PDP
MICOM_NC4_8PIN
R3007 10K
R3010 10K
MICOM_TOUCH_KEY
R3004 10K
R3005 10K
MICOM_GP3_12/15PIN
R3008 10K
MICOM_LCD/OLED
MICOM_TACT_KEY
R3013 10K
MICOM_LOGO_LIGHT
R3012 10K
MICOM_NON_LOGO_LIGHT
MICOM_OLED_FRC
MICOM_OLED_MAIN
MODEL1_OPT_0
MODEL1_OPT_1
MODEL1_OPT_2
MODEL1_OPT_3
MODEL1_OPT_4
MODEL1_OPT_5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
BODY_SHIELD
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
ARC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
D0-
9
D0_GND
8
EAG62611204
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
JK3202
51U019S-312HFN-E-R-B-LG
VA3206
ESD_HDMI
R3250
VA3208
ESD_HDMI
R320722
R320822
ESD_HDMI
VA3213
ESD_HDMI
CEC_REMOTE
VA3207
HDMI_HPD_1
DDC_SDA_1
DDC_SCL_1
R3248
1K
OPT
R3249
3.9K
OPT
D3210
RCLAMP0524PA
1
10
2
9
8
3
7
4
6
5
HDMI_ESD_SEMTEK
D3211
RCLAMP0524PA
1
10
2
9
8
3
7
4
6
5
HDMI_ESD_SEMTEK
C3202
1uF
10V
VA3215
ESD_HDMI
OPT
C3226
0.1uF
16V
ARC
SPDIF_OUT_ARC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
HDMI_ESD_NXP
D3210-*1
IP4283CZ10-TBA
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+6NC_1
5
HDMI_ESD_NXP
D3211-*1
IP4283CZ10-TBA
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+6NC_1
5
BODY_SHIELD
GND
NC_4
10
NC_3
9
GND_2
8
NC_2
EAG62611204
7
NC_4
10
NC_3
9
GND_2
8
NC_2
7
51U019S-312HFN-E-R-B-LG
JK3203
5V_HDMI_4
20
HP_DET
19
5V
18
GND
VA3216
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
ESD_HDMI
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HDMI1 With ARC
5V_HDMI_1
+5V_NORMAL
BODY_SHIELD
20
EAG62611204
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_2
VA3209
ESD_HDMI
CEC_REMOTE
VA3205
ESD_HDMI
R3251
33
HDMI_HPD_2
R3209
R3210
VA3203
ESD_HDMI
D3212
RCLAMP0524PA
1
10
2
9
8
3
7
4
6
5
HDMI_ESD_SEMTEK
D3213
RCLAMP0524PA
1
10
2
9
8
3
7
4
6
5
22
22
VA3204
ESD_HDMI
DDC_SDA_2
DDC_SCL_2
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
HDMI_ESD_NXP
D3212-*1
IP4283CZ10-TBA
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+6NC_1
5
HDMI_ESD_NXP
D3213-*1
IP4283CZ10-TBA
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+6NC_1
5
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_4
10
NC_3
9
GND_2
8
NC_2
7
D3200
R3217
47K
+5V_NORMAL
D3201
R3218
47K
5V_HDMI_1
A2CA1
5V_HDMI_3
A2CA1
R3219
47K
R3220
47K
DDC_SDA_3
DDC_SCL_3
DDC_SDA_1
DDC_SCL_1
HDMI_ESD_SEMTEK
JK3200
51U019S-312HFN-E-R-B-LG
BODY_SHIELD
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
D0-
9
D0_GND
8
EAG62611204
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
JK3201
51U019S-312HFN-E-R-B-LG
5V_HDMI_3
VA3214
ESD_HDMI
CEC_REMOTE
ESD_HDMI
D3209
RCLAMP0524PA
1
2
3
4
5
HDMI_ESD_SEMTEK
D3208
RCLAMP0524PA
1
2
3
4
5
HDMI_ESD_SEMTEK
VA3202
ESD_HDMI
VA3200
10
9
8
7
6
10
9
8
7
6
HDMI2
R3252
33
R3203
R3205
ESD_HDMI
22
22
VA3201
HDMI_HPD_3
DDC_SDA_3
DDC_SCL_3
CK-_HDMI3
CK+_HDMI3
D0-_HDMI3
D0+_HDMI3
D1-_HDMI3
D1+_HDMI3
D2-_HDMI3
D2+_HDMI3
HDMI_ESD_NXP
D3209-*1
IP4283CZ10-TBA
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+6NC_1
5
HDMI_ESD_NXP
D3208-*1
IP4283CZ10-TBA
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+6NC_1
5
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_4
10
NC_3
9
GND_2
8
NC_2
7
HDMI3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SPDIF_OUT
R3400
+3.3V_NORMAL
33
C3402
47pF
50V
VA3400
5.5V
OPT
ADUC 5S 02 0R5L
C3400
0.1uF
16V
JK3401
JSTIB15
VIN
A
VCC
B
GND
C
Fiber Optic
4
SHIELD
HP_LOUT
HP_ROUT
R3404
150
1/10W
5%
R3405
150
1/10W
5%
HP_DET
HP_OUT
R3409
100
1/16W
5%
+3.3V_NORMAL
R3406
10K
HP_OUT
VA3405
5.6V
JK3403
PEJ038-3B6
5GND
4L
3DETECT
1R
EAG61030009
HP_OUT
COMPONENT 1 PHONE JACK
JK3400
PEJ038-4G6
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
SOC_RX
SOC_TX
R3401
10K
VA3401
5.6V
+3.5V_ST
+3.3V_NORMAL
R3402
10K
OPT
C3401
18pF
P3400
12507WS-04L
1
2
3
4
5
R3407
100
1/16W
5%
COMP1_DET
COMP1_Y
COMP1_Pb
COMP1_Pr
CVBS 1 PHONE JACK
JK3402
PEJ038-4Y6
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
VA3402
5.6V
VA3403
5.6V
VA3404
5.6V
+3.3V_NORMAL
R3403
330K
C3403
0.1uF
16V
for audio Hum noise (L)
R3408
100
1/16W
5%
AV1_CVBS_DET
COMP1/AV1/DVI_L_IN
COMP1/AV1/DVI_R_IN
AV1_CVBS_IN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
JACK HIGH/MID
BSD-NC4_H034-HD
2012.10.09
Page 31
Place Near Micom
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LOGO_LIGHT
+3.5V_ST
10K
R4001
10K
LOGO_LIGHT
OPT
R4000
C4000
0.1uF
16V
LOGO_LIGHT
1K
R4002
LOGO_LIGHT
LOGO_LIGHT
B
Q4000
MMBT3904(NXP)
IR
LOGO_LIGHT
R400333
LOGO_LIGHT
R400433
C
E
R4005
10K
5%
+3.5V_ST
LOGO_LIGHT_WAFER
R4008
R4006
100
KEY1
R4007
100
KEY2
+3.5V_ST
10K
5%
R4009
10K
5%
C4001
0.1uF
C4002
0.1uF
AMOTECH CO., LTD.
+3.5V_ST
VA4000
5.6V
VA4001
5.6V
AMOTECH CO., LTD.
EYE_SCL
EYE_Q_10P
EYE_SDA
EYE_Q_10P
L4001
BLM18PG121SN1D
R4011
100
OPT
R4010
100
OPT
C4005
1000pF
50V
LOGO_LIGHT_WAFER
VA4004
ADMC 5M 02 200L
VA4003
ADMC 5M 02 200L
C4006
100pF
NON_OLED
50V
VA4002
5.6V
NON_OLED
AMOTECH CO., LTD.
NON_EYE_Q_8P
P4002
12507WR-08L
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
EYE_Q_10P
P4004
12507WR-10L
11
+3.5V_WOL
WIFI_DM
WIFI_DP
WOL/WIFI_POWER_ON
IR
C4016
5pF
50V
L4000
120-ohm
BLM18PG121SN1D
C4015
5pF
50V
OLED
R4013
22
C4010
100pF
OPT
C4004
22uF
10V
VA4005
5.6V
50V
MAX 0.4A
AMOTECH CO., LTD.
OPT
+3.5V_WOL
USB_DM
USB_DP
GND
WOL
GND
NON_OLED
P4000
SMAW200-H12S2
SMAW200-H16S2
P4003
OLED_DEV
17
2
4
6
8
10
12
14
16
.
1
3
5
7
9
11
13
15
3.3V
RTS
RX
TX
RESET
CTS
1000pF
C4011
OLED
50V
L4003
BLM18PG121SN1D
OLED
L4002
120-ohm
+3.5V_ST
+3.3V_NORMAL
C4007
0.1uF
C4012
1000pF
50V
For EMI
C4008
47pF
50V
R4012
100
C4009
47pF
50V
OPT
C4013
47pF
50V
OPT
C4014
47pF
50V
For EMI
AR4000
100
1/16W
+3.3V_NORMAL
R4014
10K
M_REMOTE_RTS
M_REMOTE_RX
M_REMOTE_TX
M_RFModule_RESET
M_REMOTE_CTS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
IR / KEY
BSD-NC4_H040-HD
2012.10.10
Page 32
+3.3V_NORMAL
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.3V_NORMAL
BLM18PG121SN1D
CAMERA
L4200
120-ohm
USB2_HUB_IC_IN_DM
USB2_HUB_IC_IN_DP
USB_DM3
USB_DP3
C4200
CAMERA
1uF
25V
C4201
0.1uF
CAMERA
CAMERA
C4202
4.7uF
CAMERA
C4203
0.1uF
CAMERA
R42040
CAMERA
R42050
USB_CAMERA_DM
USB_CAMERA_DP
CAMERA
CAMERA
R421910K
R421810K
R4216
R4215100K
PSELF
PGANG
23
AVDD_3
GND_2
X-TAL_2
22
14
100K
21
20
19
18
17
16
15
DVDD
OVCUR3
OVCUR4
TEST/SCL
RESET
DP4
DM4
C4207
22pF
CAMERA
+3.3V_NORMAL
CAMERA
C4208
0.1uF
R4217
10K
CAMERA
1/16W
5%
C4209
0.1uF
CAMERA
/RST_HUB
CAMERA POWER ENABLE CONTROL
+3.5V_ST
CAMERA_NON_OLED
Q4201
PMV48XP
S
+5V_NORMAL
L4201
UBW2012-121F
OLED
D
+3.5V_CAM
From HUB
USB_Camera
CAM_SLIDE_DET
+3.5V_CAM
C4213
4.7uF
CAMERA
5V
10V
ZD4200
CAM_PWR_ON_CMD
AUD_LRCH
OPT
AUD_LRCK
AUD_SCK
R4211
CAMERA
33
R4212
33
CAMERA
R4213
33
CAMERA
CAMERA
CAMERA
33pF
50V
OPT
33pF
50V
CAMERA
33pF
50V
C4211
C4215
33pF
50V
C4212
C4214
CAMERA
P4200
12507WR-12L
1
2
3
4
5
6
7
OPT
OVCUR2
OVCUR1
SDA
V33
[EP]GND
24
25
26
1
2
3
4
5
6
7
R4214
CAMERA
1%
C4205
0.1uF
CAMERA
X-TAL_1
CAMERA
27V528
THERMAL
29
IC4200
GL852G-31
9
8
RREF
AVDD_2
680
GND_1
22pF
C4204
CAMERA
10X111X212
X4200
12MHZ
1
2
CAMERA
DM313DP3
C4206
0.1uF
CAMERA
4
3
DM0
DP0
CAMERA
R42060
R42100
CAMERA
DM1
DP1
AVDD_1
DM2
DP2
USB2_HUB_IC_IN_DM
USB2_HUB_IC_IN_DP
NON_CAMERA
NON_CAMERA
R42000
R42010
NON_CAMERA
R42020
R42030
NON_CAMERA
USB_DM3
USB_DP3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CAM_CTL
CAMERA_NON_OLED
R4207
3.3K
R4208
22K
R4209
CAMERA_NON_OLED
2.2K
CAMERA_NON_OLED
C
B
Q4200
MMBT3904(NXP)
E
C4210
4.7uF
10V
CAMERA_NON_OLED
CAMERA_NON_OLED
G
ST_BY_DET_CAM
USB_CAMERA_DP
USB_CAMERA_DM
R4220
10K
CAMERA
VA4201
VA4200
CAMERA
D4200
OPT
RCLAMP0502BA
CAMERA
8
9
10
11
12
13
BSD-NC4_H042-HD
USB3_HUB
2012.10.08
Page 33
/USB_OCD1
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
USB_CTL1
R4500
10K
OPT
+3.3V_NORMAL
R4501
10K
+5V_NORMAL
C4500
0.1uF
16V
OCP USB1
IC4500
BD82020FVJ
GND
1
IN_1
2
IN_2
3
EN
4
+5V_USB_1
USB1 (3.0)
C4400
10uF
10V
USB3_DM
USB3_DP
+5V_USB_1
OUT_3
8
OUT_2
7
OUT_1
6
OC
5
C4501
10uF
10V
USB3_RX0M
USB3_RX0P
USB3_TX0M
USB3_TX0P
D4400
RCLAMP0502BA
D4401
RCLAMP0502BA
D4402
RCLAMP0502BA
MAX 1.2A
STDA_SSRX-
STDA_SSRX+
GND_DRAIN
STDA_SSTX-
STDA_SSTX+
VBUS
GND
D-
D+
SHIELD
JK4400
SJ113262
1
2
3
4
5
6
7
8
9
10
C4302
0.1uF
16V
+5V_NORMAL
USB_CTL3
USB_CTL2
OCP USB2/3
IC4306
TPS2066CDGNR
GND
EN1
EN2
1
IN
2
3
4
9
THERMAL
8
7
6
5
[EP]GND
FLT1
OUT1
OUT2
FLT2
C4337
10uF
10V
C4301
10uF
10V
+3.3V_NORMAL
+5V_USB_3
+5V_USB_2
10K
R4301
10K
R4302
/USB_OCD3
/USB_OCD2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
USB_DM2
USB_DP2
+5V_USB_2
C4322
10uF
10V
USB2 (2.0)
MAX 1.0A
3AU04S -30 5-ZC-(LG)
JK4302
D4302
RCLAMP0502BA
+5V_USB_3
USB3 (2.0)
MAX 1.0A
3AU04S -30 5-ZC-(LG)
JK4300
1234
USB_DM3
USB_DP3
USB DO WN STREAM
5
C4310
10uF
10V
D4300
RCLAMP0502BA
USB JACK
1234
USB DOWN STREAM
5
BSD-NC4_H044-HD
2012-11-09
Page 34
Full Scart(18 Pin Gender)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
VA4801
5.6V
EU
VA4807
VA4800
20V
EU
5.5V
EU
VA4808
5.5V
OPT
VA4802
5.6V
VA4803
5.5V
VA4804
5.5V
EU
VA4805
5.5V
EU
EU
EU
19
DA1R018H91E
JK4800
EU
SHIELD
18
17
16
15
14
13
12
11
10
AV_DET
COM_GND
SYNC_IN
SYNC_OUT
SYNC_GND
RGB_IO
R_OUT
R_GND
G_OUT
G_GND
9
ID
8
B_OUT
7
AUDIO_L_IN
6
B_GND
5
AUDIO_GND
4
AUDIO_L_OUT
3
AUDIO_R_IN
2
AUDIO_R_OUT
1
SC_CVBS_IN
VA4809
5.6V
EU
+3.3V_NORMAL
EU
R480075
EU
SC_L_IN
EU
R4801
10K
C4804
0.1uF
SC_FB
SC_G
SC_B
CLOSE TO JUNCTION
EU
R4802
100
1/16W
5%
SC_R
SC_DET
DTV/MNT_V_OUT
SC_ID
VA4806
5.6V
SC_R_IN
EU
BLM18PG121SN1D
EU
EU
C4800
1000pF
50V
BLM18PG121SN1D
EU
EU
C4801
1000pF
50V
L4800
L4801
C4802
4700pF
EU
C4803
4700pF
EU
DTV/MNT_L_OUT
DTV/MNT_R_OUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-NC4_H048-HD
2012.10.31
SCART GENDER
Page 35
Ethernet Block
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LAN_JACK_POWER
JK5100
XRJH-01A-4-DA7-180-LG(B)
LAN_XML
P1[CT]
1
P2[TD+]
2
P3[TD-]
3
P4[RD+]
4
P5[RD-]
5
P6[CT]
6
P7
7
P8
8
P9
9
P10[GND]
10
P11
11
YL_C
D1
YL_A
D2
GN_C
D3
GN_A
D4
12
SHIELD
C5100
0.1uF
16V
C5101
0.01uF
50V
VA5100
5.5V
C5102
0.1uF
16V
VA5101
5.5V
C5103
0.01uF
50V
VA5102
5.5V
VA5103
5.5V
EPHY_TDP
EPHY_TDN
EPHY_RDP
EPHY_RDN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
JK5100-*1
TLA-6T764
LAN_TDK
R1
1
R2
2
R3
3
R4
4
R5
5
R6
6
R7
7
R8
8
R9
9
R10[GND]
10
R11
11
YL_C
D1
YL_A
D2
GN_C
D3
GN_A
D4
12
SHIELD
LAN_VERTICAL
2011.12.09
50
Page 36
Ethernet Block
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.3V_WOL
3.3K
+3.5V_WOL
L5200
+3.3V_WOL
120-ohm
BLM18PG121SN1D
LAN_JACK_POWER
C5201
0.1uF
16V
EPHY_TDP
EPHY_TDN
EPHY_RDP
EPHY_RDN
C5203
0.1uF
16V
Route Single 50 Ohm, Differential 100 Ohm
C5200
4.7uF
10V
Place 0.1uF close to each power pins
ET_COL/SNI
Place this cap. near IC
C5205
0.1uF
16V
Place this Res. near IC
+3.3V_WOL
R5203
3.3K
C5206
20pF
50V
R5204
2.49K 1%
GND_1
1
2
4
3
X-TAL_2
C5207
20pF
50V
AVDD10OUT
+3.3V_WOL
X-TAL_1
X5200
25MHz
GND_2
RSET
MDI+[0]
MDI-[0]
MDI+[1]
MDI-[1]
AVDD33_1
RXDV
3.3K
R5200
+3.3V_WOL
R52021M
OPT
[EP]
CKXTAL2
1
2
3
4
5
6
7
8
RXD[0]10RXD[1]
R5206 33
Place this cap. near IC
C5208
0.1uF
16V
ET_RXER
R5218
0
DVDD10OUT
AVDD33_2
CKXTAL1
29
30
31
32
THERMAL
33
IC5200
RTL8201F-VB-CG
9
11
12
13
RXC
RXD[2]/INTB
RXD[3]/CLK_CTL
OPT
R5207 33
R5201 33
3.3K
EPHY_INT
EPHY_RXD0
R5208
EPHY_RXD1
ET_COL/SNI
COL28RXER/FXEN
27
14
DVDD33
C5209
33pF
C5202
5pF
EPHY_CRS_DV
EPHY_ACTIVITY
R521033
LED1/PHYAD[1]
CRS/CRS_DV
25
26
24
23
22
21
20
19
18
17
15
16
TXC
TXD[0]
R5209
51
EPHY_TXD0
Place near IC
LED0/PHYAD[0]/PMEB
MDIO
MDC
PHYRSTB
TXEN
TXD[3]
TXD[2]
TXD[1]
+3.3V_WOL
C5211
0.1uF
16V
R5215
3.3K
R5217
EPHY_EN
EPHY_TXD1
R5205
+3.3V_WOL
3.3K
R5212
1.5K
1/16W
EPHY_ACTIVITY
ET_RXER
R5219
10K
1/16W
1%
C5212
0.1uF
OPT
5%
33
R522033
OPT
R5221
WOL/ETH_POWER_ON
EPHY_MDIO
EPHY_MDC
/RST_PHY
EDID_WP
(from SOC)
(PHY reset from MICOM)
WOL POWER ENABLE CONTROL
+3.5V_ST
WOL_CTL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R4316
3.3K
B
R4317
22K
R4318
2.2K
C
Q4300
MMBT3904(NXP)
E
C4325
4.7uF
10V
Q4301
PMV48XP
S
+3.5V_WOL
D
G
EPHY_REFCLK
BSD-NC4_H052-HD
2012-09-12
ETHERNET
Page 37
R5602
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP4_MT5369
AUDIO[ST]
SPK_L+
SPK_L-
SPK_R+
SPK_R-
WAFER-ANGLE
4
3
2
1
P5600
2011.11.21
58
Page 38
WOOFER
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPK_WOOFER_R-
SPK_WOOFER_R+
P5700
FW25003_03
1
2
3
DEV_WOOFER_STEREO
GP4_MT5369
AUDIO[ST]
2011.11.21
58
Page 39
AUD_OUT >> EU/CHINA_HOTEL_OPT
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
DTV/MNT_L_OUT
1uF
25V
EU
C6000
OPT
C6002
6800pF
EU
R60002.2K
R6002
OPT
470K
SCART_AMP_L_FB
SCART_Lout
33pF
+12V
EU
IC6000
AZ4580MTR-E1
EU
VCC
8
OUT2
7
IN2-
6
IN2+
5
OUT1
1
EU
R600433K
C6003
EU
IN1-
IN1+
VEE
2
3
4
L6000
C6004
0.1uF
50V
EU
SIGN600002
R6008 33K
C6005
EU
EU
33pF
SCART_AMP_R_FB
SCART_Rout
OPT
R6010
470K
R6011
OPT
C6007
6800pF
2.2K
EU
C6008
1uF
25V
EU
DTV/MNT_R_OUT
[SCART AUDIO MUTE]
DTV/MNT_L_OUT
Q6000
MMBT3904(NXP)
DTV/MNT_R_OUT
Q6001
MMBT3904(NXP)
C
E
C
E
EU
R6013
1K
B
EU
EU
R6014
1K
B
EU
EU_SCART_MUTE_ISAHAYA
Q6002
RT1P141C-T112
E
C
B
SCART_MUTE
PDTA114ET
Q6002-*1
E
C
B
EU_SCART_MUTE_NXP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SCART AUDIO AMP
2011.11.21
60
Page 40
EARPHONE AMP
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HP_OUT_H13
C6104-*1
18pF
IC6100
TPA6138A2
HP_OUT_H13
C6109-*1
18pF
HP_ROUT_MAIN
HP_OUT_H13
R6103-*1
43K
1%
C6100
1uF
10V
HP_OUT
HP_ROUT_AMP
SIDE_HP_MUTE
HP_OUT
R6100
10K
C6104
180pF
R6103
33K
HP_OUT_MTK
HP_OUT_MTK
HP_OUT
R6106
43K
+3.3V_NORMAL
4.7K
R6105
HP_OUT
+INR
1
C6108
10pF
50V
C6102
1uF
10V
-INR
OUTR
GND_1
MUTE
VSS
2
3
4
5
6
CN
7
C6103
1uF
HP_OUT
HP_OUT
1%
HP_OUT
10V
+INL
14
-INL
13
12
11
10
HP_OUT
OUTL
UVP
GND_2
VDD
9
CP
8
C6106
10pF
50V
HP_OUT_MTK
HP_OUT
R6104
43K
1%
+3.3V_NORMAL
HP_OUT
R6102
HP_OUT_MTK
L6100
120-ohm
HP_OUT
BLM18P G12 1SN1D
C6105
1uF
10V
C6109
180pF
33K
HP_OUT
C6107
0.1uF
16V
HP_OUT
R6101
10K
C6101
1uF
10V
HP_OUT
HP_LOUT_AMP
HP_LOUT_MAIN
HP_OUT_H13
R6102-*1
43K
1%
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HEADPHONE AMP
2011.09.29
61
Page 41
CI POWER ENABLE CONTROL
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+5V_NORMAL
PCM_5V_CTL
R6218
10K
CI
CI
R6217
100
IN
EN
IC6200
AP2151WG-7
5
4
+5V_CI_ON
OUT
1
CI
GND
2
FLG
3
C6210
1uF
25V
CI
R6219
10K
CI
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CI SLOT
2011.10.31
62
Page 42
B-CAS (SMART CARD) INTERFACE
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SMARTCARD_PWR_SEL/SD_EMMC_DATA[1]
JAPAN
R6300 22
+3.3V_NORMAL
2.7K
R6301
R6303
JAPAN
OPT
R6302
R6304
OPT
2.7K
JAPAN
R6305
R6306
CLKDIV1 CLKDIV2 : F_CRD_CLK
2.7K
---------------------------- 1 0 CLKIN
JAPAN
+5V_NORMAL
OPT
BLM18PG121SN1D
JAPAN
C6300
0.1uF
16V
JAPAN
L6300
SIGN630028
JAPAN
C6301
10uF
10V
C6302
0.1uF
INT CMDVCC : STATUS
+3.3V_NORMAL
IC6300
TDA8024TT
CLKDIV1
1
CLKDIV2
2
5V/3V
3
PGND
4
S2
5
VDDP
PRES
PRES
AUX2
AUX1
CGND
6
S1
7
VUP
I/O
JAPAN
8
9
10
11
12
13
14
JAPAN
C6303
0.1uF
16V
JAPAN
16V
AUX2UC
28
AUX1UC
27
I/OUC
26
XTAL2
25
XTAL1
24
OFF
23
GND
22
VDD
21
RSTIN
20
CMDVCC
19
PORADJ
18
VCC
17
RST
16
CLK
15
C6304
0.1uF
JAPAN
16V
JAPAN
R6307 22
JAPAN
R6308 22
JAPAN
R6309 22
JAPAN
R6310 22
JAPAN
R6311 22
Place CLK C3 far from C2,C7,C4 and C8
75 ohm in I/O is for short circuit Protection
OPT
JAPAN
R6317
1.2K
L6301
JAPAN
BLM18PG121SN1D
JAPAN
C6305
0.1uF
16V
JAPAN
JAPAN
R6315
R6318
1.2K
JAPAN
C6306
0.1uF
16V
+3.3V_NORMAL
10K
R6312
1.2K
JAPAN
R6313
75
OPT
R6319
1.2K
JAPAN
R6316
1.2K
+3.3V_NORMAL
JAPAN
C6307
0.33uF
16V
JAPAN
R6314
1K
ZD6300
5V
JAPAN
SMARTCARD_DATA/SD_EMMC_CLK
SMARTCARD_CLK/SD_EMMC_DATA[0]
SMARTCARD_DET/SD_EMMC_DATA[3]
SMARTCARD_RST/SD_EMMC_DATA[2]
B-CAS SLOT
P6300
10057542-1311FLF(B CAS Slot)
VCC
C1
RST
C2
CLK
C3
RESERVED_1
JAPAN
RESERVED
ZD6301
5V
C4
GND
C5
JAPAN
VPP
C6
I/O
C7
C8
SW1
S1
SW2
S2
-------------------------------- HIGH HIGH CARD PRESENT
LOW HIGH CARD not PRESENT
SMARTCARD_VCC/SD_EMMC_CMD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CI SLOT
2011.04.17
62
Page 43
Global F/E Option Name
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. TU
2. Tuner Name = TDS’S’,TDS’Q’...
3. Country Name = T,T2,S2,KR,US,BR ...
Example of Option name
TU_Q_T2 = apply TDSQ type tuner and T2 country
TU_M/W = apply TDSM&TDSW Type Tuner
13’ Tuner Type for Global
TDS’S’-G501D : T/C Half NIM Horizontal Type
TDS’Q’-G501D : T/C/S2 Combo Horizontal type
TDS’Q’-G601D : T2/C/S2 Combo Horizontal Type
TDS’Q’-G651D : T2/C/S2 Combo Vertical Type
TDS’M’-C601D : China NIM with Isolater Type
TDS’W’-J551F : Japan Dual NIM
TDS’W’-B651F : Brazil 2Tuner
TDS’W’-A651F : Taiwan 2Tuner
TDS’W’-K651F : Colombia DVB-T2 2Tuner
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER
2012.07.10
65
Page 44
B1
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
B1
TU_GND_B
GND seperation for CHINA tuner
TU_GND_B
TU_M_CN
1000pF
R6700
0
NON_CHINA
/TU_RESET2
R6701
0
NON_CHINA
NON_CHINA
C6707
630V
TU_S_US
TU_GND_A
R6703
R6702
0
0
NON_CHINA
12
TU_M/W
C6700
0.1uF
SHIELD
TU_M_CN
C6706
1000pF
630V
TU6700
TDSS-H651F(B)
NC
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBS
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
A1
A1
R6704
100
TU_M/W
TU_PIN2
I2C_SCL6_TU
I2C_SDA6_TU
+3.3V_TU
TUNER_SIF_TU
TU_+1.8V_TU
RF_SWITCH_CTL_50
TU_PIN2
I2C_SCL6_TU
I2C_SDA6_TU
+3.3V_TU
TUNER_SIF_TU
TU_+1.8V_TU
RF_S/W_CTL
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
TU_GND_B
TU6705
TDSN-G351D
TU_T2/C
NC_1
RESET
SCL
SDA
TU6701
TDSM-C651D(B)
+B1[3.3V]
SIF
+B2[1.8V]
TU_M_CN
50
51
52
53
54
55
56
B1
B1
59
B2
B2
A2
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
A1
A2
CVBS
NC_1
NC_2
NC_3
+B3[3.3V]
+B4[1.23V]
DEMOD_RESET
GND
NC_4
SYNC
VALID
MCLK
D0
D1
D2
D3
D4
D5
D6
D7
A1
B1
CVBS
NC_2
NC_3
NC_4
+B3[3.3V]
+B4[1.23V]
NC_5
GND
ERROR
SYNC
VALID
MCLK
D0
D1
D2
D3
D4
D5
D6
D7
B1
28
SHIELD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
A1
A1
SHIELD
TU_GND_A
TU_GND_B
B1
TU_Korea_PIP
B1
TU6702
TDSQ-H651F(B)
+B1[+3.3V_S/P]
1
RESET
2
TU_SCL
3
TU_SDA
4
+B2[3.3V_M]
5
S_SIF
6
+B3[1.8V_M]
7
S_CVBS
8
M_IF_AGC
9
M_DIF[P]
10
M_DIF[N]
11
+B4[3.3V_S]
12
+B5[1.8V_S]
13
NC_1
14
GND
15
SD_ERROR
16
SD_SYNC
17
SD_VALID
18
SD_MCLK
19
SD_SERIAL_D0
20
NC_2
21
NC_3
22
NC_4
23
NC_5
24
NC_6
25
NC_7
26
NC_8
27
GND_1
28
GND_2
29
+B6[1.23V_SD]
30
SD_RESET
31
+B7[3.3V_SD]
32
NC_9
33
SD_SCL
34
SD_SDA
35
A1
A1
TU_Q_T2/S2
36
B1
SHIELD
B1
TU_GND_B
TU_PIN2
I2C_SCL6_TU
I2C_SDA6_TU
+3.3V_TU
TUNER_SIF_TU
TU_+1.8V_TU
FE_LNA_Ctrl1
FE_LNA_Ctrl2
TU_GND_B
RF_SWITCH_CTL_50
50
51
52
TU6702-*1
TDSQ-A651D(B)
+B1[+3.3V_S/P]
1
RESET
2
TU_SCL
3
TU_SDA
4
+B2[3.3V_M]
5
S_SIF
6
+B3[1.8V_M]
7
S_CVBS
8
M_IF_AGC
9
M_DIF[P]
10
M_DIF[N]
11
+B4[3.3V_S]
12
+B5[1.8V_S]
13
NC_1
14
GND
15
SD_ERROR
16
SD_SYNC
17
SD_VALID
18
SD_MCLK
19
SD_SERIAL_D0
20
NC_2
21
NC_3
22
NC_4
23
NC_5
24
NC_6
25
NC_7
26
NC_8
27
GND_1
28
GND_2
29
+B6[1.23V_SD]
30
SD_RESET
31
+B7[3.3V_SD]
32
NC_9
33
SD_SCL
34
SD_SDA
35
A1A1B1
TU6704-*1
TDSW-B652F(B)
TU_BR
TU_TW
+B1(3.3V)_S/P
1
T_RESET
2
TU_SCL
3
TU_SDA
4
+B2[3.3V_M]
5
S_SIF
6
+B3[1.8V_M]
7
S_CVBS
8
M_IF_AGC
9
M_DIF[P]
10
M_DIF[N]
11
+B4[3.3V_S]
12
+B5[1.8V_S]
13
GND_1
28
GND_2
29
+B6[1.23V_D]
30
D_RESET
31
+B7[3.3V_D]
32
NC_1
33
D_SCL
34
D_SDA
35
GND_3
38
GND_4
39
MD_ERROR
40
RF_S/W_CTRL
RF_S/W_CTRL
MD_SYNC
50
50
41
NC_2
NC_7
MD_VALID
51
51
42
MD_MCLK
43
MD_DATA
44
SD_ERROR
45
SD_SYNC
46
SD_VALID
47
SD_MCLK
48
SD_DATA
49
A1A1B1
B1
B1
59
SHIELD
TU6704-*4
TDSN-T751F
TU_TW_SINGLE
TU_AJJA
RF_S/W_CTL
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBS
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
NC_1
12
NC_2
13
NC_3
14
GND
15
NC_4
16
NC_5
17
NC_6
18
NC_7
19
NC_8
20
NC_9
21
NC_10
22
NC_11
23
NC_12
24
NC_13
25
LNA_CTRL1
NC_14
57
26
LNA_CTRL2
NC_15
58
27
A1B1
A1
B1
59
SHIELD
B1
36
SHIELD
TU6704-*3
TU6404-*2
TDSW-K651F(B)
TDSW-A652F(B)
TU_CO
+B1(3.3V)_S/P
+B1(3.3V)_S/P
1
1
T_RESET
T_RESET
2
2
TU_SCL
TU_SCL
3
3
TU_SDA
TU_SDA
4
4
+B2[3.3V_M]
+B2[3.3V_M]
5
5
S_SIF
S_SIF
6
6
+B3[1.8V_M]
+B3[1.8V_M]
7
7
S_CVBS
S_CVBS
8
8
M_IF_AGC
M_IF_AGC
9
9
M_DIF[P]
M_DIF[P]
10
10
M_DIF[N]
M_DIF[N]
11
11
+B4[3.3V_S]
+B4[3.3V_S]
12
12
+B5[1.8V_S]
+B5[1.8V_S]
13
13
GND_1
GND_1
28
28
GND_2
GND_2
29
29
+B6[1.23V_D]
+B6[1.23V_D]
30
30
D_RESET
D_RESET
31
31
+B7[3.3V_D]
+B7[3.3V_D]
32
32
NC_1
NC_1
33
33
D_SCL
SD_SCL
34
34
D_SDA
SD_SDA
35
35
GND_3
GND_3
38
38
GND_4
GND_4
39
39
MD_ERROR
NC_2
40
40
RF_S/W_CTRL
MD_SYNC
NC_3
50
41
41
NC_2
MD_VALID
NC_4
51
42
42
MD_MCLK
NC_5
43
43
MD_DATA
NC_6
44
44
SD_ERROR
SD_ERROR
45
45
SD_SYNC
SD_SYNC
46
46
SD_VALID
SD_VALID
47
47
SD_MCLK
SD_MCLK
48
48
SD_DATA
SD_DATA
49
49
A1A1B1
A1A1B1
B1
59
59
SHIELD
SHIELD
53
54
55
56
57
58
TU6703
TDSQ-G651D(B)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
A1
38
+B4[3.3V]
TU_W_JP
2.2K
R6705
TU_W_JP
2.2K
R6706
N.C_1
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
GND
ERROR
SYNC
VALID
MCLK
D0
D1
D2
D3
D4
D5
D6
D7
GND_2
GND_3
+B3[1.23V]
DEMOD_RESET
F22_OUTPUT
DEMOD_SCL
DEMOD_SDA
LNB
GND_4
SHIELD
A1
+3.3V_S_TUNER
TU_W_JP
C6701
0.1uF
16V
TU_W_JP
C6702
0.1uF
16V
NC_7
RESET_T2
SCL_S
SDA_S
NC_8
NC_9
LNA_CTR1
LNA_CTR2
TU_GND_B
TU6704
TDSW-J551F(B)
TU_W_JP
TU_Q_T2/S2
R6707 0
50
51
52
53
54
55
56
57
58
B1
B1
59
+5V_OR_+3.3V_SPLITTER
1
RESET_T1
2
SCL_T
3
SDA_T
4
+3.3V_T1
5
NC_1
6
+1.8V_T1
7
NC_2
8
NC_3
9
NC_4
10
NC_5
11
+3.3V_T2
12
+1.8V_T2
13
GND_2
28
GND_3
29
+B5[1.23V]
30
D_RESET
31
+B6[3.3V]
32
NC_6
33
D_SCL
34
D_SDA
35
LNB
36
GND_4
37
GND_5
38
GND_6
39
TS1_ERROR
40
TS1_SYNC
41
TS1_VALID
42
TS1_MCLK
43
TS1_DATA
44
TS2_ERROR
45
TS2_SYNC
46
TS2_VALID
47
TS2_MCLK
48
TS2_DATA
49
A1
A1
+3.3V_D_Demod2
TU_W_JP
TU_QW
C6708
0.1uF
SHIELD
+3.3V_D_Demod
TU_GND_A
TU_MNQW
C6703
0.1uF
C6705
10uF
10V
0
R6708
TU_MNQW
RF_SWITCH_CTL_TU
/TU_RESET1_TU
I2C_SCL6_TU
I2C_SDA6_TU
+3.3V_TU
TUNER_SIF_TU
TU_+1.8V_TU
TU_CVBS_TU
IF_AGC_TU
IF_P
IF_N
+3.3V_D_Demod
Power_D_Demod_TU
CN_RESET_TU
FE_DEMOD1_TS_ERROR
FE_DEMOD1_TS_SYNC
FE_DEMOD1_TS_VAL
FE_DEMOD1_TS_CLK
FE_DEMOD1_TS_DATA[0]
FE_DEMOD1_TS_DATA[1]
FE_DEMOD1_TS_DATA[2]
FE_DEMOD1_TS_DATA[3]
FE_DEMOD1_TS_DATA[4]
FE_DEMOD1_TS_DATA[5]
FE_DEMOD1_TS_DATA[6]
FE_DEMOD1_TS_DATA[7]
+1.23V_D_Demod_TU
/S2_RESET_TU
+3.3V_D_Demod2
LNB_TX
I2C_SCL4_TU
I2C_SDA4_TU
LNB_OUT
FE_DEMOD2_TS_ERROR
FE_DEMOD2_TS_SYNC
FE_DEMOD2_TS_VAL
FE_DEMOD2_TS_CLK
FE_DEMOD2_TS_DATA
FE_DEMOD3_TS_ERROR
FE_DEMOD3_TS_SYNC
FE_DEMOD3_TS_VAL
FE_DEMOD3_TS_CLK
FE_DEMOD3_TS_DATA
TU_QW
L6701
BLM18PG121SN1D
TU_QW
C6709
10uF
10V
TU_MNQW
L6700
BLM18PG121SN1D
C6704
10uF
10V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16
17
18
19
20
21
22
23
24
25
26
27
30
31
32
33
34
35
36
40
41
42
43
44
45
46
47
48
49
+3.3V_TU
+3.3V_TU
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TU_SYMBOL
BSD-NC4_H067-HD
2012.09.14
Page 45
DVB-S2 LNB Part Allegro
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LNB_OUT
(Option:LNB)
C6900
18pF
LNB
Close to Tuner
Surge protectioin
C6901
33pF
LNB
D6900
LNB
R6900
2.2K
1W
LNB
D6901
MBR230LSFT1G
C6902
0.22uF
LNB
25V
A_GND
30V
LNB
2A
D6902
LNB
30V
C6903
0.01uF
50V
LNB
C6905
10uF
25V
LNB
close to Boost pin(#1)
C6904
0.1uF
50V
LNB
A_GND
C6906
10uF
25V
D6903
LNB_SMAB34
40V
D6903-*1
LNB_SX34
40V
LNB
A_GND
C6907
10uF
25V
LNB
LNB_SMAB34
LNB
C6908 0.1uF
D6904-*1
40V
LNB_SX34
D6904
40V
VCP
LNB
NC_1
TDI
TDO
A_GND
NC_2
NC_3
BOOST
[EP]GND
18
19
20
1
THERMAL
2
21
3
IC6900
A8303SESTR-T
4
LNB
5
7
8
6
SCL9ADD
SDA
IRQ
GNDLX
3.5A
15uH
SP-7850_15
16LX17
15
14
13
12
11
10
TONECTRL
L6900
VIN
GND
VREG
ISET
TCAP
+12V
LNB
3A
Max 1.3A
C6909
10uF
25V
LNB
A_GND
close to VIN pin(#15)
C6910
0.1uF
50V
LNB
C6912
LNB
0.1uF
LNB
C69110.22uF
Input trace widths should be sized to conduct at least 3A
Ouput trace widths should be sized to conduct at least 2A
LNB
R6903
39K
1/16W
1%
Caution!! need isolated GND
A_GND
R6904
0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LNB
R6901 33
I2C_SCL4
LNB
R6902 33
I2C_SDA4
LNB_TX
LNB
2012.03.08
69
Page 46
LVDS
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[51Pin LVDS OUTPUT Connector]
LVDS
P7201
FI-RE51S-HF-J-R1500
OLED
OLED
UD_CPBOX
UD_CPBOX
UD_OLED
R7210 33
R7209 0
R7208 0
R7200 0
R7201 0
R7204
OLED
R7213
ALEF
0
0
52
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
GND
NC
NC
NC
NC
NC
NC
LVDS_SEL
NC
NC
L/DIM_ENABLE
GND
RA0N
RA0P
RA1N
RA1P
RA2N
RA2P
GND
RACLKN
RACLKP
GND
RA3N
RA3P
RA4N
RA4P
GND
BIT_SEL
RB0N
RB0P
RB1N
RB1P
RB2N
RB2P
GND
RBCLKN
RBCLKP
GND
RB3N
RB3P
RB4N
RB4P
GND
GND
GND
GND
GND
NC
VLCD
VLCD
VLCD
VLCD
FRC_RESET
I2C_SCL1
I2C_SDA1
I2C_SDA1
I2C_SCL1
INV_CTL
BPL_IN
TXA0N/TX11N
TXA0P/TX11P
TXA1N/TX10N
TXA1P/TX10P
TXA2N/TX9N
TXA2P/TX9P
TXACLKN/TX8N
TXACLKP/TX8P
TXA3N/TX7N
TXA3P/TX7P
TXA4N/TX6N
TXA4P/TX6P
TXB0N/TX5N
TXB0P/TX5P
TXB1N/TX4N
TXB1P/TX4P
TXB2N/TX3N
TXB2P/TX3P
TXBCLKN/TX2N
TXBCLKP/TX2P
TXB3N/TX1N
TXB3P/TX1P
TXB4N/TX0N
TXB4P/TX0P
T_CON_SYS_POWER_OFF
T_CON_SYS_POWER_OFF
OLED : FRC_RESET = LVDS_VAL
INV_CTL = ELVDD_ON
UD
R7217
0
FRC_FLASH_WP
10K
OLED
R7215
BIT_SEL
R7214
10K
LVDS_BIT_SEL_LOW
PANEL_VCC
L7201
120-ohm
LVDS
C7201
10uF
16V
OPT
R7216
0
OLED
LED_R
C7203
0.1uF
16V
LVDS
[41Pin LVDS OUTPUT Connector]
P7202
FI-RE41S-HF-J-R1500
LVDS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
TXC0N
TXC0P
TXC1N
TXC1P
TXC2N
TXC2P
TXCCLKN
TXCCLKP
TXC3N
TXC3P
TXC4N
TXC4P
TXA1N
TXA1P
TXACLKN
TXACLKP
TXA4N
TXA4P
TXB0N
TXB0P
TXB1N
TXB1P
TXB2N
TXB2P
TXD0N/TX17N
TXD0P/TX17P
TXD1N/TX16N
TXD1P/TX16P
TXD2N/TX15N
TXD2P/TX15P
TXDCLKN/TX14N
TXDCLKP/TX14P
TXD3N/TX13N
TXD3P/TX13P
TXD4N/TX12N
TXD4P/TX12P
H13 BALL NAME
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-NC4_H072-HD
2012-10-15
LVDS INTERFACE
Page 47
LOCAL DIMMING 1
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[To LED DRIVER]
P7400
12507WR-08L
L/DIM_OUT
1
2
3
4
5
6
7
8
9
+3.3V_NORMAL
R7400
10K
OPT
R7401
10K
L/DIM_OUT_PULL_DOWN
L/DIM_OUT_I2C
L/DIM_OUT_I2C
0
0
R7408
R7407
OPT
R7411 33
R7412 33
OPT
R7403
4.7K
L/DIM0_SCLK
L/DIM0_MOSI
I2C_SCL2
I2C_SDA2
L/DIM0_VS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LOCAL DIMMING
BSD-NC4_H074-HD
2012.09.14
Page 48
EPI_LOCK6_SOURCE
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
T-Con
2011.12.01
77
Page 49
locate different direction for each
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C7923
C7926
10uF
10uF
25V
25V
VDD_EPI
C7924
10uF
25V
locate different direction for each
C7928
10uF
25V
C7930
10uF
25V
VDD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-NC4_H079-HD
2012.09.14
EPI_CAP
Page 50
eMMC I/F
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
eMMC
11.09.29
81
Page 51
Page 52
LCD TV Repair Guide
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
`13 years New Models
< Applicable Model >
XXLA8600-UC
XXLA7900-UA
Page 53
Overview for ’13 Broadband Model
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
(Hardware)
Page 54
Model naming and Tool option
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Standard of 2013Y Model Name
Description of Tool Options
Model name
Tool Option
Page 55
New features - EPI Interface
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
EPI(Embedded Point-Point Interface)
TCON
Features
•Point-Point topology (support 2 Pair option)
•CDR (Clock Data Recovery)
•Bandwidth up to 1.85Gbps/pair
at FHD 120Hz 10 bit application
•Lock signal cascading and feedback to T-Con
•Embedded Control Data
Merits
•Better reliability on common noise
•No data skew and better EMI margin
•Fewer lines than mini-LVDS
•Slim PCB design
VCC
LOCK
2
1
Figure1. Topology
Page 56
New features -EPI Interface (mini-LVDS vs. EPI)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Comparison
HF mini-LVDS
HF mini-
LVDS
No. of Signal363672
Connector
60Hz120Hz240Hz
60pin
(2ea)
-Difficult to upgrade bandwidth limit
-Multiple number of wires needed for higher bandwidth
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HF mini-LVDSEPI
Topology
Protocol
Features
@10bit, FHD120
Merit
TCON
• Multi Drop
• Data rate: 660Mbps
• External clock
• Simple structure
• Standardization
TCON
Lock
2
1
• Point to Point
• Data rate : 1.8Gbps
• Embedded clock, Control
• Fewer Lines : 12
• Embedded clock
: low EMI, Clock skew free
Demerit
• Too many lines : 36
• Clock skew
• EMI due to clock lines
• Bandwidth limit
• Easy to PCB design
• Transmission Overhead
: 4bit delimiter
Page 58
New features -LINE OUT
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Line out is used when you want to send the TV audio signal to an external device. It works like headphone.
The signal out or line out remains at a constant level, regardless of the current setting of the volume control.
What is the difference between headphones and line out headphone adjusts the volume on the television whereas, line out adjust
the volume on the external devices such as amp or receiver.
Line-out is a two-channel stereo output and you need a cable to connect an external speaker.
H13 provides headphone and external speaker output through an output phone jack.
To set the line out, you choose Sound Option Setting in setting menu - sound and change Headphone to External
Speaker (Audio Out) in Analogue out, then choose External Speaker (Audio Out) in sound out.
Headphone
External Speaker
2CH stereo
Page 59
Main PCB for Broadband
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LA86/79
Local Dimming
(only for PSU model)
To PSU/LPB
Main
Camera assy
1
Wifi +
Motion assy(B/T)
Front Spk
Local Key + IR
+ LOGO
1
3
2
5
2
3
4
4
Main processor_Digital(LG1154D)
DDR Memory
eMMC Memory
Main processor_analog(LG1154A)
Micom for Key/IR sensing
Audio AMP (10W)
HDMI switch (4:1)
5
Page 60
1. H13 Block Diagram (External)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
DIF(P/N)
Tuner
CVBS
SIF
AUD
M-Remote_Rx/Tx
Motion-R
SCART
AV1
COMP1
HDMI1~4
Logo Light
USB_W-iFi
USB1(USB3.0)
USB2(USB2.0)
USB3(USB2.0)
USB_CAM
LAN
LNB
LNB
SC_CVBS, RGB, Audio L/R
DTV/MNT_LR/V_OUT
AV1_Audio L/R
Comp1 Y,Pb,Pr
HDMI_CEC
WOL / WOW
AV1_CVBS
HDMI
HDMI
Switch
Switch
PHY
USB
USB
HUB
HUB
H13
LG1154AN
USB 2.0
USB 3.0
USB 2.0
USB 2.0
RMII
BB_TP_DATA
CVBS
DAC_DATA
AAD_DATA
HSR_P/M
SPDIF
IRB_SPI
H13
LG1154D
FRC
TCON
16
16
8
H/P Audio L/R
I2S
Vx1 / EPI / LVDS Combo
IR_B
IR_B
Micom
Micom
H/P AMP
H/P AMP
Audio
Audio
AMP
AMP
CI
Vx1 : 6 lane
EPI : 16 lane
LVDS : Quad
OPTIC
IR_Blaster
H/P
SPK
CI
DDR316DDR3
4Gb×4 (1600)
DDR316DDR3
eMMC
Page 61
2. H13 Block Diagram (Internal)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Tuner
HDMI
Analog Chip Total Pin : 183w/o Power
H13AH13D
DIF
SIF
Audio L/R(4-ch)
SCART out
Line Out
CVBS(3ch)
CVBS-Out
Component(2ch)
GBB AFE
1ch@30MHz
w/ PLL
BTSC AFE
10b@18.432MHz
w/ PLL
1ch L/R
Audio-ADC
SW
24b@48KHz
Audio DAC
SW
(48KHz )
Audio DAC (48KHz)
CVBS DAC
SW
CVBS AFE(2-ch)
12b@54MHz
3ch Video
AFE
SW
10b@148.5MHz
w/ LLPLL
I2Cx1
I2Cx1
GPIOIx16
V/Q, DVB-T/C ISDB-T
10x3ch
Capture
Block
(3CH)
SDRAM
(MCP)
Global Baseband
Mux
LVDS
Audio PLL
w/ DCO
AtoDPin : 79
I2S
I2S
I2S
SPDIF
5x1ch (1ch)
Tx
TS (P)
I2S(External)
I2S(HPD)
Digital AMP
DVB-CI/CI+
TS(P)TS(P)
AAD
(THAT)
Audio
Mux
Digital
Audio
Output
CVBS
Encoder
CVD
Y/C
CVBS
LVDS
Rx
HDMI
(1-Link)
HDMI-Rx 1.4
(1-port PHY)
3D, ARC, 4kx2k
TS(S)
System
Demux
Audio DSP
Multi-STD
Audio Decoder
LX4 HiFi EP
Sound DSP
Clear Voice II
Perceptual
Volume Control
Slim SPK
DivX
Bluetooth
Mux
Source Mux
16
TS(S)
DE
MCU
TNR
De-interlacer
Main/Sub Scaler
DDR3 Controller
DDR3 PHY
16
Video Decoder
Multi-STD
HD Decoder
(Boda950)
Video Encoder
1080p@30fps
CPU
CPU
ARMCA9 Core
Dual 1.2GHz
32KBI$
32KBD$
1MB L2 $
H3D
H3D
FRC
SRE
VCR
Digital Chip Total Pin : 491w/o Power
USB2.0x3
UARTx3
GPIOx136
EMAC
SCI
SPIx2
I2Cx10
USB3.0 x1
eMMC
DMAC(8ch)
Timer
WDT
SRAM 16KB
(120Hz)
Vx1/EPI/LVDS Combo
DCO
CPLL
x2
SPLL
DPLL
DDR
DDR
PLL
PLL
BE
MCU
PE1
LED
OSD
DDR3 Controller
DDR3 PHY
16
GPU Rogue Han
2D GFX
JPG/PNG Decoder
JPG Encoder
TrustZone
Secure Engine
48KB ROM
64KB SRAM
OTP
UART
Timer
TCON
Output formatter
16
PHY
Page 62
3. Data Path Diagram
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 63
4. Tuner (한국)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Vertical/Horizontal bar, residual image, light
spot, external device color error
No power42
Off when on, off while viewing, power auto
on/off
No audio/Normal video 44
Remote control & Soft Touch Key checking46
41
43
11
D. Function error
12Wi-Fi operating checking48
13External device recognition error 49
14E. NoiseCircuit noise, mechanical noise50
15F. Exterior errorExterior defect51
First of all, Check whether there is SVC Bulletin in GCSC System for these model.
Qwerty Remote Motion operating checking47
33
Page 93
Standard Repair Process
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Established
date
Revised date
LCD TV
Error
symptom
A. Video error
No video/ Normal audio
First of all, Check whether all of cables between board is inserted properly or not.
(Main B/D↔ Power B/D, LVDS Cable,Speaker Cable,IR B/D Cable,,,)
☞A4☞A1
No video
Normal audio
Normal
audio
Move to No
video/No audio
Y
N
Check Back Light
On with naked eye
☞A2
Check Power Board 24V output
On
Normal
voltage
Repair Power
Board or parts
Y
Check Power Board
24V, 12V,3.5V etc.
N
Replace module
Y
N
Normal
voltage
N
Repair Power Board
or parts
End
2012.01.16
2013.01.30
Y
Replace T-con Board
or module
And Adjust VCOM
※Precaution
Always check & record S/W Version and White
Balance value before replacing the Main Board
☞A7 & A3
Replace Main Board
37
Re-enter White Balance value
Page 94
Standard Repair Process
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LCD TV
symptom
No Video/
No audio
Error
☞A4
Check various voltages
of Power Board
( 3.5V,12V,20V or
24V…)
A. Video error
No video/ No audio
Normal
voltage?
N
Replace Power
Board and repair
parts
Y
Check and
replace
MAIN B/D
Established
date
Revised date
End
2012.01.16
2013.01.30
38
Page 95
Standard Repair Process
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LCD TV
☞ A6
Check RF Signal level
Normal
Signal?
N
Check RF Cable
Connection
1. Reconnection
2. Install Booster
Y
Error
symptom
A. Video error
Picture broken/ Freezing
. By using Digital signal level meter
. By using Diagnostics menu on OSD
( Setting→ Set up→ Manual Tuning → Check the Signal )
- Signal strength (Normal : over 50%)
- Signal Quality (Normal: over 50%)
Check whether other equipments have problem or not.
(By connecting RF Cable at other equipment)
→ DVD Player ,Set-Top-Box, Different maker TV etc`
☞ A7
Normal
Picture?
N
Y
Check
S/W Version
SVC
Bulletin?
Y
Established
date
Revised date
N
2012.01.16
Check
Tuner soldering
N
2013.01.30
Y
Close
Normal
Picture?
Y
Close
N
Contact with signal distributor
or broadcaster (Cable or Air)
39
S/W Upgrade
Normal
Picture?
Y
Close
N
Replace
Main B/D
Page 96
Standard Repair Process
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LCD TV
☞A9
Check color by input
-External Input
-COMPONENT
-HDMI/DVI
☞A12
Check Test pattern
Error
symptom
Color
error?
N
Check error
color input mode
External Input/
A. Video error
☞ A10
※ Check and
replace Link
Y
Cable
(LVDS) and
contact
condition
Component
error
Color error
Color
error?
N
Check
external
device and
cable
Y
Replace Main B/D
Established
date
Revised date
External device
/Cable
normal
N
Color
error?
End
Y
2012.01.16
2013.01.30
Y
Replace module
N
Replace Main B/D
RGB/
HDMI/DVI
error
Check external
device and
cable
40
Request repair
for external
device/cable
N
External device
/Cable
normal
Y
Replace Main B/D
Page 97
Standard Repair Process
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
A. Video error
LCD TV
Error
symptom
Vertical / Horizontal bar, residual i mag e ,
light spot, external device color err or
Vertical/Horizontal bar, residual image, light spot
☞A9
Check color condition by input
-External Input
-Component
-HDMI/DVI
☞A12
Check Test pattern
Screen
normal?
N
Replace
module
Check external
Y
device
connection
condition
Normal?
Request repair
for external
device
External device screen error-Color error
Established
date
Revised date
☞ A10
Check and
Y
replace Link
Cable
N
Screen
normal?
End
N
Y
2012.01.16
Replace Main B/D
(adjust VCOM)
2013.01.30
Replace
Module
N
Screen
normal?
Y
End
Check S/W Version
Check
version
Y
S/W Upgrade
Normal
screen?
Y
End
Check screen
condition by input
N
N
-External Input
-Component
-RGB
-HDMI/DVI
External
Input
error
Component
error
RGB
error
HDMI/
DVI
Connect other external
device and cable
(Check normal operation of
External Input, Component,
RGB and HDMI/DVI by
connecting Jig, pattern
Generator ,Set-top Box etc.
Connect other external
device and cable
(Check normal operation of
External Input, Component,
RGB and HDMI/DVI by
connecting Jig, pattern
Generator ,Set-top Box etc.
Screen
normal?
Request repair for
external device
Screen
normal?
N
Y
Y
N
Replace
Main B/D
Replace
Main B/D
41
Page 98
Standard Repair Process
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LCD TV
☞A17
Check
Power LED
. Stand-By: Red or Turn Off
. Operating: Turn Off
Check Power cord
was inserted properly
Error
symptom
Power LED
On?
N
Normal?
Y
Close
Y
N
※
B. Power error
Check ST-BY 3.5V
☞A18
No power
DC Power on
by pressing Power Key
On Remote control
Y
Normal
Y
voltage?
N
Established
date
2012.01.16
Revised date
☞A19
Normal
operation?
N
Check Power
On ‘”High”
Y
Replace Main B/D
☞A4
Measure voltage of each output of Power B/D
Normal
voltage?
Replace Power B/D
Y
N
Replace Main B/D
OK?
2013.01.30
Replace
Y
Power
B/D
N
Replace Power
B/D
42
Page 99
Standard Repair Process
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LCD TV
Check outlet
Check A/C cord
Check for all 3- phase
power out
Error
symptom
Error?
Y
Fix A/C cord & Outlet
and check each 3
phase out
B. Power error
Off when on, off while viewing, power auto on/off
☞A22
N
Check Power Off
Mode
☞A19
(If Power Off mode is
not displayed)
Check Power B/D
voltage
※ Caution
Check and fix exterior
of Power B/D Part
Established
date
Revised date
CPU
Abnormal
Abnormal
1
Normal
voltage?
N
Replace Power B/D
2012.01.16
Replace Main B/D
Y
Replace Main B/D
2013.01.30
Normal?
Replace Power B/D
Y
N
End
* Please refer to the all cases which
can be displayed on power off mode.
StatusPower off ListExplanation
"POWEROFF_REMOTEKEY"Power off by REMOTE CONTROL
"POWEROFF_OFFTIMER"Power off by OFF TIMER
"POWEROFF_SLEEPTIMER"Power off by SLEEP TIMER
"POWEROFF_INSTOP"Power off by INSTOP KEY
"POWEROFF_AUTOOFF"Power off by AUTO OFF
Normal
Abnormal
"POWEROFF_ONTIMER"Power off by ON TIMER
"POWEROFF_RS232C"Power off by RS232C
"POWEROFF_RESREC"Power off by Reservated Record
"POWEROFF_RECEND"Power off by End of Recording
"POWEROFF_SWDOWN"Power off by S/W Download
"POWEROFF_UNKNOWN"Power off by unknown status except listed case
"POWEROFF_ABNORMAL1"Power off by abnormal status except CPU trouble
"POWEROFF_CPUABNORMAL"Power off by CPU Abnormal
43
Page 100
Standard Repair Process
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LCD TV
No audio
Screen normal
Error
symptom
☞A24☞A25
Check user
menu >
Speaker off
C. Audio error
No audio/ Normal video
Check audio B+ 24V
N
Off
Y
Cancel OFF
of Power Board
Established
date
Revised date
Normal
voltage
Replace Power Board and repair parts
Y
N
2012.01.16
2013.01.30
Check Speaker
disconnection
Disconnection
Y
Replace Speaker
44
N
Replace MAIN BoardEnd
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