Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in
the Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to
prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this monitor is blown, replace it
with the specified.
When replacing a high wattage resistor (Oxide Metal Film
Resistor, over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Due to high vacuum and large surface area of picture tube,
extreme care should be used in handling the Picture Tube.
Do not lift the Picture tube by it's Neck.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect
an electrical jumper across the two AC plug prongs. Place the
AC switch in the on position, connect one lead of ohm-meter to
the AC plug prongs tied together and touch other ohm-meter
lead in turn to each exposed metallic parts such as antenna
terminals, phone jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC
voltage measurements for each exposed metallic part. Any
voltage measured must not exceed 0.75 volt RMS which is
corresponds to 0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
NOTE : Specifications and others are subject to change without notice for improvement
.
V Application Range
This spec is applied to PDP TV used PA02B Chassis.
V Specification
Each part is tested as below without special appointment.
(1) Temperature : 25 °C ± 5 °C (77 °F ± 9 °F), CST : 40 ± 5
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage: Standard Input voltage (100 V - 240 V ~, 50 / 60 Hz)
* Standard Voltage of each product is marked by models.
(4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with
SBOM.
(5) The receiver must be operated for about 20 minutes prior to the adjustment.
V Test Method
(1) Performance : LGE TV test method followed.
(2) Demanded other specification
Safety: CE, IEC specification
EMC : CE, IEC
V Module Specification
(1) 50” 3D FHD
50PX950-AAAustralia, New ZealandLG
Model NameMarket PlaceBrand
Model Name
50PX950-AA
Remark
Safety : IEC/ EN60065, EMI : CISPR13
Market
Australia, New Zealand
NoItemSpecificationRemark
1Display Screen Device127 cm (50 inch) wide Color Display ModulePDP
2Aspect Ratio16:9
3PDP ModulePDP50R103##,
This spec sheet is applied to all of the PA02B chassis.
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 100 V ~ 240
V, 50 / 60 Hz.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15 °C
- In case of keeping module is in the circumstance of 0 °C,
it should be placed in the circumstance of above 15 °C
for 2 hours
- In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above
15 °C for 3 hours,.
O After RGB Full White in HEAT-RUN Mode, the receiver
must be operated prior to the adjustment.
O Enter into HEAT-RUN MODE
1) Press the POWER ON KEY on R/C for adjustment.
2) OSD display and screen display PATTERN MODE.
- Set is activated HEAT run without signal generator in this
mode.
- Single color pattern ( WHITE ) of HEAT RUN MODE uses
to check panel.
- Caution : If you turn on a still screen more than 20
minutes (Especially digital pattern, cross hatch pattern),
an after image may be occur in the black level part of the
screen.
3. MAC Address.
* Connect TV SET and PC which download MAC Address
Writing program by RS232C-Cable
(1) Start “MAC+CIKeyl.exe”Program and Click (3) Button to
connect TV and PC.
(2) Click (4) to download MAC Address.
(3) When download succeed, you can see “OK” on (6)
* Each Chassis has it’ own MAC Address. Please be careful of
download.
3-2. Ping TEST
* This test is to check Network operation.
(1) Press "Po w e r on" butt o n of a s e rvice R/C.(Baud rate :
115200 bps)
(2) Connect RS232-C Signal Cable.
(3). Connect LAN cable to MAIN PCB Assembly.
(4) When network operates normally, you can see “OK”.
3-3. ADC Adjustment
O Auto-control adjustment protocol(RS-232C)
Page 7
(1) Adjustment of RGB
1) Convert to PC in Input-source.
2) Signal equipment displays
Output Voltage: 700 mVp-p
Impress Resolution XGA (1920 x 1080 @ 60Hz)
Model : 225 in Pattern Generator
Pattern : 65 in Pattern Generator
(MSPG-925 SERISE)
3) Adjust by commanding AUTO_COLOR_ADJUST
(2) COMPONENT input ADC
V Convert to Component in Input-source.
V Signal equipment displays
Impress Resolution 480i
MODEL: 209 in Pattern Generator(480i Mode)
PATTERN : 65 in Pattern Generator
(MSPG-925 SERISE)
Impress Resolution 1080i
MODEL: 225 in Pattern Generator(1080P Mode)
PATTERN: 65 in Pattern Generator
(MSPG-925 SERISE)
3-4. Insert Tool OPTION
and Model Name download.
(1) Press IN_START key on R/C to insert Tool OPTION
(2) On the “ Tool Option ”, Insert Tool Option by a number key
(3) Press the ENTER(
V)
(4) Press ENTER(
V) again.
(5) Select “OK to Download” by using
F/G(VOL +/-) and press
G(VOL +)
1) 50/60PX950-AA
3-5. EDID(The Extended Display
Identification Data) download
(1) Press the ADJ KEY on R/C and enter EZ ADJUST.
(2) Select “5.EDID D/L” by using
D/E(CH +/-) and press
ENTER(
V).
(3) Select “Start” and press navigation key(
G).
(4) EDID download is executed automatically.
(5) Press EXIT key on R/C
* Caution
- Never connect HDMI & D-sub Cable when the user
download EDID .
(1) Press ‘InStart’ Key on Factory SVC Remote Controller.
And MUST check ADC & EDID ADJ status is OK.
4. SET assembly adjustment method
* Caution : Each PCB assembly must be checked by check JIG
set. (Because power PCB Assembly damages to PDP
Module, especially be careful)
4-1.POWER PCB Assembly Voltage
adjustment (Va/Vs Voltage Adjustment)
Test equipment : D.M.M 1EA
Connection Diagram for Measuring : refer to fig.4
Adjustment method
(1) Va adjustment
1) Connect + terminal of D. M.M. to Va pin of P811,
connect -terminal to GND pin of P811.
2) After turning VR901,voltage of D.M.M adjustment as
same as Va voltage which on label of panel right/top
(deviation; ±0.5V)
(2) Vs adjustment
1) Connect + terminal of D. M..M. to Vs pin of P811,
connect -terminal to GND pin of P811.
2) After turning VR951, voltage of D.M.M adjustment as
same as Vs voltage which on label of panel right/top (
deviation ; ±0.5V)
4-2. Download Serial number (RS-232C)
V Press “Power on” key of service R/C.
(Baud rate : 115200 bps)
V Connect RS232 Signal Cable to RS-232 Jack.
V Write Serial number by use RS-232.
V Must check the serial number at the Diagnostics of SET UP
menu.
(Refer to below ‘6.SET INFORMATION’).
4-3. Adjustment of White Balance
Required Equipment
O Remote controller for adjustment
O Color Analyzer ( CS-1000, CA-100,100+,CA-210 or same
produc: CH 10 (PDP)
* Please adjust CA-210, CA-100+ by CS-1000 before
measuring
O Auto W/B adjustment instrument(only for Auto adjustment)
O 9 Pin D-Sub Jack(RS232C) is connected to the AUTO W/B
EQUIPMENT.
Before Adjust of White Balance, Please press POWER ONLY
key
Adjust Process will start by execute RS232C Command.
O Color temperature standards according to CSM and Module
O CS-1000/CA-100+/CA-210(CH 10) White balance
adjustment coordinates and color temperature.
* Manual W/B process (using adjusts Remote control)
Please Adjust in AV 1 MODE, Turn off Energy Saving Mode.
(1) Enter ‘PICTURE RESET’ on Picture Mode, then turn off
Fresh Contrast and Fresh colour in Advanced Control
(2) After enter Service Mode by pushing “ADJ” key,
(3) Enter White Pattern off of service mode, and change off ->
* Gain Max Value is 192. So, Never make any Gain Value over
192 and please fix one Value on 192, between R, G and B.
* Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Measure and adjust after sticking the Color Analyzer (CA-
100+, CA210 ) to the side of the module.
(3) Aging time
After aging start, keep the Power on (no suspension of
power supply) and heat-run over 5 minutes
4-4. Serial number download & Model
name D/L and Check Tool Option.
(1) Press "Power on" button of a service R/C.(Baud rate :
115200 bps)
(2) Connect RS232-C Signal Cable and start ‘Option Check
Program Ver3.8’
(3) Scan serial Number and press ‘F5’ button.
(4) Check ‘OK’ on program (1) program.
(5) Press ‘In start’ button on SVC R/C, check Serial Number
and Model Name.
4-5. Checking the EYE-Q Operation.
(1) Press the EYE Key on the adjustment remote controller.
(2) Check the Sensor DATA ( It must be under 10) and keep
the data longer than 1.5s
(3) Check ‘OK’
(Sensor DATA 0 ~ 4095, Power Saving Mode 0 ~ 12)
* IF you press IN-STAP Button, change Green Eye-check OSD.
4-6. Ping TEST
* This test is to check Network operation.
(1) Connect LAN cable from Computer to TV Set
(2) When network operates normally, you can see “OK” on
Computer
5. 3D Function Test
(Pattern Generator MSPG-3233, HDMI mode NO. 371 ,
pattern No. 81)
(1) Please input 3D test pattern like below
(2) Enter 3D mode , then select side by side
(If you don’t wear a 3D Glasses, you will see the picture
like below)
(3) Put on the 3D Glasses, And block the right side of Glasses
(LEFT:OPEN[TEST], RIGHT:CLOSED)
And check the middle sides of picture , RED -> normal ,
others -> abnormal
(4) Put on the 3D Glasses, And block the right side of Glasses
(LEFT:CLOSED, RIGHT:OPEN[TEST])
And check the middle sides of picture , BLUE -> normal ,
others -> abnormal
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Boot Strap
22R73
22R72
NAND_DATA[0-7]
NAND_ALE
NAND_CLE
MODEL OPTION
IF_AGC_SEL
BT_ON/OFF
0R75
0R74
NAND_DATA[0]
NAND_DATA[1]NAND_DATA[1]
NAND_DATA[2]
NAND_DATA[3]
NAND_DATA[4]
NAND_DATA[5]
NAND_DATA[6]NAND_DATA[6]
NAND_DATA[7]
MODEL OPTION
PIN NAME
MODEL_OPT_0
MODEL_OPT_1
MODEL_OPT_2
MODEL_OPT_3
MODEL_OPT_4
MODEL_OPT_5
PIN NO.
G19
C5
F7
B6
E18
D18
D3.3V
R46
2.7K
READY
R58
READY
READY
2.7K
R55
2.7K
R56
2.7K
R59
2.7K
R60
2.7K
R57
2.7K
R61
2.7K
R62
2.7K
R63
2.7K
R47
2.7K
READY
R50
2.7K
READY
R48
2.7K
R41
2.7K
READY
R42
2.7K
READY
R43
2.7K
R44
2.7K
READY
R45
2.7K
READY
R49
2.7K
D3.3V
1K
1K
1K
1K
FHD
AUS
R51
R53
READY
1K
AUS
R64
R66
R68
READY
100R37
100R40
1K
1K
1K
EU
READY
R65
R67
R69
READY
1K
1K
HD
READY
R52
R54
LOWHIGH
FRC
BRAZIL&AUS
NO FRC
EURO
NOT USE
FHD
XGA
EURO&AUS
HD
WXGA
BRAZIL
NAND_IO[0] : Flash Select (1)
0 : Boot From Serial Flash
1 : Boot From NAND Flash
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RED_GND
GND_2
RED
GREEN_GND
DDC_DATA
GREEN
BLUE_GND
H_SYNC
BLUE
NC
V_SYNC
GND_1
SYNC_GND
DDC_CLOCK
DDC_GND
+5V_VGA
JP1113
JP1112
C900
0.1uF
16V
+3.3V_MULTI
10K
R911
30V
D909
R942
READY FOR BEAD
bcm REF circuit
R917
1K
READY
C914
0.1uF
16V
READY
30V
D907
30V
5.5V
D908
READY
READY
C913
4.7pF
C912
4.7pF
READY
C915
4.7pF
R916
R915
10
DSUB_R
DSUB_G
DSUB_B
DSUB_VSYNC
10
12pF
C917
DSUB_HSYNC
C916
12pF
5.5V
5.5V
D904
D905
D906
0R943
0
0R944
DSUB_DET
DDC_SCL/UART_RX
DDC_SDA/UART_TX
30V
30V
D918
D917
R903
10
C2-
ROUT1
4
13
D900
READY
C2+
RIN1
R905
3
$0.179
14
100
C908
220pF
50V
READY
D901
ROM DOWNLOAD FOR PDP
READY
C909
0.1uF
50V
0.1uF
C1-
V+
2
15
GND
DOUT1
C905
220pF
50V
READY
R902
10
C901
C906
270pF
220pF
50V
50V
READY
READY
C902
0.1uF
R900
4.7K
R901
4.7K
50V
RIN2
8
9
ROUT2
C907
0.1uF
50V
V-
DOUT2
5
6
7
IC900
MAX3232CDR
12
11
10
DIN1
DIN2
R904
100
RS232CPC AUDIO
+3.3V_ST
RS232C_TXD
RS232C_RXD
PC_SER_DATA
PC_SER_CLK
+3.3V_ST
C910
50V
C1+
1
16
VCC
D902
ADUC30S03010L_AMODIODE
30V
D903
ADUC30S03010L_AMODIODE
30V
C911
0.1uF
50V
M24C02 COMPARE THE COST
IC901
AT24C02BN-10SU-1.8
STM_2K_EEPROM
1
2
3
4
IC901-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
RENESAS_2K_EEPROM
8
7
6
5
C918
18pF
50V
VCC
8
WP
7
SCL
6
SDA
5
R913
JK900
PEJ027-01
18pF
RGB V/HSYNC BUUFFER
IC903
74F08D
D0A
D0B
Q0
D1A
D1B
Q1
GND
R921
10K
IR
R945
22
R946
22
R947
READY
22
C924
10pF
+3.3V_ST
L901
MLB-201209-0120P-N2
1
2
3
4
5
6
7
+3.3V_ST
R925
47K
C
Q902
2SC3052
C926
10pF
L900
MLB-201209-0120P-N2
RGB_VSYNC
003:B2
RGB_HSYNC
003:B2
+5V_VGA
+5V_MULTI
ENKMC2838-T112
A1CA2
D912
EDID_WP
R929
0
R930
0
R932
22
R934
22
D910
5.6V
D911
5.6V
C922
0.1uF
DDC_SCL/UART_RX
DDC_SDA/UART_TX
READY
R926
470K
READY
R927
470K
DDC_SCL
DDC_SDA
R931
0
R933
0
READY
12K
READY
R936
12K
R935
PC_R_IN
PC_L_IN
IR_NEC
SUB_SCL
SUB_SDA
SUB Board I/F
R910
22
KEY1
KEY2
LED_RED
+5V_MULTI
LED_WHITE
R924
R923
2.7K
2.7K
100R922
10K
C919
50V
E_SPRING
3
T_TERMINAL1
6A
B_TERMINAL1
7A
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
R938
10K
R959
22
R953
22
BCM Reference
+3.3V_ST
R914
47K
Q901
2SC3052
+3.3V_ST
R941
10K
+3.3V_MULTI
R937
R939
C
E
4.7K
4.7K
B
C923
10pF
READY
+5V_MULTI
VCC
14
D3B
D3A
Q3
D2B
D2A
Q2
C928
0.1uF
13
12
11
10
9
8
DSUB_VSYNC
DSUB_HSYNC
FOR PK/J90 - BREATING
P907
JP1108
JP1109
JP1110
12507WR-03L
LED_PK950
1
2
3
4
+5V_MULTI
LED_PK950
R988
+3.3V_ST
READY
R940
10K
R928
47K
B
E
C927
0.1uF
16V
C930
10pF
C931
10pF
D915
CDS3C05HDMI1
5.6V
C932
0.1uF
16V
C903
10pF
D913
D916
CDS3C05HDMI1
5.6V
C933
10pF
JP1111
LED-RED
3.3V_ST
3.3V_MULTI
LED-WHITE
KEY1
KEY2
GND
GND
SCL
SDA
GND
IR
12507WS-12L
1
2
3
4
5
6
7
8
9
10
11
12
GND
LED_BREATHING
P906
13
10
READY
C929
10pF
LED_PK950
L903
MLB-201209-0120P-N2
6
7
8
P901
SPG09-DB-009
1
2
9
10
3
4
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Capacitors on VBUSA should be
placed as closd to connector as possible.
USB1_OCD
P1101
EAG41945401
KJA-UB-4-0004
1
USB DOWN STREAM
C1116
100uF
16V
USB1_OCD_HUB
2
3
D1100
4
5
CDS3C05HDMI1
5.6V
USB2 SIDE UNDER
Capacitors on VBUSA should be
placed as closd to connector as possible.
USB2_OCD
C1117
P1102
EAG41945401
KJA-UB-4-0004
1
USB DOWN STREAM
2
3
4
5
100uF
16V
SPEC_OUT550
D1101
CDS3C05HDMI1
5.6V
+3.3V_USB_HUB
0R1122
READY
D1102
CDS3C05HDMI1
5.6V
+3.3V_USB_HUB
R1123
READY
D1103
CDS3C05HDMI1
5.6V
SWITCH ADDED
IC1101
R1129
10K
AP2191SG-13
NC
1
8
OUT_2
2
7
OUT_1
3
6
FLG
4
5
USB1_DM_to_HUB
USB1_DP_to_HUB
SWITCH ADDED
IC1102
R1130
10K
AP2191SG-13
NC
8
OUT_2
7
OUT_1
6
FLG
5
0
USB2_DM_to_HUB
USB2_DP_to_HUB
+3.3V_USB_HUB
GND
R1141
10K
IN_1
READY
IN_2
EN
USB1 Dato to USB2512
+3.3V_USB_HUB
1
2
3
4
10K
READY
IN_1
IN_2
EN
R1142
GND
USB2 Dato to USB2512
READY
READY
0R1146
0R1144
+5V_USB
C1120
0.1uF
USB1_CTL
16V
USB1_CTL_HUB
USB2_CTL
USB2_CTL_HUBUSB2_OCD_HUB
+5V_USB
C1121
0.1uF
16V
USB1_CTL_HUB
+3.3V_USB_HUB
USB2_CTL_HUB
+3.3V_USB_HUB
USB1_OCD_HUB
C1110
1uF
10V
USB2_OCD_HUB
C1111
0.1uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM3556-C0
ETHERNET
WIRELESS_SCL
READY
R1216
10K
10K
R1220
READY
G
S
Q1205
2N7002(F)
READY
0R1217
D
09/10
WIRELESS MODEL
R1232
22
12 13
SCL2_3.3V
Page 25
Page 26
Great Company Great People
3DTV (PA02B) Training manual
3DTV (PA02B) Training manual
Contents
-Block Diagram
- Power Flow Diagram
2010.8.13
- Trouble Shooting Guide
PDP DVB Gr. JANG EUN KWANG
Page 27
Trouble Shooting Guide for LG Service Man
Trouble Shooting Guide for LG Service Man
5/37
Page 28
SET Layout
Z Board
Power Board
Y Board
ASIC
50PX950-AA model image
50PX950-AA model block diagram
Changed Point
1. Add 3D formatter board (3DF)
- 3DF board received LVDS data and make L/R image for 3D
- Main to 3DF cable : 51pin FFC / 3DF to ASIC cable : 80pin FFC
2. Change the module ASIC board
- ISIS-F3.0 to ISIS-A1.0 for 3D
3. Add 3D IR emitter sub Assy and wafer
- 3D IR emitter make 3D sync for 3D Active glasses
- IR emitter signal form ASIC to Main board and it connect to IR emitter Assy through 4pin wafer on Main board
3DF
X board
Main
Emitter
Page 29
Block Diagram - Overview
RF Jack
RF Jack
Half-NIM
X-tal
(54MHz)
NAND
Flash(4G)
(26Pin)
DDR(1GBit)x4
Component1/2
RGB-PC
PC audio in
HDMI
1/2/3/4
Buffer
Buffer
IF
SIF
AV1/23D SYNC_IR EMITTER
Y/Cb/Cr/L/R
TV_CVBS
CVBS/L/R
8Bits
BCM3556
R/G/B, H/V Sync
DDC
24C01
TMDS/DDC
TMDS/DDC
I2C
DP/DM
B/T_HP_LOUT_AMP
RMII
RMII
USB2.0
USB2512
USB2512
Bluetooth
TMDS/DDC
TMDS/DDC
TMDS/DDC
HDMI CEC
(To Micom)
HDMI
HDMI
Switch
Switch
8Bits
DP/DM
DP/DM
3D_SYNC_OUT
SYSTEM
SYSTEM
EEPROM
EEPROM
I2S
X-tal
(10MHz)
SOC_Reset
I2C
I2C, Detect,
RX/TX,IR
UART
IC103
MCLK
TAS5709
(Digital AMP)
HDMI CEC
NEC
NEC
Micom
Micom
IR
Wireless interface
RS-232C
24C16
24C16
Local
Local
KEY
KEY
12P
NEC ISP
SPDIF OUT
Page 30
Main board (GP2 modify)
Main board for 3D image
Center LED 3pin
LVDS
IR/Control
Speaker 4pin
wireless
IR emitter 4pin
Motion Remocon
DDRDDR
BCM3556CP
HDMI
MUX
HDMI
LAN
HDMI
HDMI
Main board for 3D block diagram
RS232RGB
Power 18pin
Tuner
USB
USB
HDMI
PC Audio
SPDIF
Rear AV
Component
Side AV
IR emitter assy - front
IR emitter assy - back
Changed Point
1. BCM 3556 revision
-
BCM3556 -> BCM3556CP
- Change the BCM version to support HDMI1.4a 3D
2. Add IR emitter wafer
- IR signal from ASIC to Main through the LVDS cable.
- IR assy connect to 4pin wafer on the main board.
3. Another block is almost same as GP2 chassis
Page 31
3D Formatter Board (3DF)
2D to 3D D/L wafer
3D function
3D Source
3D D/L wafer
2D to 3D chip
3D chip
3D formatter board image3D formatter board layout
2D to 3D
chip
Bypass
LR
BCM
LR
LVDS to ASIC
3DF board
LR
FPGA
3D
DDRDDR
3D
chip
FPGA
2D to 3D
3D
LVDS from Main
Module
(ASIC)
L
R
2D to 3D function
2D Source
2D
BCM
2D
2D to 3D
chip
3DF board
LR
3D
chip
3D
Module
(ASIC)
L
R
Page 32
Block Diagram – 3DF B/D (PDP 3DTV)
BCM
5V_VCC
3D_SYNC
I2C
L/R DETECT
FPGA RESET
LVDS 2Ch
5V_VCC
L/R DETECT
FPGA RESET
LVDS (51Pin)
3D_SYNC
I2C
LVDS 2Ch
X-tal
(54MHz)
PROM
(16Mbit)
2D to 3D
Converter
(FPGA)
EP3C55F484
I2C
FPGA RESET
LVDS 2Ch
X-tal
(54MHz)
PROM
(16Mbit)
3D Formatter
(FPGA)
EP3C55F484
3D_SYNC
LVDS 2Ch
(Left)
LVDS (80Pin)
LVDS 2Ch
(Right)
■Input
1 LVDS RX (2 channel)
10 bit 1920x1080p@60Hz
■ Processing
148.5 MHz, 74.24 MHz
DDR2 IF(153MHz)
CSC (RGB ÅÆ YUV) included
Scaler included
I2C input from LVDS RX
DDR2
(512Mbitx2)
■Output
2 LVDS TX (4 channel)
10 bit 1920x1080p@120Hz
Page 33
Changes List : Module
To improve 3D Crosstalk, change R/G fluorescent substance (Afterglow time 10㎳ Æ 4㎳ )
New ASIC for 3D (A1.0) and apply 3D sustain waveform
panel
1
0
circuit / tool
R1
35%
65%
10ms
Ctrl B/D
ISIS F3.0
As is (60R1)
▶ fluorescent substance
- Afterglow time: 10ms (R,G)
▶ 3D Cross Talk ratio
-17%
▶ color temp : 6500K
▶ brightness : 500cd/m
Time
▶ ISIS-F3.0
- not support 3D
- apply DCC
Main B/D
▶ 51pin LVDS Cable
To be (60R1X 3D)
R1 3D
▶ fluorescent substance
- Afterglow time : 4ms(R,G)
▶ 3D Cross Talk ratio
10%
90%
1
2
0
4ms
Ctrl B/D
ISIS A1.0
Time
3DF B/D
Main B/D
- About 2.5%
▶ color temp : 7200K↑
▶ brightness : 410cd/m
2
▶ ISIS-A1.0
- support 3D
- apply DPCS
▶ 80pin & 51pin LVDS Cable
- L / R Image Input
▶ Apply 3D Formatter B/D
waveform
▶ SF : 9
st
LSB SF Mapping
▶ 1
SF1
SF2SF8SF1
(LSB)
. . . . SF4
SF9
(MSB)
2D SF Mapping
Right ImageLeft Im ag e
SF1
(LSB)
(MSB)
(MSB)
3D SF Mapping
▶ SF : 4(L) + 4(R)
st
▶ 1
SF4
(LSB)
MSB SF Mapping
Page 34
Block Diagram – PSU
+5V_ST
L505
4.98V
56mV
※ INSTANT BOOT
P
O
w
E
R
P_5V
SPEC : 5A↓
예상:4.5A
5.01V
56mV
B
O
A
R
D
16.91V
P_17V
L511
SPEC : 2A
(DCDC)
Max 3A
L500
Q501
Max 4.4A
44mV
SPEC : 2A↓
(3.3V Reg)
IC501
IC500
D1.8V
1100mA
L516
+3.3V_NEC_ST
+3.3V_ST
INSTANT_BOOT
+5V_MULTI
v
58mV
5.04V
L512
L1200
L704
1440mA (Volume max 기준)
52mV
IC502
(DCDC)
Max 4A
+5V_USB
L510
IC505
(3.3V Reg)
Max 3A
48mV5.03V
+5V_TU
IC504
(DCDC)
IC701
AUDIO AMP
P17V_WIRELESS
TUNER
IC503
(2.5V)
EEPROM
IC903
(SYNC)
16.91V
L503
56mV
RGB
L520
3.25V
L1304
5.08V
56mV
+5V_TU
WIRELESS
(ST AMP)
1.83V
3.24V
IC700
52mV
80mV
+3.3V_MULTI
34mV
+3.3V_USB_HUB
L519
IC1100
(USB HUB)
L515
L518
L801
L602
L703
L1201
3.24V
3.24V
+3.3V_HDMI
3.23V
+3.3V_TU
3.23V
1.79V
+1.8V_HDMI
L800
IC102(Flash)
IC700(AMP)
IC100(EEPROM)
ETHERNET
L509
IC800
(HDMI
Switch)
OPTION
IC800
(HDMI Switch)
1.18V
1.21V
2.49V
IC600
(1.2V Reg)
D1.8V
D1.8V
A1.2V
D1.2V
A2.5V
D3.3V
A3.3V
+3.3V_TU
1.2V_TU
EEPROM(NEC)
NEC Micom
MAX3232
P906(SUB B/D)
BUZZER
BCM
DDR2x4
1G 8Bit
IC100
BCM
TUNER
STBY
Multi Power
Page 35
Power Flow Diagram
P814
117V217V
3GND4GND
55V 65V
75V 8Error_DET
9GND10GND
11GND12GND
13STBY14STBY
15RL_ON16AC DET
17M_ON18AUTO_GND
SMAW200-H18S2
<BCM Power Sequence>
Page 36
PDP TV Repair Process Index
- Trouble shooting by worst symptom
No.Symptom (L)Symptom (M)PageRemark
1
2 No Picture/No sound2
3Mal-discharge/Noise/dark picture3
4Picture broken/Freezing4
5Vertical bar/ Horizontal Bar5
6
7Turn off (Instant, under watching)7
8C. Sound ProblemNo sound/ Sound distortion8
9E. General function ProblemRemote control & Local switch checking9
A. Picture Problem
B. Power Problem
No Picture/Sound OK1
No Power (Not turn on)6
First of all, Check whether there is SVC Bulletin in GCSC System for these model.
Page 37
Repair Process
PDP TV
Symptom
A. Picture Problem
No Picture/Sound OK
Making
Revision
2010. 8 . 13
First of all, Check whether all of cable between board was inserted properly or not.
(Main B/D↔ Power B/D, Power B/D↔ Y-sus B/D,Y-Sus B/D ↔Z-Sus B/D,LVDS Cable,Speaker Cable,IR B/D Cable,,,)
Check Module pattern
by using “TILT” key
on SVC R/C
Normal
N
Check
Vs, Va
Check
Y
Sound
Normal
N
Move
Power problem
Section
Sound
OK
Move
No Picture/No sound
Section
Check voltage
Y
. -V
Y
. VSC
. VZB
Y
N
1. Check Y-Sus/ Z-Sus Board
2. Replace defective B/D
Check
LVDS Cable
Check B+ Voltage
Y
NormalNormal
N
on Power Board
/ Control Board
.Check B+(5V)
Normal
N
Replace
Main B/D
Y
Close
Power problem
Y
N
Move
Section
전자 -6-2
1/9
1.Check Control Board
. LED on
. Crystal(X101)
. 1.8V, 3V, 5V FET
. Rom update
2.Replace Control B/D
<SVC R/C & Pattern>
※Refer to the Module label for each voltage
-VYVSCVZB
Page 38
Repair Process
PDP TV
Check Module pattern
by using “TILT” key
on SVC R/C
Move
Power problem
Section
1. Check Y-Sus/ Z-Sus
Board
2. Replace defective B/D
Move
Power problem
Section
Symptom
Normal
N
Check
Vs, Va
N
Normal
Y
Check voltage
. -V
Y
. VSC
. VZB
N
Normal
Y
Check B+ Voltage
on Power Board
/ Control Board
.Check B+(5V)
N
Normal
A. Picture Problem
No Picture/No Sound
Check
Y
Sound
Check IR operation
1.Check Control Board
. LED on
. Crystal(X101)
. 1.8V, 3V, 5V FET
. Rom update