Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to LA33B Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
4. MAIN PCBA Adjustments
4.1. ADC Calibration
- An ADC cali bra tion is not necessary because MA IN SoC
(LGExxxx) is already calibrated from IC Maker
- If it needs to adjust manually, refer to appendix.
4.2. MAC Address, ESN Key and Widevine
Key download
4.2.1. Equipment & Condition
1) Play file: keydownload.exe
4.2.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process
- US, C anada m odels : DETEC T -> M AC_ WR IT E ->
WIDEVINE_WRITE
- Korea, Mexico m odels: DET ECT -> MAC_WRI TE ->
WIDEVINE_WRITE
4) Play : START
5) Check of result: Ready, Test, OK or NG
6) Printer out (MAC Address Label)
4.2.4. Communication Port connection
1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
- Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly tages can be checked by using the INSTART
Menu -> 1.ADJUST CHECK
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
3.3. Appendix
(1) Tool option menu, USB Download (S/W Update, Option and
Service only)
(2) Manual adjustment for ADC calibration and White balance.
(3) Shipment conditions, Channel pre-set
4.2.5. Download
1) US, Canada models (13Y LCD TV + MAC + Widevine +
ESN Key + DTCP Key + HDCP1.4 and HDCP2.0)
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON sta tus during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
5.1.5.2. Manual adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C à 9. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 206 Gray internal pa ttern will be
displayed.
(4) Adjust Cool modes
(i) Fix the one of R/G/B gain to 192 (default data) an d
decrease the others.
( If G gain is adjusted over 172 and R and B gain less than
192 , Adjust is O.K.)
(ii) If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain.
(iii) If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255 or
B gain is 255
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B
gain to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu. 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner (ON). By selecting OFF, you can
adjust using RF signal in 206 Gray pattern.
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.1.6. Reference (White Balance Adj. coordinate and
color temperature)
(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
5.1.7. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 204 Gray
▪ Standard color coordinate and temperature using CS-1000
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
6.2. Specification
NoItemMinTypMaxUnitRemark
1Audio
practical
max Output,
L/R
(Distortion=10%
max Output)
9.0
8.5
10.0
8.9
12.0
9.9WVrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)
8. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
7. GND and HI-POT Test
7.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
7.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically.
7.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
- Resolution : 1 080 p RG B (M SPG -92 5FA: m ode l-2 25,
pattern-65)
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level : 0.7±0.1 Vp-p
9.1.2. Adjust method
8.1.2.1 ADC 480i/1080p Comp1, RGB
(1) Check connected condition of Comp1/RGB cable to the
equipment
(2) Give a 480i Mode, Horizontal 100% Color Bar Pattern to
Comp1. (MSPG-925FA -> Model: 209, Pattern: 65)
(3) Change input mode as Component1 and picture mode as
“Standard”
(4) Press the In-start Key on the ADJ remote after at least 1
min of signal reception. Then, select 7.External ADC. And
Press OK or Right Button for going to sub menu.
(5) Press OK in Comp 480i menu
(6) Give a 1080p Mode, Horizontal 100% Color Bar Pattern to
Comp1. (MSPG-925FA -> Model: 225, Pattern: 65)
(7) Press OK in Comp 1080p menu
(8) Perform (6) and (7) in RGB-PC
(9) If ADC Comp is successful, “ADC Component Success” is
displayed. If ADC calibration is failure, “ADC Component
Fail” is displayed.
(10) If ADC calibration is failure, after rechecking ADC pattern
or condition, retry calibration
(11) If ADC RG B calibr ation is succe ss ful, “ADC RGB
Success” is displayed. If ADC calibration is failure, “ADC
RGB Fail” is displayed.
(12) If ADC calibration is failure, after recheck ADC pattern or
condition, retry calibration
9.2. Manual White balance Adjustment
9.2.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
▪ After Aging Start, Ke ep the Power ON status during 5
Minutes.
▪ In case of LCD, Back-light on should be checked using no
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Vi deo Sig nal Generator MSP G-925F 720p/216 -Gray
(Model: 217, Pattern: 78)
9.2.3. Adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►).
When KEY(►) is pressed 216 Gray internal pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safet y parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_MAIN_2
2011.12.19
9
WOL_CTL
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
VDD3V3
+3.5V_ST
R500
10K
B
C500
4.7uF
10V
OPT
R502
R501
+3.5V_ST_WAKE
10K
1.8K
C
Q500
MMBT3904(NXP)
E
+3.3V_NORMAL
OPT
L503
BLM18PG121SN1D
OPT
L502
BLM18PG121SN1D
Q501
PMV48XP
S
G
C501
4.7uF
10V
L501
BLM18PG121SN1D
C503
10uF
OPT
C504
0.1uF
D
C502
0.1uF
16V
VDD3V3
C505
10uF
AVDD_33SB
C506
0.1uF
+3.5V_ST_WAKE
5V
ZD500
IC105
+1.2V_MTK_CORE
3.3V_EMMC
L505
BLM18PG121SN1D
+1.2V_MTK_CORE
OPT
C513
10uF
POWER_ON/OFF1
C531
0.1uF
16V
OPT
C527
0.1uF
TP500
OPT
C535
0.1uF
LAN_JACK_POWER
TP501
VDD3V3
C510
0.1uF
16V
+1.2V_MTK_CORE
+1.2V_MTK_CORE
IC500
AP2121N-3.3TRE1
VIN
3
1
60mA
C507
C508
0.1uF
2.2uF
+3.5V_ST_WAKE
OPT
C514
10uF
L504
BLM18PG121SN1D
VOUT
2
GND
C517
10uF
5600mA
C523
0.1uF
C518
10uF
AVDD_33SB
C512
1uF
10V
C532
C520
0.1uF
0.1uF
+1.2V_MTK_AVDD
+3.3V_NORMAL
DECAP FOR SOC (HIDDEN - UCC)DECAP FOR SOC Rework (BOTTOM)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MID_MAIN_3
2011.12.09
10
A_RVREF1
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2011.12.09
DDR ONE SIDE12
FROM LPB & PSU
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
P_DET_BOTH_12_3.5V
P_DET_BOTH_12_3.5V
R2410-*1
2.7K
1%
R2409-*1
1.2K
1%
Power_DET
On-semi
+12V
C2401
0.1uF
50V
+3.5V_ST
RL_ON
CIS21J121
C2406
0.1uF
16V
L2401
CIS21J121
P_DET_BOTH_24_3.5V
P_DET_BOTH_24_3.5V
R2408
10K
R2401
10K
L2402
L/DIM0_MOSI_PWR
IC2401-*1
NCP803SN293
VCC
3
1
GND
P_DET_BOTH_24_3.5V
R2418-*1
100
P_DET_BOTH_24_3.5V
R2416-*1
100K
P_DET_BOTH_24_3.5V
+12V
P_DET_ONLY_12V
R2410
2.7K
1%
P_DET_ONLY_12V
R2409
1.2K
1%
MMBT3906(NXP)
Q2401
1
2
RESET
2
C2410-*1
0.1uF
50V
P_DET_BOTH_24_3.5V
+3.5V_ST
R2413
0
5%
P_DET_BOTH_24_3.5V
+3.5V_ST
+24V
R2412
8.2K
P_DET_BOTH_12_3.5V
R2411
1.5K
1%
3
L/DIM0_MOSI
VCC
C2411
0.1uF
16V
P_DET_BOTH_12_3.5V
R2400
0
VCC
C2410
0.1uF
50V
P_DET_BOTH_12_3.5V
P2400
SMAW200-H24S2
POWER_18P
PWR ON
1
1
3.5V
3
3
3.5V
5
5
GND
7
7
24V
9
9
GND
11
11
12V
13
13
12V
15
15
GND
17
17
GND
19
GND
21
19
23
POWER_24P
25
SMAW200-H18S1
P2401
P_DET_BOTH_12_24V
P_DET_BOTH_12_24V
P_DET_BOTH_12_24V
P_DET_BOTH_12_24V
R2417
100K
IC2402
NCP803SN293
RESET
3
2
1
GND
R2416
100K
IC2401
NCP803SN293
RESET
3
2
1
GND
P_DET_BOTH_12_3.5V
INV ON
2
2
PDIM#1
4
4
PDIM#2
6
6
GND
8
8
24V
10
10
GND
12
12
12V
14
14
24V
16
16
GND
18
18
GND
20
L/DIMO_VS
22
L/DIM0_SCLK
24
R2412-*1
8.2K
R2411-*1
1.5K
1%
R2410-*2
2.7K
1%
R2409-*2
1.2K
1%
P_DET_BOTH_12_3.5V
P_DET_BOTH_12_24V
R2416-*2
100K
R2418-*2
100
P_DET_BOTH_12_24V
+3.5V_ST
R2421
10K
OPT
R2419
100
R2418
100
R2425
100
PWM_DIM1
PWM_DIM2
L2403
CIS21J121
L/DIM0_VS_PWR
L/DIM0_SCLK_PWR
IC2401-*2
NCP803SN293
VCC
3
1
GND
P_DET_BOTH_12_24V
POWER_DET
C2412
0.1uF
16V
not to RESET at 8kV ESD
24V-->3.48V
12V-->3.58V
ST_3.5V-->3.5V
+3.3V_NORMAL
R2426
1K
INV_CTL
+24V
C2413
0.1uF
50V
RESET
2
C2410-*2
0.1uF
50V
P_DET_BOTH_12_24V
L/DIM_OUT
R2459
L/DIM0_SCLK
L/DIM0_MOSI
L/DIM0_VS
33
L/DIM_OUT
R2458
33
L/DIM_OUT
R2456
33
R2457
4.7K
L/DIM_OUT
+24V
L2406
BLM18PG121SN1D
C2417
10uF
35V
L/DIM0_SCLK_PWR
L/DIM0_MOSI_PWR
L/DIM0_VS_PWR
C2422
0.1uF
50V
DDR MAIN 1.5V
HDMI LEAKAGE Workaround in MTK A2(A0) (Default= with HDMI_LEAKAGE)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
5V
ZD2402
OPT
DDR MAIN 1.5V
POWER_ON/OFF2_1
10K
R2430
C2420
3A
EP[GND]
1
THERMAL
2
3
4
3A
5
AGND
17
0.1uF
BOOT14PWRGD15EN16VIN_3
13
12
11
10
IC2403
TPS54319TRE
7
8
COMP
RT/CLK6VSENSE
16V
PH_3
PH_2
PH_1
SS/TR
9
+3.5V_ST
L2405
BLM18PG121SN1D
VIN_1
VIN_2
C2448
10uF
10V
C2418
10uF
10V
C2419
0.1uF
16V
GND_1
GND_2
Vout=0.827*(1+R1/R2)=1.521V
R2431
15K
1/16W 5%
C2455
0.1uF
16V
0.01uF
R2432
C2450
50V
330K1/16W5%
4700pF
NR5040T2R2N
C2421
50V
L2411
2.2uH
C2456
10uF
10V
C2451
10uF
10V
C2454
10uF
10V
C2447
10uF
10V
R2433
56K
1/16W
1%
R2455
R1
47K 1%
R2
+1.5V_DDR
C2452
100pF
50V
C2457
0.1uF
16V
5V
ZD2401
+3.3V_NORMAL
+12V
VFB
VREG5
C2415
1uF
10V
EN
SS
IC2405
TPS54327DDAR
1
2
THERMAL
3
4
9
C2416
3300pF
50V
[EP]GND
VIN
8
0.1uF
C2437
VBST
7
SW
6
GND
5
L2409
BLM18PG121SN1D
Placed on SMD-TOP
C2431
10uF
16V
R2414
10K
C2436
0.1uF
C2434
0.1uF
16V
OPT
16V
C2430
10uF
16V
OPT
POWER_ON/OFF2_2
L2410
2uH
NR8040T2R0N
16V
C2438
10uF
10V
C2439
10uF
10V
C2442
10uF
10V
C2444
10uF
10V
MAX 3.4 A
C2445
100pF
50V
OPT
R2427
R2440
R2428
30K
3.3K
10K
1%
1/16W
1%
R1
1%
R2
+3.3V_NORMAL
5V
ZD2400
OPT
Vout=0.765*(1+R1/R2)
MID_POWER
2011.11.25
24
Renesas MICOM
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
For Debug
+3.5V_ST
MICOM_DEBUG
P3000
12507WS-04L
5
1
2
3
4
Don’t remove R3014,
not making float P40
R3016 1K
R3014 10K
MICOM_DEBUG
MICOM_DEBUG
MICOM_RESET
GP4 High/MID Power SEQUENCE
POWER_ON/OFF!
POWER_ON/OFF2_1
POWER_ON/OFF2_2
POWER_ON/OFF2_3
POWER_ON/OFF2_4
SOC_RESET
MICOM MODEL OPTION
MICOM MODEL OPTION
+3.5V_ST
MODEL_OPT_0
MODEL_OPT_1
R3007-*2
22K
R3007-*1
56K
MICOM_GED
MICOM_H13
R3002 10K
R3003 10K
MICOM_M13
R3000 10K
R3001 10K
MICOM_NON_GED
R3006 10K
MICOM_PDP
MICOM_NC4_8PIN
R3007 10K
R3010 10K
MICOM_TOUCH_KEY
R3004 10K
R3005 10K
MICOM_GP3_12/15PIN
R3008 10K
MICOM_LCD/OLED
MICOM_TACT_KEY
R3013 10K
MICOM_LOGO_LIGHT
R3012 10K
MICOM_NON_LOGO_LIGHT
MICOM_OLED_FRC
MICOM_OLED_MAIN
MODEL1_OPT_0
MODEL1_OPT_1
MODEL1_OPT_2
MODEL1_OPT_3
MODEL1_OPT_4
MODEL1_OPT_5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
BODY_SHIELD
GND
20
19
18
17
16
15
14
13
12
11
10
EAG62611204
51U019S-312HFN-E-R-B-LG
JK3301
SIDE
BODY_SHIELDGND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
ARC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
D0-
9
D0_GND
8
EAG62611204
51U019S-312HFN-E-R-B-LG
JK3303
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
VA3302
R3342
VA3304
ADLC 5S 02 015
OPT
VA3305
OPT
ADLC 5S 02 015
BLM18PG121SN1D
VA3303
ADLC 5S 02 015
0
OPT
CEC_REMOTE
CK-_HDMI4_JACK
CK+_HDMI4_JACK
D0-_HDMI4_JACK
D0+_HDMI4_JACK
D1-_HDMI4_JACK
D1+_HDMI4_JACK
D2-_HDMI4_JACK
D2+_HDMI4_JACK
5V_HDMI_3_JACK
MMBT3904(NXP)
R3327
ADLC 5S 02 015
100K
OPT
HDMI_ARC
CEC_REMOTE
OPT
1
2
3
4
5
OPT
D3321
RCLAMP0524PA
1
2
3
4
5
L3303
OPT
SOC_RX
VA3300
UI : HDMI3
C
Q3303
E
VA3306
D3320
RCLAMP0524PA
10
9
8
7
6
10
9
8
7
6
UI : HDMI1
5VBUS
R3308 100
R3309 100
VA3301
ADLC 5S 02 015
ADLC 5S 02 015
OPT
R3373
1K
1/16W
5%
R3386
180K
R3387
120K
R3330
1K
R3331
1K
B
ADLC 5S 02 015
VA3307
ADLC 5S 02 015
OPT
OPT
+12V
+12V
R3370
OPT
C3322
0.1uF
16V
OPT
R3328 100
R3329 100
CK-_HDMI3_JACK
CK+_HDMI3_JACK
D0-_HDMI3_JACK
D0+_HDMI3_JACK
D1-_HDMI3_JACK
D1+_HDMI3_JACK
D2-_HDMI3_JACK
D2+_HDMI3_JACK
OPT
R3384
1K
G
1K
G
DDC_SDA_MHL
DDC_SCL_4_JACK
Q3301
MMBT3904(NXP)
R3336
4.7K
SIL_HPD/CBUS
S
OPT
Q3304
2N7002K
D
R3371
820
D
Q3314
PMBFJ177
S
+3.5V_ST
R3374
10K
C
B
E
HDMI_HPD_3_JACK
DDC_SDA_3_JACK
DDC_SCL_3_JACK
R3375
10K
R3376
0
B
E
MMBT3906(NXP)
Q3302
C
SIDE
MHL_DET
(CD_SENCE)
BODY_SHIELD
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
D0-
9
D0_GND
8
EAG62611204
51U019S-312HFN-E-R-B-LG
JK3300
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
VA3310
ADLC 5S 02 015
OPT
VA3311
R3341 0
OPT
5V_HDMI_1_SOC
MMBT3904(NXP)
R3301
100K
ADLC 5S 02 015
OPT
SOC_TX
CEC_REMOTE
D3319
RCLAMP0524PA
OPT
1
2
3
4
5
OPT
D3318
RCLAMP0524PA
1
2
3
4
5
#SIL_RESET
Q3300
10
9
8
7
6
10
9
8
7
6
+3.3V_NORMAL
R3356
10K
C3314
OPT
0.1uF
16V
R3304
1K
C
R3305
1K
B
E
VA3309
ADLC 5S 02 015
VA3308
ADLC 5S 02 015
OPT
OPT
CK-_HDMI1_SOC
CK+_HDMI1_SOC
D0-_HDMI1_SOC
D0+_HDMI1_SOC
D1-_HDMI1_SOC
D1+_HDMI1_SOC
D2-_HDMI1_SOC
D2+_HDMI1_SOC
UI : HDMI2
MHL_DET
DDC_SDA_MHL
DDC_SCL_MHL
SIL_HPD/CBUS
R3306
4.7K
HDMI_INTERNAL_EDID
R3321
4.7K
HDMI_EXT_EDID
R3302 100
R3303 100
1.2V_MHL
R3351
4.7K
5V_MHL
C3313
0.1uF
16V
HDMI_HPD_1_SOC
DDC_SDA_1_SOC
DDC_SCL_1_SOC
+3.3V_NORMAL
RSVDL1
VDD12_1
RSVDL2
RESET
PWR5V_DET
INT
OPT
DSDA
DSCL
CBUS/HPD
VDD5_IN
OPT
D3303
RCLAMP0524PA
VDD33_2
[EP]GND
40
1
2
3
4
5
6
7
8
9
10
11
RSVDNC
MHL_DET
D1+_HDMI4_JACK
D2-_HDMI4_JACK
D2+_HDMI4_JACK
9
10
1827364
5
RX1+
RX2-
RX2+
37
38
39
THERMAL
41
IC3304
SIL1292CNUC
12
13
14
PS_CTRL
HDMI_DET
VREG33_OUT
HDMI_DET
DDC_SCL_4_JACK
D0+_HDMI4_JACK
D0-_HDMI4_JACK
D1-_HDMI4_JACK
9
10
D3302
RCLAMP0524PA
1827364
5.1
R3388
R3389
RXC+
RX0-
RX0+
RX1-
33
34
35
36
15
16
17
CSDA18CSCL
GPIO0
GPIO1/CI2CA
R3363 10K
I2C_SDA4
I2C_SCL4
5V_MHL
R3381
22K
CK-_HDMI4_JACK
CK+_HDMI4_JACK
OPT
5
+3.3V_NORMAL
5.1
VDD33_1
RXC-
31
32
30
29
28
27
26
25
24
23
22
21
19
20
1.2V_MHL
CEC_A
VDD12_2
+3.5V_ST
R3361
47K
22K
R3379
B
AVDD12
TXCTXC+
TX0TX0+
TX1TX1+
TX2TX2+
HPD_IN
+3.3V_NORMAL
OPT
R3355
4.7K
OPT
R3345
4.7K
5V_MHL
C
Q3311
MMBT3904(NXP)
E
M24C02-RMN6T
E0
1
E1
2
HDMI_EXT_EDID
E2
3
VSS
4
1.2V_MHL
A2CA1
D3301
MMBD6100
30V
BAT54_SUZHO
D3304
Q3309
PMV48XP
S
HDMI_EXT_EDID
MMBT3904(NXP)
IC3300
CK-_HDMI4_MHL
CK+_HDMI4_MHL
D0-_HDMI4_MHL
D0+_HDMI4_MHL
D1-_HDMI4_MHL
D1+_HDMI4_MHL
D2-_HDMI4_MHL
D2+_HDMI4_MHL
5V_MHL
G
Q3313
8
7
6
5
D
VCC
WC
SCL
SDA
R3338
10K
E
C
HDMI_EXT_EDID
HDMI_EXT_EDID
R3380
1.8K
B
DDC_SCL_MHL
30V
BAT54_SUZHO
EDID_WP
R3319
22
R3320
22
5V_MHL
R3348
10K
R3358
4.7K
OPT
30V
D3312
D3313
BAT54_SUZHO
R3307
1.8K
5V_HDMI_1_SOC
R3323
47K
HDMI_EXT_EDID
HDMI_HPD_4_MHL
DDC_SDA_MHL
DDC_SCL_MHL
+5V_NORMAL
A2CA1
MMBD6100
D3300
HDMI_EXT_EDID
R3325
47K
DDC_SCL_1_SOC
HDMI_EXT_EDID
DDC_SDA_1_SOC
#MHL_OCP
+1.23V_D_Demod
MHL_DET
C3312
10uF
10V
#MHL_OCP
NON_TU_H/N/S_T/US
+3.3V_NORMAL
TP3300
5VBUS
R3359
100K
C3302
0.1uF
16V
1.2V_MHL
L3302
BLM18PG121SN1D
C3311
0.1uF
16V
R3357
10K
OUT
GND
OC
+5V_NORMAL
R3337
47K
Close to SIL1292
C3316
0.1uF
16V
+5V_NORMAL
C3318
0.1uF
16V
5V_MHL
R3362
10K
C
B
MMBT3904(NXP)
E
Current Limit
IC3301
TPS2051BDBVR
1
2
3
A2CA1
D3314
MMBD6100
R3339
47K
C3320
0.1uF
16V
L3301
BLM18PG121SN1D
Q3310
5V_MHL
IN
5
EN
4
R3340
47K
R3377
HDMI_INTERNAL_EDID
5V_MHL
HDMI_DET
R3332
10K
R3378
47K
C3315
0.1uF
16V
47K
C3321
0.1uF
16V
MHL_DET
HDMI_INTERNAL_EDID
DDC_SDA_MHL
DDC_SCL_3_JACK
DDC_SDA_3_JACK
DDC_SCL_1_SOC
DDC_SDA_1_SOC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HDMI 4
2011.10.29
33
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