LG 50LB6000-UH Schematic

Internal Use Only

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

LED TV

SERVICE MANUAL

CHASSIS : LA43B

MODEL : 50LB6000 50LB6000-UH

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL67988309(1402-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 4

ADJUSTMENT INSTRUCTION .............................................................. 10

TROUBLE SHOOTING ............................................................................ 16

BLOCK DIAGRAM .................................................................................. 21

EXPLODED VIEW .................................................................................. 24

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This spec sheet is applied LCD TV with LA43B/M chassis

2. Test condition

Each part is tested as below without special notice.

1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage

Market Input voltage Frequency Remark

USA 100~240V 50/60Hz Standard Voltage of each

product is marked by models

4) Specification and performance of each parts are followed ea ch drawing and s pe cificatio n b y p art number in accordance with BOM

5) The receiver must be operated for about 20 minutes prior to the adjustment

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification Safety : UL, CSA, IEC specification EMC: FCC, ICES, IEC specification

4. General Specification

No Item Specication Result Remark

1. Receiving System ATSC / NTSC-M / 64 & 256 QAM

2. Available Channel 1) VHF : 02~13

2) UHF : 14~69

3) DTV : 02-69

4) CATV : 01~135

5) CADTV : 01~135

3. Input Voltage AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz (N.America)

4. Market NORTH AMERICA

5. Screen Size 42/49 inch Wide (1920 × 1080) FHD + 60Hz All models without HD models

60 Inch Wide (1920X1080) FHD + M120Hz

32 inch Wide (1366 × 768) HD + 60Hz

6. Aspect Ratio 16:9

7. Tuning System FS

8. Module POLA HC600DUF-VHHS1 HS (Sharp Panel) 60LB6000-Ux

LC550DUE-FGA3 LGD 55LB6000-Ux

T550HVF04.1 AUO 55LB6000-Ux.xxxJxxx

LC500DUE-FGA3 LGD 50LB6000-Ux.xxxWxxx

NC500DUN-VXBP1 INX 50LB6000-Ux.xxxJxxx

LC470DUE-FGA3 LGD 47LB6000-Ux

LC420DUE-FGP2 LGD 42LB6200-Ux

9. Operating Environment 1) Temp : 0 ~ 40 deg

2) Humidity : ~ 80 %

10. Storage Environment 1) Temp : -20 ~ 60 deg

2) Humidity : ~ 85 %

Only for training and service purposes

- 6 -

5. Supported video resolutions

5.1. Component input(Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

1 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I

2 720*480 15.73 59.94 13.50 SDTV ,DVD 480I

3 720*480 31.50 60.00 27.027 SDTV 480P

4 720*480 31.47 59.94 27.00 SDTV 480P

5 1280*720 45.00 60.00 74.25 HDTV 720P

6 1280*720 44.96 59.94 74.176 HDTV 720P

7 1920*1080 33.75 60.00 74.25 HDTV 1080I

8 1920*1080 33.72 59.94 74.176 HDTV 1080I

9 1920*1080 67.50 60.00 148.50 HDTV 1080P

10 1920*1080 67.432 59.94 148.352 HDTV 1080P

11 1920*1080 27.00 24.00 74.25 HDTV 1080P

12 1920*1080 26.97 23.94 74.176 HDTV 1080P

13 1920*1080 33.75 30.00 74.25 HDTV 1080P

14 1920*1080 33.71 29.97 74.176 HDTV 1080P

5.2. HDMI Input (DTV / PC)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

DTV

1 720*480 31.500 60.000 27.027 SDTV 480P

2 720*480 31.470 59.940 27.000 SDTV 480P

3 1280*720 45.000 60.000 74.250 HDTV 720P

4 1280*720 44.960 59.940 74.176 HDTV 720P

5 1920*1080 33.750 60.000 74.250 HDTV 1080I

6 1920*1080 33.720 59.940 74.176 HDTV 1080I

7 1920*1080 67.500 60.000 148.500 HDTV 1080P

8 1920*1080 67.4320 59.940 148.352 HDTV 1080P

9 1920*1080 27.000 24.000 74.250 HDTV 1080P

10 1920*1080 26.970 23.976 74.176 HDTV 1080P

11 1920*1080 33.750 30.000 74.250 HDTV 1080P

12 1920*1080 33.710 29.970 74.176 HDTV 1080P

PC

1 640*350 31.468 70.09 25.17 EGA X

2 720*400 31.469 70.08 28.32 DOS O

3 640*480 31.469 59.94 25.17 VESA(VGA) O

4 800*600 37.879 60.31 40.00 VESA(SVGA) O

5 1024*768 48.363 60.00 65.00 VESA(XGA) O

6 1152*864 54.348 60.053 VESA O

7 1280*1024 63.981 60.020 108.0 VESA (SXGA) O Full HD model Only

8 1360*768 47.712 60.015 85.50 VESA (WXGA) O

9 1920*1080 67.50 60.00 148.5 HDTV 1080P O Full HD model Only

Only for training and service purposes

- 7 -

6. 3D Mode ('LB6200' models)

6.1. RF Input(DTV)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1 1920*1080 45.00 60.00 74.25 HDTV 1080I Side by Side, Top & Bottom

2 1280*720 45.00 60.00 74.25 HDTV 720P Side by Side, Top & Bottom

6.2. HDMI Input

(a) HDMI Input(1.4a)

- When connect the cable on TV or change the input mode, 3D display on automatically

- Display OSD information => 1920x2205 [1080p 24], 1280x1470 [720p 60]

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1280*720 89.9 / 90 59.94/60 148.35/148.50 HDTV 720P Frame packing (720 60p)

2 1280*720 45 60 74.25 HDTV 720P Side by Side(half), Top & Bottom

3 1920*1080 53.95 / 54 23.98 / 24 148.35/148.50 HDTV 1080P Frame packing (1080 24p)

4 1920*1080 67.5 60 148.50 HDTV 1080P Side by Side(half), Top & bottom

5 1920*1080 33.7 60 74.25 HDTV 1080i Side by Side(half), Top & Bottom

6 1920*1080 27 24 74.25 HDTV 1080P Side by Side(half), Top & Bottom

7 1920*1080 33.7 30 74.25 HDTV 1080P Side by Side(half), Top &Bottom

(b) HDMI Input(1.3)

- Connect the HDMI cable & receiving the HDMI signal

- Press “3D” key of remote control & select 3D format below.

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1280*720 45.00 60.00 74.25 HDTV 720P Side by Side, Top & Bottom

2 1920*1080 33.75 60.00 74.25 HDTV 1080I Side by Side, Top & Bottom

3 1920*1080 27.00 24.00 74.25 HDTV 1080P Side by Side, Top & Bottom

4 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side, Top & Bottom

5 1920*1080 67.50 60.00 148.5 HDTV 1080P Side by Side, Top & Bottom,

Single Frame Sequential

6.3. USB Input

(a) Movie

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side, Top & Bottom

(b) MPO Picture 3D : when selecting the MPO le, Automatically 3D on

(c) 3D Demo in store mode

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side

Only for training and service purposes

- 8 -

6.4. 2D to 3D Mode

6.5. DLNA

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side, Top & Bottom

6.6. Remark: 3D Input mode

No 2D to 3D Top & Bottom Side by Side Single Frame Sequential Frame Packing

1

Only for training and service purposes

- 9 -

ADJUSTMENT INSTRUCTION

1. Application

This spec. sheet applies to LA43B/M Chassis applied LED TV all models manufactured in TV factory

2. Specification

(1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation

transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of

25 ±5 ºC of temperature and 65±10% of relative humidity if

there is no specific designation (4) The input voltage of the receiver must keep 100~240V,

50/60Hz (5) At first Worker must turn on the SET by using Power Only

key. (6) The receiver must be operated for about 5 minutes prior to

the adjustment when module is in the circumstance of over

15

ºC

In case of keeping module is in the circumstance of 0°C, it

should be placed in the circumstance of above 15°C for 2

hours In case of keeping module is in the circumstance of below

-20°C, it should be placed in the circumstance of above

15°C for 3 hours.

※ Caution When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area

3. Adjustment items

3.1. Main PCBA Adjustments

(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p (2) EDID download: HDMI and RGB-PC

■ Above adjustment items can be also performed in Final

Assembly if needed. Adjustment items in both PCBA and final assembly tages can be checked by using the INSTART Menu(1.ADJUST CHECK)

Component 1080p and RGB-PC Adjust will be calculated by

480i adjust value.

3.2. Final assembly adjustment

(1) White Balance adjustment (2) RS-232C functionality check (3) Factory Option setting per destination (4) Shipment mode setting (In-Stop) (5) GND and HI-POT test

4. MAIN PCBA Adjustments

4.1. ADC Calibration

4.1.1. Overview

▪ ADC adjustment is needed to find the optimum black level and

gain in Analog-to-Digital device and to compensate RGB deviation

4.1.2. Equipment & Condition

(1) Protocol: RS-232C (2) Inner Pattern

- Resolution : 1080p(Comp) / 1024*768(RGB)

- Pattern : Horizontal 100% Color Bar Pattern

- Pattern level : 0.7±0.1 Vp-p

4.1.3. Adjustment

4.1.3.1. Adjustment method

- Connect to Jig by using RS-232(USB), adjust Component

※ Manual adj (If needed in Final Assembly)

- Required equipment : Adjustment R/C

- Enter Service Mode by pushing “ADJ” key,

- Start ‘OTP’ ADC Type by pushing ‘►’ key at [7. ADC Calibration]

※ In L13 case, Adjust ADC(OTP) is automatically ‘OK’

4.1.3.2. Adj. protocol (only Internal patten)

Protocol CMD 1 CMD 2 Data 1 Data 2 Remark

Enter adj mode

Start ADC adj

4.2. EDID Download

4.2.1. Overview

▪ It is a VESA regulation. A PC or a MNT will display an

optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.

4.2.2. Equipment

▪ Since embedded EDID data is used, EDID download JIG,

HDMI cable and D-sub cable are not need.

▪ Adjust by using remote controller

a a 00 00 When transfer

the ‘Mode In’,Carry the command.

a d 00 10 Automatically

adjustment (Use internal pattern)

3.3. Appendix

(1) Shipment conditions (2) Tool option menu (3) USB Download (S/W Update, Option and Service only) (4) Preset CH Information

Only for training and service purposes

- 10 -

4.2.3. Download method

1) Press Adj. key on the Adj. R/C,

2) Select EDID D/L menu.

3) By pressing Enter key, EDID download will begin

4) If Download is successful, OK is display, but If Download is

failure, NG is displayed.

5) If Download is failure, Re-try downloads.

※ Caution) When EDID Download, must remove RGB/HDMI

Cable.

4.2.3.1. Models for EDID Data

2D 3D

North America

(PCM)

8bit-FHD

(HDMI2)

55/50/47

LB6000-Ux

10bit-FHD

(HDMI2)

60LB6000-Ux 42LB6200-Ux

8bit-FHD

(HDMI2)

4.2.4. EDID DATA

5. Final Assembly Adjustment

5.1. White Balance Adjustment

5.1.1. Overview

5.1.1.1. W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel’s W/B deviation (2) How-it-works: When R/G/B gain in the OSD is at 192, it

means the panel is at its Full Dynamic Range.

● Case : Cool Mode

- To adjust the white balance without the saturation, G gain

should be adjust at least 172 and change the others (R,B Gain)

▪ When R or B gain is over 255, G gain can be adjust below

172)

● Case : Medium / Warm Mode

- To adjust the white balance without the saturation, Fix the

one of R/G/B gain to 192 (default data) and decrease the others.

(3) Adj. condition: normal temperature

- Surrounding Temperature: 25±5 °C

- Warm-up time: About 5 Min

- Surrounding Humidity: 20% ~ 80%

- Before White balance adjustment, Keep power on status,

don’t power off

Only for training and service purposes

5.1.1.2. Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark surrounding.

(2) Probe location: Color Analyzer (CA-210) probe should be

within 10cm and perpendicular of the module surface (80°~ 100°) (3) Aging time

- After Aging Start, Keep the Power ON sta tus during 5

Minutes.

- In case of LCD, Back-light on should be checked using no

signal or Full-white pattern.

- 11 -

5.1.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)

(2) Adj. Computer (During auto adj., RS-232C protocol is

needed) (3) Adjust Remocon (4) Vi deo Signal Generat or MS PG-925F 720p/ 204-Gray

(Model: 217, Pattern: 49)

→ Only when internal pattern is not available

※ Color Analyzer Matrix should be calibrated using CS-1000

5.1.3. Equipment connection

5.1.4. Adjustment Command (Protocol)

(1) RS-232C Command used during auto-adj.

RS-232C COMMAND

CMD DATA ID

Wb 00 00 Begin White Balance adj.

Wb 00 ff End White Balance adj.

(internal pattern disappears )

(2) Adjustment Map

Adj. item Command

(lower caseASCII)

CMD1 CMD2 MIN MAX

Cool R Gain j g 00 C0

G Gain j h 00 C0

B Gain j i 00 C0

Medium R Gain j a 00 C0

G Gain j b 00 C0

B Gain j c 00 C0

Warm R Gain j d 00 C0

G Gain j e 00 C0

B Gain j f 00 C0

Explanation

Data Range (Hex.)

5.1.5. Adjustment method

5.1.5.1. Auto WB calibration (1) Set TV in ADJ mode using P-ONLY key (or POWER ON

key)

(2) Place optical probe on the center of the display

- It need to check probe condition of zero calibration before

adjustment. (3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message,

check adjustment status of pre-set mode (Cool, Medium,

Warm) (6) Remove probe and RS-232C cable.

▪ W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need

5.1.5.2. Manual adjustment (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface..

(3) Press ADJ key → EZ adjust using adj. R/C → 8. White-

Balance then press the cursor to the right (KEY►).

(When KEY(►) is pressed 204 Gray(80IRE) internal

pattern will be displayed)

(4-a) Adjust modes (Cool) : Fix the G gain at least 172 and

change the others (R/B Gain).

▪ If R or B gain is over 255, G gain can be adjust below 172.

(4-b) Adjust two modes ( Medium / Warm) : Fix the one of

R/G/B gain to 192 (default data) and decrease the others.

※ CASE : Cool mode First adjust the coordinate far away from the target value(x, y).B (1) x, y >target (2) x, y< target (3) x >target , y< target (4) x < target , y >target

- Every 4 case have to t y value by adjusting B Gain and

then t x value by adjusting R-Gain

- In this case, increasing/decreasing of B Gain and R Gain

can be adjusted.

► How to adjust

(1) Fix G gain at least 172 : Adjust R, B Gain ( In Case of

Mostly Blue Gain Saturation )

(2) When R or B Gain > 255, Release Fixed G Gain and

Readjust

※ CASE : Medium / Warm mode First adjust the coordinate far away from the target value(x, y). (1) x, y >target i) Decrease the R, G. (2) x, y< target i) First decrease the B gain, ii) Decrease the one of the others. (3) x >target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G

Only for training and service purposes

- 12 -

5.1.6. Reference (White Balance Adj. coordinate and color temperature)

▪ Luminance: 204 Gray, 80IRE

** (normal line) LGD Cell (LB5xxx, LB6xxx, LB7xxx, LB8xxx) ** Except Gumi winter season (Mar ~ Dec) & Global

▪ Sta nd ar d co lor co ordinate an d t em pe ra ture u sing

CA-210(CH-14) – by aging time

Aging time

L14

1 0-2 282 289 297 308 324 348

2 3-5 281 287 296 306 323 346

3 6-9 279 284 294 303 321 343

4 10-19 277 280 292 299 319 339

5 20-35 275 277 290 296 317 336

6 36-49 274 274 289 293 316 333

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

(Min)

Cool Medium Warm

X Y X Y X Y

271 270 286 289 313 329

** INX, AUO, Sharp , CSOT Models (Cool Mo de Spec :

13000K)

▪ Sta nd ar d co lor co ordinate an d t em pe ra ture u sing

CA-210(CH-14) – by aging time

cool med warm

x y x y x y

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

5.2. Option selection per country

5.2.1. Overview

(1) Tool option selection is only done for models in Non-USA

North America due to rating

(2) Applied model: LA43B/M Chassis applied to CANADA and

MEXICO

5.2.2. Country Group selection

(1) Press ADJ key on the Adj. R/C, and then select Country

Group Menu

(2) Depending on destination, select US, then on the lower

Country option, select US, CA, MX.

Selection is done using +, - KEY

** (Agin g chamber) LGD Cell (LB5xxx, LB6 xxx, LB7x xx,

LB8xxx)

▪ S ta ndard co lor c oor di nate a nd te mpe ra ture usi ng

CA-210(CH-14) – by aging time

** (normal line) LGD Cell (LB5xxx, LB6xxx, LB7xxx, LB8xxx) ** Gumi winter season (Jan ~ Feb) & Global, except Cinema

Screen models

▪ Sta nd ar d co lor co ordinate an d t em pe ra ture u sing

CA-210(CH-14) – by aging time

Aging time

GP4

1 0-2 286 295 301 314 328 354

2 3-5 284 290 299 309 326 349

3 6-9 282 287 297 306 324 346

4 10-19 279 283 294 302 321 342

5 20-35 276 278 291 297 318 337

6 36-49 274 275 289 294 316 334

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

(Min)

Cool Medium Warm

X Y X Y X Y

271 270 286 289 313 329

5.2.3. Tool Option inspection

▪ Press Adj. key on the Adj. R/C, then select Tool option

Model Module Tool 1 Tool 2 Tool 3 Tool 4 Tool 5 Tool 6

60LB6000-

Ux.A

60LB6000-

Ux.K/S

55LB6000-UxPola

50LB6000-UxPola

47LB6000-UxPola

42LB6200-UGPola

* Tool option can be reconstructed by Software

Pola

(Sharp)

Pola

(Sharp)

(LGD)

(INX)

(LGD)

22571 2473 11009 30532 27650 2440

22571 2473 11009 30532 27650 2312

42 2473 11009 30532 31746 2312

41 2473 11009 30532 31746 2312

2089 2473 11009 30532 27650 2311

40 2473 11009 30532 31746 2311

55 2473 27393 63300 23554 2311

Only for training and service purposes

- 13 -

5.3. 3D Module inspection

5.3.1. Test equipment

(1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4

support)

(2) Pattern: HDMI mode (model No. 872, pattern No. 83)

5.3.2. Test method

(1) Start 3D pattern inspection

Fig.1 <model No. 872, pattern No. 83>

(2) check the 3D patterm with 3D FPR Glasses or L/R Film.

6. GND and HI-POT Test

6.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

6.2. GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX) (5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process

automatically.

6.3. Checkpoint

(1) Test voltage

- GND: 1.5KV/min at 100mA

- SIGNAL: 3KV/min at 100mA (2) TEST time: 1 second (3) TEST POINT

- GND Test = POWER CORD GND and SIGNAL CABLE GND.

- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms

(3) If 3D Module is correctly worked, The 3D FPR Glasses is

change Color.

Left is Red. Right is Blue

5.4. Ship-out mode check (In-stop)

After final inspection, press In-Stop key of the Adj. R/C and check that the unit goes to Stand-by mode

7. AUDIO output check

7.1. Audio input condition

(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation (2) CVBS, Component: 1KHz sine wave signal (0.4Vrms) (3) RGB PC: 1KHz sine wave signal (0.7Vrms)

7.2. Specification

No Item Min Typ Max Unit Remark

1 Audio practi-

cal max Output, L/R (Distortion=10% max Output)

2 Audio practi-

cal max Output, L/R (Distortion=10% max Output)

9.0

8.5

9.0

8.5

10.0

8.9

10.0

8.9

12.0

9.9WVrms

12.0

9.9WVrms

(1) Measurement

condition

- EQ/AVL/Clear Voice: Off

(2) Speaker (8Ω

Impedance)

(3) 60LB6000-UH

(1) Measurement

condition

- EQ/AVL/Clear Voice: Off

(2) Speaker (8Ω

Impedance)

(3)

Only for training and service purposes

- 14 -

8. USB S/W Download (optional, Service only)

(1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick

- If your downloaded program version in USB Stick is lower than that of TV set, it didn’t work. Otherwise USB data is automatically detected.

(3) Show the message “Copying files from memory”

(4) Updating is staring.

(5) Updating Completed, The TV will restart automatically (6) If your TV is turned on, check your updated version and

Tool option.

* If downloading version is more high than your TV have, TV

can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ ATV test on production line.

* After downloading, TOOL OPTION setting is needed again. (1) Push "IN-START" key in service remote controller. (2) Select "Tool Option 1" and Push “OK” button. (3) Punch in the number. (Each model has their number.)

Only for training and service purposes

- 15 -

Check stand-by Voltage.

P401 3, 5, 6pin : +3.5V_ST

Check Power c onnector

Main B/D 3.5V Line

Short Check

Check X101 clock

24 MHz

Replace X101

Check P401 PWR_ON.

1pin : 3.3V

Replace Mstar(IC101) or Main b oard

Check Multi Vo ltage

P401 9pin:24V ,13pin:12V

Replace Power Board

Check Inverter Control

P401 2 pin : High

Check Power Board or Module

Check IC403/4 Output Voltage

IC403 : 1.15V / IC404 : 1.5V

Q406 : 3.3V

Replace IC403/4, Q406

Re-download software.(IC102, IC1300)

Check Micom Voltage

L206 : +3.3V (AVDD_NODIE)

Replace L206

Check LVDS Power Voltag e

Q405 : 12V

Replace Q405

Check Mstar LVDS Output

Replace Mstar(IC101) or Main Board

Change Mod ule

ok

okNo

No

ok

Replace Power board.

ok

No

1. Power-up boot check

TROUBLE SHOOTING

Only for training and service purposes

- 16 -

2. Digital / Analog TV Video

Check RF Cable & Signal

Check Tuner 3.3V Power

L1600

Replace L1600

Check IF_P/N Signal

TU1601 6/7 Pin

Check Mstar LVDS Output

Replace Mstar(IC101) or Main Board.

ok

No

Bad Tuner. Replace Tuner.

Check input signal format.

Is it suppo rted?

Check AV Cable f or damage

for damage or open cond uctor

Check JK1702, CVBS Signal Line

R1707

ok

No

Replace Jack

ok

Check CVBS_DET Signal

R1713

Replace R1713 or R1710

No

Check Mstar LVDS Output

Replace Mstar(IC101) or Main Board.

No

Check input signal format.

Is it suppo rted?

Check Compo nent Cable

for damage or open cond uctor.

Check JK1702

Y/PB/PR signal Line

ok

No

Replace Jack

Check COMP_DET Signal

Replace R1709 or R1712

No

Check Mstar LVDS Output

Replace Mstar(IC101) or Main Board.

ok

No

3. AV Video

4. Component Video

Only for training and service purposes

- 17 -

5. HDMI Video

Check input signal format.

Is it suppo rted?

Check HDMI Cable c onductors for damage or open cond uctor.

Check EDID

R810,R811,R815,R816 I2C Signal

Check JK800, JK801

ok

No

Re-download EDID data

ok

Replace Jack

Check HDMI Signal

Check other set If no problem, check sig nal line

No

Check Mstar LVDS Output

Replace Mstar(IC101) or Main Board.

ok

No

Replace Main Board

No

Check HDMI_DET(HPD)

No

ok

Replace R809, R814

Only for training and service purposes

- 18 -

Check the TV Speaker Menu

(Menu -> Audio -> Sound Out -> TV Speaker)

On

ok

Check Output Signal P5600

1, 2, 3, 4 pin.

Replace Audio AMP IC(IC5600)

ok

No

Check Connector & P5600

Replace connector if f ound to be damaged.

ok

No

Check speaker resistance

and connector damage.

Replace speaker.

ok

No

Off

Toggle the Menu

Check AMP IC(IC5600) Power

24V, 3.3V

No

Replace Amp IC(IC5600)

Check Mstar I2S Output

IC5600 20,21,22 Pin

No

Check signal line. Or replace Mstar(IC101)

Check Mstar AUDIO_MASTER_CLK

IC5600 15 Pin

No

Replace Mstar(IC101) or Main Board.

ok

Check AMP I2C Line

IC5600 23,24 Pin

No

Check signal line. Or replace Mstar(IC101)

6. All Source Audio

Only for training and service purposes

- 19 -

7. Digital / Analog TV Audio

Check RF Cable & Signal

Follo w procedure

‘6. All source audio’

trouble shoo ting guid e.

ok

Check Tuner 3.3V Power

L1600

Replace L1600

Check IF_P/N Signal

TU1601 6/7 Pin

ok

No

Bad Tuner. Replace Tuner.

Check AV Cable f or damage

for damage or open cond uctor

Check JK1702 Signal Line

R1714,R1715

ok

No

Replace Jack

Follo w procedure

‘7. All source audio’

trouble shoo ting guid e.

8. AV/Comp Audio

Only for training and service purposes

- 20 -

1. 2D Model

(P1101)

30P HD LVDS wafer

51P FHD LVDS wafer

(P1100)

COMP2_L /R_IN

COMP2_Y+/ AV_CVB S_IN, COMP2_Pb +/Pr +

CK+/ -, D0+/-, D1+/-, D2+/-_H DMI2

DDC _SCL/SDA_2, HD MI_CEC

Serial Flash

(8Mbit)

IC1300

SPI_SCK /SDI/SD O/CS

System EEPROM

(256Kbit)

IC104

I2C_SC L/SDA

NAND FLASH

(1Gbit)

IC102

PCM_A[0-7],…

< FHD >

RXA0+/-~RXA4+/-, RXACK+/-

RXB0+/ -~RXB4+/-, RXB CK+/-

SPK_R

SPK_L

AMP_SCL/ SDA

AUD_MASTER _CLK,

AUD_LR CH,

AUD_LR CK, AUD_SCK

TAS5733

(IC5600)

Main SOC

M1A -256MB

(IC101)

Connector

(P600)

KEY1/2, LED_R , IR

REAR

HDM I1

(JK801)

TU_SC L / SDA

SIF

D_IF

CVBS

Comp 1 & AV1

(JK1701)

SPDIF _OUT

SPDIF (Optic)

(JK1001)

SIDE

USB

(JK700)

HDM I2(MHL)

(JK803)

CK+/-, D0+/-, D1+/-, D2+/-, _HDMI 4, DDC_SC L/SDA_4, HDM I_CEC

SIDE_U SB_DM/DP

USB1_OCD /CTL

TPS65282

+5V_USB

MHL_C D_SENSE

HP_L/R OUT, SIDE_HP_MU TE

Headphone

(JK1500)

< HD >

RXA0+/-~RXA3+/-, RXACK+/-

BLOCK DIAGRAM

Only for training and service purposes

- 21 -

2. 3D Model

(P1101)

30P HD LVDS wafer

51P FHD LVDS wafer

(P1100)

COMP2_L /R_IN

COMP2_Y+/ AV_CVB S_IN, COMP2_Pb +/Pr +

CK+/ -, D0+/-, D1+/-, D2+/-_H DMI2

DDC _SCL/SDA_2, HD MI_CEC

Serial Flash

(8Mbit)

IC1300

SPI_SCK /SDI/SD O/CS

System EEPROM

(256Kbit)

IC104

I2C_SC L/SDA

NAND FLASH

(1Gbit)

IC102

PCM_A[0-7],…

< FHD >

RXA0+/-~RXA4+/-, RXACK+/-

RXB0+/ -~RXB4+/-, RXB CK+/-

SPK_R

SPK_L

AMP_SCL/ SDA

AUD_MASTER _CLK,

AUD_LR CH,

AUD_LR CK, AUD_SCK

TAS5733

(IC5600)

Main SOC

M1A -128MB 내장

(IC101)

Connector

(P600)

KEY1/2, LED_R , IR

REAR

HDM I1

(JK801)

TU_SC L / SDA

SIF

D_IF

CVBS

Comp 1 & AV1

(JK1701)

SPDIF _OUT

SPDIF (Optic)

(JK1001)

SIDE

USB

(JK700)

HDM I2(MHL)

(JK803)

CK+/-, D0+/-, D1+/-, D2+/-, _HDMI 4, DDC_SCL/ SDA_4, HDMI _CEC

SIDE_U SB_DM/DP

USB1_OCD /CTL

TPS65282

+5V_USB

MHL_C D_SENSE

HP_L/R OUT, SIDE_HP_MU TE

Headphone

(JK1500)

< HD >

RXA0+/-~RXA3+/-, RXACK+/-

DDR3 SDRAM

(1Gbit)

IC1201

B-MD QL[0-7], B-MDQU [0-7],…

DDR CLK (Max) : 792 MHz

Only for training and service purposes

- 22 -

3. I2C Map

HW_I2C

SW_I2C

TUNER

AMP

DEMOD

LNB

EEPROM

Digital_Eye

HW I2C 4ea + SW I2C 1ea

HW_I2C

I2C_SC(D)KM3/I2C_DDCR_CK/GPIO76/(77)

SCK(D)M0/GPIO58(59)

I2C_SC(D)KM1/GPIO80(81)

GPIO159(160)

SDAM2/GPIO55(56)

HW_I2C

URSA

VCOM

Only for training and service purposes

- 23 -

400

410

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

900

521

350

540

121

530

LV1

820

120

A10

Set + Stand

A2

200

Only for training and service purposes

- 24 -

TP for NON-EU models(except EU and China)

LGE Internal Use Only

TP for CI slot

/PCM_REG

/PCM_OE

/PCM_WE

/PCM_IORD PCM_A[11]

/PCM_IOWR CI_TS_DATA[1]

/PCM_CE

/PCM_IRQA

/PCM_CD

/PCM_WAIT

PCM_RST

PCM_5V_CTL

/CI_DET

TP for S2

PCM_D[0]

PCM_D[2]

PCM_D[3]

PCM_D[4]

PCM_D[5]

PCM_D[6]

PCM_D[7]

PCM_A[8]

PCM_A[9]

PCM_A[10]

PCM_A[12]

PCM_A[13]

PCM_A[14]

TP for FE_TS_DATA

CI_TS_CLK

CI_TS_VAL

CI_TS_SYNC

CI_TS_DATA[0]

CI_TS_DATA[2]

CI_TS_DATA[3]

CI_TS_DATA[4]

CI_TS_DATA[5]

CI_TS_DATA[6]

CI_TS_DATA[7]

TP for SCART

SCART1_MUTE

SC1_IDPCM_D[1]

SC1_FB

DTV/MNT_VOUT

SCART1_Lout

SCART1_Rout

SC1_R+/COMP1_Pr+

SC1_G+/COMP1_Y+

SC1_B+/COMP1_Pb+

SC1/COMP1_DET

SC1/COMP1_L_IN

SC1/COMP1_R_IN

TP for Headphone

HP_LOUT

HP_ROUT

SIDE_HP_MUTE

HP_DET

FE_TS_DATA[1]

FE_TS_DATA[2]

FE_TS_DATA[3]

FE_TS_DATA[4]

FE_TS_DATA[5]

FE_TS_DATA[6]

FE_TS_DATA[7]

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC5_L14

TP_NON_EN

2013.05.09 3

L14 POWER BLOCK (POWER DETECT 2)

LGE Internal Use Only

FROM LIPS or POWER B/D

+3.5V_ST

OPT

R400

10K

R402

R401

10K

C407 10uF

2012

10V

10K

+3.5V_POWER_DET

L400

CB2012PK501T

C400

1005

+24V_CAP

C432

4.7uF

3216

+12V_CAP

C433

4.7uF

3216

RL_ON

+3.5V_ST

+24V

+12V

+3.5V_ST

Q401

MMBT3906(NXP)

3

1

R406 10K

R404

4.7K

C

Q400 MMBT3904(NXP)

B

E

1uF

ZD400

10V

5V

OPT

C401

0.1uF 50V

50V

C402

0.1uF

16V

2

R455

OPT

R456

0

CB2012PK501T

MLB-201209-0120P-N2

0

L401

L402

L403

ZD404

+1.5V_DDR

+3.3V_Normal

L409

BLM18PG121SN1D

10uF

C426

10V

AZ1117EH-ADJTRG1

1.3A

OPT

R412

33K

+3.3V_Normal

R420

1K

5V

PWR ON

3.5V

3.5V GND 24V GND 12V 12V GND

P401

SMAW200-H18S5

1 3 5 7

10

9 11

12

13

14

15

16

17

18

19

.

DRV ON

2

PDIM#1

4

3.5V

6

PDMI#2

8

24V GND 12V NC GND

R419 100

PWM_DIM_PULL_DOWN

Vout=1.25*(1+R2/R1)+Iadj*R2

+1.5V_DDR

IC404

ADJ/GND

OUTIN

R449 1K 1/16W 1%

R450 200 1/16W 1%

R1

R2

L411

CB2012PK501T

R453

0

C431 10uF

10V

ZD403

2.5V

C

B

E

Q402

MMBT3904(NXP)

R424

3.9K

+3.5V_ST

R426

10K

R425 10K

PWM2_2CH_POWER

R423

100

OPT R467 1K

INV_CTL

PWM_DIM

PWM1

C415

0.1uF

C413

0.1uF

R457

8.2K

16V

OPT

16V

+24V

OPT

1%

R427

R428

5.1K

R430

2.7K

R431

1.2K

OPT

27K

1%

OPT

1%

+12V

+24V

+3.5V_POWER_DET

OPT

R432

0

5%

+3.5V_POWER_DET

OPT

R458

0

5%

Ready - Dual Power Det

* Notice

- Applying all inch models for LCD L14

- Dual Power Det is used for detecting two kinds of voltage

+1.10V_VDDC

ZD401

2.5V

+3.5V_ST

OPT

C424

0.1uF 16V

C437

0.1uF

CB2012PK501T

OPT C436 10uF

10V

16V

C420

C421

22uF

10V

RESET_IC_ROHM

BD48K28G

VDD

3

BD48K28G

VDD

3

L406

C423

50V

270pF

R435 100K

IC401

OPT

R436

100K

OPT

IC402

C414 10uF

10V

2

1

GND

2

1

GND

0.1uF

R43 9

20K

1%

R44 0

47K

1%

PD_+3.5V

R454-*1 300

5%

PD_+12V

R454

VOUT

100 5%

POWER_DET_RESET

OPT

R437

100 5%

Detect Valtage

Power Detect +3.5V

Power Detect +12V

Power Detect +24V

C435

16V

C417

L407

0.1uF

3.6uH 16V

R1

R2

+3.5V_ST

OPT

R438

4.7K

C422

0.1uF

Power_DET

POWER_DET

VCC

Power Detect activity

Now is

Use Circuit Designator

R432, R454-*1, R438

O R430, R431, R454

R457, R454

IC403

TPS5432DDAR

BOOT

VIN

PH

GND

1

2

3

4

3A

9

THERMAL

8

7

6

5

[EP]GND

SS

EN

COMP

VSENSE

C418

0.01uF

R433

2.7K

C419

0.039uF 50V

1%

Vout=0.808*(1+R1/R2)

RESET_IC_DIODES IC401-*1

APX803D29

3

2

1

GND

OPT

IC402-*1

APX803D29

3

2

1

GND

+3.3V_Normal

R429

10K

C416

0.33uF 16V

C434

390pF

50V

RESET

PANEL_VCC

PANEL_CTL

+3.3V_Normal

POWER_ON/OFF_1

L408

UBW2012-121F

120OHM

OPT

C425

0.1uF 25V

R441

10K

+3.5V_ST

R443

10K

R444 10K

+12V

B

R447 22K

R448

2.2K

R442

10K

C

Q404 MMBT3904(NXP)

E

C428

2.2uF 10V

R445

R446 12K

B

33K

C427 10uF

16V

C

Q403 MMBT3904(NXP)

E

FET_2.5V_DIODE

Q406-*1 DMP2130L

S

FET_2.5V_AOS

Q406

AO3435

S

FET_NXP Q405-*1 PMV48XP

D

S

G

FET_Diode

Q405

DMP2130L

S

G

FET_NXP Q406-*2 PMV48XP

D

S

G

BLM18PG121SN1D

D

C429

G

0.1uF 16V

PANEL_VCC

D

R451

R452

5.6K

D

+3.3V_Normal

G

L410

C430

ZD402

22uF

5V

10V

+5V_Normal & +5V_USB with OCP

C403

100pF

50V

R408

OPT R405

4.7K

/VBUS_EN

(Active Low)

MHL_OCP_EN

(Active High)

+3.3V_Normal

MHL_SW_TR

R461

10K

MHL_SW_TR

R462

10K

Q407

B

R463

2.7K

C

MHL_SW_TR

E

MHL_SW_TR

Q409

MHL_SW_TR R464

10K

MHL_SW_TR

Q408

E

B

R465

10K

B

+3.3V_Normal

OPT R403

4.7K

MHL_5V_EN

USB1_CTL

C

MHL_5V_EN

R466 20K

C

E

R410

OPT

100K

C404

4700pF

50V

OPT

R459

0

+3.3V_Normal

R407

10K

R409

10K

COMP

ROSC

EN_SW2

EN_SW1

[EP]GND

V7V

EN

1

2

SS

3

4

TPS65282REGR

5

6

FAULT2

+12V

C405 10uF

PGOOD

23

24

THERMAL

25

IC400

4A

7

8

FAULT1

SW_OUT2

USB1_OCD

/MHL_OCP_DET

VIN_122VIN_2

9

RLIM11AGND

C406 10uF 16V

21

10

R415 15K

5%

R416 100K

PGND_1

PGND_2

19

20

12

SW_OUT1

MBR230LSFT1G

OPT

C411 82pF 50V

+5V_Normal

C412 22uF 16V

C409

L405

0.047uF

4.7uH

25V

BST

18

LX_2

17

LX_1

16

FB

15

SW_IN_2

14

SW_IN_1

13

+5V_USB

5V_HDMI_4

D401

30V

C408 10uF

10V

C410 10uF

10V

AVDD5V_MHL

R418

10

R422

3.3K

R421

18K

R1 R2

1%

Vout=0.8*(1+R1/R2)

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_M1A

Power_PD2

131123

4

USB 3216 CAP(SIDE)

LGE Internal Use Only

+5V_USB

JK700

1234

USB DOWN STR EAM

3AU 04S-3 05-Z C-(LG )

5

OPT C701

5pF 50V

OPT C702

5pF 50V

ZD700 SD05 5V OPT

C700 22uF 16V

OPT D700 RCLAMP0502BA

C703 22uF 16V

16V

C704 22uF

SIDE_USB1_DM

SIDE_USB1_DP

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_M1A

USB_S1

13/11/16

66

HDMI (REAR 1 / SIDE 1 MHL)

LGE Internal Use Only

HDMI_1

SHIELD

20

19

18

17

16

15

14

13

12

11

CK+

10

EAG59023302

JK800

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

5V_HDMI_2

R803

1K

R802

1.8K

VA800

ESD_HDMI1_VARISTOR

5V_DET_HDMI_2

R805

3.3K

VA801

ESD_HDMI1_VARISTOR

VA800-*1 1uF 10V

ESD_HDMI1_CAP

VA801-*1 1uF 10V

ESD_HDMI1_CAP

VA802

ESD_HDMI1

MMBT3904(NXP)

Q800

C

E

VA803

ESD_HDMI1

R808

10K

B

R809

10K

R810 100

R811 100

VA804

ESD_HDMI1

D803

1 2 3 4 5

ESD_HDMI1_IP4294

IP4294CZ10-TBR

D804

1 2 3 4 5

ESD_HDMI1_IP4294

IP4294CZ10-TBR

10 9 8 7 6

HPD2

DDC_SDA_2

DDC_SCL_2

HDMI_ARC HDMI_CEC

CK-_HDMI2

CK+_HDMI2

D0-_HDMI2

D0+_HDMI2

D1-_HDMI2

D1+_HDMI2

D2-_HDMI2

D2+_HDMI2

HDMI_2 MHL

VA805

ESD_HDMI2

GND

20

HP_DET

19

5V

18

GND

17

DDC_DATA

16

DDC_CLK

15

NC

14

CE_REMOTE

13

CK-

12

CK_GND

11

CK+

10

BODY_SHIELD

20

19

HOT_PLUG_DETECT

18

VDD[+5V]

17

DDC/CEC_GND

16

SDA

15

SCL

14

RESERVED

13

CEC

12

TMDS_CLK-

11

TMDS_CLK_SHIELD

10

TMDS_CLK+

9

TMDS_DATA0-

8

TMDS_DATA0_SHIELD

7

TMDS_DATA0+

6

TMDS_DATA1-

5

TMDS_DATA1_SHIELD

4

TMDS_DATA1+

3

TMDS_DATA2-

2

TMDS_DATA2_SHIELD

1

TMDS_DATA2+

JK801-*1 DAADR019A

HDMI-2_EMI_FOOSUNG

EAG62611204

JK801

HDMI-2

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

5V_HDMI_4

R812

1.8K

HDMI-2

5V_DET_HDMI_4

ESD_HDMI2

VA806

R813

3.3K HDMI-2

VA807

5.6V OPT

ESD_HDMI2 VA808

ESD_HDMI2

VA809

HDMI-2

R814

33

HDMI-2

R815 100

R816 100

HDMI-2

VA810

ESD_HDMI2

VA811

ESD_HDMI2

1 2 3 4 5

ESD_HDMI2_IP4294

IP4294CZ10-TBR

1 2 3 4 5

ESD_HDMI2_IP4294

IP4294CZ10-TBR

C800

0.047uF 25V

HDMI-2

D805

D806

10 9 8 7 6

R817 300K

MHL Spec

HDMI-2

HPD4

DDC_SDA_4

DDC_SCL_4

HDMI_CEC

CK-_HDMI4

CK+_HDMI4

D0-_HDMI4

D0+_HDMI4

D1-_HDMI4

D1+_HDMI4

D2-_HDMI4

D2+_HDMI4

MHL_CD_SENSE

CEC

R804

A2CA1

MMBD6100 D800

100

DDC_SDA_2

DDC_SCL_2

CEC_REMOTE_S7

5V_HDMI_4

R806

2.7K

+5V_Normal

A2CA1

MMBD6100 D801

R807

2.7K

+3.5V_ST

DDC_SDA_4

DDC_SCL_4

A2CA1

MMBD6100 D802

HDMI_CEC

5V_HDMI_2

R800

2.7K

+5V_Normal

R801

2.7K

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

D803-*1

TMDS_CH1-

1

2

GND_1

3

4

5

D803-*2

1 2 3 4 5

10

9

8

7

6

10 9 8 7 6

TMDS_CH1+

TMDS_CH2-

TMDS_CH2+

ESD_HDMI1_IP4283

IP4283CZ10-TBA

ESD_HDMI1_SEMTECH

RCLAMP0524PA

NC_4

NC_3

GND_2

NC_2

NC_1

D804-*1

TMDS_CH1-

1

2

GND_1

3

4

5

D804-*2

1 2 3 4 5

10

10 9 8 7 6

TMDS_CH1+

TMDS_CH2-

TMDS_CH2+

ESD_HDMI1_IP4283

IP4283CZ10-TBA

ESD_HDMI1_SEMTECH

RCLAMP0524PA

D805-*1

NC_4

NC_3

9

GND_2

8

NC_2

7

NC_1

6

TMDS_CH1-

1

2

GND_1

3

4

5

D805-*2

1 2 3 4 5

10

10 9 8 7 6

TMDS_CH1+

TMDS_CH2-

TMDS_CH2+

ESD_HDMI2_IP4283

IP4283CZ10-TBA

ESD_HDMI2_SEMTECH

RCLAMP0524PA

NC_4

NC_3

9

GND_2

8

NC_2

7

NC_1

6

D806-*1

TMDS_CH1-

1

TMDS_CH1+

2

GND_1

3

TMDS_CH2-

4

TMDS_CH2+

5

ESD_HDMI2_IP4283

IP4283CZ10-TBA

D806-*2

1 2 3 4 5

ESD_HDMI2_SEMTECH

RCLAMP0524PA

L14_M1A

NC_4

10

NC_3

9

GND_2

8

NC_2

7

NC_1

6

10 9 8 7 6

2013/08/15

HDMI_R1_S1 8

SPDIF

LGE Internal Use Only

SPDIF OPTIC JACK

5.15 Mstar Circuit Application

SPDIF_OUT

+3.3V_Normal

C1001

1uF

OPT

10V

ESD Ready

SPDIF_CAP_47pF C1002 47pF 50V

SPDIF_CAP_18pF C1002-*1 18pF 50V

VINPUT

SPDIF_OPTIC JST1223-001

GND

VCC

JK1001

1

2

3

Fiber Optic

4

FIX_POLE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC5_L14

SPDIF

2013/10/29

10

LVDS (NON EU)

LGE Internal Use Only

[51Pin LVDS Connector] (For FHD 60Hz)

MO_FHD

P1100

FI-RE51S-HF-J-R1500

.

1

.

2

.

3

.

4

.

5

.

6

.

7

.

8

.

9

.

10

.

11

RXA0-

12

RXA0+

13

RXA1-

14

RXA1+

15

RXA2-

16

RXA2+

17

.

18

RXACK-

19

RXACK+

20

.

21

RXA3-

22

RXA3+

23

RXA4-

24

RXA4+

25

.

26

.

27

RXB0-

28

RXB0+

29

RXB1-

30

RXB1+

31

RXB2-

32

RXB2+

33

.

34

RXBCK-

35

RXBCK-

36

.

37

RXB3-

38

RXB3+

39

RXB4-

40

RXB4+

41

.

42

.

43

.

44

.

45

.

46

.

47

.

48

.

49

.

50

.

51

52

.

VCOM_SDA

VCOM_SCL

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2-

RXB1+

RXB1-

RXB0+

RXB0-

R1100 0

MO_FHD

R1101 0

R1102 0

MO_FHD

LVDS_SEL

+3.3V_Normal

OPT R1103

3.3K

OPT R1104

10K

PANEL_VCC

MO_FHD

L1100 120OHM UBW2012-121F

MO_FHD

C1100

0.1uF 16V

FOR FHD REVERSE(10bit) Change in S7LR

MIRROR

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2- RXBCK-

RXB1+

RXB1-

RXB0+

RXB0-

Pol-change

RXA0+

RXA0-

RXA1+

RXA1-

RXA2+

RXA2-

RXACK+

RXACK-

RXA3+

RXA3-

RXA4+

RXA4-

RXB0+

RXB0-

RXB1+

RXB1-

RXB2+

RXB2-

RXBCK+

RXB3+

RXB3-

RXB4+

RXB4-

FOR FHD REVERSE(8bit) Change in S7LR

RXA4+

RXA4-

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+

RXBCK-

RXB2+

RXB2-

RXB1+

RXB1-

RXB0+

RXB0-

MIRROR

Pol-change

RXA4+

RXA4-

RXA0+

RXA0-

RXA1+

RXA1-

RXA2+

RXA2-

RXACK+

RXACK-

RXA3+

RXA3-

RXB4+

RXB4-

RXB0+

RXB0-

RXB1+

RXB1-

RXB2+

RXB2-

RXBCK+

RXBCK-

RXB3+

RXB3-

RXA0-

RXA0+

RXA1-

RXA1+

RXA2-

RXA2+

RXACK-

RXACK+

RXA3-

RXA3+

RXA4-

RXA4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXB4-

RXB4+

Shift

RXA4-

RXA4+

RXA0-

RXA0+

RXA1-

RXA1+

RXA2- RXACK-

RXA2+

RXACK-

RXACK+

RXA3-

RXA3+

RXB4-

RXB4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXA0-

RXA0+

RXA1-

RXA1+

RXA2-

RXA2+

RXACK+

RXA3-

RXA3+

RXA4-

RXA4+

RXB0-

RXB0+

RXB1-

RXB1+

RXB2-

RXB2+

RXBCK-

RXBCK+

RXB3-

RXB3+

RXB4-

RXB4+

[30Pin LVDS Connector] (For HD 60Hz_Normal)

MO_HD P1101

10031HR-30

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

VCOM_SCL

VCOM_SDA

LVDS_SEL

+3.3V_Normal

OPT R1109

3.3K

OPT R1110 10K

EU pin assign is different from NON EU. Because of position of HD wafer.

V-COM I2C

+3.3V_Normal

VCOM_I2C_PULL_UP

R1115 2K

URSA/VCOM_SCL

URSA/VCOM_SDA

VCOM_SCL

VCOM_SDA

VCOM_I2C_PULL_UP

R1114

VCOM_I2C

R1105

0

R1106

0

VCOM_I2C

2K

PANEL_VCC

120OHM

MO_HD

MO_HD L1101

UBW2012-121F

C1101

0.1uF 16V

URSA/VCOM_SCL

URSA/VCOM_SDA

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_S7LR(M1A)

LVDS_NON_EU

2013/05/22

11

R12011K1%

LGE Internal Use Only

DDR_EXT

R1202 1K1%

DDR_EXT

C1201 0.1uF

DDR_EXT

C1202 1000pF

A-MVREFDQ

+1.5V_DDR+1.5V_DDR

DDR_EXT

R1204 1K1%

DDR_EXT

R1205 1K1%

DDR_EXT

C1213 0.1uF

1000pF

DDR_EXT

C1214

A-MVREFCA

Option : Ripple Check !!!

+1.5V_DDR

C1217

C1216

10uF 10V

OPT

0.1uF

C1218

OPT

0.1uF

C1219

OPT

+1.5V_DDR

1uF

C1222

OPT

C1223

OPT

1uF

0.1uF

C1224

OPT

C1220

OPT

C1221

OPT

CLose to DDR3

DDR_1600_1G_SS

IC1201-*1

K4B1G1646G-BCK0

EAN61836301

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

M7

NC_5

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

CLose to Saturn7M IC

DDR_1600_1G_HYNIX

IC1201

DDR_1600_2G_HYNIX_OLD

IC1201-*2

H5TQ2G63DFR-PBC

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

N3 P7 P3 N2 P8 P2 R8 R2 T8 R3 L7 R7 N7 T3

M7

M2 N8 M3

J7 K7 K9

L2 K1 J3 K3 L3

T2

F3 G3

C7 B7

E7 D3

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

EAN61829203

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12/BC A13

NC_5

BA0 BA1 BA2

CK CK CKE

CS ODT RAS CAS WE

RESET

DQSL DQSL

DQSU DQSU

DML DMU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

VREFCA

VREFDQ

ZQ

VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9

VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9

NC_1 NC_2 NC_3 NC_4 NC_6

VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8

VSS_9 VSS_10 VSS_11 VSS_12

VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9

M8

H1

L8

B2 D9 G7 K2 K8 N1 N9 R1 R9

A1 A8 C1 C9 D2 E9 F1 H2 H9

J1 J9 L1 L9 T7

A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9

B1 B9 D1 D8 E2 E8 F9 G1 G9

DDR_1600_2G_HYNIX_NEW

IC1201-*3

H5TQ2G63FFR-PBC

EAN61829204

N3

VREFCA

A0

P7

A1

P3

A2

N2

A3

VREFDQ

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7 R7 N7 T3

M7

M2 N8 M3

J7 K7 K9

L2 K1 J3 K3 L3

T2

F3 G3

C7 B7

E7 D3

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

VDD_1

A10/AP

VDD_2

A11

VDD_3

A12/BC

VDD_4 VDD_5

A13

VDD_6 VDD_7

NC_5

VDD_8 VDD_9

BA0 BA1 BA2

VDDQ_1 VDDQ_2

CK

VDDQ_3

CK

VDDQ_4

CKE

VDDQ_5 VDDQ_6

CS

VDDQ_7

ODT

VDDQ_8

RAS

VDDQ_9

CAS WE

NC_1 NC_2

RESET

NC_3 NC_4 NC_6

DQSL DQSL

VSS_1

DQSU

VSS_2

DQSU

VSS_3 VSS_4

DML

VSS_5

DMU

VSS_6 VSS_7

DQL0

VSS_8

DQL1

VSS_9

DQL2

VSS_10

DQL3

VSS_11

DQL4

VSS_12

DQL5 DQL6 DQL7

VSSQ_1 VSSQ_2

DQU0

VSSQ_3

DQU1

VSSQ_4

DQU2

VSSQ_5

DQU3

VSSQ_6

DQU4

VSSQ_7

DQU5

VSSQ_8

DQU6

VSSQ_9

DQU7

DDR_1600_2G_SS

IC1201-*4

K4B2G1646Q-BCK0

M8

H1

L8

ZQ

B2 D9 G7 K2 K8 N1 N9 R1 R9

A1 A8 C1 C9 D2 E9 F1 H2 H9

J1 J9 L1 L9 T7

A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9

B1 B9 D1 D8 E2 E8 F9 G1 G9

N3 P7 P3 N2 P8 P2 R8 R2 T8 R3 L7 R7 N7 T3

M7

M2 N8 M3

J7 K7 K9

L2 K1 J3 K3 L3

T2

F3 G3

C7 B7

E7 D3

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

EAN61848803

A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12/BC A13

NC_5

BA0 BA1 BA2

CK CK CKE

CS ODT RAS CAS WE

RESET

DQSL DQSL

DQSU DQSU

DML DMU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT DDR_EXT

+1.5V_DDR

10V

A-MVREFCA

A-MVREFDQ

DDR_EXT

C1203 10uF C1204 0.1uF C1205 0.1uF C1206 0.1uF C1207 0.1uF C1208 0.1uF C1209 0.1uF C1210 0.1uF C1211 0.1uF C1212 0.1uF

R1203

240

1%

A-MA14

H5TQ1G63EFR-PBC

EAN61829003

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

NC_6

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

A10/AP

A12/BC

NC_7

NC_5

RESET

DQSL DQSL

DQSU DQSU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7 R7

A11

N7 T3

M7

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

F3 G3

C7 B7

E7

DML

D3

DMU

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

A-MA0 A-MA1 A-MA2 A-MA3 A-MA4 A-MA5 A-MA6 A-MA7 A-MA8 A-MA9 A-MA10 A-MA11 A-MA12 A-MA13

A-MBA0 A-MBA1 A-MBA2

A-MCKE

A/B_DDR3_CS

A-MODT A-MRASB A-MCASB A-MWEB

A-MRESETB

A-MDQSL A-MDQSLB

A-MDQSU A-MDQSUB

A-MDML A-MDMU

A-MDQL0 A-MDQL1 A-MDQL2 A-MDQL3 A-MDQL4 A-MDQL5 A-MDQL6 A-MDQL7

A-MDQU0 A-MDQU1 A-MDQU2 A-MDQU3 A-MDQU4 A-MDQU5 A-MDQU6 A-MDQU7

R1207

DDR_EXT

R1208

DDR_EXT

R1206 10K

DDR_EXT

56 1%

C1215

0.01uF 50V

56 1%

+1.5V_DDR

A-MCK

A-MCKB

A-MDQSUB

A-MDQSLB

A-MDQSU

A-MDQSL

A-MA0 A-MA1 A-MA2 A-MA3 A-MA4 A-MA5 A-MA6 A-MA7 A-MA8

A-MA9 A-MA10 A-MA11 A-MA12 A-MA13 A-MA14

A-MBA0 A-MBA1 A-MBA2

A-MCK A-MCKB A-MCKE

A-MODT

A-MRASB A-MCASB

A-MWEB

A-MRESETB

A/B_DDR3_CS

A-MDML A-MDMU

A-MDQL0

A-MDQL1 A-MDQL2 A-MDQL3 A-MDQL4 A-MDQL5 A-MDQL6 A-MDQL7 A-MDQU0 A-MDQU1 A-MDQU2 A-MDQU3 A-MDQU4 A-MDQU5 A-MDQU6 A-MDQU7

R1209

240

1%

M1A_256M

IC101

LGE2132(M1A_256M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

M1A_128M IC101-*1

LGE2131(M1A_128M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC5_S7LR(M1A)

1_DDR

2013/05/20

12

Serial Flash for SPI boot

LGE Internal Use Only

/FLASH_WP

OPT R1300 10K

+3.5V_ST

/SPI_CS

SPI_SDO

OPT R1301

4.7K

SPI_FLASH_MACRONIX

IC1300

MX25L8006EM2I-12G

CS#

1

SO/SIO1

2

WP#

3

GND

4

8

7

6

5

VCC

HOLD#

SCLK

SI/SIO0

+3.5V_ST+3.5V_ST

R1302

33

C1300

0.1uF

SPI_SCK

SPI_SDI

SPI_FLASH_WINBOND

IC1300-*1

W25Q80BVSSIG

CS

1

DO[IO1]

2

%WP[IO2]

3

GND

4

8

7

6

5

VCC

HOLD[IO3]

CLK

DI[IO0]

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC5_S7LR(M1A)

S_FLASH

2013/04/29

13

GLOBAL tuner block KR & AJ

LGE Internal Use Only

TU_ATSC

TU1601 TDJH-H101F

B1[+3.3V]

1

NC_1

2

IF_AGC

3

SCL

4

SDA

5

IF[P]

6

IF[N]

7

NC_2

8

NC_3

9

+3.3V_TU

C1616

C1615

0.1uF

100pF

16V

50V

close to the tuner pin, add,09029

R1605 0 IF_NON_FILTER_KR

R1606 0 IF_NON_FILTER_KR

Close to the tuner

IF_FILTER_AJ

R1605-*1 10

IF_FILTER_AJ R1606-*1 10

C1609 18pF 50V

C1610 18pF 50V

R1607 33

R1608 33

C1611

0.1uF 16V

R1609 100

should be guarded by ground

+3.3V_TU

R1610

1.8K

TU_IIC_ATSC_1.8K

OPT

OPT C1613

C1614

20pF

50V

IF_AGC_MAIN

R1610-*1 1K TU_IIC_NON_ATSC_1K

R1611-*1 1K TU_IIC_NON_ATSC_1K

R1611

1.8K TU_IIC_ATSC_1.8K

TU_SCL

TU_SDA

+3.3V_TU

CHANGE TO

6.3V 2012 X5R

C1602 22uF

6.3V

Size change,0929

L1600

UBW2012-121F

C1603

0.1uF 16V

FE_TS_SYNC

FE_TS_VAL_ERR

FE_TS_CLK

FE_TS_DATA[0]

+3.3V_Normal

C1605 22uF

6.3V

CHANGE TO

6.3V 2012 X5R

C1607

0.1uF 16V

FE_AGC_SPEED_CTL IF_AGC_SEL

TUNER_RESET

RF_SWITCH_CTL

TU_AJ_T/C

TU1601-*1 TDJH-G101D

B1[+3.3V]

1

NC_1

2

IF_AGC

3

SCL

4

SDA

5

IF[P]

6

IF[N]

7

NC_2

8

NC_3

9

A1

47

SHIELD

B1

GND seperation for ASIS tuner

TU_GND_A

IF_P_MSTAR

IF_N_MSTAR

1. should be guarded by ground

2. No via on both of them

3. Signal Width >= 12mils Signal to Signal Width = 12mils Ground Width >= 24mils

A1

B1

47

SHIELD

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_M1A

TUNER_KR_AJ

2013/06/05

16

COMPONENT & AV1(COMMON), AV2

LGE Internal Use Only

COMP_AV1/2_YG

JK1701

PPJ248-21

[RD3]E-LUG

6C

[RD3]O-SPRING

5C

VA1706

5.6V AV2_LR_ZENER

R1700 470K AV2

C1701 330pF 50V OPT

R1716 10K

AV2

R1718 12K AV2

AV2_R_IN

AV2

COMPONENT & AV1

COMP_AV1_YG

JK1702

PPJ245N2-01

[RD2]E-LUG

6E

[RD2]O-SPRING

5E

[RD2]CONTACT

4E

[WH]O-SPRING

5D

[RD1]CONTACT

4C

[RD1]O-SPRING

5C

[RD1]E-LUG-S

7C

[RD3]CONTACT

4C

[WH2]O-SPRING

5B

[YL]CONTACT

4A

[YL]O-SPRING

5A

[YL]E-LUG

6A

[RD2]E-LUG

6H

[RD2]O-SPRING

5H

[RD2]CONTACT

4H

[WH1]O-SPRING

5G

[RD1]CONTACT

4F

[RD1]O-SPRING

5F

[RD1]E-LUG-S

7F

AV2_CVBS_ZENER_ROHM

COMP_Pr_ZENER_ROHM

ZD1701

VA1704

5.6V AV2_LR_ZENER

VA1705

5.6V OPT

ZD1706 AV2_CVBS_ZENER_ROHM

ZD1707

VA1700

5.6V COMP_LR_ZENER

VA1701

5.6V COMP_LR_ZENER

VA1702

5.6V OPT

ZD1700

COMP_Pr_ZENER_ROHM

R1703

470K

R1704 470K

+3.3V_Normal

R1709 10K

R1705 75

R1701 470K AV2

+3.3V_Normal

R1708 10K AV2

Size Check !!!

R1712

1K

R1711 1K

AV2 R1702

75

1608

1%

C1704 330pF 50V OPT

C1705 330pF 50V OPT

AV2

R1725 75

OPT

R1714 10K

R1715 10K

COMP2_DET

C1702 330pF 50V OPT

3216 1% 1/4W

R1717 10K

AV2

AV2_CVBS_DET

R1720 12K

R1721 12K

C1703 47pF 50V

AV2

R1719 12K AV2

AV2_L_IN

SC1/AV2_CVBS_IN

COMP2_R_IN

COMP2_L_IN

COMP2_Pr+

ZD1707-*1

AV2_CVBS_ZENER_KEC

ZD1701-*1

COMP_Pr_ZENER_KEC

ZD1706-*1

AV2_CVBS_ZENER_KEC

ZD1700-*1

COMP_Pr_ZENER_KEC

[BL]O-SPRING

5B

[GN/YL]CONTACT

4A

[GN/YL]O-SPRING

5A

[GN/YL]E-LUG

6A

* One Ton Color Jack - Yellow/Green

JK1702-*1

PPJ245-01

COMP_AV1_G

[RD2]E-LUG

7E

[RD2]C-SPRING

6E

[RD2]CONTACT

4E

[WH]C-SPRING

5D

[RD1]CONTACT

4C

[RD1]C-SPRING

6C

[RD1]E-LUG-S

8C

[BL]C-SPRING

5B

[GN]CONTACT

4A

[GN]C-SPRING

6A

7A

[GN]E-LUG

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

JK1701-*1

PPJ248-01

COMP_AV1/2_G

7C

6C

4C

5B

4A

6A

7A

7H

6H

4H

5G

4F

6F

8F

5E

4D

6D

7D

[RD3]E-LUG

[RD3]C-SPRING

[RD3]CONTACT

[WH2]C-SPRING

[YL]CONTACT

[YL]C-SPRING

[YL]E-LUG

[RD2]E-LUG

[RD2]C-SPRING

[RD2]CONTACT

[WH1]C-SPRING

[RD1]CONTACT

[RD1]C-SPRING

[RD1]E-LUG-S

[BL]C-SPRING

[GN]CONTACT

[GN]C-SPRING

[GN]E-LUG

[BL]O-SPRING

5E

[YL/GN]CONTACT

4D

[YL/GN]O-SPRING

5D

[YL/GN]E-LUG

6D

ZD1703

COMP_Pb_ZENER_ROHM

ZD1705

COMP_Y_ZENER_ROHM

ZD1702

COMP_Pb_ZENER_ROHM

VA1703

5.6V OPT

ZD1704 COMP_Y_ZENER_ROHM

R1706

75

+3.3V_Normal

R1707 75

1608

1%

Size Check !!!

R1710 10K

R1722 75

OPT

3216 1% 1/4W

R1713

1K

CVBS_OUT_TEST

R1723

75

CVBS_OUT_TEST

REAR_JACK_NON_EU

R1724 0

COMP2_Pb+

AV_CVBS_DET

COMP2_Y+/AV_CVBS_IN

DTV/MNT_VOUT

ZD1703-*1

COMP_Pb_ZENER_KEC

ZD1705-*1

COMP_Y_ZENER_KEC

2013.08.15L14_S7LR(M1A) 17

ZD1702-*1

COMP_Pb_ZENER_KEC

ZD1704-*1 COMP_Y_ZENER_KEC

Headphone

LGE Internal Use Only

*Option : HEAD_PHONE_EU

SIDE_HP_MUTE

OPT R3000 1K

Q3000

MMBT3904(NXP)

OPT

Close to the Main IC

HEAD_PHONE

L3000

HP_LOUT

+3.5V_ST

E

B

HP_ROUT

OPT Q3001

MMBT3906(NXP)

C

OPT

R3001

C

3.3K

B

E

5.6uH

HEAD_PHONE

L3001

5.6uH

HEAD_PHONE

C3004

4.7uF

C3005

4.7uF

10V

HEAD_PHONE

C3000 10uF 16V

HEAD_PHONE

C3001 10uF 16V

OPT

C3002 1000pF 50V

OPT

C3003 1000pF 50V

HEAD_PHONE

R3002 1K

HEAD_PHONE

R3003

1K

Q3002 MMBT3904(NXP) OPT

Q3003 MMBT3904(NXP)

OPT

C

B

E

C

B

E

B

E

Q3004 MMBT3904(NXP)

OPT

C

HP_DET

E

Q3005 MMBT3904(NXP)

OPT

C

+3.3V_Normal

HEAD_PHONE

R3004

HEAD_PHONE

R3005 10K

1K

HEAD_PHONE_6pie

JK3000

PEJ038-3B6

5GND

4L

3DETECT

1R

HEAD_PHONE_5pie

JK3000-*1

KJA-PH-0-0177 5GND

4L

3DETECT

1R

Close to the Main IC

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC5_M1A

2013.04.29

HEAD_PHONE_EU 30

RS-232C 4PIN & MSTAR DEBUG 4PIN

LGE Internal Use Only

RS-232C 4PIN

PM_TXD

PM_RXD

MSTAR DEBUG 4PIN

MSTAR_DEBUG_4P

12505WS-04A00

P4001

JP_GND2

VCC

PM_RXD

GND

RM_TXD

JP_GND3

RS232C_DEBUG_4P

P4000

12507WS-04L

1

2

3

4

5

GND

JP_GND4

+3.5V_ST

R4001 100

R4000 100

1

2

3

4

5

RGB_DDC_SCL

RGB_DDC_SDA

JP_GND1

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_S7LR(M1A)

RS232C_MSTAR_DEBUG_4P

2013/04/30

40

IR/LED + Digital Eye + Control

LGE Internal Use Only

+3.5V_ST

10K

1%

R4604

10K 1%

LED_R/BUZZ

SENSOR_SCL

SENSOR_SDA

KEY_CAP

C4602

0.1uF 16V

KEY_CAP

C4603

0.1uF 16V

C4604 100pF

+3.3V_Normal

Digital Eye

R4605

50V

1K

R4606

1.8K

VA4600

LED_R_Zener

IR_Zener

VA4601

Digital Eye

R4607 1K

R4608 100 Digital Eye

R4609 100 Digital Eye

Digital Eye C4605 18pF 50V

Digital Eye C4606 18pF 50V

P4600

12507WR-10L

1

2

3

4

5

6

7

8

9

10

11

OPT

P4601

12507WR-08L

1

2

3

4

5

6

7

8

9

R4603

R4601 100

KEY1

R4602 100

KEY2

+3.5V_ST

L4600

BLM18PG121SN1D

+3.5V_ST

R4600

3.3K

IR

C4600

0.1uF

C4601 1000pF 50V

16V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_M1A

IR_EYE_SENSOR

2013/09/03

46

/F_RB

LGE Internal Use Only

/PF_OE

/PF_CE0

/PF_CE1

PF_ALE /PF_WE /PF_WP

DIMMING

NAND FLASH MEMORY

AR103

22

AR104

22

NC_1

1

NC_2

2

NC_3

3

NC_4

4

NC_5

5

NC_6

6

R/B

7

RE

8

CE

9

NC_7

10

NC_8

11

VCC_1

12

VSS_1

13

NC_9

14

NC_10

15

CLE

16

ALE

17

WE

18

WP

19

NC_11

20

NC_12

21

NC_13

22

NC_14

23

NC_15

24

NC_1

1

NC_2

2

NC_3

3

NC_4

4

NC_5

5

NC_6

6

R/B

7

RE

8

CE

9

NC_7

10

NC_8

11

VCC_1

12

VSS_1

13

NC_9

14

NC_10

15

CLE

16

ALE

17

WE

18

WP

19

NC_11

20

NC_12

21

NC_13

22

NC_14

23

NC_15

24

PWM_DIM

EEPROM

NVRAM_ST

IC104

M24256-BRMN6TP

E0

1

E1

2

A0’h

E2

3

VSS

4

EAN61548301

R101

NAND_FLASH_2G_HYNIX_OLD

EAN60708702

IC102-*1

H27U2G8F2CTR

NAND_FLASH_2G_HYNIX_NEW

EAN60708703

IC102-*2

H27U2G8F2DTR-BD

+3.3V_Normal

3.3K

NC_29

48

NC_28

47

NC_27

46

NC_26

45

I/O7

44

I/O6

43

I/O5

42

I/O4

41

NC_25

40

NC_24

39

NC_23

38

VCC_2

37

VSS_2

36

NC_22

35

NC_21

34

NC_20

33

I/O3

32

I/O2

31

I/O1

30

I/O0

29

NC_19

28

NC_18

27

NC_17

26

NC_16

25

NC_29

48

NC_28

47

NC_27

46

NC_26

45

I/O7

44

I/O6

43

I/O5

42

I/O4

41

NC_25

40

NC_24

39

NC_23

38

VCC_2

37

VSS_2

36

NC_22

35

NC_21

34

NC_20

33

I/O3

32

I/O2

31

I/O1

30

I/O0

29

NC_19

28

NC_18

27

NC_17

26

NC_16

25

0.1uF

VCC

8

WC

7

SCL

6

SDA

5

R103

R102

R143

C105

OPT R104 1K

R105 1K

NC_1

NC_2

NC_3

NC_4

NC_5

NC_6

RY/BY

NC_7

NC_8

VCC_1

VSS_1

NC_9

NC_10

NC_11

NC_12

NC_13

NC_14

NC_15

100

10K

+3.3V_Normal

C106

C104

8pF

OPT

R106

1K

OPT

R107

1K

NAND_FLASH_1G_TOSHIBA

TC58NVG0S3HTA00

1

2

3

4

5

6

7

RE

8

CE

9

10

11

12

13

14

15

CLE

16

ALE

17

WE

18

WP

19

20

21

22

23

24

R108 22

R109 22

+3.3V_Normal

R110

3.9K

C101

0.1uF

EAN61508002

IC102-*3

PWM2

PWM0

PWM3

NC_1

NC_2

NC_3

NC_4

NC_5

NC_6

R/B

RE

CE

NC_7

NC_8

VCC_1

VSS_1

NC_9

NC_10

CLE

ALE

WE

WP

NC_11

NC_12

NC_13

NC_14

NC_15

I2C_SCL

I2C_SDA

IC102

H27U1G8F2CTR-BC

1

NAND_FLASH_1G_HYNIX

EAN35669103

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

NC_29

48

NC_28

47

NC_27

46

NC_26

45

I/O8

44

I/O7

43

I/O6

42

I/O5

41

NC_25

40

NC_24

39

NC_23

38

VCC_2

37

VSS_2

36

NC_22

35

NC_21

34

NC_20

33

I/O4

32

I/O3

31

I/O2

30

I/O1

29

NC_19

28

NC_18

27

NC_17

26

NC_16

25

I2C

NVRAM_RENESAS

IC104-*1

R1EX24256BSAS0A

A0

1

A1

2

A2

3

VSS

4

EAN62389501

NC_1

NC_2

NC_3

NC_4

NC_5

NC_6

RY/BY

RE

CE

NC_7

NC_8

VCC_1

VSS_1

NC_9

NC_10

CLE

ALE

WE

WP

NC_11

NC_12

NC_13

NC_14

NC_15

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

R1111KR112

VCC

8

WP

7

SCL

6

SDA

5

+3.3V_Normal

NC_29

48

NC_28

47

NC_27

46

NC_26

45

I/O7

44

I/O6

43

I/O5

42

I/O4

41

NC_25

40

NC_24

39

NC_23

38

VCC_2

37

VSS_2

36

NC_22

35

NC_21

34

NC_20

33

I/O3

32

I/O2

31

I/O1

30

I/O0

29

NC_19

28

NC_18

27

NC_17

26

NC_16

25

NAND_FLASH_2G_TOSHIBA

TC58NVG1S3HTA00

EAN60991002

IC102-*4

C103

0.1uF

+3.3V_Normal

R113

1K

R114

2.2K

NVRAM_ATMEL

IC104-*2

AT24C256C-SSHL-T

A0

1

A1

2

A2

3

GND

4

EAN61133501

C102 10uF

22

AR101

10V

AR102

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

8

7

6

5

NC_29

NC_28

NC_27

NC_26

I/O8

I/O7

I/O6

I/O5

NC_25

NC_24

NC_23

VCC_2

VSS_2

NC_22

NC_21

NC_20

I/O4

I/O3

I/O2

I/O1

NC_19

NC_18

NC_17

NC_16

VCC

WP

SCL

SDA

PCM_A[7]

PCM_A[6]

PCM_A[5]

PCM_A[4]

PCM_A[3]

PCM_A[2]

PCM_A[1]

PCM_A[0]

22

AMP_SDA AMP_SCL

I2C_SDA

I2C_SCL

NC_1

NC_2

NC_3

NC_4

NC_5

NC_6

R/B

RE

CE

NC_7

NC_8

VCC_1

VSS_1

NC_9

NC_10

CLE

ALE

WE

WP

NC_11

NC_12

NC_13

NC_14

NC_15

NVRAM_ROHM

IC104-*3

BR24G256FJ-3

A0

1

A1

2

A2

3

GND

4

EAN62389502

PCM_A[0-7]

NAND_FLASH_1G_SS

K9F1G08U0D-SCB0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

EAN61857001

IC102-*5

PM MODEL OPTION

VCC

8

WP

7

SCL

6

SDA

5

<CHIP Config> (SPI_SDI, PM_LED, PWM_PM)

LG-NonOS SB51_ExtSPI 3’b000 51boot from SPI LG-OS HEMCU_ExtSPI 3’b001 MIPS boot from SPI

+3.5V_ST

OPT

C112 100pF 50V

R123

56

R115 4.7K

AUD_MASTER_CLK

OPT

R117 4.7K

R121 2.7KR122 2.7K

LED_R/BUZZ

PM_LED

SPI_SDI

OPT

R118 4.7K

R116 4.7K

NAND_FLASH_4G_HYNIX

EAN61950603

IC102-*6

H27U4G8F2ETR-BC

NC_1

NC_29

48

NC_28

47

NC_27

46

NC_26

45

I/O7

44

I/O6

43

I/O5

42

I/O4

41

NC_25

40

NC_24

39

NC_23

38

VCC_2

37

VSS_2

36

NC_22

35

NC_21

34

NC_20

33

I/O3

32

I/O2

31

I/O1

30

I/O0

29

NC_19

28

NC_18

27

NC_17

26

NC_16

25

+3.5V_ST

VCC_1

VSS_1

NC_10

NC_11

NC_12

NC_13

NC_14

NC_15

R119 10K LCD

R120 10K PDP

NC_2

NC_3

NC_4

NC_5

NC_6

NC_7

NC_8

NC_9

R/B

RE

CE

CLE

ALE

WE

WP

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

PM_MODEL_OPT_0

- HIGH : LCD

- LOW :: PDP

NC_29

48

NC_28

47

NC_27

46

NC_26

45

I/O7

44

I/O6

43

I/O5

42

I/O4

41

NC_25

40

NC_24

39

NC_23

38

VCC_2

37

VSS_2

36

NC_22

35

NC_21

34

NC_20

33

I/O3

32

I/O2

31

I/O1

30

I/O0

29

NC_19

28

NC_18

27

NC_17

26

NC_16

25

AUD_MASTER_CLK_0

AA19 AA20

AA18

DEMOD_SCL DEMOD_SDA

LGE2131(M1A_128M)

Y1

GPIO78

W4

GPIO79

K17

I2C_SCKM3/I2C_DDCR_CK/GPIO77

J15

I2C_SDAM3/I2C_DDCR_DA/GPIO76

U8

SDAM2/GPIO55

T7

SCKM2/GPIO56

U7

SCKM0/GPIO58

V7

SDAM0/GPIO59

F6

I2S_IN_BCK/GPIO159

G6

I2S_IN_SD/GPIO160

AA4

I2C_SCKM1/GPIO80

Y4

I2C_SDAM1/GPIO81

J6

ET_TXD[0]/GPIO62

K6

EXT_TX_CLK/GPIO64

G7

I2S_IN_WS/GPIO158

J4

ET_COL/GPIO60

J5

ET_TXD[1]/GPIO61

H19

LCK/GPIO194

G20

LDE/GPIO195

G19

LHSYNC/GPIO196

G21

LVSYNC/GPIO197

J17

UART2_RX/GPIO69

J16

UART2_TX/GPIO70

E8

UART3_TX/GPIO52

D7

UART3_RX/GPIO53

U6

GPIO46[CTS]

V6

GPIO47[RTS]

K15

UART1_TX/GPIO48

L16

UART1_RX/GPIO49

H5

ET_TX_EN/GPIO63

K5

ET_RXD[0]/GPIO65

K4

ET_MDC/GPIO66

H6

ET_MDIO/GPIO67

L5

ET_RXD[1]/GPIO68

U17

PCMADR[0]/NF_AD[0]/GPIO130

R18

PCMADR[1]/NF_AD[1]/GPIO129

V17

PCMADR[2]/NF_AD[2]/GPIO127

R16

PCMADR[3]/NF_AD[3]/GPIO126

U16

PCMADR[4]/NF_AD[4]/GPIO104

T17

PCMADR[5]/NF_AD[5]/GPIO106

W18

PCMADR[6]/NF_AD[6]/GPIO107

U20

PCMADR[7]/NF_AD[7]/GPIO108

Y19

PCMADR[8]/GPIO113 PCMADR[9]/GPIO115 PCMADR[10]/GPIO119

W21

PCMADR[11]/GPIO117

V20

PCMADR[12]/GPIO109

Y17

PCMADR[13]/GPIO112

V18

PCMADR[14]/GPIO111

V19

PCMCD_N/GPIO135

W19

PCMCE_N/GPIO120

U18

PCMDATA[0]/GPIO131

V16

PCMDATA[1]/GPIO132

W17

PCMDATA[2]/GPIO133

Y20

PCMDATA[3]/GPIO125

R15

PCMDATA[4]/GPIO124 PCMDATA[5]/GPIO123

T15

PCMDATA[6]/GPIO122

Y21

PCMDATA[7]/GPIO121

W20

PCMIORD_N/GPIO116

V21

PCMIOWR_N/GPIO114

Y18

PCMIRQA_N/GPIO110

T16

PCMOE_N/GPIO118

R17

PCMREG_N/GPIO128

T18

PCM_RESET/GPIO134

W16

PCMWAIT_N/GPIO105

U15

PCMWE_N/GPIO198

DEMOD_SCL DEMOD_SDA

AMP_SCL AMP_SDA

MODEL_OPT_4

MODEL_OPT_5

MODEL_OPT_6

/CI_DET

IC101-*1

M1A_128M

TS0CLK/GPIO92 TS0DATA[0]/GPIO82 TS0DATA[1]/GPIO83 TS0DATA[2]/GPIO84 TS0DATA[3]/GPIO85 TS0DATA[4]/GPIO86 TS0DATA[5]/GPIO87 TS0DATA[6]/GPIO88 TS0DATA[7]/GPIO89

TS0SYNC/GPIO91

TS0VALID/GPIO90

TS1CLK/GPIO103 TS1DATA[0]/GPIO93 TS1DATA[1]/GPIO94 TS1DATA[2]/GPIO95 TS1DATA[3]/GPIO96 TS1DATA[4]/GPIO97 TS1DATA[5]/GPIO98 TS1DATA[6]/GPIO99

TS1DATA[7]/GPIO100

TS1SYNC/GPIO102

TS1VALID/GPIO101

PM_SPI_SCZ1/GPIO_PM[6]/GPIO13

PM_SPI_SCK/GPIO1

PM_SPI_SCZ0/GPIO0

PM_SPI_SDI/GPIO2 PM_SPI_SDO/GPIO3

SPDIF_IN/GPIO161

SPDIF_OUT/GPIO162

DDCA_CK/UART0_RX DDCA_DA/UART0_TX

NF_ALE/GPIO146

NF_CEZ/GPIO142

NF_CLE/GPIO141

NF_RBZ/GPIO147

NF_REZ/GPIO144

NF_WEZ/GPIO145

NF_WPZ/GPIO199

IRIN/GPIO5

PWM0/GPIO71 PWM1/GPIO72 PWM2/GPIO73 PWM3/GPIO74 PWM4/GPIO75

HWRESET

IF_AGC

SENSOR_SCL SENSOR_SDA

AV2_CVBS_DET

V10 T14 T13 U13 V15 U12 V13 U14 T11 T12 V12 Y14 Y16 AA15 Y13 AA16 W12 AA13 W14 W13 Y15 W15

B3 A3 A4 C3 A2

B1

RP

C2

TN

C1

TP

B2

RN

D2 D1

D8 E5 G4 G5

J18 K18 K16 L18 L17

T8 T9 U9 U11 V9 U10 T10

W2 W1

SIFM

W3

SIFP

V2

IM

V1

IP

AA2

XIN

Y2

XOUT

R126 22 DVB_T2

R127 22 DVB_T2

DEMOD_RESET

FRC_RESET

/CI_CD1 /CI_CD2

PCM_A[0-14]

/PCM_CD /PCM_CE

PCM_D[0-7]

RXA4+ RXA4RXA3+

RXA3RXACK+ RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

RXB4+

RXB4-

RXB3+

RXB3-

RXBCK+ RXBCK-

RXB2+

RXB2-

RXB1+

RXB1-

RXB0+

RXB0-

EEPROM (IC104)

TUNER_RESET

5V_DET_HDMI_4

I2C_SCL

I2C_SDA URSA/VCOM_SDA URSA/VCOM_SCL

SENSOR_SCL SENSOR_SDA

TU_SCL TU_SDA

AV_CVBS_DET

AV2_CVBS_DET

COMP2_DET

DEMOD_RESET

MODEL_OPT_0 MODEL_OPT_1

MODEL_OPT_2 /MHL_OCP_DET

FRC_RESET

HP_DET

SC1/COMP1_DET

MHL_OCP_EN

AMP_RESET

RF_SWITCH_CTL

/CI_CD1 /CI_CD2

USB1_CTL

USB1_OCD

/PCM_IORD /PCM_IOWR /PCM_IRQA

/PCM_OE

/PCM_REG

PCM_RST

/PCM_WAIT

/PCM_WE

R129 22

R128 22

R12533

R12433

PCM_A[0] PCM_A[1] PCM_A[2] PCM_A[3] PCM_A[4] PCM_A[5] PCM_A[6] PCM_A[7] PCM_A[8] PCM_A[9] PCM_A[10] PCM_A[11] PCM_A[12]

PCM_A[13] PCM_A[14]

PCM_D[0] PCM_D[1] PCM_D[2] PCM_D[3] PCM_D[4] PCM_D[5]

PCM_D[6] PCM_D[7]

U19

LVA4P/TTL_B[0]/HCONV/GPIO170

T20

LVA4M/TTL_B[1]/E_O/GPIO171

T21

LVA3P/TTL_B[2]/FB/GPIO172

T19

LVA3M/TTL_B[3]/OPT_P/GPIO173

R21

LVACKP/TTL_B[4]/MCLK/GPIO174

R20

LVACKM/TTL_B[5]/GCLK/GPIO175

R19

LVA2P/TTL_B[6]/GST/GPIO176

P20

LVA2M/TTL_B[7]/POL/GPIO177

P19

LVA1P/TTL_G[0]/EPI0+/GPIO178

N20

LVA1M/TTL_G[1]/EPI0-/GPIO179

N21

LVA0P/TTL_G[2]/EPI1+/GPIO180

N19

LVA0M/TTL_G[3]/EPI1-/GPIO181

M21

LVB4P/TTL_G[4]/EPI2+/GPIO182

M20

LVB4M/TTL_G[5]/EPI2-/GPIO183

M19

LVB3P/TTL_G[6]/EPI3+/GPIO184

L20

LVB3M/TTL_G[7]/EPI3-/GPIO185

L19

LVBCKP/TTL_R[0]/EPI4+/GPIO186

K20

LVBCKM/TTL_R[1]/EPI4-/GPIO187

K21

LVB2P/TTL_R[2]/EPI5+/GPIO188

K19

LVB2M/TTL_R[3]/EPI5-/GPIO189

J21

LVB1P/TTL_R[4]/EPI6+/GPIO190

J20

LVB1M/TTL_R[5]/EPI6-/GPIO191

J19

LVB0P/TTL_R[6]/EPI7+/GPIO192

H20

LVB0M/TTL_R[7]/EPI7-/GPIO193

IC101

LGE2132(M1A_256M)

Y1

GPIO78

W4

GPIO79

K17

I2C_SCKM3/I2C_DDCR_CK/GPIO77

J15

I2C_SDAM3/I2C_DDCR_DA/GPIO76

U8

SDAM2/GPIO55

T7

SCKM2/GPIO56

U7

SCKM0/GPIO58

V7

SDAM0/GPIO59

F6

I2S_IN_BCK/GPIO159

G6

I2S_IN_SD/GPIO160

AA4

I2C_SCKM1/GPIO80

Y4

I2C_SDAM1/GPIO81

J6

ET_TXD[0]/GPIO62

K6

EXT_TX_CLK/GPIO64

G7

I2S_IN_WS/GPIO158

J4

ET_COL/GPIO60

J5

ET_TXD[1]/GPIO61

H19

LCK/GPIO194

G20

LDE/GPIO195

G19

LHSYNC/GPIO196

G21

LVSYNC/GPIO197

J17

UART2_RX/GPIO69

J16

UART2_TX/GPIO70

E8

UART3_TX/GPIO52

D7

UART3_RX/GPIO53

U6

GPIO46[CTS]

V6

GPIO47[RTS]

K15

UART1_TX/GPIO48

L16

UART1_RX/GPIO49

H5

ET_TX_EN/GPIO63

K5

ET_RXD[0]/GPIO65

K4

ET_MDC/GPIO66

H6

ET_MDIO/GPIO67

L5

ET_RXD[1]/GPIO68

U17

PCMADR[0]/NF_AD[0]/GPIO130

R18

PCMADR[1]/NF_AD[1]/GPIO129

V17

PCMADR[2]/NF_AD[2]/GPIO127

R16

PCMADR[3]/NF_AD[3]/GPIO126

U16

PCMADR[4]/NF_AD[4]/GPIO104

T17

PCMADR[5]/NF_AD[5]/GPIO106

W18

PCMADR[6]/NF_AD[6]/GPIO107

U20

PCMADR[7]/NF_AD[7]/GPIO108

Y19

PCMADR[8]/GPIO113

AA19

PCMADR[9]/GPIO115

AA20

PCMADR[10]/GPIO119

W21

PCMADR[11]/GPIO117

V20

PCMADR[12]/GPIO109

Y17

PCMADR[13]/GPIO112

V18

PCMADR[14]/GPIO111

V19

PCMCD_N/GPIO135

W19

PCMCE_N/GPIO120

U18

PCMDATA[0]/GPIO131

V16

PCMDATA[1]/GPIO132

W17

PCMDATA[2]/GPIO133

Y20

PCMDATA[3]/GPIO125

R15

PCMDATA[4]/GPIO124

AA18

PCMDATA[5]/GPIO123

T15

PCMDATA[6]/GPIO122

Y21

PCMDATA[7]/GPIO121

W20

PCMIORD_N/GPIO116

V21

PCMIOWR_N/GPIO114

Y18

PCMIRQA_N/GPIO110

T16

PCMOE_N/GPIO118

R17

PCMREG_N/GPIO128

T18

PCM_RESET/GPIO134

W16

PCMWAIT_N/GPIO105

U15

PCMWE_N/GPIO198

IC101

LGE2132(M1A_256M)

M1A_256M

PM_SPI_SCZ2/GPIO_PM[10]/GPIO17

M1A_256M

TS0CLK/GPIO92 TS0DATA[0]/GPIO82 TS0DATA[1]/GPIO83 TS0DATA[2]/GPIO84 TS0DATA[3]/GPIO85 TS0DATA[4]/GPIO86 TS0DATA[5]/GPIO87 TS0DATA[6]/GPIO88 TS0DATA[7]/GPIO89

TS0SYNC/GPIO91

TS0VALID/GPIO90

TS1CLK/GPIO103 TS1DATA[0]/GPIO93 TS1DATA[1]/GPIO94 TS1DATA[2]/GPIO95 TS1DATA[3]/GPIO96 TS1DATA[4]/GPIO97 TS1DATA[5]/GPIO98 TS1DATA[6]/GPIO99

TS1DATA[7]/GPIO100

TS1SYNC/GPIO102

TS1VALID/GPIO101

PM_SPI_SCZ1/GPIO_PM[6]/GPIO13

PM_UART_TX/GPIO_PM[1]/GPIO8

PM_UART_RX/GPIO_PM[5]/GPIO12

PM_SPI_SCK/GPIO1

PM_SPI_SCZ0/GPIO0

PM_SPI_SDI/GPIO2 PM_SPI_SDO/GPIO3

SPDIF_IN/GPIO161

SPDIF_OUT/GPIO162

IRIN/GPIO5 DDCA_CK/UART0_RX DDCA_DA/UART0_TX

PWM0/GPIO71 PWM1/GPIO72 PWM2/GPIO73 PWM3/GPIO74 PWM4/GPIO75

NF_ALE/GPIO146 NF_CEZ/GPIO142 NF_CLE/GPIO141 NF_RBZ/GPIO147 NF_REZ/GPIO144 NF_WEZ/GPIO145 NF_WPZ/GPIO199

SAR0/GPIO35 SAR1/GPIO36 SAR2/GPIO37 SAR3/GPIO38 SAR4/GPIO39

GPIO_PM[13]/GPIO20 GPIO_PM[14]/GPIO21

PM_LED/GPIO4

GPIO_PM[0]/GPIO7

GPIO_PM[15]/GPIO22

GPIO_PM[4]/GPIO11 GPIO_PM[7]/GPIO14 GPIO_PM[8]/GPIO15

PWM_PM/GPIO200

V10 T14 T13 U13 V15 U12 V13 U14 T11 T12 V12 Y14 Y16 AA15 Y13 AA16 W12 AA13 W14 W13 Y15 W15

B3 A3

R134 33 A4 C3 A2

for SERIAL FLASH

B1

RP

C2

TN

C1

TP

B2

RN

D2 D1

R132 100

SPDIF_OPTIC

D8

HWRESET

E5 G4 G5

J18 K18 K16 L18 L17

T8 T9 U9 U11 V9 U10 T10

W2

IF_AGC

W1

SIFM

W3

SIFP

V2

IM

V1

IP

AA2

XIN

Y2

XOUT

D5 F8 E7 E6 D6

W10 Y10 P3 Y3 Y5 W11 D3 AA3 W5 D4 L15 Y11

CI_TS_DATA[0] CI_TS_DATA[1] CI_TS_DATA[2] CI_TS_DATA[3] CI_TS_DATA[4] CI_TS_DATA[5] CI_TS_DATA[6] CI_TS_DATA[7]

R133 33

R135

R136

TUNER_IF_100_ohm

KEY1 KEY2

PM_MODEL_OPT_0 PANEL_CTL SCART1_MUTE

MHL_CD_SENSE /VBUS_EN PM_LED POWER_DET AMP_MUTE INV_CTL POWER_ON/OFF_1

RL_ON /FLASH_WP LED_R/BUZZ PM_TXD PM_RXD

FE_TS_DATA[0] FE_TS_DATA[1] FE_TS_DATA[2] FE_TS_DATA[3] FE_TS_DATA[4] FE_TS_DATA[5] FE_TS_DATA[6] FE_TS_DATA[7]

33

1M

R138-*1 100

R139-*1 100

from CI SLOT

5V_DET_HDMI_2 SPDIF_OUT

SOC_RESET IR

PWM0 PWM1 PWM2 PWM3 PCM_5V_CTL

PF_ALE /PF_CE0 /PF_CE1

/F_RB

/PF_OE

/PF_WE

/PF_WP

Close to MSTAR

TUNER_IF_0_ohm

0

R138

TUNER_IF_0_ohm

0

R139

XTAL_LOAD_15pF

C113

X101 24MHz

C114 15pF

XTAL_LOAD_15pF

CI_TS_CLK CI_TS_DATA[0-7]

CI_TS_SYNC CI_TS_VAL

FE_TS_CLK FE_TS_DATA[0-7]

FE_TS_SYNC FE_TS_VAL_ERR

Internal demod out

/SPI_CS SPI_SCK SIDE_HP_MUTE

SPI_SDO

EPHY_RP EPHY_TN EPHY_TP EPHY_RN

RGB_DDC_SCL RGB_DDC_SDA

BLM18PG121SN1D

HALF_NIM/EU_NON_T2

R137 10K

R140

0

HALF_NIM/EU_NON_T2

0.1uF C117

HALF_NIM/EU_NON_T2

0.1uF C118

15pF

LGE2131(M1A_128M)

U19

LVA4P/TTL_B[0]/HCONV/GPIO170

T20

LVA4M/TTL_B[1]/E_O/GPIO171

T21

LVA3P/TTL_B[2]/FB/GPIO172

T19

LVA3M/TTL_B[3]/OPT_P/GPIO173

R21

LVACKP/TTL_B[4]/MCLK/GPIO174

R20

LVACKM/TTL_B[5]/GCLK/GPIO175

R19

LVA2P/TTL_B[6]/GST/GPIO176

P20

LVA2M/TTL_B[7]/POL/GPIO177

P19

LVA1P/TTL_G[0]/EPI0+/GPIO178

N20

LVA1M/TTL_G[1]/EPI0-/GPIO179

N21

LVA0P/TTL_G[2]/EPI1+/GPIO180

N19

LVA0M/TTL_G[3]/EPI1-/GPIO181

M21

LVB4P/TTL_G[4]/EPI2+/GPIO182

M20

LVB4M/TTL_G[5]/EPI2-/GPIO183

M19

LVB3P/TTL_G[6]/EPI3+/GPIO184

L20

LVB3M/TTL_G[7]/EPI3-/GPIO185

L19

LVBCKP/TTL_R[0]/EPI4+/GPIO186

K20

LVBCKM/TTL_R[1]/EPI4-/GPIO187

K21

LVB2P/TTL_R[2]/EPI5+/GPIO188

K19

LVB2M/TTL_R[3]/EPI5-/GPIO189

J21

LVB1P/TTL_R[4]/EPI6+/GPIO190

J20

LVB1M/TTL_R[5]/EPI6-/GPIO191

J19

LVB0P/TTL_R[6]/EPI7+/GPIO192

H20

LVB0M/TTL_R[7]/EPI7-/GPIO193

FE_TS_DATA[0]

SPDIF_OUT

5V_DET_HDMI_2

+3.3V_Normal

L101

HALF_NIM/EU_NON_T2

C119

0.1uF

XTAL_LOAD_18pF

C113-*118pF

XTAL_LOAD_18pF

18pF

C114-*1

IC101-*1

M1A_128M

PM_SPI_SCZ2/GPIO_PM[10]/GPIO17

PM_UART_TX/GPIO_PM[1]/GPIO8

PM_UART_RX/GPIO_PM[5]/GPIO12

SPI_SDI

EPHY_RP EPHY_TN EPHY_TP EPHY_RN

C121

OPT

100pF

IF_FILTER_AJ/CSA C122 33pF

XTAL_LOAD_22pF

C113-*2 22pF

XTAL_LOAD_22pF

C114-*2 22pF

SAR0/GPIO35 SAR1/GPIO36 SAR2/GPIO37 SAR3/GPIO38 SAR4/GPIO39

GPIO_PM[13]/GPIO20 GPIO_PM[14]/GPIO21

PM_LED/GPIO4

GPIO_PM[0]/GPIO7

GPIO_PM[15]/GPIO22

GPIO_PM[4]/GPIO11 GPIO_PM[7]/GPIO14 GPIO_PM[8]/GPIO15

PWM_PM/GPIO200

IF_AGC_MAIN

D5 F8 E7 E6 D6

W10 Y10 P3 Y3 Y5 W11 D3 AA3 W5 D4 L15 Y11

C120

0.047uF 25V HALF_NIM/EU_NON_T2

IF_N_MSTAR

DTV_IF

IF_P_MSTAR

IF_FILTER_AJ/CSA

C124 33pF

XTAL_LOAD_27pF

27pF

C113-*3

XTAL_LOAD_27pF

27pF

C114-*3

XTAL_LOAD_30pF

C113-*4

30pF

XTAL_LOAD_30pF

C114-*4

30pF

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

M1A_L14

2013/09/16

MAIN1_NON_EU 51

MODEL OPTION

LGE Internal Use Only

IF_AGC_SEL

OPT

R205 100

OPT

R206

OPT

R207

OPT

R201 100

OPT

R202 100

OPT

R203 100

AUDIO OUT

SCART1_Lout SCART1_Rout

100 100

H/P OUT

HP_LOUT HP_ROUT

+3.3V_Normal

1K

MO_DUALSTREAM

R210

1K

R209

MO_DUALSTREAM_NON

SC1/COMP1_L_IN

SC1/COMP1_R_IN

DDR_EXT:256

MO_S/W_EU/AJ

R212 1K

R216 1K

R214 1K

MO_S/W_TW

R211 1K

R213 1K

R215 1K

DDR_EXT:128 or NON

HDMI_ARC D0-_HDMI4 D0+_HDMI4 D1-_HDMI4 D1+_HDMI4 D2-_HDMI4 D2+_HDMI4 CK-_HDMI4 CK+_HDMI4

CEC_REMOTE_S7

DDC_SCL_2 DDC_SDA_2 DDC_SCL_4 DDC_SDA_4 HPD2 HPD4 D0-_HDMI2 D0+_HDMI2 D1-_HDMI2 D1+_HDMI2 D2-_HDMI2 D2+_HDMI2 CK-_HDMI2 CK+_HDMI2

AV2_L_IN

COMP2_L_IN

AV2_R_IN

COMP2_R_IN

BLM18PG121SN1D

L201

MO_M120

DDR_EXT:128

R219 1K

R218 1K

R221 1K

MO_DVB_T2/C/S2

MO_DVB_T/C

R222 1K

MO_M120_NON

R217 1K

R220 1K

DDR_EXT:256 or NON

IC101-*1

LGE2131(M1A_128M)

M4

ARC0

W7

RXC0N

Y8

RXC0P

W8

RXC1N

Y9

RXC1P

AA9

RXC2N

W9

RXC2P

AA7

RXCCKN

Y7

RXCCKP

N2

CEC/GPIO6

E3

DDCDA_CK/GPIO27

E2

DDCDA_DA/GPIO28

W6

DDCDC_CK/GPIO31

AA6

DDCDC_DA/GPIO32

L4

HOTPLUGA/GPIO23

Y6

HOTPLUGC/GPIO25

F1

RXA0N

G3

RXA0P

G1

RXA1N

G2

RXA1P

H3

RXA2N

H2

RXA2P

F3

RXACKN

F2

RXACKP

U4

EAR_OUTL

T4

EAR_OUTR

P2

AUL1

R2

AUL2

T1

AUL3

R3

AUR1

R1

AUR2

T3

AUR3

U2

AUOUTL0

V3

AUOUTR0

T2

AUVAG

HDMI

HDMI1_ARC 1uF

1uF

4.7uF

C203

C204

MO_HD

MO_S/W_AJ

R224 1K

MO_FHD

MO_S/W_NON_AJ

R223 1K

M1A_128M

I2S_OUT_BCK/GPIO165 I2S_OUT_MCK/GPIO163

I2S_OUT_SD/GPIO166 I2S_OUT_WS/GPIO164

C205

2.2uF

R22510 R22610

HDMI1_ARC

C2092.2uF

C2072.2uF

C2112.2uF

AUVRM

MODEL OPTION ("MO")

PIN NAME

MODEL_OPT_0

MODEL_OPT_1

MODEL_OPT_2 MODEL_OPT_3

MODEL_OPT_0

MODEL_OPT_1

MODEL_OPT_2

AUD_LRCH MODEL_OPT_4 MODEL_OPT_5 MODEL_OPT_6

AUD_LRCK

MODEL_OPT_4 MODEL_OPT_5

MODEL_OPT_6

MODEL_OPT_7

* Dual Stream is only Korea 3D spec

Memory OPTION

Memory INT+EXT

128M Only

256M Only

128M+256M

256M+256M 1 0 1

T6

CVBSOUT1

V5

CVBS0

U5

CVBS1

T5

CVBS2

V4

VCOM

E4 F4 F7 F5

C4

USB0_DM

Y12

USB1_DM

B4

USB0_DP

AA12

USB1_DP

J2

BIN0M

J3

BIN0P

K3

GIN0M

J1

GIN0P

K2

RIN0M

K1

RIN0P

M6

HSYNC0

L6

VSYNC0

L2

BIN1M

L3

BIN1P

M1

GIN1M

M2

GIN1P

N1

RIN1M

N3

RIN1P

M3

SOGIN1

M1A_256M

M4

ARC0

W7

RXC0N

Y8

RXC0P

W8

RXC1N

Y9

RXC1P

AA9

RXC2N

W9

RXC2P

AA7

RXCCKN

Y7

RXCCKP

N2

CEC/GPIO6

E3

DDCDA_CK/GPIO27

E2

DDCDA_DA/GPIO28

W6

DDCDC_CK/GPIO31

AA6

DDCDC_DA/GPIO32

L4

HOTPLUGA/GPIO23

Y6

HOTPLUGC/GPIO25

F1

RXA0N

G3

RXA0P

G1

RXA1N

G2

RXA1P

H3

RXA2N

H2

RXA2P

F3

RXACKN

F2

RXACKP

U4

EAR_OUTL

T4

EAR_OUTR

P2

AUL1

R2

AUL2

T1

AUL3

R3

AUR1

R1

AUR2

T3

AUR3

U2

AUOUTL0

V3

AUOUTR0

T2

AUVAG

IC101

I2S_OUT_BCK/GPIO165 I2S_OUT_MCK/GPIO163

I2S_OUT_SD/GPIO166 I2S_OUT_WS/GPIO164

LGE2132(M1A_256M)

0

R227

C206

AV2

PIN NO.

J5

H19

G20

G19

U6 K5 K4

L5

Auto Det

0

1

0

CVBSOUT1

CVBS0 CVBS1 CVBS2

VCOM

USB0_DM USB1_DM USB0_DP USB1_DP

BIN0M BIN0P GIN0M GIN0P RIN0M

RIN0P HSYNC0 VSYNC0

BIN1M

BIN1P

GIN1M

GIN1P

RIN1M

RIN1P SOGIN1

LOW

MO_FHD

MO_S/W_NON_AJ MO_DVB_T/C

MO_M120_NON

DDR_EXT:256 or NON

MO_S/W_TW DDR_EXT:128 or NON

MO_DUALSTREAM_NON

MODEL_OPT_4

0

1

0

T6 V5

C2260.047uF

U5

C2270.047uF

T5 V4

E4 F4 F7 F5

C4 Y12 B4 AA12

J2

0.047uF

J3

C212

0.047uF

K3

C213

0.047uF

J1

C214

68

0.047uF

K2 K1 M6 L6

L2 L3 M1 M2 N1 N3 M3

C215 C216 C217

C218 C219 C220 C221 C222 C223 C224

0.047uF

0.047uF 1000pF

33

68 33

MODEL_OPT_6

0

0128M+128M

1

R24133 R24233

R22868 R22933 R230 R231 R23268 R23333

R23468 R23533 R236 R237 R23868 R23933

HIGH

MO_HD MO_S/W_AJ MO_DVB_T2/C/S2 MO_M120

DDR_EXT : 128 MO_S/W_EU/AJ DDR_EXT : 256

MO_DUALSTREAM

R243

C2280.047uF

68

SC1_B+/COMP1_Pb+

SC1_G+/COMP1_Y+

SC1_R+/COMP1_Pr+ SC1_ID SC1_FB

COMP2_Pb+

COMP2_Y+/AV_CVBS_IN

COMP2_Pr+

DTV/MNT_VOUT

SC1/AV2_CVBS_IN COMP2_Y+/AV_CVBS_IN

Close to MSTAR

WIFI_DM SIDE_USB1_DM WIFI_DP SIDE_USB1_DP

10K

R244

R245

+3.3V_Normal

R246

10K

OPT

R247

10K

OPT

WIFI_DM WIFI_DP

+1.10V_VDDC

VDDC 1.05V

+1.10V_VDDC

VDDC : 2026mA

C237

C235

10uF 10V

Normal Power 3.3V

+3.3V_Normal

0.1uF

C231

C232 0.1uF

VDD33

L204

BLM18PG121SN1D

10uF

C233

10V

10uF

C236

C238 0.1uF

Normal 2.5V

฀

M1A 2.5V embedded

DDR3 1.5V

C234

10uF 10V

AVDD_DDR0:55mA

AVDD_DDR1:55mA

SOC_RESET

POWER_DET_RESET

PD_+3.5V

C239

4.7uF

+1.5V_DDR

C230

0.1uF

I2S_I/F

OPT

AUD_SCK AUD_MASTER_CLK_0 AUD_LRCH AUD_LRCK

C240 1uF

R248 470

C243

10V

0.1uF

C241 0.1uF

C242

C244 1uF



0.1uF

+3.5V_ST

PD_+12V

4.7uF

C245 0.1uF

C246

C248

10V

C247 0.1uF



1uF

SWITCH_NAMAE

SW200

JTP-1127WEM

1 2

R249

470K

43

SWITCH

R250 100

C249

0.1uF

U3

A6 A13 A15 A18 B12 B14 B16 B17 B19 B20

C9 C10 C21

D9 E20

F9 F11 F13 F15 F17 F19 F21

G8

G9 G10 G11 G12 G13 G14 G15 G16 G17 G18

H7

H8

H9 H10 H11 H12 H13 H14 H15 H16 H17 H18

J7

J8

J9 J10 J11 J12 J13 J14

K8 K10 K11 L10

M5

M7

M8

M9 M10

N4

N5

N6

N7

N8

N9 N10

P4

P5

P6

P7

P9 P10 P15 P16 P17 P18 R10 R11 R12 R13 R14

K7

SWITCH_POSTEC

SW200-*1

TMSV153BRA

43

1 2

SOC_RESET

AVDD_AU33

+1.5V_DDR

AVDD_NODIE

VDD33

AVDD_NODIE

VDD33

AVDD_DMPLL

+1.10V_VDDC

VDD33

AVDD5V_MHL

M1A_128M

IC101-*1

LGE2131(M1A_128M)

AUVRM

AVDD_DDR0_CLK

GND_1

AVDD_DDR1_CLK

GND_2

AVDD_DDR0_CMD

GND_3

AVDD_DDR1_CMD

GND_4

AVDD_DDR0_D_1

GND_5

AVDD_DDR0_D_2

GND_6

AVDD_DDR0_D_3

GND_7

AVDD_DDR1_D_1

GND_8

AVDD_DDR1_D_2

GND_9

AVDD_DDR1_D_3

GND_10 GND_11 GND_12

AVDD_DVI_USB_MPLL_1

GND_13

AVDD_DVI_USB_MPLL_2

GND_14 GND_15 GND_16 GND_17 GND_18

AVDD3P3_DMPLL

GND_19 GND_20 GND_21 GND_22 GND_23 GND_24 GND_25 GND_26 GND_27 GND_28 GND_29 GND_30 GND_31 GND_32 GND_33 GND_34 GND_35 GND_36 GND_37 GND_38 GND_39 GND_40 GND_41 GND_42 GND_43 GND_44 GND_45 GND_46 GND_47 GND_48 GND_49 GND_50 GND_51 GND_52 GND_53 GND_54 GND_55 GND_56 GND_57 GND_58 GND_59 GND_60 GND_61 GND_62 GND_63 GND_64 GND_65 GND_66 GND_67 GND_68 GND_69 GND_70 GND_71 GND_72 GND_73 GND_74 GND_75 GND_76 GND_77 GND_78 GND_79 GND_80 GND_81 GND_82 GND_83 GND_84 GND_EFUSE

C2501uF

R4

AVDD_AU33

L11 L13 M11 K13 C5 K12 L12 C6 K14 L14 B5

AVDD_DRAM_1

B6

AVDD_DRAM_2

R8 R9 L7

AVDD_MOD_1

L8

AVDD_MOD_2

P8

AVDD_NODIE

K9

AVDD_PLL

R5 P11

AVDDL_MOD

C7

DVDD_DDR_1

M13

DVDD_DDR_2

R6

DVDD_NODIE

A7

DVDD_RX_1_1

M12

DVDD_RX_1_2

B7

DVDD_RX_2_1

M14

DVDD_RX_2_2

N11

VDDC_1

N12

VDDC_2

N13

VDDC_3

N14

VDDC_4

N15

VDDC_5

P12

VDDC_6

P13

VDDC_7

P14

VDDC_8

L9

VDDP

AA10

AVDD5V_MHL

STby 3.5V

+3.5V_ST

L206

BLM18PG121SN1D

L207

BLM18PG121SN1D

L205

BLM18PG121SN1D

L11 L13 M11 K13

K12 L12

K14 L14

P11

M13

M12

M14 N11 N12 N13 N14 N15 P12 P13 P14

AA10

AVDD_DMPLL

C251 10uF

R4

C5

C6

B5 B6 R8 R9 L7 L8 P8 K9 R5

C7

R6 A7

B7

L9

C252

0.1uF

M1A_256M

IC101

LGE2132(M1A_256M)

AVDD_AU33 AVDD_DDR0_CLK AVDD_DDR1_CLK AVDD_DDR0_CMD AVDD_DDR1_CMD AVDD_DDR0_D_1 AVDD_DDR0_D_2 AVDD_DDR0_D_3 AVDD_DDR1_D_1 AVDD_DDR1_D_2 AVDD_DDR1_D_3 AVDD_DRAM_1 AVDD_DRAM_2 AVDD_DVI_USB_MPLL_1 AVDD_DVI_USB_MPLL_2 AVDD_MOD_1 AVDD_MOD_2 AVDD_NODIE AVDD_PLL AVDD3P3_DMPLL AVDDL_MOD DVDD_DDR_1 DVDD_DDR_2 DVDD_NODIE DVDD_RX_1_1 DVDD_RX_1_2 DVDD_RX_2_1 DVDD_RX_2_2 VDDC_1 VDDC_2 VDDC_3 VDDC_4 VDDC_5 VDDC_6 VDDC_7 VDDC_8 VDDP

AVDD5V_MHL

AVDD_NODIE

C257

C255

C253 10uF

AVDD_AU33

C256

10uF

0.1uF

C254

0.1uF

C258

0.1uF

AUVRM GND_1 GND_2 GND_3 GND_4 GND_5 GND_6 GND_7 GND_8

GND_9 GND_10 GND_11 GND_12 GND_13 GND_14 GND_15 GND_16 GND_17 GND_18 GND_19 GND_20 GND_21 GND_22 GND_23 GND_24 GND_25 GND_26 GND_27 GND_28 GND_29 GND_30 GND_31 GND_32 GND_33 GND_34 GND_35 GND_36 GND_37 GND_38 GND_39 GND_40 GND_41 GND_42 GND_43 GND_44 GND_45 GND_46 GND_47 GND_48 GND_49 GND_50 GND_51 GND_52 GND_53 GND_54 GND_55 GND_56 GND_57 GND_58 GND_59 GND_60 GND_61 GND_62 GND_63 GND_64 GND_65 GND_66 GND_67 GND_68 GND_69 GND_70 GND_71 GND_72 GND_73 GND_74 GND_75 GND_76 GND_77 GND_78 GND_79 GND_80 GND_81 GND_82 GND_83 GND_84

GND_EFUSE

U3 A6 A13 A15 A18 B12 B14 B16 B17 B19 B20 C9 C10 C21 D9 E20 F9 F11 F13 F15 F17 F19 F21 G8 G9 G10 G11 G12 G13 G14 G15 G16 G17 G18 H7 H8 H9 H10 H11 H12 H13 H14 H15 H16 H17 H18 J7 J8 J9 J10 J11 J12 J13 J14 K8 K10 K11 L10 M5 M7 M8 M9 M10 N4 N5 N6 N7 N8 N9 N10 P4 P5 P6 P7 P9 P10 P15 P16 P17 P18 R10 R11 R12 R13 R14 K7

+1.10V_VDDC

10uF

10V

C259

AUVRM

+1.10V_VDDC

C260

0.1uF

C261

0.1uF

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC5_L14

MAIN2_NON_EU

2013.08.15

52

AUDIO AMP(TI)

LGE Internal Use Only

AMP_MUTE

OPT

R5600

10K

POWER_DET

+24V

+3.5V_ST

B

L5600

UBW2012-121F

R5601

10K

C

OPT

Q5600

MMBT3904(NXP)

E

OPT

R3405

+24V_AMP

R5603

0

100

C5601

0.1uF 50V

C5602

1000pF

50V

AUD_MASTER_CLK

AUD_LRCK

AUD_SCK

AUD_LRCH AMP_SDA

AMP_SCL

AMP_RESET

+3.3V_Normal

C5604

0.1uF 16V

This parts are Located on AVSS area.

4700pF

AVDD

MCLK

PDN

SCLK SDIN

SDA SCL

13 14 15 16 17 18 19 20 21 22 23 24

C5610

0.1uF 16V

C5611

0.047uF

R5608 2K

18K

R5607

C5607

0.1uF

C5606

0.1uF 16V

C5609

C5608

1%

4700pF

R5609

470

A_SEL_FAULT

OSC_RES

DVSSO

VR_DIG

LRCLK

+3.3V_Normal

5V

ZD5600

OPT

R5610

470

C5612

PLL_FLTP

VR_ANA

11

12

25

RESET26STEST

0.047uF

PBTL

AVSS

PLL_FLTM

8

9

10

27

29

GND

DVDD28DVSS

C5614

0.1uF

50V

C5613 2200pF

NC_1

SSTIMER

NC_2

5

6

7

TAS5733

30

32

AGND31VREG

GVDD_OUT

25V

C5617

C5616

0.033uF

PVDD_AB_2

BST_A

3

4

THERMA L

49

IC5600

33

34

BST_D

PVDD_CD_1

1uF

C5615

50V

OUT_A

PVDD_AB_1

1

2

48 47 46 45 44 43 42 41 40 39 38 37

35

36

OUT_D

PVDD_CD_2

0.033uF 50V

C5618

0.1uF 50V

[EP] PGND_AB_2 PGND_AB_1 OUT_B NC_6 NC_5 BST_B BST_C NC_4 NC_3 OUT_C PGND_CD_2 PGND_CD_1

+24V_AMP

C5619

0.1uF 50V

+24V_AMP

C5620 10uF 35V

C5621 10uF 35V

+24V_AMP_CAP

C5640

4.7uF 50V

3216

50V

0.033uF

C5624

50V

0.033uF C5625

+24V_AMP_CAP

C5641

4.7uF 50V

3216

AMP_COIL_GET

L5603-*1

AMP_COIL_TAIYO

R5611 18

C5626 330pF 50V

C5627 330pF 50V

R5612 18

R5613181/16W

C5628 330pF 50V

C5629 330pF 50V

R5614181/16W

10.0uH

L5603-*2

10.0uH

AMP_COIL_GET

L5604-*1

10.0uH

AMP_COIL_TAIYO

L5604-*2

10.0uH

AMP_COIL_ABCO

L5605

10uH

AMP_LC_0.33uF

C5630-*1

0.33uF

L5606

10uH

AMP_COIL_ABCO

L5604

10uH

AMP_LC_0.33uF

C5631-*1

0.33uF 50V

L5603 10uH

AMP_COIL_ABCO

50V

AMP_LC_0.47uF

AMP_COIL_GET

L5605-*1

10.0uH

AMP_COIL_TAIYO

L5605-*2

10.0uH

AMP_LC_0.47uF

C5630

0.47uF 50V

C5631

0.47uF 50V

AMP_COIL_GET

L5606-*1

10.0uH

AMP_COIL_TAIYO

L5606-*2

10.0uH

C5632

0.1uF 50V

C5633

0.1uF 50V

C5634

0.1uF 50V

C5635

0.1uF 50V

Close to Speaker

OPT C5636 2200pF

50V

OPT C5637 2200pF

50V

OPT

C5638 2200pF 50V

OPT C5639 2200pF

50V

SPK_L+

SPEAKER_L

SPK_L-

SPK_R+

SPEAKER_R

SPK_R-

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14

AUDIO[TI]

SPK_L+

SPK_L-

SPK_R+

SPK_R-

WAFER-ANGLE

4

3

2

1

P5600

131116

56

L14 MHL SW AND GATE

LGE Internal Use Only

MHL_CD_SENSE

MHL_OCP_EN

MHL_SW_AND_GATE

74LVC1G08GW

B

1

A

2

GND

3

IC5801

+3.3V_Normal

VCC

5

Y

4

MHL_5V_EN

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

MHL_SW_AND

2013.09.01L14_M1A

58