Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to LA54H Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment(OTP) : Component
(2) EDID downloads for HDMI
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
4. MAIN PCBA Adjustments
4.1. ADC Adjustment
4.1.1. Overview
- ADC adjustment is needed to find the optimum black level and
gain in Analog-to-Digital device and to compensate RGB
deviation..
4.1.2. Equipment & Condition
(1) Protocol: RS-232C
(2) Inner Pattern
- Resolution : 1080p(Comp) / 1024*768(RGB)
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level : 0.7±0.1 Vp-p
4.1.3. Adjustment
4.1.3.1. Adjustment method
- Connect to Jig by using RS-232(USB), adjust Component
※ Manual adj (If needed in Final Assembly)
- Required equipment : Adjustment R/C
- Enter Service Mode by pushing “ADJ” key,
- Start ‘OTP’ ADC Type by pushing ‘►’ key at [7. ADC Calibration]
※ In L13 case, Adjust ADC(OTP) is automatically ‘OK’
4.1.3.2. Adj. protocol (only Internal patten)
4.2. EDID Download
4.2.1. Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust by using remote controller
4.2.3. Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
3.3. Appendix
(1) Shipment conditions
(2) Tool option menu
(3) USB Download (S/W Update, Option and Service only)
(4) Preset CH Information
Only for training and service purposes
- 10 -
※ Caution) When EDID Download, must remove RGB/HDMI
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range.
● Case : Cool Mode
- To adjust the white balance without the saturation, G gain
should be adjust at least 172 and change the others (R,B
Gain)
▪ When R or B gain is over 255, G gain can be adjust below
172)
● Case : Medium / Warm Mode
- To adjust the white balance without the saturation, Fix the
one of R/G/B gain to 192 (default data) and decrease the
others.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25 ± 5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location : Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(90 ° ± 2.5 °)
(3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
※ CASE : Cool mode
First adjust the coordinate far away from the target value(x,
y).B
(1) x, y >target
(2) x, y< target
(3) x >target , y< target
(4) x < target , y >target
- Every 4 case have to t y value by adjusting B Gain and
then t x value by adjusting R-Gain
- In this case, increasing/decreasing of B Gain and R Gain
can be adjusted.
► How to adjust
(1) Fix G gain at least 172 : Adjust R, B Gain ( In Case of
Mostly Blue Gain Saturation )
(2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※ CASE : Medium / Warm mode
First adjust the coordinate far away from the target value(x, y).
(1) x, y >target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
5.1.6. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 204 Gray, 80IRE
** (normal line) LGD Cell
** Except Gumi winter season (Mar ~ Dec) & Global
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process
automatically.
6.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
8. Control Key Check UI
8.1. Test method
(1) Condition : Power Only Full White Mode
(2) When you check the operation of control key, appear the UI
such as below figure on TV Screen.
(3) In case of the model applied the joystick type control key
(xxLF56, xxLF55, xxLF60 and xxLF62), the UI Sequence is
CH+, CH-, Vol+, Vol-, Enter and TEST OK such as figure 1.
(4) In case of the model applied rotary switch type (xxLF640R-
NA KR only), the UI Sequence is Channel Up, Channel
Down, Volume Up, Volmue Down, Enter, Test OK, Input
Select and Power such as figure 2.
Fig.1
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(7) In terms of FRC version update, below sequence are the
only for 60LF6000-Ux model.
(a) When the main sw downloading was finished, if FRC
SW version of TV Set is lower than the FRC version
Included in downloading version, FRC verison update
will be started automatically during displaying the below
figure.
(b) Be careful to not be off of TV Power.
(c) Udating the FRC is completed, the TV will restrart
automatically.
(d) Check your updated FRC version on TV set with
pushing “IN-START” key in service remote controller.
(e) In references, FRC version value shown in TV may
differ from below value.
Refer to the BOM aobut the latest FRC version.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+24V
OPT
R457
8.2K
1%
C415
0.1uF
16VC425
OPT
C413
0.1uF
16V
Ready - Dual Power Det
* Notice
- Applying all inch models for LCD L14
- Dual Power Det is used
for detecting two kinds of voltage
R430
2.7K
R431
1.2K
OPT
R427
R428
5.1K
1%
1%
27K
1%
OPT
1%
+12V
+24V
+3.5V_POWER_DET
OPT
R432
0
5%
+3.5V_POWER_DET
OPT
R458
0
5%
R435
100K
RESET_IC_DIODES(MULTI)
IC401
APX803E29
3
1
GND
OPT
R436
100K
OPT
IC402
APX803E29
3
1
GND
RESET
2
RESET
2
VCC
VCC
+3.5V_ST
R454
100 5%
POWER_DET_RESET
OPT
R437
100 5%
Detect Valtage
Power Detect +3.5V
Power Detect +12V
Power Detect +24V
OPT
Power_DET
R438
4.7K
C422
0.1uF
Now is
POWER_DET
Use Circuit Designator
OR430, R431, R454
RESET_IC_KEC(MULTI)
IC401-*1
KIC7529M2
VCC
3
Power Detect activity
R432, R454-*1, R438
R457, R454
+12V
OUT
2
1
GND
MLB-201209-0120P-N2
L408
PANEL_CTL
OPT
Upper 79"
L412
R417
10K
+3.3V_Normal
+1.5V_DDR
+3.3V_NORMAL
L409
BLM18PG121SN1D
C426
10uF
10V
Vout=1.25*(1+R2/R1)+Iadj*R2
+1.5V_DDR
R1
R2
L411
CB2012PK501T
R453
0
C431
10uF
10V
IC404
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
1.3A
R449
1K
1/16W
1%
R450
200
1/16W
1%
ZD403
2.5V
POWER_ON/OFF_1
PANEL_POWER
0.1uF
25V
C427
10uF
16V
C
Q403-*1
B
MMBT3904(NXP)
E
C428
2.2uF
10V
C
Q404
2N3904S
NPN_KEC(MULTI)
E
C438
10uF
16V
NPN_NXP(MULTI)
R442
10K
+3.5V_ST
R443
10K
R445
R446
1.8K
B
R444
10K
10K
C
Q403
2N3904S
NPN_KEC(MULTI)
E
R447
22K
R448
2.2K
B
PANEL_FET_AOS(MULTI)
Q405
AO4447A
S_1
1
S_2
2
S_3
3
G
4
PANEL_FET_ROHM(MULTI)
Q405-*1
RRH140P03TB
1S_1
2S_2
3S_3
4G
3.3V_FET_AOS(MULTI)
Q406-*1
AO3435
D
S
G
3.3V_FET_TOSHIBA(MULTI)
Q406
SSM3J332R
D
S
C429
G
0.1uF
16V
C
Q404-*1
B
MMBT3904(NXP)
NPN_NXP(MULTI)
E
D_4
8
D_3
7
D_2
6
D_1
5
D_48
7 D_3
6 D_2
5 D_1
L410
BLM18PG121SN1D
C430
22uF
10V
TYP 6000mA
R452
R451
2K
2K
OPT
OPT
+3.3V_NORMAL
ZD402
5V
TVS_SEMTECH(MULTI)
ZD402-*1
TVS_KEC(MULTI)
C439
10uF
16V
PANEL_VCC
C440
10uF
16V
+1.10V_VDDC
+1.10V_VDDC
ZD401
2.5V
+3.5V_ST
OPT
C424
0.1uF
16V
C437
0.1uF
16V
C421
22uF
10V
C436
10uF
10V
OPT
C420
22uF
10V
L406
CB2012PK501T
C414
10uF
10V
C423
50V
270pF
R43 9
R44 0
IC403
TPS5432DDAR
C417
0.1uF
16V
BOOT
1
VIN
2
PH
3
GND
4
C435
0.1uF
16V
L407
3.6uH
20K
R1
1%
R2
47K
1%
3A
9
THERMAL
8
7
6
5
[EP]GND
SS
EN
COMP
VSENSE
C418
0.01uF
R433
2.7K
C419
0.039uF
50V
1%
C434
390pF
50V
+3.3V_NORMAL
R429
10K
C416
0.33uF
16V
Vout=0.808*(1+R1/R2)
+12V
L404
BLM18PG121SN1D
C403
10uF
16V
USB1_OCD
USB1_CTL
C404
0.1uF
+5V_Normal
R408
R1
120K
1%
C405
100pF
50V
R2
+3.3V_NORMAL
R405
4.7K
R403
10K
R409
6.8K
1%
R410
22K
1%
+5V_NORMAL
C406
0.1uF
16V
+3.3V_NORMAL
R415
10K
C409
1uF
10V
C410
2200pF
50V
EN
FB
VREG
SS
VIN
GND
EN
IC405
BD9D321EFJ
1
2
THERMAL
3
4
3A
IC406
BD2242G
1
2
3
FROM LIPS or POWER B/D
+5V_NORMAL
[EP]
VIN
8
9
7
6
5
6
5
4
BOOT
SW
GND
VOUT
ILIM
OC
16V
0.1uF
C411
LPH6050T-3R6N-R
+5V_USB
1%
14K
R41 8
L405
3.6uH
1458mA
C412
22uF
C443
22uF
10V
10V
RL_ON
ZD404-*1
TVS_KEC(MULTI)
ZD400-*1
TVS_KEC(MULTI)
B
+3.5V_ST
OPT
R400
10K
10K
+3.5V_ST
C
Q400-*1
MMBT3904(NXP)
NPN_NXP(MULTI)
E
R402
10K
C407
10uF
10V
2012
+12V
+24V
B
CB2012PK501T
+3.5V_ST
R406
10K
R404
4.7K
C
Q400
2N3904S
NPN_KEC(MULTI)
E
OPT
R456
0
+3.5V_POWER_DET
L400
C400
1uF
10V
1005
OPT
C433
4.7uF
16V
3216
C442
4.7uF
50V
3216
Q401-*1
PNP_NXP(MULTI)
MMBT3906(NXP)
3
1
2
Q401
PNP_KEC(MULTI)
2N3906S-RTK
3
1
2
R455
0
CB2012PK501T
ZD400
5V
TVS_SEMTECH(MULTI)
MLB-201209-0120P-N2
C402
0.1uF
16V
MLB-201209-0120P-N2
C401
0.1uF
50V
PWM_from_MAIN
OPT
R412
33K
ZD404
5V
TVS_SEMTECH(MULTI)
L401
L403
L402
R414
R424
3.9KR401
PWM_DIM
0
PWM_DIM_SYNC
R416
0
PWM_from_TCON
URSA_OPT_5
URSA_OPT_6
POWER_28P
R407
R411 33
POWER_28P
C408
18pF
OPT
POWER_28P
PWR ON
PDIM1
3.5V
3.5V
GND
12V
12V
12V
GND
24V
24V
GND
33
C432
18pF
OPT
SCLK
PWR ON
PDIM1
3.5V
3.5V
SIN
P402
GND
12V
12V
12V
GND
24V
24V
GND
1
3
5
7
9
11
13
15
17
19
21
23
25
27
POWER_24P
1
3
5
7
9
11
13
15
17
19
21
23
P401
DRV ON
2
PDIM2
4
GND
6
3.5V
8
GND
10
12V
12
12V
14
GND
16
24V
18
24V
20
GND
22
NC
24
GND
26
V_SYNC
28
29
.
DRV ON
2
PDIM2
4
GND
6
3.5V
8
GND
10
12V
12
12V
14
GND
16
24V
18
24V
20
GND
22
NC
24
25
POWER_28P
C441
18pF
OPT
R41333
URSA_L/D_VSYNC
+3.3V_NORMAL
R420
1K
R419
100
C
E
R423
100
R470
0
B
Q402
2N3904S
OPT
R467
1K
R425
10K
+3.5V_ST
R426
10K
NPN_KEC(MULTI)
C
B
E
Q402-*1
MMBT3904(NXP)
NPN_NXP(MULTI)
INV_CTL
PWM1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Power_PD2
2014.04.24M1A_URSA9_UD
04
USB 3216 CAP(SIDE)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+5V_USB
JK700
1234
USB DOW N ST REAM
3AU 04S- 305- ZC-( LG)
5
OPT
C701
5pF
50V
OPT
C702
5pF
50V
ZD700
SD05
5V
OPT
C700
10uF
10V
R700
2.2
R701
2.2
OPT
D700
RCLAMP0502BA
C703
10uF
10V
OPT
SIDE_USB1_DM
SIDE_USB1_DP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
USB_S1
2014.04.24
07
SPDIF
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF_OUT
+3.3V_NORMAL
C1001
1uF
OPT
10V
ESD Ready
C1002
18pF
50V
SPDIF_OPTIC
SPDIF_OPTIC_SOLTEAM
JK1001
JST1223-001
GND
1
VCC
2
VINPUT
3
4
Fib er O ptic
FIX_POLE
SPDIF_OPTIC_FOXCONN
JK1001-*1
2F01TC1-CLM97-4F
GND
1
VCC
2
VIN
3
Fiber Optic
4
SHIELD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPDIF
2014.04.24M1A_URSA9_UD
10
+1.5V_DDR
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA_UD
1_DDR
2014.04.24
12
Serial Flash for SPI boot
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
/FLASH_WP
OPT
R1300
10K
+3.5V_ST
/SPI_CS
SPI_SDO
+3.5V_ST
OPT
R1301
4.7K
SPI_FLASH_MACRONIX
IC1300
MX25L8006EM2I-12G
CS#
1
SO/SIO1
2
WP#
3
GND
4
SPI_FLASH_WINBOND
IC1300-*1
W25Q80BVSSIG
CS
1
DO[IO1]
2
%WP[IO2]
3
GND
4
8
7
6
5
8
7
6
5
VCC
HOLD#
R1303 0
SCLK
SI/SIO0
VCC
HOLD[IO3]
CLK
DI[IO0]
+3.5V_ST
C1300
0.1uF
R1302
33
SPI_SCK
SPI_SDI
SPI_FLAHS_WINBOND_NEW
IC1300-*2
W25Q80DVSSIG
CS
1
DO[IO1]
2
WP[IO2]
3
GND
4
8
7
6
5
SPI_FHASH_MACRONIX_NEW
VCC
HOLD[IO3]
SO/SIO1
CLK
WP#/SIO2
DI[IO0]
IC1300-*3
MX25L8035EM2I-10G
CS#
1
2
3
GND
4
8
7
6
5
VCC
NC/SIO3
SCLK
SI/SIO0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
S_FLASH
2014.04.24
13
CI Region
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
PCMCI
2014.04.24
19
ETHERNET
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
* H/W option : ETHERNET
JK2100
RJ45VT-01SN002
1
2
ETHERNET
3
4
5
6
7
8
9
9
1
2
3
4
5
6
7
8
ETHERNET
C2105
0.01uF
50V
ETHERNET
C2104
0.01uF
50V
EPHY_TP
EPHY_TN
EPHY_RP
EPHY_RN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
LAN
2014.04.24
21
DVB-S2 LNB Part Allegro
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
(Option:LNB)
2A
LNB_DIODE_ONSEMI(MULTI)
LNB_DIODE_SUZHOU(MILTI)
D2703-*1
SS2040LL-LG
D2703
30V
LNB
C2703
0.01uF
50V
40V
LNB
C2704
10uF
25V
LNB
C2705
10uF
25V
LNB_DIODE_SUZHOU(MULTI)
D2705-*1
40V
D2705
LNB_DIODE_KEC(MULTI)
40V
SMAB34
LNB
C2706
10uF
25V
3A
+12V_LNB
LNB
L2702
LPH6050T-150M-R
15uH
3.5A
Max 1.3A
LNB
C2708
10uF
25V
Input trace widths should be sized to conduct at least 3A
Ouput trace widths should be sized to conduct at least 2A
LNB_OUT
LNB
C2714
18pF
close to TUNER
LNB
C2701
18pF
LNB
C2702
33pF
Close to Tuner
Surge protectioin
Caution!! need isolated GND
A_GND
R2701
0
LNB
D2701
LNB_DIODE_SUZHOU(MILTI)
D2702-*1
SS2040LL-LG
40V
LNB_DIODE_ONSEMI(MULTI)
LNB
R2702
2.2K
1W
A_GND
D2702
MBR230LSFT1G
30V
LNB
C2713
0.22uF
25V
close to Boost pin(#1)
LNB
C2712
0.1uF
50V
A_GND
LNB_DIODE_KEC(MULTI)
D2704
SMAB34
40V
LNB_DIODE_SUZHOU(MULTI)
D2704-*1
40V
A_GND
LNB
C2707
0.1uF
A_GND
NC_3
BOOST
[EP]GND
19
20
VCP
1
THERMAL
LNB
2
NC_1
TDI
TDO
21
3
LNB
IC2701
4
A8303SESTR-T(4M)
5
7
6
SCL9ADD
IRQ
LNB
R2704
33
DEMOD_SCL
GNDLX
NC_2
18
8
SDA
R2706
0
LNB
R2705
33
DEMOD_SDA
16LX17
15
14
13
12
11
10
TONECTRL
LNB_TX
VIN
GND
VREG
ISET
TCAP
A_GND
close to VIN pin(#15)
LNB
C2709
0.1uF
50V
LNB
C2710
0.1uF
LNB
C2711
0.22uF
LNB
R2703
36K
1/16W 1%
Max 1.3A
+12V
BLM18PG121SN1D
L2701
+12V_LNB
LNB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
LNB27
2014.04.24
SCART_COMPONENT
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
COMPONENT
JK2802
PPJ245N2-01
COMP_ZENER_ROHM(MULTI)
COMP_ZENER_ROHM(MULTI)
COMP_ZENER_ROHM(MULTI)
COMP_ZENER_ROHM(MULTI)
COMP_ZENER_ROHM(MULTI)
COMP_ZENER_ROHM(MULTI)
[RD2]E-LUG
6E
[RD2]O-SPRING
5E
[RD2]CONTACT
4E
[WH]O-SPRING
5D
[RD1]CONTACT
4C
[RD1]O-SPRING
5C
[RD1]E-LUG-S
7C
[BL]O-SPRING
5B
[GN/YL]CONTACT
4A
[GN/YL]O-SPRING
5A
[GN/YL]E-LUG
6A
ZD2806-*1
ZD2807-*1
ZD2804-*1
ZD2805-*1
ZD2802-*1
ZD2803-*1
VA2804
5.6V
OPT
VA2803
5.6V
OPT
COMP_ZENER_KEC(MULTI)
COMP_ZENER_KEC(MULTI)
COMP_ZENER_KEC(MULTI)
COMP_ZENER_KEC(MULTI)
VA2800
5.6V
OPT
COMP_ZENER_KEC(MULTI)
COMP_ZENER_KEC(MULTI)
ZD2802
ZD2803
R2803
470K
R2802
470K
330pF
C2802
330pF
C2803
R2804
1608
ZD2806
ZD2807
ZD2804
ZD2805
75
OPT
R2811
10K
R2810
10K
R2859
75
3216
R2816
12K
R2815
12K
VA2802
5.5V
OPT
VA2801
OPT
5.5V
COMP2_R_IN
COMP2_L_IN
R28 01
75
R28 00
75
+3.3V_NORMAL
R2817
10K
VA2816
5.6V
OPT
+3.3V_NORMAL
R2812
10K
C2800
0.1uF
COMP2_Y+/AV_CVBS_IN
SCART AMP
+12V
EU
C2808
VCC
OUT2
IN2-
IN2+
0.1uF
50V
EU
R2841
EU
R2840
5.6K
EU
C2810
33pF
EU
R2842
220K
33K
EU
R2839
10K
CLOSE TO MSTAR
SCART_MUTE_NPN_NXP(MULTI)
Q2803-*1
MMBT3904(NXP)
R2843
470K
OPT
EU
C2811
330pF
EU
R2844
2.2K
EU
C2812
10uF
16V
SCART1_Rout
DTV/MNT_R_OUT
IC2801
AZ4580MTR-E1
OUT1
1
IN1-
2
IN1+
3
VEE
4
8
EU
7
6
5
R2818
1K
COMP2_Pr+
COMP2_Pb+
COMP2_DET
DTV/MNT_L_OUT
SCART1_Lout
C2804
10uF
16V
EU
330pF
C2806
EU
R2831
2.2K
OPT
R2832
470K
EU
220K
R2833
EU
EU
R2834
33K
C2807
33pF
EU
R2835
5.6K
EU
R2836
10K
EU
CLOSE TO MSTAR
R2814
1K
OPT
16V
AV_CVBS_DET
SCART_MUTE_NPN_NXP(MULTI)
Q2802-*1
MMBT3904(NXP)
FULL SCART
22
21
20
19
18
17
16
15
14
13
12
11
10
EU
JK2801
PSC008-01
AV_DET
COM_GND
SYNC_IN
SYNC_OUT
SYNC_GND2
SYNC_GND1
RGB_IO
R_OUT
RGB_GND
R_GND
D2B_OUT
G_OUT
D2B_IN
G_GND
9
ID
8
B_OUT
7
AUDIO_L_IN
6
B_GND
5
AUDIO_GND
4
AUDIO_L_OUT
3
AUDIO_R_IN
2
AUDIO_R_OUT
1
VA2807
5.5V
ESD_SCART
VA2808
20V
ESD_SCART
ESD_SCART
VA2810
20V
VA2811
20V
ESD_SCART
VA2812
20V
ESD_SCART
VA2813
5.6V
ESD_SCART/AV2
AV2_L_IN_A
VA2809
5.6V
ESD_SCART/AV2
AV2_R_IN_A
VA2806
5.6V
OPT
VA2815
5.6V
OPT
VA2814
R2807
75
R2808
75
R2805
75
R2806
470K
SCART/AV2
R2809
470K
SCART/AV2
EU
C2813
1000pF
50V
5.6V
+3.3V_NORMAL
R2819
10K
ZD2800-*1
AV2_CVBS_ZENER_ROHM(MULTI)
ZD2801-*1
AV2_CVBS_ZENER_ROHM(MULTI)
C2818
1000pF
50V
OPT
C2817
1000pF
50V
OPT
R2820 1K
EU
R2850 1K
AV2
ZD2800
AV2_CVBS_ZENER_KEC(MULTI)
ZD2801
AV2_CVBS_ZENER_KEC(MULTI)
SC1/COMP1_DET
AV2_CVBS_DET
EU
R2821
75
SCART/AV2
R2857
R2860
75
75
1608
OPT
1%
OPT
C2815
68pF
50V
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
3216
EU
R2861
10
OPT
C2816
68pF
50V
AV2
C2801
47pF
50V
R2822
75
EU
SC1/AV2_CVBS_IN
EU
R2824
15K
VA2817
20V
ESD_SCART
SCART/AV2
R2826
10K
SCART/AV2
R2825
10K
DTV/MNT_VOUT
EU
R2827
22
EU
R2828
3.9K
R2829
12K
SCART/AV2
R2830
12K
SCART/AV2
R2846
0
AV2
R2849
0
AV2
SC1_FB
SC1_ID
SC1/COMP1_L_IN
AV2_L_IN
SC1/COMP1_R_IN
AV2_R_IN
DTV/MNT_L_OUT
[SCART AUDIO MUTE]
DTV/MNT_L_OUT
SCART_MUTE_NPN_KEC(MULTI)
DTV/MNT_R_OUT
SCART_MUTE_NPN_KEC(MULTI)
AV2
JK2803
PPJ231-02
Q2802
2N3904S
Q2803
2N3904S
4
5
7
8
6
SCART_MUTE
R2837
2K
SCART_MUTE
R2838
2K
R2848
0
EU
R2847
0
AV2
AV2
VA2820
5.6V
OPT
SCART_MUTE
C2809
0.1uF
AV2_R_IN_A
AV2_L_IN_A
AV2_CVBS_DET
SC1/AV2_CVBS_IN
SCART_MUTE
R2845
10K
+3.5V_ST
SCART1_MUTE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
VA2805
5.6V
OPT
EU
C2814
1000pF
50V
DTV/MNT_R_OUT
M1A_URSA9_UD
SCART_ COMPONENT
2014.04.24
28
Headphone
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
RS-232C Control INTERFACE
SIDE_HP_MUTE
OPT
R3000
1K
RS232C_PHONE
RS232C_PHONE
RS232C_PHONE
RS232C_PHONE
MMBT3904(NXP)
C3006
0.33uF
RS232C_PHONE
C3008
0.1uF
C3009
0.1uF
C3010
0.1uF
C3011
0.1uF
DOUT2
RIN2
Q3000
C1+
V+
C1-
C2+
C2-
V-
B
OPT
1
2
3
4
5
6
7
8
OPT
R3001
C
3.3K
E
RS232C_PHONE
IC3001
MAX3232CDR
EAN41348201
Close to the Main IC
HEAD_PHONE
L3000
HP_LOUT
+3.5V_ST
B
HP_ROUT
E
OPT
Q3001
MMBT3906(NXP)
C
5.6uH
HEAD_PHONE
L3001
5.6uH
Close to the Main IC
+3.5V_ST
RS232C_PHONE
C3007
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
HEAD_PHONE
C3004
4.7uF
HEAD_PHONE
C3005
4.7uF
10V
10V
RS232C_PHONE
R3008
0
RS232C_PHONE
R3009
0
HEAD_PHONE
C3000
10uF
16V
HEAD_PHONE
C3001
10uF
16V
OPT
C3002
1000pF
50V
OPT
C3003
1000pF
50V
HEAD_PHONE
R3002
1K
HEAD_PHONE
R3003
1K
PM_RXD
PM_TXD
Q3002
MMBT3904(NXP)
OPT
Q3003
MMBT3904(NXP)
OPT
C
E
C
E
B
B
OPT
ZD3001
ADUC 20S 02 010L
20V
B
B
E
Q3004
MMBT3904(NXP)
OPT
C
HP_DET
E
Q3005
MMBT3904(NXP)
OPT
C
RS232C_PHONE
RS232C_PHONE
OPT
ZD3002
ADUC 20S 02 010L
20V
+3.3V_NORMAL
HEAD_PHONE
R3004
HEAD_PHONE
R3006
100
R3007
100
R3005
10K
1K
PHONE_JACK
JK3000
PEJ038-3B6
5GND
4L
3DETECT
1R
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
2014.04.24
HEAD_PHONE_EU30
VA3216
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
HDMI32
2014.04.24
RS-232C 4PIN & MSTAR DEBUG 4PIN
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
RS-232C 4PIN
PM_TXD
PM_RXD
MSTAR DEBUG 4PIN
12507WS-04L
P4001
+3.5V_ST
R4001
100
R4000
100
JP_GND2
1
2
3
4
5
RGB_DDC_SCL
RGB_DDC_SDA
JP_GND1
VCC
PM_RXD
GND
RM_TXD
JP_GND3
P4000
12507WS-04L
1
2
3
4
GND
JP_GND4
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
RS232C_MSTAR_DEBUG_4P
2014.04.24
40
TP for EU
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SPDIF_OUT
AV2_CVBS_DET
HDMI_ARC
DDC_SDA_2
DDC_SCL_2
HP_ROUT
HP_LOUT
SIDE_HP_MUTE
HP_DET
CI_DET
/CI_CD1
/CI_CD2
EPHY_RP
EPHY_TN
EPHY_TP
EPHY_RN
URSA_RESET
DEMOD_RESET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
TP_EU41
2014.04.24
IR/LED + Digital Eye + Control
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
R4604
R4603
R4601
100
KEY1
R4602
100
KEY2
+3.5V_ST
L4600
BLM18PG121SN1D
+3.5V_ST
R4600
3.3K
IR
C4600
0.1uF
C4601
1000pF
16V
50V
HDMI_SW_SCL
HDMI_SW_SDA
IR_SCL
IR_SDA
10K
10K
1%
1%
P4600
12507WR-10L
1
2
3
4
5
6
7
8
9
10
11
LED_R/BUZZ
C4602
0.1uF
16V
C4603
0.1uF
16V
C4604
100pF
R4608 100
R4609 100
R4606
1.8K
50V
OPT
OPT
R4605 100
EYE_SENSOR
R4607 100
EYE_SENSOR
VA4600
OPT
ZD4601
OPT
5V
EYE_SENSOR
C4605
18pF
50V
EYE_SENSOR
C4606
18pF
50V
OPT
P4601
12507WR-08L
1
2
3
4
5
6
7
8
9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
IR_EYE_SENSOR
2014.04.24
46
/F_RB
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
/PF_OE
/PF_CE0
/PF_CE1
PF_ALE
/PF_WE
/PF_WP
+3.3V_NORMAL
AR103
R107
22
1K
R108
1K
OPT
+3.3V_NORMAL
AR104
22
R102
3.3K
C101
0.1uF
R109
3.9K
OPT
R105
1K
R106
1K
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
R/B
RE
CE
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
CLE
ALE
WE
WP
NC_11
NC_12
NC_13
NC_14
NC_15
IC102
H27U1G8F2CTR-BC
1
NAND_1G_HYNIX(MULTI)
EAN35669103
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
NAND FLASH MEMORY
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
C103
VSS_2
0.1uF
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
+3.3V_NORMAL
22
AR101
C102
10uF
10V
AR102
PCM_A[0-7]
PCM_A[7]
PCM_A[6]
PCM_A[5]
PCM_A[4]
PCM_A[3]
PCM_A[2]
PCM_A[1]
PCM_A[0]
22
<CHIP Config>
(SPI_SDI, PM_LED, PWM_PM)
LG-NonOS SB51_ExtSPI 3’b000 51boot from SPI
LG-OS HEMCU_ExtSPI 3’b001 MIPS boot from SPI
+3.5V_ST
OPT
OPT
R165 2.7K
R117 4.7K
R115 4.7K
OPT
R121 2.7K
R116 4.7K
R118 4.7K
NVRAM_ATMEL(MULTI)
IC104
AT24C256C-SSHL-T
A0
1
A1
2
A2
A0’h
3
GND
4
VCC
8
WP
7
SCL
6
SDA
5
EAN61133501
R125
1.8K
A0
A1
A2
GND
NVRAM_RHOM(MULTI)
IC104-*1
BR24G256FJ-3
1
2
3
4
EAN62389502
+3.3V_NORMAL
R140
R144
R141
1K
2.2K
1K
8
7
6
5
R145
2.2K
NAND_2G_HYNIX(MULTI)
NC_1
1
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
R/B
7
RE
8
CE
9
NC_7
10
NC_8
11
VCC_1
12
VSS_1
13
NC_9
14
NC_10
15
CLE
16
ALE
17
WE
18
WP
19
NC_11
20
NC_12
21
NC_13
22
NC_14
23
NC_15
24
NAND_2G_TOSHIBA(MULTI)
NC_1
1
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
RY/BY
7
RE
8
CE
9
NC_7
10
NC_8
11
VCC_1
12
VSS_1
13
NC_9
14
NC_10
15
CLE
16
ALE
17
WE
18
WP
19
NC_11
20
NC_12
21
NC_13
22
NC_14
23
NC_15
24
EAN60708703
IC102-*1
H27U2G8F2DTR-BD
EAN60991001
IC102-*3
TC58NVG1S3ETA00
NAND_1G_TOSHIBA(MULTI)
EAN61508002
IC102-*2
TC58NVG0S3HTA00
NC_29
NC_1
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O8
44
I/O7
43
I/O6
42
I/O5
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O4
32
I/O3
31
I/O2
30
I/O1
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
NC_2
NC_3
NC_4
NC_5
NC_6
RY/BY
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
1
2
3
4
5
6
7
RE
8
CE
9
10
11
12
13
14
15
CLE
16
ALE
17
WE
18
WP
19
20
21
22
23
24
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O8
44
I/O7
43
I/O6
42
I/O5
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O4
32
I/O3
31
I/O2
30
I/O1
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
R1011KR104
1K
R110
1.8K
R119
1.8K
R120
1.8K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
I2S_AMP
SPK_L+
SPK_L-
SPK_R+
SPK_R-
M1A_URSA9_UD
AUDIO[NTP]
WAFER-ANGLE
4
3
2
1
P5600
2014.04.24
56
L14 TUNER_EU T/C_T2/C/S2_CHINA
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
TUNER_EU67
2014.04.24
+3.3V_U_NORMAL
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
output wafer]
DEV_51pin_Wafer
P13000
SP14-11592-01-51Pin
51
1
50
2
49
3
48
4
47
5
46
6
45
7
44
8
43
9
42
10
41
11
40
12
39
13
38
14
37
15
36
16
35
17
34
18
33
19
32
20
31
21
30
22
29
23
28
24
27
25
26
26
25
27
24
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
.
R13011 0
Non_INX_Module
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
R13033 10K
R13006 0
TXDAP7_L
TXDAN7_L
TXDAP6_L
TXDAN6_L
TXDAP5_L
TXDAN5_L
TXDAP4_L
TXDAN4_L
TXDAP3_L
TXDAN3_L
TXDAP2_L
TXDAN2_L
TXDAP1_L
TXDAN1_L
TXDAP0_L
TXDAN0_L
LOCKn_IN
HTPDn_IN
OPT
OPT
L13000
MLB-201209-0120P-N2
TCON_PWR_Vx1_Wafer
C13032
10uF
16V
+3.3V_U_NORMAL
+3.3V_U_NORMAL
*Pin31(BIT_SEL)
HIGH or NC : 10Bit
LOW : 8Bit
*Pin35(PCID)
High:PCID enable
3D_EN
Low or NC : PCID diable
R13005 0
LGD_120Hz
R1501 0
LGD_60Hz
PWM_DIM
R13009
0
PANEL_VCC
C13033
10uF
16V
IC13000
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
R13010
0
LOCKn_IN
R13003
10K
OPT
R13004
10K
LGD_Module
R1502 0
75
R13036
33
R13042
+1.8VR13008
LGD_60Hz
+1.8V
C13034
10uF
10V
+3.3V_U_NORMAL
R13025
10K
R13002
100
PWM_DIM_SYNC
10K
C
Q13001
B
2N3904S
NPN_KEC(MULTI)
E
+3.3V_U_NORMAL
R13034
10K
OPT
R13037 0
Non_AUO_Module
R13007
10K
Non_AUO_Module
L13001
OPT
R13015 0
LGD_120Hz
C13035
10uF
10V
R13014
10K
B
B
+3.3V_U_NORMAL
R13016 0
LGD_120Hz
+3.3V_U_NORMAL
R13040
10K
OPT
R13041
10K
LGD_120Hz
R13017
10K
C
Q13002
2N3904S
NPN_KEC(MULTI)
E
C
Q13001-*1
MMBT3904(NXP)
NPN_NXP(MULTI)
E
L_DIM_EN
R13044
10K
OPT
R13045
10K
LGD_120Hz
LOCKAn
C
Q13002-*1
B
MMBT3904(NXP)
NPN_NXP(MULTI)
E
L/D_EN(Pin30)
- T-Con L/D Function
HIGH : Enable
LOW or NC : Disable
*LGD_120Hz: T240 module (UB98/95,D9)
+3.3V_U_NORMAL
R13018
4.7K
OPT
R13013 0
2N7002KA
TCON_FET_KEC(MULTI)
+3.3V_U_NORMAL
R13019
4.7K
OPT
R13012 0
2N7002KA
TCON_FET_KEC(MULTI)
Data_Format_1
Data_Format_0
HTPDn_IN
TCON_I2C_EN
G
D
S
Q13004
R13055
OPT
33
TCON_I2C_EN
G
D
S
Q13005
R13059
OPT
33
G
S
D
Q13005-*1
2N7002K
TCON_FET_DIODES(MULTI)
Data Input Format[1:0]
*Mode 3 (4 Division)
- Data Format 0(Pin37) = Low
Data Format 1(Pin36) = High
*Mode 2 (2 Division)
- Data Format 0(Pin37) = High
Data Format 1(Pin36) = Low
+1.8V
R13020
10K
R13021
100
G
S
D
Q13004-*1
2N7002K
TCON_FET_DIODES(MULTI)
R13061 0
OPT
R1503 0
Non_AUO_Module
R13062 0
OPT
R1506 0
Non_AUO_Module
+3.3V_U_NORMAL
R13022
10K
C
Q13003
B
2N3904S
NPN_KEC(MULTI)
E
R13023
B
10K
C
E
URSA_SCL
IR_SCL
URSA_SDA
IR_SDA
R13024
10K
C
Q13006
B
2N3904S
NPN_KEC(MULTI)
E
Q13003-*1
MMBT3904(NXP)
NPN_NXP(MULTI)
B
HTPDAn
C
Q13006-*1
MMBT3904(NXP)
NPN_NXP(MULTI)
E
[41P Vx1
output wafer]
DEV_41pin_Wafer
P13001
SP14-11592-01-41Pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
Not Used Net (UB85/95/UC89)
1
2
3
4
5
6
7
8
9
TXDBP11_L
TXDBN11_L
TXDBP10_L
TXDBN10_L
TXDBP9_L
TXDBN9_L
TXDBP8_L
TXDBN8_L
GND_Vx1
GND_Vx1_2
GND_Vx1
TXDBP11_L
TXDBN11_L
GND_Vx1_2
TXDBP10_L
TXDBN10_L
TXDBP9_L
TXDBN9_L
TXDBP8_L
TXDBN8_L
TXDBP7_L
TXDBN7_L
TXDBP6_L
TXDBN6_L
TXDBP5_L
TXDBN5_L
TXDBP4_L
TXDBN4_L
TXDBP3_L
TXDBN3_L
TXDBP2_L
TXDBN2_L
TXDBP1_L
TXDBN1_L
TXDBP0_L
TXDBN0_L
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
U_Output_wafer
2014.04.24
130
A_DDR3_DQ[0-15]
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
URSA9_DDR
2014.04.24
131
Clock for URSA9
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C13236
8pF
50V
X-TAL_1
GND_1
1
2
3
C13237
8pF
50V
4
GND_2
X-TAL_2
SPI Flash
SPI_CZ
SPI_DO
FLASH_WP_URSA
R13246
R13205
FRC_FLASH_WP
Chip Config
Debug/ISP ADDR
Slave (Debug Port:0XB4,ISP:0X98)
CHIP_CONF:{DIM2,DIM1,DIM0}
CHIP_CONF=3’d7:111:boot from SPI Flash
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
U_UART_GPITO
2014.04.24
132
+1.5V_U_DDR
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
U_Power
2014.04.24
133
+12V
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
L13411
BLM18PG121SN1D
C13443
10uF
16V
+12V
L13401
BLM18PG121SN1D
C13412
10uF
16V
C13410
0.1uF
C13413
0.1uF
+1.5V URSA DDR
R13424
10K
EN
R13422
R13421
3.6K
18K
R1
C13444
100pF
50V
1%
1%
R13423
22K
1/1 6W
1%
R2
C13445
1uF
10V
C13446
2200pF
50V
FB
VREG
SS
Vout=0.765*(1+R1/R2)=1.516V
+3.3V URSA
+3.3V_NORMAL
R13415
10K
EN
R13412
R13413
R1
68K
6.8K
1%
1%
C13414
100pF
50V
R2
R13414
22K
1%
C13415
1/1 6W
1uF
10V
C13416
2200pF
50V
FB
VREG
SS
POWER_ON/OFF_1
IC13403
BD9D321EFJ
1
9
2
THERMAL
3
4
3A
IC13401
BD9D321EFJ
1
9
2
THERMAL
3
4
3A
MAX 4.7A
+1.5V_U_DDR
[EP]
VIN
8
7
6
5
8
7
6
5
BOOT
SW
GND
[EP]
VIN
BOOT
SW
GND
16V
0.1uF
C13447
L13412
2.2uH
VLS5045EXT-2R2N
C13448
16V
0.1uF
C13417
L13404
2.2uH
VLS5045EXT-2R2N
C13418
22uF
10V
+3.3V_U_NORMAL
22uF
10V
C13449
22uF
10V
C13419
22uF
10V
D13401
ZD13401
2.5V
OPT
5V
TVS_SEMTECH(MULTI)
D13401-*1
TVS_KEC(MULTI)
+3.3V_U_NORMAL
VDDC
ZD13400
+1.15V URSA9 Core
R13404
10K
3.3
R13403
1/10W
5%
C13404
470pF
50V
1%
16V
0.1uF
C13405
4.7
1%
27K
1/1 6W
30V
R13425
10K
R13426
OPT
2.5V
10K
C13400
22uF
C13401
22uF
C13403
1000pF
50V
R134010
R13400
C13402
2K
1/16W
0.1uF
5%
16V
L13403
1.0uH
C13411
R13402
22uF
Vout=0.6*(1+R1/R2)
1/1 6W
R13 405
PGOOD
VBST
NC_1
SW_1
SW_2
SW_3
SW_4
D13400
OPT
91K
R13 406
RF
1
2
EN
3
4
5
6
7
8
9
R13407
39K
1/16W
5%
[EP]
THERMAL
29
IC13402
TPS53513RVER
8A
10
PGND_111PGND_212PGND_313PGND_414PGND_5
R1
R13408
4.87K
1/16W
1%
TRIP26NC_327GND128GND2
24VO25
R2
R13409
5.1K
1/16W
1%
1%
FB
23
GND
22
MODE
21
VREG
20
VDD
19
NC_2
18
VIN_3
17
VIN_2
16
VIN_1
15
R13411
C13406
2200pF
50V
240
1/16W
1%
1/16W
20K
R13410
C13407
1uF
10V
L13402
C13408
10uF
16V
+12V
C13409
10uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_URSA9_UD
URSA_DCDC
2014.04.24
134
TCON_PWR_5pin_Wafer
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
P13401
20037WR-05A00
1
T-con power
GASKET_8.0X6.0X10.5H
OPT
M13000
MDS62110225
GASKET_8.0X6.0X10.5H
OPT
M13001
MDS62110225
6
GASKET_8.0X6.0X10.5H
OPT
M13002
MDS62110225
2
3
4
5
GASKET_8.0X6.0X10.5H
OPT
M13003
MDS62110225
C13434
10uF
16V
L13409
MLB-201209-0120P-N2
L13410
MLB-201209-0120P-N2
C13435
0.1uF
25V
GASKET_8.0X6.0X10.5H
MDS62110225
10.5TSMD bottom Gasket
OPT
M13004
PANEL_VCC
C13440
10uF
16V
OPT
GASKET_8.0X6.0X10.5H
C13442
0.1uF
25V
M13005
MDS62110225
OPT
GASKET_8.0X6.0X10.5H
OPT
M13006
MDS62110225
SMD_GASKET
GASKET_8.0X6.0X10.5H
M13007
MDS62110225
GASKET_8.0X6.0X10.5H
OPT
M13008
MDS62110225
GASKET_8.0X6.0X10.5H
OPT
M13009
MDS62110225
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SMD_GASKET
GASKET_8.0X6.0X10.5H
M13010
MDS62110225
M1A_URSA9_UD
T-CON POWER
2014.04.24
141
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