Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to LA41U/LA41V/LA41B Chassis
applied LED TV all models manufactured in TV factory
2. Specification.
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15ºC
▪ In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
▪ In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above 15°C
for 3 hours
* Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
Above adjustment items can be also performed in Final
Assembly if needed. Both Board-level and Final assembly
adjustment items can be check using In-Start Menu 1.ADJUST
CHECK.
3.2. Final assembly adjustment
▪ White Balance adjustment
▪ RS-232C functionality check
▪ PING Test
▪ Factory Option setting per destination
▪ Ship-out mode setting (In-Stop)
4. Automatic Adjustment
4.1. ADC Adjustment
ADC adjustment is needed to find the optimum black level and
gain in Analog-to-Digital device and to compensate RGB
deviation.
4.1.1. Equipment & Condition
(1) USB to RS-232C Jig
(2) MSPG -925 Series Patt ern Gener ator(MSPG-925FA,
pattern -65)
- Resolution : 480i Comp1
1080P Comp1
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level : 0.7±0.1 Vp-p
- Image
4.1.2. Adjustment method
▪ Using USB, adjust items listed in 3.1 in the other shown in
“4.1.3.3”
4.1.3. 3 Adj. protocol
ProtocolCommandSet ACK
Enter adj. modeaa 00 00a 00 OK00x
Source changexb 00 40
xb 00 60
Begin adj.ad 00 10
Return adj. resultOKx (Case of Success)
Read adj. data(main)
ad 00 20
(sub )
ad 00 21
Conrm adj.ad 00 99NG 03 00x (Fail)
End adj.ad 00 90a 00 OK90x
b 00 OK04x (Adjust 480i, 1080p Comp1 )
b 00 OK06x (Adjust 1920*1080 RGB)
NGx (Case of Fail)
(main)
000000000000000000000000007c007b006dx
(Sub)
000000070000000000000000007c0083
0077x
NG 03 01x (Fail)
NG 03 02x (Fail)
OK 03 03x (Success)
3.3. Etc.
▪ Ship-out mode
▪ Service Option Default
▪ USB Download(S/W Update, Option, Service only)
▪ ISP Download (Option)
Only for training and service purposes
Ref.) ADC Adj. RS232C Protocol_Ver1.0
Adj. order
▪ aa 00 00 [Enter ADC adj. mode]
▪ xb 00 04 [Change input source to Component1(480i&1080p)]
▪ ad 00 10 [Adjust 480i&1080p Comp1]
▪ xb 00 06 [Change input source to RGB(1024*768)]
▪ ad 00 10 [Adjust 1920*1080 RGB]
▪ aa 00 90 End adj.
▪ Pr ess “Power on” key of service re mocon.(Bau d rate :
115200 bps)
▪ Connect RS-232C Signal to USB Cable to USB.
▪ Write Serial number by use USB port.
▪ Must check the serial number at Instart menu.
* Manual Download (Model Name and Serial Number)
If the TV set is downloaded By OTA or Service ma n,
sometimes model name or serial number is initialized. ( not
always)
It is impossible to download by bar code scan, so It need
Manual download.
a. Press the ‘INSTART’ key of ADJ remote controller.
b. Go to the menu ‘7. Model Number D/L’ like below photo.
c. Input the Factory model name or Serial number like below
photo.
d. Check the model name INSTART menu -> Factory name
displayed
e. Check the Diagnostics (DTV country only) -> Buyer model
displayed
4.5. WIFI MAC ADDRESS CHECK
4.5.1. Using RS232 Command
CommandSet ACK
Transmission[A][l][][Set ID][][20][Cr][O][K][x] or [N][G]
■ Check the menu on in-start
■ Method & Notice
A. Serial number D/L is using of scan equipment.
B. Setting of scan equipment operated by Manufacturing
Technology Group.
C. Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
5.1. ADC adjustment is not needed because of
OTP (Auto ADC adjustment)
5.2. EDID
(The Extended Display Identification Data)
/ DDC (Display Data Channel) download
5.2.1. Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any necessity of
user input. It is a realization of “Plug and Play”.
5.2.2. Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust remocon
5.2.3. Download method
1) Press Adj. key on the Adjust remocon, then select “12.EDID
D/L”.
By pressing Enter key, enter EDID D/L menu
5.2.4. EDID DATA
▪ Reference
- HDMI1 ~ HDMI3
- HDMI1 ~ HDMI4
- In the data of EDID, bellows may be different by Input mode
ⓐ Product ID
ⓑ Serial No: Controlled on production line.
ⓒ Month, Year: Controlled on production line:
ex) Monthly : ‘01’ -> ‘01’
Year : ‘2014’ -> ‘18
ⓓ Model Name(Hex): LGTV
ⓔ Checksum(LG TV): Changeable by total EDID data.
ⓕ Vendor Specific(HDMI)
2) Select [Start] button by pressing Enter key, HDMI1 / HDMI2
(*) ONLY FO R G P2 20 10 ye ar mo del. GP3 LW Se ries
[2011year] spec out !
5.5. White Balance Adjustment
5.5.1. Overview
5.5.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
5.5.2. Equipment
(1) Color Analyzer: CA-210 (LED Module : CH 14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Vi deo Sig nal Generator MSP G-925F 720p/204 -Gray
(Model: 217, Pattern: 49)
※ Color Analyzer Matrix should be calibrated using CS-1000
5.5.3. Equipment connection MAP
5.5.4. Adj. Command (Protocol)
<Command Format>
START 6E A 50 A LEN A 03 A CMD A 00 A VAL A CS
A STOP
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMDDATAID
wb0000Begin White Balance adj.
wb0010Gain adj.(internal white pattern)
wb001fGain adj. completed
wb0020Offset adj.(internal white pattern)
wb002fOffset adj. completed
wb00ffEnd White Balance adj.
(internal pattern disappears )
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
*(wb 00 20(start), wb 00 2f(endc)) -> Off-set adj.
wb 00 ff -> End white balance auto adj.
(2) Adjustment Map
(Applied Model : L A41 U/L A 41 V /LA 41B Cha ssi s ALL
5.5.5.1. Auto WB calibration
(1) Set TV in adj. mode using POWER ONNY key
(2) Zero calibrate probe then place it on the center of the
Display
(3) Connect Cable (RS-232C to USB)
(4) Select mode in adj. Program and begin adj.
(5) When adj. is complete (OK Sign), check adj. status pre
mode(Warm, Medium, Cool)
(6) Remove probe and RS-232C to USB cable to complete adj.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.5.6. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 206 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode
Cool0.2710.27013,000K0.0000
Medium0.2860.2899,300K0.0000
Warm0.3130.3296,500K0.0000
Coordinate
XY
Temp△uv
5.5.5.2. Manual adj. method
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
3) Press ADJ key -> EZ adjust using adj. R/C -> 7. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 216 Gray internal pattern will be
displayed)
4) One of R Gain / G Gain / B Gain should be fixed at 192, and
the rest will be lowered to meet the desired value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
** R-fix adjustment
Adjust modes (Cool), Fix the R gain to 210 (default data) and
change the others (G/B Gain ).
- Adjust the R gain more than 210 ( If G gain or B gain is less
than 0 , R gain can adjust more than 210 ) and
change the others ( G/B Gain ).
Adjust two modes (Medium / Warm), Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 7.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
▪ Adj. condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to isolate
adj. area into dark surrounding.
2) Probe location
- PDP : Color Analyzer (CA-100, CA-100+, CA210) probe
should be firmly attached to the Module
- LCD : Color Analyzer (CA-210) probe should be within 10cm
and perpendicular of the module surface (80°~ 100°)
3) Aging time
- After Aging Start, Keep the Po wer ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
▪ Standard color coordinate and temperature using CA-210
(CH 14)
Mode
Cool0.271±0.0020.270±0.00213000K0.0000
Medium0.286±0.0020.289±0.0029300K0.0000
Warm0.313±0.0020.329±0.0026500K0.0000
Coordinate
XY
Temp△uv
5.5.7. EDGE & IOL LED White balance table
▪ Edge & ALEF LED module change color coordinate because
of aging time
▪ apply under the color coordinate table, for compensated
aging time
(Normal line) Edge & ALEF LED White balance table
- gumi(Mar~Dec) & Global
Model : (normal line)LGD, CMI
(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
(2) Check the sound from the TV Set
6. GND and Internal Pressure check
6.1. Method
1) GND & Internal Pressure auto-check preparation
- Check that Power Cord is fully inserted to the SET. (If loose,
re-insert)
2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V arrive
to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
(3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
5.10. EYE-Q Green Function Inspection
step 1) Turn on the TV..
Step 2) Press 'EYE button' on the adjustment remote-controller.
Step 3) Cover 'Eye Q sensor' on the front of set with your hands,
hold it for 6 seconds.
Step 4) Check "the Sensor Data" on the screen, make certain that
Data is below 10. If Data isn’t below 10 in 6 seconds, Eye
Q sensor would be bad. You sho uld change Eye Q
sensor.
Step 5) Uncover your hands from Eye Q sensor, hold it for 6
seconds.
Step 6) Check "B ack Light(xxx)" on the screen, check data
increase . You should change Eye Q sensor
Tuner GND is separated.
6.2. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
*Measurement condition:
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
10.0
12.0
8.10
10.8WVrms
1012WEQ On
EQ Off
AVL Off
Clear Voice Off
AVL On
Clear Voice On
8. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-001-HD
2013-12-17
H13 D CHIP
LG1154A
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
SMD TOP for EMI
SMD_GASKET_8.5T
GASKET_8.0X6.0X8.5H
M200
MDS62110209
SMD_GASKET_12.5T
GASKET_8.0X6.0X12.5H
M200-*1
MDS62110217
+1.5V_DDR
L230
BLM18PG121SN1D
22uF
C303
C302
0.1uF
C306
0.1uF
C308
0.1uF
C305
VDDC15_M1
+1.5V_Bypass Cap
VDDC15_M0
R200
OPT
OPT
OPT
0.1uF
C309
0.1uF
C311
0.1uF
C312
OPT
OPT
0.1uF
C313
OPT
0.1uF
C314
C350
0.1uF
C352
0.1uF
0.1uF
C353
0.1uF
C354
0.1uF
C355
0.1uF
C356
0.1uF
C357
0.1uF
C358
0.1uF
C359
0.1uF
C360
0.1uF
C361
0.1uF
C362
0.1uF
C363
0.1uF
C365
0.1uF
C366
0.1uF
C367
0.1uF
C369
0.1uF
C370
0.1uF
C371
0.1uF
C372
0.1uF
R201
VREF_M0_0
1K 1%
1K 1%
C296
OPT
0.1uF
VDDC15_M0
R202
R203
1K 1%
VREF_M0_1
1K 1%
OPT
C344
0.1uF
+1.5V_DDR
L228
BLM18PG121SN1D
22uFC299
C307
0.1uF
VDDC15_M1
R300
R301
VREF_M1_0
1K 1%
1K 1%
C304
OPT
0.1uF
VDDC15_M1VDDC15_M0
VREF_M1_1
R302
1K 1%
OPT
0.1uF
R303
1K 1%
C310
BSD-14Y-UD-003-HD
2013-12-17
MAIN POWER
Place JACK Side
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
AV1_CVBS_IN
5.5V
D404
SC_CVBS_IN
TU_CVBS
SCART_FB_DIRECT
SC_FB
SC_ID
NON_EU
R422-*1
SC_CVBS_IN_SOY
COMP1_Pb
COMP1_Y
COMP1_Pr
SC_L_IN
SC_R_IN
SCART_Lout
SCART_Rout
HP_LOUT_MAIN
HP_ROUT_MAIN
R423100
R435
R422
75
0
SCART_FB_DIRECT
SC_B
SC_G
SC_R
C472
D406
D403
D401
5.5V
5.5V
5.5V
Near Place Scart AMP
EU
1uF25V
C6006
EU
10K
1uF 25V
R6005
C6001
COMP1/AV1/DVI_L_IN
COMP1/AV1/DVI_R_IN
+12V
EU
R403
100K
EU
R404
100K
R430
22K
OPT
R445
22K
OPT
C405
150pF
50V
C408
150pF
50V
EU
10K
10pF
C473
50V
OPT
EU
10K
R60 06
EU
R408
100K
2.2uF
R409
100K
R6450
C400
0.01uF
OPT
C401
0.01uF
OPT
10V
C402
150pF
50V
EU
C403
EU
L408
OPT
EU
10pF
50V
EU
100
R6451
L409
EU
C474
OPT
C430
2.2uF
100
1uH
C410
150pF
1uH
C462
150pF
EU
R436
2.7K
10pF
50V
OPT
10pF
10pF
C431
50V
50V
SCART_AMP_R_FB
SCART_AMP_L_FB
EU
C406
10V
+3.3V_NORMAL
R4641K1/16W
R465
390
EU
R436-*1
0
75
1%
EU
R412
10pF
C470
50V
SCART_Lout_SOC
SCART_Rout_SOC
1%
C404
0.01uF
50V
1/16W
1%
DAC_START_PULLDOWN
R466821/16W
R410
75
1%
3216
R411
75
1%
3216
NON_EU
75
75
EU
EU
1%
1%
R416
R414
75
75
1%
1%
R415
R413
AUDA_OUTL
AUDA_OUTR
CLK_54M_VTT
1%
75
1%
R417
FOR EMI
R400
R405
R427
R424
R425
1%
R41827K
1%
R41927K
1%
R42027K
1%
R42127K
SC_FB
Clock for H13A
MAIN Clock(24Mhz)
12pFD13_STPO_SOP
C426
12pF
C427
Place SOC Side
R434
C424 0.047uF
100
R433
C425 0.047uF
100
SC_CVBS_IN_SOY
R432
C423 0.047uF
100
C417 0.047uF
33
C418 0.047uF
33
C428 1000pF
C419 0.047uF
33
C420 0.047uF
33
C421 0.047uF
33
C429 1000pF
C422 0.047uF
33
R431
AUDIO IN
C4324.7uF
R43710K 1%
C4334.7uF
R43810K 1%
C4344.7uF
R43910K 1%
C4354.7uF
R44010K 1%
+3.3V_NORMAL
R446
4.7K
R401
470
1/16W
5%
R4061K
SCART_FB_BUFFER
SCART_FB_BUFFER
C
B
E
1/16W
1%
SCART_FB_BUFFER
X-TAL_1
GND_1
1
2
4
3
GND_2
X-TAL_2
AV1_CVBS_IN_SOC
SC_CVBS_IN_SOC
TU_CVBS_SOC
SC_FB_SOC
SC_ID_SOC
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_Y_IN_SOC_SOY
COMP1_PR_IN_SOC
COMP2_PB_IN_SOC
COMP2_Y_IN_SOC
COMP2_Y_IN_SOC_SOY
COMP2_PR_IN_SOC
SC_FB_BUF
MMBT3904(NXP)
Q400
SCART_FB_BUFFER
R441
X400
24MHz
SOC_RESET
AUAD_L_CH3_IN
AUAD_R_CH3_IN
AUAD_L_CH2_IN
AUAD_R_CH2_IN
Tuner IF Filter
1M
COMP1_Y_IN_SOC_SOY
COMP2_Y_IN_SOC_SOY
HP_LOUT_AMP
XIN_SUB
XOUT_SUB
XIN_SUB
XOUT_SUB
XTAL_SEL[0]
XTAL_SEL[1]
C415
OPM[0]
0.1uF
OPM[1]
H13A_SCL
H13A_SDA
AV1_CVBS_IN_SOC
SC_CVBS_IN_SOC
TU_CVBS_SOC
DTV/MNT_V_OUT_SOC
OPT
Placed as close as possible to SOC
REFT
REFB
R44768
R44868
R44968
SC_ID_SOC
SC_FB_SOC
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_PR_IN_SOC
COMP2_PB_IN_SOC
COMP2_Y_IN_SOC
COMP2_PR_IN_SOC
+3.3V_NORMAL
POWER_SAVE
HP_OUT
L400
To ADC
VOUT
VSAG
NON_TU_W_BR/TW
NON_TU_W_BR/TW
NON_TU_W_BR/TW
HP_OUT
C407
0.22uF
10V
DTV/MNT_V_OUT
ADC_I_INN
ADC_I_INP
BLM18PG121SN1D
Place at JACK SIDE
P17
6
5
4
TU_W_BR/TW
R443-*1
220
0.01uF
0.01uF
BLM18PG121SN1D
HP_ROUT_AMP
V+
GND
VIN
C437
C438
P18
J17
N18
D18
M18
M17
E3
K3
K2
A8
B8
U13
V14
V15
V13
U15
U14
U7
V6
V7
U10
V12
T5
T6
U8
V8
V9
U9
V10
U11
V11
U12
L406
OPT
HP_OUT
L401
R453330
C443 0.047uF
68
R450
C439
100pF
50V
C440 0.047uF
C441 0.047uF
C442 0.047uF
IC400
NJM2561BF1
1
EU
2
3
R443
51
C436
22pF
R444
51
Placed as close as possible to IC100
HP_LOUT
OP MODE Setting
& Select XTAL Input
OP MODE[0:1] : SW[2:1]
00 => Normal Operaiton Mode
/T32 Debug Mode
01 => Internal Test Purpose
10 => Internal Test Purpose
11 => Internal Test Purpose
XTAL SEL[1:0] : SW[4:3]
00 => Xtal Input
01 => CLK 24M from H13D
10 => XTAL Bypass from H13D
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-004-HD
2013-12-17
MAIN AUDIO/VIDEO
IC100
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BSD-14Y-UD-005-HD
2013-12-17
MAIN DDR
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