LG 49SJ800V, 55SJ800V Schematic

CONFIDENTIAL

LED TV

SERVICE MANUAL

CHASSIS : UD71H

MODEL : 49SJ800V 55SJ800V

CAUTION

49SJ800V-ZB 55SJ800V-ZB

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

P/NO : MFL69780305 (1703-REV00)

Copyright © 2017 LG Electronics Inc. All rights reserved. Only training and service purposes.

CONTENTS

CONTENTS ..............................................................................................	2
SAFETY PRECAUTIONS .........................................................................	3
SERVICING PRECAUTIONS....................................................................	4
SPECIFICATION........................................................................................	6
SOFTWARE UPDATE ............................................................................	10
BLOCK DIAGRAM..................................................................................	11
EXPLODED VIEW ..................................................................................	18
DISASSEMBLY GUIDE ..........................................................................	19
TROUBLE SHOOTING GUIDE ................................................	APPENDIX

- 2 -	Copyright ©	LG Electronics. Inc. All rights reserved.
	Only for training and service purposes.

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Exploded View.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc.

If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ.

When the exposed metal has no return path to the chassis the reading must be infinite.

An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts.

Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA.

In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

- 3 -	Copyright ©	LG Electronics. Inc. All rights reserved.
	Only for training and service purposes.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1.Always unplug the receiver AC power cord from the AC power source before;

a.Removing or reinstalling any component, circuit board module or any other receiver assembly.

b.Disconnecting or reconnecting any receiver electrical plug or other electrical connection.

c.Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2.Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3.Do not spray chemicals on or near this receiver or any of its assemblies.

4.Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

5.Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6.Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7.Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

8.Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static type solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1.Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2.Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3.Keep the soldering iron tip clean and well tinned.

4.Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5.Use the following unsoldering technique

a.Allow the soldering iron tip to reach normal temperature. (500 °F to 600 °F)

b.Heat the component lead until the solder melts.

c.Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6.Use the following soldering technique.

a.Allow the soldering iron tip to reach a normal temperature (500 °F to 600 °F)

b.First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.

c.Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d.Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

- 4 -	Copyright ©	LG Electronics. Inc. All rights reserved.
	Only for training and service purposes.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1.Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2.Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1.Carefully insert the replacement IC in the circuit board.

2.Carefully bend each IC lead against the circuit foil pad and solder it.

3.Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1.Remove the defective transistor by clipping its leads as close as possible to the component body.

2.Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3.Bend into a "U" shape the replacement transistor leads.

4.Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1.Heat and remove all solder from around the transistor leads.

2.Remove the heat sink mounting screw (if so equipped).

3.Carefully remove the transistor from the heat sink of the circuit board.

4.Insert new transistor in the circuit board.

5.Solder each transistor lead, and clip off excess lead.

6.Replace heat sink.

Diode Removal/Replacement

1.Remove defective diode by clipping its leads as close as possible to diode body.

2.Bend the two remaining leads perpendicular y to the circuit board.

3.Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4.Securely crimp each connection and solder it.

5.Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1.Clip each fuse or resistor lead at top of the circuit board hollow stake.

2.Securely crimp the leads of replacement component around notch at stake top.

3.Solder the connections.

CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1.Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2.carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3.Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4.Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1.Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2.Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3.Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

- 5 -	Copyright ©	LG Electronics. Inc. All rights reserved.
	Only for training and service purposes.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range	3. Test method
This specification is applied to the LED TV used UD71H	(1) Performance: LGE TV test method followed
chassis.	(2) Demanded other specification
	- Safety : CE, IEC specification
	- EMC : CE, IEC specification
2. Requirement for Test	- Wireless : Wireless HD Specification (Option)
Each part is tested as below without special notice.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100~240 V, 50/60 Hz)

*Standard Voltage of each products is marked by models.

(4)Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM.

(5)The receiver must be operated for about 20 minutes prior to the adjustment.

4.Model General Specification

	No.	Item	Specification	Remarks
				DTV & Analog (Total 37 countries)
				DTV (MPEG2/4, DVB-T) : 26 countrie
				Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
				France, Spain, Belgium, Luxemburg, Greece, Czech, Turkey, Morocco,
				Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania,
				Bosnia, Slovakia, Belarus
				DTV (MPEG2/4, DVB-T2) :11 countries
				UK(Ireland), Sweden, Denmark, Finland, Norway, Ukraine, Kazakhstan,
				Russia, Italy, Croatia, Serbia
				DTV (MPEG2/4, DVB-C) : 37 countries
				Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
				France, Spain, Italy, Belgium, Russia, Luxemburg, Greece, Czech, Croa-
				tia, Turkey, Morocco, Ireland, Latvia, Estonia, Lithuania, Poland, Portu-
				gal, Romania, Albania, Bosnia, Serbia, Slovakia, Belarus, UK, Sweden,
	1	Market	EU(PAL Market-36Countries)/CIS	Denmark, Finland, Norway, Ukraine, Kazakhstan
			+ Morocoo(Africa)	DTV (MPEG2/4,DVB-S) : 37 countries
				Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,
				France, Spain,Belgium, Luxemburg, Greece, Czech, Turkey, Morocco,
				Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania,
				Bosnia, Slovakia, Belarus, UK(Ireland), Sweden, Denmark, Finland, Nor-
				way, Ukraine, Kazakhstan,Russia, Italy, Croatia, Serbia
				Supported satellite : 35 satellites
				ABS1 75.0E, AMOS 4.0W, ASIASAT3S 105.5E, ASTRA 19.2E, ASTRA
				23.5E, ASTRA 28.2E, ASTRA 4.8E, ATLANTIC BIRD2 8.0W, ATLANTIC
				BIRD3 5.0W, BADR 26.0E, DIRECTV-1R 56.0E, EUROBIRD 9A 9.0E,
				EUROBIRD3 33.0E, EUTELSAT 36 A/B 36.0E,EUTELSAT W2A 10.0E,
				EUTELSAT W3A 7.0E, EUTELSAT7WA 7.3WEUTELSAT 16.0E, EX-
				PRESS AM1 40.0E, EXPRESS AM3 140.0E, EXPRESS AM33 96.5E,
				HELLASSAT 39.0E, HISPASAT 1CDE 30.0WHOTBIRD 13.0E, INTEL-
				SAT10&7 68.5E, INTELSAT15 85.2E, INTELSAT1R 50.0W, INTEL-
				SAT903 33.5W, INTELSAT904 60.0E, NILESAT 7.0W, NSS12 57.0E,
				THOR 0.8W, TURKSAT 42.0E,YAMAL201 90.0E, OTHER

- 6 -	Copyright ©	LG Electronics. Inc. All rights reserved.
	Only for training and service purposes.

	No.	Item	Specification		Remarks
			(1) Digital TV
			- DVB-T
			- DVB-T2*
	2	Broadcasting system	- DVB-C	*:Depending on country
			- DVB-S/S2*
			(2) Analogue TV
			- PAL/SECAM B/G/I/D/K
			- SECAM L
			(1) Digital TV
			1) DVB-T/T2
			- VHF III : 174~230MHz
			- UHF IV : 470~606MHz
			- UHF V : 606~862MHz
			- S Band II : 230~300MHz
	3	Channel coverage	- S Band III : 300 ~470MHz
			2) DVB-C
			- 46 ~ 890MHz
			3) DVB-S/S2
			- 950~2150MHz
			(2) Analogue TV
			- 46~862MHz
				DVB-T
				- Guard Interval(Bitrate_Mbit/s)
				1/4, 1/8, 1/16, 1/32
				- Modulation : Code Rate
				QPSK	: 1/2, 2/3, 3/4, 5/6, 7/8
				16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
				64-QAM	: 1/2, 2/3, 3/4, 5/6, 7/8
				DVB-T2 (Model : *L*V*-Z* (T2 only Model))
				- Guard Interval(Bitrate_Mbit/s)
				1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
				- Modulation : Code Rate
				QPSK	: 1/2, 2/5, 2/3, 3/4, 5/6
			Analog : Upper Heterodyne	16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
	4	Receiving system		64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
			Digital : COFDM, QAM
				256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
				DVB-C
				- Symbolrate :
				4.0Msymbols/s to 7.2Msymbols/s
				- Modulation :
				16QAM, 64-QAM, 128-QAM and 256-QAM
				DVB-S/S2
				- symbolrate
				DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
				DVB-S (QPSK) : 2 ~ 45Msymbol/s
				- viterbi
				DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
				DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
			Antenna,
	5	Head phone out	HDMI1, HDMI2, HDMI3, HDMI4, USB1,
			USB2, USB3
	6	HDMI Input (4EA)	HDMI1, HDMI2, HDMI3, HDMI4
	7	SPDIF out (1EA)	SPDIF out
	8	USB (3EA)	EMF, For SVC (download)
	9	Ethernet Connect(1EA)	Ethernet Connect	STP cable.
	10	PCMCIA Card slot (1EA)	PCMCIA slot

- 7 -	Copyright ©	LG Electronics. Inc. All rights reserved.
	Only for training and service purposes.

5. External Input Format

5.1.2D Mode

(1)HDMI Input (DTV)

	No.	Resolution	H-freq(kHz)	V-freq.(kHz)	Pixel clock(MHz)	Proposed	Remarks
	1	640*480	31.469	59.94	25.125	SDTV 480P
	2	640*480	31.5	60.00	25.125	SDTV 480P
	3	720*480	15.73	59.94	13.500	SDTV 576P
	4	720*480	15.75	60.00	13.514	HDTV 720P	Spec. out but display
	5	720*576	15.625	50.00	13.500	HDTV 720P
	6	720*480	31.47	59.94	27.00	HDTV 720P
	7	720*480	31.5	60.00	27.027	HDTV 1080I
	8	720*576	31.25	50.00	27.00	HDTV 1080I
	9	1280*720	44.96	59.94	74.176	HDTV 1080I
	10	1280*720	45.00	60.00	74.25	HDTV 1080P
	11	1280*720	37.50	50.00	74.25	HDTV 1080P
	12	1920*1080	28.125	50.00	74.25	HDTV 1080P
	13	1920*1080	33.72	59.94	74.176	HDTV 1080P
	14	1920*1080	33.75	60.00	74.25	HDTV 1080P
	15	1920*1080	26.97	23.976	63.296	HDTV 1080P
	16	1920*1080	27.00	24.000	63.36	HDTV 1080P
	17	1920*1080	33.71	29.97	79.120	UDTV 2160P
	18	1920*1080	33.75	30.00	79.20	UDTV 2160P
	19	1920*1080	56.25	50.00	148.50	UDTV 2160P
	20	1920*1080	67.432	59.94	148.350	UDTV 2160P
	21	1920*1080	67.50	60.00	148.50	UDTV 2160P
	22	1920*1080	135.00	120.00	297.00	UDTV 2160P(DVB)
	23	1920*1080	135.00	119.88	296.703	UDTV 2160P
	24	1920*1080	112.5	100.00	297.00	UDTV 2160P
	25	3840*2160	53.95	23.98	296.703	UDTV 2160P
	26	3840*2160	54.00	24.00	297.00	UDTV 2160P
	27	3840*2160	56.25	25.00	297.00	UDTV 2160P
	28	3840*2160	61.43	29.97	296.703	UDTV 2160P
	29	3840*2160	67.50	30.00	297.00	UDTV 2160P
	30	3840*2160	112.50	50.00	594.00	UDTV 2160P(DVB)	When HDMI1,2,3
							UHD DEEP COLOUR ON
	31	3840*2160	134.865	59.94	593.407	UDTV 2160P	When HDMI1,2,3
							UHD DEEP COLOUR ON
	32	3840*2160	135.00	60.00	594.00	UDTV 2160P	When HDMI1,2,3,4
							UHD DEEP COLOUR ON
	33	4096*2160	53.95	23.98	296.703	UDTV 2160P
	34	4096*2160	54.00	24.00	297.00	UDTV 2160P
	35	4096*2160	56.25	25.00	297.00	UDTV 2160P
	36	4096*2160	61.43	29.97	296.703	UDTV 2160P
	37	4096*2160	67.50	30.00	297.00	UDTV 2160P

- 8 -	Copyright ©	LG Electronics. Inc. All rights reserved.
	Only for training and service purposes.

No.	Resolution		H-freq(kHz)	V-freq.(kHz)		Pixel clock(MHz)		Proposed			Remarks
38	4096*2160		112.50	50.00	594.00		UDTV 2160P			When HDMI1,2,3,4
										UHD DEEP COLOUR ON
39	4096*2160		134.865	59.94	593.407		UDTV 2160P			When HDMI1,2,3,4
										UHD DEEP COLOUR ON
40	4096*2160		135.00	60.00	594.00		UDTV 2160P			When HDMI1,2,3,4
										UHD DEEP COLOUR ON
(4) HDMI Input (PC)
No.	Resolution		H-freq(kHz)	V-freq.(kHz)		Pixel clock(MHz)		Proposed			Remarks
1	640*350		31.46	70.09		25.17		EGA
2	720*400		31.46	70.08		28.32		DOS
3	640*480		31.46	59.94		25.17		VESA(VGA)
4	800*600		37.87	60.31		40.00		VESA(SVGA)
5	1024*768		48.36	60.00		65.00		VESA(XGA)
6	1360*768		47.71	60.01		84.75		VESA(WXGA)
7	1152*864		54.34	60.05		80.00		VESA
8	1280*1024		63.98	60.02		109.00		SXGA			Support to HDMI-PC
9	1920*1080		67.50	60.00		158.40		WUXGA(Reduced Blanking)
10	3840*2160		54.00	24.00		297.00		UDTV 2160P
11	3840*2160		56.25	25.00		297.00		UDTV 2160P
12	3840*2160		67.50	30.00		297.00		UDTV 2160P
13	4096*2160		53.95	23.97		296.70		UDTV 2160P
14	4096*2160		54.00	24.00		297.00		UDTV 2160P

- 9 -	Copyright ©	LG Electronics. Inc. All rights reserved.
	Only for training and service purposes.

SOFTWARE UPDATE

1. USB

(1)Insert the USB memory Stick to the USB port.

(2)Automatically detect the SW Version and show the below message

(3) Click [YES]: initiate the download and install of the update.

(4)Click [Check Now]: move to “About This TV” page for update.

(5)TV is updating.

(6) After finished the update, below Pop-up appear.

(7)Click [Yes] : TV will be DC OFF -> ON

(8)After TV turned on, Check the updated SW Version and Tool Option.

2. NSU

(1) Menu -> All Settings -> General -> About This TV

(2)Click [CHEK FOR UPDATES] : system check newest version

(3)Click [DOWNLOAD AND INSTALL]

(4)TV is updating

(5) After finished the update, below Pop-up appear

(6)Turn OFF the TV and On. Check the updated SW Version and Tool Option

- 10 -	Copyright ©	LG Electronics. Inc. All rights reserved.
	Only for training and service purposes.

.reserved rights All .Inc .Electronics LG © Copyright - 11 - .purposes service and training for Only

Tuner

	R		Tuner : I2C 5
	E		D-Demod : I2C 2
	A
	R
	(H)
		S	USB1 (3.0)
		I	HDMI1 (2.0)
		D
		E	HDMI2 (2.0)
			(ARC)
			USB2 (2.0)
			USB3 (2.0)
			HDMI3 (2.0)
			HDMI4 (2.0)
	R
	E
	A		H/P
	R
			AV
			COMP
	Component/AV Spec. out In Europe		OPTIC
	Component Spec Out In North America
			LAN

IF (+/-)

P_TS

CVBS/SIF

OCP 1.5A

OCP 1.5A

OCP 1.5A

HP

AMP

X_TAL	DDR3 2133 X 16
24MHz	(512MB X 2EA)

MainSOC

I2S Out

SPDIF OUT

DDR3 2133 X 16 (512MB X 2EA)

SYSTEM EEPROM (256Kb)

eMMC (4GB)

Audio 2 AMP

BLUTOOTH

WIFI

SUB

ASSY

IR

I2C

KEY

Sub Micom

X_TAL 32.768kHz

Diagram Block SOC .1

DIAGRAM BLOCK

.reserved rights All .Inc .Electronics LG © Copyright - 12 - .purposes service and training for Only

TUNER

[+3.3V_LNA_TU] 3

[+3.3V_TUNER] 11

[D_Demod_Core] 13

[I2C_SCL5_TU] 1 [I2C_SDA5_TU] 2

[FE_DEMOD1_TS_ERROR_TU] 14

[FE_DEMOD1_1_TS_CLK] 15 [FE_DEMOD1_TS_SYNC] 16 [FE_DEMOD1_TS_VAL] 17

FE_DEMOD1_TS_DATA[0] 18 FE_DEMOD1_TS_DATA[1] 19 FE_DEMOD1_TS_DATA[2] 20 FE_DEMOD1_TS_DATA[3] 21 FE_DEMOD1_TS_DATA[4] 22 FE_DEMOD1_TS_DATA[5] 23 FE_DEMOD1_TS_DATA[6] 24 FE_DEMOD1_TS_DATA[7] 25

[/TU_RESET1_TU] 10

[IF_P] 7 [IF_N] 8

[IF_AGC_TU] 5

+3.3V_TUNER

+1.2V_Demod_Core

+3.3V_TUNER

1.2Kȳ

	I2C_SCL5	33 ȳ
	I2C_SDA5

FE_DEMOD1_TS_ERROR

FE_DEMOD1_TS_CLK

FE_DEMOD1_TS_SYNC

FE_DEMOD1_TS_VAL

FE_DEMOD1_TS_DATA [0-7]

/TU_RESET1
IF_P		ADC_I_INP
IF_N	FILTER	ADC_I_INN

IF_AGC

MAIN

SOC

AH25[SCL5]

AH26[SDA5]

AC29 [TP_DVB_CLK] AC30 [TP_DVB_SOP] AB30 [TP_DVB_VAL]

AB28 [TP_DVB_DATA0] AC28 [TP_DVB_DATA1] AD28 [TP_DVB_DATA2] AD29 [TP_DVB_DATA3] AE29 [TP_DVB_DATA4] AE30 [TP_DVB_DATA5] AF29 [TP_DVB_DATA6] AF30 [TP_DVB_DATA7]

AK14 [GPIO26]

AN31 [DMD_ADC_INP] AN32 [DMD_ADC_INN]

AL31[IF_AGC]

PCM_5V_CTL	CI 5V	+5V_CI_ON
	Power detect
	+5V_CI_ON	+3.3V_NORMAL

C25 [CAM_VCCEN_N]

C23[CAM_CD1_N] B23[CAM_CD2_N]

G28[TPI_VAL]

B25[CAM_CE1_N] B26[CAM_CE2_N]

B29 [EB_BE_N1]

E28 [EB_EB_N0]

[EB_ADDR_0~14]

[EB_DATA_0~7]

A24[CAM_RESET] C24[CAM_WAIT_N]

A25[CAM_REG_N] B24[CAM_IREQ_N] A32 [EB_OE_N] D28 [EB_WE_N]

P30 [TPO_CLK]

P29 [TPO_VAL]

N29 [TPO_SOP]

[TPI_DATA 0~7]

[TPO_DATA[ 0~7]

10K ȳ	/CI_CD1,2	47K ȳ

CI_TS_VAL /PCM_CE1.2

/PCM_IOWR /PCM_IORD

CI_ADDR[0-14]

CI_TS_DATA[0-7]

PCM_RESET

/PCM_WAIT PCM_INPACK

/PCM_REG

/PCM_IRQA

/PCM_OE

/PCM_WE

CI_IN_TS_CLK

CI_IN_TS_VAL

CI_IN_TS_SYNC

TPI_DATA [0-7]	100	ȳ	CI_TS_DATA[0-7]
TPO_DATA[0-7]	33	ȳ	CI_IN_TS_DATA[0-7]

CI Slot

VCC

/CI_CD1,2

CI_TS_VAL

/PCM_CE1.2

/PCM_IOWR /PCM_IORD

CI_ADDR[0-14]

CI_DAT[0-7]

PCM_RESET /PCM_WAIT PCM_INPACK /PCM_REG /PCM_IRQA

/PCM_OE

/PCM_WE

CI_IN_TS_CLK CI_IN_TS_VAL CI_IN_TS_SYNC

CI_TS_DATA[0~7]

CI_IN_TS_DATA[0-7]

CI + Tuner .2

.reserved rights All .Inc .Electronics LG © Copyright - 13 - .purposes service and training for Only

AV Jack Side	SOC Side
Phone JA
AV_CVBS_IN	AV1_CVBS_IN_SOC

Component/AV Spec. out In Europe

Component Spec Out In North America

COMP2/AV_L_IN

COMP2/AV_R_IN

Component 1

Phone JACK

COMP2_Pb

COMP2_Y

COMP2_Pr

AUAD_L_CH2_IN

AUAD_R_CH2_IN

COMP2_SOG2_IN_SOC

COMP2_Y_IN_SOC

COMP2_Pb_IN_SOC

COMP2_Pr_IN_SOC

Front Speaker

Audio

AMP

NTP7515

AMP_RESET

Woofer Speaker

AMP_MUTE		MICOM
(WOOFER_MUTE)

MAIN SOC

AM24 [CVBS_IN2]

AL18 [AUAD_L_CH2_IN

AM18 [AUAD_R_CH2_IN]

AM20 [SOY1_IN]

AN20 [Y1_IN]

AL21 [PB1_IN]

AM22 [PR1_IN]

[SCK]

[LRCK] I2S [DACLRCH]

[I2C_SCL_0/SDA_0]

[GPIO23]

SPDIF OUT	SPDIF_OUT
			AM14 [IEC958OUT]
ARC OUT
(HDMI2)	SPDIF_OUT_ARC		[PHY0_ARC_OUT]
H/P JACK	HP_LOUT_JACK
	HP_ROUT_JACK
		HP AMP	AL15 [AUDA_OUTL]
		TPA6138
			AM15 [AUDA_OUTR]

IN/OUT Audio & Video .3

.reserved rights All .Inc .Electronics LG © Copyright - 14 - .purposes service and training for Only

+5V

HDMI 1

(2.0)_V

+5V

HDMI 2

(2.0)_V

ARC

+5V

HDMI 3

(2.0)_H

+5V

HDMI 4

(2.0)_H

MICOM

CEC_REMOTE

Port_1

DDC_I2C_1

HDMI_HPD_1

CEC_REMOTE

Port_2

DDC_I2C_2

HDMI_HPD_2 SPDIF_OUT_ARC

CEC_REMOTE

Port_3

DDC_I2C_3

HDMI_HPD_3 SPDIF_OUT_ARC

CEC_REMOTE

Port_4

DDC_I2C_4

HDMI_HPD_4

MAIN SOC

[HDMI2_3_SDA]
	HDMI2.0		HDCP1.4
[HDMI2_3_SCL]
	LGE PHY		HDCP2.2
[HDMI2_3_HPD]
[HDMI2_2_SDA]
	HDMI2.0		HDCP1.4
[HDMI2_2_SCL]
[HDMI2_2_HPD]	LGE PHY		HDCP2.2
[HDMI2_1_SDA]
	HDMI2.0		HDCP1.4
[HDMI2_1_SCL]
[HDMI2_1_HPD]	LGE PHY		HDCP2.2
[PHY0_ARC_OUT]
[HDMI2_0_SDA]
	HDMI2.0		HDCP1.4
[HDMI2_0_SCL]
	LGE PHY		HDCP 2.2
[HDMI2_0_HPD]

0.2 HDMI .4

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MAN SOC

[USB3_0_DP0 / DM0]

[USB3_0_TX0_P / M] [USB3_0_RX0_P / M]

[GPIO90]

[USB2_1_DP0 / DM0]

[GPIO95]

[USB2_0_DP0 / DM0]

[GPIO34]

[USB2_2_DP0 / DM0]

[UART0_RXD/GPIO106]

[UART0_TXD/GPIO105]

[UART1_RXD / TXD]

USB3.0_1_TX_DP0 / DM0 USB3.0_1_RX_DP0 / DM0 USB3.0_1_DP0 / DM0

USB_CTL1

USB2.0_2_DP1 / DM1

USB_CTL2

USB2.0_3_DP0 / DM0

USB_CTL3

WIFI_DP / DM

SOC_RX/TX

UART1_RX/TX

+5V_USB_1

OCP

+5V_USB_2

OCP

+5V_USB_3

OCP

WIFI_EN

MICOM WOL/WIFI_POWER_ON

SOC_RX/TX

SOC_RX/TX

USB 1 (3.0)_V

USB 2 (2.0)_H

USB 3 (2.0)_H

IR + Wi-Fi /BT

Wafer 25P

+3.5V_WIFI

UART wafer

(*) US model only

RS232 IC

JK6200

RS232C phone Jack

Debug Wafer

UART / Remote-M / Fi-Wi / USB .5

								I2C .6
							Cap Ready	Map
				+3.3V_NORMAL	MAIN SOC
		AUDIO AMP	33pF	100 ˟		+3.3V_TU
				ZUZr˟
		AUDIO AMP		100 ˟	I2C_SCL0: AK23[SCL0]	ZZ˟	LNB
					I2C_SDA0: AJ23[SDA0]	YU^r˟
			33pF
				+3.3V_NORMAL	I2C_SCL3: AH24[SCL3]	ZZ˟	TUNER (Demod)
					I2C_SDA3: AJ24[SDA3]
							18pF
				ZUZr˟		+3.3V_NORMAL
	-				I2C_SCL1: AK22[SCL1]
	16	MICOM
					I2C_SDA1: AJ22[SDA1]
	-
						ZUZr˟
training for Only	© Copyright	EYE_I2C_SDA	ZUZr˟	+3.5V_ST
		EYE_I2C_SCL	XWW˟	+3.3V_NORMAL	I2C_SCL4: AJ21[SCL4]	ZZ˟	NVRAM
					I2C_SDA4: AH21[SDA4]
		IR / KEY/EYE
				ZUZr˟		+3.3V_TU
.Inc .Electronics LG .purposes service and
			33 ˟		I2C_SCL2: AH23[SCL2]
		PMIC (EPI)			I2C_SDA2: AH22[SDA2]	XUYr˟GOl|P
		WAFER (Vx1)
					I2C_SCL5: AH25[SCL5]	ZZ˟	Tuner
					I2C_SDA5: AH26[SDA5]
	All					47pF
	.reserved rights

.reserved rights All .Inc .Electronics LG © Copyright - 17 - .purposes service and training for Only

		PANEL_VCC
			EO, GCLK,
M16p	I2C_2		MCLK, GST
			VCC, HVDD,
		PMIC	VGH, VEPI,
	VCOM1FB/		VGL2, VCOM1,2
	VCOM2FB
			VST, RESET,
			VGH_E/O

	P-GAMMA Voltage	Level shifter	EO, GCLK,
			MCLK, GST
	8 CH OUTPUT	CLK[1:8]

MAIN

SOC

PANEL_VCC
	Sub	VDD, Vterm
	PMIC

60P EPI Output

RIGHT

P-gamma

(8CH)

VDD, VEPI, Vterm,

HVDD, VCOM1,2,

VGL1,2, VGH

VST, RESET, VGH_E/O

VCOM1FB

[TX_LOCKN]

[OUT4P]

: EPI 6 Lane

[OUT9N]

[OUT12P]

: EPI 6 Lane

[OUT17N]

LOCK N

CLK[

8]

CLK[8]

VCOM2FB

VST, RESET, VGH_E/O

VDD, VEPI, Vterm,

HVDD, VCOM1,2,

VGL1,2, VGH

P-gamma

(8CH) 6 EPI Output

LEFT

(PMIC) block EPI .7

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the EXPLODED VIEW.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

			901
	400
			902
			951
	800	120	952
	521		121
LV2	540	570 571
LV1	530
	820
		500	700
		200A	A10
	200		AR2

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	Only for training and service purposes.

DISASSEMBLY GUIDE

1. After Screw Disassemble, please remove B/C from Module 49"-Screw : 15 ea

1

1

1

1

1

1	1
	1
	2

1

1

1

1

1

1

55"-Screw : 17 ea

1

1

1

1

1

1	f f	f f f	1
f	f	ff
		1
1			1
1	1	2
1			1

1

1

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	Only for training and service purposes.

2.Detach Tape

-Screw : 4 ea

Detach tape

3	3
3	3

3. Remove all sort of cable

- 20 -	Copyright ©	LG Electronics. Inc. All rights reserved.
	Only for training and service purposes.