• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer' s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly or
electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight or inverter
circuit, must disconnect the AC adapter because high
voltage appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
Good Earth Ground
such as WATER PIPE,
0.15µF
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
CONDUIT etc.
• Make certain that treatment person' s body are grounded
• Do not leave the module in high temperature and in
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
• If the surface of panel become dirty, please wipe it off
through wrist band.
areas of high humidity for a long time.
the module.
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
• Replaceable batteries
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS.
REPLACE ONLY WITH THE SAME OR EQUIVALENT
TYPE.
ADVARSEL
Lithiumbatteri - Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri af samme
fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
This spec sheet is applied all of the Digital Signage Product
with LW43B chassis.
2. Specication
1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specic designation.
4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz.
5) At rst Worker must turn on the SET by using Power Only
key.
6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours.
In case of keeping module is in the circumstance of below -20
°C, it should be placed in the circumstance of above 15 °C for
3 hours.
4. MAIN PCBA Adjustments
4.1. ADC Calibration [MS75A Model Digital
Only Model: does not apply]
- An ADC calibration is not necessary because MAIN
SoC (LGExxxx) is already calibrated from IC Maker
- If it needs to adjust manually, refer to appendix.
4.2. MAC Address
4.2.1. Equipment & Condition
1) Play le: keydownload.exe
4.2.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process : DETECT → MAC_WRITE
4) Play: START
5) Check of result: Ready, Test, OK or NG
4.2.4. Communication Port connection
1) Connect : PCBA Jig → RS-232C Port == PC → RS-232C
Port
Caution) When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital
pattern 13ch and/or Cross hatch pattern 09ch), there can
some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments MAC Address
Download
1) ADC adjustment: Digital Only [does not apply]
2) EDID / DDC Download.
3) MAC Address Download
* Remark
- Above adjustment items can be also performed in
Final Assembly if needed. Adjustment items in both
PCBA and nal assembly stages can be checked by
using the INSTART Menu → ADJUST CHECK.
3.2. Final Assembly adjustment
1) White Balance adjustment
2) RS-232C functionality check
3) Factory Option setting per destination
4) Shipment mode setting (IN-STOP)
5) GND and HI-POT test
3.3. Appendix.
1) Ship-out mode
2) Service Option Default
3) Tool option menu, USB Download (S/W Update, Option,
▪ Each other connection to LAN Port of IP Hub and Jig
4.5 Serial number download
Connect Bar Code scan equipment and set by RS-232C
cable.
1) E2PROM Data Write
4.3.2. LAN inspection solution
1) LAN Port connection with PCB
2) Network setting at MENU Mode of SET (Installer Menu →
119 → 253 → Menu)
3) Setting automatic IP
4) Setting state conrmation
→ If automatic setting is nished, you conrm IP and MAC
Address.
4.4. LAN PORT INSPECTION(PING TEST)
4.4.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
4.4.2. LAN PORT inspection(PING TEST)
1) Play the LAN Port Test Program.
2) Connect each other LAN Port Jack.
3) Play Test (F9) button and conrm OK Message.
4) Remove LAN cable.
2) E2PROM Data Read
4.6 EDID/DDC Download (EDID PCM)
4.6.1 Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any necessity
of user input. It is a realization of “Plug and Play”.
4.6.2 Equipment
1) Since EDID data is embedded, EDID download JIG, HDMI
cable and D-sub are not need.
2) Adjust by using remote controller.
4.6.3 Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L (PCM) menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
→ Caution) When EDID Download, must remove HDMI / D-
1) Objective: To reduce each Panel's W/B deviation
2) How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is xed at 192, and the other two is lowered to nd
the desired value.
3) Adjustment condition : normal temperature
- Surrounding Temperature : 25 °C ± 5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity : 20 % ~ 80 %
- Before White balance adjustment, Keep power on
status, don’t power off
5.1.1.2. Adj. condition and cautionary items
1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface (80°~
100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked us-
End White Balance adjustment
(internal pattern disappears )
Explantion
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f → Gain adj. completed
*(wb 00 20(Start), wb 00 2f(end)) → Off-set adj.
wb 00 ff → End white balance auto-adj.
▪ Adj. Map
Cool
Medium
Warm
Adj. item
R GainjG00C0
G GainjH00C0
B GainjI00C0
R Cut
G Cut
B Cut
R GainjA00C0
G GainjB00C0
B GainjC00C0
R Cut
G Cut
B Cut
R GainjD00C0
G GainjE00C0
B GainjF00C0
R Cut
G Cut
B Cut
Command
(lower caseASCII)
CMD1CMD2MINMAX
Data Range
(Hex.)
Default
(Decimal)
5.1.5. Adj. method
5.1.5.1 Auto WB calibration
1) Set in ADJ mode using P-ONLY key (or POWER ON key)
2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration
before adjustment.
3) Connect RS-232C Cable
4) Select mode in ADJ Program and begin a adjustment.
5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” ,
and nish as end command “wb 00 ff”, and Adj. offset
if need
5.1.5.2 Manual adjustment Method.
1) Set in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
3) Press ADJ key → EZ adjust using adj. R/C → White-
Balance then press the cursor to the right (KEY►). When
KEY (►) is pressed 204 Gray (80IRE) internal patterns will
be displayed.
4) Adjust Cool modes
- Fix the one of R/G/B gain to 192 (default data) and
decrease the others. ( If G gain is adjusted over 172
and R and B gain less than 192 , Adjust is O.K.)
- If G gain is less than 172, Increase G gain by up
to 172, and then increase R gain and G gain same
amount of increasing G gain.
- If R gain or B gain is over 255, Readjust G gain less
than 172, Conform to R gain is 255 or B gain is 255
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In
EZ Adj. menu 6.White Balance, you can select one
of 2 Test-pattern : ON, OFF. Default is inner (ON). By
selecting OFF, you can adjust using RF signal in 206
Gray pattern.
5.1.5.3 Adj. condition and cautionary items
1) Lighting condition in surrounding area Surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
2) Probe location: CA-210 probe should be within 10cm and
perpendicular of the module surface (80°~ 100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no signal or Full-white pattern.
5.1.6. Reference (White balance Adj. coordinate and
color temperature)
▪ Luminance : 204 Gray (80IRE)
▪ Standard color coordinate and temperature using CA-210 (CH14)
: [applied only LGD Module]
Mode
Cool0.271±0.0020.270±0.00213,000K-0.003
Medium0.286±0.0020.289±0.0029,300K0.0000
Warm0.313±0.0020.329±0.0026,500K0.0000
▪ Standard color coordinate and temperature using CA-210(CH
14) – by aging time
1) Egde LED models (applied only LGD Module) in LGEKR
(GUMI) And LGERS
2) Automatically detecting update le in USB Stick
- If your downloaded program version in USB Stick is
lower than that of Signage set, it didn’t work. Otherwise USB data is automatically detected.
3) Updating is staring.
4) Updating Completed, The Signage will restart automatically
5) If your Signage is turned on, check your updated version
and Tool option.(explain the Tool option, next stage)
* If downloading version is more high than your Signage
have, Signage can lost all channel data. In this case,
you have to channel recover. If all channel data is
cleared, you didn’t have a DTV/ATV test on production
line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number)
7) Press OK in Comp 1080p menu
8) If ADC Comp is successful, “ADC Component Success” is
displayed.
9) If ADC calibration is failure, “ADC Component Fail” is
displayed.
10) If ADC calibration is failure, after rechecking ADC pattern
or condition, retry calibration
10.2. Manual White balance Adjustment
10.2.1. Adj. condition and cautionary items
1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface (80°~
100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked us-
2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
10. Optional adjustments
10.1. Manual ADC Calibration
10.1.1. Equipment & Condition
1) Adjustment Remocon
2) 801GF (802B, 802F, 802R) or MSPG925FA Pattern Generator
- Resolution: 480i Comp1 (MSPG-925FA: model-209,
pattern-65)
- Resolution: 1080p Comp1 (MSPG-925FA: model-225,
pattern-65)
- Resolution : 1080p RGB (MSPG-925FA: model-225,
pattern-65)
- Pattern: Horizontal 100% Color Bar Pattern
- Pattern level: 0.7±0.1 Vp-p
10.1.2 Adjust method
10.1.2.1 ADC 480i/1080p Comp
[MS75A Model Digital Only Model: does not apply]
1) Check connected condition of Comp cable to the equipment
2) Give a 480i Mode, Horizontal 100% Color Bar Pattern to
Comp1. (MSPG-925FA → Model: 209, Pattern: 65)
3) Change input mode as Component1 and picture mode as
“Standard”
4) Press the In-start Key on the ADJ remote after at least 1
min of signal reception. Then, select 7.External ADC. And
Press OK or Right Button for going to sub menu.
5) Press OK in Comp 480i menu
6) Give a 1080p Mode, Horizontal 100% Color Bar Pattern to
Comp1. (MSPG-925FA → Model: 225, Pattern: 65)
10.2.3. Adjustment
[MS75A Model Digital Only Model: does not apply]
1) Set in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
3) Press ADJ key → EZ adjust using adj. R/C → WhiteBalance then press the cursor to the right (KEY►). When
KEY(►) is pressed 216 Gray internal pattern will be
displayed.
4) One of R Gain / G Gain / B Gain should be xed at 192,
and the rest will be lowered to meet the desired value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.