Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
Always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. Carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This specification sheet is applied to all of the LED TV with
LD5GG chassis.
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25±5℃ of temperature and 65±10% of relative humidity if
there is no specific designation.
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15℃
▪ In case of keeping module is in the circumstance of 0°C,
it should be placed in the circumstance of above 15°C for
2 hours.
▪ In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
* Caution : When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area.
Above adjustment items can be also performed in Final
Assembly if needed. Both Board-level and Final assembly
adjustment items can be check using In-Star Menu ‘1.
ADJUST CHECK’.
3.2. Final assembly adjustment
▪White Balance adjustment
▪RS-232C functionality check
▪ PING Test
▪Factory Option setting per destination
▪Ship-out mode setting (In-Stop)
▪ If you want manual connection, enter Network connection
at the HOTEL MENU. Press the Instart button first and blue
button after press the etc button, then Network Menu will
be appeared.
4.3. LAN PORT INSPECTION(PING TEST)
Connect SET -> LAN port == PC -> LAN Port
4.3.1. Equipment setting
(1) Play the LAN Port Test PROGRAM.
(2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
(1) (2) (3)
4.2.3. WIDEVINE Key Inspection
- Confirm Key input Data at the “IN START” MENU Mode
4.3.2. LAN PORT inspection (PING TEST)
(1) Play the LAN Port Test Program.
(2) Connect each other LAN Port Jack.
(3) Play Test (F9) button and confirm OK Message.
(4) Remove LAN cable.
4.4. Model name & Serial number Download
4.4.1. Model name & Serial number D/L
▪
Press “P-ONLY” key of service remote control.(Baud rate :
115200 bps)
▪
Connect RS-232C Signal to USB Cable to USB.
▪
Write Serial number by use USB port.
▪
Must check the serial number at Instart menu.
4.4.2 Method & notice
(1) Serial number D/L is using of scan equipment.
(2) Setting of scan equipment operated by Manufacturing
Technology Group.
(3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
Only for training and service purposes
- 11 -
※ Manual Download (Model Name and Serial Number)
- If the TV set is downloaded By OTA or Service man,
Sometimes model name or serial number is initialized.( Not
always)
- There is impossible to download by bar code scan, so It
need Manual download.
a. Press the ‘instart’ key of ADJ Remote control.
b. Go to the menu ‘7.Model Number D/L’ like below photo.
c. Input the Factory model name(ex 55LF630V-ZA) or
Serial number like photo.
d. Check the model name Instart menu →
Factory name displayed (ex 55LF630V-ZA)
e. Check the Diagnostics (DTV country only) →
Buyer model displayed (ex 55LF630V-ZA)
- How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
- Adj. condition : normal temperature.
1) Surrounding Temperature: 25±5℃
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
4) Before White balance adjustment, Keep power on
status, don’t power off
5.3.2 Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux., Try to isolate adj. area into dark
surrounding
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using
5.3.6.1. Auto adj. method
(1) Set TV in ADJ mode using P-ONLY key
(or POWER ON key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
5.3.6.2 Manual adj. method
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key à EZ adjust using adj. R/C à 11. White-
Balance then press the cursor to the right (KEY▶).
- When KEY(▶) is pressed 206 Gray internal pattern will
be displayed.
(4) Adjust Cool modes
1) Fix the one of R/G/B gain to 192 (default data) and
decrease the others.
(If G gain is adjusted over 172 and R and B gain less
than 192 , Adjust is O.K.)
2) If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain
and G gain same amount of increasing G gain.
3) If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is
255 or B gain is 255
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B
gain to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote control.
▪ Adj. condition and cautionary items
(1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to isolate
adj. area into dark surrounding.
(2) Probe location
- PDP: Color Analyzer (CA-100, CA-100+, CA210) probe
should be firmly attached to the Module
- LCD: Color Analyzer (CA-210) probe should be within
10cm and perpendicular of the module surface (80°~
100°)
5.3.7. Reference (White Balance Adj. coordinate
and color temperature)
▪ Luminance: 204 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
ModeCoordinateTemp△uv
xy
Cool0.2710.27013000K0.0000
Medium0.2860.2899300K0.0000
Warm0.3130.3296500K0.0000
▪ Standard color coordinate and temperature using
CA-210(CH 14)
ModeCoordinateTemp△uv
xy
Cool0.271±0.0020.270±0.00213000K0.0000
Medium0.286±0.0020.289±0.0029300K0.0000
Warm0.313±0.0020.329±0.0026500K0.0000
5.3.8. LED White balance table
▪ Edge LED module change color coordinate because of
aging time
▪ Apply under the color coordinate table, for compensated
(1) Turn on the TV..
(2) Press 'EYE button' on the adjustment remote control.
(3) Cover 'Eye Q sensor' on the front of set with your hands,
hold it for 6 seconds.
(4) Check "the Sensor Data" on the screen, make certain that
Data is below 10.
- If Data isn’t below 10 in 6 seconds, Eye Q sensor would
be bad. You should change Eye Q sensor.
(5) Uncover your hands from Eye Q sensor, hold it for 6
seconds.
(6) Check "Back Light(xxx)" on the screen, check data
increase.
- You should change Eye Q sensor.
5.7. Wi-Fi Test
(1) Turn on TV
(2) Select Wi-Fi Connection option in Network Menu.
Press the Instart button first and blue button after press
the etc button, then Network Menu will be appeared.
5.8. LNB voltage and 22KHz tone check
(only for DVB-S/S2 model)
5.8.1. Test method
(1) Set TV in Adj. mode using POWER ON.
(2) Connect cable between satellite ANT and test JIG.
(3) Press Yellow Key (ETC+SWAP) in Adj Remote control to
make LNB on.
(4) check LED light ‘ON’ at 18V menu.
(5) check LED light ‘ON’ at 22KHz tone menu.
(6) Press Blue Key (ETC+PIP INPUT) in Adj Remote control
to make LNB off.
(7) check LED light ‘OFF’ at 18V menu.
(8) check LED light ‘OFF’ at 22KHz tone menu.
5.8.2. Test result
(1) After press LNB On key, ‘18V LED’ and ‘22KHz tone LED’
should be ON.
(2) After press LNB OFF key, ‘18V LED’ and ‘22KHz tone
LED’ should be OFF.
6. Ship-out mode and GND/Hi-pot
check
6.1. Ship-out mode check (In-stop)
▪ After final inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode.
6.2. GND and Hi-pot auto-check
6.2.1 Method
(1) GND & Hi-pot auto-check preparation
- Check that Power Cord is fully inserted to the SET.
(If loose, re-insert)
(2) Perform GND & Hi-pot auto-check
- Unit fully inserted Power cord, Antenna cable and A/V
arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
7. Audio
NoItemMin Ty pMaxUnitRemark
1.Audio
practi-
cal max
Output,
L/R
(Distor-
tion=10%
max
Output)
2.Speaker
(6Ω
Imped-
ance)
91012WEQ Off
8.10 10.8Vrms
4.556WEQ Off
5.56Vrms
91012WEQ Off
4.556WEQ Off
AVL Off
Clear
Voice Off
AVL Off
Clear
Voice Off
AVL Off
Clear
Voice Off
AVL Off
Clear
Voice Off
40/43/49/55
LX761H-ZA
32LX761H-ZA
40/43/49/55
LX761H-ZA
32LX761H-ZA
- Measurement condition:
1) RF input: Mono, 1KHz sine wave signal, 100%
Modulation
2) CVBS, Component: 1KHz sine wave signal 0.5Vrms
8. USB S/W Download
(option, Service only)
(1) Put the USB Stick to the USB socket
(2) Go to General menu then enter to About This TV
(3) Enter the USB EXPERT MODE
6.2.2 Checkpoint
▪ TEST voltage
(1) DQA Test
- GND : AC 1.5KV/1min, Cut off current not exceed 100mA
- SIGNAL : AC 3.0KV/1min, Cut off current not exceed
100mA
(2) Mass Production Line Test
- GND : AC 1.5KV/1sec, Cut off current not exceed 100mA
▪ TEST time: DQA 1min, Mass Production Line 1 sec
▪ TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Hi-pot TEST = POWER CORD GND & LIVE & NEUTRAL
▪ LEAKAGE CURRENT: At 0.5mArms
Only for training and service purposes
- 17 -
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "ADJ" key in service Remote control.
2) Select "Tool Option 1" and Push “OK” button.
3) Punch in the number. (Each model has their number.)
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-Peripheral
xxLX761H-ZA
M14-Peripheral
P104
12505WS-10A00
OPT
10
11
+3.3V_NORMAL
1
2
3
4
5
6
7
8
9
TRST_N1
TDI1
TDO1
TMS1
TCK1
SOC_RESET
2015.02.02
1
29
Page 30
[RF Tuner -> M14] RF Parallel In
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
** MODEL_OPT_14/15 is ready for only consumer model
NORTH AMERICA
Default(ATV_EXT)
Default(ATV_EXT)
ATV_INTERNAL
DDR_3G
R21910K
DDR3_1.5GB
DDR3_2GB
R220 10K
NON_DDR_3G
R22110K
MODEL_OPT_11
MODEL_OPT_12
MODEL_OPT_13
R222 10K
DDR3
DDR3
FOR UD
Support
EXTERNAL EDID
FOR HDMI2.0
SS_DDR
ODT
Reserved
Reserved
BRAZIL
JAPAN
ISDB PIP
ISDB
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
LOW
<NON_DDP>
2GB
<NON_DDR3 3G>
EXTERNAL
<NON_SS_DDR>
<ODT_46_ohm>
R22710K
NON_EXTERNAL_EDID
R228 10K
EXTERNAL_EDID
HIGH
DDP
<1.5GB>
DDR3 3G
<NON_EXTERNAL>
SS_DDR
ODT_55_ohm
SS_DDR
R22910K
R23710K
ODT_55_ohm
R230 10K
R238 10K
ODT_46_ohm
NON_SS_DDR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
M14-Display In/Out
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
M14-Display In/Out
2015.02.04
2
29
Page 31
PLACE AT JACK SIDE
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-AV In/Out
AUDA_OUTL
AUDA_OUTR
OPT
4.7K
R382
R383 4.7K
OPT
4.7K
R384
R385 4.7K
DDR3_OPT1
DDR3_OPT2
xxLX761H-ZA
M14-AV In/Out
2014.05.02
3
29
Page 32
IC101
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
M14-DDR3(MAIN)
2015.02.02
4
29
Page 33
IC101
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA2014.05.02
M14-DDR3(DE)
5
29
Page 34
VDD3V3_HDMI
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
xxLX761H-ZA2014.05.02
M14-POWER
6
29
Page 35
PCM_RESET
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
CI SLOT
2015.02.02
7
29
Page 36
+3.5V_ST
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
R2301
10K
RL_ON
R2362
10K
OPT
+13V_A
UBW2012-121F
C23 69
C2306
0.1 uF
0.1uF
50V
25V
OPT
+3.3V_NORMAL
INV_CTL
R2343 0
OPT
R2300
10K
VA23001-*1
ICVS0505201FR
Multi_Innochips
L2304
R2306
1K
R2334
10K
OPT
C
Q2300
B
MMBT3904(NXP)
E
Default_Amotech
VA23001
5.6V
AMOTECH CO., LTD.
20V
OPT
ZD2303
R2307
100
R2367
10K
L/DIM0_VS
R2366
10K
B
R2330
E
Q2303
MMBT3906(NXP)
RL_ON_NXP
C
1K
OPT
E
Q2303-*1
2N3906S-RTK
B
RL_ON_KEC
C
POWER_WAFER_12PIN
P2300
SMAW200-H12S5K(BK)(LTR)
PWR ON
1
1
GND
3
3
D13V
5
5
A13V
7
7
GND
9
9
DRV-ON
11
11
GND
13
GND
15
13
VSYNC
17
P2301
.
SMAW200-H18S5
POWER_WAFER_18PIN
+13V
L2303
UBW2012-121F
C2307
C23 67
0.1 uF
C23 68
4.7 uF
25V
50V
OPT
OPT
PWM_DIM2
R2355
4.7K
OPT
PWM_DIM
R2354
4.7K
OPT
0.1uF
20V
50V
ZD2301
OPT
PDIM2
2
2
D13V
4
4
D13V
6
6
A13V
8
8
GND
10
10
PDIM1
12
12
GND
14
SCLK
16
SIN
18
ADUC 20S 02 010L
L/DIM0_MOSI
L/DIM0_SCLK
+3.3V - eMMC 4.41/4.51
+3.3V_NORMAL
L2302
BLM18PG121SN1D
C2305
0.1uF
16V
C2300
22uF
10V
3.3V_EMMC
+1.8V - eMMC 4.51
+3.3V_NORMAL
IC2306
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
+13V
L2300
BLM18PG121SN1D
C2302
10uF
25V
POWER_ON/OFF1
C2303
0.1uF
25V
C2360
0.1uF
16V
OPT
R2302
5.1K
1/16W
1%
+3.3V_NORMAL
R2304
10K
R23 03
R1
68K
1/1 6W
1%
C2304
100pF
50V
R2
R23 05
22K
1/1 6W
1%
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DVDD18_EMMC
R2347
R2347-*1 0
1
ESR_1ohm
75
1%
1/16W
R2357
C2301
10uF
33
C2310
1uF
10V
1%
C2312
2200pF
50V
1/16W
VREG
R2358
BD9D320EFJ
EN
1
FB
2
3
SS
4
IC2300
3A
10V
9
THERMAL
8
7
6
5
[EP]FIN
VIN
BOOT
SW
GND
Vout=0.765*(1+R1/R2)
ESR_0ohm
C2308
10uF
10V
0.1uF
C2313
OPT
16V
2.5V
D2302
NR8040T2R0N
L2301
2uH
C2314
22uF
10V
+3.3V_NORMAL
C2315
22uF
10V
5V
ZD2300
ZD2300-*1
3.3V_Diode_SEMTECH
5V
3.3V_Diode_KEC
+13V
PANEL_CTL
+3.3V_NORMAL
+5V_NORMAL
POWER_ON/OFF2_3
OPT
C2366
0.1uF
16V
R2308
18K
1/16W
R2309
22K
1/16W
+3.5V_ST
+13V
L2305
BLM18PG121SN1D
PANEL_POWER
Q2302 Change: Diodes --> NXP, 131118
Default_NXP
Q2302
C2333
0.1uF
50V
PMV48XP
S
G
L2313
UBW2012-121F
OPT
ADUC 20S 02 010L
R2314
10K
10K
R2361
C2331
R2317
0.1uF
36KC2347
50V
VA23002
R2318
150K
C
Q2301
B
MMBT3904(NXP)
C2359
4.7uF
10V
OPT
E
+2.5V
IC2302
POWER_ON/OFF2_1
C2321
10uF
10V
R2315
10K
BIAS
POK
EN
IN
TJ2132GDP
1
2
3
4
2A
9
THERMAL
8
7
6
5
[EP]GND
GND
FB
OUT
SS
C2328
0.01uF
50V
C2332
2700pF
50V
Vout=0.6*(1+R2/R1)
R2316
R2310
1K
1%
1%
C2316
1uF
10V
100
1/16W
1%
IC2301
MP8762HGLE-Z
EN
1
FREQ
R2311
100K
1/16W
1%
AGND
R2313
4.7
1/16W
5%
2
FB
3
SS
4
5
PG
6
VCC
7
BST
8
R1
R2
C2318
0.033uF
50V
C2319
0.1uF
16V
16
15
14
13
12
11
10
9
SW_2
SW_1
IN_2
PGND_4
PGND_3
PGND_2
PGND_1
IN_1
1%
1/16W
R2320
560K
1/10W
5%
430K
R2319
LPBN8050T-1R0N
L2307
1.0uH
C2325
10uF
25V
C2327
+1.1V_CORE
330pF
50V
C2337
22uF
OPT
2.5V
10V
ZD2304
C2326
10uF
25V
Vout=0.611*(1+R1/R2)
+3.5V_ST
IC2305
TPS563200
GND
1
SW
2
3A
VIN
3
Vout=0.765*(1+R1/R2)
C2317
10uF
25V
C2320
0.1uF
25V
R2312
L2306
4.7uH
C2323
C2322
22uF
10V
10K
22uF
10V
D
Multi_AOS
Q2302-*1
1%
1/1 6W
1%
1/1 6W
C2346
22uF
10V
L2312
6
5
4
AO3435
S
8.2 K
R23 21
26. 1K
R23 22
VBST
EN
VFB
R2346
3.3K
G
R1
R2
PANEL_VCC
LVDS_DISCHARGE
D
C2354
10uF
10V
+1.1V_VDD
C2356
22uF
10V
+13V
0.1uF
16V
C2353
R2
R23 23
10K
1/1 6W
1%
C2363
10uF
10uF
25V
25V
+2.5V_NORMAL
C2357
0.1uF
5V
OPT
16V
ZD2305
R1
1%
1%
1/1 6W
1/1 6W
24. 9K
11K
R23 27
R23 28
50V
10pF
OPT
C2358
POWER UP SEQUENCE
3.3V->5V->1.5V->1.1V->2.5V
Power_DET
+13V
R2325
14K
C2370
0.1uF
25V
OPT
RESET IC_DIODES_APX803D29
VCC
1%
R2326
5.1K
1%
IC2307-*1
APX803D29
3
1
GND
RESET
2
VDD
C2355
0.1uF
25V
RESET_IC_DIODES_NEW_APX803E29
IC2307-*2
APX803E29
VCC
3
DDR MAIN 1.5V
10K
R2324
+3.5V_ST
L2308
C2339
10uF
10V
C2340
0.1uF
16V
PVIN_1
PVIN_2
PGND_1
PGND_2
[EP]FIN
1
THERMAL
2
17
IC2303
3
BD9A300MUV
4
3A
5
FB
AGND8MODE
6
3A
Vout=0.8*(1+R1/R2)
+5.0V normal & USB
C2334
2200pF
+13V
L2310
120-ohm
C2309
10uF
25V
OPT
C2311
10uF
25V
R23 35 1 6K 1%
AGND
[EP]
28
VIN_1
1
THERMAL
VIN_2
2
VIN_3
C2329
0.1uF
50V
PGND_1
PGND_2
PGND_3
1uF
25V
C23 24
C2330
0.0068uF
29
3
4
SN1302001(TPS65286RHDR)
5
6
V7V
7
8
MODE/SYNC
50V
R2339
50V
R2342
10K
R23 40 1 6K 1%
R23 4115 0K 1%
COMP25RLIM26RSET1
RSET2
27
IC2304
6A
9EN10
12
SW_EN213SW_EN1
SW_OUT211SW_OUT1
10K
4.7K
R2359
+5V_USB_3
USB_CTL2
POWER_ON/OFF2_4
xxLX761H-ZA2015.02.05
MAIN POWER
R2337
100K
RESET IC_ROHM
IC2307
BD48K28G
3
1
GND
RESET
2
1
GND
OPT
C2361
0.1uF
16V
BOOT14PGD15EN16AVIN
13
12
11
10
9
7
ITH
OPT
C2335
100pF
50V
22SS23FB24
LX_3
21
LX_2
20
LX_1
19
BST
18
SW_IN2
17
SW_IN1
16
NFAULT1
15
14
NFAULT2
OPT
OPT
4.7K
R2360
CB3216PA501E
USB_CTL3
Non_Cruise
+3.5V_ST
R2338
10K
OPT
R2350
100
POWER_ON/OFF2_2
VLS5045EXT-2R2N
L2309
2.2uH
C2345
C2349
22uF
C2342
0.01uF
50V
C2344
2700pF50V
22uF
10V
10V
R2
1%
6.8K
R2345
1/16W
C2348
22uF
R1
1%
R2353
1/16W
1/16W
51K
R2352
for Currnet UP
5%
100K
10V
L2311 Change, 131120
C2350
1uF
10V
C2343
82pF
5%
50V
L2311
4.7uH
C2338
0.047uF
25V
100K
R2344
1/16W
/USB_OCD3
Vout=0.6*(1+R1/R2)
5.1V:R1-51K, R2-6.8K
+5V_USB_2
SW_3
SW_2
SW_1
SS
R2329
8.2K
1/16W1%
L2314
2
C2336
0.047uF
25V
VOUT
C2341
0.1uF
16V
R2331
330K1/16W5%
/USB_OCD2
POWER_DET
C2365
0.1uF
16V
not to RESET at 8kV ESD
12V-->3.58V
ST_3.5V-->3.5V
+1.5V_DDR
1%
16K
R1
R23 32
1/1 6W
R2
1%
18K
1/1 6W
R23 33
C2352
C2351
10uF
22uF
10V
10V
+5V_NORMAL
2.5V
ZD2302
OPT
8
29
Page 37
SHIELD
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
20
EAG59023302
JK3202
YKF45-7058V
HDMI_1(ARC)
5V_HDMI_1
VA3215
ESD_HDMI_Amotech
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
ARC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
VA3208
ESD_HDMI_Amotech
AR3207
5.1
1/16W
EOS_5.1OHM
AR3208
5.1
1/16W
EOS_5.1OHM
HDMI_EXT_EDID
1K
R3268
100K
R3265
AR3200
VA3206
VA3207
ESD_HDMI_Amotech
ESD_HDMI_Amotech
CEC_REMOTE
R3251
33
HDMI_INT_EDID
33
1/16W
VA3213
ESD_HDMI_Amotech
D3210
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI_TMDS
D3211
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI_TMDS
Q3204
C
B
DDC_SCL_1
DDC_SDA_1
10
9
8
7
6
10
9
8
7
6
HDMI_EXT_EDID
MMBT3904(NXP)
E
1K
R3269
HDMI_EXT_EDID
HDMI_EXT_EDID
R3270
4.7K
5V_HDMI_1
R3248
1K
OPT
C3202 1uF
10V
R3249
3.9K
OPT
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
HDMI (REAR 1 ARC / SIDE 1 MHL)
VA3208-*1
ESD_HDMI_Innochips
VA3215-*1
ESD_HDMI_Innochips
VA3216
ESD_HDMI_Amotech
IR_OUT_HDMI1
CEC_REMOTE
AR3215
5.1
EOS_5.1OHM
AR3214
5.1
EOS_5.1OHM
VA3216-*1
ESD_HDMI_Innochips
VA3212-*1
ESD_HDMI_Innochips
100K
R3267
VA3212
ESD_HDMI_Amotech
VA3210
ESD_HDMI_Amotech
D3215
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI_TMDS
D3214
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI_TMDS
HDMI_HPD_1
SPDIF_OUT_ARC
C3226
0.1uF
16V
OPT
ARC
AR3207-*1
0
1/16W
EOS_0OHM
VA3206-*1
ESD_HDMI_Innochips
VA3207-*1
ESD_HDMI_Innochips
VA3213-*1
ESD_HDMI_Innochips
AR3208-*1
0
1/16W
EOS_0OHM
BODY_SHIELD
GND
20
19
18
17
16
15
14
13
12
11
10
9
EAG63530101
8
7
6
5
4
3
2
1
JK3203
DAADR019A
HDMI_JACK_FOOSUNG
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_4
AR3202
33
1/16W
NON_MHL
VA3211
ESD_HDMI_Amotech
10
9
8
7
6
10
9
8
7
6
+3.3V_NORMAL
R3274
1K
1/16W
5%
DDC_SCL_4
DDC_SDA_4
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
R3277
0
1/16W
5%
NON_MHL
+5V_NORMAL
MHL
B
VA3210-*1
ESD_HDMI_Innochips
VA3211-*1
ESD_HDMI_Innochips
R3275
10K
MHL
C
Q3208
MMBT3904(NXP)
MHL
E
AR3215-*1
0
1/16W
EOS_0OHM
MHL
R3243
1K
1/16W
5%
VA3217
5.6V
MHL_AMOTECH
HDMI_2(MHL/IR_OUT)
G
AR3214-*1
0
1/16W
EOS_0OHM
C3223
0.047uF
25V
MHL
R3261 0
MHL
R3261-*1
33
NON_MHL
D
Q3207
SI1012CR-T1-GE3
MHL
S
R3273
1K
MHL
Q3200
MMBT3904(NXP)
MHL
R3246
B
+3.5V_ST
10K
MHL
HDMI_HPD_4
R3247 10K
MHL
C
E
B
E
Q3201
MMBT3906(NXP)
MHL
C
+5V_NORMAL
C3201
0.1uF
MHL
MHL_DET
MHL_DET
HDMI2 With MHL
R3204
100K
C3203
MHL
5V_HDMI_4
C3228
10uF
22uF
10V
10V
MHL
OPT
D3202-*1
SS2040LL-LG
40V
MHL_SUZHOU
MHL
IC3201
BD2242G
VIN
1
GND
R3202
330K
MHL
2
EN
3
D3201
MHL
R3201
10K
A1
C
MHL
A2
6
5
4
VOUT
ILIM
OC
JK3203-*1
5501-56219
HDMI_JACK_CNPLUS
MHL
20
19
18
17
16
15
14
13
12
11
10
D3202
MBR230LSFT1G
30V
MHL_ONSEMI
R3200
14K
9
8
7
6
5
4
3
2
1
EDID
GND
VSS
EDID_WP
IC3203-*1
BR24G02FJ-3GTE2
A0
1
A1
2
A2
3
4
HDMI_EXT_EDID_ROHM
IC3203
M24C02-RMN6T
E0
1
E1
2
E2
3
4
HDMI_EXT_EDID_ST
R3272
10K
OPT
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WC
7
SCL
6
SDA
5
R3271 10K
HDMI_EXT_EDID
HDMI_SW_SUZHOU
+3.5V_ST
R3253
4.7K
OPT
R3258
HDMI_EXT_EDID
R3259 33
HDMI_EXT_EDID
C
Q3209
B
MMBT3904(NXP)
HDMI_EXT_EDID
E
+5V_NORMAL
D3203
MMBD6100
AR3205
47K
MMBD6100
HDMI_SW_SUZHOU
R3278 4.7K
HDMI_EXT_EDID
AR3206
33
5V_HDMI_4
1/16W
D3216
47K
1/16W
A2CA1
HDMI_SW_SUZHOU
5V_HDMI_1
+5V_NORMAL
D3205
MMBD6100
DDC_SDA_4
DDC_SCL_4
A2CA1
HDMI_SW_KEC
D3216-*1
KDS184
DDC_SCL_1
DDC_SDA_1
+3.5V_ST
A2CA1
D3203-*1
KDS184
HDMI_SW_KEC
D3205-*1
KDS184
HDMI_SW_KEC
A2CA1
VA3217-*1
ICVS0505201FR
Multi_MHL_Innochips
A2CA1
A2CA1
For CEC
From HDMI Connector
CEC_REMOTEHDMI_CEC
G
S
D
Q3210-*1
SI1012CR-T1-GE3
HDMI_CEC_FET_VISHAY
R3209
27K
D3208
BAT54_SUZHO
+3.5V_ST
G
D
HDMI_CEC_FET_ROHM
S
Q3210
RUE003N02
R3210
120K
To NEC MICOM
HDMI LEAKAGE Workaround in MTK A2(A0) (Default= with HDMI_LEAKAGE)
+3.3V_NORMAL
R3255
0
OPT
1/16W
5%
PANEL_VCC
R3254
10K
G
S
NTR4501NT1G
Q3202
D
VDD3V3_HDMI
C3227
0.1uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
HDMI(MHL)
2015.02.02
9
29
Page 38
EXTERNAL CLOCK
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
CLK_COM5
CLK_COM4
CLK_COM3
CLK_COM2
CLK_COM1
CLK_DATA7
CLK_DATA6
CLK_DATA5
CLK_DATA4
CLOCK
R3401
CLOCK
R34020
CLOCK
R3403
CLOCK
R3404
CLOCK
R3405
CLOCK
R3422470
CLOCK
R3421470
CLOCK
R3420470
CLOCK
R3419
470
0
0
0
0
CLOCK
C3415
0.1uF
CLOCK
R3425
0
CLOCK_DET
CLK_DATA3
CLK_DATA2
CLK_DATA1
CLOCK
R3418
470
CLOCK
R3417 470
CLOCK
R3416
470
CLOCK
JK3404
SPG09-DB-010
DATA1
DATA6
COM1
DATA2
NC
COM2
DATA3
DATA7
COM3
DATA4
GND
COM4
DATA5
DETECT
COM5
CLOCK
R3424
0
SHILED
SPDIF OUT
SPDIF_OUT
+3.3V_NORMAL
C3402
47pF
50V
C3400
0.1uF
16V
Default_Solteam
JST1223-001
GND
VCC
VINPUT
JK3401
1
2
3
Fiber Optic
4
Multi_Foxconn
JK3401-*1
2F01TC1-CLM97-4F
GND
1
VCC
2
VIN
3
Fiber Optic
4
SHIELD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA2015.02.02
CLOCK/SPDIF
10
29
Page 39
RS232C
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
C3800 0.1uF
C3801 0.1uF
C3802 0.1uF
C3803 0.1uF
C1+
V+
C1-
C2+
C2-
V-
DOUT2
RIN2
IC3800
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
EXT UART SWITCH
CONNECTION
1A@5V /1A@12V FOR COMMERCIAL(RS-232C POWER)
DBG_SW
EXT_12V
EXT_5V
10
5
9
8
7
6
SPG09-DB-009
JK3803
4
3
2
1
C3804
0.1uF
IR_OUT_RS232C
D3804
20V
OPT
+3.5V_ST
R3811
4.7K
D3805
20V
OPT
R3814
4.7K
+3.5V_ST
R3820 100
R3821 100
50V
BAP70-02
D3803
RS232_RX
RS232_TX
R3834
1K
+3.5V_ST
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
UART_SW1
+3.5V_ST
SOC_TX
SOC_RX
B0 - A
L
H
B1 - A
SELECT
VCC
C3822
0.1uF
SELECT
VCC
C3823
0.1uF
IC3811
NLASB3157DFT2G
6
ON SEMICONDUCTOR
ANALOG SWITCH
5
A
4
EAN38256201
IC3812
NLASB3157DFT2G
6
ON SEMICONDUCTOR
ANALOG SWITCH
5
A
4
EAN38256201
M14 ADJ.
M14 DEBUG
B1
1
GND
2
B0
3
B1
1
GND
2
B0
3
R3801
22R3805
R3802
R3803
R3804
SOC_DBG_TX
22
RS232_TX
22
SOC_DBG_RX
22
RS232_RX
SOC_NEC_TX
SOC_NEC_RX
NEC_RXRS232_RX
UART_SW2
L
22
R3806
22
CONNECTION
B0 - A
B1 - AH
B1
GND
B0
B1
GND
B0
IC3802
NLASB3157DFT2G
1
ON SEMICONDUCTOR
ANALOG SWITCH
2
3
EAN38256201
IC3804
NLASB3157DFT2G
1
ON SEMICONDUCTOR
ANALOG SWITCH
2
3
EAN38256201
NEC INTERACTIVE
CPU INTERACTIVE
SELECT
6
VCC
5
C3811
0.1uF
A
4
SELECT
6
VCC
5
C3813
0.1uF
A
4
+3.5V_ST
R38550R3854 0
R38590R3858 0
UART_SW2
RS232_TXNEC_TX
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
UART DBG SWITCH
UART_DBG_SW
CONNECTION
L
H
SOC_DBG_TX
NEC_DBG_TXD
SOC_DBG_RX
NEC_DBG_RXD
B0 - A
B1 - A
+3.5V_ST
R3844
4.7K
R3845
4.7K
OPT
Debug NEC
Debug M14
B1
GND
B0
B1
GND
B0
IC3805
NLASB3157DFT2G
1
ON SEMICONDUCTOR
ANALOG SWITCH
2
3
EAN38256201
IC3807
NLASB3157DFT2G
1
ON SEMICONDUCTOR
ANALOG SWITCH
2
3
EAN38256201
EXT_SPK_CONTROL & DBG OUT
DBG_SW
D3806
5.6V
D3807
5.6V
CONNECTION
L
B0 - ADEBUG_NEC/M14
H
OPT
OPT
EXT.SPK VOL Control
B1 - A
E_SPRING
T_TERMINAL1
B_TERMINAL1
R_SPRING
T_SPRING
B_TERMINAL2
T_TERMINAL2
PEJ027-04
3
6A
7A
4
5
7B
6B
JK3801
EXT_SPK
2014.05.02
11
29
+3.3V_NORMAL
IC3806
R3849
UART_DBG_SW
SELECT
6
VCC
5
C3814
0.1uF
A
4
SELECT
6
VCC
5
C3815
0.1uF
A
4
+3.5V_ST
EXT_SPK_VOL+
JK_DBG_TX
JK_DBG_TX
EXT_SPK_VOL-
JK_DBG_RX
JK_DBG_RX
3.6K
+3.3V_NORMAL
R3851
3.6K
NLASB3157DFT2G
B1
1
ON SEMICONDUCTOR
ANALOG SWITCH
GND
2
B0
3
EAN38256201
NLASB3157DFT2G
B1
1
ON SEMICONDUCTOR
ANALOG SWITCH
GND
2
B0
3
EAN38256201
IC3808
SELECT
6
VCC
5
A
4
SELECT
6
VCC
5
A
4
+3.5V_ST
+3.5V_ST
C3816
0.1uF
C3817
0.1uF
DBG_SW
C3818
1000pF
C3819
1000pF
OPT
50V
OPT
50V
JP3801
JP3802
xxLX761H-ZA
RS232/UART/VOL_CTL
Page 40
WOL/WIFI_POWER_ON
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
EYE_SDA
EYE_SCL
BT_RESET
I2C_SDA2
AR4001
100
EYE_Q_MICOM
I2C_SCL2
IR
LED_R
R4012 100
EYE_Q_CPU
R4013 100
EYE_Q_CPU
R4034 22
R4015
1.8K
C4009
0.1uF
16V
P4000
SMAW200-H18S5
GND
NC
WOL
SDA
SCL
GND
IR
1
3
5
7
9
11
13
15
17
19
R4001
R4033
C4003
0.1uF
OPT
C4004
0.1uF
+3.5V_ST
R4005
10K
5%
C4007
100pF
50V
OPT
ZD4000
5.48VTO5.76V
100
2K
R4002
100
D4001
5.6V
OPT
BT_RESET
LED_R
+3.5V_WIFI
2
USB_DM
4
USB_DP
6
GND
8
GND
10
KEY1
12
KEY2
14
+3.5V_ST
16
GND
18
L4000 Delete for voltage drop, 131120
C4005
0.1uF
Place Near Wafer
C4016
5pF
OPT
WIFI_DMDP_5pF
C4008
1000pF
50V
OPT
50V
WIFI_DMDP_5pF
+3.5V_ST
D4000
RCLAMP0502BA
C4006
C4015
5pF
50V
22uF
10V
R4018
10
R4019
10
C4001
0.1uF
OPT
WIFI_DM
WIFI_DP
+3.5V_WIFI
+3.5V_ST
R4008
10K
5%
C4002
0.1uF
OPT
R4009
10K
5%
R4006
R4007
100
KEY1
100
KEY2
GND
IR OUT
IR_OUT_CTRL
IR_OUT_RS232C
IR_OUT_HDMI1
R4031 2K
R4023 22
R4028 22
Q4003
2SC3052
C
IR_OUT_ISAHAYA
B
E
Q4001
2SC3052
IR_OUT_ISAHAYA
Q4001-*1
2N3904S
IR_OUT_KEC
+5V_ST
R4024
10K
C
E
C
E
B
+5V_ST
B
R4025 10K
R4029
10K
C
B
E
Q4004
2SC3052
IR_OUT_ISAHAYA
Q4002-*1
2N3904S
IR_OUT_KEC
R4030 10K
C
B
E
+3.5V_ST
Q4003-*1
2N3904S
IR_OUT_KEC
R4026
10K
C
R4027 33K
B
E
Q4002
2SC3052
IR_OUT_ISAHAYA
C
IR_OUT_KEC
B
E
Q4004-*1
2N3904S
WIFI POWER ENABLE CONTROL
+3.5V_ST
C4010
R4035
0.1uF
10K
OPT
WIFI_EN
C
B
E
R4022 33
R4021
10K
OPT
C4017
0.1uF
16V
IN
EN
IC4001
AP2191WG-7
5
4
1
2
3
+3.5V_WIFI
OUT
GND
FLG
R4032
30K
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
IR / KEY
2015.02.04
12
29
Page 41
USB_DM3
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
USB_DP3
C4308
10uF
10V
EOS_2.2ohm
R43022.2
EOS_2.2ohm
R43012.2
EOS_0ohm
R4302-*1 0
EOS_0ohm
R4301-*1 0
C4306
22uF
10V
+5V_USB_3
5V
D4302
USB_ESD_SEMTECH
USB2 Side(Side Up)
5V
D4302-*1
USB_ESD_KEC
USB_ESD_0582B
RCLAMP0582B
D4301
3AU04S-305- ZC- (LG)
JK4300
1234
USB DOWN ST REA M
5
USB_DM2
USB_DP2
C4307
10uF
10V
C4304
22uF
10V
EOS_2.2ohm
R43042.2
EOS_2.2ohm
R43032.2
EOS_0ohm
R4304-*1 0
EOS_0ohm
R4303-*1 0
Multi_Toshiba
D4301-*2
DF3D6.8MS
+5V_USB_2
5V
D4303
USB_ESD_SEMTECH
5V
D4303-*1
USB_ESD_KEC
USB_ESD_0502BA
D4301-*1
RCLAMP0502BA
USB1 SIDE(Side Down)
3AU04S-305- ZC- (LG)
JK4302
1234
USB DOWN ST REA M
5
D4300
RCLAMP0582B
USB_ESD_0582B
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Multi_Toshiba
D4300-*2
DF3D6.8MS
USB_ESD_0502BA
D4300-*1
RCLAMP0502BA
xxLX761H-ZA
USB1/2
2015.02.04
13
29
Page 42
VA4601
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5.6V
EU_Amotech
VA4601-*1
EU_Innochips
+3.3V_NORMAL
EU
R4601
10K
EU
C4604
0.1uF
CLOSE TO JUNCTION
EU
R4602
100
SC_DET
Full Scart
(with screw hole)
EU
AV_DET
22
COM_GND
21
SYNC_IN
20
SYNC_OUT
19
SYNC_GND2
18
SYNC_GND1
17
RGB_IO
16
R_OUT
15
RGB_GND
14
R_GND
13
D2B_OUT
12
G_OUT
11
D2B_IN
10
G_GND
9
ID
8
B_OUT
7
AUDIO_L_IN
6
B_GND
5
AUDIO_GND
4
AUDIO_L_OUT
3
AUDIO_R_IN
2
AUDIO_R_OUT
1
PSC008-03
JK4600
JK4601
PPJ231-02
4
5
7
8
6
NON_EU
R4605
0
VA4612
5.6V
NON_EU
+3.3V_NORMAL
R4606
10K
NON_EU
AV_CVBS_DET
R4604
0
EU
VA4609
5.5V
VA4610
5.5V
EU
VA4607
5.6V
EU_Amotech
VA4608
5.6V
EU_Amotech
VA4602
5.6V
EU_Amotech
VA4603
5.5V
EU
VA4604
5.5V
EU
VA4605
5.5V
EU
VA4600
20V
EU_Amotech
VA4611
5.6V
EU_Amotech
VA4606
5.6V
EU_Amotech
VA4607-*1
EU_Innochips
VA4608-*1
EU_Innochips
SC_CVBS_IN
VA4602-*1
EU_Innochips
VA4600-*1
EU_Innochips
VA4611-*1
EU_Innochips
VA4606-*1
EU_Innochips
BLM18PG121SN1D
EU
C4600
1000pF
50V
BLM18PG121SN1D
EU
C4601
1000pF
50V
EU
1/16W
75
R4603
SC_FB
SC_R
SC_G
SC_B
SC_ID
SC_L_IN
SC_R_IN
L4600
EU
L4601
EU
EU
C4602
4700pF
EU
C4603
4700pF
DTV/MNT_L_OUT
DTV/MNT_R_OUT
DTV/MNT_V_OUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
SCART JACK
2015.02.02
1429
Page 43
AUDIO AMP(NTP7514)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
AUDIO AMP(MAIN)
SPK_L+
SPK_L-
SPK_R+
SPK_R-
4
3
2
1
P5600
Black : Box_Type
2015.02.03
15
29
Page 44
AUD_OUT >> EU/CHINA_HOTEL_OPT
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
EU
DTV/MNT_L_OUT
C6000
1uF
25V
SCART_LOUT
EU
R6000
2.2K
OPT
C6002
6800pF
OPT
R6002
470K
EU
R600433K
C6003 33pF
EU
R6001
10K
C6001
4.7uF
10V
PANEL_VCC
L6000
EU
IC6000
C6006
4.7uF
10V
EU
C6004
0.1uF
50V
10K
EU
EU
EU
R600833K
33pF
C6005
EU
R6003
OPT
R6010
470K
OPT
C6007
6800pF
EU
R6011
2.2K
EU
C6008
1uF
25V
DTV/MNT_R_OUT
SCART_ROUT
AZ4580MTR-E1
OUT1
1
IN1-
2
IN1+
EU
EU
VEE
EU
3
4
VCC
8
OUT2
7
IN2-
6
IN2+
5
[SCART AUDIO MUTE]
DTV/MNT_L_OUT
C
Q6000
MMBT3904(NXP)
E
DTV/MNT_R_OUT
C
Q6001
MMBT3904(NXP)
E
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EU
R6013
1K
B
EU
EU
R6014
1K
B
EU
EU_SCART_MUTE_ISAHAYA
C
R6015-*1
0
ISAHAYA,NXP
Q6002
RT1P141C-T112
E
R6016
10K
B
R6015
10K
KEC,NXP_NEW
EU_SCART_MUTE_NXP
SCART_MUTE
R6016 should be applied if Q6002 has not internal resistor
(Q6002 : KEC or NXP_NEW)
PDTA114ET
Q6002-*1
E
C
B
EU_SCART_MUTE_KEC
C
B
2N3906S-RTK
Q6002-*2
E
EU_SCART_MUTE_NXP_NEW
C
MMBT3906(NXP)
E
B
Q6002-*3
xxLX761H-ZA
SCART AUDIO AMP/MUTE
2015.02.02
16
29
Page 45
FE_DEMOD1_TS_ERROR
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. should be guarded by ground
2. No via on both of them
close to Tuner
+3.3V_NORMAL
L6500
1
+3.3V_LNA_TU
BLM18PG121SN1D
C6501
0.1uF
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
Global F/E Option Name
1. TU
2. Tuner Name = TDJ’H’,TDj’M’...
3. Country Name = KR,US,BR,EU ...
Example of Option name
TU_ALL_IntDemod = All Tuner type for Internal demod
TU_M/W = apply TDSM&TDSW Type Tuner
14’ Tuner Type for Global
TDJ’H’-G101D : Half NIM for EU,AJJA
TDJ’H’-H101F : Half NIM for US, KR
TDJ’K’-T101F : Half NIM for TW
TDJ’M’-C301D,F : FULL NIM for China
TDJ’M’-B101F : Brazil NIM with Isolater Type
TDJ’M’-K101F : colombia NIM
TDJ’M’-G101D,G105D,G151D : EU Combo&Full NIM
TDJ’M’-H101F,H151F : Korea PIP tuner
TDJ’W’-A151D : AJJA T2 PIP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
TUNER
2015.02.26
17
29
Page 46
TU_H_EU
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TU6701
TDJH-G301D
TU_M_BR
TU6702-*1
TDJM-B301F
+3.3V
1
NC_1
2
NC_2
3
SCL_RF
4
SDA_RF
5
NC_3
6
NC_4
7
SIF
8
CVBS
9
NC_5
10
+3.3V_RF
11
ERROR
12
GND_1
13
MCLK
14
SYNC
15
VAILD
16
D0
17
D1
18
D2
19
D3
20
D4
21
D5
22
D6
23
D7
24
RESET_DEMOD
25
+3.3V_DEMOD
26
SCL_DEMOD
27
+1.2V_DEMOD
28
NC_6
29
SDA_DEMOD
30
A1
B1B1A1
47
SHIELD
A1
TU_CHINA
47
SHIELD
TU6702-*2
TDJM-C401D
+3.3V
1
NC_1
2
NC_2
3
SCL_RF
4
SDA_RF
5
NC_3
6
NC_4
7
SIF
8
CVBS
9
NC_5
10
+3.3V_RF
11
ERROR
12
GND_1
13
MCLK
14
SYNC
15
VAILD
16
D0
17
D1
18
D2
19
D3
20
D4
21
D5
22
D6
23
D7
24
RESET_DEMOD
25
+3.3V_DEMOD
26
SCL_DEMOD
27
+1.2V_DEMOD
28
NC_6
29
SDA_DEMOD
30
B1B1A1
TU_H/M_EU/CN
C6701
1000pF
R6712-*1
22
TU_H/M_BR
630V
A1
R6712
0
TU_EU/CN
A1
TU_GND_B
TU_H/M_EU
C6710
1000pF
630V
47
SHIELD
1
2
3
4
5
6
7
8
9
B1
TU_H/M_CN
C6702
1000pF
+3.3V
NC_1
IF_AGC
SCL_RF
SDA_RF
IF[P]
IF[N]
SIF
CVBS
B1
630V
TU_GND_B
0
R67 01
TU_H/W_EU/JP
TU_M_EU
TU6702
TDJM-G301D
+3.3V
1
NC_1
2
AIF_AGC
3
SCL_RF
4
SDA_RF
5
AIF[P]
6
AIF[N]
7
SIF
8
CVBS
9
NC_2
10
+3.3V_RF
11
ERROR
12
GND_1
13
MCLK
14
SYNC
15
VALID
16
D0
17
D1
18
D2
19
D3
20
D4
21
D5
22
D6
23
D7
24
RESET_DEMOD
25
+3.3V_DEMOD
26
SCL_DEMOD
27
+1.2V_DEMOD
28
NC_3
29
SDA_DEMOD
30
LNB
31
GND
32
A1
A1
B1
B1
47
+3.3V_LNA_TU
IF_AGC_TU
I2C_SCL6_TU
I2C_SDA6_TU
IF_P_TU
IF_N_TU
TU_SIF_TU
TU_CVBS_TU
+3.3V_TU
FE_DEMOD1_TS_ERROR
FE_DEMOD1_TS_CLK
FE_DEMOD1_TS_SYNC
FE_DEMOD1_TS_VAL
FE_DEMOD1_TS_DATA[0]
FE_DEMOD1_TS_DATA[1]
FE_DEMOD1_TS_DATA[2]
FE_DEMOD1_TS_DATA[3]
FE_DEMOD1_TS_DATA[4]
FE_DEMOD1_TS_DATA[5]
FE_DEMOD1_TS_DATA[6]
FE_DEMOD1_TS_DATA[7]
/TU_RESET1_TU
+3.3V_DEMOD_TU
I2C_SCL4_TU
D_Demod_Core
LNB_TX
I2C_SDA4_TU
LNB_OUT
1
3
4
5
6
7
8
9
10
11
12
13
14
16
17
18
19
20
21
22
23
24
25
26
27
30
31
32
47
SHIELD
DVB-T GND DVB-S JACK GND
TU_GND_B
POWER_ON/OFF2_1
+3.5V_ST
L6701
BLM18PG121SN1D
TU_M/W
TU_M/W
C6708
0.1uF
TU_M/W
C6703
10uF
10V
+5V_NORMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TU_M/W
10K
R6705
TU_M/W
C6704
1uF
10V
POK
EN
IN
BIAS
Vout=0.6*(1+R2/R1)
TU_M/W
IC6700
TJ2132GDP
1
2
THERMAL
3
2A
4
D_Demod_Core
[EP]GND
R6704-*1
TU_M/W
C6707
10uF
10V
10.5K
R6703-*1
9.1K
TU_M/W_1.1V
TU_M/W_1.1V
xxLX761H-ZA
TU_SYMBOL
2014.02.26
1829
TU_M/W_1.2V
R1
C6706
0.01uF
50V
10K
R67 04
R2
R67 03
10. 5K
TU_M/W_1.2V
GND
8
FB
9
7
OUT
6
SS
5
C6705
2700pF
50V
Page 47
DVB-S2 LNB Part Allegro
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
(Option:LNB)
Input trace widths should be sized to conduct at least 3A
Ouput trace widths should be sized to conduct at least 2A
LNB_OUT
C6900
0.1uF
LNB
C6901
33pF
LNB
Close to Tuner
Surge protectioin
D6900
LNB
LNB_SUZHOU
D6902-*2
SS2040LL-LG
40V
40V
SS2040LL-LG
D6901-*2
LNB_SUZHOU
R6900
2.2K
1W
LNB
LNB_TSC
SS23L
D6901-*1
LNB_TSC
D6901
MBR230LSFT1G
LNB_ONSEMI
C6902
0.22uF
LNB
25V
A_GND
D6902-*1
SS23L
30V
30V
30V
D6902
LNB_ONSEMI
30V
C6903
0.01uF
50V
LNB
LNB
2A
C6905
10uF
25V
LNB
close to Boost pin(#1)
C6904
0.1uF
50V
A_GND
C6906
10uF
25V
LNB
D6903
LNB_SMAB34
40V
D6903-*1
LNB_SX34
40V
A_GND
C6907
10uF
25V
LNB
D6904-*1
LNB_SX34
LNB_SMAB34
C6908 0.1uF
LNB_Allegro
40V
D6904
40V
NC_1
NC_2
LNB
TDI
TDO
[EP]
1
2
3
4
5
A_GND
NC_4
BOOST
19
20
THERMAL
21
IC6900
DT1803
LNB_DMBT
7
6
SCL9ADD
IRQ
NC_3
18
8
SDA
PGND
16LX17
15
14
13
12
11
10
TONECTRL
+13V_M
3.0A
LNB
15uH
L6900
LPH6050T-150M-R
VIN
GND
VREG
ISET
TCAP
A_GND
Max 1.3A
C6909
10uF
25V
LNB
close to VIN pin(#15)
C6910
0.1uF
50V
LNB
C6912
LNB
0.1uF
LNB
C69110.22uF
3A
LNB
R6903
39K
1/16W
1%
C6913
0.1uF
50V
+3.3V_NORMAL
Caution!! need isolated GND
A_GND
R6904
0
R6910
10K
OPT
1/16W
5%C6915
B
4.7uF
10V
C6914
R6908
0.1uF
36K
50V
R6909
150K
C
Q6902
MMBT3904(NXP)
E
Q6901
PMV48XP
S
+13V_M+13V
D
G
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
33
I2C_SCL4
I2C_SDA4
LNB
AR6901
LNB_TX
0
R6911
LNB_TX
LNB_Tx
GND
0
R6912
LNB_NON_Tx
xxLX761H-ZA
LNB
LNB_Allegro
VCP
LNB
NC_1
TDI
TDO
GNDLX18NC_219NC_320BOOST
[EP]GND
1
THERMAL
2
21
3
IC6900-*1
A8303SESTR-T(4M)
4
5
7
8
SCL9ADD
SDA6IRQ
16LX17
15
14
13
12
11
10
TONECTRL
VIN
GND
VREG
ISET
TCAP
2015.02.26
1929
Page 48
LVDS
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
LVDS INTERFACE
2015.02.05
2029
Page 49
eMMC I/F
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
eMMC
2015.02.02
21
29
Page 50
Ethernet HUB(RTL8305N-CG)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
Ethernet HUB
2014.05.02
22
29
Page 51
EXT_SPEAKER_AMP
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
R8629
47K
EXT_SPK_DET
HP_DET
EXT_AMP_/SD
AMP_RESET_N
EXT_SPK_MUTE
R8631 0
OPT
R8630 47K
OPT
R8601
OPT
C
Q8602
B
MMBT3904(NXP)
P
OPT
E
+3.5V_ST
B
47K
OPT
R8610
HP_LOUT/Ext_LOUT
HP_ROUT/Ext_ROUT
R8602
15K
OPT
C
Q8601
MMBT3904(NXP)
OPT
E
1K
OPT
EXT_SPK
R8603
100
R8613 10K
C8600
C8601
Close to IC8600
C8602
1uF
50V
1uF
10V
1uF
10V
EXT_SPK
EXT_SPK
C8603
EXT_SPK
1uF
50V
C8604
0.1uF
50V
EXT_SPK
Close to Pin10
+13V_AMP
L8600
EXT_SPK
UBW2012-121F
TPA3124D2PWPR
PVCCL_1
SD
PVCCL_2
MUTE
LIN
RIN
BYPASS
AGND_1
AGND_2
PVCCR_1
VCLAMP
PVCCR_2
Close to Pin3
EXT_AMP_14Y
IC8600
1
2
3
4
5
6
7
8
9
10
11
12
EXT_SPK
C8611
0.1uF
50V
EXT_AMP_15Y_CI
IC8600-*1
PAM8124
1
2
3
4
5
6
7
8
9
10
11
12
AMP GAIN
20dB
26dB1
32dB001
36dB
PGNDL_2
24
PGNDL_1
23
LOUT
22
BSL
21
AVCC_2
20
AVCC_1
19
GAIN0
18
GAIN1
17
BSR
16
ROUT
15
PGNDR_2
14
PGNDR_1
13
C8616
47uF
25V
EXT_SPK
C8617
47uF
25V
EXT_SPK
EXT_SPK
R8616
10K
EXT_SPK
R8617
10K
EXT_OUT_L
EXT_OUT_R
EXT_SPK OUT(Single End)
EXT_OUT_R
EXT_OUT_L
EXT_SPK_DET
Multi_Innochips
ICVS0505201FR
R8611
VA8600-*1
C8619
EXT_SPK
C8618
OPT
1uF
10V
OPT
100
1uF
10V
+3.5V_ST
EXT_SPK
R8612
15K
VA8600
5.6V
Default_Amotech
GND
DETECT
GND
Connected
High
EXT_SPK
JK8600
PEJ034-01
R
L
EXT_SPK_DET
Disconnected
Low
PVCCL_1
SD
PVCCL_2
MUTE
LIN
RIN
BYPASS
AGND_1
EXT_SPK
C8612
0.47uF
50V
EXT_SPK
C8613
0.47uF
50V
GAIN1
0
1
PVCCR_1
PVCCR_2
GAIN0
AGND_2
VCLAMP
OPT
C8614
0.47uF
50V
OPT
C8615
0.47uF
50V
0
1
C8609
C8610
0.1uF
10uF
50V
35V
EXT_SPK
EXT_SPK
Close to Pin1
PGNDL_2
24
PGNDL_1
23
LOUT
22
BSL
21
AVCC_2
20
AVCC_1
19
GAIN0
18
GAIN1
17
BSR
16
ROUT
15
PGNDR_2
14
PGNDR_1
13
Close to Pin19,20
C8607
0.22uF
50V
EXT_SPK
EXT_SPK
C8608
0.22uF
50V
Close to IC8600
EXT_SPK
L8602
22.0uH
L8603
22.0uH
EXT_SPK
C8632
0.1uF
50V
EXT_SPK
R8604
10K
OPT
R8605
10K
EXT_SPK
EXT_SPK
R8608
4.7K
EXT_SPK
R8609
4.7K
R8606
10K
OPT
R8607
10K
EXT_SPK
HEAD PHONE AMP
C8620
2.2uF
HP_ROUT/Ext_ROUT
10V
HP_OUT
HP_ROUT_AMP
SIDE_HP_MUTE
R8618 10K
HP_OUT
C8621
18pF
50V
HP_OUT
R8619 43K
HP_OUT
R8620
43K
HP_OUT
+3.3V_NORMAL
R8621
4.7K
HP_OUT
C8623
1uF
10V
HP_OUT
HP_OUT
C8622
10pF
50V
+INR
-INR
OUTR
GND_1
MUTE
VSS
CN
HP_OUT
IC8601
TPA6138A2
1
2
3
4
5
6
7
C8624 1uF 10V
HP_OUT
HP OUT
+INL
14
-INL
13
12
11
10
R8622 43K 1%
HP_OUT
C8629
10pF
OUTL
50V
HP_OUT
UVP
GND_2
VDD
9
CP
8
C8625
18pF
50V
R8624
43K 1%
HP_OUT
+3.3V_NORMAL
C8627
1uF
10V
HP_OUT
HP_OUT
R8623 10K
HP_OUT
C8628
0.1uF
16V
HP_OUT
C8626
2.2uF
10V
HP_OUT
HP_LOUT/Ext_LOUT
HP_LOUT_AMP
HP_LOUT_AMP
HP_ROUT_AMP
Place at JACK SIDE
L8605
BLM18PG121SN1D
HP_OUT
L8606
BLM18PG121SN1D
HP_OUT
C8630
0.22uF
10V
HP_OUT
C8631
0.22uF
10V
HP_OUT
HP_LOUT
HP_ROUT
HP_ROUT
HP_LOUT
HP_DET
R8627 150
HP_OUT
R8625 150
HP_OUT
R8626
100
HP_OUT
VA8601-*1
ICVS0505201FR
Multi_Innochips
+3.5V_ST
R8628
10K
HP_OUT
VA8601
5.6V
Default_Amotech
Connected Disconnected
High
HP_DET
Low
HP_Jack_6pie
JK8601
PJ752-F04L3BE-A
33
22
44
11
HP_Jack_5pie
JK8601-*1
PJ-3596T
33
22
44
11
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
2015.02.04
23EXT_SPK/HP
29
Page 52
REAL TIME CLOCK(RTC)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
NEC MICOM
SOC_RESET
2015.02.02
24
29
Page 53
Ethernet PHY(RTL8201FN)/RJ45
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
Ethernet PHY/RJ45
2015.02.02
25
29
Page 54
5V/12V EXT.Power Out
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
EXT.Power Out 5VEXT.Power Out 12V
IC9103
TPS54327DDAR
EN
1
VFB
2
3
SS
4
9
THERMAL
8
7
6
5
EXT5V_CTRL
R1
R9112
R9113
11K
56K
1%
1%
C9112
100pF
R2
R9116
12K
R9103
10K
VREG5
1%
C9117
1uF
10V
C9115
3300pF
50V
[EP]GND
VIN
VBST
SW
GND
+13V_A
CB3216PA501E
C9116
0.1uF
50VL9104
L9105
close IC9103
C9111
10uF
25V
3.6uH
NR8040T3R6N
C9103
22uF
16V
C9101
22uF
16V
EXT_5V
L9102
CB3216PA501E
C9118
0.1uF
16V
L9106
CB3216PA501E
Non_Cruise
Cruise
+5V_USB_2
EXT12V_CTRL
+13V_A
Non_Cruise
C9105
470pF
50V
R9101
1K
Non_Cruise
UF3D(SUZHOU GRANDE)
Non_Cruise
D9101
D9102
OPT
UF3D(SUZHOU GRANDE)
Vout=(1+R1/R2)*0.765=5.036V
GND
DV/DT
ENABLE/FAULT
I-LIMIT
1
2
3
4
NC
5
Non_Cruise
C9107
10uF
25V
close IC9101
Non_Cruise
R9104
75
IC9101
MP5000DQ
Non_Cruise
11
VCC
10
9
8
7
6
SOURCE_5
SOURCE_4
SOURCE_3
SOURCE_2
SOURCE_1
C9109
0.1uF
50V
Non_Cruise
Non_Cruise
L9101
CB3216PA501E
C9119
10uF
25V
Non_Cruise
close IC9104
EXT_12V
EXTERNAL_POWER DETECTION
EXT_12VEXT_5V
R9117
200
EXT_PWR_DET
D9103
EXT_PWR_DET
R9118
2.4K
EXT_PWR_DET
A2
A1
C
R9119
1.2K
1/16W
EXT_PWR_DET
EXT_PWR_DET
VCC
C9120
0.1uF
16V
EXT_PWR_DET
R9120
100K
EXT_PWR_DET
IC9104
APX803D29
3
1
GND
2
RESET
EXT_PWR_DET
R9121
100
EXT_PWR_DET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
EXT.Power(5V/12V)
2015.02.02
26
29
Page 55
Pro:Idiom (XMARK)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
Pro:IDIOM
2015.02.03
27
29
Page 56
TPI_DATA[6]
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TPI_DATA[7]
P:I_OUT_DATA7
P:I_OUT_DATA6
TPI_DATA[4]
TPI_DATA[5]
P:I_OUT_DATA5
P:I_OUT_DATA4
C9501
0.1uF
C9502
0.1uF
PRO_IDIOM
IC9501
SN74LVC16244AZQLR
1OE
A1
NC_1
A2
NC_2
A3
NC_3
A4
NC_4
A5
2OE
A6
1Y2
B1
1Y1
B2
GND_1
B3
GND_2
B4
1A1
B5
1A2
B6
1Y4
C1
1Y3
C2
VCC_1
C3
VCC_2
C4
1A3
C5
1A4
C6
2Y2
D1
2Y1
D2
GND_3
D3
GND_4
D4
2A1
D5
2A2
D6
2Y4
E1
2Y3
E2
2A3
E5
2A4
E6
+3.3V_NORMAL
L9501
BLM18PG121SN1D
+3.3V_NORMAL
10K
R9503
C
Q9501
MMBT3904(NXP)
PRO_IDIOM
E
3OE
K6
NC_8
K5
NC_7
K4
NC_6
K3
NC_5
K2
4OE
K1
4A3
J6
4A4
J5
GND_8
J4
GND_7
J3
4Y4
J2
4Y3
J1
4A1
H6
4A2
H5
H4
H3
H2
H1
G6
G5
G4
G3
G2
G1
F6
F5
F2
F1
VCC_4
VCC_3
4Y2
4Y1
3A3
3A4
GND_6
GND_5
3Y4
3Y3
3A1
3A2
3Y2
3Y1
C9503
0.1uF
C9504
0.1uF
PRO_IDIOM
B
PRO_IDIOM
P:I_OUT_VAL
P:I_OUT_SOP
TPI_SOP
TPI_VAL
P:I_OUT_CLK
TPI_CLK
P:I_OUT_DATA1
P:I_OUT_DATA0
TPI_DATA[0]
TPI_DATA[1]
P:I_OUT_DATA3
P:I_OUT_DATA2
TPI_DATA[2]
TPI_DATA[3]
R9504
10K
OPT
R9502
10K
TP_SWITCH
CI_OUT_DATA7
CI_OUT_DATA6
CI_OUT_DATA5
CI_OUT_DATA4
C9505
0.1uF
C9506
0.1uF
IC9502
SN74LVC16244AZQLR
1OE
A1
NC_1
A2
NC_2
A3
NC_3
A4
NC_4
A5
2OE
A6
1Y2
B1
1Y1
B2
GND_1
B3
GND_2
B4
1A1
B5
1A2
B6
1Y4
C1
1Y3
C2
VCC_1
C3
VCC_2
C4
1A3
C5
1A4
C6
2Y2
D1
2Y1
D2
GND_3
D3
GND_4
D4
2A1
D5
2A2
D6
2Y4
E1
2Y3
E2
2A3
E5
2A4
E6
R9501
10K
CI
3OE
K6
NC_8
K5
NC_7
K4
NC_6
K3
NC_5
K2
4OE
K1
4A3
J6
4A4
J5
GND_8
J4
GND_7
J3
4Y4
J2
4Y3
J1
4A1
H6
4A2
H5
H4
H3
H2
H1
G6
G5
G4
G3
G2
G1
F6
F5
F2
F1
VCC_4
VCC_3
4Y2
4Y1
3A3
3A4
GND_6
GND_5
3Y4
3Y3
3A1
3A2
3Y2
3Y1
C9507
0.1uF
C9508
0.1uF
CI
R9505
10K
OPT
TP_SWITCH
+3.3V_NORMAL
CI_OUT_VAL
CI_OUT_SOP
CI_OUT_CLK
CI_OUT_DATA1
CI_OUT_DATA0
CI_OUT_DATA3
CI_OUT_DATA2
10K
R9506
10K
R9507
OPT
TP_SWITCH2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
xxLX761H-ZA
TP SWITCH
2015.02.04
28
29
Page 57
PLACE AT JACK SIDE
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SCART SIGNAL
+3.3V_NORMAL
Place JACK Side
SC_CVBS_IN
SC_FB
SC_ID
SC_B
SC_G
SC_CVBS_IN_SOY
SC_RCOMP1_PR_IN_SOC
C302
150pF
50V
EU
R305
R30610K
R390
75
EU
10pF
C304
50V
OPT
NON_EU
R3940
L302
1uH
EU
EU
EU
10pF
C308
C307
50V
OPT
100
10pF
50V
OPT
C311
150pF
EU
1005
75
1%
R313
EU
1005
R391
75
EU
R389
2.7K
75
1%
R317
EU
1005
75
1%
R392
Place SOC Side
IC300
NJM2561BF1
R328
R3270
EU
100
C326 0.047uF
POWER_SAVE
DTV/MNT_V_OUT
SC_CVBS_IN_SOC
SC_CVBS_IN_SOY
VOUT
VSAG
1
EU
2
3
SC_FB_SOC
SC_ID_SOC
33
R330
EU
R33133
EU
R33233
EU
EU
EU
C3190.047uF
EU
C3200.047uF
EU
C3271000pF
C3210.047uF
EU
COMP1_PB_IN_SOC
COMP1_Y_IN_SOC
COMP1_Y_IN_SOC_SOY
PANEL_VCC
V+
6
GND
5
VIN
4
EU
C362
0.1uF
EU
C364
0.1uF
DTV/MNT_V_OUT_SOC
AUDIO OUT
AUDIO IN
SC_L_IN
SC_R_IN
R307 27K
1%
R308 27K
1%
C3144.7uF
R393 10K
1%
C3154.7uF
R321 10K
1%
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUAD_L_CH2_IN
AUAD_R_CH2_IN
SCART_LOUT
SCART_ROUT
R337
100K
EU
R338
100K
R339
100K
EU
EU
R336
100K
xxLX761H-ZA
SCART SIGNAL
2.2uF
C329
10V
EU
C330 2.2uF
10V
EU
EU
SCART_LOUT_SOC
SCART_ROUT_SOC
2015.02.02
2929
Page 58
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