LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
Page 4
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Application range
This spec sheet is applied LCD TV with LJ01M/P/R chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC
2) Relative Humidity: 65 ± 10 %
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
Page 7
- 7 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
4) CATV : 01 ~ 135
3Input Voltage1) AC 100 - 240V~ 50/60Hz
4MarketCentral and South AMERICA
5Screen Size19 inch Wide (1366 x 768)19LV2500
22 inch Wide (1366 x 768) 22LV2500
26 inch Wide (1366 x 768) 26LV2500
32 inch Wide (1366 x 768) 32LV2500
32 inch Wide (1920 x 1080)
32LV3500, 32LV3400, 32LK450, 32LK430
37 inch Wide (1920 x 1080) 37LV3500
42 inch Wide (1920 x 1080) 42LV3500, 42LV3400 42LK450
47 inch Wide (1920 x 1080) 47LV3500
•HDMI Monitor Range Limits
Min Vertical Freq - 58 Hz Max Vertical Freq - 62 Hz
Min Horiz. Freq - 30 kHz Max Horiz. Freq - 83 kHz
Pixel Clock - 160 MHz
Page 11
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV with
LJ01M/LJ01P/LJ01R chassis.
2. Designation
1) The adjustment is according to the order which is designated
and which must be followed, according to the plan which can
be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 ºC ± 5 ºC
Relative humidity : 65 % ± 10 %
Input voltage : 100 ~ 220 V~, 50/60 Hz
6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),
DDC Adjustment Jig equipment, Service remote control.
7) Push the “IN STOP” key - For memory initialization.
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot file Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message
If “Error” is displayed, Check connection between
computer, jig, and set.
3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
4) Click “Connect” tab. If “Can’t” is displayed, check
connection between computer, jig, and set.
5) Click “Auto” tab and set as below
6) Click “Run”.
7) After downloading, check “OK” message.
* USB DOWNLOAD
1) Put the USB Stick to the USB socket
2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work. But your downloaded version is High, USB
data is automatically detecting
3) Show the message “Copying files from memory”
4) Updating is staring.
filexxx.bin
(4)
(7) .OK
(5)
(6)
(1)
filexxx.bin
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
Case1 : Software version up
1. After downloading S/W by USB, TV set will reboot
automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at first.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
Page 12
- 12 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5) Uploading completed, The TV will restart automatically.
6) If your TV is turned on, check your updated version and
Tool option.(explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote control.
2) Select “Tool Option 1” and Push “OK” button.
3) Punch in the number. (Each model has their number)
4) Completed selecting Tool option.
3.1. ADC Process
(1) ADC
- Enter Service Mode by pushing “ADJ” key,
- Enter Internal ADC mode by pushing “
G
” key at “6. ADC
Calibration”
<Caution> Using ‘power on’ button of the Adjustment R/C,
power on TV.
* ADC Calibration Protocol (RS232)
Adjust Sequence
• aa 00 00 [Enter Adjust Mode]
• xb 00 40 [Component1 Input (480i)]
• ad 00 10 [Adjust 480i Comp1]
• xb 00 60 [RGB Input (1024*768)]
• ad 00 10 [Adjust 1024*768 RGB]
• aa 00 90 End Adjust mode
* Required equipment : Adjustment R/C.
3.2. Function Check
* Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART1/SCART2/ CVBS)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In
* Display and Sound check is executed by Remote control.
NoItem CMD1 CMD2 Data0
Enter AdjustAdjustAA0 0 When transfer the ‘Mode In’,
Mode‘Mode In’Carry the command.
ADC adjust ADC Adjust A D1 0 Automatically adjustment
(The use of a internal pattern)
Module Modu le Tool op ti on1 Tool op ti on2 Too l option3 Too l option4 Too l option5
42LV4500-SA LGD
32LV4500-SA LGD
55LV3500-SA LGD
47LV3500-SA LGD
42LV3500-SA AUO
42LV3500-SA LGD
37LV3500-SA AUO
37LV3500-SA LGD
32LV3500-SA CMI
32LV3500-SA AUO
32LV3500-SA LGD
42LV3400-SA LGD
32LV3400-SA LGD
32LV2500-SA CMI
32LV2500-SA AUO
32LV2500-SA LGD
26LV2500-SA AUO
26LV2500-SA LGD
22LV2500-SA CMI
22LV2500-SA AUO
19LV2500-SA AUO
19LV2500-SA CMI
19LV2500-SA LGD
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. Total Assembly line process
4.1. Adjustment Preparation
· W/B Equipment condition
CA210 : CH 9, Test signal : Inner pattern (85IRE)
· Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
* Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER ON ->
Enter the mode of White-Balance, the pattern will come out.
* Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10 lux).
2) Adhere closely the Color Analyzer (CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color Analyzer’s prove vertically.(80° ~ 100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
• Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 0000White Balance Start
Wb 00ffWhite Balance End
<Caution>
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)
* Manual W/B process using adjusts Remote control.
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “
G
” key at “6. White
Balance”.
* After done all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is not
same, then correct it same with BOM and unplug AC cable.
For correct it to the model’s module from factory Jig model.
* Push the “IN STOP” key after completing the function
inspection. And Mechanical Power Switch must be set
“ON”.
4.2. DDC EDID Write (RGB 128Byte)
• Connect D-sub Signal Cable to D-sub Jack.
• Write EDID Data to EEPROM(24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
4.3. DDC EDID Write (HDMI 256Byte)
• Connect HDMI Signal Cable to HDMI Jack.
• Write EDID Data to EEPROM(24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
4.4. EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
Cool 13,000KX=0.269(±0.002)
Y=0.273(±0.002)<Test Signal>
Medium 9,300KX=0.285(±0.002)Inner pattern
Y=0.293(±0.002)(216gray,85IRE)
Warm6,500KX=0.313(±0.002)
Y=0.329(±0.002)
Full White Pattern
COLOR
ANALYZER
TYPE: CA-210
RS-232C Communication
CA-210
RS-232C COMMAND MINCENTERMAX
[CMD ID DATA](DEFAULT)
CoolMidWarmCoolMidWarm
R Gainjg Ja jd 00172 192 192192
G Gain jh Jbje 00172 192 192192
B Gain ji Jc jf00192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
Page 14
- 14 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.5. Auto Download
1) Press Adj. key on the Adj. Remote control.
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download if
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
* Edid data and Model option download (RS232)
- Manual Download
* Caution
1) Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
2) Never connect HDMI & D-sub Cable at the same time.
3) Use the proper cables below for EDID Writing
4) Download HDMI1, HDMI2, separately because HDMI1 is
different from HDMI2
1) FHD RGB EDID data(Check sum:ED)
2) FHD HDMI EDID data
HDMI 1 (Check sum:E2, 99)
HDMI 2 (Check sum:E2, 89)
Item
Manufacturer ID
Version
Revision
Condition
GSM
Digital : 1
Digital : 3
Data(Hex)
1E6D
01
03
D-sub to D-subDVI-D to HDMI or HDMI to HDMI
For HDMI EDIDFor Analog EDID
NOItemCMD1 CMD2 Data0
EnterDownloadAA0 0 When transfer the ‘Mode In’,
download Mode ‘Mode In’Carry the command.
EDID dataDownloadAE00 10 Automatically Download
and Model(The use of a internal pattern)
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
HDMI 3 (Check sum:B4, 45)
3) HD RGB EDID data(Check sum:CD)
4) HD HDMI EDID data
HDMI 1 (Check sum:B4, 65)
HDMI 2 (Check sum:B4, 55)
HDMI 3 (Check sum:B4, 45)
- Model List
4.5. Outgoing condition Configuration
- When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then Automatically turn off.
(Must not AC power OFF during blinking)
4.6. Hi-pot Test
Confirm whether is normal or not when between power
board’s ac block and GND is impacted on 1.5 kV/min at
100mA(GND) and 3kV/min at 100mA(Signal)
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 16 -
300
200
LV1
400
540
530
521
900
910
800
710
120
511
510
A2
A21
A10
310
320
A5
* Set + Stand
* Stand Base + Body
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Page 17
/PF_WP
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
NAND FLASH MEMORY
/F_RB
/PF_OE
/PF_CE0
+3.3V_Normal
OPT
R104
B
3.3K
R102
NAND_FLASH_1G_HYNIX
EAN35669102
IC102-*1
H27U1G8F2BTR-BC
1
2
3
4
5
6
R/B
7
RE
8
CE
9
10
11
12
13
14
15
CLE
16
ALE
17
WE
18
WP
19
20
21
22
23
24
10K
C
Q101
KRC103S
E
/PF_CE1
PF_ALE
/PF_WE
OPT
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
R105
1K
OPT
NC_29
NC_28
NC_27
NC_26
I/O7
I/O6
I/O5
I/O4
NC_25
NC_24
NC_23
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
R106
IC102
NC_1
1
NAND_FLASH_1G_NUMONYX
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
RB
7
R
8
E
9
NC_7
10
NC_8
11
12
13
NC_9
14
15
CL
16
AL
17
W
18
WP
19
20
21
22
23
24
NAND_FLASH_1G_SS
EAN61857001
IC102-*2
K9F1G08U0D-SCB0
NAND01GW3B2CN6E
EAN60762401
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NC_29
NC_28
NC_27
NC_26
I/O7
I/O6
I/O5
I/O4
NC_25
NC_24
NC_23
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
+3.3V_Normal
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VDD_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
RY/BY
RE
CE
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
CLE
ALE
WE
WP
NC_11
NC_12
NC_13
NC_14
NC_15
22
AR101
C102
10uF
C103
0.1uF
AR102
NAND_FLASH_1G_TOSHIBA
EAN61508001
IC102-*3
TC58NVG0S3ETA0BBBH
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
PCM_A[7]
PCM_A[6]
PCM_A[5]
PCM_A[4]
PCM_A[3]
PCM_A[2]
PCM_A[1]
PCM_A[0]
22
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
PCM_A[0-7]
NC_29
NC_28
NC_27
NC_26
I/O8
I/O7
I/O6
I/O5
NC_25
NC_24
NC_23
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O4
I/O3
I/O2
I/O1
NC_19
NC_18
NC_17
NC_16
DIMMING
A_DIM
PWM_DIM
I2C
<CHIP Config(LED_R/BUZZ)>
Boot from SPI CS1N(EXT_FLASH) 1’b0
Boot from SPI_CS0N(INT_FLASH) 1’b1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
20101023GP2R
USB_OCP_DIODE7
Page 20
HDMI_1
SHIELD
HDMI_1
EAG59023302
JK802
HDMI EEPROM
5V_HDMI_1
+5V_Normal
A2
A1
ENKMC2838-T112
D821
R874
10K
HDMI_1_EEPROM
R884
2.7K
5V_HDMI_2
10K
R873
HDMI_2_EEPROM
R885
2.7K
C
R888
2.7K
+5V_Normal
A2
A1
ENKMC2838-T112
D822
C
R889
2.7K
EDID_WP
DDC_SCL_1
DDC_SDA_1
EDID_WP
DDC_SCL_2
DDC_SDA_2
5V_HDMI_1
20
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
R896
1K
R804
1.8K
OPT
D802
5V_DET_HDMI_1
3.3K
R802
C802
0.1uF
16V
R805
OPT
R824
R806
10K
C
Q802
2SC3052
0
0
R830
B
10K
E
HPD1
DDC_SDA_1
DDC_SCL_1
HDMI_ARC
HDMI_CEC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
HDMI_1_RENESAS
IC801-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
HDMI_2_RENESAS
IC802-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
HDMI_1_ATMEL
AT24C02BN-SH-T
A0
1
A1
2
A2
3
GND
4
AT24C02BN-SH-T
A0
1
A1
2
A2
3
GND
4
IC801
$0.055
HDMI_2_ATMEL
IC802
$0.055
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
R876 22
R875 22
JP810
R878 22
R877 22
C806
0.1uF
0.1uF
C807
HDMI_2
SHIELD
20
HDMI_2
EAG59023302
JK801
5V_HDMI_2
R895
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
1K
R803
1.8K
5V_DET_HDMI_2
C801
0.1uF
16V
R801
3.3K
R815 0
OPT
D801
R807
10K
Q801
2SC3052
C
R828
10K
B
E
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
SIDE_HDMI
BODY_SHIELD
20
19
18
17
16
15
14
13
12
11
10
EAG62611201
HDMI_SIDE
JK803
5V_HDMI_4
R897
1K
R837
1.8K
CK+
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
5V_DET_HDMI_4
C803
0.1uF
16V
3.3K
JP805
JP806
R841
R835
OPT
D811
R808
10K
C
Q803
2SC3052
0
R862
B
10K
E
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
HDMI_SIDE_RENESAS
IC804-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
VCC
8
WP
7
SCL
6
SDA
5
For CEC
HDMI_CEC
OPT
D803
AVRL161A1R1NT
GND
HDMI_SIDE_ATMEL
AT24C02BN-SH-T
A0
1
A1
2
A2
3
GND
4
OPT
D804
IC804
$0.055
VCC
8
WP
7
SCL
6
SDA
5
OPT
68K
R854
S
R855
100
OPT
G
C809
0.1uF
JP812
R881 22
R882 22
+3.5V_ST
OPT
D
Q806
SI1012CR-T1-GE3
GND
+5V_Normal
5V_HDMI_4
A2
10K
R871
HDMI_SIDE_EEPROM
R887
R891
2.7K
2.7K
R856
10K
C805
0.1uF
16V
OPT
A1
ENKMC2838-T112
D824
C
R857
68K
OPT
EDID_WP
DDC_SCL_4
DDC_SDA_4
CEC_REMOTE_S7
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
20110324 GP3_S7LR
HDMI8
Page 21
RGB/SPDIF/PC/HP
New Item Development
EARPHONE BLOCK
HP_LOUT
002:V7
HP_ROUT
002:V7
C1118
10uF
16V
C1119
10uF
16V
C1115
1000pF
50V
OPT
C1116
1000pF
50V
OPT
R1125
1K
R1128
1K
Q1101
MMBT3904-(F)
Q1102
MMBT3904-(F)
C
B
E
C
B
E
MMBT3904-(F)
B
MMBT3904-(F)
B
E
C
E
C
Q1104
Q1103
HP_DET
+3.3V_Normal
R1130
10K
R1155
1K
HEAD_PHONE
JK3301
KJA-PH-0-0177
5GND
4L
3DETECT
1R
C
Q1105
ISA1530AC1
B
R1129
3.3K
E
+3.5V_ST
C
E
B
Q1106
2SC3052
SIDE_HP_MUTE
PC AUDIO
JK1102
PEJ027-04
E_SPRING
3
T_TERMINAL1
6A
B_TERMINAL1
7A
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
D1101
AMOTECH
5.6V
OPT
D1102
AMOTECH
5.6V
OPT
C1107
100pF
50V
C1108
100pF
50V
R1102
470K
R1103
470K
R1107
15K
R1108
15K
R1110
10K
R1111
10K
PC_R_IN
PC_L_IN
002:S12
002:S12
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF_OUT
002:T18
R1104
10K
OPT
C1109
22uF
16V
OPT
C1110
10uF
16V
OPT
+3.3V_Normal
C1131
0.1uF
16V
C1121
100pF
50V
JK1103
2F01TC1-CLM97-4F
GND
1
VCC
2
VIN
3
Fib er O pti c
4
SHI ELD
RGB PC
RGB_EEMPROM_RENESAS
R1EX24002ASAS0A
A0
A1
A2
VSS
DSUB_VSYNC
DSUB_HSYNC
DSUB_B+
DSUB_G+
DSUB_R+
IC1105-*1
1
2
3
4
D1116
5.6V
OPT
+5V_Normal
EDID_WP
RGB_DDC_SCL
RGB_DDC_SDA
+3.3V_Normal
R1146
10K
D1117
5.6V
OPT
R1147
1K
DSUB_DET
D1115
ENKMC2838-T112
A1
C
A2
RGB_EEMPROM_ATMEL
IC1105
AT24C02BN-SH-T
R1133
75
R1135
75
R1137
75
GND
C1122
68pF
50V
OPT
A0
A1
A2
VCC
8
WP
7
SCL
6
SDA
5
VCC
1
8
WP
7
2
SCL
6
3
SDA
4
5
D1109
30V
D1110
30V
D1111
30V
D1112
30V
C1127
18pF
R1139
2.2K
C1128
18pF
50V
50V
C1126
68pF
50V
OPT
D1113
30V
R1140
2.2K
RGB_EEPORM
R1141
22
D1114
5.6V
OPT
R1142
10K
C1129
0.1uF
16V
R1143
22
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RED2GREEN3BLUE4GND_15DDC_GND
RED_GND7GREEN_GND8BLUE_GND9NC10SYNC_GND
GND_212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK
JK1104
SPG09-DB-010
11
6
1
SHILED
16
RGB/SPDIF/HP9
20110324GP3_S7LR
Page 22
RS232C
C1101 0.33uF
C1102
0.1uF
C1103
0.1uF
C1104
0.1uF
C1105
0.1uF
DOUT2
RIN2
C1+
C1-
C2+
C2-
V+
V-
IC1101
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
10
5
9
4
R1123
100
+3.5V_ST
D1107
CDS3C30GTH
30V
OPT
C1106
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
D1108
CDS3C30GTH
30V
OPT
PM_RXD
PM_TXD
R1124
100
JP1111
JP1112
8
7
6
SPG09-DB-009
JK1101
3
2
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP3_S7LR
SFLASH
20110324
13
Page 25
GP4R_GLOBAL_TUNER_BLOCK
TU3702
TDTJ-S001D
DVB_1INPUT_H_LGIT
19
SHIELD
TUNER MULTI-OPTION
TU3702-*4
GP2R_AU_1INPUT_H_LGIT
19
SHIELD
TU3702-*1
TDVJ-H101F
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
TDTJ-S101D
ANT_PWR
1
NC_1
2
+B1[5V]
3
RF_AGC
4
MOPLL_AS
5
SCL
6
SDA
7
NC_2
8
SIF
9
NC_3
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
IF_AGC
16
DIF_1[N]
17
DIF_2[P]
18
TU3702-*3
UDA55AL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
GP3_ATSC_1INPUT_H_SANYO
19
SHIELD
NC_1
NC_2
+B[+5V]
NC[RF_AGC]
AS
SCL
SDA
NC(IF_TP)
SIF
NC_3
VIDEO
GND
+1.2V
+3.3V
RESET
IF_AGC_CNTL
DIF_1
DIF_2
RF_S/W_CTL
1
BST_CTL
2
+B1[5V]
3
NC_1[RF_AGC]
4
NC_2
5
SCLT
6
SDAT
7
NC_3
8
SIF
9
NC_4
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
NTSC_2INPUT_H_LGIT
RESET
15
IF/AGC
16
DIF_1[N]
17
DIF_2[P]
18
19
SHIELD
TU3702-*2
TDTR-T036F
GP3_ATSC_1INPUT_H_LGIT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TU3701
TDFR-C036D
CN_2INPUT_H_LG3911
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC[IF_TP]
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
31
SHIELD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
close to TUNER
RF_S/W_CNTL
BST_CNTL
+B1[+5V]
NC[RF_AGC]
NC_1
SCLT
SDAT
NC_2
SIF
NC_3
VIDEO
GND
+B2[1.2V]
+B3[3.3V]
RESET
NC_4
SCL
SDA
ERR
R3702 100
R3701 100
FULL_NIM
SYNC
VALID
MCL
D0
D1
D2
D3
D4
D5
D6
D7
R3705 0
C3701
RF_SW_OPT
0.1uF
16V
R3707 0
OPT
C3706
0.1uF
16V
C3702
0.1uF 16V
C3737
C3738
0.1uF
100pF
16V
50V
FULL_NIM
close to IF line
close to TUNER
+1.2V/+1.8V_TU
FULL_NIM
C3705
100uF
16V
+5V_TU
C3704
C3703
0.1uF
100pF
16V
50V
close to the tuner pin, add,09029
CN
C3739
10uF
6.3V
HALF_NIM
R3760 0
R3761 0
HALF_NIM
Close to the tuner
RF_SWITCH_CTL
Pull-up can’t be applied
because of MODEL_OPT_2
C3728
0.1uF
16V
OPT
2SC3052
+3.3V_TU
C3708
C3707
0.1uF
100pF
16V
50V
FULL_NIM_CHINA
FULL_NIM_CHINA
Close to the CI Slot
FULL_NIM_BR
Q3704
OPT
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
+5V_TU
L3701
BOOSTER_OPT
BLM18PG121SN1D
BOOSTER_OPT
R3734
0
Q3701
BOOSTER_OPT
ISA1530AC1
E
C
C3709
0.01uF
25V
GPIO must be added.
C3731
10uF
10V
OPT
C
B
E
OPTION : RF AGC
R3754
10K
OPT
R3732
100
FE_AGC_SPEED_CTL
IF_AGC_SEL
TU_I2C_NON_FILTER
+3.3V_TU
R3733
100K
C3710
0.1uF
16V
TU_I2C_NON_FILTER
TUNER_RESET
C3711
18pF
50V
TU_IIC_NON_ATSC_SANYO
33
TU_I2C_NON_FILTER
33
TU_I2C_NON_FILTER
C3713
18pF
50V
TU_I2C_FILTER
C3711-*1
20pF
50V
TU_I2C_FILTER
TU_I2C_FILTER
R3735-*1
MLG1005SR27JT
R3704 100
C3716
0.1uF
16V
HALF_NIM
should be guarded by ground
BOOSTER_OPT
R3740-*1
1K
TU_IIC_ATSC_SANYO
R3735
R3736
C3742
20pF
50V
C3713-*1
20pF
50V
TU_I2C_FILTER
TU_I2C_FILTER
R3736-*1
MLG1005SR27JT
IF_AGC_MAIN
C3712
22pF
50V
FULL_NIM
+3.3V_TU
R3740
1.2K
C3743
20pF
50V
TU_I2C_FILTER
C3714
22pF
50V
B
BOOSTER_OPT
TU_IIC_ATSC_SANYO
R3741
1.2K
R3742
4.7K
FULL_NIM
FULL_NIM
R3737
2.2K
TU_IIC_NON_ATSC_SANYO
Q3702
2SC3052
R3741-*1
1K
TU_SCL
TU_SDA
+3.3V_TU
R3744
4.7K
BOOSTER_OPT
C
E
BOOSTER_OPT
FULL_NIM
R3743
10K
IF_N_MSTAR
IF_P_MSTAR
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
CN_2INPUT_H_ALTO
TU3701-*4
TDFR-C236D
RF_S/W_CNTL
1
BST_CNTL
2
+B1[+5V]
3
NC[RF_AGC]
4
NC_1
5
SCLT
6
SDAT
7
NC_2
8
SIF
9
NC_3
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_4
16
SCL
17
SDA
18
ERR
19
SYNC
20
VALID
21
MCL
22
D0
23
D1
24
D2
25
D3
26
D4
27
D5
28
D6
29
D7
30
31
SHIELD
R3721
R3722
R3723
R3706
R3724
R3730
R3731
R3725
R3727
R3728
R3729
R3726
0
0
0
0
0
0
0
0
0
0
0
FE_TS_SYNC
FE_TS_VAL_ERR
FE_TS_CLK
FE_TS_DATA[0]
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
0
FE_TS_DATA[0-7]
FULL_NIM_BR
TU3701-*2
TDFR-B036F
RF_S/W_CNTL
1
BST_CNTL
2
+B1[5V]
3
NC_1[RF_AGC]
4
NC_2
5
SCLT
6
SDAT
7
NC_3
8
SIF
9
NC_4
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_5
16
SCL
17
SDA
18
ERR
19
SYNC
20
VALID
21
MCL
22
D0
23
D1
24
D2
25
D3
26
D4
27
D5
28
D6
29
D7
30
31
SHIELD
BOOSTER : CHINA OPT
BOOSTER_OPT
R3745
10K
B
NON_BUFFER
R37730
R3749 0
DEMOD_SCL
DEMOD_SDA
200mA
FE_BOOSTER_CTL
LNA2_CTL
The pull-up/down of LNA2_CTL
is depended on MODLE_OPT_1.
GPIO must be added for FE_BOOSTER_CTL
+3.3V_TU
+3.3V_BUFFER
R3774
0
R3751
R3752
220
220
E
BUFFER
B
Q3703
ISA1530AC1
C
BUFFER
R3750
OPT
BUFFER
1K
+3.3V_TU
HALF_NIM_1.2V_DIODES
Please, check Multi Item! 10/12
C3717
0.1uF
16V
+5V_Normal
L3704
FULL_NIM_BCD
+5V_TU
Size change,0929
L3702
MLB-201209-0120P-N2
+5V_TUNER
C3719
C3724
22uF
0.1uF
16V
10V
+5V_TUNER
+5V_TUNER
+5V_TU
+5V_BUFFER
R3775
0
BUFFER
IC3703-*2
AZ1117BH-1.8TRE1
IN
3
HALF_NIM_1.8V
IC3703-*1
AP1117EG-13
ADJ/GND
R3771 10K
FULL_NIM_BCD
R3770 10K
FULL_NIM_SEMTEK
R3769 10K
FULL_NIM_BCD
2
1
ADJ/GND
OUTIN
+5V_TUNER
C3722
22uF
16V
+5V_TUNER
NON_BUFFER
R3772 0
R3753
4.7K
TU_CVBS
OUT
HALF_NIM_1.2V_BCD
AZ1117BH-ADJTRE1
INPUT
IC3701
AP2132MP-2.5TRG1
PG
1
FULL_NIM_BCD
EN
2
VIN
3
VCTRL
4
IC3701-*1
SC4215ISTRT
NC_1
1
FULL_NIM_SEMTEK
EN
2
VIN
3
NC_2
4
C3726
0.1uF
16V
+5V_TUNER
+3.3V_TU
+3.3V_BUFFER
R3776
R3755
470
B
BUFFER
IC3703
3
1
2
HALF_NIM_1.2V
OUTPUT
9
THERMAL
60mA
0
ADJ/GND
8
7
6
5
8
7
6
5
+5V_TU
+5V_BUFFER
R3777
0
BUFFER
R3758
82
E
BUFFER
ISA1530AC1
Q3705
C
DEMOD_RESET
This was being applied to the only china demod,
so this has to be deleted in both main and ISDB sheet.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP3_S7LR
NTP7400
20110324
16
Page 27
Rear AV
JK1604
PPJ233-01
REAR_AV
FIX-TER
PPJ-230-01
JK1601
COMPONENT1
11
5C
4C
3C
4B
3A
4A
5A
10
9
8
7
6
5
4
13
[GN]GND
[GN]G
[GN]C_DET
[BL]B
[RD]R
[WH]L_IN
[RD]R_IN
[RD]MONO
[RD]E-LUG
[RD]O-SPRING
[RD]CONTACT
[WH]C-LUG
[YL]CONTACT
[YL]O-SPRING
[YL]E-LUG
L-MONO
0
R4223
COMPONENT1
EU_OPT
22
21
20
19
18
17
16
15
14
13
12
11
10
PSC008-01
JK1602
AV_DET
COM_GND
SYNC_IN
SYNC_OUT
SYNC_GND2
SYNC_GND1
RGB_IO
R_OUT
RGB_GND
R_GND
D2B_OUT
G_OUT
D2B_IN
G_GND
9
ID
8
B_OUT
7
AUDIO_L_IN
6
B_GND
5
AUDIO_GND
4
AUDIO_L_OUT
3
AUDIO_R_IN
2
AUDIO_R_OUT
1
R4221
0
EU_OPT
REAR_AV
D1619
30V
R1654
75
REAR_AV
REAR_AV
D1626
5.6V
C1643
47pF
50V
REAR_AV
D1625
5.6V
REAR_AV
R1672
470K
REAR_AV
D1624
5.6V
OPT
R1671
470K
REAR_AV
D1602
30V
OPT
D1603
30V
OPT
D1604
30V
D1605
30V
D1606
30V
D1607
5.6V
NON_EU
D1609
5.6V
NON_EU
C1648
220pF
50V
OPT
+3.3V_Normal
C1646
0.1uF
16V
REAR_AV
L1609
120-ohm
REAR_AV
L1610
120-ohm
REAR_AV
D1610
30V
OPT
R1660
10K
REAR_AV
R1604
75
R1607
470K
R1608
75
R1605
75
R1606
470K
R1666
1K
REAR_AV
C1663
330pF
50V
REAR_AV
C1662
330pF
50V
REAR_AV
AV_CVBS_IN
REAR_AV
R1685
10K
R1689
REAR_AV
R1684
10K
D1611
5.6V
OPT
EU_OPT
R1609
75
12K
REAR_AV
R1688
12K
REAR_AV
AV_CVBS_DET
AV_R_IN
AV_L_IN
EU_OPT
C1604
47pF
50V
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
Full Scart/ Comp1
D1608
5.6V
OPT
D1601
5.6V
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP3_S7LR
PCMCI
20110324
20
Page 29
SMD GASKET
GAS 1
MDL 6193 000 1
6.5T_GAS1
GAS 2
MDL 6193 000 1
6.5T_GAS2
GAS 3
MDL 6193 000 1
6.5T_GAS3
GAS 4
MDL 6193 000 1
6.5T_GAS4
GAS 5
MDL 6193 000 1
6.5T_GAS5
GAS 6
MDL 6193 000 1
6.5T_GAS6
GAS 7
MDL 6193 000 1
6.5T_GAS7
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP3_S7LR
SMD_GAS
20110324
20
Page 30
NON_Adapter
SMAW200-12
Adapter
JPD003N-M432-4F
Adapter
P7501
SM14B-SRSS-TB
15
POWER_ON/OFF_1
+12V/+15V
P7500
JK7500
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
1
2
3
4
5
6
7
8
9
10
11
12
24V
24V
24V
24V
24V
GND
GND
GND
GND
GND
ERROR_OUT
INV_ON
NC
PWM_DIM
+15V
+15V
GND
GND
+3.5V_ST
+3.5V_ST
GND
OLP
INV_ON
P_DIM
A_DIM
NC
R7580
+3.5V_ST
C435
MLB-201209-0120P-N2
L7504-*1
CIS21J121
+2.5V_Normal
OLP
10K
R7513
R7512
22
OLP
R7505
A_DIM
4.7K
C7506
1uF
6.3V
OPT
24V
SW
GND
+24V_LED_driver
C7927
0.1uF
50V
C7502
0.1uF
50V
C7928
0.01uF
50V
OLP
C7507
1uF
6.3V
OPT
PWM_PULL_DOWN
L7503-*1
CIS21J121
MLB-201209-0120P-N2
C7509
0.1uF
16V
OPT
C7507-*1
3.9K
MLB-201209-0120P-N2
NON_Adapter
L7502-*1
CIS21J121
L7502
NON_Adapter
PWM_DIM
Adapter
L7503
NON_Adapter
C7511
0.1uF
16V
L7504
+3.3V_Normal
C
R7511
6.8K
OPT
E
+3.5V_ST
RL_ON
+3.5V_ST
R7504
10K
OPT
R7509
10K
R7506
10K
R7508
0
OPT
R7588
0
ERROR_OUT
100
+3.3V_Normal
0.1uF
16V
R434
10K
R443
10K
Q403
RSR025P03
S
D
G
OPT
C423
R438
4.7uF
22K
16V
C424
R445
2.2K
C
B
Q400
2SC3052
E
1uF
25V
OPT
L403
BLM18PG121SN1D
C425
0.1uF
16V
780 mA
+24V/+15V
Adapter
L7912
MLB-201209-0120P-N2
C7517
C7514
68uF
0.1uF
35V
50V
+3.5V_ST
C7515
68uF
35V
NON_Adapter
3.3K -> 1K (threshold voltage up)
R7514
1K
R7515
10K
B
Q7502
2SC3052
RT1P141C-T112
Q7508
1
2
R7507
4.7K
C
Q7507
B
2SC3052
E
+3.3V_Normal
R446
C445
10K
0.1uF
16V
OPT
+3.5V_ST
R7516
10K
3
OPT
10K
C437
22uF
16V
R7517
OPT
L7912-*1
CIS21J121
INV_CTL
RL_ON_BUFFER
+5V_USB
L401
C405
10uF
25V
R416
56K
1%
R1
C489
100pF
R2
R607
11K
R423
R410
10K
1%
12K
1%
C494
C493
1uF
3300pF
10V
50V
Vout=(1+R1/R2)*0.765=5.03V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TPS54327DDAR
EN
VFB
VREG5
SS
IC401
1
2
3
3A
4
9
THERMAL
8
7
6
5
[EP]GND
VIN
VBST
SW
GND
C413
0.1uF
L406
3.6uH
NR8040T3R6N
2000 mA
C420
22uF
16V
C492
22uF
16V
OPT
+5V_USB
BLM18PG121SN1D
+5V_Normal
L425
NON_5V_PANEL
+24V_LED
+5V_Normal
5V_PANEL
L7505
4A -> 3A modify 090916
PANEL_CTL
+3.3V_Normal
R7524
10K
+3.5V_ST
C461
10uF
10V
+2.5V/+1.8V
TJ3940S-2.5V-3L
C432
0.1uF
16V
300 mA
+3.5V_ST
L413
C430
10uF
10V
Vout=0.827*(1+R1/R2)=1.225V
+12V/+15V
12V_PANEL
L7517
R7522
10K
R7521
47K
OPT
L420
BLM18PG121SN1D
+3.3V_Normal
POWER_ON/OFF_1
RL_ON_BUFFER
IC402
VOUTVIN
Vd=550mV
GND
+3.3V_Normal
C431
0.1uF
16V
0.015uF
B
C7504
0.015uF
50V
R7523
22K
OPT
C
Q7503
2SC3052
E
C7525
0.01uF
0.01uF
OPT
25V
5V_PANEL
R7530-*1
22K
5V_PANEL
R7531-*1
2.7K
R7527
22K
C7526
0.1uF
16V
B
OPT
10uF
16V
OPT
R7530
33K
12V_PANEL
R7531
5.6K
12V_PANEL
C
Q7505
2SC3052
E
C7531
10uF
25V
Q7506
AO3407A
C7529
+1.5V_DDR
VCC
C475
IN
PG
EN
IC407
1
2
THERMAL
3
1.5A‘
4
[EP]
OUT
8
FB
9
7
SS
6
GND
5
C467
560pF
50V
AP7173-SPG-13 HF(DIODES)
R433
10K
16V
0.1uF
Vout=0.8*(1+R1/R2)=1.5319
AMP_VCC Control
+24V/+15V
10K
R473
AO3407A Vgs : 10.8V(24V input)
C7501
0.1uF
50V
R7502
OPT
1
AO3407A Vgs : 8.3V(15V input)
C7503
2.2uF
50V
R7500
R7501
10K
27K
Adapter
B
R7832
10K
NON_Adapter
+2.5V_Normal
C403
C440
10uF
0.1uF
10V
16V
R7503
22K
G
Q7501
AO3407A
C
MMBT3904(NXP)
Q7500
C7505
E
0.01uF
50V
S
Adapter
CPI2520NHL3R3ME
D
BLM18PG121SN1D
NON_Adapter
+24V_LED
RL_ON_BUFFER
L7913
3.3uH
L7914
1608
2A
LED Driver Power
C7924
0.1uF
50V
Adapter
R7860
10K
Adapter
S7LR core 1.2V volt
10K
C447
R428
0.1uF
16V
C441
0.1uF
7
BOOT14PWRGD
13
12
11
10
9
8
RT/CLK
$ 0.165
PH_3
PH_2
PH_1
SS/TR
R436
15K
16V
R432
C488
3300pF
50V
330K1/16W5%
3300pF
C448
50V
L415
3.6uH
NR8040T3R6N
C453
22uF
10V
10V
C456
22uF
VIN_1
VIN_2
GND_1
GND_2
EP[GND]
VIN_3
1
THERMAL
2
3
TPS54319TRE
4
5
AGND
17
IC403
VSENSE
4A
15EN16
6
COMP
PANEL_POWER
PANEL_DISCHARGE_RES
New item
D
S
G
C7541
0.1uF
50V
OPT
R457
4.3K
1/16W
R1
1%
1%
R45 6
4.7 K
1/1 6W
R2
AMP_VCC
+12V/+15V
+24V
R7572
2520
0
NON_Adapter
C7932
C7933
3.3uF
0.01uF
50V
50V
C7925
R7862
22K
2.2uF
Adapter
50V
R1
R2
Adapter
R7861
27K
Adapter
B
G
Q7521
Adapter
AO3407A
C
MMBT3904(NXP)
Q7520
Adapter
E
5%
0
R608
1/16W
1%
27K
R44 2
1/1 6W
1%
56K
R44 1
1/1 6W
S
D
Adapter
C7926
0.01uF
+1.10V_VDDC
50V
100pF
C439
C7547
0.1uF
16V
R7863-*1
R7864-*1
3K
3K
PANEL_DISCHARGE_RES
OPT
R7863
2.2K
R7864
2.2K
Max 1000mA
+1.5V_DDR
C472
C476
22uF
0.1uF
16V
10V
+24V_LED_driver
AO3407A Vgs : 10.8V
50V
C444
0.1uF
16V
OPT
R400
0
PANEL_VCC
OPT
FB_CORE
+24V/+15V
1%
1608
R7547
15K
24V-->3.48V
15V-->3.56V
ST_3.5V-->3.5V --> 3.375V
C7958
0.1uF
16V
1608
1608
R7548
2.7K
Power_DET
C7959
0.1uF
16V
LIPS
SW
BST
Adapter
R7865
0
Adapter
Q7504
1
2
3
G
4
MBRA340T3G
Adapter
Adapter
R7525
68K
Adapter
5V_PANEL
C7922
0.1uF
16V
VCC
D_4
8
D_3
7
D_2
6
D_1
5
D7500
C7524
220pF
50V
1/16W
5%
AOZ1072AI-3
PGND
VIN
AGND
FB
BG
1
2
3
4
5%
1/16W
Adapter
Adapter
R7519
C7519
1uF
25V
close to IC7502
18K
R7570
Adapter
C7522
1uF
50V
SI4124DY-T1-GE3(VISHAY)
S_1
S_2
S_3
close to pin
Adapter
22
+5V_Normal(only for 5V PANEL)
+12V/+15V
5V_PANEL
5V_PANEL
C7550
C7552
10uF
10uF
25V
25V
3.9K
1%
Adapter
R7547-*1
1608
1.21K1%LIPS
1%
Adapter
R7548-*1
+3.5V_ST
5%
0
1608
LIPS
R7583
1/10W
1%
27K
OPT
R7584
1/16W
IC7502
MP8670DN-LF-Z
1
Adapter
2
$0.37
3
4
Adapter
L7508
4.7uH
SP-7850_4.7
Adapter
R7529
100K
Adapter
C7527
50V
IC7503
MP4460DQ-LF-Z
SW_1
1
SW_2
2
THERMAL
EN
3
Adapter
COMP
4
$0.21
FB
5
Adapter
L7509
3.6uH
NR8040T3R6N
5V_PANEL
IC7507
2A
$0.148
LIPS
IN
8
EN/SYNC
7
FB
6
R2
GND
5
0.1uF
EP_GND
BST
10
VIN_2
11
9
VIN_1
8
FREQ
7
GND
6
LX_2
8
LX_1
7
5V_PANEL
EN
6
R7560
COMP
5V_PANEL
5
12K
R7559
Vout=0.8*(1+R1/R2)
+5V_TUNER(only for 5V Tuner)
+12V/+15V
+5V_TUNER
L7861
+5V_TUNER
C7861
10uF
25V
+5V_TUNER
C7862
10uF
25V
+5V_TUNER
C7921
0.1uF
16V
PGND
VIN
AGND
IC7861
AOZ1072AI-3
1
+5V_TUNER
2
2A
3
FB
4
LX_2
8
LX_1
7
+5V_TUNER
EN
6
R7867
10K
COMP
+5V_TUNER
5
12K
R7866
Vout=(1+R1/R2)*0.8
+5V_TUNER
IC7952
AP1117EG-13
2 OUT3IN
1
ADJ/GND
LDO for Tuner
+5V
+5V_TUNER
C7962
0.1uF
16V
S7LR Small
POWER
NCP803SN293
VCC
3
GND
NCP803SN293
VCC
3
Adapter
Adapter
C7536
C7533
3.3uF
0.1uF
50V
50V
R1
1%
6.8K
1%
1.6K
1/8W
Placed on SMD-TOP
Adapter
Adapter
C7532
10uF
25V
22
R7571
Adapter
R7537
100K
1/8W
5%
Adapter
C7538
10uF
10V
5V_PANEL
L7514
3.6uH
NR8040T3R6N
5V_PANEL
10K
2200pF
C7560
+5V_TUNER
L7862
3.6uH
NR8040T3R6N
+5V_TUNER
2200pF
C7863
R7957
R7956
330
1/10W
110
1/10W
+5V_TUNER
+5V_TUNER
R7561
100K
IC7509
1
IC7512
GND
+24V/+15V
R7538
Adapter
R7581
Adapter
C7537
10uF
25V
R7585
100K
1
Adapter
C7540
3.3uF
50V
RESET
2
PWR_DET_ON_SEMI
LIPS
RESET
2
LIPS_PWR_DET_ON_SEMI
Adapter
R7540
120K
1%
22K
OPT
+3.5V_ST
1%
R7569
R7582
100
LIPS
1%
R7586
100
24V->15V
+12V/+15V
090916
RL_ON_BUFFER
R7542
Adapter
C7545
0.1uF
50V
10K
24V->3.5V
Switching noise reducing [MPS recommend]
Adapter
Adapter
R1
5V_PANEL
+5V_TUNER
R465
24K
51K
R466
+5V_TUNER
R7870
10K
C7571
10uF
10V
1%
R1
1%
1%
R2
C7542
3.3uF
50V
5V_PANEL
1%
R7565
51K
1%
1.5K
R7566
5V_PANEL
1%
R7567
10K
Max 1A
6.8V
C7864
100pF
50V
+5V_TUNER
+5V_TUNER
1%
Adapter
Adapter
C7543
0.1uF
50V
5V_PANEL
R2
OPT
1
R7958
+5V_TUNER
C7960
0.1uF
16V
+24V/+15V
Adapter
C7544
0.1uF
50V
Adapter
R7544
100K
1/10W
1%
30K
R7543
1/10W
5V_PANEL
+5V_TUNER
C7865
22uF
16V
+5V_TUNER
+5V_TUNER
C7961
22uF
16V
C7566
22uF
16V
5V_PANEL
+5V_TUNER
C7565
100pF
50V
2011.03.02.
22
OPT
POWER_DET
C7957
0.1uF
16V
OPT
real output : 12.3V
+3.5V_ST
+5V_Normal
BLM18PG121SN1D
L424
5V_PANEL
5V_PANEL
C7570
C7578
0.1uF
0.1uF
16V
16V
+5V
+5V_TUNER
C7867
C7866
0.1uF
0.1uF
16V
16V
Page 31
CONTROL
IR & LED
+3.5V_ST
19-22_LAMP
D2401
5.6V
AMOTECH
P7600
12507WR-03L
1
2
3
4
AMOTECH
C2404
1000pF
50V
+3.3V_Normal
C906
18pF
50V
OPT
C907
18pF
50V
OPT
D2402
5.6V
LED_B/LG_LOGO
L2404
BLM18PG121SN1D
NEW_SUB
D902
CDS3C05HDMI1
5.6V
NEW_SUB
D903
CDS3C05HDMI1
5.6V
C2405
0.1uF
EYEQ/TOUCH_KEY
R2411
LED_R/BUZZ
50V
100
EYEQ/TOUCH_KEY
100
R2412
R2413 1.5K
C2407
100pF
50V
SENSOR_SCL
SENSOR_SDA
C2406
1000pF
16V
C2408
18pF
50V
OPT
C2409
18pF
50V
OPT
C2410
0.1uF
D2405
5.6V
R2414
1.5K
OPT
16V
EYEQ/TOUCH_KEY
5.6V
D2403
EYEQ/TOUCH_KEY
5.6V
D2404
JP2407
JP2408
OPT
R2416
10K
JP2409
JP2410
JP2411
OLD_SUB
P2401
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
NEW_SUB
P2402
12507WR-15L
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
R2405
R2404
10K
10K
1%
1%
R2401
100
KEY1
R2402
100
KEY2
+3.5V_ST
R2425
Q2406
2SC3052
47K
OPT
C
B
E
OPT
R2427
0
R2430
10K
OPT
R2429
Q2405
2SC3052
R2428
IR
22
BLM18PG121SN1D
L2402
BLM18PG121SN1D
+3.5V_ST
47K
OPT
C
B
E
OPT
19-22_LAMP
L7600
BLM18PG121SN1D
L7601
BLM18PG121SN1D
19-22_LAMP
L2401
R2431
47K
OPT
R2426
+3.5V_ST
47K
C7600
0.1uF
16V
19-22_LAMP
C7601
0.1uF
16V
19-22_LAMP
5.6V
D7600
19-22_LAMP
S/T_SCL
S/T_SDA
D7601
5.6V
19-22_LAMP
+3.5V_ST
C2401
0.1uF
C2402
0.1uF
L2403
BLM18PG121SN1D
C2403
0.1uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
S7LR.Small2011.03.02.
6IR/CONTROL
Page 32
[51Pin LVDS Connector]
(For FHD 60/120Hz)
P703
FI-RE51S-HF-J-R1500
WAFER_FHD
52
PANEL_VCC
L702
120-ohm
WAFER_FHD
C709
1000pF
50V
OPT
RXA4-
RXA4+
RXA3-
RXA3+
BIT_SEL
C710
0.1uF
16V
WAFER_FHD
R709
10K
BIT_SEL_LOW
LVDS_SEL
+3.3V_Normal
R705
3.3K
OPT
R710
10K
OPT
C700
10uF
16V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
OPT
RXACK-
RXACK+
RXA2-
RXA2+
RXA1-
RXA1+
RXA0-
RXA0+
RXB4-
RXB4+
RXB3-
RXB3+
RXBCK-
RXBCK+
RXB2-
RXB2+
RXB1-
RXB1+
RXB0-
RXB0+
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
P7901
FF10001-30
HD_60Hz_NORMAL
1
R7915 0
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
R7914 0
23
HD_60Hz_NORMAL
24
25
26
27
28
29
30
31
SMALL_NC1
SMALL_NC2
SMALL_OPC_OUT
OPT
RXA3-
RXA3+
RXACK-
RXACK+
RXA2-
RXA2+
RXA1-
RXA1+
+3.3V_Normal
RXA0-
RXA0+
SMALL_OPC_EN
SMALL_NC3
SMALL_NC4
R7919
3.3K
R7920
10K
OPT
OPT
C7905
10uF
16V
OPT
PANEL_VCC
HD_60Hz_NORMAL
C7904
1000pF
50V
OPT
L7901
120-ohm
HD_60Hz_NORMAL
C7903
0.1uF
16V
[30Pin LVDS Connector]
(For HD 60Hz_Small)
P7902
FF10001-30
HD_60Hz_SMALL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
C7908
10uF
16V
OPT
C7907
1000pF
50V
OPT
SMALL_NC1
SMALL_NC2
SMALL_OPC_OUT
RXA3-
RXA3+
RXACK-
RXACK+
RXA2-
RXA2+
RXA1-
RXA1+
RXA0-
RXA0+
SMALL_OPC_EN
SMALL_NC3
SMALL_NC4
PANEL_VCC
L7902
120-ohm
HD_60Hz_SMALL
HD_60Hz_SMALL
C7906
0.1uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
S7LR.Small2011.03.02.
LVDS.Small24
Page 33
PPJ235-01
JK9903
SIDE_AV_3HOLE
5A
[YL]E-LUG
4A
[YL]O-SPRING
3A
[YL]CONTACT
4B
[WH]O-SPRING
3C
[RD]CONTACT
4C
[RD]O-SPRING
5C
[RD]E-LUG
SIDE CVBS PHONE JACK
(New Item Development)
JK9901
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
SIDE_AV_GENDER
SIDE_CVBS
D9901
OPT
D9902
SIDE_CVBS
D9903
5.6V
SIDE_CVBS
D9904
30V
5.6V
5.6V
ADUC30S03010L_AMODIODE
ADMC5M03200L_AMODIODE
ADMC5M03200L_AMODIODE
ADMC5M03200L_AMODIODE
SIDE_CVBS
R9907
75
SIDE_CVBS
SIDE_CVBS
SIDE_CVBS
R9906
470K
R9905
470K
BLM18PG121SN1D
+3.3V_Normal
C9901
100pF
SIDE_CVBS
L9902
BLM18PG121SN1D
SIDE_CVBS
L9901
BLM18PG121SN1D
SIDE_CVBS
L9903
SIDE_CVBS
10K
R9911
SIDE_CVBS
C9906
100pF
50V
SIDE_CVBS
C9905
100pF
50V
SIDE_CVBS
R9915
1K
SIDE_CVBS
R99 14
10K
SIDE_CVBS
R99 13
10K
C9907
100pF
OPT
SIDE_CVBS
R9917
12K
SIDE_CVBS
R9916
12K
SIDEAV_CVBS_IN
SIDEAV_DET
SIDEAV_L_IN
SIDEAV_R_IN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP3_S7LR
SIDE_JACK
20110324
18
Page 34
Page 35
Block Diagram: S7LR
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Half
Half
NIM
NIM
(CAN)
(CAN)
IF +/-
TU_CVBS
SIF
X-tal
12M
FPC(51P)
LVDS
(FHD/HD 60z)
HDMI EEPROM
AT24C02BN-SH-T
HDMI EEPROM
AT24C02BN-SH-T
HDMI(DVI)
Component
AV
RGB EEPROM
AT24C02BN-SH-T
RGB PC
PC Audio In
RS-232C
SPDIF
SPK L/R
I2C
Rear
TMDS
CVBS, Y/Pb/Pr, L/R
CVBS, L/R
I2C
RGB/H/V
MAX3232
SPDIF
A. AMP
NTP7500
L/R
RS232C
I2S
L/R
S7LR
PCM_A[0:7]
SPI
DDR2 Add.
DDR2 Data
I2C
NAND Flash
H27U1G8F2BTR-BC
SERIAL FLASH
MXIC (8M bit)
MX25L8005M2I
DDR3 256MB(1Gb)
H5TQ1G63BFR
Internal Micom
(PM)
AV gender
H/P L/R
DP/DM
H/P OUT
USB2.0
(1Gbit)
DDR3 256MB 1Gb
Hynic
HDCP EEPROM
CAT24WC08W-T
AT24C1024BN-SH-T
Hynic
H5TQ1G63BFR
1Mbit
X-tal
24.69M
FPC(30P)
LED_R/BUZZ
LED_B/LG LOGO
SOFT TOUCH
_SCL/SDA
KEY1
KEY2
CONTROL
IR & LED /
(SOFT TOUCH)
IR
TMDS
HDMI EEPROM
I2C
AT24C02BN-SH-T
HDMI
Side
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