LG 47LS55A-5DB, 47LS55A-5BB Schematic

Internal Use Only
North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com
MONITOR SIGNAGE
SERVICE MANUAL
CHASSIS :
MODEL :
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LW43A
47LS55A 47LS55A-5DB
47LS55A-5BB
MFL63725154 (1405-REV00)
Printed in KoreaP/NO :
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION ........................................................................................... 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 8
BLOCK DIAGRAM .................................................................................. 14
EXPLODED VIEW .................................................................................. 15
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
PRECAUTION
AC Volt-meter
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
zmonitor that are important for safety. These parts are marked on the schematic diagram and the Exploded View. It is essential that these critical parts
should be replaced with the manufacturer' s specified parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly or
electric shock as this will result in damage to the screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person' s body are grounded
through wrist band.
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight or inverter
circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
Good Earth Ground such as WATER PIPE,
To Instrument's exposed METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
0.15µF
1.5 Kohm/10W
CONDUIT etc.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.
Replaceable batteries
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE. DISPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS. REPLACE ONLY WITH THE SAME OR EQUIVALENT TYPE.
ADVARSEL Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af samme fabrikat og type. Levér det brugte batteri tilbage til leverandøren.
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unl ess specified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and semiconductor "chip" compon ents. The following techniques should be used to help reduce the incide nce of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter natively, obtain and wear a comme rcially availab le discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most re pla cem ent ES dev ice s are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motio ns wh en h andli ng u npack ag ed replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carp eted floor can ge ner ate st atic electricit y sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only un til the solder fl ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern si de of the circuit board. (Use this techniq ue onl y on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break an d loc ate the nearest component that is dir ect ly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.
Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
1. Application range
This specication is applied to the LW43A chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.
4) Specication and performance of each parts are followed each drawing and specication by part number in accord-
ance with BOM.
5) The receiver must be operated for about 5 minutes prior to the adjustment.
3. Test method
1) Performance: LGE Monitor test method followed.
2) Demanded other specication
- Safety : CE, IEC specication
- EMC : CE, IEC
4. General Specication
4.1. General Specication
No. Item Content Remark
1 HDMI Input (2EA) HDMI Rear / support D-TV&PC
resolution
2 DVI Input (1EA) DVI
3 DP Input/Output(2EA) DP Rear / support D-TV&PC
resolution
4 Audio Input (1EA) DVI Audio L/R Input
5 Speaker Output (1EA) Compatible with common speaker 10W*2Ch Output
6 IR&Brightness Sensor Input
(1EA)
7 Pixel Sensor Input (1EA) Pixel Sensor Optional
8 External USB (1EA) Picture, Music, Movie, SVC Device : Memory Stick, Mouse,
9 RS-232C Input/Output
(1EA)
10 LAN(1EA) RJ45, 100BASE-T Network Connection for Super-
11 Local Key 8 keys
IR&Brightness Sensor
Keyboard
Display Control
Sign Elite
4.2. DVI-D, HDMI, Display Port (PC) Specication
No. Item Specication Remarks 1 Supported Sync. Type Digital
2 Operating Frequency Digital
3 Resolution Digital
Only for training and service purposes
Horizontal 30 ~ 83 kHz Vertical 56 ~ 60 Hz Max 1920×1080 @ 60Hz Recommend 1920×1080 @ 60Hz
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Signal Timing (Supporting Resolution)
5.1. DVI, HDMI, Display Port (PC Mode )
No. Section Pol. Dot Clock
[MHz]
1 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
V(Lines) - 59.94 525 480 10 2 33
2 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
V(Lines) + 60.317 628 600 1 4 23
3 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
V(Lines) - 60.0 806 768 3 6 29
4 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720
V(Lines) + 59.855 748 720 3 5 20
5 H(Pixels) + 85.86 47.7 1800 1366 72 144 216 1366 x 768
V(Lines) + 60 795 768 1 3 23
6 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024
V(Lines) + 60.02 1066 1024 1 3 38
7 H(Pixels) - 146.25 65.290 2240 1680 104 176 280 1680 x 1050
V(Lines) + 59.954 1089 1050 3 6 30
8 H(Pixels) + 148.5 67.5 2200 1920 88 44 88 1920 x 1080
V(Lines) + 60 1125 1080 4 5 46
Frequency
[kHz]/[Hz]
Total
Cycle
(E)
Display
(A)
Front
Porch(B)
Sync.
(D)
Back
Porch(F)
Resolution
5.2. HDMI, DisplayPort (DTV Mode ) * DVI Input dont support DTV Mode
No.
Resolution H-freq(kHz) V-freq(Hz) Proposed
1 480/60P 31.5 60 EDTV 480p
2 576/50P 31.25 50 EDTV 576p
3 720/50P 37.5 50 HDTV 720p
4 720/60P 45 60 HDTV 720p
5 1080/50i 28.1 50 HDTV 1080i 50Hz For Australian
6 1080/60i 33.75 60 HDTV 1080i 60Hz
7 1080/50P 56.25 50 HDTV 1080P 50Hz
8 1080/60P 67.5 60 HDTV 1080P 60Hz
Specication Remark
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application Range
This spec sheet is applied all of the Digital Signage Product with LW43A chassis.
2. Specication
1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of 25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specic designation.
4) The input voltage of the receiver must keep AC 100-240 V~, 50/60 Hz.
5) At rst Worker must turn on the SET by using Power Only
key.
6) The receiver must be operated for about 5 minutes prior to the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it should be placed in the circumstance of above 15 °C for 2 hours.
In case of keeping module is in the circumstance of below -20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.
4. MAIN PCBA Adjustments
4.1. ADC Calibration [LS55A Model Digital Only Model: does not apply]
- An ADC calibration is not necessary because MAIN SoC (LGExxxx) is already calibrated from IC Maker
- If it needs to adjust manually, refer to appendix.
4.2. MAC Address
4.2.1. Equipment & Condition
1) Play le: keydownload.exe
4.2.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process : DETECT → MAC_WRITE
4) Play: START
5) Check of result: Ready, Test, OK or NG
4.2.4. Communication Port connection
1) Connect : PCBA Jig → RS-232C Port == PC → RS-232C
Port
Caution) When still image is displayed for a period of 20 min­utes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments MAC Address Download
1) ADC adjustment: Digital Only [does not apply]
2) EDID / DDC Download.
3) MAC Address Download * Remark
- Above adjustment items can be also performed in Final Assembly if needed. Adjustment items in both
PCBA and nal assembly stages can be checked by using the INSTART Menu → ADJUST CHECK.
3.2. Final Assembly adjustment
1) White Balance adjustment
2) RS-232C functionality check
3) Factory Option setting per destination
4) Shipment mode setting (IN-STOP)
5) GND and HI-POT test
3.3. Appendix.
1) Ship-out mode
2) Service Option Default
3) Tool option menu, USB Download (S/W Update, Option,
service only)
4) ISP Download (Optional)
4.2.5. Download
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.3. LAN Inspection
4.3.1. Equipment & Condition
▪ Each other connection to LAN Port of IP Hub and Jig
4.5 Serial number download
Connect Bar Code scan equipment and set by RS-232C cable.
1) E2PROM Data Write
4.3.2. LAN inspection solution
1) LAN Port connection with PCB
2) Network setting at MENU Mode of SET (Installer Menu →
119 → 253 → Menu)
3) Setting automatic IP
4) Setting state conrmation
→ If automatic setting is nished, you conrm IP and MAC
Address.
4.4. LAN PORT INSPECTION(PING TEST)
4.4.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
4.4.2. LAN PORT inspection(PING TEST)
1) Play the LAN Port Test Program.
2) Connect each other LAN Port Jack.
3) Play Test (F9) button and conrm OK Message.
4) Remove LAN cable.
2) E2PROM Data Read
4.6 EDID/DDC Download (EDID PCM)
4.6.1 Overview
It is a VESA regulation. A PC or a MNT will display an optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.
4.6.2 Equipment
1) Since EDID data is embedded, EDID download JIG, HDMI cable and D-sub are not need.
2) Adjust by using remote controller.
4.6.3 Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L (PCM) menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is failure, NG is displayed.
5) If Download is failure, Re-try downloads.
→ Caution) When EDID Download, must remove HDMI / D-
sub Cable.
Only for training and service purposes
4.6.4. EDID DATA
1) DVI (Check Sum : 0x3C)
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
2) HDMI 1 (Check Sum : 0x3E, 0xA2)
Color Analyzer
Computer
Pattern Generator
If Signage internal pattern is us ed, not needed
Signal Source
Probe
RS-232C
RS-232C
RS-232C
3) HDMI 2 (Check Sum : 0x3E, 0x92)
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
1) Objective: To reduce each Panel's W/B deviation
2) How-it-works : When R/G/B gain in the OSD is at 192, it means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of
R/G/B is xed at 192, and the other two is lowered to nd
the desired value.
3) Adjustment condition : normal temperature
- Surrounding Temperature : 25 °C ± 5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity : 20 % ~ 80 %
- Before White balance adjustment, Keep power on
status, don’t power off
5.1.1.2. Adj. condition and cautionary items
1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
2) Probe location: Color Analyzer (CA-210) probe should be within 10cm and perpendicular of the module surface (80°~ 100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked us-
ing no signal or Full-white pattern.
4) DP (Check Sum : 0x3C, 0xA2)
5.1.2. Equipment
1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED: CH14)
2) Adj. Computer(During auto adj., RS-232C protocol is needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/204­Gray(Model:217, Pattern:49)
* Only when internal pattern is not available
* Color Analyzer Matrix should be calibrated using CS-1000.
5.1.3. Equipment connection MAP
Only for training and service purposes
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.1.4. Adj. Command (Protocol)
▪ RS-232C Command used during auto-adjustment.
RS-232C COMMAND
[CMD ID DATA]
wb 00 00 Begin White Balance adjustment
wb 00 ff
End White Balance adjustment (internal pattern disappears )
Ex) wb 00 00 -> Begin white balance auto-adj. wb 00 10 -> Gain adj. ja 00 ff -> Adj. data
jb 00 c0 ... ...
wb 00 1f → Gain adj. completed *(wb 00 20(Start), wb 00 2f(end)) → Off-set adj. wb 00 ff → End white balance auto-adj.
Explantion
4) Adjust Cool modes
- Fix the one of R/G/B gain to 192 (default data) and
decrease the others. ( If G gain is adjusted over 172 and R and B gain less than 192 , Adjust is O.K.)
- If G gain is less than 172, Increase G gain by up
to 172, and then increase R gain and G gain same amount of increasing G gain.
- If R gain or B gain is over 255, Readjust G gain less
than 172, Conform to R gain is 255 or B gain is 255
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of color temperature.
6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern : ON, OFF. Default is inner (ON). By selecting OFF, you can adjust using RF signal in 206 Gray pattern.
▪ Adj. Map
Cool
Medium
Warm
Adj. item
R Gain j G 00 C0
G Gain j H 00 C0
B Gain j I 00 C0
R Cut
G Cut
B Cut
R Gain j A 00 C0
G Gain j B 00 C0
B Gain j C 00 C0
R Cut
G Cut
B Cut
R Gain j D 00 C0
G Gain j E 00 C0
B Gain j F 00 C0
R Cut
G Cut
B Cut
Command
(lower caseASCII)
CMD1 CMD2 MIN MAX
Data Range
(Hex.)
Default
(Decimal)
5.1.5. Adj. method
5.1.5.1. Auto adj. method
1) Set TV in adj. mode using POWER ON key.
2) Zero calibrate probe then place it on the center of the Display.
3) Connect Cable.(RS-232C to USB)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sign), check adj. status pre mode. (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
▪ W/B Adj. must begin as start command “wb 00 00” , and n-
ish as end command “wb 00 ff”, and Adj. offset if need.
5.1.6. Reference (White balance Adj. coordinate and color temperature)
▪ Luminance : 216 Gray ▪ Standard color coordinate and temperature using CA-210 (CH14)
: [applied only LGD Module]
Mode
Cool 0.271±0.002 0.270±0.002 13,000K -0.003
Medium 0.286±0.002 0.289±0.002 9,300K 0.0000
Warm 0.313±0.002 0.329±0.002 6,500K 0.0000
▪ Standard color coordinate and temperature using CA-210(CH 14)
– by aging time
1) ROW Direct LED models (applied only LGD Module) in LGEKR (GUMI) And LGERS
Coordinate
x y
Temp ∆uv
5.1.5.2. Manual adjustment. method
1) Set TV in Adj. mode using POWER ON.
2) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10 cm of the surface.
3) Press ADJ key → EZ adjust using adj. R/C → White-Bal­ance then press the cursor to the right(key ►). When KEY (►) is pressed 204 Gray (80IRE) internal patterns will be
displayed.
Only for training and service purposes
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
2) ROW Direct LED models (applied only LGD Module) in LGEKR
(GUMI for Winter Season)
▪ Standard color coordinate and temperature using CA-
210(CH-14) – by aging time
5.3. Ship-out mode check (In-stop)
▪ After nal inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode
5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
7.3. Checkpoint
1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
2) TEST time: 1 second
3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CA­BLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEU­TRAL.
4) LEAKAGE CURRENT: At 0.5mArms
8. EYE Q Green Inspection
8.1 Method [ Brightness + IR Sensor & Pixel Sensor ]
6. Audio
6.1. Audio input condition
1) Only DVI PC Input
6.2. Specication
No. Item Min Typ Max Unit Remark
Audio practical
max Output, L/R
1.
(Distortion=10% max Output)
Speaker (8Ω
2. Impedance)
9.0 10.0 12.0 W
8.5 8.9 9.8 Vrms
10.0 14.0 W
Measurement condition EQ Off AVL Off Clear Voice Off
7. GND and HI-POT Test
7.1. GND & HI-POT auto-check preparation
1) Check the POWER CABLE and SIGNAL CABE insertion condition
7.2. GND & HI-POT auto-check
1) Pallet moves in the station. (POWER CORD / AV CORD is tightly inserted)
2) Connect the AV JACK Tester.
3) Controller (GWS103-4) on.
4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
Remove A/V CORD from A/V JACK BOX)
1) Connect the cable Assy on the set → 2) Turn on the Sig­nage SET → 3) Press “EYE Button” on the adjustment of R/C → 4) Cover the “EYE Q sensor” on the front of Cable Assy
with your hands, hold it for 3 second
5) Check the sensor data on the screen, make certain that data is below 20. If data isn’t below 20 in 3 seconds, EYE Q sensor would be bad. You should change EYE Q sensor.
6) Uncover your hands from EYE Q sensor, hold it for 3 sec-
onds →
7) Check “Back Light(xxx)” on the screen, check data in-
crease, you should change EYE Q sensor
8.2 Pixel Sensor Inspection Manual
* Pixel Sensor Kit Parts
- 47LS55A SET / Power Cord / IR+Brightness Cable Assy /
Remote Control
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* Method
Power Cord Connection
IR+Brigntness Cable Connection
Pixel Sensor Cable
Connection
1
2
3
a
c
b
1) Connect the cable Assy[Power Cord] on the set.
2) Connect the cable Assy[IR+Brightness Cable] on the set.
5) As follows: the remote control operation.
a. Press " P-ONLY " on the adjustment of R/C.
3) Connect the cable Assy[Pixel Sensor Cable] on the set.
4) Turn on the Signage SET.
b. Press " EXIT " on the adjustment of R/C.
c. Press “EYE Button” on the adjustment of R/C
- Please Check the R,G,B pattern on the Screen.
- Check the sensor data on the screen
- Please check RGB Sensor-Check On the screen.
OK : Pass . NG : Fail [Re-Run]
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* USB S/W Download(Service only)
1) Put the USB Stick to the USB socket
2) Automatically detecting update le in USB Stick
- If your downloaded program version in USB Stick is lower than that of Signage set, it didn’t work. Other­wise USB data is automatically detected.
3) Updating is staring.
4) Updating Completed, The Signage will restart automatically
5) If your Signage is turned on, check your updated version
and Tool option.(explain the Tool option, next stage)
* If downloading version is more high than your Signage
have, Signage can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number)
Only for training and service purposes
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
BLOCK DIAGRAM
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
400
810
IMPORTANT SAFETY NOTICE
LV1
A2
510
200
541
540
542
530
201
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
System Configuration
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
Clock for M14-A0
MAIN Clock(24Mhz)
50V
10pF
C101
50V
C102
System Clock for Analog block(24Mhz)
PLL SET[1:0] : internal pull up "00" : CPU(1200Mhz),M0 / M1 DDR(792,792 Mhz) "01" : CPU(1056Mhz),M0 / M1 DDR(672,672 Mhz) "10" : CPU(1056Mhz),M0 / M1 DDR(792,792 Mhz) "11" : CPU( 960Mhz),M0 / M1 DDR(792,792 Mhz)
OP MODE[1:0] "00" : Normal Mode "01/10/11" : Internal Test mode
+3.3V_NORMAL
OPT
R101 3.3K
R102 3.3K
OPT
Extenal test only
+3.3V_NORMAL
BOOT MODE "0 : EMMC "1 : TEST MODE
3.3K
R127
OPT
3.3K
R128
BOOT_MODE0
X-TAL_1
GND_1
1
2
24MHz
4
3
10pF
GND_2
X-TAL_2
Extenal test only
OPT
R103 3.3K
R104 3.3K
OPT
OPM1
OPM0
BOOT_MODE
X101
1M
R118
R8849 560
1%
PLLSET1
PLLSET0
INSTANT_MODE0
+3.3V_NORMAL
INSTANT boot MODE
3.3K "1 : Instant boot
"0 : normal
(internal pull down)
R8843
XTAL_IN
XTAL_OUT
INSTANT_BOOT
NVRAM
+3.5V_ST
OPT R110
4.7K R111
OPT
0
AT24C1024BN-SH-T
R112 OPT
NC
1
A1
2
A2
3
GND
4
R8810
IC102
NVRAM I2C SWITCH
H
CONNECTION
B0 - AL B1 - A
SCL_NVRAM
SDA_NVRAM
EEPROM_SW
NVRAM - NEC NVRAM - M14
+3.5V_ST
EEPROM_SW
PAGE 1
+3.3V_NORMAL
R123
OPT
10K
XTAL_IN
XTAL_OUT
BOOT_MODE
PLLSET0 PLLSET1
OPM0 OPM1
TRST_N1
TMS1 TCK1 TDO1 TDI1
R182 10K
OPT
10K
R183
10K
R184
R185 10K
SOC_RX
SOC_TX
I2C_SCL1 I2C_SDA1
I2C_SCL2 I2C_SDA2 I2C_SCL4 I2C_SDA4
33 33
EMMC_DATA[7] EMMC_DATA[6] EMMC_DATA[5] EMMC_DATA[4] EMMC_DATA[3] EMMC_DATA[2] EMMC_DATA[1] EMMC_DATA[0]
R109 33
AMP
R180 33 R181 33
R178 33
SOC_RESET
C108
0.1uF 16V
Write Protection
- Low : Normal Operation
+3.5V_ST
VCC
8
7
6
5
C105
WP
0.1uF 16V
SCL
SDA
- High : Write Protection
R113 33
R114 33
SCL_NVRAM
SDA_NVRAM
FORCED_JTAG_0
Sub Micom Ready
SUB1_SCL SUB1_SDA
T-CON/L-DIMMING
L/DIM0_VS
L/DIM0_SCLK
TCK0 TDI0
L/DIM0_MOSI
READY
R117 22
R116 22
READY
Temp Sensor
I2C_SCL5
NVRAM
PWM_DIM2
PWM_DIM
EMMC_CLK EMMC_CMD EMMC_RST
EMMC_DATA[0-7]
I2C_SDA5
R107 R108
C103
0.1uF 16V
C104
0.1uF 16V
SELECT
VCC
SELECT
VCC
IC103
NLASB3157DFT2G
6
ON SEMICONDUCTOR
ANALOG SWITCH 5
A
4
EAN38256201
IC104
NLASB3157DFT2G
6
ON SEMICONDUCTOR
ANALOG SWITCH 5
A
4
EAN38256201
B1
1
GND
2
B0
3
B1
1
GND
2
B0
3
R121 0
OPT
R119 0
R122 0
OPT
R115 0
I2C_SCL5
NEC_EEPROM_SCL
I2C_SDA5
NEC_EEPROM_SDA
33
R179 10K
1/16W 5%
AR101
AG21
AJ18
AG30 AG28 AG29 AH29 AJ27 AH27 AG26 AH26
AJ12 AJ13 AH12 AG12
AH23 AG22
AH11 AG11
AG10
AH22 AJ22 AH10 AJ10 AG23 AH24
B23 A23
AB8 AC8
AD8 AE8
Y7 Y6 W7 W6 W5
AH7 AJ7
AG8 AH8
AH9 AG9
AJ9
AC6 AC7 AD7 AB7
G32 G33 G31 D31 F33 F32 E32 F31 D33 D32 E31
IC101
LG1311
XIN_MAIN XO_MAIN
PORES_N
BOOT_MODE
PLLSET0 PLLSET1
OPM0 OPM1
L_VSOUT_LD/TRST0_N DIM0_SCLK/TMS0 DIM1_SCLK/TCK0 DIM1_MOSI/TDI0 DIM0_MOSI/TDO0
SPI_CS0 SPI_SCLK0 SPI_DO0 SPI_DI0/TRST1_N SPI_CS1/TMS1 SPI_SCLK1/TCK1 SPI_DO1/TDO1 SPI_DI1/TDI1
EXT_INTR0 EXT_INTR1 EXT_INTR2 EXT_INTR3
UART0_RXD UART0_TXD UART1_RXD UART1_TXD
UART1_RTS_N UART1_CTS_N
SCL0 SDA0 SCL1 SDA1 SCL2 SDA2 SCL3 SDA3 SCL4 SDA4 SCL5 SDA5
PWM0 PWM1 PWM2 PWM_IN
EMMC_CLK EMMC_CMD EMMC_RESETN EMMC_DATA7 EMMC_DATA6 EMMC_DATA5 EMMC_DATA4 EMMC_DATA3 EMMC_DATA2 EMMC_DATA1 EMMC_DATA0
USB2_0_DP0 USB2_0_DM0
USB2_0_TXRTUNE
USB2_1_DP0 USB2_1_DM0
USB2_1_TXRTUNE
USB3_DP0
USB3_DM0 USB3_TXP0 USB3_TXM0 USB3_RXP0 USB3_RXM0
USB3_RESREF0
USB3_DP1
USB3_DM1 USB3_TXP1 USB3_TXM1 USB3_RXP1 USB3_RXM1
USB3_RESREF1
HUB_PORT_OVER0 HUB_VBUS_CTRL0
EB_CS3 EB_CS2 EB_CS1 EB_CS0
EB_WE_N EB_OE_N
EB_WAIT EB_BE_N1 EB_BE_N0
CAM_CD1_N CAM_CD2_N CAM_CE1_N CAM_CE2_N
CAM_IREQ_N
CAM_RESET
CAM_INPACK_N
CAM_VCCEN_N
CAM_WAIT_N
CAM_REG_N
EB_ADDR0 EB_ADDR1 EB_ADDR2 EB_ADDR3 EB_ADDR4 EB_ADDR5 EB_ADDR6 EB_ADDR7 EB_ADDR8 EB_ADDR9
EB_ADDR10 EB_ADDR11 EB_ADDR12 EB_ADDR13 EB_ADDR14 EB_ADDR15
EB_DATA0 EB_DATA1 EB_DATA2 EB_DATA3 EB_DATA4 EB_DATA5 EB_DATA6 EB_DATA7
AN9 AM9 AN8
READY
H32 J31 H33
N31 N32 P33 P32 M32 M33 P31
K33 K32 L32 L31 K31 J32 M31
W28 W29
H28 J30 J28 J29
G30 F30 H29 G29 G28
P28 P27 U28 R29 V27 T28 T29 R28 U27 N29
K30 E30 M30 N28 M28 M29 L29 K29 K28 L28 D30 F29 C32 C33 C31 B33
B32 A32 B31 A31 A30 B30 C30 C29
R1712001%
READY
R1722001%
READY
R1732001%
R1742001%
/USB_OCD3
USB3_DP USB3_DM
USB_CTL3
USB 2.0 : 1EA
+3.3V_NORMAL
I2C
I2C PULL UP
R161
3.3K
R162
3.3K
R158
3.3K
R157
3.3K
R125
3.3K
R120
3.3K
R124
3.3K
R126
3.3K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-Peripheral
I2C_1 : AMP I2C_2 : T-CON,L/DIMING I2C_3 : Temp Sensor I2C_4 : NVRAM
I2C_SDA1 I2C_SCL1
I2C_SDA2 I2C_SCL2
I2C_SDA4 I2C_SCL4
I2C_SDA5 I2C_SCL5
LOCAL DIMMING I2C CONTROL
+3.3V_NORMAL
R105
R106
3.3K
3.3K
DEBUG
DEBUG
LED_SCL LED_SDA
P102
12507WS-04L
DEBUG
1
2
3
4
5
Jtag-0 I/F
P103
12505WS-10A00
JTAG_CPU
1
2
3
4
5
6
7
8
9
10
11
+3.3V_NORMAL
L/DIM0_VS
(TRST0_N)
TDI0
L/DIM0_MOSI
L/DIM0_SCLK
TCK0
SOC_RESET
FORCED_JTAG_0
(TDO0)
(TMS0)
LS55A
M14 Symbol A
P104
12505WS-10A00
OPT
10
11
Jtag-1 I/F
+3.3V_NORMAL
1
2
3
4
5
6
7
8
9
TRST_N1
TDI1
TDO1
TMS1
TCK1
SOC_RESET
2013.10.21 1
36
AMP_RESET_N
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
LED_SDA
INSTANT_BOOT
Near AMP 14.02.12
R233
4.7K
R8840 0
C8740 1000pF 50V
14.02.10
DVDD33
14.02.11 OPT
R8837 22
14.02.11
14.02.10
14.02.10
10K
R236
14.02.11
R232
10K
R231
10K
MODEL_OPT_11
14.02.11
INV_CTL
/RST_PHY
2D/3D_CTL
SOC_NEC_TX SOC_NEC_RX
OPC_EN
14.02.10
LED_SCL
WARM_MODE
MODEL_OPT_12
MODEL_OPT_0
PANEL_CTL
MODEL_OPT_1
10K
10K
MODEL_OPT_2 MODEL_OPT_3 MODEL_OPT_4
R230
R235
MODEL_OPT_5 MODEL_OPT_6 MODEL_OPT_7 MODEL_OPT_8 MODEL_OPT_9
MODEL_OPT_10
14.02.10
DEBUG
14.02.10
14.02.10
R237
R8842
R214 R215
R8839
R213
R229 R228
R225 22 R226
R234
R203 R202
R201
IC101
LG1311
AH30
TP_DVB_CLK
AH32
TP_DVB_SOP
AH31
TP_DVB_VAL
AH33
TP_DVB_ERR
AM33
TP_DVB_DATA7
AL32
TP_DVB_DATA6
AL33
TP_DVB_DATA5
AK32
TP_DVB_DATA4
AK33
TP_DVB_DATA3
AK31
TP_DVB_DATA2
AJ30
TP_DVB_DATA1
AJ31
TP_DVB_DATA0
AL31
STPI0_CLK
AN32
STPI0_SOP
AM32
STPI0_VAL
AN31
STPI0_ERR
AM31
STPI0_DATA
AH28
STPI1_CLK
AJ28
STPI1_SOP
AK30
STPI1_VAL
AJ29
STPI1_ERR
AG27
STPI1_DATA
A28
TPI_CLK
B28
TPI_SOP
B29
TPI_VAL
C28
TPI_ERR
A27
TPI_DATA0
B27
TPI_DATA1
C27
TPI_DATA2
B26
TPI_DATA3
C26
TPI_DATA4
B25
TPI_DATA5
A25
TPI_DATA6
C25
TPI_DATA7
AG13
22
GPIO31
22
AJ19
GPIO30
AG14
GPIO29
AG15
GPIO28
AJ15
22
GPIO27
AH19
22
GPIO26
AH18
22
GPIO25
AG19
22
GPIO24
AH5
22
GPIO23
AJ5
22
GPIO22
AJ6
GPIO21
AH6
GPIO20
AG6
OPT
GPIO19
AG5
GPIO18
22
AF7
GPIO17
AG7
GPIO16
AG24
22
GPIO15
AH16
22
GPIO14
V29
22
GPIO13
AJ21
GPIO12
AH21
GPIO11
V28
GPIO10
AG16
22
GPIO9
AJ24
GPIO8
AH17
GPIO7
AG17
GPIO6
AH13
GPIO5
AH15
GPIO4
AG18
GPIO3
AH14
GPIO2
AJ16
GPIO1
AH20
GPIO0
TPIO_CLK TPIO_SOP TPIO_VAL
TPIO_ERR TPIO_DATA0 TPIO_DATA1 TPIO_DATA2 TPIO_DATA3 TPIO_DATA4 TPIO_DATA5 TPIO_DATA6 TPIO_DATA7
EPI_SOE EPI_MCLK EPI_GCLK
EPI_EO
EPI_VST
TX_0N TX_0P TX_1N TX_1P TX_2N TX_2P TX_3N TX_3P TX_4N TX_4P TX_5N TX_5P TX_6N TX_6P TX_7N TX_7P TX_8N TX_8P TX_9N
TX_9P TX_10N TX_10P TX_11N TX_11P TX_12N TX_12P TX_13N TX_13P TX_14N TX_14P TX_15N TX_15P TX_16N TX_16P TX_17N TX_17P TX_18N TX_18P TX_19N TX_19P TX_20N TX_20P TX_21N TX_21P TX_22N TX_22P TX_23N TX_23P
TX_LOCKN
D28 E29 E28 F28 D27 E27
14.02.11
F27 E26 F26 E25 D25 F25
AA5 AB5 AA7 AA6 AB6
AK8 AL8 AK7 AL7 AM6 AN6 AK6 AL6 AK5 AL5 AN4 AN3 AM2 AM1 AM4 AM3 AL4 AL3 AK2 AK1 AK4 AK3 AJ4 AJ3 AH2 AH1 AH4 AH3 AG4 AG3 AF2 AF1 AF4 AF3 AE4 AE3 AD2 AD1 AD4 AD3 AC4 AC3 AB2 AB1 AB4 AB3 AA4 AA3
AM8
14.02.11
14.02.11
DVDD33
OPT R8841
10K
TXB4N/TX0N TXB4P/TX0P TXB3N/TX1N TXB3P/TX1P TXBCLKN/TX2N TXBCLKP/TX2P TXB2N/TX3N TXB2P/TX3P TXB1N/TX4N TXB1P/TX4P TXB0N/TX5N TXB0P/TX5P
TXD4N/TX12N TXD4P/TX12P TXD3N/TX13N TXD3P/TX13P TXDCLKN/TX14N TXDCLKP/TX14P TXD2N/TX15N TXD2P/TX15P TXD1N/TX16N TXD1P/TX16P TXD0N/TX17N TXD0P/TX17P
TXA4N/TX6N TXA4P/TX6P TXA3N/TX7N TXA3P/TX7P TXACLKN/TX8N TXACLKP/TX8P TXA2N/TX9N TXA2P/TX9P TXA1N/TX10N TXA1P/TX10P TXA0N/TX11N TXA0P/TX11P
TXC4N/TX18N TXC4P/TX18P TXC3N/TX19N TXC3P/TX19P TXCCLKN/TX20N TXCCLKP/TX20P TXC2N/TX21N TXC2P/TX21P TXC1N/TX22N TXC1P/TX22P TXC0N/TX23N TXC0P/TX23P
+3.3V_NORMAL
BIT0_1
BIT0_0
MODEL_OPT_[0/1]
0 / 0
CHINA/HONGKONG
0 / 1 1 / 0 1 / 1
BIT1_1
R8823 10K
R8824 10K
10K
BIT1_0
R8825 10K
R8826
14.02.10
DVB
TAIWAN/COLOM
EU/CIS
ASIA/AFRICA
14.02.10
14.02.10
N/AMERICA
S/AMERCIA
MODEL_OPT_0 MODEL_OPT_1
AREA OPTION
ATSC
KOREA
JAPAN
MODEL_OPT_9
MODEL_OPT_10
MODEL_OPT_11
MODEL_OPT_12
Model Option
BIT2_1
R205 10K
BIT3_1
R207 10K
BIT4_1
R209 10K
BIT5_1
R211 10K
BIT6_1
R238 10K
BIT7_1
R240 10K
BIT11_1
R242 10K
BIT12_1
R244 10K
DDR3_DDP
MODEL_OPT_2 MODEL_OPT_3 MODEL_OPT_4 MODEL_OPT_5
14.02.10
BIT3_0
BIT2_0
14.02.12
JP
BIT4_0
BIT5_0
R206 10K
R210 10K
R208 10K
R212 10K
BACK-END OPTION
MODEL_OPT_[2/3/4/5]
0 / 0 / 0 / 0 0 / 0 / 0 / 1 0 / 0 / 1 / 0 0 / 0 / 1 / 1 0 / 1 / 0 / 0 0 / 1 / 0 / 1 0 / 1 / 1 / 0 0 / 1 / 1 / 1 1 / 0 / 0 / 0 1 / 0 / 0 / 1 1 / 0 / 1 / 0 1 / 0 / 1 / 1 1 / 1 / 0 / 0 1 / 1 / 0 / 1 1 / 1 / 1 / 0 1 / 1 / 1 / 1
TYPE
EPI FHD, 120Hz, V14 (8 lane) EPI FHD, 120Hz, v14_32inch (6 lane) EPI FHD, 120Hz, V13 (6 lane) EPI FHD, 120Hz, V12 (6 lane)
EPI FHD, 60Hz, V14_32 inch (6lane)
LVDS FHD, 120Hz LVDS FHD, 60Hz LVDS HD, 60Hz LVDS FHD, 60Hz, CP BOX
LVDS HD, 60Hz SMALL SMART
Vby1 FHD, 120Hz Reserve Reserve Reserve Reserve Reserve
FHD
BIT6_0
R239 10K
BIT7_0
R241 10K
FRC
BIT11_0
BIT12_0
R243 10K
MODEL_OPT_[6/7]
0 / 0 0 / 1 1 / 0 1 / 1
PANEL TYPE
OLED,UD
R245 10K
DDR3_NON_DDP
T2/C/S2/ATV_EXT
T/C/S2/ATV_SOC
OPT
R217 10K
R221 10K
R219 10K
MODEL_OPT_8 MODEL_OPT_9 MODEL_OPT_10
MODEL_OPT_6 MODEL_OPT_7
OPT
R220 10K
R218 10K
EU/CIS KOREA
R222 10K
AJJA JAPAN
TAIWAN/COL
T/C
T2/C PIP
T2/C T2/C
T2/C/S2
T/C
T/C
T2/C PIP
T2/C
CHINA/HONG
Default
14.02.12
ATSC PIP
ATV_SOC ATV_EXT
PAGE 2
HIGH
DDR3MODEL_OPT_8
MODEL_OPT_11 MODEL_OPT_12
14.02.12
DDP
14.02.12
NORTH AMERICA
ATSC PIP
ATV_SOC ATV_EXT
LOW
NON_DDP
BRAZIL
ISDB PIP
ISDB
Default
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
M14-Display In/Out
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DEBUG
+3.3V_NORMAL
SW201
JTP-1127WEM
12
3
4
For ISP
R223
3.3K
LS55A
M14 Symbol C
2013.10.21 2
36
PLACE AT JACK SIDE
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
IC101
LG1311
PAGE 3
Place JACK Side
OPS_L_IN
OPS_R_IN
PC_L_IN
PC_R_IN
Place SOC Side
OPS AUDIO IN
R309 27K
R310 27K
C316 4.7uF
1%
1%
R322 10K
C317 4.7uF
R323 10K
AUDIO IN
R8816 27K
1%
R8817 27K
1%
10V
1%
10V
1%
C8721 4.7uF10V
10K1%
R8818
C8722 4.7uF10V
10K
1%
R8819
14.02.07
AUAD_L_CH3_IN
AUAD_R_CH3_IN
AUAD_L_CH2_IN
AUAD_R_CH2_IN
Placed as close as possible to IC101
R37 4 51K
AUAD_L_REF
1%
R37 8
47K 1%
C313
4.7uF 10V
R38 0 51K 1%
AUAD_R_REF
R38 1 47K 1%
C353
4.7uF 10V
C354 10uF
10V
L307
120-ohm
AVDD25
AUD_MASTER_CLK
AUD_LRCH
AUD_SCK
AUD_LRCK
MAIN I2S_I/F
AVDD25
AUDIO IN
OPS AUDIO IN
50V C335
22pF
OPT
14.02.11
14.02.11
AUAD_L_CH2_IN AUAD_R_CH2_IN
50V C337
33pF OPT
R8828 R8829 68 R8830 68
14.02.11
BLM15BD121SN1
R354 0 R355 0
AUAD_L_CH3_IN AUAD_R_CH3_IN
50V C340 22pF OPT
I2S_AMP
14.02.11
R8827 68
14.02.11
14.02.11
L306
READY READY
14.02.11
14.02.11
AUAD_R_REF AUAD_L_REF
50V C342 22pF OPT
R368 100 R369
14.02.11
C8724 C8725 0.1uF 16V C8726 0.1uF 16V
C8727 0.047uF25V
C8728 C8729 C8730 C8731
C8732 C8733 C8734 C8735 0.1uF16V
C8736
68
C8737 0.047uF25V C8738 0.047uF25V
14.02.11
L305
BLM15BD121SN1
R361 0 R362 0
R363 0 R364 0
R372 0 R376 0
C348 2.2uF
R360 33
R365 100 R366 100
R367 0
100
R386
OPT
R370
R371
C8739
C351
C352 0.1uF
0.1uF 16V
0.1uF
0.1uF16V
0.1uF16V
0.1uF16V
0.1uF16V
0.1uF16V
0.1uF16V
0.047uF25V
C301
0.1uF
16V
OPT OPT
OPT OPT
READY READY
10uF 10VC347
10V
OPT
R387 OPT
OPT
0
OPT
0
0.1uF16V
0.1uF 16V
16V
16V
R388 OPT
AL27 AK26 AM27
AL26
AN27
AL25 AM25
AN23 AL22 AK21 AK22
AL24 AK23 AL23 AK24
AL21 AM23 AN25
AM21 AN21
AK16 AL16
AL19 AK19 AN19 AM19 AN17 AM17 AL17 AK17
AK20 AL20
AK18 AL18
AN15
AM15
AN11 AK11 AK10 AL10 AL11 AM11
AK29 AL29 AM29
AK27 AL30
AK28 AL28 AN29
AD5 AE5 AE7 AE6
AD6
CVBS_IN1 CVBS_IN2 CVBS_IN3
CVBS_VCM
BUF_OUT1
SC1_SID SC1_FB
SOY1_IN Y1_IN PB1_IN PR1_IN
SOY2_IN Y2_IN PB2_IN PR2_IN
ADC1_COM ADC2_COM ADC3_COM
AVSS25_COMP_REF AVDD25_COMP_REF
AUDA_SCART_OUTL AUDA_SCART_OUTR
AUAD_L_CH1_IN AUAD_R_CH1_IN AUAD_L_CH2_IN AUAD_R_CH2_IN AUAD_L_CH3_IN AUAD_R_CH3_IN AUAD_L_CH4_IN AUAD_R_CH4_IN
AUDA_OUTL AUDA_OUTR
AUAD_L_REF AUAD_R_REF
AUD_VBG_EXT
IEC958OUT
AUDCLK_OUT DAC_LRCH DAC_SLRCH DAC_CLFCH DAC_SCK DAC_LRCK
PCMI3LRCH PCMI3LRCK PCMI3SCK AUDCLK_IN
FRC_LRSYNC
AAD_ADC_SIF AAD_ADC_SIFM IFAGC
DMD_DAC_OUT DMD_SIF_OUT
DMD_ADC_INP DMD_ADC_INN DMD_ADC_INCOM
SD_CLK
SD_CMD SD_CD_N SD_WP_N
SD_DATA3 SD_DATA2 SD_DATA1 SD_DATA0
RMII_REF_CLK
RMII_CRS_DV
RMII_MDIO
RMII_MDC RMII_TXEN RMII_TXD1 RMII_TXD0 RMII_RXD1 RMII_RXD0
HDMI_1_SCL HDMI_1_SDA HDMI_1_HPD
HDMI_1_5V_DET
HDMI_1_ARC
HDMI_1_RX_0
HDMI_1_RX_0B
HDMI_1_RX_1
HDMI_1_RX_1B
HDMI_1_RX_2
HDMI_1_RX_2B
HDMI_1_RX_C
HDMI_1_RX_CB
HDMI_2_SCL HDMI_2_SDA HDMI_2_HPD
HDMI_2_5V_DET
HDMI_2_RX_0
HDMI_2_RX_0B
HDMI_2_RX_1
HDMI_2_RX_1B
HDMI_2_RX_2
HDMI_2_RX_2B
HDMI_2_RX_C
HDMI_2_RX_CB
HDMI_3_SCL HDMI_3_SDA HDMI_3_HPD
HDMI_3_5V_DET
HDMI_3_RX_0
HDMI_3_RX_0B
HDMI_3_RX_1
HDMI_3_RX_1B
HDMI_3_RX_2
HDMI_3_RX_2B
HDMI_3_RX_C
HDMI_3_RX_CB
HDMI_4_SCL
HDMI_4_SDA HDMI_4_CBUS_HPD HDMI_4_CD_SENSE
HDMI_4_5V_DET
HDMI_4_RX_0
HDMI_4_RX_0B
HDMI_4_RX_1
HDMI_4_RX_1B
HDMI_4_RX_2
HDMI_4_RX_2B
HDMI_4_RX_C
HDMI_4_RX_CB
E22 D22 F22 F24 D24 E24 F23 E23
AK14 AK12 AL12 AK13 AL13 AM13 AN13 AL14 AK15
AE27 AF28 AE29 AF27 AE28
AF33 AF32 AE31 AE30 AD31 AD30 AF31 AF30
AD28 AD29 AC27 AD27
AC31 AC30 AB33 AB32 AA31 AA30 AD32 AD33
AB28 AB27 AB29 AC28
Y32 Y33 W31 W30 V33 V32 Y31 Y30
Y27 AA28 Y28 AA29 AA27
T31 T30 T32 T33 R31 R30 U31 U30
R327 0
R329 0
R328 0
R325 0
R324 0
R326 0
R315 33 R316 33
R375 33
R373 33 R300 33
R377 33
OPT
OPT
OPT
OPT
OPT
OPT
EPHY_REFCLK EPHY_CRS_DV EPHY_MDIO EPHY_MDC EPHY_EN EPHY_TXD1 EPHY_TXD0 EPHY_RXD1 EPHY_RXD0
READY READY
READY
READY
HDMI_RX0+ HDMI_RX0­HDMI_RX1+ HDMI_RX1­HDMI_RX2+ HDMI_RX2­HDMI_CLK+ HDMI_CLK-
DDR3_OPT1 DDR3_OPT2
+5V_HDMI
R331
10
C302
1uF
10V
R33 0
5.1 K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-AV In/Out
DDR3 VENDOR OPTION
+3.3V_NORMAL
4.7K
4.7K
R384
R382
OPT
OPT
R385 4.7K
R383 4.7K
DDR3_OPT1 DDR3_OPT2
HDMI_EN
LS55A
M14 Symbol B
+5V_ST
OPT R389
33
IN
EN
AP2151WG-7
5
4
IC381
+5V_NORMAL
OPT
PZ1608U121-2R0TF
OUT
1
GND
2
FLG
3
2013.10.21
14.02.07
L8702
3
+5V_HDMI
36
PAGE 4
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
IC101
LG1311
M0_DDR_VREF1 M0_DDR_VREF2
M0_DDR_U_CLKP M0_DDR_U_CLKN M0_DDR_D_CLKP M0_DDR_D_CLKN
M0_DDR_RESET_N
M0_DDR_DQS_P0 M0_DDR_DQS_N0 M0_DDR_DQS_P1 M0_DDR_DQS_N1 M0_DDR_DQS_P2 M0_DDR_DQS_N2 M0_DDR_DQS_P3 M0_DDR_DQS_N3
M0_DDR_ZQCAL
M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8
M0_DDR_A9 M0_DDR_A10 M0_DDR_A11 M0_DDR_A12 M0_DDR_A13 M0_DDR_A14 M0_DDR_A15
M0_DDR_BA0 M0_DDR_BA1 M0_DDR_BA2
M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN M0_DDR_CASN
M0_DDR_WEN
M0_DDR_DM0 M0_DDR_DM1 M0_DDR_DM2 M0_DDR_DM3
M0_DDR_DQ0 M0_DDR_DQ1 M0_DDR_DQ2 M0_DDR_DQ3 M0_DDR_DQ4 M0_DDR_DQ5 M0_DDR_DQ6 M0_DDR_DQ7 M0_DDR_DQ8 M0_DDR_DQ9
M0_DDR_DQ10 M0_DDR_DQ11 M0_DDR_DQ12 M0_DDR_DQ13 M0_DDR_DQ14 M0_DDR_DQ15 M0_DDR_DQ16 M0_DDR_DQ17 M0_DDR_DQ18 M0_DDR_DQ19 M0_DDR_DQ20 M0_DDR_DQ21 M0_DDR_DQ22 M0_DDR_DQ23 M0_DDR_DQ24 M0_DDR_DQ25 M0_DDR_DQ26 M0_DDR_DQ27 M0_DDR_DQ28 M0_DDR_DQ29 M0_DDR_DQ30 M0_DDR_DQ31
VREF_M0_0
A22 A3
E13 E11 E15 E17 D8 D16 D9 E16 E9 E14 D7 D10 D11 D14 E10 E12
D17 E8 D13
C8 B8 C17 B17 D12
E19 D19 D18 E18
D15
B18 C18 B16 A16 B9 C9 B7 A7
A15 A18 A6 A9
B20 B13 C21 C14 A21 A13 B21 C13 B14 B19 C15 C20 C16 A19 B15 C19 B11 C5 C12 B4 A12 A4 B12 C4 B5 B10 C6 C11 C7 A10 B6 C10
E7
VREF_M0_1
R401 240
M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4
M0_DDR_A5
M0_DDR_A6 M0_DDR_A7 M0_DDR_A8 M0_DDR_A9 M0_DDR_A10
M0_DDR_A11
M0_DDR_A12 M0_DDR_A13 M0_DDR_A14 M0_DDR_A15
M0_DDR_BA0 M0_DDR_BA1 M0_DDR_BA2
M0_U_CLK M0_U_CLKN M0_D_CLK M0_D_CLKN M0_DDR_CKE
M0_DDR_ODT M0_DDR_RASN M0_DDR_CASN M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS0 M0_DDR_DQS_N0 M0_DDR_DQS1 M0_DDR_DQS_N1 M0_DDR_DQS2 M0_DDR_DQS_N2 M0_DDR_DQS3 M0_DDR_DQS_N3
M0_DDR_DM0 M0_DDR_DM1 M0_DDR_DM2 M0_DDR_DM3
M0_DDR_DQ0 M0_DDR_DQ1 M0_DDR_DQ2 M0_DDR_DQ3 M0_DDR_DQ4 M0_DDR_DQ5 M0_DDR_DQ6 M0_DDR_DQ7 M0_DDR_DQ8 M0_DDR_DQ9 M0_DDR_DQ10 M0_DDR_DQ11 M0_DDR_DQ12 M0_DDR_DQ13 M0_DDR_DQ14 M0_DDR_DQ15 M0_DDR_DQ16 M0_DDR_DQ17 M0_DDR_DQ18 M0_DDR_DQ19 M0_DDR_DQ20 M0_DDR_DQ21 M0_DDR_DQ22 M0_DDR_DQ23 M0_DDR_DQ24 M0_DDR_DQ25 M0_DDR_DQ26 M0_DDR_DQ27 M0_DDR_DQ28 M0_DDR_DQ29 M0_DDR_DQ30 M0_DDR_DQ31
1%
+1.5V_DDR
+1.5V_DDR
OPT
+1.5V_DDR
+1.5V_DDR
R402 1K 1%
R403 1K 1%
R404 10K
R405 100
M0_DDR_VREFCA
R406 1K 1%
R407 1K 1%
M0_DDR_VREFDQ
R408 1K 1%
R409 1K 1%
VREF_M0_0
C401
0.1uF
16V
M0_DDR_RESET_N
M0_D_CLK
M0_D_CLKN
C402
0.1uF 16V
C403
0.1uF 16V
M0_DDR_CKE
+1.5V_DDR
R410
100
+1.5V_DDR
R411 1K 1%
R412
1K 1%
+1.5V_DDR
R413 1K 1%
R414 1K 1%
VREF_M0_1
R415 1K 1%
R416 1K 1%
R417 10K
M0_U_CLK
M0_U_CLKN
M0_1_DDR_VREFCA
C406
0.1uF 16V
M0_1_DDR_VREFDQ
C407
0.1uF 16V
C408
0.1uF
16V
M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8
M0_DDR_A9 M0_DDR_A10 M0_DDR_A11 M0_DDR_A12 M0_DDR_A13 M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0 M0_DDR_BA1 M0_DDR_BA2
M0_D_CLK
M0_D_CLKN M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN M0_DDR_CASN
M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS0
M0_DDR_DQS_N0
M0_DDR_DQS1
M0_DDR_DQS_N1
M0_DDR_DM0 M0_DDR_DM1
M0_DDR_DQ0 M0_DDR_DQ1
M0_DDR_DQ2 M0_DDR_DQ3 M0_DDR_DQ4 M0_DDR_DQ5 M0_DDR_DQ6 M0_DDR_DQ7
M0_DDR_DQ8
M0_DDR_DQ9 M0_DDR_DQ10 M0_DDR_DQ11 M0_DDR_DQ12 M0_DDR_DQ13 M0_DDR_DQ14 M0_DDR_DQ15
IC401
H5TQ4G63AFR-PBC
DDR3
N3 P7 P3 N2 P8 P2 R8 R2 T8 R3 L7 R7 N7 T3 T7 M7
M2 N8 M3
J7 K7 K9
L2 K1 J3 K3 L3
T2
F3 G3
C7 B7
E7 D3
E3 F7 F2 F8 H3 H8 G2 H7
D7 C3 C8 C2 A7 A2 B8 A3
4Gbit
A0
(x16)
A1
DDR_512MB_HYNIX_1600_29n
A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12/BC A13 A14 A15
BA0 BA1 BA2
CK CK CKE
CS ODT RAS CAS WE
RESET
DQSL DQSL
DQSU DQSU
DML DMU
DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7
DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7
VREFCA
VREFDQ
VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9
VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9
NC_1 NC_2 NC_3 NC_4
VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8
VSS_9 VSS_10 VSS_11 VSS_12
VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9
ZQ
M0_DDR_VREFCA
M0_DDR_VREFDQ
M8
H1
R418
L8
240 1%
B2 D9 G7 K2 K8 N1 N9 R1 R9
A1 A8 C1 C9 D2 E9 F1 H2 H9
J1 J9 L1 L9
A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9
B1 B9 D1 D8 E2 E8 F9 G1 G9
+1.5V_DDR
IC401-*1
K4B4G1646B-HCK0
DDR_512MB_SS
N3
A0
VREFCA
P7
A1
P3
A2
N2
A3
VREFDQ
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
VDD_1
L7
A10/AP
VDD_2
R7
A11
VDD_3
N7
A12/BC
VDD_4
T3
A13
VDD_5
T7
VDD_6
A14
M7
A15
VDD_7 VDD_8
M2
BA0
VDD_9
N8
BA1
M3
BA2
VDDQ_1
J7
CK
VDDQ_2
K7
CK
VDDQ_3
K9
CKE
VDDQ_4 VDDQ_5
L2
CS
VDDQ_6
K1
ODT
VDDQ_7
J3
RAS
VDDQ_8
K3
CAS
VDDQ_9
L3
WE
NC_1
T2
RESET
NC_2 NC_3 NC_4
F3
DQSL
G3
DQSL
C7
DQSU
VSS_1
B7
DQSU
VSS_2 VSS_3
E7
DML
VSS_4
D3
DMU
VSS_5 VSS_6
E3
DQL0
VSS_7
F7
DQL1
VSS_8
F2
DQL2
VSS_9
F8
DQL3
VSS_10
H3
DQL4
VSS_11
H8
DQL5
VSS_12
G2
DQL6
H7
DQL7
VSSQ_1
D7
DQU0
VSSQ_2
C3
DQU1
VSSQ_3
C8
DQU2
VSSQ_4
C2
DQU3
VSSQ_5
A7
DQU4
VSSQ_6
A2
DQU5
VSSQ_7
B8
DQU6
VSSQ_8
A3
DQU7
VSSQ_9
C413 C414
ZQ
IC402
H5TQ4G63AFR-PBC
DDR3
N3
M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8
M0_DDR_A9 M0_DDR_A10 M0_DDR_A11 M0_DDR_A12 M0_DDR_A13 M0_DDR_A14 M0_DDR_A15
M0_DDR_BA0 M0_DDR_BA1 M0_DDR_BA2
M0_U_CLK
M0_U_CLKN M0_DDR_CKE
1uF 16V 1uF 16V
M0_DDR_ODT
M0_DDR_RASN M0_DDR_CASN
M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS2
M0_DDR_DQS_N2
M0_DDR_DQS3
M0_DDR_DQS_N3
M0_DDR_DM2 M0_DDR_DM3
M0_DDR_DQ16
M0_DDR_DQ17 M0_DDR_DQ18 M0_DDR_DQ19 M0_DDR_DQ20 M0_DDR_DQ21 M0_DDR_DQ22 M0_DDR_DQ23
M0_DDR_DQ24 M0_DDR_DQ25 M0_DDR_DQ26 M0_DDR_DQ27 M0_DDR_DQ28 M0_DDR_DQ29 M0_DDR_DQ30 M0_DDR_DQ31
IC402-*1
K4B4G1646B-HCK0
DDR_512MB_SS
N3
M8
A0
VREFCA
P7
M8
H1
L8
B2 D9 G7 K2 K8 N1 N9 R1 R9
A1 A8 C1 C9 D2 E9 F1 H2 H9
J1 J9 L1 L9
A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9
B1 B9 D1 D8 E2 E8 F9 G1 G9
A1
P3
A2
N2
H1
A3
VREFDQ
P8
A4
P2
A5
L8
R8
ZQ
A6
R2
A7
T8
A8
B2
R3
VDD_1
A9
D9
L7
VDD_2
A10/AP
G7
R7
VDD_3
A11
N7
K2
VDD_4
A12/BC
T3
K8
A13
VDD_5
N1
T7
VDD_6
A14
M7
N9
A15
VDD_7
R1
VDD_8
M2
R9
BA0
VDD_9
N8
BA1
M3
BA2
A1
VDDQ_1
J7
A8
CK
VDDQ_2
K7
C1
CK
VDDQ_3
K9
C9
CKE
VDDQ_4
D2
VDDQ_5
L2
E9
CS
VDDQ_6
K1
F1
ODT
VDDQ_7
J3
H2
RAS
VDDQ_8
K3
H9
CAS
VDDQ_9
L3
WE
J1
NC_1
T2
J9
RESET
NC_2
L1
NC_3
L9
NC_4
F3
DQSL
G3
DQSL
C7
A9
DQSU
VSS_1
B7
B3
DQSU
VSS_2
E1
VSS_3
E7
G8
DML
VSS_4
D3
J2
DMU
VSS_5
J8
VSS_6
E3
M1
DQL0
VSS_7
F7
M9
DQL1
VSS_8
F2
P1
DQL2
VSS_9
F8
P9
DQL3
VSS_10
H3
T1
DQL4
VSS_11
H8
T9
DQL5
VSS_12
G2
DQL6
H7
DQL7
B1
VSSQ_1
D7
B9
DQU0
VSSQ_2
C3
D1
DQU1
VSSQ_3
C8
D8
DQU2
VSSQ_4
C2
E2
DQU3
VSSQ_5
A7
E8
DQU4
VSSQ_6
A2
F9
DQU5
VSSQ_7
B8
G1
DQU6
VSSQ_8
A3
G9
DQU7
VSSQ_9
4Gbit
A0
P7
(x16)
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
M0_1_DDR_VREFCA
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
M0_1_DDR_VREFDQ
+1.5V_DDR
R419
240 1%
C429 C430
1uF 16V 1uF 16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LS55A
M14 DDR3-M0
2013.10.21 4
36
PAGE 5
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
IC101
LG1311
M1_DDR_VREF1 M1_DDR_VREF2
M1_DDR_U_CLKP M1_DDR_U_CLKN M1_DDR_D_CLKP M1_DDR_D_CLKN
M1_DDR_RESET_N
M1_DDR_DQS_P0 M1_DDR_DQS_N0 M1_DDR_DQS_P1 M1_DDR_DQS_N1 M1_DDR_DQS_P2 M1_DDR_DQS_N2 M1_DDR_DQS_P3 M1_DDR_DQS_N3
M1_DDR_ZQCAL
M1_DDR_A0 M1_DDR_A1 M1_DDR_A2 M1_DDR_A3 M1_DDR_A4 M1_DDR_A5 M1_DDR_A6 M1_DDR_A7 M1_DDR_A8
M1_DDR_A9 M1_DDR_A10 M1_DDR_A11 M1_DDR_A12 M1_DDR_A13 M1_DDR_A14 M1_DDR_A15
M1_DDR_BA0 M1_DDR_BA1 M1_DDR_BA2
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN M1_DDR_CASN
M1_DDR_WEN
M1_DDR_DM0 M1_DDR_DM1 M1_DDR_DM2 M1_DDR_DM3
M1_DDR_DQ0 M1_DDR_DQ1 M1_DDR_DQ2 M1_DDR_DQ3 M1_DDR_DQ4 M1_DDR_DQ5 M1_DDR_DQ6 M1_DDR_DQ7 M1_DDR_DQ8 M1_DDR_DQ9
M1_DDR_DQ10 M1_DDR_DQ11 M1_DDR_DQ12 M1_DDR_DQ13 M1_DDR_DQ14 M1_DDR_DQ15 M1_DDR_DQ16 M1_DDR_DQ17 M1_DDR_DQ18 M1_DDR_DQ19 M1_DDR_DQ20 M1_DDR_DQ21 M1_DDR_DQ22 M1_DDR_DQ23 M1_DDR_DQ24 M1_DDR_DQ25 M1_DDR_DQ26 M1_DDR_DQ27 M1_DDR_DQ28 M1_DDR_DQ29 M1_DDR_DQ30 M1_DDR_DQ31
VREF_M1_0
A2 Y1
M5 N5 K5 H5 T4 H4 R4 J5 T5 L5 U4 P4 P5 K4 R5 N4
G4 U5 L4
R3 R2 F3 F2 M4
F5 E4 F4 G5
J4
E2 E3 G2 G1 P2 P3 T2 T1
H1 E1 U1 P1
C2 K2 B3 J3 B1 K1 B2 K3 J2 D2 H3 C3 G3 D1 H2 D3 M2 V3 L3 W2 L1 W1 L2 W3 V2 N2 U3 M3 T3 N1 U2 N3
E5
R501
VREF_M1_1
M1_DDR_A0 M1_DDR_A1 M1_DDR_A2 M1_DDR_A3 M1_DDR_A4 M1_DDR_A5 M1_DDR_A6 M1_DDR_A7 M1_DDR_A8 M1_DDR_A9 M1_DDR_A10 M1_DDR_A11 M1_DDR_A12 M1_DDR_A13 M1_DDR_A14 M1_DDR_A15
M1_DDR_BA0 M1_DDR_BA1
M1_DDR_BA2
M1_U_CLK M1_U_CLKN M1_D_CLK M1_D_CLKN
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN
M1_DDR_CASN M1_DDR_WEN
M1_DDR_RESET_N
M1_DDR_DQS0
M1_DDR_DQS_N0 M1_DDR_DQS1 M1_DDR_DQS_N1 M1_DDR_DQS2 M1_DDR_DQS_N2
M1_DDR_DQS3
M1_DDR_DQS_N3
M1_DDR_DM0 M1_DDR_DM1
M1_DDR_DM2
M1_DDR_DM3
M1_DDR_DQ0 M1_DDR_DQ1 M1_DDR_DQ2
M1_DDR_DQ3
M1_DDR_DQ4 M1_DDR_DQ5 M1_DDR_DQ6 M1_DDR_DQ7
M1_DDR_DQ8
M1_DDR_DQ9 M1_DDR_DQ10 M1_DDR_DQ11 M1_DDR_DQ12 M1_DDR_DQ13 M1_DDR_DQ14
M1_DDR_DQ15
M1_DDR_DQ17 M1_DDR_DQ18
M1_DDR_DQ19 M1_DDR_DQ20 M1_DDR_DQ21
M1_DDR_DQ22 M1_DDR_DQ23
M1_DDR_DQ24
M1_DDR_DQ25 M1_DDR_DQ26
M1_DDR_DQ27
M1_DDR_DQ28
M1_DDR_DQ29 M1_DDR_DQ30
M1_DDR_DQ31
240
1%
+1.5V_DDR
+1.5V_DDR
+1.5V_DDR
+1.5V_DDR
VREF_M1_0
R508 1K 1%
R509
1K 1%
R502 10K
R503 100
M1_DDR_VREFCA
R504
1K 1%
R505
1K 1%
M1_DDR_VREFDQ
R506 1K 1%
R507 1K 1%
C501
0.1uF 16V OPT
M1_DDR_RESET_N
M1_D_CLK
M1_D_CLKN
C502
0.1uF 16V
C503
0.1uF 16V
+1.5V_DDR
M1_DDR_CKE
+1.5V_DDR
+1.5V_DDR
VREF_M1_1
R515 1K 1%
R516 1K 1%
R510
100
M1_1_DDR_VREFCA
R511 1K 1%
C507
R512
1K
0.1uF
1%
16V
M1_1_DDR_VREFDQ
R513
1K 1%
C508
R514
1K
0.1uF
1%
16V
C506
0.1uF16V OPT
R517 10K
M1_U_CLK
M1_U_CLKN
+1.5V_DDR
IC501
H5TQ4G63AFR-PBC
N3
M1_DDR_A0 M1_DDR_A1 M1_DDR_A1 M1_DDR_A2 M1_DDR_A3 M1_DDR_A4 M1_DDR_A5 M1_DDR_A6 M1_DDR_A7 M1_DDR_A8
M1_DDR_A9 M1_DDR_A10 M1_DDR_A11 M1_DDR_A12 M1_DDR_A13 M1_DDR_A14 M1_DDR_A15
M1_DDR_BA0 M1_DDR_BA1 M1_DDR_BA2
M1_D_CLK
M1_D_CLKN M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN
M1_DDR_CASN
M1_DDR_WEN
M1_DDR_RESET_N
M1_DDR_DQS0
M1_DDR_DQS_N0
M1_DDR_DQS1
M1_DDR_DQS_N1
M1_DDR_DM0 M1_DDR_DM1
M1_DDR_DQ0 M1_DDR_DQ1 M1_DDR_DQ2 M1_DDR_DQ3 M1_DDR_DQ4 M1_DDR_DQ5 M1_DDR_DQ6 M1_DDR_DQ7
M1_DDR_DQ8 M1_DDR_DQ9
M1_DDR_DQ10 M1_DDR_DQ11
M1_DDR_DQ12 M1_DDR_DQ13M1_DDR_DQ16 M1_DDR_DQ14 M1_DDR_DQ15
DDR3
A0
P7
4Gbit
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
VREFCA
VREFDQ
VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9
VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9
NC_1 NC_2 NC_3 NC_4
VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8
VSS_9 VSS_10 VSS_11 VSS_12
VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9
M8
H1
L8
ZQ
B2 D9 G7 K2 K8 N1 N9 R1 R9
A1 A8 C1 C9 D2 E9 F1 H2 H9
J1 J9 L1 L9
A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9
B1 B9 D1 D8 E2 E8 F9 G1 G9
M1_DDR_VREFCA
R518
+1.5V_DDR
OPT
C524 C525
OPT
0.1uF
0.1uF 16V
M1_DDR_VREFDQ
240
16V
DDR3 1.5V bypass Cap
: Place these caps near Memory
H5TQ2G63DFR-PBC
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
IC501-*1
DDR_256MB_HYNIX_1600
VREFCA
VREFDQ
ZQ
VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9
VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9
NC_1 NC_2 NC_3 NC_4 NC_6
VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8
VSS_9 VSS_10 VSS_11 VSS_12
VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9
N3
M8
P7 P3 N2
H1
P8 P2 R8
L8
R2 T8 R3
B2
L7
D9
R7
G7
N7
K2
T3
K8 N1
M7
N9 R1
M2
R9
N8 M3
A1
J7
A8
K7
C1
K9
C9 D2
L2
E9
K1
F1
J3
H2
K3
H9
L3
J1
T2
J9 L1 L9
F3
T7
G3
C7
A9
B7
B3 E1
E7
G8
D3
J2 J8
E3
M1
F7
M9
F2
P1
F8
P9
H3
T1
H8
T9
G2 H7
B1
D7
B9
C3
D1
C8
D8
C2
E2
A7
E8
A2
F9
B8
G1
A3
G9
1_2Gbit : T7(NC_6)
4Gbit : T7(A14)
M1_DDR_A0
M1_DDR_A2 M1_DDR_A3 M1_DDR_A4 M1_DDR_A5 M1_DDR_A6 M1_DDR_A7 M1_DDR_A8
M1_DDR_A9 M1_DDR_A10 M1_DDR_A11 M1_DDR_A12 M1_DDR_A13 M1_DDR_A14 M1_DDR_A15
M1_DDR_BA0 M1_DDR_BA1 M1_DDR_BA2
M1_U_CLK
M1_U_CLKN M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN M1_DDR_CASN
M1_DDR_WEN
M1_DDR_RESET_N
M1_DDR_DQS2
M1_DDR_DQS_N2
M1_DDR_DQS3
M1_DDR_DQS_N3
M1_DDR_DM2 M1_DDR_DM3
M1_DDR_DQ16 M1_DDR_DQ17 M1_DDR_DQ18 M1_DDR_DQ19 M1_DDR_DQ20 M1_DDR_DQ21 M1_DDR_DQ22 M1_DDR_DQ23
M1_DDR_DQ24 M1_DDR_DQ25 M1_DDR_DQ26 M1_DDR_DQ27 M1_DDR_DQ28 M1_DDR_DQ29 M1_DDR_DQ30 M1_DDR_DQ31
IC502-*1
H5TQ2G63DFR-PBC
DDR_256MB_HYNIX_1600
M8
A0
VREFCA A1 A2
H1
A3
VREFDQ A4 A5
L8
A6
ZQ A7 A8
B2
A9
VDD_1
D9
A10/AP
VDD_2
G7
A11
VDD_3
K2
A12/BC
VDD_4
K8
A13
VDD_5
N1
VDD_6
N9
NC_5
VDD_7
R1
VDD_8
R9
BA0
VDD_9 BA1 BA2
A1
VDDQ_1
A8
CK
VDDQ_2
C1
CK
VDDQ_3
C9
CKE
VDDQ_4
D2
VDDQ_5
E9
CS
VDDQ_6
F1
ODT
VDDQ_7
H2
RAS
VDDQ_8
H9
CAS
VDDQ_9
WE
J1
NC_1
J9
RESET
NC_2
L1
NC_3
L9
NC_4
T7
DQSL
NC_6
DQSL
A9
DQSU
VSS_1
B3
DQSU
VSS_2
E1
VSS_3
G8
DML
VSS_4
J2
DMU
VSS_5
J8
VSS_6
M1
DQL0
VSS_7
M9
DQL1
VSS_8
P1
DQL2
VSS_9
P9
DQL3
VSS_10
T1
DQL4
VSS_11
T9
DQL5
VSS_12 DQL6 DQL7
B1
VSSQ_1
B9
DQU0
VSSQ_2
D1
DQU1
VSSQ_3
D8
DQU2
VSSQ_4
E2
DQU3
VSSQ_5
E8
DQU4
VSSQ_6
F9
DQU5
VSSQ_7
G1
DQU6
VSSQ_8
G9
DQU7
VSSQ_9
IC502
H5TQ4G63AFR-PBC
N3
DDR3
A0
P7
4Gbit
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
VREFCA
VREFDQ
VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9
VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9
NC_1 NC_2 NC_3 NC_4
VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8
VSS_9 VSS_10 VSS_11 VSS_12
VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9
ZQ
+1.5V_DDR
M8
H1
L8
B2 D9 G7 K2 K8 N1 N9 R1 R9
A1 A8 C1 C9 D2 E9 F1 H2 H9
J1 J9 L1 L9
A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9
B1 B9 D1 D8 E2 E8 F9 G1 G9
M1_1_DDR_VREFCA
R519
+1.5V_DDR
0.1uF
C540
0.1uF
C541
M1_1_DDR_VREFDQ
240
16V
16V
DDR3 1.5V bypass Cap
: Place these caps near Memory
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LS55A
M14 DDR3-M1
2013.10.21 5
31
PAGE 6
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
VDD3V3_HDMI
AVDD33
C637
0.1uF 16V
+1.5V_DDR
TP5207
+1.5V_DDR
TP5208
AVDD25_C4TX
AVDD25
AVDD25_AUD
GND JIG POINT
DVDD33
JP601
AA23 AC12 AC13 AC14 AC15 AC11
AF22
AA11 AC18 AC19 AC20 AC21 AC22 AC23
AC17 AB23
L18 L21 L22 L23 M23 T11 Y23
P23 R23 T23 U23 V23
F10 F11 F12 F13 F14 F15 F16 F17
V11 W11 Y11
G19 H19 H20
F9
G6 H6 J6 K6 L6 M6 N6 P6 R6
JP602
IC101
LG1311
DVDD33_1 DVDD33_2 DVDD33_3 DVDD33_4 DVDD33_5 DVDD33_6 DVDD33_7 DVDD33_8 DVDD33_9 DVDD33_10 DVDD33_11 DVDD33_12 AVDD33_BT_USB AVDD33_USB_1 AVDD33_USB_2 AVDD33_HDMI_1 AVDD33_HDMI_2 AVDD33_HDMI_3
AVDD33_CVBS
DVDD15_M0_1 DVDD15_M0_2 DVDD15_M0_3 DVDD15_M0_4 DVDD15_M0_5 DVDD15_M0_6 DVDD15_M0_7 DVDD15_M0_8 DVDD15_M0_9
DVDD15_M1_1 DVDD15_M1_2 DVDD15_M1_3 DVDD15_M1_4 DVDD15_M1_5 DVDD15_M1_6 DVDD15_M1_7 DVDD15_M1_8 DVDD15_M1_9
AVDD25_C4TX_1 AVDD25_C4TX_2 AVDD25_C4TX_3 AVDD25_C4TX_4 AVDD25_COMP_1 AVDD25_COMP_2 AVDD25_CVBS_1 AVDD25_CVBS_2 AVDD25_DMD AVDD25_AAD DVDD25_XTAL AVDD25_DR3PLL SP_VQPS
AVDD25_AUD AVDD25_APLL
JP604
JP603
DVDD11_1 DVDD11_2 DVDD11_3 DVDD11_4 DVDD11_5 DVDD11_6 DVDD11_7 DVDD11_8
DVDD11_9 DVDD11_10 DVDD11_11 DVDD11_12 DVDD11_13 DVDD11_14 DVDD11_15 DVDD11_16 DVDD11_17 DVDD11_18 DVDD11_19 DVDD11_20 DVDD11_21 DVDD11_22 DVDD11_23 DVDD11_24 DVDD11_25 DVDD11_26 DVDD11_27 DVDD11_28 DVDD11_29 DVDD11_30 DVDD11_31 DVDD11_32 DVDD11_33 DVDD11_34 DVDD11_35 DVDD11_36 DVDD11_37 DVDD11_38 DVDD11_39
DVDD11_40 DVDD11_41 DVDD11_42 DVDD11_43 DVDD11_44 DVDD11_45 DVDD11_46 DVDD11_47 DVDD11_48 DVDD11_49 DVDD11_50 DVDD11_51
AVDD11_APLL
AVDD11_COMP_LLPLL
AVDD11_C4TX_1 AVDD11_C4TX_2 AVDD11_C4TX_3 AVDD11_C4TX_4
DVDD11_XTAL
DVDD11_DR3PLL
DVDD11_CVBSPLL
AVDD11_DMD_1 AVDD11_DMD_2
DVDD18_EMMC_1 DVDD18_EMMC_2
+1.1V_VDD
M20 M21 N13 N14 N15 N16 N17 N18 P20 P21 R13 R14 R15 R16 R17 R18 R19 R20 R21 T13 T20 T21 U14 U15 U16 U17 U18 U19 U20 U21 V13 V20 V21 W13 W14 W15 W16 W17 W18 W19 Y13 Y20 Y21 AA13 AA14 AA15 AA17 AA18 AA19 AA20 AA21 AB21 AB19 V12 W12 Y12 AA12
G18 H18
AF23 AF24 AF25
L26 M26
TP5209
+1.1V_VDD
AVDD11_DMD
TP5210
DVDD18_EMMC
+3.3V_Bypass Cap
+3.3V_NORMAL
PZ1608U121-2R0TF
L601
DVDD33
C601
4.7uF 10V
C604
4.7uF 10V
C607
0.1uF 16V
+2.5V_Bypass Cap
+2.5V_NORMAL
PZ1608U121-2R0TF
+2.5V_NORMAL
PZ1608U121-2R0TF
HDMI LEAKAGE Workaround in MTK A2(A0) (Default= with HDMI_LEAKAGE)
+3.3V_NORMAL
L602
4.7uF
AVDD25_AUD
L603
4.7uF
D
NTR4501NT1G
AVDD25
C602
10V
C603
10V
R602 0
1/16W 5%
R601
10K
G
Q601
4.7uF
4.7uF
OPT
PANEL_VCC
13K
S
C605
C606
R603
C608
0.1uF 16V
10V
C609
0.1uF 16V
10V
VDD3V3_HDMI
C635
0.1uF 16V
+3.3V_NORMAL
+2.5V_NORMAL
PZ1608U121-2R0TF
PZ1608U121-2R0TF
AFE 3CH Power
AVDD25_C4TX
L604
C610
4.7uF 10V
L606
4.7uF
C613
4.7uF
C614
10V
AVDD33
10V
C616
0.1uF 16V
C615
0.1uF 16V
+1.1V_VDD
C617
4.7uF 10V
+1.1V_VDD
+1.5V_Bypass Cap
+1.5V_DDR
+1.5V_DDR
+1.1V_Bypass Cap
C619
C618
4.7uF 10V
L607
PZ1608U121-2R0TF
OPT
C629 22uF 10V
OPT
C630 22uF 10V
4.7uF 10V
AVDD11_DMD
C622
4.7uF 10V
C631
0.1uF 16V
C632
0.1uF 16V
C620
4.7uF
C633
0.1uF 16V
C634
0.1uF 16V
10V
C625
0.1uF
C623
4.7uF
16V
IC101
LG1311
GND_1 GND_2 GND_3 GND_4 GND_5 GND_6 GND_7 GND_8 GND_9 GND_10 GND_11 GND_12 GND_13 GND_14 GND_15 GND_16 GND_17 GND_18 GND_19 GND_20 GND_21 GND_22 GND_23 GND_24 GND_25 GND_26 GND_27 GND_28 GND_29 GND_30 GND_31 GND_32 GND_33 GND_34 GND_35 GND_36 GND_37 GND_38 GND_39 GND_40 GND_41 GND_42 GND_43 GND_44 GND_45 GND_46 GND_47 GND_48 GND_49 GND_50 GND_51 GND_52 GND_53 GND_54 GND_55 GND_56 GND_57 GND_58 GND_59 GND_60 GND_61 GND_62 GND_63 GND_64 GND_65 GND_66 GND_67 GND_68 GND_69 GND_70 GND_71 GND_72 GND_73 GND_74 GND_75 GND_76 GND_77 GND_78 GND_79 GND_80 GND_81 GND_82 GND_83 GND_84 GND_85 GND_86 GND_87 GND_88 GND_89 GND_90 GND_91 GND_92 GND_93 GND_94 GND_95 GND_96 GND_97 GND_98 GND_99 GND_100 GND_101 GND_102 GND_103 GND_104 GND_105 GND_106 GND_107 GND_108 GND_109 GND_110 GND_111 GND_112 GND_113
@optio
GND_114 GND_115 GND_116 GND_117 GND_118 GND_119 GND_120 GND_121 GND_122 GND_123 GND_124 GND_125 GND_126 GND_127 GND_128 GND_129 GND_130 GND_131 GND_132 GND_133 GND_134 GND_135 GND_136 GND_137 GND_138 GND_139 GND_140 GND_141 GND_142 GND_143 GND_144 GND_145 GND_146 GND_147 GND_148 GND_149 GND_150 GND_151 GND_152 GND_153 GND_154 GND_155 GND_156 GND_157 GND_158 GND_159 GND_160 GND_161 GND_162 GND_163 GND_164 GND_165 GND_166 GND_167 GND_168 GND_169 GND_170 GND_171 GND_172 GND_173 GND_174 GND_175 GND_176 GND_177 GND_178 GND_179 GND_180 GND_181 GND_182 GND_183 GND_184 GND_185 GND_186 GND_187 GND_188 GND_189 GND_190 GND_191 GND_192 GND_193 GND_194 GND_195 GND_196 GND_197 GND_198 GND_199 GND_200 GND_201 GND_202 GND_203 GND_204 GND_205 GND_206 GND_207 GND_208 GND_209 GND_210 GND_211 GND_212 GND_213 GND_214 GND_215 GND_216 GND_217 GND_218 GND_219 GND_220 GND_221 GND_222 GND_223 GND_224 GND_225 GND_226
P19 P22 P26 P30 R7 R8 R11 R12 R22 R26 R27 T6 T7 T8 T12 T14 T15 T16 T17 T18 T19 T22 T26 T27 U6 U7 U8 U11 U12 U13 U22 U26 V4 V5 V6 V7 V8 V14 V15 V16 V17 V18 V19 V22 V26 V30 V31 W4 W8 W20 W21 W22 W23 W26 W27 Y2 Y3 Y4 Y8 Y14 Y15 Y16 Y17 Y18 Y19 Y22 Y26 AA8 AA16 AA22 AA26 AB11 AB12 AB13 AB14 AB15 AB16 AB17 AB18 AB20 AB22 AB26 AB30 AB31 AC16 AC26 AD26 AE26 AF6 AF8 AF9 AF10 AF11 AF12 AF13 AF14 AF15 AF16 AF17 AF18 AF19 AF20 AF21 AF26 AG20 AG25 AG31 AH25 AJ25 AK9 AK25 AL9 AL15
B22 B24 C22 C23
C626
C627
0.1uF
C628
0.1uF
16V
16V
0.1uF
10V
16V
C24
D4 D5
D6 D20 D21
E6 E20 E21
F6
F7
F8 F18 F19 F20 F21
G7
G8
G9 G10 G11 G12 G13 G14 G15 G16 G17 G20 G21 G22 G23 G24 G25 G26 G27
H7
H8
H9 H10 H11 H12 H13 H14 H15 H16 H17 H21 H22 H23 H24 H25 H26 H27 H31
J7
J8 J26 J27
K7
K8 K26 K27
L7
L8 L11 L12 L13 L14 L15 L16 L17 L19 L20 L27
M7
M8 M11 M12 M13 M14 M15 M16 M17 M18 M19 M22 M27
N7
N8 N11 N12 N19 N20 N21 N22 N23 N26 N27 N30
P7
P8 P11 P12 P13 P14 P15 P16 P17 P18
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
LS55A
VCC & GND
2013.10.21 6
31
+3.5V_ST
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
+3.3V_NORMAL
RL_ON
+3.5V_ST
+12V
C2306
0.1uF
L/DIM0_MOSI
R2301
R2300
10K
50V
10K
MMBT3906(NXP)
VA23001
AMOTECH CO., LTD.
L2304
UBW2012-121F
C2307
0.1uF 16V
UBW2012-121F
L2303
5.6V
Q2300
2
5V
ZD2303
14.02.06
1
3
POWER_WAFER_18PIN
PWR ON
3.5V
3.5V GND 24V GND 12V 12V GND GND GND
L/DIM0_MOSI
DEV_POWER_WAFER_24PIN
P2300
SMAW200-H18S5
1
1 3
3 5
5 7
7
10
9
9
10
11
12
12
11 13
14
13
14
15
16
16
15 17
18
18
17
20
19 21
22
19
23
24
25
.
SMAW200-H24S2
P2301
INV ON
2
2
PDIM#1
4
4
3.5V
6
6
PDIM#2
8
8
24V GND 12V 24V GND GND L/DIMO_VS L/DIM0_SCLK
L2306
UBW2012-121F
C2316
0.1uF 50V
R2309 100
R2354
4.7K OPT
L/DIM0_VS L/DIM0_SCLK
R2310 1K
R2355
4.7K OPT
OPT
PWM_DIM
PWM_DIM2
C2358
0.1uF
INV_CTL
50V
C2359
10uF
L2312
35V
+24V
UBW2012-121F
+3.3V - eMMC 4.41(LG1311-A0)
+3.3V_NORMAL
L2302
PZ1608U121-2R0TF
C2305
0.1uF 16V
C2300 22uF 10V
3.3V_EMMC
+1.8V - eMMC 4.51(LG1311-B0)
+3.3V_NORMAL
IC2306
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
+12V
+3.3V_NORMAL
L2300
PZ1608U121-2R0TF
C2302
C2303
10uF
0.1uF
16V
16V
R23 03
68K
1/1 6W
1%
R2304 10K
R1
R2
R23 05
22K
1/1 6W
1%
POWER_ON/OFF1
R2302
5.1K
1/16W 1%
C2304 100pF
EN
VFB
VREG5
SS
3.3V_DCDC_TI
IC2300-*1
TPS54327DDAR
1
2
3
4
THERMAL
[EP]GND
VIN
8
VBST
9
7
SW
6
GND
5
3.3V_DCDC_RHOM
3.3V_DCDC_TI C2312-*1
3300pF 50V
50V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DVDD18_EMMC
R2347 1
75
1%
1/16W
R2357
C2301 10uF
33
C2310 1uF 10V
1%
1/16W
VREG
C2312 2200pF 50V
3.3V_DCDC_RHOM
R2358
BD9D320EFJ
EN
1
FB
2
3
3.3V_DCDC_RHOM
SS
4
IC2300
THERMAL
3A
10V
[EP]FIN
VIN
8
BOOT
9
7
SW
6
GND
5
Vout=0.765*(1+R1/R2)
C2308 10uF 10V
OPT
16V
0.1uF C2313
2.5V
D2302
L2301
2uH
C2314
22uF
10V
+3.3V_NORMAL
C2315 22uF 10V
5V
ZD2300
+3.3V_NORMAL
PANEL_POWER
R8813
4.7K
OPT
OPT R8812
ERROR_OUT
100
+12V
POWER_WAFER_24PIN_LS75A
P2302
0
PWR ON
3.5V
3.5V
R8811
24V GND GND
GND GND GND 12V 12V GND
14.02.06
SMAW200-H24S5
1
2
3
4
5
6
7
8
10
9 11
12
13
14
15
16
17
18 20
19 21
22
23
24
25
GND
24V 24V GND GND
3.5V
3.5V GND GND INV ON FLOATING PDIM ERROR_OUT
PANEL_CTL
L2313
UBW2012-121F
R8814
10K
+2.5V
POWER_ON/OFF2_1
+3.3V_NORMAL
C2327
0.1uF 16V
R2312
10K
16V
+5V_NORMAL
PZ1608U121-2R0TF
C2337 1uF 25V
14.02.21
L8703
14.02.21
AP2132MP-2.5TRG1
C2346
0.1uF
READY R8845 0
PG
EN
VIN
VCTRL
Vout=0.6*(1+R1/R2)
+1.1V_CORE
R2311 10K
1% C2321 1000pF 50V
C2320
0.1uF 16V
C2319 22uF 10V
L2305
1uH
R2307 1K
R2306 2K
1/16W 5%
R2308
3.3
1/10W
C2322 470pF 50V
POWER_ON/OFF2_3
+1.1V_VDD
C2317 22uF 10V
OPT
2.5V
ZD2301
C2318
22uF 10V
SoC A0/A1 : 1.22V(R1/R2=10.7K,10.5K) SoC B0 : 1.12V(R1/R2=9.1K10.7K)(1309016)
POWER UP SEQUENCE
3.3V->2.5V->1.5V/1.1V->5V
91K
1/1 6W
R23 15
27K
R23 13
PGOOD
VBST
NC_1
SW_1
SW_2
SW_3
SW_4
RF
1
2
EN
3
4
5
6
7
8
9
[EP]
THERMAL
TPS53513RVER
10
PGND_111PGND_212PGND_313PGND_414PGND_5
R2351
5%
1%
0.1uF
C2323
4.7
1/1 6W
16V
Vout=0.6*(1+R1/R2)
C2331
0.1uF 50V
R2314
10K
IC2302
1
2
3
4
EAN61387601
R2316 39K
1/16W 5%
29
IC2301
8A
2A
R2318
9
THERMAL
TRIP26NC_327GND128GND2
R2317
18K
B
24VO25
100K
8
7
6
5
14.02.06
C
Q2301 MMBT3904(NXP)
E
[EP]
GND
ADJ
VOUT
NC
FB
23
GND
22
MODE
21
VREG
20
VDD
19
NC_2
18
VIN_3
17
VIN_2
16
VIN_1
15
C2333 10uF
16V
R1
R2
R2321
R23 22
R2319
9.1K
R2320
10.7K
CORE_V_B0
C2325 2200pF 50V
Q2302
DMP2130L
S
1.2K
R2
R1
3.9 K
C2357 10uF 10V
1/16W
1%
CORE_V_B0
1/16W
1%
1%
D
G
+2.5V_NORMAL
OPT
20K
R2323
1/16W
PANEL_VCC
R2346
3.3K
LVDS_DISCHARGE
5V
ZD2304
CORE_V_A0/A1
R2319-*1
10.7K
1/16W 1%
CORE_V_A0/A1
R2320-*1
10.5K
1/16W 1%
L2307
C2326
C2328
1uF
10uF
10V
16V
PAGE 8
R2327-*1
P_DET_BOTH_12_24V
P_DET_BOTH_12_24V
P_DET_BOTH_12_24V
P_DET_BOTH_12_24V
C2347
0.1uF 50V
R2349-*1 100
P_DET_BOTH_24_3.5V
R2336-*1 100K
P_DET_BOTH_24_3.5V
C2356-*1
0.1uF 50V
P_DET_BOTH_24_3.5V
Power_DET
P_DET_BOTH_12_3.5V
P_DET_BOTH_12_3.5V
+12V
R2325-*1
2.7K 1%
R2326-*1
1.2K 1%
P_DET_BOTH_24_3.5V
P_DET_BOTH_24_3.5V
P_DET_ONLY_12V R2325
2.7K 1%
P_DET_ONLY_12V
R2326
1.2K 1%
+24V
+3.5V_ST
R2327
8.2K
R2328
1.5K 1%
READY R2330 0 5%
+3.5V_ST
DDR MAIN 1.5V
+3.5V_ST
L2308
R1
R2
+12V
1.5V_DCDC_TI
EP[GND]
VIN_1
1
VIN_2
2
GND_1
3
GND_2
4
THERMAL
17
IC2303-*1
TPS54319TRE
5
AGND
BOOT14PWRGD15EN16VIN_3
13
7
8
COMP
RT/CLK6VSENSE
PH_3
12
PH_2
11
PH_1
10
SS/TR
9
1.5V_DCDC_TI
1.5V_DCDC_TI
C2339 10uF 10V
R2329-*1 15K
1/16W 5%
C2344-*1
4700pF50V
C2340
0.1uF 16V
PVIN_1
PVIN_2
PGND_1
PGND_2
[EP]FIN
1
2
3
4
1.5V_DCDC_RHOM
AGND8MODE
Vout=0.8*(1+R1/R2)
C2332 10uF 16V
+5.0V normal & USB
+24V
R23 35 16 K 1 %
R23 40 16 K 1 %
R23 41150 K 1%
L2310
120-ohm
C2309 10uF 35V
OPT
C2311 10uF 35V
C2329
0.1uF 50V
1uF
25V
C23 24
[EP]
RSET2
AGND
27
28
VIN_1
1
THERMAL
VIN_2
2
VIN_3
PGND_1
PGND_2
PGND_3
C2330
0.0068uF 50V
29
3
IC2304
4
SN1302001(TPS65286RHDR)
5
6
V7V
7
MODE/SYNC
6A
9EN10
8
10K
R2339
POWER_ON/OFF2_4
COMP25RLIM26RSET1
SW_EN213SW_EN1
SW_OUT211SW_OUT1
+5V_USB_3
12
8.2K
R2328-*1
1.5K 1%
R2325-*2
2.7K 1%
R2326-*2
1.2K 1%
VDD
C2355
0.1uF 16V
P_DET_BOTH_12_3.5V
R2348 0
READY
VDD
C2356
0.1uF 50V
P_DET_BOTH_12_3.5V
10K
C2353
R2324
0.1uF
16V
1.5V_DCDC_TI
BOOT14PGD15EN16AVIN
13
12
THERMAL
11
17
3A
10
IC2303
BD9A300MUV
5
7
6
FB
ITH
9
1.5V_DCDC_RHOM
3A
C2334
OPT
2200pF
C2335
50V
100pF 50V
R2342 10K
22SS23FB24
LX_3
21
LX_2
20
LX_1
19
BST
18
SW_IN2
17
SW_IN1
16
NFAULT1
15
14
NFAULT2
USB_CTL3
LS55A
POWER
P_DET_BOTH_12_24V
R2336-*2 100K
C2356-*2
0.1uF 50V
P_DET_BOTH_12_24V
+3.5V_ST
R2350 100
R2349 100
P_DET_BOTH_12_3.5V
C2345
C2349
22uF
22uF
10V
10V
6.8K
1/16W
R2345
C2348 22uF 10V
51K
1/16W
R2352
C2350 1uF
5%
10V
100K
1/16W
R1
R2
P_DET_BOTH_12_24V
R2337 100K
IC2307
BD48K28G
3
1
R2336 100K
IC2308
BD48K28G
3
1
C2341
0.1uF
16V
SW_3
SW_2
SW_1
SS
0.01uF
R2331
330K1/16W 5%
R2329
8.2K 1/16W1%
C2336
0.047uF 25V
R2349-*2 100
VOUT
2
GND
VOUT
2
GND
POWER_ON/OFF2_2
NR5040T2R2N L2309
2.2uH
C2342
50V
C2344
2700pF50V
1.5V_DCDC_RHOM
C2343
82pF
50V
L2311
4.7uH
C2338
0.047uF 25V
5%
100K
R2344
1/16W
/USB_OCD3
R2
1%
R1
1%
R2353
Vout=0.6*(1+R1/R2)
5V:R1-36K, R2-4.8K
5.1V:R1-51K, R2-6.8K
R2338 10K OPT
C2365
0.1uF 16V
not to RESET at 8kV ESD
ST_3.5V-->3.5V
+1.5V_DDR
1%
16K
R23 32
1/1 6W
1.5V_DCDC_TI
1%
18K
R23 33
1/1 6W
C2352
C2351
10uF
22uF
10V
10V
2013.03.22
POWER_DET
24V-->3.48V 12V-->3.58V
2.5V
ZD2302
OPT
C2354 100pF 50V
+5V_NORMAL
8
31
Loading...
+ 51 hidden pages