zmonitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer' s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly or
electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person' s body are grounded
through wrist band.
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight or inverter
circuit, must disconnect the AC adapter because high
voltage appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
Good Earth Ground
such as WATER PIPE,
To Instrument's
exposed
METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
0.15µF
1.5 Kohm/10W
CONDUIT etc.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
• Replaceable batteries
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS.
REPLACE ONLY WITH THE SAME OR EQUIVALENT
TYPE.
ADVARSEL
Lithiumbatteri - Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri af samme
fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unl ess specified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motio ns wh en h andli ng u npack ag ed
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
This spec sheet is applied all of the Digital Signage Product
with LW43A chassis.
2. Specication
1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specic designation.
4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz.
5) At rst Worker must turn on the SET by using Power Only
key.
6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours.
In case of keeping module is in the circumstance of below -20
°C, it should be placed in the circumstance of above 15 °C for
3 hours.
4. MAIN PCBA Adjustments
4.1. ADC Calibration [LS55A Model Digital
Only Model: does not apply]
- An ADC calibration is not necessary because MAIN
SoC (LGExxxx) is already calibrated from IC Maker
- If it needs to adjust manually, refer to appendix.
4.2. MAC Address
4.2.1. Equipment & Condition
1) Play le: keydownload.exe
4.2.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process : DETECT → MAC_WRITE
4) Play: START
5) Check of result: Ready, Test, OK or NG
4.2.4. Communication Port connection
1) Connect : PCBA Jig → RS-232C Port == PC → RS-232C
Port
Caution) When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital
pattern 13ch and/or Cross hatch pattern 09ch), there can
some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments MAC Address
Download
1) ADC adjustment: Digital Only [does not apply]
2) EDID / DDC Download.
3) MAC Address Download
* Remark
- Above adjustment items can be also performed in
Final Assembly if needed. Adjustment items in both
PCBA and nal assembly stages can be checked by
using the INSTART Menu → ADJUST CHECK.
3.2. Final Assembly adjustment
1) White Balance adjustment
2) RS-232C functionality check
3) Factory Option setting per destination
4) Shipment mode setting (IN-STOP)
5) GND and HI-POT test
3.3. Appendix.
1) Ship-out mode
2) Service Option Default
3) Tool option menu, USB Download (S/W Update, Option,
▪ Each other connection to LAN Port of IP Hub and Jig
4.5 Serial number download
Connect Bar Code scan equipment and set by RS-232C
cable.
1) E2PROM Data Write
4.3.2. LAN inspection solution
1) LAN Port connection with PCB
2) Network setting at MENU Mode of SET (Installer Menu →
119 → 253 → Menu)
3) Setting automatic IP
4) Setting state conrmation
→ If automatic setting is nished, you conrm IP and MAC
Address.
4.4. LAN PORT INSPECTION(PING TEST)
4.4.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
4.4.2. LAN PORT inspection(PING TEST)
1) Play the LAN Port Test Program.
2) Connect each other LAN Port Jack.
3) Play Test (F9) button and conrm OK Message.
4) Remove LAN cable.
2) E2PROM Data Read
4.6 EDID/DDC Download (EDID PCM)
4.6.1 Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any necessity
of user input. It is a realization of “Plug and Play”.
4.6.2 Equipment
1) Since EDID data is embedded, EDID download JIG, HDMI
cable and D-sub are not need.
2) Adjust by using remote controller.
4.6.3 Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L (PCM) menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
→ Caution) When EDID Download, must remove HDMI / D-
1) Objective: To reduce each Panel's W/B deviation
2) How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is xed at 192, and the other two is lowered to nd
the desired value.
3) Adjustment condition : normal temperature
- Surrounding Temperature : 25 °C ± 5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity : 20 % ~ 80 %
- Before White balance adjustment, Keep power on
status, don’t power off
5.1.1.2. Adj. condition and cautionary items
1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface (80°~
100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked us-
End White Balance adjustment
(internal pattern disappears )
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f → Gain adj. completed
*(wb 00 20(Start), wb 00 2f(end)) → Off-set adj.
wb 00 ff → End white balance auto-adj.
Explantion
4) Adjust Cool modes
- Fix the one of R/G/B gain to 192 (default data) and
decrease the others. ( If G gain is adjusted over 172
and R and B gain less than 192 , Adjust is O.K.)
- If G gain is less than 172, Increase G gain by up
to 172, and then increase R gain and G gain same
amount of increasing G gain.
- If R gain or B gain is over 255, Readjust G gain less
than 172, Conform to R gain is 255 or B gain is 255
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern
: ON, OFF. Default is inner (ON). By selecting OFF, you can
adjust using RF signal in 206 Gray pattern.
▪ Adj. Map
Cool
Medium
Warm
Adj. item
R GainjG00C0
G GainjH00C0
B GainjI00C0
R Cut
G Cut
B Cut
R GainjA00C0
G GainjB00C0
B GainjC00C0
R Cut
G Cut
B Cut
R GainjD00C0
G GainjE00C0
B GainjF00C0
R Cut
G Cut
B Cut
Command
(lower caseASCII)
CMD1CMD2MINMAX
Data Range
(Hex.)
Default
(Decimal)
5.1.5. Adj. method
5.1.5.1. Auto adj. method
1) Set TV in adj. mode using POWER ON key.
2) Zero calibrate probe then place it on the center of the
Display.
3) Connect Cable.(RS-232C to USB)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sign), check adj. status pre
mode. (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
▪ W/B Adj. must begin as start command “wb 00 00” , and n-
ish as end command “wb 00 ff”, and Adj. offset if need.
5.1.6. Reference (White balance Adj. coordinate and
color temperature)
▪ Luminance : 216 Gray
▪ Standard color coordinate and temperature using CA-210 (CH14)
: [applied only LGD Module]
Mode
Cool0.271±0.0020.270±0.00213,000K-0.003
Medium0.286±0.0020.289±0.0029,300K0.0000
Warm0.313±0.0020.329±0.0026,500K0.0000
▪ Standard color coordinate and temperature using CA-210(CH 14)
– by aging time
1) ROW Direct LED models (applied only LGD Module) in LGEKR
(GUMI) And LGERS
Coordinate
xy
Temp∆uv
5.1.5.2. Manual adjustment. method
1) Set TV in Adj. mode using POWER ON.
2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10 cm of the surface.
3) Press ADJ key → EZ adjust using adj. R/C → White-Balance then press the cursor to the right(key ►). When KEY
(►) is pressed 204 Gray (80IRE) internal patterns will be
Measurement condition
EQ Off
AVL Off
Clear Voice Off
7. GND and HI-POT Test
7.1. GND & HI-POT auto-check preparation
1) Check the POWER CABLE and SIGNAL CABE insertion
condition
7.2. GND & HI-POT auto-check
1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
2) Connect the AV JACK Tester.
3) Controller (GWS103-4) on.
4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
Remove A/V CORD from A/V JACK BOX)
1) Connect the cable Assy on the set → 2) Turn on the Signage SET → 3) Press “EYE Button” on the adjustment of R/C
→ 4) Cover the “EYE Q sensor” on the front of Cable Assy
with your hands, hold it for 3 second
5) Check the sensor data on the screen, make certain that
data is below 20. If data isn’t below 20 in 3 seconds, EYE Q
sensor would be bad. You should change EYE Q sensor.
6) Uncover your hands from EYE Q sensor, hold it for 3 sec-
onds →
7) Check “Back Light(xxx)” on the screen, check data in-
crease, you should change EYE Q sensor
8.2 Pixel Sensor Inspection Manual
* Pixel Sensor Kit Parts
- 47LS55A SET / Power Cord / IR+Brightness Cable Assy /
2) Automatically detecting update le in USB Stick
- If your downloaded program version in USB Stick is
lower than that of Signage set, it didn’t work. Otherwise USB data is automatically detected.
3) Updating is staring.
4) Updating Completed, The Signage will restart automatically
5) If your Signage is turned on, check your updated version
and Tool option.(explain the Tool option, next stage)
* If downloading version is more high than your Signage
have, Signage can lost all channel data. In this case,
you have to channel recover. If all channel data is
cleared, you didn’t have a DTV/ATV test on production
line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number)
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
M14-Display In/Out
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DEBUG
+3.3V_NORMAL
SW201
JTP-1127WEM
12
3
4
For ISP
R223
3.3K
LS55A
M14 Symbol C
2013.10.21
2
36
PLACE AT JACK SIDE
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-AV In/Out
DDR3 VENDOR OPTION
+3.3V_NORMAL
4.7K
4.7K
R384
R382
OPT
OPT
R3854.7K
R3834.7K
DDR3_OPT1
DDR3_OPT2
HDMI_EN
LS55A
M14 Symbol B
+5V_ST
OPT
R389
33
IN
EN
AP2151WG-7
5
4
IC381
+5V_NORMAL
OPT
PZ1608U121-2R0TF
OUT
1
GND
2
FLG
3
2013.10.21
14.02.07
L8702
3
+5V_HDMI
36
PAGE 4
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LS55A
M14 DDR3-M0
2013.10.21
4
36
PAGE 5
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LS55A
M14 DDR3-M1
2013.10.21
5
31
PAGE 6
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
LS55A
VCC & GND
2013.10.21
6
31
+3.5V_ST
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.3V_NORMAL
RL_ON
+3.5V_ST
+12V
C2306
0.1uF
L/DIM0_MOSI
R2301
R2300
10K
50V
10K
MMBT3906(NXP)
VA23001
AMOTECH CO., LTD.
L2304
UBW2012-121F
C2307
0.1uF
16V
UBW2012-121F
L2303
5.6V
Q2300
2
5V
ZD2303
14.02.06
1
3
POWER_WAFER_18PIN
PWR ON
3.5V
3.5V
GND
24V
GND
12V
12V
GND
GND
GND
L/DIM0_MOSI
DEV_POWER_WAFER_24PIN
P2300
SMAW200-H18S5
1
1
3
3
5
5
7
7
10
9
9
10
11
12
12
11
13
14
13
14
15
16
16
15
17
18
18
17
20
19
21
22
19
23
24
25
.
SMAW200-H24S2
P2301
INV ON
2
2
PDIM#1
4
4
3.5V
6
6
PDIM#2
8
8
24V
GND
12V
24V
GND
GND
L/DIMO_VS
L/DIM0_SCLK
L2306
UBW2012-121F
C2316
0.1uF
50V
R2309
100
R2354
4.7K
OPT
L/DIM0_VS
L/DIM0_SCLK
R2310
1K
R2355
4.7K
OPT
OPT
PWM_DIM
PWM_DIM2
C2358
0.1uF
INV_CTL
50V
C2359
10uF
L2312
35V
+24V
UBW2012-121F
+3.3V - eMMC 4.41(LG1311-A0)
+3.3V_NORMAL
L2302
PZ1608U121-2R0TF
C2305
0.1uF
16V
C2300
22uF
10V
3.3V_EMMC
+1.8V - eMMC 4.51(LG1311-B0)
+3.3V_NORMAL
IC2306
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
+12V
+3.3V_NORMAL
L2300
PZ1608U121-2R0TF
C2302
C2303
10uF
0.1uF
16V
16V
R23 03
68K
1/1 6W
1%
R2304
10K
R1
R2
R23 05
22K
1/1 6W
1%
POWER_ON/OFF1
R2302
5.1K
1/16W
1%
C2304
100pF
EN
VFB
VREG5
SS
3.3V_DCDC_TI
IC2300-*1
TPS54327DDAR
1
2
3
4
THERMAL
[EP]GND
VIN
8
VBST
9
7
SW
6
GND
5
3.3V_DCDC_RHOM
3.3V_DCDC_TI
C2312-*1
3300pF
50V
50V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.