LG 47LS55A-5DB, 47LS55A-5BB Schematic
Internal Use Only
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MONITOR SIGNAGE
SERVICE MANUAL
CHASSIS :
MODEL :
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LW43A
47LS55A 47LS55A-5DB
47LS55A-5BB
MFL63725154 (1405-REV00)
Printed in KoreaP/NO :
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION ........................................................................................... 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 8
BLOCK DIAGRAM .................................................................................. 14
EXPLODED VIEW .................................................................................. 15
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
PRECAUTION
AC Volt-meter
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
zmonitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer' s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly or
electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person' s body are grounded
through wrist band.
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight or inverter
circuit, must disconnect the AC adapter because high
voltage appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
Good Earth Ground
such as WATER PIPE,
To Instrument's
exposed
METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
0.15µF
1.5 Kohm/10W
CONDUIT etc.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
• Replaceable batteries
CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS.
REPLACE ONLY WITH THE SAME OR EQUIVALENT
TYPE.
ADVARSEL
Lithiumbatteri - Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri af samme
fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unl ess specified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motio ns wh en h andli ng u npack ag ed
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
1. Application range
This specication is applied to the LW43A chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F),
CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specication and performance of each parts are followed
each drawing and specication by part number in accord-
ance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE Monitor test method followed.
2) Demanded other specication
- Safety : CE, IEC specication
- EMC : CE, IEC
4. General Specication
4.1. General Specication
No. Item Content Remark
1 HDMI Input (2EA) HDMI Rear / support D-TV&PC
resolution
2 DVI Input (1EA) DVI
3 DP Input/Output(2EA) DP Rear / support D-TV&PC
resolution
4 Audio Input (1EA) DVI Audio L/R Input
5 Speaker Output (1EA) Compatible with common speaker 10W*2Ch Output
6 IR&Brightness Sensor Input
(1EA)
7 Pixel Sensor Input (1EA) Pixel Sensor Optional
8 External USB (1EA) Picture, Music, Movie, SVC Device : Memory Stick, Mouse,
9 RS-232C Input/Output
(1EA)
10 LAN(1EA) RJ45, 100BASE-T Network Connection for Super-
11 Local Key 8 keys
IR&Brightness Sensor
Keyboard
Display Control
Sign Elite
4.2. DVI-D, HDMI, Display Port (PC) Specication
No. Item Specication Remarks
1 Supported Sync. Type Digital
2 Operating Frequency Digital
3 Resolution Digital
Only for training and service purposes
Horizontal 30 ~ 83 kHz
Vertical 56 ~ 60 Hz
Max 1920×1080 @ 60Hz
Recommend 1920×1080 @ 60Hz
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Signal Timing (Supporting Resolution)
5.1. DVI, HDMI, Display Port (PC Mode )
No. Section Pol. Dot Clock
[MHz]
1 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
V(Lines) - 59.94 525 480 10 2 33
2 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
V(Lines) + 60.317 628 600 1 4 23
3 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
V(Lines) - 60.0 806 768 3 6 29
4 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720
V(Lines) + 59.855 748 720 3 5 20
5 H(Pixels) + 85.86 47.7 1800 1366 72 144 216 1366 x 768
V(Lines) + 60 795 768 1 3 23
6 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024
V(Lines) + 60.02 1066 1024 1 3 38
7 H(Pixels) - 146.25 65.290 2240 1680 104 176 280 1680 x 1050
V(Lines) + 59.954 1089 1050 3 6 30
8 H(Pixels) + 148.5 67.5 2200 1920 88 44 88 1920 x 1080
V(Lines) + 60 1125 1080 4 5 46
Frequency
[kHz]/[Hz]
Total
Cycle
(E)
Display
(A)
Front
Porch(B)
Sync.
(D)
Back
Porch(F)
Resolution
5.2. HDMI, DisplayPort (DTV Mode ) * DVI Input dont support DTV Mode
No.
Resolution H-freq(kHz) V-freq(Hz) Proposed
1 480/60P 31.5 60 EDTV 480p
2 576/50P 31.25 50 EDTV 576p
3 720/50P 37.5 50 HDTV 720p
4 720/60P 45 60 HDTV 720p
5 1080/50i 28.1 50 HDTV 1080i 50Hz For Australian
6 1080/60i 33.75 60 HDTV 1080i 60Hz
7 1080/50P 56.25 50 HDTV 1080P 50Hz
8 1080/60P 67.5 60 HDTV 1080P 60Hz
Specication Remark
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application Range
This spec sheet is applied all of the Digital Signage Product
with LW43A chassis.
2. Specication
1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specic designation.
4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz.
5) At rst Worker must turn on the SET by using Power Only
key.
6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours.
In case of keeping module is in the circumstance of below -20
°C, it should be placed in the circumstance of above 15 °C for
3 hours.
4. MAIN PCBA Adjustments
4.1. ADC Calibration [LS55A Model Digital
Only Model: does not apply]
- An ADC calibration is not necessary because MAIN
SoC (LGExxxx) is already calibrated from IC Maker
- If it needs to adjust manually, refer to appendix.
4.2. MAC Address
4.2.1. Equipment & Condition
1) Play le: keydownload.exe
4.2.2. Communication Port connection
1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
1) Select the download items.
2) Mode check: Online Only
3) Check the test process : DETECT → MAC_WRITE
4) Play: START
5) Check of result: Ready, Test, OK or NG
4.2.4. Communication Port connection
1) Connect : PCBA Jig → RS-232C Port == PC → RS-232C
Port
Caution) When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital
pattern 13ch and/or Cross hatch pattern 09ch), there can
some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments MAC Address
Download
1) ADC adjustment: Digital Only [does not apply]
2) EDID / DDC Download.
3) MAC Address Download
* Remark
- Above adjustment items can be also performed in
Final Assembly if needed. Adjustment items in both
PCBA and nal assembly stages can be checked by
using the INSTART Menu → ADJUST CHECK.
3.2. Final Assembly adjustment
1) White Balance adjustment
2) RS-232C functionality check
3) Factory Option setting per destination
4) Shipment mode setting (IN-STOP)
5) GND and HI-POT test
3.3. Appendix.
1) Ship-out mode
2) Service Option Default
3) Tool option menu, USB Download (S/W Update, Option,
service only)
4) ISP Download (Optional)
4.2.5. Download
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.3. LAN Inspection
4.3.1. Equipment & Condition
▪ Each other connection to LAN Port of IP Hub and Jig
4.5 Serial number download
Connect Bar Code scan equipment and set by RS-232C
cable.
1) E2PROM Data Write
4.3.2. LAN inspection solution
1) LAN Port connection with PCB
2) Network setting at MENU Mode of SET (Installer Menu →
119 → 253 → Menu)
3) Setting automatic IP
4) Setting state conrmation
→ If automatic setting is nished, you conrm IP and MAC
Address.
4.4. LAN PORT INSPECTION(PING TEST)
4.4.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
4.4.2. LAN PORT inspection(PING TEST)
1) Play the LAN Port Test Program.
2) Connect each other LAN Port Jack.
3) Play Test (F9) button and conrm OK Message.
4) Remove LAN cable.
2) E2PROM Data Read
4.6 EDID/DDC Download (EDID PCM)
4.6.1 Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any necessity
of user input. It is a realization of “Plug and Play”.
4.6.2 Equipment
1) Since EDID data is embedded, EDID download JIG, HDMI
cable and D-sub are not need.
2) Adjust by using remote controller.
4.6.3 Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L (PCM) menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
→ Caution) When EDID Download, must remove HDMI / D-
sub Cable.
Only for training and service purposes
4.6.4. EDID DATA
1) DVI (Check Sum : 0x3C)
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
2) HDMI 1 (Check Sum : 0x3E, 0xA2)
Color Analyzer
Computer
Pattern Generator
※
※If Signage internal pattern is us ed, not needed
Signal Source
Probe
RS-232C
RS-232C
RS-232C
3) HDMI 2 (Check Sum : 0x3E, 0x92)
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
1) Objective: To reduce each Panel's W/B deviation
2) How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is xed at 192, and the other two is lowered to nd
the desired value.
3) Adjustment condition : normal temperature
- Surrounding Temperature : 25 °C ± 5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity : 20 % ~ 80 %
- Before White balance adjustment, Keep power on
status, don’t power off
5.1.1.2. Adj. condition and cautionary items
1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface (80°~
100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked us-
ing no signal or Full-white pattern.
4) DP (Check Sum : 0x3C, 0xA2)
5.1.2. Equipment
1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/204Gray(Model:217, Pattern:49)
* Only when internal pattern is not available
* Color Analyzer Matrix should be calibrated using CS-1000.
5.1.3. Equipment connection MAP
Only for training and service purposes
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.1.4. Adj. Command (Protocol)
▪ RS-232C Command used during auto-adjustment.
RS-232C COMMAND
[CMD ID DATA]
wb 00 00 Begin White Balance adjustment
wb 00 ff
End White Balance adjustment
(internal pattern disappears )
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f → Gain adj. completed
*(wb 00 20(Start), wb 00 2f(end)) → Off-set adj.
wb 00 ff → End white balance auto-adj.
Explantion
4) Adjust Cool modes
- Fix the one of R/G/B gain to 192 (default data) and
decrease the others. ( If G gain is adjusted over 172
and R and B gain less than 192 , Adjust is O.K.)
- If G gain is less than 172, Increase G gain by up
to 172, and then increase R gain and G gain same
amount of increasing G gain.
- If R gain or B gain is over 255, Readjust G gain less
than 172, Conform to R gain is 255 or B gain is 255
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern
: ON, OFF. Default is inner (ON). By selecting OFF, you can
adjust using RF signal in 206 Gray pattern.
▪ Adj. Map
Cool
Medium
Warm
Adj. item
R Gain j G 00 C0
G Gain j H 00 C0
B Gain j I 00 C0
R Cut
G Cut
B Cut
R Gain j A 00 C0
G Gain j B 00 C0
B Gain j C 00 C0
R Cut
G Cut
B Cut
R Gain j D 00 C0
G Gain j E 00 C0
B Gain j F 00 C0
R Cut
G Cut
B Cut
Command
(lower caseASCII)
CMD1 CMD2 MIN MAX
Data Range
(Hex.)
Default
(Decimal)
5.1.5. Adj. method
5.1.5.1. Auto adj. method
1) Set TV in adj. mode using POWER ON key.
2) Zero calibrate probe then place it on the center of the
Display.
3) Connect Cable.(RS-232C to USB)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sign), check adj. status pre
mode. (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
▪ W/B Adj. must begin as start command “wb 00 00” , and n-
ish as end command “wb 00 ff”, and Adj. offset if need.
5.1.6. Reference (White balance Adj. coordinate and
color temperature)
▪ Luminance : 216 Gray
▪ Standard color coordinate and temperature using CA-210 (CH14)
: [applied only LGD Module]
Mode
Cool 0.271±0.002 0.270±0.002 13,000K -0.003
Medium 0.286±0.002 0.289±0.002 9,300K 0.0000
Warm 0.313±0.002 0.329±0.002 6,500K 0.0000
▪ Standard color coordinate and temperature using CA-210(CH 14)
– by aging time
1) ROW Direct LED models (applied only LGD Module) in LGEKR
(GUMI) And LGERS
Coordinate
x y
Temp ∆uv
5.1.5.2. Manual adjustment. method
1) Set TV in Adj. mode using POWER ON.
2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10 cm of the surface.
3) Press ADJ key → EZ adjust using adj. R/C → White-Balance then press the cursor to the right(key ►). When KEY
(►) is pressed 204 Gray (80IRE) internal patterns will be
displayed.
Only for training and service purposes
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
2) ROW Direct LED models (applied only LGD Module) in LGEKR
(GUMI for Winter Season)
▪ Standard color coordinate and temperature using CA-
210(CH-14) – by aging time
5.3. Ship-out mode check (In-stop)
▪ After nal inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode
5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
7.3. Checkpoint
1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
2) TEST time: 1 second
3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
4) LEAKAGE CURRENT: At 0.5mArms
8. EYE Q Green Inspection
8.1 Method
[ Brightness + IR Sensor & Pixel Sensor ]
6. Audio
6.1. Audio input condition
1) Only DVI PC Input
6.2. Specication
No. Item Min Typ Max Unit Remark
Audio practical
max Output, L/R
1.
(Distortion=10%
max Output)
Speaker (8Ω
2.
Impedance)
9.0 10.0 12.0 W
8.5 8.9 9.8 Vrms
10.0 14.0 W
Measurement condition
EQ Off
AVL Off
Clear Voice Off
7. GND and HI-POT Test
7.1. GND & HI-POT auto-check preparation
1) Check the POWER CABLE and SIGNAL CABE insertion
condition
7.2. GND & HI-POT auto-check
1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
2) Connect the AV JACK Tester.
3) Controller (GWS103-4) on.
4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
Remove A/V CORD from A/V JACK BOX)
1) Connect the cable Assy on the set → 2) Turn on the Signage SET → 3) Press “EYE Button” on the adjustment of R/C
→ 4) Cover the “EYE Q sensor” on the front of Cable Assy
with your hands, hold it for 3 second
5) Check the sensor data on the screen, make certain that
data is below 20. If data isn’t below 20 in 3 seconds, EYE Q
sensor would be bad. You should change EYE Q sensor.
6) Uncover your hands from EYE Q sensor, hold it for 3 sec-
onds →
7) Check “Back Light(xxx)” on the screen, check data in-
crease, you should change EYE Q sensor
8.2 Pixel Sensor Inspection Manual
* Pixel Sensor Kit Parts
- 47LS55A SET / Power Cord / IR+Brightness Cable Assy /
Remote Control
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* Method
Power Cord Connection
IR+Brigntness Cable Connection
Pixel Sensor Cable
Connection
1
2
3
a
c
b
1) Connect the cable Assy[Power Cord] on the set.
2) Connect the cable Assy[IR+Brightness Cable] on the set.
5) As follows: the remote control operation.
a. Press " P-ONLY " on the adjustment of R/C.
3) Connect the cable Assy[Pixel Sensor Cable] on the set.
4) Turn on the Signage SET.
b. Press " EXIT " on the adjustment of R/C.
c. Press “EYE Button” on the adjustment of R/C
- Please Check the R,G,B pattern on the Screen.
- Check the sensor data on the screen
- Please check RGB Sensor-Check On the screen.
OK : Pass . NG : Fail [Re-Run]
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* USB S/W Download(Service only)
1) Put the USB Stick to the USB socket
2) Automatically detecting update le in USB Stick
- If your downloaded program version in USB Stick is
lower than that of Signage set, it didn’t work. Otherwise USB data is automatically detected.
3) Updating is staring.
4) Updating Completed, The Signage will restart automatically
5) If your Signage is turned on, check your updated version
and Tool option.(explain the Tool option, next stage)
* If downloading version is more high than your Signage
have, Signage can lost all channel data. In this case,
you have to channel recover. If all channel data is
cleared, you didn’t have a DTV/ATV test on production
line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number)
Only for training and service purposes
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
BLOCK DIAGRAM
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
400
810
IMPORTANT SAFETY NOTICE
LV1
A2
510
200
541
540
542
530
201
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
System Configuration
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Clock for M14-A0
MAIN Clock(24Mhz)
50V
10pF
C101
50V
C102
System Clock for Analog block(24Mhz)
PLL SET[1:0] : internal pull up
"00" : CPU(1200Mhz),M0 / M1 DDR(792,792 Mhz)
"01" : CPU(1056Mhz),M0 / M1 DDR(672,672 Mhz)
"10" : CPU(1056Mhz),M0 / M1 DDR(792,792 Mhz)
"11" : CPU( 960Mhz),M0 / M1 DDR(792,792 Mhz)
OP MODE[1:0]
"00" : Normal Mode
"01/10/11" : Internal Test mode
+3.3V_NORMAL
OPT
R101 3.3K
R102 3.3K
OPT
Extenal test only
+3.3V_NORMAL
BOOT MODE
"0 : EMMC
"1 : TEST MODE
3.3K
R127
OPT
3.3K
R128
BOOT_MODE0
X-TAL_1
GND_1
1
2
24MHz
4
3
10pF
GND_2
X-TAL_2
Extenal test only
OPT
R103 3.3K
R104 3.3K
OPT
OPM1
OPM0
BOOT_MODE
X101
1M
R118
R8849
560
1%
PLLSET1
PLLSET0
INSTANT_MODE0
+3.3V_NORMAL
INSTANT boot MODE
3.3K
"1 : Instant boot
"0 : normal
(internal pull down)
R8843
XTAL_IN
XTAL_OUT
INSTANT_BOOT
NVRAM
+3.5V_ST
OPT
R110
4.7K
R111
OPT
0
AT24C1024BN-SH-T
R112
OPT
NC
1
A1
2
A2
3
GND
4
R8810
IC102
NVRAM I2C SWITCH
H
CONNECTION
B0 - AL
B1 - A
SCL_NVRAM
SDA_NVRAM
EEPROM_SW
NVRAM - NEC
NVRAM - M14
+3.5V_ST
EEPROM_SW
PAGE 1
+3.3V_NORMAL
R123
OPT
10K
XTAL_IN
XTAL_OUT
BOOT_MODE
PLLSET0
PLLSET1
OPM0
OPM1
TRST_N1
TMS1
TCK1
TDO1
TDI1
R182 10K
OPT
10K
R183
10K
R184
R185 10K
SOC_RX
SOC_TX
I2C_SCL1
I2C_SDA1
I2C_SCL2
I2C_SDA2
I2C_SCL4
I2C_SDA4
33
33
EMMC_DATA[7]
EMMC_DATA[6]
EMMC_DATA[5]
EMMC_DATA[4]
EMMC_DATA[3]
EMMC_DATA[2]
EMMC_DATA[1]
EMMC_DATA[0]
R109 33
AMP
R180 33
R181 33
R178 33
SOC_RESET
C108
0.1uF
16V
Write Protection
- Low : Normal Operation
+3.5V_ST
VCC
8
7
6
5
C105
WP
0.1uF
16V
SCL
SDA
- High : Write Protection
R113 33
R114 33
SCL_NVRAM
SDA_NVRAM
FORCED_JTAG_0
Sub Micom Ready
SUB1_SCL
SUB1_SDA
T-CON/L-DIMMING
L/DIM0_VS
L/DIM0_SCLK
TCK0
TDI0
L/DIM0_MOSI
READY
R117 22
R116 22
READY
Temp Sensor
I2C_SCL5
NVRAM
PWM_DIM2
PWM_DIM
EMMC_CLK
EMMC_CMD
EMMC_RST
EMMC_DATA[0-7]
I2C_SDA5
R107
R108
C103
0.1uF
16V
C104
0.1uF
16V
SELECT
VCC
SELECT
VCC
IC103
NLASB3157DFT2G
6
ON SEMICONDUCTOR
ANALOG SWITCH
5
A
4
EAN38256201
IC104
NLASB3157DFT2G
6
ON SEMICONDUCTOR
ANALOG SWITCH
5
A
4
EAN38256201
B1
1
GND
2
B0
3
B1
1
GND
2
B0
3
R121 0
OPT
R119 0
R122 0
OPT
R115 0
I2C_SCL5
NEC_EEPROM_SCL
I2C_SDA5
NEC_EEPROM_SDA
33
R179
10K
1/16W
5%
AR101
AG21
AJ18
AG30
AG28
AG29
AH29
AJ27
AH27
AG26
AH26
AJ12
AJ13
AH12
AG12
AH23
AG22
AH11
AG11
AG10
AH22
AJ22
AH10
AJ10
AG23
AH24
B23
A23
AB8
AC8
AD8
AE8
Y7
Y6
W7
W6
W5
AH7
AJ7
AG8
AH8
AH9
AG9
AJ9
AC6
AC7
AD7
AB7
G32
G33
G31
D31
F33
F32
E32
F31
D33
D32
E31
IC101
LG1311
XIN_MAIN
XO_MAIN
PORES_N
BOOT_MODE
PLLSET0
PLLSET1
OPM0
OPM1
L_VSOUT_LD/TRST0_N
DIM0_SCLK/TMS0
DIM1_SCLK/TCK0
DIM1_MOSI/TDI0
DIM0_MOSI/TDO0
SPI_CS0
SPI_SCLK0
SPI_DO0
SPI_DI0/TRST1_N
SPI_CS1/TMS1
SPI_SCLK1/TCK1
SPI_DO1/TDO1
SPI_DI1/TDI1
EXT_INTR0
EXT_INTR1
EXT_INTR2
EXT_INTR3
UART0_RXD
UART0_TXD
UART1_RXD
UART1_TXD
UART1_RTS_N
UART1_CTS_N
SCL0
SDA0
SCL1
SDA1
SCL2
SDA2
SCL3
SDA3
SCL4
SDA4
SCL5
SDA5
PWM0
PWM1
PWM2
PWM_IN
EMMC_CLK
EMMC_CMD
EMMC_RESETN
EMMC_DATA7
EMMC_DATA6
EMMC_DATA5
EMMC_DATA4
EMMC_DATA3
EMMC_DATA2
EMMC_DATA1
EMMC_DATA0
USB2_0_DP0
USB2_0_DM0
USB2_0_TXRTUNE
USB2_1_DP0
USB2_1_DM0
USB2_1_TXRTUNE
USB3_DP0
USB3_DM0
USB3_TXP0
USB3_TXM0
USB3_RXP0
USB3_RXM0
USB3_RESREF0
USB3_DP1
USB3_DM1
USB3_TXP1
USB3_TXM1
USB3_RXP1
USB3_RXM1
USB3_RESREF1
HUB_PORT_OVER0
HUB_VBUS_CTRL0
EB_CS3
EB_CS2
EB_CS1
EB_CS0
EB_WE_N
EB_OE_N
EB_WAIT
EB_BE_N1
EB_BE_N0
CAM_CD1_N
CAM_CD2_N
CAM_CE1_N
CAM_CE2_N
CAM_IREQ_N
CAM_RESET
CAM_INPACK_N
CAM_VCCEN_N
CAM_WAIT_N
CAM_REG_N
EB_ADDR0
EB_ADDR1
EB_ADDR2
EB_ADDR3
EB_ADDR4
EB_ADDR5
EB_ADDR6
EB_ADDR7
EB_ADDR8
EB_ADDR9
EB_ADDR10
EB_ADDR11
EB_ADDR12
EB_ADDR13
EB_ADDR14
EB_ADDR15
EB_DATA0
EB_DATA1
EB_DATA2
EB_DATA3
EB_DATA4
EB_DATA5
EB_DATA6
EB_DATA7
AN9
AM9
AN8
READY
H32
J31
H33
N31
N32
P33
P32
M32
M33
P31
K33
K32
L32
L31
K31
J32
M31
W28
W29
H28
J30
J28
J29
G30
F30
H29
G29
G28
P28
P27
U28
R29
V27
T28
T29
R28
U27
N29
K30
E30
M30
N28
M28
M29
L29
K29
K28
L28
D30
F29
C32
C33
C31
B33
B32
A32
B31
A31
A30
B30
C30
C29
R1712001%
READY
R1722001%
READY
R1732001%
R1742001%
/USB_OCD3
USB3_DP
USB3_DM
USB_CTL3
USB 2.0 : 1EA
+3.3V_NORMAL
I2C
I2C PULL UP
R161
3.3K
R162
3.3K
R158
3.3K
R157
3.3K
R125
3.3K
R120
3.3K
R124
3.3K
R126
3.3K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-Peripheral
I2C_1 : AMP
I2C_2 : T-CON,L/DIMING
I2C_3 : Temp Sensor
I2C_4 : NVRAM
I2C_SDA1
I2C_SCL1
I2C_SDA2
I2C_SCL2
I2C_SDA4
I2C_SCL4
I2C_SDA5
I2C_SCL5
LOCAL DIMMING I2C CONTROL
+3.3V_NORMAL
R105
R106
3.3K
3.3K
DEBUG
DEBUG
LED_SCL
LED_SDA
P102
12507WS-04L
DEBUG
1
2
3
4
5
Jtag-0 I/F
P103
12505WS-10A00
JTAG_CPU
1
2
3
4
5
6
7
8
9
10
11
+3.3V_NORMAL
L/DIM0_VS
(TRST0_N)
TDI0
L/DIM0_MOSI
L/DIM0_SCLK
TCK0
SOC_RESET
FORCED_JTAG_0
(TDO0)
(TMS0)
LS55A
M14 Symbol A
P104
12505WS-10A00
OPT
10
11
Jtag-1 I/F
+3.3V_NORMAL
1
2
3
4
5
6
7
8
9
TRST_N1
TDI1
TDO1
TMS1
TCK1
SOC_RESET
2013.10.21
1
36
AMP_RESET_N
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LED_SDA
INSTANT_BOOT
Near AMP 14.02.12
R233
4.7K
R8840
0
C8740
1000pF
50V
14.02.10
DVDD33
14.02.11
OPT
R8837
22
14.02.11
14.02.10
14.02.10
10K
R236
14.02.11
R232
10K
R231
10K
MODEL_OPT_11
14.02.11
INV_CTL
/RST_PHY
2D/3D_CTL
SOC_NEC_TX
SOC_NEC_RX
OPC_EN
14.02.10
LED_SCL
WARM_MODE
MODEL_OPT_12
MODEL_OPT_0
PANEL_CTL
MODEL_OPT_1
10K
10K
MODEL_OPT_2
MODEL_OPT_3
MODEL_OPT_4
R230
R235
MODEL_OPT_5
MODEL_OPT_6
MODEL_OPT_7
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
14.02.10
DEBUG
14.02.10
14.02.10
R237
R8842
R214
R215
R8839
R213
R229
R228
R225 22
R226
R234
R203
R202
R201
IC101
LG1311
AH30
TP_DVB_CLK
AH32
TP_DVB_SOP
AH31
TP_DVB_VAL
AH33
TP_DVB_ERR
AM33
TP_DVB_DATA7
AL32
TP_DVB_DATA6
AL33
TP_DVB_DATA5
AK32
TP_DVB_DATA4
AK33
TP_DVB_DATA3
AK31
TP_DVB_DATA2
AJ30
TP_DVB_DATA1
AJ31
TP_DVB_DATA0
AL31
STPI0_CLK
AN32
STPI0_SOP
AM32
STPI0_VAL
AN31
STPI0_ERR
AM31
STPI0_DATA
AH28
STPI1_CLK
AJ28
STPI1_SOP
AK30
STPI1_VAL
AJ29
STPI1_ERR
AG27
STPI1_DATA
A28
TPI_CLK
B28
TPI_SOP
B29
TPI_VAL
C28
TPI_ERR
A27
TPI_DATA0
B27
TPI_DATA1
C27
TPI_DATA2
B26
TPI_DATA3
C26
TPI_DATA4
B25
TPI_DATA5
A25
TPI_DATA6
C25
TPI_DATA7
AG13
22
GPIO31
22
AJ19
GPIO30
AG14
GPIO29
AG15
GPIO28
AJ15
22
GPIO27
AH19
22
GPIO26
AH18
22
GPIO25
AG19
22
GPIO24
AH5
22
GPIO23
AJ5
22
GPIO22
AJ6
GPIO21
AH6
GPIO20
AG6
OPT
GPIO19
AG5
GPIO18
22
AF7
GPIO17
AG7
GPIO16
AG24
22
GPIO15
AH16
22
GPIO14
V29
22
GPIO13
AJ21
GPIO12
AH21
GPIO11
V28
GPIO10
AG16
22
GPIO9
AJ24
GPIO8
AH17
GPIO7
AG17
GPIO6
AH13
GPIO5
AH15
GPIO4
AG18
GPIO3
AH14
GPIO2
AJ16
GPIO1
AH20
GPIO0
TPIO_CLK
TPIO_SOP
TPIO_VAL
TPIO_ERR
TPIO_DATA0
TPIO_DATA1
TPIO_DATA2
TPIO_DATA3
TPIO_DATA4
TPIO_DATA5
TPIO_DATA6
TPIO_DATA7
EPI_SOE
EPI_MCLK
EPI_GCLK
EPI_EO
EPI_VST
TX_0N
TX_0P
TX_1N
TX_1P
TX_2N
TX_2P
TX_3N
TX_3P
TX_4N
TX_4P
TX_5N
TX_5P
TX_6N
TX_6P
TX_7N
TX_7P
TX_8N
TX_8P
TX_9N
TX_9P
TX_10N
TX_10P
TX_11N
TX_11P
TX_12N
TX_12P
TX_13N
TX_13P
TX_14N
TX_14P
TX_15N
TX_15P
TX_16N
TX_16P
TX_17N
TX_17P
TX_18N
TX_18P
TX_19N
TX_19P
TX_20N
TX_20P
TX_21N
TX_21P
TX_22N
TX_22P
TX_23N
TX_23P
TX_LOCKN
D28
E29
E28
F28
D27
E27
14.02.11
F27
E26
F26
E25
D25
F25
AA5
AB5
AA7
AA6
AB6
AK8
AL8
AK7
AL7
AM6
AN6
AK6
AL6
AK5
AL5
AN4
AN3
AM2
AM1
AM4
AM3
AL4
AL3
AK2
AK1
AK4
AK3
AJ4
AJ3
AH2
AH1
AH4
AH3
AG4
AG3
AF2
AF1
AF4
AF3
AE4
AE3
AD2
AD1
AD4
AD3
AC4
AC3
AB2
AB1
AB4
AB3
AA4
AA3
AM8
14.02.11
14.02.11
DVDD33
OPT
R8841
10K
TXB4N/TX0N
TXB4P/TX0P
TXB3N/TX1N
TXB3P/TX1P
TXBCLKN/TX2N
TXBCLKP/TX2P
TXB2N/TX3N
TXB2P/TX3P
TXB1N/TX4N
TXB1P/TX4P
TXB0N/TX5N
TXB0P/TX5P
TXD4N/TX12N
TXD4P/TX12P
TXD3N/TX13N
TXD3P/TX13P
TXDCLKN/TX14N
TXDCLKP/TX14P
TXD2N/TX15N
TXD2P/TX15P
TXD1N/TX16N
TXD1P/TX16P
TXD0N/TX17N
TXD0P/TX17P
TXA4N/TX6N
TXA4P/TX6P
TXA3N/TX7N
TXA3P/TX7P
TXACLKN/TX8N
TXACLKP/TX8P
TXA2N/TX9N
TXA2P/TX9P
TXA1N/TX10N
TXA1P/TX10P
TXA0N/TX11N
TXA0P/TX11P
TXC4N/TX18N
TXC4P/TX18P
TXC3N/TX19N
TXC3P/TX19P
TXCCLKN/TX20N
TXCCLKP/TX20P
TXC2N/TX21N
TXC2P/TX21P
TXC1N/TX22N
TXC1P/TX22P
TXC0N/TX23N
TXC0P/TX23P
+3.3V_NORMAL
BIT0_1
BIT0_0
MODEL_OPT_[0/1]
0 / 0
CHINA/HONGKONG
0 / 1
1 / 0
1 / 1
BIT1_1
R8823 10K
R8824 10K
10K
BIT1_0
R8825 10K
R8826
14.02.10
DVB
TAIWAN/COLOM
EU/CIS
ASIA/AFRICA
14.02.10
14.02.10
N/AMERICA
S/AMERCIA
MODEL_OPT_0
MODEL_OPT_1
AREA OPTION
ATSC
KOREA
JAPAN
MODEL_OPT_9
MODEL_OPT_10
MODEL_OPT_11
MODEL_OPT_12
Model Option
BIT2_1
R205 10K
BIT3_1
R207 10K
BIT4_1
R209 10K
BIT5_1
R211 10K
BIT6_1
R238 10K
BIT7_1
R240 10K
BIT11_1
R242 10K
BIT12_1
R244 10K
DDR3_DDP
MODEL_OPT_2
MODEL_OPT_3
MODEL_OPT_4
MODEL_OPT_5
14.02.10
BIT3_0
BIT2_0
14.02.12
JP
BIT4_0
BIT5_0
R206 10K
R210 10K
R208 10K
R212 10K
BACK-END OPTION
MODEL_OPT_[2/3/4/5]
0 / 0 / 0 / 0
0 / 0 / 0 / 1
0 / 0 / 1 / 0
0 / 0 / 1 / 1
0 / 1 / 0 / 0
0 / 1 / 0 / 1
0 / 1 / 1 / 0
0 / 1 / 1 / 1
1 / 0 / 0 / 0
1 / 0 / 0 / 1
1 / 0 / 1 / 0
1 / 0 / 1 / 1
1 / 1 / 0 / 0
1 / 1 / 0 / 1
1 / 1 / 1 / 0
1 / 1 / 1 / 1
TYPE
EPI FHD, 120Hz, V14 (8 lane)
EPI FHD, 120Hz, v14_32inch (6 lane)
EPI FHD, 120Hz, V13 (6 lane)
EPI FHD, 120Hz, V12 (6 lane)
EPI FHD, 60Hz, V14_32 inch (6lane)
LVDS FHD, 120Hz
LVDS FHD, 60Hz
LVDS HD, 60Hz
LVDS FHD, 60Hz, CP BOX
LVDS HD, 60Hz SMALL SMART
Vby1 FHD, 120Hz
Reserve
Reserve
Reserve
Reserve
Reserve
FHD
BIT6_0
R239 10K
BIT7_0
R241 10K
FRC
BIT11_0
BIT12_0
R243 10K
MODEL_OPT_[6/7]
0 / 0
0 / 1
1 / 0
1 / 1
PANEL TYPE
OLED,UD
R245 10K
DDR3_NON_DDP
T2/C/S2/ATV_EXT
T/C/S2/ATV_SOC
OPT
R217 10K
R221 10K
R219 10K
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
MODEL_OPT_6
MODEL_OPT_7
OPT
R220 10K
R218 10K
EU/CIS KOREA
R222 10K
AJJA JAPAN
TAIWAN/COL
T/C
T2/C PIP
T2/C T2/C
T2/C/S2
T/C
T/C
T2/C PIP
T2/C
CHINA/HONG
Default
14.02.12
ATSC PIP
ATV_SOC
ATV_EXT
PAGE 2
HIGH
DDR3MODEL_OPT_8
MODEL_OPT_11
MODEL_OPT_12
14.02.12
DDP
14.02.12
NORTH AMERICA
ATSC PIP
ATV_SOC
ATV_EXT
LOW
NON_DDP
BRAZIL
ISDB PIP
ISDB
Default
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
M14-Display In/Out
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DEBUG
+3.3V_NORMAL
SW201
JTP-1127WEM
12
3
4
For ISP
R223
3.3K
LS55A
M14 Symbol C
2013.10.21
2
36
PLACE AT JACK SIDE
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC101
LG1311
PAGE 3
Place JACK Side
OPS_L_IN
OPS_R_IN
PC_L_IN
PC_R_IN
Place SOC Side
OPS AUDIO IN
R309 27K
R310 27K
C316 4.7uF
1%
1%
R322 10K
C317 4.7uF
R323 10K
AUDIO IN
R8816
27K
1%
R8817
27K
1%
10V
1%
10V
1%
C8721 4.7uF10V
10K1%
R8818
C8722 4.7uF10V
10K
1%
R8819
14.02.07
AUAD_L_CH3_IN
AUAD_R_CH3_IN
AUAD_L_CH2_IN
AUAD_R_CH2_IN
Placed as close as possible to IC101
R37 4
51K
AUAD_L_REF
1%
R37 8
47K
1%
C313
4.7uF
10V
R38 0
51K
1%
AUAD_R_REF
R38 1
47K
1%
C353
4.7uF
10V
C354
10uF
10V
L307
120-ohm
AVDD25
AUD_MASTER_CLK
AUD_LRCH
AUD_SCK
AUD_LRCK
MAIN I2S_I/F
AVDD25
AUDIO IN
OPS AUDIO IN
50V
C335
22pF
OPT
14.02.11
14.02.11
AUAD_L_CH2_IN
AUAD_R_CH2_IN
50V
C337
33pF
OPT
R8828
R8829 68
R8830 68
14.02.11
BLM15BD121SN1
R354 0
R355 0
AUAD_L_CH3_IN
AUAD_R_CH3_IN
50V
C340
22pF
OPT
I2S_AMP
14.02.11
R8827
68
14.02.11
14.02.11
L306
READY
READY
14.02.11
14.02.11
AUAD_R_REF
AUAD_L_REF
50V
C342
22pF
OPT
R368 100
R369
14.02.11
C8724
C8725 0.1uF 16V
C8726 0.1uF 16V
C8727 0.047uF25V
C8728
C8729
C8730
C8731
C8732
C8733
C8734
C8735 0.1uF16V
C8736
68
C8737 0.047uF25V
C8738 0.047uF25V
14.02.11
L305
BLM15BD121SN1
R361 0
R362 0
R363 0
R364 0
R372 0
R376 0
C348 2.2uF
R360 33
R365 100
R366 100
R367 0
100
R386
OPT
R370
R371
C8739
C351
C352 0.1uF
0.1uF 16V
0.1uF
0.1uF16V
0.1uF16V
0.1uF16V
0.1uF16V
0.1uF16V
0.1uF16V
0.047uF25V
C301
0.1uF
16V
OPT
OPT
OPT
OPT
READY
READY
10uF 10VC347
10V
OPT
R387
OPT
OPT
0
OPT
0
0.1uF16V
0.1uF
16V
16V
16V
R388
OPT
AL27
AK26
AM27
AL26
AN27
AL25
AM25
AN23
AL22
AK21
AK22
AL24
AK23
AL23
AK24
AL21
AM23
AN25
AM21
AN21
AK16
AL16
AL19
AK19
AN19
AM19
AN17
AM17
AL17
AK17
AK20
AL20
AK18
AL18
AN15
AM15
AN11
AK11
AK10
AL10
AL11
AM11
AK29
AL29
AM29
AK27
AL30
AK28
AL28
AN29
AD5
AE5
AE7
AE6
AD6
CVBS_IN1
CVBS_IN2
CVBS_IN3
CVBS_VCM
BUF_OUT1
SC1_SID
SC1_FB
SOY1_IN
Y1_IN
PB1_IN
PR1_IN
SOY2_IN
Y2_IN
PB2_IN
PR2_IN
ADC1_COM
ADC2_COM
ADC3_COM
AVSS25_COMP_REF
AVDD25_COMP_REF
AUDA_SCART_OUTL
AUDA_SCART_OUTR
AUAD_L_CH1_IN
AUAD_R_CH1_IN
AUAD_L_CH2_IN
AUAD_R_CH2_IN
AUAD_L_CH3_IN
AUAD_R_CH3_IN
AUAD_L_CH4_IN
AUAD_R_CH4_IN
AUDA_OUTL
AUDA_OUTR
AUAD_L_REF
AUAD_R_REF
AUD_VBG_EXT
IEC958OUT
AUDCLK_OUT
DAC_LRCH
DAC_SLRCH
DAC_CLFCH
DAC_SCK
DAC_LRCK
PCMI3LRCH
PCMI3LRCK
PCMI3SCK
AUDCLK_IN
FRC_LRSYNC
AAD_ADC_SIF
AAD_ADC_SIFM
IFAGC
DMD_DAC_OUT
DMD_SIF_OUT
DMD_ADC_INP
DMD_ADC_INN
DMD_ADC_INCOM
SD_CLK
SD_CMD
SD_CD_N
SD_WP_N
SD_DATA3
SD_DATA2
SD_DATA1
SD_DATA0
RMII_REF_CLK
RMII_CRS_DV
RMII_MDIO
RMII_MDC
RMII_TXEN
RMII_TXD1
RMII_TXD0
RMII_RXD1
RMII_RXD0
HDMI_1_SCL
HDMI_1_SDA
HDMI_1_HPD
HDMI_1_5V_DET
HDMI_1_ARC
HDMI_1_RX_0
HDMI_1_RX_0B
HDMI_1_RX_1
HDMI_1_RX_1B
HDMI_1_RX_2
HDMI_1_RX_2B
HDMI_1_RX_C
HDMI_1_RX_CB
HDMI_2_SCL
HDMI_2_SDA
HDMI_2_HPD
HDMI_2_5V_DET
HDMI_2_RX_0
HDMI_2_RX_0B
HDMI_2_RX_1
HDMI_2_RX_1B
HDMI_2_RX_2
HDMI_2_RX_2B
HDMI_2_RX_C
HDMI_2_RX_CB
HDMI_3_SCL
HDMI_3_SDA
HDMI_3_HPD
HDMI_3_5V_DET
HDMI_3_RX_0
HDMI_3_RX_0B
HDMI_3_RX_1
HDMI_3_RX_1B
HDMI_3_RX_2
HDMI_3_RX_2B
HDMI_3_RX_C
HDMI_3_RX_CB
HDMI_4_SCL
HDMI_4_SDA
HDMI_4_CBUS_HPD
HDMI_4_CD_SENSE
HDMI_4_5V_DET
HDMI_4_RX_0
HDMI_4_RX_0B
HDMI_4_RX_1
HDMI_4_RX_1B
HDMI_4_RX_2
HDMI_4_RX_2B
HDMI_4_RX_C
HDMI_4_RX_CB
E22
D22
F22
F24
D24
E24
F23
E23
AK14
AK12
AL12
AK13
AL13
AM13
AN13
AL14
AK15
AE27
AF28
AE29
AF27
AE28
AF33
AF32
AE31
AE30
AD31
AD30
AF31
AF30
AD28
AD29
AC27
AD27
AC31
AC30
AB33
AB32
AA31
AA30
AD32
AD33
AB28
AB27
AB29
AC28
Y32
Y33
W31
W30
V33
V32
Y31
Y30
Y27
AA28
Y28
AA29
AA27
T31
T30
T32
T33
R31
R30
U31
U30
R327 0
R329 0
R328 0
R325 0
R324 0
R326 0
R315 33
R316 33
R375 33
R373 33
R300 33
R377 33
OPT
OPT
OPT
OPT
OPT
OPT
EPHY_REFCLK
EPHY_CRS_DV
EPHY_MDIO
EPHY_MDC
EPHY_EN
EPHY_TXD1
EPHY_TXD0
EPHY_RXD1
EPHY_RXD0
READY
READY
READY
READY
HDMI_RX0+
HDMI_RX0HDMI_RX1+
HDMI_RX1HDMI_RX2+
HDMI_RX2HDMI_CLK+
HDMI_CLK-
DDR3_OPT1
DDR3_OPT2
+5V_HDMI
R331
10
C302
1uF
10V
R33 0
5.1 K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-AV In/Out
DDR3 VENDOR OPTION
+3.3V_NORMAL
4.7K
4.7K
R384
R382
OPT
OPT
R385 4.7K
R383 4.7K
DDR3_OPT1
DDR3_OPT2
HDMI_EN
LS55A
M14 Symbol B
+5V_ST
OPT
R389
33
IN
EN
AP2151WG-7
5
4
IC381
+5V_NORMAL
OPT
PZ1608U121-2R0TF
OUT
1
GND
2
FLG
3
2013.10.21
14.02.07
L8702
3
+5V_HDMI
36
PAGE 4
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC101
LG1311
M0_DDR_VREF1
M0_DDR_VREF2
M0_DDR_U_CLKP
M0_DDR_U_CLKN
M0_DDR_D_CLKP
M0_DDR_D_CLKN
M0_DDR_RESET_N
M0_DDR_DQS_P0
M0_DDR_DQS_N0
M0_DDR_DQS_P1
M0_DDR_DQS_N1
M0_DDR_DQS_P2
M0_DDR_DQS_N2
M0_DDR_DQS_P3
M0_DDR_DQS_N3
M0_DDR_ZQCAL
M0_DDR_A0
M0_DDR_A1
M0_DDR_A2
M0_DDR_A3
M0_DDR_A4
M0_DDR_A5
M0_DDR_A6
M0_DDR_A7
M0_DDR_A8
M0_DDR_A9
M0_DDR_A10
M0_DDR_A11
M0_DDR_A12
M0_DDR_A13
M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0
M0_DDR_BA1
M0_DDR_BA2
M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN
M0_DDR_CASN
M0_DDR_WEN
M0_DDR_DM0
M0_DDR_DM1
M0_DDR_DM2
M0_DDR_DM3
M0_DDR_DQ0
M0_DDR_DQ1
M0_DDR_DQ2
M0_DDR_DQ3
M0_DDR_DQ4
M0_DDR_DQ5
M0_DDR_DQ6
M0_DDR_DQ7
M0_DDR_DQ8
M0_DDR_DQ9
M0_DDR_DQ10
M0_DDR_DQ11
M0_DDR_DQ12
M0_DDR_DQ13
M0_DDR_DQ14
M0_DDR_DQ15
M0_DDR_DQ16
M0_DDR_DQ17
M0_DDR_DQ18
M0_DDR_DQ19
M0_DDR_DQ20
M0_DDR_DQ21
M0_DDR_DQ22
M0_DDR_DQ23
M0_DDR_DQ24
M0_DDR_DQ25
M0_DDR_DQ26
M0_DDR_DQ27
M0_DDR_DQ28
M0_DDR_DQ29
M0_DDR_DQ30
M0_DDR_DQ31
VREF_M0_0
A22
A3
E13
E11
E15
E17
D8
D16
D9
E16
E9
E14
D7
D10
D11
D14
E10
E12
D17
E8
D13
C8
B8
C17
B17
D12
E19
D19
D18
E18
D15
B18
C18
B16
A16
B9
C9
B7
A7
A15
A18
A6
A9
B20
B13
C21
C14
A21
A13
B21
C13
B14
B19
C15
C20
C16
A19
B15
C19
B11
C5
C12
B4
A12
A4
B12
C4
B5
B10
C6
C11
C7
A10
B6
C10
E7
VREF_M0_1
R401 240
M0_DDR_A0
M0_DDR_A1
M0_DDR_A2
M0_DDR_A3
M0_DDR_A4
M0_DDR_A5
M0_DDR_A6
M0_DDR_A7
M0_DDR_A8
M0_DDR_A9
M0_DDR_A10
M0_DDR_A11
M0_DDR_A12
M0_DDR_A13
M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0
M0_DDR_BA1
M0_DDR_BA2
M0_U_CLK
M0_U_CLKN
M0_D_CLK
M0_D_CLKN
M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN
M0_DDR_CASN
M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS0
M0_DDR_DQS_N0
M0_DDR_DQS1
M0_DDR_DQS_N1
M0_DDR_DQS2
M0_DDR_DQS_N2
M0_DDR_DQS3
M0_DDR_DQS_N3
M0_DDR_DM0
M0_DDR_DM1
M0_DDR_DM2
M0_DDR_DM3
M0_DDR_DQ0
M0_DDR_DQ1
M0_DDR_DQ2
M0_DDR_DQ3
M0_DDR_DQ4
M0_DDR_DQ5
M0_DDR_DQ6
M0_DDR_DQ7
M0_DDR_DQ8
M0_DDR_DQ9
M0_DDR_DQ10
M0_DDR_DQ11
M0_DDR_DQ12
M0_DDR_DQ13
M0_DDR_DQ14
M0_DDR_DQ15
M0_DDR_DQ16
M0_DDR_DQ17
M0_DDR_DQ18
M0_DDR_DQ19
M0_DDR_DQ20
M0_DDR_DQ21
M0_DDR_DQ22
M0_DDR_DQ23
M0_DDR_DQ24
M0_DDR_DQ25
M0_DDR_DQ26
M0_DDR_DQ27
M0_DDR_DQ28
M0_DDR_DQ29
M0_DDR_DQ30
M0_DDR_DQ31
1%
+1.5V_DDR
+1.5V_DDR
OPT
+1.5V_DDR
+1.5V_DDR
R402
1K
1%
R403
1K
1%
R404
10K
R405
100
M0_DDR_VREFCA
R406
1K
1%
R407
1K
1%
M0_DDR_VREFDQ
R408
1K
1%
R409
1K
1%
VREF_M0_0
C401
0.1uF
16V
M0_DDR_RESET_N
M0_D_CLK
M0_D_CLKN
C402
0.1uF
16V
C403
0.1uF
16V
M0_DDR_CKE
+1.5V_DDR
R410
100
+1.5V_DDR
R411
1K
1%
R412
1K
1%
+1.5V_DDR
R413
1K
1%
R414
1K
1%
VREF_M0_1
R415
1K
1%
R416
1K
1%
R417
10K
M0_U_CLK
M0_U_CLKN
M0_1_DDR_VREFCA
C406
0.1uF
16V
M0_1_DDR_VREFDQ
C407
0.1uF
16V
C408
0.1uF
16V
M0_DDR_A0
M0_DDR_A1
M0_DDR_A2
M0_DDR_A3
M0_DDR_A4
M0_DDR_A5
M0_DDR_A6
M0_DDR_A7
M0_DDR_A8
M0_DDR_A9
M0_DDR_A10
M0_DDR_A11
M0_DDR_A12
M0_DDR_A13
M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0
M0_DDR_BA1
M0_DDR_BA2
M0_D_CLK
M0_D_CLKN
M0_DDR_CKE
M0_DDR_ODT
M0_DDR_RASN
M0_DDR_CASN
M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS0
M0_DDR_DQS_N0
M0_DDR_DQS1
M0_DDR_DQS_N1
M0_DDR_DM0
M0_DDR_DM1
M0_DDR_DQ0
M0_DDR_DQ1
M0_DDR_DQ2
M0_DDR_DQ3
M0_DDR_DQ4
M0_DDR_DQ5
M0_DDR_DQ6
M0_DDR_DQ7
M0_DDR_DQ8
M0_DDR_DQ9
M0_DDR_DQ10
M0_DDR_DQ11
M0_DDR_DQ12
M0_DDR_DQ13
M0_DDR_DQ14
M0_DDR_DQ15
IC401
H5TQ4G63AFR-PBC
DDR3
N3
P7
P3
N2
P8
P2
R8
R2
T8
R3
L7
R7
N7
T3
T7
M7
M2
N8
M3
J7
K7
K9
L2
K1
J3
K3
L3
T2
F3
G3
C7
B7
E7
D3
E3
F7
F2
F8
H3
H8
G2
H7
D7
C3
C8
C2
A7
A2
B8
A3
4Gbit
A0
(x16)
A1
DDR_512MB_HYNIX_1600_29n
A2
A3
A4
A5
A6
A7
A8
A9
A10/AP
A11
A12/BC
A13
A14
A15
BA0
BA1
BA2
CK
CK
CKE
CS
ODT
RAS
CAS
WE
RESET
DQSL
DQSL
DQSU
DQSU
DML
DMU
DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7
DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7
VREFCA
VREFDQ
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
NC_1
NC_2
NC_3
NC_4
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9
ZQ
M0_DDR_VREFCA
M0_DDR_VREFDQ
M8
H1
R418
L8
240
1%
B2
D9
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
+1.5V_DDR
IC401-*1
K4B4G1646B-HCK0
DDR_512MB_SS
N3
A0
VREFCA
P7
A1
P3
A2
N2
A3
VREFDQ
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
VDD_1
L7
A10/AP
VDD_2
R7
A11
VDD_3
N7
A12/BC
VDD_4
T3
A13
VDD_5
T7
VDD_6
A14
M7
A15
VDD_7
VDD_8
M2
BA0
VDD_9
N8
BA1
M3
BA2
VDDQ_1
J7
CK
VDDQ_2
K7
CK
VDDQ_3
K9
CKE
VDDQ_4
VDDQ_5
L2
CS
VDDQ_6
K1
ODT
VDDQ_7
J3
RAS
VDDQ_8
K3
CAS
VDDQ_9
L3
WE
NC_1
T2
RESET
NC_2
NC_3
NC_4
F3
DQSL
G3
DQSL
C7
DQSU
VSS_1
B7
DQSU
VSS_2
VSS_3
E7
DML
VSS_4
D3
DMU
VSS_5
VSS_6
E3
DQL0
VSS_7
F7
DQL1
VSS_8
F2
DQL2
VSS_9
F8
DQL3
VSS_10
H3
DQL4
VSS_11
H8
DQL5
VSS_12
G2
DQL6
H7
DQL7
VSSQ_1
D7
DQU0
VSSQ_2
C3
DQU1
VSSQ_3
C8
DQU2
VSSQ_4
C2
DQU3
VSSQ_5
A7
DQU4
VSSQ_6
A2
DQU5
VSSQ_7
B8
DQU6
VSSQ_8
A3
DQU7
VSSQ_9
C413
C414
ZQ
IC402
H5TQ4G63AFR-PBC
DDR3
N3
M0_DDR_A0
M0_DDR_A1
M0_DDR_A2
M0_DDR_A3
M0_DDR_A4
M0_DDR_A5
M0_DDR_A6
M0_DDR_A7
M0_DDR_A8
M0_DDR_A9
M0_DDR_A10
M0_DDR_A11
M0_DDR_A12
M0_DDR_A13
M0_DDR_A14
M0_DDR_A15
M0_DDR_BA0
M0_DDR_BA1
M0_DDR_BA2
M0_U_CLK
M0_U_CLKN
M0_DDR_CKE
1uF 16V
1uF 16V
M0_DDR_ODT
M0_DDR_RASN
M0_DDR_CASN
M0_DDR_WEN
M0_DDR_RESET_N
M0_DDR_DQS2
M0_DDR_DQS_N2
M0_DDR_DQS3
M0_DDR_DQS_N3
M0_DDR_DM2
M0_DDR_DM3
M0_DDR_DQ16
M0_DDR_DQ17
M0_DDR_DQ18
M0_DDR_DQ19
M0_DDR_DQ20
M0_DDR_DQ21
M0_DDR_DQ22
M0_DDR_DQ23
M0_DDR_DQ24
M0_DDR_DQ25
M0_DDR_DQ26
M0_DDR_DQ27
M0_DDR_DQ28
M0_DDR_DQ29
M0_DDR_DQ30
M0_DDR_DQ31
IC402-*1
K4B4G1646B-HCK0
DDR_512MB_SS
N3
M8
A0
VREFCA
P7
M8
H1
L8
B2
D9
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
A1
P3
A2
N2
H1
A3
VREFDQ
P8
A4
P2
A5
L8
R8
ZQ
A6
R2
A7
T8
A8
B2
R3
VDD_1
A9
D9
L7
VDD_2
A10/AP
G7
R7
VDD_3
A11
N7
K2
VDD_4
A12/BC
T3
K8
A13
VDD_5
N1
T7
VDD_6
A14
M7
N9
A15
VDD_7
R1
VDD_8
M2
R9
BA0
VDD_9
N8
BA1
M3
BA2
A1
VDDQ_1
J7
A8
CK
VDDQ_2
K7
C1
CK
VDDQ_3
K9
C9
CKE
VDDQ_4
D2
VDDQ_5
L2
E9
CS
VDDQ_6
K1
F1
ODT
VDDQ_7
J3
H2
RAS
VDDQ_8
K3
H9
CAS
VDDQ_9
L3
WE
J1
NC_1
T2
J9
RESET
NC_2
L1
NC_3
L9
NC_4
F3
DQSL
G3
DQSL
C7
A9
DQSU
VSS_1
B7
B3
DQSU
VSS_2
E1
VSS_3
E7
G8
DML
VSS_4
D3
J2
DMU
VSS_5
J8
VSS_6
E3
M1
DQL0
VSS_7
F7
M9
DQL1
VSS_8
F2
P1
DQL2
VSS_9
F8
P9
DQL3
VSS_10
H3
T1
DQL4
VSS_11
H8
T9
DQL5
VSS_12
G2
DQL6
H7
DQL7
B1
VSSQ_1
D7
B9
DQU0
VSSQ_2
C3
D1
DQU1
VSSQ_3
C8
D8
DQU2
VSSQ_4
C2
E2
DQU3
VSSQ_5
A7
E8
DQU4
VSSQ_6
A2
F9
DQU5
VSSQ_7
B8
G1
DQU6
VSSQ_8
A3
G9
DQU7
VSSQ_9
4Gbit
A0
P7
(x16)
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
M0_1_DDR_VREFCA
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
M0_1_DDR_VREFDQ
+1.5V_DDR
R419
240
1%
C429
C430
1uF 16V
1uF 16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LS55A
M14 DDR3-M0
2013.10.21
4
36
PAGE 5
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC101
LG1311
M1_DDR_VREF1
M1_DDR_VREF2
M1_DDR_U_CLKP
M1_DDR_U_CLKN
M1_DDR_D_CLKP
M1_DDR_D_CLKN
M1_DDR_RESET_N
M1_DDR_DQS_P0
M1_DDR_DQS_N0
M1_DDR_DQS_P1
M1_DDR_DQS_N1
M1_DDR_DQS_P2
M1_DDR_DQS_N2
M1_DDR_DQS_P3
M1_DDR_DQS_N3
M1_DDR_ZQCAL
M1_DDR_A0
M1_DDR_A1
M1_DDR_A2
M1_DDR_A3
M1_DDR_A4
M1_DDR_A5
M1_DDR_A6
M1_DDR_A7
M1_DDR_A8
M1_DDR_A9
M1_DDR_A10
M1_DDR_A11
M1_DDR_A12
M1_DDR_A13
M1_DDR_A14
M1_DDR_A15
M1_DDR_BA0
M1_DDR_BA1
M1_DDR_BA2
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN
M1_DDR_CASN
M1_DDR_WEN
M1_DDR_DM0
M1_DDR_DM1
M1_DDR_DM2
M1_DDR_DM3
M1_DDR_DQ0
M1_DDR_DQ1
M1_DDR_DQ2
M1_DDR_DQ3
M1_DDR_DQ4
M1_DDR_DQ5
M1_DDR_DQ6
M1_DDR_DQ7
M1_DDR_DQ8
M1_DDR_DQ9
M1_DDR_DQ10
M1_DDR_DQ11
M1_DDR_DQ12
M1_DDR_DQ13
M1_DDR_DQ14
M1_DDR_DQ15
M1_DDR_DQ16
M1_DDR_DQ17
M1_DDR_DQ18
M1_DDR_DQ19
M1_DDR_DQ20
M1_DDR_DQ21
M1_DDR_DQ22
M1_DDR_DQ23
M1_DDR_DQ24
M1_DDR_DQ25
M1_DDR_DQ26
M1_DDR_DQ27
M1_DDR_DQ28
M1_DDR_DQ29
M1_DDR_DQ30
M1_DDR_DQ31
VREF_M1_0
A2
Y1
M5
N5
K5
H5
T4
H4
R4
J5
T5
L5
U4
P4
P5
K4
R5
N4
G4
U5
L4
R3
R2
F3
F2
M4
F5
E4
F4
G5
J4
E2
E3
G2
G1
P2
P3
T2
T1
H1
E1
U1
P1
C2
K2
B3
J3
B1
K1
B2
K3
J2
D2
H3
C3
G3
D1
H2
D3
M2
V3
L3
W2
L1
W1
L2
W3
V2
N2
U3
M3
T3
N1
U2
N3
E5
R501
VREF_M1_1
M1_DDR_A0
M1_DDR_A1
M1_DDR_A2
M1_DDR_A3
M1_DDR_A4
M1_DDR_A5
M1_DDR_A6
M1_DDR_A7
M1_DDR_A8
M1_DDR_A9
M1_DDR_A10
M1_DDR_A11
M1_DDR_A12
M1_DDR_A13
M1_DDR_A14
M1_DDR_A15
M1_DDR_BA0
M1_DDR_BA1
M1_DDR_BA2
M1_U_CLK
M1_U_CLKN
M1_D_CLK
M1_D_CLKN
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN
M1_DDR_CASN
M1_DDR_WEN
M1_DDR_RESET_N
M1_DDR_DQS0
M1_DDR_DQS_N0
M1_DDR_DQS1
M1_DDR_DQS_N1
M1_DDR_DQS2
M1_DDR_DQS_N2
M1_DDR_DQS3
M1_DDR_DQS_N3
M1_DDR_DM0
M1_DDR_DM1
M1_DDR_DM2
M1_DDR_DM3
M1_DDR_DQ0
M1_DDR_DQ1
M1_DDR_DQ2
M1_DDR_DQ3
M1_DDR_DQ4
M1_DDR_DQ5
M1_DDR_DQ6
M1_DDR_DQ7
M1_DDR_DQ8
M1_DDR_DQ9
M1_DDR_DQ10
M1_DDR_DQ11
M1_DDR_DQ12
M1_DDR_DQ13
M1_DDR_DQ14
M1_DDR_DQ15
M1_DDR_DQ17
M1_DDR_DQ18
M1_DDR_DQ19
M1_DDR_DQ20
M1_DDR_DQ21
M1_DDR_DQ22
M1_DDR_DQ23
M1_DDR_DQ24
M1_DDR_DQ25
M1_DDR_DQ26
M1_DDR_DQ27
M1_DDR_DQ28
M1_DDR_DQ29
M1_DDR_DQ30
M1_DDR_DQ31
240
1%
+1.5V_DDR
+1.5V_DDR
+1.5V_DDR
+1.5V_DDR
VREF_M1_0
R508
1K
1%
R509
1K
1%
R502
10K
R503
100
M1_DDR_VREFCA
R504
1K
1%
R505
1K
1%
M1_DDR_VREFDQ
R506
1K
1%
R507
1K
1%
C501
0.1uF 16V
OPT
M1_DDR_RESET_N
M1_D_CLK
M1_D_CLKN
C502
0.1uF
16V
C503
0.1uF
16V
+1.5V_DDR
M1_DDR_CKE
+1.5V_DDR
+1.5V_DDR
VREF_M1_1
R515
1K
1%
R516
1K
1%
R510
100
M1_1_DDR_VREFCA
R511
1K
1%
C507
R512
1K
0.1uF
1%
16V
M1_1_DDR_VREFDQ
R513
1K
1%
C508
R514
1K
0.1uF
1%
16V
C506
0.1uF16V
OPT
R517
10K
M1_U_CLK
M1_U_CLKN
+1.5V_DDR
IC501
H5TQ4G63AFR-PBC
N3
M1_DDR_A0
M1_DDR_A1 M1_DDR_A1
M1_DDR_A2
M1_DDR_A3
M1_DDR_A4
M1_DDR_A5
M1_DDR_A6
M1_DDR_A7
M1_DDR_A8
M1_DDR_A9
M1_DDR_A10
M1_DDR_A11
M1_DDR_A12
M1_DDR_A13
M1_DDR_A14
M1_DDR_A15
M1_DDR_BA0
M1_DDR_BA1
M1_DDR_BA2
M1_D_CLK
M1_D_CLKN
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN
M1_DDR_CASN
M1_DDR_WEN
M1_DDR_RESET_N
M1_DDR_DQS0
M1_DDR_DQS_N0
M1_DDR_DQS1
M1_DDR_DQS_N1
M1_DDR_DM0
M1_DDR_DM1
M1_DDR_DQ0
M1_DDR_DQ1
M1_DDR_DQ2
M1_DDR_DQ3
M1_DDR_DQ4
M1_DDR_DQ5
M1_DDR_DQ6
M1_DDR_DQ7
M1_DDR_DQ8
M1_DDR_DQ9
M1_DDR_DQ10
M1_DDR_DQ11
M1_DDR_DQ12
M1_DDR_DQ13M1_DDR_DQ16
M1_DDR_DQ14
M1_DDR_DQ15
DDR3
A0
P7
4Gbit
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
VREFCA
VREFDQ
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
NC_1
NC_2
NC_3
NC_4
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9
M8
H1
L8
ZQ
B2
D9
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
M1_DDR_VREFCA
R518
+1.5V_DDR
OPT
C524
C525
OPT
0.1uF
0.1uF
16V
M1_DDR_VREFDQ
240
16V
DDR3 1.5V bypass Cap
: Place these caps near Memory
H5TQ2G63DFR-PBC
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
IC501-*1
DDR_256MB_HYNIX_1600
VREFCA
VREFDQ
ZQ
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
NC_1
NC_2
NC_3
NC_4
NC_6
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9
N3
M8
P7
P3
N2
H1
P8
P2
R8
L8
R2
T8
R3
B2
L7
D9
R7
G7
N7
K2
T3
K8
N1
M7
N9
R1
M2
R9
N8
M3
A1
J7
A8
K7
C1
K9
C9
D2
L2
E9
K1
F1
J3
H2
K3
H9
L3
J1
T2
J9
L1
L9
F3
T7
G3
C7
A9
B7
B3
E1
E7
G8
D3
J2
J8
E3
M1
F7
M9
F2
P1
F8
P9
H3
T1
H8
T9
G2
H7
B1
D7
B9
C3
D1
C8
D8
C2
E2
A7
E8
A2
F9
B8
G1
A3
G9
1_2Gbit : T7(NC_6)
4Gbit : T7(A14)
M1_DDR_A0
M1_DDR_A2
M1_DDR_A3
M1_DDR_A4
M1_DDR_A5
M1_DDR_A6
M1_DDR_A7
M1_DDR_A8
M1_DDR_A9
M1_DDR_A10
M1_DDR_A11
M1_DDR_A12
M1_DDR_A13
M1_DDR_A14
M1_DDR_A15
M1_DDR_BA0
M1_DDR_BA1
M1_DDR_BA2
M1_U_CLK
M1_U_CLKN
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_RASN
M1_DDR_CASN
M1_DDR_WEN
M1_DDR_RESET_N
M1_DDR_DQS2
M1_DDR_DQS_N2
M1_DDR_DQS3
M1_DDR_DQS_N3
M1_DDR_DM2
M1_DDR_DM3
M1_DDR_DQ16
M1_DDR_DQ17
M1_DDR_DQ18
M1_DDR_DQ19
M1_DDR_DQ20
M1_DDR_DQ21
M1_DDR_DQ22
M1_DDR_DQ23
M1_DDR_DQ24
M1_DDR_DQ25
M1_DDR_DQ26
M1_DDR_DQ27
M1_DDR_DQ28
M1_DDR_DQ29
M1_DDR_DQ30
M1_DDR_DQ31
IC502-*1
H5TQ2G63DFR-PBC
DDR_256MB_HYNIX_1600
M8
A0
VREFCA
A1
A2
H1
A3
VREFDQ
A4
A5
L8
A6
ZQ
A7
A8
B2
A9
VDD_1
D9
A10/AP
VDD_2
G7
A11
VDD_3
K2
A12/BC
VDD_4
K8
A13
VDD_5
N1
VDD_6
N9
NC_5
VDD_7
R1
VDD_8
R9
BA0
VDD_9
BA1
BA2
A1
VDDQ_1
A8
CK
VDDQ_2
C1
CK
VDDQ_3
C9
CKE
VDDQ_4
D2
VDDQ_5
E9
CS
VDDQ_6
F1
ODT
VDDQ_7
H2
RAS
VDDQ_8
H9
CAS
VDDQ_9
WE
J1
NC_1
J9
RESET
NC_2
L1
NC_3
L9
NC_4
T7
DQSL
NC_6
DQSL
A9
DQSU
VSS_1
B3
DQSU
VSS_2
E1
VSS_3
G8
DML
VSS_4
J2
DMU
VSS_5
J8
VSS_6
M1
DQL0
VSS_7
M9
DQL1
VSS_8
P1
DQL2
VSS_9
P9
DQL3
VSS_10
T1
DQL4
VSS_11
T9
DQL5
VSS_12
DQL6
DQL7
B1
VSSQ_1
B9
DQU0
VSSQ_2
D1
DQU1
VSSQ_3
D8
DQU2
VSSQ_4
E2
DQU3
VSSQ_5
E8
DQU4
VSSQ_6
F9
DQU5
VSSQ_7
G1
DQU6
VSSQ_8
G9
DQU7
VSSQ_9
IC502
H5TQ4G63AFR-PBC
N3
DDR3
A0
P7
4Gbit
A1
P3
DDR_512MB_HYNIX_1600_29n
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
T7
A14
M7
A15
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
VREFCA
VREFDQ
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9
VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
NC_1
NC_2
NC_3
NC_4
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9
ZQ
+1.5V_DDR
M8
H1
L8
B2
D9
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
M1_1_DDR_VREFCA
R519
+1.5V_DDR
0.1uF
C540
0.1uF
C541
M1_1_DDR_VREFDQ
240
16V
16V
DDR3 1.5V bypass Cap
: Place these caps near Memory
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LS55A
M14 DDR3-M1
2013.10.21
5
31
PAGE 6
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
VDD3V3_HDMI
AVDD33
C637
0.1uF
16V
+1.5V_DDR
TP5207
+1.5V_DDR
TP5208
AVDD25_C4TX
AVDD25
AVDD25_AUD
GND JIG POINT
DVDD33
JP601
AA23
AC12
AC13
AC14
AC15
AC11
AF22
AA11
AC18
AC19
AC20
AC21
AC22
AC23
AC17
AB23
L18
L21
L22
L23
M23
T11
Y23
P23
R23
T23
U23
V23
F10
F11
F12
F13
F14
F15
F16
F17
V11
W11
Y11
G19
H19
H20
F9
G6
H6
J6
K6
L6
M6
N6
P6
R6
JP602
IC101
LG1311
DVDD33_1
DVDD33_2
DVDD33_3
DVDD33_4
DVDD33_5
DVDD33_6
DVDD33_7
DVDD33_8
DVDD33_9
DVDD33_10
DVDD33_11
DVDD33_12
AVDD33_BT_USB
AVDD33_USB_1
AVDD33_USB_2
AVDD33_HDMI_1
AVDD33_HDMI_2
AVDD33_HDMI_3
AVDD33_CVBS
DVDD15_M0_1
DVDD15_M0_2
DVDD15_M0_3
DVDD15_M0_4
DVDD15_M0_5
DVDD15_M0_6
DVDD15_M0_7
DVDD15_M0_8
DVDD15_M0_9
DVDD15_M1_1
DVDD15_M1_2
DVDD15_M1_3
DVDD15_M1_4
DVDD15_M1_5
DVDD15_M1_6
DVDD15_M1_7
DVDD15_M1_8
DVDD15_M1_9
AVDD25_C4TX_1
AVDD25_C4TX_2
AVDD25_C4TX_3
AVDD25_C4TX_4
AVDD25_COMP_1
AVDD25_COMP_2
AVDD25_CVBS_1
AVDD25_CVBS_2
AVDD25_DMD
AVDD25_AAD
DVDD25_XTAL
AVDD25_DR3PLL
SP_VQPS
AVDD25_AUD
AVDD25_APLL
JP604
JP603
DVDD11_1
DVDD11_2
DVDD11_3
DVDD11_4
DVDD11_5
DVDD11_6
DVDD11_7
DVDD11_8
DVDD11_9
DVDD11_10
DVDD11_11
DVDD11_12
DVDD11_13
DVDD11_14
DVDD11_15
DVDD11_16
DVDD11_17
DVDD11_18
DVDD11_19
DVDD11_20
DVDD11_21
DVDD11_22
DVDD11_23
DVDD11_24
DVDD11_25
DVDD11_26
DVDD11_27
DVDD11_28
DVDD11_29
DVDD11_30
DVDD11_31
DVDD11_32
DVDD11_33
DVDD11_34
DVDD11_35
DVDD11_36
DVDD11_37
DVDD11_38
DVDD11_39
DVDD11_40
DVDD11_41
DVDD11_42
DVDD11_43
DVDD11_44
DVDD11_45
DVDD11_46
DVDD11_47
DVDD11_48
DVDD11_49
DVDD11_50
DVDD11_51
AVDD11_APLL
AVDD11_COMP_LLPLL
AVDD11_C4TX_1
AVDD11_C4TX_2
AVDD11_C4TX_3
AVDD11_C4TX_4
DVDD11_XTAL
DVDD11_DR3PLL
DVDD11_CVBSPLL
AVDD11_DMD_1
AVDD11_DMD_2
DVDD18_EMMC_1
DVDD18_EMMC_2
+1.1V_VDD
M20
M21
N13
N14
N15
N16
N17
N18
P20
P21
R13
R14
R15
R16
R17
R18
R19
R20
R21
T13
T20
T21
U14
U15
U16
U17
U18
U19
U20
U21
V13
V20
V21
W13
W14
W15
W16
W17
W18
W19
Y13
Y20
Y21
AA13
AA14
AA15
AA17
AA18
AA19
AA20
AA21
AB21
AB19
V12
W12
Y12
AA12
G18
H18
AF23
AF24
AF25
L26
M26
TP5209
+1.1V_VDD
AVDD11_DMD
TP5210
DVDD18_EMMC
+3.3V_Bypass Cap
+3.3V_NORMAL
PZ1608U121-2R0TF
L601
DVDD33
C601
4.7uF
10V
C604
4.7uF
10V
C607
0.1uF
16V
+2.5V_Bypass Cap
+2.5V_NORMAL
PZ1608U121-2R0TF
+2.5V_NORMAL
PZ1608U121-2R0TF
HDMI LEAKAGE Workaround in MTK A2(A0) (Default= with HDMI_LEAKAGE)
+3.3V_NORMAL
L602
4.7uF
AVDD25_AUD
L603
4.7uF
D
NTR4501NT1G
AVDD25
C602
10V
C603
10V
R602
0
1/16W
5%
R601
10K
G
Q601
4.7uF
4.7uF
OPT
PANEL_VCC
13K
S
C605
C606
R603
C608
0.1uF
16V
10V
C609
0.1uF
16V
10V
VDD3V3_HDMI
C635
0.1uF
16V
+3.3V_NORMAL
+2.5V_NORMAL
PZ1608U121-2R0TF
PZ1608U121-2R0TF
AFE 3CH Power
AVDD25_C4TX
L604
C610
4.7uF
10V
L606
4.7uF
C613
4.7uF
C614
10V
AVDD33
10V
C616
0.1uF
16V
C615
0.1uF
16V
+1.1V_VDD
C617
4.7uF
10V
+1.1V_VDD
+1.5V_Bypass Cap
+1.5V_DDR
+1.5V_DDR
+1.1V_Bypass Cap
C619
C618
4.7uF
10V
L607
PZ1608U121-2R0TF
OPT
C629
22uF
10V
OPT
C630
22uF
10V
4.7uF
10V
AVDD11_DMD
C622
4.7uF
10V
C631
0.1uF
16V
C632
0.1uF
16V
C620
4.7uF
C633
0.1uF
16V
C634
0.1uF
16V
10V
C625
0.1uF
C623
4.7uF
16V
IC101
LG1311
GND_1
GND_2
GND_3
GND_4
GND_5
GND_6
GND_7
GND_8
GND_9
GND_10
GND_11
GND_12
GND_13
GND_14
GND_15
GND_16
GND_17
GND_18
GND_19
GND_20
GND_21
GND_22
GND_23
GND_24
GND_25
GND_26
GND_27
GND_28
GND_29
GND_30
GND_31
GND_32
GND_33
GND_34
GND_35
GND_36
GND_37
GND_38
GND_39
GND_40
GND_41
GND_42
GND_43
GND_44
GND_45
GND_46
GND_47
GND_48
GND_49
GND_50
GND_51
GND_52
GND_53
GND_54
GND_55
GND_56
GND_57
GND_58
GND_59
GND_60
GND_61
GND_62
GND_63
GND_64
GND_65
GND_66
GND_67
GND_68
GND_69
GND_70
GND_71
GND_72
GND_73
GND_74
GND_75
GND_76
GND_77
GND_78
GND_79
GND_80
GND_81
GND_82
GND_83
GND_84
GND_85
GND_86
GND_87
GND_88
GND_89
GND_90
GND_91
GND_92
GND_93
GND_94
GND_95
GND_96
GND_97
GND_98
GND_99
GND_100
GND_101
GND_102
GND_103
GND_104
GND_105
GND_106
GND_107
GND_108
GND_109
GND_110
GND_111
GND_112
GND_113
@optio
GND_114
GND_115
GND_116
GND_117
GND_118
GND_119
GND_120
GND_121
GND_122
GND_123
GND_124
GND_125
GND_126
GND_127
GND_128
GND_129
GND_130
GND_131
GND_132
GND_133
GND_134
GND_135
GND_136
GND_137
GND_138
GND_139
GND_140
GND_141
GND_142
GND_143
GND_144
GND_145
GND_146
GND_147
GND_148
GND_149
GND_150
GND_151
GND_152
GND_153
GND_154
GND_155
GND_156
GND_157
GND_158
GND_159
GND_160
GND_161
GND_162
GND_163
GND_164
GND_165
GND_166
GND_167
GND_168
GND_169
GND_170
GND_171
GND_172
GND_173
GND_174
GND_175
GND_176
GND_177
GND_178
GND_179
GND_180
GND_181
GND_182
GND_183
GND_184
GND_185
GND_186
GND_187
GND_188
GND_189
GND_190
GND_191
GND_192
GND_193
GND_194
GND_195
GND_196
GND_197
GND_198
GND_199
GND_200
GND_201
GND_202
GND_203
GND_204
GND_205
GND_206
GND_207
GND_208
GND_209
GND_210
GND_211
GND_212
GND_213
GND_214
GND_215
GND_216
GND_217
GND_218
GND_219
GND_220
GND_221
GND_222
GND_223
GND_224
GND_225
GND_226
P19
P22
P26
P30
R7
R8
R11
R12
R22
R26
R27
T6
T7
T8
T12
T14
T15
T16
T17
T18
T19
T22
T26
T27
U6
U7
U8
U11
U12
U13
U22
U26
V4
V5
V6
V7
V8
V14
V15
V16
V17
V18
V19
V22
V26
V30
V31
W4
W8
W20
W21
W22
W23
W26
W27
Y2
Y3
Y4
Y8
Y14
Y15
Y16
Y17
Y18
Y19
Y22
Y26
AA8
AA16
AA22
AA26
AB11
AB12
AB13
AB14
AB15
AB16
AB17
AB18
AB20
AB22
AB26
AB30
AB31
AC16
AC26
AD26
AE26
AF6
AF8
AF9
AF10
AF11
AF12
AF13
AF14
AF15
AF16
AF17
AF18
AF19
AF20
AF21
AF26
AG20
AG25
AG31
AH25
AJ25
AK9
AK25
AL9
AL15
B22
B24
C22
C23
C626
C627
0.1uF
C628
0.1uF
16V
16V
0.1uF
10V
16V
C24
D4
D5
D6
D20
D21
E6
E20
E21
F6
F7
F8
F18
F19
F20
F21
G7
G8
G9
G10
G11
G12
G13
G14
G15
G16
G17
G20
G21
G22
G23
G24
G25
G26
G27
H7
H8
H9
H10
H11
H12
H13
H14
H15
H16
H17
H21
H22
H23
H24
H25
H26
H27
H31
J7
J8
J26
J27
K7
K8
K26
K27
L7
L8
L11
L12
L13
L14
L15
L16
L17
L19
L20
L27
M7
M8
M11
M12
M13
M14
M15
M16
M17
M18
M19
M22
M27
N7
N8
N11
N12
N19
N20
N21
N22
N23
N26
N27
N30
P7
P8
P11
P12
P13
P14
P15
P16
P17
P18
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
LS55A
VCC & GND
2013.10.21
6
31
+3.5V_ST
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.3V_NORMAL
RL_ON
+3.5V_ST
+12V
C2306
0.1uF
L/DIM0_MOSI
R2301
R2300
10K
50V
10K
MMBT3906(NXP)
VA23001
AMOTECH CO., LTD.
L2304
UBW2012-121F
C2307
0.1uF
16V
UBW2012-121F
L2303
5.6V
Q2300
2
5V
ZD2303
14.02.06
1
3
POWER_WAFER_18PIN
PWR ON
3.5V
3.5V
GND
24V
GND
12V
12V
GND
GND
GND
L/DIM0_MOSI
DEV_POWER_WAFER_24PIN
P2300
SMAW200-H18S5
1
1
3
3
5
5
7
7
10
9
9
10
11
12
12
11
13
14
13
14
15
16
16
15
17
18
18
17
20
19
21
22
19
23
24
25
.
SMAW200-H24S2
P2301
INV ON
2
2
PDIM#1
4
4
3.5V
6
6
PDIM#2
8
8
24V
GND
12V
24V
GND
GND
L/DIMO_VS
L/DIM0_SCLK
L2306
UBW2012-121F
C2316
0.1uF
50V
R2309
100
R2354
4.7K
OPT
L/DIM0_VS
L/DIM0_SCLK
R2310
1K
R2355
4.7K
OPT
OPT
PWM_DIM
PWM_DIM2
C2358
0.1uF
INV_CTL
50V
C2359
10uF
L2312
35V
+24V
UBW2012-121F
+3.3V - eMMC 4.41(LG1311-A0)
+3.3V_NORMAL
L2302
PZ1608U121-2R0TF
C2305
0.1uF
16V
C2300
22uF
10V
3.3V_EMMC
+1.8V - eMMC 4.51(LG1311-B0)
+3.3V_NORMAL
IC2306
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
+12V
+3.3V_NORMAL
L2300
PZ1608U121-2R0TF
C2302
C2303
10uF
0.1uF
16V
16V
R23 03
68K
1/1 6W
1%
R2304
10K
R1
R2
R23 05
22K
1/1 6W
1%
POWER_ON/OFF1
R2302
5.1K
1/16W
1%
C2304
100pF
EN
VFB
VREG5
SS
3.3V_DCDC_TI
IC2300-*1
TPS54327DDAR
1
2
3
4
THERMAL
[EP]GND
VIN
8
VBST
9
7
SW
6
GND
5
3.3V_DCDC_RHOM
3.3V_DCDC_TI
C2312-*1
3300pF
50V
50V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DVDD18_EMMC
R2347
1
75
1%
1/16W
R2357
C2301
10uF
33
C2310
1uF
10V
1%
1/16W
VREG
C2312
2200pF
50V
3.3V_DCDC_RHOM
R2358
BD9D320EFJ
EN
1
FB
2
3
3.3V_DCDC_RHOM
SS
4
IC2300
THERMAL
3A
10V
[EP]FIN
VIN
8
BOOT
9
7
SW
6
GND
5
Vout=0.765*(1+R1/R2)
C2308
10uF
10V
OPT
16V
0.1uF
C2313
2.5V
D2302
L2301
2uH
C2314
22uF
10V
+3.3V_NORMAL
C2315
22uF
10V
5V
ZD2300
+3.3V_NORMAL
PANEL_POWER
R8813
4.7K
OPT
OPT
R8812
ERROR_OUT
100
+12V
POWER_WAFER_24PIN_LS75A
P2302
0
PWR ON
3.5V
3.5V
R8811
24V
GND
GND
GND
GND
GND
12V
12V
GND
14.02.06
SMAW200-H24S5
1
2
3
4
5
6
7
8
10
9
11
12
13
14
15
16
17
18
20
19
21
22
23
24
25
GND
24V
24V
GND
GND
3.5V
3.5V
GND
GND
INV ON
FLOATING
PDIM
ERROR_OUT
PANEL_CTL
L2313
UBW2012-121F
R8814
10K
+2.5V
POWER_ON/OFF2_1
+3.3V_NORMAL
C2327
0.1uF
16V
R2312
10K
16V
+5V_NORMAL
PZ1608U121-2R0TF
C2337
1uF
25V
14.02.21
L8703
14.02.21
AP2132MP-2.5TRG1
C2346
0.1uF
READY
R8845
0
PG
EN
VIN
VCTRL
Vout=0.6*(1+R1/R2)
+1.1V_CORE
R2311
10K
1%
C2321
1000pF
50V
C2320
0.1uF
16V
C2319
22uF
10V
L2305
1uH
R2307 1K
R2306
2K
1/16W
5%
R2308
3.3
1/10W
C2322
470pF
50V
POWER_ON/OFF2_3
+1.1V_VDD
C2317
22uF
10V
OPT
2.5V
ZD2301
C2318
22uF
10V
SoC A0/A1 : 1.22V(R1/R2=10.7K,10.5K)
SoC B0 : 1.12V(R1/R2=9.1K10.7K)(1309016)
POWER UP SEQUENCE
3.3V->2.5V->1.5V/1.1V->5V
91K
1/1 6W
R23 15
27K
R23 13
PGOOD
VBST
NC_1
SW_1
SW_2
SW_3
SW_4
RF
1
2
EN
3
4
5
6
7
8
9
[EP]
THERMAL
TPS53513RVER
10
PGND_111PGND_212PGND_313PGND_414PGND_5
R2351
5%
1%
0.1uF
C2323
4.7
1/1 6W
16V
Vout=0.6*(1+R1/R2)
C2331
0.1uF
50V
R2314
10K
IC2302
1
2
3
4
EAN61387601
R2316
39K
1/16W
5%
29
IC2301
8A
2A
R2318
9
THERMAL
TRIP26NC_327GND128GND2
R2317
18K
B
24VO25
100K
8
7
6
5
14.02.06
C
Q2301
MMBT3904(NXP)
E
[EP]
GND
ADJ
VOUT
NC
FB
23
GND
22
MODE
21
VREG
20
VDD
19
NC_2
18
VIN_3
17
VIN_2
16
VIN_1
15
C2333
10uF
16V
R1
R2
R2321
R23 22
R2319
9.1K
R2320
10.7K
CORE_V_B0
C2325
2200pF
50V
Q2302
DMP2130L
S
1.2K
R2
R1
3.9 K
C2357
10uF
10V
1/16W
1%
CORE_V_B0
1/16W
1%
1%
D
G
+2.5V_NORMAL
OPT
20K
R2323
1/16W
PANEL_VCC
R2346
3.3K
LVDS_DISCHARGE
5V
ZD2304
CORE_V_A0/A1
R2319-*1
10.7K
1/16W
1%
CORE_V_A0/A1
R2320-*1
10.5K
1/16W
1%
L2307
C2326
C2328
1uF
10uF
10V
16V
PAGE 8
R2327-*1
P_DET_BOTH_12_24V
P_DET_BOTH_12_24V
P_DET_BOTH_12_24V
P_DET_BOTH_12_24V
C2347
0.1uF
50V
R2349-*1
100
P_DET_BOTH_24_3.5V
R2336-*1
100K
P_DET_BOTH_24_3.5V
C2356-*1
0.1uF
50V
P_DET_BOTH_24_3.5V
Power_DET
P_DET_BOTH_12_3.5V
P_DET_BOTH_12_3.5V
+12V
R2325-*1
2.7K
1%
R2326-*1
1.2K
1%
P_DET_BOTH_24_3.5V
P_DET_BOTH_24_3.5V
P_DET_ONLY_12V
R2325
2.7K
1%
P_DET_ONLY_12V
R2326
1.2K
1%
+24V
+3.5V_ST
R2327
8.2K
R2328
1.5K
1%
READY
R2330
0
5%
+3.5V_ST
DDR MAIN 1.5V
+3.5V_ST
L2308
R1
R2
+12V
1.5V_DCDC_TI
EP[GND]
VIN_1
1
VIN_2
2
GND_1
3
GND_2
4
THERMAL
17
IC2303-*1
TPS54319TRE
5
AGND
BOOT14PWRGD15EN16VIN_3
13
7
8
COMP
RT/CLK6VSENSE
PH_3
12
PH_2
11
PH_1
10
SS/TR
9
1.5V_DCDC_TI
1.5V_DCDC_TI
C2339
10uF
10V
R2329-*1
15K
1/16W
5%
C2344-*1
4700pF50V
C2340
0.1uF
16V
PVIN_1
PVIN_2
PGND_1
PGND_2
[EP]FIN
1
2
3
4
1.5V_DCDC_RHOM
AGND8MODE
Vout=0.8*(1+R1/R2)
C2332
10uF
16V
+5.0V normal & USB
+24V
R23 35 16 K 1 %
R23 40 16 K 1 %
R23 41150 K 1%
L2310
120-ohm
C2309
10uF
35V
OPT
C2311
10uF
35V
C2329
0.1uF
50V
1uF
25V
C23 24
[EP]
RSET2
AGND
27
28
VIN_1
1
THERMAL
VIN_2
2
VIN_3
PGND_1
PGND_2
PGND_3
C2330
0.0068uF
50V
29
3
IC2304
4
SN1302001(TPS65286RHDR)
5
6
V7V
7
MODE/SYNC
6A
9EN10
8
10K
R2339
POWER_ON/OFF2_4
COMP25RLIM26RSET1
SW_EN213SW_EN1
SW_OUT211SW_OUT1
+5V_USB_3
12
8.2K
R2328-*1
1.5K
1%
R2325-*2
2.7K
1%
R2326-*2
1.2K
1%
VDD
C2355
0.1uF
16V
P_DET_BOTH_12_3.5V
R2348
0
READY
VDD
C2356
0.1uF
50V
P_DET_BOTH_12_3.5V
10K
C2353
R2324
0.1uF
16V
1.5V_DCDC_TI
BOOT14PGD15EN16AVIN
13
12
THERMAL
11
17
3A
10
IC2303
BD9A300MUV
5
7
6
FB
ITH
9
1.5V_DCDC_RHOM
3A
C2334
OPT
2200pF
C2335
50V
100pF
50V
R2342
10K
22SS23FB24
LX_3
21
LX_2
20
LX_1
19
BST
18
SW_IN2
17
SW_IN1
16
NFAULT1
15
14
NFAULT2
USB_CTL3
LS55A
POWER
P_DET_BOTH_12_24V
R2336-*2
100K
C2356-*2
0.1uF
50V
P_DET_BOTH_12_24V
+3.5V_ST
R2350
100
R2349
100
P_DET_BOTH_12_3.5V
C2345
C2349
22uF
22uF
10V
10V
6.8K
1/16W
R2345
C2348
22uF
10V
51K
1/16W
R2352
C2350
1uF
5%
10V
100K
1/16W
R1
R2
P_DET_BOTH_12_24V
R2337
100K
IC2307
BD48K28G
3
1
R2336
100K
IC2308
BD48K28G
3
1
C2341
0.1uF
16V
SW_3
SW_2
SW_1
SS
0.01uF
R2331
330K1/16W 5%
R2329
8.2K
1/16W1%
C2336
0.047uF
25V
R2349-*2
100
VOUT
2
GND
VOUT
2
GND
POWER_ON/OFF2_2
NR5040T2R2N
L2309
2.2uH
C2342
50V
C2344
2700pF50V
1.5V_DCDC_RHOM
C2343
82pF
50V
L2311
4.7uH
C2338
0.047uF
25V
5%
100K
R2344
1/16W
/USB_OCD3
R2
1%
R1
1%
R2353
Vout=0.6*(1+R1/R2)
5V:R1-36K, R2-4.8K
5.1V:R1-51K, R2-6.8K
R2338
10K
OPT
C2365
0.1uF
16V
not to RESET at 8kV ESD
ST_3.5V-->3.5V
+1.5V_DDR
1%
16K
R23 32
1/1 6W
1.5V_DCDC_TI
1%
18K
R23 33
1/1 6W
C2352
C2351
10uF
22uF
10V
10V
2013.03.22
POWER_DET
24V-->3.48V
12V-->3.58V
2.5V
ZD2302
OPT
C2354
100pF
50V
+5V_NORMAL
8
31
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