Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to LA32B Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
▪ ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate RGB
deviation.
▪ ADC adjustment is OTP (Auto ADC)
4.2.5. EDID DATA
4.2.5.1. North America (PCM)
4.2.5.1.1. FHD Model
■ HDMI 1-FHD-8BIT (C/S : E808)
EDID Block 0, Bytes 0-127 [00H-7FH]
4.2. EDID Download
4.2.1. Overview
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
(1) Since EDID data is embedded, EDID download JIG, HDMI
cable is not need.
(2) Adjust by using remote controller
4.2.3. Download method (using DFT)
※ PC(for communication through RS-232C), UART baud rate:
115200 bps
Command : aa 00 00 (Start Factory mode)
Command : ae 00 10 (Download All EDID)
Command : aa 00 90 (End of Factory mode)
4.2.4. Download method (using Service Remocon)
(1) Press Adj. key on the Adj. R/C.
(2) Select EDID D/L menu.
(3) By pressing Enter key, EDID download will begin
(4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
(5) If Download is failure, Re-try downloads.
※Caution : Wh en EDID Download, must remove HDMI
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 ºC
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
※ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
5.1.5.2. Manual adj. method
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 204 Gray(80IRE) internal
pattern will be displayed)
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
※ CASE
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
► How to adjust
(1) Fix G gain at least 172
Adjust R, B Gain (In Case of Mostly Blue Gain Saturation)
(2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically
6.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
* USB S/W Download (option, Service only)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
7.2. Specification
NoItemMinTypMaxUnitRemark
1Audio practical
max Output, L/R
(Distortion=10%
max Output)
9.0
8.5
10.9
9.3
12.0
9.8WVrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker
(8Ω Impedance)
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In thi s case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
※After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TP for CI slot
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORDPCM_A[11]
/PCM_IOWRCI_TS_DATA[1]
/PCM_CE
/PCM_IRQA
/PCM_CD
/PCM_WAIT
PCM_RST
PCM_5V_CTL
CI_DET
TP for S2
PCM_D[0]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[12]
PCM_A[13]
PCM_A[14]
TP for FE_TS_DATA
CI_TS_CLK
CI_TS_VAL
CI_TS_SYNC
CI_TS_DATA[2]
CI_TS_DATA[3]
CI_TS_DATA[4]
CI_TS_DATA[5]
CI_TS_DATA[6]
CI_TS_DATA[7]
TP for SCART
SCART1_MUTE
SC1_IDPCM_D[1]
SC1_FB
SC1_SOG_INCI_TS_DATA[0]
DTV/MNT_VOUT
SCART1_Lout
SCART1_Rout
SC1_CVBS_IN
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for Headphone
HP_LOUT
HP_ROUT
SIDE_HP_MUTE
HP_DET
S2_RESET
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
TP_NON_EN
2012.07.02
3
Page 26
L13 POWER BLOCK (POWER DETECT 2)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
Power_PD2
2012/09/19
4
Page 27
IR/LED and Control
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
+3.5V_ST
CONTROL_NO_FILTER
R611
0
CONTROL_FILTER
L601
BLM18PG121SN1D
CONTROL_FILTER
L602
BLM18PG121SN1D
CONTROL_NO_FILTER
R612
0
CONTROL_FILTER
C609
0.1uF
16V
+3.5V_ST
L600
BLM18PG121SN1D
C602
0.1uF
16V
CONTROL_FILTER
C608
0.1uF
16V
C603
1000pF
50V
LED_R/BUZZ
C604
100pF
P600
12507WR-08L
1
2
3
R610
1.8K
OPT
C607
0.1uF
16V
50V
4
5
6
7
8
9
R603
R602
R600
KEY1
KEY2
IR
100
R601
100
10K
10K
1%
1%
R607
3.3K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
IR/CONTROL
2012/07/18
6
Page 28
USB (SIDE)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
JK700
1234
USB DOWN STR EAM
3AU 04S-3 05-Z C-(LG )
5
C700
22uF
10V
D700
RCLAMP0502BA
OPT
+5V_USB
SIDE_USB1_DM
SIDE_USB1_DP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
USB
12/06/20
7
Page 29
HDMI (REAR 1 / SIDE 1 MHL)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
SHIELD
20
EAG59023302
JK801
CEC
HDMI_CEC
5V_HDMI_2
R822
2.7K
+5V_Normal
R823
2.7K
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A2CA1
MMBD6100
D822
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_2
R826
1K
R803
1.8K
VA801
ESD_HDMI1_VARISTOR
R820
100
DDC_SDA_2
DDC_SCL_2
5V_DET_HDMI_2
VA802
3.3K
ESD_HDMI
R801
D801
ESD_HDMI1_VARISTOR
CEC_REMOTE_S7
5V_HDMI_4
R824
2.7K
+5V_Normal
A2CA1
MMBD6100
D824
R825
2.7K
MMBT3904(NXP)
Q801
R8050
HDMI1_ARC
VA801-*1
1uF
10V
ESD_HDMI1_CAP
D801-*1
1uF
10V
ESD_HDMI1_CAP
+3.5V_ST
DDC_SDA_4
DDC_SCL_4
C
E
ESD_HDMI
A2CA1
MMBD6100
D825
R807
10K
B
VA803
R817
10K
VA804
ESD_HDMI
1
2
3
4
5
ESD_HDMI_SEMTECH
1
2
3
4
5
ESD_HDMI_SEMTECH
R832 100
R833 100
D826
RCLAMP0524PA
10
9
8
7
6
D827
RCLAMP0524PA
10
9
8
7
6
TMDS_CH1-
TMDS_CH1+
GND_1
TMDS_CH2-
TMDS_CH2+
TMDS_CH1-
TMDS_CH1+
GND_1
TMDS_CH2-
TMDS_CH2+
D826-*1
IP4283CZ10-TBA
1
2
3
4
5
ESD_HDMI_NXP
D828-*1
IP4283CZ10-TBA
1
2
3
4
5
ESD_HDMI_NXP
SIDE_HDMI (MHL)
5V_HDMI_4
GND
BODY_SHIELD
20
HP_DET
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
19
18
17
16
15
14
13
12
11
10
EAG62611204
9
8
7
6
5
4
3
2
1
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R819
1.8K
VA805
ESD_HDMI
JK803
D827-*1
IP4283CZ10-TBA
TMDS_CH1-
NC_4
10
TMDS_CH1+
NC_3
9
GND_1
GND_2
8
TMDS_CH2-
NC_2
7
TMDS_CH2+
NC_1
6
10
9
8
7
6
NC_4
NC_3
GND_2
NC_2
NC_1
ESD_HDMI_NXP
IP4283CZ10-TBA
TMDS_CH1-
TMDS_CH1+
GND_1
TMDS_CH2-
TMDS_CH2+
ESD_HDMI_NXP
1
2
3
4
5
D829-*1
1
2
3
4
5
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
MHL OCP
AVDD5V_MHL
R809
10
5V_HDMI_4
C809
10uF
10V
D800
MBR230LSFT1G
30V
100K
OPT
R808
+3.3V_Normal
R806
/MHL_OCP_DET
R804
0
10K
OPT
D811
OUT_3
OUT_2
OUT_1
R818
OC
5V_DET_HDMI_4
VA806
ESD_HDMI
3.3K
D812
5.6V
IC802
BD82020FVJ
8
7
6
5
OPT
R810
0
R830 100
GND
1
IN_1
2
IN_2
3
EN
4
VA807
ESD_HDMI
1
2
3
4
5
ESD_HDMI_SEMTECH
1
2
3
4
5
ESD_HDMI_SEMTECH
C801
0.047uF
25V
+5V_Normal
R827
20K
D828
RCLAMP0524PA
10
9
8
7
6
D829
RCLAMP0524PA
10
9
8
7
6
+3.5V_ST
R811
OPT
B
C802
0.1uF
C
Q804
B
R813
10K
C
E
R834 100
R835 100
VA808
ESD_HDMI
10K
R812
10K
C
Q802
OPT
E
R802
0
R821
10K
E
B
Q805
B
OPT
+3.3V_Normal
R814
2.7K
C
E
E
C
B
Q806
Q803
OPT
R831
300K
R815
10K
R816
10K
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
MHL_CD_SENSE
/VBUS_EN
(Active Low)
MHL_OCP_EN
(Active High)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
2012/11/07
HDMI_R1_S18
Page 30
SPDIF
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF_OUT
+3.3V_Normal
C1001
0.1uF
16V
SPDIF-JACK-FOXCONN
2F01TC1-CLM97-4F
GND
VCC
VIN
C1002
100pF
50V
JK1001
1
2
3
SPDIF-JACK-SOLTEAM
JK1001-*1
JST1223-001
GND
Fiber Optic
1
VCC
2
Fib er Op tic
4
SHI ELD
VINPUT
3
4
FIX_POLE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
SPDIF
12/06/12
10
Page 31
LVDS (NON EU)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[51Pin LVDS Connector]
(For FHD 60Hz)
FHD
P1100
FI-RE51S-HF-J-R1500
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
+3.3V_Normal
R11110
NON_AUO/CMI_39inch
NON_AUO39inch
R11120
R11130
NON_AUO39inch
LVDS_SEL
OPT
R1100
3.3K
OPT
R1101
10K
PANEL_VCC
FHD
L1100
120
CIS21J121
FHD
C1100
0.1uF
16V
FOR FHD REVERSE(10bit)
Change in S7LR
MIRROR
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-RXBCK-
RXB1+
RXB1-
RXB0+
RXB0-
Pol-change
RXA0+
RXA0-
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXA4+
RXA4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXB3+
RXB3-
RXB4+
RXB4-
FOR FHD REVERSE(8bit)
Change in S7LR
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
MIRROR
Pol-change
RXA4+
RXA4-
RXA0+
RXA0-
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXB4+
RXB4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXBCK-
RXB3+
RXB3-
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
Shift
RXA4-
RXA4+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-RXACK-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXB4-
RXB4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
HD
P1101
FF10001-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
LVDS_SEL
+3.3V_Normal
OPT
R1103
3.3K
OPT
R1104
10K
EU pin assign is different from NON EU.
Because of position of HD wafer.
PANEL_VCC
HD
L1101
120
CIS21J121
HD
C1101
0.1uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
LVDS_NON_EU
2012/09/19
11
Page 32
GLOBAL tuner block except EU and China
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
RF_SWITCH_CTL
Pull-up can’t be applied
because of MODEL_OPT_2
TU3700
TU3702
TDSH-G501D(B)
TUNER_ISOLATOR_DVB_1INPUT_H
NC
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBS
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
B1
B1
A2
B2
B2
A1
A1
A2
close to TUNER
R3705 0
C3701
0.1uF
16V
OPT
TDSS-G201D
B1
B1
TUNER_OPT
12
SHIELD
1
2
3
4
5
6
7
8
9
10
11
A1
NC_1
RESET
SCL
SDA
+B1[3.3V]
NC_2
0.1uF 16V
+B2[1.8V]
NC_3
IF_AGC
DIF[P]
DIF[N]
A1
TU_GND_A
C3702
OPT
close to TUNER
R3732
100
+3.3V_TU
R3733
100K
C3710
0.1uF
16V
HALF_NIM/IF_FILTER
R3760-*1
10
R37610
HALF_NIM/IF_NON_FILTER
R37600
HALF_NIM/IF_NON_FILTER
Close to the tuner
TUNER_RESET
HALF_NIM/IF_FILTER
R3761-*1
10
C3711
18pF
50V
C3713
18pF
50V
R373533
R373633
LNA_CTRL_1
LNA_CTRL_2
+3.3V_TU
R3740
1.8K
TU_IIC_ATSC_1.8K
OPT
C3742
20pF
50V
OPT
C3743
20pF
50V
R3741
1.8K
TU_IIC_ATSC_1.8K
IF_P_MSTAR
IF_N_MSTAR
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
R3740-*1
1K
TU_IIC_NON_ATSC_1K
R3741-*1
1K
TU_IIC_NON_ATSC_1K
TU_SCL
TU_SDA
R3758
82
OPT
R3784
0
OPT
+3.3V_TU
TU_SIF
TU_CVBS
BR_RESET_DEMOD
FE_TS_SYNC
FE_TS_VAL_ERR
FE_TS_CLK
FE_TS_DATA[0]
FE_AGC_SPEED_CTL
IF_AGC_SEL
FE_BOOSTER_CTL
LNA2_CTL
DEMOD_SCL
DEMOD_SDA
GND seperation for ASIS tuner
TU_GND_A
R3714
R3715
NON_ASIA
0
0
NON_ASIA
TUNER MULTI-OPTION
TU3700-*1
TDSS-H501F(B)
TUNER_ATSC
1
2
3
4
5
6
7
8
9
10
X
11
A1
B1
12
SHIELD
NC_1
RESET
SCL
SDA
+B1[3.3V]
NC_2
+B2[1.8]
NC_3
IF_AGC
DIF[P]
DIF[N]
A1
TU_GND_A
TW_FE_LNA FILTER_SETTING
Frequence
54MHz~350MHz
350Hz~450MHz
450Hz~870MHz
CTRL_1 CTRL_2
1
0
0
0
0
1
Filter_Type
LPF
Through
HPF
+3.3V_TU
CHANGE TO
6.3V 2012 X5R
C3723
22uF
6.3V
Size change,0929
L3703
CIS21J121
C3725
0.1uF
16V
+3.3V_Normal
C3715
22uF
6.3V
CHANGE TO
6.3V 2012 X5R
C3737
100pF
50V
C3727
0.1uF
16V
C3738
0.1uF
16V
+1.8V_TU
C3716
0.1uF
16V
close to the tuner pin, add,09029
R3704 100
should be guarded by ground
+3.3V_TU
C3717
0.1uF
16V
C3707
100pF
50V
IF_AGC_MAIN
IC3703
AP1117E18G-13
3
IN1ADJ/GND
OUT
2
C3708
0.1uF
16V
+1.8V_TU
C3740
0.1uF
16V
R3766
1
C3741
10uF
10V
85C
C3741-*1
10uF 10V
CAP_X7R_MP
CAP_10uF_X5R
CHANGE TO
10UF 10V X5R
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
TUNER_NON_EU
2012.06.21
14
Page 33
COMPONENT1 & AV(COMMON), AV2
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
COMP_AV1/2
JK1701
PPJ248-01
[RD3]E-LUG
7C
[RD3]C-SPRING
6C
D1700
5.6V
AV2_LR_ZENER
R1700
470K
AV2
C1701
1000pF
50V
OPT
R1716
10K
AV2
R1718
12K
AV2
AV2_R_IN
AV2
COMPONENT
&
AV1
COMP_AV1
JK1702
PPJ245-01
[RD2]E-LUG
7E
[RD2]C-SPRING
6E
[RD2]CONTACT
4E
[WH]C-SPRING
5D
[RD1]CONTACT
4C
[RD1]C-SPRING
6C
[RD1]E-LUG-S
8C
[RD3]CONTACT
4C
[WH2]C-SPRING
5B
[YL]CONTACT
4A
[YL]C-SPRING
6A
[YL]E-LUG
7A
[RD2]E-LUG
7H
[RD2]C-SPRING
6H
[RD2]CONTACT
4H
[WH1]C-SPRING
5G
[RD1]CONTACT
4F
[RD1]C-SPRING
6F
[RD1]E-LUG-S
8F
AV2_CVBS_ZENER_ROHM
COMP_Pr_ZENER_ROHM
D1707
D1701
5.6V
AV2_LR_ZENER
D1702
5.6V
OPT
D1713
AV2_CVBS_ZENER_ROHM
D1714
D1704
5.6V
COMP_LR_ZENER
D1705
5.6V
COMP_LR_ZENER
D1706
5.6V
OPT
D1703
COMP_Pr_ZENER_ROHM
R1703
470K
R1704
470K
+3.3V_Normal
R1709
10K
R1705
75
R1701
470K
AV2
+3.3V_Normal
R1708
10K
AV2
R1712
1K
R17111K
R1702
75
AV2
C1704
1000pF
50V
OPT
C1705
1000pF
50V
OPT
R1717
10K
AV2
C1702
1000pF
50V
OPT
C1703
47pF
50V
AV2
COMP2_DET
AV2_CVBS_DET
AV2
R1714
10K
R1715
10K
R1720
12K
R1721
12K
R1719
12K
AV2
AV2_L_IN
AV2_CVBS_IN
COMP2_R_IN
COMP2_L_IN
COMP2_Pr+
D1714-*1
AV2_CVBS_ZENER_KEC
D1707-*1
COMP_Pr_ZENER_KEC
D1713-*1
AV2_CVBS_ZENER_KEC
D1703-*1
COMP_Pr_ZENER_KEC
[BL]C-SPRING
5B
[GN]CONTACT
4A
[GN]C-SPRING
6A
[GN]E-LUG
7A
[BL]C-SPRING
5E
[GN]CONTACT
4D
[GN]C-SPRING
6D
[GN]E-LUG
7D
D1710
COMP_Pb_ZENER_ROHM
D1712
COMP_Y_ZENER_ROHM
D1708
COMP_Pb_ZENER_ROHM
D1709
5.6V
OPT
D1711
COMP_Y_ZENER_ROHM
R1706
75
R1707
75
+3.3V_Normal
R1710
10K
CVBS_TEST
R1723
75
+3.3V_Normal
R1713
1K
COMP2_Pb+
D1710-*1
COMP_Pb_ZENER_KEC
AV_CVBS_DET
R1722
0
CVBS_TEST
IC1700
MM1756DURE
VCC
6
PS
5
OUT
4
IN
1
GND
2
BIAS
3
COMP2_Y+/AV_CVBS_IN
CVBS_TEST
C1706
0.1uF
CVBS_TEST
4.7uF
C1708
C1707
0.1uF
CVBS_TEST
D1712-*1
COMP_Y_ZENER_KEC
DTV/MNT_VOUT
D1708-*1
COMP_Pb_ZENER_KEC
D1711-*1
COMP_Y_ZENER_KEC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
REAR_NON_EU_L
2012.08.14NC4_S7LRM
17
Page 34
ETHERNET
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
* H/W option : ETHERNET
JK2100-*1
RJ45VT-01SN002
JK2100
XRJV-01V-0-D12-080
+2.5V_Normal
ETHERNET
L2101
BLM18PG121SN1D
1
1
2
2
3
3
ETHERNET_XML_EMI
4
4
5
5
6
6
7
7
8
8
9
9
1
2
3
ETHERNET_XMULTIPLE
4
5
6
7
8
9
9
ETHERNET
C2104
0.01uF
50V
ETHERNET
ETHERNET
ETHERNET
ETHERNET
R2101
49.9
R2102
49.9
R2103
49.9
R2104
49.9
C2101
0.1uF
ETHERNET
C2102
0.1uF
ETHERNET
EPHY_TP
EPHY_TN
EPHY_RP
EPHY_RN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
LAN
2012/06/21
21
Page 35
AUDIO AMP(STA380BWEF)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
2012/08/29
AMP_STA380BWEF34
Page 36
MSTART DEBUG_4PIN
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
MSTAR_DEBUG_4P
P3900
12505WS-04A00
5
JP_GND2
JP_GND3
1
2
3
4
RGB_DDC_SCL
RGB_DDC_SDA
JP_GND1
JP_GND4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
2012/06/20
MSTAR DEBUG_4PIN39
Page 37
RS-232C
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
PM_TXD
PM_RXD
R4001
100
R4000
100
+3.5V_ST
RS232C_DEBUG_4P
VCC
PM_RXD
GND
RM_TXD
P4000
12507WS-04L
1
2
3
4
5
GND
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
RS232C_4P_OS
2012/06/20
40
Page 38
/F_RB
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
/PF_OE
/PF_CE0
/PF_CE1
PF_ALE
/PF_WE
/PF_WP
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
R/B
RE
CE
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
CLE
ALE
WE
WP
NC_11
NC_12
NC_13
NC_14
NC_15
DIMMING
NAND FLASH MEMORY
OS
AR103
22
AR104
22
OS
NAND_FLASH_2G_HYNIX
EAN60708702
IC102-*1
H27U2G8F2CTR
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
PWM_DIM
EEPROM
M24256-BRMN6TP
E0
1
E1
2
E2
3
VSS
4
NVRAM_ST
IC104
A0’h
+3.3V_Normal
OS
R102
3.3K
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
OPT
C111
2.2uF
VCC
8
WC
7
SCL
6
SDA
5
R156
R157
C105
0.1uF
NC_29
NC_28
NC_27
NC_26
I/O7
I/O6
I/O5
I/O4
NC_25
NC_24
NC_23
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
OPT
R105
1K
OS
R106
1K
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
RY/BY
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
CLE
ALE
NC_11
NC_12
NC_13
NC_14
NC_15
OPT
10K
100
+3.3V_Normal
C106
C104
8pF
8pF
OPT
OPT
OS
R107
1K
OPT
R108
C101
1K
0.1uF
NAND_FLASH_1G_TOSHIBA
TC58NVG0S3ETA0BBBH
1
2
3
4
5
6
7
RE
8
CE
9
10
11
12
13
14
15
16
17
WE
18
WP
19
20
21
22
23
24
R11122
R11222
+3.3V_Normal
OS
R109
3.9K
OS
EAN61508001
IC102-*2
PWM0
PWM2
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
R/B
RE
CE
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
CLE
ALE
WE
WP
NC_11
NC_12
NC_13
NC_14
NC_15
I2C_SCL
I2C_SDA
IC102
H27U1G8F2CTR-BC
1
NAND_FLASH_1G_HYNIX
EAN35669103
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O8
44
I/O7
43
I/O6
42
I/O5
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O4
32
I/O3
31
I/O2
30
I/O1
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
I2C
NVRAM_RENESAS
IC104-*1
R1EX24256BSAS0A
A0
1
A1
2
A2
3
VSS
4
EAN62389501
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
RY/BY
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
1
2
3
4
5
6
7
RE
8
CE
9
10
11
12
13
14
15
CLE
16
ALE
17
WE
18
WP
19
20
21
22
23
24
R140
1K
VCC
8
WP
7
SCL
6
SDA
5
+3.3V_Normal
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
NC_23
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
EAN60991001
IC102-*3
TC58NVG1S3ETA00
+3.3V_Normal
R144
2.2K
NON_OS_512k_ST
IC104-*2
M24512-RMN6TP
E0
1
E1
2
E2
3
VSS
4
CAP_10uF_X5R_OS
0.1uF
R145
2.2K
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NAND_FLASH_2G_TOSHIBA
R141
1K
EAN43349003
AR101
C102 10uF
C103
OS
AR102
OS
22
10V
CHANGE TO
10UF 10V X5R
OS
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O8
44
I/O7
43
I/O6
42
I/O5
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O4
32
I/O3
31
I/O2
30
I/O1
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
VCC
8
WC
7
SCL
6
SDA
5
PCM_A[7]
PCM_A[6]
PCM_A[5]
PCM_A[4]
85C
PCM_A[3]
PCM_A[2]
PCM_A[1]
PCM_A[0]
22
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
R/B
RE
CE
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
CLE
ALE
WE
WP
NC_11
NC_12
NC_13
NC_14
NC_15
AMP_SDA
AMP_SCL
I2C_SDA
I2C_SCL
NON_OS_512k_ATMEL
AT24C512C-SSHD-T
A0
A1
A2
GND
PCM_A[0-7]
C102-*1
10uF 10V
CAP_10uF_X7R_OS
NAND_FLASH_1G_SS
EAN61857001
IC102-*4
K9F1G08U0D-SCB0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
IC104-*3
1
2
3
4
EAN43349004
<CHIP Config(LED_R/BUZZ)>
Boot from SPI CS1N(EXT_FLASH) 1’b0
Boot from SPI_CS0N(INT_FLASH) 1’b1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
2012/09/19
MAIN1_NON_EU51
Page 39
MODEL OPTION
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
RS232_PHONE
RS232_PHONE
RS232_PHONE
RS232_PHONE
C5302
0.1uF
C5303
0.1uF
C5304
0.1uF
C5305
0.1uF
DOUT2
RIN2
C1+
C1-
C2+
C2-
V+
V-
RS232_PHONE
IC5301
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
HEAD_PHONE
R5309
RS232_PHONE
R5302
+3.5V_ST
OPT
D5301
ADUC 20S 02 010L
RS232_PHONE
C5306
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
PM_RXD
PM_TXD
20V
HP_LOUT
HP_ROUT
HP_DET
RS232_PHONE
OPT
D5302
ADUC 20S 02 010L
20V
HEAD_PHONE
C5307
10uF
16V
HEAD_PHONE
C5308
10uF
16V
+3.3V_Normal
R5306
10K
R5305
1K
HEAD_PHONE
100
R5301
100
HEAD_PHONE
OPT
C5309
1000pF
50V
OPT
C5310
1000pF
50V
HEAD_PHONE
R5307
1K
HEAD_PHONE
R5308
1K
0
RS232_PHONE
6M6
1M1
3M3_DETECT
4M4
5M5_GND
KJA-PH-1-0177
JK5301
HEAD_PHONE
JK5301-*1
KJA-PH-0-0177
5GND
4L
3DETECT
1R
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
RS232C_PHONE
2012/06/21
53
Page 41
AVDD_DDR0
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
M1_DDR (1DDR)
2012/06/21
54
Page 42
Serial Flash for SPI boot_NON_OS
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
/FLASH_WP
R5502
0
+3.5V_ST
OPT
R5501
10K
MX25L6406EM2I-12G
CS
SO/SIO1
WP
GND
/SPI_CS
SPI_SDO
SFLASH_NON_OS_MX
IC1300-*1
1
2
3
4
8
7
6
5
VCC
HOLD
SCLK
SI/SIO0
+3.5V_ST
OPT
R5503
4.7K
SFLASH_NON_OS_WINBOND
IC1300
W25Q64FVSSIG
CS
1
DO[IO1]
2
WP[IO2]
3
GND
4
SFLASH_OS_WINBOND
IC1300-*2
W25Q80BVSSIG
CS
1
DO[IO1]
2
%WP[IO2]
3
GND
4
VCC
8
%HOLD[IO3]
7
CLK
6
DI[IO0]
5
VCC
8
HOLD[IO3]
7
CLK
6
DI[IO0]
5
+3.5V_ST
R5504
33
SFLASH_OS_MACRONIX
MX25L8006EM2I-12G
CS#
SO/SIO1
WP#
GND
0.1uF
C5501
SPI_SCK
SPI_SDI
IC1300-*3
1
2
3
4
8
7
6
5
VCC
HOLD#
SCLK
SI/SIO0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
S_FLASH_NON_OS
2012.06.21
55
Page 43
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.