LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
Page 4
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Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
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Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
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Only for training and service purposes
1. Application range
This spec sheet is applied all of the 32”, 37”, 42” LCD TV with
LA06A chassis and 26” LCD TV with LA06B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC
2) Relative Humidity: 65 ± 10 %
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
** The W/B Tolerance is –0.015 for
picture quality by DQA.
(1) Video input: 204 Gray (85% of full
white pattern)
(1) Backlight UI setting
- Cool (100), Medium (100), Warm (30)
(2) Color temp UI setting
- Warm (W50), Medium (0), Cool (C50)
Page 9
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LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Component Video Input (Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.50 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.0 SDTV 480P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6.1280*72044.9659.9474.176HDTV 720P
7. 1920*1080 33.75 60.00 74.25 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 67.500 60 148.50 HDTV 1080P
10.1920*108067.43259.94148.352HDTV 1080P
11.1920*108027.00024.00074.25HDTV 1080P
12.1920*108026.9723.97674.176HDTV 1080P
13.1920*108033.7530.00074.25HDTV 1080P
14.1920*108033.7129.97740176HDTV 1080P
7. RGB Input (PC)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
PCDDC
1. 640*350 31.468 70.09 25.17 EGA X
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4.800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1360*768 47.712 60.015 85.50 VESA(WXGA) X
7.1920*1080 66.587 59.934 138.50 WUXGAO
Page 10
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Only for training and service purposes
- 10 -
8. HDMI input (PC/DTV)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
PCDDC
1. 640*350 31.468 70.09 25.17 EGA X
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) X
4.800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1280*768 47.77659.870 79.5 CVT(WXGA) O
7. 1360*768 47.712 60.015 85.50 VESA (WXGA)O
8. 1280*102463.98160.020 108.00 VESA (SXGA) O
9.1920*1080 67.50060.000 148.50 HDTV 1080PO
DTV
1 720*480 31.47 60 27.027 SDTV 480PO
2 720*480 31.47 59.94 27.00 SDTV 480P O
3 1280*720 45.00 60.00 74.25 HDTV 720P O
4 1280*720 44.96 59.94 74.176 HDTV 720P O
5 1920*1080 33.75 60.00 74.25 HDTV 1080I O
6 1920*1080 33.72 59.94 74.176 HDTV 1080I O
7 1920*1080 67.500 60 148.50 HDTV 1080P O
8 1920*1080 67.432 59.939 148.352 HDTV 1080P O
9 1920*1080 27.000 24.000 74.25 HDTV 1080P O
10 1920*1080 26.97 23.976 74.176 HDTV 1080P O
11 1920*1080 33.75 30.000 74.25 HDTV 1080P O
12 1920*1080 33.7129.97 74.176 HDTV 1080P O
Page 11
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Only for training and service purposes
- 11 -
ADJUSTMENT INSTRUCTION
1. Application range
This spec. sheet applies to LA12B Chassis applied LCD TV all
models manufactured in TV factory
2. Specification
2.1 Because this is not a hot chassis, it is not necessary
to use an isolation transformer. However, the use of
isolation transformer will help protect test instrument.
2.2 Adjustment must be done in the correct order.
2.3 The adjustment must be performed in the
circumstance of 25±5°C of temperature and 65±10%
of relative humidity
2.4 The input voltage of the receiver must keep
100~240V~, 50/60Hz.
2.5 The receiver must be operated for about 5 minutes
prior to the adjustment when module is in the
circumstance of over 15.
In case of keeping module is in the circumstance
of 0°C, it should be placed in the circumstance of
above 15°C for 2 hours
In case of keeping module is in the circumstance
of below -20°C, it should be placed in the
circumstance of above 15°C for 3 hours.
Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
3. Adjustment items
3.1 Main PCBA Adjustments
• EDID downloads for HDMI and RGB-PC
Remark
Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and final
assembly stages can be checked by using the INSTART
Menu 1.ADJUST CHECK.
3.2 Final assembly adjustment
• White Balance adjustment
• RS-232C functionality check
• Factory Option setting per destination
• Shipment mode setting (IN-STOP)
• GND and HI-POT test
3.3. Appendix
• Tool option menu, USB Download (S/W Update, Option and
Service only)
• Manual adjustment for ADC calibration and White balance.
• Shipment conditions, Channel pre-set
Chassis Model Name
Module
type
Local
dimming
THXRemark
42/47/55LV3700-UA Edge LED
XX
1 point W/B adjustment
42/47LK550-UA,
42/47/55LK530-UA
Lamp
LA12B
Page 12
- 12 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. MAIN PCBA Adjustments
4.1. MAC Address, ESN Key and Widevine
Key download
1) Connect: PCBA Jig RS-232C Port == PC RS-232C Port
4.1.5. Download
1) US, Canada models (11Y LCD TV + MAC + Widevine +
ESN Key)
2) Korea, Mexico models (11Y LCD TV + MAC + Widevine
Only)
4.1.6. Inspection
- In INSTART menu, check these keys.
4.2. LAN port Inspection (Ping Test)
4.2.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
- IP number: 12.12.2.2
4.2.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) remove LAN CABLE
Page 13
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4.3 EDID Download
4.3.1 Overview
• It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.3.2 Equipment
(1) Since EDID data is embedded, EDID download JIG, HDMI
cable and D-sub cable are not need.
(2) Adjust by using remote controller.
4.3.3 Download method
(1) Press Adj. key on the Adj. R/C,
(2) Select 11. PCM EDID D/L menu.
(3) By pressing Enter key, EDID download will begin
(4) If Download is successful, OK is display, but If Download
is failure, NG is displayed.
(5) If Download is failure, Re-try downloads.
* Caution) When EDID Download, must remove RGB/HDMI
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic
Range. In order to prevent saturation of
Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is
lowered to find the desired value.
- Adj. condition : normal temperature
1) Surrounding Temperature: 25±5ºC
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
4) Before White balance adjustment, Keep power on
status, don’t power off
5.1.1.2. Adj. condition and cautionary items
• Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
• Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
• Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked
using no signal or Full-white pattern.
5.1.2. Equipment
1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 /
LED : CH14)
2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model:217, Pattern:78)
-> Only when internal pattern is not available
5.1.3. Equipment connection
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
2) Adjustment Map
5.1.5. Adjustment method
• Auto adj. method
1) Set TV in adj. mode using POWER ON key
2) Zero calibrate probe then place it on the center of the
Display
3) Connect Cable(RS-232C)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sing), check adj. status pre
mode (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
• W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.1.6 Reference (White Balance Adj. coordinate and color
temperature)
• Luminance: 216 Gray
• Standard color coordinate and temperature using CS-
1000
• Standard color coordinate and temperature using CA-210
(CH 14)
Colo r Analyzer
Comp ut er
Pattern Ge n e r ator
RS-232C
RS-232C
RS-232C
Probe
Signal Source
* If TV internal pattern is used, not needed
ModeColor CoordinationTemp∆UV
xy
COOL0.2690.27313000K0.0000
MEDIUM0.2850.2939300K0.0000
WARM0.3130.3296500K0.0000
ModeColor CoordinationTemp∆UV
xy
COOL0.269±0.0020.273±0.00213000K0.0000
MEDIUM0.285±0.0020.293±0.0029300K0.0000
WARM0.313+0.0020.329±0.0026500K0.0000
Page 16
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LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
• Standard color coordinate and temperature using CA210(CH-14) – by aging time
Only for LGD Edge LED (47LV3700-UD / 55LV3700-UD)
- 42LV3700-UD : AUO Module , This model doesn’t use
this table.
5.2 Tool Option setting & Inspection per
countries
5.2.1. Overview
• Tool option selection is only done for models in Non-USA
North America due to rating
• Applied model: LA12B Chassis applied to CANADA and
MEXICO
5.2.2. Country Group selection
• Press ADJ key on the Adj. R/C, and then select Country
Group Menu
• Depending on destination, select KR or US, then on the
lower Country option, select US, CA, MX. Selection is
done using +, - KEY
5.2.3. Tool Option Inspection
• Press Adj. key on the Adj. R/C, and then check Tool
option.
5.3 Check the EYE-Q function
Step 1) Turn on the TV.
Step 2) Press EYE button in adjust remote control.
Step 3) Stay 6 seconds with Eye Q sensor hidden located on
the front of the set.
Step 4) Check the “Sensor Data” on the screen and check
whether the value is lower thanafter 6 seconds, the
value does not go below 10, Eye Q sensor is not
working properly. Then, change the sensor.
Step 5) Remove hand from the Eye Q II sensor and stay for 6
seconds.
Step 6) Check whether the “Back Light (xxx)” value has risen
on the screen. If after 6 seconds and the value still
does not go high, the eye Q II sensor is not working
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. HDMI ARC Function Inspection
6.1 Test equipment
- Optic Receiver Speaker
- MSHG-600 (SW: 1220
↑)
- HDMI Cable (for 1.4 version)
6.2 Test method
(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
(2) Check the sound from the TV Set
(3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
* Remark: Inspect in Power Only Mode and check SW version
in a master equipment
6.3 Ship-out mode check (In-stop)
• After final inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode.
7. AUDIO output check
7.1 Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
7.2 Specification
8. GND and Hi-pot Test
8.1. Method
8.1.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE
insertion condition
8.1.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV
CORD is tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
8.2. Checkpoint
• TEST voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
• TEST time: 1 second
• TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &
NEUTRAL
• LEAKAGE CURRENT: At 0.5mArms
Item Min Typ Max Unit Remark
Audio practical max Output, L/R
(Distortion=10% max Output)
9.0
8.5
10.0
8.9
12.0
9.9 W Vrms
(1) Measurement condition
- EQ/AVL/Clear Voice: Off
(2) Speaker (8ü Impedance)
Page 18
- 18 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. USB S/W Download (Option,
Service only)
1. Put the USB Stick to the USB socket
2. Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low, it
didn’t work. But your downloaded version is High, USB data
is automatically detecting
3. Show the message “Copying files from memory”
4. Updating is starting.
5. Updating Completed, The TV will restart automatically
6. If your TV is turned on, check your updated version and
Tool option. (Explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a
DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1. Push "IN-START" key in service remote controller.
2. Select "Tool Option 1" and Push “OK” button.
3. Punch in the number. (Each model has their number.)
10. Optional adjustments
10.1 Manual White balance Adjustment
10.1.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model: 217, Pattern: 78)
10.1.3. Adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY
G
). When
KEY(
G
) is pressed 216 Gray internal pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
• If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
Page 19
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 19 -
300
200
800
LV1
LV2
120
810
400
540
530
521
900
910
820
510
500
A2
A4
A21
A10
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
CI_ADDR[8]:
0: RESETOUTb (in On/Off only) stay asserted until software releases them.
1: Fix amount of delay for de-assertion on RESETOUTb (in On/IOff only)
at end of RESETb pulse (O)
NAND_DATA[3]:
0: MIPS will boot from external flash (O)
1: MIPS will boot from ROM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Run Along COMP_Y_IN,COMP_Pr_IN,COMP_Pb_IN/SC R,G,B Trace
INCM_R
INCM_G
INCM_B
INCM_VID_COMP1
INCM_VID_AV2
INCM_TUNER
INCM_VID_AV1
INCM_VID_SC/COMP2
SCL3_3.3V
SDA3_3.3V
+3.3V_Normal
R302
R301
1.2K
1.2K
C301
C302
33pF
33pF
50V
50V
PHONE JACK
INCM_AUD_SC/COMP2
M_REMOTE_TX
PC_L_IN
PC_R_IN
AV1_L_IN
AV1_R_IN
INCM_AUD_AV1
AV2_L_IN
AV2_R_IN
INCM_AUD_AV2
SC/COMP2_L_IN
SC/COMP2_R_IN
C305 1uF 10V
C306 1uF 10V
C307 1uF 10V
C308 1uF 10V
C309 1uF 10V
C310 1uF 10V
C311 1uF 10V
C312 1uF 10V
C313 1uF 10V
C314 1uF 10V
C315 1uF 10V
C316 1uF 10V
SPDIF_INC_P
SPDIF_INC_N
SPDIF_IND_P
SPDIF_IND_N
I2SSCK_IN/GPIO
I2SWS_IN
I2SSD_IN/GPIO
AADC_LINE_L1
AADC_LINE_R1
AADC_INCM1
AADC_LINE_L2
AADC_LINE_R2
AADC_INCM2
AADC_LINE_L3
AADC_LINE_R3
AADC_INCM3
AADC_LINE_L4
AADC_LINE_R4
AADC_INCM4
AADC_LINE_L5
AADC_LINE_R5
AADC_INCM5
AADC_LINE_L6
AADC_LINE_R6
AADC_INCM6
AADC_LINE_L7
AADC_LINE_R7
AADC_INCM7
IC101
I2SSCK_OUTA/GPIO
I2SWS_OUTA/GPIO
I2SSD_OUTA0/GPIO
I2SSOSCK_OUTA/GPIO
I2SSD_OUTA1/GPIO
I2SSD_OUTA2/GPIO
I2SSCK_OUTC/GPIO
I2SWS_OUTC/GPIO
I2SSD_OUTC/GPIO
I2SSOSCK_OUTC/GPIO
I2SSCK_OUTD/GPIO
I2SWS_OUTD/GPIO
I2SSD_OUTD/GPIO
I2SSOSCK_OUTD/GPIO
SPDIF_OUTA/GPIO
LGE35230(BCM35230KFSBG)
B15
C15
C14
B14
G4
F4
G5
C25
B24
A24
E22
E23
D23
C24
C23
B23
E21
D21
D22
B22
C22
A22
F21
D20
E20
A21
C21
B21
AUDMUTE_0/GPIO
AUDMUTE_1
ADAC_AL_N
ADAC_AL_P
ADAC_AR_N
ADAC_AR_P
ADAC_CL_N
ADAC_CL_P
ADAC_CR_N
ADAC_CR_P
ADAC_DL_N
ADAC_DL_P
ADAC_DR_N
ADAC_DR_P
AF8
AF9
AG9
AC9
AD8
AD9
E2
F2
E3
F3
G2
G3
G1
H1
B13
AG8
E13
C28
C27
D28
D27
C26
A27
B27
B28
B25
A25
A26
B26
R326 100
R327 100
R328 100
R329 100
TU_RESET_SUB
HP_DET
AV1_CVBS_DET
TU_RESET
SC_RE1
SC_RE2INCM_AUD_PC
/RST_HUB
S2_RESET
SPDIF_OUT
HP_LOUT_N
HP_LOUT_P
HP_ROUT_N
HP_ROUT_P
SCART1_Lout_N
SCART1_Lout_P
SCART1_Rout_N
SCART1_Rout_P
C337
22pF
OPT
C338
22pF
OPT
C339
22pF
OPT
C340
33pF
OPT
AUD_SCK
AUD_LRCK
AUD_LRCH
AUD_MASTER_CLK
Near
Near
Near
Near
Near
JK1102
JK1103
JK2501
JK1104
JK801
TU2101/2
TU2201/2/3
R3210
R3220
R3230
R3240
AUDIO INCM
Route Between AV1_L_IN & AV1_R_IN Trace
Route Between SC/COMP2_L_IN & SC/COMP2_R_IN Trace
Route Between AV2_L_IN & AV2_R_IN Trace
Route Between PC_L_IN & PC_R_IN Trace
Route Along With TUNER_SIF_IF_N
INCM_AUD_AV1
INCM_AUD_SC/COMP2
INCM_AUD_AV2
INCM_AUD_PC
INCM_SIF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
MICOM
6
50
Page 25
Q901,Q902,Q903
Q904,Q905,Q906
D903,D904
D905,D906
DUAL COMPONENT
1ST : 0TRIY80001A 2ND : 0TR387500AA
1ST : EAH42720601, 2ND : EAH60994401
IR & KEY
IR
Q901
2SC3052
+3.5V_ST
R903
47K
R902
0
+3.5V_ST
KEY1
KEY2
3.5V
3.3V
S/T_SCL
ST_SDA
GND
GND
IR
GND
GND
IR_15P
P901
12507WR-15L
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
.
IR_12P
P902
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
EEPROM_SCL
EEPROM_SDA
LED_B/LOGO
LED_R/BUZZ
C911
100pF
50V
R933
100
R934
100
R9281.5K
D907
5.6V
AMOTECH
LED_R/BUZZ
D903
CDS3C05HDMI1
5.6V
D904
CDS3C05HDMI1
5.6V
D905
CDS3C05HDMI1
5.6V
D906
CDS3C05HDMI1
5.6V
R929
1.5K
LED_B/LG_LOGO
+3.3V_Normal
BLM18PG121SN1D
16V
EEPROM_SCL
EEPROM_SDA
L902
C913
0.1uF
16V
ESD_ATSC
R920
R919
10K
10K
1%
1%
R915
100
KEY1
R916
+3.5V_ST
R908
47K
COMMERCIAL_EU
Q903
2SC3052
COMMERCIAL_EU
WIRELESS
Q904
2SC3052
WIRELESS
+3.5V_ST
R909
3.3K
OPT
+3.5V_ST
R911
47K
C
B
E
COMMERCIAL_EU
COMMERCIAL_US
R910
0
+3.5V_ST
R912
47K
C
B
E
R905
47K
R904
C
10K
B
E
OPT
Q902
2SC3052
C
B
E
COMMERCIAL
R906
COMMERCIAL
22
IR_OUT
WIRELESS
R907
WIRELESS
22
IR_PASS
KEY2
R913
10K
R914
10K
WIRELESS
R917
COMMERCIAL
Q905
2SC3052
COMMERCIAL
R918
WIRELESS
Q906
2SC3052
WIRELESS
100
+3.5V_ST
47K
+3.5V_ST
47K
C
E
C
E
B
COMMERCIAL
B
WIRELESS
47K
47K
R921
R922
+3.5V_ST
C901
0.1uF
C902
0.1uF
OPT
BLM18PG121SN1D
16V
L901
S/T_SCL
S/T_SDA
C903
0.1uF
C904
0.1uF
D901
5.6V
AMOTECH
16V
OPT
Zener Diode is
close to wafer
C905
1000pF
50V
R935
100
R936
100
D902
5.6V
AMOTECH
ESD_ATSC
C912
0.1uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
IR/KEY
9
50
Page 26
WIRELESS READY MODEL
D1001,D1002
Q1001
Q1002
DUAL COMPONENT
1ST : EAH42720601 2ND : EAH60994401
1ST : EBK61012601, 2ND : 0TRDI80002A
1ST : EBK60752501, 2ND : EBK61011501
Wireless power
+24V
R1002
22K
WIRELESS
R1003
2.2K
WIRELESS
WIRELESS_PWR_EN
R1001
10K
WIRELESS
B
C1002
2.2uF
WIRELESS
Q1002
AO3407A
WIRELESS
C
Q1001
MMBT3904(NXP)
WIRELESS
E
JK1001
KJA-PH-3-0168
DETECT
INTERRUPT
GND_1
RESET
GND_2
I2C_SCL
I2C_SDA
GND_3
UART_RX
UART_TX
GND_4
GND_5
IR
WIRELESS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20GND_6
21
SHIELD
VCC(24V/20V/17V)_1
VCC(24V/20V/17V)_2
VCC(24V/20V/17V)_3
VCC(24V/20V/17V)_4
VCC(24V/20V/17V)_1
VCC(24V/20V/17V)_1
+3.3V_Normal
S
G
D
L1001
MLB-201209-0120P-N2
WIRELESS
C1004
10uF
35V
WIRELESS
WIRELESS_DET
WIRELESS_SCL
WIRELESS_SDA
IR_PASS
R1008
WIRELESS
R1007 1K
WIRELESS
D1001
CDS3C05HDMI1
WIRELESS
10K
5.6V
WIRELESS
D1002
5.6V
CDS3C05HDMI1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Wireless I2C connection with I2C_1
Address : 0X20
WIRELESS_SCL
WIRELESS_SDA
R100533
WIRELESS
R100633
WIRELESS
SCL2_3.3V
SDA2_3.3V
BCM35230
10
50WIRELESS
Page 27
CVBS 1 PHONE JACK
D1105
D1107
5.6V
5.6V
ZD1115
5.1V
ZD1116
5.1V
D1108
5.6V
R1110
JK1102
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
COMPONENT 1 PHONE JACK
D1101
JK1101
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
5.6V
ZD1117
5.1V
ZD1110
5.1V
ZD1111
5.1V
ZD1112
5.1V
ZD1113
5.1V
ZD1114
5.1V
R1109
75
1%
470K
R1111
470K
+3.3V_Normal
R1105
2.7K
R1106
75
1%
R1107
75
1%
R1108
75
1%
+3.3V_Normal
R1112
2.7K
C1106
47pF
50V
C1107
560pF
50V
C1108
560pF
50V
R1137
10
R1138
10
R1139
10
R1143
22
R1144
22
R1113
1K
R1136
10
R1114
1K
L1110
CM2012FR27KT
C1102
27pF
50V
L1111
CM2012FR27KT
C1103
27pF
50V
L1112
CM2012FR27KT
C1104
27pF
50V
FOR EMI
C1109
560pF
50V
C1110
560pF
50V
C1125
27pF
50V
C1126
27pF
50V
C1127
27pF
50V
COMP1_DET
COMP1_Y
COMP1_Pb
COMP1_Pr
AV1_CVBS_DET
AV1_CVBS_IN
AV1_L_IN
AV1_R_IN
JACK_PACK
JK1105
PPJ238-01
[RD1]E-LUG
6C
[RD1]O-SPRING
5C
[RD1]CONTACT
4C
[WH1]O-SPRING
5B
[YL1]CONTACT
4A
[YL1]O-SPRING
5A
[YL1]E-LUG
6A
[RD2]E-LUG
6H
[RD2]O-SPRING_2
5H
[RD2]CONTACT
4H
[WH2]O-SPRING
5G
[RD2]O-SPRING_1
5F
[RD2]E-LUG-S
7F
[BL2]O-SPRING
5E
[BL2]E-LUG-S
7E
[GN2]CONTACT
4D
[GN2]O-SPRING
5D
[GN2]E-LUG
6D
CVBS2 REAR JACK
JK1104
PPJ233-01
AV2_JACK
[RD]E-LUG
5C
[RD]O-SPRING
4C
[RD]CONTACT
3C
[WH]C-LUG
4B
[YL]CONTACT
3A
[YL]O-SPRING
4A
[YL]E-LUG
5A
COMP2 REAR JACK
COMP2
COMP2
COMP2
COMP2
COMP2
COMP2
ZD1103
5.1V
ZD1104
5.1V
ZD1105
5.1V
ZD1106
5.1V
ZD1107
5.1V
ZD1108
5.1V
AV2
R1141
22
D1109
AMOTECH
5.6V
AV2
D1110
AMOTECH
5.6V
AV2
ZD1101
AV2
5.1V
ZD1102
AV2
5.1V
D1111
AV2
5.6V
COMP2
R1119
0
COMP2
R1124
75
COMP2
R1120
0
COMP2
R1125
75
COMP2
R1121
0
COMP2
R1126
75
D1112
5.6V
COMP2
D1113
5.6V
COMP2
COMP2
D1114
5.6V
AV2
AV2
10
10
10
AV2
COMP2
COMP2
COMP2
R1116
470K
R1117
470K
R1118
75
R1133
R1134
R1135
+3.3V_Normal
+3.3V_Normal
R1128
2.7K
AV2
COMP2
R1122
470K
COMP2
R1123
470K
COMP2_Pr
COMP2_Pb
COMP2_Y
COMP2
R1127
2.7K
C1118
560pF
50V
AV2
C1119
560pF
50V
AV2
C1120
47pF
50V
AV2
BLM18PG121SN1D
C1113
560pF
50V
COMP2
BLM18PG121SN1D
COMP2
C1114
560pF
50V
COMP2_Pr
COMP2_Pb
COMP2_Y
COMP2
R11301K
COMP2
COMP2
R1142
22
R1129
1K
AV2
L1103
L1104
C1123
560pF
50V
C1121
560pF
50V
COMP2
COMP2
C1122
560pF
50V
CM2012FR27KT
C1115
27pF
50V
CM2012FR27KT
C1116
27pF
50V
CM2012FR27KT
C1117
27pF
50V
L1109
L1108
L1107
FOR EMI
AV2
C1124
560pF
50V
AV2
COMP2
R1131
22
COMP2
R1132
22
AV2
R1140
10
SC/COMP2_R_IN
SC/COMP2_L_IN
SC_R/COMP2_Pr
C1128
27pF
50V
SC_B/COMP2_Pb
C1129
27pF
50V
SC_G/COMP2_Y
C1130
27pF
50V
SC_DET/COMP2_DET
AV2
AV2_R_IN
AV2_L_IN
AV2_CVBS_IN
AV2_CVBS_DET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
COMP/AV11
50
Page 28
DUAL COMPONENT
D1201,D1202
D1203,D1204
D1205,D1206
1ST : EAH42720601 2ND : EAH60994401
ONLY FOR LV7_ATSC
+3.3V_USB
C1204
1uF
10V
WIFI
+3.3V_Normal
C1205
0.1uF
WIFI
L1203
BLM18PG121SN1D
WIFI
USB_DM1
USB_DP1
USB_DM2
USB_DP2
C1206
C1207
0.1uF
0.1uF
WIFI
WIFI
+3.3V_USB
C1208
0.1uF
WIFI
USBDM_DN[1]
USBDP_DN[1]
USBDM_DN[2]
USBDP_DN[2]
VDDA33_1
NC_1
NC_2
NC_3
NC_4
[EP]VSS
1
2
3
4
5
6
7
8
9
WIFI
THERMAL
10
VDDA33_2
WIFI
C1209
1uF
10V
WIFI
C1210
0.1uF
WIFI
R1205
1M
WIFI
X1201
24MHz
R1204
12K
1/16W 1%
XTALIN/CLKIN
PLLFILT
RBIAS36VDD33_3
33
34
35
37
IC1202
USB2512B-AEZG
11
12
13
TEST
OCS_N[1]
PRTPWR[1]/BC_EN[1]
USB_CTL1
/USB_OCD1
WIFI
C1211
15pF
XTALOUT
WIFI
CRFILT
C1212
WIFI
C1213
15pF
1%
32
14
WIFI
C1214
USBDP_UP
31
15
VDD33_1
0.1uF
1uF
WIFI
SIDE_USB_DM
SIDE_USB_DP
WIFI
R1206
100K
SUSP_IND/LOCAL_PWR/NON_REM[0]
VDDA33_3
USBDM_UP
28
29
30
16
PRTPWR[2]/BC_EN[2]
10V
17
OCS_N[2]
USB_CTL2
/USB_OCD2
18
NC_5
VBUS_DET
27
RESET_N
26
HS_IND/CFG_SEL[1]
25
SCL/SMBCLK/CFG_SEL[0]
24
VDD33_2
23
SDA/SMBDATA/NON_REM[1]
22
NC_8
21
NC_7
20
NC_6
19
WIFI
R1207
100K
WIFI
C1216
0.1uF
C1215
0.1uF
WIFI
WIFI
R1208
100K
WIFI
100K
R1209
R1212
100K
OPT
R1213
100K
OPT
+3.3V_USB
+3.3V_USB
C1218
0.1uF
OPT
R1215 100K
R1214 100K
R1216 100K
WIFI
C1217
4.7uF
OPT
OPT
OPT
+3.3V_USB
/RST_HUB
USB / DVR Ready
L1205
MLB-201209-0120P-N2
120-ohm
C1220
10uF
C1231
100uF
10V
3AU04S-305-ZC-(LG)
JK1201
1234
USB DOW N S TREA M
5
16V
D1203
CDS3C05HDMI1
5.6V
USB
L1204
MLB-201209-0120P-N2
120-ohm
C1230
C1219
100uF
10uF
16V
3AU04S-305-ZC-(LG)
JK1202
1234
USB DOW N S TREA M
5
10V
D1204
CDS3C05HDMI1
5.6V
IC1204
NC
OUT_2
OUT_1
FLG
D1205
CDS3C05HDMI1
5.6V
IC1203
AP2191DSG
NC
8
OUT_2
7
OUT_1
6
FLG
5
EAN61849601
D1206
CDS3C05HDMI1
5.6V
AP2191DSG
8
7
6
5
EAN61849601
GND
1
IN_1
2
IN_2
3
EN
4
GND
1
IN_1
2
IN_2
3
EN
4
R12240
R12250
+3.3V_Normal
NON_WIFI
R12260
R12270
NON_WIFI
+3.3V_Normal
R1221
4.7K
OPT
USB_CTL1
R12300
R12310
NON_WIFI
NON_WIFI
R1220
4.7K
OPT
USB_CTL2
NON_WIFI
R12280
R12290
NON_WIFI
NON_WIFI
NON_WIFI
R1222
2.7K
USB_DM2
USB_DP2
WIFI_DM
WIFI_DP
R1223
2.7K
USB_DM1
USB_DP1
SIDE_USB_DM
SIDE_USB_DP
SIDE_USB_CTL2
SIDE_USB_OCD2
/USB_OCD1
SIDE_USB_CTL1
SIDE_USB_OCD1
+5V_USB
C1223
0.1uF
/USB_OCD2
+5V_USB
C1224
0.1uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
USB + WIFI
72
50
Page 29
FHD120Hz LVDS output(51pin+41Pin)
P1501
FI-RE51S-HFK-A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
R150433
R150633
R150733
R150833
R151633
FRC2
FRC2
FRC2
FRC2
SHARP_60INCH
C1501
10uF
25V
OPT
PANEL_VCC
C1502
1000pF
50V
3D_SYNC_RF
SDA2_3.3V
SCL2_3.3V
FRC_RESET
PANEL_CTL
TXA0N
TXA0P
TXA1N
TXA1P
TXA2N
TXA2P
TXACLKN
TXACLKP
TXA3N
TXA3P
TXA4N
TXA4P
TXB0N
TXB0P
TXB1N
TXB1P
TXB2N
TXB2P
TXBCLKN
TXBCLKP
TXB3N
TXB3P
TXB4N
TXB4P
L1501
MLB-201209-0120P-N2
NON_SHARP_60INCH
C1503
0.1uF
16V
LVDS_SEL
+3.3V_Normal
R1513
3.3K
LVDS_SEL_HIGH
R1514
10K
LVDS_SEL_LOW
BIT_SEL
R1512
10K
BIT_SEL_LOW
P1502
FI-RE41S-HFK-A
LVDS_41P
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
1
2
3
4
5
6
7
8
9
TXC0N
TXC0P
TXC1N
TXC1P
TXC2N
TXC2P
TXCCLKN
TXCCLKP
TXC3N
TXC3P
TXC4N
TXC4P
TXD0N
TXD0P
TXD1N
TXD1P
TXD2N
TXD2P
TXDCLKN
TXDCLKP
TXD3N
TXD3P
TXD4N
TXD4P
REVERSE MARK
LVDS_41P
C1504
2.2uF
50V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
2010.11.03
5015LVDS
Page 30
[Local Dimming Block]
P1601
12507WR-08L
1
2
3
4
5
6
7
8
9
R1601 33
R1602 33
L/DIM0_SCLK
L/DIM0_MOSI
SCL2_3.3V
SDA2_3.3V
L/DIM0_VS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
NON CI50
20
Page 32
LNB_INT
Non_DVB-S2 LNB Part_Allegro
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
NON LNB50
24
Page 33
3D_SYNC
L_VS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CK+_HDMI3
CK-_HDMI3
HDMI3
D0-_HDMI3
D0+_HDMI3
D1+_HDMI3
D1-_HDMI3
D2+_HDMI3
D2-_HDMI3
DDC_SCL_1
DDC_SDA_1
HDMI_HPD_1
BCM35230
5037LV7 HDMI
Page 35
RGB/ PC AUDIO/ SPDIF/ EARPHONE/ RS232C
RGB PC
DSUB_VSYNC
DSUB_HSYNC
R3856 22
R385722
R3850 0
OPT
R3851 0
OPT
R3825
100K
OPT
DUAL COMPONENT
L3804
BG2012B080TF
C3829
0.22uF
10V
+3.3V_Normal
R3826
4.7K
C
Q3801
2SC3052
E
L3805
BG2012B080TF
C3830
0.22uF
10V
HP_LOUT
OPT
R3827
0
R3828
1K
B
SIDE_HP_MUTE
HP_ROUT
D3811
5.6V
OPT
+5V_Normal
+3.3V_Normal
ESD_COMMON
EDID_WP
RGB_DDC_SCL
RGB_DDC_SDA
R3814
10K
D3812
5.6V
D3804,D3805,D3806
HP_DET
+3.3V_Normal
R3858
1K
R3816
2.7K
HP_LOUT
HP_ROUT
JK3803
KJA-PH-0-0177
5GND
4L
3DETECT
1R
D3807,D3808,D3813
D3814
D3810
Q3801
1ST : EAH39491601, 2ND : EAH33945901
1ST : 0DD184009AA, 2ND : 0DSIH00028A
1ST : 0TRIY80001A, 2ND : 0TR387500AA
EARPHON JACK
+3.3V_Normal
EARPHONE AMP
Close to the IC
4.7K
INL-
INL+
INR+
INR-
OUTL
16
1
2
3
4
5
OUTR
C3818
1uF
4.7K
R3817
OPT
R3818
10V
C3819
1uF
10V
C3820
1uF
10V
C3821
1uF
10V
OPT
R3820
R3819
HP_LOUT_N
HP_LOUT_P
HP_ROUT_N
HP_ROUT_P
EU_ESD
D3812-*1
5.6V
DSUB_DET
R38151K
SGND
15
IC3804
TPA6132A2
EAN60724701
6G07G18
L3803
BLM18PG121SN1D
C3824
10uF
10V
C3823
1uF
10V
EN14VDD
13
12
11
10
9
HPVSS
C3825
2.2uF
10V
HPVDD
CPP
PGND
CPN
C3826
0.1uF
16V
C3827
2.2uF
10V
C3828
2.2uF
10V
D3810
KDS184
A2
C
A1
IC3801
74F08D
D0A
1
D0B
2
Q0
3
D1A
4
D1B
5
Q1
6
GND
7
+5V_Normal
IC3802
VCC
14
D3B
13
D3A
12
Q3
11
D2B
R3852 0
10
OPT
D2A
R3853 0
9
OPT
Q2
8
OPT
R3802
10K
OPT
R3801
10K
DSUB_B+
DSUB_G+
DSUB_R+
EU_ESD
5.6V
D3808-*1
EU_ESD
5.6V
D3806-*1
EU_ESD
5.6V
D3807-*1
A0
A1
A2
GND
R3807
75
R3806
75
R3808
75
AT24C02BN-SH-T
1
2
3
4
8
7
6
5
D3804
30V
D3805
30V
C3807
47pF
50V
C3808
47pF
50V
C3809
47pF
50V
VCC
WP
SCL
SDA
C3812
18pF
50V
C3810
22pF
50V
Closed to JACK
C3811
22pF
50V
BLM15BD121SN1
ESD_COMMON
D3808
30V
BLM15BD121SN1
ESD_COMMON
D3806
30V
BLM15BD121SN1
ESD_COMMON
D3807
30V
R3809
R3810
2.7K
2.7K
C3813
18pF
50V
L3806
L3807
L3808
RED_GND7GREEN_GND8BLUE_GND9NC10SYNC_GND
GND_212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK
R3813
10K
22
R3812
R381122
D3809
5.6V
OPT
RED2GREEN3BLUE4GND_15DDC_GND
P3801
SPG09-DB-010
PC AUDIO
JK3801
PEJ027-01
SPDIF OUT
SPDIF_OUT
E_SPRING
3
T_TERMINAL1
6A
B_TERMINAL1
7A
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
R3861
0
ESD_COMMON
D3802
AMOTECH
5.6V
ESD_COMMON
D3801
AMOTECH
5.6V
R3804
470K
R3803
470K
+3.3V_Normal
R3805
2.7K
C3803
560pF
50V
C3802
560pF
50V
D3803
30V
OPT
R3854
22
R3855
22
C3804
0.1uF
16V
C3806
560pF
50V
C3805
560pF
50V
PC_R_IN
PC_L_IN
VINPUT
GND
1
VCC
2
3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
6
Fiber Optic
4
FIX_POLE
11
1
JK3802
JST1223-001
SHILED
16
0.1uF
RS232C
C1+
C38140.1uF
V+
C3815
C1-
C2+
C38160.1uF
C2-
V-
C38170.1uF
DOUT2
RIN2
IC3803
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
10
5
IR_OUT
ESD_COMMON
D3814
30V
D3814-*1
EU_ESD
5.6V
R38290
BCM_RX
NEC_RXD
BCM_TX
NEC_TXD
4.7K
OPT
D3813-*1
EU_ESD
5.6V
IR_OUT
ESD_COMMON
D3813
30V
R3821
0
R3822
0
R3823
0
R3824
0
R3860
+3.5V_ST
C3822
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
HIGH : SELECT X1, Y1, SELECT MAIN TX/RX
LOW : SELECT X0, Y0, SELECT MICOM TX/RX
100
R3859
100
+3.5V_ST
R3830
4.7K
OPT
R3831
JP3809
JP3808
9
8
7
6
SPG09-DB-009
P3802
4
3
2
1
BCM35230
LV7 COMM JACK
5038
Page 36
Ethernet Block
JK3901
XRJV-01V-D12-180
+2.5V_BCM35230
L3901
CIC21J501NE
1
2
3
4
5
6
7
8
R3901 510
D1
D2
R3902
D3
D4
9
C3901
0.1uF
16V
D3902
ADLC 5S 03 015
C3902
0.1uF
16V
+3.3V_Normal
510
5.5V
D3901
ADLC 5S 03 015
5.5V
D3903
ADLC 5S 03 015
5.5V
D3904
ADLC 5S 03 015
5.5V
D3906
ADLC 5S 03 015
5.5V
D3905
ADLC 5S 03 015
5.5V
EPHY_TDP
EPHY_TDN
EPHY_RDP
EPHY_RDN
EPHY_LINK
EPHY_ACTIVITY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
LV7 ATSC AMP4950
Page 38
NON CHINA HOTELNON SCART
5V_HDMI_4
CHB_RESET
CHBO_TS_VAL_ERR
CHBO_TS_CLK
CHBO_TS_SERIAL
CHBO_TS_SYNC
TW9910_RESET
3D_SYNC
AV2_CVBS_DET
SDA3_3.3V
SCL3_3.3V
3D_SYNC_RF
3D_GPIO_2
3D_GPIO_1
3D_GPIO_0
SPK_R+_HOTEL
SPK_R-_HOTEL
TU_RESET_SUB
M_RFModule_RESET
M_REMOTE_RX
M_REMOTE_TX
DC_MREMOTE
DD_MREMOTE
SC_CVBS_IN
DTV_ATV_SELECT
DTV/MNT_V_OUT
SC_FB
SC_ID
SC_RE1
SC_RE2
SCART_MUTE
SCART1_Lout_N
SCART1_Lout_P
SCART1_Rout_N
SCART1_Rout_P
INCM_VID_SC
SPK_R+_HOTEL
SPK_R-_HOTEL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
LV7 ATSC5050
Page 39
H/NIM (KOR/USA)
DUAL COMPONENT
NON_CHB_TUNER_V
TU5101
UDA55AL
10
11
12
13
14
15
16
17
18
19
SHIELD
NON_CHB_TUNER_H
TU5101-*1
UFA55AL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
SHIELD
NC_1
1
NC_2
2
+B[+5V]
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC_3
VIDEO
GND
+1.2V
+3.3V
RESET
IF_AGC_CNTL
DIF_1
DIF_2
NC_1
NC_2
+B[+5V]
NC[RF_AGC]
AS
SCL
SDA
NC(IF_TP)
SIF
NC_3
VIDEO
GND
+1.2V
+3.3V
RESET
IF_AGC_CNTL
DIF_1
DIF_2
R5101
75
OPT
NON_CHB_TUNER_H_LGIT
TU5101-*2
TDVJ-H101F
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
close to TUNER
R5102 0
OPT
C5101
100pF
50V
C5102
0.1uF
16V
OPT
+1.26V_TU
C5103
0.1uF
16V
RF_SWITCH_CTL
C5104
100uF
16V
+5V_TU
C5105
100pF
50V
R5103 0
OPT
C5106
0.1uF
16V
+3.3V_S_TU
R5104
OPT
100K
+3.3V_DE
C5107
100pF
50V
RF_SWITCH_CTL_2
close to TUNER
C5109
C5110
0.1uF
100uF
16V
16V
IF_N
IF_P
C5111
18pF
50V
IC5103
C5112
18pF
50V
R5105
100
+3.3V_TU
R5106
1K
C5113
0.1uF
1ST : EAN54428101, 2ND : 0IPMG00048A
SCL0_3.3V
SDA0_3.3V
OPT
R5107
100K
TU_RESET
C5114
0.1uF
16V
IF_AGC
C5115
100pF
+5V_Normal
L5103
BLM18PG121SN1D
C5116
0.1uF
16V
C5120
22uF
C5132
0.1uF
16V
16V
+3.3V_Normal
+5V_TU
R5109
470
B
R5108
50V
4.7K
E
Q5101
C
MMBT3906(NXP)
R5112
82
TU_SIF
MLB-201209-0120P-N2
C5117
0.1uF
16V
L5104
C5121
22uF
16V
+5V_TU
L5101
BLM18PG121SN1D
C5122
22uF
16V
+3.3V_TU
C5123
0.1uF
16V
C5124
0.1uF
C5125
0.1uF
+3.3V_TU
16V
16V
MLB-201209-0120P-N2
C5126
0.1uF
L5105
+3.3V_DE
C5128
10uF
10V
C5129
0.1uF
+5V_TU
R5113
1K
R5115
R5116
OPT
R5110
R5111
220
OPT
0
0
1K
R5114
OPT
B
220
E
Q5102
MMBT3906(NXP)
C
TU_CVBS
+3.3V_TU
C5118
2.2uF
16V
L5102
120-ohm
C5119
2.2uF
16V
IC5103
AP1117EG-13
OUTIN
ADJ/GND
R5117
+1.26V_TU
L5106
BLM18PG121SN1D
C5127
R1
R2
R5118
4.7
22uF
220
C5130
22uF
C5131
0.1uF
10V
50V
VOUT = VREF *(1+R2/R1)
FE_TS_DATA[0]
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
FE_TS_DATA[0-7]
RF_BOOSTER_CTL
TS_VAL_ERR
TU_TS_SYNC
TU_TS_CLK
S2_RESET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
TUNER_NON CHB
51
51
Page 40
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SMD GASKET
M1-*3
MDS62110206
GASKET_6.5T
M2-*3
MDS62110206
GASKET_6.5T
M3-*3
MDS62110206
GASKET_6.5T
M4-*3
MDS62110206
GASKET_6.5T
M5-*3
MDS62110206
GASKET_6.5T
M6-*3
MDS62110206
GASKET_6.5T
M7-*3
MDS62110206
GASKET_6.5T
M8-*3
MDS62110206
GASKET_6.5T
M9-*3
MDS62110206
GASKET_6.5T
M10-*3
MDS62110206
GASKET_6.5T
M11-*3
MDS62110206
GASKET_6.5T
M12-*3
MDS62110206
GASKET_6.5T
SMD GASKET 6.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
M1-*2
M2-*2
M3-*2
M4-*2
M5-*2
M6-*2
M7-*2
M8-*2
M9-*2
M10-*2
M11-*2
M12-*2
SMD GASKET 5.5T
M1-*1
MDS62110210
GASKET_5.0T
M2-*1
MDS62110210
GASKET_5.0T
M3-*1
MDS62110210
GASKET_5.0T
M4-*1
MDS62110210
GASKET_5.0T
M5-*1
MDS62110210
GASKET_5.0T
M6-*1
MDS62110210
GASKET_5.0T
M7-*1
MDS62110210
GASKET_5.0T
M8-*1
MDS62110210
GASKET_5.0T
M9-*1
MDS62110210
GASKET_5.0T
M10-*1
MDS62110210
GASKET_5.0T
M11-*1
MDS62110210
GASKET_5.0T
M12-*1
MDS62110210
GASKET_5.0T
SMD GASKET 5.0T
M1
MDS62110208
GASKET_4.5T
M2
MDS62110208
GASKET_4.5T
M3
MDS62110208
GASKET_4.5T
M4
MDS62110208
GASKET_4.5T
M5
MDS62110208
GASKET_4.5T
M6
MDS62110208
GASKET_4.5T
M7
MDS62110208
GASKET_4.5T
M8
MDS62110208
GASKET_4.5T
M9
MDS62110208
GASKET_4.5T
M10
MDS62110208
GASKET_4.5T
M11
MDS62110208
GASKET_4.5T
M12
MDS62110208
GASKET_4.5T
SMD GASKET 4.5T
SMD GASKET
BCM35230
GASKET3.5T_HEATSINK
MDS62110213
M20
GASKET3.5T_HEATSINK
MDS62110213
M21
GASKET3.5T_HEATSINK
MDS62110213
M22
GASKET3.5T_HEATSINK
MDS62110213
M23
M1-*6
MDS61887710
GASKET_9.5T
M2-*6
MDS61887710
GASKET_9.5T
M3-*6
MDS61887710
GASKET_9.5T
M4-*6
MDS61887710
GASKET_9.5T
M5-*6
MDS61887710
GASKET_9.5T
M6-*6
MDS61887710
GASKET_9.5T
M7-*6
MDS61887710
GASKET_9.5T
M8-*6
MDS61887710
GASKET_9.5T
M9-*6
MDS61887710
GASKET_9.5T
M10-*6
MDS61887710
GASKET_9.5T
M11-*6
MDS61887710
GASKET_9.5T
M12-*6
MDS61887710
GASKET_9.5T
SMD GASKET 9.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
M1-*5
M2-*5
M3-*5
M4-*5
M5-*5
M6-*5
M7-*5
M8-*5
M9-*5
M10-*5
M11-*5
M12-*5
SMD GASKET 8.5T
M1-*4
MDS62110205
GASKET_7.5T
M2-*4
MDS62110205
GASKET_7.5T
M3-*4
MDS62110205
GASKET_7.5T
M4-*4
MDS62110205
GASKET_7.5T
M5-*4
MDS62110205
GASKET_7.5T
M6-*4
MDS62110205
GASKET_7.5T
M7-*4
MDS62110205
GASKET_7.5T
M8-*4
MDS62110205
GASKET_7.5T
M9-*4
MDS62110205
GASKET_7.5T
M10-*4
MDS62110205
GASKET_7.5T
M11-*4
MDS62110205
GASKET_7.5T
M12-*4
MDS62110205
GASKET_7.5T
SMD GASKET 7.5T
2010. 09. 18
56
56
Page 41
FROM LIPS & POWER B/D
+3.5V_ST
RT1P141C-T112
Q502
R502
RL_ON
10K
+3.5V_ST
+12V
MLB-201209-0120P-N2
C506
0.1uF
50V
#16/#20/#23
LD - GND OR USE
LE(N.L.D.) - OPEN
LE(L.D.) - USE
C
Q501
B
2SC3052
E
L503
MLB-201209-0120P-N2
C508
0.1uF
16V
L501
R508
4.7K
3
1
2
PWR ON
3.5V
3.5V
GND/P.DIM2
NORMAL_26~55
1
1
24V
3
3
GND
5
5
GND
7
7
9
9
11
11
GND
13
13
GND
15
15
12V
17
17
12V
19
19
12V
21
2122
23
2324
SLIM_32~55
SMAW200-H24S2
P502
FW20020-24S
2
2
4
4
6
6
8
8
10
10
12
12
14
14
16
16
18
18
20
20
22
24
25
P501
24V
24V
GND
GND
3.5V
3.5V
GND
GND/V-sync
INV ON
A.DIM
P.DIM1
Err OUT
L504
MLB-201209-0120P-N2
POWER_16_URSA_SCAN
R574 0
R573 0
POWER_16_BCM_SCAN
R518
0
POWER_16_GND
C519
0.1uF
+24V
50V
L_VS
L/DIM0_VS
INV_CTL_18
A_DIM_20
PWM_DIM_22
Power_DET
PD_+20V
R510-*4
5.6K
1%
PD_+20V
R511-*4
1.3K
1%
PD_+18.5V
R510-*3
4.7K
1%
PD_+18.5V
R511-*3
1.21K
1%
+12V
PD_+12V
R512
2.7K
1%
NON_PD_+3.5V
R513
1.21K
1%
+24V
+3.5V_ST
PD_24V
R510
8.2K
1%
PD_24V
R511
1.5K
1%
PD_+3.5V
R515
0
5%
VCC
C580
0.1uF
16V
VCC
C581
0.1uF
16V
NON_PD_+3.5V
R517
100K
IC503
APX803D29
3
1
GND
NON_PD_+3.5V
R516
100K
NON_PD_+3.5V
IC502
APX803D29
3
1
GND
+3.5V_ST
R522
10K
OPT
R520
RESET
2
RESET
2
100
R519
100
NON_PD_+3.5V
POWER_DET
ESD
C520
0.1uF
16V
not to RESET at 8kV ESD
15V-->3.6V
20V-->3.5V
24V-->3.48V
12V-->3.58V
ST_3.5V-->3.5V
+0.9V_CORE_BCM35230
+12V
L502
BLM18PG121SN1D
Placed on SMD-TOP
C505
C503
10uF
10uF
16V
16V
POWER_ON/OFF2_2
R503
C504
100pF
50V
12K
1%
R501
R2
1K
R504
2K
C509
+3.3V_Normal
TEST
C507
1000pF
50V
R505
6.8K
1%
R1
10K
R506
330
50V
220pF
R507
C510
0.01uF
50V
OPT
ENABLE
COMP
VDD
PGD
C513
0.1uF
16V
FB
IC501
TPS40192DRCR
1
2
3
4
5
11
THERMAL
EP_GND
HDRV
10
9
8
7
6
SW
BOOT
LDRV
BP5
R5774.7
C515
0.47uF
25V
R5784.7
C516
4.7uF
Vout=0.591*(1+R1/R2)
10V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
OK (0x7F,0xC9)
OK (0x7F, 0xB9)
OK (0x7F, 0xA9)
OK (0x7F, 0x99)
1. Adjust Check
: This menu displays Country Group, Tool Option and Adjust Result
Information. This is very useful when you want to know about TV systems
adjustment as White Balance, ADC.
1) Country Group
- You can change Country Group and Tool Optio n only. This change is saved
real-time.
2) Tool Option
- You can change Tool Option value. Move a cursor to dialog box and push
some numbers with remote-controller.
3) Adjust White Balance
- This dialog box shows the result of White Balance adjustment. OK/NG
4) Adjust ADC
- You need not control ADC
5) EDID
- This dialog box shows the status of EDID Download.
Page 72
22. Trouble shooting - SW download
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
The latest S/W put in the ‘LG DTV’ folder of USB Memory
USB connects to USB jack for service.
If SW update screen appears,
push the OK button.
The SW update is finished, please check new SW version by
in-start menu.
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