LG 47LB650T-DF Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LT42B

MODEL : 47LB650T 47LB650T-DF

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFLMFL68007707 (1402-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION .............................................................. 18

EXPLODED VIEW .................................................................................. 26

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This spec sheet is applied all of the 32”,39’’,42”,47”,55”,60”, 70” LED TV with LT42B chassis

2. Test condition

Each part is tested as below without special notice.

1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage Standard input voltage (100~240V@ 50/60Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.

5) The receiver must be operated for about 20 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC: CE, IEC

Only for training and service purposes

- 6 -

4. General Specification

No Item Specication Remark

1. Display Screen Device 32” wide Color Display Module Resolution: 1366*768

32” wide Color Display Module Resolution: 1920*1080

39” wide Color Display Module Resolution: 1920*1080

42” wide Color Display Module Resolution: 1920*1080

47” wide Color Display Module Resolution: 1920*1080

50” wide Color Display Module Resolution: 1920*1080

55” wide Color Display Module Resolution: 1920*1080

60” wide Color Display Module Resolution: 1920*1080

70” wide Color Display Module Resolution: 1920*1080

2. Aspect Ratio 16:9 All

3. LCD Module 32" TFT WUXGA LCD

32" TFT WXGA LCD

39" TFT WXGA LCD

42" TFT WUXGA LCD

47” TFT WUXGA LCD

50” TFT WUXGA LCD

55” TFT WUXGA LCD

60” TFT WUXGA LCD

70” TFT WUXGA LCD

4. Operating Environment TFT 1) Temp. : 0 ~ 40 deg

5. Storage Environment TFT 1) Temp. : -20 ~ 60 deg

6. Input Voltage AC100 ~ 240V, 50/60Hz

7. Power Consumption(Max) = LCD(Module) + Backlight(LED)

FHD T240Hz Slim Direct

FHD M120Hz Direct

FHD T240Hz Edge LED

2) Humidity : 0 ~ 85%

2) Humidity : 10 ~ 90%

60”’ 72.16 W

39” 45.74 W FPR : LC550EUJ-SEK1 [55LA6200-DA]

42’’ TBD W LC420DUH-FGP2

47’’ TBD W LC470DUH-FGP2

50’’ 64.1 W LC500DUH-FGP2

55’’ 62.5 W LC550DUH-FGP2

60’’ TBD W LC600DUF-FGP2

49”’ 50.24 W FPR : LC490EUH-LGF1 [49LB870T-DA]

LGE SPEC

LC600DUF-FGP1 [60LB720T-DA]

[42LB6500-DF / 42LB650T-DF]

[47LB6500-DF / 47LB650T-DF]

[50LB6500-DF / 50LB650T-DF]

[55LB6500-DF / 55LB650T-DF]

[60LB6500-DF / 60LB650T-DF]

Only for training and service purposes

- 7 -

8. LCD Module Size Maker Inch (H) × (V) × (D)

LGD 32” 725.2 x 424.4 x 35.0

725.2×424.4 X 35.0

725.8 x 425 x 37.4

42” 959.5 x 559.5 x 25.0 LC420DUH-FGP2

958 x 559.1 x 9.9

956.4 x 555.0 x 37.4

958.2 x 555.8 x 35.0

47” 1071 x.621.6x26.3 LC470DUH-FGP2

1070.6 x 622.0 x 9.9

1068.0 x 617.8 x 38.8

1067.6 x 617.4 x 36.5

49” 1086.3 X 622.0 X 9.9 LC490EUH-LGF1 [49LB870T-DA]

50” 1121.6 x 644.3 x 10.8

1126.11 x 652.5 x 26.3 LC500DUH-FGP2

55” 1241.19 x 717.94 x 26 LC550DUH-FGP2

1244.6 x 720.9 x 9.9

1232.0 x 704.0 x 1.94

1237.4 x 712.8 x 35

1229.4 x 706.3 x 9.9

60” 1350.89x 780.54 x 28 LC600DUF-FGP1 [60LB720T-DA]

1346.8 x 774.4 x 29.9 LC600DUF-FGP2

CMI 39” 853.92 × 480.33 ×38.5

AUO 50” 1111.8x637.3x26.2

39” 853.92 × 480.33 ×38.5

39’’ 881.12 x 512.1 x 46.7

HeeSung 60” 1346.8 x 774.4 x 29.9

BOE 32” 725.2 x 424.4 x 35.0

SHARP 32” 725.2 x 424.4 x 35.0

[42LB6500-DF / 42LB650T-DF]

[47LB6500-DF / 47LB650T-DF]

[50LB6500-DF / 50LB650T-DF]

[55LB6500-DF / 55LB650T-DF]

[60LB6500-DF / 60LB650T-DF]

Only for training and service purposes

- 8 -

Pixel Pitch Maker Inch (H) × (V) × (D)

LGD 32” TBD

170.25 x 510.75

363.75 x 363.75

39’’ 444.75 x 444.75 T390HVJ01.2 [39LB650T-DF]

42” 483.3 x 483.3 LC420DUH-FGP2

483.3 x 483.3

47” 541.5 x 541.5 LC470DUH-FGP2

541.5 x 541.5

49” 559.3 x 559.3 FPR : LC490EUH-LGF1 [49LB870T-DA]

50” 570.75 x 570.75

570.75 x 570.75 LC500DUH-FGP2

55” 630 x 630 LC550DUH-FGP2

630 x 630

60 686.1 x 686.1 LC600DUF-FGP1 [60LB720T-DA]

TBD LC600DUF-FGP2

CMI 39” 176.75*530.25

AUO 50” 570.75 x 570.75

39” 444.75 x 444.75

HeeSung 60” 687 x 687

BOE 32” 170.25 x 510.75

SHARP 32” 510.75 x510.75

[42LB6500-DF / 42LB650T-DF]

[47LB6500-DF / 47LB650T-DF]

[50LB6500-DF / 50LB650T-DF]

[55LB6500-DF / 55LB650T-DF]

[60LB6500-DF / 60LB650T-DF]

Only for training and service purposes

- 9 -

8. Back Light Maker Inch TYPE Module Name

LGD 32” Slim Direct

42”

47”

60” LC600DUF-FGP1 [60LB720T-DA]

42” Edge

47”

49” FPR : LC490EUH-LGF1 [49LB870T-DA]

50”

55”

50” Direct M

55”

60”

39” D-LED, CMI

D-LED, AUO

39’’ Direct L T390HVJ01.2 [39LB650T-DF]

42’’ LC420DUH-FGP2

47 LC470DUH-FGP2

50 LC500DUH-FGP2

55 LC550DUH-FGP2

60’’ LC600DUF-FGP2

AUO 50” Edge

HeeSung 60” D-LED

BOE 32”

SHARP 32”

Display Colors 1.06 B (10-bit) Except FHD 60Hz models

16.7 M (8-bit) FHD/HD 60Hz models

Coating 3H(Hard coating), Anti-glare

[42LB6500-DF / 42LB650T-DF]

[47LB6500-DF / 47LB650T-DF]

[50LB6500-DF / 50LB650T-DF]

[55LB6500-DF / 55LB650T-DF]

[60LB6500-DF / 60LB650T-DF]

AUO_T390HVJ01.2 [39LB6500]

Only for training and service purposes

- 10 -

5. External Input Support Format

5.1. Component input(Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I

2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I

3. 720*480 31.50 60 27.027 SDTV 480P

4. 720*480 31.47 59.94 27.00 SDTV 480P

5. 720*576 15.625 50* 13.5 SDTV 576I

6. 720*576 31.25 50* 13.5 SDTV 576P

7. 1280*720 37.5 50* 74.25 HDTV 720P

8. 1280*720 45.00 60.00 74.25 HDTV 720P

9. 1280*720 44.96 59.94 74.176 HDTV 720P

10. 1929*1080 28.125 50* 74.25 HDTV 1080I

11. 1920*1080 33.75 60.00 74.25 HDTV 1080I

12. 1920*1080 33.72 59.94 74.176 HDTV 1080I

13. 1920*1080 56.25 50* 148.5 HDTV 1080P

14. 1920*1080 67.50 60 148.50 HDTV 1080P

15. 1920*1080 67.432 59.94 148.352 HDTV 1080P

16. 1920*1080 27.00 24.00 74.25 HDTV 1080P

17. 1920*1080 26.97 23.976 74.176 HDTV 1080P

18. 1920*1080 33.75 30.00 74.25 HDTV 1080P

19. 1920*1080 33.71 29.97 74.176 HDTV 1080P

Only for training and service purposes

- 11 -

5.2. HDMI : EDID DATA : Refer to adjust specification

5.2.1. DTV mode

No Resolution H-freq(kHz) V-freq.(Hz)

1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out but display

2 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4 720*480 31.47 59.94 27 SDTV 480P

5 31.5 60.00 27.027 SDTV 480P

6 720*576 31.25 50.00 27 SDTV 576P

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 45 60.00 74.25 HDTV 720P

9 37.5 50.00 74.25 HDTV 720P

10 1920*1080 28.125 50.00 74.25 HDTV 1080I

11 33.72 59.94 74.176 HDTV 1080I

12 33.75 60.00 74.25 HDTV 1080I

13 26.97 23.976 63.296 HDTV 1080P

14 27.00 24.000 63.36 HDTV 1080P

15 33.71 29.97 79.120 HDTV 1080P

16 33.75 30.00 79.20 HDTV 1080P

17 56.25 50.00 148.5 HDTV 1080P

18 67.432 59.94 148.350 HDTV 1080P

19 67.5 60.00 148.5 HDTV 1080P

Pixel

clock(MHz)

Proposed Remark

5.2.2. PC mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed Remarks

1 640*350 31.468 70.09 25.17 EGA

2 720*400 31.469 70.09 28.32 DOS

3 640*480 31.469 59.94 25.17 VESA(VGA)

4 800*600 37.879 60.31 40 VESA(SVGA)

5 1024*768 48.363 60.00 65 VESA(XGA)

6 1152*864 54.348 60.053 80.002 VESA(VGA)

7 1360*768 47.712 60.015 84.75 VESA(WXGA)

8 1280*1024 63.981 60.020 109.00 SXGA

9 1920*1080 67.5 60 158.40 WUXGA (Reduced Blanking) Only FHD Model

Only FHD Model (Support to HDMI-PC)

Only for training and service purposes

- 12 -

5.3. 3D mode

5.3.1. RF Input (3D supported mode manually)

No Resolution Proposed 3D input proposed mode

1 HD 1080I

720P

2 SD 576P

576I

5.3.2. RF Input (3D supported mode automatically)

No Signal 3D input proposed mode

1 Frame Compatible Side by Side(Half), Top & Bottom

5.3.3. HDMI Input 1.3(3D supported mode manually)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1 1280*720 45.00 60.00 74.25 HDTV 720P 2D to 3D

2 1280*720 37.500 50 74.25 HDTV 720P 2D to 3D

3 1920*1080 33.75 60.00 74.25 HDTV 1080I 2D to 3D

4 1920*1080 28.125 50.00 74.25 HDTV 1080I 2D to 3D

5 1920*1080 27.00 24.00 74.25 HDTV 1080P 2D to 3D

6 1920*1080 28.12 25 74.25 HDTV 1080P 2D to 3D

7 1920*1080 33.75 30.00 74.25 HDTV 1080P 2D to 3D

8 1920*1080 56.25 50 148.5 HDTV 1080P 2D to 3D

9 1920*1080 67.50 60.00 148.5 HDTV 1080P 2D to 3D

2D to 3D Side by Side(Half) Top & Bottom

2D to 3D

Side by Side(half), Top & Bottom, Single Frame Sequential

Side by Side(half), Top & Bottom

Side by Side(half), Top & Bottom, Checkerboard

Side by Side(half), Top & Bottom, Checkerboard, Single Frame Sequential, Row Interleaving, Column Interleaving

Only for training and service purposes

- 13 -

5.3.4. HDMI Input 1.4b (3D supported mode automatically)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed

mode

1 640*480 31.469 / 31.5 59.94/ 60 25.175/25.2 Top-and-Bottom

Side-by-side(half)

2 62.938 / 63 59.94/ 60 50.35/50.4 Frame packing

Line alternative

3 31.469 / 31.5 59.94/ 60 50.35/50.4 Side-by-side(Full) (SDTV 480P)

4 720*480 31.25 50 27 Top-and-Bottom

Side-by-side(half)

5 62.5 50 54 Frame packing

Line alternative

6 31.25 50 54 Side-by-side(Full) (SDTV 480P)

7 720*576

(576p)

8 62.5 50 54 Frame packing

9 31.25 50 54 Side-by-side(Full) (SDTV 576P)

10 720 (1440)*576

(576i)

11 31.25 50 54 Frame packing

12 15.625 50 54 Side-by-side(Full) (SDTV 576I)

13 1280*720 37.5 50 74.25 Top-and-Bottom

14 75 50 148.5 Frame packing

15 37.5 50 148.5 Side-by-side(Full) (HDTV 720P)

16 44.96 / 45 59.94 / 60 74.18/74.25 Top-and-Bottom

17 89.91 / 90 59.94 / 60 148.35/148.5 Frame packing

18 44.96 / 45 59.94 / 60 148.35/148.5 Side-by-side(Full) (HDTV 720P)

31.25 50 27 Top-and-Bottom Side-by-side(half)

Line alternative

15.625 50 27 Top-and-Bottom Side-by-side(half)

Field alternative

Side-by-side(half)

Line alternative

Side-by-side(half)

Line alternative

Secondary(SDTV 480P) Secondary(SDTV 480P)

Secondary(SDTV 480P) (SDTV 480P)

Secondary(SDTV 480P) Secondary(SDTV 480P)

Secondary(SDTV 480P) (SDTV 480P)

Secondary(SDTV 576P) Secondary(SDTV 576P)

Secondary(SDTV 576P) (SDTV 576P)

Secondary(SDTV 576I) Secondary(SDTV 576I)

Secondary(SDTV 576I) (SDTV 576I)

Primary(HDTV 720P) Primary(HDTV 720P)

Primary(HDTV 720P) (HDTV 720P)

Primary(HDTV 720P) Primary(HDTV 720P)

Primary(HDTV 720P) (HDTV 720P)

Proposed

Only for training and service purposes

- 14 -

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed

mode

19 1920*1080 33.72 / 33.75 59.94 / 60 74.18/74.25 Top-and-Bottom

Side-by-side(half)

20 67.432 / 67.5 59.94 / 60 148.35/148.5 Frame packing

Field alternative

21 33.72 / 33.75 59.94 / 60 148.35/148.5 Side-by-side(Full) (HDTV 1080I)

22 28.125 50.00 74.25 Top-and-Bottom

Side-by-side(half)

23 56.25 50.00 148.5 Frame packing

Field alternative

24 28.125 50.00 148.5 Side-by-side(Full) (HDTV 1080I)

25 26.97 / 27 23.97 / 24 74.18/74.25 Top-and-Bottom

Side-by-side(half)

26 43.94 / 54 23.97 / 24 148.35/148.5 Frame packing

Line alternative

27 26.97 / 27 23.97 / 24 148.35/148.5 Side-by-side(Full) (HDTV 1080P)

28 28.12 25 74.25 Top-and-Bottom

Side-by-side(half)

29 56.25 25 148.5 Frame packing

Line alternative

30 28.125 25 148.5 Side-by-side(Full) (HDTV 1080P)

31 33.716 / 33.75 29.976 / 30.00 74.18/74.25 Top-and-Bottom

Side-by-side(half)

32 67.432 / 67.5 29.976 / 30.00 148.35/148.5 Frame packing

Line alternative

33 33.716 / 33.75 29.976 / 30.00 148.35/148.5 Side-by-side(Full) (HDTV 1080P)

34 56.25 50 148.5 Top-and-Bottom

Side-by-side(half)

35 67.43 / 67.5 59.94 / 60 148.35/148.50 Top-and-Bottom

Side-by-side(half)

Secondary(HDTV 1080I) Primary(HDTV 1080I)

Primary(HDTV 1080I) (HDTV 1080I)

Secondary(HDTV 1080I) Primary(HDTV 1080I)

Primary(HDTV 1080I) (HDTV 1080I)

Primary(HDTV 1080P) Primary(HDTV 1080P)

Primary(HDTV 1080P) (HDTV 1080P)

Secondary(HDTV 1080P) Secondary(HDTV 1080P)

Secondary(HDTV 1080P) (HDTV 1080P)

Primary(HDTV 1080P) Secondary(HDTV 1080P)

Primary(HDTV 1080P) (HDTV 1080P)

Primary(HDTV 1080P) Secondary(HDTV 1080P)

Proposed

5.3.5. HDMI-PC 3D Input (3D supported mode manually)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1 1024*768 48.36 60 65 2D to 3D,

Side by Side(half) Top & Bottom

2 1360*768 47.71 60 85.5 2D to 3D,

Side by Side(half) Top & Bottom

3 1920*1080 67.500 60 148.50 2D to 3D,

Side by Side(half) Top & Bottom, Checker Board, Single Frame Sequential Row Interleaving, Column Interleaving

4 Others - - - 2D to 3D 640*350

- 15 -

Only for training and service purposes

HDTV 768P

HDTV 1080P

720*400 640*480 800*600 1152*864

5.3.6. Component 3D Input (3D supported mode manually)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1 1280*720 37.5 50 74.25 2D to 3D,

Side by Side(half), Top & Bottom

2 1280*720 45.00 60.00 74.25 2D to 3D,

Side by Side(half), Top & Bottom

3 1280*720 44.96 59.94 74.176 2D to 3D,

Side by Side(half) Top & Bottom

4 1920*1080 33.75 60.00 74.25 2D to 3D,

Side by Side(half) Top & Bottom

5 1920*1080 33.72 59.94 74.176 2D to 3D,

Side by Side(half) Top & Bottom

6 1920*1080 28.12 50 74.25 2D to 3D,

Side by Side(half) Top & Bottom

7 1920*1080 67.500 60 148.50 2D to 3D,

Side by Side(half) Top & Bottom

8 1920*1080 67.432 59.94 148.352 2D to 3D,

Side by Side(half) Top & Bottom

9 1920*1080 27.000 24.000 74.25 2D to 3D,

Side by Side(half) Top & Bottom

10 1920*1080 28.12 25 74.25 2D to 3D,

Side by Side(half) Top & Bottom

11 1920*1080 56.25 50 74.25 2D to 3D,

Side by Side(half) Top & Bottom

12 1920*1080 26.97 23.976 74.176 2D to 3D,

Side by Side(half) Top & Bottom

13 1920*1080 33.75 30.000 74.25 2D to 3D,

Side by Side(half) Top & Bottom

14 1920*1080 33.71 29.97 74.176 2D to 3D,

Side by Side(half) Top & Bottom

HDTV 720P

HDTV 1080I

HDTV 1080P

Only for training and service purposes

- 16 -

5.3.7. USB Input (3D) (3D supported mode manually)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1 1920*1080 33.75 30 74.25 2D to 3D

Side by Side(Half)*, Top & Bottom*, Checkerboard* Row Interleaving, Column Interleaving (Photo : side by Side(half), Top & Bottom)

HDTV 1080P

5.2.8. DLNA Input (3D)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1 1920*1080 33.75 30 74.25 2D to 3D

Side by Side(Half)*, Top & Bottom*, Checkerboard* Row Interleaving, Column Interleaving (Photo : side by Side(half), Top & Bottom)

HDTV 1080P

Only for training and service purposes

- 17 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied all of the LT42B LED TV models, which produced in manufacture department or similar LG TV factory

2. Notice

(1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation transformer will help protect test instrument.

(2) Adjustment must be done in the correct order. But it is

flexible when its factory local problem occurs.

(3) The adjustment must be performed in the circumstance of

25 ±5ºC of temperature and 65±10% of relative humidity if there is no specific designation.

(4) The input voltage of the receiver must keep 100~220V,

50/60Hz.

(5) Before adjustment, execute Heat-Run for 5 minutes.

▪ After Receive 100% Full white pattern (06CH) then process

Heat-run

(or “8. Test pattern” condition of Ez-Adjust status)

▪ How to make set white pattern

1) Press Power ON button of Service Remocon

2) Pr ess ADJ button of Service remocon. Select “8. Test pattern” and, after select “White” using navigation button, and then you can see 100% Full White pattern.

* In this status you can maintain Heat-Run useless any pattern

generator

* Notice : if you mai nt ain one pictu re ov er 20 minutes

(Especially sharp distinction black with white pattern

-13Ch, or Cross hatch pattern – 09Ch) then it can appear image stick near black level.

4. PCB Assembly Adjustment

4.1. MAC Address, ESN Key and Widevine Key download

4.1.1. Equipment & Condition

1) Play file: keydownload.exe

4.1.2. Communication Port connection

1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)

2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)

4.1.3. Download process

1) Select the download items.

2) Mode check: Online Only

3) Check the test process

- DETECT -> MAC_WRITE -> ESN_WRITE -> WIDEVINE_ WRITE

4) Play : START

5) Check of result: Ready, Test, OK or NG

4.1.4. Communication Port connection

1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C

Port

3. Adjustment items

3.1. PCB Assembly Adjustment

▪ MAC Address / ESN / Widevine / HDCP1.4 / HDCP 2.0

Download

▪ EDID (The Extended Display Identification Data)/DDC

(Display Data Channel) download * If it is necessary, it can adjustment at Manufacture Line You can see set adjustment status at “1. ADJUST CHECK”

of the “In-start menu”

3.2. Set Assembly Adjustment

▪ Color Temperature (White Balance) Adjustment ▪ Using RS-232C ▪ PING Test ▪ Selection Factory output option

Only for training and service purposes

4.1.5. Download

1) 14Y LCD TV+MAC+Widevine+ESN Key+ HDCP1.4 and HDCP2.0

4.1.6. Inspection

- In INSTART menu, check these keys.

- 18 -

4.2. LAN PORT INSPECTION(PING TEST)

4.2.1. Equipment setting

1) Play the LAN Port Test PROGRAM.

2) Input IP set up for an inspection to Test Program.

*IP Number : 12.12.2.2.

4.2.2. LAN PORT inspection (PING TEST)

1) Play the LAN Port Test Program.

2) connect each other LAN Port Jack.

3) Play Test (F9) button and confirm OK Message.

4) remove LAN CABLE

4.3. ADC Adjust => No need at Assembly line because of OPT type

* OTP mode Automatic ADC Calibration. (Internal ADC Calibration) On the manufacture line, OTP is used for ADC Calibration automatically.

* External mode Manual ADC Calibration. When OTP mode is failed, ADC calibration should be “OK” by using External mode.

- If you want re-adjust for ADC.

■ Enter Service Mode by pushing “ADJ” key,

■ Enter Internal ADC mode by pushing “►” key at “9. ADC

Calibration”

■

Adjustment protocol

Order Command Set response

(1) Inter the Adjustment mode aa 00 00 a 00 OK00x

(2) Change the Source xb 00 40 b 00 OK40x (Adjust 480i Comp1 )

(3) Start Adjustment ad 00 10

(4) Return the Response OKx ( Success condition )

(5) Read Adjustment data ( main)

ad 00 20 ( main ) ad 00 30

(6) Conrm Adjustment ad 00 99 NG 03 00x (Failed condition)

(7) End of Adjustment ad 00 90 d 00 OK90x

(Adjust 1080p Comp1)

NGx ( Failed condition )

(main : component1 480i) 000000000000000000000000007c007b006dx (main : component1 1080p) 000000070000000000000000007c0083 0077x

NG 03 01x (Failed condition) NG 03 02x (Failed condition) OK 03 03x (Success condition)

Only for training and service purposes

- 19 -

5. Factory Adjustment

5.1. EDID (The Extended Display Identification Data)/DDC (Display Data Channel) Download

● Summary

▪ It is established in VESA, for communication between PC

and Monitor without order from user for building user condition. It helps to make easily use realize “Plug and Play” function. For EDID data write, we use DDC2B protocol.

● Auto Download (No need Writing EDID data in Assembly line)

▪ After Set Tool Option, then TV turn off and on finish auto

download

* EDID data for 3DTV (LB65/67/72/87 Serise) (Model name =

LG TV ) .

*Rev. 15xxx to confirm that, Rev. up subject to change

- HDMI EDID table

- HDMI-1 EDID table (0XE8, 0xCC)

* EDID data for Non-3DTV (FHD) (Model name = LG TV ) *Rev. 24xxx to confirm that, Rev. up subject to change

- HDMI EDID table

- HDMI-1 EDID table (0x42, 0X1B)

A. If the LVDS supports 8bit (not support Deep color) , CEA

Block 0x23 :80, 0x24 : 1E) (1) HDMI 1 Check sum : 0x42, 0X1B (CEA Block 0x21 :10) (2) HDMI 2 Check sum : 0x42, 0X0B (CEA Block 0x21 :20) (3) HDMI 3 Check sum : 0x42, 0XFB (CEA Block 0x21 :30)

A. If support 8bit (not support Deep color) (1) HDMI 1 Check sum : 0xE8, 0XCC (CEA Block 0x21 :10) (2) HDMI 2 Check sum : 0x E8, 0XBC (CEA Block 0x21 :20) (3) HDMI 3 Check sum : 0x E8, 0XAC (CEA Block 0x21 :30)

B. If support 10bit (support Deep color) (1) HDMI 1 Check sum : 0xE8, 0X85 (CEA Block 0x21 :10) (2) HDMI 2 Check sum : 0x E8, 0X75 (CEA Block 0x21 :20) (3) HDMI 3 Check sum : 0x E8, 0X65 (CEA Block 0x21 :30)

B. If the LVDS supports 10bit (support Deep color) , CEA Block

0x23 :B8, 0x24 : 2D) (1) HDMI 1 Check sum : 0x42, 0XD4 (CEA Block 0x21 :10) (2) HDMI 2 Check sum : 0x42, 0XC4 (CEA Block 0x21 :20) (3) HDMI 3 Check sum : 0x42, 0XB4 (CEA Block 0x21 :30

* EDID data for Non-3DTV (HD) (Model name = LG TV) *Rev. 24xxx to confirm that, Rev. up subject to change

- HDMI EDID table

- HDMI-1 EDID table (0X76, 0XE2)

Only for training and service purposes

- 20 -

(1) HDMI 1 Check sum : 0X76, 0XE2 (CEA Block 0x21 :10) (2) HDMI 2 Check sum : 0X76, 0XD2 (CEA Block 0x21 :20) (3) HDMI 3 Check sum : 0X76, 0XC2 (CEA Block 0x21 :30)

5.2. Adjustment White balance

● W/B Equipment condition

CA210 : CH 14, Test signal : Inner pattern (80IRE) – LED

Module

CH18 , Test signal : Inner pattern (80IRE) – ALEF

Module

● Above 5 minutes H/run in the inner pattern. (“power on” key of

adjust remote control)

※ The spec of color temperature and coordinate.

X=0.271

Cool (C50) 13,000k K

All

Medium (0) 9,300k K

Warm (W50) 6,500k K

※ Normal line(LGD Module (LB5xxx, LB6xxx, LB7xxx, LB8xxx))

- Except Winter Season ( Jan. , Feb. ) and Global table

Cool Medium Warm

H/R Time(Min)

1 0-2 282 289 297 308 324 348

2 3-5 281 287 296 306 323 346

3 6-9 279 284 294 303 321 343

4 10-19 277 280 292 299 319 339

5 20-35 275 277 290 296 317 336

6 36-49 274 274 289 293 316 333

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

x y x x y x

271 270 286 289 313 329

※ AUO, INX, Sharp, CSOT, BOE Model (in case, Cool spec =

13000K)

cool med warm

x y x y x y

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

(±0.002) Y=0.270 (±0.002)

X=0.286 (±0.002) Y=0.289 (±0.002)

X=0.313 (±0.002) Y=0.329 (±0.002)

- Inner pattern for W/B adjust

- External white

pattern (80IRE, 204gray)

※ Connecting picture of the measuring instrument (On Automatic

control)

Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER-ON -> Enter the mode of White-Balance, the pattern will come out

● Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (Illumination is less than 10ux).

(2) Adhere closely the Color Analyzer ( CA210 ) to the module

less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°).

(3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.

● Auto adjustment Map(RS-232C)

RS-232C COMMAND [ CMD ID DATA ] Wb 00 00 White Balance Start Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm 00 Cool Mid Warm

R Gain Jg ja jd 00 172 192 192 192

G Gain Jh jb je 00 172 192 192 192

B Gain Ji jc jf 192 192 172 192

R Gain 64 64 64 128

G Gain 64 64 64 128

B Gain 64 64 64 128

MIN CENTER

(DEFAULT)

MAX

Only for training and service purposes

- 21 -

● Manual W/B process using adjusts Remote control.(TBD)

- Co lor analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000

- Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting.

- After enter Service Mode by pushing “ADJ” key,

- Enter White Balance by pushing “►” key at “8. White

Balance”

● For manual adjustment, it is also possible by the following

sequence

(1) Set TV in Adj. mode using “P-ONLY” key on remote controller

and then operate heat run longer than 15 minutes.

(I f not executed this step, the condition for W/B may be

different.) (2) Push “Exit” key. (3) Enter White Balance mode by pushing the ADJ key and select

“8. White Balance”. When KEY (►) is pressed, 206 Gray

internal pattern will be displayed.

(4) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface

(5) Select each items (Red/Green/Blue Gain) using ▲/▼(CH +/-)

key on R/C..

(6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.

(7) Adjust three modes all (Cool / Medium / Warm) -Fix the one of

R/G/B gain and change the others

(8) When adjustment is completed, exit adjustment mode using

EXIT key on R/C.

※ CASE Cool

- First adjust the coordinate far away from the target value(x, y). (1) x, y > target (i) Decrease the R, G. (2) x, y < target (i) First decrease the B gain, (ii) Decrease the one of the others. (3) x > target , y < target (i) First decrease B, so make y a little more than the target. (ii) Adjust x value by decreasing the R (4) x < target , y > target (i) First decrease B, so make x a little more than the target. (ii) Adjust x value by decreasing the G

● RS-232C Command (Commonly apply)

RS-232C COMMAND

CMD DATA ID

wb 00 00 White Balance adjustment start

Wb 00 10

wb 00 1f End of gain adjust

wb 00 20

wb 00 2f End of offset adjust

wb 00 ff End of White Balance adjust

Start of adjust gain (Inner white pattern)

Start of offset adjust(Inner white pattern)

(Inner pattern disappeared)

Explanation

▪ “wb 00 00”: Start Auto-adjustment of white balance. ▪ “wb 00 10”: Start Gain Adjustment (Inner pattern) ▪ “jb 00 c0” : ▪ … ▪ “wb 00 1f”: End of Adjustment

* If it needs, offset adjustment (wb 00 20-start, wb 00 2f-end)

▪ “wb 00 ff”: End of white balance adjustment (inner pattern

disappear)

※ Notice) Adjustment Mapping information

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm 00 Cool Mid Warm

R Gain Jg ja jd 00 172 192 192 192

G Gain Jh jb je 00 172 192 192 192

B Gain Ji jc jf 192 192 172 192

R Gain 64 64 64 128

G Gain 64 64 64 128

B Gain 64 64 64 128

MIN CENTER

(DEFAULT)

MAX

5.3. Magic Motion remote controller Check (Only LB67/LB69/LB772/LB87)

5.3.1 Test equipment

- RF-remote controller for check, IR-KEY-CODE remote controller.

- Check AA battery before test. A recommendation is that a tester change battery every lots.

5.3.2. Test

(1) Make pairing with TV set by pressing “Mute (START) key”

on RCU.

(2) Check a cursor on screen by pressing ‘ENTER” or “OK”

key of RCU

(3) Stop paring with TV set by pressing “VOL+ (STOP) key.

※ After You finish all adjustments, Press “In-start” button and

compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.

If it is not same, then correct it same with BOM and unplug AC

cable. For correct it to the model’s module from factory JIG model.

※ Push The “I N STOP KEY” after completing the functi on

inspection.

Only for training and service purposes

- 22 -

5.4. 3D pattern test

5.4.1. Test equipment

(1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4

support)

(2) Pattern: HDMI mode (model No. 872, pattern No. 83)

5.5. HDMI ARC Function Inspection

5.5.1. Test equipment

- Optic Receiver Speaker

- MSHG-600 (SW: 1220 ↑)

- HDMI Cable (for 1.4 version)

5.4.2. Test method

(1) Input 3D test signal as Fig.1.

(2) Press ‘OK” key as a 3D input OSD is shown. (3) Check pattern as Fig2 without 3D glasses. (3D mode

without 3D glasses)

Fig.2

5.5.2. Test method

(1) Insert the HDMI Cable to the HDMI ARC port from the

master equipment (HDMI1)

(2) Check the sound from the TV Set

(3) Check the Sound from the Speaker or using AV & Optic

TEST program (It’s connected to MSHG-600)

Only for training and service purposes

Fig.3

* Remark: Inspect in Power Only Mode and check SW version

in a master equipment

5.6. Selection of Country option

Selection of country option is allowed only North American model (Not allowed Korean model). It is selection of Country about Rating and Time Zone.

▪ Models: All models which use LJ22E Chassis (See the first

page.)

▪ Press “In-Start” button of Service Remocon, then enter the

“Option” Menu with “PIP CH-“ Button

▪ Select one of these three (USA, CANADA, MEXICO) defends

on its market using “Vol. +/-“button.

- 23 -

5.7. MHL Test

Green Eye-Check

Sensor Data : 492 BackLight : 100

OK

Step 1) Turn on TV Step 2) Select HDMI4 mode using input Menu. Step 3) Set MHL Zig(M1S0D3617) using MHL input, output

and power code.

Step 4) Connect HDMI cable between MHL Zig and HDMI4

port.

Step 5) Check LED light of Zig and Module of Set

5.9. Intelligent Sensor Inspection

Step 1) Turn on the TV set. Step 2) Press “ EY E” button o n t he Adjust me nt remote

controller.

Step 3) Block the Intelligent Sensor module on the front C/A

about 6 seconds. When the “Sensor Data” is lower than 20, you can see the “OK” message

=> If it doesn’t show “OK” message, the Sensor Module is

defected one. You have to replace that with a good one.

Step 4) After check the “OK” message come out, take out your

hand from the Sensor module

=> Check “Sensor Data” value change from “0” to “300” or

not. If it doesn’t change the value, the sensor is also defected one. You have to replace it.

※ Caution : Don’t push The INSTOP KEY after completing the

function inspection

Result) If, The LED light is green and The Module shows normal stream -> OK Else -> NG

※ Caution : Don’t push The INSTOP KEY after completing the

function inspection.

5.8. Local Dimming Function Check

Step 1) Turn on TV Step 2) Press “TILT” key on the Adj. R/C Step 3) At the Local Dimming mode, module Edge Backlight

moving left to right. Back light of IOP module moving Step 4) confirm the Local Dimming mode. Step 5) Press “exit” key.

Only for training and service purposes

6. GND and HI-POT Testing

6.1. GND & HI-POT auto-check preparation Check the connection between set and power cord

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

6.2. GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX) (5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process

automatically

6.3. Check Point

(1) Test voltage 3 Poles : GND: 1.5KV/min at 100mA / SIGNAL: 3KV/min at

100mA (2) TEST time: 1 second (3) TEST POINT 3 Poles : GND Test = POWER CORD GND and SIGNAL

CABLE GND. Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms

- 24 -

7. Default Service option

7.1. ADC-Set

▪ R-Gain adjustment Value (default 128) ▪ G-Gain adjustment Value (default 128) ▪ B-Gain adjustment Value (default 128) ▪ R-Offset adjustment Value (default 128) ▪ G-Offset adjustment Value (default 128) ▪ B-Offset adjustment Value (default 128)

7.2. White balance. Value

CENTER (DEFAULT)

C50 0 W50

R Gain 192 192 192

G Gain 192 192 192

B Gain 192 192 192

R Cut 64 64 64

G Cut 64 64 64

B Cut 64 64 64

8. USB DOWNLOAD (*.epk file download)

(1) Put the USB Stick to the USB socket (2) Press Menu key, and move General *before 10.2 Step. Set USB Expert Mode : Enabled IN START > System 3 > USB Expert Mode

(3) Press “number key 7” Press 7 times

(4) Select download file (epk file) (5) After download is finished, remove the USB stick. ( it will be

auto-reboot )

(6) Press “IN-START” key of ADJ remote control, check the

S/W version.

Only for training and service purposes

- 25 -

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safet y parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

900

400

410

521

540

LV2

LV1

200

Only for training and service purposes

350

121

530

120

- 26 -

AT1

AG1

A10

Set + Stand

A22

System Configuration

LGE Internal Use Only

Clock for M14-A0

MAIN Clock(24Mhz)

LOADCAP_ATSC_PCB

10pF

C101

C102 LOADCAP_ATSC_PCB

System Clock for Analog block(24Mhz)

PLL SET[1:0] : internal pull up "00" : CPU(1200Mhz),M0 / M1 DDR(792,792 Mhz) "01" : CPU(1056Mhz),M0 / M1 DDR(672,672 Mhz) "10" : CPU(1056Mhz),M0 / M1 DDR(792,792 Mhz) "11" : CPU( 960Mhz),M0 / M1 DDR(792,792 Mhz)

OP MODE[1:0] "00" : Normal Mode "01/10/11" : Internal Test mode

+3.3V_NORMAL

R101 3.3K

R102 3.3K

Extenal test only

+3.3V_NORMAL

+3.3V_TUNER

R148

3.3K

R146

3.3K

KR_PIP_NOT

1.5K

KR_PIP

R146-*1

KR_PIP

R148-*1

10pF

Extenal test only

OPT

R149

2

3

OPT

R103 3.3K

R104 3.3K

OPT

3.3K

X-TAL_1

GND_1

1

4

X-TAL_2

OPM1

OPM0

24MHz

GND_2

X101

R118

PLLSET1

PLLSET0

+3.3V_TUNER

R150

3.3K

R155

1.2K

KR_PIP_NOT

3.3K

KR_PIP

R155-*1

1M

R180 560

LOADCAP_DVB_PCB

C101-*1

6.8pF 50V

+3.3V_NORMAL

INSTANT boot MODE "1 : Instant boot "0 : normal

3.3K

R121

(internal pull down)

OPT

INSTANT_MODE0

+3.3V_NORMAL

R158

R157

R156

3.3K

R156-*1

3.3K

1.2K

XTAL_IN

XTAL_OUT

LOADCAP_DVB_PCB

C102-*1

6.8pF 50V

INSTANT_BOOT

I2C PULL UP

R159

3.3K

R160

3.3K

R161

+3.3V_NORMAL

3.3K

R127

OPT

3.3K

R128

BOOT_MODE0

I2C

I2C_1 : AMP I2C_2 : T-CON,L/DIMING I2C_3 : MICOM I2C_4 : S/Demod,T2/Demod, LNB I2C_5 : NVRAM I2C_6 : TUNER_MOPLL(T/C,ATV)

R162

3.3K

IC103

AT24C256C-SSHL-T

A0

1

A1

2

A2

3

GND

4

NVRAM_ATMEL

BOOT MODE "0 : EMMC "1 : TEST MODE



BOOT_MODE

I2C_SDA1 I2C_SCL1 I2C_SDA_MICOM_SOC I2C_SCL_MICOM_SOC I2C_SDA2 I2C_SCL2

I2C_SDA4 I2C_SCL4

I2C_SDA5 I2C_SCL5

I2C_SDA6 I2C_SCL6

NVRAM

VCC

8

WP

7

SCL

6

SDA

5

+3.3V_NORMAL

C107

0.1uF 16V

Write Protection

- Low : Normal Operation

- High : Write Protection

R143 33

R144 33

IC103-*1

M24256-BRMN6TP

E0

VCC

1

8

WC

E1

7

2

SCL

E2

6

3

SDA

VSS

5

4

NVRAM_ST

I2C_SCL5

I2C_SDA5

I2C_SCL_MICOM_SOC I2C_SDA_MICOM_SOC

LOCAL DIMMING I2C CONTROL

+3.3V_NORMAL

OPT

R105

3.3K

R106

3.3K

LED_SCL LED_SDA

SOC_RESET

FORCED_JTAG_0

P102

12507WS-04L

1

2

3

4

5

+3.3V_NORMAL

R163 10K

OPT

C104

0.1uF 16V

L/DIM0_VS

L/DIM0_SCLK

L/DIM0_MOSI

IRB_SPI_MOSI/TDO1 IRB_SPI_MISO/TDI1

M_REMOTE_RX M_REMOTE_TX

1/16W

33

AR100

I2C_SCL4 I2C_SDA4

I2C_SCL6 I2C_SDA6

PWM_DIM2

PWM_DIM

EMMC_CLK EMMC_CMD EMMC_RST

EMMC_DATA[0-7]

OPT

XTAL_IN

XTAL_OUT

BOOT_MODE

PLLSET0 PLLSET1

TCK0 TDI0

TRST_N1 IRB_SPI_SS/TMS1 IRB_SPI_CK/TCK1

I2C_SCL1 I2C_SDA1

I2C_SCL2 I2C_SDA2

I2C_SCL5 I2C_SDA5

33

R107

33

R108

OPM0 OPM1

R178 33

OPT

R182 10K

R183 10K R184 10K

R185 10K

SOC_RX

SOC_TX

EMMC_DATA[7] EMMC_DATA[6] EMMC_DATA[5] EMMC_DATA[4] EMMC_DATA[3] EMMC_DATA[2] EMMC_DATA[1] EMMC_DATA[0]

12505WS-10A00

JTAG_CPU

B23 A23

R169

AG21

33

AJ18

AB8 AC8

AD8 AE8

AR101

AG30 AG28 AG29 AH29 AJ27 AH27 AG26 AH26

AJ12 AJ13 AH12 AG12

AH23 AG22

AH11 AG11

AG10

AH22 AJ22 AH10 AJ10 AG23 AH24

Y7 Y6 W7 W6 W5

AH7 AJ7

AG8 AH8

AH9 AG9

AJ9

AC6 AC7 AD7 AB7

G32 G33 G31 D31 F33 F32 E32 F31 D33 D32 E31

33

R179 10K

1/16W 5%

Jtag-0 I/F

+3.3V_NORMAL

P103

1

2

3

4

5

6

7

8

9

10

11

IC101

LG1311

XIN_MAIN XO_MAIN

PORES_N

BOOT_MODE

PLLSET0 PLLSET1

OPM0 OPM1

L_VSOUT_LD/TRST0_N DIM0_SCLK/TMS0 DIM1_SCLK/TCK0 DIM1_MOSI/TDI0 DIM0_MOSI/TDO0

SPI_CS0 SPI_SCLK0 SPI_DO0 SPI_DI0/TRST1_N SPI_CS1/TMS1 SPI_SCLK1/TCK1 SPI_DO1/TDO1 SPI_DI1/TDI1

EXT_INTR0 EXT_INTR1 EXT_INTR2 EXT_INTR3

UART0_RXD UART0_TXD UART1_RXD UART1_TXD

UART1_RTS_N UART1_CTS_N

SCL0 SDA0 SCL1 SDA1 SCL2 SDA2 SCL3 SDA3 SCL4 SDA4 SCL5 SDA5

PWM0 PWM1 PWM2 PWM_IN

EMMC_CLK EMMC_CMD EMMC_RESETN EMMC_DATA7 EMMC_DATA6 EMMC_DATA5 EMMC_DATA4 EMMC_DATA3 EMMC_DATA2 EMMC_DATA1 EMMC_DATA0

USB2_0_DP0 USB2_0_DM0

USB2_0_TXRTUNE

USB2_1_DP0 USB2_1_DM0

USB2_1_TXRTUNE

USB3_DP0

USB3_DM0 USB3_TXP0 USB3_TXM0 USB3_RXP0 USB3_RXM0

USB3_RESREF0

USB3_DP1

USB3_DM1 USB3_TXP1 USB3_TXM1 USB3_RXP1 USB3_RXM1

USB3_RESREF1

HUB_PORT_OVER0 HUB_VBUS_CTRL0

EB_CS3 EB_CS2 EB_CS1 EB_CS0

EB_WE_N EB_OE_N

EB_WAIT EB_BE_N1 EB_BE_N0

CAM_CD1_N CAM_CD2_N CAM_CE1_N CAM_CE2_N

CAM_IREQ_N

CAM_RESET

CAM_INPACK_N

CAM_VCCEN_N

CAM_WAIT_N

CAM_REG_N

EB_ADDR0 EB_ADDR1 EB_ADDR2 EB_ADDR3 EB_ADDR4 EB_ADDR5 EB_ADDR6 EB_ADDR7 EB_ADDR8 EB_ADDR9

EB_ADDR10 EB_ADDR11 EB_ADDR12 EB_ADDR13 EB_ADDR14 EB_ADDR15

EB_DATA0 EB_DATA1 EB_DATA2 EB_DATA3 EB_DATA4 EB_DATA5 EB_DATA6 EB_DATA7

L/DIM0_VS

TDI0

L/DIM0_MOSI

L/DIM0_SCLK

TCK0

SOC_RESET

FORCED_JTAG_0

AN9 AM9 AN8

H32 J31 H33

N31 N32 P33 P32 M32 M33 P31

K33 K32 L32 L31 K31 J32 M31

W28 W29

H28 J30 J28 J29

G30 F30 H29 G29 G28

P28 P27 U28 R29 V27 T28 T29 R28 U27 N29

K30 E30 M30 N28 M28 M29 L29 K29 K28 L28 D30

EB_ADDR[10]

F29

EB_ADDR[11]

C32

EB_ADDR[12]

C33

EB_ADDR[13]

C31

EB_ADDR[14]

B33

B32 A32 B31 A31 A30 B30 C30 C29

(TRST0_N)

(TDO0)

(TMS0)

R1712001%

R1722001%

R1732001%

R1742001%

/USB_OCD1

/USB_OCD2 /USB_OCD3

EB_BE_N1 EB_BE_N0

CAM_CD1_N CAM_CD2_N

CAM_IREQ_N CAM_INPACK_N CAM_WAIT_N

EB_ADDR[0] EB_ADDR[1] EB_ADDR[2] EB_ADDR[3] EB_ADDR[4] EB_ADDR[5] EB_ADDR[6] EB_ADDR[7] EB_ADDR[8] EB_ADDR[9]

EB_DATA[0] EB_DATA[1] EB_DATA[2] EB_DATA[3] EB_DATA[4] EB_DATA[5] EB_DATA[6] EB_DATA[7]

12505WS-10A00

WIFI_DP WIFI_DM

USB_DP3 USB_DM3

USB_DP1 USB_DM1

USB_DP2 USB_DM2

USB_CTL1

USB_CTL2 USB_CTL3 EB_WE_N

EB_OE_N

/PCM_CE1 /PCM_CE2

PCM_RESET PCM_5V_CTL CAM_REG_N

Jtag-1 I/F

+3.3V_NORMAL

P104

OPT

1

2

3

4

5

6

7

8

9

10

11

EB_ADDR[0-14]

TP102

EB_DATA[0-7]

TP103

PAGE 1

TP104 TP105

TP106 TP107

TP108 TP109

TP110 TP111 TP112 TP113 TP114 TP115 TP116 TP117

EB_ADDR[0-14]

EB_DATA[0-7]

EB_WE_N EB_OE_N

EB_BE_N1 EB_BE_N0

CAM_CD1_N CAM_CD2_N

/PCM_CE1 /PCM_CE2 CAM_IREQ_N PCM_RESET CAM_INPACK_N PCM_5V_CTL CAM_WAIT_N CAM_REG_N

TRST_N1

IRB_SPI_MISO/TDI1

IRB_SPI_MOSI/TDO1

IRB_SPI_SS/TMS1

IRB_SPI_CK/TCK1

SOC_RESET

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

M14-Peripheral

MID_LG1311

M14 Symbol A

2013.04.04 1

31

PAGE 2

LGE Internal Use Only

FE_DEMOD1_TS_DATA[0-7]

TPI_ERR

AMP_RESET_N

TP226 TP227

FE_DEMOD3_TS_SYNC

FE_DEMOD3_TS_DATA

TPI_DATA[0-7]

Near AMP

C200

1000pF

50V

R231

4.7K

TP228

FE_DEMOD1_TS_CLK

FE_DEMOD1_TS_SYNC

FE_DEMOD1_TS_VAL

FE_DEMOD1_TS_ERROR

FE_DEMOD3_TS_CLK FE_DEMOD3_TS_VAL

SC_DET

R226

100

1/16W

5%

LED_SDA

INSTANT_BOOT

LED_SCL

CAM_SLIDE_DET

CAM_TRIGGER_DET

/RST_HUB

IC101

LG1311

AH30

TP_DVB_CLK

AH32

TP_DVB_SOP

AH31

TP_DVB_VAL

AH33

TP_DVB_ERR

FE_DEMOD1_TS_DATA[7] FE_DEMOD1_TS_DATA[6] FE_DEMOD1_TS_DATA[5] FE_DEMOD1_TS_DATA[4] FE_DEMOD1_TS_DATA[3] FE_DEMOD1_TS_DATA[2] FE_DEMOD1_TS_DATA[1] FE_DEMOD1_TS_DATA[0]

FE_DEMOD2_TS_CLK

FE_DEMOD2_TS_SYNC

FE_DEMOD2_TS_VAL

FE_DEMOD2_TS_ERROR

FE_DEMOD2_TS_DATA

TPI_CLK TPI_SOP TPI_VAL

SC_DET

/RST_PHY

2D/3D_CTL

/TU_RESET1 /TU_RESET2

BT_RESET

HP_DET

OPT

OPC_EN

DEBUG

BIT0

/RST_HUB

COMP1_DET

IR_B_RESET

BIT1 BIT2 BIT3 BIT4 BIT5 BIT6 BIT7

TPI_ERR

TPI_DATA[0] TPI_DATA[1] TPI_DATA[2] TPI_DATA[3] TPI_DATA[4] TPI_DATA[5] TPI_DATA[6] TPI_DATA[7]

MODEL_OPT_11

TP225

RF_SWITCH_CTL

R224

33

CAM_SLIDE_DET

CAM_TRIGGER_DET

MODEL_OPT_12

AV1_CVBS_DET

MODEL_OPT_8 MODEL_OPT_9

MODEL_OPT_10 EPI_LOCK8/6

AM33

TP_DVB_DATA7

AL32

TP_DVB_DATA6

AL33

TP_DVB_DATA5

AK32

TP_DVB_DATA4

AK33

TP_DVB_DATA3

AK31

TP_DVB_DATA2

AJ30

TP_DVB_DATA1

AJ31

TP_DVB_DATA0

AL31

STPI0_CLK

AN32

STPI0_SOP

AM32

STPI0_VAL

AN31

STPI0_ERR

AM31

STPI0_DATA

AH28

STPI1_CLK

AJ28

STPI1_SOP

AK30

STPI1_VAL

AJ29

STPI1_ERR

AG27

STPI1_DATA

A28

TPI_CLK

B28

TPI_SOP

B29

TPI_VAL

C28

TPI_ERR

A27

TPI_DATA0

B27

TPI_DATA1

C27

TPI_DATA2

B26

TPI_DATA3

C26

TPI_DATA4

B25

TPI_DATA5

A25

TPI_DATA6

C25

TPI_DATA7

AG13

GPIO31

AJ19

GPIO30

AG14

GPIO29

AG15

GPIO28

AJ15

GPIO27

AH19

GPIO26

AH18

GPIO25

AG19

GPIO24

AH5

GPIO23

AJ5

GPIO22

AJ6

GPIO21

AH6

GPIO20

AG6

AG24 AH16

AJ21 AH21

AG16 AJ24 AH17 AG17 AH13 AH15 AG18 AH14 AJ16 AH20

GPIO19

AG5

GPIO18

AF7

GPIO17

AG7

GPIO16 GPIO15 GPIO14

V29

GPIO13 GPIO12 GPIO11

V28

GPIO10 GPIO9 GPIO8 GPIO7 GPIO6 GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0

R225

OPT

33

TPIO_CLK TPIO_SOP TPIO_VAL

TPIO_ERR TPIO_DATA0 TPIO_DATA1 TPIO_DATA2 TPIO_DATA3 TPIO_DATA4 TPIO_DATA5 TPIO_DATA6 TPIO_DATA7

EPI_SOE EPI_MCLK EPI_GCLK

EPI_EO

EPI_VST

TX_0N TX_0P TX_1N TX_1P TX_2N TX_2P TX_3N TX_3P TX_4N TX_4P TX_5N TX_5P TX_6N TX_6P TX_7N TX_7P TX_8N TX_8P TX_9N

TX_9P TX_10N TX_10P TX_11N TX_11P TX_12N TX_12P TX_13N TX_13P TX_14N TX_14P TX_15N TX_15P TX_16N TX_16P TX_17N TX_17P TX_18N TX_18P TX_19N TX_19P TX_20N TX_20P TX_21N TX_21P TX_22N TX_22P TX_23N TX_23P

TX_LOCKN

D28 E29 E28 F28 D27 E27 F27 E26 F26 E25 D25 F25

AA5 AB5 AA7 AA6 AB6

AK8 AL8 AK7 AL7 AM6 AN6 AK6 AL6 AK5 AL5 AN4 AN3 AM2 AM1 AM4 AM3 AL4 AL3 AK2 AK1 AK4 AK3 AJ4 AJ3 AH2 AH1 AH4 AH3 AG4 AG3 AF2 AF1 AF4 AF3 AE4 AE3 AD2 AD1 AD4 AD3 AC4 AC3 AB2 AB1 AB4 AB3 AA4 AA3

AM8

TPO_CLK TPO_SOP TPO_VAL TPO_ERR

TPO_DATA[0] TPO_DATA[1] TPO_DATA[2] TPO_DATA[3] TPO_DATA[4] TPO_DATA[5] TPO_DATA[6] TPO_DATA[7]

EPI_SOE MCLK_SOC GCLK_SOC EO_SOC GST_SOC

TXB4N/TX0N TXB4P/TX0P TXB3N/TX1NFE_DEMOD3_TS_ERROR TXB3P/TX1P TXBCLKN/TX2N TXBCLKP/TX2P TXB2N/TX3N TXB2P/TX3P TXB1N/TX4N TXB1P/TX4P TXB0N/TX5N TXB0P/TX5P

TXD4N/TX12N TXD4P/TX12P TXD3N/TX13N TXD3P/TX13P TXDCLKN/TX14N TXDCLKP/TX14P TXD2N/TX15N TXD2P/TX15P TXD1N/TX16N TXD1P/TX16P TXD0N/TX17N TXD0P/TX17P

TPO_DATA[0-7]

TXA4N/TX6N TXA4P/TX6P TXA3N/TX7N TXA3P/TX7P TXACLKN/TX8N TXACLKP/TX8P TXA2N/TX9N TXA2P/TX9P TXA1N/TX10N TXA1P/TX10P TXA0N/TX11N TXA0P/TX11P

TXC4N/TX18N TXC4P/TX18P TXC3N/TX19N TXC3P/TX19P TXCCLKN/TX20N TXCCLKP/TX20P TXC2N/TX21N TXC2P/TX21P TXC1N/TX22N TXC1P/TX22P TXC0N/TX23N TXC0P/TX23P

TPO_ERR

EPI_SOE

+3.3V_NORMAL

BIT0_1

R201 10K

BIT0_0

R202 10K

BIT [0/1]

0 / 0 0 / 1 1 / 0 1 / 1

TAIWAN/COLOM

CHINA/HONGKONG

ASIA/AFRICA

EU/CIS

BIT1_1

R203 10K

BIT1_0

R204 10K

ATSC

N/AMERICA

KOREA

S/AMERCIA

Model Option

BIT3_1

BIT2_1

R205 10K

R207 10K

BIT0 BIT1

BIT3_0

BIT2_0

R206 10K

R208 10K

JP

JAPAN

BIT4_1

R209 10K

BIT4_0

R210 10K

BIT5_1

R211 10K

BIT5_0

R212 10K

BIT2 BIT3 BIT4 BIT5

BACK-END OPTIONAREA OPTION

BIT[2/3/4/5]DVB 0 / 0 / 0 / 0 0 / 0 / 0 / 1 0 / 0 / 1 / 0 0 / 0 / 1 / 1 0 / 1 / 0 / 0 0 / 1 / 0 / 1 0 / 1 / 1 / 0 0 / 1 / 1 / 1 1 / 0 / 0 / 0 1 / 0 / 0 / 1 1 / 0 / 1 / 0 1 / 0 / 1 / 1 1 / 1 / 0 / 0 1 / 1 / 0 / 1 1 / 1 / 1 / 0 1 / 1 / 1 / 1

BIT6_1

R213 10K

BIT [6/7]

BIT7_1

R215 10K

0 / 0 0 / 1 1 / 0 1 / 1

EU/CIS

T/C

T2/C/S2/ATV_EXT

T2/C

T2/C/S2/ATV_SOC

BIT6 BIT7

BIT6_0

BIT7_0

R214 10K

R216 10K

TYPE

EPI FHD, 120Hz, V14 (8 lane) EPI FHD, 120Hz, v14_32inch (6 lane) EPI FHD, 120Hz, V13 (6 lane) EPI FHD, 120Hz, V12 (6 lane)

EPI FHD, 60Hz, V14_32 inch (6lane)

LVDS FHD, 120Hz LVDS FHD, 60Hz

LVDS HD, 60Hz

LVDS FHD, 60Hz, CP BOX LVDS HD, 60Hz SMALL SMART

Vby1 FHD, 120Hz LVDS FHD, 120Hz OLED

FRC

FHD

PANEL TYPE

OLED

AJJA

T/C T2/C/ATV_EXT T2/C/ATV_SOC

T2/C/S2

DDR3_DDP

R219 10K

R217 10K

DDR3_1.5GB

DDR3_2GB

R220 10K

R218 10K

DDR3_NON_DDP

TAIWAN/COL

T/C

T2/C PIP

T2/C

DDR_3G

R221 10K

R222 10K

NON_DDR_3G

MODEL_OPT_8

MODEL_OPT_9

MODEL_OPT_10

MODEL_OPT_11

MODEL_OPT_12

BRAZILKOREA

ISDB PIP

ISDB

ATV_SOC ATV_EXT

OPT

R227 10K

NORTH AMERICA

ATSC PIP

ATV_SOC ATV_EXT

OPT

R229 10K

CHINA/HONG

Default Default

ATSC PIP

MODEL_OPT_8 MODEL_OPT_9 MODEL_OPT_10

OPT

R230 10K

R228 10K

DDR3

FOR UD

LOW

NON_DDP

NON_DDR3 3G

HIGH

DDP

1.5GB

2GB

DDR3 3G

JAPAN

MODEL_OPT_11

MODEL_OPT_12

FE_DEMOD2_TS_CLK

FE_DEMOD2_TS_SYNC

FE_DEMOD2_TS_VAL

FE_DEMOD2_TS_ERROR

FE_DEMOD2_TS_DATA

FE_DEMOD3_TS_CLK

FE_DEMOD3_TS_SYNC

FE_DEMOD3_TS_VAL

FE_DEMOD3_TS_ERROR

FE_DEMOD3_TS_DATA

TPI_DATA[0-7]

TPI_CLK TPI_SOP TPI_VAL

TPO_DATA[0-7]

TPO_CLK TPO_SOP TPO_VAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

M14-Display In/Out

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TP202 TP203 TP204 TP205 TP206

TP207 TP208 TP209 TP210 TP211

TP212

TP213 TP214 TP215

TP221

TP218 TP219 TP220

DEBUG

+3.3V_NORMAL

SW201

JTP-1127WEM

12

3

4

For ISP

R223

3.3K

MID_LG1311

M14 Symbol B

2013.04.04 2

31

PLACE AT JACK SIDE

LGE Internal Use Only

Place JACK Side

AV1_CVBS/COMP1_Y Circuit was moved to 34Page

COMP1_Pb

COMP1_Pr

TU_CVBS

COMP1/AV1/DVI_L_IN

COMP1/AV1/DVI_R_IN

C303 150pF 50V

OPT

1005

75

1%

R318

1005

1%

75

R326

Place SOC Side

33

R333

R335 33

TU_ALL_2178B

R329 100

AUDIO IN

R309 27K

R310 27K

C316 4.7uF

1%

C317 4.7uF

1%

C322 0.047uF

C324 0.047uF

C318 0.047uF

R322 10K

1%

R323 10K

1%

TU_ALL_2178B

COMP2_PB_IN_SOC

COMP2_PR_IN_SOC

TU_CVBS_SOC

AUAD_L_CH3_IN

AUAD_R_CH3_IN

COMP

TP308 TP310

TP311

TP312 TP313 TP314 TP315

TP316 TP317

TP302 TP303 TP304 TP305 TP306 TP307

SC_CVBS_IN_SOC SC_FB_SOC

SC_ID_SOC COMP1_PB_IN_SOC

COMP1_Y_IN_SOC COMP1_Y_IN_SOC_SOY COMP1_PR_IN_SOC

AUAD_L_CH2_IN AUAD_R_CH2_IN

SMARTCARD_DATA/SD_EMMC_CLK SMARTCARD_VCC/SD_EMMC_CMD SMARTCARD_DET/SD_EMMC_DATA[3] SMARTCARD_RST/SD_EMMC_DATA[2] SMARTCARD_PWR_SEL/SD_EMMC_DATA[1] SMARTCARD_CLK/SD_EMMC_DATA[0]

TP318 TP319

TP320

Placed as close as possible to LG1311

Tuner IF Filter

ADC_I_INN

ADC_I_INP

TU_ALL_IntDemod

To ADC

TU_ALL_IntDemod

R344

51

R345

51

TU_ALL_IntDemod

C332

0.01uF

C331 22pF

TU_ALL_IntDemod

0.01uF TU_ALL_IntDemod

C333

Placed as close as possible to IC101

R37 4

51K

AUAD_L_REF

1%

R37 8 47K 1%

C313

4.7uF 10V

AUAD_R_REF

DDR3 VENDOR OPTION

+3.3V_NORMAL

R38 0

51K

1%

R38 1

47K 1%

SCART_LOUT_SOC

SCART_ROUT_SOC

DTV/MNT_V_OUT_SOC

IF_N

L303

OPT

IF_P

AVDD25

L307

120-ohm

C354 10uF 10V

C353

4.7uF 10V

SOC_CVBS_OUT

SCART_LOUT_SOC SCART_ROUT_SOC

TUNER_SIF

IF_AGC

AUD_MASTER_CLK

AUD_LRCH

AUD_SCK

AUD_LRCK

MAIN I2S_I/F

OPT

INT_ADEMOD

R11022 390

INT_ADEMOD

DTV/MNT_V_OUT_SOC

AVDD25

EU

C334

0.01uF 50V

C335 22pF OPT

TU_ALL_2178B

C312 0.1uF

C309 1000pF 50V

C338

0.1uF OPT

Close to IC101

INT_ADEMOD

R11023 390

INT_ADEMOD

C11009 68pF 50V

OPT

EU C336

0.01uF

EU

50V

R351 22K

SPDIF_OUT

C337 33pF

OPT

TU_ALL_IntDemod

R350

470

SOC_CVBS_OUT

C11010 68pF 50V

R356

R353 0

C339 100pF 50V

COMP1_Y_IN_SOC_SOY

COMP2_Y_IN_SOC_SOY

R357 68 R358 68 R359 68

BLM15BD121SN1

R354 0 R355 0

EU

AUAD_L_CH2_IN AUAD_R_CH2_IN

R352 22K

AUAD_L_CH3_IN AUAD_R_CH3_IN

C340 22pF OPT

I2S_AMP

ADC_I_INP ADC_I_INN

C11011

TU_CVBS_SOC

SC_CVBS_IN_SOC

AV1_CVBS_IN_SOC

C343 0.047uF

68

EU

SC_ID_SOC SC_FB_SOC

COMP1_Y_IN_SOC COMP1_PB_IN_SOC COMP1_PR_IN_SOC

COMP2_Y_IN_SOC COMP2_PB_IN_SOC COMP2_PR_IN_SOC

L304

BLM15BD121SN1

EU EU

AUDA_OUTL AUDA_OUTR

AUAD_R_REF AUAD_L_REF

R360 33

R365 100

R366 100 C342 22pF OPT

R368 100 R369

GOOGLE

R367 0

INT_ADEMOD

0.1uF

16V

0.047uF

C344 C345 0.047uF C346 0.047uF

C349

0.1uF

L305

16V

10uF 10VC347

C348 2.2uF

10V

100

GOOGLE

R371 0

C351 0.1uF

C352 0.1uF

GOOGLE

R370 0

AL27 AK26 AM27

AL26

AN27

AL25 AM25

AN23 AL22 AK21 AK22

AL24 AK23 AL23 AK24

AL21 AM23 AN25

AM21 AN21

AK16 AL16

AL19 AK19 AN19 AM19 AN17 AM17 AL17 AK17

AK20 AL20

AK18 AL18

AN15

AM15

AN11 AK11 AK10 AL10 AL11 AM11

AK29 AL29 AM29

AK27 AL30

AK28 AL28 AN29

AD5 AE5 AE7 AE6

AD6

IC101

LG1311

CVBS_IN1 CVBS_IN2 CVBS_IN3

CVBS_VCM

BUF_OUT1

SC1_SID SC1_FB

SOY1_IN Y1_IN PB1_IN PR1_IN

SOY2_IN Y2_IN PB2_IN PR2_IN

ADC1_COM ADC2_COM ADC3_COM

AVSS25_COMP_REF AVDD25_COMP_REF

AUDA_SCART_OUTL AUDA_SCART_OUTR

AUAD_L_CH1_IN AUAD_R_CH1_IN AUAD_L_CH2_IN AUAD_R_CH2_IN AUAD_L_CH3_IN AUAD_R_CH3_IN AUAD_L_CH4_IN AUAD_R_CH4_IN

AUDA_OUTL AUDA_OUTR

AUAD_L_REF AUAD_R_REF

AUD_VBG_EXT

IEC958OUT

AUDCLK_OUT DAC_LRCH DAC_SLRCH DAC_CLFCH DAC_SCK DAC_LRCK

PCMI3LRCH PCMI3LRCK PCMI3SCK AUDCLK_IN

FRC_LRSYNC

AAD_ADC_SIF AAD_ADC_SIFM IFAGC

DMD_DAC_OUT DMD_SIF_OUT

DMD_ADC_INP DMD_ADC_INN DMD_ADC_INCOM

SD_CLK

SD_CMD SD_CD_N SD_WP_N

SD_DATA3 SD_DATA2 SD_DATA1 SD_DATA0

RMII_REF_CLK

RMII_CRS_DV

RMII_MDIO

RMII_MDC RMII_TXEN RMII_TXD1 RMII_TXD0 RMII_RXD1 RMII_RXD0

HDMI_1_SCL HDMI_1_SDA HDMI_1_HPD

HDMI_1_5V_DET

HDMI_1_ARC

HDMI_1_RX_0

HDMI_1_RX_0B

HDMI_1_RX_1

HDMI_1_RX_1B

HDMI_1_RX_2

HDMI_1_RX_2B

HDMI_1_RX_C

HDMI_1_RX_CB

HDMI_2_SCL HDMI_2_SDA HDMI_2_HPD

HDMI_2_5V_DET

HDMI_2_RX_0

HDMI_2_RX_0B

HDMI_2_RX_1

HDMI_2_RX_1B

HDMI_2_RX_2

HDMI_2_RX_2B

HDMI_2_RX_C

HDMI_2_RX_CB

HDMI_3_SCL HDMI_3_SDA HDMI_3_HPD

HDMI_3_5V_DET

HDMI_3_RX_0

HDMI_3_RX_0B

HDMI_3_RX_1

HDMI_3_RX_1B

HDMI_3_RX_2

HDMI_3_RX_2B

HDMI_3_RX_C

HDMI_3_RX_CB

HDMI_4_SCL

HDMI_4_SDA HDMI_4_CBUS_HPD HDMI_4_CD_SENSE

HDMI_4_5V_DET

HDMI_4_RX_0

HDMI_4_RX_0B

HDMI_4_RX_1

HDMI_4_RX_1B

HDMI_4_RX_2

HDMI_4_RX_2B

HDMI_4_RX_C

HDMI_4_RX_CB

E22 D22 F22 F24 D24 E24 F23 E23

AK14 AK12 AL12 AK13 AL13 AM13 AN13 AL14 AK15

AE27 AF28 AE29 AF27 AE28

AF33 AF32 AE31 AE30 AD31 AD30 AF31 AF30

AD28 AD29 AC27 AD27

AC31 AC30 AB33 AB32 AA31 AA30 AD32 AD33

AB28 AB27 AB29 AC28

Y32 Y33 W31 W30 V33 V32 Y31 Y30

Y27 AA28 Y28 AA29 AA27

T31 T30 T32 T33 R31 R30 U31 U30

PAGE 3

SMARTCARD_CLK/SD_EMMC_DATA[0] SMARTCARD_RST/SD_EMMC_DATA[2] SMARTCARD_VCC/SD_EMMC_CMD SMARTCARD_PWR_SEL/SD_EMMC_DATA[1] DDR3_OPT1 DDR3_OPT2 SMARTCARD_DET/SD_EMMC_DATA[3] SMARTCARD_DATA/SD_EMMC_CLK

EPHY_REFCLK EPHY_CRS_DV EPHY_MDIO EPHY_MDC EPHY_EN EPHY_TXD1 EPHY_TXD0

R520733

EPHY_RXD1

R520633

EPHY_RXD0

DDC_SCL_1 DDC_SDA_1 HDMI_HPD_1

SPDIF_OUT_ARC

D0+_HDMI1 D0-_HDMI1

D1+_HDMI1 D1-_HDMI1 D2+_HDMI1 D2-_HDMI1 CK+_HDMI1 CK-_HDMI1

DDC_SCL_2

DDC_SDA_2

HDMI_HPD_2

D0+_HDMI2 D0-_HDMI2 D1+_HDMI2 D1-_HDMI2 D2+_HDMI2 D2-_HDMI2 CK+_HDMI2 CK-_HDMI2

DDC_SCL_3

DDC_SDA_3

HDMI_HPD_3

5V_HDMI_3_SOC

D0+_HDMI3 D0-_HDMI3 D1+_HDMI3 D1-_HDMI3 D2+_HDMI3 D2-_HDMI3 CK+_HDMI3 CK-_HDMI3

DDC_SCL_4

DDC_SDA_4

HDMI_HPD_4

MHL_DET

D0+_HDMI4 D0-_HDMI4 D1+_HDMI4 D1-_HDMI4 D2+_HDMI4 D2-_HDMI4 CK+_HDMI4 CK-_HDMI4

5V_HDMI_1

R372 10

C356 1uF 10V

5V_HDMI_2

R373 10

C357 1uF

10V

5V_HDMI_4

R375 10

C359 1uF 10V

R376

5.1K

R377

5.1K

R379

5.1K

HP_OUT L308

BLM18PG121SN1D

HP_LOUT_AMP

BLM18PG121SN1D

HP_ROUT_AMP

HP_OUT L309

HP_OUT

C365

0.22uF 10V

HP_OUT C366

0.22uF 10V

HP_LOUT

HP_ROUT

Place at JACK SIDE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

M14-AV In/Out

HP_LOUT_MAIN

HP_ROUT_MAIN

4.7K

R384

R382

OPT

R383 4.7K

R385 4.7K

AUDIO OUT

R303

22K

R304

22K

R311 0

C305

0.01uF 50V

R312 0

C306

0.01uF 50V

DDR3_OPT1 DDR3_OPT2

AUDA_OUTL

AUDA_OUTR

DDC_SCL_3 DDC_SDA_3

HDMI_HPD_3

5V_HDMI_3_SOC

D0+_HDMI3 D0-_HDMI3 D1+_HDMI3 D1-_HDMI3 D2+_HDMI3 D2-_HDMI3 CK+_HDMI3 CK-_HDMI3

MID_LG1311

M14 Symbol C

TP321 TP322 TP323 TP324

TP325 TP326 TP327 TP328 TP329 TP330 TP331 TP332

2013.04.04 3

31

PAGE 4

LGE Internal Use Only

IC101

LG1311

M0_DDR_VREF1 M0_DDR_VREF2

M0_DDR_U_CLKP M0_DDR_U_CLKN M0_DDR_D_CLKP M0_DDR_D_CLKN

M0_DDR_RESET_N

M0_DDR_DQS_P0 M0_DDR_DQS_N0 M0_DDR_DQS_P1 M0_DDR_DQS_N1 M0_DDR_DQS_P2 M0_DDR_DQS_N2 M0_DDR_DQS_P3 M0_DDR_DQS_N3

M0_DDR_ZQCAL

M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8

M0_DDR_A9 M0_DDR_A10 M0_DDR_A11 M0_DDR_A12 M0_DDR_A13 M0_DDR_A14 M0_DDR_A15

M0_DDR_BA0 M0_DDR_BA1 M0_DDR_BA2

M0_DDR_CKE

M0_DDR_ODT

M0_DDR_RASN M0_DDR_CASN

M0_DDR_WEN

M0_DDR_DM0 M0_DDR_DM1 M0_DDR_DM2 M0_DDR_DM3

M0_DDR_DQ0 M0_DDR_DQ1 M0_DDR_DQ2 M0_DDR_DQ3 M0_DDR_DQ4 M0_DDR_DQ5 M0_DDR_DQ6 M0_DDR_DQ7 M0_DDR_DQ8 M0_DDR_DQ9

M0_DDR_DQ10 M0_DDR_DQ11 M0_DDR_DQ12 M0_DDR_DQ13 M0_DDR_DQ14 M0_DDR_DQ15 M0_DDR_DQ16 M0_DDR_DQ17 M0_DDR_DQ18 M0_DDR_DQ19 M0_DDR_DQ20 M0_DDR_DQ21 M0_DDR_DQ22 M0_DDR_DQ23 M0_DDR_DQ24 M0_DDR_DQ25 M0_DDR_DQ26 M0_DDR_DQ27 M0_DDR_DQ28 M0_DDR_DQ29 M0_DDR_DQ30 M0_DDR_DQ31

VREF_M0_0

A22 A3

E13 E11 E15 E17 D8 D16 D9 E16 E9 E14 D7 D10 D11 D14 E10 E12

D17 E8 D13

C8 B8 C17 B17 D12

E19 D19 D18 E18

D15

B18 C18 B16 A16 B9 C9 B7 A7

A15 A18 A6 A9

B20 B13 C21 C14 A21 A13 B21 C13 B14 B19 C15 C20 C16 A19 B15 C19 B11 C5 C12 B4 A12 A4 B12 C4 B5 B10 C6 C11 C7 A10 B6 C10

E7

VREF_M0_1

R401 240

M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8 M0_DDR_A9 M0_DDR_A10 M0_DDR_A11 M0_DDR_A12 M0_DDR_A13 M0_DDR_A14 M0_DDR_A15

M0_DDR_BA0 M0_DDR_BA1

M0_DDR_BA2

M0_U_CLK M0_U_CLKN M0_D_CLK

M0_DDR_CKE

M0_DDR_ODT M0_DDR_RASN M0_DDR_CASN M0_DDR_WEN

M0_DDR_RESET_N

M0_DDR_DQS0 M0_DDR_DQS_N0 M0_DDR_DQS1 M0_DDR_DQS_N1 M0_DDR_DQS2 M0_DDR_DQS_N2 M0_DDR_DQS3 M0_DDR_DQS_N3

M0_DDR_DM0 M0_DDR_DM1 M0_DDR_DM2 M0_DDR_DM3

M0_DDR_DQ0 M0_DDR_DQ1

M0_DDR_DQ2 M0_DDR_DQ3 M0_DDR_DQ4

M0_DDR_DQ5

M0_DDR_DQ6 M0_DDR_DQ7 M0_DDR_DQ8 M0_DDR_DQ9

M0_DDR_DQ10 M0_DDR_DQ11 M0_DDR_DQ12 M0_DDR_DQ13 M0_DDR_DQ14

M0_DDR_DQ15

M0_DDR_DQ16

M0_DDR_DQ17

M0_DDR_DQ18

M0_DDR_DQ19 M0_DDR_DQ20 M0_DDR_DQ21

M0_DDR_DQ22

M0_DDR_DQ23 M0_DDR_DQ24

M0_DDR_DQ25 M0_DDR_DQ26 M0_DDR_DQ27

M0_DDR_DQ28 M0_DDR_DQ29

M0_DDR_DQ30

M0_DDR_DQ31

1%

+1.5V_DDR

R402

R403

+1.5V_DDR

OPT

+1.5V_DDR

R406

R407

+1.5V_DDR

R408

R409

VREF_M0_0

1K 1%

C401

R404 10K

100

R40 5

M0_DDR_VREFCA

1K 1%

M0_DDR_VREFDQ

1K 1%

0.1uF

1K 1%

C403

0.1uF

M0_DDR_RESET_N

M0_D_CLK

M0_D_CLKN

C402

0.1uF

M0_DDR_CKE

+1.5V_DDR

R411

R412

+1.5V_DDR

R413

R414

VREF_M0_1

R415

1K 1%

R416

1K 1%

R417 10K

M0_U_CLK

100

R41 0

M0_U_CLKN

M0_1_DDR_VREFCA

1K 1%

C406

0.1uF

1K 1%

M0_1_DDR_VREFDQ

1K 1%

0.1uF

1K 1%

C407

C408

0.1uF

M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8 M0_DDR_A9

M0_DDR_A10

M0_DDR_A11 M0_DDR_A12

M0_DDR_A13

M0_DDR_A14

M0_DDR_A15

M0_DDR_BA0

M0_DDR_BA1

M0_DDR_BA2

M0_D_CLK

M0_D_CLKN

M0_DDR_CKE

M0_DDR_ODT M0_DDR_RASN M0_DDR_CASN

M0_DDR_WEN

M0_DDR_RESET_N

M0_DDR_DQS0

M0_DDR_DQS_N0

M0_DDR_DQS1

M0_DDR_DQS_N1

M0_DDR_DM0 M0_DDR_DM1

M0_DDR_DQ0

M0_DDR_DQ1 M0_DDR_DQ2 M0_DDR_DQ3 M0_DDR_DQ4 M0_DDR_DQ5 M0_DDR_DQ6 M0_DDR_DQ7

M0_DDR_DQ8 M0_DDR_DQ9

M0_DDR_DQ10 M0_DDR_DQ11 M0_DDR_DQ12 M0_DDR_DQ13 M0_DDR_DQ14 M0_DDR_DQ15

IC401

H5TQ4G63AFR-PBC

DDR3

N3 P7 P3 N2 P8 P2 R8 R2 T8 R3 L7 R7 N7 T3 T7 M7

M2 N8 M3

J7 K7 K9

L2 K1 J3 K3 L3

T2

F3 G3

C7 B7

E7 D3

E3 F7 F2 F8 H3 H8 G2 H7

D7 C3 C8 C2 A7 A2 B8 A3

4Gbit

A0

(x16)

A1

DDR_512MB_HYNIX_1600_29n

A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12/BC A13 A14 A15

BA0 BA1 BA2

CK CK CKE

CS ODT RAS CAS WE

RESET

DQSL DQSL

DQSU DQSU

DML DMU

DQL0 DQL1 DQL2 DQL3 DQL4 DQL5 DQL6 DQL7

DQU0 DQU1 DQU2 DQU3 DQU4 DQU5 DQU6 DQU7

VREFCA

VREFDQ

VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9

VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9

NC_1 NC_2 NC_3 NC_4

VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8

VSS_9 VSS_10 VSS_11 VSS_12

VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9

ZQ

M0_DDR_VREFCA

M0_DDR_VREFDQ

M8

H1

R418

L8

240

1%

B2 D9 G7 K2 K8 N1 N9 R1 R9

A1 A8 C1 C9 D2 E9 F1 H2 H9

J1 J9 L1 L9

A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9

B1 B9 D1 D8 E2 E8 F9 G1 G9

+1.5V_DDR

IC401-*1

MT41K256M16HA-125:E

DDR_512MB_MICRON

N3

A0

VREFCA

P7

A1

P3

A2

N2

A3

VREFDQ

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

VDD_1

A9

L7

VDD_2

A10/AP

R7

VDD_3

A11

N7

VDD_4

A12/BC

T3

A13

VDD_5 VDD_6

M7

NC_5

VDD_7 VDD_8

M2

BA0

VDD_9

N8

BA1

M3

BA2

VDDQ_1

J7

CK

VDDQ_2

K7

CK

VDDQ_3

K9

CKE

VDDQ_4 VDDQ_5

L2

CS

VDDQ_6

K1

ODT

VDDQ_7

J3

RAS

VDDQ_8

K3

CAS

VDDQ_9

L3

WE

NC_1

T2

RESET

NC_2 NC_3 NC_4

F3

DQSL

G3

DQSL

C7

DQSU

VSS_1

B7

DQSU

VSS_2 VSS_3

E7

DML

VSS_4

D3

DMU

VSS_5 VSS_6

E3

DQ0

VSS_7

F7

DQ1

VSS_8

F2

DQ2

VSS_9

F8

DQ3

VSS_10

H3

DQ4

VSS_11

H8

DQ5

VSS_12

G2

DQ6

H7

DQ7

VSSQ_1

D7

DQ8

VSSQ_2

C3

DQ9

VSSQ_3

C8

DQ10

VSSQ_4

C2

DQ11

VSSQ_5

A7

DQ12

VSSQ_6

A2

DQ13

VSSQ_7

B8

DQ14

VSSQ_8

A3

DQ15

VSSQ_9

C413 1uF C414 1uF

M8

H1

L8

ZQ

B2 D9 G7 K2 K8 N1 N9 R1 R9

A1 A8 C1 C9 D2 E9 F1 H2 H9

J1 J9 L1 L9 T7

A14

A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9

B1 B9 D1 D8 E2 E8 F9 G1 G9

M0_DDR_A0 M0_DDR_A1 M0_DDR_A2 M0_DDR_A3 M0_DDR_A4 M0_DDR_A5 M0_DDR_A6 M0_DDR_A7 M0_DDR_A8

M0_DDR_A9 M0_DDR_A10 M0_DDR_A11 M0_DDR_A12 M0_DDR_A13 M0_DDR_A14

M0_DDR_A15

M0_DDR_BA0M0_D_CLKN M0_DDR_BA1 M0_DDR_BA2

M0_U_CLK

M0_U_CLKN M0_DDR_CKE

M0_DDR_ODT

M0_DDR_RASN M0_DDR_CASN

M0_DDR_WEN

M0_DDR_RESET_N

M0_DDR_DQS2

M0_DDR_DQS_N2

M0_DDR_DQS3

M0_DDR_DQS_N3

M0_DDR_DM2 M0_DDR_DM3

M0_DDR_DQ16

M0_DDR_DQ17 M0_DDR_DQ18 M0_DDR_DQ19 M0_DDR_DQ20 M0_DDR_DQ21 M0_DDR_DQ22 M0_DDR_DQ23

M0_DDR_DQ24 M0_DDR_DQ25 M0_DDR_DQ26 M0_DDR_DQ27 M0_DDR_DQ28 M0_DDR_DQ29 M0_DDR_DQ30 M0_DDR_DQ31

MT41K256M16HA-125:E

N3

A0

P7

A1

P3

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

M7

NC_5

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQ0

F7

DQ1

F2

DQ2

F8

DQ3

H3

DQ4

H8

DQ5

G2

DQ6

H7

DQ7

D7

DQ8

C3

DQ9

C8

DQ10

C2

DQ11

A7

DQ12

A2

DQ13

B8

DQ14

A3

DQ15

IC402-*1

DDR_512MB_MICRON

IC402

H5TQ4G63AFR-PBC

DDR3

N3

4Gbit

A0

P7

(x16)

A1

P3

DDR_512MB_HYNIX_1600_29n

A2

N2

A3

P8

A4

P2

A5

R8

A6

R2

A7

T8

A8

R3

A9

L7

A10/AP

R7

A11

N7

A12/BC

T3

A13

T7

A14

M7

A15

M2

BA0

N8

BA1

M3

BA2

J7

CK

K7

CK

K9

CKE

L2

CS

K1

ODT

J3

RAS

K3

CAS

L3

WE

T2

RESET

F3

DQSL

G3

DQSL

C7

DQSU

B7

DQSU

E7

DML

D3

DMU

E3

DQL0

F7

DQL1

F2

DQL2

F8

DQL3

H3

DQL4

H8

DQL5

G2

DQL6

H7

DQL7

D7

DQU0

C3

DQU1

C8

DQU2

C2

DQU3

A7

DQU4

A2

DQU5

B8

DQU6

A3

DQU7

M8

VREFCA

H1

VREFDQ

L8

ZQ

B2

VDD_1

D9

VDD_2

G7

VDD_3

K2

VDD_4

K8

VDD_5

N1

VDD_6

N9

VDD_7

R1

VDD_8

R9

VDD_9

A1

VDDQ_1

A8

VDDQ_2

C1

VDDQ_3

C9

VDDQ_4

D2

VDDQ_5

E9

VDDQ_6

F1

VDDQ_7

H2

VDDQ_8

H9

VDDQ_9

J1

NC_1

J9

NC_2

L1

NC_3

L9

NC_4

T7

A14

A9

VSS_1

B3

VSS_2

E1

VSS_3

G8

VSS_4

J2

VSS_5

J8

VSS_6

M1

VSS_7

M9

VSS_8

P1

VSS_9

P9

VSS_10

T1

VSS_11

T9

VSS_12

B1

VSSQ_1

B9

VSSQ_2

D1

VSSQ_3

D8

VSSQ_4

E2

VSSQ_5

E8

VSSQ_6

F9

VSSQ_7

G1

VSSQ_8

G9

VSSQ_9

M0_1_DDR_VREFCA

VREFCA

VREFDQ

ZQ

VDD_1 VDD_2 VDD_3 VDD_4 VDD_5 VDD_6 VDD_7 VDD_8 VDD_9

VDDQ_1 VDDQ_2 VDDQ_3 VDDQ_4 VDDQ_5 VDDQ_6 VDDQ_7 VDDQ_8 VDDQ_9

NC_1 NC_2 NC_3 NC_4

VSS_1 VSS_2 VSS_3 VSS_4 VSS_5 VSS_6 VSS_7 VSS_8

VSS_9 VSS_10 VSS_11 VSS_12

VSSQ_1 VSSQ_2 VSSQ_3 VSSQ_4 VSSQ_5 VSSQ_6 VSSQ_7 VSSQ_8 VSSQ_9

M8

H1

L8

B2 D9 G7 K2 K8 N1 N9 R1 R9

A1 A8 C1 C9 D2 E9 F1 H2 H9

J1 J9 L1 L9

A9 B3 E1 G8 J2 J8 M1 M9 P1 P9 T1 T9

B1 B9 D1 D8 E2 E8 F9 G1 G9

M0_1_DDR_VREFDQ

+1.5V_DDR

R419

240

1%

C429 C430

1uF 1uF

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

MID_LG1311

M14 DDR3-M0

2013.04.04 4

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