LG 47LB5610 Schematic

Printed in KoreaP/NO : MFL67987514 (1404-REV00)

CHASSIS : LC43B

MODEL: 47LB5610 47LB5610-CD

CAUTION

BEFORE SERVICING THE CHASSIS,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

LED TV

SERVICE MANUAL

North/Latin America http://aic.lgservice.com

Europe/Africa http://eic.lgservice.com

Asia/Oceania http://biz.lgservice.com

Internal Use Only

- 2 -

Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 8

BLOCK DIAGRAM .................................................................................. 15

EXPLODED VIEW .................................................................................. 16

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

- 3 -

Only for training and service purposes

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the

Schematic Diagram and Exploded View.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent

Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the

servicing of a receiver whose chassis is not isolated from the AC

power line. Use a transformer of adequate power rating as this

protects the technician from accidents resulting in personal injury

from electrical shocks.

It will also protect the receiver and it's components from being

dama ged by ac ciden tal sho rts of th e circuitr y that ma y be

inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,

replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,

over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to

be sure the set is safe to operate without damage of electrical

shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an

electrical jumper across the two AC plug prongs. Place the AC

switch in the on position, connect one lead of ohm-meter to the AC

plug prongs tied together and touch other ohm-meter lead in turn to

each exposed metallic parts such as antenna terminals, phone

jacks, etc.

If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 1 MΩ and 5.2 MΩ.

When the exposed metal has no return path to the chassis the

reading must be infinite.

An other abnormality exists that must be corrected before the

receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor

between a known good earth ground (Water Pipe, Conduit, etc.)

and the exposed metallic parts.

Measure the AC voltage across the resistor using AC voltmeter

with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage

measur ements for each exposed met allic part. Any vol tage

measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.

In case any measurement is out of the limits specified, there is

possibility of shock hazard and the set must be checked and

repaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

SAFETY PRECAUTIONS

- 4 -

Only for training and service purposes

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service

manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions

on page 3 of this publication, always follow the safety precau-

tions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power

source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an explo-

sion hazard.

2. Test high voltage only by measuring it with an appropriate

high voltage meter or other voltage measuring device (DVM,

FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the

contacts with a pipe cleaner, cotton-tipped stick or comparable

non-abrasive applicator; 10 % (by volume) Acetone and 90 %

(by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture.

Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks

are correctly installed.

7. Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive

lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas-

ily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques

should be used to help reduce the incidence of component dam-

age caused by static by static electricity.

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic

charge on your body by touching a known earth ground. Alter-

natively, obtain and wear a commercially available discharg-

ing wrist strap device, which should be removed to prevent

potential shock reasons prior to applying power to the unit

under test.

2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or expo-

sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder

ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate

electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective

package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads elec-

trically shorted together by conductive foam, aluminum foil or

comparable conductive material).

7. Immediately before removing the protective material from the

leads of a replacement ES device, touch the protective mate-

rial to the chassis or circuit assembly into which the device will

be installed.

CAUTION: Be sure no power is applied to the chassis or cir-

cuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replace-

ment ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity suf-

cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropri-

ate tip size and shape that will maintain tip temperature within

the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed

of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there

only until the solder ows onto and around both the compo-

nent lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 5 -

Only for training and service purposes

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through

which the IC leads are inserted and then bent at against the cir-

cuit foil. When holes are the slotted type, the following technique

should be used to remove and replace the IC. When working with

boards using the familiar round hole, use the standard technique

as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by

gently prying up on the lead with the soldering iron tip as the

solder melts.

2. Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing

the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and

solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close

as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remain-

ing on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with

long nose pliers to insure metal to metal contact then solder

each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit

board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos-

sible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit

board.

3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and

if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board to

prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit

board will weaken the adhesive that bonds the foil to the circuit

board causing the foil to separate from or "lift-off" the board. The

following guidelines and procedures should be followed when-

ever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the

following procedure to install a jumper wire on the copper pattern

side of the circuit board. (Use this technique only on IC connec-

tions).

1. Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the

good copper pattern. Solder the overlapped area and clip off

any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern

at connections other than IC Pins. This technique involves the

installation of a jumper wire on the component side of the circuit

board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly con-

nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the

lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.

- 6 -

Only for training and service purposes

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This specification is applied to the LED TV used LC43B

chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage

: Standard input voltage (AC 100-240 V~, 50/60 Hz)

* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch dra w ing a n d spec ifica tion b y part n umber i n

accordance with BOM.

5) The receiver must be operated for about5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

No. Item Specication Remarks

1. Market Hong Kong

2. Broadcasting system

1) PAL-DK

2) PAL-I

3) NTSC-M

4) DTMB

5) DVB-C

DTMB : DMB-T + ADTB-T

3. Channel Storage 1500EA Maximum number of storable program for ATV /DTV

4. Channel Coverage

Digital TV

DTMB : 21~69

DVB-C : 52.5 MHz ~866MHz

Analogue TV

PAL D/K : VHF/UHF 1 ~ 69, Cable 1 ~ 47

PAL I : VHF/UHF 1 ~ 69, Cable 1 ~ 47

NTSC M : VHF/UHF 2 ~ 78, Cable 1 ~ 71

5. Receiving system

Analog : Upper Heterodyne

Digital : COFDM, QAM

► DTMB

(Carrier, Code Rate, Constellation, Frame Header, Inter-

leaving)

MODE : 3780, 0.4/0.6, 4/16/64QAM, PN945, 720

QPSK : 1/2, 2/3, 3/4, 5/6, 7/8

16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

► DVB-C

- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s

- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM

6. Video(Composite) Input PAL, SECAM, NTSC Rear 1EA

7. Component Input Y/Cb/Cr, Y/Pb/Pr Rear 1EA

8. HDMI Input

HDMI1-DTV/DVI

HDMI2-DTV

PC(HDMI version 1.4), Support HDCP

9. Audio Input Component, AV L/R Input

10. USB

For My Media(Movie/Photo/Music List)

and SVC

1EA(JPEG, MP3, DivX HD)

- 7 -

Only for training and service purposes

5. Component Video Input (Y, Pb, Pr)

No. Specication H-freq(kHz) V-freq(Hz) Porposed

Resolution H-freq(kHz) V-freq(Hz)

1. 720×480 15.73 60.00 SDTV, DVD 480i

2. 720×480 15.63 59.94 SDTV, DVD 480i

3. 720×480 31.47 59.94 480p

4. 720×480 31.50 60.00 480p

5. 720×576 15.625 50.00 SDTV, DVD 625 Line

6. 720×576 31.25 50.00 HDTV 576p

7. 1280×720 45.00 50.00 HDTV 720p

8. 1280×720 44.96 59.94 HDTV 720p

9. 1280×720 45.00 60.00 HDTV 720p

10. 1920×1080 28.125 50.00 HDTV 1080i

11. 1920×1080 33.75 60.00 HDTV 1080i

12. 1920×1080 33.72 59.94 HDTV 1080i

13. 1920×1080 26.97 23.976 HDTV 1080p

14. 1920×1080 27.00 24 HDTV 1080p

15. 1920×1080 33.71 29.97 HDTV 1080p

16. 1920×1080 33.75 30 HDTV 1080p

17. 1920×1080 56.25 50 HDTV 1080p

18. 1920×1080 67.432 59.94 HDTV 1080p

19. 1920×1080 67.5 60 HDTV 1080p

6. HDMI Input

6.1. DTV mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

1. 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P

2. 720*576 31.25 50 54 SDTV 576P

3. 1280*720 37.500 50 74.25 HDTV 720P

4. 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P

5. 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I

6. 1920*1080 28.125 50.00 74.25 HDTV 1080I

7. 1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 HDTV 1080P

8. 1920*1080 33.716/33.75 29.976/30.00 74.25 HDTV 1080P

9. 1920*1080 56.250 50 148.5 HDTV 1080P

10. 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P

6.2. PC mode

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 640*350 @70Hz 31.468 70.09 25.17 EGA

2. 720*400 @70Hz 31.469 70.08 28.321 DOS

3. 640*480 @60Hz 31.469 59.940 25.175 VESA(VGA)

4. 800*600 @60Hz 37.879 60.31 40.000 VESA(SVGA)

5. 1024*768 @60Hz 48.363 60.00 65.000 VESA(XGA)

6 1152*864 @60Hz 54.348 60.053 80.002 VESA

7. 1280*1024 @60Hz 63.981 60.020 108 VESA(SXGA) FHD only

8. 1360*768 @60Hz 47.712 60.015 85.5 VESA(WXGA)

9. 1920*1080 @60Hz 67.5 60.0 148.5 WUXGA (Reduced blanking) FHD only

- 8 -

Only for training and service purposes

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with

LC43B chassis.

2. Designation

(1) Th e adjus tme nt is acco rdi ng to the ord er whic h is

designated and which must be followed, according to the

plan which can be changed only on agreeing.

(2) Power adjustment : Free Voltage.

(3) Magnetic Field Condition: Nil.

(4) Input signal Unit: Product Specification Standard.

(5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25 °C ± 5 °C

Relative humidity : 65 ± 10 %

Input voltage : 220 V~, 60 Hz

(6) Adjustment equipments

: Color Analyzer(CA-210 or CA-110), Service remote control.

(7) Push the “IN STOP" key - For memory initialization.

3. Main PCB check process

▪ APC - After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program "Mstar ISP Utility" and then click

"Config" tab.

(2) Set as below, and then click "Auto Detect" and check "OK"

message.

If "Error" is displayed, check connection between computer,

jig, and set.

(3) Click "Read" tab, and then load download file(XXXX.bin)

by clicking "Read"

(4) Click "Connect" tab. If "Can't" is displayed, check connection

between computer, jig and set.

(5) Click "Auto" tab and set as below.

(6) Click "Run".

(7) After downloading, check "OK" message.

* USB DOWNLOAD(*.epk file download)

(1) Put the USB Stick to the USB socket.

(2) Automatically detecting update file in USB Stick.

- If version of update file in USB Stick is lower, it will not

work. But version of update file is higher, USB data will be

detected automatically.

Case1 : Software version up

1. After downloading S/W by USB , TV set will reboot

automatically.

2. Push “In-stop” key.

3. Push “Power on” key.

4. Function inspection

5. After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push

“In-stop” key at rst.

2. Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

3. After function inspection, Push “In-stop” key.

(1)

filexxx.bin

(4)

(5)

(6)

(7)...........OK

filexxx.bin

(2)

(3)

Please Check the Speed :

To use speed between

from 200KHz to 400KHz

- 9 -

Only for training and service purposes

(3) Show the message "Copying files from memory".

(4) Updating is starting.

(5) Updating Completed, The TV will restart automatically.

(6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If updated version is higher than what TV has, the TV can

lost all channel data. In this case, you have to channel

recover. If all channel data is cleared, you didn’t have a

DTV/ATV test on production line.

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control.

(2) Select "Tool Option 1" and push "OK" key.

(3) Punch in the number. (Each model has their number)

(4) Completed selecting Tool option.

4. ADC Process

4.1. ADC

- Enter Service Mode by pushing "ADJ" key,

- Enter Internal ADC mode by pushing "►" key at "8. ADC

Calibration".

<Caution> Using "P-ONLY" key of the Adjustment remote

control, power on TV.

* ADC Calibration Protocol (RS232)

Adjust Sequence

▪ aa 00 00 [Enter Adjust Mode]

▪ xb 00 40 [Component1 Input (480i)]

▪ ad 00 10 [Adjust 480i Comp1]

▪ xb 00 60 [RGB Input (1024*768)]

▪ ad 00 10 [Adjust 1024*768 RGB]

▪ aa 00 90 End Adjust mode

* Required equipment : Adjustment remote control.

4.2. Function Check

4.2.1. Check display and sound

■ Check Input and Signal items.

(1) TV

(2) AV (CVBS)

(3) COMPONENT (480i)

(4) HDMI

* Display and Sound check is executed by Remote control.

<Caution> Not to push the "INSTOP" key after completion if

the function inspection.

NO Item CMD 1 CMD 2 Data 0

Enter

Adjust MODE

Adjust

‘Mode In’

A A 0 0

When transfer the ‘Mode In’,

Carry the command.

ADC adjust ADC Adjust A D 1 0

Automatically adjustment

(The use of a internal pattern)

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration ►

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L

13. Sub B/C

14. Ext. Input Adjust

ADC Calibration

ADC Comp 480i

ADC Comp 1080p

ADC Type ◄ ►

Start

OPT

Reset

- 10 -

Only for training and service purposes

5. Total Assembly line process

5.1. Adjustment Preparation

▪ W/B Equipment condition

CA210: LED → CH14, Test signal: Inner pattern(80IRE)

▪ Above 5 minutes H/run in the inner pattern. ("power on" key

of Adjustment remote control)

* The spec of color temperature and coordinate.

5.1.1. W/B adj. Objective & How-it-works

(1) Objective: To reduce each Panel’s W/B deviation

(2) How-it-works: When R/G/B gain in the OSD is at 192, it

means the panel is at its Full Dynamic Range.

In order to prevent saturation of Full Dynamic range and

data, one of R/G/B is fixed at 192, and the other two is

lowered to find the desired value.

(3) Adj. condition: normal temperature

- Surrounding Temperature: 25 ± 5 °C

- Warm-up time: About 5 Min

- Surrounding Humidity: 20% ~ 80%

- Before White balance adjustment, Keep power on status,

don’t power off

* If Model is POLA model

* W/B Table( Netcast4.0 Model)

CA210 : CH 14, Test signal : Inner pattern (80IRE)

Normal line - Standard color coordinate and temprature using

CA-1000(by H/R time)

Aging chamber line - Standard color coordinate and temprature

using CA-1000(by H/R time)

* When Model produce in Gumi Factory at Winter(Jan,Feb)

Normal line

* AUO, Sharp, CSOT use Model(If Cool spec 13000K)

Mode Color Temp Color coordinate Remark

Cool (C50) 13,000 K

X=0.271 (±0.002)

Y=0.270 (±0.002)

- Inner pattern

for W/B adjust

- External white

pattern(80IRE,

204gray)

Medium(0) 9,300 K

X=0.286 (±0.002)

Y=0.289 (±0.002)

Warm(W50) 6,500 K

X=0.313 (±0.002)

Y=0.329 (±0.002)

NC4.0

Aging

time

(Min)

Cool Medium Warm

x y x y x y

271 270 286 289 313 329

1 0-2 282 289 297 308 324 348

2 3-5 281 287 296 306 323 346

3 6-9 279 284 294 303 321 343

4 10-19 277 280 292 299 319 339

5 20-35 275 277 290 296 317 336

6 36-49 274 274 289 293 316 333

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

NC4.0

Aging

time

(Min)

Cool Medium Warm

x y x y x y

271 270 285 293 313 329

1 0-5 280 285 294 308 319 340

2 6-10 276 280 290 303 315 335

3 11-20 272 275 286 298 311 330

4 21-30 269 272 283 295 308 327

5 31-40 267 268 281 291 306 323

6 41-50 266 265 280 288 305 320

7 51-80 265 263 279 286 304 318

8 81-119 264 261 278 284 303 316

9 Over 120 264 260 278 283 303 315

NC4.0

Aging

time

(Min)

Cool Medium Warm

x y x y x y

271 270 286 289 313 329

1 0-5 286 295 301 314 328 354

2 6-10 284 290 299 309 326 349

3 11-20 282 287 297 306 324 346

4 21-30 279 283 294 302 321 342

5 31-40 276 278 291 297 318 337

6 41-50 274 275 289 294 316 334

7 51-80 273 272 288 291 315 331

8 81-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

NC4.0 Cool Medium Warm

x y x y x y

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

Case : Cool Mode

• Purpose : Adjust the color temperature to reduce the

deviation of the module color temperature.

• Pr in ciple : To adjust the white bala nce without the

saturation, Fix the G gain to 172 (default data) and

change the others ( R/B Gain ).

• Adjustment mode : mode - Cool

Case : Medium / Warm Mode

• Purpose : Adjust the color temperature to reduce the

deviation of the module color temperature.

• Pr in ciple : To adjust the white bala nce without the

saturation, Fix the one of R/G/B gain to 192 (default

data) and decrease the others.

• Adjustment mode : Two modes - Medium / Warm

- 11 -

Only for training and service purposes

* Connecting picture of the measuring instrument

(On Automatic control)

Inside Pattern is used when W/B is controlled. Connect to

auto controller or push Adjustment Remote control POWER

ON → Enter the mode of White-Balance, the pattern will

come out.

* Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (Illumination is less than 10 lux).

(2) Adhere closely the Color analyzer(CA210) to the module

less than 10 cm distance, keep it with the surface of the

Module and Color analyzer's prove vertically.(90°(± 2.5°))

(3) Aging time

- After aging start, keep the power on (no suspension of

power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others,

check the back light on.

▪ Auto adjustment Map(RS-232C)

RS-232C COMMAND

[CMD ID DATA]

Wb 00 00 White Balance Start

Wb 00 ff White Balance End

* Manual W/B process using adjust Remote control.

■ Color Temperature : COOL, Medium, Warm

■ One of R Gain/ G Gain/ B Gain should be kept on 0xC0,

and adjust other two lower than C0. (when R/G/B Gain are

all C0, it is the FULL Dynamic Range of Module)

■ After enter Service Mode by pushing “ADJ” key,

■ Enter White Balance by pushing “►” key at “9. White

Balance”.

■ For manual adjustment, it is also possible by the following

sequence.

(1) Set TV in Adj. mode using POWER ON

(2) Zero Calibrate the probe of Color Analyzer, then place it

on the center of LCD module within 10cm of the surface

(3) Press ADJ key → EZ adjust using adj. R/C → 8. White-

Balance then press the cursor to the right (KEY►).

When KEY(►) is pressed 206 Gray internal pattern will

be displayed.

(4) Adjust Cool modes

1) Fix the one of R/G/B gain to 192 (default data) and

decrease the others. (If G gain is adjusted over 172

and R and B gain less than 192 , Adjust is O.K.)

2) If G gain is less than 172, Increase G gain by up to

172, and then increase R gain and G gain same

amount of increasing G gain.

3) If R gain or B gain is over 255, readjust G gain less

than 172, Conform to R gain is 255 or B gain is 255

(5) Adjust two modes (Medium/Warm) Fix the one of R/G/B

gain to 192 (default data) and decrease the others.

(6) Adj. is completed, Exit adjust mode using “EXIT” key on

Remote control.

▪ If internal pattern is not available, use RF input In EZ Adj.

9. White Balance, you can select one of 2 Test-pattern:

ON, OFF. Default is inner (ON).

By selecting OFF, you can adjust using RF signal in 206

Gray pattern.

Full White Pattern

CA-210

COLOR

ANALYZER

TYPE : CA-210

RS-232C Communication

RS-232C COMMAND

[CMD ID DATA]

MIN

CENTER

(DEFAULT)

MAX

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 20 Point WB

11. Test Pattern

12 EDID D/L

13. Sub B/C

14. V-com

15. Ext. Input Adjust

Whit Balance

Color Temp. ◄ ►

R-Gain

G-Gain

B-Gain

R-Cut

G-Cut

B-Cut

Test-Pattern

Backlight

Reset To Set

Cool

172

192

100

- 12 -

Only for training and service purposes

* CASE Cool

First adjust the coordinate far away from the target

value(x, y).

1) x, y > target

i) Decrease the R, G.

2) x, y < target

i) First decrease the B gain,

ii) Decrease the one of the others.

3) x > target, y < target

i) First decrease B, so make y a little more than the

target.

ii) Adjust x value by decreasing the R.

4) x < target, y > target

i) First decrease B, so make x a little more than the

target.

ii) Adjust x value by decreasing the G.

How to adjust

1) If G gain is adjusted over 172 and R gain and B gain

less than 192, Adjust is O.K.

2) If G gain is less than 172, increase G gain by up to

172, and then increase R gain and B gain same

amount of increasing G gain.

3) If R gain or B gain is over 255, Readjust G gain less

than 172, Conform to R gain is 255 or B gain is 255.

* CASE Medium / Warm

First adjust the coordinate far away from the target

value(x, y).

1) x, y > target

i) Decrease the R, G.

2) x, y < target

i) First decrease the B gain,

ii) Decrease the one of the others.

3) x > target, y < target

i) First decrease B, so make y a little more than the

target.

ii) Adjust x value by decreasing the R

4) x < target, y > target

i) First decrease B, so make x a little more than the

target.

ii) Adjust x value by decreasing the G

* After You finish all adjustments, Press “In-start” button

and compare Tool option and Area option value with its

BOM, if it is correctly same then unplug the AC cable.

If it is not same, then correct it same with BOM and

unplug AC cable.

For correct it to the model’s module from factory JIG

model.

* Push the “IN-STOP KEY” after completing the function

inspection.

5.2. DDC EDID Write (RGB 128Byte)

■ Connect D-sub Signal Cable to D-Sub Jack.

■ Write EDID DATA to EEPROM(24C02) by using DDC2B

protocol.

■ Check whether written EDID data is correct or not.

* For SVC main Assembly, EDID have to be downloaded to

Insert Process in advance.

5.3. DDC EDID Write (HDMI 256Byte)

■ Connect HDMI Signal Cable to HDMI Jack.

■ Write EDID DATA to EEPROM(24C02) by using DDC2B

protocol.

■ Check whether written EDID data is correct or not.

* For SVC main Assembly, EDID have to be downloaded to

Insert Process in advance.

5.4. EDID DATA

1) All Data : HEXA Value

2) Changeable Data :

*: Serial No : Controlled / Data:01

**: Month : Controlled / Data:00

***: Year : Controlled

****: Check sum

- Auto Download

■ After enter Service Mode by pushing “ADJ” key,

■ Enter EDID D/L mode.

■ Enter “START” by pushing “OK” key.

* Caution : Never connect HDMI & D-sub Cable when EDID

downloaded

* Edid data and Model option download (RS232)

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 20 Point WB

11. Test Pattern

12. EDID D/L ►

13. Sub B/C

14. V-Com

EDID D/L

HDMI1 OK

HDMI2 OK

Start

Reset

NO Item CMD 1 CMD 2 Data 0

Enter download

Mode

Download

‘Mode In’

A A 0 0

When transfer the ‘Mode In’,

Carry the command.

EDID data and

Model option

download

ADC Adjust A E 00 10

Automatically adjustment

(The use of a internal pattern)

- 13 -

Only for training and service purposes

- Manual Download

[Caution]

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

- Never connect HDMI & D-sub Cable at the same time.

- Use the proper cables below for EDID Writing.

- Download HDMI1/2/3 separately because each EDID data is

different.

(1) EDID Data

- FHD 8BIT HDMI EDID DATA

- HD HDMI EDID data (2D Model)

(2) Detail EDID Options are below

a. Product ID

b. Serial No: Controlled on production line.

c. Month, Year: Controlled on production line:

ex) Week : '01' -> '01'

Year : '2012' -> '16' fix

d. Model Name(Hex):

cf) TV set’s model name in EDID data is below.

e. Checksum: Changeable by total EDID data.

5.5. Outgoing condition Configuration

■ When pressing IN-STOP key by Service remote control,

Red LED are blinked alternatively. And then automatically

turn off. (Must not AC power OFF during blinking)

5.6. GND and HI-POT Test

5.5.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition.

5.6.2. GND & HI-POT auto-check

(1) Pallet moves in the station.(POWER CORD / AV CORD is

tightly inserted)

(2) Connect the AV JACK Tester.

(3) Controller (GWS103-4) on.

(4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process(Hi-pot test).

(Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next

process automatically.

5.6.3. Checkpoint

(1) Test voltage

1) 3 Poles

- GND: 1.5 KV/min at 100 mA

- SIGNAL: 3 KV/min at 100 mA

2) 2 Poles

- SIGNAL: 3 KV/min at 100 mA

(2) TEST time: 1 second

(3) TEST POINT

1) 3 Poles

- GND Test = POWER CORD GND and SIGNAL

CABLE GND.

- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.

2) 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.

(4) LEAKAGE CURRENT: At 0.5 mArms

No. Item Condition Hex Data

1 Manufacturer ID GSM 1E6D

2 Version Digital : 1 01

3 Revision Digital : 3 03

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D a b

10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 2 6

20 0F 50 54 A1 08 00 31 40 45 4 0 61 40 71 4 0 81 80

30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C

40 45 00 A0 5A 0 0 00 00 1E 66 21 50 B 0 51 00 1B 30

50 40 70 36 00 A0 5A 00 00 0 0 1E 00 00 00 FD 00 3A

60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d

70 d 01 e

80 02 03 22 F1 4E 10 9F 04 13 05 14 03 02 12 20 21

90 22 15 01 26 15 07 50 09 57 07 f

A0 f 01 1D 80 18 71 1C 16 20 58 2C 25 00 20 C2

B0 31 00 00 9E 01 1D 00 72 51 D0 1E 20 6E 28 5 5 00

C0 20 C2 31 00 00 1E 02 3A 80 18 71 38 2D 40 58 2C

D0 45 00 A0 5A 00 00 00 1E 01 1D 00 BC 52 D0 1E 20

E0 B8 28 55 40 C4 8E 21 00 00 1E 00 00 00 00 00 00

F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D a b

10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 2 6

20 0F 50 54 A1 08 00 31 40 45 4 0 61 40 71 4 0 01 01

30 01 01 01 01 01 01 66 21 50 B0 51 0 0 1B 30 40 70

40 36 00 40 84 63 0 0 00 1E 6 4 19 00 40 41 00 26 30

50 18 88 03 06 40 8 4 63 00 00 18 00 0 0 00 FD 0 0 3A

60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d

70 d 01 e

80 02 03 22 F1 4E 10 1F 04 93 05 14 03 02 12 20 21

90 22 15 01 26 15 07 50 09 57 07 f

A0 80 1E 01 1D 80 18 71 1C 16 20 58 2C 25 00 A0 5A

B0 00 00 00 9E 01 1D 00 72 51 D0 1E 20 6E 28 5 5 00

C0 20 C2 31 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E

D0 96 00 A0 5A 00 00 00 18 02 3A 80 18 71 38 2D 40

E0 58 2C 45 00 A0 5A 00 00 00 1E 00 00 00 00 00 00

F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

Model Name HEX EDID Table DDC Function

HD/FHD Model 0001 01 00 Analog/Digital

MODEL NAME MODEL NAME(HEX)

LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)

EDID C/S data

FHD-8BIT

HDMI

FHD-10BIT

HDMI

Check Sum

(Hex)

Block 0 41 41 75

Block 1

25 (HDMI1) DE (HDMI1) 5B (HDMI1)

15 (HDMI2) CE (HDMI2) 4B (HDMI2)

For HDMI EDID

DVI-D to HDMI or HDMI to HDMI

- 14 -

Only for training and service purposes

6. Model name & Serial No. download

■ Press “Power on” key of service remote control

(Baud rate : 115200 bps)

■ Connect USB to RS232 cable at USB Jack.

■ Write model name and serial number.

■ Must check the model name and serial number at the

Product/Se rvice Info . (menu key → red key → select

Product/Service info)

6.1. Signal TABLE

CMD : A0h

LENGTH : 85~94h (1~16 bytes)

ADH : EEPROM Sub Address high (00~1F)

ADL : EEPROM Sub Address low (00~FF)

Data : Write data

CS : CMD + LENGTH + ADH + ADL + Data_1 +...+ Data_n

Delay : 20ms

6.2. Comand Set

* Description

FOS Default write : <7mode data> write

Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,

Phase

Data write : Model Name and Serial Number write in EEPROM,.

6.3. Method & notice

(1) Serial number D/L is using of scan equipment.

(2) Set tin g of scan eq uip men t oper ate d by Manufactu rin g

Technology Group.

(3) Serial number D/L must be conformed when it is produced in

production line, because serial number D/L is mandatory by

D-book 4.0.

* Manual Download(Model Name and Serial Number)

If the TV set is downloaded by OTA or Service man, sometimes

model name or serial number is initialized.(Not always)

There is impossible to download by bar code scan, so It need

Manual download.

1) Press the "Instart" key of Adjustment remote control.

2) Go to the menu "6.Model Number D/L" like below photo.

3) Input the Factory model name or Serial number like photo.

4) Check the model name Instart menu.

→

Factory name displayed.

5) Check the Product/Service Info.(Menu Key → Red Key →

Select Product/Service Info.) → Buyer model displayed.

CMD LENGTH ADH ADL DATA_1 . . . Data_n CS DELAY

Adjust mode CMD(hex) LENGTH(hex) Description

EEPROM WRITE A0h 84h+n n-bytes Write (n = 1~16)

- 15 -

Only for training and service purposes

(P1801)

30P HD LVDS wafer

51P FHD LVDS wafer

(P1800)

COMP2_L/R_IN

COMP2_Y+/AV_CVBS_IN, COMP2_Pb+/Pr+

CK+/-, D0+/-, D1+/-, D2+/-_HDMI2

DDC_SCL/SDA_2, HDMI_CEC

Serial Flash

(8Mbit)

IC1300

SPI_SCK/SDI/SDO/CS

System EEPROM

(256Kbit)

IC104

I2C_SCL/SDA

RXA0+/-~RXA4+/ -, RXACK+/ -

RXB0+/-~RXB4+/ -, RXBCK+/ -

SPK_R

SPK_L

AMP_SCL/SDA

AUD_MASTER_CLK,

AUD_LRCH,

AUD_LRCK, AUD_SCK

TAS5733

(IC5600)

Connector

(P4600)

KEY1/2, LED_R, IR

REAR

HDMI1

(JK800)

SPDIF_OUT

SPDIF(Optic)

(JK1001)

SIDE

USB

(JK700)

HDMI2(MHL)

(JK801)

CK+/-, D0+/-, D1+/-, D2+/-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC

SIDE_USB_DM/DP

USB1_OCP/CTL

TPS65282

+5V_USB

MHL_CD_SENSE

AVDD5V_MHL,MHL_OCP

CI Slot(P1900)

NAND FLASH

IC102 (1Gbit)

H27U1G8F2CTR-BC

PCM_A[0:7]

TC74LCX244FT

Buffer

TS_DATA[0:7]

PCM_DATA[0:7]

COMPONENT

(JK2802)

5V_HDMI_4

PCM_A[8:14]

X-tal

24M

Main SOC

M1A -256MB Built-in

(IC101)

TU_SCL / SDA

SIF

FE_TS_DATA[8]

CVBS

BLOCK DIAGRAM

- 16 -

Only for training and service purposes

900

200

400

410

540

521

530

820

501

500

120

310

121

LV1

A10

Set + Stand

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These

parts are identified by in the Schematic Diagram and EXPLODED VIEW.

It is essenti al that these special safety parts should be replac ed with the same compo nents as

recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

THERMAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

Power_PD2

131123

L14_M1A

Q403

MMBT3904(NXP)

+12V

R426

10K

+3.5V_ST

Q406

AO3435

FET_2.5V_AOS

PANEL_VCC

PWM_DIM

Q400

MMBT3904(NXP)

R420

R424

3.9K

PWM_DIM_PULL_DOWN

R401

10K

R442

10K

+24V

Q404

MMBT3904(NXP)

R441

10K

+3.5V_ST

R445

33K

R448

2.2K

C413

0.1uF

16V

OPT

C416

0.33uF

16V

R444

10K

+12V

INV_CTL

R430

2.7K

+3.5V_ST

R400

10K

OPT

+3.5V_ST

R425

10K

R435

100K

Q402

MMBT3904(NXP)

R429

10K

C415

0.1uF

16V

C417

0.1uF

16V

L410

BLM18PG121SN1D

C424

0.1uF

16V

OPT

+3.3V_Normal

Q406-*1

DMP2130L

FET_2.5V_DIODE

R432

OPT

R431

1.2K

L403

MLB-201209-0120P-N2

POWER_ON/OFF_1

C401

0.1uF

50V

+1.10V_VDDC

POWER_DET

RL_ON

+3.3V_Normal

+12V

+24V

+3.5V_ST

L402

MLB-201209-0120P-N2

C429

0.1uF

16V

R423

100

PWM2_2CH_POWER

PANEL_CTL

R443

10K

R406

10K

R419

100

+3.5V_ST

POWER_DET_RESET

+3.3V_Normal

C402

0.1uF

16V

C425

0.1uF

25V

OPT

C422

0.1uF

R436

100K

OPT

R451

5.6K

R404

4.7K

R402

10K

R452

5.6K

R412

33K

OPT

Q401

MMBT3906(NXP)

PWM1

L407

3.6uH

R454

100 5%

PD_+12V

C430

22uF

10V

C414

10uF

10V

C428

2.2uF

10V

C420

22uF

10V

C421

22uF

10V

C427

10uF

16V

ZD400

ZD402

L401

CB2012PK501T

L400

CB2012PK501T

L408

UBW2012-121F

120OHM

+3.3V_Normal

C406

10uF

16V

R418

R410

100K

L405

4.7uH

R405

4.7K

OPT

R409

10K

C408

10uF

10V

+3.3V_Normal

R416

100K

OPT

AVDD5V_MHL

+5V_Normal

USB1_OCD

C412

22uF

16V

+5V_USB

10uF

C405

R407

10K

R403

4.7K

OPT

5V_HDMI_4

USB1_CTL

+12V

/MHL_OCP_DET

C409

0.047uF

25V

L409

BLM18PG121SN1D

+3.3V_Normal

L411

CB2012PK501T

10uF

C426

10V

+1.5V_DDR

10uF

C431

10V

R455

C410

10uF

10V

ZD403

2.5V

ZD401

2.5V

R456

OPT

C432

4.7uF

50V

3216

+24V_CAP

C400

1uF

10V

1005

OPT

+24V

R457

8.2K

OPT

R458

OPT

R438

4.7K

OPT

C407

10uF

10V

2012

C434

390pF

50V

C419

0.039uF

50V

C423

270pF

50V

C435

0.1uF

16V

C418

0.01uF

ZD404

+3.5V_POWER_DET

+3.3V_Normal

/VBUS_EN

MHL_OCP_EN

R463

2.7K

MHL_SW_TR

R464

10K

MHL_SW_TR

Q408

MHL_SW_TR

R462

10K

MHL_SW_TR

Q407

MHL_SW_TR

Q409

MHL_SW_TR

R465

10K

MHL_SW_TR

R461

10K

MHL_SW_TR

R43 9

20K

R44 0

47K

R433

2.7K

R447

22K

C403

100pF

50V

OPT

R415

15K

R459

OPT

R408

4.7K

R449

1/16W

R450

200

1/16W

C411

82pF

50V

C404

4700pF

50V

D401

30V

MBR230LSFT1G

L406

CB2012PK501T

+3.5V_ST

C436

10uF

10V

OPT

C437

0.1uF

16V

Q405

DMP2130L

FET_Diode

R427

27K

OPT

R428

5.1K

OPT

IC404

AZ1117EH-ADJTRG1

ADJ/GND

OUTIN

R437

100 5%

OPT

R454-*1

300

PD_+3.5V

IC403

TPS5432DDAR

VIN

GND

BOOT

VSENSE

COMP

[EP]GND

TPS65282REGR

IC400

FAULT2

SW_OUT2

RLIM

AGND

SW_OUT1

SW_IN_1

SW_IN_2

LX_1

LX_2

BST

PGND_1

PGND_2

VIN_1

VIN_2

PGOOD

V7V

EN_SW2

FAULT1

EN_SW1

ROSC

COMP

[EP]GND

C433

4.7uF

16V

+12V_CAP

3216

MHL_5V_EN

R421

18K

R422

3.3K

P401

SMAW200-H18S5

12V

24V

PDIM#1

GND

12V

PDMI#2

3.5V

GND

DRV ON

GND

3.5V

PWR ON

12V

24V

3.5V

R446

12K

R453

R467

OPT

R466

20K

IC401

BD48K28G

RESET_IC_ROHM

GND

VOUT

VDD

IC402

BD48K28G

OPT

GND

VOUT

VDD

IC401-*1

APX803D29

RESET_IC_DIODES

GND

VCC

RESET

IC402-*1

APX803D29

OPT

GND

VCC

RESET

Q405-*1

PMV48XP

FET_NXP

Q406-*2

PMV48XP

FET_NXP

PANEL_VCC

+1.10V_VDDC

+3.3V_Normal

+1.5V_DDR

Vout=0.808*(1+R1/R2)

Power_DET

FROM LIPS or POWER B/D

L14 POWER BLOCK (POWER DETECT 2)

+5V_Normal & +5V_USB with OCP

1.3A

Vout=1.25*(1+R2/R1)+Iadj*R2

Vout=0.8*(1+R1/R2)

(Active High)

(Active Low)

Ready - Dual Power Det

R432, R454-*1, R438

Now is

R457, R454

Detect Valtage

O R430, R431, R454

Use Circuit Designator

Power Detect +3.5V

Power Detect +12V

Power Detect +24V

Power Detect activity

* Notice

- Applying all inch models for LCD L14

- Dual Power Det is used

for detecting two kinds of voltage

Only for training and service purposes

LGE Internal Use Only

USB DO WN ST REA M

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

14/03/03

USB_S1

L14_M1A

JK700

3AU 04S -3 05- ZC- (L G)

1234

D700

RCLAMP0502BA

OPT

SIDE_USB1_DM

SIDE_USB1_DP

C700

22uF

10V

USB_HDD_CAP1_22uF

ZD700

OPT

SD05

C701

5pF

50V

OPT

C702

5pF

50V

OPT

C703

22uF

10V

USB_HDD_CAP2_22uF

+5V_USB

C704

22uF

10V

OPT

C700-*1

10uF

10V

USB_HDD_CAP1_10uF

C703-*1

10uF

10V

USB_HDD_CAP2_10uF

USB (SIDE)

Only for training and service purposes

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

2013/08/15

HDMI_R1_S1 8

L14_M1A

VA804

ESD_HDMI1

R803

D802

MMBD6100

HDMI_ARC

VA805

ESD_HDMI2

D1+_HDMI2

CEC_REMOTE_S7

+3.5V_ST

VA800

ESD_HDMI1_VARISTOR

VA808

ESD_HDMI2

R809

10K

D2-_HDMI2

VA802

ESD_HDMI1

R807

2.7K

D801

MMBD6100

CK-_HDMI4

CK-_HDMI2

R804

100

VA801

ESD_HDMI1_VARISTOR

R816 100

HDMI-2

R810 100

DDC_SCL_2

R812

1.8K

HDMI-2

DDC_SCL_2

JK800

EAG59023302

D1_GND

SHIELD

D2_GND

CK+

D1+

D2+

D0-

D0_GND

D2-

D0+

D1-

D0+_HDMI2

R811 100

VA803

ESD_HDMI1

DDC_SDA_2

5V_HDMI_2

R800

2.7K

HPD4

5V_HDMI_4

CK+_HDMI4

D800

MMBD6100

VA809

ESD_HDMI2

VA800-*1

1uF

10V

ESD_HDMI1_CAP

+5V_Normal

R805

3.3K

DDC_SCL_4

VA801-*1

1uF

10V

ESD_HDMI1_CAP

R814

HDMI-2

D1-_HDMI4

DDC_SDA_4

5V_DET_HDMI_4

5V_HDMI_4

D1-_HDMI2

HDMI_CEC

CK+_HDMI2

R806

2.7K

R817

300K

HDMI-2

5V_DET_HDMI_2

DDC_SDA_4

+5V_Normal

DDC_SCL_4

HPD2

HDMI_CEC

Q800

MMBT3904(NXP)

R801

2.7K

D0-_HDMI2

VA811

ESD_HDMI2

D0-_HDMI4

MHL_CD_SENSE

5V_HDMI_2

R813

3.3K

HDMI-2

VA810

ESD_HDMI2

D2+_HDMI4

VA807

OPT

5.6V

DDC_SDA_2

D1+_HDMI4

R815 100

HDMI-2

C800

0.047uF

25V

HDMI-2

D2-_HDMI4

R802

1.8K

D2+_HDMI2

R808

10K

HDMI_CEC

D0+_HDMI4

VA806

ESD_HDMI2

JK801

EAG62611204

HDMI-2

CE_REMOTE

D1_GND

GND

CK-

CK_GND

D2_GND

HP_DET

CK+

D1+

D2+

GND

D0-

D0_GND

D2-

DDC_DATA

D0+

D1-

DDC_CLK

D803-*2

RCLAMP0524PA

ESD_HDMI1_SEMTECH

D804-*2

RCLAMP0524PA

ESD_HDMI1_SEMTECH

D806-*2

RCLAMP0524PA

ESD_HDMI2_SEMTECH

D805-*2

RCLAMP0524PA

ESD_HDMI2_SEMTECH

JK801-*1

DAADR019A

HDMI-2_EMI_FOOSUNG

RESERVED

CEC

TMDS_DATA1_SHIELD

BODY_SHIELD

TMDS_CLK-

TMDS_CLK_SHIELD

TMDS_DATA2_SHIELD

HOT_PLUG_DETECT

VDD[+5V]

TMDS_CLK+

TMDS_DATA1+

TMDS_DATA2+

DDC/CEC_GND

TMDS_DATA0-

TMDS_DATA0_SHIELD

TMDS_DATA2-

SDA

TMDS_DATA0+

TMDS_DATA1-

SCL

D803

IP4294CZ10-TBR

ESD_HDMI1_IP4294

D803-*1

IP4283CZ10-TBA

ESD_HDMI1_IP4283

GND_1

TMDS_CH1+

TMDS_CH2-

TMDS_CH1-

TMDS_CH2+

NC_1

NC_2

GND_2

NC_3

NC_4

D804-*1

IP4283CZ10-TBA

ESD_HDMI1_IP4283

GND_1

TMDS_CH1+

TMDS_CH2-

TMDS_CH1-

TMDS_CH2+

NC_1

NC_2

GND_2

NC_3

NC_4

D805-*1

IP4283CZ10-TBA

ESD_HDMI2_IP4283

GND_1

TMDS_CH1+

TMDS_CH2-

TMDS_CH1-

TMDS_CH2+

NC_1

NC_2

GND_2

NC_3

NC_4

D806-*1

IP4283CZ10-TBA

ESD_HDMI2_IP4283

GND_1

TMDS_CH1+

TMDS_CH2-

TMDS_CH1-

TMDS_CH2+

NC_1

NC_2

GND_2

NC_3

NC_4

D804

IP4294CZ10-TBR

ESD_HDMI1_IP4294

D805

IP4294CZ10-TBR

ESD_HDMI2_IP4294

D806

IP4294CZ10-TBR

ESD_HDMI2_IP4294

HDMI (REAR 1 / SIDE 1 MHL)

HDMI_2 MHL

HDMI_1

CEC

MHL Spec

Only for training and service purposes

LGE Internal Use Only

Fiber Optic

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

SPDIF

2013/10/29

NC5_L14

+3.3V_Normal

SPDIF_OUT

JK1001

JST1223-001

SPDIF_OPTIC

GND

VCC

VINPUT

FIX_POLE

C1001

1uF

10V

OPT

C1002

47pF

50V

SPDIF_CAP_47pF

C1002-*1

18pF

50V

SPDIF_CAP_18pF

SPDIF OPTIC JACK

5.15 Mstar Circuit Application

SPDIF

ESD Ready

Only for training and service purposes

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

1_DDR

2014/02/04

NC5_S7LR(M1A)

A-MWEB

A-MA7

A-MDQL5

A-MBA2

A-MCASB

A-MA8

A-MA12

R1208

56 1%

DDR_EXT

A-MODT

A-MA2

A-MDQU7

A-MDQL0

A-MDQL2

C1201 0.1uF

DDR_EXT

A-MA14

C1202 1000pF

DDR_EXT

A-MDQSLB

A-MA4

R12011K1%

DDR_EXT

A-MVREFDQ

A-MRESETB

A-MCKB

A-MDQL3

A-MDMU

A-MVREFCA

R1202 1K1%

DDR_EXT

A-MDQL4

A-MBA1

R1205 1K 1%

DDR_EXT

A-MDQU2

R1203

240

DDR_EXT

A-MDQSU

R1206

10K

DDR_EXT

A-MBA0

A-MA5

A-MDQU1

A-MDQSL

A-MA9

R1207

56 1%

DDR_EXT

C1214

1000pF

DDR_EXT

A-MCKE

A-MVREFDQ

A-MDML

A-MA10

A-MDQU0

A-MA13

A-MDQU3

A-MA11

A-MDQU6

A-MDQSUB

C1213 0.1uF

DDR_EXT

A-MRASB

A-MVREFCA

A-MDQU4

A-MDQU5

A-MDQL7

A-MA0

A-MDQL6

A-MA3

A-MDQL1

A-MA1

A-MA6

A-MCK

R1204 1K 1%

DDR_EXT

+1.5V_DDR

C1217

0.1uF

OPT

C1210 0.1uF

DDR_EXT

C1206 0.1uF

DDR_EXT

C1211 0.1uF

DDR_EXT

C1207 0.1uF

DDR_EXT

C1208 0.1uF

DDR_EXT

C1204 0.1uF

DDR_EXT

C1212 0.1uF

DDR_EXT

C1209 0.1uF

DDR_EXT

C1205 0.1uF

DDR_EXT

C1215

0.01uF

50V

DDR_EXT

C1218

0.1uF

OPT

C1224

0.1uF

OPT

H5TQ2G63DFR-PBC

IC1201-*2

DDR_1600_2G_HYNIX_OLD

EAN61829203

A10/AP

A11

A12/BC

A13

NC_5

BA0

BA1

BA2

CKE

ODT

RAS

CAS

RESET

DQSL

DQSU

DML

DMU

DQL0

DQL1

DQL2

DQL3

DQL4

DQL5

DQL6

DQL7

DQU0

DQU1

DQU2

DQU3

DQU4

DQU5

DQU6

DQU7

VREFCA

VREFDQ

VDD_1

VDD_2

VDD_3

VDD_4

VDD_5

VDD_6

VDD_7

VDD_8

VDD_9

VDDQ_1

VDDQ_2

VDDQ_3

VDDQ_4

VDDQ_5

VDDQ_6

VDDQ_7

VDDQ_8

VDDQ_9

NC_1

NC_2

NC_3

NC_4

NC_6

VSS_1

VSS_2

VSS_3

VSS_4

VSS_5

VSS_6

VSS_7

VSS_8

VSS_9

VSS_10

VSS_11

VSS_12

VSSQ_1

VSSQ_2

VSSQ_3

VSSQ_4

VSSQ_5

VSSQ_6

VSSQ_7

VSSQ_8

VSSQ_9

C1216

10uF 10V

OPT

C1203 10uF

10V

DDR_EXT

C1219

1uF

OPT

C1220

1uF

OPT

C1221

1uF

OPT

C1222

1uF

OPT

C1223

1uF

OPT

+1.5V_DDR

+1.5V_DDR+1.5V_DDR

A-MA13

A-MA14

A-MA7

A-MA10

A-MA1

A-MA8

A-MA3

A-MA0

A-MA4

A-MA6

A-MA11

A-MA9

A-MA5

A-MA2

A-MA12

A-MBA0

A-MBA1

A-MBA2

A-MCKE

A-MCK

A-MCKB

A-MCASB

A-MWEB

A-MRASB

A-MODT

A-MRESETB

A-MDMU

A-MDML

A-MDQSU

A-MDQSUB

A-MDQSL

A-MDQSLB

A-MDQL4

A-MDQL0

A-MDQL3

A-MDQL7

A-MDQL5

A-MDQL2

A-MDQL6

A-MDQL1

A-MDQU1

A-MDQU3

A-MDQU0

A-MDQU4

A-MDQU5

A-MDQU2

A-MDQU6

A-MDQU7

R1209

240

A/B_DDR3_CS

H5TQ1G63EFR-PBC

IC1201

DDR_1600_1G_HYNIX

EAN61829003

A10/AP

A11

A12/BC

NC_7

NC_5

BA0

BA1

BA2

CKE

ODT

RAS

CAS

RESET

DQSL

DQSU

DML

DMU

DQL0

DQL1

DQL2

DQL3

DQL4

DQL5

DQL6

DQL7

DQU0

DQU1

DQU2

DQU3

DQU4

DQU5

DQU6

DQU7

VREFCA

VREFDQ

VDD_1

VDD_2

VDD_3

VDD_4

VDD_5

VDD_6

VDD_7

VDD_8

VDD_9

VDDQ_1

VDDQ_2

VDDQ_3

VDDQ_4

VDDQ_5

VDDQ_6

VDDQ_7

VDDQ_8

VDDQ_9

NC_1

NC_2

NC_3

NC_4

NC_6

VSS_1

VSS_2

VSS_3

VSS_4

VSS_5

VSS_6

VSS_7

VSS_8

VSS_9

VSS_10

VSS_11

VSS_12

VSSQ_1

VSSQ_2

VSSQ_3

VSSQ_4

VSSQ_5

VSSQ_6

VSSQ_7

VSSQ_8

VSSQ_9

IC101

LGE2132(M1A_256M)

M1A_256M_UO3

B_DDR3_A[0]

E11

B_DDR3_A[1]

F12

B_DDR3_A[2]

D10

B_DDR3_A[3]

B10

B_DDR3_A[4]

E15

B_DDR3_A[5]

B11

B_DDR3_A[6]

F14

B_DDR3_A[7]

C11

B_DDR3_A[8]

D14

B_DDR3_A[9]

A12

B_DDR3_A[10]

F16

B_DDR3_A[11]

D13

B_DDR3_A[12]

D15

B_DDR3_A[13]

C12

B_DDR3_A[14]

E13

B_DDR3_BA[0]

B_DDR3_BA[1]

D16

B_DDR3_BA[2]

A10

B_DDR3_MCLK

C13

B_DDR3_MCLKZ

B13

B_DDR3_MCLKE

E17

B_DDR3_ODT

B_DDR3_RASZ

B_DDR3_CASZ

B_DDR3_WEZ

D11

B_RESET

F10

B_DDR3_CS0

D12

B_DDR3_DQSL

A19

B_DDR3_DQSU

B18

B_DDR3_DQML

C16

B_DDR3_DQMU

D21

B_DDR3_DQSBL

C18

B_DDR3_DQSBU

C17

B_DDR3_DQL[0]

A20

B_DDR3_DQL[1]

A16

B_DDR3_DQL[2]

C19

B_DDR3_DQL[3]

C15

B_DDR3_DQL[4]

C20

B_DDR3_DQL[5]

C14

B_DDR3_DQL[6]

B21

B_DDR3_DQL[7]

B15

B_DDR3_DQU[0]

F18

B_DDR3_DQU[1]

D19

B_DDR3_DQU[2]

D17

B_DDR3_DQU[3]

E21

B_DDR3_DQU[4]

E19

B_DDR3_DQU[5]

D20

B_DDR3_DQU[6]

D18

B_DDR3_DQU[7]

F20

H5TQ2G63FFR-PBC

IC1201-*3

DDR_1600_2G_HYNIX_NEW

EAN61829204

A10/AP

A11

A12/BC

A13

NC_5

BA0

BA1

BA2

CKE

ODT

RAS

CAS

RESET

DQSL

DQSU

DML

DMU

DQL0

DQL1

DQL2

DQL3

DQL4

DQL5

DQL6

DQL7

DQU0

DQU1

DQU2

DQU3

DQU4

DQU5

DQU6

DQU7

VREFCA

VREFDQ

VDD_1

VDD_2

VDD_3

VDD_4

VDD_5

VDD_6

VDD_7

VDD_8

VDD_9

VDDQ_1

VDDQ_2

VDDQ_3

VDDQ_4

VDDQ_5

VDDQ_6

VDDQ_7

VDDQ_8

VDDQ_9

NC_1

NC_2

NC_3

NC_4

NC_6

VSS_1

VSS_2

VSS_3

VSS_4

VSS_5

VSS_6

VSS_7

VSS_8

VSS_9

VSS_10

VSS_11

VSS_12

VSSQ_1

VSSQ_2

VSSQ_3

VSSQ_4

VSSQ_5

VSSQ_6

VSSQ_7

VSSQ_8

VSSQ_9

K4B1G1646G-BCK0

IC1201-*1

DDR_1600_1G_SS

EAN61836301

A10/AP

A11

A12/BC

A13

NC_5

BA0

BA1

BA2

CKE

ODT

RAS

CAS

RESET

DQSL

DQSU

DML

DMU

DQL0

DQL1

DQL2

DQL3

DQL4

DQL5

DQL6

DQL7

DQU0

DQU1

DQU2

DQU3

DQU4

DQU5

DQU6

DQU7

VREFCA

VREFDQ

VDD_1

VDD_2

VDD_3

VDD_4

VDD_5

VDD_6

VDD_7

VDD_8

VDD_9

VDDQ_1

VDDQ_2

VDDQ_3

VDDQ_4

VDDQ_5

VDDQ_6

VDDQ_7

VDDQ_8

VDDQ_9

NC_1

NC_2

NC_3

NC_4

NC_6

VSS_1

VSS_2

VSS_3

VSS_4

VSS_5

VSS_6

VSS_7

VSS_8

VSS_9

VSS_10

VSS_11

VSS_12

VSSQ_1

VSSQ_2

VSSQ_3

VSSQ_4

VSSQ_5

VSSQ_6

VSSQ_7

VSSQ_8

VSSQ_9

K4B2G1646Q-BCK0

IC1201-*4

DDR_1600_2G_SS

EAN61848803

A10/AP

A11

A12/BC

A13

NC_5

BA0

BA1

BA2

CKE

ODT

RAS

CAS

RESET

DQSL

DQSU

DML

DMU

DQL0

DQL1

DQL2

DQL3

DQL4

DQL5

DQL6

DQL7

DQU0

DQU1

DQU2

DQU3

DQU4

DQU5

DQU6

DQU7

VREFCA

VREFDQ

VDD_1

VDD_2

VDD_3

VDD_4

VDD_5

VDD_6

VDD_7

VDD_8

VDD_9

VDDQ_1

VDDQ_2

VDDQ_3

VDDQ_4

VDDQ_5

VDDQ_6

VDDQ_7

VDDQ_8

VDDQ_9

NC_1

NC_2

NC_3

NC_4

NC_6

VSS_1

VSS_2

VSS_3

VSS_4

VSS_5

VSS_6

VSS_7

VSS_8

VSS_9

VSS_10

VSS_11

VSS_12

VSSQ_1

VSSQ_2

VSSQ_3

VSSQ_4

VSSQ_5

VSSQ_6

VSSQ_7

VSSQ_8

VSSQ_9

IC101-*1

LGE2131(M1A_128M)

M1A_128M_UO3

B_DDR3_A[0]

E11

B_DDR3_A[1]

F12

B_DDR3_A[2]

D10

B_DDR3_A[3]

B10

B_DDR3_A[4]

E15

B_DDR3_A[5]

B11

B_DDR3_A[6]

F14

B_DDR3_A[7]

C11

B_DDR3_A[8]

D14

B_DDR3_A[9]

A12

B_DDR3_A[10]

F16

B_DDR3_A[11]

D13

B_DDR3_A[12]

D15

B_DDR3_A[13]

C12

B_DDR3_A[14]

E13

B_DDR3_BA[0]

B_DDR3_BA[1]

D16

B_DDR3_BA[2]

A10

B_DDR3_MCLK

C13

B_DDR3_MCLKZ

B13

B_DDR3_MCLKE

E17

B_DDR3_ODT

B_DDR3_RASZ

B_DDR3_CASZ

B_DDR3_WEZ

D11

B_RESET

F10

B_DDR3_CS0

D12

B_DDR3_DQSL

A19

B_DDR3_DQSU

B18

B_DDR3_DQML

C16

B_DDR3_DQMU

D21

B_DDR3_DQSBL

C18

B_DDR3_DQSBU

C17

B_DDR3_DQL[0]

A20

B_DDR3_DQL[1]

A16

B_DDR3_DQL[2]

C19

B_DDR3_DQL[3]

C15

B_DDR3_DQL[4]

C20

B_DDR3_DQL[5]

C14

B_DDR3_DQL[6]

B21

B_DDR3_DQL[7]

B15

B_DDR3_DQU[0]

F18

B_DDR3_DQU[1]

D19

B_DDR3_DQU[2]

D17

B_DDR3_DQU[3]

E21

B_DDR3_DQU[4]

E19

B_DDR3_DQU[5]

D20

B_DDR3_DQU[6]

D18

B_DDR3_DQU[7]

F20

IC101-*2

LGE2134(256M)

M1A_256M_UO4

B_DDR3_A[0]

E11

B_DDR3_A[1]

F12

B_DDR3_A[2]

D10

B_DDR3_A[3]

B10

B_DDR3_A[4]

E15

B_DDR3_A[5]

B11

B_DDR3_A[6]

F14

B_DDR3_A[7]

C11

B_DDR3_A[8]

D14

B_DDR3_A[9]

A12

B_DDR3_A[10]

F16

B_DDR3_A[11]

D13

B_DDR3_A[12]

D15

B_DDR3_A[13]

C12

B_DDR3_A[14]

E13

B_DDR3_BA[0]

B_DDR3_BA[1]

D16

B_DDR3_BA[2]

A10

B_DDR3_MCLK

C13

B_DDR3_MCLKZ

B13

B_DDR3_MCLKE

E17

B_DDR3_ODT

B_DDR3_RASZ

B_DDR3_CASZ

B_DDR3_WEZ

D11

B_RESET

F10

B_DDR3_CS0

D12

B_DDR3_DQSL

A19

B_DDR3_DQSU

B18

B_DDR3_DQML

C16

B_DDR3_DQMU

D21

B_DDR3_DQSBL

C18

B_DDR3_DQSBU

C17

B_DDR3_DQL[0]

A20

B_DDR3_DQL[1]

A16

B_DDR3_DQL[2]

C19

B_DDR3_DQL[3]

C15

B_DDR3_DQL[4]

C20

B_DDR3_DQL[5]

C14

B_DDR3_DQL[6]

B21

B_DDR3_DQL[7]

B15

B_DDR3_DQU[0]

F18

B_DDR3_DQU[1]

D19

B_DDR3_DQU[2]

D17

B_DDR3_DQU[3]

E21

B_DDR3_DQU[4]

E19

B_DDR3_DQU[5]

D20

B_DDR3_DQU[6]

D18

B_DDR3_DQU[7]

F20

IC101-*3

LGE2133(128M)

M1A_128M_UO4

B_DDR3_A[0]

E11

B_DDR3_A[1]

F12

B_DDR3_A[2]

D10

B_DDR3_A[3]

B10

B_DDR3_A[4]

E15

B_DDR3_A[5]

B11

B_DDR3_A[6]

F14

B_DDR3_A[7]

C11

B_DDR3_A[8]

D14

B_DDR3_A[9]

A12

B_DDR3_A[10]

F16

B_DDR3_A[11]

D13

B_DDR3_A[12]

D15

B_DDR3_A[13]

C12

B_DDR3_A[14]

E13

B_DDR3_BA[0]

B_DDR3_BA[1]

D16

B_DDR3_BA[2]

A10

B_DDR3_MCLK

C13

B_DDR3_MCLKZ

B13

B_DDR3_MCLKE

E17

B_DDR3_ODT

B_DDR3_RASZ

B_DDR3_CASZ

B_DDR3_WEZ

D11

B_RESET

F10

B_DDR3_CS0

D12

B_DDR3_DQSL

A19

B_DDR3_DQSU

B18

B_DDR3_DQML

C16

B_DDR3_DQMU

D21

B_DDR3_DQSBL

C18

B_DDR3_DQSBU

C17

B_DDR3_DQL[0]

A20

B_DDR3_DQL[1]

A16

B_DDR3_DQL[2]

C19

B_DDR3_DQL[3]

C15

B_DDR3_DQL[4]

C20

B_DDR3_DQL[5]

C14

B_DDR3_DQL[6]

B21

B_DDR3_DQL[7]

B15

B_DDR3_DQU[0]

F18

B_DDR3_DQU[1]

D19

B_DDR3_DQU[2]

D17

B_DDR3_DQU[3]

E21

B_DDR3_DQU[4]

E19

B_DDR3_DQU[5]

D20

B_DDR3_DQU[6]

D18

B_DDR3_DQU[7]

F20

CLose to Saturn7M IC

CLose to DDR3

Option : Ripple Check !!!

Only for training and service purposes

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

S_FLASH

2013/04/29

NC5_S7LR(M1A)

SPI_SCK

+3.5V_ST+3.5V_ST

C1300

0.1uF

R1301

4.7K

OPT

/SPI_CS

SPI_SDO

IC1300

MX25L8006EM2I-12G

SPI_FLASH_MACRONIX

WP#

SO/SIO1

GND

CS#

SI/SIO0

SCLK

HOLD#

VCC

R1302

R1300

10K

OPT

SPI_SDI

/FLASH_WP

IC1300-*1

W25Q80BVSSIG

SPI_FLASH_WINBOND

%WP[IO2]

DO[IO1]

GND

DI[IO0]

CLK

HOLD[IO3]

VCC

+3.5V_ST

Serial Flash for SPI boot

Only for training and service purposes

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LVDS_EU

2013.07.15

L14_M1A

R1806

3.3K

OPT

RXB0-

RXA0+

C1800

0.1uF

16V

RXBCK-

RXA1-

RXB4-

+3.3V_Normal

RXB1+

RXBCK+

PANEL_VCC

RXB3+

RXA3-

RXB4+

RXA4-

RXA4+

RXA2+

+3.3V_Normal

RXB2-

R1807

10K

OPT

RXA1+

RXA2-

RXB1-

R1808

3.3K

OPT

RXA3+

RXA0-

PANEL_VCC

RXACK-

RXB2+

R1809

10K

OPT

RXB3-

RXB0+

P1800

FI-RE51S-HF-J-R1500

MO_FHD

RXACK+

RXA2+

RXA2-

RXA3+

RXACK+

RXA1+

RXA3-

RXA0+

RXA1-

RXACK-

RXA0-

R1801 0

MO_FHD

R1802 0

MO_FHD

R1803 0

MO_FHD

P1801

10031HR-30

MO_HD

VCOM_SDA

VCOM_SCL

VCOM_SDA

VCOM_SCL

URSA/VCOM_SCL

R1811

VCOM_I2C_PULL_UP

R1805

VCOM_I2C

R1810

VCOM_I2C_PULL_UP

+3.3V_Normal

R1804

VCOM_I2C

VCOM_SCL

URSA/VCOM_SDA

URSA/VCOM_SCL

VCOM_SDA

RXB1-

RXB0-

RXA4+

RXA1-

Pol-change

RXB4+

RXACK+

RXBCK-

RXA0+

RXA2+

LVDS_EU

RXA2+

RXBCK-

RXB4-

RXA3+

RXA1+

RXB2+

RXB3-

RXA3-

RXBCK-

RXACK-

RXA2+

RXA1-

RXB1-

RXB3-

RXA3+

RXA2-

RXA0+

RXA4+

Shift

RXBCK+

RXB2-

RXA4+

[51Pin LVDS Connector]

(For FHD 60Hz)

RXACK+

RXA3-

RXACK-

RXB3+

RXA3+

RXA1-

RXB0-

RXA0-

RXACK+

RXB3+

LVDS_SEL

RXA4-

RXB3+

RXA4+

RXA2-

RXA2+

RXA1+

RXB2-

Pol-change

RXB4+

RXB1-

RXA4-

RXACK+

RXB3-

RXB0+

RXB3+

RXBCK+

RXB4-

RXA0+

RXA2+

RXB0+

RXB1+

RXA3-

RXA2-

RXBCK+

RXB4-

RXA0+

RXA4+

RXA2+

RXB3-

RXA0-

RXB0-

RXA4-

RXACK-

RXB0-

RXA4+

RXB2+

RXA1-

RXB2+

RXACK-

RXA3-

RXA1+

RXA3-

RXA1+

RXB3+

RXB3-

RXA3-

RXB1-

RXB4+

FOR FHD REVERSE(10bit)

RXB0+

RXB3-

RXA3+

RXA0+

RXA2- RXACK-

RXB1-

RXA3+

RXB2- RXBCK-

RXBCK+

RXA1+

RXA0-

RXA3+

RXA0-

RXB2+

RXB0-

RXA0-

RXB2-

RXACK-

MIRROR

RXB4-

RXA0-

RXB2+

RXA4+

RXB4-

RXA1+

RXB3+

RXB0+

RXB1+

RXA1-

RXA0-

RXA4-

RXB2-

Change in S7LR

RXA4-

RXB2+

MIRROR

RXB1-

RXA3+

RXA1-

RXACK+

RXB3+

RXB0+

RXB4-

RXACK+

RXB1+

RXACK-

RXA4-

RXA1-

RXA2-

RXA0+

RXB0-

RXB1+

RXB4+

RXB2+

RXBCK-

RXB0-

FOR FHD REVERSE(8bit)

RXBCK-

RXBCK+

RXB4+

RXB0+

RXB2-

RXA1+

RXBCK-

RXA2-

RXB1+

RXB1-

RXA4-

RXB4+

[30Pin LVDS Connector]

(For HD 60Hz_Normal)

Change in S7LR

RXB1+

RXB3-

RXA2+

RXA3-

RXA2-

RXB2-

LVDS_SEL

RXBCK+

RXB4-

RXB0+

RXA0+

RXB4+

RXBCK+

RXACK+

EU pin assign is different from NON EU.

Because of position of HD wafer.

V-COM I2C

Only for training and service purposes

LGE Internal Use Only

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