Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to UA65S Chassis applied LED TV all
models manufactured in TV factory
2. Specification.
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15ºC
▪ In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
▪ In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above 15°C
for 3 hours
* (Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
Above adjustment items can be also performed in Final
Assembly if needed. Both Board-level and Final assembly
adjustment items can be check using In-Start Menu 1.ADJUST
CHECK.
3.2. Final assembly adjustment
▪ White Balance adjustment
▪ RS-232C functionality check
▪ PING Test
▪ Factory Option setting per destination
▪ Ship-out mode setting (In-Stop)
4. Automatic Adjustment
4.1. ADC Adjustment
ADC adjustment is needed to find the optimum black level and
gain in Analog-to-Digital device and to compensate RGB
deviation.
4.1.1. Equipment & Condition
(1) USB to RS-232C Jig
(2) MSPG-925 Series Pattern Generator(MSPG-925FA,
pattern -65)
- Resolution : 480i Comp1
1080P Comp1
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level : 0.7±0.1 Vp-p
- Image
4.1.2. Adjustment method
▪ Using USB, adjust items listed in 3.1 in the other shown in
“4.1.3.3”
4.1.3. Adj. protocol
ProtocolCommandSet ACK
Enter adj. modeaa 00 00a 00 OK00x
Source changexb 00 40
xb 00 60
Begin adj.ad 00 10
Return adj.
result
Read adj. data(main)
ad 00 20
(sub )
ad 00 21
Conrm adj.ad 00 99NG 03 00x (Fail)
End adj.ad 00 90a 00 OK90x
(Ref.) ADC Adj. RS232C Protocol_Ver1.0
b 00 OK04x (Adjust 480i, 1080p Comp1 )
b 00 OK06x (Adjust 1920*1080 RGB)
OKx (Case of Success)
NGx (Case of Fail)
(main)
000000000000000000000000007c007b006dx
(Sub)
000000070000000000000000007c00830077x
NG 03 01x (Fail)
NG 03 02x (Fail)
OK 03 03x (Success)
3.3. Etc.
▪ Ship-out mode
▪ Service Option Default
▪ USB Download(S/W Update, Option, Service only)
▪ ISP Download (Option)
Only for training and service purposes
- 14 -
Adj. order
▪ aa 00 00 [Enter ADC adj. mode]
▪ xb 00 04
[Change input source to Component1(480i&1080p)]
▪ ad 00 10 [Adjust 480i&1080p Comp1]
▪ xb 00 06 [Change input source to RGB(1024*768)]
▪ ad 00 10 [Adjust 1920*1080 RGB]
▪ aa 00 90 End adj.
(1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)
(2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)
4.2.3. Download process
(1) Select the download items.
(2) Mode check: Online Only
(3) Check the test process : DETECT -> MAC -> Widevine
(4) Play: START
(5) Check of result: Ready, Test, OK or NG
4.2.4. Communication Port connection
(1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C
Port
4.3. LAN Inspection
4.3.1. Equipment & Condition
▪ Each other connection to LAN Port of IP Hub and Jig
4.3.2. LAN inspection solution
▪ LAN Port connection with PCB
▪ Network setting at MENU Mode of TV
▪ Setting automatic IP
▪ Setting state confirmation
- If automatic setting is finished, you confirm IP and MAC
Address.
4.2.5. Download
(1) Models(MAC + Widevine + ESN): Korea model(K2Lp)
4.3.3. LAN PORT INSPECTION (PING TEST)
(1) Play the LAN Port Test PROGRAM.
(2) Input IP set up for an inspection to Test Program.
(1) Play the LAN Port Test Program.
(2) connect each other LAN Port Jack.
(3) Play Test (F9) button and confirm OK Message.
(4) remove LAN CABLE
4.4. Model name & Serial number Download
4.4.1. Model name & Serial number D/L
▪ Press “Power on” key of service remocon.(Baud rate :
115200 bps)
▪ Connect RS-232C Signal to USB Cable to USB.
▪ Write Serial number by use USB port.
▪ Must check the serial number at Instart menu.
* Manual Download (Model Name and Serial Number)
If the TV set is downloaded By OTA or Service man,
Sometimes model name or serial number is initialized. ( not
always)
It is impossible to download by bar code scan, so It need
Manual download.
a. Press the ‘INSTART’ key of ADJ remote controller.
b. Go to the menu ‘7. Model Number D/L’ like below photo.
c. Input the Factory model name or Serial number like
below photo.
d. Check the model name INSTART menu -> Factory name
displayed
e. Check the Diagnostics (DTV country only) -> Buyer
model displayed
4.5. WIFI MAC ADDRESS CHECK
4.5.1. Using RS232 Command
CommandSet ACK
Transmission[A][l][][Set ID][][20][Cr][O][K][x] or [N][G]
■ Check the menu on in-start
■ Method & Notice
A. Serial number D/L is using of scan equipment.
B. Setting of scan equipment operated by Manufacturing
Technology Group.
C. Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
5.1. ADC adjustment is not needed because of
OTP (Auto ADC adjustment)
5.2. EDID
(The Extended Display Identification Data)
/ DDC (Display Data Channel) download
5.2.1. Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any necessity of
user input. It is a realization of “Plug and Play”.
5.2.2. Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust remocon
5.2.3. Download method
(1) Press Adj. key on the Adjust remocon, then select “12.EDID
D/L”.
By pressing Enter key, enter EDID D/L menu
(2) Select [Start] button by pressing Enter key, HDMI1 / HDMI2
/ HDMI3 / HDMI4 are Writing and display OK or NG.
For HDMI EDID
5.2.4. EDID DATA
▪ Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by Input mode
(1) Objective : To check how it connects between Camera and
PCBA normally, and their Function
(2) Test Method : This Inspection is available only Power-Only
Status.
1) Push Camera Up
2) Camera’s Preview picture appears on TV Set
3) Push Camera Down
(3) RS-232C Command
RS-232C COMMAND
CMDD ATAID
Ai0023Camera Function Start.
Ai0024Camera Function End.
Explanation
5.4. V-COM Adjust
(ONLY FOR EPI model, 43/49/55UH6600, 43/49/55UH6500)
5.4.1. Overview
▪ V-COM adj. Objective & How-it-works
- Objective: To reduce each Panel’s V-COM voltage deviation
- How-it-works: When V-COM gain in the adjust-OSD of each
SET is at default value, each SET can have flicker by each
Panel’s V-COM voltage deviation. In order to prevent flicker
of each SET, find the desired each Panel’s V-COM voltage
value.
- Adj. condition: normal temperature
1) Surrounding Temperature: 25
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
ºC
± 5
ºC
5.4.4. Adj. Command (Protocol)
<Command Format>
CMD ID DATA CR RF
- CMD: Command
- ID : Command
- Data : Command
(Ex) [Send: va 00 00\r\n]
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMDD ATAID
va0000V-com pattern
vb00 00 ~ FEV-com adj.(internal Flicker pattern)
wb00FFV-com adj. completed
Explanation
5.4.5. Adjustment method
(1) Set TV in POWER-ONLY mode using POWER ONLY key
(2) Zero calibrate probe then place it on the center of the
Display
(3) Connect Cable (RS-232C to USB)
(4) Select Model in “V-com adj. Program” and begin “V-com
adj.”
(5) When V-com adj. is complete (OK)
(6) Remove probe and RS-232C to USB cable to complete adj.
▪ V-com Adj. must begin as start command “va 00 00” , and
finish as end command “wb 00 ff”
▪ V-com adjust data
43” inch49” inch55” inch65” inch
V-com Data
hexdec hexdec hex dec hexdec
MaxB41808B 139 85133AB171
Default 961506D 109 681048D141
Min781204F 79 49736F111
5.4.2. Equipment
(1) Color Analyzer: CA-310 (LED Module : CH 14) or CM-H505
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Signal : internal flicker Pattern in SET
▪ Color Analyzer Matrix should be calibrated using CS-100
5.5.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
5.5.2. Equipment
(1) Color Analyzer: CA-210 (LED Module : CH 14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)
(3) Adjust Remocon
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
※ Color Analyzer Matrix should be calibrated using CS-1000
5.5.3. Equipment connection MAP
Color Analyzer
Probe
RS-232C
Pattern Generator
Signal Source
5.5.4. Adj. Command (Protocol)
<Command Format>
START 6E A 50 A LEN A 03 A CMD A 00 A VAL A CS A STOP
RS-232C
Computer
RS-232C
(Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
* (wb 00 20(start), wb 00 2f(endc)) -> Off-set adj.
wb 00 ff -> End white balance auto adj.
(2) Adjustment Map
Applied Model : ALL MODELS
Adj.
item
CoolR Gainjg00C0TBD
G Gainjh00C0TBD
B Gainji00C0TBD
R CutTBD
G CutTBD
B CutTBD
Medium R Gainja00C0TBD
G Gainjb00C0TBD
B Gainjc00C0TBD
R CutTBD
G CutTBD
B CutTBD
WarmR Gainjd00C0TBD
G Gainje00C0TBD
B Gainjf00C0TBD
R CutTBD
G CutTBD
Command
(lower caseASCII)
CMD1CMD2MINMAX
Data Range
(Hex.)
Default
(Decimal)
- LEN: Number of Data Byte to be sent
- CMD : Command
- VAL : FOS Data value
- CS : Checksum of sent data
- A : Acknowledge
(Ex) [Send: JA_00_DD] / [Ack: A_00_okDDX]
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMDD ATAID
wb0000Begin White Balance adj.
wb0010Gain adj.(internal white pattern)
wb001fGain adj. completed
wb0020Offset adj.(internal white pattern)
wb002fOffset adj. completed
wb00ffEnd White Balance adj.
(internal pattern disappears )
Only for training and service purposes
Explanation
5.5.5. Adjustment method
5.5.5.1. Auto WB calibration
(1) Set TV in adj. mode using POWER ONNY key
(2) Zero calibrate probe then place it on the center of the
Display
(3) Connect Cable (RS-232C to USB)
(4) Select mode in adj. Program and begin adj.
(5) When adj. is complete (OK Sign), check adj. status pre
mode(Warm, Medium, Cool)
(6) Remove probe and RS-232C to USB cable to complete adj.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.5.5.2. Manual adj. method
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C -> 7. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 216 Gray internal pattern will be
displayed)
(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
** R-fix adjustment
Adjust modes (Cool), Fix the R gain to 210 (default data) and
change the others (G/B Gain ).
- Adjust the R gain more than 210 ( If G gain or B gain is less
than 0 , R gain can adjust more than 210 ) and change the
others ( G/B Gain ).
- Adjust two modes (Medium / Warm), Fix the one of R/G/B
gain to 192 (default data) and decrease the others.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 7.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
▪ Adj. condition and cautionary items
(1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to isolate
adj. area into dark surrounding.
(2) Probe location
- LCD : Color Analyzer (CA-210) probe should be within
10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
5.5.6. Reference (White Balance Adj. coordinate and
color temperature)
▪ Luminance: 206 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode
Cool0.2710.27013,000K0.0000
Medium0.2830.2899,300K0.0000
Warm0.3130.3296,500K0.0000
Coordinate
XY
Temp△uv
5.5.7. EDGE & IOL LED White balance table
▪ Edge & ALEF LED module change color coordinate because
of aging time
▪ apply under the color coordinate table, for compensated
aging time
▪ Luminance: 204 Gray, 80IRE
** Except Gumi winter season(Jan~Feb) and except for winter
season (Mar ~ Dec) & Global are same as the table below
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
Aging time
(Min)
10-2282 289 297308324348
23-5281 287 296306323346
36-9279 284 294303321343
410-19277 280 292299319339
520-35275 277 290296317336
636-49274 274 289293316333
750-79273 272 288291315331
880-119272 271 287290314330
9Over 120271 270 286289313329
CoolMediumWarm
XYXYXY
271270286289313329
* Use only AUO, INX, Sharp, CSOT, BOE
(Cool temp Spec is 13000K)
coolmedwarm
xyxyxy
spec271270286289313329
target278280293299320339
5.6. Local Dimming Function Check
(Step 1) Turn on TV
(Step 2) At the Local Dimming mode, module Edge Backlight
moving right to left
Back light of IOP module moving
(Step 3) confirm the Local Dimming mode
(Step 4) Press “exit” Key
▪ Standard color coordinate and temperature using CA-210
- Check that Power Cord is fully inserted to the SET. (If
loose, re-insert)
(2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V
arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
6.2. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
8. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring
(5) Updating Completed, The TV will restart automatically
7. AUDIO output check
NoItemMinTypMaxUnitRemark
1Audio practical
max Output, L/R
(Distortion=10%
max Output)
2
Speaker
(8Ω Impedance)
*Measurement condition:
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
10.0
12.0
8.10
10.8WVrms
1012WEQ On
EQ Off
AVL Off
Clear Voice Off
AVL On
Clear Voice On
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PCMCI
K2L / K2Lp
PCMCI
2015-01-10
9
Page 42
+3.5V_ST
L2306
C2324
10uF
10V
C2366
0.1uF
16V
+1.5V DDR
OPT
10K
C2335
R2322
0.1uF
16V
C2338
0.1uF
16V
[EP]FIN
PVIN_1
1
PVIN_2
2
PGND_1
3
PGND_2
4
Vout=0.8*(1+R1/R2)
BOOT14PGD15EN16AVIN
13
THERMAL
17
EAN62870501
IC2303
BD9A300MUV
3A
5
6
7
FB
ITH
AGND8MODE
3A
SW_3
12
SW_2
11
SW_1
10
SS
9
R2323
8.2K
1/16W1%
C2339
0.01uF
50V
+3.5V_ST
C2342
2700pF50V
POWER_ON/OFF2_3
NR5040T2R2N
L2309
2.2uH
C2348
10uF
10V
C2350
10uF
10V
330K
330K
R2349
R2326
C2354
10uF
10V
OPT
C2361
10uF
10V
C2326
10uF
10V
C2328
10uF
10V
R1
R2
+1.5V_DDR
1%
1/1 6W
1%
1/1 6W
Power_DET
+13V
OPT
6.3V
2.5V
C2365
150uF
ZD2302
16K
R23 28
18K
R23 29
PD_+12V
R2331
14K
1%
PD_+12V
R2332
5.1K
1%
+3.5V_ST
PD_+3.5V
R2333
0
5%
R2341
OPT
NON_OLED
0
NON_OLED
R2335
100K
PD_RESET_IC_APX803-MAIN
IC2304
APX803L
VCC
3
EAN61829903
C2356
0.1uF
GND
16V
POWER_DET_1
RESET
2
1
PD_RESET_IC_7529M2-SUB
VCC
IC2304-*1
KIC7529M2
3
EAN63491301
+3.5V_ST
R2336
10K
OPT
POWER_DET
PD_RESET_IC
C2358
0.1uF
OUT
16V
2
1
GND
not to RESET
at 8kV ESD
+3.3V - eMMC
+3.3V_NORMAL
3.3V_EMMC
L2304
PZ1608U121-2R0TF
C2308
0.1uF
16V
+1.8V - K2L, eMMC
& Vx1 pull-up
+3.3V_NORMAL
POWER_ON/OFF2_2
+5V_NORMAL
C2310
10uF
10V
Vout=0.6*(1+R1/R2)=1.8V
+3.3V_NORMAL
+3.3V_NORMAL
R1
R2304
1.2K
1%
R2305
R2
R2306
7.5K
1%
2.7K
1%
C2301
10uF
5V
10V
ZD2300
OPT
C2300
1500pF
50V
1/1 6W
C2302
10uF
10V
OPT
R2311
20K
C2303
10uF
10V
+1.8V
DVDD18_EMMC
L2305
PZ1608U121-2R0TF
TJ2132GDP
POK
EN
IN
L2301
UBW2012-121F
C2305
10uF
25V
C2307
0.1uF
16V
IC2301
1
2
3
2A
4
EAN63492001
9
THERMAL
C2306
0.1uF
50V
GND
C2309
10uF
10V
C2311
1uF
10V
C2304
10uF
10V
C2323
10uF
10V
R2307
10K
L2300
4.7uH
BIAS
+13V
Vout=0.8*(1+R1/R2)
C2312
10uF
10V
[EP]GND
8
GND
7
FB
6
OUT
5
SS
C2359
2700pF
50V
MP1471AGJ-C667
1
SW
2
IN
3
C2327
10uF
10V
IC2302
C2333
0.01uF
25V
OPT
+3.3V_NORMAL
33
R2310
DEBUG_LED
LD2300
DEBUG_LED
EAV60793101
R2315
5.6K
1/16W
5%
DEBUG_LED
+1.8V
R2308
R2
10K
1%
R1
20K
1%
R2309
C2341
10uF
10V
2.5V
ZD2304
C2313
1uF
25V
R2347
22
5%
BST
6
EN
5
4
R2342
10K
FB
1%
75K
R2348
1/16W
POWER_ON/OFF2_1
C2331
0.1uF
16V
OPT
+1.0V CORE
VID_CORE Low : 0.970V
VID_CORE High : 1.0V
D1V0
2.5V
ZD2303
C2330 10uF 10V
C2332 10uF 10V
C2325 10uF 10V
C2336 10uF 10V
R2319
R1
R2300
6.8K
1%
R2301
22K
1%
R2302
0
5%
+3.3V_NORMAL
R2303
10K
VID_CPU
C2345
0.1uF
OPT
16V
PGOOD_1
LP#
MODE
NC
R2321
CMLB065T-1R0MS
L2307
1uH
C2340 10uF 10V
C2337 10uF 10V
0
OPT
GSNS
R2320
3.3
OPT
1/8W
C2343
470pF
50V
C2344
5%
0.1uF
4.7
25V
BST
5%
SW_1
SW_2
SW_3
SW_4
+1.05V_CPU_GPU
VID_CPU High : 1.03V
VID_CPU Low : 1.00V
POWER_ON/OFF2_2
R2
R2313
0 5%
G
2K
R23 25
180 K
R23 34
OPT
16V
1%
1%
D
FET_TOSHIBA
Q2302
T2N7002AK
S
G
C2314
0.1uF
C2315
10V
C2316
D
S
R2343
1uF
4700pF50V
FET_KEC
2N7002KA
Q2302-*1
10K
POWER_ON/OFF2_2
C2346
0.1uF
16V
1K
R2327
[EP]GND
1
THERMAL
2
3
4
TPS51362RVER
5
6
7
8
9
10
PGND_511PGND_412PGND_313PGND_214PGND_1
VREF27RA28EN
29
IC2305
REFIN2
REFIN
24
25
26
GSNS
23
VSNS
22
SLEW
21
TRIP
20
GND
19
V5
18
VIN_1
17
VIN_2
16
VIN_3
15
Vout=2*R2/(R1+R2)=1.054V
PZ1608U121-2R0TF
VREG5
PGOOD
IC2300
RT7231GQW
EN
1
FB
2
3
SS
4
5
11
THERMAL
10
9
8
7
6
[EP]PGND
VIN_2
VIN_1
BOOT
SW_2
SW_1
C2317
0.1uF
25V
Vout=0.765*(1+R1/R2)
1%
47K
R1
R23 30
1/1 6W
1%
47K
R23 37
1/1 6W
R2
5%
0
1/1 6W
R23 38
C2347
0.01uF
25V
+13V
L2302
C2318
10uF
25V
L2303
Epoxy-SDES053T-1R0MS
1%
430 K
R23 14
5%
330 K
R23 17
T2N7002AK
Q2300
FET_TOSHIBA
D
G
S
GSNS
debugging point
R2339
0
+5V_NORMAL
C2351
C2349
10uF
10uF
25V
25V
C2319
0.1uF
16V
OPT
1.0uH
C2320
10uF
10V
R2318
C2352
2.2uF
10V
C2321
10uF
10V
FET_KEC
2N7002KA
Q2300-*1
05%
D1V0
L2308
D
S
R2324
10K
G
+13V
CPU_1V0
C2322
10uF
10V
VID_CORE
C2329
10uF
10V
2.5V
ZD2301
C2353
50V
+3.5V_ST
R1
240K
R2340
47K
R2344
1/16W
10K
R2346
R2
C2355
1%
0.47uF
25V
1%
5pF
1/16W
1%
1/16W
R2345
3.6K
K2L Power SEQUENCE
POWER_ON/OFF1(5V)
POWER_ON/OFF2_1(3.3V)
POWER_ON/OFF2_2(1.05V / 1.0V / 1.8V)
POWER_ON/OFF2_3(1.5V)
POWER_ON/OFF2_4
+3.5V_ST
IC2306
TPS56428DDAR
EN
1
VFB
2
VREG5
3
PG
4
SOC_RESET
4A
9
THERMAL
8
7
6
5
[EP]GND
VIN
VBST
VLS6045EXT-4R7M(125)
C2357
L2312
0.1uF
SW
GND
4.7uH
50V
10V
10uF
C2367
Vout=0.6*(1+R1/R2)
C2360
10uF
25V
C2368
10uF
10V
BLM18PG121SN1D
L2313
C2363
0.1uF
25V
C2370
10uF
10V
C2369
10uF
10V
+13V
+3.5V_ST
5V
ZD2305
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
K2H
PWR_1
2015-01-10
07
Page 43
+3.5V_ST
R2502
1
10K
R2500
RL_ON
+3.3V_NORMAL
PSU_MODE_SELECT_NON
INV_CTL
MODE_SELECT
L/D_VSYNC
JP-BLOCK-1POWER_13V
+13V
D13V
10K
R2501
GND
1K
JP2505
2
Q25002N3906S-RTK
3
PSU_MODE_SELECT_NON
R2503100
D-GND
P/ON
D-GND
A-GND
INVON
VSINC
D13
A13
GND
P2502
GND
SMAW200-H18S5
PSU_18P
D-GND
PDIM2
D13
D13
A13
A-GND
PDIM1
SCLK
SIN
P2501
SMAW200-H12S5K(BK)(LTR)
PSU_12P
’15 UHD 12.5V sole out power
’Net name +12V means 12.5V power output
MLB-201209-0120P-N2
MLB-201209-0120P-N2
L2503
A13V
R2512 100
R2513 100R2514 100
C25 05
0.1 uF
25V
+13V
L2502
A13V
C2511
10uF
25V
55INCH_BOE_M+_MODULE
R2507 100
55/60/65INCH_LGD_M+_MODULE
R2506
0
LGD_M+_MODULE
R2508 100
BOE_M+_MODULE
R2509 100
C2508
10uF
25V
PWM_DIM2
PWM_TCON_OUT
PWM_DIM
L/D_CLK
L/D_DO
+13V
C2512
10uF
25V
+13V
PANEL_CTL
PANEL_POWER
Q2302 Change: Diodes --> NXP, 131118
Q2504
C2522
0.1uF
50V
SSM3J332R
D
S
G
L2504
UBW2012-121F
OPT
ADUC 20S 02 010L
R2518
10K
10K
R2517
VA2500
C2521
4.7uF
10V
OPT
C2520
0.1uF
50V
R2519
R2520
150K
B
36K
C
Q2503
MMBT3904(NXP)
E
R2521
3.3K
LVDS_DISCHARGE
C2523
10uF
25V
PANEL_VCC
C2524
10uF
25V
+5.0V normal & USB
R1
POWER_ON/OFF1
R2504
C2516
12K
150pF
1%
R2505
1.6K
1%
R2510
560
1%
50V
R2
C2500
OPT
16V
0.1uF
C2501
10V
C2502
R2511
10K
1uF
4700pF50V
PZ1608U121-2R0TF
VREG5
PGOOD
IC2500
RT7231GQW
EN
1
FB
2
3
SS
4
5
11
THERMAL
10
9
8
7
6
[EP]PGND
VIN_2
VIN_1
BOOT
SW_2
SW_1
C2503
0.1uF
25V
Vout=0.765*(1+R1/R2)
L2500
+13V
C2504
10uF
25V
SPM6530T-3R3M
L2501
3.3uH
C2506
0.1uF
16V
OPT
C2509
10uF
10V
C2513
10uF
10V
+5V_NORMAL
C2514
10uF
10V
C2515
10uF
10V
5V
ZD2500
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
K2H
PWR_2
2015-01-10
08
Page 44
Renesas MICOM
For Debug
+3.5V_ST
MODE_SELECT(PWM1)
MICOM_MODE_SELECT
R3000
10K
MODE_SELECT
C3005
2.2uF
10V
MICOM_MODE_SELECT
MICOM_DEBUG
P3000
12507WS-04L
5
1
2
3
4
Don’t remove R3016,
not making float P40
R3016 1K
R3014 10K
MICOM_DEBUG
K2L Power SEQUENCE
POWER_ON/OFF1(5V)
POWER_ON/OFF2_1(3.3V)
POWER_ON/OFF2_2(1.05V / 1.0V / 1.8V)
POWER_ON/OFF2_3(1.5V)
POWER_ON/OFF2_4
SOC_RESET
MICOM MODEL OPTION
+3.5V_ST
R3010 10K
R3006 10K
R3008 10K
R3004 10K
MICOM_DEBUG
MICOM_RESET
MODEL1_OPT_0(AM0)
MODEL1_OPT_1(AM1)
MODEL1_OPT_2(AM2)
MODEL1_OPT_3(AM3)
MICOM MODEL OPTION
MODEL_OPT_0
MODEL_OPT_1
MODEL_OPT_2
MODEL_OPT_3
(FHD)
MODEL_OPT_3
(UHD)
0.72V2.27V
NON LOGO / LCDLOGO / OLED
TV
FHD
M16
M16
1.53V
LOGO / LCD
50V
50V
18pF
15pF
C3002
C3003
X3000
+3.5V_ST
WIFI_EN
10K
R3030
C3004
0.1uF
270K
R3031
16V
P120/ANI19
37
P140/PCLBUZ0/INTP6
36
P00/TI00/TXD1
35
P01/TO00/RXD1
34
P130
33
P20/ANI0/AVREFP
32
P21/ANI1/AVREFM
31
P22/ANI2
30
P23/ANI3
29
P24/ANI4
28
P25/ANI5
27
P26/ANI6
26
P27/ANI7
25
24
MICOM_RESET_SW
JTP-1127WEM
OPT
43
SW3000
12
RL_ON
INSTANT_BOOT
POWER_ON/OFF2_4
POWER_ON/OFF2_1
KEY2
KEY1
MODEL1_OPT_0(AM0)
MODEL1_OPT_1(AM1)
MODEL1_OPT_2(AM2)
MODEL1_OPT_3(AM3)
SIDE_HP_MUTE
DDR_CS_ON_OFF
RETENTION_DISABLE
POWER_ON/OFF2_4
I2C_SCL1
I2C_SDA1
3D&L_DIM_EN
INV_CTL
MODE_SELECT(PWM1)
HDMI_CEC
POWER_ON/OFF2_2
POWER_ON/OFF2_3
EYE_SDA
EYE_SCL
WOL/WIFI_POWER_ON
+3.5V_ST
32.768KHz
T_CON_SYS_POWER_OFF
AR3001
33
1/16W
T_CON_SYS_POWER_OFF
P60/SCLA0
+3.5V_ST
C3000
0.1uF
R3039
10K
MICOM_LCD
P61/SDAA0
P62
P63
P31/TI03/TO03/INTP4
IR
R3038
100
P75/KR5/INTP9/SCK01/SCL01
P74/KR4/INTP8/SI01/SDA01
P73/KR3/SO01
P72/KR2/SO21
P71/KR1/SI21/SDA21
P70/KR0/SCK21/SCL21
P30/INTP3/RTC1HZ/SCK11/SCL11
AR3000
3.3K
AR3002
3.3K
OPT
MICOM_EYE_Q
+3.3V_NORMAL
1/16W
5%
1
2
3
4
5
6
7
8
9
10
11
12
GND
C3001 0.47uF
REGC
VSS
VDD
46
47
48
R5F100GEAFB#30
13
14
15
RETENTION_DISABLE
POWER_DET_1
P137/INTP0
P122/X2/EXCLK
P121/X1
43
44
45
IC3000
16
17
18
MICOM_RESET
R3028
4.7M
OPT
P123/XT1
42
19
MICOM_DEBUG
R3029 33
P41/TI07/TO07
P40/TOOL0
RESET
P124/XT2/EXCLKS
39
40
41
20
21
22
LED_R
38
23
P146
P147/ANI18
3.0V
NON LOGO / OLED
BOX
RTK
TV
UHD
A5LR
H15
BOX
8K
M2
P17/TI02/TO02
P51/INTP2/SO11
P50/INTP1/SI11/SDA11
P16/TI01/TO01/INTP5
P13/TXD2/SO20
P14/RXD2/SI20/SDA20
P12/SO00/TXD0/TOOLTXD
P15/PCLBUZ1/SCK20/SCL20
P11/SI00/RXD0/TOOLRXD/SDA00
P10/SCK00/SCL00
OPT
OPT
R3011 10K
OPT
OPT
R3007 10K
R3009 10K
R3005 10K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
POWER_DET
WOL/ETH_POWER_ON
WOL_CTL
POWER_ON/OFF1
check WOL power K2H
LED_R
WOL_CTL
SOC_RESET
PANEL_CTL
SOC_TX
SOC_RX
EDID_WP
AMP_MUTE
CEC_REMOTE
K2L / K2Lp
MICOM
BAT54_TSC
D3000
For CEC
R3033
27K
+3.5V_ST
G
S
D
EBK63231501
SSM3K56FS
Q3001
2015-06-13
30
R3034
120K
HDMI_CEC
Page 45
MICOM MODEL OPTION
MODEL_OPT_0(AM0)
MODEL_OPT_1(AM1)
MODEL_OPT_2(AM2)
MODEL_OPT_3(AM3)
(FHD)
MODEL_OPT_3(AM3)
(UHD)
0.72V
(2.7K)
NON LOGO / LCD
FHD
M16
M16
1.53V
(8.2K)(20K)(75K)
LOGO / LCD
BOX_NON_EPITV_NON_EPI
2.27V
NON LOGO / OLEDLOGO / OLED
TV_EPIBOX_NON_EPI
UHD
A5LRM2
RTK
H15
3.0V
8K
MODEL_OPT_0(AM0)
MODEL_OPT_1(AM1)
MODEL_OPT_2(AM2)
MODEL_OPT_3(AM3)
(FHD)
MODEL_OPT_3(AM3)
(UHD)
0.72V
(2.7K)
MICOM_NON_LOGO/LCD
R3005-*1 2.7K
MICOM_TV_NON_EPI
R3007-*1 2.7K
MICOM_FHD
R3009-*1 2.7K
MICOM_M16
R3011-*1 2.7K
1.53V
(8.2K)
MICOM_LOGO/LCD
R3005-*2 8.2K
MICOM_RTK
R3011-*2 8.2K
2.27V
(20K)
MICOM_NON_LOGO/OLED
R3005-*3 20K
MICOM_TV_EPI
R3007-*3 20K
MICOM_UHD
R3009-*3 20K
MICOM_H15/A5LR
R3011-*3 20K
3.0V
(75K)
MICOM_LOGO/OLED
R3005-*4 75K
MICOM_8K
R3009-*4 75K
MICOM_M2
R3011-*4 75K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
K2H
MODEL OPTION
2015-01-10
30
Page 46
SHIELD
SHIELD
20
YKF45-7058V
JK3301
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
YKF45-7058V
JK3300
VA3300-*1
ADMC 5M 02 200L
EAF61530101
ESD_HDMI_AMOTECH_2
19
18
+5V_POWER
17
DDC/CEC_GND
16
SDA
15
SCL
14
NC
13
CEC
12
CLK-
11
CLK_SHIELD
10
CLK+
9
DATA0-
8
DATA0_SHIELD
7
DATA0+
6
DATA1-
5
DATA1_SHIELD
4
DATA1+
3
DATA2-
2
DATA2_SHIELD
1
DATA2+
VA3301-*1
ADUC 20S 02 010L
ESD_HDMI_AMOTECH_2
EAF61530301
+5V_POWER
DDC/CEC_GND
SDA
SCL
NC
CEC
CLK-
CLK_SHIELD
CLK+
DATA0-
DATA0_SHIELD
DATA0+
DATA1-
DATA1_SHIELD
DATA1+
DATA2-
DATA2_SHIELD
DATA2+
5V_HDMI_3
HPD
5V_HDMI_2
HPD
CEC_REMOTE
VA3300
ESD_HDMI
EAF61530102
CEC_REMOTE
VA3301
ESD_HDMI
EAF61530301
EAF61630102
0TRKE80046A
BJT_KEC_1
R3300
100K
VA3302
ESD_HDMI
EAF61630102
VA3302-*1
ADUC 20S 02 010L
ESD_HDMI_AMOTECH_2
VA3306-*1
ADUC 20S 02 010L
ESD_HDMI_AMOTECH_2
EAF61530301
VA3303-*1
ADMC 5M 02 200L
EAF61530101
ESD_HDMI_AMOTECH_2
R3301
100K
VA3303
ESD_HDMI
EAF61530102
AR3303
33
1/16W
VA3304
VA3305
ESD_HDMI
ESD_HDMI
EAF61630102
VA3304-*1
ADUC 20S 02 010L
ESD_HDMI_AMOTECH_2
EAF61530301
R3302
1K
C
Q3300
2N3904S
E
C
B
Q3300-*1
MMBT3904(NXP)
BJT_NXP_2
E
VA3306
ESD_HDMI
EAF61630102
C
Q3301
2N3904S
BJT_KEC_1
E
DDC_SCL_2
EAF61530301
ESD_HDMI_AMOTECH_2
ADUC 20S 02 010L
EAF61630102
VA3314
ESD_HDMI
EAF61530102
AR3310
5.1
1/16W
AR3311
5.1
1/16W
R3303
1K
B
AR3304
33
1/16W
VA3307
ESD_HDMI
EAF61630102
VA3307-*1
ADUC 20S 02 010L
ESD_HDMI_AMOTECH_2
EAF61530301
AR3306
5.1
1/16W
AR3307
5.1
1/16W
R3304
1K
R3309
1K
B
C
B
Q3301-*1
MMBT3904(NXP)
BJT_NXP_2
E
DDC_SDA_2
VA3305-*1
VA3314-*1
ADMC 5M 02 200L
EAF61530101
ESD_HDMI_AMOTECH_2
R3315
R3307
4.7K
HDMI_EXT_EDID_NON
HDMI_EXT_EDID
R3312
4.7K
CK-_HDMI3
CK+_HDMI3
D0-_HDMI3
D0+_HDMI3
D1-_HDMI3
D1+_HDMI3
D2-_HDMI3
D2+_HDMI3
1.8K
HDMI_HPD_3
HDMI3 with EEPROM
R3313
1.8K
R3311
4.7K
HDMI_HPD_2
+5V_NORMAL
10K
39K
R3321
C3303
R3323
0.01uF
50V
R3332
ARC
100
R3334
180
1%
5%
Close to SOC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
HDMI2 with ARC
5V_DET_HDMI_3
R3317
3.3K
HDMI_EXT_EDID
R3337
0
0
R3338
HDMI_EXT_EDID
HDMI_EXT_EDID_NON
R3336
0
0
R3335
HDMI_EXT_EDID_NON
5V_DET_HDMI_2
R3314
HDMI_ARC
HDMI_ARC
3.3K
DDC_BUFFER_SDA
DDC_BUFFER_SCL
DDC_SDA_3
DDC_SCL_3
BODY_SHIELD
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
5501-56219
JK3302-*1
HDMI_JACK_CNPLUS
DDC_BUFFER_SDA
HOT_PLUG_DETECT
VDD[+5V]
DDC/CEC_GND
SDA
SCL
RESERVED
CEC
TMDS_CLK-
TMDS_CLK_SHIELD
TMDS_CLK+
TMDS_DATA0-
TMDS_DATA0_SHIELD
TMDS_DATA0+
TMDS_DATA1-
TMDS_DATA1_SHIELD
TMDS_DATA1+
TMDS_DATA2-
TMDS_DATA2_SHIELD
TMDS_DATA2+
+5V_NORMAL
5V_HDMI_3
HDMI_EXT_EDID
HDMI_EXT_EDID
DDC_BUFFER_SCL
FROM HDMI PORT
5V_HDMI_1
R3326
R3308
4.7K
1.8K
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
HDMI_HPD_CBUS_1
BODY_SHIELD
HDMI_JACK_DEV
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
05008WR_H19C
JK3302
VA3309-*1
ADUC 20S 02 010L
ESD_HDMI_AMOTECH_2
EAF61530301
HOT_PLUG_DETECT
VDD[+5V]
DDC/CEC_GND
SDA
SCL
RESERVED
CEC
TMDS_CLK-
TMDS_CLK_SHIELD
TMDS_CLK+
TMDS_DATA0-
TMDS_DATA0_SHIELD
TMDS_DATA0+
TMDS_DATA1-
TMDS_DATA1_SHIELD
TMDS_DATA1+
TMDS_DATA2-
TMDS_DATA2_SHIELD
TMDS_DATA2+
VA3309
ESD_HDMI
EAF61630102
VA3310-*1
ADUC 20S 02 010L
ESD_HDMI_AMOTECH_2
EAF61530301
CEC_REMOTE
VA3311-*1
ADMC 5M 02 200L
EAF61530101
ESD_HDMI_AMOTECH_2
0TRKE80046A
R3320
100K
OPT
VA3311
EAF61530102
ESD_HDMI
VA3310
VA3313
ESD_HDMI
ESD_HDMI
EAF61630102
EAF61630102
C
Q3302
2N3904S
BJT_KEC_1
E
AR3305
33
1/16W
VA3313-*1
ADUC 20S 02 010L
ESD_HDMI_AMOTECH_2
EAF61530301
R3305
1K
AR3308
5.1
1/16W
AR3309
5.1
1/16W
B
R3306
1K
C
E
B
Q3302-*1
MMBT3904(NXP)
BJT_NXP_2
DDC_SDA_1
DDC_SCL_1
EDID external EEPROM & DDC BUFFER for HDMI3
A2CA1
1/16W
47K
HDMI_EXT_EDID
MMBD6100
D3310
DEV_PCA9517_EXTEDID
IC3302
PCA9517DGKR
VCCA
1
SCLA
2
SDAA
3
GND
4
VCCB
8
SCLB
7
SDAB
6
EN
5
DDC_SCL_3_1
DDC_SDA_3_1
DDC_BUFFER_SW
DDC_SCL_3_1
DDC_SDA_3_1
C3304
0.1uF
16V
AR3312
5V_DET_HDMI_1
R3331
HDMI_EXT_EDID
HDMI_EXT_EDID
R3339
0
HDMI_EXT_EDID
R3340
0
3.3K
AR3301-*1
1/16W
DDC_SCL_3
DDC_SDA_3
HDMI_PULLUP_KEC_2
10K
HDMI_EXT_EDID_NON
DDC_SCL_3
DDC_SDA_3
D3308-*1
KDS184
0DD184009AA
+5V_NORMAL
MMB D610 0
D33 08
HDMI_PULLUP_1
AR3301
1/16W
47K
A2CA1
5V_HDMI_3
A2
C
A1
EDID_WP
DDC_BUFFER_SW
C3302
0.1uF
16V
B
HDMI_EXT_EDID
R3330
4.7K
E
C
Q3303
2N3904S
HDMI_EXT_EDID
VCC
WP
SCL
SDA
HDMI_EXT_EDID
IC3301
BR24G02FJ-3GTE2
8
7
6
5
A0
1
A1
2
A2
3
GND
4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HDMI
DDC pull-up
5V_HDMI_2
KDS184
C3300
0.1uF
A2CA1
D3305-*1
0DD184009AA
HDMI_PULLUP_KEC_2
16V
AR3300
47K
1/16W
+5V_NORMAL
A1
A2
MMBD6100
D3305
HDMI_PULLUP_1
C
DDC_SDA_2
DDC_SCL_2
+5V_NORMAL
5V_HDMI_1
A1
A2
C
C3301
0.1uF
16V
MMBD6100
D3309
HDMI_PULLUP_1
AR3 302
47K
1/1 6W
DDC_SDA_1
DDC_SCL_1
A2CA1
D3309-*1
KDS184
0DD184009AA
HDMI_PULLUP_KEC_2
K2L
HDMI
2015-01-10
33
Page 47
SPDIF OUT
SPDIF_OUT
+3.3V_NORMAL
VA3807
C3800
5.5V
47pF
50V
OPT
C3818
0.1uF
PLACE CLOSE TO JACK
R3821
C3819
0
0
FOR EMI
R3808751/4W
R3811
R3809
C3807
1000pF
50V
OPT
C3808
1000pF
50V
OPT
1%
C3812
27pF
50V
OPT
C3813
27pF
50V
OPT
R3812
6.8K 1%
R3813
6.8K 1%
390pF
50V
OPT
C3811
47pF
50V
AV/COMPONENT REAR
VINPUT
OPTIC_SOLTEAM
JK3800-*1
JST1223-001
GND
VCC
1
2
3
Fiber Optic
4
FIX_POLE
JK3802
PPJ245-31
[GN/YL]E-LUG
6A
5A
[GN/YL]O-SPRING
4A
[GN/YL]CONTACT
5B
[BL]O-SPRING
7C
[RD1]E-LUG-S
5C
[RD1]O-SPRING
4C
[RD1]CONTACT
5D
[WH]O-SPRING
4E
[RD2]CONTACT
5E
[RD2]O-SPRING
6E
[RD2]E-LUG
VA3804
5.5V
VA3805
5.5V
VA3801
5.6V
SIGN380008
R3800
470K
VA3802
5.6V
VA3806
5.5V
R3801
Place JACK Side
1608 sizs For EMI
R3832
C3803
100pF
50V
OPT
C3804
100pF
50V
OPT
0
C3805
C3806
27pF
100pF
50V
50V
OPT
OPT
1608 sizs For EMI
1608 sizs For EMI
C3810
27pF
50V
OPT
1608 sizs For EMI
C3809
27pF
50V
OPT
C3822
150pF
OPT
+3.3V_NORMAL
R3807
10K
R3803
1K
VA3803
5.6V
470K
+3.3V_NORMAL
R3810
10K
VA3800
5.6V
AV1_CVBS_DET
R3802
1K
1608 sizs For EMI
R3805
0
C3801
560pF
50V
OPT
1608 sizs For EMI
R3806
0
C3802
560pF
50V
OPT
COMP1_DET
OPTIC_FOXCONN
JK3800
2F01TC1-CLM97-4F
GND
1
VCC
2
VIN
3
Fiber Optic
16V
4
SHIELD
R3816
75
R3817
75
PLACE CLOSE TO SOC
0
OPT
C3820
390pF
R3822751/4W
50V
OPT
OPT
C3815
10pF
50V
1%
C3814
10pF
50V
1%
R3814
10K
1%
R3815
10K
1%
DTV/MNT_V_OUT
1%
COMP1_Y/CVBS
COMP1_Pb
COMP1_Pr
COMP1/AV1/DVI_L_IN
COMP1/AV1/DVI_R_IN
HP_ROUT_AMP
HP_LOUT_AMP
HP_DET
HP OUT
RS232C
L3800
BLM18PG121SN1D
HP_OUT
BLM18PG121SN1D
DOUT1
L3801
HP_OUT
RIN1
HP_OUT
C3816
0.22uF
25V
HP_OUT
C3817
0.22uF
25V
R3818
HP_AMP
R3819 150
HP_AMP
R3804 1K
HP_OUT
R3818-*1
22uF
16V
HP_AMP_NON
150
R3819-*1
22uF
16V
HP_AMP_NON
+3.3V_NORMAL
R3820
10K
HP_OUT
VA3808
5.6V
HP_OUT
E_SPRING
R_SPRING
T_SPRING
B_TERMINAL2
T_TERMINAL2
JACK_HP_OUT/RS232C
EAG60841811
JK3801
PEJ034-01
3
4
5
7B
6B
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
UF71/7500
JACK_COMMON_H
2014-07-24
38
Page 48
WIFI POWER ENABLE CONTROL
+3.5V_ST
IC4101
AO-R123C7G-LG
R4103
330
GND
G
DEBUG_IR_PROTO
VS
V
OUT
O
DEBUG_IR_PROTO
1/16W
5%
IR
R4105471/10W
5%
DEBUG_IR_PROTO
P4100
12507WR-H21L2B(BK)
1
2
3
4
5
6
7
8
12
13
14
15
16
17
18
19
20
21
22
GND
VCC
USB D-
USB D+
GND
WL_HOST_WAKE
GND
BT_REG_ON
GND
SDA
SCL
GND
IR
LED
GND
3.5v_ST
KEY2
KEY1
GND
D4100-*1
WIFI_DIODE_SEMTECH
EAH61515101
1/16W
0
R4119
WIFI_11N_ONLY
JP-BLOCK-IR
IR
GND
D4100
WIFI_DIODE_TOSHIBA
EAH62735601
R4118
0
1/16W
OPT
5%
JP4101
VA4110
ESD_READY
C4108
0.1uF
NON_EASY_TV
C4107
5pF
50V
OPT
+3.5V_ST
R4121
100
ESD_READY
ZD4110
5V
3D_SYNC
C4105
100pF
50V
OPT
C4102
0.1uF
C4106
1000pF
50V
OPT
R4110
16V
ESD_READY
ZD4111
5V
C4110
10uF
10V
NON_EASY_TV
NON_EASY_TV
NON_EASY_TV
C4109
5pF
50V
OPT
NON_EASY_TV
NON_EASY_TV
10K
5%
R4113
2.2
R4114
2.2
R4112
510
R4111
510
AR4101
1/16W
R4109
1.8K
100
R4117
R4107
0
2K
+3.5V_WIFI
C4113
10uF
10V
NON_EASY_TV
C4104
0.1uF
NON_EASY_TV
OPT
C4111
0.1uF
OPT
WIFI_DM
WIFI_DP
WOL/WIFI_POWER_ON
M_RFModule_RESET
EYE_SDA
EYE_SCL
IR
LED_R
+3.5V_ST
MICOM_5KEY_JOG_TYPE
C4112
0.1uF
OPT
3D_SYNC
R4104
100
R4106
100
R4115
10K
1%
+3.5V_ST
R4116
10K
1%
KEY2
KEY1
+3.5V_ST
WIFI_EN
C4100
0.1uF
R4101 33
R4100
10K
OPT
IC4100
TAEJIN TECHNOLOGY CO., LTD.
IN
1
EAN64148901
GND
2
EN
3
Current Limit : 2.0A
OUT
6
ILIMIT
5
FLAG
4
6.8K
R4120
+3.5V_WIFI
1/16W
1%
R4102
3.3K
Discharge Resistor
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MICOM_KEY_ONE_KEY
UF71/7500
IR/KEY
2014-05-19
12
Page 49
10K(2.63V) --> 4.7K(2.97V)
value change
/USB_OCD1
USB_CTL1
R4301
10K
USB_REAR
+3.3V_NORMAL
+5V_NORMAL
USB_REAR
R4303
4.7K
OCP USB2_2.0
USB_REAR
C4301
0.1uF
16V
IC4301
VIN
1
GND
2
EN
3
EAN62871401
USB_REAR
BD2242G
USB2.0 2Port
+5V_USB_1
VOUT
6
ILIM
5
OC
4
1%
14K
R4305
USB_REAR
USB_DM1
USB_DP1
+5V_USB_1
C4322
10uF
5V
10V
D4301
USB_REAR
USB_REAR_ESD_DIODE
USB_REAR
R4309 2.2
USB_REAR
R4308 2.2
C4323
10uF
10V
USB_REAR
USB1
MAX 1.0A
D4302
DF3D6.8MS
USB_REAR
JP4300
JP-BLOCK-USB
DPGND
USB-STRAIGHT
(Rear Jack)
JK4302
US-04A-VSD
USB_REAR
2
1
3
4
5
VBUSDM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
K2L
USB2.0 jack
2015-04-27
13
Page 50
+3.3V_NORMAL
USB3_RXM0
USB3_DM0
USB3_DP0
+5V_USB_2
C4400
10uF
5V
10V
ZD4400
USB_SIDE_ESD_DIODE
/USB_OCD1
C4401
10uF
10V
USB_SIDE
R4400 2.2
USB_SIDE
R4401 2.2
USB2
MAX 1.0A
D4400
DF3D6.8MS
USB_SIDE
DPGND
M4400
JP-BLOCK-USB
VBUSDM
USB_SIDE
1234
5
JK4400
USB DOWN STREAM
3AU04S-305-ZC-(LG)
value change
10K(2.63V) --> 4.7K(2.97V)
/USB_OCD3_0
USB_CTL3_0
R4402
10K
USB_SIDE
R4403
4.7K
+5V_NORMAL
USB_SIDE
C4402
0.1uF
USB_SIDE
16V
IC4400
VIN
1
GND
2
EN
3
USB_SIDE
BD2242G
+5V_USB_2
VOUT
6
ILIM
5
OC
4
1%
USB_SIDE
14K
R4404
USB3_RXP0
USB3_TXM0
USB3_TXP0
USB_CTL1
USB_DM1
USB_DP1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
043.sht
K2H
USB 2 & 326
2015.02.11
15
Page 51
Ethernet Block
EAG35781018
LANJACK_HONGLIN_SUB2
JK5000-*2
B50(512-10)F4-03A-A013-B52
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
EAG35781016
LANJACK_FREEPORT_SUB1
JK5000-*1
26TM9G-30100-02HF
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
EAG35781010
LANJACK_UDE_MAIN
JK5000
RJ45VT-01SN002
1
2
3
4
5
6
7
8
9
9
1
2
3
4
5
6
7
8
NON_EASY_TV
OPT
NON_EASY_TV
OPT
L5000
PZ1608U121-2R0TF
R5000 0
L5001
PZ1608U121-2R0TF
R5001 0
NON_EASY_TV
NON_EASY_TV
VA5000
5.5V
C5000
0.1uF
16V
NON_EASY_TV
C5001
0.01uF
50V
NON_EASY_TV
VA5001
5.5V
NON_EASY_TV
VA5002
5.5V
VA5003
5.5V
EPHY_TDP
EPHY_TDN
EPHY_RDP
EPHY_RDN
NON_EASY_TV
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
WOOFER_MUTE
I2S_AMP
SPK_L+
SPK_L-
SPK_R+
SPK_R-
MAIN_AMP
4P Box type
WAFER-ANGLE
4
3
2
1
P5800
SPK_WOOFER_NON
2014-10-17
58
Page 53
HP_ROUT
HP_ROUT_AMP
EARPHONE AMP
H/P out R/C filter
Close to Main SOC
(ready for debugging)
R6108
0
C6110
0.01uF
OPT
HP_AMP_NON
R6107
0
HP_AMP
C6100
2.2uF
10V
SIDE_HP_MUTE
HP_AMP
R6100
10K
HP_AMP
C6104
18pF
R6103
HP_AMP
+3.3V_NORMAL
43K
4.7K
R6105
HP_AMP
1%
HP_AMP
R6106
43K
1%
HP_AMP
HP_AMP
C6102
1uF
10V
C6108
10pF
50V
+INR
-INR
OUTR
GND_1
MUTE
VSS
CN
IC6100
TPA6138A2
1
HP_AMP
2
3
4
5
6
7
HP_AMP
C6103
1uF
10V
R6104
43K
1%
HP_AMP
C6109
18pF
1%
R6102
43K
HP_AMP
+3.3V_NORMAL
C6105
1uF
10V
R6101
10K
HP_AMP
C6107
0.1uF
16V
HP_AMP
HP_AMP
C6101
2.2uF
10V
HP_AMP_NON
R6110
+INL
14
-INL
13
OUTL
12
UVP
11
GND_2
10
VDD
9
CP
8
HP_AMP
C6106
10pF
50V
HP_AMP
HP_AMP
H/P out R/C filter
Close to Main SOC
(ready for debugging)
C6111
0.01uF
0
OPT
R6109
0
HP_LOUT
HP_LOUT_AMP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
K2H
2014-11-22
HP_AMP61
Page 54
Global F/E Option Name
1. TU
2. Tuner Name = TDJ’H’,TDj’M’...
3. Country Name = KR,US,BR,EU ...
Example of Option name
TU_ALL_IntDemod = All Tuner type for Internal demod
TU_M/W = apply TDSM&TDSW Type Tuner
14’ Tuner Type for Global
TDJ’H’-G101D : Half NIM for EU,AJJA
TDJ’H’-H101F : Half NIM for US, KR
TDJ’K’-T101F : Half NIM for TW
TDJ’M’-C301D,F : FULL NIM for China
TDJ’M’-B101F : Brazil NIM with Isolater Type
TDJ’M’-K101F : colombia NIM
TDJ’M’-G101D,G105D,G151D : EU Combo&Full NIM
TDJ’M’-H101F,H151F : Korea PIP tuner
TDJ’W’-A151D : AJJA T2 PIP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
K2H
TU_SYMBOL_H
2014-09-11
19
Page 56
LNB PART (DVB-S2)
OPTION ; LNB
LNB_OUT
C6900
0.1uF
LNB
C6901
33pF
Close to Tuner
Surge Protection
LNB
D6900
LNB
R6900
2.2K
1W
LNB
2A
SS2040LL-LG
C6902
0.22uF
LNB
25V
A_GND
D6901
40V
LNB
D6902
LNB
40V
C6903
0.01uF
50V
LNB
Closed to Boost Pin (#1)
LNB
C6905
10uF
25V
LNB
C6904
0.1uF
50V
A_GND
SX34
D6903
40V
C6906
10uF
25V
LNB
LNB
A_GND
C6907
10uF
25V
LNB
C6908 0.1uF
D6904
LNB
SX34
40V
LNB
VCP
LNB
IRQ
Input trace widths should be sized to conduct at least 3A
Ouput trace widths should be sized to conduct at least 2A
3A
+13V_M
Max 1.3A
14LX15
7
ADD
LNB_Tx
LNB
L6900
15uH
VIN
13
12
11
10
9
8
TONECTRL
0
R6905
GND
VREG
ISET
TCAP
0
R6908
LNB_NON_Tx
C6909
10uF
25V
LNB
A_GND
Close to VIN pin (#15)
C6910
0.1uF
50V
LNB
C6912
LNB
0.1uF
LNB
C69110.22uF
+13V_M
27K
R6901
LNB_JAPAN
R6902
10K
LNB_JAPAN
LNB
R6903
39K
1/16W
1%
R6902-*1
0
NON_JAPAN_LNB
Need Isolated GND
R6904
0
A_GND
+13V
+3.3V_NORMAL
LNB
R6909
10K
1/16W
5%
C6913
0.1uF
50V
LNB
OPT
B
C6914
4.7uF
10V
C6915
R6910
36K
0.1uF
LNB
50V
R6911
150K
LNB
EBK61012601
C
LNB
Q6900
MMBT3904(NXP)
E
LNB
LNB
Q6901
AO3435
S
G
+13V_M
D
LPH6050T-150M-R
A_GND
[EP]
GNDLX
BOOST
16
1
THERMAL
2
3
4
33
AR6900
17
IC6901
A8305SESTR
LNB
5
6
SCL
SDA
LNB
NC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
I2C_SCL2
I2C_SDA2
LNB_TX
K2H
LNB
2014-08-25
20
Page 57
+3.3V_NORMAL
[51P Vx1
output wafer]
LGD/BOE_PANEL_VX1
P7100
SP14-11592-01-51Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
C7102
C7103 0.1uF
C7104
C7105 0.1uF
C7106
C7107 0.1uF
C7108
C7109 0.1uF
C7110
C7111 0.1uF
C7112
C7113 0.1uF
C7114
C7115 0.1uF
C7116
C7117 0.1uF
R7125
0
NON_BOE MODULE
R7102 10K
R7123 10K
LGD/BOE_PANEL_VX1
0.1uF
LGD/BOE_PANEL_VX1
LGD/BOE_PANEL_VX1
0.1uF
LGD/BOE_PANEL_VX1
LGD/BOE_PANEL_VX1
0.1uF
LGD/BOE_PANEL_VX1
LGD/BOE_PANEL_VX1
0.1uF
LGD/BOE_PANEL_VX1
LGD/BOE_PANEL_VX1
0.1uF
LGD/BOE_PANEL_VX1
LGD/BOE_PANEL_VX1
0.1uF
LGD/BOE_PANEL_VX1
LGD/BOE_PANEL_VX1
0.1uF
LGD/BOE_PANEL_VX1
LGD/BOE_PANEL_VX1
0.1uF
LGD/BOE_PANEL_VX1
LOCKAn_IN
HTPDAn_IN
OPT
Non_LGD_60Hz
L7100
MLB-201209-0120P-N2
PANEL_VX1_51P_VCC
C7100
10uF
25V
PANEL_VX1_51P_VCC
TXDBP0_L
TXDBN0_L
TXDBP1_L
TXDBN1_L
TXDBP2_L
TXDBN2_L
TXDBP3_L
TXDBN3_L
TXDBP4_L
TXDBN4_L
TXDBP5_L
TXDBN5_L
TXDBP6_L
TXDBN6_L
TXDBP7_L
TXDBN7_L
*Pin31(BIT_SEL)
HIGH or NC : 10Bit
LOW : 8Bit
VBY1_LGD_M+_MODULE
R7124
R71030
LGD/INX/BOE_Module
PANEL_VCC
C7101
10uF
25V
PANEL_VX1_51P_VCC
LOCKAn_IN
HTPDAn_IN
EPI Share Lane
C7102~C7117
Close to EPI Wafer!
+3.3V_NORMAL
OPT
R7104
AGP_CTRL
10K
R7101
VX1_MSE
0
VBY1_LGD/BOE_M+_MODULE
R7105
1K
1/16W
5%
3D&L_DIM_EN
DATA_FORMAT_0
(MPLUS MODE 1)
+3.3V_NORMAL
VBY1_LGD/BOE_M+_MODULE
+3.3V_NORMAL
OPT
+3.3V_NORMAL
VBY1_LGD_M+_MODULE
R7130
1K
VBY1_LGD_M+_MODULE
R7107
+3.3V_NORMAL
VBY1_LGD/BOE_M+_MODULE
0
R7137
100
OPT
0
3D&L_DIM_EN_Micom
R7108 0
R7100
10K
R7131 0
VBY1_LGD/BOE_M+_MODULE
R7106
10K
OPT
PWM_DIM
LGD/BOE_PANEL_VX1
R7114 0
LGD/BOE_PANEL_VX1
R7113 0
M+ LGD_Module
High : AGP & M+ BYPASS
L & NC : NSB & M+ ENABLE
R7111
10K
R7132 0
VBY1_LGD/BOE_M+_MODULE
OPT
R7112
10K
R7109
10K
OPT
R7110
10K
+3.3V_NORMAL
LGD/BOE_PANEL_VX1
R7136
10K
OPT
R7117 0
+3.3V_NORMAL
OPT
R7126 0
AGP_CTRL
+3.3V_NORMAL
R7115
4.7K
OPT
LGD_PANEL_VX1
+3.3V_NORMAL
R7116
4.7K
OPT
DATA_FORMAT_1
(MPLUS MODE 0)
R7133 0
OPT
R7134
VBY1_LGD/BOE_M+_MODULE
0
LOCKAn
LGD/BOE_PANEL_VX1
R7118
10K
HTPDAn
AR7101
0
1/16W
DATA_FORMAT_0
PWM_TCON_OUT
OPT
OPT
R7122
100
I2C_SCL6
I2C_SDA6
B
(MLE3)
(MLE1,2)
R7127
1K
C
Q7102
2N3904S
OPT
E
+1.8V
R7121
10K
LOCKAn_IN
TCON_I2C_EN
G
LGD_PANEL_VX1_FET
S
D
Q7100
T2N7002AK
R7119
OPT
33
TCON_I2C_EN
G
LGD_PANEL_VX1_FET
S
D
Q7101
T2N7002AK
R7120
OPT
33
Input Data Format[1:0]=[35pin:36pin]
’00’ : Low Power(MLE Off)
’01’ : High Luminance
’10’ : High Luminance
’11’ : PC Mode
OPT
OPT
R7128
100
OPT
R7129
1K
C
B
E
Q7103
2N3904S
OPT
LOCKAn
Must be assigned at Vx1 51p wafer !!!
PWM_TCON_OUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Data Input Format[1:0]
*Mode 1 (NON Division)
- Data Format 0(Pin37) = Low
Data Format 1(Pin36) = Low
*Mode 3 (4 Division)
- Data Format 0(Pin37) = Low
Data Format 1(Pin36) = High
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
K2H
eMMC
2014-11-17
81
Page 59
RS-232C Control INTERFACE
+3.5V_ST
RS232C
C11204
0.1uF
RS232C
RS232C
RS232C
RS232C
C11200
0.1uF
C11201
0.1uF
C11202
0.1uF
C11203
0.1uF
C1+
C1-
C2+
C2-
DOUT2
RIN2
V+
V-
RS232C
IC11200
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
Closed to Jack side
AR11200
RS232C
100
1/16W
OPT
OPT
VA11200
EAF61630102
VA11201
EAF61630102
DOUT1
RIN1
SOC_RX
SOC_TX
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
(If Power Off mode
is not displayed)
Check Power B/D
voltage
※ Caution
Check and fix exterior
of Power B/D Part
Abnormal
Abnormal
Established
date
Revised date
CPU
1
Normal
voltage?
Replace Power B/D
Replace Main B/D
Y
N
Replace Power B/D
Replace Main B/D
Normal?
N
7/16
Y
End
* Please refer to the all cases which
can be displayed on power off mode.
Status Power off List Explanation
"POWEROFF_Remote KEY" Power off by Remote CONTROL
"POWEROFF_OFFTIMER" Power off by OFF TIMER
"POWEROFF_SLEEPTIMER" Power off by SLEEP TIMER
"POWEROFF_INSTOP" Power off by INSTOP KEY
"POWEROFF_AUTOOFF" Power off by AUTO OFF
Normal
Abnormal
"POWEROFF_ONTIMER" Power off by ON TIMER
"POWEROFF_RS232C" Power off by RS232C
"POWEROFF_RESREC" Power off by Reservated Record
"POWEROFF_RECEND" Power off by End of Recording
"POWEROFF_SWDOWN" Power off by S/W Download
"POWEROFF_UNKNOWN" Power off by unknown status except listed case
"POWEROFF_ABNORMAL1" Power off by abnormal status except CPU trouble
"POWEROFF_CPUABNORMAL" Power off by CPU Abnormal
※ Mechanical noise is a natural
phenomenon, and apply the 1st level
description. When the customer does not
agree, apply the process by stage.
※ Describe the basis of the description
in “Part related to nose” in the Owner’s
Manual.
Replace PSU
OR
Established
date
Revised date
※ When the nose is severe, replace the module
(For models with fix information, upgrade the
S/W or provide the description)
※If there is a “Tak Tak” noise from the
cabinet, refer to the KMS fix information and
then proceed as shown in the solution manual
(For models without any fix information,
provide the description)