Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
Always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. Carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This specification sheet is applied to all of the LED TV with
LD5CB chassis.
2. Designation
(1) The adjustment is according to the order which is designated
and which must be followed, according to the plan
can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation : Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 220 V, 60 Hz
(6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),
DDC Adjustment Jig, Service remote control.
(7) Push the "IN STOP" key - For memory initialization.
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at rst.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
which
3. Main PCB check process
▪ APC - After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
(2) Set as below, and then click "Auto Detect" and check "OK"
message.
If "Error" is displayed, check connection between computer,
jig, and set.
(3) Click "Read" tab, and then load download file(XXXX.bin)
by clicking "Read".
(4) Click "Connect" tab. If "Can't" is displayed, check connection
between computer, jig, and set.
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
(4)
filexxx.bin
(5)
(7)...........OK
(6)
* USB DOWNLOAD
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting.
(3) Show the message "UPDATING".
(4) Updating is starting.
(1)
filexxx.bin
Only for training and service purposes
- 10 -
(5) Updating Completed, The TV will restart automatically in 5
seconds.
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control.
(2) Select "Adjust Check" and push "OK" key.
(3) Punch in the number. (Each of model has their number)
(4) Completed selecting Tool option.
3.1. ADC Process(Optional)
* If ADC processes as OTP, There is no need to proceed
internal ADC.
(1) Enter Service Mode by pushing "ADJ" key,
(2) Enter Internal ADC mode by pushing "►" key at "8. ADC
Calibration".
<Caution> Using "P-ONLY" key of the Adjustment remote
control, power on TV.
* ADC Calibration Protocol (RS232)
NOItemCMD 1 CMD 2 Data 0
Enter Adjust
MODE
ADC adjust
Adjust
‘Mode In’
ADC
Adjust
AA0 0
AD1 0
When transfer the ‘Mode In’,
Carry the command.
Automatically adjustment
(The use of a internal pattern)
Adjust Sequence
▪ aa 00 00 [Enter Adjust Mode]
▪ xb 00 40 [Component Input]
▪ ad 00 10 [Adjust 480i & 1080p Comp]
▪ aa 00 90 End Adjust mode
* Required equipment : Adjustment R/C.
3.2. EDID Download
▪ After enter Service Mode by pushing "ADJ" key.
▪ Enter EDID D/L menu.
▪ Enter "START" by pushing "OK" key.
<Caution> Never connect HDMI cable when EDID downloaded.
3.3. EDID data
(1) RGB
1) HD RGB EDID DATA
0123456789A B C D E F
00 00 ffffffff ffff 00 1e 6dab
10c01 03 68 a0 5a 78 0a ee 91 a3 54 4c 99 26
20 0f 50 54 a1 08 00 71 40 61 40 45 40 31 40 01 01
30 01 01 01 01 01 01 1b 21 50 a0 51 00 1e 30 48 88
40 35 00 40 84 00 00 00 1c 01 1d 00 72 51 d0 1e 20
50 6e 28 55 00 a0 5a 00 00 00 1e 00 00 00 fd 00 3a
60 3e 1e 53 10 00 0a 20 20 20 20 20 20d
70d00 e
2) FHD RGB EDID DATA
0123456789A B C D EF
00 00 ffffffff ffff 00 1e 6dab
10c01 03 68 a0 5a 78 0a ee 91 a3 54 4c 99 26
20 0f 50 54 a1 08 00 31 40 45 40 61 40 71 40 81 80
30 01 01 01 01 01 01 02 3a 80 18 71 38 2d 40 58 2c
40 45 00 a0 5a 00 00 00 1e 66 21 50 B0 51 00 1B 30
50 40 70 36 00 a0 5a 00 00 00 1e 00 00 00 fd 00 3a
60 3e 1e 53 10 00 0a 20 20 20 20 20 20d
70d00 e
b. Serial No: Controlled on production line.
c. Month, Year: Week : '01' -> '01', Year : '2015' -> '19' fix
d. Model Name(Hex): Refer to the ASCII Code Table
cf) TV set’s model name in EDID data is below.
▪ Use only AUO/Sharp/CSOT (Cool temp Spec is 13000K)
Aging time
(Min)
spec271270286289313329
target278280293299320339
CoolMediumWarm
xyxyxy
▪ W/B information
Model informationW/B information
Chassis
or Model
Module Panel
Backlight
Type
Using W/B table
22/28LX**AllAllEdge LEDX
60LX**SharpSharpEdge LEDX
Direct LED
OhtersLGDLGD
or
O
Edge LED
▪ Auto adjustment Map(using RS-232C to USB cable)
RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
CoolMidWarmCool Mid Warm
R GainjgJajd00172192192254
G GainjhJbje00172192192192
B GainjiJcjf00192192172254
R Cut646464128
G Cut646464128
B Cut646464128
MIN
CENTER
(DEFAULT)
MAX
<Caution>
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.(When R/G/B Gain are all
C0, it is the FULL Dynamic Range of Module)
* Manual W/B process using adjust Remote control.
▪ After enter Service Mode by pushing "ADJ" key,
▪ Enter White Balance by pushing "►" key at "9. White
Balance".
* Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C P-ONLY → Enter the
mode of White-Balance, the pattern will come out.
Full White Pattern
RS-232C Communication
CA-210
COLOR
ANALYZER
TYPE : CA-210
* Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10 lux).
(2) Adhere closely the Color analyzer(CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color analyzer's prove vertically.(90° +/-
2.5°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using 'no signal' or 'POWER ONLY' or the others, check
the back light on.
* CASE Cool Mode
First adjust the coordinate far away from the target
value(x, y).B.
1) x, y > target
2) x, y < target
3) x >target, y < target
4) x < target, y > target
- Every 4 case have to fit y value by adjusting B Gain
and then fit x value by adjusting R-Gain.
- In this case, increasing/decreasing of B Gain and R
Gain can be adjusted.
How to adjust
1) In case G gain more than 172
Adjust R Gain and B Gain less than 192
2) If the G gain value be adjusted down to 172
One of the R/B Gain is 254
3) If G Gain is 172 , More than one of R/B Gain is to be
First adjust the coordinate far away from the target
value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4) x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
* After you finished all adjustments, Press "In-start" key and
compare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is not
same, then correct it same with BOM and unplug AC cable.
For correct it to the model's module from factory Jig model.
* Push the "IN STOP" key after completing the function
inspection. And Mechanical Power Switch must be set
“ON”.
4.2. IR emitter inspection
(1) Start 3D pattern inspection.
(2) If IR emitter signal is correctly received to IR receiver, the
lamp of IR tester turns on.
6. Model name & Serial number D/L
▪ Press "Power on" key of service remote control.
(Baud rate : 115200 bps)
▪ Connect RS232 Signal Cable to USB Jack.
▪ Write Serial number
▪ Must check the serial number at the Diagnostics of SET UP menu.
(Refer to below).
6.1. Signal Table
CMD LENGTH ADHADLDATA_1. . .Data_nCSDELAY
CMD : A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 +...+ Data_n
Delay : 20ms
6.2. Command Set
No. Adjust mode CMD(hex) LENGTH(hex)Description
EEPROM
1
WRITE
* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write : Model Name and Serial Number write in EEPROM,.
A0h84h+nn-bytes Write (n = 1~16)
5. HI-POT Test
5.1. HI-POT auto-check preparation
- Check the POWER cable and SIGNAL cable insertion condition
5.2. HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
5.3. Checkpoint
(1) Test voltage
- Touchable Metal : 3 KV / min at 100 mA
- SIGNAL : 3KV / min at 100 mA
(2) TEST time: 1 second. (case : mass production )
(3) TEST POINT
- Touchable Metal => LIVE & NEUTRAL : Touchable Metal.
- SIGNAL => LIVE & NEUTRAL : SIGNAL.
Only for training and service purposes
6.3. Method & notice
(1) Serial number D/L is using of scan equipment.
(2) Setting of scan equipment operated by Manufacturing
Technology Group.
(3) Serial number D/L must be conformed when it is produced in
production line, because serial number D/L is mandatory by
D-book 4.0.
If the TV set is downloaded by OTA or Service man, sometimes
model name or serial number is initialized.(Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the "Instart" key of Adjustment remote controller.
2) Go to the menu "6.Model Number D/L" like below photo.
3) Input the Factory model name or Serial number like photo.
4) Check the model name Instart menu. → Factory name
displayed.
5) Check the Diagnostics.(DTV country only) → Buyer model
displayed.
7. MAC Address & CI+ key download
7.1 MAC Address
7.1.1 Equipment & Condition
▪ Play file : Serial.exe
▪ MAC Address edit
▪ Input Start / End MAC address
7.1.2 Download method
(1) Communication Prot connection
Connection: PCBA(USB Port) → USB to Serial Adapter(UC-
232A) → RS-232C cable → PC(RS-232C port)
* Caution: LJ21* chassis support only UC-232A driver. (only
use this one.)
(2) MAC Address & CI+ Key Download
▪ Set CI+ Key path Directory at Start Mac & CI+ Download
Programme
▪ Com 1,2,3,4 and 115200(Baudrate)
GP4_LOW
▪ Port connection button click(1)
▪ Push the (2) MAC Address write.
▪ At success Download, check the OK (3)
▪ Start CI+ Key Download, Push the (4)
▪ Check the OK or NG
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
FROM POWER B/D 13.2V
+3.5V_ST
TR_NXP
MMBT3906(NXP)
R406
10K
R404
4.7K
TR_NXP
Q400
MMBT3904(NXP)
R419
100
TR_NXP
Q402
MMBT3904(NXP)
1
TVS_SEMTECH
RL_ON
INV_CTL
+3.5V_ST
R400
10K
R401
10K
OPT
+3.5V_ST
R426
10K
TR_KEC
Q400-*1
2N3904S
B
R402
10K
+3.3V_Normal
R425
10K
TR_KEC
Q402-*1
2N3904S
B
B
B
R420
C
E
C
E
C
E
1K
C
E
+13.2V to +3.5V_STANDBY
+13.2V
L412
BLM18PG121SN1D
C438
C439
10uF
0.1uF
25V
25V
R1
R46 9
R468
68K
6.8K
1/1 6W
1/16W
1%
1%
C440
100pF
50V
R2
R471
22K
1/16W
1%
C441
1uF
10V
C442
2200pF
Vout=0.765*(1+R1/R2)
Q401
ZD404
TVS_KEC
ZD404-*1
R470
10K
OPT
50V
3
2
5V
TR_KEC
Q401-*1
2N3906S-RTK
EBC
OPT
R412
33K
EN
R475
30K
FB
VREG
SS
PWR_ON
D13.2V
A13.2V
DRV_ON
BD9D321EFJ
1
2
3
4
3A
P401
SMAW200-H12S5K(BK)(LTR)
PDIM#2
1
2
GND
GND
IC405
9
THERMAL
D13.2V
4
3
D13.2V
5
6
A13.2V
7
8
GND
10
9
PDIM#1
11
12
13
[EP]
VIN
8
BOOT
7
SW
6
GND
5
C443
0.1uF
16V
R424
3.9K
L413
2uH
C444
22uF
PWM1_Pulldown_R
10V
PWM1_CAP
R467-*1
1000pF
50V
PWM1
R467
1K
L403
MLB-201209-0120P-N2
OPT
0.1 uF
L414
L415
MLB-201209-0120P-N2
PWM_DIM
+3.5V_ST
C445
22uF
10V
C40 2
25V
TVS_SEMTECH
TVS_KEC
ZD405-*1
OPT
C43 3
4.7 uF
C44 6
0.1 uF
ZD405
5V
50V
25V
+13.2V
+13.2V POWER_DET
R435
100K
RESET_IC_KEC
IC401
KIC7529M2
VCC
3
IC401-*1
RESET_IC_DIODES
APX803E29
VCC
3
A13.2V
C415
0.1uF
+13.2V
R430
14K
1%
R431
5.6K
1%
25V
+3.5V_Normal to +1.5V_DDR
+3.3V_Normal
L409
BLM18PG121SN1D
C426
10uF
10V
IC404
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
1.3A
Vout=1.25*(1+R2/R1)+Iadj*R2
+13.2V to PANEL_VCC+3.5V_ST to +3.3V_Normal
D
R451
5.6K
G
C
TR_KEC
Q403-*1
2N3904S
E
+3.3V_Normal
C405
10uF
25V
PANEL_VCC
R452
5.6K
C406
10uF
25V
2200pF
2200pF
C408
50V
C409
R409
+3.5V_ST
POWER_ON/OFF_1
R443
10K
R444
10K
B
R447
22K
R448
2.2K
C428
2.2uF
C
TR_NXP
Q404
MMBT3904(NXP)
E
Vout=0.6(R1/R2)+0.6
L405
4.7uH
25V
0.047uF
10
PGND2
LX2
C410
BST120LX121PGND1
19
COMP1
18
FB1
17
AGND
16
RSET
15
FB2
14
COMP2
13
11
12
BST2
+5V_Normal
C421
0.047uF
25V
R422
15K
L406
4.7uH
C407
1uF
OPT
OPT
50V
91K
10V
ROSC/SYNC
SW_EN
NFAULT
[EP]
SS2
1
EN1
2
EN2
3
SN1406035RGER
4
5
6
SW_OUT
THERMAL
25
7
SW_IN
VIN123V7V24SS1
IC400
8
VIN2
22
9
+3.5V_ST
OPT
R438
4.7K
R454
100
OUT
2
1
GND
RESET
2
1
GND
R449
1K
1/16W
1%
R450
200
1/16W
1%
CB2012PK501T
R1
R2
C431
10uF
R453
10V
0
C422
0.1uF
16V
+1.5V_DDR
L411
OPT
ZD403
2.5V
POWER_DET
POWER_DET_RESET
OPT
ZD406
5.1v
PANEL_CTL
+13.2V
L408
UBW2012-121F
120OHM
OPT
C425
0.1uF
25V
R441
R445
33K
R446
120K
B
C
TR_NXP
Q403
MMBT3904(NXP)
E
R442
10K
10K
NON_60_SHARP
C427
0.22uF
25V
Q405
SSM3J332R
S
60_SHARP
C427-*1
0.1uF
50V
B
+5V_Normal & +1.10V_VDDC
+13.2V
L404
CB2012PK501T
+3.3V_Normal
OPT
C403
4700pF
50V
Check the pull down
when AC Power On with HDD
+3.3V_Normal
R403
10K
OPT
OPT
R473
C404
30K
4700pF
50V
USB1_CTL
USB1_CTL_Pull_Down
USB1_OCD
R472
3.3K
R405
10K
OPT
R474
30K
OPT
R407
4.7K
R408
100K
+5V_Normal
10V
R41 8
FET_AOS
Q406-*1
AO3435
D
S
L410
ZD401
OPT
2.5V
C430
22uF
10V
R2
+3.3V_Normal
ZD402
5V
TVS_SEMTECH
TVS_KEC
ZD402-*1
OPT
C412
10uF
6.3V
C418
47pF
50V
+5V_Normal
C423
22uF
16V
C413
22uF
10V
C424
22uF
16V
+1.10V_VDDC
C414
22uF
10V
G
FET_TOSHIBA
Q406
SSM3J332R
BLM18PG121SN1D
D
S
C429
G
0.1uF
16V
C
TR_KEC
Q404-*1
B
2N3904S
E
R1
OPT
OPT
C411
R411
4.7K
1%
R2
R413
5.1K
1%
C419
22pF
50V
C420
3300pF
50V
20K
R41 4
ZD407
82pF
5.1v
50V
C416
22pF
50V
C417
3300pF
10K
50V
R415
0
5%
R416
5.1K
1%
R417
39K
1%
R1
+5V_USB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C432
1uF
16V
L14_CA
POWER
Vout=0.6(R1/R2)+0.6
2014/12/03
4
USB (SIDE)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
USB_HDD_CAP1_10uF
C700-*1
USB_HDD_CAP1_22uF
OPT
JK700
1234
USB DOW N ST REAM
3AU 04S- 305- ZC-( LG)
5
ZD700
SD05
C701
5V
OPT
OPT
C702
5pF
5pF
50V
50V
10uF
10V
USB_HDD_CAP2_10uF
C703-*1
USB_HDD_CAP2_22uF
C700
22uF
10V
OPT
D700
RCLAMP0502BA
10uF
10V
C703
22uF
10V
R700
2.2
R701
2.2
+5V_USB
OPT
C704
22uF
10V
SIDE_USB1_DM
SIDE_USB1_DP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
USB_S1
2014/05/20
7
HDMI (REAR 1 / SIDE 1 MHL)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
5V_HDMI_2
R802
1.8K
VA800
R803
1K
SHIELDGND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
ESD_HDMI1_VARISTOR
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG59023302
JK800
This GND Pattern should be very narrow
HDMI jack burnt problem improvement
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_DET_HDMI_2
R805
3.3K
ESD_HDMI1_VARISTOR
VA801
ESD_HDMI1_CAP
VA800-*1
1uF
10V
ESD_HDMI1_CAP
VA801-*1
1uF
10V
AR801
5.1
AR802
5.1
MMBT3904(NXP)
ESD_HDMI1
VA802
TR_NXP
Q800
C
E
TR_KEC
Q800-*1
2N3904S
B
C
B
E
ESD_HDMI1
VA803
ESD_HDMI1_TMDS
IP4294CZ10-TBR
ESD_HDMI1_TMDS
IP4294CZ10-TBR
HDMI_2 MHL
5V_HDMI_4
R808
10K
R809
10K
R810 100
R811 100
ESD_HDMI1
VA804
D803
1
2
3
4
5
1
2
3
4
5
D804
10
9
8
7
6
10
9
8
7
6
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
BODY_SHIELD
20
JK801-*1
DAADR019A
HDMI-2_EMI_FOOSUNG
GND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG62611204
HDMI-2
JK801
19
HOT_PLUG_DETECT
18
VDD[+5V]
17
DDC/CEC_GND
16
SDA
This GND Pattern should be very narrow
15
SCL
HDMI jack burnt problem improvement
14
RESERVED
13
CEC
12
TMDS_CLK-
11
TMDS_CLK_SHIELD
10
TMDS_CLK+
9
TMDS_DATA0-
8
TMDS_DATA0_SHIELD
7
TMDS_DATA0+
6
TMDS_DATA1-
5
TMDS_DATA1_SHIELD
4
TMDS_DATA1+
3
TMDS_DATA2-
2
TMDS_DATA2_SHIELD
1
TMDS_DATA2+
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
HDMI-2
R812
1.8K
5V_DET_HDMI_4
ESD_HDMI2
VA805
HDMI-2
R813
3.3K
ESD_HDMI2
VA806
OPT
VA807
5.6V
AR804
AR803
HDMI-2_MHL_Non
R819
0
5.1
5.1
ESD_HDMI2
HDMI-2_MHL
R818
0
ESD_HDMI2
VA809
ESD_HDMI2
VA808
VA811
ESD_HDMI2
VA810
HDMI-2_MHL
HDMI-2
R814
33
HDMI-2
R815100
R816100
HDMI-2
D805
1
2
3
4
5
ESD_HDMI2_TMDS
IP4294CZ10-TBR
D806
1
2
3
4
5
ESD_HDMI2_TMDS
IP4294CZ10-TBR
HDMI-2_MHL
C800
R817
0.047uF
300K
25V
MHL Spec
HDMI-2_MHL_Non
R817-*1
3.3K
10
9
8
7
6
10
9
8
7
6
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
MHL_CD_SENSE
CEC
HDMI_CEC
HDMI_DIODE_SUZHOU
D800-*1
MMBD6100
A1
C
5V_HDMI_2
R800
2.7K
+5V_Normal
R801
2.7K
R804
100
A2
HDMI_DIODE_KEC
A2CA1
KDS184
D800
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE_S7
HDMI_DIODE_SUZHOU
D801-*1
MMBD6100
A1
C
R806
2.7K
+5V_Normal
R807
2.7K
5V_HDMI_4
HDMI_DIODE_SUZHOU
A2
HDMI_DIODE_KEC
A2CA1
KDS184
D801
D802-*1
MMBD6100
DDC_SDA_4
DDC_SCL_4
A2
A1
C
+3.5V_ST
A2CA1
HDMI_DIODE_KEC
KDS184
D802
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1A
HDMI_R1S18
140813
SPDIF
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SPDIF_OUT
+3.3V_Normal
OPT
C1001
1uF
10V
ESD Ready
SPDIF_OPTIC
C1002
18pF
50V
GND
VCC
VINPUT
SPDIF_OPTIC
JK1001
JST1223-001
1
2
3
4
FIX_POLE
Fiber Optic
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
SPDIF
2014/06/02
10
DDR_EXT
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
DDR
2014/06/13
12
Serial Flash for SPI boot
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
/FLASH_WP
OPT
R1300
10K
+3.5V_ST
/SPI_CS
SPI_SDO
R1301
4.7K
OPT
WP#/SIO2
SPI_FLASH_MACRONIX
IC1300
MX25L8035EM2I-10G
CS#
1
SO/SIO1
2
3
GND
4
SPI_FLASH_WINBOND
IC1300-*1
W25Q80DVSSIG
CS
1
DO[IO1]
2
WP[IO2]
3
GND
4
8
7
6
5
8
7
6
5
VCC
NC/SIO3
SCLK
SI/SIO0
VCC
HOLD[IO3]
CLK
DI[IO0]
R1302
33
+3.5V_ST+3.5V_ST
C1300
0.1uF
16V
SPI_SCK
SPI_SDI
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
S_FLASH
140721
13
LVDS
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[51Pin LVDS Connector]
(For FHD 60Hz)
MO_FHD
P1800
SP14-11592-01-51Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
PANEL_VCC
C1800
0.1uF
25V
VCOM_SDA
VCOM_SCL
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
MO_FHD_non_55CSOT
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
MO_FHD_non_55CSOT
RXB0-
MO_FHD_VCC_CAP
C1801
10uF
25V
LVDS_SEL
+3.3V_Normal
Cell_CSOT_55inch
R1806
1K
OPT
R1807
10K
R1801
0
0
R1812
Cell_INX_FHD
AR1800
0
1/16W
FOR FHD REVERSE(10bit)
Change in S7LR
MIRROR
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-RXBCK-
RXB1+
RXB1-
RXB0+
RXB0-
Pol-change
RXA0+
RXA0-
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXA4+
RXA4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXB3+
RXB3-
RXB4+
RXB4-
FOR FHD REVERSE(8bit)
Change in S7LR
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
MIRROR
Pol-change
RXA4+
RXA4-
RXA0+
RXA0-
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXB4+
RXB4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXBCK-
RXB3+
RXB3-
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
Shift
RXA4-
RXA4+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-RXACK-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXB4-
RXB4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
MO_HD
P1801
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
VCOM_SDA
VCOM_SCL
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
PANEL_VCC
LVDS_SEL
+3.3V_Normal
OPT
R1808
3.3K
OPT
R1809
10K
EU pin assign is different from NON EU.
Because of position of HD wafer.
V-COM I2C
URSA/VCOM_SCL
URSA/VCOM_SDA
VCOM_SCL
VCOM_SDA
+3.3V_Normal
VCOM_I2C_PULL_UP
R1810
VCOM_I2C
R1804
0
VCOM_I2C
R1805
0
VCOM_I2C_PULL_UP
2K
R1811
2K
URSA/VCOM_SCL
URSA/VCOM_SDA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
LVDS
140613
18
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