LG 43LX310C, 43LX310C-SA-B Schematic
Internal Use Only
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
LED TV
SERVICE MANUAL
CHASSIS : LJ5CB
MODEL : 43LX310C 43LX310C-SA/B
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL69153901 (1504-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................. 10
BLOCK DIAGRAM ................................................................................. 15
EXPLODED VIEW .................................................................................. 16
SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX
TROUBLESHOOTING GUIDE .................................................. APPENDIX
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LED TV used LJ5CB
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC specification
Only for training and service purposes
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4. Model General Specification
No. Item Specication Remarks
1 Receiving System SBTVD / NTSC / PAL-M / PAL-N
1) VHF : 02~13
2 Available Channel
3 Input Voltage AC 100 ~ 240V@ 50/60Hz
4 Market Central and South AMERICA
5 Screen Size
6 Aspect Ratio 16:9
7 Tuning System FS
Module
*J : Titan
8
*A : Titan
*D : Silver
*E : Gold
9 Operating Environment
10 Storage Environment
2) UHF : 14~69
3) CATV : 01~135
32LX330C-S*
32 inch Wide (1366 × 768)
42 inch Wide (1920 × 1080)
43 inch Wide (1920 × 1080) 43LX310C-S*
49 inch Wide (1920 × 1080)
55 inch Wide (1920 × 1080)
LC320DXE-MGA3
LC320DXE-MGA4
LC320DUE-MGA3
LC320DUE-MGA4
LC420DUE-MGA3
LC420DUE-MGA4 FHD, 60Hz LGD
NC430EUN-AACR1 FHD, 60Hz New Optics 43LX310C-S*
NC490EUN-AACR1 FHD, 60Hz New Optics 49LX310C-S*
LC490EUE-FHM3 FHD, 60Hz LGD 49LX341C-S*
LC550EUE-FHM3 FHD, 60Hz LGD 55LX341C-S*
LC550DUE-MGA4 FHD, 60Hz LGD 55LX530S-S*
1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
1) Temp. : -20 ~ 60 deg
2) Humidity : ~ 85%
HD, 60Hz LGD
FHD, 60Hz LGD 32LX535S-S*
32LX330H-S*
32LX530H-S*
32LX535S-S*
42LX330C-S*
42LX330H-S*
42LX530H-S*
42LX530S-S*
49LX341C-S*
49LX341C-S*
55LX341C-S*
55LX530S-S*
32LX330C-S*
32LX330H-S*
32LX530H-S*
42LX330C-S*
42LX330H-S*
42LX530H-S*
42LX530S-S*
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. External Input Support Format
5.1. Component input(Y, CB, PR, CR, PR)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock Proposed
1 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
2 720*480 15.73 60 13.5135 SDTV ,DVD 480I
3 720*480 31.47 59.94 27.0 SDTV 480P
4 720*480 31.50 60 27.027 SDTV 480P
5 1280*720 44.96 59.94 74.176 HDTV 720P
6 1280*720 45.00 60.00 74.25 HDTV 720P
7 1920*1080 28.12 50.00 74.250 HDTV 1080I
8 1920*1080 33.72 59.94 74.176 HDTV 1080I
9 1920*1080 33.75 60.00 74.25 HDTV 1080I
10 1920*1080 26.97 23.976 74.176 HDTV 1080P
11 1920*1080 27.00 24.000 74.25 HDTV 1080P
12 1920*1080 33.71 29.97 74.176 HDTV 1080P
13 1920*1080 33.75 30.000 74.25 HDTV 1080P
14 1920*1080 56.25 50.00 148.50 HDTV 1080P
15 1920*1080 67.43 59.939 148.352 HDTV 1080P
16 1920*1080 67.50 60.00 148.50 HDTV 1080P
5.2. RGB Input(PC)
- HD Model
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640*350 31.468 70.09 25.17 EGA X
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
6 1152*864 54.348 60.053 80.00 VESA O
7 1360*768 47.712 60.015 85.50 VESA (WXGA) O
- FHD Model
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed DDC Remark
1 640*350 31.468 70.09 25.17 EGA X
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
6 1152*864 54.348 60.053 80.00 VESA O
7 1360*768 47.712 60.015 85.50 VESA (WXGA) O
8 1280*1024 63.981 60.020 108.0 VESA (SXGA) O FHD
9 1920*1080 66.587 59.934 138.5 HDTV 1080P O FHD
10 1920*1080 67.50 60.00 138.5 HDTV 1080P O FHD
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.3. HDMI Input(PC/DTV)
* HDMI PC support only Rear HDMI Input
* If use DVI to HDMI cable for PC, you have to use external SPK for PC audio sound.
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
PC(DVI) DDC
1 640*350 31.46 70.09 25.17 EGA X
2 720*400 31.46 70.08 28.32 DOS O
3 640*480 31.46 59.94 25.17 VESA(VGA) O
4 800*600 37.87 60.31 40.00 VESA(SVGA) O
5 1024*768 48.36 60.00 65.00 VESA(XGA) O
6 1152*864 54.34 60.053 80.00 VESA O
7 1360*768 47.71 60.015 85.50 VESA (WXGA) O
8 1280*1024 63.98 60.02 108.00 VESA (SXGA) O (FHD Only)
9 1920*1080 67.5 60 148.5 HDTV 1080P O (FHD Only)
DTV
1 720*480 31.47 59.94 27.000 SDTV 480P
2 720*480 31.50 60.00 27.027 SDTV 480P
3 1280*720 37.50 50.00 74.25 HDTV 720P
4 1280*720 44.96 59.94 74.176 HDTV 720P
5 1280*720 45.00 60.00 74.25 HDTV 720P
6 1920*1080 28.12 50.00 74.25 HDTV 1080I
7 1920*1080 33.72 59.94 74.176 HDTV 1080I
8 1920*1080 33.75 60.00 74.25 HDTV 1080I
9 1920*1080 26.97 23.97 74.176 HDTV 1080P
10 1920*1080 27.00 24.00 74.25 HDTV 1080P
11 1920*1080 33.71 29.97 74.176 HDTV 1080P
12 1920*1080 33.75 30.00 74.25 HDTV 1080P
13 1920*1080 56.25 50.00 148.50 HDTV 1080P
14 1920*1080 67.43 59.94 148.352 HDTV 1080P
15 1920*1080 67.5 60.00 148.50 HDTV 1080P
16 1920*1080 67.50 60.00 148.50 HDTV 1080P
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with
LJ5CB chassis.
2. Designation
(1) The adjustment is according to the order which is designated
and which must be followed, according to the plan
which
can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation : Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 220 V, 60 Hz
(6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),
DDC Adjustment Jig, Service remote control.
(7) Push the "IN STOP" key - For memory initialization.
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at rst.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
3. Main PCB check process
▪ APC - After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
(2) Set as below, and then click "Auto Detect" and check "OK"
message.
If "Error" is displayed, check connection between computer,
jig, and set.
(3) Click "Read" tab, and then load download file(XXXX.bin)
by clicking "Read"
(4) Click "Connect" tab. If "Can't" is displayed, check connection
between computer, jig, and set.
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
(4)
filexxx.bin
(5)
(7)...........OK
(6)
* USB DOWNLOAD
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If version of update file in USB Stick is lower, it will not
work.
- But your downloaded version is High, USB data is
automatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is starting.
(1)
filexxx.bin
Only for training and service purposes
(5) Updating Completed, The TV will restart automatically.
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. If all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* After downloading, have to check and adjust TOOL OPTION
again.
(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
(4)Completed selecting Tool option.
Model HD/
43LX310C-S* LGD EDGE 748 17425 2624 3616 5634 4369
49LX310C-S* LGD EDGE 750 17425 2624 3616 5634 4368
32LX330C-S* LGD POLA 295 19473 2752 3616 5634 4369
42LX330C-S* LGD POLA 299 19473 2752 3616 5634 4369
32LX330H-S* LGD POLA 295 19473 2752 3616 5634 4369
42LX330H-S* LGD POLA 299 19473 2752 3616 5634 4369
49LX341C-S* LGD EDGE 686 19473 2624 3616 5634 4369
55LX341C-S* LGD EDGE 688 19473 2624 3616 5634 4369
32LX530H-S* LGD POLA 295 19473 2752 3616 5634 4369
42LX530H-S* LGD POLA 299 19473 2752 3616 5634 4369
Commercial Tool Option : 128
Module Tool option
FHD
1 2 3 4 5 6
* RS-232C Connection Method.
Connection : PCBA (USB Port) -> USB to Serial Adapter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
- Product name of USB to Serial Adapter is UC-232A.
* Caution : LJ5CB* chassis support only UC-232A driver. (
only use this one. )
L14 LGD, INX Module
▪ Normal line (LGD/CMI, March ~ December, Global)
NC
5.0
Aging
time
(Min)
Cool Medium Warm
x y x y x y
271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
▪ Aging chanber
NC
5.0
Aging
time
(Min)
Cool Medium Warm
x y x y x y
271 270 285 293 313 329
1 0-2 280 285 294 308 319 340
2 3-5 276 280 290 303 315 335
3 6-9 272 275 286 298 311 330
4 10-19 269 272 283 295 308 327
5 20-35 267 268 281 291 306 323
6 36-49 266 265 280 288 305 320
7 50-79 265 263 279 286 304 318
8 80-119 264 261 278 284 303 316
9 Over 120 264 260 278 283 303 315
4. Total Assembly line process
4.1. Adjustment Preparation
- W/B Equipment condition
ca210 : LED -> CH14, Test signal: Inner pattern(80IRE)
- Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
▪ The spec of color temperature and coordinate.
Mode Temp Coordinate spec
Cool(C50) 13,000 k
Medium(0) 9,300 k
Warm(W50) 6,500 k
X=0.271 (± 0.002)
Y=0.270 (± 0.002)
X=0.286 (± 0.002)
Y=0.289 (± 0.002)
X=0.313 (± 0.002)
Y=0.329 (± 0.002)
▪ CA210 : CH 14, Test signal : Inner pattern (80IRE)
- Standard color coordinate and temperature using
CA-1000 (by H/R time)
<Test Signal>
Inner pattern
(204gray,
80IRE)
* W/B luminance Spec
Min 60↑
▪ Normal line ( LGD/CMI, January ~ February for Gumi, Apply
not Cinema Screen)
NC
5.0
Aging
time
(Min)
Cool Medium Warm
x y x y x y
271 270 286 289 313 329
1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346
4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
* Use only AUO/Sharp/CSOT (Cool temp Spec is 13000K)
Cool Medium Warm
x y x y x y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
Only for training and service purposes
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C P-ONLY → Enter the
mode of White-Balance, the pattern will come out.
Full White Pattern
RS-232C Communication
CA-210
COLOR
ANALYZER
TYPE : CA-210
* Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10 lux).
(2) Adhere closely the Color analyzer(CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color analyzer's prove vertically.(80° ~ 100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using 'no signal' or 'POWER ONLY' or the others, check
the back light on.
▪ Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
MIN
<Caution>
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.(When R/G/B Gain are all
C0, it is the FULL Dynamic Range of Module)
CENTER
(DEFAULT)
MAX
* Manual W/B process using djust Remote control.
▪ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
▪ Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
▪ After enter Service Mode by pushing “ADJ” key,
▪ Enter White Balance by pushing “►” key at “9. White
Balance”.
▪ For manual adjustment, it is also possible by the following
sequence.
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-
Balance then press the cursor to the right (KEY▶).
When KEY(▶) is pressed 206 Gray internal pattern will be
displayed.
(4) Adjust Cool modes
1) Fix the one of R/G/B gain to 192 (default data) and
decrease the others.
( If G gain is adjusted over 172 and R and B gain less
than 192 , increase G gain to 192 and increase R gain
and B gain same amount of increasing G gain.)
2) If G gain is less than 172, Increase G gain by up to 172,
and then increase R gain and G gain same amount of
increasing G gain.
3) If R gain or B gain is over 255, Readjust G gain less
than 172, Conform to R gain is 255 or B gain is 255
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B
gain to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ I f internal pattern is not available, use RF input. In EZ Adj.
menu
(7) White Balance, you can select one of 2 Test-pattern: ON,
OFF. Default is inner (ON).
By selecting OFF, you can adjust using RF signal in 206
Gray pattern.
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* CASE Cool Mode
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
1) Decrease the R, G.
(2) x, y < target
1) First decrease the B gain,
2) Decrease the one of the others.
(3) x > target, y < target
1) First decrease B, so make y a little more than the target.
2) Adjust x value by decreasing the R
(4) x < target, y > target
1) First decrease B, so make x a little more than the target.
2) Adjust x value by decreasing the G
■ How to adjust
(1) If G gain is adjusted over 172 and R gain and B gain less
than 192 , increase G gain to 192 and increase R gain and
B gain same amount of increasing G gain.
(2) If G gain is less than 172 , increase G gain by up to 172,
and then increase R gain and B gain same amount of
increasing G gain.
(3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
4.2. DPM operation confirmation
Check if Power LED Color and Power Consumption operate
as standard.
■ Set Input to RGB and connect D-sub cable to set
■ Measurement Condition: (100~240V@ 50/60Hz)
■ Confirm DPM operation at the state of screen without Signal
4.3. EDID DATA
(1) All Data : HEXA Value
(2) Changeable Data :
1) Serial No : Controlled / Data:01
2) Month : Controlled / Data:00
3) Year : Controlled
4) Check sum
(3) Auto Download
■ After enter Service Mode by pushing “ADJ” key,
■ Enter EDID D/L mode.
■ Enter “START” by pushing “OK” key.
* ADC Calibration Protocol (RS232)
NO Item CMD 1 CMD 2 Data 0
Enter Adjust
MODE
ADC adjust
Adjust
‘Mode In’
ADC
Adjust
A A 0 0
A D 1 0
When transfer the ‘Mode In’,
Carry the command.
Automatically adjustment (The
use of a internal pattern)
<Caution>
■ Use the proper signal cable for EDID Check
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
For Analog For HDMI EDID
D-sub to D-sub DVI-D to HDMI or HDMI to HDMI
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
(4) EDID DATA
- RGB 2D EDID Data
1) HD RGB EDID DATA
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 ff ff ff ff ff ff 00 1e 6d a b
10 c 01 03 68 a0 5a 78 0a ee 91 a3 54 4c 99 26
20 0f 50 54 a1 08 00 71 40 61 40 45 40 31 40 01 01
30 01 01 01 01 01 01 1b 21 50 a0 51 00 1e 30 48 88
40 35 00 40 84 00 00 00 1c 01 1d 00 72 51 d0 1e 20
50 6e 28 55 00 a0 5a 00 00 00 1e 00 00 00 fd 00 3a
60 3e 1e 53 10 00 0a 20 20 20 20 20 20 d
70 d 00 e
2) FHD RGB EDID DATA
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 ff ff ff ff ff ff 00 1e 6d a b
10 c 01 03 68 a0 5a 78 0a ee 91 a3 54 4c 99 26
20 0f 50 54 a1 08 00 31 40 45 40 61 40 71 40 81 80
30 01 01 01 01 01 01 02 3a 80 18 71 38 2d 40 58 2c
40 45 00 a0 5a 00 00 00 1e 66 21 50 B0 51 00 1B 30
50 40 70 36 00 a0 5a 00 00 00 1e 00 00 00 fd 00 3a
60 3e 1e 53 10 00 0a 20 20 20 20 20 20 d
70 d 00 e
- HDMI
1) 2D HD Model HDMI EDID data
0 1 2 3 4 5 6 7 8 9 A B C D E F
00 00 FF FF FF FF FF FF 00 1E 6D a b
10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26
20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80
30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 A0 5A 00 00 00 1E 66 21 50 B0 51 00 1B 30
50 40 70 36 00 A0 5A 00 00 00 1E 00 00 00 FD 00 3A
60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d
70 d 01 e
80 02 03 22 F1 4E 10 9F 04 13 05 14 03 02 12 20 21
90 22 15 01 26 15 07 50 09 57 07 f
A0 f 01 1D 80 18 71 1C 16 20 58 2C 25 00 20 C2 5A
B0 31 00 00 9E 01 1D 00 72 51 D0 1E 20 6E 28 55 00
C0 20 C2 31 00 00 1E 02 3A 80 18 71 38 2D 40 58 2C
D0 45 00 A0 5A 00 00 00 1E 01 1D 00 BC 52 D0 1E 20
E0 B8 28 55 40 C4 8E 21 00 00 1E 00 00 00 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
(5) Detail EDID Options are below
a. Product ID
MODEL NAME HEX EDID Table DDC Function
HD/FHD Model 0001 01 00 Analog/Digital
4.5. GND and HI-POT Test
4.5.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition.
b. Serial No: Controlled on production line.
c. Month, Year: Controlled on production line:
ex) Week : '01' -> '01'
Year : '2015' -> '19' fix
d. Model Name(Hex):
cf) TV set’s model name in EDID data is below.
Model name MODEL NAME(HEX)
LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)
e. Checksum: Changeable by total EDID data.
- 2D Model
EDID C/S data
Block 0
Check
sum
Block 1
(Hex)
f. Vendor Specific(HDMI)
- 2D Model
Input
HDMI1 67 03 0C 00 10 00 80 1E 67 03 0C 00 10 00 80 1E
HDMI2 67 03 0C 00 20 00 80 1E 67 03 0C 00 20 00 80 1E
5B (HDMI1) 25 (HDMI1)
4B (HDMI2) 15 (HDMI2)
HD FHD
HDMI RGB HDMI RGB
74
A2
MODEL NAME(HEX)
HD FHD
40
4.4. Outgoing condition Configuration
■ When pressing IN-STOP key by Service remote control,
Red LED are blinked alternatively. And then automatically
turn off. (Must not AC power OFF during blinking)
59
4.5.2. GND & HI-POT auto-check
(1) Pallet moves in the station.(POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process(Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
4.5.3. Checkpoint
(1) Test voltage
1) 3 Poles
- GND: 1.5 KV/min at 100 mA
- SIGNAL: 3 KV/min at 100 mA
2) 2 Poles
- SIGNAL: 3 KV/min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT
1) 3 Poles
- GND Test = POWER CORD GND and SIGNAL
CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
2) 2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms
Only for training and service purposes
5. Local Dimming Function Check
(Not require)
(Step1) Turn on TV.
(Step2) Press “P-only” key, enter to power only mode and
escape the “P-only” Mode by pressing “Exit” key
(Step3) Press “Tilt” key, entrance to Local Dimming mode.
(Step4) At the Local Dimming mode, module Edge Backlight
moving Top to bottom Back light of module moving
(Step5) confirm the Local Dimming mode
(Step6) Press “Exit” key
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
BLOCK DIAGRAM
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
400
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
900
350
901
800
LV1
521
A10
Set + Stand
540
A2
120
200
530
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
TP for NON-EU models(except EU and China)
Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
TP for CI slot
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORD PCM_A[11]
/PCM_IOWR CI_TS_DATA[1]
/PCM_CE
/PCM_IRQA
/PCM_CD
/PCM_WAIT
PCM_RST
PCM_5V_CTL
/CI_DET
TP for S2
PCM_D[0]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[12]
PCM_A[13]
PCM_A[14]
TP for FE_TS_DATA
CI_TS_CLK
CI_TS_VAL
CI_TS_SYNC
CI_TS_DATA[0]
CI_TS_DATA[2]
CI_TS_DATA[3]
CI_TS_DATA[4]
CI_TS_DATA[5]
CI_TS_DATA[6]
CI_TS_DATA[7]
TP for SCART
SCART1_MUTE
SC1_IDPCM_D[1]
SC1_FB
DTV/MNT_VOUT
SCART1_Lout
SCART1_Rout
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for Headphone
HP_LOUT
HP_ROUT
SIDE_HP_MUTE
HP_DET
TP for L15
/VBUS_EN
RGB_DDC_SCL
RGB_DDC_SDA
TU_GND_A
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1A
TP_NON_EU 3
140702
POWER
Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
FROM POWER B/D 13.2V
+3.5V_ST
MMBT3906(NXP)
R406
10K
R404
4.7K
TR_NXP
Q400
MMBT3904(NXP)
R419
100
TR_NXP
Q402
MMBT3904(NXP)
1
TVS_SEMTECH
RL_ON
INV_CTL
+3.5V_ST
R400
10K
R401
10K
OPT
+3.5V_ST
R426
10K
TR_KEC
Q400-*1
2N3904S
B
R402
10K
+3.3V_Normal
R425
10K
TR_KEC
Q402-*1
2N3904S
B
B
B
R420
C
E
C
E
C
E
1K
C
E
+13.2V to +3.5V_STANDBY
+13.2V
L412
BLM18PG121SN1D
C438
C439
10uF
0.1uF
25V
25V
R1
R46 9
R468
68K
6.8K
1/1 6W
1/16W
1%
1%
C440
100pF
50V
R2
R471
C441
22K
1/16W
1%
2200pF
1uF
10V
Vout=0.765*(1+R1/R2)
TR_NXP
Q401
ZD404
TVS_KEC
ZD404-*1
R470
10K
OPT
C442
50V
3
2
5V
TR_KEC
Q401-*1
2N3906S-RTK
EBC
OPT
R412
33K
EN
R475
30K
FB
VREG
SS
PWR_ON
D13.2V
A13.2V
DRV_ON
BD9D321EFJ
1
2
3
4
3A
P401
SMAW200-H12S5K(BK)(LTR)
PDIM#2
1
2
GND
GND
IC405
9
THERMAL
D13.2V
4
3
D13.2V
5
6
A13.2V
7
8
GND
10
9
PDIM#1
11
12
13
[EP]
VIN
8
BOOT
7
SW
6
GND
5
C443
0.1uF
16V
R424
3.9K
L413
2uH
C444
22uF
PWM1_Pulldown_R
10V
PWM1_CAP
R467-*1
1000pF
50V
PWM1
R467
1K
L403
MLB-201209-0120P-N2
OPT
L414
L415
MLB-201209-0120P-N2
PWM_DIM
+3.5V_ST
C445
22uF
10V
C40 2
0.1 uF
25V
TVS_SEMTECH
TVS_KEC
ZD405-*1
4.7 uF
0.1 uF
ZD405
5V
OPT
C43 3
50V
C44 6
25V
+13.2V
+13.2V POWER_DET
R435
100K
RESET_IC_KEC
IC401
KIC7529M2
VCC
3
IC401-*1
RESET_IC_DIODES
APX803E29
VCC
3
A13.2V
C415
0.1uF
+13.2V
R430
14K
1%
R431
5.6K
1%
25V
+3.5V_Normal to +1.5V_DDR
+3.3V_Normal
L409
BLM18PG121SN1D
C426
10uF
10V
IC404
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
1.3A
Vout=1.25*(1+R2/R1)+Iadj*R2
+13.2V to PANEL_VCC +3.5V_ST to +3.3V_Normal
D
R451
5.6K
G
C
TR_KEC
Q403-*1
2N3904S
E
+3.3V_Normal
C405
10uF
25V
PANEL_VCC
R452
5.6K
C406
10uF
25V
2200pF
2200pF
C408
50V
C409
R409
+3.5V_ST
POWER_ON/OFF_1
R443
10K
R444
10K
B
R447
22K
R448
2.2K
C428
2.2uF
C
TR_NXP
Q404
MMBT3904(NXP)
E
Vout=0.6(R1/R2)+0.6
L405
4.7uH
25V
0.047uF
10
PGND2
LX2
C410
BST120LX121PGND1
19
COMP1
18
FB1
17
AGND
16
RSET
15
FB2
14
COMP2
13
11
12
BST2
+5V_Normal
C421
0.047uF
25V
R422
15K
L406
4.7uH
C407
1uF
OPT
OPT
50V
91K
10V
ROSC/SYNC
SW_EN
NFAULT
[EP]
SS2
1
EN1
2
EN2
3
SN1406035RGER
4
5
6
SW_OUT
THERMAL
25
7
SW_IN
VIN123V7V24SS1
IC400
8
VIN2
22
9
+3.5V_ST
OPT
R438
4.7K
R454
100
OUT
2
1
GND
RESET
2
1
GND
R449
1K
1/16W
1%
R450
200
1/16W
1%
R1
R2
C422
0.1uF
16V
L411
CB2012PK501T
R453
0
C431
10uF
10V
+1.5V_DDR
ZD403
2.5V
POWER_DET
POWER_DET_RESET
OPT
ZD406
5.1v
PANEL_CTL
+13.2V
L408
UBW2012-121F
120OHM
OPT
C425
0.1uF
25V
R441
R445
33K
R446
120K
B
C
TR_NXP
Q403
MMBT3904(NXP)
E
R442
10K
10K
NON_60_SHARP
C427
0.22uF
25V
Q405
SSM3J332R
S
60_SHARP
C427-*1
0.1uF
50V
B
+5V_Normal & +1.10V_VDDC
+13.2V
L404
CB2012PK501T
+3.3V_Normal
OPT
C403
4700pF
50V
Check the pull down
when AC Power On with HDD
+3.3V_Normal
R403
10K
OPT
OPT
R473
C404
30K
4700pF
50V
USB1_CTL
USB1_CTL_Pull_Down
USB1_OCD
R472
3.3K
R405
10K
OPT
R474
30K
OPT
R407
4.7K
R408
100K
+5V_Normal
10V
R41 8
FET_AOS
Q406-*1
AO3435
D
S
L410
ZD401
2.5V
C430
22uF
10V
R2
+3.3V_Normal
ZD402
5V
TVS_SEMTECH
TVS_KEC
ZD402-*1
OPT
C412
10uF
6.3V
C418
47pF
50V
+5V_Normal
C423
22uF
16V
C413
22uF
10V
C424
22uF
16V
+1.10V_VDDC
C414
22uF
10V
G
FET_TOSHIBA
Q406
SSM3J332R
BLM18PG121SN1D
D
S
C429
G
0.1uF
16V
C
TR_KEC
Q404-*1
B
2N3904S
E
R1
OPT
OPT
C411
R411
4.7K
1%
R2
R413
5.1K
1%
C419
22pF
50V
C420
3300pF
50V
20K
R41 4
ZD407
82pF
5.1v
50V
C416
22pF
50V
C417
3300pF
10K
50V
R415
0
5%
R416
5.1K
1%
R417
39K
1%
R1
+5V_USB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C432
1uF
16V
L14_CA
POWER
Vout=0.6(R1/R2)+0.6
2014/12/03
4
USB (SIDE)
Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
USB_HDD_CAP1_10uF
C700-*1
USB_HDD_CAP1_22uF
OPT
JK700
1234
USB DOW N ST REAM
3AU 04S- 305- ZC-( LG)
5
ZD700
SD05
C701
5V
OPT
OPT
C702
5pF
5pF
50V
50V
10uF
10V
USB_HDD_CAP2_10uF
C703-*1
USB_HDD_CAP2_22uF
C700
22uF
10V
10uF
10V
C703
22uF
10V
R700
2.2
R701
2.2
OPT
D700
RCLAMP0502BA
+5V_USB
OPT
C704
22uF
10V
SIDE_USB1_DM
SIDE_USB1_DP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
USB_S1
2014/05/20
7
HDMI (REAR 1 / SIDE 1 MHL)
Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
5V_HDMI_2
R802
1.8K
VA800
R803
1K
SHIELDGND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
ESD_HDMI1_VARISTOR
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG59023302
JK800
This GND Pattern should be very narrow
HDMI jack burnt problem improvement
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_DET_HDMI_2
R805
3.3K
ESD_HDMI1_VARISTOR
VA801
ESD_HDMI1_CAP
VA800-*1
1uF
10V
ESD_HDMI1_CAP
VA801-*1
1uF
10V
AR801
5.1
AR802
5.1
MMBT3904(NXP)
ESD_HDMI1
VA802
TR_NXP
Q800
HDMI_2 MHL
5V_HDMI_4
R808
10K
C
TR_KEC
Q800-*1
C
2N3904S
B
E
ESD_HDMI1
B
R809
E
VA803
10K
D803
1
2
3
4
5
ESD_HDMI1_TMDS
IP4294CZ10-TBR
D804
1
2
3
4
5
ESD_HDMI1_TMDS
IP4294CZ10-TBR
R810 100
R811 100
ESD_HDMI1
VA804
10
9
8
7
6
10
9
8
7
6
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
BODY_SHIELD
20
19
HOT_PLUG_DETECT
18
VDD[+5V]
17
DDC/CEC_GND
16
SDA
This GND Pattern should be very narrow
15
SCL
HDMI jack burnt problem improvement
14
RESERVED
13
CEC
12
TMDS_CLK-
11
TMDS_CLK_SHIELD
10
TMDS_CLK+
9
TMDS_DATA0-
8
TMDS_DATA0_SHIELD
7
TMDS_DATA0+
6
TMDS_DATA1-
5
TMDS_DATA1_SHIELD
4
TMDS_DATA1+
3
TMDS_DATA2-
2
TMDS_DATA2_SHIELD
1
TMDS_DATA2+
JK801-*1
DAADR019A
HDMI-2_EMI_FOOSUNG
GND
20
19
18
17
16
15
14
13
12
11
10
EAG62611204
9
8
7
6
5
4
3
2
1
HDMI-2
JK801
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
HDMI-2
R812
1.8K
5V_DET_HDMI_4
ESD_HDMI2
VA805
HDMI-2
R813
3.3K
ESD_HDMI2
VA806
OPT
VA807
5.6V
AR804
AR803
HDMI-2_MHL_Non
R819
0
5.1
5.1
ESD_HDMI2
HDMI-2_MHL
R818
0
ESD_HDMI2
VA809
ESD_HDMI2
VA808
VA811
ESD_HDMI2
VA810
HDMI-2_MHL
HDMI-2
R814
33
HDMI-2
R815 100
R816 100
HDMI-2
D805
1
2
3
4
5
ESD_HDMI2_TMDS
IP4294CZ10-TBR
D806
1
2
3
4
5
ESD_HDMI2_TMDS
IP4294CZ10-TBR
HDMI-2_MHL
C800
R817
0.047uF
300K
25V
MHL Spec
HDMI-2_MHL_Non
R817-*1
3.3K
10
9
8
7
6
10
9
8
7
6
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
MHL_CD_SENSE
CEC
HDMI_CEC
HDMI_DIODE_SUZHOU
D800-*1
MMBD6100
A1
C
5V_HDMI_2
R800
2.7K
+5V_Normal
R801
2.7K
R804
100
A2
HDMI_DIODE_KEC
A2CA1
KDS184
D800
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE_S7
HDMI_DIODE_SUZHOU
D801-*1
MMBD6100
A1
C
R806
2.7K
+5V_Normal
R807
2.7K
5V_HDMI_4
HDMI_DIODE_SUZHOU
A2
HDMI_DIODE_KEC
A2CA1
KDS184
D801
D802-*1
MMBD6100
DDC_SDA_4
DDC_SCL_4
A2
A1
C
+3.5V_ST
A2CA1
HDMI_DIODE_KEC
KDS184
D802
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1A
HDMI_R1S1 8
140813
SPDIF
Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
SPDIF_OUT
+3.3V_Normal
OPT
C1001
1uF
10V
ESD Ready
SPDIF_OPTIC
C1002
18pF
50V
VINPUT
SPDIF_OPTIC
JK1001
JST1223-001
1
GND
2
VCC
3
Fiber Optic
4
FIX_POLE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
SPDIF
2014/06/02
10
DDR_EXT
Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
R1201
DDR_EXT
R1202
1K
1%
DDR_EXT
1K
1%
CLose to DDR3
DDR_EXT
C1201
C1202
0.1uF
1000pF
A-MVREFDQ
+1.5V_DDR+1.5V_DDR
DDR_EXT
R1204
DDR_EXT
R1205
1K
1%
1K
1%
CLose to MAIN IC
DDR_EXT
DDR_EXT
C1213
C1214
0.1uF
1000pF
A-MVREFCA
+1.5V_DDR
Option : Ripple Check !!!
OPT
C1217
0.1uF
C1218
0.1uF
OPT
C1216
10uF
10V
OPT
C1219
+1.5V_DDR
OPT
OPT
OPT
C1221
OPT
C1222
1uF
1uF
C1220
1uF
1uF
C1223
OPT
OPT
C1224
0.1uF
1uF
DDR_1600_1G_NAN
IC1201-*1
NT5CB64M16FP-DH
EAN61859502
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12
T3
NC_6
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
DDR_1600_1G_SS
IC1201
K4B1G1646G-BCK0
EAN61836301
DDR_EXT
R1203
240 1%
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
+1.5V_DDR
A-MVREFCA
A-MVREFDQ
C1203 10uF 10V
C1204 0.1uF
C1205 0.1uF
C1206 0.1uF
C1207 0.1uF
C1208 0.1uF
C1209 0.1uF
C1210 0.1uF
C1211 0.1uF
C1212 0.1uF
A-MA14
DDR_1600_2G_SS
IC1201-*2
K4B2G1646Q-BCK0
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_7
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
N3
P7
P3
N2
P8
P2
R8
R2
T8
R3
L7
R7
N7
T3
M7
M2
N8
M3
J7
K7
K9
L2
K1
J3
K3
L3
T2
F3
G3
C7
B7
E7
D3
E3
F7
F2
F8
H3
H8
G2
H7
D7
C3
C8
C2
A7
A2
B8
A3
EAN61848803
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10/AP
A11
A12/BC
A13
NC_5
BA0
BA1
BA2
CK
CK
CKE
CS
ODT
RAS
CAS
WE
RESET
DQSL
DQSL
DQSU
DQSU
DML
DMU
DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7
DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
DDR_1600_2G_SK
IC1201-*3
H5TQ2G63FFR-PBC
EAN61829204
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
A10/AP
A12/BC
NC_5
RESET
DQSL
DQSL
DQSU
DQSU
DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7
DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
R7
A11
N7
T3
A13
M7
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
F3
G3
C7
B7
E7
DML
D3
DMU
E3
F7
F2
F8
H3
H8
G2
H7
D7
C3
C8
C2
A7
A2
B8
A3
A-MA0
A-MA1
A-MA2
A-MA3
A-MA4
A-MA5
A-MA6
A-MA7
A-MA8
A-MA9
A-MA10
A-MA11
A-MA12
A-MA13
A-MBA0
A-MBA1
A-MBA2
A-MCKE
A/B_DDR3_CS
A-MODT
A-MRASB
A-MCASB
A-MWEB
A-MRESETB
A-MDQSL
A-MDQSLB
A-MDQSU
A-MDQSUB
A-MDML
A-MDMU
A-MDQL0
A-MDQL1
A-MDQL2
A-MDQL3
A-MDQL4
A-MDQL5
A-MDQL6
A-MDQL7
A-MDQU0
A-MDQU1
A-MDQU2
A-MDQU3
A-MDQU4
A-MDQU5
A-MDQU6
A-MDQU7
DDR_EXT
R1207
DDR_EXT
R1208
56
1%
56
1%
DDR_EXT
R1206
10K
DDR_EXT
C1215
0.01uF
50V
+1.5V_DDR
A-MCK
A-MCKB
A-MA0
A-MA1
A-MA2
A-MA3
A-MA4
A-MA5
A-MA6
A-MA7
A-MA8
A-MA9
A-MA10
A-MA11
A-MA12
A-MA13
A-MA14
A-MBA0
A-MBA1
A-MBA2
A-MCK
A-MCKB
A-MCKE
A-MODT
A-MRASB
A-MCASB
A-MWEB
A-MRESETB
A/B_DDR3_CS
A-MDQSL
A-MDQSU
A-MDML
A-MDMU
A-MDQSLB
A-MDQSUB
A-MDQL0
A-MDQL1
A-MDQL2
A-MDQL3
A-MDQL4
A-MDQL5
A-MDQL6
A-MDQL7
A-MDQU0
A-MDQU1
A-MDQU2
A-MDQU3
A-MDQU4
A-MDQU5
A-MDQU6
A-MDQU7
R1209
240
1%
M1A_256M_UO4
LGE2134(256M)
E11
B_DDR3_A[0]
F12
B_DDR3_A[1]
D10
B_DDR3_A[2]
B10
B_DDR3_A[3]
E15
B_DDR3_A[4]
B11
B_DDR3_A[5]
F14
B_DDR3_A[6]
C11
B_DDR3_A[7]
D14
B_DDR3_A[8]
A12
B_DDR3_A[9]
F16
B_DDR3_A[10]
D13
B_DDR3_A[11]
D15
B_DDR3_A[12]
C12
B_DDR3_A[13]
E13
B_DDR3_A[14]
A9
B_DDR3_BA[0]
D16
B_DDR3_BA[1]
A10
B_DDR3_BA[2]
C13
B_DDR3_MCLK
B13
B_DDR3_MCLKZ
E17
B_DDR3_MCLKE
B8
B_DDR3_ODT
C8
B_DDR3_RASZ
B9
B_DDR3_CASZ
D11
B_DDR3_WEZ
F10
B_RESET
D12
B_DDR3_CS0
A19
B_DDR3_DQSL
B18
B_DDR3_DQSU
C16
B_DDR3_DQML
D21
B_DDR3_DQMU
C18
B_DDR3_DQSBL
C17
B_DDR3_DQSBU
A20
B_DDR3_DQL[0]
A16
B_DDR3_DQL[1]
C19
B_DDR3_DQL[2]
C15
B_DDR3_DQL[3]
C20
B_DDR3_DQL[4]
C14
B_DDR3_DQL[5]
B21
B_DDR3_DQL[6]
B15
B_DDR3_DQL[7]
F18
B_DDR3_DQU[0]
D19
B_DDR3_DQU[1]
D17
B_DDR3_DQU[2]
E21
B_DDR3_DQU[3]
E19
B_DDR3_DQU[4]
D20
B_DDR3_DQU[5]
D18
B_DDR3_DQU[6]
F20
B_DDR3_DQU[7]
E9
ZQ
IC101
M1A_128M_UO4
LGE2133(128M)
E11
B_DDR3_A[0]
F12
B_DDR3_A[1]
D10
B_DDR3_A[2]
B10
B_DDR3_A[3]
E15
B_DDR3_A[4]
B11
B_DDR3_A[5]
F14
B_DDR3_A[6]
C11
B_DDR3_A[7]
D14
B_DDR3_A[8]
A12
B_DDR3_A[9]
F16
B_DDR3_A[10]
D13
B_DDR3_A[11]
D15
B_DDR3_A[12]
C12
B_DDR3_A[13]
E13
B_DDR3_A[14]
A9
B_DDR3_BA[0]
D16
B_DDR3_BA[1]
A10
B_DDR3_BA[2]
C13
B_DDR3_MCLK
B13
B_DDR3_MCLKZ
E17
B_DDR3_MCLKE
B8
B_DDR3_ODT
C8
B_DDR3_RASZ
B9
B_DDR3_CASZ
D11
B_DDR3_WEZ
F10
B_RESET
D12
B_DDR3_CS0
A19
B_DDR3_DQSL
B18
B_DDR3_DQSU
C16
B_DDR3_DQML
D21
B_DDR3_DQMU
C18
B_DDR3_DQSBL
C17
B_DDR3_DQSBU
A20
B_DDR3_DQL[0]
A16
B_DDR3_DQL[1]
C19
B_DDR3_DQL[2]
C15
B_DDR3_DQL[3]
C20
B_DDR3_DQL[4]
C14
B_DDR3_DQL[5]
B21
B_DDR3_DQL[6]
B15
B_DDR3_DQL[7]
F18
B_DDR3_DQU[0]
D19
B_DDR3_DQU[1]
D17
B_DDR3_DQU[2]
E21
B_DDR3_DQU[3]
E19
B_DDR3_DQU[4]
D20
B_DDR3_DQU[5]
D18
B_DDR3_DQU[6]
F20
B_DDR3_DQU[7]
E9
ZQ
IC101-*1
M1A_256M_AVS+
LGE2136(256M)
E11
B_DDR3_A[0]
F12
B_DDR3_A[1]
D10
B_DDR3_A[2]
B10
B_DDR3_A[3]
E15
B_DDR3_A[4]
B11
B_DDR3_A[5]
F14
B_DDR3_A[6]
C11
B_DDR3_A[7]
D14
B_DDR3_A[8]
A12
B_DDR3_A[9]
F16
B_DDR3_A[10]
D13
B_DDR3_A[11]
D15
B_DDR3_A[12]
C12
B_DDR3_A[13]
E13
B_DDR3_A[14]
A9
B_DDR3_BA[0]
D16
B_DDR3_BA[1]
A10
B_DDR3_BA[2]
C13
B_DDR3_MCLK
B13
B_DDR3_MCLKZ
E17
B_DDR3_MCLKE
B8
B_DDR3_ODT
C8
B_DDR3_RASZ
B9
B_DDR3_CASZ
D11
B_DDR3_WEZ
F10
B_RESET
D12
B_DDR3_CS0
A19
B_DDR3_DQSL
B18
B_DDR3_DQSU
C16
B_DDR3_DQML
D21
B_DDR3_DQMU
C18
B_DDR3_DQSBL
C17
B_DDR3_DQSBU
A20
B_DDR3_DQL[0]
A16
B_DDR3_DQL[1]
C19
B_DDR3_DQL[2]
C15
B_DDR3_DQL[3]
C20
B_DDR3_DQL[4]
C14
B_DDR3_DQL[5]
B21
B_DDR3_DQL[6]
B15
B_DDR3_DQL[7]
F18
B_DDR3_DQU[0]
D19
B_DDR3_DQU[1]
D17
B_DDR3_DQU[2]
E21
B_DDR3_DQU[3]
E19
B_DDR3_DQU[4]
D20
B_DDR3_DQU[5]
D18
B_DDR3_DQU[6]
F20
B_DDR3_DQU[7]
E9
ZQ
IC101-*2
M1A_128M_AVS+
LGE2135(128M)
E11
B_DDR3_A[0]
F12
B_DDR3_A[1]
D10
B_DDR3_A[2]
B10
B_DDR3_A[3]
E15
B_DDR3_A[4]
B11
B_DDR3_A[5]
F14
B_DDR3_A[6]
C11
B_DDR3_A[7]
D14
B_DDR3_A[8]
A12
B_DDR3_A[9]
F16
B_DDR3_A[10]
D13
B_DDR3_A[11]
D15
B_DDR3_A[12]
C12
B_DDR3_A[13]
E13
B_DDR3_A[14]
A9
B_DDR3_BA[0]
D16
B_DDR3_BA[1]
A10
B_DDR3_BA[2]
C13
B_DDR3_MCLK
B13
B_DDR3_MCLKZ
E17
B_DDR3_MCLKE
B8
B_DDR3_ODT
C8
B_DDR3_RASZ
B9
B_DDR3_CASZ
D11
B_DDR3_WEZ
F10
B_RESET
D12
B_DDR3_CS0
A19
B_DDR3_DQSL
B18
B_DDR3_DQSU
C16
B_DDR3_DQML
D21
B_DDR3_DQMU
C18
B_DDR3_DQSBL
C17
B_DDR3_DQSBU
A20
B_DDR3_DQL[0]
A16
B_DDR3_DQL[1]
C19
B_DDR3_DQL[2]
C15
B_DDR3_DQL[3]
C20
B_DDR3_DQL[4]
C14
B_DDR3_DQL[5]
B21
B_DDR3_DQL[6]
B15
B_DDR3_DQL[7]
F18
B_DDR3_DQU[0]
D19
B_DDR3_DQU[1]
D17
B_DDR3_DQU[2]
E21
B_DDR3_DQU[3]
E19
B_DDR3_DQU[4]
D20
B_DDR3_DQU[5]
D18
B_DDR3_DQU[6]
F20
B_DDR3_DQU[7]
E9
ZQ
IC101-*3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
DDR
2014/06/13
12
Serial Flash for SPI boot
Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
/FLASH_WP
OPT
R1300
10K
+3.5V_ST
/SPI_CS
SPI_SDO
R1301
4.7K
OPT
WP#/SIO2
SPI_FLASH_MACRONIX
IC1300
MX25L8035EM2I-10G
CS#
1
SO/SIO1
2
3
GND
4
SPI_FLASH_WINBOND
IC1300-*1
W25Q80DVSSIG
CS
1
DO[IO1]
2
WP[IO2]
3
GND
4
8
7
6
5
8
7
6
5
VCC
NC/SIO3
SCLK
SI/SIO0
VCC
HOLD[IO3]
CLK
DI[IO0]
R1302
33
+3.5V_ST+3.5V_ST
C1300
0.1uF
16V
SPI_SCK
SPI_SDI
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
S_FLASH
140721
13
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