Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
3) Show the message "Copying files from memory"
4) Updating is staring.
* After downloading, have to adjust Tool
Option again.
1) Push "IN-START" key in service remote controller.
2) Select "Tool Option 1" and Push "OK" button.
3) Punch in the number. (Each model has their number.)
4) Completed selecting Tool option.
BLU
Tool
Tool
Tool
Tool
Tool
Model
32LF510B-
SB/D
43LF5100-
SA
49LF5100-
SA
Module
Type
option1
option2
option3
option4
LGDPOLA551418994044363849218
LGDPOLA556337074044363849218
LGDPOLA558337074044363849218
* RS-232C Connection Method
Connection : PCBA (USB Port) -> USB to Serial Adapter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
▪ Product name of USB to Serial Adapter is UC-232A.
※ Caution: LJ55H chassis support only UC-232A driver. (only
use this one. )
option5
Tool
option6
273
273
273
5) After updating is complete, The TV will restart automatically.
6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In this case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of
LED back light
■ Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
► The spec of color temperature and coordinate
ModelModeColor TempColor coordinateRemark
Cool (C50)13,000k
Medium (0)9,300k
All
Warm (W50)6,500k
► CA210 : CH 14, Test signal : Inner pattern (80IRE)
- Standard color coordinate and temperature using CA-1000 (by
H/R time)
▪ L15 LGD, INX Module
March to December & Global
Normal line
H/R Time(Min)
271270286289313329
10-2282 289 297308324348
23-5281 287 296306323346
36-9279 284 294303321343
410-19277 280 292299319339
520-35275 277 290296317336
636-49274 274 289293316333
750-79273 272 288291315331
880-119272 271 287290314330
9Over 120271 270 286289313329
x = 0.271 (±0.002)
y = 0.270 (±0.002)
x = 0.286 (±0.002)
y = 0.289 (±0.002)
x = 0.313 (±0.002)
y = 0.329 (±0.002)
CoolMediumWarm
xyxxyx
※ Test signal
- Inner pattern for W/B adjust
- External white pattern
(80IRE, 204gray)
▪ Gumi Winter table(
January to February - Gumi production of prospective models all
models except Cinema Screen
Normal line
CoolMediumWarm
H/R Time(Min)
10-2286 295 301314328354
23-5284 290 299309326349
36-9282 287 297306324346
410-19279 283 294302321342
520-35276 278 291297318337
636-49274 275 289294316334
750-79273 272 288291315331
880-119272 271 287290314330
9Over 120271 270 286289313329
▪
INX, AUO, Sharp, CSOT (13000K Cool the SPEC)
spec271270286289313329
target278280293299320339
xyxxyx
271270286289313329
coolmedwarm
xyxyxy
※ Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER-ON -> Enter
the mode of White-Balance, the pattern will come out.
▪ Aging chamber line
CoolMediumWarm
H/R Time(Min)
10-5280 285 294308319340
26-10276 280 290 303 315 335
311-20272 275 286 298 311 330
421-30269 272 283 295 308 327
531-40267 268 281 291 306 323
641-50266 265 280 288 305 320
751-80265 263 279 286 304 318
881-119264 261 278 284 303 316
9Over 120264 260 278 283 303 315
Only for training and service purposes
xyxxyx
271270285293313329
● Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
CoolMidWarmCoolMidWarm
R GainjgJajd00172192192192
G GainjhJbje00172192192192
B GainjiJcjf00192192172192
R Cut646464128
G Cut646464128
B Cut646464128
MIN
CENTER
(DEFAULT)
MAX
*Manual W/B process using adjusts Remote control.(TBD)
■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■Enter White Balance by pushing “►” key at “8. White Balance”.
5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu
8. White Balance, you can select one of 2 Test-pattern: ON,
OFF. Default is inner (ON). By selecting OFF, you can adjust
using RF signal in 206 Gray pattern.
※ CASE Cool
First adjust the coordinate far away from the target value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
How to adjust
1) If G gain is adjusted over 172 and R gain and B gain less
than 192 , Adjust is O.K.
2) If G gain is less than 172 , increase G gain by up to 172, and
then increase R gain and B gain same amount of increasing
G gain.
3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
■ For manual adjustment, it is also possible by the following
sequence.
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place it on the
center of LCD module within 10cm of the surface
3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-Balance
then press the cursor to the right (KEY►). When KEY(►) is
pressed 206 Gray internal pattern will be displayed.
4) Adjust Cool modes
(i). Fix the one of R/G/B gain to 192 (default data) and
decrease the others
(If G gain is adjusted over 172 and R and B gain less than
192, increase G gain to 192 and increase R gain and B gain
same amount of increasing G gain.)
(ii). If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain.
(iii). If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255 or
B gain is 255
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
▪ After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is
correctly same then unplug the AC cable. If it is not same, then
correct it same with BOM and unplug AC cable. For correct it to
the model’s module from factory JIG model.
▪ Push the “IN STOP KEY” after completing the function
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
FROM ADAPTOR 19V
JK400
KJA-DC-1-0032
4
4
2
Surge Protection
2
1
1
D471
20V
OPT
R493
120K
OPT
R492
120K
OPT
C492
10uF
25V
19V TO PANEL VCC(12V) DCDC CONVERTER
+19V
C472
C470
10uF
0.1uF
25V
25V
R470
100K
OPT
Q407
SSM3J332R
S
G
AAM
IN
SW
GND
+19V
D
MP2315GJ
1
2
3
4
OPT
C488
68uF
35V
IC403
NEW
3A
+19V to +3.5V_STANDBY
IC402
MP2315GJ
R471
AAM
C471
68uF
35V
8
7
6
5
C473
10uF
FB
VCC
EN/SYNC
BST
25V
39K
1/16W
1%
C474
0.1uF
25V
20130528 cJ.LIM
R475
68
C475
0.1uF
50V
GND
IN
SW
0.47uF
OPT
R476
47K
OPT
C477
1
2
NEW
3
3A
4
OPT
R489
10K
16V
CYNTEC
L470-*1
10uH
C478
0.1uF
25V
FB
8
VCC
7
EN/SYNC
6
BST
5
+3.5V_ST
OPT
R490
10K
R480
10K
TDK
L470
10uH
C480
10uF
20130528 cJ.LIM
C481
10uF
16V
16V
R478
100K
R479
R477
68
20K
C476
0.1uF
50V
RL_ON
POWER_ON/OFF_1
C483
C486
0.1uF
10uF
25V
16V
R481
56K
R48 2
R48 3
3.3 K
R48 4
C479
0.1uF
25V
11K
1%
1%
1K
1%
CYNTEC
L471-*1
4.7uH
TDK
L471
4.7uH
C482
C484
10uF
10uF
10V
10V
X5R => X7R
To improve CST Issue
2013.12.21 by GH.Song
+12V
OPT
ZD405
15V
C487
22uF
10V
R485
56K
C489
22uF
10V
C485
0.1uF
25V
R48 6
R48 7
1.2 K
R48 8
3.5V_ST POWER_DET
+3.5V_ST
R410
10K
+3.5V_ST
C400
0.1uF
16V
2K
1%
1%
1K
1%
5V
5.6B->5V
READY->APPLY
2013.08.07
D470
+12V to PANEL_VCC
UBW2012-121F
PANEL_CTL
L408
120OHM
OPT
C425
0.1uF
25V
R441
OPT
C490
1uF
10V
+12V
R442
10K
10K
B
R445
R446
120K
OPT
ZD408
33K
5V
C
E
POWER_DET
C427
0.22uF
25V
TR_NXP
Q403
MMBT3904(NXP)
Q405
SSM3J332R
S
B
PANEL_VCC
D
R451
R452
5.6K
5.6K
G
C
TR_KEC
Q403-*1
2N3904S
E
+3.5V_ST to +3.3V_Normal
+3.5V_ST
POWER_ON/OFF_1
R443
4.7K
R444
10K
B
R447
22K
R448
2.2K
C428
2.2uF
10V
C
TR_NXP
Q404
MMBT3904(NXP)
E
+3.5V_Normal to +1.5V_DDR
+3.3V_Normal
L409
BLM18PG121SN1D
C426
10uF
10V
1.3A
IC404
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
R449
1K
1/16W
1%
R450
200
1/16W
1%
BOOST_EN
R1
R2
FET_AOS
Q406-*1
AO3435
S
G
FET_TOSHIBA
Q406
SSM3J332R
S
G
C
B
E
L411
CB2012PK501T
R453
0
C431
10uF
10V
D
D
C429
0.1uF
16V
TR_KEC
Q404-*1
2N3904S
+1.5V_DDR
L410
BLM18PG121SN1D
C430
22uF
10V
BRAZIL_ESD
ZD403
2.5V
+3.3V_Normal
TVS_SEMTECH
ZD402
5V
TVS_KEC
ZD402-*1
Vout=1.25*(1+R2/R1)+Iadj*R2
+5V_Normal & +1.10V_VDDC
+3.3V_Normal
R403
10K
OPT
C403
4700pF
50V
USB1_CTL
Check the pull down
when AC Power On with HDD
USB1_CTL_Pull_Down
USB1_OCD
OPT
R473
30K
R472
3.3K
CB2012PK501T
+5V_Normal
R408
100K
L404
+12V
C405
10uF
25V
Vout=0.6(R1/R2)+0.6
TDK
L405
4.7uH
CYNTEC
R1
R411
4.7K
1%
R2
R413
5.1K
1%
50V
C420
3300pF
50V
CYNTEC
L406-*1
4.7uH
R41 4
OPT
OPT
C411
ZD407
82pF
5.1v
50V
C416
22pF
50V
C417
3300pF
50V
10K
R415
R416
5.1K
R417
100
1%
1%
39K
1%
ZD401
2.5V
R1
R2
C412
10uF
6.3V
C418
47pF
50V
+5V_Normal
C423
22uF
16V
C410
0.047uF
25V
C406
10uF
25V
C408
OPT
2200pF
50V
C409
OPT
2200pF
50V
R409
91K
C407
1uF
10V
SS2
EN1
EN2
ROSC/SYNC
SW_EN
NFAULT
+5V_USB
VIN123V7V24SS1
[EP]
22
1
THERMAL
25
2
3
IC400
SN1406035RGER
4
5
6
7
9
8
VIN2
SW_IN
SW_OUT
10
PGND2
LX2
BST120LX121PGND1
19
COMP1
18
FB1
17
AGND
16
RSET
15
FB2
14
COMP2
13
11
12
BST2
+5V_Normal
C432
1uF
16V
L405-*1
4.7uH
R422
15K
C419 22pF
R41 8
20K
TDK
C421
0.047uF
L406
4.7uH
25V
C491
470pF
50V
R491
5.1
Vout=0.6(R1/R2)+0.6
C413
22uF
10V
C424
22uF
16V
+1.10V_VDDC
C414
22uF
10V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5_ECI_M1A
POWER
150112
4
Page 19
TOTAL LED DRIVER BLOCK
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LED_DRIVER
150112L15.5_ECI_M1A
5
Page 20
USB
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
JK700
US-04A-VSD
5
OPT
C704
22uF
10V
+5V_USB
SIDE_USB1_DM
SIDE_USB1_DP
USB_HDD_CAP1_10uF
C700-*1
USB_HDD_CAP1_22uF
OPT
ZD700
SD05
1
2
3
4
5V
C701
OPT
OPT
C702
5pF
5pF
50V
50V
10uF
10V
C700
22uF
10V
USB_HDD_CAP2_10uF
C703-*1
10uF
10V
USB_HDD_CAP2_22uF
C703
22uF
10V
R700
2.2
R701
2.2
OPT
D700
RCLAMP0502BA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5_ECI_M1A
USB_S1
150112
7
Page 21
HDMI (REAR)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
5V_HDMI_2
SHIELDGND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
ESD_HDMI1_VARISTOR
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG59023302
JK1000
This GND Pattern should be very narrow
HDMI jack burnt problem improvement
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R1001
R1000
1.8K
VA1000
1K
5V_DET_HDMI_2
R1002
3.3K
ESD_HDMI1_VARISTOR
VA1001
ESD_HDMI1_CAP
VA1000-*1
1uF
10V
ESD_HDMI1_CAP
VA1001-*1
1uF
10V
AR1000
5.1
AR1001
5.1
MMBT3904(NXP)
ESD_HDMI1
VA1002
TR_NXP
Q1000
C
E
TR_KEC
Q1000-*1
2N3904S
B
C
B
E
ESD_HDMI1
VA1003
ESD_HDMI1_TMDS
IP4294CZ10-TBR
ESD_HDMI1_TMDS
IP4294CZ10-TBR
1
2
3
4
5
1
2
3
4
5
R1003
10K
R1004
10K
D1000
D1001
AR1002
100
1/16W
ESD_HDMI1
VA1004
10
9
8
7
6
10
9
8
7
6
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
CEC
HDMI_CEC
HDMI_DIODE_SUZHOU
D1002-*1
MMBD6100
A1
C
R1007
2.7K
+5V_Normal
R1008
2.7K
5V_HDMI_2
R1009
100
A2
HDMI_DIODE_KEC
A2CA1
KDS184
D1002
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE_S7
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5
2015/01/21
HDMI_R1S18
Page 22
DDR_EXT
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
DDR
2014/06/13
12
Page 23
Serial Flash for SPI boot
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
/FLASH_WP
OPT
R1300
10K
+3.5V_ST
/SPI_CS
SPI_SDO
R1301
4.7K
OPT
WP#/SIO2
SPI_FLASH_MACRONIX
IC1300
MX25L8035EM2I-10G
CS#
1
SO/SIO1
2
3
GND
4
SPI_FLASH_WINBOND
IC1300-*1
W25Q80DVSSIG
CS
1
DO[IO1]
2
WP[IO2]
3
GND
4
8
7
6
5
8
7
6
5
VCC
NC/SIO3
SCLK
SI/SIO0
VCC
HOLD[IO3]
CLK
DI[IO0]
R1302
33
+3.5V_ST+3.5V_ST
C1300
0.1uF
16V
SPI_SCK
SPI_SDI
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5_ECI_M1A
S_FLASH
140721
13
Page 24
Central and South Americatuner block
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.3V_TU
R1428
TU3901
TDJA-T101F(A)
1
2
3
4
5
6
7
8
9
SHIELD
SCL
SDA
B[+3.3V]
CVBS
IF_AGC
SIF
IF[N]
IF[P]
Close to Tuner
C1412
18pF
50V
C1414
18pF
50V
HALF_NIM/BRAZIL
C1404
0.1uF
16V
HALF_NIM/BRAZIL
R1405
R1427
33
33
HALF_NIM/BRAZIL
R1404
HALF_NIM/BRAZIL
10
R1403
10
1K
R1411
R1425
100
1K
should be guarded by ground
IF_AGC_MAIN
TU_SCL
TU_SDA
C1405
100pF
50V
IF_N_MSTAR
IF_P_MSTAR
+3.3V_TU
L1401
UBW2012-121F
C1408
0.1uF
16V
+3.3V_TU
CVBS
CVBS
R3732
R3735
220
220
E
CVBS_NXP
Q3701
MMBT3906(NXP)
B
C
OPT
R3731
0
SIF
C3726
0.1uF
16V
close to TUNER
B
TU_CVBS
C
CVBS_KEC
Q3701-*1
2N3906S-RTK
E
SIGN37000000
SIF
R3724
4.7K
OPT
R3726
0
+3.3V_TU
SIF
R3725
470
SIGN37000001
B
SIF
R3728
82
E
SIF_NXP
Q3700
MMBT3906(NXP)
C
TU_SIF
B
C
SIF_KEC
Q3700-*1
2N3906S-RTK
E
+3.3V_TU
C1418
22uF
10V
L1400
UBW2012-121F
C1419
0.1uF
16V
+3.3V_Normal
C1422
C1420
0.1uF
22uF
16V
10V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
TUNER_CSA
2014.08.11
14
Page 25
LVDS
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[51Pin LVDS Connector]
(For FHD 60Hz)
MO_FHD
P1800
SP14-11592-01-51Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
PANEL_VCC
C1800
0.1uF
25V
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
UBW2012-121F
OPT
AR1800
1/16W
L1801
PANEL_HD
C1801
10uF
25V
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
MO_HD
P1801
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
OPT
R1801
0
0
R1812
OPT
0
23
24
25
26
27
28
29
30
31
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
PANEL_HD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
LVDS
140613
18
Page 26
SCART_COMPONENT
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
COMPONENT
COMP
JK2601
PPJ245N2-01
[RD2]E-LUG
6E
[RD2]O-SPRING
5E
[RD2]CONTACT
4E
[WH]O-SPRING
5D
[RD1]CONTACT
4C
[RD1]O-SPRING
5C
[RD1]E-LUG-S
7C
[BL]O-SPRING
5B
[GN/YL]CONTACT
4A
[GN/YL]O-SPRING
5A
[GN/YL]E-LUG
6A
ESD_COMP_ZENER_ROHM
ESD_COMP_ZENER_ROHM
ESD_COMP_ZENER_ROHM
ESD_COMP_ZENER_ROHM
ZD2601-*1
ESD_COMP_ZENER_KEC
ZD2602-*1
ESD_COMP_ZENER_KEC
ZD2603-*1
ESD_COMP_ZENER_KEC
ZD2604-*1
ESD_COMP_ZENER_KEC
ZD2605-*1
ESD_COMP_ZENER_KEC
ZD2606-*1
ESD_COMP_ZENER_KEC
ZD2605
ZD2606
ZD2603
ZD2604
ESD_COMP_ZENER_ROHM
ESD_COMP_ZENER_ROHM
OPT
VA2601
5.6V
OPT
VA2602
5.6V
ESD_COMP
VA2603
5.5V
ESD_COMP
VA2604
5.5V
OPT
VA2605
5.6V
ZD2601
ZD2602
R2601
470K
COMP
R2602
470K
COMP
COMP
R2603
COMP
R2604
COMP
R2606
10K
COMP
ATV_330P
330pF
C2601
COMP
R2607
10K
ATV_330P
330pF
C2602
75
75
COMP
R2605
75
3216
R2608
12K
COMP
R2609
12K
COMP2_R_IN
COMP2_L_IN
COMP2_Pr+
COMP2_Pb+
COMP2_Y+/AV_CVBS_IN
+3.3V_Normal
+3.3V_Normal
COMP
R2611
10K
COMP
R2610
10K
OPT
VA2606
5.6V
OPT
C2603
0.1uF
16V
COMP
R2612
COMP
R2613
1K
1K
COMP2_DET
AV_CVBS_DET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5_ECI
COMPONENT
2015/02/27
26
Page 27
RS-232C 4PIN
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
RS-232C 4PIN
+3.5V_ST
PM_RXD
PM_TXD
AR4000
100
1/16W
MSTAR DEBUG 4PIN
RS232C_DEBUG_4P
VCC
PM_RXD
GND
RM_TXD
P4000
12507WS-04L
1
2
3
4
5
GND
JP_GND1
JP_GND2
JP_GND3
JP_GND4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
RS232C_MSTAR_DEBUG_4P
2014/05/22
40
Page 28
KEY1
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
KEY2
IR
+3.5V_ST
LED_R/BUZZ
+3.5V_ST
AR4601
10K
1/16W
C4601
0.1uF
R4606
100
OPT
C4604
0.1uF
16V
OPT
C4602
1000pF
50V
16V
IR
R4601
1.8K
+3.5V_ST
R4602
3.3K
C4605
100pF
50V
OPT
VR4602
ZD4601
OPT
5V
IR_6P
P4602
12507WR-06L
1
2
3
4
5
6
7
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5_CI_M1A
IR
2015/01/12
47
Page 29
NAND FLASH MEMORY
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LG-NonOS SB51_ExtSPI 3’b000 51boot from SPI
LG-OS HEMCU_ExtSPI 3’b001 MIPS boot from SPI
+3.5V_ST
22
22
PCM_A[0-7]
PCM_A[7]
PCM_A[6]
PCM_A[5]
PCM_A[4]
PCM_A[3]
PCM_A[2]
PCM_A[1]
PCM_A[0]
NAND_FLASH_1G_TOSHIBA_24n
TC58NVG0S3HTA00
NC_1
1
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
RY/BY
7
RE
8
CE
9
NC_7
10
NC_8
11
VCC_1
12
VSS_1
13
NC_9
14
NC_10
15
CLE
16
ALE
17
WE
18
WP
19
NC_11
20
NC_12
21
NC_13
22
NC_14
23
NC_15
24
EAN61508002
IC102-*2
OPT
R115
4.7K
R116
4.7K
EEPROM
BR24G256FJ-3
EAN62389502
A0
A1
A2
GND
OPT
R117
4.7K
R118
4.7K
NVRAM_RHOM
IC104
1
2
A0’h
3
4
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O8
44
I/O7
43
I/O6
42
I/O5
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O4
32
I/O3
31
I/O2
30
I/O1
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
R165
2.7K
R121
2.7K
LED_R/BUZZ
PM_LED
OPT
SPI_SDI
+3.3V_Normal
VCC
8
C105
0.1uF
WP
7
SCL
6
SDA
5
OPT
C104
8pF
OPT
C106
8pF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5_CI_M1A
MAIN1_DVB1
2015/01/12
Page 30
MODEL OPTION
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15.5_CI_M1A
MAIN2_DVB
150511
2
Page 31
AUDIO AMP(NTP7515)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Check RF signal cable (DVB satellite signal or not)
Check whether other equipments have problem or not.
(By connecting RF Cable at other equipment)
→ Set-Top-Box, Different maker TV etc
(If Power Off mode
is not displayed)
Check Adaptor
voltage
Y
N
Replace Main B/D
Replace Adaptor
Replace Adaptor
N
Y
☞A14
☞A13
Status Power off List Explanation
Normal
"POWEROFF_REMOTEKEY" Power off by REMOTE CONTROL
"POWEROFF_OFFTIMER" Power off by OFF TIMER
"POWEROFF_SLEEPTIMER" Power off by SLEEP TIMER
"POWEROFF_INSTOP" Power off by INSTOP KEY
"POWEROFF_AUTOOFF" Power off by AUTO OFF
"POWEROFF_ONTIMER" Power off by ON TIMER
"POWEROFF_RS232C" Power off by RS232C
"POWEROFF_RESREC" Power off by Reservated Record
"POWEROFF_RECEND" Power off by End of Recording
"POWEROFF_SWDOWN" Power off by S/W Download
"POWEROFF_UNKNOWN" Power off by unknown status except listed case
Abnormal
"POWEROFF_ABNORMAL1" Power off by abnormal status except CPU trouble
"POWEROFF_CPUABNORMAL" Power off by CPU Abnormal
※ When the nose is severe, replace the module
(For models with fix information, upgrade the S/W or
provide the description)
※If there is a “Tak Tak” noise from the cabinet, refer
to the KMS fix information and then proceed as
shown in the solution manual
(For models without any fix information, provide the
description)
or
※ Mechanical noise is a natural
phenomenon and apply the 1st level
description.
When the customer does not agree, apply
the process by stage.
1, 2. Check IR cable condition between IR & Main board
3. Check the ST-BY 3.5V on the terminal 4
4. When checking the Pre-Amp when the power is in ON condition, it is normal when the Analog
Tester needle moves slowly, and defective when it does not move at all.
Standard Repair Process Detail Technical Manual
①
②
③
④
P4600
< Sub Ass’y>
< Main Ass’y>
Error Symptom
D. Function Error, No Response in remote controller, Key error