Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
Page 4
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
LGE Display Division
Product Specification
LC12C Product Specification
LC12C
LG 전자
LCD TV Research Department 3
LG ELECTRONICS Inc.
GL1 Group
Page 7
LGE Display Division
LC12C Product Specification
- Contents -
1. Application range.
2. Specification
3. Test Method
4. Electrical Specification
5. Feature and Function
6. Safety and Regulation
7. Video
8. Digital Receiver (DTMB)
9. Digital Receiver (DVB-C)
10. Chroma & Brightness
11. Audio
12. Power
13. Standard Level For Input Signal(Video, Audio, Y/C, Component, RGB)
)
, P
14. Component Video Input (Y, P
B
R
15. RGB Input ( PC )
16. HDMI Input
17. 3D Mode – HDMI & USB
18. RGB/HV Control Signal In/Out Spec(D-sub15 pin Cable )
19. USB Input
20. Magic Remocon
21. WiFi
22. Screen Size(over scan spec)
23. The others
LG 전자
Page 8
LGE Display Division
LC12C Product Specification
24. Reliability
25. LED Control
26. SET factoring condition
27. Accessories & Mechanical Spec.
28. EEI
LG 전자
Page 9
LGE Display Division
LC12C Product Specification
1. Application range.
This spec sheet is applied to the LCD TV used LC12C chassis.
Chassis Basic Model Name Market Place Brand Remarks
LC12C 42/47/55LW6500-CA CHINA,HONG KONG (PAL/DTMB Market) LG
2. Specification
Each part is tested as below without special appointment.`
2.1 Temperature : 25±5℃ (77±9℉), CST : 40±5℃
2.2 Relative Humidity : 65±10%
2.3 Power Voltage : Standard input voltage (100~240V@ 50/60Hz)
Standard Voltage of each product is marked by models
2.4 Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM .
2.5 The receiver must be operated for about5 minutes prior to the adjustment
LG 전자
Page 10
LGE Display Division
3. Test method
3.1 Performance : LGE TV test method followed.
3.2 Demanded other specification
Safety : CE, IEC specification
EMC : CE, IEC
42/47/55LW6500-CA
Model Market Appliance Remarks
CHINA,HONG KONG
(PAL/DTMB Market)
LC12C Product Specification
Safety : IEC/EN60065
EMI : EN55013
EMS : EN55020
LG 전자
Page 11
LGE Display Division
LC12C Product Specification
4. Electrical Specification
4.1 Module Specification
4.1.1 General Specification
No Item Specification Measurement Result Remark
1 Display Screen Device 42,47,55 Wide Color Display Module LCD
9 USB 2EA EMF, DivX, For SVC (download) Side (2EA)
10 Remocon Code LG code
11 Remote control Wireless Remote Control Only Hong Kong
12 Local Key ▼PR▲, ◄VOL►, OK, MENU, INPUT, Power
13 Set Installation Wall Mount / Desk top
14 Main Power Key O Soft touch
15 Favorite O
16 AVL O
17 On/Off Timer O
18 Aspect Ratio 16:9/JustScan/Original/Full Wide/4:3/14:9/Zoom/Cinema Zoom1/
19 Picture Mode
20 Sound Mode Standard /Music /Cinema /Sport /Game
POWER, Navigation key (Up, Down ,Left ,Right ), OK, Numeric(0~9), P +/-, Δ
+/-,
RED KEY, GREEN KEY, YELLOW KEY, BLUE KEY
SUBTITLE,REC KEY,SIMPLINK
IP Auto Setting / IP Manual Setting
IP Address(0.0.0.0)
Subnet Mask(0.0.0.0)
Gateway(0,0,0,0)
DNS Server(0,0,0,0)
Setting/Test/Close
28
29
setup
(Network)
Customer
support
INPUT
RATIO
TV/RAD
Q.MENU
MENU
GUIDE
RETURN
INFO
AV MODE
Etc.
MARK Favorite List
MUTE Audio Mute
LIST
Q.VIEW
APP/* APP List MHP model
Network type Wired / Wireless
Network Setting
Network Status
Legal Notice
Software update
Picture test
Sound test
Signal test
Product service info.
LC12C Product Specification
LG 전자
Page 19
LGE Display Division
No Item Specification Measurement ResultRemarks
Network test
30 MENU(UI) Netcast
31 MENU(UI) APP.store
32 MENU(UI) PR guide
33 MENU(UI) PR list
34 MENU(UI) Recorded list
35 MENU(UI) My media
Ex MENU(UI) Bottom widget
LC12C Product Specification
Yahoo, netflix, accuwether,picasa, you tube
HOT(TBD), NEW(TBD)
1) In non-impressed condition, measure peak brightness displayable as much as possible LCD module.
2) Measuring instrument: CA-210 or a sort of Color Analyzer.
3) Pattern Generator : VG-828 or a sort of digital pattern generator (displayable Full White & 1/25 White Window pattern)
4) Measure condition
● Test pattern: in center, 1/5(H) * 1/5(V) of Window Pattern (white pattern in non-impressed condition)
● Environment condition : Dark room in the non outside light
● Video menu option condition
Signal Picture Mode Dynamic Contrast Dynamic Color
LC12C Product Specification
RF PAL Vivid Off Off
AV PAL Vivid Off Off
Component1080p Vivid Off Off
RGB 1920x1080 Vivid NA NA
HDMI DTV 1080p Vivid Off Off
5) Measurement
● Do heat-run LCD module at 30minutes in normal temperature (25℃) by using full white pattern of 100% signal level(255 gray level).
● Impress test pattern signal in 1/5(H) * 1/5(V) White Window of 100%(255Gray Level)
● Brightness tracking : Change brightness value in video menu. Check the luminance and chromaticity every 10 point while decrease brightness
value 100 to 0.
● Contrast tracking : Change contrast value in video menu. Check the luminance and chromaticity every 10 point while decrease contrast value 100 to 0.
● Measure the same condition in video signal /RGB signal.
LG 전자
Page 32
LGE Display Division
LC12C Product Specification
Average Brightness measure specification
1)
Impress 100%(255Gray Level) full white pattern at the same peak brightness measurement.
2)
Measure average brightness in 5 points.
Contrast ratio measure specification
1) Test display signal : 100%(255Gray)Full White Window signal & all Black Raster signal(0Gray)
2) Dark room measure condition : : Using touch type Color analyzer CA-210 Dark room in the non outside light
3) Bright room measure condition : In bright room of 150Lx illumination in the panel surface, locate a source of light on the above 45˚of the panel surface.
4) Measure method
● In standard test condition, impress 100%(255Gray)Full White Window Pattern signal .
measure center peak brightness degree Lw of white window
● Impress black Raster signal as contrast ratio measurement signal.
Measure black brightness degree Lb of central
Calculate the following numerical formula
Contrast ratio = Lw / Lb
LG 전자
Page 33
LGE Display Division
If it does not use Prior measurement, use generally simple test measurement.
Signal Picture Mode Dynamic Contrast Dynamic
RF PAL Vivid High High Off
AV PAL Vivid High High Off
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz)Proposed 3D input proposed mode
1. 1920*108053.95 / 54 23.98 / 24
2. 1280*720 89.9 / 90 59.94/60
3. 1280*720 75 50
4 1920*108067.5 60 148.5 HDTV 1080P Side by Side(half), Top and bottom
5 1920*108056.3 50 148.5 HDTV 1080P Side by Side(half), Top and bottom,
6 1280*720 45 60 74.25 HDTV 720P Side by Side(half), Top and Bottom
7 1280*720 37.5 50 74.25 HDTV 720P Side by Side(half), Top and Bottom
8 1920*108033.7 60 74.25 HDTV 1080i Side by Side(half), Top and Bottom
9 1920*108028.1 50 74.25 HDTV 1080i Side by Side(half), Top and Bottom
10 1920*108027 24 74.25 HDTV 1080P Side by Side(half), Top and Bottom
11 1920*108033.7 30 89.1 HDTV 1080P Side by Side(half), Top and Bottom
LC12C Product Specification
148.35/148.5 HDTV 1080P Frame packing
148.35/148.5 HDTV 720P Frame packing
148.5 HDTV 720P Frame packing
17-2 HDMI Input(1.3)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)Proposed 3D input proposed mode
1 1280*720 45.00 60.00 74.25 HDTV 720P Side by Side, Top & Bottom
2 1280*720 37.500 50 74.25 HDTV 720P Side by Side, Top & Bottom
3 1920*1080 33.75 60.00 74.25 HDTV 1080I Side by Side, Top & Bottom
4 1920*1080 28.125 50.00 74.25 HDTV 1080I Side by Side, Top & Bottom
5 1920*1080 27.00 24.00 74.25 HDTV 1080P Side by Side, Top & Bottom, Checkerboard
6 1920*1080 33.75 30.00 74.25 HDTV 1080P Side by Side, Top & Bottom, Checkerboard
7 1920*1080 67.50 60.00 148.5 HDTV 1080P
8 1920*1080 56.250 50 148.5 HDTV 1080P
17-3 RF 3D Input(DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode
Side by Side, Top & Bottom, Checkerboard
Single Frame Sequential
Side by Side, Top & Bottom, Checkerboard
Single Frame Sequential
LG 전자
Page 44
LGE Display Division
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode
1 1280*720 37.500 50 74.25 HDTV 720P Side by Side, Top & Bottom
2 1920*1080 28.125 50 74.25 HDTV 1080I Side by Side, Top & Bottom
LC12C Product Specification
17-4 USB Input
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
Side by Side
1 1920*1080 33.75 30.000 74.25
Top & Bottom
Checkerboard
HDTV 1080P
17-5 3D Input mode
No Side by Side Top & Bottom Checkerboard
1
RL
Single Frame
Sequential
R
L
Frame Packing
17-6. HDMI EDID Data
* HDMI EDID DATA:
Refer to adjust specification.
18. RGB/HV Control Signal In/Out Spec (D-sub15 pin Cable )
LG 전자
Page 45
LGE Display Division
No Pin Name Min Typ Max Unit Spec. Remarks
1 R 0.65 0.7 0.75 Vpp 75Ohm
2 G 0.65 0.7 0.75 Vpp 75Ohm
3 B 0.65 0.7 0.75 Vpp 75Ohm
4 NC
5 ID_DSUBN3 5 5.5 Vdc D-sub Enable
6 GND Case Common GND
7 GND Case Common GND
8 GND Case Common GND
9 NC
10 GND Case Common GND
11 NC
12 SDA 3.0 4.5 5.5 Vdc
13 H_SYNC 3.0 5.0 5.5 Vdc
14 V_SYNC 3.0 5.0 5.5 Vdc
15 SCL 3.0 4.5 5.5 Vdc
LC12C Product Specification
19. USB Input
LG 전자
Page 46
LGE Display Division
LC12C Product Specification
19.1 PHOTO/MUSIC
19.1.1 2D Mode
No Extension Item Profile MeasurementResult Remark
SOF0 : baseline
JPEG,
1 PHOTO
2 MUSIC MP3
JPG,
JPE
Support File type
Picture Size
Bit rate 32kbps~320kbps
Sample freq. 32kHz~48kHz
Support
SOF1 : Extend Sequential
SOF2 : Progressive
Min : 64 * 64
Max : - Normal type : 15360(W)*8640(H)
- Progressive type : 1920(W) * 1440(H)
MPEG1, MPEG2, MPEG2.5
Layer2, Layer3
LG 전자
Page 47
LGE Display Division
LC12C Product Specification
19.1.2 3D Mode
No Extension Item Profile MeasurementResult Remark
Support File type MPO
1 PHOTO MPO
2 MUSIC MP3
Picture Size
Bit rate 32kbps~320kbps
Sample freq. 32kHz~48kHz
Support
1. 4:3 size : 3,648 x 2,736, 2,592 x 1,944
2,048 x 1,536
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
CI_ADDR[8]:
0: RESETOUTb (in On/Off only) stay asserted until software releases them.
1: Fix amount of delay for de-assertion on RESETOUTb (in On/IOff only) at end of RESETb pulse (O)
NAND_DATA[3]:
0: MIPS will boot from external flash (O)
1: MIPS will boot from ROM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Run Along COMP_Y_IN,COMP_Pr_IN,COMP_Pb_IN/SC R,G,B Trace
INCM_R
INCM_G
INCM_B
INCM_VID_COMP1
INCM_VID_AV2
INCM_TUNER
INCM_VID_AV1
INCM_VID_SC/COMP2
BCM35230_with_CAP_220pF
IC101-*1
LGE35230
B6
BCM_CAP
VI_R
A6
VI_INCM_R
C7
VI_G
A7
VI_INCM_G
B7
VI_B
C8
VI_INCM_B
C13
HSYNC_IN
A13
VSYNC_IN
C9
VI_Y1
A9
VI_PR1
B9
VI_PB1
B8
VI_INCM_COMP1
C11
VI_SC_R1
A10
VI_SC_G1
B10
VI_SC_B1
C10
VI_INCM_SC1
D10
VI_FB_1/GPIO
F13
VI_FS1
A12
VI_SC_R2
C12
VI_SC_G2
B12
VI_SC_B2
B11
VI_INCM_SC2
E12
VI_FB_2/GPIO
E14
VI_FS2
E15
VI_L1
F17
VI_C1_1
E16
VI_INCM_LC1_1
F14
VI_C1_2
E11
VI_INCM_LC1_2
C18
VI_CVBS1
B18
VI_INCM_CVBS1
A18
VI_CVBS2
C19
VI_INCM_CVBS2
A19
VI_CVBS3
B19
VI_INCM_CVBS3
C20
VI_CVBS4
B20
VI_INCM_CVBS4
E19
VI_SIF1_1
D19
VI_INCM_SIF1_1
E10
VI_SIF1_2
F11
VI_INCM_SIF1_2
SCL3_3.3V
SDA3_3.3V
+3.3V_Normal
R302
R301
1.2K
1.2K
C301
33pF
50V
PHONE JACK
INCM_AUD_SC/COMP2
M_REMOTE_TX
C302
33pF
50V
PC_L_IN
PC_R_IN
AV1_L_IN
AV1_R_IN
INCM_AUD_AV1
AV2_L_IN
AV2_R_IN
INCM_AUD_AV2
SC/COMP2_L_IN
SC/COMP2_R_IN
C3051uF 10V
C3061uF 10V
C3071uF 10V
C3081uF 10V
C3091uF 10V
C3101uF 10V
C3111uF 10V
C3121uF 10V
C3131uF 10V
C3141uF 10V
C3151uF 10V
C3161uF 10V
NON_BCM_CAP
SPDIF_INC_P
SPDIF_INC_N
SPDIF_IND_P
SPDIF_IND_N
I2SSCK_IN/GPIO
I2SWS_IN
I2SSD_IN/GPIO
AADC_LINE_L1
AADC_LINE_R1
AADC_INCM1
AADC_LINE_L2
AADC_LINE_R2
AADC_INCM2
AADC_LINE_L3
AADC_LINE_R3
AADC_INCM3
AADC_LINE_L4
AADC_LINE_R4
AADC_INCM4
AADC_LINE_L5
AADC_LINE_R5
AADC_INCM5
AADC_LINE_L6
AADC_LINE_R6
AADC_INCM6
AADC_LINE_L7
AADC_LINE_R7
AADC_INCM7
IC101
I2SSCK_OUTA/GPIO
I2SWS_OUTA/GPIO
I2SSD_OUTA0/GPIO
I2SSOSCK_OUTA/GPIO
I2SSD_OUTA1/GPIO
I2SSD_OUTA2/GPIO
I2SSCK_OUTC/GPIO
I2SWS_OUTC/GPIO
I2SSD_OUTC/GPIO
I2SSOSCK_OUTC/GPIO
I2SSCK_OUTD/GPIO
I2SWS_OUTD/GPIO
I2SSD_OUTD/GPIO
I2SSOSCK_OUTD/GPIO
SPDIF_OUTA/GPIO
LGE35230(BCM35230KFSBG)
B15
C15
C14
B14
G4
F4
G5
C25
B24
A24
E22
E23
D23
C24
C23
B23
E21
D21
D22
B22
C22
A22
F21
D20
E20
A21
C21
B21
AUDMUTE_0/GPIO
AUDMUTE_1
ADAC_AL_N
ADAC_AL_P
ADAC_AR_N
ADAC_AR_P
ADAC_CL_N
ADAC_CL_P
ADAC_CR_N
ADAC_CR_P
ADAC_DL_N
ADAC_DL_P
ADAC_DR_N
ADAC_DR_P
AF8
AF9
AG9
AC9
AD8
AD9
E2
F2
E3
F3
G2
G3
G1
H1
B13
AG8
E13
C28
C27
D28
D27
C26
A27
B27
B28
B25
A25
A26
B26
R326100
R327100
R328100
R329100
TU_RESET_SUB
HP_DET
AV1_CVBS_DET
TU_RESET
SC_RE1
SC_RE2INCM_AUD_PC
/RST_HUB
S2_RESET
SPDIF_OUT
HP_LOUT_N
HP_LOUT_P
HP_ROUT_N
HP_ROUT_P
SCART1_Lout_N
SCART1_Lout_P
SCART1_Rout_N
SCART1_Rout_P
C337
22pF
OPT
C338
22pF
OPT
C339
22pF
OPT
C340
33pF
OPT
AUD_SCK
AUD_LRCK
AUD_LRCH
AUD_MASTER_CLK
Near
Near
Near
Near
Near
JK1102
JK1103
JK2501
JK1104
JK801
TU2101/2
TU2201/2/3
R3210
R3220
R3230
R3240
AUDIO INCM
Route Between AV1_L_IN & AV1_R_IN Trace
Route Between SC/COMP2_L_IN & SC/COMP2_R_IN Trace
Route Between AV2_L_IN & AV2_R_IN Trace
Route Between PC_L_IN & PC_R_IN Trace
Route Along With TUNER_SIF_IF_N
INCM_AUD_AV1
INCM_AUD_SC/COMP2
INCM_AUD_AV2
INCM_AUD_PC
INCM_SIF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
MICOM
6
50
Page 96
BODY_SHIELD
20
EAG62611201
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
ARC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_1
R730
3.6K
OPT
VR703
10V
OPT
CEC_REMOTE
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
R737
0
DUAL COMPONENT
D707,D708
D713
D710,D711
D713
R754
27K
BODY_SHIELD
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_4
R735
3.6K
OPT
VR707
10V
OPT
CEC_REMOTE
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
R727
0
R729
1K
OPT
HDMI_HPD_4
* HDMI CEC
BAT54_SUZHO
CEC_REMOTE
VR708
10V
OPT
C717
OPT
0.1uF
16V
OPT
DDC_SDA_4
DDC_SCL_4
GND
20
EAG62611201
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
R77 5
150
R77 6
63. 4
R728
1K
OPT
HDMI_HPD_1
HDMI_ARC
VR706
10V
OPT
C714
OPT
0.1uF
16V
OPT
DDC_SDA_1
DDC_SCL_1
ARC
C730
0.1uF
1ST : 0DD184009AA 2ND : 0DSIH00028A
1ST : T-BAT54_SUZHO, 2ND : 0DSON00138A
+3.5V_ST
G
SBD
Q710
BSS83
R741
120K
HDMI_CEC
+3.3V_Normal+3.3V_HDMI
L701
BLM18PG121SN1D
C720
0.1uF
16V
C718
10uF
C719
10uF
JK703
RSD-105156-100
BODY_SHIELD
20
EAG62611201
JK701
RSD-105156-100
BODY_SHIELD
20
EAG62611201
JK702
RSD-105156-100
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
19
18
17
16
15
14
13
12
11
10
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
HP_DET
GND
DDC_DATA
5V_HDMI_2
R740
3.6K
OPT
5V_HDMI_3
R739
3.6K
OPT
VR701
10V
OPT
VR702
10V
OPT
R725
0
R731
0
HDMI1
R736
1K
OPT
HDMI_HPD_2
CEC_REMOTE
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
VR704
10V
OPT
C715
OPT
0.1uF
16V
OPT
DDC_SDA_2
DDC_SCL_2
HDMI2
R726
1K
OPT
HDMI_HPD_3
CEC_REMOTE
CK-_HDMI3
CK+_HDMI3
D0-_HDMI3
D0+_HDMI3
D1-_HDMI3
D1+_HDMI3
D2-_HDMI3
D2+_HDMI3
VR705
10V
OPT
C716
OPT
0.1uF
16V
OPT
DDC_SDA_3
DDC_SCL_3
RSD-105156-100
JK704
+5V_Normal
D707
R713
4.7K
+5V_Normal
D708
R714
4.7K
5V_HDMI_1
A1CA2
5V_HDMI_3
A1CA2
R715
4.7K
R716
4.7K
HDMI3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
2010.10.21
8COMMON JACK
58
Page 98
Q901,Q902,Q903
Q904,Q905,Q906
D903,D904
D905,D906
DUAL COMPONENT
1ST : 0TRIY80001A 2ND : 0TR387500AA
1ST : EAH42720601, 2ND : EAH60994401
IR & KEY
IR
Q901
2SC3052
+3.5V_ST
R903
47K
R902
0
+3.5V_ST
KEY1
KEY2
3.5V
3.3V
S/T_SCL
ST_SDA
GND
GND
IR
GND
GND
IR_15P
P901
12507WR-15L
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
.
IR_12P
P902
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
EEPROM_SCL
EEPROM_SDA
LED_B/LOGO
LED_R/BUZZ
C911
100pF
50V
R933
100
R934
100
R9281.5K
D907
5.6V
AMOTECH
LED_R/BUZZ
D903
CDS3C05HDMI1
5.6V
D904
CDS3C05HDMI1
5.6V
D905
CDS3C05HDMI1
5.6V
D906
CDS3C05HDMI1
5.6V
R929
1.5K
LED_B/LG_LOGO
+3.3V_Normal
BLM18PG121SN1D
16V
EEPROM_SCL
EEPROM_SDA
L902
C913
0.1uF
16V
ESD_ATSC
R920
R919
10K
10K
1%
1%
R915
100
KEY1
R916
+3.5V_ST
R908
47K
COMMERCIAL_EU
Q903
2SC3052
COMMERCIAL_EU
WIRELESS
Q904
2SC3052
WIRELESS
+3.5V_ST
R909
3.3K
OPT
+3.5V_ST
R911
47K
C
B
E
COMMERCIAL_EU
COMMERCIAL_US
R910
0
+3.5V_ST
R912
47K
C
B
E
R905
47K
R904
C
10K
B
E
OPT
Q902
2SC3052
C
B
E
COMMERCIAL
R906
COMMERCIAL
22
IR_OUT
WIRELESS
R907
WIRELESS
22
IR_PASS
KEY2
R913
10K
R914
10K
WIRELESS
R917
COMMERCIAL
Q905
2SC3052
COMMERCIAL
R918
WIRELESS
Q906
2SC3052
WIRELESS
100
+3.5V_ST
47K
+3.5V_ST
47K
C
E
C
E
47K
B
COMMERCIAL
47K
B
WIRELESS
R921
R922
+3.5V_ST
C901
0.1uF
C902
0.1uF
OPT
BLM18PG121SN1D
16V
L901
S/T_SCL
S/T_SDA
C903
0.1uF
C904
0.1uF
D901
5.6V
AMOTECH
16V
OPT
Zener Diode is
close to wafer
C905
1000pF
50V
R935
100
R936
100
D902
5.6V
AMOTECH
ESD_ATSC
C912
0.1uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
IR/KEY
9
50
Page 99
WIRELESS READY MODEL
D1001,D1002
Q1001
Q1002
DUAL COMPONENT
1ST : EAH42720601 2ND : EAH60994401
1ST : EBK61012601, 2ND : 0TRDI80002A
1ST : EBK60752501, 2ND : EBK61011501
Wireless power
+24V
R1002
22K
WIRELESS
R1003
2.2K
WIRELESS
WIRELESS_PWR_EN
R1001
10K
WIRELESS
B
C1002
2.2uF
WIRELESS
Q1002
AO3407A
WIRELESS
C
Q1001
MMBT3904(NXP)
WIRELESS
E
JK1001
KJA-PH-3-0168
DETECT
INTERRUPT
GND_1
RESET
GND_2
I2C_SCL
I2C_SDA
GND_3
UART_RX
UART_TX
GND_4
GND_5
IR
WIRELESS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20GND_6
21
SHIELD
VCC(24V/20V/17V)_1
VCC(24V/20V/17V)_2
VCC(24V/20V/17V)_3
VCC(24V/20V/17V)_4
VCC(24V/20V/17V)_1
VCC(24V/20V/17V)_1
+3.3V_Normal
S
G
D
L1001
MLB-201209-0120P-N2
WIRELESS
C1004
10uF
35V
WIRELESS
WIRELESS_DET
WIRELESS_SCL
WIRELESS_SDA
IR_PASS
R1008
WIRELESS
R1007 1K
WIRELESS
D1001
CDS3C05HDMI1
WIRELESS
10K
5.6V
WIRELESS
D1002
5.6V
CDS3C05HDMI1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Wireless I2C connection with I2C_1
Address : 0X20
WIRELESS_SCL
WIRELESS_SDA
R100533
WIRELESS
R100633
WIRELESS
SCL2_3.3V
SDA2_3.3V
BCM35230
10
50WIRELESS
Page 100
CVBS 1 PHONE JACK
D1105
D1107
5.6V
5.6V
ZD1115
5.1V
ZD1116
5.1V
D1108
5.6V
R1110
JK1102
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
COMPONENT 1 PHONE JACK
D1101
JK1101
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
5.6V
ZD1117
5.1V
ZD1110
5.1V
ZD1111
5.1V
ZD1112
5.1V
ZD1113
5.1V
ZD1114
5.1V
R1109
75
1%
470K
R1111
470K
+3.3V_Normal
R1105
2.7K
R1106
75
1%
R1107
75
1%
R1108
75
1%
+3.3V_Normal
R1112
2.7K
C1106
47pF
50V
C1107
560pF
50V
C1108
560pF
50V
R1137
10
R1138
10
R1139
10
R1143
22
R1144
22
R1113
1K
R1136
10
R1114
1K
L1110
CM2012FR27KT
C1102
27pF
50V
L1111
CM2012FR27KT
C1103
27pF
50V
L1112
CM2012FR27KT
C1104
27pF
50V
FOR EMI
C1109
560pF
50V
C1110
560pF
50V
C1125
27pF
50V
C1126
27pF
50V
C1127
27pF
50V
COMP1_DET
COMP1_Y
COMP1_Pb
COMP1_Pr
AV1_CVBS_DET
AV1_CVBS_IN
AV1_L_IN
AV1_R_IN
JACK_PACK
JK1105
PPJ238-01
[RD1]E-LUG
6C
[RD1]O-SPRING
5C
[RD1]CONTACT
4C
[WH1]O-SPRING
5B
[YL1]CONTACT
4A
[YL1]O-SPRING
5A
[YL1]E-LUG
6A
[RD2]E-LUG
6H
[RD2]O-SPRING_2
5H
[RD2]CONTACT
4H
[WH2]O-SPRING
5G
[RD2]O-SPRING_1
5F
[RD2]E-LUG-S
7F
[BL2]O-SPRING
5E
[BL2]E-LUG-S
7E
[GN2]CONTACT
4D
[GN2]O-SPRING
5D
[GN2]E-LUG
6D
CVBS2 REAR JACK
JK1104
PPJ233-01
AV2_JACK
[RD]E-LUG
5C
[RD]O-SPRING
4C
[RD]CONTACT
3C
[WH]C-LUG
4B
[YL]CONTACT
3A
[YL]O-SPRING
4A
[YL]E-LUG
5A
COMP2 REAR JACK
COMP2
COMP2
COMP2
COMP2
COMP2
COMP2
ZD1103
5.1V
ZD1104
5.1V
ZD1105
5.1V
ZD1106
5.1V
ZD1107
5.1V
ZD1108
5.1V
AV2
R1141
22
D1109
AMOTECH
5.6V
AV2
D1110
AMOTECH
5.6V
AV2
ZD1101
AV2
5.1V
ZD1102
AV2
5.1V
D1111
AV2
5.6V
COMP2
R1119
0
COMP2
R1124
75
COMP2
R1120
0
COMP2
R1125
75
COMP2
R1121
0
COMP2
R1126
75
D1112
5.6V
COMP2
D1113
5.6V
COMP2
COMP2
D1114
5.6V
AV2
10
10
10
AV2
AV2
COMP2
COMP2
COMP2
R1116
470K
R1117
470K
R1118
75
R1133
R1134
R1135
+3.3V_Normal
+3.3V_Normal
R1128
2.7K
AV2
COMP2
R1122
470K
COMP2
R1123
470K
COMP2_Pr
COMP2_Pb
COMP2_Y
COMP2
R1127
2.7K
C1118
560pF
50V
AV2
C1119
560pF
50V
AV2
C1120
47pF
50V
AV2
BLM18PG121SN1D
C1113
560pF
50V
COMP2
BLM18PG121SN1D
COMP2
C1114
560pF
50V
COMP2_Pr
COMP2_Pb
COMP2_Y
COMP2
R11301K
COMP2
COMP2
R1142
22
R1129
1K
AV2
L1103
L1104
C1123
560pF
50V
C1121
560pF
50V
COMP2
COMP2
C1122
560pF
50V
CM2012FR27KT
C1115
27pF
50V
CM2012FR27KT
C1116
27pF
50V
CM2012FR27KT
C1117
27pF
50V
L1109
L1108
L1107
FOR EMI
AV2
C1124
560pF
50V
AV2
COMP2
R1131
22
COMP2
R1132
22
AV2
R1140
10
SC/COMP2_R_IN
SC/COMP2_L_IN
SC_R/COMP2_Pr
C1128
27pF
50V
SC_B/COMP2_Pb
C1129
27pF
50V
SC_G/COMP2_Y
C1130
27pF
50V
SC_DET/COMP2_DET
AV2
AV2_R_IN
AV2_L_IN
AV2_CVBS_IN
AV2_CVBS_DET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
COMP/AV11
50
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