LG 42LN5460 Schematic

Internal Use Only
LED TV
SERVICE MANUAL
CHASSIS : LJ36B
MODEL : 42LN5460 42LN5460-SM
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL67711911 (1309-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION .............................................................. 10
BLOCK DIAGRAM .................................................................................. 19
EXPLODED VIEW .................................................................................. 20
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent poten­tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electri­cally shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This spec sheet is applied all of the 32”, 42”, 47”, 50” LED TV with LJ31B/LJ36B chassis.
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage Standard input voltage (100~240V@ 50/60Hz) * Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC: CE, IEC
4. General Specification
No Item Specication Measurement Result Remark
1. Receiving System 1) SBTVD / NTSC / PAL-M / PAL-N
2. Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) CATV : 01~135
3. Input Voltage 1) AC 100 ~ 240V 50/60Hz
4. Market Central and South AMERICA
5. Screen Size 32 inch Wide (1366 × 768) 32LN540B-SH/SA 32LA613B-SB 32LN520B-SA 32LN536B-SI 32LN546B-SM
32 inch Wide (1920 × 1080) 32LN5400-SB/SA
39 inch Wide (1920 × 1080) 39LN5400-SB/SA
42 inch Wide (1920 × 1080) 42LN5400-SB/SA
42LA6130-SB 42LN5200-SA 42LN5460-SM
47 inch Wide (1920 × 1080) 47LN5400-SB/SA
47LA6130-SB 47LM5460-SM
50 inch Wide (1920 × 1080) 50LN5400-SB/SA
50 inch Wide (1920 × 1080) 55LN5400-SB/SA
6. Aspect Ratio 16:9
7. Tuning System FS
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
No Item Specication Measurement Result Remark
8. Module LC320DXE-SFR5 HD, 60Hz LGD 32LN520B-SA
HC320DXN-SLFG1 HD, 60Hz LGD 32LN536B-SI
HC320DXN-SLFA1 HD, 60Hz LGD 32LN546B-SM
LC320DXE-SFR1 HD, 60Hz LGD 32LN540B-SH/SA
LC320DUE-SFR1 FHD, 60Hz LGD 32LN5400-SB/SA
HC390DUN-VCFP1 FHD, 60Hz CMI 39LN5400-SB/SA
T390HVN02.2 FHD, 60Hz AUO 39LN5400-SB/SA
LC420DUE-SFR5 FHD, 60Hz LGD 42LN5200-SA
HC420DUN-SLFA1 FHD, 60Hz LGD 42LN5460-SM
LC420DUE-SFR1 FHD, 60Hz LGD 42LN5400-SB/SA
T420HVN05.0 FHD, 60Hz AUO 42LN5400-SB/SA
LC470DUE-SFR1 FHD, 60Hz LGD 47LN5400-SB/SA
FHD, 60Hz LGD 47LN5460-SM
LC500DUE-SFR2 FHD, 60Hz LGD 50LN5400-SB/SA
LC550DUJ-SEE1 FHD, 60Hz LGD 55LN5400-SB/SA
LC320DXE-SFU2 HD, 60Hz LGD 32LA613B-SB
LC420DUE-SFU2 FHD, 60Hz LGD 42LA6130-SB
LC470DUE-SFU2 FHD, 60Hz LGD 47LA6130-SB
9. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. External Input Support Format
5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*576 15.625 50.000 13.5 SDTV 576I
2. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
3. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
4. 720*480 31.50 60 27.027 SDTV 480P
5. 720*480 31.47 59.94 27.0 SDTV 480P
6. 720*576 31.250 50.000 27.000 SDTV 576P
7. 1280*720 37.500 50.000 74.25 HDTV 720P
8. 1280*720 45.00 60.00 74.25 HDTV 720P
9. 1280*720 44.96 59.94 74.176 HDTV 720P
10. 1920*1080 28.125 50.00 74.250 HDTV 1080I
11. 1920*1080 33.75 60.00 74.25 HDTV 1080I
12. 1920*1080 33.72 59.94 74.176 HDTV 1080I
13. 1920*1080 56.250 50.00 148.50 HDTV 1080P
14. 1920*1080 67.500 60.00 148.50 HDTV 1080P
15. 1920*1080 67.432 59.939 148.352 HDTV 1080P
16. 1920*1080 27.000 24.000 74.25 HDTV 1080P
17. 1920*1080 26.97 23.976 74.176 HDTV 1080P
18. 1920*1080 33.75 30.000 74.25 HDTV 1080P
19. 1920*1080 33.71 29.97 74.176 HDTV 1080P
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.2. HDMI Input (PC/DTV)
*HDMI PC support only Rear HDMI Input *If use DVI to HDMI cable for PC, you have to use external SPK for PC audio sound.
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC DDC
1. 640*350 31.468 70.09 25.17 EGA X
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4. 800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1152*864 54.348 60.053 80.00 VESA O
7. 1360*768 47.712 60.015 85.50 VESA (WXGA) O
8. 1280*1024(FHD Only) 63.981 60.02 108.00 VESA (SXGA) O
9. 1920*1080(FHD Only) 67.5 60 148.5 HDTV 1080P O
DTV
1. 720*480 31.469 59.940 27.000 SDTV 480P
2. 720*480 31.500 60.000 27.027 SDTV 480P
3. 720*576 31.250 50.000 27.000 SDTV 576P
4. 1280*720 37.500 50.000 74.25 HDTV 720P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 28.125 50.000 74.25 HDTV 1080I
8. 1920*1080 33.75 60.00 74.25 HDTV 1080I
9. 1920*1080 33.72 59.94 74.176 HDTV 1080I
10. 1920*1080 56.250 50.000 148.50 HDTV 1080P
11. 1920*1080 67.500 60.00 148.50 HDTV 1080P
12. 1920*1080 67.432 59.94 148.352 HDTV 1080P
13. 1920*1080 27.000 24.000 74.25 HDTV 1080P
14. 1920*1080 26.97 23.976 74.176 HDTV 1080P
15. 1920*1080 33.75 30.00 74.25 HDTV 1080P
16. 1920*1080 33.71 29.97 74.176 HDTV 1080P
HDMI Monitor Range Limits Min Vertical Freq - 58 Hz Max Vertical Freq - 62 Hz Min Horiz. Freq - 30 kHz Max Horiz. Freq - 83 kHz Pixel Clock - 160 MHz
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
(1)
(2
Please Check the Speed
To use speed between
from 200KHz to 400KHz
(4)
(5)
(6)
(7)...........OK
1. Application
This spec sheet is applied all of the LCD TV with LJ31B, LJ36B, LJ36M chassis.
2. Designation
(1) Th e adju stment is ac cordi ng to the order which is
designated and which must be followed, according to the
plan whic al Unit: Product Specification Standard. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation: Above 5 Minutes (Heat Run). Temperature : at 25 ºC±5 Relative humidity : 65 ± 10% Input voltage : 100~220V, 50/60Hz (6) Adjustment equipments : Color Analyzer (CA-210 or
CA-110), SVC remote controller (7) Push The “IN STOP KEY” – For memory initialization.
Case1 : Software version up
1) After downloading S/W by USB , TV set will reboot automatically
2) Push “In-stop” key
3) Push “Power on” key
4) Function inspection
5) After function inspection, Push “In-stop” key.
ºC
3. Main PCB check process
* APC – After Manual-Insert, executing APC * Boot file Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message.
If “Error ” i s d is pl ayed, Check co nn ection betwe en
computer, jig, and set.
(3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
filexxx.bin
(4) Click “Connect” tab. If “Can’t ” is displaye d, Check
connection between computer, jig, and set.
Case2 : Function check at the assembly line
1) When TV set is entering on the assembly line, Push
“In-stop” key at first.
2) Push “Power on” key for turning it on.
=> If you push “Power on” key, TV set will recover channel
information by itself.
3).After function inspection, Push “In-stop” key.
(5) Click “Auto” tab and set as below. (6) Click “Run”. (7) After downloading, check “OK” message.
filexxx.bin
Only for training and service purposes
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low, it didn't work. But your downloaded version is High, USB data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
* After downloading, have to adjust Tool
Option again.
(1) Push "IN-START" key in service remote controller. (2) Select "Tool Option 1" and Push "OK" button. (3) Punch in the number. (Each model has their number.) (4) Completed selecting Tool option.
Tool
Tool
Tool
Tool
Tool
Model Module
32LA613B-
SB
42LA6130-
SB
47LA6130-
SB
32LN540B-
SH/SA
32LN5400-
SB/SA
39LN5400-
SB/SA
39LN5400-
SB/SA
42LN5400-
SB/SA
42LN5400-
SB/SA
47LN5400-
SB/SA
50LN5400-
SB/SA
55LN5400-
SB/SA
32LN536B-SI LGD
32LN520B-
SA
42LN5200-
SA
32LN546B-
SM
42LN5460-
SM
47LN5460-
SM
LGD 84 2440 32669 46344 47108 97
LGD 87 2440 32669 46344 47108 97
LGD 88 2440 32669 46344 47108 97
LGD 20 2440 16281 13576 43012 17
LGD 20 2440 16281 13576 43012 17
CMI 2070 2440 16153 13576 43012 17
AUO 4118 2440 16153 13576 43012 17
LGD 23 2440 16281 13576 43012 17
AUO 4119 2440 16153 13576 43012 17
LGD 24 2440 16281 13576 43012 17
LGD 25 2440 16281 13576 43012 17
LGD 26 2440 16153 13576 59396 17
LGD
LGD
LGD 132 426 16153 13576 10244 273
LGD
LGD POLA
option1
option2
option3
option4
option5
Tool
option6
(5) After updating is complete, The TV will restart automatically. (6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In thi s case, you have to channel recover. If all channel data is cleared, you didn't have a DTV/ATV test on production line.
Only for training and service purposes
* RS-232C Connection Method Connection : PCBA (USB Port) -> USB to Se ri al Ada pter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
▪ Product name of USB to Serial Adapter is UC-232A.
Caution: LJ31* chassis support only UC-232A driver. (only use
this one. )
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4. Total Assembly line process
4.1. Adjustment Preparation
■ W/B Equipment condition
CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of
LED back light
■ Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
► The spec of color temperature and coordinate
Model Mode Color Temp Color coordinate Remark
Cool (C50) 13,000k
Medium (0) 9,300k
All
Warm (W50) 6,500k
► CA210 : CH 14, Test signal : Inner pattern (80IRE)
- Standard color coordinate and temperature using CA-1000 (by H/R time)
▪ Normal line
model: (normal line)LN5xxx, LA6xxx, LA7xxx, LA8xxx
H/R Time(Min)
271 270 286 289 313 329
1 0-2 283 287 298 306 322 342
2 3-5 282 285 297 304 321 340
3 6-9 281 284 296 303 320 339
4 10-19 279 281 294 300 318 336
5 20-35 277 277 292 296 316 332
6 36-49 275 274 290 293 314 329
7 50-79 273 272 288 291 312 327
8 80-119 272 271 287 290 311 326
9 Over 120 271 270 286 289 310 325
▪ Aging chamber line
model: (aging chamber)LN5xxx, LA6xxx, LA7xxx, LA8xxx
H/R Time(Min)
271 270 286 289 313 329
1 0-5 282 285 297 304 321 340
2 6-10 278 280 293 299 317 335
3 11-20 275 275 290 294 314 330
4 21-30 272 272 287 291 311 327
5 31-40 269 269 284 288 308 324
6 41-50 268 267 283 286 307 322
7 51-80 267 266 282 285 306 321
8 81-119 266 264 281 283 305 319
9 Over 120 265 263 280 282 304 318
x = 0.271 (±0.002) y = 0.270 (±0.002)
x = 0.286 (±0.002) y = 0.289 (±0.002)
x = 0.313 (±0.002) y = 0.329 (±0.002)
Cool Medium Warm
x y x x y x
Cool Medium Warm
x y x x y x
Test signal
- Inner pattern for W/B adjust
- External white pattern (80IRE, 204gray)
Connecting picture of the measuring instrument (On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER-ON -> Enter the mode of White-Balance, the pattern will come out.
Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°).
(3) Aging time
- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.
● Auto adjustment Map(RS-232C)
RS-232C COMMAND [ CMD ID DATA ] Wb 00 00 White Balance Start Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
MIN
CENTER
(DEFAULT)
MAX
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
*Manual W/B process using adjusts Remote control.(TBD)
■ Color analy zer(CA10 0+, CA210) should be used in th e
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key, ■Enter White Balance by pushing “►” key at “8. White Balance”.
■ For manual adjustment, it is also possible by the following
sequence. (1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface
(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-
Balance then press the cursor to the right (KEY►). When KEY(►) is pressed 206 Gray internal pattern will be displayed.
(4) Adjust Cool modes (i). Fix the one of R/G/B gain to 192 (default data) and decrease
the others
(If G gain is adjusted over 172 and R and B gain less than
192, increase G gain to 192 and increase R gain and B gain
same amount of increasing G gain.) (ii). If G gain is less than 172, Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain. (iii). If R gain or B gain is over 255, Readjust G gain less than 172, Conform to R gain is 255 or B
gain is 255 (5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
CASE Cool First adjust the coordinate far away from the target value(x, y). (1) x, y > target i) Decrease the R, G. (2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. (3) x > target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
How to adjust (1) If G gain is adjusted over 172 and R gain and B gain less than 192 , Adjust is O.K. (2) If G gain is less than 172 , increase G gain by up to 172, and then increase R gain and B gain same amount of increasing G gain. (3) If R gain or B gain is over 255 , Readjust G gain less than 172, Conform to R gain is 255 or B gain is 255
CASE Medium / Warm First adjust the coordinate far away from the target value(x, y). (1) x, y > target i) Decrease the R, G. (2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others. (3) x > target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R (4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
▪ After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.
▪ Push the “IN STOP KEY” afte r co mplet ing the funct ion
inspection.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu
8. White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner (ON). By selecting OFF, you can adjust using RF signal in 206 Gray pattern.
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
4.2. DPM operation confirmation (Only Apply for MNT Model)
Check if Power LED Color and Power Consumption operate as standard.
■ Set Input to RGB and connect D-sub cable to set ■ Measurement Condition: (100~240V@ 50/60Hz) ■ Confirm DPM operation at the state of screen without Signal
4.3. DDC EDID Write (HDMI 256Byte)
■ Connect HDMI Signal Cable to HDMI Jack. ■ Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
■ Check whether written EDID data is correct or not.
* For SVC Ass’y, EDID have to be downloaded.
4.4. EDID DATA
1) All Data : HEXA Value
2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***:Year : Controlled ****:Check sum
- Auto Download
■ After enter Service Mode by pushing “ADJ” key, ■ Enter EDID D/L mode. ■ Enter “START” by pushing “OK” key.
Caution
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
=> Caution
- Never connect HDMI & D-sub Cable at the same time.
- Use the proper cables below for EDID Writing.
- Download HDMI1, HDMI2 separately because HDMI1 is different from HDMI2.
For Analog EDID For HDMI EDID
D-sub to D-sub DVI-D to HDMI or HDMI to HDMI
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
EDID DATA
(1) HD 2D EDID Data
CheckSum Physical Address (0x9E)
HDMI 1 A3/5B 10
HDMI 2 A3/4B 20
Edid data and Model option download (RS232C)
NO Item CMD 1 CMD 2 Data 0
Enter download MODE
Edid data and Model option download
Only for training and service purposes
Download ‘Mode In’
Download A E 00 10
A A 0 0
When transfer the ‘Mode In’, Carry the com­mand
Automatically download (The use of a internal Data)
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
(2) FHD 2D EDID Data (Support Deep Color – 10bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/DE 10
HDMI 2 42/CE 20
(4) HD 3D EDID Data
CheckSum Physical Address (0x9E)
HDMI 1 A3/59 10
HDMI 2 A3/49 20
- HDMI
(5) FHD 3D EDID Data (Not Support Deep Color – 8bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/23 10
HDMI 2 42/13 20
(3) FHD 2D EDID Data (Not Support Deep Color – 8bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/25 10
HDMI 2 42/15 20
- HDMI
Only for training and service purposes
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
(6) FHD 3D EDID Data (Support Deep Color – 10bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/DC 10
HDMI 2 42/CC 20
(7) HD 3D DTS EDID Data
CheckSum Physical Address (0x9E)
HDMI 1 A3/C0 10
HDMI 2 A3/B0 20
(8) FHD 3D DTS EDID Data (Not Support Deep Color – 8bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/8A 10
HDMI 2 42/7A 20
- HDMI
(9) HD 2D DTS EDID Data
CheckSum Physical Address (0x9E)
HDMI 1 A3/C2 10
HDMI 2 A3/B2 20
- HDMI
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
(10) FHD 2D DTS EDID Data (Not Support Deep Color – 8bit)
CheckSum Physical Address (0x9E)
HDMI 1 42/8C 10
HDMI 2 42/7C 20
- HDMI
4.6.3. Checkpoint
(1) Test voltage 3 Poles
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA 2 Poles
- SIGNAL: 3KV/min at 100mA (2) TEST time: 1 second (3) TEST POINT 3 Poles
- GND Test = POWER CORD GND and SIGNAL CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
5. Local Dimming Function Check
Step1) Turn on TV. Step2) Press “P-only” key, enter to power only mode and
escape the “P-only” Mode by pressing “Exit” key Step3) Press “Tilt” key, entrance to Local Dimming mode. Step4) At the Local Dimming mode, module Edge Backlight
moving Top to bottom Back light of module moving Step5) confirm the Local Dimming mode Step6) Press “Exit” key
4.5. Outgoing condition Configuration
■ When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.6. GND & Hi-pot test
4.6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
4.6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
Only for training and service purposes
- 17 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
6. 3D Function Test (Only 3D Model)
(Pattern Genera tor MSHG-600, MSPG-6100 [SUPPORT HDMI1.4]) * HDMI mode NO. 872 , pattern No.83
1) Please input 3D test pattern like below (HDMI mode NO.
872 , pattern No.83)
2) When 3D OSD appear automatically , then select OK
button.
3) Don’t wear a 3D Glasses, Check the picture like below
Only for training and service purposes
- 18 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
BLOCK DIAGRAM
(P1101)
30P HD LVDS wafer
51P FHD LVDS wafer
(P1100)
(P1101)
30P HD LVDS wafer
51P FHD LVDS wafer
(P1100)
SIDE
USB
(JK700)
HDMI2(MHL)
(JK803)
CK+/-, D0+/-, D1+/-, D2+ /-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC
SIDE_USB_DM/DP
USB1_OCD/CTL
OCP IC : TPS65281
(IC401)
+5V_USB
SIDE
USB
(JK700)
HDMI2(MHL)
(JK803)
CK+/-, D0+/-, D1+/-, D2+ /-,_HDMI4, DDC_SCL/SDA_4, HDMI_CEC
SIDE_USB_DM/DP
USB1_OCD/CTL
OCP IC : TPS65281
(IC401)
+5V_USB
COMP2_L/R_IN
COMP2_Y+/AV_CVBS_IN, COMP2_Pb+/Pr+
AV2_L/R_IN
AV2_CVBS_IN
CK+/-, D0+/-, D1+/-, D2+ /-_HDMI2
DDC_SCL/SDA_2, HDMI_CEC
Serial Flash
(8Mbit)
IC1300
SPI_SCK/SDI/SDO/CS
Serial Flash
(8Mbit)
IC1300
Serial Flash
(8Mbit)
IC1300
SPI_SCK/SDI/SDO/CS
System EEPROM
(256Kbit)
IC104
I2C_SCL/SDA
System EEPROM
(256Kbit)
IC104
System EEPROM
(256Kbit)
IC104
I2C_SCL/SDA
NAND FLASH
(2Gbit)
IC102
PCM_A[0-7],…
NAND FLASH
(2Gbit)
IC102
NAND FLASH
(2Gbit)
IC102
PCM_A[0-7],…
DDR3 SDRAM
(2Gbit)
IC1201
A-MDQL[0-7], A-MDQU[0-7],…
DDR3 SDRAM
(2Gbit)
IC1201
DDR3 SDRAM
(2Gbit)
IC1201
A-MDQL[0-7], A-MDQU[0-7],…
RXA0+/-~RXA4+/-, RXACK+/-
RXB0+/-~RXB4+/-, RXBCK+/-
SPK_R
SPK_L
AMP_SCL/SDA
AUD_MASTER_CLK,
AUD_LRCH,
AUD_LRCK, AUD_SCK
STA380BW
(IC3401)
Main SOC
M1(MSD804KKX)
(IC101)
Connector
(P600)
KEY1/2, LED_R, IR
REAR
HDMI1
(JK801)
DDR3 SDRAM
(1Gbit)
IC1202
B-MDQL[0-7], B-MDQU[0-7],…
DDR3 SDRAM
(1Gbit)
IC1202
DDR3 SDRAM
(1Gbit)
IC1202
B-MDQL[0-7], B-MDQU[0-7],…
TU_SCL / SDA
SIF
TDSN-B601F
FULL NIM
FE_TS_DATA[8]
CVBS
TU_SCL / SDA
SIF
TDSN-B601F
FULL NIM
FE_TS_DATA[8]
CVBS
AV2
Comp1 & AV1
(JK1701)
MHL_CD_SENSE
OCP IC : BD82020FVJ
(IC802)
AVDD5V_MHL, VBUS_EN
MHL_OPC
SPDIF_OUT
SPDIF(Optic)
(JK1001)
HP_L/ROUT, SIDE_HP_MUTE
Headphone
(JK1500)
Only for training and service purposes
- 19 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
400
521
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
910
900
540
510
121
120
LV1
530
200T
200
A31
A10
Set + Stand
A2
300
Only for training and service purposes
- 20 -
301
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
TP for NON-EU models(except EU and China)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
TP for CI slot
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORD PCM_A[11]
/PCM_IOWR CI_TS_DATA[1]
/PCM_CE
/PCM_IRQA
/PCM_CD
/PCM_WAIT
PCM_RST
PCM_5V_CTL
CI_DET
TP for S2
PCM_D[0]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[12]
PCM_A[13]
PCM_A[14]
TP for FE_TS_DATA
CI_TS_CLK
CI_TS_VAL
CI_TS_SYNC
CI_TS_DATA[2]
CI_TS_DATA[3]
CI_TS_DATA[4]
CI_TS_DATA[5]
CI_TS_DATA[6]
CI_TS_DATA[7]
TP for SCART
SCART1_MUTE
SC1_IDPCM_D[1]
SC1_FB
SC1_SOG_INCI_TS_DATA[0]
DTV/MNT_VOUT
SCART1_Lout
SCART1_Rout
SC1_CVBS_IN
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for Headphone
HP_LOUT
HP_ROUT
SIDE_HP_MUTE
HP_DET
S2_RESET
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
TP_NON_EN
2012.07.02 3
L13 POWER BLOCK (POWER DETECT 2)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
FROM LIPS & POWER B/D
+3.5V_ST
MMBT3906(NXP)
Q402
3
1
2
L404
CIC21J501NE
L407
MLB-201209-0120P-N2
L402
MLB-201209-0120P-N2
OPT
R411
33K
P401
SMAW200-H18S1
PWR ON
3.5V
3.5V GND 24V GND 12V 12V GND
DRV ON
1
2
PDIM#1
3
4
PDIM#2
5
6
GND
7
8
24V
10
9
GND
11
12
12V
13
14
N.C
15
16
GND
17
18
19
.
R415 100
RL_ON
+3.5V_ST
R461 10K
+3.5V_ST
+24V
+12V
OPT
R462 10K
R401
10K
B
D401 5V
CIC21J501NE
L408
C406 0.1uF
C418 0.1uF
C404 0.1uF
R416 10K
R406
4.7K
C
Q401 MMBT3904(NXP)
E
OPT
16V
50V
16V
+3.3V_Normal
R419
1K
C
R421 10K
B
E
Q405
MMBT3904(NXP)
R412 3.9K
PWM_DIM_PULL_DOWN
*For 55LN54 Power ON Noise
R408 100
PWM2_2CH_POWER
+3.5V_ST
R426 10K
INV_CTL
PWM_DIM PWM1
PANEL_POWER
+12V
L412 120
CIS21J121
C438
0.1uF 25V
OPT
PANEL_CTL 001:AL22
R489 10K
+1.5V_DDR
+3.5V_ST
L420
BLM18PG121SN1D
C461 10uF
10V
+3.3V_Normal
R433 10K
R439
33K
R440
5.6K
1
2
3
1.5A
4
B
IC407
C
Q407 MMBT3904(NXP)
E
9
THERMAL
8
7
6
5
R430 10K
AP7173-SPG-13 HF(DIODES)
IN
PG
VCC
EN
[EP]
OUT
FB
SS
GND
C443 10uF
16V
Q409
AO3407A
S
G
C467 560pF 50V
+3.5V_ST --> 3.375V --> 3.46V
+24V --> 3.78V --> 3.92V (3.79V)
Power_DET
+12V
+3.5V_ST
D
R1
R457
4.3K
1/16W 1%
R2
R456
4.7K 1/16W 1%
R405
5.6K
PANEL_VCC
R407
5.6K
C472 22uF 10V
C476
0.1uF 16V
+1.5V_DDR
D403 5V OPT
PD_+24V
R482
8.2K 1%
PD_+24V
PD_+24V C412
0.1uF 16V
R403
1.5K 1%
+3.3V_Normal
+24V
C411
0.1uF 16V
PD_+12V
R448
2.7K
PD_+12V
R447
1.2K
1%
1%
+3.5V_ST
PD_+3.5V
R434
10K
R450
0
5%
PWR_DET_ON_SEMI
NCP803SN293
VCC
3
PD_+24V_PWR_DET_ON_SEMI
NCP803SN293
VCC
3
R438 22K
+12V --> 3.58V --> 3.82V (3.68V)
R402-*1 100
+3.5V_SOC_RESET
RESET_IC_SOC_RESET
R402 300
PD_+24V
R480 100
AO3435 Q403
D
S
G
+3.5V_ST
R463
RESET_IC_SOC_RESET
10K
BLM18PG121SN1D
C425
0.1uF 16V
R488 100K
IC408
GND
PD_+24V
R404
100K
IC409
GND
1
1
C423
2.2uF 10V
RESET
2
POWER_DET_RESET
RESET
2
FET_2.5V_AOS
C474
0.1uF
L403
POWER_DET
+3.3V_Normal
IC408-*1
APX803D29
RESET
PWR_DET_ON_DIODES
RESET
PD_+24V_PWR_DET_DIODES
C437 22uF 10V
2
1
IC409-*1
APX803D29
2
1
5V OPT
3
GND
3
GND
D405
VCC
VCC
+5V_Normal & +5V_USB
+12V
L401
CIC21J501NE
R410
100K
CHANGE TO 16V/X5R
C405 10uF 16V
C419
4.7uF 10V
Vout=0.8*(1+R1/R2)
L406
R491
0
BST
13
14
15
16
THERMAL
1
SS
3.6uH
10FB11LX12
IC401 TPS65281RGV
17
3
2
ROSC
COMP4RLIM
R409 2K
C410 3300pF 50V
C413
0.047uF 25V
PGND
VIN
V7V
[EP]
EN
C426 100pF 50V
OPT
SW_IN
9
C420 22uF 16V
R413 20K
8
7
6
5
C421 22uF 16V
SW_OUT
AGND
FAULT
EN_SW
R445
R436 15K
PH_3
PH_2
PH_1
SS/TR
B
C441
0.1uF 16V
R432
C488 3300pF
330K1/16W 5%
2.2K
C
Q400 MMBT3904(NXP)
E
C448
3300pF
50V
L415
3.6uH
C453 22uF 10V
C456 22uF 10V
R1
R2
FET_2.5V_DIODE
DMP2130L Q403-*1
S
G
R442 30K 1/16W 1%
R441 75K 1/16W 1%
D
+1.10V_VDDC
C439
50V 100pF
C444
0.1uF 16V
D404 5V OPT
Vout=0.8*(1+R1/R2)=1.5319
POWER_ON/OFF_1
R443 10K
+2.5V_Normal
+3.3V_Normal
+5V_Normal
R1
R452
33K
1%
C424 330pF
R453
OPT
27K
C417 10uF
10V 85C
1%
50V
R2
R454
11K 1%
CAP_10uF_X5R
CHANGE TO 10UF/10V/X5R
+5V_Normal
C417-*1
10uF 10V
CAP_10uF_X7R
+3.3V_Normal
R414 10K
+5V_USB
R417
4.7K
OPT
C422
0.1uF 16V
OPT
USB1_OCD
USB1_CTL
TJ1118S-2.5
IN
3
IC402
1
GND
OUT
2
CAP_10uF_X5R
CHANGE TO 10UF/10V/X5R
C403
10uF
10V
85C
C403-*1
10uF 10V
CAP_10uF_X7R
C440
0.1uF 16V
+2.5V_Normal
D402 5V OPT
S7LR core 1.15V volt
R428 10K
EP[GND]
VIN_3
1
THERMAL
2
3
TPS54319TRE
4
5
AGND
15EN16
17
IC403
6
VSENSE
3A
C447
0.33uF 16V
7
COMP
BOOT14PWRGD
13
12
11
10
8
RT/CLK
9
+3.5V_ST
L413 CIC21J501NE
C430 10uF
10V
+3.3V_Normal
VIN_1
VIN_2
GND_1
GND_2
Vout=0.827*(1+R1/R2)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
Power_PD2
2012/09/19
4
IR/LED and Control
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
+3.5V_ST
CONTROL_NO_FILTER
R611 0
CONTROL_FILTER
L601
BLM18PG121SN1D
CONTROL_FILTER
L602
BLM18PG121SN1D
CONTROL_NO_FILTER
R612 0
CONTROL_FILTER
C609
0.1uF 16V
+3.5V_ST
L600
BLM18PG121SN1D
C602
0.1uF 16V
CONTROL_FILTER
C608
0.1uF 16V
C603 1000pF 50V
LED_R/BUZZ
C604
100pF
P600
12507WR-08L
1
2
3
R610
1.8K
OPT
C607
0.1uF 16V
50V
4
5
6
7
8
9
R603
R602
R600
KEY1
KEY2
IR
100
R601 100
10K
10K
1%
1%
R607
3.3K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM IR/CONTROL
2012/07/18
6
USB (SIDE)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
JK700
1234
USB DOWN STR EAM
3AU 04S-3 05-Z C-(LG )
5
C700 22uF 10V
D700 RCLAMP0502BA
OPT
+5V_USB
SIDE_USB1_DM
SIDE_USB1_DP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
USB
12/06/20
7
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