Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to LA3AA Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
(1) Since EDID data is embedded, EDID download JIG, HDMI
cable is not need.
(2) Adjust by using remote controller
4.2.3. Download method
(1) Press Adj. key on the Adj. R/C.
(2) Select EDID D/L menu.
(3) By pressing Enter key, EDID download will begin
(4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
(5) If Download is failure, Re-try downloads.
※Caution : Wh en EDID Download, must remove HDMI
Cable.
4.2.3.1. Models for EDID Data
2D
8bit-HD8bit-FHD
North America
(PCM)
32LN541C-UA39/42/47/55
LN541C-UA
LN549E-UA
4.3. Tool Option Input
- Input Model Tool Option according to BOM
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range.
▪ Case : Cool Mode
- To adjust the white balance without the saturation, G gain
should be adjust at least 172 and change the others (R,B
Gain)
※ When R or B gain is over 255, G gain can be adjust below
172)
▪ Case : Medium / Warm Mode
- To adjust the white balance without the saturation, Fix the
one of R/G/B gain to 192 (default data) and decrease the
others.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 ºC
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON sta tus during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
※ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
5.1.5.2. Manual adj. method
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 204 Gray(80IRE) internal
pattern will be displayed)
(4-a) Adjust modes (Cool) : Fix the G gain at least 172 and
change the others (R/B Gain).
※ If R or B gain is over 255, G gain can be adjust below 172.
(4-b) Adjust two modes ( Medium / Warm) : Fix the one of
R/G/B gain to 192 (default data) and decrease the others
※ CASE : Cool mode
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
(2) x, y < target
(3) x >target , y < target
(4) x < target , y > target
- Every 4 case have to fit y value by adjusting B Gain and then
fit x value by adjusting R-Gain
- In this case, increasing/decreasing of B Gain and R Gain can
be adjusted
► How to adjust
(1) Fix G gain at least 172 : Adjust R, B Gain (In Case of
Mostly Blue Gain Saturation)
(2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically
6.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
* USB S/W Download (option, Service only)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
7.2. Specification
NoItemMinTypMaxUnitRemark
1Audio practical
max Output, L/R
(Distortion=10%
max Output)
2Audio practical
max Output, L/R
(Distortion=10%
max Output)
9.0
8.5
4.5
6.0
10.9
9.3
5.2
6.45
12.0
9.8WVrms
6.24
7.07WVrms
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker
(8Ω Impedance)
(3) 32/37/42/47/55
INCH
(1) Measurement
condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker
(8Ω Impedance)
(3) 26 INCH
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In thi s case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
※After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
(1) Connect external speaker to speaker out port with phone
jack on TV side as below
(2) Check the Max. speaker output is 1W or not. Sine wave
with 1KHz will be displayed
(3) Check Both of the signal in speaker.
(Power only mode -> Fived 1W Default)
-> Check the input signal(1KHZ, Sine wave) and the wave
of output by utilizing oscilloscope
7.1.1. Overview
▪ Jig(Commercial Check JIG)
▪ RJ45 cable
▪ Power only mode
7.1.2. Test sequence
(1) Operate JIG(Commercial Check JIG) as shown on picture1
(2) Turn on TV an d press “P-ONLY” key on adjustment
remocon.
(3) Connect RJ45 cable into RJP port of the TV set.
(4) Connect RJ45 cable into the JIG.
(5) If shown “OK” it’s normal, “NG” it’s defect.
(6) If defect, check the connection once again as done above.
(7) If the signal power is no good, check the connection of RF
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
NC_1
1
NAND_FLASH_1G_NUMONYX
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
RB
7
R
8
E
9
NC_7
10
NC_8
11
12
13
NC_9
14
15
CL
16
AL
17
W
18
WP
19
20
21
22
23
24
NC_29
NC_1
NC_28
NC_2
NC_27
NC_3
NC_26
NC_4
I/O8
NC_5
I/O7
NC_6
I/O6
R/B
I/O5
RE
NC_25
CE
NC_24
NC_7
NC_23
NC_8
VCC_2
VCC_1
VSS_2
VSS_1
NC_22
NC_9
NC_21
NC_10
NC_20
CLE
I/O4
ALE
I/O3
WE
I/O2
WP
I/O1
NC_11
NC_19
NC_12
NC_18
NC_13
NC_17
NC_14
NC_16
NC_15
I2C
Addr:10101--
I2C_SCL
I2C_SDA
NAND01GW3B2CN6E
EAN60762401
EAN60708701
NAND_FLASH_2G_HYNIX_OLD
IC102-*4
HY27UF082G2B-TPCB
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
R141
R140
1K
1K
+3.3V_Normal
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VDD_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
EAN60991001
NAND_FLASH_2G_TOSHIBA
TC58NVG1S3ETA00
NC_1
NC_29
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
NC_2
NC_28
2
NC_3
NC_27
3
NC_4
NC_26
4
NC_5
I/O7
5
NC_6
I/O6
6
RY/BY
I/O5
7
RE
I/O4
8
CE
NC_25
9
NC_7
NC_24
10
NC_8
NC_23
11
VCC_1
VCC_2
12
VSS_1
VSS_2
13
NC_9
NC_22
14
NC_10
NC_21
15
CLE
NC_20
16
ALE
I/O3
17
WE
I/O2
18
WP
I/O1
19
NC_11
I/O0
20
NC_12
NC_19
21
NC_13
NC_18
22
NC_14
NC_17
23
NC_15
NC_16
24
IC102-*5
OS
C102
10uF
C103
0.1uF
OS
AR101
10V
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O8
44
I/O7
43
I/O6
42
I/O5
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O4
32
I/O3
31
I/O2
30
I/O1
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
OS
22
OS
AR102
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
R/B
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
CLE
ALE
NC_11
NC_12
NC_13
NC_14
NC_15
PCM_A[7]
PCM_A[6]
PCM_A[5]
PCM_A[4]
PCM_A[3]
PCM_A[2]
PCM_A[1]
PCM_A[0]
22
NAND_FLASH_2G_HYNIX_NEW
1
2
3
4
5
6
7
RE
8
CE
9
10
11
12
13
14
15
16
17
WE
18
WP
19
20
21
22
23
24
EAN60708702
IC102-*6
H27U2G8F2CTR
PCM_A[0-7]
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
+3.3V_Normal
R144
R145
2.2K
2.2K
AMP_SDA
AMP_SCL
I2C_SDA
I2C_SCL
EEPROM
AT24C256C-SSHL-T
A0
A1
A2
GND
IC104
NVRAM_ATMEL
1
2
A0’h
3
4
EAN61133501
+3.3V_Normal
C105
0.1uF
VCC
8
WP
7
SCL
6
SDA
5
C104
8pF
OPT
R11122
R11222
C106
8pF
OPT
/PF_WP
EAN35669102
NAND_FLASH_1G_HYNIX
H27U1G8F2BTR-BC
NC_1
1
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
R/B
7
RE
8
CE
9
NC_7
10
NC_8
11
VCC_1
12
VSS_1
13
NC_9
14
NC_10
15
CLE
16
ALE
17
WE
18
WP
19
NC_11
20
NC_12
21
NC_13
22
NC_14
23
NC_15
24
EAN35669103
NAND_FLASH_1G_HYNIX_NEW
IC102-*7
H27U1G8F2CTR-BC
NC_1
1
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
R/B
7
RE
8
CE
9
NC_7
10
NC_8
11
VCC_1
12
VSS_1
13
NC_9
14
NC_10
15
CLE
16
ALE
17
WE
18
WP
19
NC_11
20
NC_12
21
NC_13
22
NC_14
23
NC_15
24
DIMMING
PWM_DIM
HDCP EEPROM
HDCP_EEPROM
NAND FLASH MEMORY
OS
R102
3.3K
IC102-*1
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
HDCP_EEPROM
IC103
CAT24WC08W-T
R113
4.7K
A0
1
A1
2
A2
3
VSS
4
/F_RB
/PF_OE
/PF_CE0
+3.3V_Normal
OPT
R104
10K
B
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
R/B
RE
CE
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
CLE
ALE
WE
WP
NC_11
NC_12
NC_13
NC_14
NC_15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
8
7
6
5
C
E
NAND_FLASH_1G_SS
VCC
WP
SCL
SDA
/PF_CE1
PF_ALE
/PF_WE
OPT
Q101
MMBT3904(NXP)
EAN61857001
IC102-*2
K9F1G08U0D-SCB0
R157
R127 4.7K
HDCP_EEPROM
R105
1K
OPT
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
100
OS
R107
1K
OPT
R108
1K
OS
R106
1K
RY/BY
VCC_1
VSS_1
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
+3.3V_Normal
HDCP_EEPROM
HDCP_EEPROM
R128
R129 22
HDCP_EEPROM
C101
0.1uF
NAND_FLASH_1G_TOSHIBA_NEW
TC58NVG0S3ETA0BBBH
NC_1
1
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
7
RE
8
CE
9
NC_7
10
NC_8
11
12
13
NC_9
14
15
CLE
16
ALE
17
WE
18
WP
19
20
21
22
23
24
C107
0.1uF
22
+3.3V_Normal
OS
R109
3.9K
OS
EAN61508001
IC102-*3
PWM2
VDD_1
VSS_1
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
<CHIP Config(LED_R/BUZZ)>
Boot from SPI CS1N(EXT_FLASH) 1’b0
Boot from SPI_CS0N(INT_FLASH) 1’b1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA2AW2012.09.11
POWER,IN/OUT,H/W OPT
2
Page 24
Serial Flash for SPI boot_NON_OS and OS
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
/FLASH_WP
OPT
R304
+3.5V_ST
+3.5V_ST
S_FLASH_OS_MACRONIX
OPT
R302
+3.5V_ST
OPT
R301
10K
0
B
/SPI_CS
SPI_SDO
C
OPT
Q301
MMBT3904(NXP)
E
4.7K
MX25L8006EM2I-12G
CS#
SO/SIO1
WP#
GND
1
2
3
4
IC301
8
7
6
5
VCC
HOLD#
SCLK
SI/SIO0
R303
33
S_FLASH_OS
S_FLASH_OS
C301
0.1uF
SPI_SCK
SPI_SDI
S_FLASH_OS_WINBOND
IC301-*1
W25Q80BVSSIG
DO[IO1]
%WP[IO2]
GND
CS
1
2
3
4
VCC
8
HOLD[IO3]
7
CLK
6
DI[IO0]
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA2AW2012.09.11
3Serial FLASH
Page 25
FROM LIPS & POWER B/D
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA2AW2012.09.11
POWER
4
Page 26
Audio amp(NTP-7500)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA2AW2012.09.11
NTP-7500
5
Page 27
IR/LED and control for normal models.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
R608
KEY1
KEY2
IR_OUT
R606
R602
100
R603
100
IR
10K
10K
1%
IR_OUT
R601
22
1%
IR_OUT_EU
IR_OUT_EU
R605
Q601
2SC3052
IR_OUT_US
L602
BLM18PG121SN1D
L603
BLM18PG121SN1D
+3.5V_ST
BLM18PG121SN1D
+3.5V_ST
1K
IR_OUT_EU
C
B
E
R604
0
R607
10K
L601
C603
0.1uF
AMOTECH CO., LTD.
C601
0.1uF
16V
IR_OUT
2SC3052
OPT
VA601
5.6V
IR_OUT
R609
Q602
+3.5V_ST
1K
C
E
C602
1000pF
50V
B
C604
0.1uF
AMOTECH CO., LTD.
LED_R
IR_OUT
R610
47K
VA602
5.6V
+3.5V_ST
R611
3.3K
OPT
R615
1.5K
C607
100pF
50V
OPT
C608
0.1uF
16V
OPT
ZD603
5.48VTO5.76V
P601
12507WR-08L
1
2
3
4
5
6
7
8
9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA2AW2012.09.11
IR/CONTROL6
Page 28
RGB PC
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
USB2_CTL
+5V_Normal
+3.3V_Normal
R713
4.7K
OPT
RGB_PC
R723
2.2K
OCP for USB_2
TEST
EAN61849601
IC702
AP2191DSG
GND
1
IN_1
2
IN_2
3
EN
4
MMBD6100
RGB_PC
R724
2.2K
RGB_PC
D710
C
A2
A1
+5V_Normal
NON_CI_CAP_RGB_PC
C724
0.1uF
16V
NC
8
OUT_2
7
OUT_1
6
FLG
5
L703-*1
MLB-201209-0120P-N2
120-ohm
TEST
L703
CIS21J121
C716
22uF
10V
TEST
R715 47
TEST
+5V_USB_1
+5V_USB_2
TEST
R714
10K
USB2_OCD
JP_GND
USB1_DM
USB1_DP
USB2_DM
USB2_DP
+5V_USB_1
+5V_USB_2
TEST
C717
10uF
C719
10uF
USB1
3AU 04S-3 05-Z C-(LG )
JK7 03
1234
10V
OPT
D708
RCLAMP0502BA
USB DOWN STR EAM
5
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF-JACK-SOLTEAM
JK702-*1
JST1223-001
GND
Fiber Optic
1
VCC
2
VINPUT
3
4
FIX_POLE
SPDIF_OUT
+3.3V_Normal
C707
0.1uF
16V
SPDIF-JACK-FOXCONN
2F01TC1-CLM97-4F
GND
VCC
VIN
C709
100pF
50V
1
2
3
JK702
4
SHI ELD
Fib er Op tic
USB2
USB2
3AU 04S-3 05-Z C-(LG )
JK7 04
1234
Rear AV
R701
75
D702
5.6V
C708
47pF
50V
D701
USB DOWN STREAM
OPT
D709
10V
RCLAMP0502BA
JP_GND1
5
JK701
PPJ233-01
[RD]E-LUG
5C
[RD]O-SPRING
4C
[RD]CONTACT
3C
[WH]C-LUG
4B
[YL]CONTACT
3A
[YL]O-SPRING
4A
[YL]E-LUG
5A
L-MONO
30V
JP_GND2
D703
5.6V
R703
470K
R702
470K
D705
5.6V
C710
220pF
50V
+3.3V_Normal
OPT
C711
0.1uF
OPT
16V
L701
120-ohm
L702
120-ohm
R704
10K
R705
1K
C712
330pF
50V
C713
330pF
50V
AV_CVBS_IN
R706
10K
R708
R707
10K
12K
R709
12K
AV_CVBS_DET
AV_COMP_PC_R_IN
AV_COMP_PC_L_IN
JP_GND3
DSUB_VSYNC
DSUB_HSYNC
DSUB_B+
DSUB_G+
DSUB_R+
OPT
C718
68pF
50V
RGB_PC
R718
75
RGB_PC
R719
75
RGB_PC
R720
75
NON_CI_CAP_RGB_PC
OPT
VA701
20V
ADUC 20S 02 010L
ADUC 20S 02 010L
RGB_VARISTOR
VA702
20V
ADUC 20S 02 010L
RGB_VARISTOR
VA703
20V
ADUC 20S 02 010L
RGB_VARISTOR
VA704
20V
OPT
C720
68pF
50V
NON_CI_CAP_RGB_PC
C721
18pF
50V
OPT
VA705
20V
ADUC 20S 02 010L
C723
18pF
50V
OPT
VA706
5.6V
RED2GREEN3BLUE4GND_15DDC_GND
RED_GND7GREEN_GND8BLUE_GND9NC10SYNC_GND
GND_212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK
11
6
1
JK705
SPG09-DB-010
RGB_PC
OPT
VA707
5.6V
SHILED
16
RGB_DDC_SCL
RGB_DDC_SDA
+3.3V_Normal
RGB_PC
R729
10K
OPT
VA708
5.6V
ADMC 5M 02 200L
RGB_PC
R732
1K
DSUB_DET
RS232C
C701 0.33uF
C702
0.1uF
C703
0.1uF
C704
0.1uF
C705
0.1uF
DOUT2
RIN2
C1+
C1-
C2+
C2-
V+
V-
IC701
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
JP_GND4
10
5
IR_OUT
+3.5V_ST
D704
CDS3C30GTH
30V
OPT
C706
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
D706
CDS3C30GTH
30V
OPT
+3.5V_ST
R710
100
R711
100
D707
BAP70-02
50V
R712
1K
JP708
JP709
PM_RXD
PM_TXD
9
8
7
6
SPG09-DB-009
JK706
4
3
2
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA2AW2012.09.11
REAR JACKS
7
Page 29
HDMI
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
SHIELD
EAG59023302
HDMI_1_Normal
JK802
5V_HDMI_1
20
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
R802
1.8K
VA804
ESD_HDMI
5V_DET_HDMI_1
3.3K
R805
VA801
ESD_HDMI
VA805
ESD_HDMI
5V_HDMI_1
Q801
MMBT3904(NXP)
ESD_HDMI
VA806
C
E
1K
R801
R811
B
10K
VA807
ESD_HDMI
D804
RCLAMP0524PA
1
2
3
4
5
ESD_HDMI
D805
RCLAMP0524PA
1
2
3
4
5
ESD_HDMI
5V_HDMI_1
R818 100
R822 100
10
9
8
7
6
10
9
8
7
6
10K
R808
HPD1
DDC_SDA_1
DDC_SCL_1
HDMI_CEC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
5V_HDMI_1
R812
2.7K
5V_HDMI_4
R827
2.7K
HDMI_SIDE
For CEC
+5V_Normal
A2CA1
R813
2.7K
+5V_Normal
HDMI_SIDE
R828
2.7K
MMBD6100
D801
A2CA1
MMBD6100
D803
HDMI_SIDE
DDC_SDA_1
DDC_SCL_1
DDC_SDA_4
DDC_SCL_4
5V_HDMI_2
R819
2.7K
HDMI_2
HDMI_2
+5V_Normal
A2CA1
MMBD6100
D802
R820
2.7K
HDMI_2
DDC_SDA_2
DDC_SCL_2
HDMI_2
SHIELD
20
EAG59023302
HDMI_2_Normal
JK801
R816
5V_HDMI_4
ESD_HDMI
R815
1.8K
VA812
100
5V_DET_HDMI_4
R817
VA803
ESD_HDMI
3.3K
CEC_REMOTE_S7
VA813
ESD_HDMI
Q804
MMBT3904(NXP)
ESD_HDMI
VA814
5V_HDMI_4
R814
1K
C
E
R823
B
10K
VA815
ESD_HDMI
D808
RCLAMP0524PA
1
2
3
4
5
ESD_HDMI
D809
RCLAMP0524PA
1
2
3
4
5
ESD_HDMI
R826 100
R829 100
10
9
8
7
6
10
9
8
7
6
5V_HDMI_4
R821
10K
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
BODY_SHIELD
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SIDE_HDMI_32LS3500
51U019S-312HFN-E-R-E-LG
JK803-*1
HOT_PLUG_DETECT
VDD[+5V]
DDC/CEC_GND
SDA
SCL
RESERVED
CEC
TMDS_CLK-
TMDS_CLK_SHIELD
TMDS_CLK+
TMDS_DATA0-
TMDS_DATA0_SHIELD
TMDS_DATA0+
TMDS_DATA1-
TMDS_DATA1_SHIELD
TMDS_DATA1+
TMDS_DATA2-
TMDS_DATA2_SHIELD
TMDS_DATA2+
For BDP In-Packing Model
- EMI Gasket Touch Jack
SHIELD
20
19
HPD
18
+5V_POWER
17
DDC/CEC_GND
16
SDA
15
SCL
14
NC
13
CEC
12
CLK-
11
CLK_SHIELD
10
CLK+
9
DATA0-
8
DATA0_SHIELD
7
DATA0+
6
DATA1-
5
DATA1_SHIELD
4
DATA1+
3
DATA2-
2
DATA2_SHIELD
1
DATA2+
HDMI_2_BDP_Model
YKF45-7054V
JK801-*1
SHIELD
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HDMI_1_BDP_Model
YKF45-7054V
JK802-*1
HPD
+5V_POWER
DDC/CEC_GND
SDA
SCL
NC
CEC
CLK-
CLK_SHIELD
CLK+
DATA0-
DATA0_SHIELD
DATA0+
DATA1-
DATA1_SHIELD
DATA1+
DATA2-
DATA2_SHIELD
DATA2+
HDMI_CEC
SIDE_HDMI
5V_HDMI_2
R803
Q802
VA810
ESD_HDMI
1K
C
R810
B
E
VA811
ESD_HDMI
1
2
3
4
5
ESD_HDMI
1
2
3
4
5
10K
R824 100
R825 100
D806
RCLAMP0524PA
10
9
8
7
6
D807
RCLAMP0524PA
10
9
8
7
6
ESD_HDMI
5V_HDMI_2
R809
10K
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
BODY_SHIELD
20
EAG62611204
HDMI_SIDE
JK803
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
5V_HDMI_2
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
R804
1.8K
ESD_HDMI
VA808
5V_DET_HDMI_2
R806
3.3K
ESD_HDMI
VA802
VA809
ESD_HDMI
R8070
HDMI1_ARC
MMBT3904(NXP)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA2AW2012.09.11
HDMI/RJP8
Page 30
RJP
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+12V
RJP
L901
BLM18PG121SN1D
RJP
JK901
KRJV9768-1001-024
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
R901
RJP
10K
C901
2.2uF
16V
RJP
R902
10K
RJP_PROTECTION
R904
RJP_PROTECTION
R903
RJP
5.1K
5.1K
R905
1K
RJP_PROTECTION
R906
RJP_PROTECTION
Q902
AO3407A
Q901
AO3407A
S
RJP_NORMAL
R907 0
RJP
RJP
ZD901 5.1V
C902 0.01uF
RJP
D
S
C903
1uF
25V
G
OPT
RJP_PROTECTION
D
G
0
RJP
ZD902 5.1V
RJP
C904 0.01uF
RJP_PROTECTION
100K
R908
RJP
RJP
RJP
0.01uF
ZD903 5.1V
ZD904 5.1V
C905
RJP
C906 0.01uF
RJP
ZD905 5.1V
RJP
C907 0.01uF
C908
22uF
16V
OPT
R911 510
R909 510
R910 510
R912 510
R913 510
RJP
R914
10K
RJP
RJP
RJP
RJP
RJP
R916
3.9K
R915
3.9K
RJP
RJP
R917
RJP
3.9K
R918
3.9K
RJP
R919
8.2K
RJP
RJP_CTRL0
RJP_CTRL1
RJP_CTRL2
RJP_CTRL3
RJP_CTRL4
Single ended
EXT_SPK
SUB_AMP_MUTE
EXT_AMP_L
EXT_AMP_R
001:AC13
EXT_SPK
C928
10V
1uF
C927
EXT_SPK
10V
1uF
MMBT3904(NXP)
10K
R922
Q903
EXT_SPK
EXT_SPK
4.7K
R923
B
+3.5V_ST
EXT_SPK
R924
10K
+24V
L902
EXT_SPK
BLM18PG121SN1D
C
E
PVCCL_1
PVCCL_2
MUTE
BYPASS
AGND_1
AGND_2
C913
0.1uF
50V
PVCCR_1
VCLAMP
PVCCR_2
C911
1uF
50V
EXT_SPK
C912
1uF
50V
EXT_SPK
EXT_SPK
EXT_SPK
EXT_SPK
IC901
TPA3124D2PWPR
1
SD
2
3
4
LIN
5
RIN
6
7
8
9
10
11
12
C914
0.1uF
50V
PGNDL_2
24
PGNDL_1
23
LOUT
22
BSL
21
AVCC_2
20
AVCC_1
19
GAIN0
18
GAIN1
17
BSR
16
ROUT
15
PGNDR_2
14
PGNDR_1
13
EXT_SPK
C917
0.22uF
50V
EXT_SPK
C918
0.22uF
50V
EXT_SPK
C915
0.1uF
50V
EXT_SPK
C916
4.7uF
50V
EXT_SPK
L904
22.0uH
22.0uH
L905
EXT_SPK
R930
10K
OPT
R931
10K
EXT_SPK
EXT_SPK
EXT_SPK
R932
10K
OPT
R933
10K
EXT_SPK
R934
4.7K
R935
4.7K
C919
0.47uF
50V
EXT_SPK
C920
0.47uF
50V
EXT_SPK
C921
0.47uF
50V
EXT_SPK
C922
0.47uF
50V
EXT_SPK
C923
C924
47uF
47uF
25V
EXT_SPK
25V
EXT_SPK
EXT_SPK
10K
R936
EXT_SPK
10K
R937
EXT_OUT_L
EXT_OUT_R
EXT_SPEAKER
EXT_SPK
JK902
PEJ034-01
E_SPRING
3
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
+3.3V_Normal
EXT_SPK
R939
100K
EXT_SPK
R938 100
C925
1uF
OPT
C926
1uF
OPT
EXT_SPK_DET
EXT_OUT_R
EXT_OUT_L
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA2AW2012.09.11
RJP / EXT AMP
9
Page 31
GP4R_GLOBAL_TUNER_BLOCK
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TU1001
TDSN_B001F
SI2176_BR_2INPUT_H
B1
B1
28
SHIELD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
A1
RF_S/W_CTL
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
NC_1
NC_2
NC_3
+B3[3.3V]
+1.23V_TU
+B4[1.23V]
NC_4
GND
ERROR
SYNC
VALID
MCLK
D0
D1
D2
D3
D4
D5
D6
D7
A1
C1001
0.1uF
16V
C1002
0.1uF
16V
FULL_NIM
R1001 0
RF_SW_OPT
FULL_NIM
L1001
120
TU1002
TDSS-G102D
SI2176_DVB_1INPUT_H
B1
B1
12
SHIELD
RF_SWITCH_CTL
Pull-up can’t be applied
because of MODEL_OPT_2
NC
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBVS
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
A1
A1
TU1002-*1
TDSS-H101F
1
2
3
4
5
6
7
8
9
10
11
SI2176_ATSC_1INPUT_H
B1
A1
B1
12
SHIELD
FE_TS_SYNC
FE_TS_VAL_ERR
FE_TS_CLK
NC
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
IF_AGC
DIF[P]
DIF[N]
A1
B1
FE_TS_DATA[0]
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
TDSS-H101F(B)
B1
12
C1003
100pF
50V
TU1002-*2
TDSS-H101F(B)
1
2
3
4
5
6
7
8
9
10
11
A1
SHIELD
NC_1
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8]
CVBS
IF_AGC
DIF[P]
DIF[N]
A1
0.1uF 16V
C1005
0.1uF
16V
C1004-*1
0
ASIA
C1004
close to TUNER
NON_ASIA
+1.2V/+1.8V_TU
C1006
22uF
25V
NON_BR
R1002 0
R1003 0
NON_BR
Close to the tuner
FE_TS_DATA[0-7]
C1009
100pF
C1008
50V
10uF
6.3V
close to the tuner pin, add,09029
+3.3V_TU
R1005 10K
C1007
0.1uF
16V
FULL_NIM_OPT
+5V_Normal
FULL_NIM
R1004 10K
L1002
R1006
FULL_NIM
0
FULL_NIM_BCD
+3.3V_TU
C1011
0.1uF
16V
C10 10
0.1 uF
16V
R1007 100
NON_BR
NON_BR
C1012
0.1uF
16V
IC1001
AZ1117BH-1.8TRE1
IN
3
AP2132MP-2.5TRG1
PG
EN
VIN
VCTRL
+3.3V_TU
R1010
100K
R1008
100
C1014
0.1uF
16V
should be guarded by ground
+1.2V/+1.8V_TU
OUT
2
1
ADJ/GND
IC1002
1
FULL_NIM_BCD
9
2
THERMAL
3
4
IF_AGC_MAIN
5%
C1013
0.1uF
16V
[EP]
GND
8
ADJ
7
VOUT
6
NC
5
TUNER_RESET
R1009
1
1/16W
add,0929
C1019
C1016
18pF
18pF
50V
50V
C1015
10uF
10V
FULL_NIM_BCD
FULL_NIM_BCD
R1012
11K
R1
FULL_NIM_BCD
R1011
20K
1005
R2
BCD Vo=0.6*(1+R1/R2)
TJ Vo=0.8*(1+R1/R2)
33
R1013
10K
33
R1014
R1015
C1017
5pF
50V
ASIA
C1018
0.1uF
16V
FULL_NIM
+3.3V_TU
R1019
1K
C1020
5pF
50V
ASIA
+1.23V_TU
C1021
10uF
10V
FULL_NIM
R1022
1K
R1016
3.3
ASIA
R1017
0
ASIA
380mA
R1018
2K
OPT
TU_SCL
TU_SDA
R1020
3.3
ASIA
R1021
0
ASIA
NON_ASIA
NON_ASIA
60mA
R1023 0
R1024 0
IF_N_MSTAR
IF_P_MSTAR
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
+3.3V_TU
C1024
22uF
10V
TU_NON_BUFFER
R1026 0
R1027
4.7K
TU_BUFFER
TU_NON_BUFFER
R1025 0
R1028
1K
OPT
Size change,0929
L1003
MLB-201209-0120P-N2
C1025
0.1uF
16V
+3.3V_TU
R1030
B
+3.3V_TU
TU_BUFFER
R1029
220
B
+3.3V_Normal
C1026
22uF
10V
470
E
C
TU_BUFFER
E
TU_BUFFER
MMBT3906(NXP)
Q1002
C
TU_BUFFER
R1031
220
TU_BUFFER
Q1001
MMBT3906(NXP)
C1027
0.1uF
16V
R1032
82
TU_SIF
TU_CVBS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA2AW2012.09.11
TUNER
10
Page 32
LVDS for large inch
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[51Pin LVDS Connector]
(For FHD 60Hz)
FHD
P1100
FI-RE51S-HF-J-R1500
R1101
10K
OPT
C1100
10uF
16V
AUO_GND
LVDS_SEL
+3.3V_Normal
OPT
C1101
1000pF
50V
OPT
R1102
3.3K
OPT
R1103
10K
FHD
C1102
0.1uF
16V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
PSU_T120_LGD
R1100
0
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
PWM_DIM
AUO_GND/LGD_NC
PANEL_VCC
L1100
70-ohm
FHD
SCANNING_EN
+3.3V_Normal
OPT
R1104
3.3K
OPT
R1105
10K
OPC&SCANNING_CTRL
FOR FHD REVERSE(10bit)
Change in S7LR
MIRROR
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+RXA2+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
Pol-change
RXA0+
RXA0-
RXA1+
RXA1-
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXA4+
RXA4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXBCK-
RXB3+
RXB3-
RXB4+
RXB4-
FOR FHD REVERSE(8bit)
Change in S7LR
MIRROR
RXA4+
RXA4-
RXA3+
RXA3-RXA0-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-RXB0+
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
Pol-changeShift
RXA4+
RXA4-
RXA0+
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXB4+
RXB4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXBCK-RXBCK+
RXB3+
RXB3-
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
RXA4-
RXA4+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXB4-
RXB4+
RXB0-
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXB3-
RXB3+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
HD
P1101
FF10001-30
1
HD_GND_2pin
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
R1106
0
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
LVDS_SEL
+3.3V_Normal
OPT
R1107
3.3K
OPT
R1108
10K
OPT
C1103
10uF
16V
OPT
C1104
1000pF
50V
HD
C1105
0.1uF
16V
PANEL_VCC
HD
L1101
70-ohm
BLM18SG700TN1D
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA2AW2012.09.11
LVDS_LARGE11
Page 33
AVDD_DDR0
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.