Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec sheet is applied all of the LED TV with LJ36B
chassis
2. Designation
(1) Th e adju stment is ac cordi ng to the order which is
designated and which must be followed, according to the
plan whic al Unit: Product Specification Standard.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run).
Temperature : at 25 ºC±5
Relative humidity : 65 ± 10%
Input voltage : 100~220V, 50/60Hz
(6) Adjustment equipments : Color Analyzer (CA-210 or
CA-110), SVC remote controller
(7) Push The “IN STOP KEY” – For memory initialization.
Case1 : Software version up
1) After downloading S/W by USB , TV set will reboot
automatically
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
* After downloading, have to adjust Tool
Option again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push "OK" button.
(3) Punch in the number. (Each model has their number.)
(4) Completed selecting Tool option.
Tool
Tool
Tool
Tool
Tool
ModelModule
32LA613B-SBLGD84244032669463444710897
42LA6130-SBLGD87244032669463444710897
47LA6130-SBLGD88244032669463444710897
55LA6130-SBLGD90244032541463444710897
32LN540B-
SH/SA
32LN540B-
SH/SA
32LN540B-
SH/SA
32LN5400-SB/SALGD20244016281135764301217
39LN5400-SB/SACMI2070244016153135764301217
39LN5400-SB/SAAUO4118244016153135764301217
42LN5400-SB/SALGD23244016281135764301217
42LN5400-SB/SAAUO4119244016153135764301217
47LN5400-SB/SALGD24244016281135764301217
50LN5400-SB/SALGD25244016281135764301217
55LN5400-SB/SALGD26244016153135765939617
32LN536B-SILGD4244016153135764302817
32LN520B-SALGD1004261628113576102441297
42LN5200-SALGD1034261628113576102441297
32LN546B-SMLGD132426161531357610244273
42LN5460-SMLGD135426161531357610244273
47LN5460-SMLGD1362473161531357610244273
option1
option2
option3
option4
option5
LGD20244016281135764301217
CSOT14356244016153135764302817
SHARP6164244016153135764302817
Tool
option6
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In thi s case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
Only for training and service purposes
* RS-232C Connection Method
Connection : PCBA (USB Port) -> USB to Se ri al Ada pter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
▪ Product name of USB to Serial Adapter is UC-232A.
※ Caution: LJ31* chassis support only UC-232A driver. (only use
※ Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER-ON -> Enter
the mode of White-Balance, the pattern will come out.
● Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
● Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
*Manual W/B process using adjusts Remote control.(TBD)
■ Color analy zer(CA10 0+, CA210) should be used in th e
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■Enter White Balance by pushing “►” key at “8. White Balance”.
■ For manual adjustment, it is also possible by the following
sequence.
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface
(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 206 Gray internal pattern will be displayed.
(4) Adjust Cool modes
(i). Fix the one of R/G/B gain to 192 (default data) and decrease
the others
(If G gain is adjusted over 172 and R and B gain less than
192, increase G gain to 192 and increase R gain and B gain
same amount of increasing G gain.)
(ii). If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain.
(iii). If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255 or B
gain is 255
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
※ CASE Cool
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
How to adjust
(1) If G gain is adjusted over 172 and R gain and B gain less
than 192 , Adjust is O.K.
(2) If G gain is less than 172 , increase G gain by up to 172,
and then increase R gain and B gain same amount of increasing
G gain.
(3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
▪ After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is
correctly same then unplug the AC cable. If it is not same, then
correct it same with BOM and unplug AC cable. For correct it to
the model’s module from factory JIG model.
▪ Push the “IN STOP KEY” afte r co mplet ing the funct ion
inspection.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu
8. White Balance, you can select one of 2 Test-pattern: ON,
OFF. Default is inner (ON). By selecting OFF, you can adjust
using RF signal in 206 Gray pattern.
(10) FHD 2D DTS EDID Data (Not Support Deep Color – 8bit)
CheckSumPhysical Address (0x9E)
HDMI 142/8C10
HDMI 242/7C20
- HDMI
4.6.3. Checkpoint
(1) Test voltage
① 3 Poles
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
② 2 Poles
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
① 3 Poles
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
② 2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
5. Local Dimming Function Check
Step1) Turn on TV.
Step2) Press “P-only” key, enter to power only mode and
escape the “P-only” Mode by pressing “Exit” key
Step3) Press “Tilt” key, entrance to Local Dimming mode.
Step4) At the Local Dimming mode, module Edge Backlight
moving Top to bottom Back light of module moving
Step5) confirm the Local Dimming mode
Step6) Press “Exit” key
4.5. Outgoing condition Configuration
■ When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.6. GND & Hi-pot test
4.6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
4.6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TP for CI slot
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORDPCM_A[11]
/PCM_IOWRCI_TS_DATA[1]
/PCM_CE
/PCM_IRQA
/PCM_CD
/PCM_WAIT
PCM_RST
PCM_5V_CTL
CI_DET
TP for S2
PCM_D[0]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[12]
PCM_A[13]
PCM_A[14]
TP for FE_TS_DATA
CI_TS_CLK
CI_TS_VAL
CI_TS_SYNC
CI_TS_DATA[2]
CI_TS_DATA[3]
CI_TS_DATA[4]
CI_TS_DATA[5]
CI_TS_DATA[6]
CI_TS_DATA[7]
TP for SCART
SCART1_MUTE
SC1_IDPCM_D[1]
SC1_FB
SC1_SOG_INCI_TS_DATA[0]
DTV/MNT_VOUT
SCART1_Lout
SCART1_Rout
SC1_CVBS_IN
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for Headphone
HP_LOUT
HP_ROUT
SIDE_HP_MUTE
HP_DET
S2_RESET
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
TP_NON_EN
2012.07.02
3
L13 POWER BLOCK (POWER DETECT 2)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
FROM LIPS & POWER B/D
+3.5V_ST
MMBT3906(NXP)
Q402
3
1
2
L404
CIC21J501NE
L407
MLB-201209-0120P-N2
L402
MLB-201209-0120P-N2
OPT
R411
33K
PWR ON
3.5V
3.5V
GND
24V
GND
12V
12V
GND
P401
SMAW200-H18S1
1
3
5
7
10
9
11
12
13
14
15
16
17
18
19
.
R415
100
DRV ON
2
PDIM#1
4
PDIM#2
6
GND
8
24V
GND
12V
N.C
GND
RL_ON
+3.5V_ST
R461
10K
+3.5V_ST
+24V
+12V
10K
OPT
R401
R462
10K
B
D401 5V
CIC21J501NE
L408
C406 0.1uF
C418 0.1uF
C404 0.1uF
R416
10K
R406
4.7K
C
Q401
MMBT3904(NXP)
E
OPT
16V
50V
16V
+3.3V_Normal
R419
1K
C
R421
10K
B
E
Q405
MMBT3904(NXP)
R412 3.9K
PWM_DIM_PULL_DOWN
*For 55LN54 Power ON Noise
R408 100
PWM2_2CH_POWER
+3.5V_ST
R426
10K
INV_CTL
PWM_DIM
PWM1
PANEL_POWER
+12V
L412
120
CIS21J121
C438
0.1uF
25V
OPT
PANEL_CTL
001:AL22
R489
10K
+1.5V_DDR
+3.5V_ST
L420
BLM18PG121SN1D
C461
10uF
+3.3V_Normal
10V
R433
10K
R439
33K
R440
5.6K
1
2
3
1.5A
4
B
IC407
C
Q407
MMBT3904(NXP)
E
9
THERMAL
8
7
6
5
R430
10K
AP7173-SPG-13 HF(DIODES)
IN
PG
VCC
EN
[EP]
OUT
FB
SS
GND
C443
10uF
16V
Q409
AO3407A
S
G
C467
560pF
50V
+3.5V_ST --> 3.375V --> 3.46V
+24V --> 3.78V --> 3.92V (3.79V)
Power_DET
+12V
+3.5V_ST
D
R1
R457
4.3K
1/16W
1%
R2
R456
4.7K
1/16W
1%
R405
5.6K
PANEL_VCC
R407
5.6K
C472
22uF
10V
C476
0.1uF
16V
+1.5V_DDR
D403
5V
OPT
PD_+24V
R482
8.2K
1%
PD_+24V
PD_+24V
C412
0.1uF
16V
R403
1.5K
1%
+3.3V_Normal
+24V
C411
0.1uF
16V
PD_+12V
R448
2.7K
PD_+12V
R447
1.2K
1%
1%
+3.5V_ST
PD_+3.5V
R434
10K
R450
0
5%
PWR_DET_ON_SEMI
NCP803SN293
VCC
3
PD_+24V_PWR_DET_ON_SEMI
NCP803SN293
VCC
3
R438
22K
+12V --> 3.58V --> 3.82V (3.68V)
R402-*1
100
+3.5V_SOC_RESET
RESET_IC_SOC_RESET
R402
300
PD_+24V
R480
100
AO3435
Q403
D
S
G
+3.5V_ST
R463
RESET_IC_SOC_RESET
10K
BLM18PG121SN1D
C425
0.1uF
16V
R488
100K
IC408
GND
PD_+24V
R404
100K
IC409
GND
1
1
C423
2.2uF
10V
RESET
2
POWER_DET_RESET
RESET
2
FET_2.5V_AOS
C474
0.1uF
L403
POWER_DET
+3.3V_Normal
IC408-*1
APX803D29
RESET
PWR_DET_ON_DIODES
RESET
PD_+24V_PWR_DET_DIODES
C437
22uF
10V
2
1
IC409-*1
APX803D29
2
1
5V
OPT
3
GND
3
GND
D405
VCC
VCC
+5V_Normal
&
+5V_USB
+12V
L401
CIC21J501NE
R410
100K
CHANGE TO
16V/X5R
C405
10uF
16V
4.7uF 10V
C419
Vout=0.8*(1+R1/R2)
L406
R491
0
BST
13
14
15
16
THERMAL
1
SS
3.6uH
10FB11LX12
IC401
TPS65281RGV
17
3
2
ROSC
COMP4RLIM
R409
2K
C410
3300pF
50V
C413
0.047uF
25V
PGND
VIN
V7V
[EP]
EN
C426
100pF
50V
OPT
SW_IN
9
C420
22uF
16V
R413
20K
8
7
6
5
C421
22uF
16V
SW_OUT
AGND
FAULT
EN_SW
R445
R436
15K
PH_3
PH_2
PH_1
SS/TR
B
C441
0.1uF
16V
R432
C488
3300pF
330K1/16W5%
2.2K
C
Q400
MMBT3904(NXP)
E
C448
3300pF
50V
L415
3.6uH
C453
22uF
10V
C456
22uF
10V
R1
R2
FET_2.5V_DIODE
DMP2130L
Q403-*1
S
G
R442
30K
1/16W
1%
R441
75K
1/16W
1%
D
+1.10V_VDDC
C439
50V
100pF
C444
0.1uF
16V
D404
5V
OPT
Vout=0.8*(1+R1/R2)=1.5319
POWER_ON/OFF_1
R443
10K
+2.5V_Normal
+3.3V_Normal
+5V_Normal
R1
R452
33K
1%
C424
330pF
R453
OPT
27K
C417
10uF
10V
85C
1%
50V
R2
R454
11K 1%
CAP_10uF_X5R
CHANGE TO
10UF/10V/X5R
+5V_Normal
C417-*1
10uF 10V
CAP_10uF_X7R
+3.3V_Normal
R414
10K
+5V_USB
R417
4.7K
OPT
C422
0.1uF
16V
OPT
USB1_OCD
USB1_CTL
TJ1118S-2.5
IN
3
IC402
1
GND
OUT
2
CAP_10uF_X5R
CHANGE TO
10UF/10V/X5R
C403
10uF
10V
85C
C403-*1
10uF 10V
CAP_10uF_X7R
C440
0.1uF
16V
+2.5V_Normal
D402
5V
OPT
S7LR core 1.15V volt
R428
10K
EP[GND]
VIN_3
1
THERMAL
2
3
TPS54319TRE
4
5
AGND
15EN16
17
IC403
6
VSENSE
3A
C447
0.33uF
16V
7
COMP
BOOT14PWRGD
13
12
11
10
8
RT/CLK
9
+3.5V_ST
L413
CIC21J501NE
C430
10uF
10V
+3.3V_Normal
VIN_1
VIN_2
GND_1
GND_2
Vout=0.827*(1+R1/R2)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
Power_PD2
2012/09/19
4
IR/LED and Control
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
+3.5V_ST
CONTROL_NO_FILTER
R611
0
CONTROL_FILTER
L601
BLM18PG121SN1D
CONTROL_FILTER
L602
BLM18PG121SN1D
CONTROL_NO_FILTER
R612
0
CONTROL_FILTER
C609
0.1uF
16V
+3.5V_ST
L600
BLM18PG121SN1D
C602
0.1uF
16V
CONTROL_FILTER
C608
0.1uF
16V
C603
1000pF
50V
LED_R/BUZZ
C604
100pF
P600
12507WR-08L
1
2
3
R610
1.8K
OPT
C607
0.1uF
16V
50V
4
5
6
7
8
9
R603
R602
R600
KEY1
KEY2
IR
100
R601
100
10K
10K
1%
1%
R607
3.3K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
IR/CONTROL
2012/07/18
6
USB (SIDE)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
JK700
1234
USB DOWN STR EAM
3AU 04S-3 05-Z C-(LG )
5
C700
22uF
10V
D700
RCLAMP0502BA
OPT
+5V_USB
SIDE_USB1_DM
SIDE_USB1_DP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC4_S7LRM
USB
12/06/20
7
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