LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω
Page 4
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
4. Electrical specification
4.1 General Specification
1. Application range
This specification is applied to the LCD TV used LJ91A
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3)
Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: UL, CSA, IEC specification, CE
- EMC: FCC, ICES, IEC specification, CE
No Item Specification Remark
1.
Receiving System
1) SBTVD / NTSC / PAL-M / PAL-N
2.
Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
3. Input Voltage 1) AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz
4. Market Central and South AMERICA
5.
Screen Size
32 inch Wide (1920 X 1080)32LH35FD-SF
37 inch Wide (1920 X 1080)37LH35FD-SF
42 inch Wide (1920 X 1080)42LH35FD-SF
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 10 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied all of the LJ91A LCD TV
models, which produced in manufacture department or similar
LG TV factory.
2. Notice
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order. But it is
flexible when its factory local problem occurs. .
3) The adjustment must be performed in the circumstance of
25 ±5°C of temperature and 65±10% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes.
• After Receive 100% Full white pattern (06CH) then process
Heat-run
(or “8. Test pattern” condition of Ez-Adjust status)
• How to make set white pattern
1) Press Power ON button of Service Remocon
2) Press ADJ button of Service remocon. Select “8. Test
pattern” and, after select “White” using navigation button,
and then you can see 100% Full White pattern.
* In this status you can maintain Heat-Run useless any
pattern generator
* Notice: if you maintain one picture over 20 minutes
(Especially sharp distinction black with white pattern –
13Ch, or Cross hatch pattern – 09Ch) then it can appear
image stick near black level.
3. Adjustment Items
3.1 PCB Assembly adjustment
• CPLD DOWNLOAD
• Adjust 480i Comp1
• Adjust 1080p Comp1/RGB
- If it is necessary, it can adjustment at Manufacture Line
- You can see set adjustment status at “1. ADJUST
CHECK” of the “In-start menu”
3.2 Set Assembly Adjustment
• EDID (The Extended Display Identification Data ) / DDC
(Display Data Channel) download
• Color Temperature (White Balance) Adjustment
• Make sure RS-232C control
• Selection Factory output option
4. PCB Assembly Adjustment
4.1. CPLD DOWNLOAD : JTAG MODE
4.2. << PRINT PORT >> PIN MAP
PinJTAG Mode Signal Name
2TCK
3TMS
8TDI
11TDO
1315VCC
18 TO 25GND
Page 11
- 11 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.3. << 10P WAFER >> PIN MAP
Page 12
- 12 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.4. Using RS-232C
Adjust 3 items at 3.1 PCB assembly adjustments “4.1.3
000000000000000000000000007c007b006dx
(main)(main : component1 1080p)
ad 00 30
000000070000000000000000007c00830077x
6.Confirm ad 00 99 NG 03 00x (Failed condition)
AdjustmentNG 03 01x (Failed condition)
NG 03 02x (Failed condition)
OK 03 03x (Success condition)
7.
End of Adjustment
ad 00 90 d 00 OK90x
Page 13
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 13 -
5. Factory Adjustment
5.1 Manual Adjust Component 480i/1080p
RGB 1080p
O Summary : Adjustment component 480i/1080i and RGB
1080p is Gain and Black levelsetting at Analog
to Digital converter, and compensate the RGB
deviation
O Using instrument
- Adjustment remocon, 801GF(802B, 802F, 802R) or
MSPG925FA pattern generator (It can output 480i/1080i
horizontal 100% color bar pattern signal, and its output
level must setting 0.7V±0.1V p-p correctly)
* You must make it sure its resolution and pattern cause every
instrument can have different setting
O Adjustment method 480i Comp1, Adjust 1080p
Comp1/RGB (Factory adjustment)
• ADC 480i Component1 adjustment
- Check connection of Component1
- MSPG-925FA Ë Model: 209, Pattern 65
• Set Component 480i mode and 100% Horizontal Color
Bar Pattern(HozTV31Bar), then set TV set to
Component1 mode and its screen to “NORMAL”
• ADC 1080p Component1 / RGB adjustment
- Check connection both of Component1 and RGB
- MSPG-925FA Model: 225, Pattern 65
• Set Component 1080p mode and 100% Horizontal Color
Bar Pattern(HozTV31Bar), then set TV set to
Component1 mode and its screen to “NORMAL”
• After get each the signal, wait more a second and enter
the “IN-START” with press IN-START key of Service
remocon. After then select “7. External ADC” with
navigator button and press “Enter”.
• After Then Press key of Service remocon “Right
Arrow(VOL+)”
• You can see “ADC Component1 Success”
• Component1 1080p, RGB 1080p Adjust is same
method.
• Component 1080p Adjustment in Component1 input
mode
• RGB 1080p adjustment in RGB input mode
• If you success RGB 1080p Adjust. You can see “ADC
RGB-DTV Success”
5.2 EDID (The Extended Display
Identification Data) / DDC (Display Data
Channel) Download.
O Summary
• It is established in VESA, for communication between
PC and Monitor without order from user for building user
condition. It helps to make easily use realize “Plug and
Play” function.
• For EDID data write, we use DDC2B protocol.
O Auto Download
• After enter Service Mode by pushing “ADJ” key,
• Enter EDID D/L mode.
• Enter “START” by pushing “OK” key.
Caution: - Never connect HDMI & D-sub Cable when the user
downloading .
- Use the proper cables below for EDID Writing.
Page 14
- 14 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
O Manual Download
• Write HDMI EDID data
- Using instruments
=> Jig. (PC Serial to D-Sub connection) for PC, DDC
adjustment.
=> S/W for DDC recording (EDID data write and
read)
=> D-sub jack
=> Additional HDMI cable connection Jig.
- Preparing and setting.
=> Set instruments and Jig. Like pic.5), then turn on
PC and Jig.
=> Operate DDC write S/W (EDID write & read)
=> It will operate in the DOS mode.
Pic.3) For write EDID data, setting Jig and another instruments.
• EDID data for LJ91D Chassis (Model name = LG TV)
- HDMI-1 EDID table (0x3D, 0x2C)
- HDM2 EDID table (0x3D, 0x1C)
- HDMI-3 EDID table (0x3D, 0x0C)
- Analog (RGB) EDID table (0xA5, 0x25)
PC
Download jig
RGB cable
Main
B/D
Edid data and Model option download (RS232)
NO Item CMD 1 CMD 2Data 0
Enter
download MODE
Download
Mode In
A E 0 0
When transfer the ’Mode In’ ,
Carry the command.
Edid data and
Model option
download
Download
A E *Note1 *Note2
Automatically download
(The use of a internal Data)
Adjust Mode Out
A E 9 0
Adjustment
Confirmation
A E 9 9
To check Download
on Assembly line.
Page 15
5.3 Adjustment Color Temperature(White
balance)
O Using Instruments
• Color Analyzer: CA-210 (CH 9)
- Using LCD color temperature, Color Analyzer (CA-210)
must use CH 9, which Matrix compensated (White, Red,
Green, Blue compensation) with CS-2100. See the
Coordination bellowed one.
• Auto-adjustment Equipment (It needs when Autoadjustment – It is availed communicate with RS-232C :
Baud rate: 115200)
• Video Signal Generator MSPG-925F 720p, 216Gray
(Model: 217, Pattern 78)
O Connection Diagram (Auto Adjustment)
• Using Inner Pattern
• Using HDMI input
<Pic.5 Connection Diagram for Adjustment White balance> .
O White Balance Adjustment
If you can’t adjust with inner pattern, then you can adjust
it using HDMI pattern. You can select option at "Ez-Adjust
Menu – 7. White Balance" there items "NONE, INNER,
HDMI". It is normally setting at inner basically. If you can’t
adjust using inner pattern you can select HDMI item, and
you can adjust.
In manual Adjust case, if you press ADJ button of service
remocon, and enter "Ez-Adjust Menu – 7. White
Balance", then automatically inner pattern operates. (In
case of "Inner" originally "Inner" will be selected.
• Connect all cables and equipments like Pic.5)
• Set Baud Rate of RS-232C to 115200. It may set
115200 orignally.
• Connect RS-232C cable to set
• Connect HDMI cable to set
¢ RS-232C Command (Commonly apply)
wb0000White Balance adjustment start.
wb 0010Start of adjust gain (Inner white
pattern)
wb001fEnd of gain adjust
wb0020Start of offset adjust(Inner white
pattern)
wb002fEnd of offset adjust
wb00ffEnd of White Balance adjust(Inner
pattern disappeared)
• "wb 00 00": Start Auto-adjustment of white balance.
• "wb 00 10": Start Gain Adjustment (Inner pattern)
• "jb 00 c0" :
• …
• "wb 00 1f": End of Adjustment
* If it needs, offset adjustment (wb 00 20-start, wb 00
2f-end)
• "wb 00 ff": End of white balance adjustment (inner
pattern disappear)
- 15 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
CA-100+
COL OR
ANALYZER
TYPE; CA-100+
Full W hite Pattern
RS-232C
Page 16
- 16 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
O White Balance Adjustment (Manual adjustment)
• Test Equipment: CA-210
- Using LCD color temperature, Color Analyzer (CA-
210) must use CH 9, which Matrix compensated
(White, Red, Green, Blue compensation) with CS-
2100. See the Coordination bellowed one.
• Manual adjustment sequence is like bellowed one.
- Turn to "Ez-Adjust" mode with press ADJ button of
service remocon.
- Select "10.Test Pattern" with CH+/- button and press
enter. Then set will go on Heat-run mode. Over 30
minutes set let on Heat-run mode.
- Let CA-210 to zero calibration and must has gap more
10cm from center of LCD module when adjustment.
- Press "ADJ" button of service remocon and select
"7.White-Balance" in "Ez-Adjust" then press "▶"
button of navigation key.
(When press "▶" button then set will go to full white
mode)
- Adjust at three mode (Cool, Medium, Warm)
- If "cool" mode
Let B-Gain to 192 and R, G, B-Cut to 64 and then
control R, G gain adjustment High Light adjustment.
- If "Medium" and "Warm" mode
Let R-Gain to 192 and R, G, B-Cut to 64 and then
control G, B gain adjustment High Light adjustment.
- All of the three mode
Let R-Gain to 192 and R, G, B-Cut to 64 and then
control G, B gain adjustment High Light adjustment.
- With volume button (+/-) you can adjust.
- After all adjustment finished, with Enter (■ key) turn
to Ez-Adjust mode. Then with ADJ button, exit from
adjustment mode
Attachment: White Balance adjustment coordination and color
temperature.
O Using CS-1000 Equipment.
- COOL : T=11000K, △uv=0.000, x=0.276 y=0.283
- MEDIUM : T=9300K, △uv=0.000, x=0.285 y=0.293
- WARM : T=6500K, △uv=0.000, x=0.313 y=0.329
Page 17
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
300
200
A5
801
LV1
A2
A10
802
803
804
805
521
400
900
120
510
301
500
320
302
540
530
550
806
200T
303
310
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Page 18
Block Diagram
(Front-end)
Cable
ISDB-T/
PAL/NTS
C
TU101/2
Serial
TP1
CVBS1/
SIF1
(System + Scalar)
CVBS_LIVE
2069_L/R_OUT1
MPEG_TS
HDMI0_BCM
SIF_LIVE
CVBS1
CVBS2
AV1 LR
AV2 LR
COMP1_LR
COMP2_LR
RGB_LR
TP1
TP2
NANDFlash
NANDFlash
IC101
IC101
128MB
128MB
(400M MIPS)
DDR2
256MB
256MB
BCM3556
BCM3556
IC100
IC100
(400M MIPS)
DDR2
DDR2
256MB
256MB
LVDS
SPDIF
USB2.0
DDR2
1080P
X-TAL
54MHz
(Etc)
SIDE HDMI_PORT4
UI_HW_PORT1
UI_HW_PORT2
HDMI4
HDMI2
HDMI1
TDA9996
TDA9996
IC601
IC601
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
(Comp1/2, RGB)
HDMI0_BCM
I2C
I2S_BCM
MICOM
MICOM
IC407
IC407
NTP3100L
NTP3100L
IC500
IC500
X-TAL
24MHz
LGE Internal Use Only
Page 19
Power-Up Sequence
¾BCM3556 (Main Chip)
There are no power sequence requirements. Any sequence will be acceptable
All supplies have a minimum ramp up time of 100us. There is no maximum ramp up time restriction
RESET should be held active during ramp up and at least 10ms after all voltages are above 95% of their specified nominal
levels
either 1.2V, 1.8V, 2.5V, 3.3V
either 1.2V, 1.8V, 2.5V, 3.3V
Min 100us
1.2V rail at 1.14V
1.8V rail at 1.71V
2.5V rail at 2.375V
3.3V rail at 3.135V
All power rails above
minimum operating voltage
95%
Reset Input
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Min 10ms
LGE Internal Use Only
Page 20
Power-Up Sequence
¾SAA7164 (MPEG Encoder)
Applications must guarantee all 4 conditions mentioned below during power-on of SAA7164
Condition 1:
RESET has to be LOW, when the 1.2 V digital and the 3.3 V digital supplies become available
RESET has to remain LOW for at least 5 ms after all supplies became available.
Condition 2:
Either power-on the 1.2 V analog and 3.3 V analog supplies simultaneously
Or power-on the 1.2 V analog supplies after the 3.3 V analog supplies
Condition 3:
Either power-on the 1.2 V analog, the 1.2 V digital and 3.3 V digital supplies simultaneously
Or power-on the 1.2 V digital supplies after the 1.2 V analog and 3.3 V digital supplies.
Condition 4:
Either power-on the 2.6 V digital supplies after the 3.3 V digital supplies
Or power-on the 1.2 V digital supplies simultaneously or after the 2.6 V digital supplies.
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 21
Power-Up Sequence
¾Measured Waveform
All power have enough ramp up time (4 ms > minimum 100us)
RESET is negated after last power is ramped up (115 ms > minimum 10ms)
3.3V, 2.6V, 1.2V power sequence requirement of MPEG encoder is satisfied.
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2.5V, 1.8V, 1.2V, RESET3.3V, 2.5V, 1.8V, 1.2V
LGE Internal Use Only
Page 22
1. Power-Up Boot Fail Trouble Shooting
Check P800 All Voltage Level
(20V, 12V, 5V_ST)
Y
Check All Voltage Level
at L804/L807/L808
Y
Check Voltage Level 3.3V at L815
Y
Check Voltage Level 2.5V at L827
Y
Check Voltage Level 1.8V
at IC804 #6 pin
Y
Check Voltage Level 1.2V at L803
Y
Check X201 Clock 54MHz
NY
N
N
N
N
N
N
Check Power connector
Replace one of L804/L807/L808
& Recheck
Replace one of
IC807/IC802/L815/L823/L810/L826
& Recheck
Replace one of IC803/L824/L827
& Recheck
Replace one of IC804/L825
& Recheck
Replace one of
IC809/IC800/L803/L816/L819/L801
& Recheck
Replace X201
N
N
N
N
Replace Power board
Check Micom IC407
Redownload or repla c e
Y
Check signal transition
at IC101 #9 pin
Y
Replace IC101 Flash Memory
N
Maybe BCM3556 has troubles
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 23
2. No OSD Trouble Shooting
Check 12V Voltage Level
at P800 #13 Pin
Y
Check 12V Voltage Level
at L902
Y
Check 12V Voltage Level at L903
Y
Check P903
#16(TXAC-), #17(TXAC+),
#32(TXBC-), #33(TXBC+)
Y
Check LVDS Cable
Y
Check Voltage LCD Module
NY
N
N
N
N
Check Power connector
Replace one of L804/L902
& Recheck
Replace one of
Q900/Q901/Q902/L903
& Recheck
Maybe BCM3556(IC100)
has troubles
Replace Cable
Replace Power board
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 24
3. Digital TV Video Trouble Shooting
Check RF Cable
Y
Check Tuner(TU1101) Power
(5.0V, 2.5V, 3.3V, 1.2V)
Y
Check TP Clock, Data, Sync
R1114, R1103, R1102
Y
Maybe BCM3556(IC100)
has problems
N
N
L1108/L1105/L1100/L1107/L1109
Maybe Tuner(TU1101) has
Replace one of
& Recheck
problems
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 25
4. Analog TV Video Trouble Shooting
Check RF Cable
Y
Check Tuner Power
(5.0V, 2.5V, 3.3V, 1.2V)
Y
Check CVBS Signal
TU1101 #9 Pin
Y
Check CVBS Signal
C102
Y
Maybe BCM3556(IC100)
has problems
N
N
N
L1108/L1105/L1100/L1107/L1109
Maybe Tuner(TU1100) has
Replace one of C1122/R1122
Replace one of
& Recheck
problems
& Recheck
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 26
5. Component Video Trouble Shooting
Check Signal Format
Is it supported signal?
Y
Check Component Cable
Y
Check Component Jack JK700
N
Replace Jack
Y
Check Component Signal
R754, R755, R756
R741, R744, R745
Y
Check Component Signal
C127, C128, C129
C130, C131. C132
Y
Maybe BCM3556(IC100)
has problems
Replace one of
N
N
R754, R755, R756
/L705/L706/L707
R741, R744, R745
/L702/L703/L704
& Recheck
Replace it
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 27
6. RGB Video Trouble Shooting
Check Signal Format
Is it supported signal?
Y
Check RGB Cable
Y
Check RGB Jack JK701
Y
Check RGB Signal
L708, L709, L710
Y
Check Sync Signal
IC702 #11, #3
Y
Check EEPROM (IC703)
N
N
N
N
Replace Jack
Replace It & Recheck
Replace one of R759/R761/IC702
& Recheck
Replace it or re-burn
& Recheck
Y
Maybe BCM3556(IC100)
has problems
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 28
7. AV Video Trouble Shooting
Check Signal Format
Is it supported signal?
Y
Check AV Cable
Y
Check Jack JK700/JK704
Y
Y
N
Replace Jack
Check CVBS Signal
C103
Y
Maybe BCM3556(IC100)
has problems
N
Replace one of
R729/R706/C711/D703
& Recheck
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 29
8. HDMI Video Trouble Shooting
Check Signal Format
Is it supported signal?
Y
Check HDMI Cable
Y
Check HDMI Jack
JK500, JK501, JK503
Y
Check IC601 Voltage Level
+1.8V_HDMI, +3.3V_HDMI
Y
Check I2C Signal
R670/R671
/R605/R606/R616/R617/R639/R64
2
Y
N
N
N
Replace Jack
Replace one of
L601/L602/R665/R663
Replace It & Recheck
Maybe BCM3556(IC100)
has problems
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 30
9. All Source Audio Trouble Shooting
Make sure you can’t hear any
audio
Y
Check Speaker
Y
Check Connector P500
Y
Check Signal
L504, L506
Y
Check IC500 Power
20V, 3.3V, 1.8V
L500,L501,L502,L503,IC504
Y
Check BCM3556 I2S Output
R148, R149, R150
Y
N
N
N
N
N
Replace Speaker
Replace Connector
Replace one of
L508/L509/L510/L511/L504/L506
& Recheck
Replace It & Recheck
Replace It & Recheck
N
Maybe NTP3100 has problems.
Replace It
Maybe BCM3556(IC100)
has problems
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 31
10. Digital TV Audio Trouble Shooting
Check video output
Y
Follow procedure All source
audio trouble shooting
N
N
Follow procedure digital TV
video trouble shooting
Maybe BCM3556 internal audio
DSP has problems. Replace It
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 32
11. Analog TV Audio Trouble Shooting
Check video output
Y
Check Tuner Power
(5.0V, 2.5V, 3.3V, 1.2V)
Y
Check SIF Signal
TU1101 #8 Pin
Y
Check SIF Signal
C1139
Y
Check SIF Signal
C141
Y
Follow procedure All source
audio trouble shooting
N
N
N
N
N
N
Follow procedure analog TV
video trouble shooting
Replace one of
L1108/L1105/L1100/L1107/L1109
& Recheck
Maybe Tuner(TU1101) has
problems
Replace one of
R1124,R1125,C1137,Q1101,R112
9
Recheck
Replace one of R113/R128
& Recheck
Maybe BCM3556 audio block has
problems. Replace It
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 34
13. HDMI Audio Trouble Shooting
Check video output
Y
Re-download EDID data
Y
Follow procedure All source
audio trouble shooting
N
N
N
Follow procedure HDMI video
trouble shooting
Replace IC601
Maybe BCM3556 audio block has
problems. Replace it
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 35
14. USB Trouble Shooting
Check USB 2.0 Cable
Y
Check USB device
If devuce is 2. 5 in ch HDD,
Check power adaptor
Y
Check JK1403
Y
Check 5V voltage level at L1407
Y
Maybe BCM3556(IC100)
has problems. Replace It.
N
N
Replace Jack
Replace one of
L1407/IC1402 & Recheck
• Exception
- USB power could be disabled by inrushing current
- In this case, remove the device and try to reboot the TV (AC power off/on)
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 36
15. Digital TV Recording Fail Trouble Shooting (USING USB HDD)
Check video/audio output
Y
Check USB HDD more 40Gbyte
Y
Maybe IC1402 has problems
Replace It.
N
N
N
Follow procedure digital TV
video/audio trouble shooting
Replace HDD
Maybe BCM3556(IC100) USB
block has problems. Replace It.
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 37
ABCDEFGHIJ
+5.0V_ST
R766
4.7K
R765
22
D733
ENKMC2838-T112
A1
C
A2
4.7K
R768
R772
22
D732
ADLC 5S 03 015
5.5V
OPT
0
R771 0
R773
R774
OPT
16
2.7K
D734
ADMC5M03200L
5.6V
0
SHILED
R777
C768
100pF
/W_PROTECT
D3.3V
JP734
DDC_SCL
DDC_SDA
1K
R778
12:J4
12:E5
12:E4
RGB_SW
9:H6
COMPONENT1/2,AV1
AV
D3.3V
R707
2.7K
D701
ADMC5M03200L
TP7
ADLC 5S 03 015
D702
ADMC5M03200L
5.6V
5.6V
D703
5.5V
7
6
5
JK700
PPJ227-01
9N [GN]E-LUG
5K [GN]O-SPRING-L
6K [GN]CONTACT-L
4E [GN]O-SPRING-S
3E [GN]CONTACT-S
9M [BL]E-LUG
7J [BL]C-LUG-L
8D [BL]C-LUG-S
9L [YL]E-LUG
4L [YL]O-SPRING-S
3L [YL]CONTACT-S
7H [RD]C-LUG-L
8C [RD]C-LUG-S
9G [WH]E-LUG
8M [WH]C-LUG-S_1
7G [WH]C-LUG-L
8B [WH]C-LUG-S_2
9F [RD]E-LUG
4N [RD]O-SPRING-S_1
3N [RD]CONTACT-S_1
5F [RD]O-SPRING-L
6F [RD]CONTACT-L
4A [RD]O-SPRING-S_2
3A [RD]CONTACT-S_2
D704
ADMC5M03200L
5.6V
R729
75
R705
R70 2
470 K
100pF
5.1
C708
C707
1K
R711
R706
15
C712
25V
1uF
R70 8
470 K
R71 0
100
1uF
25V
C711
47pF
OPT
AV1_CVBS_INCM
3:T19
AV1_CVBS_IN
R71 4
100
COMPOSITE1_SW
9:H5
C714
100pF
AV1_INCM
AV1_R_IN
C715
100pF
AV1_L_IN
5:E2
5:E2
3:T20
5:E2
TP4
D712
ADLC 5S 03 015
5.5V
ADLC 5S 03 015
ADLC 5S 03 015
D709
ADMC5M03200L
5.6V
R7285.1
D710
ADMC5M03200L
5.6V
D716
ADMC5M03200L
5.6V
D714
5.5V
D715
5.5V
R73 0
470 K
R73 2
470 K
27pF
C723
25V
COMPONENT1COMPONENT2
D3.3V
R736
27pF
C724
C729
1uF
C731
1uF
25V
2.7K
C734
100pF
27pF
C727
L702
270nH
L703
L704
270nH
270nH
R73 7
100
R73 8
100
27pF
C735
1K
R740
R745
15
27pF
C737
R741
15
27pF
C736
100pF
R744
15
100pF
C738
C739
COMP1_SW
9:H4
COMP1_VID_INCM
11:M17
COMP1_Y
11:M18
COMP1_Pb
COMP1_Pr
5:H3
COMP1_L_IN
COMP1_INCM
5:H3
3:T24
COMP1_R_IN
11:M18
11:M18
TP5
D717
ADLC 5S 03 015
5.5V
D718
ADLC 5S 03 015
5.5V
D721
ADLC 5S 03 015
5.5V
D719
ADMC5M03200L
5.6V
D720
ADMC5M03200L
5.6V
D722
ADMC5M03200L
5.6V
R7495.1
R74 7
470 K
R74 8
470 K
25V
27pF
C741
27pF
C742
27pF
C743
25V
C744
2.7K
100pF
L705
1uF
C745
R750
C747
L706
L707
1uF
D3.3V
270nH
270nH
270nH
R75 1
100
R75 2
R756
15
C752
COMP2_VID_INCM
COMP2_L_IN
COMP2_INCM
3:T22
COMP2_R_IN
COMP2_SW
9:H4
COMP2_Y
COMP2_Pb
COMP2_Pr
11:M16
11:M17
11:M16
11:M17
5:H3
5:H3
1K
R753
R754
15
27pF
C749
27pF
C750
R755
15
27pF
C748
C751
100pF
100
100pF
R,G,B PC INPUT
D2A10D2B11Q312D3A13D3B14VCC
Q2
9
11:M18
11:M19
11:M19
8
7
GND
6Q15
RGB_B
B_VID_INCM
3:T15
RGB_G
G_VID_INCM
3:T15
RGB_R
R_VID_INCM
3:T15
4
D1A
D1B
RGB_VS
11:K10
RGB_HS
11:K10
0.1uF
3Q02
C753
+5.0V
D0B
RGB_VSYNC
1
D0A
RGB_HSYNC
R75 9 22
IC702
74F08D
R761
C710
22uF
16V
RGB_HV_1K
22
R761-*1
1K
RGB_HV_1K
R759-*1
1K
TP1
TP2
TP3
C757
47pF
C758
47pF
C759
47pF
E0
E1
E2
VSS
D726
ADUC30S03010L
D723
ADUC30S03010L
30V
D724
ADUC30S03010L
30V
D725
ADUC30S03010L
30V
IC703
M24C02-RMN6T
1
2
3
4
R762
10K
30V
BG1608B121F
120ohm
L708
BG1608B121F
120ohm
L709
BG1608B121F
120ohm
L710
8
7
6
5
R763
10K
L708-*1
0
L709-*1
0
L710-*1
0
VCC
JP722
WC
SCL
SDA
RGB_0OHM
RGB_0OHM
RGB_0OHM
C760
C761
0.1uF
4700pF
ADLC 5S 03 015
D727
ADUC30S03010L
30V
RED_GND7GREEN_GND8BLUE_GND9NC10SYNC_GND
JK701
KCN-DS-1-0089
D731
5.5V
RED2GREEN3BLUE4GND_15DDC_GND
GND_212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK
11
6
1
SMD Gasket Option
15
R715
SIDE_AV
4
JK704
PPJ218-01
[YL ]O_S PRIN G
4A
[YL ]CON TACT
5A
[YL ]U_C AN
2A
[WH ]C_L UG
3B
[WH ]U_C AN
2B
[RD ]O_S PRIN G
4C
[RD ]CON TACT
5C
[RD ]U_C AN
2C
D706
ADLC 5S 03 015
5.5V
ADMC5M03200L
D707
5.6V
R701
75
D3.3V
R712
2.7K
C713
100pF
D705
ADMC5M03200L
5.6V
C716
47pF
50V
OPT
1K
R720
R72 1
470 K
R72 2
470 K
D708
ADMC5M03200L
5.6V
TP6
C719
1uF
25V
C720
1uF
25V
COMPOSITE2_SW
9:H6
R72 5
100
R72 6
100
100pF
100pF
C721
C722
R7345.1
3
RS-232C
C701
0.1uF
C705
0.1uF
C703 0.1uF
2
0.1uF
C704
0.1uF
C702
DOUT2
RIN2
C1+
V+
C1-
C2+
C2-
V-
IC701
MAX3232CDR
1
2
3
4
5
6
7
8
1
L701
BLM18PG121SN1D
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
R703
100
R704
100
+3.3V_ST
C706
0.1uF
R709
4.7K
12:D4;14:U23
4.7K
R718
R719
R713
R716
0
R717
0
100
OPT
100
OPT
RS232C_RxD
RS232C_TxD
C717
220pF
IR
C718
220pF
R723
0
R724
10K
1/16W
OPT
5%
14:X8
14:X7
RxD
TxD
D711
ADUC30S03010L
30V
+5.0V_ST
R727
3.3K
C
B
E
D713
ADUC30S03010L
30V
OPT
US_Commercial
Q701
2SC3052
OPT
R733
100K
R735
US_Commercial
47pF
C726
US_Commercial
100K
R739
47pF
C733
3.3K
B
R742
220
R743
220
+5.0V_ST
C
E
SIDE_CVBS_IN
SIDE_CVBS_INCM
SIDE_L_IN
SIDE_INCM
3:T18
SIDE_R_IN
JK705
KCN-DS-1-0088
Q702
2SC3052
US_Commercial
5:J4
5:J4
6
7
8
9
10
JP718
5:G4
3:T19
PC AUDIO
JK703
PEJ024-01
INCM
1
2
3
4
5
Place this INCM
near connector
Run alongG, B, R traces
Run alongY, PB, Pr traces
SPDIF OPTIC JACK
E_SPRING
3
T_TERMINAL1
6A
B_TERMINAL1
7A
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
SHIELD_PLATE
8
BCM_SPDIF_OUT
11:W20
GAS1
MDS61887701
JP720
JP721
R764
D728
ADUC30S03010L
30V
OPT
GAS2
MDS61887701
D3.3V
1K
GAS3
MDS61887701
R7675.1
D729
ADMC5M03200L
5.6V
D730
ADMC5M03200L
5.6V
+5.0V
C762
0.1uF
GAS4
MDS61887701
R76 9
470 K
R77 0
470 K
JP729
GAS5
MDS61887701
C763
1uF
25V
C764
1uF
25V
JP732
JP730
VINPUT
GAS6
MDS61887701
R77 5
100
R77 6
100
JK702
JST1223-001
GND
1
VCC
2
3
4
C766
100pF
C767
100pF
Fib er O ptic
FIX _POL E
PC_INCM
PC_R_IN
PC_L_IN
3:T14
5:J4
5:J4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BRAZIL DVR DV2009.01.20
AUDIO
317
Page 40
ABCDEFGHIJ
* FROM LIPS & POWER B/D -->Apply changed Pin Map
MLB-201209-0120P-N2
C877
15pF
50V
R851
33K
OPT
C
Q806
B
RT1P141C-T112
+5.0V_ST
L806
2SC3875S(ALY)
5.2V
5.2V
A.DIM
JP1322
C8001
0.1uF
50V
OPC_OUT2
R807
3.3K
GND
GND
GND
12V
GND
20V
OPT
NC
NC
P800
FW20020-24S
1
3
5
7
9
11
13
15
17
19
21
23NC24
BST
OCS
COMP
LDOG
LDFB
GND_1
PWR ON
2
GND
4
GND
6
5.2V
8
5.2V
10
GND
12
12V
14
GND
16
20V
18
INV ON
20
Err Out
22
PWM DIM
R809
150K
1/10W
IC801
SC2621ASTRT
1
2
3
FB
4
5
6
7
JP1314
JP1315
JP1316
JP1317
JP1318
JP1319
JP1320
JP1321
L807
CB4532UK121E
CB4532UK121E
C878
0.1uF
50V
100
R848
R849
OPT
R850
0
OPT
L808
6.8K
+12.0V
CHATTERING_BEAD
MLB-201209-0120P-N2
L817
DH
14
PN
13
GND_2
12
DL
11
DRV
10
NC
9
VCC
8
C809
1uF
must be placed with pin#8,#10 as close as possible.
L817-*1
120
CHATTERING_120
C811
1uF
0.1uF
C853
7
+12.0V
L804
4.7K
R847
C874
330uF
C873
CB4532UK121E
35V
L805
MLB-201209-0120P-N2
1uF
25V
OPC_NON
R861
0
R860
0
OPC_EN
C876
0.1uF
50V
OPT
C875
16V
0.1uF
OPT
C881
1uF
25V
MLB-201209-0120P-N2
OPT
001:AF12
L809
C871
C872
22uF
0.1uF
16V
50V
BCMPWM_VBR_A
6
BCMPWM_VBR_B
OPC_OUT
5
MLB-201209-0120P-N2
L814
OPT
S1
S2
S3
G
OPT
Q801
Si4800BDY
1
2
3
4
D8
8
D7
7
D6
6
D5
5
C803
0.068uF
R805
1.8K
10uF10V
OPT
C805
C807
2200pF
OPT
L812
MLB-201209-0120P-N2
4
1%
OPT
R802
10K
C801
OPT
10uF
R803
OPT
10V
1.1K
3
LDO BLOCK
(For TUNER 5V)
E
+5.0V_ST
Q808
2SC3052
C879
0.1uF
16V
OPT
D801
1N4148W
100V
+3.3V_ST
R854
33K
Q807
C880
220uF
16V
C882
330uF
35V
+3.3V_ST
+5.0V
R852
3.3K
C
R822
10K
B
E
Q802
2SC3875S(ALY)
OPT
R853
0
C813
1uF
25V
C883
22uF
16V
R856
OPT
1K
R859
0
C
R862
B
10K
OPT
OPT
E
C886
1uF
25V
OPT
C884
1uF
35V
R830
10K
OPT
R834
0
C
R855
B
5%
10K
E
OPT
+20.0V
R857
10K
OPT
ERROR_OUT
RL_ON
OPT
120K
R863
INV_ON/OFF
OPT
L820
MLB-201209-0120P-N2
1%
OPT
R812
20K
C818
10uF
10V
OPT
LDO BLOCK
(For ENC / ENC DDR)
1%
R813
4.7K
OPT
S1
S2
S3
G
Q804
Si4800BDY
1
2
3
4
MLB-201209-0120P-N2
OPT
C843
10uF
6.3V
L821
OPT
D8
8
D7
7
D6
6
D5
5
C823
6800pF
R826
10K
D3.3V
MLB-201209-0120P-N2
C858
33uF
10V
D3.3V
L824
0
R835
R827
3.3K
10uF10V
OPT
C824
GND_1
C827
470pF
C887
22uF
16V
NC_2
4
VIN
3
EN
2
NC_1
1
SC4215ISTRT
IC803
SC2621ASTRT
BST
OCS
COMP
FB
LDOG
LDFB
NC_3
5
VO
6
ADJ
7
GND
8
MLB-201209-0120P-N2
R828
330K
1/10W
IC802
1
2
3
4
5
6
7
+12.0V
L818
0
+5.0V
L802
S1
G1
S2
G2
IC808
SI4804BDY
1
2
3
4
2.2uH
D1_2
8
D1_1
7
D2_2
6
D2_1
5
10uF
16V
C815
C8170.1uF
R811
1
C820
3.3nF
R823
R820
10K
1.1K
R825
300
470pF
C822
C826
10uF
16V
C841
10uF
16V
C842
10uF
16V
C831
20V
SANYO
100uF
+5.0V
+12.0V
CHATTERING_BEAD
L823
DH
14
PN
13
GND_2
12
DL
11
DRV
10
NC
9
VCC
8
C838
1uF
must be placed with pin#8,#10 as close as possible.
L823-*1
120
CHATTERING_120
C839
C855
0.1uF
D2.5V
1uF
C857
1uF
D803
1N4148W
100V
VOUT : 2.533V
MLB-201209-0120P-N2
R840
1%
C835
39K
1%
R841
18K
C864
33uF
10V
+5.0V
C850
10uF
6.3V
0.01uF
L822
MLB-201209-0120P-N2
0.1uF
C846
C852
1000pF
50V
C854
10uF
L827
C851
10uF
6.3V
S1
G1
S2
G2
PGND
VIN
AGND
IC807
SI4804BDY
1
2
3
4
C840
33uF
10V
AOZ1073AIL
1
2
3
FB
4
8
7
6
5
A2.5V
ENG
A2[ GN]
IC805
+12.0V
0
L826
We’ll change SI4804 to KEC’s Product
D3.3V
L810
R844
R838
1%
5.6K
C863
470pF
1K
1%
R839
620
C866
10uF
C847
10uF
C845
10uF
C848
10uF
C867
100uF
D1_2
D1_1
D2_2
D2_1
10uF
16V
C860
C8610.1uF
R837
1
C862
3.3nF
2.2uH
* +1.26V Core for FRC
+1.8V
R846
1K
D805
A1[ RD]
ENG
SAM2333
C
C828
10uF
R816
10K
C830
10V
0.1uF
16V
SC4215ISTRT
NC_1
EN
VIN
NC_2
IC804
1
2
3
4
GND
8
ADJ
7
VO
6
NC_3
5
R818
22K
1%
12.4K
R817
1%
C832
10uF 6.3V
DIMMING_1.8V
LH90_ONLY
L829
MLB-201209-0120P-N2
C890
0.1uF
16V
LH90_ONLY
10K
R821
L825
R829
3.6uH
C865
10uF
10V
R832
C885
0.1uF
20K
1%
C859
10uF
10V
11K
R831
50V
15K
1%
LX_2
8
LX_1
7
EN
6
COMP
5
C856
330pF
+1.8V
C889
330uF
4V
SANYO
L830
MLB-201209-0120P-N2
OPT
C891
0.1uF
OPT
16V
L831
MLB-201209-0120P-N2
C892
0.1uF
16V
+3.3V_MEMC
L832
MLB-201209-0120P-N2
C896
10uF
A3.3V
L815
MLB-201209-0120P-N2
C868
0.01uF
C869
33uF
+1.26V_MEMC
16V
C844
C834
10uF 6.3V
0.1uF
C893
10uF
10V
LH90_ONLY
+1.8V_MEMC
C894
10uF
OPT
10V
D1.8V
C895
10uF
10V
C870
0.1uF
1uF
L816
MLB-201209-0120P-N2
C810
1uF
D800
1N4148W
100V
C812
1uF
S1
G1
S2
G2
IC809
SI4804BDY
1
2
3
4
D1_2
8
D1_1
7
D2_2
6
D2_1
5
+5.0V_ST
L819
0
10uF
16V
C814
C8160.1uF
R810
1
C819
3.3nF
L801
2.2uH
R819
D1.2V
MLB-201209-0120P-N2
R824
1.2K
R814
1%
2K
R815
200
1%
1%
1.5K
470pF
C821
C825
10uF
6.3V
C829
330uF
4V
SANYO
C833
0.01uF
L803
C836
10uF
6.3V
A1.2V
C837
0.1uF
12:I5
LVDS_PANEL_CTRL
R842
R843
+12.0V
L833
CB3216PA501E
R864
C849
47K
4.7uF
22K
R845
OPT
10K
C
2SC3052
B
10K
Q803
E
2SC3052
GND
GND
22K
Q805
R858
OPT
R865
47K
C
B
E
GND
BRAZIL DVR DV
POWER
1uF
C897
Q809
SI4925BDY
1S1
2G1
3S2
4G2
8 D1_2
7 D1_1
6 D2_2
5 D2_1
GND
C898
1uF
+12.0V_LCD
C899
100uF
LH35_LH50_ONLY
2009.01.20
417
We have to decide whether IC803
use after D2.5V test
+1.8V_MEMC
LH50_90_ONLY
R800
13K
LH50_90_ONLY
R801
4.7K
LH50_90_ONLY
LH50_90_ONLY
Si4800BDY
S1
1
S2
2
S3
3
G
4
L811
BG2012B121F
2
LH50_90_ONLY
C800 10uF
1
LDO BLOCK
(For TUNER / BCM)
Q800
D3.3V
BG2012B121F
L813
D8
8
D7
7
D6
6
D5
5
C802
2200pF
R804
15K
1%
LH50_90_ONLY
LH50_90_ONLY
C804 10uF
C806
R806
6.8K
220pF
BST
OCS
COMP
FB
LDOG
LDFB
GND_1
R808
390K
1/10W
IC800
SC2621ASTRT
1
2
3
4
5
6
7
DH
14
PN
13
GND_2
12
DL
11
DRV
10
NC
9
VCC
8
C808
must be placed with pin#8,#10 as close as possible.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Page 41
ABCDEFGHIJ
D3.3V
TUNER
7
+5.0V_TU
L1101
10V
10uF
C1106
TU_LGIT
TU_LGIT
TU_LGIT
C1107
22pF
50V
TU_LGIT
C1108
0.1uF
50V
C1109
22pF
50V
TU_LGIT
19
SHIELD
TU_SHARP
TU1102
VA1G5BF8005
CTR
1
RF-GAIN_SW
2
B0[+5V]
3
VTU
4
RF_AGC
5
TU_LGIT
6
TU1101
TDYR-H071F
5
24
SHIELD
B1[+5V]
6
NC_1
7
SIF
8
VIDEO_OUT
9
NC_2
10
NC_3
11
AIF
12
B2[2.5V]
13
B3[3.3V]
14
B4[1.2V]
15
RESET[SYRSTN]
16
SDA
17
SCL
18
RSEORF
19
SBYTE
20
SPBVAL
21
SRDT
22
SRCK
23
C1116-*1
0.1uF
50V
TU_LGIT
RF_SW
1
GAIN_SW
2
BB
3
B1
4
AFT
5
SIF
6
VIDEO
7
B2
8
B3
9
B4
10
RESET
11
SDA
12
SCL
13
RSEORF
14
SBYTE
15
SPBVAL
16
SRDT
17
SRCK
18
0
R1108
22
22
22
C1116
2200pF
50V
R1109
R1110
R1111
R111222
R111322
R111422
C1118
2200pF
50V
0
R1116
0
R1118
0
R1117
C1121
0.1uF
L1105
C1123
10uF
OPT
R1119
4.7K
C1125
0.01uF
D2.5V
C1124
0.1uF
TUNER_RESETb
SDA0_3.3V
SCL0_3.3V
TU_SYNC
TU_SDATA
TU_SCLK
@netLa
RF_GAIN1
0.01uF
C1128
3:T26
3:T26
C1126
10uF
3:T26
3:T27
3:T27
3:T27
C1127
0.1uF
RF_SW
RF_GAIN1
C1130
0.1uF
C1131
22uF
L1107
Place close to Pin
L1109
C1134
0.1uF
Place close to Pin
D3.3V
L1108
C1132
C1135
0.1uF
10uF
C1133
0.1uF
L1110
C1136
10uF
C1137
0.01uF
R1125
+5.0V_TU
D1.2V
C1138
0.1uF
R1124
12K
10K
+5.0V_TU
+5.0V_TU
R1127
R1129
0
OPT
B
470
R1128
1K
L1111
2012
E
Q1101
2SA1504S
C
A1[RD]
A2[GN]
C1139
0.01uF
LD1101
SAM2333
ENG
SAM2333
LD1102
C
330
R1130
C
TP9
A1[RD]
A2[GN]
D3.3V
TU_SIF
TU_SIF_INCM
3:T25
3:T25
ENG
C1114
0.1uF
16V
R1122
56
R1123
56
C1115
4.7uF
10V
OPT
TU_CVBS_IN
TP8
OPT
GND
+5.0V_TU
C1120
100uF
16V
TU_CVBS_INCM
3:T25
3:T25
C1112
0.1uF
50V
10uF
C1113
0.01uF
50V
16V
C1122
L1102
MLB-201209-0120P-N2
4
L1103
10uH
C1110
91pF
CM3216F100KE
50V
3
2
MAIN & SUB TUNER +5V
C1100
0.1uF
16V
+12.0V
C1101
100uF
16V
INPUT
IC1100
AS7809DTRE1
1
2
GND
3
OUTPUT
C1102
0.1uF
50V
L1100
MLB-201209-0120P-N2
C1103
100uF
16V
C1104
0.33uF
16V
1
VIN
R1100
1K
TU_LGIT
TU_LGIT
2VC3
C1105
0.1uF
50V
VOUT
6
R1106
82
GND2
OPT
4NC5
IC1101
KIA78R05F
GND1
C1111
47uF
16V
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BRAZIL DVR DV
DDR
2009.01.20
6
17
Page 43
ABCDEFGHIJ
7:D7
7:D7
7:D7
7:D7
7:D7
7:D7
7:D7
7:D7
7:D7
7:D7
7:D7
7:D7
7:E7
7:E7
7:E7
7:E7
7:E7
7:E7
7:E7
7:E7
7:E7
008:P27
M_XTALO
7:E7
7:E7
7:E7
7
LVDS_TX_0_DATA0_N
LVDS_TX_0_DATA0_P
LVDS_TX_0_DATA1_N
XTAL
LVDS_TX_0_DATA3_N
LVDS_TX_0_DATA3_P
LVDS_TX_0_DATA4_N
LVDS_TX_1_DATA1_N
LVDS_TX_1_DATA1_P
LVDS_TX_1_DATA2_P
LVDS_TX_1_CLK_P
LVDS_TX_1_CLK_N
0
1/16W
AR2702
LH50_90_ONLY
TX_1_CLK_N
LVDS_TX_1_DATA2_N
TX_1_CLK_P
TX_1_DATA2_P
TX_1_DATA2_N
GPIO12 GPIO14
Non M+S LVDS LOW LOW
M+S 42" Mini LVDS LOW HIGH
M+S 47" Mini LVDS HIGH LOW
M+S 37" Mini LVDS HIGH HIGH
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BRAZIL DVR DV
LVDS
2009.01.20
16
17
Page 53
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