LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
Page 4
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Application range
This spec sheet is applied all of the 32”,42”,46”, 47”, 52”, 55”,
60” LCD TV with LA02B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25±5ºC, (77°±9ºF), CST: 40±5°C
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
ModelMarketAppliance
32LD550-UA North America Safety : UL1492, CSA C22.2.No.1,
42LD550-UA EMC : FCC Class B, IEC Class B
46LD550-UA
52LD550-UA
60LD550-UA
47LD650-UA
55LD650-UA
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 10 -
ADJUSTMENT INSTRUCTION
1. Application range
This spec. sheet applies to LA02B Chassis applied LCD TV
all models manufactured in TV factory
2. Specification
2.1 Because this is not a hot chassis, it is not necessary
to use an isolation transformer. However, the use of
isolation transformer will help protect test instrument.
2.2 AdjThe adjustment must be performed in the
circumstance of 25 ±5 C of temperature and
65±10% of relative humidity if there is no specific
designation.
2.4 The input voltage of the receiver must keep
100~240V, 50/60Hz.
2.5 The receiver must be operated for about 5 minutes
prior to the adjustment when module is in the
circumstance of over 15
In case of keeping module is in the circumstance of
0°C, it should be placed in the circumstance of above
15°C for 2 hours
In case of keeping module is in the circumstance of
below -20°C, it should be placed in the circumstance of
above 15°C for 3 hours,.
Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
3. Adjustment items
3.1 Main PCB check process
• Adjust 480i Comp
• Adjust 1080p Comp
• Adjust RGB
Above adjustment items can be also performed in Final
Assembly if needed. Both Board-level and Final assembly
adjustment items can be check using In-Star Menu 1.ADJUST
CHECK.
3.2 Final assembly adjustment
• EDID/DDC download
• White Balance adjustment
• RS-232C functionality check
• Factory Option setting per destination
• Ship-out mode setting (In-Stop)
3.3 Etc
• Ship-out mode
• Tool option menu
• USB Download(S/W Update, Option, Service only)
4. Automatic Adjustment
4.1. ADC Adjustment
(1) Overview
ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate
RGB deviation.
ad 00 21000000070000000000000000007c00830077x
Confirm adj.ad 00 99NG 03 00x (Fail)
NG 03 01x (Fail)
NG 03 02x (Fail)
OK 03 03x (Success)
End adj.aa 00 90a 00 OK90x
Page 11
- 11 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.2 MAC Address and ESN Key Write
4.2.1 Equipment & Condition
• Play file: Serial.exe
• MAC Address edit
• Input Start / End MAC address
4.2.2 Download method
4.2.2.1 Communication Prot connection
Connect: PCBA Jig-> RS-232C Port== PC-> RS-232C Port
4.2.2.2 MAC Address Download
• Com 1,2,3,4 and 115200(Baudrate)
• Port connection button click(1)
• Load button click(2) for MAC Address write.
• Start MAC Address write button(3)
• Check the OK Or NG
4.2.2.3 Input the ESN Key
• download Model sending Key file
• input by 1 by SET so as not to be duplicated
4.3 LAN PORT + ESN INSPECTION (Automatic IP)
4.3.1 Equipment & Condition
• Each other connection to LAN Port of IP Hub and Jig
4.3.2 LAN inspection solution
• LAN Port connection with PCB
• Network setting at MENU Mode of TV
• setting automatic IP
• Setting state confirmation
- If automatic setting is finished, you confirm IP and MAC
Address.
4.3.3 ESN Key confirmation
• confirm Key input Data at ESN MENU Mode
PCBA
PC(RS-232C)
RS-232C Port
Page 12
- 12 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.4 LAN PORT INSPECTION(PING TEST)
4.4.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test
Program.
*IP Number : 12.12.2.2
4.4.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) remove LAN CABLE
5.
EDID (The Extended Display
Identification Data) / DDC (Display
Data Channel) download
5.1 Overview
It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
5.2 Equipment
• Adjust remocon.
• Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
5.3 Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If
Download is failure, NG is displayed.
5) If Download is failure, Re-try downloads.
•Caution) When EDID Download, must remove RGB/HDMI
Cable.
Page 13
- 13 -
5.4 EDID DATA
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 14
- 14 -
5.5. White Balance Adjustment
(1) Overview
• W/B adj. Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic
Range. In order to prevent saturation of
Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is
lowered to find the desired value.
- Adj. condition : normal temperature
1) Surrounding Temperature: 25±5ºC
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
(2) Equipment
1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model:217, Pattern:78)
-> Only when internal pattern is not available
• Color Analyzer Matrix should be calibrated using CS-1000
(3) Equipment connection MAP
(4) Adj. Command (Protocol)
1) RS-232C Command used during auto-adj.
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.
wb 00 ff -> End white balance auto adj.
2) Adjustment Map
Applied Model : LA02B Chassis ALL MODELS
(5) Auto adj. method
1) Set TV in adj. mode using POWER ON key
2) Zero calibrate probe then place it on the center of the
Display
3) Connect Cable(RS-232C)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sing), check adj. status pre
mode (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
* W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
(6) Manual adj. method
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place
it on the center of LCD module within 10cm of the
surface..
3) Press ADJ key -> EZ adjust using adj. R/C > 6. WhiteBalance then press the cursor to the right (KEY
G ).
(When KEY(
G ) is pressed 216 Gray internal pattern
will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at
192, and the rest will be lowered to meet the desired
value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes
of color temperature.
- If internal pattern is not available, use RF input. In EZ
Adj. menu 6.White Balance, you can select one of 2
Test-pattern: ON, OFF. Default is inner(ON). By
selecting OFF, you can adjust using RF signal in 216
Gray pattern.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Colo r Analyzer
Comp ut er
Pattern Ge n e r ator
RS-232C
RS-232C
RS-232C
Probe
Signal Source
* If TV internal pattern is used, not needed
Connection Diagram of Automatic Adjustment
RS-232C COMMAND
Meaning
[CMDIDDATA]
wb0000Begin White Balance adj.
wb00ffEnd White Balance adj.(Internal pattern disappeared)
ITEMCommandData RangeDefault
(Hex.)(Decimal)
Cmd 1Cmd 2MinMax
CoolR-Gainjg00C0
G-Gainjh00C0
B-Gainji00C0
R-Cut
G-Cut
B-Cut
Medium R-Gainja00C0
G-Gainjb00C0
B-Gainjc00C0
R-Cut
G-Cut
B-Cut
WarmR-Gainjd00C0
G-Gainje00C0
B-Gainjf00C0
R-Cut
G-Cut
Page 15
- 15 -
* Adj. condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
- LCD: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module
surface (80°~ 100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked
using no signal or Full-white pattern.
(7) Reference (White Balance Adj. coordinate and color
temperature)
• Luminance: 216 Gray
• Standard color coordinate and temperature using CS1000 (over 26 inch)
• Standard color coordinate and temperature using CA210(CH 14)
5.4. HDCP (High-Bandwidth Digital
Contents Protection) SETTING
- HDCP setting is not necessary in This Chassis.
5.5 Option selection per country
(1) Overview
- Option selection is only done for models in Non-USA
North America due to rating
- Applied model: LA92A Chassis applied None USA
model(CANADA, MEXICO)
(2) Method
1) Press ADJ key on the Adj. R/C, then select Country
Group Menu
2) Depending on destination, select KR or US, then on the
lower Country option, select US, CA, MX. Selection is
done using +, - KEY
5.6. Tool Option selection
• Method: Press Adj. key on the Adj. R/C, then select Tool
option.
• After final inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode.
• After final inspection, Always turn on the Mechanical S/W.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
ModeColor CoordinationTemp∆UV
xy
COOL0.2690.27313000K0.0000
MEDIUM0.2850.2939300K0.0000
WARM0.3130.3296500K0.0000
ModeColor CoordinationTemp∆UV
xy
COOL0.269±0.0020.273±0.00213000K0.0000
MEDIUM0.285±0.0020.293±0.0029300K0.0000
WARM0.313+0.0020.329±0.0026500K0.0000
Model
Tool 1Tool 2Tool 3Tool 4Tool5
Menu
32LD550
16460 31831 56332 4398 34
4 HDMI, CAN Tuner, 2 COMP , 2AV (REAR /SIDE)
42LD550
24640 31831 56332 4398 34
4 HDMI, CAN Tuner, 2 COMP , 2AV (REAR /SIDE)
46LD550
28748 31831 563324398 34
4 HDMI, CAN Tuner, 2 COMP , 2AV (REAR /SIDE)
52LD550
41036 31831 56332 4398 35
4 HDMI, CAN Tuner, 2 COMP , 2AV (REAR /SIDE)
60LD550
49228 31831 56332 4398 35
4 HDMI, CAN Tuner, 2 COMP , 2AV (REAR /SIDE)
Page 16
- 16 -
6. GND and Internal Pressure check
6.1. Method
1) GND & Internal Pressure auto-check preparation
- Check that Power Cord is fully inserted to the SET.
(If loose, re-insert)
2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V
arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
6.2. Checkpoint
• TEST voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
• TEST time: 1 second
• TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &
NEUTRAL
2. CVBS, Component : 1KHz sine wave signal 0.4Vrms
3. RGB PC : 1KHz sine wave signal 0.7Vrms
8. Etc
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
No Item Min Typ Max Unit
1.
Audio practical max
9.0 10.0 12.0 W EQ Off
Output, L/R AVL Off
(Distortion=10% 8.5 8.9 9.8 VrmsClear
max Output) Voice Off
2. Speaker (8ΩTDB TDB W EQ On
Impedance) AVL On
Clear
Voice On
Power Status
Main B/D Shipping Condition
AC Swithch condtion
Chassis Module Assembly
ON N/A
Front Module Assembly
N/A OFF
Factory incoming ON OFF
Final Assembly ON ON
Ship-Out OFF ON
Page 17
- 17 -
7. USB S/W Download (option)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work.
But your downloaded version is High, USB data is
automatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote controller.
2) Select "Tool Option 1" and Push “OK” button.
3) Punch in the number. (Each model has their number.)
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 18
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 18 -
300
200
800
520
530
810
910
590
120
500
510
540
400
900
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Page 19
COMPONENT/AV
REAR JACK
REAR AV
COMPONENT2
COMPONENT1
REAR AV
COMPONENT2
COMPONENT1
JK100
PPJ237-01
DEV
[RD1]E-LUG
6C
[RD1]O-SPRING
5C
[RD1]CONTACT
4C
[WH1]O-SPRING
5B
[YL1]CONTACT
4A
[YL1]O-SPRING
5A
[YL1]E-LUG
6A
[RD2]E-LUG
6H
[RD2]O-SPRING_2
5H
[RD2]CONTACT
4H
[WH2]O-SPRING
5G
[RD2]O-SPRING_1
5F
[RD2]E-LUG-S
7F
[BL2]O-SPRING
5E
[BL2]E-LUG-S
7E
[GN2]CONTACT
4D
[GN2]O-SPRING
5D
[GN2]E-LUG
6D
[RD3]E-LUG
6N
[RD3]O-SPRING_2
5N
[RD3]CONTACT
4N
[WH3]O-SPRING
5M
[RD3]O-SPRING_1
5L
[RD3]E-LUG-S
7L
[BL3]O-SPRING
5K
[BL3]E-LUG-S
7K
[GN3]CONTACT
4J
[GN3]O-SPRING
5J
[GN3]E-LUG
6J
D104
5.6V
D105
5.6V
D106
5.6V
D107
5.5V
D3.3V
R108
2.7K
C105
100pF
50V
C104 1uF
25V
R104
470K
C101 1uF
R103
470K
25V
R113
1K
R110
0
R109
0
R105
0
C109
100pF
50V
C108
100pF
50V
C106
47pF
50V
AV
REAR_AV_DET
9:G3
REAR_AV_R_IN
10:B5
REAR_AV_L_IN
10:B5
REAR_AV_CVBS
11:C4
D108
5.6V
D109
5.6V
D110
5.5V
D111
5.5V
D112
5.5V
D114
5.6V
D119
5.6V
D115
5.6V
D116
5.5V
D117
5.5V
D113
5.6V
D3.3V
R114
470K
R115
470K
R116
2.7K
C114
27pF
50V
C112
27pF
50V
C113
27pF
50V
R124
470K
R123
470K
C127
27pF
50V
C128
27pF
50V
C115
100pF
50V
C116
1uF
25V
C117
1uF
25V
L102
270nH
L100
270nH
L101
270nH
D3.3V
C132
1uF
25V
C131
1uF
25V
L103
270nH
L104
270nH
R117
0
R118
0
R125
2.7K
C130
100pF
50V
R127
0
R126
0
C122
27pF
50V
C120
27pF
50V
C121
27pF
50V
C133
27pF
50V
C134
27pF
50V
COMPONENT2
R119
1K
C123
100pF
C124
100pF
R100
0
R101
0
R102
10
COMPONENT1
R129
1K
C137
100pF
C136
100pF
R106
0
R107
0
COMP2_DET
9:G5
COMP2_R_IN
10:B5
COMP2_L_IN
10:B5
COMP2_Pr
11:D3
COMP2_Pb
11:D3
COMP2_Y
11:D3
COMP1_DET
9:G5
COMP1_R_IN
10:B5
COMP1_L_IN
10:B5
COMP1_Pr
11:D4
COMP1_Pb
11:D4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L105
D118
5.5V
C129
27pF
50V
270nH
GP2_BCM_ATSC
COMPONENT / AV REAR
C135
27pF
50V
R131
10
COMP1_Y
11:D4
09/10/xx
1 100
Page 20
HDMI SWITCH 1.8V POWER
1.8V FOR HDMI SW
R202
+1.8V_HDMI
OPT
C201
10K
4.7uF
D1.8V
POWER_ON/OFF2_1
R200
120K
OPT
C200
4.7uF
10V
OPT
DEV
Q200
AO3438
EBK60752601
D
S
G
R201
0
Seperated from Common sheet83
N.America & Korea only use 1.8V control
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HDMI_POWER
09/10/xxGP2_BCM_ATSC
2 100
Page 21
EARPHONE BLOCK
USB BLOCK
EARPHONE AMP
HP/BT_LOUT_N
11:F2
HP/BT_LOUT_P
11:F2
HP/BT_ROUT_N
11:F2
HP/BT_ROUT_P
11:F2
R300
R301
4.7K
OPT
1uF
C307
1uF
10V
EARPHONE JACK SIDE
HP_L_OUT
Q26
HP_R_OUT
Q21
C304
1uF
10V
C305
10V
C306
1uF
10V
INL-
INL+
INR+
INR-
4.7K
R302
OPT
R303
Q300
MMBT3904-(F)
OPT
Q301
MMBT3904-(F)
OPT
Close to the IC
SGND
OUTL
15
16
1
2
3
4
EAN60724701
5
OUTR
C
B
E
C
B
E
+3.3V_NORMAL
L302
10uH
C308
1uF
10V
IC300
TPA6132A2
6G07G18
B
9:G3
B
C315
10uF
10V
EN14VDD
13
12
11
10
9
HPVSS
C316
2.2uF
10V
E
Q303
MMBT3904-(F)
OPT
C
SIDE_HP_DET
E
Q302
MMBT3904-(F)
OPT
C
HPVDD
CPP
PGND
CPN
C
C317
0.1uF
16V
B
C318
2.2uF
10V
C319
2.2uF
10V
R314
120
E
Q306
ISA1530AC1
OPT
+3.5V_ST
R315
150
OPT
2SC3052
Q307
R306
100K
OPT
R308
0
1/16W
R307
0
1/16W
Q308
2SC3052
L304
BG2012B080TF
C321
22000pF
50V
+3.3V_NORMAL
R309
4.7K
C
E
L303
BG2012B080TF
C320
22000pF
50V
USB2
+5V_USB
C311
C313
HP_L_OUT
OPT
R310
0
R311
1K
B
SIDE_HP_MUTE
HP_R_OUT
10:D4
0.1uF
USB_PWRFLT2
10uF
10V
R321
2.7K
+3.3V_NORMAL
R320
4.7K
OPT
USB_PWRON2
10:D4
10:D4
10:D4
USB_DM2
USB_DP2
IC301
AP2191SG-13
GND
1
IN_1
2
IN_2
3
EN
4
EAN60921001
DEV
R3180
NC
8
OUT_2
7
OUT_1
6
FLG
5
D303
CDS3C05HDMI1
5.6V
ESD_USB
L301
MLB-201209-0120P-N2
120-ohm
C310
100uF
16V
D301
CDS3C05HDMI1
5.6V
ESD_USB
P30 1
KJA -UB- 4-0 004
1234
USB DOW N S TREA M
5
USB
USB(DVR Ready)
EAG41945401
CHANGE USB_PWRFLT PULL-UP FROM 5V TO 3.3V
USB1 (DVR Ready)
+3.3V_NORMAL
IN_1
IN_2
GND
EN
AP2191SG-13
DEV
IC302
1
2
3
4
EAN60921001
CDS3C05HDMI1
NC
8
MLB-201209-0120P-N2
OUT_2
7
OUT_1
6
FLG
5
R3170
D302
5.6V
ESD_USB
L300
120-ohm
100uF
CDS3C05HDMI1
ESD_USB
C309
16V
D300
5.6V
P30 0
KJA -UB- 4-0 004
1234
USB DOW N S TREA M
5
EAG41945401
+5V_USB
C312
10:D4
C314
0.1uF
10uF
10V
USB_PWRFLT1
10:D4
10:D4
R322
2.7K
JK300
KJA-PH-0-0177
5GND
4L
3DETECT
DEV
1R
EAG61030001
C
B
OPT
E
SIDE_HP_MUTE
Q23;81:I4
USB_DM1
USB_DP1
R319
4.7K
OPT
USB_PWRON1
10:D4
WIRELESS I2C LEVEL SHIFTER
LEVEL SHIFTER
+3.3V_NORMAL
R324
10K
OPT
Q304
G
FDV301N
WIRELESS_SCL
WIRELESS_SDA
OPT
D
S
G
D
Q305
FDV301N
OPT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SCL3_3.3V
SDA3_3.3V
S
GP2_BCM_ATSC
USB/EAR-PHONE
09/10/xx
3 100
Page 22
SMD GASKET FOR EMI (8*6*5.5 FOR LE5400/5500/7500)
SMD GASKET FOR EMI (8*6*12.5T)
GASKET on the Bottom
DEV
GAS 1
GAS 4
GAS 3
GAS 2
GAS 6
GAS 5
GAS 7
GAS 9
GAS 8
GAS 10
GAS 12
GAS 11
GAS 13
SMD GASKET FOR EMI (8*6*7.5 FOR LE8500)
GASKET on the Bottom
DEV
GAS 1-*1
GAS 4-*1
GAS 3-*1
GAS 2-*1
GAS 6-*1
GAS 5-*1
GAS 7-*1
GAS 9-*1
GAS 8-*1
GAS 10-* 1
GAS 12-* 1
GAS 11-* 1
GAS 13-* 1
Draw bottom location when make a new pcb
GAS11
GASKET_12.5T
GAS1-*2
MDS61887708
MDS61887708
GAS2-*2
MDS61887708
GAS3-*2
MDS61887708
GAS4-*2
MDS61887708
GAS6-*2
MDS61887708
MDS61887708
GAS7-*2
MDS61887708
GAS8-*2
MDS61887708
GAS9-*2
MDS61887708
GAS10-*2
MDS61887708
GAS11-*2
MDS61887708
GAS12-*2
MDS61887708
GAS13-*2
GAS5-*2
SMD GASKET FOR EMI (8*6* 9.5T)
GASKET_9.5T
GAS1-*3
MDS61887710
MDS61887710
GAS2-*3
MDS61887710
GAS3-*3
MDS61887710
GAS4-*3
MDS61887710
GAS5-*3
MDS61887710
GAS6-*3
MDS61887710
GAS7-*3
MDS61887710
GAS8-*3
MDS61887710
GAS9-*3
MDS61887710
GAS10-*3
MDS61887710
GAS11-*3
MDS61887710
GAS12-*3
MDS61887710
GAS13-*3
GAS5
GAS3
GAS6
GAS8
GAS2
GAS1
EAX61538101
GAS12
GAS4
GAS9
GAS10
GAS7
GAS5
GAS11
GAS13
GAS3
GAS6
GAS8
GAS1
EAX61746401
GAS10
GAS12
GAS4
GAS9
GAS2
GAS7
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_BCM_ATSC
BCM-DDR
09/10/xx
6 100
Page 24
ATSC TUNER
CHB OPTION
+5V_TU
CHB OPTION
TU701-*1
TDTD-V035F
+B1[1.8V]
1
SCL[SUB]
2
SDA[SUB]
3
RESET[SUB]
4
DIF_2[SUB]
5
DIF_1[SUB]
6
IF_AGC[SUB]
7
CVBS[SUB]
8
SCL[MAIN]
9
SDA[MAIN]
+B2[5V]
+B3[32V]
SIF
CVBS[MAIN]
GND
+B4[1.2V][MAIN]
+B5[3.3V][MAIN]
RESET[MAIN]
IF_AGC[MAIN]
DIF_1[MAIN]
DIF_2[MAIN]
TU701
TUNER_CHB_V
DEV
22
SHIELD
TUNER TYPE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Vertical
1.8V
SCL[SUB]
SDA[SUB]
RESET[SUB]
IF_N[SUB]
IF_P[SUB]
IF_AGC[SUB]
CVBS[SUB]
SCL[MAIN]
SDA[MAIN]
5V
+32V_TU
32V
SIF
CVBS[MAIN]
GND
1.2V[MAIN]
3.3V[MAIN]
RESET[MAIN]
IF_AGC[MAIN]
IF_N[MAIN]
IF_P[MAIN]
Horizon
+1.8V_TU
+1.26V_TU
60mA
R701
R702
200mA
CHB
0
TDTD-V055F
TU700
TDVJ-H031F
TUNER_NON_CHB_V
DEV
19
SHIELD
DEV
TUNER_NON_CHB_H
19
SHIELD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
TU700-*1
TDVJ-H001F
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
N.C
N.C
+5V
N.C
N.C
SCL
SDA
N.C
SIF
N.C
CVBS
GND
1.2V
3.3V
RESET
IF_AGC
IF_N
IF_P
DEV
TUNER_CHB_H
22
SHIELD
10
11
12
13
14
15
16
17
18
19
20
21
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R738
200
OPT
R739
200
OPT
CVBS_CHB_SEARCH
E
Q703
ISA1530AC1
B
OPT
C
11:C4;AI6
+3.3V_TU
+5V_TU
CHB
R712
R713
3.3K
+3.3V_TU
R711
100K
OPT
C716
0.1uF
16V
0
3.3K
CHB
SCL0_3.3V
SDA0_3.3V
R714 0
NON_CHB
TUNER_MAIN_RESET
9:G4
M_IF_AGC
11:D1
M_IF_N
11:D2
M_IF_P
11:D2
+3.3V_TU
L702
500
C717
2.2uF
16V
C718
2.2uF
16V
+5V_TU
0
R715
CHB
0
R716
CHB
16V
0.1uF
C719
OPT
0
R717
CHB
IC700
AP1117EG-13
OUTIN
ADJ/GND
IF_N_CHB
15:A3
IF_P_CHB
15:A3
IF_AGC_CHB
15:A2
C720
47pF
50V
R718
R724
R731
200
CHB
R726
1K
OPT
0
CHB
R727
OPT
1K
R735
200
CHB
CVBS_CHB
E
Q700
ISA1530AC1
B
CHB
C
15:B5;AI7
+5V_TU
R732
470
R737
C721
47pF
50V
Q701
ISA1530AC1
R736
220
Q702
ISA1530AC1
82
B
+5V_TU
R733
220
B
E
C
E
C
+3.3V_TU
R722
R723
3.3K
100
R719
100
R720
3.3K
SCL0_3.3V
SDA0_3.3V
C725
100pF
R728
50V
4.7K
R729
1K
OPT
OPT
R741
0
0
R725
R730
1K
OPT
TU_SIF
11:C5
TU_CVBS
11:C4
NON CHB OPTION
+1.26V_TU
L703
BLM18PG121SN1D
C723
C722
R1
R721
1
22uF
R2
120
22uF
C724
0.1uF
10V
50V
NON_CHB
R734 0
NON_CHB
R740 0
CVBS_CHB
CVBS_CHB_SEARCH
R705
100
CHB
100
R706
CHB
C710
C714
47pF
47pF
50V
50V
CHB
CHB
+3.3V_TU
OPT
R704
R703
100K
100
CHB
C713
0.1uF
16V
CHB
TUNER_SUB_RESET
9:G5
+5V_TU
C700
C706
100pF
0.1uF
50V
16V
CHB
CHB
0
+3.3V_TU
C703
C709
100pF
0.1uF
50V
+5V_TU
C702
22uF
16V
OPT
BLM18PG121SN1D
C704
22uF
16V
16V
+5V_NORMAL
L700
C707
0.1uF
16V
C711
0.1uF
16V
C715
0.1uF
16V
OPT
R707
100
R708
R709
R710
0
0
+3.3V_NORMAL
+3.3V_TU
C701
22uF
16V
OPT
BLM18PG121SN1D
C705
22uF
16V
C708
0.1uF
16V
L701
C712
0.1uF
16V
VOUT = VREF *(1+R2/R1)
GP2_BCM_ATSC
ATSC_TUNER
09/10/xx
7 100
Page 25
NAND FLASH MEMORY
D3.3V
R994
2.7K
I4
I4
I4
A5;I4
A5;I4
I4
81:I5
NAND_RBb
NAND_REb
NAND_CEb
NAND_CLE
NAND_ALE
NAND_WEb
FLASH_WP
Open Drain
D3.3V
R995
10K
C
B
E
C958
0.1uF
Q901
KRC103S
C963
4700pF
BCM3549 Boot Strap
D3.3V
R606
R607
R601
R602
R631
2.7K
R603
R609
OPT
R610
OPT
R604
R605
2.7K
2.7K
OPT
2.7K
2.7K
OPT
OPT
2.7K
2.7K
2.7K
2.7K
OPT
2.7K
OPT
R627
2.7K
OPT
R628
2.7K
OPT
R629
2.7K
R630
2.7K
R6082.7K
OPT
R632
2.7K
R633
2.7K
R634
2.7K
R635
2.7K
R636
2.7K
C1;I4
C1;I4
C1;I4
C1;I4
C1;I4
C1;I4
C1;I4
C1;I4
A2;I4
A2;I4
NAND_IO[0]
NAND_IO[1]
NAND_IO[3]
NAND_IO[2]
NAND_IO[4]
NAND_IO[6]
NAND_IO[5]
NAND_IO[7]
NAND_ALE
NAND_CLE
MODEL OPTION
D3.3V
FRC
GIP
R600100
OPT
R637100
OPT
R638100
OPT
R639100
OPT
OPT
R660 2.7K
NON_GIP
R659 2.7K
R641 2.7K
R640 2.7K
R642 2.7K
NON_FRC
R643 2.7K
R645 2.7K
OPT
OPT
R646 2.7K
IC901
NAND04GW3B2DN6E
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
VDD_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
1
2
3
4
5
DEV
6
RB
7
R
8
E
9
10
11
12
13
14
15
CL
16
AL
17
4G8G
W
18
WP
19
20
21
22
23
24
EAN61009301
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
I/O6
I/O5
I/O4
NC_25
NC_24
NC_23
VDD_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
NAND_IO[7]
NAND_IO[6]
NAND_IO[5]
NAND_IO[4]
C959
0.1uF
NAND_IO[3]
NAND_IO[2]
NAND_IO[1]
NAND_IO[0]
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
MAIN_FLASH_4G_NUMONYX
Boot Strap
Default Res. of all NAND pin is Pull-down
NAND_IO[0] : Flash Select (1)
0 : Boot From Serial Flash
1 : Boot From NAND Flash
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_BCM_ATSC
BCM-BOOT/FLASH/GPIO
09/10/xx
9 100
Page 26
BCM3549 LVDS/AUDIO
BBS CONNECT
AUDIO INCM
Route INCM between associated
left and right signals of same channel
The INCM trace ends at the
same point where the connector
ground connects to the board ground
(thru-hole connector pin).
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
#CAUTION
Location numer is mixed
100 & 1000
GP2_BCM_ATSC
BCM-LVDS/AUDIO
09/10/xx
10 100
Page 27
BCM3549 VIDEO
+5V_NORMAL
Place this test point
near connector
Run alongsideG, B, R traces
Run alognsideY, PB, Pr traces
Run alognsideL, C traces
Run along CVBS
Run along SIF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AR1503
22
VSB_SOP
VSB_CLK
VSB_DATA
VSB_VALID
E7;G2
E7;G2
E7;G2
E7;G2
R1532 100
R1533 100
SDA2_3.3V
SCL2_3.3V
GP2_BCM_ATSC
CHB15 100
09.10
Page 30
Motion Remote controller
Motion Remocon Interface
P2000
12507WR-08L
9
M_REMOTE
+3.3V_NORMAL
M_REMOTE_RX
9:F3;9:G4
M_REMOTE_TX
9:F3;9:G4
+3.3V_NORMAL
R2005
2.7K
R2006
L2000
1
2
3
4
5
6
7
8
120-ohm
BLM18PG121SN1D
R2000
100
R2001
100
R2002
100
R2003
100
R2004
100
ALL M_REMOTE OPTION
2.7K
R2007
2.7K
M_RFModule_RESET
9:F3;9:G4
DC
9:F3;9:G3
DD
9:F3;9:G3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_BCM_ATSC
MOTION_REMOCON
09/10/xx
20 100
Page 31
MINI-LVDS FROM URSA3
[LEFT FFC Connector to Module RIGHT Conn]
(60Pin Mini-LVDS)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMMON
URSA3 120Hz MINI_LVDS
09/10/xx
74
Page 32
LVDS FROM BCM3549
[51Pin LVDS From BCM]
PANEL_VCC
L7600
CIC21J501NE
NON_SCAN
R7600 0
TM480Hz
C7600
10uF
25V
OPT
R76040
TM480Hz
R76050
OPT
R76060
TM480Hz
R76070
OPT
R7601 33
TM480Hz
R7602 33
TM480Hz
R7603 33
TM480Hz
C7601
1000pF
50V
TM480Hz
P7600
TF05-51S
TM480Hz
52
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
C7602
0.1uF
50V
TM480Hz
LVDS_TX_1_DATA4_P
LVDS_TX_1_DATA4_N
LVDS_TX_1_DATA3_P
LVDS_TX_1_DATA3_N
LVDS_TX_1_CLK_P
LVDS_TX_1_CLK_N
LVDS_TX_1_DATA2_P
LVDS_TX_1_DATA2_N
LVDS_TX_1_DATA1_P
LVDS_TX_1_DATA1_N
LVDS_TX_1_DATA0_P
LVDS_TX_1_DATA0_N
LVDS_TX_0_DATA4_P
LVDS_TX_0_DATA4_N
LVDS_TX_0_DATA3_P
LVDS_TX_0_DATA3_N
LVDS_TX_0_CLK_P
LVDS_TX_0_CLK_N
LVDS_TX_0_DATA2_P
LVDS_TX_0_DATA2_N
LVDS_TX_0_DATA1_P
LVDS_TX_0_DATA1_N
LVDS_TX_0_DATA0_P
LVDS_TX_0_DATA0_N
SCAN_BLK2
OPC_EN
SCAN_BLK1/OPC_OUT
PWM_DIM
FRC_RESET
SCL3_3.3V
SDA3_3.3V
R7608
10K
OPT
+3.3V_NORMAL
R7609
3.3K
OPT
R7610
10K
OPT
LVDS_SEL
JEIDA
HIGH
GND(NC)
VESA
10BIT
8BIT
BIT_SEL
OPC_OUT
OPEN
GND
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMMON
BCM 60Hz LVDS
09/10/xx
76 100
Page 33
LVDS FROM URSA3
[LEFT FFC Connector to Module LEFT Conn]
(51Pin LVDS)
[51Pin LVDS Connector]
(For FHD 120Hz)
P7700
TF05-51S
FRC_LVDS
52
PANEL_VCC
1
2
3
4
5
6
7
8
R7700 0
9
NON_LGD_22/NON_LED
R7701 0
10
NON_LGD_22/NON_LED
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
R7702 0
42
43
44
45
46
47
48
49
50
51
L7700
500
FRC_LVDS
C7700
10uF
25V
OPT
R77060
OPT
R77070
OPT
R77080
OPT
R77090
OPT
C7701
1000pF
50V
FRC_LVDS
RXA4-
RXA4+
RXA3-
RXA3+
RXACK-
RXACK+
RXA2-
RXA2+
RXA1-
RXA1+
RXA0-
RXA0+
RXB4-
RXB4+
RXB3-
RXB3+
RXBCK-
RXBCK+
RXB2-
RXB2+
RXB1-
RXB1+
RXB0-
RXB0+
SCAN_BLK2
OPC_EN
SCAN_BLK1/OPC_OUT
PWM_DIM
C7702
0.1uF
50V
FRC_LVDS
R7710
10K
8BIT
BIT_SEL
10BIT
8BIT GND
R7708-*1 0
FHD_OPC
+3.3V_NORMAL
JEIDA
HIGH
GND(NC)
OPEN
R7711
3.3K
R7712
10K
VESA
LVDS_SEL
JEIDA
VESA
OPC_OUT
[RIFHT FFC Connector to Module RIGHT Conn]
(41Pin LVDS)
[41Pin LVDS Connector]
(For FHD 120Hz)
P7701
TF05-41S
FRC_LVDS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
RXD4-
RXD4+
RXD3-
RXD3+
RXDCK-
RXDCK+
RXD2-
RXD2+
RXD1-
RXD1+
RXD0-
RXD0+
RXC4-
RXC4+
RXC3-
RXC3+
RXCCK-
RXCCK+
RXC2-
RXC2+
RXC1-
RXC1+
RXC0-
RXC0+
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMMON
URSA3 120Hz LVDS
09/10/xx
77 100
Page 34
FROM LIPS & POWER B/D
+3.5V_ST
RT1P141C-T112
Q8002
R8004
R8000
RL_ON
C8000
100uF
C8001
100uF
16V
25V
10K
+3.5V_ST
+12V
MLB-201209-0120P-N2
C8003
0.1uF
50V
#16/#20/#23
LD - GND OR USE
LE(N.L.D.) - OPEN
LE(L.D.) - USE
C
B
E
MLB-201209-0120P-N2
C8004
0.1uF
16V
L8002
Q8000
2SC3052
L8003
C8005
0.1uF
50V
4.7K
C8006
0.1uF
16V
<OS MODULE PIN MAP>
CMO(09)
PIN No
LGD
INV_ON
18
V4:VBR-A
20
V5:NC
PWM_DIM
22
Err_out
24
LED:GND
A-DIM
NC
PWM_DIM
INV_ON
CHECK PWR/MODULE PIN MAP
+12V
L8000
CIC21J501NE
R8003
22K
OPT
R8002
10K
C
R8001
PANEL_CTL
81:A2
+12V
L8001
C8002
10uF
25V
47K
Q8001
B
2SC3052
E
3
1
2
0
0
0
OPT
R8005
R8076
R8007
POWER_23_42/47_LOCAL_DIM
MO_MOSI
M2_MOSI
AUO
INV_ON
Err_out
A-DIM
PWM_DIM
C8008
0.01uF
25V
R8008
+5V_USB
MP8706EN-C247-LF-Z
IN
SW_1
SW_2
C8007
0.1uF
BST
R8006
22
POWER_23_GND
C8009
0.1uF
50V
R8010
B
22K
IC8000
1
2
3
4
EAN31346002
NR8040T3R6N
PWR ON
24V
GND
GND
3.5V
3.5V
GND
GND
12V
12V
12V
GND/P.DIM2
R8009
0
POWER_23_SCAN_BLK2
SCAN_BLK2
SHARP
INV_ON
Err_out
PWM_DIM
GND
C8010
25V
10K
R8011
1.8K
C
Q8003
2SC3052
E
3A
L8004
3.6uH
NORMAL_26~55
P8000
FW20020-24S
24V
2
1
2
1
3
3
5
5
7
7
9
9
11
11
13
13
15
15
17
17
19
19
2122
21
2324
23
SLIM_32~55
SMAW200-H24S2
OPT
C8011
0.1uF
16V
C8012
1uF
25V
OPT
10uF
OPT
C8013
4.7uF
50V
GND
8
VCC
7
FB
6
EN/SYNC
5
4
4
6
6
8
8
10
10
12
12
14
14
16
16
18
18
20
20
22
24
25
P8001
POWER_20_SCAN_BLK1
C8014
1uF
50V
24V
GND
GND
3.5V
3.5V
GND
GND/V-sync
INV ON
A.DIM
P.DIM1
Err OUT
POWER_16_GND
0
POWER_24_GND
R8014
POWER_24_PWM_DIM
R8065
0
POWER_22_SCAN_BLK2
SCAN_BLK2
Q8004
AO3407A
S
G
C8015
OPT
C8016
100pF
50V
R8012
10K
POWER_ON/OFF2_1
R8013
10K
+5V_USB
MLB-201209-0120P-N2
R8015
POWER_22_PWM_DIM
D
1uF
25V
Vout=(1+R1/R2)*0.8
L8005
C8018
0.1uF
50V
POWER_16_V_SYNC
POWER_18_INV_CTL
R8019
100
0
R8018
100
POWER_24_INV_CTL
R8020
POWER_24_ERROR_OUT
PANEL_POWER
MAX 1500mA
1%
R8016
33K
R1
1%
R8017
6.2K
R2
R8082
V_SYNC
0
R8028
0
OPT
+3.3V_NORMAL
R8026
1K
C
R8023
6.8K
OPT
E
0R8022
POWER_20_PWM_DIM
C8017
0.1uF
OPT
OPT
C8019
100pF
50V
0R8027
C8021
1uF
25V
OPT
0R8024
0R8025
PANEL_VCC
C8022
0.1uF
50V
C8020
22uF
10V
0R8021
0
POWER_20_ERROR_OUT
L_VS
R_VS
MO_SCLK
M2_SCLK
MO_MOSI
M2_MOSI
+24V
POWER_16_42/47_LOCAL_DIM
R8078
0
C8024
68uF
35V
R8036
0
R80770
POWER_20_42/47_LOCAL_DIM
B
Q8005
2SC3052
POWER_18_A_DIM
R8029
POWER_22_A_DIM
R8030 0
POWER_20_A_DIM
R8031 0
OPT
M2_SCLK
MO_SCLK
+3.5V_ST
R8038
10K
R8032
10K
R8039
10K
OPT
0
0R8033
NON_OPC/NON_IOP
SCAN_BLK1/OPC_OUT
0R8034
POWER_SCAN1/FHD_OPC
0R8035
POWER_22_HD_OPC
C8023
0.1uF
16V
+5V_USB
+3.3V_NORMAL
OPT
R8037
4.7K
C8025
0.1uF
16V
OPT
PWM_DIM
ERROR_OUT
R_VS
L_VS
INV_CTL
A_DIM
OPC_OUT
+12V
L8007
CIC21J501NE
C8030
C8028
10uF
10uF
25V
25V
Vout=0.8*(1+R1/R2)
BCM core 1.2V volt
IC8001
MP2208DL-LF-Z
AGND
1
SS
15
2
PGND_1
THERMAL
3
SW_1
4
IN_1
5
NC
6
DEV
BS
7
EAN60911601
C8032
0.1uF
+3.5V_ST
L8006
C8027
0.1uF
C8026
0.1uF
MLB-201209-0120P-N2
C8029
22uF
16V
BCM DDR 1.8V
+3.5V_ST
L8008
CIC21J501NE
Placed on SMD-TOP
C8031
C IN
22uF
10V
+5V_NORMAL
IC8003
AOZ1072AI
PGND
1
VIN
2
AGND
3
FB
4
EAN60922901
R8040
100K
R8041
10
C8035
22uF
Vout=0.9*(1+R1/R2)
C8034
0.01uF
25V
BST
VIN
LX
PGND
SGND
2A
DEV
L8009
C8036
0.1uF
R8042
0
IC8002
MP2108DQ
1
2
3A
3
4
DEV
5
EAN60991601
2uH
14
13
12
11
10
9
8
C8033
1uF
10V
C8067
0.1uF
EP
FB
EN/SYNC
PGND_2
SW_2
IN_2
POK
VCC
L8010
8
7
6
5
R8044
10K
R8045
0
R8043
470K
LX_2
LX_1
EN
COMP
1%
R8046
30K
1%
R1R2
C8037
22uF
10V
3.6uH
NR8040T3R6N
POWER_ON/OFF2_2
R8050
10K
12KC8046
2200pF
R8049
3.9K
OPT
R8047
C8040
POWER_ON/OFF2_1
C8047
22uF
10V
D1.2V
R8048
910K
1%
L8011
BLM18PG121SN1D
C8041
22uF
10V
C8043
22uF
10V
Vout=0.8*(1+R1/R2)
Max 1100 mA
L8012
10
9
8
7
6
Replaced Part
RUN
VREF
COMP
FB
SS
C8038
0.01uF
25V
10K
R8052
C8042
0.01uF
25V
C8039
3300pF
50V
DEV
R8051
6.8K
3.6uH
NR8040T3R6N
100pF
MAX 350mA
C8066
22uF
10V
A1.2V
C8045
0.1uF
16V
POWER_ON/OFF1
OPT
50V
C8044
R2
R8056
10K
1/10W
1%
R8053
47K
5.6K
R8054
R8055
10K
MAX 3.1A
R1
R8057
10K
1%
+5V_NORMAL
1%
R1
1%
OPT
100pF
50V
1%
R2
C8048
22uF
10V
C8049
0.1uF
16V
D1.8V
Placed on SMD-TOP
C8050
0.1uF
15V-->3.6V
20V-->3.5V
24V-->3.48V
12V-->3.58V
ST_3.5V-->3.5V
Power_DET
OPT
R8080
14K 1%
+12V
L8013
CIC21J501NE
C8051
C8052
0.1uF
22uF
25V
50V
C8053
10uF
16V
R8058
20K
C8054
3300pF
50V
+3.3V_NORMAL
500
C8055
0.1uF
L8014
+12V
R8063
12K
PD_+12V
R8064
5.1K
1/16W
NON_PD_+3.5V
POWER 24V
R8061-*1
24K 1%
POWER 24V
R8062-*1
4.3K 1%
+24V
POWER 20V
R8061
24K 1%
POWER 20V
R8062
5.1K 5%
+3.5V_ST
+3.3V_NORMAL
R8060
10K
R8066
VIN
3
AGND
2
1
PGND
COMP
EN
FB
6
IC8005
4
AOZ1024DI
5
EAN60660601
A2.5V
NC_1
R8059
10K
0.1uF
Vout=0.8*(1+R1/R2)
C8056
OPT
EN
VIN
NC_2
+3.5V_ST
R8067
14K
1%
5%
POWER_ON/OFF2_2
OPT
3.9K
LX
7
IC8004
SC4215ISTRT
1
2
3
4
0IPMGS1010A
1%
PD_+3.5V
VCC
8
7
6
5
NCP803SN293
VCC
3
GND
R8079
100K
IC8008
NCP803SN293
3
1
GND
L8015
3.6uH
GND
ADJ
VO
NC_3
R8068
100K
IC8007
1
EAN60670101
2
C8057
22uF
10V
RESET
2
R8074
100
RESET
MAX 2.3A
C8059
22uF
10V
VOUT : 2.533V
R8073
18K
1%
R8072
39K
1%
C8058
10uF
16V
R2
R1
R8081
100
C8069
OPT
50V
+3.5V_ST
R8075
10K
OPT
For RESET at 8kV ESD
+3.3V_NORMAL
1%
R8069
27K
1%
4.7K
R8070
1%
R8071
10K
C8061
10uF
16V
POWER_DET
C8065
0.1uF
16V
L8016
CIC21J501NE
C8063
0.1uF
16V
A2.5V
500
C8062
0.1uF
L8017
D3.3V
C8064
0.1uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
MICOM
Ver. 1.4
5
Page 36
+3.5V_ST
EYEQ
R8225
50V
R8227 1.5K
R8224
100
C8212
100pF
LED_R/BUZZ
100
EYEQ
R8226
100
50V
IR & KEY
KEY1
KEY2
+3.5V_ST
R8202
Q8200
2SC3052
47K
R8203
C
B
E
R8201
0
OPT
R8200
IR
22
+3.5V_ST
R8205
47K
R8206
3.3K
+3.5V_ST
OPT
COMMERCIAL
IR_OUT
COMMERCIAL
R8207
22
R8204
47K
10K
C
B
Q8201
E
2SC3052
R8211
10K
1%
R8209
100
R8210
100
R8214
COMMERCIAL_EU
Q8202
2SC3052
COMMERCIAL_EU
R8213
10K
1%
BLM18PG121SN1D
BLM18PG121SN1D
+3.5V_ST
47K
C
B
E
COMMERCIAL_EU
R8212
0
COMMERCIAL_US
L8200
L8201
+3.5V_ST
R8216
10K
C8206
0.1uF
R8218
COMMERCIAL
Q8204
2SC3052
COMMERCIAL
C8207
0.1uF
L8202
BLM18PG121SN1D
C8208
0.1uF
+3.5V_ST
47K
C
B
COMMERCIAL
E
16V
R8220
47K
D8200
5.6V
AMOTECH
D8201
5.6V
AMOTECH
C8209
1000pF
50V
+3.3V_NORMAL
LED_B/LG_LOGO
L8203
BLM18PG121SN1D
C8210
0.1uF
16V
NEC_EEPROM_SCL
NEC_EEPROM_SDA
C8211
1000pF
Zener Diode is
WIRELESS
IR_PASS
R8208
WIRELESS
+3.5V_ST
R8215
47K
WIRELESS
22
R8217
C
Q8203
B
2SC3052
WIRELESS
WIRELESS
E
+3.5V_ST
R8219
47K
WIRELESS
10K
Q8205
2SC3052
WIRELESS
R8221
47K
C
B
WIRELESS
E
close to wafer
C8213
1000pF
50V
OPT
C8214
1000pF
50V
OPT
AMOTECH
D8204
CDS3C05HDMI1
5.6V
OPT
C8215
0.1uF
16V
D8206
5.6V
R8276
1.5K
D8205
CDS3C05HDMI1
5.6V
OPT
R8280
10K
P8200
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
ETHERNET CONNECT
EPHY_TDP
D8207
5.6V
EPHY_TDN
EPHY_RDP
EPHY_RDN
EPHY_LINK
EPHY_ACTIVITY
D8208
5.6V
D8209
D8210
5.6V
5.6V
D8212
D8211
5.6V
5.6V
C8216
1000pF
50V
1000pF
C8217
A2.5V
L8204
CIC21J501NE
D3.3V
R8281 510
R8282 510
JK8200
XRJV-01V-D12-180
1
2
3
4
5
6
7
8
D1
D2
D3
D4
9
RS232C
+3.5V_ST
C8200 0.33uF
C8201
0.1uF
C8202
0.1uF
C8203
0.1uF
C8204
0.1uF
DOUT2
RIN2
C1+
C1-
C2+
C2-
V+
V-
IC8200
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
C8205
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.5V_ST
4.7K
OPT
R8222
R8223
4.7K
OPT
D8202
CDS3C30GTH
30V
IR_OUT
D8203
CDS3C30GTH
30V
R8273 0
R8272
R8274
R8275
R8277
100
R8278
100
0
0
0
OPT
R8279
Trace impedance : 100 ohm differenctial impedance to GND plane
10
5
9
0
BCM_RXD1
NEC_RXD
BCM_TXD1
NEC_TXD
8
7
6
SPG09-DB-009
P8201
4
3
2
1
5 mils trace width with 7 mils air gap on P/N pair.
Adjacent TX/RX differential pairs should be separated by more than
15 mils to each other
Page 37
SHIELD
20
EAG59023302
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R8302
D8302
5.5V
OPT
1K
GND
R8307
0
R8308
0
GND
KRC104S
Q8302
JP8304
JP8305
E
C
KRC104S
Q8305
B
DDC_SDA_1
DDC_SCL_1
* HDMI CEC
E
C
KRC104S
Q8307
B
DDC_SDA_4
DDC_SCL_4
E
C
B
R8321
4.7K
GND
D8311
5.5V
OPT
HDMI_HPD_4
5V_HPD4
5V_HDMI_4
CEC_REMOTE
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
CEC_REMOTE
R8326
D8312
MMBD301LT1G
+3.5V_ST
22K
G
SBD
Q8308
BSS83
+3.3V_HDMI
HDMI_CEC
+3.3V_NORMAL
E
C
B
R8311
4.7K
HDMI_HPD_1
5V_HPD1
5V_HDMI_1
D8305
5.5V
OPT
GND
CEC_REMOTE
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
JACK_GND
GND
20
EAG42463001
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R8316
D8308
5.5V
1K
GND
OPT
KRC104S
GND
Q8306
JP8306
R8317
0
R8318
JP8307
0
+3.3V_HDMI
L8300
BLM18PG121SN1D
C8324
0.1uF
5V_HDMI_1
A1CA2
5V_HDMI_3
A1CA2
19
HPD
18
+5V_POWER
17
DDC/CEC_GND
16
SDA
15
SCL
14
NC
13
CEC
12
CLK-
11
CLK_SHIELD
10
CLK+
9
DATA0-
8
DATA0_SHIELD
7
DATA0+
6
DATA1-
5
DATA1_SHIELD
4
DATA1+
3
DATA2-
2
DATA2_SHIELD
1
DATA2+
R8314
47K
R8315
47K
HDMI_3
GND
JK8302
YKF45-7058V
HDMI_JALCO
SHIELD
20
EAG59023302
JK8300
YKF45-7058V
HDMI_JALCO
SHIELD
20
EAG59023302
JK8301
YKF45-7058V
HDMI_3_JALCO
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
19
18
17
16
15
14
13
12
11
10
DDC_CLK
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
KJA-ET-0-0032
GND
D8300
5.5V
GND
OPT
KRC104S
GND
R8303
0
R8304
0
GND
HDMI_3
R8305
0
R8306
0
HDMI_3
Q8300
JP8300
JP8301
GND
KRC104S
Q8301
HDMI_3
JP8302
JP8303
R8300
1K
GND
D8301
5.5V
OPT
HDMI_3
R8301
1K
GND
UI_HW_PORT1
E
KRC104S
Q8303
E
C
B
C
DDC_SDA_2
DDC_SCL_2
UI_HW_PORT2
E
KRC104S
Q8304
E
HDMI_3
C
B
C
DDC_SDA_3
DDC_SCL_3
UI_HW_PORT3
B
R8309
4.7K
R8310
4.7K
HDMI_3
HDMI_HPD_2
5V_HPD2
5V_HDMI_2
D8303
5.5V
OPT
GND
CEC_REMOTE
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
HDMI_HPD_3
B
5V_HPD3
5V_HDMI_3
D8304
5.5V
OPT
GND
CEC_REMOTE
CK-_HDMI3
CK+_HDMI3
D0-_HDMI3
D0+_HDMI3
D1-_HDMI3
D1+_HDMI3
D2-_HDMI3
D2+_HDMI3
JK8303
+5V_NORMAL
5V_HPD1
D8306
+5V_NORMAL
5V_HPD3
D8307
HDMI_3
R8313
47K
HDMI_3
SHIELD
QJ4119C-CFFB8-7F
HDMI_FOXCONN
R8312
47K
20
JK8302-*1
DEV
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
09/10/xxCOMMON
RGB/SPDIF84 100
Page 39
(New Item Developmen H:9.2mm)
SIDE_AV
PPJ235-01
JK8500
5A
[YL]E-LUG
4A
[YL]O-SPRING
3A
[YL]CONTACT
4B
[WH]O-SPRING
3C
[RD]CONTACT
4C
[RD]O-SPRING
5C
[RD]E-LUG
D8502
5.6V
D8503
D8500
D8501
5.6V
5.5V
5.6V
+3.3V_NORMAL
R8500
470K
R8501
470K
R8502
2.7K
C8500
100pF
50V
R8503
0
C8501
C8502
R8504
1K
1uF25V
1uF25V
C8503
47pF
SIDE_AV_CVBS
50V
SIDE_AV_DET
R85 05
0
R85 06
0
C8504
100pF
C8505
100pF
SIDE_AV_L_IN
SIDE_AV_R_IN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMMON
SIDE_AV
09/10/xx
85 100
Page 40
WIRELESS READY
Wireless power
+24V
C8700
0.1uF
50V
R8702
0
10K
MC14053BDR2G
Y1
Y0
Z1
Z
Z0
INH
VEE
VSS
WIRELESS_DL_RX
WIRELESS_TX
BCM_TX
WIRELESS_PWR_EN
WIRELESS
R8700
0
R8701
WIRELESS
R8705
2.2K
B
NON_WIRELESS
R8703
IC8700
1
WIRELESS
2
3
4
5
6
7
8
JK8700
KJA-PH-3-0168
VCC[24V/20V/17V]_1
VCC[24V/20V/17V]_2
VCC[24V/20V/17V]_3
VCC[24V/20V/17V]_4
VCC[24V/20V/17V]_5
VCC[24V/20V/17V]_6
OPT
4.7K
47K
R8711
R8712
+3.3V_NORMAL
R8714
10K
R8713 1K
WIRELESS_SW_CTRL
RS232C & Wireless
WIRELESS_SW_CTRL
LOW
R8704
22K
C8701
2.2uF
S
G
Q8701
D
AO3407A
C
Q8700
E
0
16
15
14
13
12
11
10
9
VDD
Y
X
X1
X0
A
B
C
+3.5V_ST
WIRELESS
R8707
BCM_TXD1
R8708
R8706
0
NON_WIRELESS
C8702
0.01uF
50V
0
BCM_RXD1
WIRELESS
R8709
0
1/4W
3216
0
WIRELESS_DETECT
WIRELESS_SCL
WIRELESS_SDA
WIRELESS_RX
WIRELESS_TX
IR_PASS
C8703
0.1uF
WIRELESS_DL_TX
WIRELESS_RX
+3.5V_ST
BCM_RX
OPT
DETECT
INTERRUPT
GND_1
RESET
GND_2
I2C_SCL
I2C_SDA
GND_3
UART_RX
UART_TX
GND_4
GND_5
GND_6
IR
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
SHIELD
SELECT PIN
X1/Y1/Z1
STATUS
WIRELESS Dongle connect --> WIRELESS RS232HIGH
WIRELESS Dongle Dis_con --> S7 RS232X0/Y0/Z0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
3D_IR_GENDER / POWER
BLANK
BLANK
BLANK
BLANK
BLANK
BLANK
SELECTABLE
SHEET 090
SHEET 091
SHEET 092
SHEET 093
SHEET 094
SHEET 096
SHEET 097
SHEET 098
SHEET 099
URSA3 (NO L.D.)
T-CON (NO L.D.)
BLANK
LG5111 (L.D.) from URSA3
URSA3 (L.D.)
T-CON (L.D.)SHEET 095
BLANK
LG5111 (L.D.) from BCM
BLANK
BLANK
SELECTABLE
WITHOUT
LOCAL
DIMMING
WITH
LOCAL
DIMMING
T240Hz
WITH
LOCAL
DIMMING
T4800Hz
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_BCM_ATSC
INDEX100 100
09/10/xx
Page 46
Page 47
1. Power-up boot check
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check stand-by Voltage.
P8000 9~12pin : +3.5V_ST
ok
Check Micom Voltage
IC8101 pin 48 : +3.5V
ok
Check X8101 clock
32 KHz
ok
Check P404 PWR_ON.
1pin : 3.3V
ok
Check Multi Voltage
P8000 2 pin : *20V , 17 pin : 12V
ok
No
No
No
No
Check Power connector
Replace L8003
Replace X8101
Re-download Micom software.
Replace Power Board
okNo
Main B/D 3.5V Line
Short Check
ok
Replace Power board.
No
Replace Micom(IC8101 ) or Main board
*20V Voltage is dependent on Model
32/42/46LD550 , 47LD650 => 20V
52/60LD550 , 55LD650 => 24V
Check IC402/3/5/7 Output Voltage
IC8001 : 1.2V
IC8003 : 1.8V
IC8004 : 2.5V
IC8005 : 3.3V
ok
Check X1001 Clock
54 MHz
ok
Check LVDS Power Voltage
Q8004 : 12V
ok
Check FRC(IC9001)LVDS Output
ok
Check Inverter Control
P8000 18 pin : High
No
No
No
No
No
Replace IC8001/ 3 /4 / 5
Replace X1001
Replace Q8004
Check IC402/3/5/7 Output Voltage
IC8903 : 3.3V
IC8001 : 1.5V
IC8902 : 1.2V
Check Power Board or Module
No
Replace IC8901/ 2/ 3
OK
Replace FRC(IC9001)or Main Board
ok
Change Module
Page 48
2. Digital TV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check RF Cable & Signal
ok
Check Tuner 5V Power
L700
ok
Check Tuner 3.3V Power
L701
ok
Check Tuner 1.2V Power
IC700 2pin : 1.26V
ok
Check IF_P/N Signal
TU700 17/18 Pin
ok
Check FRC and BCM LVDS Output
No
No
No
No
No
No
Check IC8003
Replace IC8003
ok
Replace L8007
Replace L701
Replace IC700.
Bad Tuner. Replace Tuner.
Replace Mstar(IC9001) or BCM( IC900)
or Main Board.
Page 49
3. Analog TV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check RF Cable & Signal
ok
Check Tuner 5V Power
L700
ok
Check Tuner 3.3V Power
L701
ok
Check Tuner 1.2V Power
IC700 2 pin : 1.2V
ok
Check CVBS Signal
TU700 11 Pin
ok
Check FRC and BCM LVDS Output
No
No
No
No
No
No
Check IC8003
Replace IC8003
ok
Replace L8007
Replace L701
Replace IC700.
Bad Tuner. Replace Tuner.
Replace Mstar(IC9001) or BCM( IC900)
or Main Board.
Page 50
4. AV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
ok
Check AV Cable for damage
for damage or open conductor
ok
Check JK100 , JK8500
CVBS Signal Line
R105 , R8503
No
ok
No
Check CVBS_DET Signal
ok
Check FRC and BCM LVDS Output
No
5. Component Video
Check input signal format.
Is it supported?
ok
Check Component Cable
for damage or open conductor.
Replace Jack
Replace R113 or R8504
Replace Mstar(IC9001) or BCM( IC900)
or Main Board.
ok
Check JK100
Y/PB/PR signal Line
No
ok
No
Check COMP_DET Signal
ok
Check FRC and BCM LVDS Output
No
Replace Jack
Replace R119 or R129
Replace Mstar(IC9001) or BCM( IC900)
or Main Board.
Page 51
6. RGB Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
ok
Check RGB Cable conductors
for damage or open conductor
ok
Check EDID & EEPROM
IC8401 I2C Signal R8415,
R8416, R8417,R8421(SDA,SCL)
ok
Check P8400
H/V_Sync/R/G/B Signal Line
R8408, R8409, R8410
ok
Check DSUB_DET
ok
Check FRC and BCM LVDS Output
No
No
No
No
Re-download EDID data or Replace th e d e f ective I C
Replace Jack
Replace R8425
Replace Mstar(IC9001) or BCM( IC900)
or Main Board.
Page 52
7. HDMI Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
ok
Check HDMI Cable conductors
for damage or open conductor.
ok
Check HDMI Switch
IC8300 video Signal and I2C line
ok
Check JK8300 / 1 / 2 / 3
ok
Check HDMI_DET(HPD)
ok
Check HDMI Signal output
of HDMI Switch (IC8300)
ok
Check FRC and BCM LVDS Output
No
No
No
No
No
Check L8300(+3.3V) , Q200 (+1.8V)
Replace Jack
Replace R8300.R8302, R8301,R8316
Check resister R8329 ~ R8334
If no problem, check signal line
Replace Mstar(IC9001) or BCM( IC900)
or Main Board.
No
Replace Coil or FET
OK
Replace the defective IC.
No
Replace BCM( IC900) or Main Board
Page 53
8. All Source Audio
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check the TV Speaker Menu
(Menu -> Sound -> TV Speaker)
On
Check AMP IC(IC8801) Power
*20V, 3.3V, 1.8V.
ok
Check AUDIO_MASTER_CLK
R8828
ok
Check AMP I2C Line
R8804, R8805
ok
Check Mstar I2S Output
R8801, R8802, R8803
Off
No
No
No
Toggle the Menu
Check Regulator IC8800
No
Replace BCM( IC900) or Main Board.
Check signal line. Or replace BCM( IC900)
Check signal line. Or replace BCM( IC900)
*20V Voltage is dependent on Model
32/42/46LD550 , 47LD650 => 20V
52/60LD550 , 55LD650 => 24V
ok
Check Output Signal P8800
1, 2, 3, 4 pin.
ok
Check Connector & P8800
ok
Check speaker resistance
and connector damage.
No
No
No
Replace Audio AMP IC(IC8801)
Replace connector
if found to be damaged.
Replace speaker.
Page 54
9. Digital TV Audio
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check RF Cable & Signal
ok
Check Tuner 5V Power
L700
ok
Check Tuner 3.3V Power
L701
ok
Check Tuner 1.2V Power
IC700 2 pin : 1.2V
ok
Check IF_P/N Signal
TU700 17/18 Pin
ok
Follow procedure
‘8. All source audio’
trouble shooting guide.
No
No
No
No
Check IC8003
Replace L701
Replace IC700
Bad Tuner. Replace Tuner.
No
Replace IC8003
ok
Replace L8007
Page 55
10. Analog TV Audio
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check RF Cable & Signal
ok
Check Tuner 5V Power
L700
ok
Check Tuner 3.3V Power
L701
ok
Check Tuner 1.2V Power
IC700 2 pin : 1.2V
ok
Check CVBS Signal
TU700 11 Pin
ok
Follow procedure
‘8. All source audio’
trouble shooting guide.
No
No
No
No
Check IC8003
Replace L701
Replace IC700.
Bad Tuner. Replace Tuner.
No
Replace IC8003
ok
Replace L8007
Page 56
11. AV Audio
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check AV Cable for damage
for damage or open conductor
ok
Check JK100 , JK8500
& Signal Line
No
ok
Follow procedure
‘8. All source audio’
trouble shooting guide.
12. Component Audio
Check Component Cable
for damage or open conductor.
ok
No
Check JK100 & Signal Line
ok
Replace Jack
Replace Jack
Follow procedure
‘8. All source audio’
trouble shooting guide.
13. RGB Audio
Check Cable conductors
for damage or open conductor
ok
Check JK8401 & Signal Line
ok
Follow procedure
‘8. All source audio’
trouble shooting guide.
No
Replace Jack
Page 57
14. SPDIF Audio
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check AV Cable for damage
for damage or open conductor
ok
Check JK8400
& Signal Line
No
ok
Follow procedure
‘8. All source audio’
trouble shooting guide.
15. Headphone Audio
Check Component Cable
for damage or open conductor.
ok
Check L302 (+3.3V_NORMAL)
ok
Check HP/BT OUT_Signal
(input of IC300)
No
No
Replace Jack
Replace L302
Replace C304 ~ 307
ok
Check IC300 & HP_L/R_OUT
ok
Check JK300
& Signal Line
ok
Follow procedure
‘8. All source audio’
trouble shooting guide.
No
Replace IC300
No
Replace Jack (JK300)
Page 58
JACK PACK
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
JACK PACK
at REAR
at REAR
IF +/-
RF
TDVJ
TU_CVBS
SIF
-
H001F
AV
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
SDA/SCL_5V
Reset / IF_AGC …
CVBS, L/R
Y Pb Pr, L/R
Y Pb Pr, L/R
RGB/H/V
Audio L/R
4x1
HDMI Switch
NXP
BCM3549
BCM3549
(ATSC)
(ATSC)
LVDS_60HzLVDS_120Hz
FRC_URSA3
DDR3 (1Gbit)
Hynix
DDR_Data[0:15], DQS, DM …
Addr.[ ], ctrl. data
Data[16:31]
Data [0 … 7]
Addr[0…1], CS …
MCLK
LCD Module
(FHD, 120Hz)
DDR2 (128Mbit)
Nanya
DDR2 (128Mbit)
Nanya
NAND Flash
(4GB)
DDR2 (128Mbit)
Nanya
DDR2 (128Mbit)
Nanya
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
LAN
HDMI4
JACK PACK
JACK PACK
at SIDE
at SIDE
USB1
USB2
Side AV
Wireless Ready
SPDIF
MAX3232
CVBS, L/R
DP/DM/ +5V
DP/DM/ +5V
RX/TX
I2S
HP_L/R
SCL, SDA_3.3V
SCL, SDA_3.3V
54MHz(3rdovertone)
Digital AMP
NTP7000L
Earphone
NVRAM
MICOM
(uPD)
X-tal
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