LG 42LB65 Series, 42LB650V Service Manual

Printed in KoreaP/NO : MFL67985212 (1403-REV00)
CHASSIS : LD42B
MODEL : 42LB65** 42LB65**-Z*
42LB650V 42LB650V-TA
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
SERVICE MANUAL
North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com
Internal Use Only
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION .............................................................. 13
BLOCK DIAGRAM ................................................................................. 21
EXPLODED VIEW .................................................................................. 22
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental sh orts of the cir cui try that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precau­tions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharg­ing wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads elec­trically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective mate­rial to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or cir­cuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropri­ate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remain­ing on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed when­ever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LED TV used LD42B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
ea ch dra wing and spe cificat ion by part n umber in accordance with BOM.
(5) The receiver must be operated for about 20 minutes prior
to the adjustment.
3. Test method
(1) Performance: LGE TV test method followed (2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
No. Item Specication Remarks
1 Market EU(PAL Market-37Countries) DTV & Analog (Total 37 countries)
DTV (MPEG2/4, DVB-T) : 29 countries
Germany, Netherland, Switzerland, Hungary, Austria, Slov­enia, Bulgaria, France, Spain, Italy, Belgium, Luxemburg, Greece, Czech, Croatia, Turkey, Moroco, Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania, Bosnia, Serbia, Slovakia, Beralus
DTV (MPEG2/4, DVB-T2): 8 countries
UK(Ireland), Sweden, Denmark, Finland, Norway, Ukraine, Kazakhstan, Russia
DTV (MPEG2/4, DVB-C): 37 countries
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria, France, Spain, Italy, Belgium, Russia, Luxemburg, Greece, Czech, Croatia, Turkey, Moroco, Ire­land, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania, Bosnia, Serbia, Slovakia, Beralus, UK, Sweden, Denmark, Finland, Norway, Ukraine, Kazakhstan
DTV (MPEG2/4,DVB-S): 30 countries
Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria, France, Spain, Italy, Belgium, Russia, Luxemburg, Greece, Czech, Croatia, Turkey, Moroco, Ire­land, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania, Bosnia, Serbia, Slovakia, Beralus
Supported satellite : 22 satellites
HISPASAT 1C/1D, ATLANTIC BIRD 2, NILESAT 101/102, ATLANTIC BIRD 3, AMOS 2/3, THOR 5/6, IRIUS 4, EUTELSAT-W3A, EUROBIRD 9A, EUTELSAT-W2A, HOTBIRD 6/8/9, EUTELSAT-SESAT, ASTRA 1L/H/M/ KR, ASTRA 3A/3B, BADR 4/6, ASTRA 2D, EUROBIRD 3, EUTELSAT-W7, HELLASSAT 2, EXPRESS AM1, TURK­SAT 2A/3A, INTERSAT10
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
No. Item Specication Remarks
2 Television system
1) Digital TV
- DVB-T/T2
- DVB-C
- DVB-S/S2
2) Analogue TV
- PAL/SECAM B/G/I/D/K
- SECAM L/L’
3 Program coverage
1) Digital TV
- VHF, UHF
- C-Band, Ku-Band
2) Analogue TV
- VHF : E2 to E12
- UHF : E21 to E69
- CATV : S1 to S20
- HYPER : S21 to S47
4 Receiving system
Analog : Upper Heterodyne Digital : COFDM, QAM
► DVB-T
- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2 (Model : *L*V*-Z* (T2 only Model))
- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-C
- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s
- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM
► DVB-S/S2
- symbolrate DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s DVB-S (QPSK) : 2 ~ 45Msymbol/s
- viterbi DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8 DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
5 Scart (1EA) PAL, SECAM
Scart 1 Jack is Full scart and support ATV/DTV-OUT (not support DTV Auto AV)
6 Video Input RCA(1EA) PAL, SECAM, NTSC4.43
4 System : PAL, SECAM, NTSC4.43, PAL60 Hybrid Type
7 Head phone out
Antenna, AV1, AV2, Component, HDMI1, HDMI2, HDMI3, USB1, USB2, USB3
8 Component Input (1EA)
Y/Cb/Cr Y/Pb/Pr
Hybrid Type
9 HDMI Input (3EA)
HDMI1-DTV HDMI2-DTV HDMI3-DTV
HDMI1: PC support(HDMI version 1.3) Support HDCP
10 Audio Input (3EA)
DVI Audio Component/AV2 AV1
L/R Input.
11 SDPIF out (1EA) SPDIF out 12 USB (1EA) EMF, DivX HD, For SVC (download) JPEG, MP3, DivX HD 13 Ethernet Connect(1EA) Ethernet Connect 14 PCMCIA Card slot (1EA) PCMCIA slot
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5. Component Video Input (Y,
Pb, Pr)
No.
Specication
Resolution H-freq(kHz) V-freq(Hz) Pixel clock
1. 720×480 15.73 60.00 SDTV, DVD 480i
2. 720×480 15.63 59.94 SDTV, DVD 480i
3. 720×480 31.47 59.94 480p
4. 720×480 31.50 60.00 480p
5. 720×576 15.625 50.00 SDTV, DVD 625 Line
6. 720×576 31.25 50.00 HDTV 576p
7. 1280×720 45.00 50.00 HDTV 720p
8. 1280×720 44.96 59.94 HDTV 720p
9. 1280×720 45.00 60.00 HDTV 720p
10. 1920×1080 31.25 50.00 HDTV 1080i
11. 1920×1080 33.75 60.00 HDTV 1080i
12. 1920×1080 33.72 59.94 HDTV 1080i
13. 1920×1080 56.250 50 HDTV 1080p
14. 1920×1080 67.5 60 HDTV 1080p
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
6.2. PC mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
1 640 x 350 @70Hz 31.468 70.09 EGA
2 720 x 400 @70Hz 31.469 70.08 DOS
3 640 x 480 @60Hz 31.469 59.94 VESA(VGA)
4 800 x 600 @60Hz 37.879 60.31 VESA(SVGA)
5 1024 x 768 @60Hz 48.363 60.00 VESA(XGA)
6 1152 x 864 @60Hz 54.348 60.053 VESA
7 1280 x 1024 @60Hz 63.981 60.020 VESA(SXGA)
8 1360 x 768 @60Hz 47.712 60.015 VESA(WXGA)
9 1920 x 1080 @60Hz 67.5 60.00 WUXGA(Reduced Blanking)
6. HDMI Input
6.1. DTV mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)
1. 640*480 31.469 / 31.5 59.94/60 SDTV 480P
2. 720*480 31.469 / 31.5 59.94 / 60 SDTV 480P
3. 720*576 31.25 50 SDTV 576P
4. 720*576 15.625 50 SDTV 576I
5. 1280*720 37.500 50 HDTV 720P
6. 1280*720 44.96 / 45 59.94 / 60 HDTV 720P
7. 1920*1080 33.72 / 33.75 59.94 / 60 HDTV 1080I
8. 1920*1080 28.125 50.00 HDTV 1080I
9. 1920*1080 26.97 / 27 23.97 / 24 HDTV 1080P
10. 1920*1080 28.125 25 HDTV 1080P
11. 1920*1080 33.716 / 33.75 29.976 / 30.00 HDTV 1080P
12. 1920*1080 56.250 50 HDTV 1080P
13. 1920*1080 67.43 / 67.5 59.94 / 60 HDTV 1080P
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) VIC 3D input proposed mode Proposed
1
640*480
31.469 / 31.5 59.94/ 60 25.125 1
Top-and-Bottom Side-by-side(half)
Secondary(SDTV 480P) Secondary(SDTV 480P)
2 62.938/63 59.94/ 60 50.35/50.4 1
Frame packing Line alternative
Secondary(SDTV 480P) (SDTV 480P)
3 31.469 / 31.5 59.94/ 60 50.35/50.4 1 Side-by-side(Full) (SDTV 480P)
4
720*480
31.469 / 31.5 59.94 / 60 27.00/27.03 2,3
Top-and-Bottom Side-by-side(half)
Secondary(SDTV 480P) Secondary(SDTV 480P)
5 62.938/63 59.94 / 60 54/54.06 2,3
Frame packing Line alternative
Secondary(SDTV 480P) (SDTV 480P)
6 31.469 / 31.5 59.94 / 60 54/54.06 2,3 Side-by-side(Full) (SDTV 480P)
7
720*576
31.25 50 27 17,18
Top-and-Bottom Side-by-side(half)
Secondary(SDTV 576P) Secondary(SDTV 576P)
8 62.5 50 54 17,18
Frame packing Line alternative
Secondary(SDTV 576P) (SDTV 576P)
9 31.25 50 54 17,18 Side-by-side(Full) (SDTV 576P)
10
1280*720
37.5 50 74.25 19
Top-and-Bottom Side-by-side(half)
Primary(HDTV 720P) Primary(HDTV 720P)
11 75 50 148.5 19
Frame packing Line alternative
Primary(HDTV 720P) (HDTV 720P)
12 37.500 50 148.5 19 Side-by-side(Full) (HDTV 720P)
13 44.96 / 45 59.94 / 60 74.18/74.25 4
Top-and-Bottom Side-by-side(half)
Primary(HDTV 720P) Primary(HDTV 720P)
14 89.91/90 59.94 / 60 148.35/148.5 4
Frame packing Line alternative
Primary(HDTV 720P) (HDTV 720P)
15 44.96 / 45 59.94 / 60 148.35/148.5 4 Side-by-side(Full) (HDTV 720P)
16
1920*1080
33.72 / 33.75 59.94 / 60 74.18/74.25 5
Top-and-Bottom Side-by-side(half)
Secondary(HDTV 1080I) Primary(HDTV 1080I)
17 67.432 / 67.50 59.94 / 60 148.35/148.5 5
Frame packing Field alternative
Primary(HDTV 1080I) (HDTV 1080I)
18 33.72 / 33.75 59.94 / 60 148.35/148.5 5 Side-by-side(Full) (HDTV 1080I)
19 28.125 50.00 74.25 20
Top-and-Bottom Side-by-side(half)
Secondary(HDTV 1080I) Primary(HDTV 1080I)
20 56.25 50.00 148.5 20
Frame packing Field alternative
Primary(HDTV 1080I) (HDTV 1080I)
21 28.125 50.00 148.5 20 Side-by-side(Full) (HDTV 1080I)
22 26.97 / 27 23.97 / 24 74.18/74.25 32
Top-and-Bottom Side-by-side(half)
Primary(HDTV 1080P) Primary(HDTV 1080P)
23 43.94/54 23.97 / 24 148.35/148.5 32
Frame packing Line alternative
Primary(HDTV 1080P) (HDTV 1080P)
24 26.97 / 27 23.97 / 24 148.35/148.5 32 Side-by-side(Full) (HDTV 1080P)
25 28.125 25 74.25 33
Top-and-Bottom Side-by-side(half)
Secondary(HDTV 1080P) Secondary(HDTV 1080P)
26 56.24 25 148.5 33
Frame packing Line alternative
Secondary(HDTV 1080P) (HDTV 1080P)
27 28.12 25 148.5 33 Side-by-side(Full) (HDTV 1080P)
28 33.716 / 33.75 29.976 / 30.00 74.18/74.25 34
Top-and-Bottom Side-by-side(half)
Primary(HDTV 1080P) Secondary(HDTV 1080P)
29 67.432 / 67.5 29.976 / 30.00 148.35/148.5 34
Frame packing Line alternative
Primary(HDTV 1080P) (HDTV 1080P)
30 33.716 / 33.75 29.976 / 30.00 148.35/148.5 34 Side-by-side(Full) (HDTV 1080P)
31 56.250 50 148.5 31
Top-and-Bottom Side-by-side(half)
Primary(HDTV 1080P) Secondary(HDTV 1080P)
32 67.43 / 67.5 59.94 / 60 148.35/148.50 16
Top-and-Bottom Side-by-side(half)
Primary(HDTV 1080P) Secondary(HDTV 1080P)
7. 3D Mode
7.1. HDMI 1.4b (3D supported mode automatically)
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
7.3. RF Input(3D supported mode manually)
No. Resolution Proposed 3D input proposed mode
1 HD
1080I
720P
2D to 3D Side by Side(Half) Top & Bottom
2 SD
576P
576I
3 SD (ATV : CVBS / SCART) -
7.4. RF Input (3D supported mode automatically)
No. Signal 3D input proposed mode
1 Frame Compatible Side by Side(Half), Top & Bottom
7.2. HDMI Input(1.3)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed 3D input proposed mode
1 720*480 31.5 60 27.03 SDTV 480P
2D to 3D, Side by Side(Half), Top & Bot­tom, Checker Board, Frame Sequential, Row Interleaving, Column Interleaving
2 720*576 31.25 50 27 SDTV 576P
3 1280*720 45.00 60.00 74.25 HDTV 720P
4 1280*720 37.500 50 74.25 HDTV 720P
5 1920*1080 33.75 60.00 74.25 HDTV 1080I
2D to 3D, Side by Side(Half), Top & Bot­tom
6 1920*1080 28.125 50.00 74.25 HDTV 1080I
7 1920*1080 27.00 24.00 74.25 HDTV 1080P
2D to 3D, Side by Side(Half), Top & Bot­tom, Checker Board, Row Interleaving, Column Interleaving
8 1920*1080 28.12 25 74.25 HDTV 1080P
9 1920*1080 33.75 30.00 74.25 HDTV 1080P
10 1920*1080 67.50 60.00 148.5 HDTV 1080P
2D to 3D, Side by Side(Half), Top & Bottom, Checker Board, Single Frame Sequential, Row Interleaving, Column Interleaving
11 1920*1080 56.250 50 148.5 HDTV 1080P
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 Under 704x480 - - - 2D to 3D
2
Over 704x480 interlaced
- - - 2D to 3D, Side by Side(Half), Top & Bottom
3
Over 704x480 progressive
- 50 / 60 -
2D to 3D, Side by Side(Half), Top & Bottom, Checker Board, Row Interleaving, Column Interleaving, Frame Sequential
4
Over 704x480 progressive
- others -
2D to 3D, Side by Side(Half), Top & Bottom, Checker Board, Row Interleaving, Column Interleaving
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 Under 320x240 - - - 2D to 3D
2 Over 320x240 - - - 2D to 3D, Side by Side(Half), Top & Bottom
7.5. USB, DLNA (Movie) Input (3D supported mode manually)
7.6. USB, DLNA (Photo) Input (3D supported mode manually)
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock Proposed 3D input proposed mode
1 1280*720 45.00 60.00 74.25 HDTV 720P
2D to 3D, Side by Side(Half), Top & Bottom
2 1280*720 37.500 50 74.25 HDTV 720P
3 1920*1080 33.75 60.00 74.25 HDTV 1080I
4 1920*1080 28.125 50.00 74.25 HDTV 1080I
5 1920*1080 27.00 24.00 74.25 HDTV 1080P
6 1920*1080 28.12 25 74.25 HDTV 1080P
7 1920*1080 33.75 30.00 74.25 HDTV 1080P
8 1920*1080 67.50 60.00 148.5 HDTV 1080P
9 1920*1080 56.250 50 148.5 HDTV 1080P
10 Others - - - SDTV
7.8. Component Input(3D) (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed
1 1024*768 48.36 60 65
2D to 3D, Side by Side(half) Top & Bottom
HDTV 768P
2 1360*768 47.71 60 85.5
3 1920*1080 67.500 60 148.50
2D to 3D, Side by Side(half), Top & Bottom, Checker Board, Single Frame Sequential, Row Interleaving, Column Interleaving
HDTV 1080P
4 Others - - -
2D to 3D, Side by Side(half) Top & Bottom
640*350 720*400 640*480 800*600 1152*864
7.7. HDMI-PC Input (3D supported mode manually)
* USB, DNLA Input (3D supported mode automatically)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 1080P 33.75 30 -
2D to 3D, Side by Side(Half)*,Top & Bottom*,Checker Board*, Row Interleaving, Column Interleaving(Photo : Side by Side(Half), Top&Bottom)
7.10. 3D Input mode
No. Side by Side Top & Bottom Checker board
Single Frame
Sequential
Frame
Packing
2D to 3D
1
ii.
iii.
iv.
v.
vi.
7.9. Miracast, Widi (3D supported mode manually)
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode
1 1024X768p - 30 / 60 -
2D to 3D, Side by Side(Half), Top & Bottom2. 1280x720p - 30 / 60 -
3 1920X1080p 30 / 60
4 Others - 2D to 3D
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with LD42B chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation. (4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz. (5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it should be placed in the circumstance of above 15 °C for 2 hours.
In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.
[Caution] When still image is displayed for a period of 20 minutes or longer (Especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area.
3. Automatic Adjustment
3.1. MAC address D/L, CI+ key D/L, Widevine key D/L, ESN D/L, HDCP14/20 D/L, DTCP
Connect: USB port Communication Prot connection
▪ Com 1,2,3,4 and 115200(Baudrate)
Mode check: Online Only
▪ Check the test process: DETECT → MAC → CI → Widevine
→ ESN → HDCP14 → HDCP20 → DTCP ▪ Play: Press Enter key ▪ Result: Ready, Test, OK or NG ▪ Printer Out (MAC Address Label)
3.2. LAN Inspection
3.2.1. Equipment & Condition
▪ Each other connection to LAN Port of IP Hub and Jig
3.2.2. LAN inspection solution
▪ LAN Port connection with PCB ▪ Setting automatic IP
▪ If you want manual connection, enter Network connection at
MENU Mode of TV. Press Start connection key, then Network will be connected.
▪ Setting state confirmation
- If automatic setting is finished, you confirm IP and MAC Address at ‘in start’ menu mode.
3.2.3. WIDEVINE key Inspection
- Confirm key input data at the "IN START" MENU Mode.
- 14 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
3.3. LAN PORT INSPECTION(PING TEST)
Connect SET → LAN port == PC → LAN Port
3.3.1. Equipment setting
(1) Play the LAN Port Test PROGRAM. (2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
3.3.2. LAN PORT inspection(PING TEST)
(1) Play the LAN Port Test Program. (2) Connect each other LAN Port Jack. (3) Play Test (F9) button and confirm OK Message. (4) Remove LAN cable.
3.4. Model name & Serial number Download
3.4.1. Model name & Serial number D/L
Press "P-ONLY" key of service remote control.
(Baud rate : 115200 bps)
Connect RS-232C Signal to USB Cable to USB. Write Serial number by use USB port. Must check the serial number at Instart menu.
3.4.2. Method & notice
(1) Serial number D/L is using of scan equipment. (2) Setting of scan equipment operated by Manufacturing
Technology Group.
(3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory by D-book 4.0.
* Manual Download (Model Name and Serial Number)
If the TV set is downloaded by OTA or service man, sometimes model name or serial number is initialized.(Not always) It is impossible to download by bar code scan, so It need Manual download.
1) Press the "Instart" key of Adjustment remote control.
2) Go to the menu "7.Model Number D/L" like below photo.
3) Input the Factory model name(ex 47LB650V-ZA) or Serial
number like photo.
4) Check the model name Instart menu. → Factory name
displayed. (ex 47LB650V-ZA)
5) Check the Diagnostics.(DTV country only) → Buyer
model displayed. (ex 47LB650V-ZA)
3.5. CI+ Key checking method
- Check the Section 3.1 Check whether the key was downloaded or not at ‘In Start’ menu. (Refer to below).
=> Check the Download to CI+ Key value in LGset.
3.5.1. Check the method of CI+ Key value
(1) Check the method on Instart menu (2) Check the method of RS232C Command
1) Into the main ass’y mode(RS232: aa 00 00)
2) Check the key download for transmitted command (RS232: ci 00 10)
3) Result value
- Normally status for download : OKx
- Abnormally status for download : NGx
3.5.2. Check the method of CI+ key value(RS232)
1) Into the main ass’y mode(RS232: aa 00 00)
2) Check the mothed of CI+ key by command (RS232: ci 00 20)
3) Result value
i 01 OK 1d1852d21c1ed5dcx
SET PC
CMD 1 CMD 2 Data 0
A A 0 0
CMD 1 CMD 2 Data 0
C I 1 0
CMD 1 CMD 2 Data 0
A A 0 0
CMD 1 CMD 2 Data 0
C I 2 0
CI+ Key Value
- 15 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
3.6. WIFI MAC ADDRESS CHECK
(1) Using RS232 Command
(2) Check the menu on in-start
4. Manual Adjustment
* ADC adjustment is not needed because of OTP(Auto ADC
adjustment)
4.1. EDID DATA
4.1.1. 3D EDID
▪ Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by S/W or Input mode.
Product ID
Serial No: Controlled on production line. Month, Year: Controlled on production line:
ex) Monthly : ‘01’ → ‘01’
Year : ‘2014’ → ‘18’
Model Name(Hex): LGTV
Checksum(LG TV): Changeable by total EDID data.
Vendor Specific(HDMI)
1) Deep color (module 10bit)
2) None deep color (module 8bit)
Colorimetry Data Block(HDMI)
1) The Model not supporting XvYcc
4.1.2. 2D EDID
▪ Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by S/W or Input mode.
Product ID
Serial No: Controlled on production line. Month, Year: Controlled on production line:
ex) Monthly : ‘01’ → ‘01’
Year : ‘2013’ → ‘17’
Model Name(Hex): LGTV
Checksum(LG TV): Changeable by total EDID data.
Vendor Specific(HDMI)
H-freq(kHz) V-freq.(Hz)
Transmission [A][I][][Set ID][][20][Cr] [O][K][X] or [NG]
HEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
Chassis MODEL NAME(HEX)
LD42B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
1
2 2
3
10bit
/none XvYcc
8bit
/none XvYcc
HDMI1 E7 85 CC X
HDMI2 E7 75 BC X
HDMI3 E7 65 AC X
INPUT MODEL NAME(HEX)
HDMI1 78 03 0C 00 10 00 B8 2D 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
HDMI2 78 03 0C 00 20 00 B8 2D 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
HDMI3 78 03 0C 00 30 00 B8 2D 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
INPUT MODEL NAME(HEX)
HDMI1 E3 05 00 00
HDMI2 E3 05 00 00
HDMI3 E3 05 00 00
INPUT MODEL NAME(HEX)
HDMI1 78 03 0C 00 10 00 80 1E 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
HDMI2 78 03 0C 00 20 00 80 1E 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
HDMI3 78 03 0C 00 30 00 80 1E 20 C0 0E 01 4F 3F FC 08 10 18 10 06 10 16 10 28 10
HEX EDID Table DDC Function
0001 0100 Analog
0001 0100 Digital
Chassis MODEL NAME(HEX)
LD33B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
1 2 3
HDMI1 42 1B X
HDMI2 42 0B X
HDMI3 42 FB X
INPUT MODEL NAME(HEX)
HDMI1 67 03 0C 00 10 00 80 1E
HDMI2 67 03 0C 00 20 00 80 1E
HDMI3 67 03 0C 00 30 00 80 1E
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.2. White Balance Adjustment
4.2.1. Overview
▪ W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel's W/B deviation (2) How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.
(3) Adjustment condition : normal temperature
1) Surrounding Temperature : 25 °C ± 5 °C
2) Surrounding Humidity : 20 % ~ 80 %
4.2.2. Equipment
(1) Color Analyzer: CA-210 (LED Module : CH 14) (2) Adjustment Computer(During auto adj., RS-232C protocol
is needed) (3) Adjustment Remote control (4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
→ Only when internal pattern is not available
▪ Color Analyzer Matrix should be calibrated using CS-1000.
4.2.3. Equipment connection MAP
4.2.4. Adj. Command (Protocol)
<Command Format>
- LEN: Number of Data Byte to be sent
- CMD: Command
- VAL: FOS Data value
- CS: Checksum of sent data
- A: Acknowledge Ex) [Send: JA_00_DD] / [Ack: A_00_okDDX]
▪ RS-232C Command used during auto-adjustment.
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj. ja 00 ff -> Adj. data
jb 00 c0 ... ...
wb 00 1f → Gain adj. completed *(wb 00 20(Start), wb 00 2f(end)) → Off-set adj. wb 00 ff → End white balance auto-adj.
▪ Adj. Map
Applied Model : LD42B Chassis ALL MODELS
4.2.5. Adj. method
(1) Auto adj. method
1) Set TV in adj. mode using P-Only key.
2) Zero calibrate probe then place it on the center of the
Display.
3) Connect Cable.(RS-232C to USB)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sign), check adj. status pre mode. (Cool, Medium, Warm)
6) Remove probe and RS-232C cable to complete adj.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
(2) Manual adjustment. method
1) Set TV in Adj. mode using P-Only key.
2) Zero Calibrate the probe of Color Analyzer, then place it
on the center of LCD module within 10 cm of the surface.
3) Press ADJ key → EZ adjust using adj. R/C → 7. White­Balance then press the cursor to the right(key ►).
(When right key(►) is pressed 204 Gray internal pattern
will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at 192, and the rest will be lowered to meet the desired value.
5) Adjustment is performed in COOL, MEDIUM, WARM 3
modes of color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 7.White Balance, you can select one of 2 Test­pattern: ON, OFF. Default is inner(ON). By selecting OFF, you can adjust using RF signal in 204 Gray pattern.
▪ Adjustment condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to isolate adj. area into dark surrounding.
2) Probe location
: Color Analyzer(CA-210) probe should be within 10 cm
and perpendicular of the module surface (80° ~ 100°)
START 6E A 50 A LEN A 03 A CMD A 00 A VAL A CS STOP
Col or Analy zer
Com puter
* Pat tern Ge nerat or
RS- 232C
USB t o RS-23 2C
RS- 232C
Pro be
Sig nal Sou rce
* If TV internal pattern is used, not needed
RS-232C COMMAND
[CMD ID DATA]
Explanation
wb 00 00 Begin White Balance adjustment
wb 00 10 Gain adjustment(internal white pattern)
wb 00 1f Gain adjustment completed
wb 00 20 Offset adjustment(internal white pattern)
wb 00 2f Offset adjustment completed
wb 00 ff
End White Balance adjustment (internal pattern disappears )
Adj. item
Command
(lower caseASCII)
Data Range
(Hex.)
Default
(Decimal)
CMD1 CMD2 MIN MAX
Cool
R Gain j g 00 C0 G Gain j h 00 C0 B Gain j i 00 C0 R Cut G Cut B Cut
Medium
R Gain j a 00 C0 G Gain j b 00 C0 B Gain j c 00 C0 R Cut G Cut B Cut
Warm
R Gain j d 00 C0 G Gain j e 00 C0 B Gain j f 00 C0 R Cut
G Cut
- 17 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.2.6. Reference (White balance Adj. coordinate and color temperature)
▪ Luminance : 204 Gray ▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
▪ Standard color coordinate and temperature using CA-210(CH 14)
4.2.7. LED White balance table
- EDGE LED module change color coordinate because of aging time.
- Apply under the color coordinate table, for compensated aging time.
Only march to December & Global Model: (normal line)LGD (LB5xxx, LB6xxx, LB7xxx, LB8xxx)
Only January to Febuary & Global Model: (normal line)LGD (LB5xxx, LB6xxx, LB7xxx, LB8xxx)
AUO, INX, Sharp, CSOT, BOE (Cool : 13000 K)
4.3. Local Dimming Function Check
(1) Normal Edge LED Model
Step 1) Turn on TV. Step 2) Press “TILT” key on the Adj. Remote control. Step 3) A t the Local D im mi ng mo de , module Edge
Backlight moving right to left Back light of IOP
module moving. Step 4) Confirm the Local Dimming mode. Step 5) Press "exit" key.
(2) Only 50inch AUO Local dimming Model(50LA66)
- Test method
Insert the USB memo ry included vide o fi le below inspection pattern in Poweronly mode. Play repeat first, second pattern once per second
(3) Only LA71 Series LGD Local Dimming Model (47/55LA71,
16 block) Step 1) Turn on TV Step 2) Press “TILT” key on the Adj. R/C. Step 3) A t the Local D im mi ng mo de , module Edge
Backlight moving left to right, bottom to Up, Back
light of ALEF module moving. (No1->2->3->….->14
->15->16)
Step 4) Confirm the Local Dimming mode Step 5) Press “exit” Key
Mode
Coordinate
Temp ∆uv
x y
Cool 0.271 0.270 13000 K 0.0000
Medium 0.286 0.289 9300 K 0.0000
Warm 0.313 0.329 6500 K 0.0000
Mode
Coordinate
Temp ∆uv
x y
Cool 0.271 ± 0.002 0.270 ± 0.002 13000 K 0.0000
Medium 0.286 ± 0.002 0.289 ± 0.002 9300 K 0.0000
Warm 0.313 ± 0.002 0.329 ± 0.002 6500K 0.0000
NC4.0
Aging
time
(Min)
Cool Medium Warm
x y x y x y
271 270 286 289 313 329 1 0-2 282 289 297 308 324 348 2 3-5 281 287 296 306 323 346 3 6-9 279 284 294 303 321 333 4 10-19 277 280 292 299 319 339 5 20-35 275 277 290 296 317 336 6 36-49 274 274 289 293 316 333 7 50-79 273 272 288 291 315 331 8 80-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329
NC4.0
Aging
time
(Min)
Cool Medium Warm
x y x y x y
271 270 286 289 313 329 1 0-5 286 295 301 314 328 354 2 6-10 284 290 299 309 326 349 3 11-20 282 287 297 306 324 346 4 21-30 279 283 294 302 321 342 5 31-40 276 278 291 297 318 337 6 41-50 274 275 289 294 316 334 7 51-80 273 272 288 291 315 331 8 81-119 272 271 287 290 314 330 9 Over 120 271 270 286 289 313 329
NC4.0
Cool Medium Warm
x y x y x y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
- 18 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.4. Magic Motion Remote control test
- Results are automatically marked in Instart OSD after through the AP/Magic Remocon Equipment on the line
4.5. 3D function test(Except Non-3D product)
(Pattern Generator MSHG-600, MSPG-6100[Support HDMI1.4]) * HDMI mode NO. 872 , pattern No.83 (1) Please input 3D test pattern like below.
(2) When 3D OSD appear automatically, then select OK key.
(3) Don't wear a 3D Glasses, check the picture like below.
4.6. Wi-Fi Test
Step 1) Turn on TV Step 2) Select Wi-Fi Connection option in Network Menu.
Step 3) Click Off Button to On in Wi-Fi Connection.
Step 4) The system finds any AP like blow PIC.
Step 5) Select the AP you want to connect.
- 19 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.7. LNB voltage and 22KHz tone check
(only for DVB-S/S2 model)
▪ Test method
(1) Set TV in Adj. mode using POWER ON. (2) Connect cable between satellite ANT and test JIG. (3) Press Yellow key(ETC+SWAP) in Adj Remote control to
make LNB on. (4) Check LED light ‘ON’ at 18 V menu. (5) Check LED light ‘ON’ at 22 KHz tone menu. (6) Press Blue key(ETC+PIP INPUT) in Adj Remote control
to make LNB off. (7) Check LED light ‘OFF’ at 18 V menu. (8) Check LED light ‘OFF’ at 22 KHz tone menu.
▪ Test result
(1) After press LNB On key, ‘18 V LED’ and ‘22 KHz tone
LED’ should be ON.
(2) After press LNB OFF key, ‘18 V LED’ and ‘22 KHz tone
LED’ should be OFF.
4.8. Option selection per country
4.8.1. Overview
- Option selection is only done for models in Non-EU
4.8.2. Method
(1) Press ADJ key on the Adj. R/C, then select Country Group
Meun.
(2) Select Country Group Code 04 or Country Group EU.
5. Tool Option selection
▪ Method : Press "ADJ" key on the Adjustment remote control,
then select Tool option.
6. Ship-out mode check(In-stop)
▪ After final inspection, press "IN-STOP" key of the Adjustment
remote control and check that the unit goes to Stand-by mode.
7. GND and Internal Pressure check
7.1. Method
(1) GND & Internal Pressure auto-check preparation
- Check that Power cord is fully inserted to the SET. (If loose, re-insert)
(2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically. (Remove CORD, A/V form AV JACK BOX.)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the pallet to move on to next process.
7.2. Checkpoint
▪ TEST voltage
(1) DQA Test
- GND: 1.5 KV / min at 100 mA
- SIGNAL: 3 KV / min at 100 mA
(2) Mass Production Line Test
- GND: AC 1.5 KV / sec, Cut off current not exceed 100 mA
▪ TEST time: DQA 1 min, Mass Production Line 1 sec ▪ TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &
NEUTRAL
▪ LEAKAGE CURRENT: At 0.5 mArms
8. Audio
Measurement condition:
(1) RF input: Mono, 1 KHz sine wave signal, 100 % Modulation (2) CVBS, Component: 1 KHz sine wave signal 0.5 Vrms (3) RGB PC: 1 KHz sine wave signal 0.7 Vrms
No. Item Min Typ Max Unit Remark
1.
Audio practical max Output, L/R
(Distortion=10%
max Output)
9 10 12 W
EQ Off AVL Off Clear Voice Off
8.10 10.8 Vrms
2.
Speaker (8Ω
Impedance)
9 10 12 W
- 20 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
9. USB S/W Download(Service only)
(1) Put the USB Stick to the USB socket. (2) Go to General menu then enter to About This TV.
(3) Enter the USB EXPERT MODE.
(4) Updating is starting. (5) Updating completed, the TV will restart automatically (6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number)
- 21 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Audio AMP
NTP
IC101
M14
IF (+/-)
USB1(2.0)
OPTIC
LAN
DDR3 1600 X 16
(512MB X 2EA)
HDMI1
HDMI2
HDMI3
Analog Demod
Digital Demod(T/C)
SYSTEM EEPROM
(256Kb)
USB2(2.0)
USB3(2.0)
41P
51P
eMMC
(4/8GB)
Sub Micom
(RENESAS
R5F1000G)
DDR3 1600 X 16
(512MB X 2EA)
P_TS
50P
50P
X_TAL
24MHz
A B
X_TAL
32.768KHz
I2S Out
I2C 1
EPI
I2C 2
LVDS
USB 2.0
I2C 5
H/P (Line Out)
AV/COMP
D-Demod : I2C 4
OCP
1.5A
(ARC)
REA
R
SID
E
SID
E
REA
R
(H)
AMP
TI
CVBS/YPbPr
SPDIF OUT
ETHERNET
I2C 3
LOCAL DIMMING
BLUTOOTH
IR / KEY/EYE
PM
IC
WIFI
LOGO LIGHT
I2C 2
IR
KEY
UART_BT
(IR Bla Ready)
Tuner : I2C 6
LAN
PHY
OCP
1A
(MHL)
X_TAL
25MHz
I2C(EYE)
PWM
DVB T2/C TUNER
Si2158B
ATV /
DVB-T/C
AIF
TS_ [0:7]
SI2169B
DIF
Si2158B
ATV /
DVB-T/C
IF
DVB T/C TUNER
P_TS P_TS
HDMI Rx.
HDMI / MHL Rx.
USB_WIFI
SCART
CVBS/RGB
DVB T2/C/S2 TUNER
Si2158B
RDA
5815M
ATV /
DVB-T/C
DVB-S
AIF
TS_ [0:7]
SI2169B
DIF
IQ
BLOCK DIAGRAM
- 22 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these sp ecial safet y parts shoul d be replac ed with the same compon ents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
900
200
400
800
801
540
521
530
820
500
120
570
910
810
410
420
121
LV1
LV2
A22
A10
Set + Stand
AT1
AG1
AW1
A2
A9
Option
(Option)
Option
Stand Base+Stand Body
(Option)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-Peripheral
EB_ADDR[4]
EMMC_DATA[0]
EB_ADDR[1]
EB_DATA[2]
EB_ADDR[3]
EMMC_DATA[2]
EB_ADDR[10]
EB_DATA[0]
EMMC_DATA[7]
EMMC_DATA[4]
EB_ADDR[13]
EB_ADDR[6]
EMMC_DATA[3]
EB_ADDR[0]
EB_ADDR[2]
EB_DATA[3]
EMMC_DATA[1]
EB_ADDR[8]
EMMC_DATA[6]
EB_ADDR[5]
EB_DATA[6]
EB_DATA[4]
EB_ADDR[9]
EB_ADDR[7]
EB_DATA[7]
EB_DATA[5]
EB_ADDR[12]
EB_ADDR[14]
EB_DATA[1]
EMMC_DATA[5]
EB_ADDR[11]
OPM1
CAM_INPACK_N
C101-*1
6.8pF 50V
LOADCAP_DVB_PCB
IRB_SPI_MISO/TDI1
C107
0.1uF 16V
R159
3.3K
TP111
I2C_SCL4
TRST_N1
USB_DP3
R101 3.3K
OPT
R156
1.2K
KR_PIP_NOT
TDI0
USB_DM1
SOC_RESET
USB_DP1
I2C_SCL2
LED_SDA
EB_ADDR[0-14]
/PCM_CE1
C102-*1
6.8pF 50V
LOADCAP_DVB_PCB
CAM_IREQ_N
PLLSET1
XTAL_IN
XTAL_IN
R104 3.3K
OPT
TRST_N1
R162
3.3K
OPM0
LED_SCL
R155-*1
3.3K
KR_PIP
I2C_SCL5
R108
33
I2C_SDA6
USB_CTL2 USB_CTL3
I2C_SDA2
EB_WE_N
R158
3.3K
R163 10K OPT
EB_BE_N1
R182 10K
OPT
R161
3.3K
I2C_SCL4
R105
3.3K
OPT
TP113
IRB_SPI_MISO/TDI1
I2C_SDA1
IRB_SPI_MOSI/TDO1
XTAL_OUT
USB_CTL1
C104
0.1uF 16V
I2C_SDA6
I2C_SDA5
+3.3V_NORMAL
I2C_SDA5
R149
3.3K
TP116
EB_WE_N
I2C_SDA_MICOM_SOC
P102
12507WS-04L
OPT
1
2
3
4
5
I2C_SCL5
R183 10K
I2C_SDA1
PCM_RESET
INSTANT_BOOT
R148-*1
1.5K
KR_PIP
SOC_RESET
USB_DP2
EB_BE_N1
R102 3.3K
OPT
P104
12505WS-10A00
OPT
1
2
3
4
5
6
7
8
9
10
11
PLLSET0
/PCM_CE2
CAM_WAIT_N
PCM_5V_CTL
PLLSET0
I2C_SCL_MICOM_SOC
/PCM_CE1
I2C_SCL6
R184 10K
IRB_SPI_MOSI/TDO1
EB_DATA[0-7]
+3.3V_NORMAL
CAM_CD2_N
EB_BE_N0
TP108
OPM0
R157
3.3K
SOC_TX
+3.3V_NORMAL
R107
33
EB_OE_N
WIFI_DP
R179 10K
1/16W 5%
I2C_SCL2
EB_BE_N0
/USB_OCD3
/USB_OCD2
IRB_SPI_CK/TCK1
EMMC_DATA[0-7]
R185 10K
L/DIM0_VS
(TRST0_N)
CAM_CD2_N
I2C_SDA4
I2C_SDA5
IRB_SPI_SS/TMS1
R1712001%
R150
3.3K
PWM_DIM2
I2C_SDA_MICOM_SOC
+3.3V_NORMAL
I2C_SDA4
R178 33
R106
3.3K
OPT
CAM_REG_N
TP115
TP106
CAM_REG_N
R118
1M
FORCED_JTAG_0
TP110
BOOT_MODE
TCK0
I2C_SCL_MICOM_SOC
PLLSET1
CAM_CD1_N
TP109
EB_ADDR[0-14]
+3.3V_NORMAL
M_REMOTE_TX
I2C_SCL1
L/DIM0_SCLK
TP114
EMMC_CLK
R148
3.3K
KR_PIP_NOT
P103
12505WS-10A00
JTAG_CPU
1
2
3
4
5
6
7
8
9
10
11
R146
3.3K
KR_PIP_NOT
TP103
R143 33
FORCED_JTAG_0
XTAL_OUT
R1722001%
I2C_SCL1
R160
3.3K
TP105
PCM_RESET
USB_DM3
R156-*1
3.3K
KR_PIP
AR101
33
R103 3.3K
OPT
L/DIM0_SCLK
(TMS0)
R121
3.3K
OPT
+3.3V_NORMAL
R180 560
USB_DM2
+3.3V_NORMAL
R128
3.3K
CAM_CD1_N
EB_OE_N
+3.3V_NORMAL
CAM_INPACK_N
PCM_5V_CTL
R169
33
+3.3V_NORMAL
+3.3V_NORMAL
I2C_SCL5
WIFI_DM
IRB_SPI_SS/TMS1
IRB_SPI_CK/TCK1
I2C_SCL6
PWM_DIM
TP102
IC103
AT24C256C-SSHL-T
NVRAM_ATMEL
3
A2
2
A1
4
GND
1
A0
5
SDA
6
SCL
7
WP
8
VCC
CAM_IREQ_N
TP107
SOC_RESET
/USB_OCD1
EB_DATA[0-7]
TP117
R146-*1
1.5K
KR_PIP
M_REMOTE_RX
TDI0
CAM_WAIT_N
BOOT_MODE
TP112
EMMC_CMD
R144 33
R155
1.2K
KR_PIP_NOT
L/DIM0_MOSI
(TDO0)
EMMC_RST
IC103-*1
M24256-BRMN6TP
NVRAM_ST
3
E2
2
E1
4
VSS
1
E0
5
SDA
6
SCL
7
WC
8
VCC
L/DIM0_VS
L/DIM0_MOSI
TP104
/PCM_CE2
TCK0
R127
3.3K
OPT
I2C_SDA2
+3.3V_TUNER
R1742001%
+3.3V_TUNER
R1732001%
OPM1
X101
24MHz
4
GND_2
1
X-TAL_12GND_1
3
X-TAL_2
SOC_RX
AR100
33
1/16W
IC101
LG1311
XIN_MAIN
B23
XO_MAIN
A23
PORES_N
AG21
BOOT_MODE
AJ18
PLLSET0
AB8
PLLSET1
AC8
OPM0
AD8
OPM1
AE8
L_VSOUT_LD/TRST0_N
Y7
DIM0_SCLK/TMS0
Y6
DIM1_SCLK/TCK0
W7
DIM1_MOSI/TDI0
W6
DIM0_MOSI/TDO0
W5
SPI_CS0
AG30
SPI_SCLK0
AG28
SPI_DO0
AG29
SPI_DI0/TRST1_N
AH29
SPI_CS1/TMS1
AJ27
SPI_SCLK1/TCK1
AH27
SPI_DO1/TDO1
AG26
SPI_DI1/TDI1
AH26
EXT_INTR0
AJ12
EXT_INTR1
AJ13
EXT_INTR2
AH12
EXT_INTR3
AG12
UART0_RXD
AH23
UART0_TXD
AG22
UART1_RXD
AH7
UART1_TXD
AJ7
UART1_RTS_N
AG8
UART1_CTS_N
AH8
SCL0
AH11
SDA0
AG11
SCL1
AH9
SDA1
AG9
SCL2
AG10
SDA2
AJ9
SCL3
AH22
SDA3
AJ22
SCL4
AH10
SDA4
AJ10
SCL5
AG23
SDA5
AH24
PWM0
AC6
PWM1
AC7
PWM2
AD7
PWM_IN
AB7
EMMC_CLK
G32
EMMC_CMD
G33
EMMC_RESETN
G31
EMMC_DATA7
D31
EMMC_DATA6
F33
EMMC_DATA5
F32
EMMC_DATA4
E32
EMMC_DATA3
F31
EMMC_DATA2
D33
EMMC_DATA1
D32
EMMC_DATA0
E31
USB2_0_DP0
AN9
USB2_0_DM0
AM9
USB2_0_TXRTUNE
AN8
USB2_1_DP0
H32
USB2_1_DM0
J31
USB2_1_TXRTUNE
H33
USB3_DP0
N31
USB3_DM0
N32
USB3_TXP0
P33
USB3_TXM0
P32
USB3_RXP0
M32
USB3_RXM0
M33
USB3_RESREF0
P31
USB3_DP1
K33
USB3_DM1
K32
USB3_TXP1
L32
USB3_TXM1
L31
USB3_RXP1
K31
USB3_RXM1
J32
USB3_RESREF1
M31
HUB_PORT_OVER0
W28
HUB_VBUS_CTRL0
W29
EB_CS3
H28
EB_CS2
J30
EB_CS1
J28
EB_CS0
J29
EB_WE_N
G30
EB_OE_N
F30
EB_WAIT
H29
EB_BE_N1
G29
EB_BE_N0
G28
CAM_CD1_N
P28
CAM_CD2_N
P27
CAM_CE1_N
U28
CAM_CE2_N
R29
CAM_IREQ_N
V27
CAM_RESET
T28
CAM_INPACK_N
T29
CAM_VCCEN_N
R28
CAM_WAIT_N
U27
CAM_REG_N
N29
EB_ADDR0
K30
EB_ADDR1
E30
EB_ADDR2
M30
EB_ADDR3
N28
EB_ADDR4
M28
EB_ADDR5
M29
EB_ADDR6
L29
EB_ADDR7
K29
EB_ADDR8
K28
EB_ADDR9
L28
EB_ADDR10
D30
EB_ADDR11
F29
EB_ADDR12
C32
EB_ADDR13
C33
EB_ADDR14
C31
EB_ADDR15
B33
EB_DATA0
B32
EB_DATA1
A32
EB_DATA2
B31
EB_DATA3
A31
EB_DATA4
A30
EB_DATA5
B30
EB_DATA6
C30
EB_DATA7
C29
C101
10pF
LOADCAP_ATSC_PCB
C102
10pF
LOADCAP_ATSC_PCB
1
MID_LG1311
2013.04.04 31
M14 Symbol A
PLL SET[1:0] : internal pull up "00" : CPU(1200Mhz),M0 / M1 DDR(792,792 Mhz) "01" : CPU(1056Mhz),M0 / M1 DDR(672,672 Mhz) "10" : CPU(1056Mhz),M0 / M1 DDR(792,792 Mhz) "11" : CPU( 960Mhz),M0 / M1 DDR(792,792 Mhz)
MAIN Clock(24Mhz)
System Configuration
I2C
OP MODE[1:0] "00" : Normal Mode "01/10/11" : Internal Test mode
Extenal test only
BOOT_MODE0
INSTANT_MODE0
INSTANT boot MODE "1 : Instant boot "0 : normal
(internal pull down)
I2C PULL UP
NVRAM
BOOT MODE "0 : EMMC "1 : TEST MODE
Write Protection
- Low : Normal Operation
- High : Write Protection
Jtag-0 I/F
System Clock for Analog block(24Mhz)
Extenal test only
PAGE 1
Clock for M14-A0
Jtag-1 I/F
LOCAL DIMMING I2C CONTROL
I2C_1 : AMP I2C_2 : T-CON,L/DIMING I2C_3 : MICOM I2C_4 : S/Demod,T2/Demod, LNB I2C_5 : NVRAM I2C_6 : TUNER_MOPLL(T/C,ATV)
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-Display In/Out
TPI_DATA[3]
FE_DEMOD1_TS_DATA[6]
FE_DEMOD1_TS_DATA[3] FE_DEMOD1_TS_DATA[2]
TPI_DATA[7]
TPO_DATA[0]
TPI_DATA[0]
TPO_DATA[5]
FE_DEMOD1_TS_DATA[7]
TPO_DATA[6]
TPI_DATA[6]
FE_DEMOD1_TS_DATA[0]
TPO_DATA[3]
TPI_DATA[2]
TPO_DATA[1]
TPO_DATA[4]
TPO_DATA[2]
TPI_DATA[1]
TPI_DATA[5]
TPI_DATA[4]
TPO_DATA[7]
FE_DEMOD1_TS_DATA[5]
FE_DEMOD1_TS_DATA[1]
FE_DEMOD1_TS_DATA[4]
TP209
R226
100
1/16W
5%
TPI_ERR
TP210
BT_RESET
FE_DEMOD2_TS_CLK
R221 10K
DDR_3G
FE_DEMOD2_TS_CLK
GST_SOC
TXDCLKN/TX14N
TXBCLKN/TX2N
TXCCLKP/TX20P
R202 10K
BIT0_0
TXC4N/TX18N
R210 10K
BIT4_0
TXA1N/TX10N
BIT5
MODEL_OPT_10
SC_DET
TXC1P/TX22P
FE_DEMOD3_TS_SYNC
BIT1
TP203
BIT7
SC_DET
TPO_SOP
FE_DEMOD3_TS_CLK
BIT3
TPO_VAL
BIT2
FE_DEMOD2_TS_SYNC
TP213
R224
33
OPT
OPC_EN
BIT3
TP219
TPO_CLK
BIT4
COMP1_DET
FE_DEMOD2_TS_DATA
TXC2N/TX21N
TPO_ERR
TXD1N/TX16N
TXD2P/TX15P
TPO_DATA[0-7]
EO_SOC
CAM_SLIDE_DET
TP227
TXB3N/TX1NFE_DEMOD3_TS_ERROR
FE_DEMOD2_TS_VAL
FE_DEMOD3_TS_DATA
TP226
MODEL_OPT_9
FE_DEMOD2_TS_SYNC
R219 10K
DDR3_1.5GB
TPI_VAL
TXBCLKP/TX2P
BIT6
/RST_HUB
FE_DEMOD2_TS_DATA
TP204
TXC2P/TX21P
CAM_SLIDE_DET
TXB2N/TX3N
TP211
TXD1P/TX16P
LED_SCL
BIT0
R201 10K
BIT0_1
TXB4N/TX0N
FE_DEMOD1_TS_SYNC
TP221
C200
1000pF
50V
FE_DEMOD1_TS_ERROR
TPI_CLK
+3.3V_NORMAL
TPI_DATA[0-7]
R215 10K
BIT7_1
TP206
TP202
/TU_RESET1
TXC0N/TX23N
R205 10K
BIT2_1
TXB1N/TX4N
R220 10K
DDR3_2GB
EPI_SOE
TXA2N/TX9N
TPI_DATA[0-7]
FE_DEMOD1_TS_DATA[0-7]
TP208
TXD4N/TX12N
MODEL_OPT_9
TPI_SOP
TP212
TXB4P/TX0P
DEBUG
TPI_VAL
RF_SWITCH_CTL
TXA3N/TX7N
R225 33
OPT
/TU_RESET2
TP214
TXACLKN/TX8N
2D/3D_CTL
/RST_PHY
MCLK_SOC
TXA2P/TX9P
FE_DEMOD2_TS_ERROR
TP228
R203 10K
BIT1_1
LED_SDA
R206 10K
BIT2_0
FE_DEMOD3_TS_CLK
TXC3N/TX19N
TXC4P/TX18P
FE_DEMOD3_TS_DATA
TPI_ERR
TXD4P/TX12P
R209 10K
BIT4_1
TP220
TPI_CLK
BIT2
TXA3P/TX7P
TXD0N/TX17N TXD0P/TX17P
TXA4P/TX6P
FE_DEMOD2_TS_VAL
R222 10K
NON_DDR_3G
GCLK_SOC
TPI_SOP
TXACLKP/TX8P
IR_B_RESET
BIT1
R211 10K
BIT5_1
FE_DEMOD3_TS_ERROR
TXD3N/TX13N
TP225
FE_DEMOD1_TS_VAL
CAM_TRIGGER_DET
MODEL_OPT_8
BIT4
R217 10K
DDR3_DDP
TXA4N/TX6N
R207 10K
BIT3_1
FE_DEMOD2_TS_ERROR
R212 10K
BIT5_0
MODEL_OPT_8
R214 10K
BIT6_0
TXA0N/TX11N
TXC3P/TX19P
TXC0P/TX23P
TP215
BIT5
FE_DEMOD3_TS_VAL
INSTANT_BOOT
EPI_SOE
TPO_ERR
TP207
AV1_CVBS_DET
TXA1P/TX10P
TPO_CLK
TXD2N/TX15N
TXB1P/TX4P
R223
3.3K
TXA0P/TX11P
TXC1N/TX22N
TXB0P/TX5P
BIT7
TP218
R204 10K
BIT1_0
TXD3P/TX13P
TP205
TXDCLKP/TX14P
BIT6
R208 10K
BIT3_0
TXCCLKN/TX20N
TXB3P/TX1P
TXB2P/TX3P
AMP_RESET_N
R218 10K
DDR3_NON_DDP
FE_DEMOD1_TS_CLK
TXB0N/TX5N
FE_DEMOD3_TS_VAL
BIT0
MODEL_OPT_10 EPI_LOCK8/6
TPO_DATA[0-7]
R213 10K
BIT6_1
DEBUG
R216 10K
BIT7_0
HP_DET
TPO_VAL
CAM_TRIGGER_DET
/RST_HUB
+3.3V_NORMAL
FE_DEMOD3_TS_SYNC
SW201
JTP-1127WEM
12
4
3
TPO_SOP
MODEL_OPT_11
MODEL_OPT_12
MODEL_OPT_12
MODEL_OPT_11
R227 10K
OPT
R229 10K
OPT
R228 10K
OPT
R230 10K
OPT
R231
4.7K
IC101
LG1311
TP_DVB_CLK
AH30
TP_DVB_SOP
AH32
TP_DVB_VAL
AH31
TP_DVB_ERR
AH33
TP_DVB_DATA7
AM33
TP_DVB_DATA6
AL32
TP_DVB_DATA5
AL33
TP_DVB_DATA4
AK32
TP_DVB_DATA3
AK33
TP_DVB_DATA2
AK31
TP_DVB_DATA1
AJ30
TP_DVB_DATA0
AJ31
STPI0_CLK
AL31
STPI0_SOP
AN32
STPI0_VAL
AM32
STPI0_ERR
AN31
STPI0_DATA
AM31
STPI1_CLK
AH28
STPI1_SOP
AJ28
STPI1_VAL
AK30
STPI1_ERR
AJ29
STPI1_DATA
AG27
TPI_CLK
A28
TPI_SOP
B28
TPI_VAL
B29
TPI_ERR
C28
TPI_DATA0
A27
TPI_DATA1
B27
TPI_DATA2
C27
TPI_DATA3
B26
TPI_DATA4
C26
TPI_DATA5
B25
TPI_DATA6
A25
TPI_DATA7
C25
GPIO31
AG13
GPIO30
AJ19
GPIO29
AG14
GPIO28
AG15
GPIO27
AJ15
GPIO26
AH19
GPIO25
AH18
GPIO24
AG19
GPIO23
AH5
GPIO22
AJ5
GPIO21
AJ6
GPIO20
AH6
GPIO19
AG6
GPIO18
AG5
GPIO17
AF7
GPIO16
AG7
GPIO15
AG24
GPIO14
AH16
GPIO13
V29
GPIO12
AJ21
GPIO11
AH21
GPIO10
V28
GPIO9
AG16
GPIO8
AJ24
GPIO7
AH17
GPIO6
AG17
GPIO5
AH13
GPIO4
AH15
GPIO3
AG18
GPIO2
AH14
GPIO1
AJ16
GPIO0
AH20
TPIO_CLK
D28
TPIO_SOP
E29
TPIO_VAL
E28
TPIO_ERR
F28
TPIO_DATA0
D27
TPIO_DATA1
E27
TPIO_DATA2
F27
TPIO_DATA3
E26
TPIO_DATA4
F26
TPIO_DATA5
E25
TPIO_DATA6
D25
TPIO_DATA7
F25
EPI_SOE
AA5
EPI_MCLK
AB5
EPI_GCLK
AA7
EPI_EO
AA6
EPI_VST
AB6
TX_0N
AK8
TX_0P
AL8
TX_1N
AK7
TX_1P
AL7
TX_2N
AM6
TX_2P
AN6
TX_3N
AK6
TX_3P
AL6
TX_4N
AK5
TX_4P
AL5
TX_5N
AN4
TX_5P
AN3
TX_6N
AM2
TX_6P
AM1
TX_7N
AM4
TX_7P
AM3
TX_8N
AL4
TX_8P
AL3
TX_9N
AK2
TX_9P
AK1
TX_10N
AK4
TX_10P
AK3
TX_11N
AJ4
TX_11P
AJ3
TX_12N
AH2
TX_12P
AH1
TX_13N
AH4
TX_13P
AH3
TX_14N
AG4
TX_14P
AG3
TX_15N
AF2
TX_15P
AF1
TX_16N
AF4
TX_16P
AF3
TX_17N
AE4
TX_17P
AE3
TX_18N
AD2
TX_18P
AD1
TX_19N
AD4
TX_19P
AD3
TX_20N
AC4
TX_20P
AC3
TX_21N
AB2
TX_21P
AB1
TX_22N
AB4
TX_22P
AB3
TX_23N
AA4
TX_23P
AA3
TX_LOCKN
AM8
2013.04.04
M14 Symbol B
2
MID_LG1311
31
For ISP
EPI FHD, 60Hz, V14_32 inch (6lane)
HIGH
EPI FHD, 120Hz, V13 (6 lane)
LVDS HD, 60Hz SMALL SMART
1 / 1
1 / 0
TYPE
0 / 0 / 0 / 1
LVDS FHD, 60Hz
DDR3
DDP
FRC
1 / 1 / 0 / 0
0 / 1 / 1 / 1
LVDS FHD, 120Hz
TAIWAN/COLOM
1 / 1 / 1 / 0
OLED
0 / 1 / 0 / 0
EU/CIS
0 / 1 / 1 / 0
0 / 0 / 0 / 0
0 / 1 / 0 / 1
1 / 0 / 1 / 0
0 / 0
1 / 0 / 0 / 1
PAGE 2
PANEL TYPE
BACK-END OPTIONAREA OPTION
2GB
FHD
0 / 0 / 1 / 0
Model Option
MODEL_OPT_8
1 / 0 / 1 / 1
EPI FHD, 120Hz, v14_32inch (6 lane)
Vby1 FHD, 120Hz
1.5GB
BIT[2/3/4/5]DVB
LVDS FHD, 60Hz, CP BOX
1 / 0 / 0 / 0
NON_DDP
EPI FHD, 120Hz, V12 (6 lane)
LOW
1 / 1 / 0 / 1
LVDS HD, 60Hz
DDR3
MODEL_OPT_10
BIT [0/1]
0 / 1
ATSC
0 / 0 / 1 / 1
JP
CHINA/HONGKONG
MODEL_OPT_9
1 / 1 / 1 / 1
EPI FHD, 120Hz, V14 (8 lane)
Near AMP
ASIA/AFRICA
KOREA
N/AMERICA
S/AMERCIA
JAPAN
TAIWAN/COL
T/C
1 / 1
T2/C
BIT [6/7]
1 / 0
0 / 1
T2/C/S2/ATV_SOC
AJJA
0 / 0
T2/C/S2/ATV_EXT
EU/CIS
CHINA/HONG
T/C
T2/C/ATV_SOC
T2/C/S2
DDR3 3G
NON_DDR3 3G
FOR UD
T/C
T2/C
T2/C PIP
Default Default
ISDB
BRAZILKOREA
ISDB PIP
ATSC PIP
ATV_EXT
JAPAN
ATV_SOC
NORTH AMERICA
ATSC PIP ATV_SOC ATV_EXT
MODEL_OPT_11
MODEL_OPT_12
LVDS FHD, 120Hz OLED
T2/C/ATV_EXT
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M14-AV In/Out
C309 1000pF 50V
OPT
TP304
COMP1/AV1/DVI_L_IN
EPHY_REFCLK
D2-_HDMI1
TP316
C337 33pF OPT
C365
0.22uF 10V
HP_OUT
C318 0.047uF
TU_ALL_2178B
D0-_HDMI2
TUNER_SIF
HP_ROUT
R353 0
EU
R373 10
AUDA_OUTR
R365 100
TP308
C316 4.7uF
C346 0.047uF
C351 0.1uF
C11011
0.1uF
16V
INT_ADEMOD
COMP2_PB_IN_SOC
TP312
C356 1uF 10V
SOC_CVBS_OUT
AUDA_OUTL
D1+_HDMI4
EPHY_MDIO
R323 10K
1%
EPHY_TXD0
COMP1_PR_IN_SOC
TP305
R309 27K
1%
SC_CVBS_IN_SOC
+3.3V_NORMAL
ADC_I_INP
C343 0.047uF
TU_CVBS_SOC
SC_FB_SOC
TP302
CK+_HDMI4
R377
5.1K
HP_LOUT_MAIN
ADC_I_INN
R322 10K
1%
C11009 68pF 50V
INT_ADEMOD
C333
0.01uF TU_ALL_IntDemod
TP313
D1+_HDMI1
L305
BLM15BD121SN1
EPHY_TXD1
L307
120-ohm
COMP1_Y_IN_SOC_SOY
C324 0.047uF
C334
0.01uF 50V
EU
R345
51
TU_ALL_IntDemod
C342 22pF OPT
SMARTCARD_PWR_SEL/SD_EMMC_DATA[1]
SMARTCARD_RST/SD_EMMC_DATA[2]
C335 22pF OPT
IF_AGC
R326
75
1%
1005
R350
470
TU_ALL_IntDemod
D1+_HDMI2
COMP2_PR_IN_SOC
CK+_HDMI1
D2+_HDMI1
TP310
C332
0.01uF
TU_ALL_IntDemod
COMP1/AV1/DVI_R_IN
AUDA_OUTL
DDC_SDA_4
R520733
R372 10
C352 0.1uF
SMARTCARD_DATA/SD_EMMC_CLK
SMARTCARD_CLK/SD_EMMC_DATA[0]
C317 4.7uF
R384
4.7K
ADC_I_INP
C306
0.01uF 50V
DDC_SCL_2
TU_CVBS
SMARTCARD_CLK/SD_EMMC_DATA[0]
TP315
SC_ID_SOC
C336
0.01uF 50V
EU
AUAD_R_REF
R11023 390
INT_ADEMOD
DDC_SDA_2
SCART_LOUT_SOC
COMP2_PB_IN_SOC
TP319
HP_LOUT
COMP1_PB_IN_SOC
AUAD_R_CH2_IN
R344
51
TU_ALL_IntDemod
R335 33
SPDIF_OUT
C345 0.047uF
SCART_ROUT_SOC
D0+_HDMI4
5V_HDMI_4
R11022 390
INT_ADEMOD
CK-_HDMI4
L308
BLM18PG121SN1D
HP_OUT
SC_FB_SOC
AUAD_L_REF
R358 68
R303
22K
R520633
AUAD_R_CH2_IN
R310 27K
1%
DDC_SDA_1
COMP1_Y_IN_SOC_SOY
D1-_HDMI2
ADC_I_INN
R359 68
COMP2_Y_IN_SOC
5V_HDMI_2
EPHY_RXD0
COMP1_PB_IN_SOC
TU_CVBS_SOC
D0-_HDMI4
L303 OPT
C344
0.047uF
AUAD_L_CH3_IN
C348 2.2uF
10V
SMARTCARD_DATA/SD_EMMC_CLK
AUD_MASTER_CLK
SMARTCARD_DET/SD_EMMC_DATA[3]
AUAD_L_REF
DDR3_OPT2
AUAD_R_CH3_IN
D2+_HDMI2
D0-_HDMI1
C353
4.7uF 10V
R375 10
COMP1_PR_IN_SOC
DDR3_OPT2
R381 47K 1%
AUAD_L_CH2_IN
DTV/MNT_V_OUT_SOC
SMARTCARD_PWR_SEL/SD_EMMC_DATA[1]
COMP2_PR_IN_SOC
TP314
R312 0
L309
BLM18PG121SN1D
HP_OUT
C349
0.1uF 16V
AVDD25
R357 68
CK+_HDMI2
AUDA_OUTR
DDC_SCL_1
COMP2_Y_IN_SOC_SOY
TP307
L304
BLM15BD121SN1
C338
0.1uF OPT
DDC_SCL_4
DTV/MNT_V_OUT_SOC
R374
51K
1%
SMARTCARD_VCC/SD_EMMC_CMD
AVDD25
AUAD_R_REF
D2-_HDMI2
TP303
C366
0.22uF 10V
HP_OUT
AUD_LRCK
R367 0
GOOGLE
SC_ID_SOC
HDMI_HPD_2
DDR3_OPT1
EPHY_CRS_DV
R380 51K 1%
TP318
TP306
C303 150pF 50V OPT
AV1_CVBS_IN_SOC
EPHY_EN
C305
0.01uF 50V
R368 100 R369
100
TP311
R379
5.1K
10uF
10V
C354
R304
22K
IF_P
COMP1_Y_IN_SOC
R311 0
R351 22K
EU
TP317
R382
4.7K
C331 22pF
TU_ALL_IntDemod
EPHY_MDC
C340 22pF OPT
R383 4.7K
OPT
AUD_LRCH
C312 0.1uF
TU_ALL_2178B
R376
5.1K
SOC_CVBS_OUT
COMP1_Pr
10uF 10VC347
HP_ROUT_AMP
HP_LOUT_AMP
D0+_HDMI2
R354 0
EU
D2-_HDMI4
R329 100
TU_ALL_2178B
TP320
MHL_DET
R356
68
C359 1uF 10V
SPDIF_OUT_ARC
D2+_HDMI4
R318
75
1%
1005
SCART_ROUT_SOC
HDMI_HPD_4
R355 0
EU
AUAD_L_CH3_IN
EPHY_RXD1
D1-_HDMI4
R371 0
GOOGLE
R366 100
CK-_HDMI1
C322 0.047uF
R378 47K 1%
5V_HDMI_1
AUAD_L_CH2_IN
HDMI_HPD_1
DDR3_OPT1
COMP1_Pb
R370 0
GOOGLE
SMARTCARD_RST/SD_EMMC_DATA[2]
R352 22K
EU
I2S_AMP
SC_CVBS_IN_SOC
C357 1uF 10V
D1-_HDMI1
AUD_SCK
D0+_HDMI1
R333
33
C313
4.7uF 10V
COMP1_Y_IN_SOC
SCART_LOUT_SOC
C11010 68pF 50V
INT_ADEMOD
R360 33
IF_N
AUAD_R_CH3_IN
CK-_HDMI2
HP_ROUT_MAIN
SMARTCARD_VCC/SD_EMMC_CMD
C339 100pF 50V
OPT
R385 4.7K
OPT
SMARTCARD_DET/SD_EMMC_DATA[3]
D1-_HDMI3
CK+_HDMI3
D0+_HDMI3
D2-_HDMI3
D2+_HDMI3
CK-_HDMI3
D0-_HDMI3 D1+_HDMI3
HDMI_HPD_3
DDC_SDA_3
DDC_SCL_3
5V_HDMI_3_SOC
D0-_HDMI3
D2+_HDMI3
D1+_HDMI3
CK-_HDMI3
HDMI_HPD_3
D2-_HDMI3 CK+_HDMI3
DDC_SDA_3
D0+_HDMI3
DDC_SCL_3
D1-_HDMI3
5V_HDMI_3_SOC
TP321 TP322 TP323 TP324
TP325 TP326 TP327 TP328 TP329 TP330 TP331 TP332
IC101
LG1311
CVBS_IN1
AL27
CVBS_IN2
AK26
CVBS_IN3
AM27
CVBS_VCM
AL26
BUF_OUT1
AN27
SC1_SID
AL25
SC1_FB
AM25
SOY1_IN
AN23
Y1_IN
AL22
PB1_IN
AK21
PR1_IN
AK22
SOY2_IN
AL24
Y2_IN
AK23
PB2_IN
AL23
PR2_IN
AK24
ADC1_COM
AL21
ADC2_COM
AM23
ADC3_COM
AN25
AVSS25_COMP_REF
AM21
AVDD25_COMP_REF
AN21
AUDA_SCART_OUTL
AK16
AUDA_SCART_OUTR
AL16
AUAD_L_CH1_IN
AL19
AUAD_R_CH1_IN
AK19
AUAD_L_CH2_IN
AN19
AUAD_R_CH2_IN
AM19
AUAD_L_CH3_IN
AN17
AUAD_R_CH3_IN
AM17
AUAD_L_CH4_IN
AL17
AUAD_R_CH4_IN
AK17
AUDA_OUTL
AK20
AUDA_OUTR
AL20
AUAD_L_REF
AK18
AUAD_R_REF
AL18
AUD_VBG_EXT
AN15
IEC958OUT
AM15
AUDCLK_OUT
AN11
DAC_LRCH
AK11
DAC_SLRCH
AK10
DAC_CLFCH
AL10
DAC_SCK
AL11
DAC_LRCK
AM11
PCMI3LRCH
AD5
PCMI3LRCK
AE5
PCMI3SCK
AE7
AUDCLK_IN
AE6
FRC_LRSYNC
AD6
AAD_ADC_SIF
AK29
AAD_ADC_SIFM
AL29
IFAGC
AM29
DMD_DAC_OUT
AK27
DMD_SIF_OUT
AL30
DMD_ADC_INP
AK28
DMD_ADC_INN
AL28
DMD_ADC_INCOM
AN29
SD_CLK
E22
SD_CMD
D22
SD_CD_N
F22
SD_WP_N
F24
SD_DATA3
D24
SD_DATA2
E24
SD_DATA1
F23
SD_DATA0
E23
RMII_REF_CLK
AK14
RMII_CRS_DV
AK12
RMII_MDIO
AL12
RMII_MDC
AK13
RMII_TXEN
AL13
RMII_TXD1
AM13
RMII_TXD0
AN13
RMII_RXD1
AL14
RMII_RXD0
AK15
HDMI_1_SCL
AE27
HDMI_1_SDA
AF28
HDMI_1_HPD
AE29
HDMI_1_5V_DET
AF27
HDMI_1_ARC
AE28
HDMI_1_RX_0
AF33
HDMI_1_RX_0B
AF32
HDMI_1_RX_1
AE31
HDMI_1_RX_1B
AE30
HDMI_1_RX_2
AD31
HDMI_1_RX_2B
AD30
HDMI_1_RX_C
AF31
HDMI_1_RX_CB
AF30
HDMI_2_SCL
AD28
HDMI_2_SDA
AD29
HDMI_2_HPD
AC27
HDMI_2_5V_DET
AD27
HDMI_2_RX_0
AC31
HDMI_2_RX_0B
AC30
HDMI_2_RX_1
AB33
HDMI_2_RX_1B
AB32
HDMI_2_RX_2
AA31
HDMI_2_RX_2B
AA30
HDMI_2_RX_C
AD32
HDMI_2_RX_CB
AD33
HDMI_3_SCL
AB28
HDMI_3_SDA
AB27
HDMI_3_HPD
AB29
HDMI_3_5V_DET
AC28
HDMI_3_RX_0
Y32
HDMI_3_RX_0B
Y33
HDMI_3_RX_1
W31
HDMI_3_RX_1B
W30
HDMI_3_RX_2
V33
HDMI_3_RX_2B
V32
HDMI_3_RX_C
Y31
HDMI_3_RX_CB
Y30
HDMI_4_SCL
Y27
HDMI_4_SDA
AA28
HDMI_4_CBUS_HPD
Y28
HDMI_4_CD_SENSE
AA29
HDMI_4_5V_DET
AA27
HDMI_4_RX_0
T31
HDMI_4_RX_0B
T30
HDMI_4_RX_1
T32
HDMI_4_RX_1B
T33
HDMI_4_RX_2
R31
HDMI_4_RX_2B
R30
HDMI_4_RX_C
U31
HDMI_4_RX_CB
U30
3
2013.04.04
MID_LG1311
31
M14 Symbol C
Close to IC101
AUDIO OUT
Tuner IF Filter
Place SOC Side
Place JACK Side
AV1_CVBS/COMP1_Y Circuit was moved to 34Page
AUDIO IN
COMP
Placed as close as possible to LG1311
PLACE AT JACK SIDE
Placed as close as possible to IC101
Place at JACK SIDE
DDR3 VENDOR OPTION
PAGE 3
MAIN I2S_I/F
To ADC
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M0_DDR_DQ19
M0_DDR_DQ1
M0_DDR_DQS2
R402
1K 1%
M0_DDR_A9
M0_1_DDR_VREFCA
M0_DDR_DQS_N1
M0_DDR_DQS1
M0_DDR_DQ1
R415
1K 1%
VREF_M0_0
M0_DDR_DQ10
R411
1K 1%
M0_DDR_DQ25
M0_DDR_A15
M0_DDR_WEN
R408
1K 1%
M0_DDR_DQ8
M0_DDR_A7
M0_DDR_DQS_N0
M0_1_DDR_VREFDQ
M0_DDR_A6
M0_DDR_DQ15
M0_DDR_A13
M0_DDR_DQS_N2
C401
0.1uF
M0_DDR_DQ4
M0_DDR_A11
M0_DDR_DQS1
M0_DDR_DQ26
M0_DDR_DQ21
M0_DDR_A5
+1.5V_DDR
R410
100
M0_DDR_BA0M0_D_CLKN
M0_DDR_DQ16
M0_DDR_DQ13
M0_DDR_A8
M0_DDR_A10
M0_DDR_DQ21
R412
1K 1%
M0_DDR_DM1
M0_DDR_DQ25
+1.5V_DDR
M0_U_CLKN
M0_DDR_DQS0
M0_DDR_A4
M0_D_CLK
M0_DDR_A13
M0_DDR_A9
M0_D_CLK
M0_DDR_DQ17
M0_DDR_DQS3
M0_DDR_A6
M0_DDR_VREFDQ
M0_DDR_A14
M0_DDR_DQ12
M0_D_CLKN
M0_DDR_DQ23
H5TQ4G63AFR-PBC
IC402
DDR_512MB_HYNIX_1600_29n
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
A15
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
A14
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
M0_DDR_BA0
M0_DDR_A5
M0_DDR_BA2
M0_DDR_DQS_N3
M0_DDR_A1
M0_DDR_BA2
M0_DDR_DQ11
M0_DDR_DQ27
M0_DDR_DQS0
M0_DDR_DQ17
VREF_M0_1
R416
1K 1%
M0_DDR_DQ3
M0_DDR_A3
M0_DDR_A2
M0_DDR_A14
M0_DDR_CKE
M0_DDR_CASN
C407
0.1uF
M0_DDR_A4
R419
240 1%
M0_DDR_DQ24
M0_DDR_CKE
M0_DDR_A13
M0_DDR_DQ7
M0_DDR_DQ9
M0_DDR_DM1
M0_DDR_DQ9
M0_DDR_DQ13
M0_DDR_A12
+1.5V_DDR
C406
0.1uF
M0_U_CLK
M0_DDR_WEN
R414
1K 1%
M0_DDR_DQS_N2
VREF_M0_1
M0_1_DDR_VREFCA
M0_DDR_BA1
C408
0.1uF
M0_DDR_CKE
M0_DDR_DQ20
M0_DDR_DQ5
M0_DDR_A1
R404 10K
OPT
M0_U_CLKN
M0_DDR_DM2
M0_DDR_BA2
M0_DDR_DQS2
M0_DDR_DQ31
M0_DDR_DQ11
M0_DDR_DQ30
R409
1K 1%
M0_DDR_DQ15
M0_DDR_A14
M0_DDR_BA1
M0_DDR_DQS_N3
M0_DDR_A15
M0_DDR_DQ5
M0_DDR_A8
M0_DDR_DQ30
M0_DDR_A6
M0_DDR_DQS_N1
M0_DDR_DQ6
R403
1K 1%
M0_DDR_ODT
M0_DDR_A10
C403
0.1uF
C402
0.1uF
MT41K256M16HA-125:E
IC402-*1
DDR_512MB_MICRON
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQ0
E3
DQ1
F7
DQ2
F2
DQ3
F8
DQ4
H3
DQ5
H8
DQ6
G2
DQ7
H7
DQ8
D7
DQ9
C3
DQ10
C8
DQ11
C2
DQ12
A7
DQ13
A2
DQ14
B8
DQ15
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
A14
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
M0_DDR_A3
M0_DDR_DQ27
+1.5V_DDR
M0_DDR_DQ3
M0_DDR_A12
C430
1uF
M0_DDR_DQ19
M0_DDR_DQ8
M0_DDR_BA0
M0_DDR_DQ26
R401 240
1%
M0_DDR_DQ22
M0_DDR_DQS3
M0_DDR_ODT
M0_DDR_A15
M0_D_CLKN
+1.5V_DDR
M0_DDR_RESET_N
C414 1uF
M0_DDR_DQ7
M0_DDR_DQ14
R406
1K 1%
M0_DDR_DM0
M0_DDR_BA1
M0_DDR_RASN
M0_DDR_DQ14
M0_DDR_DQ12
M0_U_CLKN
MT41K256M16HA-125:E
IC401-*1
DDR_512MB_MICRON
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQ0
E3
DQ1
F7
DQ2
F2
DQ3
F8
DQ4
H3
DQ5
H8
DQ6
G2
DQ7
H7
DQ8
D7
DQ9
C3
DQ10
C8
DQ11
C2
DQ12
A7
DQ13
A2
DQ14
B8
DQ15
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
A14
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
M0_DDR_CASN
M0_DDR_A2
M0_DDR_CKE
M0_DDR_DQ0
M0_DDR_CASN
M0_DDR_A9
M0_DDR_RESET_N
M0_DDR_DM0
M0_DDR_A11
M0_DDR_A0
M0_DDR_A11
M0_DDR_DQ29
M0_DDR_A7
M0_DDR_DQ6
C429
1uF
R418
240 1%
M0_DDR_A10
+1.5V_DDR
M0_DDR_A5
M0_DDR_RASN
M0_DDR_DM2 M0_DDR_DM3
M0_D_CLK
M0_DDR_DQ29
M0_DDR_DQ18
M0_DDR_DQ31
M0_DDR_DQ10
R405
100
M0_DDR_DQ2
M0_DDR_A8
M0_DDR_RASN
M0_DDR_A4
M0_DDR_DQS_N0
M0_DDR_DQ22
VREF_M0_0
M0_DDR_RESET_N
M0_DDR_DQ16
M0_DDR_DQ20
M0_DDR_DQ0
+1.5V_DDR
M0_DDR_A3
M0_DDR_DQ2
M0_DDR_DQ23
M0_1_DDR_VREFDQ
M0_DDR_DQ24
M0_DDR_A2
M0_DDR_A0
R417 10K
H5TQ4G63AFR-PBC
IC401
DDR_512MB_HYNIX_1600_29n
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
A15
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
A14
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
M0_U_CLK
M0_U_CLK
M0_DDR_DQ18
M0_DDR_VREFDQ
R407
1K 1%
M0_DDR_DQ28
C413 1uF
M0_DDR_RESET_N
M0_DDR_DM3
M0_DDR_WEN
M0_DDR_ODT
+1.5V_DDR
M0_DDR_VREFCA
M0_DDR_A0
M0_DDR_A1
M0_DDR_VREFCA
M0_DDR_DQ28
R413
1K 1%
M0_DDR_DQ4
M0_DDR_A7
+1.5V_DDR
M0_DDR_A12
IC101
LG1311
M0_DDR_VREF1
A22
M0_DDR_VREF2
A3
M0_DDR_A0
E13
M0_DDR_A1
E11
M0_DDR_A2
E15
M0_DDR_A3
E17
M0_DDR_A4
D8
M0_DDR_A5
D16
M0_DDR_A6
D9
M0_DDR_A7
E16
M0_DDR_A8
E9
M0_DDR_A9
E14
M0_DDR_A10
D7
M0_DDR_A11
D10
M0_DDR_A12
D11
M0_DDR_A13
D14
M0_DDR_A14
E10
M0_DDR_A15
E12
M0_DDR_BA0
D17
M0_DDR_BA1
E8
M0_DDR_BA2
D13
M0_DDR_U_CLKP
C8
M0_DDR_U_CLKN
B8
M0_DDR_D_CLKP
C17
M0_DDR_D_CLKN
B17
M0_DDR_CKE
D12
M0_DDR_ODT
E19
M0_DDR_RASN
D19
M0_DDR_CASN
D18
M0_DDR_WEN
E18
M0_DDR_RESET_N
D15
M0_DDR_DQS_P0
B18
M0_DDR_DQS_N0
C18
M0_DDR_DQS_P1
B16
M0_DDR_DQS_N1
A16
M0_DDR_DQS_P2
B9
M0_DDR_DQS_N2
C9
M0_DDR_DQS_P3
B7
M0_DDR_DQS_N3
A7
M0_DDR_DM0
A15
M0_DDR_DM1
A18
M0_DDR_DM2
A6
M0_DDR_DM3
A9
M0_DDR_DQ0
B20
M0_DDR_DQ1
B13
M0_DDR_DQ2
C21
M0_DDR_DQ3
C14
M0_DDR_DQ4
A21
M0_DDR_DQ5
A13
M0_DDR_DQ6
B21
M0_DDR_DQ7
C13
M0_DDR_DQ8
B14
M0_DDR_DQ9
B19
M0_DDR_DQ10
C15
M0_DDR_DQ11
C20
M0_DDR_DQ12
C16
M0_DDR_DQ13
A19
M0_DDR_DQ14
B15
M0_DDR_DQ15
C19
M0_DDR_DQ16
B11
M0_DDR_DQ17
C5
M0_DDR_DQ18
C12
M0_DDR_DQ19
B4
M0_DDR_DQ20
A12
M0_DDR_DQ21
A4
M0_DDR_DQ22
B12
M0_DDR_DQ23
C4
M0_DDR_DQ24
B5
M0_DDR_DQ25
B10
M0_DDR_DQ26
C6
M0_DDR_DQ27
C11
M0_DDR_DQ28
C7
M0_DDR_DQ29
A10
M0_DDR_DQ30
B6
M0_DDR_DQ31
C10
M0_DDR_ZQCAL
E7
MID_LG1311
4
2013.04.04
M14 DDR3-M0
31
DDR3 4Gbit (x16)
DDR3 4Gbit (x16)
PAGE 4
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+1.5V_DDR
+1.5V_DDR
M1_DDR_DQS1
M1_DDR_DQS_N3
M1_D_CLK
MT41K256M16HA-125:E
IC502-*1
DDR_512MB_MICRON
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQ0
E3
DQ1
F7
DQ2
F2
DQ3
F8
DQ4
H3
DQ5
H8
DQ6
G2
DQ7
H7
DQ8
D7
DQ9
C3
DQ10
C8
DQ11
C2
DQ12
A7
DQ13
A2
DQ14
B8
DQ15
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
A14
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
M1_DDR_A2
M1_DDR_DM2
M1_DDR_DM1
M1_1_DDR_VREFCA
R515
1K 1%
M1_DDR_DQ1
M1_DDR_DQ27
M1_DDR_A14
M1_DDR_A13
M1_DDR_DQS3
C503
0.1uF
M1_DDR_A12
M1_DDR_BA2
M1_DDR_DQS0
M1_DDR_DQ19
M1_DDR_ODT
M1_DDR_A0
M1_DDR_RASN
M1_DDR_CKE
M1_DDR_DQS1M1_DDR_DM1
M1_DDR_DM0
M1_DDR_A13
+1.5V_DDR
M1_DDR_A8
M1_DDR_A6
M1_DDR_DQ15
M1_DDR_DQ0
M1_DDR_VREFCA
R508
1K 1%
R517 10K
C541 1uF
M1_DDR_A0
R507
1K 1%
R506
1K 1%
M1_DDR_A7
+1.5V_DDR
M1_DDR_A5
C507
0.1uF
M1_DDR_DQ10
M1_DDR_DQS_N1
M1_DDR_A10
C502
0.1uF
M1_DDR_DQ9
M1_DDR_DQ6
M1_DDR_BA1
M1_DDR_DQ21
R505
1K 1%
M1_U_CLKN
M1_DDR_DQ3
M1_DDR_DQ21
M1_DDR_DQS_N3
M1_DDR_A8
M1_DDR_A10
R509
1K 1%
M1_DDR_A2
M1_DDR_DQ11
C501
0.1uF
C508
0.1uF
M1_DDR_A3
M1_DDR_A3
M1_DDR_A11
M1_DDR_DQ29
M1_DDR_BA1
M1_D_CLK
M1_DDR_BA0
M1_DDR_DM3
M1_DDR_DQ14
M1_DDR_DQ24
H5TQ4G63AFR-PBC
IC502
DDR_512MB_HYNIX_1600_29n
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
A15
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
A14
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
R510
100
M1_DDR_A11
M1_DDR_DQ5
M1_DDR_A10
M1_DDR_DQ23
M1_DDR_DQ16
M1_DDR_DQS_N2
M1_DDR_A5
+1.5V_DDR
M1_DDR_A7
M1_DDR_RASN
M1_DDR_DQ31
M1_DDR_A11
+1.5V_DDR
M1_DDR_DQ22
M1_DDR_DQ18
M1_DDR_DQS_N0
M1_DDR_WEN
M1_DDR_RESET_N
M1_D_CLKN
M1_DDR_DQ22
M1_DDR_BA0
M1_DDR_A5
R519
240
VREF_M1_1
M1_DDR_DQ16
M1_DDR_BA2
R502 10K
OPT
M1_DDR_DQ14
M1_U_CLK
M1_DDR_RESET_N
M1_DDR_DM3
M1_DDR_A4
M1_DDR_DQ0
M1_DDR_A6
M1_DDR_A12
C524
1uF
M1_DDR_A14
M1_DDR_DQ29
M1_DDR_A15
M1_DDR_DQ26
M1_D_CLK
M1_DDR_A13
M1_DDR_DQ6
M1_DDR_DQ4
M1_DDR_DQ17
M1_DDR_A6
M1_DDR_CASN
M1_DDR_A3
M1_DDR_CKE
M1_DDR_DQ12
M1_DDR_WEN
M1_DDR_A1
+1.5V_DDR
M1_DDR_DQ25
M1_DDR_BA0
M1_DDR_DQ23
M1_DDR_DQ3
M1_D_CLKN
M1_DDR_RASNM1_DDR_DQS0 M1_DDR_CASN
R504
1K 1%
R512
1K 1%
M1_DDR_A8
M1_DDR_A0
M1_DDR_DQ13
M1_DDR_DQ11
M1_DDR_DQ20
M1_DDR_DQ15
VREF_M1_0
M1_DDR_CKE
H5TQ4G63AFR-PBC
IC501
DDR_512MB_HYNIX_1600_29n
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
A15
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
A14
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
M1_U_CLKN
M1_DDR_DQS3
R511
1K 1%
M1_DDR_DQ12
M1_DDR_DQS2
VREF_M1_0
M1_DDR_DQ19
M1_DDR_DQS2
M1_DDR_BA1
M1_DDR_A4
C506
0.1uF
M1_DDR_DQ7
M1_DDR_DQ2
M1_1_DDR_VREFCA
M1_DDR_DQ28
M1_DDR_DQ1
M1_DDR_A1
M1_DDR_DM2
M1_DDR_A9
M1_DDR_DQ27
M1_DDR_DQ7
M1_DDR_A7
M1_DDR_BA2
M1_DDR_DQ2
M1_DDR_A1
M1_DDR_VREFCA
M1_DDR_VREFDQ
M1_DDR_DQS_N1
VREF_M1_1
MT41K256M16HA-125:E
IC501-*1
DDR_512MB_MICRON
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQ0
E3
DQ1
F7
DQ2
F2
DQ3
F8
DQ4
H3
DQ5
H8
DQ6
G2
DQ7
H7
DQ8
D7
DQ9
C3
DQ10
C8
DQ11
C2
DQ12
A7
DQ13
A2
DQ14
B8
DQ15
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
A14
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
M1_DDR_A9
M1_1_DDR_VREFDQ
M1_DDR_DQ20
M1_DDR_A15
M1_DDR_ODT
M1_DDR_DQ13
M1_DDR_DQ5
R503
100
C525 1uF
M1_DDR_CASN
M1_DDR_DQ4
+1.5V_DDR
M1_DDR_DQ26
M1_DDR_DQ18
+1.5V_DDR
C540
1uF
M1_DDR_DM0
+1.5V_DDR
M1_DDR_DQS_N0
M1_DDR_A9
M1_DDR_DQ28
M1_1_DDR_VREFDQ
M1_DDR_DQ30
M1_U_CLK
M1_DDR_A2
M1_DDR_WEN
M1_DDR_VREFDQ
R501
240
1%
M1_DDR_CKE
M1_DDR_ODT
M1_DDR_DQ24
M1_DDR_DQ8
+1.5V_DDR
M1_DDR_A4
M1_U_CLKN
R516
1K 1%
M1_DDR_DQ25
M1_DDR_DQ8
M1_DDR_DQS_N2
R513
1K 1%
M1_DDR_A14
M1_DDR_RESET_N
R518
240
M1_DDR_RESET_N
M1_DDR_DQ10
M1_DDR_DQ30
M1_U_CLK
M1_D_CLKN
M1_DDR_DQ17
M1_DDR_DQ9
R514
1K 1%
M1_DDR_DQ31
M1_DDR_A12
M1_DDR_A15
H5TQ2G63FFR-PBC
IC501-*2
DDR_256MB_HYNIX_1600_29n
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
NC_6
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
H5TQ2G63FFR-PBC
IC502-*2
DDR_256MB_HYNIX_1600_29n
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQL0
E3
DQL1
F7
DQL2
F2
DQL3
F8
DQL4
H3
DQL5
H8
DQL6
G2
DQL7
H7
DQU0
D7
DQU1
C3
DQU2
C8
DQU3
C2
DQU4
A7
DQU5
A2
DQU6
B8
DQU7
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
NC_6
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
MT41K128M16JT-125:K
IC501-*3
DDR_256MB_MICRON
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQ0
E3
DQ1
F7
DQ2
F2
DQ3
F8
DQ4
H3
DQ5
H8
DQ6
G2
DQ7
H7
DQ8
D7
DQ9
C3
DQ10
C8
DQ11
C2
DQ12
A7
DQ13
A2
DQ14
B8
DQ15
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
NC_6
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
MT41K128M16JT-125:K
IC502-*3
DDR_256MB_MICRON
A0
N3
A1
P7
A2
P3
A3
N2
A4
P8
A5
P2
A6
R8
A7
R2
A8
T8
A9
R3
A10/AP
L7
A11
R7
A12/BC
N7
A13
T3
NC_5
M7
BA0
M2
BA1
N8
BA2
M3
CK
J7
CK
K7
CKE
K9
CS
L2
ODT
K1
RAS
J3
CAS
K3
WE
L3
RESET
T2
DQSL
F3
DQSL
G3
DQSU
C7
DQSU
B7
DML
E7
DMU
D3
DQ0
E3
DQ1
F7
DQ2
F2
DQ3
F8
DQ4
H3
DQ5
H8
DQ6
G2
DQ7
H7
DQ8
D7
DQ9
C3
DQ10
C8
DQ11
C2
DQ12
A7
DQ13
A2
DQ14
B8
DQ15
A3
VREFCA
M8
VREFDQ
H1
ZQ
L8
VDD_1
B2
VDD_2
D9
VDD_3
G7
VDD_4
K2
VDD_5
K8
VDD_6
N1
VDD_7
N9
VDD_8
R1
VDD_9
R9
VDDQ_1
A1
VDDQ_2
A8
VDDQ_3
C1
VDDQ_4
C9
VDDQ_5
D2
VDDQ_6
E9
VDDQ_7
F1
VDDQ_8
H2
VDDQ_9
H9
NC_1
J1
NC_2
J9
NC_3
L1
NC_4
L9
NC_6
T7
VSS_1
A9
VSS_2
B3
VSS_3
E1
VSS_4
G8
VSS_5
J2
VSS_6
J8
VSS_7
M1
VSS_8
M9
VSS_9
P1
VSS_10
P9
VSS_11
T1
VSS_12
T9
VSSQ_1
B1
VSSQ_2
B9
VSSQ_3
D1
VSSQ_4
D8
VSSQ_5
E2
VSSQ_6
E8
VSSQ_7
F9
VSSQ_8
G1
VSSQ_9
G9
IC101
LG1311
M1_DDR_VREF1
A2
M1_DDR_VREF2
Y1
M1_DDR_A0
M5
M1_DDR_A1
N5
M1_DDR_A2
K5
M1_DDR_A3
H5
M1_DDR_A4
T4
M1_DDR_A5
H4
M1_DDR_A6
R4
M1_DDR_A7
J5
M1_DDR_A8
T5
M1_DDR_A9
L5
M1_DDR_A10
U4
M1_DDR_A11
P4
M1_DDR_A12
P5
M1_DDR_A13
K4
M1_DDR_A14
R5
M1_DDR_A15
N4
M1_DDR_BA0
G4
M1_DDR_BA1
U5
M1_DDR_BA2
L4
M1_DDR_U_CLKP
R3
M1_DDR_U_CLKN
R2
M1_DDR_D_CLKP
F3
M1_DDR_D_CLKN
F2
M1_DDR_CKE
M4
M1_DDR_ODT
F5
M1_DDR_RASN
E4
M1_DDR_CASN
F4
M1_DDR_WEN
G5
M1_DDR_RESET_N
J4
M1_DDR_DQS_P0
E2
M1_DDR_DQS_N0
E3
M1_DDR_DQS_P1
G2
M1_DDR_DQS_N1
G1
M1_DDR_DQS_P2
P2
M1_DDR_DQS_N2
P3
M1_DDR_DQS_P3
T2
M1_DDR_DQS_N3
T1
M1_DDR_DM0
H1
M1_DDR_DM1
E1
M1_DDR_DM2
U1
M1_DDR_DM3
P1
M1_DDR_DQ0
C2
M1_DDR_DQ1
K2
M1_DDR_DQ2
B3
M1_DDR_DQ3
J3
M1_DDR_DQ4
B1
M1_DDR_DQ5
K1
M1_DDR_DQ6
B2
M1_DDR_DQ7
K3
M1_DDR_DQ8
J2
M1_DDR_DQ9
D2
M1_DDR_DQ10
H3
M1_DDR_DQ11
C3
M1_DDR_DQ12
G3
M1_DDR_DQ13
D1
M1_DDR_DQ14
H2
M1_DDR_DQ15
D3
M1_DDR_DQ16
M2
M1_DDR_DQ17
V3
M1_DDR_DQ18
L3
M1_DDR_DQ19
W2
M1_DDR_DQ20
L1
M1_DDR_DQ21
W1
M1_DDR_DQ22
L2
M1_DDR_DQ23
W3
M1_DDR_DQ24
V2
M1_DDR_DQ25
N2
M1_DDR_DQ26
U3
M1_DDR_DQ27
M3
M1_DDR_DQ28
T3
M1_DDR_DQ29
N1
M1_DDR_DQ30
U2
M1_DDR_DQ31
N3
M1_DDR_ZQCAL
E5
31
M14 DDR3-M1
2013.04.04
MID_LG1311
5
PAGE 5
4Gbit : T7(A14)
DDR3 1.5V bypass Cap
: Place these caps near Memory
DDR3 4Gbit
DDR3 4Gbit
DDR3 1.5V bypass Cap
: Place these caps near Memory
1_2Gbit : T7(NC_6)
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11/05/31
+1.5V_DDR
C609
0.1uF 16V
C633
0.1uF 16V
0.1uF 16V
C610
JP604
+3.3V_NORMAL
JP601
4.7uF 10V
C602
+2.5V_NORMAL
22uF 10V
C630
OPT
L604
BLM18PG121SN1D
C634
0.1uF 16V
AVDD25_C4TX
22uF 10V
C629
OPT
4.7uF 10V
C618
+3.3V_NORMAL
4.7uF 10V
C614
TP5209
L607
BLM18PG121SN1D
TP5207
DVDD33
L602
BLM18PG121SN1D
+1.1V_VDD
4.7uF 10V
C601
C608
0.1uF 16V
4.7uF 10V
C619
4.7uF 10V
C606
C625
0.1uF 16V
AVDD25_AUD
C628
0.1uF 16V
4.7uF 10V
C613
JP602
+2.5V_NORMAL
4.7uF 10V
C617
C631
0.1uF 16V
AVDD25
TP5210
+1.5V_DDR
DVDD18_EMMC
AVDD11_DMD
C607
0.1uF 16V
AVDD33
AVDD25_AUD
4.7uF 10V
C620
4.7uF 10V
C605
+1.1V_VDD
C627
0.1uF 16V
AVDD25
4.7uF 10V
C604
4.7uF 10V
C622
4.7uF 10V
C623
+1.1V_VDD
AVDD25_C4TX
+1.1V_VDD
L606
BLM18PG121SN1D
AVDD33
L603
BLM18PG121SN1D
4.7uF 10V
C603
C637
0.1uF 16V
C632
0.1uF 16V
C616
0.1uF 16V
C626
0.1uF 16V
+1.5V_DDR
+1.5V_DDR
TP5208
+2.5V_NORMAL
VDD3V3_HDMI
JP603
L601
BLM18PG121SN1D
AVDD11_DMD
DVDD33
C615
0.1uF 16V
IC101
LG1311
DVDD33_1
L18
DVDD33_2
L21
DVDD33_3
L22
DVDD33_4
L23
DVDD33_5
M23
DVDD33_6
T11
DVDD33_7
Y23
DVDD33_8
AA23
DVDD33_9
AC12
DVDD33_10
AC13
DVDD33_11
AC14
DVDD33_12
AC15
AVDD33_BT_USB
AC11
AVDD33_USB_1
P23
AVDD33_USB_2
R23
AVDD33_HDMI_1
T23
AVDD33_HDMI_2
U23
AVDD33_HDMI_3
V23
AVDD33_CVBS
AF22
DVDD15_M0_1
F9
DVDD15_M0_2
F10
DVDD15_M0_3
F11
DVDD15_M0_4
F12
DVDD15_M0_5
F13
DVDD15_M0_6
F14
DVDD15_M0_7
F15
DVDD15_M0_8
F16
DVDD15_M0_9
F17
DVDD15_M1_1
G6
DVDD15_M1_2
H6
DVDD15_M1_3
J6
DVDD15_M1_4
K6
DVDD15_M1_5
L6
DVDD15_M1_6
M6
DVDD15_M1_7
N6
DVDD15_M1_8
P6
DVDD15_M1_9
R6
AVDD25_C4TX_1
V11
AVDD25_C4TX_2
W11
AVDD25_C4TX_3
Y11
AVDD25_C4TX_4
AA11
AVDD25_COMP_1
AC18
AVDD25_COMP_2
AC19
AVDD25_CVBS_1
AC20
AVDD25_CVBS_2
AC21
AVDD25_DMD
AC22
AVDD25_AAD
AC23
DVDD25_XTAL
G19
AVDD25_DR3PLL
H19
SP_VQPS
H20
AVDD25_AUD
AC17
AVDD25_APLL
AB23
DVDD11_1
M20
DVDD11_2
M21
DVDD11_3
N13
DVDD11_4
N14
DVDD11_5
N15
DVDD11_6
N16
DVDD11_7
N17
DVDD11_8
N18
DVDD11_9
P20
DVDD11_10
P21
DVDD11_11
R13
DVDD11_12
R14
DVDD11_13
R15
DVDD11_14
R16
DVDD11_15
R17
DVDD11_16
R18
DVDD11_17
R19
DVDD11_18
R20
DVDD11_19
R21
DVDD11_20
T13
DVDD11_21
T20
DVDD11_22
T21
DVDD11_23
U14
DVDD11_24
U15
DVDD11_25
U16
DVDD11_26
U17
DVDD11_27
U18
DVDD11_28
U19
DVDD11_29
U20
DVDD11_30
U21
DVDD11_31
V13
DVDD11_32
V20
DVDD11_33
V21
DVDD11_34
W13
DVDD11_35
W14
DVDD11_36
W15
DVDD11_37
W16
DVDD11_38
W17
DVDD11_39
W18
DVDD11_40
W19
DVDD11_41
Y13
DVDD11_42
Y20
DVDD11_43
Y21
DVDD11_44
AA13
DVDD11_45
AA14
DVDD11_46
AA15
DVDD11_47
AA17
DVDD11_48
AA18
DVDD11_49
AA19
DVDD11_50
AA20
DVDD11_51
AA21
AVDD11_APLL
AB21
AVDD11_COMP_LLPLL
AB19
AVDD11_C4TX_1
V12
AVDD11_C4TX_2
W12
AVDD11_C4TX_3
Y12
AVDD11_C4TX_4
AA12
DVDD11_XTAL
G18
DVDD11_DR3PLL
H18
DVDD11_CVBSPLL
AF23
AVDD11_DMD_1
AF24
AVDD11_DMD_2
AF25
DVDD18_EMMC_1
L26
DVDD18_EMMC_2
M26
IC101
LG1311
GND_1
B22
GND_2
B24
GND_3
C22
GND_4
C23
GND_5
C24
GND_6
D4
GND_7
D5
GND_8
D6
GND_9
D20
GND_10
D21
GND_11
E6
GND_12
E20
GND_13
E21
GND_14
F6
GND_15
F7
GND_16
F8
GND_17
F18
GND_18
F19
GND_19
F20
GND_20
F21
GND_21
G7
GND_22
G8
GND_23
G9
GND_24
G10
GND_25
G11
GND_26
G12
GND_27
G13
GND_28
G14
GND_29
G15
GND_30
G16
GND_31
G17
GND_32
G20
GND_33
G21
GND_34
G22
GND_35
G23
GND_36
G24
GND_37
G25
GND_38
G26
GND_39
G27
GND_40
H7
GND_41
H8
GND_42
H9
GND_43
H10
GND_44
H11
GND_45
H12
GND_46
H13
GND_47
H14
GND_48
H15
GND_49
H16
GND_50
H17
GND_51
H21
GND_52
H22
GND_53
H23
GND_54
H24
GND_55
H25
GND_56
H26
GND_57
H27
GND_58
H31
GND_59
J7
GND_60
J8
GND_61
J26
GND_62
J27
GND_63
K7
GND_64
K8
GND_65
K26
GND_66
K27
GND_67
L7
GND_68
L8
GND_69
L11
GND_70
L12
GND_71
L13
GND_72
L14
GND_73
L15
GND_74
L16
GND_75
L17
GND_76
L19
GND_77
L20
GND_78
L27
GND_79
M7
GND_80
M8
GND_81
M11
GND_82
M12
GND_83
M13
GND_84
M14
GND_85
M15
GND_86
M16
GND_87
M17
GND_88
M18
GND_89
M19
GND_90
M22
GND_91
M27
GND_92
N7
GND_93
N8
GND_94
N11
GND_95
N12
GND_96
N19
GND_97
N20
GND_98
N21
GND_99
N22
GND_100
N23
GND_101
N26
GND_102
N27
GND_103
N30
GND_104
P7
GND_105
P8
GND_106
P11
GND_107
P12
GND_108
P13
GND_109
P14
GND_110
P15
GND_111
P16
GND_112
P17
GND_113
P18
GND_114
P19
GND_115
P22
GND_116
P26
GND_117
P30
GND_118
R7
GND_119
R8
GND_120
R11
GND_121
R12
GND_122
R22
GND_123
R26
GND_124
R27
GND_125
T6
GND_126
T7
GND_127
T8
GND_128
T12
GND_129
T14
GND_130
T15
GND_131
T16
GND_132
T17
GND_133
T18
GND_134
T19
GND_135
T22
GND_136
T26
GND_137
T27
GND_138
U6
GND_139
U7
GND_140
U8
GND_141
U11
GND_142
U12
GND_143
U13
GND_144
U22
GND_145
U26
GND_146
V4
GND_147
V5
GND_148
V6
GND_149
V7
GND_150
V8
GND_151
V14
GND_152
V15
GND_153
V16
GND_154
V17
GND_155
V18
GND_156
V19
GND_157
V22
GND_158
V26
GND_159
V30
GND_160
V31
GND_161
W4
GND_162
W8
GND_163
W20
GND_164
W21
GND_165
W22
GND_166
W23
GND_167
W26
GND_168
W27
GND_169
Y2
GND_170
Y3
GND_171
Y4
GND_172
Y8
GND_173
Y14
GND_174
Y15
GND_175
Y16
GND_176
Y17
GND_177
Y18
GND_178
Y19
GND_179
Y22
GND_180
Y26
GND_181
AA8
GND_182
AA16
GND_183
AA22
GND_184
AA26
GND_185
AB11
GND_186
AB12
GND_187
AB13
GND_188
AB14
GND_189
AB15
GND_190
AB16
GND_191
AB17
GND_192
AB18
GND_193
AB20
GND_194
AB22
GND_195
AB26
GND_196
AB30
GND_197
AB31
GND_198
AC16
GND_199
AC26
GND_200
AD26
GND_201
AE26
GND_202
AF6
GND_203
AF8
GND_204
AF9
GND_205
AF10
GND_206
AF11
GND_207
AF12
GND_208
AF13
GND_209
AF14
GND_210
AF15
GND_211
AF16
GND_212
AF17
GND_213
AF18
GND_214
AF19
GND_215
AF20
GND_216
AF21
GND_217
AF26
GND_218
AG20
GND_219
AG25
GND_220
AG31
GND_221
AH25
GND_222
AJ25
GND_223
AK9
GND_224
AK25
GND_225
AL9
GND_226
AL15
MID_LG1311
6
31
VCC & GND
2013.04.04
+2.5V_Bypass Cap
+3.3V_Bypass Cap
+1.1V_Bypass Cap
GND JIG POINT
+1.5V_Bypass Cap
AFE 3CH Power
PAGE 6
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CI_DATA[0]
CI_ADDR[4]
EB_DATA[7]
CI_DATA[5]
CI_ADDR[1]
CI_IN_TS_DATA[0]
CI_DATA[7]
CI_DATA[1]
CI_DATA[3]
CI_IN_TS_DATA[5] CI_IN_TS_DATA[6]
TPO_DATA[7]
TPO_DATA[3]
CI_ADDR[11]
EB_DATA[5]
TPO_DATA[5]
TPO_DATA[2]
CI_ADDR[3]
CI_DATA[4]
CI_ADDR[5]
CI_IN_TS_DATA[3]
EB_DATA[6]
CI_IN_TS_DATA[1]
CI_ADDR[7]
EB_DATA[2]
TPO_DATA[0]
CI_ADDR[13]
CI_IN_TS_DATA[4]
CI_ADDR[8]
EB_DATA[4]
CI_ADDR[6]
CI_IN_TS_DATA[7]
CI_ADDR[14]
CI_ADDR[2]
EB_DATA[0]
CI_DATA[4]
CI_ADDR[12]
TPO_DATA[4]
EB_DATA[0-7]
EB_DATA[3]
TPO_DATA[6]
EB_DATA[1]
CI_ADDR[0]
CI_ADDR[10]
CI_DATA[0]
CI_DATA[1]
CI_IN_TS_DATA[2]
TPO_DATA[1]
CI_DATA[6]
CI_DATA[2]
CI_DATA[7]
CI_ADDR[9]
CI_DATA[3]
CI_DATA[2]
CI_DATA[5] CI_DATA[6]
+5V_CI_ON
CAM_REG_N
CI_ADDR[10]
CI_TS_DATA[2]
AR709
33
CI
CI_TS_DATA[4]
CI_IN_TS_CLK
C707
0.1uF 16V
CI
/PCM_IOWR
CI_ADDR[8]
EB_ADDR[2]
CI_IN_TS_DATA[3]
R701
33
OPT
CI_TS_DATA[5]
EB_ADDR[9]
CI_TS_CLK
PCM_INPACK
C703 12pF 50V OPT
EB_ADDR[11]
CI_TS_SYNC
C705
0.1uF 16V
CI
TPI_DATA[6]
EB_ADDR[12]
/PCM_CE2
EB_ADDR[10]
CI_IN_TS_DATA[4]
CI_TS_DATA[6]
/PCM_WE
CI_ADDR[10]
PCM_INPACK
AR705
100
CI
R720 33
CI
EB_WE_N
C701
0.1uF CI
PCM_RESET
CI_TS_VAL
CI_ADDR[7]
CI_ADDR[0]
R715
100
CI
AR712
33
CI
CI_IN_TS_DATA[2]
R726
10K
CI_ADDR[5]
AR708
33
CI
CI_TS_DATA[7]
AR706
100
CI
EB_ADDR[3]
CI_TS_DATA[2]
CI_IN_TS_SYNC
CI_TS_CLK
CI_ADDR[8]
/PCM_OE
R722 10K
AR713
33
CI
CI_IN_TS_DATA[5]
CI_TS_DATA[0]
AR711
33
CI
CI_TS_DATA[1]
TPO_VAL
TPI_DATA[1]
/PCM_IORD
CI_IN_TS_DATA[0-7]
/CI_CD1
CI_ADDR[13]
CI_TS_DATA[0]
CI_ADDR[5]
AR704
100
EB_DATA[0-7]
CI_IN_TS_DATA[1]
R725
10K
AR710
33
CI
CI_ADDR[4]
TPO_CLK
C706
0.1uF 16V
CI
CAM_CD2_N
CI_ADDR[0]
CI_ADDR[6]
CI_IN_TS_VAL
/PCM_WAIT
+5V_NORMAL
CI_DATA[0-7]
R707
10K
CI
CI_IN_TS_DATA[0]
CI_TS_DATA[1]
CI_ADDR[9]
/CI_CD1
/PCM_REG
CAM_INPACK_N
/PCM_IRQA
R721 33
OPT
CI_ADDR[7]
/PCM_IOWR
CI_ADDR[14]
CI_ADDR[11]
CI_ADDR[2]
TPI_CLK
EB_ADDR[6]
CI_TS_DATA[7]
CI_IN_TS_DATA[6]
TPI_DATA[0]
EB_ADDR[13]
CI_ADDR[1]
AR714
33
CI
CAM_CD1_N
/CI_CD2
+5V_CI_ON
/PCM_IRQA
EB_ADDR[14]
CI_ADDR[6]
CI_TS_DATA[4]
CI_ADDR[4]
CI_IN_TS_DATA[7]
CAM_WAIT_N
CI_ADDR[11]
/PCM_REG
CI_ADDR[13]
TPO_DATA[0-7]
AR707
100
CI
TPI_SOP
R703
33
CI
CI_ADDR[3]
CI_TS_VAL
EB_BE_N0
R716 100
CI
CI_TS_DATA[5]
R702
33
CI
/CI_CD2
/PCM_WE
AR701
33
CI
TPI_DATA[4]
EB_ADDR[1]
CI_ADDR[14]
TPO_SOP
TPI_DATA[7]
PCM_INPACK
/PCM_CE2
EB_ADDR[7]
+5V_CI_ON
TPI_DATA[3]
EB_ADDR[5]
C704 0.1uF
CI
AR703
33
CI
C708 12pF 50V OPT
EB_BE_N1
CI_ADDR[2]
/PCM_IORD
CI_IN_TS_CLK
TPI_DATA[5]
CI_ADDR[12]
TPI_VAL
/PCM_WAIT
EB_ADDR[4]
CI_DATA[0-7]
AR702
33
CI
C702
4.7uF 10V CI
CI_ADDR[1]
EB_OE_N
CI_IN_TS_VAL
CAM_IREQ_N
CI_TS_DATA[3]
CI_ADDR[3]
CI_ADDR[9]
/PCM_CE1
CI_TS_SYNC
TPI_DATA[2]
EB_ADDR[8]
CI_TS_DATA[6]
CI_ADDR[12]
CI_TS_DATA[3]
EB_ADDR[0]
/PCM_OE
CI_IN_TS_SYNC
JK701
10125901-015LF
CI
G1G2
57
21
52
16
10
47
41
5
36
59
23
45
54
18
49
43
13
7
38
2
25
56
20
51
15
9
46
40
4
35
58
22
53
17
11
48
42
12
6
37
1
24
55
19
50
44
14
8
39
3
2660 2761 2862 2963 3064 31 32 33 34
65 66 67 68
69
PCMCIA
31
7
2013.03.22
MID_LG1311
PAGE 7
Copyright © 2014 LG Electronics. Inc. All rights reserved. Only for training and service purposes
LGE Internal Use Only
Loading...
+ 65 hidden pages