Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shor ts of the circuitr y tha t may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec. sheet applies to LA4AA Chassis applied LED TV all
models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only
key.
(6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
※ Caution
When still image is displayed for a period of 20 minutes or
longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there
can some afterimage in the black level area
▪ It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
(1) Since EDID data is embedded, EDID download JIG, HDMI
cable is not need.
(2) Adjust by using remote controller
4.2.3. Download method
(1) Press Adj. key on the Adj. R/C.
(2) Select EDID D/L menu.
(3) By pressing Enter key, EDID download will begin
(4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
(5) If Download is failure, Re-try downloads.
※Caution : Wh en EDID Download, must remove HDMI
Cable.
4.2.3.1. Models for EDID Data
not Deep Color, DTS + AC3 + PCM
DTS
Ver 0.10
RGB88-----
HDMI16F8DE78DE7466F60E760E719
HDMI26F7DE77DE7366F50E750E709
PCM
Ver 0.10
RGB88----
HDMI16F086F08E708E708E7C1
HDMI26FF8-E7F8-E7B1
(1)8Bit_HD(2)8Bit_
(7_a)8Bit_HD(7_b)8Bit_HD(8_a)8Bit_
2D3D
(3)10Bit_
FHD
FHD
not Deep Color, DTS + AC3 + PCM
(4)8Bit_HD(5)8Bit_
2D
FHD
(8_b)8Bit_
FHD
(6)10Bit_
FHD
(9)10Bit_
4.3. Tool Option Input
- Input Model Tool Option according to BOM
FHD
FHD
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 ºC
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON sta tus during 5
Minutes.
- In case of LCD, Back-light on should be checked using no
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before
adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
※ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
5.1.5.2. Manual adj. method
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface..
(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 204 Gray(80IRE) inte rna l
pattern will be displayed)
(4) Adjust modes (Cool) : Fix the G gain at least 172 and
change the others (R/B Gain).
* If R or B gain is over 255, G gain can be adjust below 172
(5) Adjust two modes ( Medium / Warm) : Fix the one of R/G/B
gain to 192 (default data) and decrease the others
※ CASE
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
(2) x, y < target
(3) x >target , y < target
(4) x < target , y > target
- Every 4 case have to fit y value by adjusting B Gain and then
fit x value by adjusting R-Gain
- In this case, increasing/decreasing of B Gain and R Gain can
be adjusted.
► How to adjust
(1) Fix G gain at least 172
Adjust R, B Gain (In Case of Mostly Blue Gain Saturation)
(2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is
automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
9. Test factor for commercial model
9.1. RJP TEST (Only US model)
RJP port
9.1.1. Overview
▪ Jig(Commercial Check JIG)
▪ RJ45 cable
▪ Power only mode
9.1.2. Test sequence
(1) Operate JIG(Commercial Check JIG) as shown on picture1
(2) Turn on TV and press “P-O NLY” key on adjustment
remocon.
(3) Connect RJ45 cable into RJP port of the TV set.
(4) Connect RJ45 cable into the JIG.
(5) If shown “OK” it’s normal, “NG” it’s defect.
(6) If defect, check the connection once again as done above.
(7) If the signal power is no good, check the connection of RF
cable.
10. External Speaker Out
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Only for training and service purposes
- 14 -
Recommended Input Signal
: RF, 1kHz, Sine wave
(1) Connect external speaker to speaker out port with phone
jack on TV side as below
(2) Check the Max. speaker output is 1W or not. Sine wave
with 1KHz will be displayed
(3) Check Both of the signal in speaker.
(Power only mode -> Fived 1W Default)
-> Check the input signal(1KHZ, Sine wave) and the wave
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components a s
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_L14
MAIN1_NON_EU1
13/10/16
Page 24
MODEL OPTION
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2
MAIN1_NON_EU
13/10/16
M1A_L14
MAIN2_NON_EU
2013.10.16
2
Page 25
+1.5V_DDR
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_L14
DDR
13/10/16
3
Page 26
L14 POWER BLOCK (POWER DETECT 2)
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC5_M1A
Power_PD2
2013.05.15
1
Page 27
AUDIO AMP TI (TAS5733)
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPK_L+
SPK_L-
SPK_R+
SPK_R-
M1A_L14
AMP_MAIN_TI5
WAFER-ANGLE
4
3
2
1
P5600
13/10/16
Page 28
IR/LED + Digital Eye + Control
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.5V_ST
R4604
IR_OUT
+3.5V_ST
IR_OUT
R4610
22
L4600
BLM18PG121SN1D
C4600
0.1uF
16V
IR_OUT_EU
R4612
IR_OUT_EU
Q4616
2SC3052
C4601
1000pF
50V
+3.5V_ST
1K
C
E
IR_OUT_US
R4611
0
IR_OUT_EU
B
IR
R4613
10K
IR_OUT
R4614
IR_OUT
Q4617
2SC3052
+3.5V_ST
1K
C
E
R4603
R4601
100
KEY1
R4602
100
KEY2
+3.5V_ST
R4600
3.3K
IR_OUT
R4615
47K
B
10K
1%
10K
1%
LED_R/BUZZ
SENSOR_SCL
SENSOR_SDA
C4602
0.1uF
16V
C4603
0.1uF
16V
C4604
100pF
+3.3V_Normal
50V
R4605
1K
R4606
1.8K
VA4600
LED_R_Zener
IR_Zener
VA4601
R4607
1K
R4608 100
R4609 100
C4605
18pF
50V
C4606
18pF
50V
P4600
12507WR-10L
1
2
3
4
5
6
7
8
9
10
11
OPT
P4601
12507WR-08L
1
2
3
4
5
6
7
8
9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M1A_L14
IR/LED
13/10/16
6
Page 29
USB (SIDE)
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
JK700
1234
USB DOWN STR EAM
3AU 04S-3 05-Z C-(LG )
5
OPT
C710
5pF
50V
+5V_USB
C700
22uF
16V
R700
2.2
1/16W
5%
D700
RCLAMP0502BA
OPT
C712
22uF
16V
R701
2.2
1/16W
5%
C713
22uF
16V
SIDE_USB1_DM
SIDE_USB1_DP
ZD700
OPT
SD05
5V
OPT
C711
5pF
50V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_M1A
USB_S1
13/04/30
7
Page 30
HDMI (REAR 1 / SIDE 1 MHL)
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
SHIELD
20
19
18
17
16
15
14
13
12
11
CK+
10
EAG59023302
JK800
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_2
R803
1K
R802
1.8K
VA800
ESD_HDMI1_VARISTOR
5V_DET_HDMI_2
ESD_HDMI1
R805
3.3K
VA801
ESD_HDMI1_VARISTOR
VA800-*1
1uF
10V
ESD_HDMI1_CAP
VA801-*1
1uF
10V
ESD_HDMI1_CAP
VA802
MMBT3904(NXP)
Q800
C
E
VA803
ESD_HDMI1
R808
10K
B
R809
10K
R810 100
R811 100
VA804
ESD_HDMI1
D803
IP4283CZ10-TBA
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+
5
ESD_HDMI1_NXP
D804
IP4283CZ10-TBA
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+
5
ESD_HDMI1_NXP
RCLAMP0524PA
D803-*1
1
2
3
4
5
ESD_HDMI1_SEMTECH
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
10
9
8
7
6
ESD_HDMI1_SEMTECH
RCLAMP0524PA
D804-*1
1
10
2
9
8
3
7
4
6
5
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
HDMI_2 MHL
VA805
ESD_HDMI2
GND
20
HP_DET
19
5V
BODY_SHIELD
DAADR019A
JK801-*1
HDMI2_EMI
20
19
HOT_PLUG_DETECT
18
VDD[+5V]
17
DDC/CEC_GND
16
SDA
15
SCL
14
RESERVED
13
CEC
12
TMDS_CLK-
11
TMDS_CLK_SHIELD
10
TMDS_CLK+
9
TMDS_DATA0-
8
TMDS_DATA0_SHIELD
7
TMDS_DATA0+
6
TMDS_DATA1-
5
TMDS_DATA1_SHIELD
4
TMDS_DATA1+
3
TMDS_DATA2-
2
TMDS_DATA2_SHIELD
1
TMDS_DATA2+
ESD_HDMI2_SEMTECH
18
17
16
15
14
13
12
11
10
EAG62611204
9
8
7
6
5
4
3
2
1
JK801
HDMI-2
RCLAMP0524PA
D805-*1
1
10
2
9
8
3
7
4
6
5
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_4
R812
1.8K
HDMI-2
ESD_HDMI2
VA806
RCLAMP0524PA
D806-*1
1
10
2
9
8
3
7
4
6
5
ESD_HDMI2_SEMTECH
5V_DET_HDMI_4
R813
3.3K
HDMI-2
VA807
5.6V
OPT
ESD_HDMI2
VA808
ESD_HDMI2
VA809
HDMI-2
R814
33
VA810
ESD_HDMI2
VA811
ESD_HDMI2
HDMI-2
R815100
R816100
HDMI-2
IP4283CZ10-TBA
TMDS_CH1-
TMDS_CH1+
GND_1
TMDS_CH2-
TMDS_CH2+
ESD_HDMI2_NXP
IP4283CZ10-TBA
TMDS_CH1-
TMDS_CH1+
GND_1
TMDS_CH2-
TMDS_CH2+
ESD_HDMI2_NXP
C800
0.047uF
25V
HDMI-2
1
2
3
4
5
1
2
3
4
5
D805
D806
10
9
8
7
6
10
9
8
7
6
R817
300K
MHL Spec
HDMI-2
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
NC_4
NC_3
GND_2
NC_2
NC_1
NC_4
NC_3
GND_2
NC_2
NC_1
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
MHL_CD_SENSE
CEC
R804
A2CA1
MMBD6100
D800
100
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE_S7
5V_HDMI_4
R806
2.7K
+5V_Normal
A2CA1
MMBD6100
D801
R807
2.7K
+3.5V_ST
DDC_SDA_4
DDC_SCL_4
A2CA1
MMBD6100
D802
HDMI_CEC
5V_HDMI_2
R800
2.7K
+5V_Normal
R801
2.7K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_M1A
2013/05/15
HDMI_R1_S18
Page 31
SPDIF from EAX65346302
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF_OUT
+3.3V_Normal
C1001
1uF
OPT
10V
ESD Ready
GND
VCC
VINPUT
C1002
47pF
50V
SPDIF_CAP_47pF
JK1001
JST1223-001
Fiber Optic
1
2
3
4
FIX_POLE
SPDIF_CAP_18pF
C1002-*1
18pF
50V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC5_L14
SPDIF
2013/05/15
10
Page 32
LVDS (NON EU)
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[51Pin LVDS Connector]
(For FHD 60Hz)
FHD
P1100
FI-RE51S-HF-J-R1500
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
VCOM_SDA
VCOM_SCL
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
R11000
FHD
FHD
R11010
R11020
FHD
LVDS_SEL
+3.3V_Normal
OPT
R1103
3.3K
OPT
R1104
10K
PANEL_VCC
FHD
L1100
120OHM
UBW2012-121F
FHD
C1100
0.1uF
16V
FOR FHD REVERSE(10bit)
Change in S7LR
MIRROR
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-RXBCK-
RXB1+
RXB1-
RXB0+
RXB0-
Pol-change
RXA0+
RXA0-
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXA4+
RXA4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXB3+
RXB3-
RXB4+
RXB4-
FOR FHD REVERSE(8bit)
Change in S7LR
RXA4+
RXA4-
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB4+
RXB4-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
MIRROR
Pol-change
RXA4+
RXA4-
RXA0+
RXA0-
RXA1+
RXA1-
RXA2+
RXA2-
RXACK+
RXACK-
RXA3+
RXA3-
RXB4+
RXB4-
RXB0+
RXB0-
RXB1+
RXB1-
RXB2+
RXB2-
RXBCK+
RXBCK-
RXB3+
RXB3-
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
Shift
RXA4-
RXA4+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-RXACK-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
RXB4-
RXB4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK+
RXA3-
RXA3+
RXA4-
RXA4+
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
RXB4-
RXB4+
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
HD
P1101
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
VCOM_SCL
VCOM_SDA
+3.3V_Normal
EU pin assign is different from NON EU.
Because of position of HD wafer.
V-COM I2C
+3.3V_Normal
VCOM_SCL
VCOM_SDA
VCOM_I2C_PULL_UP
R1114
VCOM_I2C
R1105
0
R1106
0
VCOM_I2C
2K
VCOM_I2C_PULL_UP
R1115
2K
URSA/VCOM_SCL
URSA/VCOM_SDA
LVDS_SEL
OPT
R1109
3.3K
OPT
R1110
10K
PANEL_VCC
120OHM
HD
L1101
UBW2012-121F
HD
C1101
0.1uF
16V
URSA/VCOM_SCL
URSA/VCOM_SDA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_S7LR(M1A)
LVDS_NON_EU
2013/05/01
11
Page 33
Serial Flash for SPI boot
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
/FLASH_WP
OPT
R1300
10K
+3.5V_ST
/SPI_CS
SPI_SDO
OPT
R1301
4.7K
SPI_FLASH_MACRONIX
IC1300
MX25L8006EM2I-12G
CS#
1
SO/SIO1
2
WP#
3
GND
4
8
7
6
5
VCC
HOLD#
SCLK
SI/SIO0
+3.5V_ST+3.5V_ST
R1302
33
C1300
0.1uF
SPI_SCK
SPI_SDI
SPI_FLASH_WINBOND
IC1300-*1
W25Q80BVSSIG
CS
1
DO[IO1]
2
%WP[IO2]
3
GND
4
8
7
6
5
VCC
HOLD[IO3]
CLK
DI[IO0]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC5_S7LR(M1A)
S_FLASH
2013/04/29
13
Page 34
GLOBAL tuner block KR & AJ
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
DEV_TU_ATSC
TU1601
TDJH-H101F
B1[+3.3V]
1
NC_1
2
IF_AGC
3
SCL
4
SDA
5
IF[P]
6
IF[N]
7
NC_2
8
NC_3
9
+3.3V_TU
C1616
C1615
100pF
0.1uF
50V
16V
close to the tuner pin, add,09029
R16050
HALF_NIM/IF_NON_FILTER
R16060
HALF_NIM/IF_NON_FILTER
Close to the tuner
HALF_NIM/IF_FILTER
R1605-*1
10
HALF_NIM/IF_FILTER
R1606-*1
10
C1609
18pF
50V
C1610
18pF
50V
R160733
R160833
C1611
0.1uF
16V
R1609 100
should be guarded by ground
+3.3V_TU
R1610
1.8K
TU_IIC_ATSC_1.8K
OPT
OPT
C1614
C1613
20pF
20pF
50V
50V
IF_AGC_MAIN
R1610-*1
1K
TU_IIC_NON_ATSC_1K
R1611-*1
1K
TU_IIC_NON_ATSC_1K
R1611
1.8K
TU_IIC_ATSC_1.8K
TU_SCL
TU_SDA
+3.3V_TU
CHANGE TO
6.3V 2012 X5R
C1602
22uF
6.3V
Size change,0929
L1600
UBW2012-121F
C1603
0.1uF
16V
FE_TS_SYNC
FE_TS_VAL_ERR
FE_TS_CLK
FE_TS_DATA[0]
+3.3V_Normal
C1605
22uF
6.3V
CHANGE TO
6.3V 2012 X5R
C1607
0.1uF
16V
FE_AGC_SPEED_CTL
IF_AGC_SEL
TUNER_RESET
RF_SWITCH_CTL
TU_AJ_T/C
TU1601-*1
TDJH-G101D
B1[+3.3V]
1
NC_1
2
IF_AGC
3
SCL
4
SDA
5
IF[P]
6
IF[N]
7
NC_2
8
NC_3
9
A1
A1
47
SHIELD
B1
B1
GND seperation for ASIS tuner
OPT
R1600
TU_GND_A
TU_GND_A
R1601
0
0
IF_P_MSTAR
IF_N_MSTAR
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
OPT
A1
A1
B1
B1
47
SHIELD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_S7LR(M1A)
TUNER_KR_AJ
2013.05.06
14
Page 35
EXT_speaker Single ended
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+24V
L902
EXT_SPK
BLM18PG121SN1D
EXT_SPK
C914
0.1uF
50V
EXT_SPK
C915
0.1uF
50V
EXT_SPK
C916
4.7uF
50V
EXT_SPEAKER
EXT_AMP_L
EXT_AMP_R
EXT_SPK
C928
10V
1uF
10V
1uF
C927
EXT_SPK
EXT_SPK_DET
SUB_MUTE
EXT_SPK
R924
10K
EXT_SPK
C911
1uF
50V
C912
1uF
50V
EXT_SPK
EXT_SPK
C913
0.1uF
50V
TPA3124D2PWPR
PVCCL_1
SD
PVCCL_2
MUTE
LIN
RIN
BYPASS
AGND_1
AGND_2
PVCCR_1
VCLAMP
PVCCR_2
EXT_SPK
IC901
1
2
3
4
5
6
7
8
9
10
11
12
PGNDL_2
24
PGNDL_1
23
LOUT
EXT_SPK
22
21
20
19
18
17
16
15
14
13
BSL
AVCC_2
AVCC_1
GAIN0
GAIN1
BSR
ROUT
PGNDR_2
PGNDR_1
C917
0.22uF
50V
EXT_SPK
C918
0.22uF
50V
EXT_SPK
L904
22.0uH
22.0uH
L905
EXT_SPK
R930
10K
OPT
R931
10K
EXT_SPK
EXT_SPK
R932
10K
EXT_SPK
R933
10K
OPT
R934
4.7K
EXT_SPK
R935
4.7K
C919
0.47uF
50V
EXT_SPK
C920
0.47uF
50V
EXT_SPK
C921
0.47uF
50V
EXT_SPK
C922
0.47uF
50V
EXT_SPK
C923
C924
47uF
47uF
25V
EXT_SPK
25V
EXT_SPK
EXT_SPK
10K
R936
EXT_SPK
10K
R937
EXT_OUT_L
EXT_OUT_R
EXT_SPK
JK902
PEJ034-01
E_SPRING
3
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
10V
C902
1uF
10V
R9061K1/16W
5%
CI_Del_EXT_SPK
0
CI
1/16W
5%
R906-*1
C925
1uF
OPT
C926
1uF
10V
OPT
EXT_OUT_R
EXT_OUT_L
+3.5V_ST
EXT_SPK
R908 100
R908-*1
0
1/16W
5%
R907
15K
CI_Del_EXT_SPK
CI
EXT_SPK_DET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC5_L14
EXT. Speaker/H.P.
2013/07/18
15
Page 36
COMPONENT & AV1(COMMON), AV2 => RGB/AV/RS232C
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
RGB PC
RGB_PC
D710
MMBD6100
C
A2
A1
+5V_Normal
DSUB_VSYNC
DSUB_HSYNC
DSUB_B+
DSUB_G+
DSUB_R+
C707
47pF
50V
OPT
C708
47pF
50V
OPT
C709
47pF
50V
OPT
OPT
C718
68pF
50V
OPT
VA701
20V
ADUC 20S 02 010L
RGB_PC
R718
75
RGB_PC
R719
75
RGB_PC
R720
75
NON_CI_CAP_RGB_PC
ADUC 20S 02 010L
RGB_VARISTOR
VA702
20V
ADUC 20S 02 010L
RGB_VARISTOR
VA703
20V
ADUC 20S 02 010L
RGB_VARISTOR
VA704
20V
OPT
C720
68pF
50V
RGB_PC
R723
2.2K
NON_CI_CAP_RGB_PC
C721
18pF
50V
OPT
VA705
20V
ADUC 20S 02 010L
RGB_EMI
BLM15BD121SN1
L704
RGB_EMI
BLM15BD121SN1
L702
RGB_EMI
BLM15BD121SN1
L701
RGB_PC
R724
2.2K
C723
18pF
50V
OPT
VA706
5.6V
RED2GREEN3BLUE4GND_15DDC_GND
RED_GND7GREEN_GND8BLUE_GND9NC10SYNC_GND
GND_212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK
11
6
1
JK705
SPG09-DB-010
NON_CI_CAP_RGB_PC
0.1uF
16V
RGB_PC
C724
OPT
VA707
5.6V
SHILED
16
RGB_DDC_SCL
RGB_DDC_SDA
+3.3V_Normal
RGB_PC
R729
10K
OPT
VA708
5.6V
ADMC 5M 02 200L
RGB_PC
R732
1K
DSUB_DET
RS232C
0.33uF
C701
C1+
C702
0.1uF
C703
0.1uF
C1-
C2+
C704
0.1uF
C2-
C705
0.1uF
DOUT2
RIN2
V+
V-
IC701
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
JP719
R712
1K
JP718
JP708
JP709
PM_RXD
PM_TXD
IR_OUT
+3.5V_ST
D704
CDS3C30GTH
30V
OPT
C706
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
D706
CDS3C30GTH
30V
OPT
+3.5V_ST
R710
100
R711
100
D707
BAP70-02
50V
10
9
8
7
6
SPG09-DB-009
JK706
5
4
3
2
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
REAR_JACK_NON_EU
2013.05.20L14_S7LR(M1A)
17
Page 37
COMPONENT & AV1(COMMON)
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
AV2
COMP_AV1
JK1702
PPJ245-01
[RD2]E-LUG
7E
[RD2]C-SPRING
6E
[RD2]CONTACT
4E
[WH]C-SPRING
5D
[RD1]CONTACT
4C
VA1700
5.6V
COMP_LR_ZENER
VA1701
5.6V
COMP_LR_ZENER
VA1702
5.6V
OPT
R1703
470K
R1704
470K
+3.3V_Normal
R1709
10K
C1704-*1
330pF
50V
330p
C1705-*1
330pF
50V
330p
R1712
1K
C1704
1000pF
50V
1000p
C1705
1000pF
50V
1000p
R1714
10K
R1715
10K
COMP_DET
R1720
12K
R1721
12K
COMP_R_IN
COMP_L_IN
COMPONENT
&
AV1
color change comp jack
JK1702-*1
PPJ245N2-01
6E
5E
4E
5D
4C
5C
7C
5B
4A
5A
6A
[RD2]E-LUG
[RD2]O-SPRING
[RD2]CONTACT
[WH]O-SPRING
[RD1]CONTACT
[RD1]O-SPRING
[RD1]E-LUG-S
[BL]O-SPRING
[GN/YL]CONTACT
[GN/YL]O-SPRING
[GN/YL]E-LUG
[RD1]C-SPRING
6C
[RD1]E-LUG-S
8C
[BL]C-SPRING
5B
[GN]CONTACT
4A
[GN]C-SPRING
6A
[GN]E-LUG
7A
COMP_Pr_ZENER_ROHM
ZD1701
ZD1703
COMP_Pb_ZENER_ROHM
ZD1705
COMP_Y_ZENER_ROHM
ZD1700
COMP_Pr_ZENER_ROHM
ZD1702
COMP_Pb_ZENER_ROHM
VA1703
5.6V
OPT
ZD1704
COMP_Y_ZENER_ROHM
R1705
75
R1706
75
+3.3V_Normal
R1707
75
1608
1%
Size Check !!!
R1710
10K
OPT
R1723
75
3216
COMP_Pr+
ZD1701-*1
COMP_Pr_ZENER_KEC
COMP_Pb+
ZD1703-*1
COMP_Pb_ZENER_KEC
R1713
1K
R1722
0
1%
AV_CVBS_DET
COMP_Y+/AV_CVBS_IN
ZD1705-*1
COMP_Y_ZENER_KEC
ZD1700-*1
COMP_Pr_ZENER_KEC
ZD1702-*1
COMP_Pb_ZENER_KEC
ZD1704-*1
COMP_Y_ZENER_KEC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
REAR_JACK_NON_EU
2013.05.20L14_S7LR(M1A)
17
Page 38
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.