LG 39LN51 Series Service Manual

Printed in KoreaP/NO : MFL67732803 (1304-REV00)

LED TV

SERVICE MANUAL

North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

Internal Use Only

CHASSIS : LB35B

MODEL : 39LN51** 39LN51**-T*

CAUTION

BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS .................................................................... 4

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

BLOCK DIAGRAM .................................................................................. 13

EXPLODED VIEW .................................................................................. 14

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

- 3 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

SAFETY PRECAUTIONS

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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau­tions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo­sion hazard.

2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam­age caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharg­ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.

2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.

4. Use only an anti-static type solder removal device. Some sol­der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec­trically shorted together by conductive foam, aluminum foil or
comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate­rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir­cuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropri­ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo­nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close
as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remain­ing on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos­sible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when­ever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec­tions).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con­nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LB35B chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage

: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

ea ch dra wing and speci ficat ion by part number in
accordance with BOM.

(5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

* HDMI 1.4 with Deep Color is only apply for FHD Model

No. Item Specication Remarks

1. Market NON EU

2. Broadcasting system

PAL/SECAM B/G/D/K
PAL-I
NTSC-M

3. Channel Storage

BAND PAL(BG,I) NTSC(M) China(DK)

VHF/UHF 01-C69 2~78 C1~C69

Cable S1~S47 1~71 S1~S47

4. Receiving system Upper Heterodyne

5. Video Input PAL, SECAM, NTSC Rear (2EA)

6. Component Input Y/Cb/Cr, Y/Pb/Pr Rear (1EA)

7. USB Input MP3, JPEG,Movie Side(1EA)

8. AV Audio Output RF/AV/HDMI Audio Output Rear (1EA)

9. D-SUB INPUT S/W Upgrade Only Rear (1EA)

10. HDMI Input HDMI-DTV, Only PCM MODE Rear (2EA)

11. Audio Input (1EA) AV&Component L/R Input(2EA)

- 7 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

5. Component Video Input (Y, PB, PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4. 720*480 31.47 59.94 27.000 SDTV 480P

5. 720*480 31.50 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45.00 60.00 74.250 HDTV 720P

9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

11. 1920*1080 33.72 59.94 74.176 HDTV 1080I

12. 1920*1080 33.75 60.00 74.25 HDTV 1080I

13. 1920*1080 56.25 50 148.5 HDTV 1080P

14. 1920*1080 67.432 59.94 148.350 HDTV 1080P

15. 1920*1080 67.5 60.00 148.5 HDTV 1080P

6. HDMI Input

6.1. PC Mode

* Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable

* Monitor Range Limits
Min Vertical Freq - 58 Hz / Max Vertical Freq - 63 Hz
Min Horiz. Freq - 28 kHz / Max Horiz. Freq - 68 kHz
Pixel Clock - 150 MHz

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks

1. 640×480 31.469 59.94 25.17 VESA(VGA)

2. 800×600 37.879 60.317 40.00 VESA(SVGA)

3. 1024×768 48.363 60.004 65.00 VESA(XGA)

4. 1280×768 47.776 59.87 79.5 VESA(WXGA)

5. 1360×768 47.72 59.799 84.62 VESA(WXGA)

6 1366×768 47.7 60.00 84.62 WXGA

7. 1280×1024 63.595 60.00 108.875 SXGA

8. 1920×1080 66.647 59.988 138.625 WUXGA

- 8 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

Spec. out but display.2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4. 720*480 31.47 59.94 27 SDTV 480P

5. 720*480 31.5 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27 SDTV 576P

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45 60.00 74.25 HDTV 720P

9. 1280*720 37.5 50.00 74.25 HDTV 720P

10. 1920*1080 28.125 50.00 74.25 HDTV 1080I

11 1920*1080 33.72 59.94 74.176 HDTV 1080I

12 1920*1080 33.75 60.00 74.25 HDTV 1080I

13 1920*1080 56.25 50.00 148.5 HDTV 1080P

14 1920*1080 67.432 59.94 148.350 HDTV 1080P

15 1920*1080 67.5 60.00 148.5 HDTV 1080P

16 1920*1080 27 24.00 74.25 HDTV 1080P

17 1920*1080 33.75 30.00 74.25 HDTV 1080P

18 1920*1080 26.97 23.97 74.25 HDTV 1080P

19 1920*1080 33.716 29.976 74.25 HDTV 1080P

6.2. DTV Mode

- 9 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with
LB35B chassis.

2. Designation

(1) Because this is not a hot chassis, it is not necessary to

use an isolation transformer. However, the use of isolation

transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of

25 °C ± 5 °C of temperature and 65 % ± 10 % of relative

humidity if there is no specific designation.
(4) The input voltage of the receiver must keep 100-220 V,

50/60Hz.
(5)

The receiver must be operated for over 5 minutes prior to

the adjustment when module is in the circumstance of

above 15 °C.

► In case of keeping module is in the circumstance of 0

°C, it should be placed in the circumstance of above 15
°C for 2 hours.

► In case of keeping module is in the circumstance of

below -20 °C, it should be placed in the circumstance of
above 15 °C for 3 hours.

* Caution

When a still image is displayed for 20 minutes or longer
(especially where W/B scale is strong. Digital pattern 13ch
an d/ or Cr os s h at ch pa tt ern 0 9ch), there can s ome
afterimage in the black level area.

3. MAIN PCBA Adjustments

3.1. ADC Calibration

3.1.1. Using D/L Jig

- An ADC calibration is automatically adjusted from DFT-Jig

- If it needs to adjust manually, refer to appendix.

* ADC Calibration Protocol (RS232)

Adjust Sequence
▪ aa 00 00 [Enter Adjust Mode]
▪ xb 00 40 [Component1 Input (480i)]
▪ ad 00 10 [Adjust 480i Comp1]
▪ aa 00 90 End Adjust mode

3.2. EDID Download

▪ HD MODEL

▪ 8BIT FHD MODEL

a. White Balance Adjustment

NO Item CMD 1 CMD 2 Data 0

Enter Adjust
MODE

Adjust
‘Mode In’

A A 0 0

When transfer the ‘Mode In’,
Carry the command.

ADC adjust

ADC
Adjust

A D 1 0

Automatically adjustment
(The use of a internal pattern)

** HDMI 1 : 256Bytes

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 17 01 03 80 A0 5A 78 0A F3 30 A4 54 46 96 26
20 0F 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01

ⓐ

80 02 03 28 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 26 11 07 50 09 7F 07 83 01 00 00 68
A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20
B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0
C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14
D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D
E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

ⓐ

** HDMI 1 : 256Bytes

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 17 01 03 80 A0 5A 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 01 01 45 40 61 40 01 01 81 80
30 01 01 D1 C0 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 08 44 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 88 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01

ⓐ

80 02 03 28 F1 4F 90 07 01 16 02 03 11 12 13 04 14
90 05 20 22 1F 26 11 07 50 09 7F 07 83 01 00 00 68
A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20
B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0

C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14
D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D

E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

ⓐ

EDID C/S data

HD FHD (8Bit)

HDMI HDMI

Check sum

(Hex)

Block 0 A5 C1

Block 1

44(HDMI1) 44 (HDMI1)
34(HDMI2) 34 (HDMI2)

- 10 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

4. White Balance Adjustment

4.1. Overview

4.1.1. W/B adj. Objective & How-it-works

(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it

means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.

(3) Adj. condition: normal temperature

1) Surrounding Temperature: 25 °C ± 5 °C

2) Warm-up time: About 5 Min◦

3) Surrounding Humidity: 20% ~ 80%

4) Befor e White balance adjustment, Keep po wer on
status, don’t power off

4.1.2. Adj. condition and cautionary items

(1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux.
Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer(CA-210) probe should be

within 10 cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time

1) After Aging Start, Keep the Power ON status during 5
Minutes.

2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.

4.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)

(2) Adj. Computer (During auto adj., RS-232C protocol is

needed)
(3) Adjust Remocon
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
* Color Analyzer Matrix should be calibrated using CS-1000.

4.3. Equipment connection

4.4. Adjustment Command (Protocol)

(1) RS-232C Command used during auto-adj.

(2) Adjustment Map

4.5. Adjustment method

4.5.1. Auto WB calibration

(1) Set TV in ADJ mode using P-Only key(or POWER ON key).
(2) Place optical probe on the center of the display.

- It need to check probe condition of zero calibration before
adjustment.

(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message,

check adjustment status of pre-set mode. (Cool, Medium,
Warm)

(6) Remove probe and RS-232C cable.

▪ W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need.

4.5.2. LED White balance table

- G-gain should be fixed.

(1) Cool Mode

1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.

2) Pr inciple : To adjust the white ba lance without the
saturation, Fix the G gain to 172 (default data) and
change the others (R/B Gain ).

3) Adjustment mode : mode - Cool

(2) Medium / Warm Mode

1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.

2) Pr inciple : To adjust the white ba lance without the
saturation, Fix the one of R/G/B gain to 192 (default
data) and decrease the others.

3) Adjustment mode : Two modes - Medium / Warm

Co lor Anal yze r

Co mp ute r

Pattern Gen era to r

RS -232 C

RS- 232 C

RS- 232 C

Pro be

Sig nal Sou rce

* If TV internal pattern is used, not needed

RS-232C COMMAND

Explantion

CMD DATA ID

wb 00 00 Begin White Balance adjustment

wb 00 ff

End White Balance adjustment
(internal pattern disappears )

Adj. item

Command

(lower caseASCII)

Data Range

(Hex.)

Default

(Decimal)

CMD1 CMD2 MIN MAX

Cool

R Gain j g 00 C0
G Gain j h 00 C0
B Gain j i 00 C0
R Cut
G Cut
B Cut

Medium

R Gain j a 00 C0
G Gain j b 00 C0
B Gain j c 00 C0
R Cut
G Cut
B Cut

Warm

R Gain j d 00 C0
G Gain j e 00 C0
B Gain j f 00 C0
R Cut

G Cut

- 11 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

4.6. Reference(White Balance Adjustment
coordinate and color temperature)

(1) Luminance: 204 Gray, 80IRE
(2) Standard color coordinate and tempera tur e using

CS-1000 (over 26 inch)

■ Direct LED & 32” POLA W/B adjust target value

■ 42” POLA LED W/B adjust target value (42LS3450 series)

5. Tool Option setting & Inspection per

countries

(1) Press 'IN START' key at Factory Service remote control.
(2) Select 'Tool Option 1'.
(3) Punch in the number and press 'OK'. (Each of models has

their number)
(4) Correct 'Tool Option2' ~ 'Tool Option5'.
(5) Completed adjusting Tool option.

6. AUDIO output check

6.1. Audio input condition

(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)

6.2. Specification

7. GND and HI-POT Test

7.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

7.2. GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next

process automatically.

7.3. Checkpoint

(1) Test voltage

- GND: 1.5 KV / min at 100 mA

- SIGNAL: 3 KV / min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT

- GND Test = POWER CORD GND and SIGNAL CABLE

GND.

- Hi-pot Tes t = POWER CORD GND a nd LIVE &

NEUTRAL.

(4) LEAKAGE CURRENT: At 0.5 mArms

Target
(Direct

LED)

Cool Medium Warm

x y x y x y

271 276 287 296 315 332

Target
(Direct

LED)

Cool Medium Warm

x y x y x y

274 280 290 300 318 336

Mode Color Temp Color coordinate Remark

Cool

(C50)

13,000 K

x = 0.269 (±0.002)
y = 0.273 (±0.002)

* Test signal

- Inner pattern for
W/B adjust

- External white
pattern

(80IRE, 204gray)

Medium

(0)

9,300 K

x = 0.285 (±0.002)
y = 0.293 (±0.002)

Warm
(W50)

6,500 K

x = 0.313 (±0.002)
y = 0.329 (±0.002)

Item Min Typ Max Unit Remark

Audio practical
max Output, L/R
(Distortion=10%
max Output)

4.5 5.0 6.0

W

Vrms

(1) Measurement condition

- EQ/AVL/Clear Voice: Off
(2) Speaker (8Ω Impedance)

- 12 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

8. USB S/W Download

(optional, Service only)

(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.

- If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work.

Otherwise USB data is automatically detected.
(3) Show the message “Copying files from memory”.

(4) Updating is starting.

(5) Updating Completed, The TV will restart automatically.
(6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If downloading version is more high than your TV have,

TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn't
have a DTV/ATV test on production line.

* After downloading, have to adjust TOOL OPTION again.

1) Push "IN-START" key in service remote control.

2) Select "Tool Option 1" and push "OK" key.

3) Punch in the number. (Each model has their number.)

9. Optional adjustments

9.1. Manual ADC Calibration

■ Enter ‘EZ ADJUST’ mode by pressing ‘ADJ’ key.

■ Enter Internal ADC calibration mode by pressing ‘’ or ‘OK’
key at ‘7. ADC Calibration’

► Caution : Using ‘P-ONLY’ key of th e Facto ry Service

remote control when turns TV on.

9.2. Manual White balance Adjustment

9.2.1. Adjustment condition and cautionary items

(1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark
surrounding.

(2) Probe location: Color Analyzer (CA-210) probe should be

within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time

1) After Aging Start, Keep the Power ON status during 5
Minutes.

2) In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.

9.2.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)
(2) Adj. Computer(During auto adj., RS-232C protocol is needed)
(3) Adjust Remot control
(4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model: 217, Pattern: 78)

9.2.3. Adjustment

(1) Set TV in Adj. mode using POWER ON.
(2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface.
(3) Press ADJ key → EZ adjust using adj. R/C → 6. White-

Balance then press the cursor to the right (Key►). When

Key(►) is pressed 216 Gray interna l pattern will be

displayed.
(4) One of R Gain / G Gain / B Gain should be fixed at 192,

and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of

color temperature.

■ If internal pattern is not available, use RF input. In EZ Adj.

menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration ►

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L

13. Sub B/C

14. Ext. Input Adjust

ADC Calibration

ADC Comp 480i

ADC Comp 1080p

ADC RGB

Start

NG

NG

NG

Reset

- 13 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

POWER BOARD

Sound AMP

NTP7513

IC301

(

(

(

(

Module

JK101

Y,Pb,Pr In

Audio

Out

MST6841XP

5

9

4

3

10

11

Tuner SDA

Tuner SCL

TUNER

IF_AGC

B+

IR/KEY

40

24Mhz

98

99

44

43

IC502

Serial Flash

8Mbytes

IC503

EEPROM

24C64

IC501

30

LPF

33

18

21

P301

AV2 In

OP-AMP

IC302

x4 Gain

P701

P601/602

Audio L-Out

2 4 1

XXX

39

37 38

Audio R-Out

HDMI

SCL/SDA

48

115

50

51 113 112

Audio_SCL

Audio_SDA

LVDS

Output

P Dim

Inv. ON

RL On

P_ST 3.5V

M_3.3V

TU_3.3V

P_24V

IC701

MP20051

Main_1.2V

A_OUT_12V

10 11

789

38

I2S_MCLK

I2S_WS

I2S_SCK

I2S_SDO

P400

108

111

117

IR

KEY1

Led_PWR

102 105 101

53

52

45

85

84

EEP SDA

EEP SCL

94

95

97

96

SPI_CLK

SPI_DI

SPI_CZ

SPI_DO

S_AMP_24V

32

40

9

LPF

JK202

USB_5V

110

KEY2

ST_3.5V

5

P_12V

Q710

IC711

1.8V REG

Main_1.8V

Main_3.3V

Q720

AO3407A

Panel_Vcc

IC709

MP1497

Main_5V

To USB

USB_DN

USB_DP

IF_P

IF_N

31

35

10

13~1 5

3

JK203

JK204

IC401

To USB

7

TU_1.8V

19

20

Comp. R/L In

AV1 In

26,33,34 27,35,3622,20,24,33,34

77

62

54

41

30

18

9

116

107

100

XXX

IR Board

BLOCK DIAGRAM

- 14 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

A2

A9

A10

900

200

400

540

521

530

500

301

910

120

300

510

123

122

Set + Stand

Stand Base+Stand Body

LV1

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

INPUT1

MNTROUT

MNTLOUT

COMMONRIN

COMMONLIN

AV2RIN

AV2LIN

AV2_VIN

COMP_PR

COMP_PB

COMMON_VIN

R105
10K

C103
5600pF
50V

R109
12K

TP101

R107
220K

COMMON_RIN

MUTE_AOUT

R106

12K

MUTE_AOUT

R103

75

R108
10K

R104
220K

COMP_PR

MNT_ROUT

C105
5600pF
50V

MNT_LOUT

R110

1K

COMMON_LIN

R101

75

COMP_PB

COMMON_VIN

P_12V

MNT_VOUT

R102
75

R111

1K

R123

220

DEBUG

R120
75

DEBUG

AV2_RIN

R116
220K

R114
10K

R117
10K

R118
12K

R113
220K

R115

12K

AV2_LIN

AV2_VIN

R112
75

C106

10uF
16V

C104

10uF
16V

Q101

MMBT3904(NXP)

E

B

C

Q102

MMBT3904(NXP)

READY

E

B

C

Q103

MMBT3904(NXP)

E

B

C

Q104

MMBT3904(NXP)

READY

E

B

C

Q105

MMBT3904(NXP)

DEBUG

E

B

C

AV2_VIN

R122

0

OPT

R121

33

DEBUG

C101
470pF
50V

C102
470pF
50V

C107
470pF
50V

C108
470pF
50V

JK101

PPJ239-06

6J

7J

4J

8K

5K

8L

5L

5M

4N

6N

7N

7D

5D

8E

5E

8F

6F

4F

5G

4H

6H

7H

ZD110

20V

ZD107
20V

ZD109

20V

ZD105
20V

ZD104

20V

ZD106

20V

ZD108
SD05

ZD100
SD05

ZD102

SD05

ZD101
SD05

D102
READY

D101

READY

D104
READY

D103

READY

D105

READY

D106

READY

D107

READY

D108

READY

1 7

INPUT1

COMPONENT / AV IN / AV AUDIO OUT

2012/11/15

32LN5100

LB35B/LC35B/LL35B

EAX65027101

POP NOISE

POP NOISE

V-OUT Buffer(DEBUG)

Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

USB D OWN STREA M

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

INPUT2

JK202

3AU04S-305-ZC-(LG)

1234

5

+5V_USB

ZD221
30V

READY
ZD220
30V

READY

USB_DP

USB_DN

C220
10uF
10V

OPT

C221
22uF
10V

L220

120

R204

0

W/O UART IC

C203

0.1uF

With UART IC

IC201

MAX3232CDR

EAN41348201

With UART IC

3

C1-

2

V+

4

C2+

1

C1+

6

V-

5

C2-

7

DOUT2

8

RIN2

9

ROUT2

10

DIN2

11

DIN1

12

ROUT1

13

RIN1

14

DOUT1

15

GND

16

VCC

R205

0

W/O UART IC

R206

0

W/O UART IC

JK201

KJA-PH-1-0177

3 M3_DETECT

4 M4

5 M5_GND

1 M1

6 M6

C205

0.1uF

With UART IC

+3.5V_ST

C202

0.1uF

With UART IC

R202
100

With UART IC

+3.5V_ST

DSUB_SCL

C201

0.1uF

P201

12505WS-04A00

DEBUG

1

2

3

4

5

P202

12507WS-04L

1

VCC

2

PM_RXD

3

GND

4

RM_TXD

5

GND

DSUB_SDA

R201
100

With UART IC

C204

0.1uF

With UART IC

HDMI1_D0-

JK203

14

NC

13

CEC

5

DATA1_SHIELD

20

SHIELD

12

CLK-

11

CLK_SHIELD

2

DATA2_SHIELD

19

HPD

18

+5V_POWER

10

CLK+

4

DATA1+

1

DATA2+

17

DDC/CEC_GND

9

DATA0-

8

DATA0_SHIELD

3

DATA2-

16

SDA

7

DATA0+

6

DATA1-

15

SCL

HDMI1_SCL

HDMI1_DET

Q230

MMBT3904(NXP)

E

B

C

R230
10K

D230

BAT54C

A2CA1

HDMI1_CK+

R233

2.7K

+5V_USB

R232

2.7K

HDMI1_D1-

R235
10K

R234

4.7K

HDMI1_D2+

HDMI1_D0+

HDMI1_CK-

HDMI1_SDA

HDMI1_D2-

HDMI1_HPD

R231
1K

HDMI1_D1+

D240

BAT54C

A2CA1

HDMI2_CK+

HDMI2_HPD

HDMI2_SCL

+5V_USB

HDMI2_D1-

HDMI2_CK-

Q240

MMBT3904(NXP)

E

B

C

R242
1K

R241
10K

HDMI2_D0-

HDMI2_D2-

HDMI2_D1+

R246
10K

JK204

14

NC

13

CEC

5

DATA1_SHIELD

20

SHIELD

12

CLK-

11

CLK_SHIELD

2

DATA2_SHIELD

19

HPD

18

+5V_POWER

10

CLK+

4

DATA1+

1

DATA2+

17

DDC/CEC_GND

9

DATA0-

8

DATA0_SHIELD

3

DATA2-

16

SDA

7

DATA0+

6

DATA1-

15

SCL

HDMI2_SDA

R245

4.7K

HDMI2_DET

R243

2.7K

R244

2.7K

HDMI2_D2+

HDMI2_D0+

ZD230

READY

ZD231

READY

ZD232

READY

ZD233

READY

R236
100
R237
100

ZD240

READY

ZD241

READY

ZD242

READY

ZD243

READY

R247
100
R248
100

2 7

INPUT2

2012/11/1532LN5100

LB35B/LC35B/LL35B

EAX65027101

Close to SIDE_USB

USB(SIDE)

I2C Control

HDMI(REAR)

Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

THERMAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

AUDIO

R357

6.8K

MNT_ROUT

Q351
MMBT3904(NXP)

E

B

C

R353

6.8K

R358

1K

C356
6800pF
50V

P_12V

MNT_R_AMP

MNT_L_AMP

R356

10K

C352 33pF50V

IC302

AS324MTR-E1

3 INPUT1+

2 INPUT1-

4 VCC

1 OUT1

6 INPUT2-

5 INPUT2+

7 OUT2 8OUT3

9INPUT3-

10INPUT3+

11GND

12INPUT4+

13INPUT4-

14OUT4

R354 5.6K

Q350
MMBT3904(NXP)

E

B

C

P_12V

C351
6800pF
50V

R359

4.7K

P_12V

R350

4.7K

C350

0.1uF
16V

C354

33pF

50V

MNT_LOUT

C355

0.1uF
16V

R352

10K

R355

5.6K

SPK_L+

SPK_R-

JP302

JP301

SPK_L-

JP304

SPK_R+

P301

SMAW250-H04R

1
.

2

3

4

JP303

SPK_R+

SPK_L-

C329

0.47uF
50V

R324

4.7K

R323

4.7K

0.1uF

C334

50V

0.1uF

C331

50V

R322

4.7K

C333

0.47uF
50V

SPK_R-

R325

4.7K

0.1uF

C330

50V

SPK_L+

0.1uF

C335
50V

R351 1K

C353

0.1uF
16V

R316

12

C306
33pF
50V

R307 100

C319

22000pF

50V

I2S_SCK

C315
22000pF

50V

C326
390pF
50V

R317

12

R314

12

R315

12

C312
1uF
10V

C302

0.1uF
16V

OPT

1uF

C303
10V

SW_RESET

AUAMP_SDA

0.1uF

C309
50V

C313
1uF
10V

0.1uF

C318

50V

+24V_AMP

C327
390pF

50V

I2S_WS

R306 100

C325
390pF

50V

C305
33pF
50V

R320

12

C301

0.1uF
16V

R318

12

C311
22000pF
50V

R311

100

C314
1uF
10V

C308

22000pF

50V

R319

12

+24V_AMP

I2S_SDO

C328
390pF

50V

R313

12

I2S_MCLK

AUAMP_SCL

C320

1000pF

50V

R308

4.7K

R309

4.7K

+3.3V_M

0.1uF

C322

16V

R301 100

R302 100

R303 100

L301

BLM18PG121SN1D

+3.3V_M

R304 100

C321
10uF

6.3V

L304
10uH

L305
10uH

L303
10uH

L306
10uH

POWER_DET

IC301

NTP7513

3

DGND_PLL

2

VDD_PLL

4

GND

1

AGND_PLL

6

DVDD

5

DGND

7

SDATA

8

WCK

9

BCK

10

SDA

11

SCL

12

FAULT

13

MONITOR_014MONITOR_115MONITOR_2

16

BST2B

17

PGND2B

18

OUT2B

19

PVDD2B20PVDD2A

21

OUT2A

22

PGND2A

23

BST2A

24

VDR2

25

AGND

26

VCC5

27

VDR1

28

BST1B

29

PGND1B

30

OUT1B

31

PVDD1B

32

PVDD1A

33

OUT1A34PGND1A

35

BST1A36RESET37AD38CLK_I39GND_IO

40

VDD_IO

41

[EP]GND

C317
10uF
35V

C310
10uF
35V

AUDIO

3 7

LB35B/LC35B/LL35B

32LN5100

2012/11/15

EAX65027101

AUDIO_OUT AMP : GAIN X 4

SPK_R+

SPK_L-

SPK_L+

SPK_R-

SPEAKER_R

SPEAKER_L

0x54

Copyright © 2013 LG Electronics. Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TUNER & IR

IF_N

C402
47pF
50V

C403
47pF
50V

IF_P

R403
100

C401

0.1uF
16V

TUNER_RESET

R404
100K

+3.3V_TU

C410

0.1uF
16V

IF_AGC

R412
100

R410

1

1/10W

+3.3V_M

R409

1

1/10W

IC401

AP1117E18G-13

2

OUT

3

IN

1

ADJ/GND

C409
100pF

50V

C408

0.1uF
16V

C405

0.1uF
16V

C411

0.1uF
16V

+3.3V_TU

+3.3V_TU

L421

BLM18PG121SN1D

IR

+3.5V_ST

C423

0.1uF
16V

KEY1

KEY2

C425

0.1uF
16V

OPT

C422

0.1uF

OPT

C421

0.1uF

OPT

C426

100pF

50V

+3.5V_ST

C424
1000pF
50V

LED

C407
10uF

6.3V

C404
22uF

6.3V

100pF

C406
50V

R423

4.7K
OPT

TUNER_SCL

TUNER_SDA

L401

BLM18PG121SN1D

R421

10K

R422

10K

R407

2.2K

R408

2.2K

R405

33

R406

33

C412
10uF

6.3V

P421

12507WR-08L

1

2

3

4

5

6

7

8

9

R411

1

R413

10

PAL

R414

10

PAL

R413-*1
0

NTSC

R414-*1
0

NTSC

TU401
TDSH-G501D(B)

PAL

5

+B1[3.3V]

11

DIF[N]

2

RESET

10

DIF[P]

4

SDA

1

NC

9

IF_AGC

8

CVBS

3

SCL

7

+B2[1.8V]

6

SIF

A1

A1

B1

B1

A2

A2

B2

B2

TU402
TDSS-H501F(B)

NTSC

5

+B1[3.3V]

11

DIF[N]

2

RESET

10

DIF[P]

4

SDA

1

NC_1

9

IF_AGC

8

NC_3

3

SCL

7

+B2[1.8]

6

NC_2

12

SHIELD

A1

A1

B1

X

ZD401
SD05

ZD402

SD05

C430

0.1uF
250V

READY

C431

0.1uF
250V

READY

R401

0

NTSC

TUNER & IR

4 8

LB35B/LC35B/LL35B

32LN5100

2012/11/15

EAX65027101

Near the pin

IR

IF

should be guarded by ground

Size change,0929

Close to the tuner

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