LG 37LP1R-ME Service Manual

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : ML-051A

MODEL : 37LP1R-ME

website:http://biz.LGservice.com

e-mail:http://www.LGEservice.com/techsup.html

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CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION........................................................................................6

ADJUSTMENT INSTRUCTION................................................................11

TROUBLE SHOOTING............................................................................15

BLOCK DIAGRAM...................................................................................18

WIRING DIAGRAM..................................................................................19

EXPLODED VIEW .................................................................................. 20

EXPLODED VIEW PARTS LIST..............................................................21

REPLACEMENT PARTS LIST ............................................................... 22

SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

0.15uF

To Instrument's exposed METALLIC PARTS

AC Volt-meter

Good Earth Ground such as WATER PIPE, CONDUIT etc.

1.5 Kohm/10W

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500

F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500

F to 600 F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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1. Application range

This specification is applied to ML-051A chassis.

2. Requirement for Test

Testing for standard of each part must be followed in below condition.

(1) Temperature: 25°C ± 2°C (2) Humidity: 65% ± 10% (3) Power: Standard input voltage (AC 100-240V, 50/60Hz) (4) Measurement must be performed after heat-run more than

30min.

(5) Adjusting standard for this chassis is followed a special

standard.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

3.General Specification(TV)

No Item Specification Remark

1. Video input applicable system PAL-D/K, B/G, I, NTSC-M, SECAM NTSC 4.43

2. Receivable Broadcasting System 1) PAL/SECAM BG (ZE/TE)

2) PAL/SECAM DK EU/Non-EU

3) PAL I/I (PAL Market)

4) SECAM L/L'

5) NTSC M

6) PAL-N/M 6),7) South America Market

7) NTSC M

7) Except South America NTSC Market (ME)

3. RF Input Channel VHF : E2 ~ E12 PAL UHF : E21 ~ E69 CATV : S1 ~ S20 HYPER : S21~ S47 L/L' : B, C, D FRANCE VHF : 2~13 NTSC UHF : 14~69 CATV : 1~125 VHF Low : 1 ~ M10 JAPAN VHF High : 4~S22 UHF : S23~62

4. Input Voltage AC 100 ~ 240 V/50Hz, 60Hz

5. Market Worldwide

6. Picture Size 800.4mm 37 inch

7. Tuning System FVS 100 program PAL,200 PR.(Option) FS NTSC

8. Operating Environment 1) Temp : 0 ~ 40 deg

2) Humidity : 10~85 %

9. Storage Environment 3) Temp : -20 ~ 60 deg

4) Humidity : 10~85 %

10. Display LCD Module LPL

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4. General Specification

No Item Specification Unit Remark

1 Panel 32" TFT WXGA LCD 2 Frequency range H : 31 ~ 61Khz PC Input

V : 56 ~ 75Hz

3 Control Function 1) Contrast/Brightness

2) H-Position / V-Position

3) Tracking : Clock / Phase

4) Auto Configure

5) Reset

4 Component Jack 1 : Y Middle east

3 : Pb / NTSC Area 5 : Pr 7 : Line1 Ready 9 : LINE2 11: LINE3

13: Line3 Ready D4 Jack 2 : Y GND JAPAN Only (525i,525p,750p,1125i) 4 : Pb GND

6 : Pr GND

8 : LINE1

10:Line2 Ready

12:SWITCH GND

14: SWITCH

5 H/V-Sync Video Power consumption LED

Power ON ON/ON Active

≤

max 190W W Green

Stand by OFF/ON OFF

≤

3.0W W Red

DPMS Mode ON/OFF OFF

≤

typ. 30W W Green

Power off - - - W *

6 LCD Module Type Size LPL 877.0 x 516.8 x 55.5 mm (H) x (V) x (D)

Pixel Pitch LPL 0.200 x 0.600 x RGB

Pixel Format 1366 horiz. By 768 vert. Pixels

RGB strip arrangement

Coating Hard coating(3H), Anti-glare

treatment of the front polarizer,

Back Light LPL 16CCFL

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5.Optical Feature(LCD Module)

Item RemarkSpecification

Viewing Angle <CR

10>

Luminance

Contrast Ratio CIE Color Coordinates

Typical MAX/MIN ALL white/All back LPL

R/L, U/D

Luminance(cd/

)

Variation

Typ

176, 176

500

600

0.285

0.293

0.640

0.341

0.287

0.610

0.146

0.069

WHITE

RED

GREEN

BLUE

Typ. Typ. Typ. Typ. Typ. Typ. Typ. Typ.

No.

3 4

6.Component Video Input (Y, PB, PR)

Specification

Proposed

Resolution H-freq(kHz) V-freq(Hz)

1. 640x480 15.73 60 SDTV, DVD 480i ZE, TE, ME

2. 640x480 15.63 59.94 SDTV, DVD 480i ZE, TE, ME

3. 704x480 31.47 59.94 EDTV 480p TE, ME

4. 720x576 15.625 50.00 SDTV, DVD 625 Line ZE, TE, ME

5. 720x576 31.25 50.00 HDTV 576p TE, ME

6. 1280x720 45.00 60.00 HDTV 720p TE, ME

7. 1280x720 44.96 59.94 HDTV 720p TE, ME

8. 1920x1080 31.25 50.00

HDTV 1080i 50Hz (AU Ver.)

TE, ME

9. 1920x1080 33.75 60.00

HDTV 1080i 60Hz (ATSC)

TE, ME

10. 1920x1080 33.72 59.94 HDTV 1080i 59.94Hz TE, ME

7. PC INPUT Mode Table

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

Analog RGB, Digital RGB 1 720x400 31.468 70.8 28.321 2 640x480 31.469 59.94 25.17 VESA

37.684 75.00 31.5 VESA

3 800x600 37.879 60.31 40.00 VESA

46.875 75 49.5 VESA 4 832x624 49.725 74.55 57.283 5 1024x768 48.363 60.00 65.00 VESA(XGA)

56.47 70.00 75.00 VESA(XGA)

60.123 75.029 78.75 VESA(XGA) 6 1280x768 47.776 59.870 79.50 VESA(WXGA) 7 1360x768 47.720 59.799 84.75 VESA(WXGA) 8 1366x768 47.720 59.799 84.75 Supported 9 1920x1080 33.75 60.00 86.375 HDCP DVI Digital 1080i

10 1280x720 45.00 60.00 74.375 HDCP DVI Digital 720p

Min

400

Typ.

-0.03

Max

Typ.

+0.03

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8. HDMI INPUT Mode Table

9. Mechanical specification

<Table 1> Scart Arrangement 1.(Full Scart)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

Analog RGB, Digital RGB 1 720x400 31.468 70.8 28.321 2 640x480 31.469 59.94 25.17 VESA

37.684 75.00 31.5 VESA

3 800x600 37.879 60.31 40.00 VESA

46.875 75 49.5 VESA 4 832x624 49.725 74.55 57.283 5 1024x768 48.363 60.00 65.00 VESA(XGA)

56.47 70.00 75.00 VESA(XGA)

10 1280x720 45.00 60.00 74.375 HDCP DVI Digital 720p

Pin Signal Signal Level Impedance

1 Audio Output B (right) 0.5 Vrms < 1 2 Audio Input B (right) 0.5 Vrms > 10 3 Audio Output A (left) 0.5 Vrms < 1 4 Ground (audio) - 5 Ground (blue) - 6 Audio input A (left) 0.5 Vrms > 10 7 Blue input 0.7 V 75 8 Function Select (AV control) High (9.5 - 12V) - AV Mode

Mid (5 - 8V) - Wide Screen Low (0 - 2V) - TV Mode > 10

9 Ground (Green) - 10 Comms Data 2 11 Green input 0.7 V 75 12 Comms Data 1 13 Ground (Red) - 14 Ground (Blanking) - 15 Red input 0.7 V 75 16 RGB Switching Control High (1 - 3V) - RGB

Low (0 - 0.4V) - Composite 75 17 Ground (Video input & Output) - 18 Ground (RGB Switching Control) - 19 Video output (Composite) 1V including sync 75 20 Video input (Composite) 1V including sync 75 21 Common ground (Shield) - -

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<Table 2> Scart Arrangement 2.(Half Scart)

Pin Signal Signal Level Impedance

1 Audio Output B (right) 0.5 Vrms < 1 2 Audio Input B (right) 0.5 Vrms > 10 3 Audio Output A (left) 0.5 Vrms < 1 4 Ground (audio) - 5 Ground (blue) - 6 Audio input A (left) 0.5 Vrms > 10 7- - 8 Function Select (AV control) High (9.5 - 12V) - AV Mode

Mid (5 - 8V) - Wide Screen

Low (0 - 2V) - TV Mode > 10

9 Ground (Green) - 10 Comms Data 2 11 - - 12 Comms Data 1 13 Ground (Red) - 14 Ground (Blanking) - 15 Red input 16 - - 17 Ground (Video input & Output) - 18 - - 19 Video output (Composite) 1V including sync 75 20 Video input (Composite) 1V including sync 75 21 Common ground (Shield) - -

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ADJUSTMENT INSTRUCTION

1. Application Range

This spec. sheet is applied to all of the ML-051A chassis (TORNADO) manufactured at LG TV Plant

2. Specification.

2.1 Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help to protect test instruments.

2.2 Adjustment must be done in the correct sequence.

2.3 The adjustment must be performed at 25±5°C temperature and 65±10% relative humidity if there is no specified designation.

2.4 The input voltage of the receiver must be kept between 100~220V, 50/60Hz.

2.5 Before adjustment, execute Heat-Run for 30 minutes

at RF no signal.

3. EDID

* Caution

- Use the proper signal cable for EDID Download Analog EDID: Pin3 exists Digital EDID: Pin3 exists

Caution: - Never connect HDMI & DVI-D & DVI-A Cable

at the same time.

- Use the proper cables below for EDID Writing

3.1 Data

3.1.1 ANALOG(128Bytes)

3.2.2 DIGITAL(128Bytes)

3.2.3 EDID FOR HDMI(256Bytes)

3.2.4 Detail EDID Options are below(a, b, c, d, e) a. Product ID

b. Serial No : Controlled on production line c. Month, Year : Controlled on production line d. Model Name(Hex) :

e. Checksum: ChangeSable by total EDID data

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 00 00 FF FF FF FF FF FF 00 1E 6D 10 01 03 80 46 27 78 EA D9 B0 A3 57 49 9C 25 20 11 49 4B A5 6E 80 31 40 01 01 01 01 45 40 01 01 30 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88 40 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30 50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00 33 60 0A 20 20 20 00 00 00 FD 70 00 38 4B 1F 3D 09 00 0A 20 20 20 20 20 20 00

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 00 02 03 21 1C 46 85 04 02 01 03 00 23 09 07 07 23 10 09 07 07 23 09 07 07 83 01 00 00 65 03 0C 00 10 20 00 01 1D 00 80 51 D0 1C 20 40 80 35 00 BC 88 21 30 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 13 40 8E 21 00 00 18 2A 12 00 10 41 43 17 20 28 60 35 50 00 00 00 32 00 00 1C 00 00 00 00 00 00 00 00 00 60 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 70 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 1E

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 00 00 FF FF FF FF FF FF 00 1E 6D 10 01 03 01 46 27 78 EA D9 B0 A3 57 49 9C 25 20 11 49 4B A5 6E 80 31 40 01 01 01 01 45 40 01 01 30 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88 40 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30 50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FD 00 38 60 4B 1F 3D 09 00 0A 20 20 20 20 20 20 00 00 00 FC 70 0A 20 20 20 00

No Item Content Hexadecimal

1 Manufacturer ID GSM 1E6D 2 Version Digital 1 01 3 Revision Digital 3 03

a b

Model name Product ID

Product ID

Dec Hex

EDID Table

26LX2R

22039(A) 22039(A) 5617 1756 22040(A) 22040(D) 5618 1856

32LX2R

30041(A) 30041(A) 7559 5975 30042(D) 30042(D) 755A 5A75

32LP1R

30039(A) 30039(A) 7557 5775 30040(D) 30040(D) 7558 5875

37LP1R

30043(A) 30043(A) 755B 5B75 30044(D) 30044(D) 755C 5C75

42LP1R

40013(A) 40013(A) 9C4D 4D9C 40014(D) 40014(D) 9C4E 4E9C

Model Name Model Name(HEX)

26LX2R-ZE 32364C5832522D5A45 32LX2R-ZE 33324C5832522D5A45 32LP1R-ZE 33324C5031522D5A45 37LP1R-ZE 33374C5031522D5A45 42LP1R-ZE 34324C5031522D5A45

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4. ADC Calibration

4.1 Adjustment of RF/AV/SAV * Test Equipment

- Remote controller for adjustment

- MSPG-925F Pattern Generator->Model: 202 / Pattern: 32

4.1.1 Method of Auto RF/AV/S-VIDEO Color Balance.

1) Input the Video Signal: 75% Color Bar signal into AV3 (ZE), AV1(TE), VIDEO1(ME)

2) Set the PSM to Standard mode in the Picture menu.

3) Press ADJ key on R/C for adjustment.

4) Press the

(Vol. +) key to operate the set, then it

becomes automatically.

5) Auto-RGB OK means the adjustment is completed.

4.2 Adjustment of Component. * Required Equipments

- Remote controller for adjustment

- MSPG-925F Pattern Generator->Model: 215 / Pattern: 33

4.2.1Method of Auto Component Color Balance

1) Input the Component 720p 100% Color Bar(MSPG925F model:215, pattern:33) signal into Component.

(ZE : component , TE/ME : component 1 or 2)

2) Set the PSM to Standard mode in the Picture menu.

3) Press the ADJ key on R/C for adjustment.

4) Press the

(Vol. +) key to operate the set , then it

becomes automatically.

5) Auto-RGB OK means the adjustment is completed.

4.3 Adjustment of RGB * Required Equipments

- Remote controller for adjustment

- MSPG-925F Pattern Generator

4.3.1Method of Auto RGB Color Balance

1) Input the PC 1024x768@60Hz 1/2 Black & White Pattern(MSPG-925F model:37, pattern:18) into RGB. (using D-sub to DVI-I cable)

2) Set the PSM to Standard mode in Picture menu.

3) Press the ADJ key on R/C for adjustment.

4) Press the

(Vol. +) key operate To set , then it

becomes automatically.

5) Auto-RGB OK means adjustment is completed.

5. white Balance

5.1 Manual white Balance (AV)

1) Execute CA-110 Zero Calibration.

2) Execute the SET Heat Run for 30minutes

3) Push the ADJ Button then you can see the OSD

4) Push the ADJ Button again for White Balance mode

5) Adjust High light with R/B Gain/Offset(G Gain fix, G Offset fix)

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