LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Application range
This spec sheet is applied all of the 32”,37”, 42”, 47” LCD TV
with LA01B chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25±5ºC, (77°±9ºF), CST: 40±5°C
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
ModelMarketAppliance
19LD350-UB North America Safety : UL1492, CSA C22.2.No.1,
22LD350-UB EMC : FCC Class B, IEC Class B
26LD350-UB
32LD350-UB
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 10 -
ADJUSTMENT INSTRUCTION
1. Application range
This spec. sheet applies to LA01B Chassis applied LCD TV all
models manufactured in TV factory
2. Specification
2.1 Because this is not a hot chassis, it is not necessary
to use an isolation transformer. However, the use of
isolation transformer will help protect test instrument.
2.2 AdjThe adjustment must be performed in the
circumstance of 25 ±5 C of temperature and
65±10% of relative humidity if there is no specific
designation.
2.4 The input voltage of the receiver must keep
100~240V, 50/60Hz.
2.5 The receiver must be operated for about 5 minutes
prior to the adjustment when module is in the
circumstance of over 15
In case of keeping module is in the circumstance of
0°C, it should be placed in the circumstance of above
15°C for 2 hours
In case of keeping module is in the circumstance of
below -20°C, it should be placed in the circumstance of
above 15°C for 3 hours,.
Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
3. Adjustment items
3.1 Board Level Adjustment
•Adjust 480i Comp1(ADC)
•EDID/DDC download
Above adjustment items can be also performed in Final
Assembly if needed. Both Board-level and Final assembly
adjustment items can be check using In-Star Menu 1.ADJUST
CHECK. Component 1080p and RGB-PC Adjust will be
calculated by 480i adjust value.
3.2 Final assembly adjustment
•White Balance adjustment
•RS-232C functionality check
•Factory Option setting per destination
•Ship-out mode setting (In-Stop)
3.3 Etc
•Ship-out mode
•Service Option Default
•USB Download(S/W Update, Option, Service only)
•ISP Download (Optional)
4. Automatic Adjustment
4.1. ADC Adjustment
(1) Overview
ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate
RGB deviation.
1) Check connected condition of Comp1 cable to the
equipment
2) Give a 480i Mode, Horizontal 100% Color Bar Pattern
to Comp1.
(MSPG-925FA -> Model: 209, Pattern: 65)
3) Change input mode as Component1 and picture mode
as “Standard”
4) Press the In-start Key on the ADJ remote after at least
1 min of signal reception. Then, select 5.ADC
Calibration. And Press OK Button on the menu “Start”.
The adjustment will start automatically.
5) If ADC Comp 480i is successful, “ADC Component
Success” is displayed and Comp480i/1080p is
completed.
If ADC calibration is failure, “ADC Component Fail” is
displayed.
6) If ADC calibration is failure, after rechecking ADC
pattern or condition, retry calibration
7) After completing ADC Component, input mode will be
changed to RGB automatically.
8) If ADC calibration is successful, “ADC RGB Success”
is displayed. If ADC calibration is failure, “ADC RGB
Fail” is displayed.
9) If ADC calibration is failure, after recheck ADC pattern
or condition, retry calibration
5.2 EDID/DDC Download
(1) Overview
It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
(2) Equipment
• Adjust remocon.
• Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
(3) Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If
Download is failure, NG is displayed.
5) If Download is failure, Re-try downloads.
•Caution) When EDID Download, must remove RGB/HDMI
Cable.
(4) EDID DATA
1)LD450 Tool(FHD)
• HDMI I EDID Table
EDID Block 0 table =
- 12 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
• HDMI II EDID Table
• Analog RGB EDID Table
5.3. White Balance Adjustment
(1) Overview
• W/B adj. Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic
Range. In order to prevent saturation of
Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is
lowered to find the desired value.
- Adj. condition : normal temperature
1) Surrounding Temperature: 25±5ºC
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
(2) Equipment
1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model:217, Pattern:78)
-> Only when internal pattern is not available
• Color Analyzer Matrix should be calibrated using CS-1000
(3) Equipment connection MAP
(4) Adj. Command (Protocol)
1) RS-232C Command used during auto-adj.
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.
wb 00 ff -> End white balance auto adj.
Colo r Analyzer
Comp ut er
Pattern Ge n e r ator
RS-232C
RS-232C
RS-232C
Probe
Signal Source
* If TV internal pattern is used, not needed
Connection Diagram of Automatic Adjustment
RS-232C COMMAND
Meaning
[CMDIDDATA]
wb0000Begin White Balance adj.
wb00ffEnd White Balance adj.(Internal pattern disappeared)
- 13 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
2) Adjustment Map
Applied Model : 32LD450-UA, 37LD450-UA, 42LD450-UA,
47LD450-UA
(5) Adj. method
• Auto adj. method
1) Set TV in adj. mode using POWER ON key
2) Zero calibrate probe then place it on the center of the
Display
3) Connect Cable(RS-232C)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sing), check adj. status pre
mode (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
* W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if
need
• Manual adj. method
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place
it on the center of LCD module within 10cm of the
surface..
3) Press ADJ key -> EZ adjust using adj. R/C > 6. WhiteBalance then press the cursor to the right (KEY
G ).
(When KEY(
G ) is pressed 216 Gray internal pattern
will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at
192, and the rest will be lowered to meet the desired
value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes
of color temperature.
- If internal pattern is not available, use RF input. In EZ
Adj. menu 6.White Balance, you can select one of 2
Test-pattern: ON, OFF. Default is inner(ON). By
selecting OFF, you can adjust using RF signal in 216
Gray pattern.
* Adj. condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
- LCD: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module
surface (80°~ 100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked
using no signal or Full-white pattern.
(6) Reference (White Balance Adj. coordinate and color
temperature)
• Luminance: 216 Gray
• Standard color coordinate and temperature using CS1000
• Standard color coordinate and temperature using CA-210
ITEMCommandData RangeDefault
(Hex.)(Decimal)
Cmd 1Cmd 2MinMax
CoolR-Gainjg00C0
G-Gainjh00C0
B-Gainji00C0
R-Cut
G-Cut
B-Cut
Medium R-Gainja00C0
G-Gainjb00C0
B-Gainjc00C0
R-Cut
G-Cut
B-Cut
WarmR-Gainjd00C0
G-Gainje00C0
B-Gainjf00C0
R-Cut
G-Cut
ModeColor CoordinationTemp∆UV
xy
COOL0.2690.27313000K0.0000
MEDIUM0.2850.2939300K0.0000
WARM0.3130.3296500K0.0000
ModeColor CoordinationTemp∆UV
xy
COOL0.269±0.0020.273±0.00213000K0.0000
MEDIUM0.285±0.0020.293±0.0029300K0.0000
WARM0.313+0.0020.329±0.0026500K0.0000
- 14 -
5.4. HDCP SETTING
- HDCP setting is not necessary in Saturn5 model.
5.5 Option selection per country
(1) Overview
- Option selection is only done for models in Non-USA
North America due to rating
- Applied model: LA92A Chassis applied None USA
model(CANADA, MEXICO)
(2) Method
1) Press ADJ key on the Adj. R/C, then select Country
Group Menu
2) Depending on destination, select KR or US, then on the
lower Country option, select US, CA, MX. Selection is
done using +, - KEY
5.6. Tool Option selection
• Method: Press Adj. key on the Adj. R/C, then select Tool
option.
5.7. Ship-out mode check (In-stop)
• After final inspection, press In-Stop key of the Adj. R/C and
check that the unit goes to Stand-by mode.
• After final inspection, Always turn on the Mechanical S/W.
6. GND and Internal Pressure check
6.1. Method
1) GND & Internal Pressure auto-check preparation
- Check that Power Cord is fully inserted to the SET.
(If loose, re-insert)
2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V
arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
6.2. Checkpoint
• TEST voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
• TEST time: 1 second
• TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &
NEUTRAL
• LEAKAGE CURRENT: At 0.5mArms
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
7. USB S/W Download (option)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work.
But your downloaded version is High, USB data is
automatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote controller.
2) Select "Tool Option 1" and Push “OK” button.
3) Punch in the number. (Each model has their number.)
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 16 -
300
510
320
330
500
120
200
800
530
810
A7
910
540
520
900
400
410
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
IC102
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
R/B
RE
CE
CLE
ALE
WE
WP
I2C_SCL
I2C_SDA
HY27UF082G2B-TPCB
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VDD_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
2GBIT
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
IC104
M24M01-HRMN6TP
NC
1
E1
2
E2
A0’h
3
VSS
4
+3.3V_Normal
AR101
C102
10uF
C103
0.1uF
AR102
EEPROM
VCC
8
WP
7
SCL
6
SDA
5
22
22
C105
0.1uF
PCM_A[7]
PCM_A[6]
PCM_A[5]
PCM_A[4]
PCM_A[3]
PCM_A[2]
PCM_A[1]
PCM_A[0]
+3.3V_Normal
C104
8pF
OPT
PCM_A[0-7]
R11122
R11222
C106
8pF
OPT
/PF_WP
NC_1
1
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
R/B
7
RE
8
CE
9
NC_7
10
NC_8
11
VCC_1
12
VSS_1
13
NC_9
14
NC_10
15
CLE
16
ALE
17
WE
18
WP
19
NC_11
20
NC_12
21
NC_13
22
NC_14
23
NC_15
24
HDCP EEPROM
R113
4.7K
NAND FLASH MEMORY
/PF_CE0
H : Serial Flash
L : NAND Flash
/PF_CE1
H : 16 bit
L : 8 bit
+3.5V_ST
R103
OPT
R101
3.3K
3.3K
R102
IC102-*1
HY27US08121B-TPCB
512MBIT
IC103
CAT24WC08W-T
A0
1
$0.199
A1
2
A2
3
VSS
4
/F_RB
/PF_OE
/PF_CE0
+3.3V_Normal
OPT
R104
0
B
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VCC
8
WP
7
SCL
6
SDA
5
/PF_CE1
10K
PF_ALE
/PF_WE
C
Q101
KRC103S
OPT
E
NC_28
NC_27
NC_26
NC_25
I/O7
I/O6
I/O5
I/O4
NC_24
NC_23
PRE
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
R127 4.7K
R105
1K
OPT
R106
VDD_1
VSS_1
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
+3.3V_Normal
R128
R129 22
1K
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
NC_9
C107
0.1uF
1K
R107
R1081K
RB
R
E
CL
AL
W
WP
22
+3.3V_Normal
R109 3.9K
C101
OPT
0.1uF
NAND01GW3B2CN6E
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
IC102-*2
1GBIT
Addr:10101--
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
<T3 CHIP Config(AUD_LRCH)>
Boot from SPI flash : 1’b0
Boot from NOR flash : 1’b1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
DDR3(FRC)
Ver. 1.4
3
RL_ON
+3.5V_ST
C401
100uF
16V
+12V/+15V
C402
100uF
16V
R401
10K
0.1uF
C
Q401
B
2SC3052
E
L404
MLB-201209-0120P-N2
C406
0.1uF
16V
L402
MLB-201209-0120P-N2
C404
16V
<OS MODULE PIN MAP>
PIN No
LGD
INV_ON
18
VBR-A
20
22
PWM_DIM
Err_out
24
23
FROM LIPS & POWER B/D
+3.5V_ST
RT1P141C-T112
Q402
R406
4.7K
C408
0.1uF
16V
C407
0.1uF
16V
CMO(09)
A-DIM
PWM_DIM
INV_ON
NC
1
2
R476
0
POWER_23_GND
AUO
INV_ON
Err_out
PWM_DIM
3
NC
NORMAL_EXPEPT_32
R478
Err_out
PWM_DIM
OLP
P403
FW20020-24S
PWR ON
24V
GND
GND
3.5V
3.5V
GND
GND
12V
12V
12V
GND/P.DIM2
C412
0.1uF
0
POWER_23_SCAN_BLK2
C484
1uF
SCAN_BLK2
SHARP
INV_ON
GND
1
1
1
3
3
3
5
5
5
7
7
7
9
9
9
11
11
11
13
13
13
15
15
15
17
17
17
19
19
19
2122
21
2122
2324
23
2324
OPT
16V
25V
OPT
L_DIM
SCLK
MOSIN
NORMAL_32
P404
FM20020-24
24V
2
2
2
24V
4
4
4
GND
6
6
6
GND
8
8
8
3.5V
10
10
10
3.5V
12
12
12
GND
14
14
14
GND/V-sync
16
16
16
INV ON
18
18
18
A.DIM
20
20
20
P.DIM1
22
Err OUT
24
25
25
SLIM_32~52
P401
SMAW200-H24S2
L407
MLB-201209-0120P-N2
POWER_16_V_SYNC
POWER_18_INV_CTL
R4120
POWER_16_GND
POWER_24_INV_CTL
R475
0
POWER_24_GND
POWER_24_PWM_DIM
POWER_22_PWM_DIM
C418
0.1uF
50V
R477
0
R415
100
R425
100
POWER_20_PWM_DIM
R479
0R472
0
0R471
C416
OPT
0.1uF
16V
POWER_20_ERROR_OUT
POWER_24_ERROR_OUT
R420
V_SYNC
+3.3V_Normal
C
R418
6.8K
OPT
E
R484
0
OPT
C419
1uF
25V
100R437
100
+24V
C426
68uF
35V
R419
1K
R421
10K
B
Q405
2SC3052
POWER_18_A_DIM
R451
POWER_22_A_DIM
R485 0
POWER_20_A_DIM
R453
R422 0
OPT
R470
+3.5V_ST
R426
10K
10K
0
0
SCAN_BLK1/OPC_OUT
OPT
0
+3.3V_Normal
OPT
R486
4.7K
OPT
INV_CTL
R427
OPT
A_DIM
PWM_DIM
ERROR_OUT
OPC_OUT
+12V/+15V
L412
PANEL_CTL
1:AK10
Placed on SMD-TOP
C IN
+3.5V_ST
C461
22uF
10V
OPT
R430
10K
R429
47K
CIC21J501NE
L420
+3.3V_Normal
C436
0.01uF
25V
R431
22K
C
Q406
B
2SC3052
E
S7M DDR 1.5V
IC407
MP2212DN
FB
R2
IC402
Vd=550mV
2
1
GND
2
3A
IN
3
BS
4
VOUT
3
GND
C432
0.1uF
16V
R449
11K
1/10W
5%
AZ2940D-2.5TRE1
VIN
1
R435
22K
R452
10
C463
1/10W
R473
C438
0.1uF
16V
R439
33K
R440
5.6K
C
B
E
100pF
50V
Replaced Part
8
7
6
5
R4550
1%
1
C403
10uF
10V
C442
10uF
16V
Q407
2SC3052
R457
10K
EN/SYNC
SW_2
SW_1
VCC
OPT
C443
4.7uF
16V
1%
Close to IC
C465
1uF
10V
Q409
AO3407A
S
G
R1
10K
R464
L423
3.6uH
NR8040T3R6N
C467
0.1uF
50V
+2.5V/+1.8V
+2.5V_Normal
C440
0.1uF
16V
C451
OPT
D
1uF
25V
New item
PANEL_POWER
C455
0.1uF
16V
PANEL_DISCHARGE_RES
PANEL_DISCHARGE_RES
1074 mA
Vout=0.8*(1+R1/R2)
+1.5V_DDR
POWER_ON/OFF1
C472
22uF
10V
Placed on SMD-TOP
300 mA
C476
0.1uF
R405
2.2K
PANEL_VCC
R407
2.2K
15V-->3.6V
20V-->3.5V
24V-->3.48V
12V-->3.58V
ST_3.5V-->3.5V -> 3.375V
+24V
POWER_+24V
POWER_+24V
+12V/+15V
R482
R403
24K
4.3K
1%
R482-*1
1%
R403-*1
L416
C457
C459
10uF
10uF
25V
25V
Vout=(1+R1/R2)*0.8
+12V/+15V
L417
C458
C460
10uF
10uF
25V
25V
Vout=0.8*(1+R1/R2)
+24V
24K
5.1K
OPT
R446
30K
POWER_+20V
1%
POWER_+20V
5%
+12V/+15V
R448
1%
R447
12K
5.1K
1%
PD_+12V
1/16W
5%
PD_+12V
+3.5V_ST
R4501K1%
R447-*1
27K
VCC
+3.5V_ST -> 3.375V
PD_+3.5V
1%
PD_+3.5V
R404
100K
IC409
NCP803SN293
3
1
GND
+3.3V_Normal
IC405
AOZ1073AIL
PGND
AGND
1
VIN
2
3A
3
FB
4
LX_2
8
LX_1
7
POWER_ON/OFF2_2
EN
6
R456
10K
COMP
5
9.1K
R454
+5V_Normal
IC406
AOZ1072AI
PGND
VIN
AGND
1
2
2A
3
FB
4
LX_2
8
LX_1
7
EN
6
COMP
5
NCP803SN293
VCC
3
GND
PD_+12V
RESET
2
PD_+12V
L421
3.6uH
NR8040T3R6N
2200pF
C464
R488
100K
IC408
RESET
2
1
PD_+12V
Power_DET
1%
R460
27K
R1
1%
4.7K
R461
OPT
C423
100pF
50V
1%
R2
R462
10K
L422
3.6uH
NR8040T3R6N
POWER_ON/OFF2_2
R459
10K
12K
2200pF
R458
C466
R402
100
R480
100
1934 mA
R465
R466
R467
+3.5V_ST
R463
10K
OPT
C469
22uF
10V
MAX 1A
5%
51K
R1
1%
1.5K
OPT
C427
100pF
50V
1%
R2
10K
C474
0.1uF
CIC21J501NE
C473
0.1uF
16V
C471
22uF
10V
POWER_DET
+3.3V_Normal
L424
C485
0.1uF
16V
+5V_Normal
C477
0.1uF
16V
+12V/+15V
C405
10uF
25V
L401
+5V_USB
IC401
MP8706EN-C247-LF-Z
IN
1
SW_1
2
SW_2
3A
3
C410
0.1uF
BST
R487
22
4
L406
3.6uH
NR8040T3R6N
8
7
6
5
GND
VCC
FB
EN/SYNC
C414
1uF
50V
R410
10K
POWER_ON/OFF2_1
R411
10K
+5V_USB
OPT
C482
100pF
50V
MAX 2000mA
OPT
1%
R416
33K
C429
100pF
R1
50V
1%
R417
6.2K
R2
C420
22uF
10V
C424
0.1uF
16V
+5V_USB
Vout=(1+R1/R2)*0.8
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MODEL OPTION
PIN NO.11HIGH
B/L_LED
8
PWM_BUZZ/GPIO_LED
30
TOUCH_KEYTACT_KEY
31PDP/3D
LOWPIN NAME
B/L_LAMP
PWM_LED
LCD/OLED
P17/TI50/TO50
P31/INTP2/OCD1A
M_REMOTE
NON_M_REMOTE
R10 62 22
R10 61 22
RF_ENABLE
P16/TOH1/INTP5
22
R10 69
OCD1A
POWER_DET
LED_B/LG_LOGO
IR
22
R10 68
LED_R/BUZZ
NEC_ISP_Rx
P11/SL10/RXD0
P10/SCK10/TXD0
22
22
R10 41
R10 37
22
R10 36
NEC_RXD
NEC_ISP_Tx
NEC_TXD
POWER_ON/OFF2_2
R1044 10K
R1045 10K
R1083 10K
OPT
OPT
+3.5V_ST
OPT
C1009 1uF
GP2_Saturn7M
MICOM
Ver. 1.4
5
CONTROL
IR & LED
+3.5V_ST
EYEQ/TOUCH_KEY
R2411
50V
EYEQ/TOUCH_KEY
R2412
R2413 1.5K
R2410
100
C2407
100pF
LED_R/BUZZ
100
5.6B
C2408
1000pF
D2403
50V
OPT
100
50V
C2409
1000pF
50V
OPT
C2410
0.1uF
D2405
5.6B
R2414
1.5K
5.6B
D2404
JP2407
JP2408
OPT
16V
OPT
R2416
10K
JP2409
JP2410
JP2411
P2401
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
LED_B/LG_LOGO
L2404
BLM18PG121SN1D
C2405
0.1uF
16V
NEC_EEPROM_SCL
NEC_EEPROM_SDA
C2406
1000pF
R2405
R2404
10K
10K
1%
1%
R2401
100
KEY1
R2402
100
KEY2
+3.5V_ST
R2429
Q2405
2SC3052
+3.5V_ST
47K
+3.5V_ST
R2426
3.3K
R2431
OPT
47K
C
B
E
COMMERCIAL
R2403
Commercial_EU
Commercial
22
Commercial_EU
Q2401
2SC3052
IR_OUT
R2425
Q2406
2SC3052
47K
R2430
C
10K
B
E
R2427
0
OPT
R2428
IR
22
BLM18PG121SN1D
BLM18PG121SN1D
+3.5V_ST
R2406
47K
C
B
E
Commercial_EU
R2422
0
Commercial_US
L2401
L2402
+3.5V_ST
R2407
10K
C2401
0.1uF
R2408
Commercial
Q2402
2SC3052
Commercial
C2402
0.1uF
L2403
BLM18PG121SN1D
C2403
0.1uF
+3.5V_ST
47K
C
B
Commercial
E
16V
R2409
47K
D2401
5.6V
AMOTECH
D2402
AMOTECH
C2404
1000pF
50V
+3.3V_Normal
5.6V
Zener Diode is
WIRELESS
IR_PASS
R2417
WIRELESS
+3.5V_ST
R2420
47K
WIRELESS
22
R2418
C
Q2404
B
2SC3052
WIRELESS
WIRELESS
E
+3.5V_ST
R2419
47K
WIRELESS
10K
Q2403
2SC3052
WIRELESS
R2421
47K
C
B
WIRELESS
E
close to wafer
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
IR & LED
Ver. 1.2
6
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