LG 37LC50CB, 37LC50CB-UA Schematic

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Page 1

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LA64A

MODEL : 37LC50CB

37LC50CB-UA

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

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Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................12

TROUBLE SHOOTING ............................................................................18

BLOCK DIAGRAM...................................................................................24

EXPLODED VIEW .................................................................................. 25

REPLACEMENT PARTS LIST ............................................................... 27

SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

AC Volt-meter

Good Earth Ground such as WATER PIPE,

To Instrument's exposed METALLIC PARTS

0.15uF

CONDUIT etc.

1.5 Kohm/10W

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500ºF to 600ºF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500ºF to 600ºF) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500ºF to 600ºF)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

4. General Specification(TV)

No Item Specification Remark

1 Receiving System VSB/64 & 256 QAM/ NTSC-M

2 Available Channel 1) VHF : 02~13

2) UHF : 14~69

3) DTV : 02-69

4) CATV : 01~135

5) CADTV : 01~135

3 Input Voltage 1) AC 100 ~ 240V 50/60Hz

4 Market NORTH AMERICA

5 Screen Size 37, 42 inch Wide

6 Aspect Ratio 16:9

7 Tuning System FS

8 LCD Module LC370WX3-SLD1 LG Philips LCD

LC420WX6-SLD1

9 Operating Environment 1) Temp : 0 ~ 40 deg

2) Humidity : ~ 80 %

10 Storage Environment 1) Temp. : -20 ~ 50 deg

2) Humidity : 10 ~ 90 %

1. Application range

This specification is applied to LA64A chassis.

2. Requirement for Test

Testing for standard of each part must be followed in below condition.

(1) Temperature : 20 ± 5°C (2) Humidity : 65% ± 10% (3) Power : Standard input voltage (100-240V~, 50/60Hz)

*Standard Voltage of each products is marked by models(4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

3.1 Performance : LGE TV test method followed

3.2 Demanded other specification Safety : UL, CSA, IEC Specification EMC : FCC, ICES, IEC

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5. Chroma & Brightness

No Item Min Typ Max Unit Remark

1 White brightness 400 500 cd/m

EZ Picture: Daylight, Color

Temperature: Medium

2 Color coordinate RED X 0.602 0.632 0.662 Full Signal Swing

(Default) Y 0.312 0.342 0.372 ± 0.025

GREEN X 0.258 0.288 0.318

Y 0.580 0.610 0.640

BLUE X 0.117 0.147 0.177

Y 0.035 0.065 0.095

WHITE X 0.246 0.287 0.296

Y 0.254 0.289 0.304

3 Brightness uniformity 80 % Full white

4 Contrast ratio 600:1 800:1 EZ Picture: Daylight, Color

Temperature: Medium

5 Color Temperature Standard 8,300 9,300 10,300 oK

Cool 10,000 11,000 12,000 oK

Warm 5,500 6,500 7,500 oK

6. Component Video Input (Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(kHz) Proposed

1 720*480 15.73 59.94 SDTV ,DVD 480I

2 720*480 15.73 60.00 SDTV ,DVD 480I

3 720*480 31.47 59.94 SDTV 480P

4 720*480 31.50 60.00 SDTV 480P

5 1280*720 44.96 59.94 HDTV 720P

6 1280*720 45.00 60.00 HDTV 720P

7 1920*1080 33.72 59.94 HDTV 1080I

8 1920*1080 33.75 60.00 HDTV 1080I

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7. RGB Input (PC/DTV)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

PC DDC

1 640*350 31.469 70.08 25.17 DOS X

2 640*480 31.469 59.94 25.17 VESA(VGA) O

3 640*480 37.861 72.80 31.50 VESA(VGA) O

4 640*480 37.500 75.00 31.50 VESA(VGA) O

5 800*600 35.156 56.25 36.00 VESA(SVGA) O

6 800*600 37.879 60.31 40.00 VESA(SVGA) O

7 800*600 48.077 72.18 50.00 VESA(SVGA) O

8 800*600 46.875 75.00 49.50 VESA(SVGA) O

9 1024*768 48.363 60.00 65.00 VESA(XGA) O

10 1024*768 56.476 70.06 75.00 VESA(XGA) O

11 1024*768 60.023 75.02 78.75 VESA(XGA) O

12 1280*768 47.700 60.000 80.140 VESA(WXGA)

1360*768 47.720 59.799 84.750 VESA(WXGA)

1366*768 47.130 59.658 72.000 VESA(WXGA)

DTV

1 720*480 31.50 59.94 SDTV 480P

2 720*480 31.47 60.00 SDTV 480P

3 1280*720 44.96 59.94 HDTV 720P

4 1280*720 45.00 60.00 HDTV 720P

5 1920*1080 33.72 59.94 HDTV 1080I

6 1920*1080 33.75 60.00 HDTV 1080I

8. HDMI1 Input (PC/DTV)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

PC DDC

1 640*480 31.469 59.94 25.17 VESA(VGA) O

2 640*480 37.861 72.80 31.50 VESA(VGA) O

3 640*480 37.500 75.00 31.50 VESA(VGA) O

4 800*600 35.156 56.25 36.00 VESA(SVGA) O

5 800*600 37.879 60.31 40.00 VESA(SVGA) O

6 800*600 48.077 72.18 50.00 VESA(SVGA) O

7 800*600 46.875 75.00 49.50 VESA(SVGA) O

8 1024*768 48.363 60.00 65.00 VESA(XGA) O

9 1024*768 56.476 70.06 75.00 VESA(XGA) O

10 1024*768 60.023 75.02 78.75 VESA(XGA) O

11 1280*768 47.700 60.00 80.140 VESA(WXGA) O

12 1360*768 47.720 59.799 84.750 VESA(WXGA) O

13 1366*768 47.130 59.658 72.000 VESA(WXGA) O

DTV

1 720*480 31.500 59.94 27.00 SDTV 480P

2 720*480 31.469 60.00 27.03 SDTV 480P

3 1280*720 44.96 59.94 HDTV 720P

4 1280*720 45.00 60.00 HDTV 720P

5 1920*1080 33.72 59.94 HDTV 1080I

6 1920*1080 33.75 60.00 HDTV 1080I

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10. General specifications (module)

10-1. 37LC5DC

No Item Value Unit Remark

1 Active Screen Size 940.3(diagonal) mm 37.02 inches

2 Outline Dimension 877.0(H)x516.8(V)x46.9(D) mm

3 Pixel Pitch 200 x 600 x RGB um

4 Pixel Format 1366(H)x768(V) stripe arrangement

5 Color Depth 8bit 16.7 Mbit

6 Luminance ,White 500 (center 1 point typ) cd/m2

7 Viewing Angle (CR>10) R/L 178(Typ),U/D 178(Typ) degree

8 Power Consumption 126 Watt

9 Weight 9 kg

10 Display Operating Mode Transmissive mode, normally black

11 Surface Treatment Hard coating (3H)

10-2. 42LC5DC

No Item Value Unit Remark

1 Active Screen Size 1067.308 (diagonal) mm 42.02 inches

2 Outline Dimension 983(H)x576(V)x47.3(D) mm

3 Pixel Pitch 227 x 681 x RGB um

4 Pixel Format 1366(H)x768(V) stripe arrangement

5 Color Depth 8bit 16.7 Mbit

6 Luminance ,White 450 (center 1 point typ) cd/m2

7 Viewing Angle (CR>10) R/L 178(Typ),U/D 178(Typ) degree

8 Power Consumption 168.36 Watt

9 Weight 110(Typ), 12(Max) kg

10 Display Operating Mode Transmissive mode ,normally black

11 Surface Treatment Hard coating (3H)

9. HDMI2 Input (DTV)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

1 720*480 31.500 59.94 27.00 SDTV 480P

2 720*480 31.469 60.00 27.03 SDTV 480P

3 1280*720 44.96 59.94 HDTV 720P

4 1280*720 45.00 60.00 HDTV 720P

5 1920*1080 33.72 59.94 HDTV 1080I

6 1920*1080 33.75 60.00 HDTV 1080I

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11. Electro Optical Characteristic Specifications (module standard)

11-1. 37LC5DC

No Item Min Typ Max Unit Remark

1 Contrast Ratio(CR) 700 900

2 Surface Luminance, White 400 500 Cd/m

Full white

3 Luminance Variation 1.3 (δwhite/5P)

4 Response Time Gray to Gray 6 10 msec

5 Color coordinate RED X Typ 0.636 Typ Full Pattern

Y -0.03 0.343 +0.03

GREEN X 0.284

Y 0.615

BLUE X 0.144

Y 0.063

WHITE X 0.279

Y 0.292

6 Viewing Angle (CR>10) X axis right(ø=0) 85 89 degree

X axis left(ø=180) 85 89

Yaxis up (ø=90) 85 89

Z axis down(ø=270) 85 89

11-2. 42LC5DC

No Item Min Typ Max Unit Remark

1 Contrast Ratio CR 800 1000

CR with DCR TBD TBD

2 Surface Luminance, White 400 450 Cd/m

Full white

3 Luminance Variation 1.3 (δwhite/5P)

4 Response Time Gray to Gray 5 18 msec

Rise+decay 10 14

5 Color coordinate RED X Typ 0.635 Typ Full Pattern

Y -0.03 0.344 +0.03

GREEN X 0.286

Y 0.614

BLUE X 0.146

Y 0.061

WHITE X 0.279

Y 0.292

6 Viewing Angle (CR>10) X axis right(ø=0) 85 89 degree

X axis left(ø=180) 85 89

Yaxis up (ø=90) 85 89

Z axis down(ø=270) 85 89

7 Gray Scale Without DCR 2.2

With DCR

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12. Customer Menu Setup (Shipment Condition)

No Item Condition Remark

1 Input Mode TV02CH

2 Volume Level 20

3 Mute Off

4 Aspect Ratio 16:9

5 Video EZ Picture Daylight

Color temperature (Disable)

Can be access only EZ picture is setting user mode

XD Auto

Advanced Cinema: Off

Reset

6 Audio Audio Language Off

EZ SoundRite Off

EZ Sound Normal

Balance 0

Treble 50

Bass 50

Front Surround Off

TV Speaker On

7 Timer Auto clock Off

Manual Clock Off

Off Timer Off

On Timer Off

Auto Off Off

8 Option Aspect Ratio 16:9

Caption/Text Off

Caption Option Off

Language English

ISM Method Normal

SET ID 1

9 Lock Lock System Off

Set password On ( Default : 0000 )

Block channel None

Movie Rating Off

TV Rating-Children Off

TV Rating-General Off

Audio Block Off

10 Channel Memory none

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ADJUSTMENT INSTRUCTION

1. Application Range

This spec sheet is applied all of the 'LA64A' Chassis.

2. Specification

2.1 Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.

2.2 Adjustment must be done in the correct order.

2.3 The adjustment must be performed in the circumstance of 25±5°C of temperature and 65±10% of relative humidity if there is no specific designation.

2.4 The input voltage of the receiver must keep 100~240V, 60Hz.

2.5 The receiver must be operated for about 15 minutes prior to the adjustment.

O After RGB Full White in HEAT-RUN Mode, the receiver

must be operated prior to the adjustment.

O Enter into HEAT-RUN MODE

(1) Press the POWER ON KEY on R/C for adjustment. (2) OSD display and screen display 100% full WHITE

PATTERN.

- Set is activated HEAT run without signal generator in this mode.

- Single color pattern (RED / BLUE / GREEN) of HEAT RUN MODE uses to check panel.

- Caution: If you turn on a still screen more than 20 minutes (Especially digital pattern, cross hatch pattern), an after image may be occur in the black level part of the screen.

3. Adjustment items

=> Use cross connected RS-232C Cable. Don°Øt use straightly

connected RS-232C Cable.

(Pin Connection: 1-1, 2-3, 3-2, 4-4, 5-5, 6-6, 7-7, 8-8, 9-9)

O Method of PTC MICOM Download O Select method of Module type O Auto AV (CVBS) Color Balance adjustment.

- Standard equipment: 802F Pattern Generator. Master Pattern Generator (MSPG-925, etc) or same product

O Auto Component Color Balance adjustment.

- tandard equipment: 802F Pattern Generator. Master Pattern Generator (MSPG-925, etc) or same product

O Auto RGB Color Balance adjustment.

- Standard equipment: PC Pattern Generator(VG828, VG854, 801GF, MSP3240A, MSPG-925, etc) or same product

O Auto RF Color Balance adjustment.

- RF 2CH

O EDID/DDC Data input. O Adjustment of White Balance. O Factoring Option Data input.

4. Method of PTC MICOM Download

4.1 Connection of MICOM JIG

1) Connect port(3) with Power Code

2) Connect jack(1) with PTC Micom.

3) Connect USB Cable to the computer

4) Download Program execution (SAP Configuration)

* Notice!

Because PTC Download JIG has internal memory, it can save download files using download program (SAP Configuration). Push the START button (4) after file saving, then it execute download.

4.2 Execution of download program (SAP Configuration)

4.2.1 Execution of SAP Configuration

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1) Select HCS12

2) Target Frequency Settings :

A. Checking the factor -> Use Specified Target Frequency

..., Unsecure target....

B. Insert Target Bus Frequency -> 7372800

3) Specify Algorithm: 9S12dt128_128k .12P

4) Specify S Record: select download file.

5) Checking factor: Erase Device, Blank Check Device,

Program Device, Verify Device * Notice! Don't check other checking boxes. You must follow fig.

6) Push the 'Save Image to Cyclone PRO' button, files

transfer from PC to the Download JIG.

5. Select method of Module type

5.1 Setting up like figure (Setting: Press ADJ Key in the Adjust remocon. Select "System Control 3" by using

D/E (CH+/-) key, and press

A(ENTER)

Using Adjust remocon, select module)

6. Color Balance adjustment.

6.1 Auto AV (CVBS) Color Balance

6.1.1 Required Equipment

- Remote controller for adjustment

- AV Pattern Generator: 802F Pattern Generator, Master (MSPG-925FS), etc (Which has NTSC-J Composite Video format output with standard (1.0 Vpp) See Fig. 1)

- It is very import to use correct adjustment pattern like Fig.1.

6.1.2 Method of Auto AV (CVBS) Color Balance

1) Input the NTSC-J Composite Video (Fig.1.) into video

input.

=> MSPG-925FS Model No: 207 / Pattern No: 65 / NTSC-J

2) Set the EZ Picture to Daylight mode in Video menu.

3) Press INSTART key on R/C for adjustment.

4) Press the

G(Vol. +) key operate to set, then it becomes

automatically.

5) Auto-RGB OK means completed adjustment.

* When adjust main picture, sub picture is included.

PC -> Download Jig

<Fig.1> Auto AV (CVBS) Color Balance Test Pattern

Default Value on OSD

Before ADC Calibration, should be executed the "Module type selection".

Auto Color Balance (Hex)

Auto-RGB G To Set

Source Main Red Offset1 102 Green Offset1 0C6 Blue Offset1 0DA Red Offset2 3F Green Offset2 3F Blue Offset2 3F Red Gain 072 Green Gain 070 Blue Gain 07B Reset

G To Set

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6.2 Auto Component Color Balance

6.2.1 Required Test Equipment

- Remote controller for adjustment

- 802F Pattern Generator Which has 720p YPbPr output with Standard (0.7Vpp) See Fig. 2

- It is very important to use correct adjustment pattern like Fig. 2.

6.2.2 Method of Auto Component Color Balance

1) Input the Component 1280*720p 60Hz signal into

Component.

=> MSPG-925FS Model No: 217 / Pattern No: 65

2) Set the EZ Pictures to Daylight mode in Video menu.

3) Press INSTART key on R/C for adjustment.

4) Press the

G(Vol. +) key operate To set, then it becomes

automatically.

5) Auto-RGB OK means completed adjustment

6.3 Auto RGB Color Balance

6.3.1 Required Test Equipment

- Remote controller for adjustment

- 802F Pattern Generator, Master (MSPG-925FS), etc. (Which has XGA 60Hz PC Format output with standard

(0.7Vpp) See Fig. 3 )

- It is very import to use correct adjustment pattern like Fig.

6.3.2 Method of Auto RGB Color Balance

1) Input the PC 1024x768 @ 60Hz into RGB.

=> MSPG-925FS Model No: 60 / Pattern No: 65

2) Set the EZ Pictures to Daylight mode in Video menu.

3) Press INSTART key on R/C for adjustment.

4) Press the

G(Vol. +) key operate To set, then it becomes

automatically.

5) Auto-RGB OK means completed adjustment.

<Fig.2> Auto Component Color Balance Test Pattern

Default Value on OSD

Auto Color Balance (Hex)

Auto-RGB G To Set

Source Main Red Offset1 0F8 Green Offset1 0DA Blue Offset1 0BC Red Offset2 01 Green Offset2 01 Blue Offset2 01 Red Gain 1FE Green Gain 1FE Blue Gain 1FE Reset G To Set

<Fig.3> Auto RGB Color Balance Test Pattern

Default Value on OSD

Auto Color Balance (Hex)

Auto-RGB G To Set

Source Main Red Offset1 069 Green Offset1 0DA Blue Offset1 0D0 Red Offset2 37 Green Offset2 39 Blue Offset2 3F Red Gain 19F Green Gain 183 Blue Gain 195 Reset G To Set

Page 15

6.4 RF Color Balance

1) Input the RF cable(2 ch)

2) Set the EZ Pictures to Daylight mode in Video menu.

3) Press INSTART key on R/C for adjustment.

4) Press the

G(Vol. +) key operate To set, then it becomes

automatically.

5) Auto-RGB OK means completed adjustment

7. EDID / DDC INPUT

7.1 EDI D(The Extended Display Identification Data) / DDC(Display Data Channel) download

7.1.1 Required Test Equipment

1) Adjusting PC with S/W for writing EDID Data.

2) A Jig for EDID Download

3) Cable: Serial (9Pin or USB) to D-sub 15Pin cable, D-sub 15Pin cable, DVI to HDMI cable.

7.1.2 Setting of device

- When input HDMI EDID data through RGB or HDMI jack,

writing 8bits of the data at every turn with 'DDC2B' protocol.

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Only for training and service purposes

Default Value on OSD

Auto Color Balance (Hex)

Auto-RGB G To Set

Source Main Red Offset1 032 Green Offset1 030 Blue Offset1 033 Red Offset2 40 Green Offset2 40 Blue Offset2 40 Red Gain 03C Green Gain 03C Blue Gain 01F Reset G To Set

<Fig.4> Connection Diagram of DDC download

Page 16

7.1.3 Data of EDID for 32/37/42LC5DC-UA,32LX5DC-UA

7.1.3.1 DDC data of Analog-RGB

7.1.3.2 DDC data of Digital-HDMI1

7.1.3.3 DDC data of Digital-HDMI2

8. Adjustment of White Balance

8.1 Required Equipment

- Remote controller for adjustment

- Color Analyzer (CA-210 or same product )

- Auto W/B adjustment instrument(only for Auto adjustment)

- Use inner(SELF) Pattern

8.2 Adjustment of White Balance (For Manual adjustment) Set TV input to RF. Operate the zero-calibration of the CA-210, Ch.9. Then stick sensor to LCD module surface when you adjust. For manual adjustment, it is also possible by the following sequence.

1) Select white pattern of heat-run mode by pressing power

on key on remote control for adjustment then operate heat run more than 15 minutes.

2) Enter the White Balance adjustment mode by pressing

the INSTART key twice (White Balance) on R/C.

3) Stick sensor to center of the screen and select each

items using

D/E(CH +/-) key on R/C.

4) Adjust G Gain / B Gain using

F/G(VOL +/-) key on R/C.

5) Adjust it until color coordination becomes as below.

- By controlling G, B GAIN, adjust X, Y target value.

- R Gain fixed at cool, normal, warm mode.

- But, Control the R GAIN, unless it has correct value

(Initially, R/G/B gain and R/G/B offset values are fixed as below.) Red Gain: 80h Green Gain: 80h Blue Gain: 80h Red Offset: 80h Green Offset: 80h Blue Offset: 80h

*Target value

X Y Temp (∆uv) Cool 0.276 ± 0.002 0.283 ± 0.002 11000k (0.000) Normal 0.285 ± 0.002 0.293 ± 0.002 9300k (0.000) Warm 0.313 ± 0.002 0.329 ± 0.002 6500k (0.003)

6) When adjustment is completed, Exit adjustment mode using EXIT key on R/C.

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Only for training and service purposes

Before adjustment of white balance, should be executed the 'color balance adjustment'

Page 17

9. Auto white Balance (AV)

command1 command2 Set ID Data Default value

Min Max

Input Select

x b 01 20h 90h R-Gain j a 01 0h FEh 77h G-Gain j b 01 0h FEh 80h B-Gain j c 01 0h FEh 7ch R-Offset j d 01 0h FEh 7ch G-Offset j e 01 0h FEh 80h B-Offset j f 01 0h FEh 8ch

10. Test factor for commercial model

10.1 IR In/ Out Check

10.1.1 Check Order 'Pass' Judgment

1) Insert RJ45 Cable, RS-232C Cable 2EA. Phone Jack to each Port as below Picture.

2) Change the Mode 'PTC Only' On OSD(In-start -> Uart Control -> Download -> PTC°±)

3) Running the 'IR/MPI Check Program' on PC

4) Click the 'AUTO Run' or 'Push the Spacebar' on the keyboard

5) If the Sign is 'NG' try One More as 'Push the Spacebar'

6) Confirm the 'OK' Sign on Screen that means IR in & MPI Test Pass / 'NG' Sign is NG

Confirm the 'PASS' Sign of IR Out Check JIG / 'NG' Sign is NG

7) After finish Check. Change the Mode 'D-Box On'(In-start

-> Uart Control -> D-Box 'ON')

10.1.2 Needs JIG & Equip. & Cable

PC('MPI/IP In' Check Program. RS-232C 2Port), IR Out Check Jig(With level Shifter), 232C to Phone jack Cable, 5V Adapter, 232C Cable(Cross) 232C Cable(Cross) 2EZ, RJ45(Direct) Cable.

10.2 Lodgenet Card & Auto Camport Check

10.3 RJP(Remote Jack Pack) Check

10.3.1 Check Order 'Pass' Judgment

1) Connecting RJP Test JIG & RJP Port of Set with Modem Cable(8Pin)

2) Check the RJP operation on OSD(In-start -> RJP Pin Check ->

3) 'SUCCESS! PIN CONNECTION OK' -> PASS

4) 'Pin Check Fail!!!!' -> NG

5) If the Result is 'NG', try One More

10.3.2 Needs JIG & Equip. & Cable

1) RJP Check JIG, Modem Cable (8 Pin)

10.4 MPI Card Check

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Only for training and service purposes

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Only for training and service purposes

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TROUBLESHOOTING

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Only for training and service purposes

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Only for training and service purposes

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Only for training and service purposes

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Only for training and service purposes

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Only for training and service purposes

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BLOCK DIAGRAM

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Only for training and service purposes

1. Overall Block Diagram (D2A + BCM7411 + Cortez Adv.)

DIGIT_D[0-23]

H,V_SYNC_DIGIT

DE,CLK_DIGIT

D2A_VIDEO_OUT

TMDS_0

TMDS_1

DDC_I2C_0,1

EEPROM

TUNER_CVBS

ATSC/NTSC

Tuner

R,G,B

VGA_H,V SYNC

CABLE_DET

COMPONENT

(Y,Pb,Pr)

COMPONENT (Y,Pb,Pr)

REAR CVBS

SIDE_CVBS

S_VIDEO Y,C(rear/side)

S_VIDEO DET

TUNER_CVBS

I2S

Comp_1/2 L/R

MSP L/R

Analog L/R

CVBS,S-VIDEO L/R

VGA L/R

MNT_OUT_L/R

SPDIF_OUT

I2C_D2A

(AT)

I2C_Cortez

(NT)

I2C_Cortez

SIDE L/R

D2A

UART_D2A_0

RS232

232C_Tx / Rx

MSP4450K

TPA3100D2

I2C_Cortez

MNT_V_OUT

INV_BR

DIGITAL_IN[24Bit]

DE,CLK_IN

DIGITAL_H,V_SYNC

ANALOG_IN

ANALOG_H,V_SYNC

ANALOG_IN

CABLE_DET

ANALOG_IN

ANALOG IN

INV_BRI

DISPLAY_EN

AI_ON_OFF/OD

SEL_1

LVDS_DATA

DISPLAY_EN

INV_CTL

UART1

LVDS

Conne cto r

For LCD

POWER

HDMI

SiI9023

NVRAM

EEPROM

16 KB

DDRRAM

(256 Mb )

Flash

2MB

232C Driver

ST3232CDR

NVRAM

EEPROM

32KB

AT49BV160C

F-ROM (2MB)

$ 0.46

DDRRAM

(32MB)

$2.7

I2C MUX

I2S

NJU26901

ANT./Cable

I2C_D2A

VSB

Pro:Idiom

BCM7411

DDRRAM

(128 MB )

I2S

CPLD

12_to_24

EBI

8_to_16

DIGITAL_IN[24Bit]

DE,CLK_IN

DIGITAL_H,V_SYNC

UART_D2A_1

SERIAL_TS

I2S

DIGIT_D[0-23]

H,V_SYNC_DIGIT

DE,CLK_DIGIT

Cortez-A.

FLI8662

UART

MUX

UART0

MSP SPDIF

Paral lel To Serial

SPDIF

MUX

7411 SPDIF

D2A SPDIF

I2S

MUX

Impl emented

in CPLD

I2C_Cortez_5V

Page 25

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Only for training and service purposes

802

808

801

809

520

510

500

300

120

200

800

803

804

807

805

700

600

530

610

601

910

900

620

710

540

400

811

810

806

200T

200N

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

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