LG 32LY340C Schematic

Internal Use Only

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

LED TV

SERVICE MANUAL

CHASSIS : LB4CA

MODEL : 32LY340C 32LY340C-TA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL68104704 (1402-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 9

TROUBLE SHOOTING GUIDE ............................................................... 15

BLOCK DIAGRAM ................................................................................. 20

EXPLODED VIEW .................................................................................. 21

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shor ts of the circuitr y tha t may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

Always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this service manual. CAUTION: Do not connect the test xture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some eld-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. Carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This specification is applied to the LED TV used LB4AC chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch drawing and sp ec ification by pa rt number in accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

No. Item Specication Remarks

1 Market Asia, Oceania, Africa, Middle East (PAL/DVB Market) Only Analog for A-ASIA

1) PAL/SECAM-B/G/D/K

2. Broadcasting system

3 Channel Storage ATV - 135 EA, DTV - 1000 EA

4 Receiving system

5 Video(Composite) Input PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60

6 RGB Input(1EA) RGB-PC Analog(D-SUB 15PIN)

7 Component Input Y/Cb/Cr, Y/Pb/Pr Spec out

8 HDMI Input

9 Audio Input (1EA)

10 SDPIF out SPDIF out

11 USB For My Media(Movie/Photo/Music List) and SVC

12 External Speaker Max 1W @ 8 ohm Stereo SE output

2) PAL-I

3) NTSC-M

4) DVB-T/T2

Analog : Upper Heterodyne Digital : COFDM(DVB-T/T2)

HDMI1-DTV/DVI HDMI2-DTV/DVI HDMI3-DTV/DVI

RGB/DVI Audio AV

PAL

► DVB-T

- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

Common Port in AV & PC input.

Only for training and service purposes

- 6 -

5. External Input Support Format

5.1. Component (Y, PB, PR) Speck out

No. Resolution H-freq(kHz) V-freq(Hz) Proposed

1. 720×480 15.73 60.00 SDTV, DVD 480i

2. 720×480 15.63 59.94 SDTV, DVD 480i

3. 720×480 31.47 59.94 480p

4. 720×480 31.50 60.00 480p

5. 720×576 15.625 50.00 SDTV, DVD 625 Line

6. 720×576 31.25 50.00 HDTV 576p

7. 1280×720 45.00 50.00 HDTV 720p

8. 1280×720 44.96 59.94 HDTV 720p

9. 1280×720 45.00 60.00 HDTV 720p

10. 1920×1080 31.25 50.00 HDTV 1080i

11. 1920×1080 33.75 60.00 HDTV 1080i

12. 1920×1080 33.72 59.94 HDTV 1080i

13. 1920×1080 56.250 50 HDTV 1080p

14. 1920×1080 67.5 60 HDTV 1080p

5.2. RGB Input(PC)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1 640*350 @70Hz 31.468 70.09 25.17 EGA

2 720*400 @70Hz 31.469 70.08 28.321 DOS

3 640*480 @60Hz 31.469 59.940 25.175 VESA(VGA)

4 800*600 @60Hz 37.879 60.31 40.000 VESA(SVGA)

5 1024*768 @60Hz 48.363 60.00 65.000 VESA(XGA)

6 1280*768 @60Hz 47.776 59.870 79.50 VESA(XGA)

7 1152*864 @60Hz 54.348 60.053 80.002 VESA

8 1280*1024 @60Hz 63.981 60.020 108 VESA(SXGA)

9 1360*768 @60Hz 47.712 60.015 85.5 VESA(WXGA)

10 1920*1080 @60Hz 67.5 60.0 148.5

WUXGA (Reduced blanking)

FHD only(Support

to HDMI-PC)

FHD only(Support

to HDMI-PC)

Only for training and service purposes

- 7 -

5.3. HDMI Input(PC/DTV)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

PC(DVI) DDC

1 640*350 @70Hz 31.468 70.09 25.17 EGA X

2 720*400 @70Hz 31.469 70.08 28.321 DOS O

3 640*480 @60Hz 31.469 59.940 25.175 VESA(VGA) O

4 800*600 @60Hz 37.879 60.31 40.000 VESA(SVGA) O

5 1024*768 @60Hz 48.363 60.00 65.000 VESA(XGA) O

6 1280*768 @60Hz 47.776 59.870 79.50 VESA(XGA) Х

7 1152*864 @60Hz 54.348 60.053 80.002 VESA O

8 1280*1024 @60Hz 63.981 60.020 108 VESA(SXGA) O

9 1360*768 @60Hz 47.712 60.015 85.5 VESA(WXGA) O

10 1920*1080 @60Hz 67.5 60.0 148.5

DTV

1 720*480 31.469 / 31.5 59.94 / 60 27.027 SDTV 480P

2 720*576 31.25 50 54 SDTV 576P

3 1280*720 37.500 50 74.25 HDTV 720P

4 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P

5 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I

6 1920*1080 28.125 50.00 74.25 HDTV 1080I

7 1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 HDTV 1080P

8 1920*1080 33.716/ 33.75 29.976/30.00 74.25 HDTV 1080P

WUXGA (Reduced blanking)

FHD only(Support

to HDMI-PC)

FHD only(Support

to HDMI-PC)

9 1920*1080 56.250 50 148.5 HDTV 1080P

10 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P

Only for training and service purposes

- 8 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with LB4CA chassis.

2. Designation

(1) Th e ad justm ent is according to the ord er which is

designated and which must be followed, according to the

plan which can be changed only on agreeing. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25 °C ± 5 °C Relative humidity : 65 ± 10 % Input voltage : 100-220 V~, 50/60 Hz

(6) Adjustment equipments

: Color Analyzer(CA-210 or CA-110), Service remote control.

(7) Push the “IN STOP" key - For memory initialization.

Case1 : Software version up

1. After downloading S/W by USB , TV set will reboot automatically.

2. Push “In-stop” key.

3. Push “Power on” key.

4. Function inspection

5. After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push “In-stop” key at rst.

2. Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

3. After function inspection, Push “In-stop” key.

(4) Click "Connect" tab. If "Can't" is displayed, check connection

between computer, jig and set.

(2)

(3)

Please Check the Speed : To use speed between from 200KHz to 400KHz

(5) Click "Auto" tab and set as below. (6) Click "Run". (7) After downloading, check "OK" message.

(4)

filexxx.bin

(5)

(7)...........OK

(6)

3. Main PCB check process

▪ APC - After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program "Mstar ISP Utility" and then click

"Config" tab.

(2) Set as below, and then click "Auto Detect" and check "OK"

message. If "Error" is displayed, check connection between computer, jig, and set.

(3) Click "Read" tab, and then load download file(XXXX.bin)

by clicking "Read"

(1)

filexxx.bin

* USB DOWNLOAD(*.epk file download)

(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.

- If version of update file in USB Stick is lower, it will not work. But version of update file is higher, USB data will be detected automatically.

Only for training and service purposes

- 9 -

(3) Show the message "Copying files from memory".

(4) Updating is starting.

(5) Updating Completed, the TV will restart automatically. (6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If updated version is higher than what TV has, the TV can

lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ATV test on production line.

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number) * [Important] AU(Australia), TS(Malaysia) Suffix have to be

applied "Tool option 3 (AU,TS)" value because of Energy Saving Standard.

(4)Completed selecting Tool option.

* RS-232C Connection Method.

Connectio n : PCBA(USB Po rt) → USB to Seria l Adapter (UC-232A) → RS-232C cable → PC(RS-232C port)

● Product name of USB to Serial Adapter is UC-232A.

3.1. ADC Process

(1) ADC

- Enter Service Mode by pushing "ADJ" key,

- Enter Internal ADC mode by pushing "►" key at "8. ADC Calibration".

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option6

6. Commercial Tool Option

7. Country Group

8. Area Option

9. ADC Calibration ►

10. White Balance

11. 10 Point WB

12. Test Pattern

13. EDID D/L

14. Sub B/C

15. Ext. Input Adjust

16. SPK Lipsync Adjust

17. SPDIF Lipsync Adjust

ADC RGB

ADC Calibration

Start

Reset

<Caution> Using "P-ONLY" key of the Adjustment remote

control, power on TV.

If there is no Component Input, disappear “ADC Comp” message.

* ADC Calibration Protocol (RS232)

NO Item CMD 1 CMD 2 Data 0 Enter Adjust MODE

ADC adjust ADC Adjust A D 1 0

Adjust ‘Mode In’

A A 0 0

When transfer the ‘Mode In’, Carry the command. Automatically adjustment (The use of a internal pattern)

Adjust Sequence

▪ aa 00 00 [Enter Adjust Mode] ▪ xb 00 40 [Component1 Input (480i)] ▪ ad 00 10 [Adjust 480i Comp1] ▪ xb 00 60 [RGB Input (1024*768)] ▪ ad 00 10 [Adjust 1024*768 RGB] ▪ aa 00 90 End Adjust mode * Required equipment : Adjustment remote control.

3.2. Function Check

3.2.1. Check display and sound

■ Check Input and Signal items. (cf. work instructions)

1. TV

2. AV

3. COMPONENT (480i)

4. RGB (PC : 1024 x 768 @ 60hz)

5. HDMI

6. PC Audio In * Display and Sound check is executed by Remote controller

Caution : Not to push the INSTOP key after completion if the

function inspection.

Only for training and service purposes

- 10 -

<Caution> Not to push the "INSTOP" key after completion if

the function inspection.

4. Total Assembly line process

4.1. Adjustment Preparation

▪ W/B Equipment condition

CA210: CH14, Test signal: Inner pattern(80IRE)-LED Module

▪ Above 5 minutes H/run in the inner pattern. ("power on" key

of Adjustment remote control)

Mode Temp Coordinate spec

Cool 13,000 K

Medium 9,300 K

Warm 6,500 K

<Netcast5.0(L14, M14)> March ~ December & Global

- Model : (normal line)LGD

Aging time

NC5.0

(Min)

1 0-2 282 289 297 308 324 348

2 3-5 281 287 296 306 323 346

3 6-9 279 284 294 303 321 343

4 10-19 277 280 292 299 319 339

5 20-35 275 277 290 296 317 336

6 36-49 274 274 289 293 316 333

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

AUO, INX, Sharp, CSOT, BOE 13000 K

Cool Medium Warm

x y x y x y

spec 286 289 295 305 313 329

target 286 289 295 305 313 329

January ~ Feburary

- Model : (normal line) LGD

Aging time

GP4

(Min)

1 0-2 286 295 301 314 328 354

2 3-5 284 290 299 309 326 349

3 6-9 282 287 297 306 324 346

4 10-19 279 283 294 302 321 342

5 20-35 276 278 291 297 318 337

6 36-49 274 275 289 294 316 334

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

X=0.271 (±0.002) Y=0.270 (±0.002)

X=0.286 (±0.002) Y=0.289 (±0.002)

X=0.313 (±0.002) Y=0.329 (±0.002)

Cool Medium Warm

X y x y x y

271 270 286 289 313 329

<Test Signal> Inner pattern (204gray, 80IRE)

Module which cool spec is

Cool Medium Warm

X y x y x y

271 270 286 289 313 329

* Connecting picture of the measuring instrument

(On Automatic control) Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C P-ONLY → Enter the mode of White-Balance, the pattern will come out.

Full White Pattern

RS-232C Communication

CA-210

COLOR ANALYZER TYPE : CA-210

* Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (illumination is less than 10 lux).

(2) Adhere closely the Color analyzer(CA210) to the module

less than 10 cm distance, keep it with the surface of the Module and Color analyzer's prove vertically.(80° ~ 100°).

(3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.

- Using 'no signal' or 'POWER ONLY' or the others, check the back light on.

▪ Auto adjustment Map(using RS-232C to USB cable)

RS-232C COMMAND [CMD ID DATA] Wb 00 00 White Balance Start Wb 00 ff White Balance End

RS-232C COMMAND [CMD ID DATA]

MIN

Cool Mid Warm Cool Mid Warm R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192 R Cut 64 64 64 128 G Cut 64 64 64 128 B Cut 64 64 64 128

Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0.(When R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)

CENTER

(DEFAULT)

MAX

LGD TN

Module which cool spec is 9300 K

Cool Medium Warm

x y x y x y

spec 286 289 295 305 313 329

target 286 289 295 305 313 329

Only for training and service purposes

- 11 -

* Manual W/B process using adjust Remote control.

▪ After enter Service Mode by pushing "ADJ" key, ▪ Enter White Balance by pushing "►" key at "9. White

Balance".

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option6

6. Commercial Tool Option

7. Country Group

8. Area Option

9. ADC Calibration

10. White Balance ►

11. 10 Point WB

12. Test Pattern

13 EDID D/L

14. Sub B/C

15. Ext. Input Adjust

16. SPK Lipsync Adjust

17. SPDIF Lipsync Adjust

■ For manual adjustment, it is also possible by the following sequence.

(1) Set TV in Adj. mode using “P-ONLY” key on remote

controller and then operate heat run longer than 15 minutes.(If not executed this step, the condition for W/B

may be different.) (2) Push “Exit” key. (3) Enter White Balance mode by pushing the ADJ key and

select “9. White Balance” When KEY (►) is pressed, 206

Gray internal pattern will be displayed. (4) Zero Calibrate the probe of Color Analyzer, then place it

on the center of LCD module within 10 cm of the surface (5) Select each items (Red/Green/Blue Gain) using ▲/▼(CH

+/-) key on R/C.. (6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C. (7) Adjust three modes all (Cool / Medium / Warm)

- For All model w/o LS345 Fix the one of R/G/B gain and change the others

- For G-FIX model (TBD) Cool Mode

1) Fix the one of R/G/B gain to 192 (default data) and

decrease the others.(If G gain is adjusted over 172 and R and B gain less than 192 , Adjust is O.K.)

2) If G gain is less than 172, Increase G gain by up to

172, and then increase R gain and G gain same amount of increasing G gain.

3) If R gain or B gain is over 255, readjust G gain less

than 172, Conform to R gain is 255 or B gain is 255

Medium / Warm Mode - Fix the one of R/G/B gain to

192 (default data) and decrease the others.

(8) When adjustment is completed, exit adjustment mode

using EXIT key on R/C.

Whit Balance

Color Temp. ◄ ►

R-Gain

G-Gain

B-Gain

R-Cut

G-Cut

B-Cut

Test-Pattern

Backlight

Reset To Set

Cool

172

192

100

* CASE Cool

First adjust the coordinate far away from the target value(x, y). ① x, y > target

i) Decrease the R, G.

② x, y < target

i) First decrease the B gain, ii) Decrease the one of the others.

③ x > target, y < target

i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R

④ x < target, y > target

i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G

* After You finish all adjustments, Press “In-start” button and

compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.

If it is not same, then correct it same with BOM and unplug

AC cable. For correct it to the model’s module from factory JIG model. * Push The “IN STOP KEY” after completing the function

inspection.

4.2. DDC EDID Write (RGB 128Byte )

■ Connect D-sub Signal Cable to D-Sub Jack.

■ Write EDID DATA to EEPROM(24C02) by using DDC2B protocol.

■ Check whether written EDID data is correct or not.

* For Service main Assembly, EDID have to be downloaded to

Insert Process in advance.

4.3. DDC EDID Write (HDMI 256Byte)

■ Connect HDMI Signal Cable to HDMI Jack.

■ Write EDID DATA to EEPROM(24C02) by using DDC2B protocol.

■ Check whether written EDID data is correct or not.

* For Service main Assembly, EDID have to be downloaded to

Insert Process in advance.

4.4. EDID data

(1) All Data : HEXA Value (2) Changeable Data :

*: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***: Year : Controlled ****: Check sum

4.4.1. Auto Download

■ After enter Service Mode by pushing “ADJ” key,

■Enter EDID D/L mode.

■Enter “START” by pushing “OK” key.

* Caution : Never connect HDMI & D-sub Cable when EDID

downloaded.

EDID

HDMI1 NG

HDMI2 NG

HDMI3 NG

RGB NG

Start Reset

EDID

HDMI1 OK

HDMI2 OK

HDMI3 OK

RGB OK

Start Reset

Only for training and service purposes

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+ 25 hidden pages