LG 32LX30C, 32LX30C-ZA Service Manual

Printed in KoreaP/NO : MFL69275401 (1508-REV00)

CHASSIS : LD5CX

MODEL : 32LX30*C 32LX30*C-ZA

CAUTION

BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

LED TV

SERVICE MANUAL

North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

Internal Use Only

- 2 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ..............................................................10

BLOCK DIAGRAM ..................................................................................16

EXPLODED VIEW ...................................................................................17

SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX

TROUBLE SHOOTING GUIDE ................................................. APPENDIX

- 3 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

Always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

SAFETY PRECAUTIONS

- 4 -

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SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precau­tions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo­sion hazard.

2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam­age caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharg­ing wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.

2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads elec­trically shorted together by conductive foam, aluminum foil or
comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective mate­rial to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or cir­cuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropri­ate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo­nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 5 -

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close
as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remain­ing on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos­sible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed when­ever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec­tions).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. Carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con­nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

- 6 -

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SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used LD5CX
chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC specification

4. Model General Specification

No. Item Specication Remarks

1 Market EU/CIS

(PAL Market-37 Countries)

DTV & Analog (Total 37 countries)
DTV (MPEG2/4, DVB-T) :37 countries

UK/Italy/Germany/France/Spain/Sweden/Finland/Netherlands/
Belgium/Luxemburg/ Greece/Denmark/Czech/Austria /Hun­gary/Swiss/Croatia/TurkeyNorway/Slovenia/Poland/Ukraine/
Portugal/Ireland/Morocco/Latvia/Estonia/Lithania/Rumania/
Bulgaria/Russia/SlovakiaBosnia/Serbia/Albania/Kazakhstan/
Belarus

DTV (MPEG2/4, DVB-T2): 8 countries

UK/Denmark/Sweden/Finland/Norway/Ireland/Ukraine/Kaza­khstan

DTV (MPEG2/4, DVB-C): 37 countries

UK/Italy/Germany/France/Spain/Sweden/Finland/Netherlands/
Belgium/Luxemburg/ Greece/Denmark/Czech/Austria /Hun­gary/Swiss/Croatia/TurkeyNorway/Slovenia/Poland /Ukraine/
Portugal/Ireland/Morocco/Latvia/Estonia/Lithania/Rumania/
Bulgaria/Russia/SlovakiaBosnia/Serbia/Albania/Kazakhstan/
Belarus

DTV (MPEG2/4,DVB-S): 29 countries

Italy/Germany/France/Spain/Netherlands/ Belgium/Luxemburg/
Greece/Czech/Austria /Hungary/Swiss/Croatia/Turkey/Slove­nia/Poland/Portugal/ Morocco/Latvia/Estonia/Lithania/Rumania/
Bulgaria/Russia/Slovakia/Bosnia/Serbia/Albania/Belarus

Supported satellite : 22 satellites

HISPASAT 1C/1D, ATLANTIC BIRD 2, NILESAT 101/102,
ATLANTIC BIRD 3, AMOS 2/3, THOR 5/6, IRIUS 4, EUTEL­SAT-W3A, EUROBIRD 9A, EUTELSAT-W2A, HOTBIRD 6/8/9,
EUTELSAT-SESAT, ASTRA 1L/H/M/KR, ASTRA 3A/3B, BADR
4/6, ASTRA 2D, EUROBIRD 3, EUTELSAT-W7, HELLASSAT
2, EXPRESS AM1, TURKSAT 2A/3A, INTERSAT10

- 7 -

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No. Item Specication Remarks

2 Broadcasting system

Analogue TV

1) PAL-B/G/D/K/I

2) SECAM-B/G/D/K/I
SECAM L/L’
Digital TV

1) DVB-T

2) DVB-C
Satellite Digital TV

1) DVB-T/T2

2) DVB-C

3) DVB-S/S2

Analogue TV : (RF) VHF: E2 to E12, UHF : E21 to E69
(CATV) S1 to S20, HYPER: S21 to S47

Digital TV : VHF, UHF

Satellite TV : VHF, UHF,
C-Band, Ku-Band

3 Receiving system

Analog : Upper Heterodyne
Digital : COFDM, QAM

► DVB-T

- Guard Interval(Bitrate_Mbit/s) : 1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

► DVB-T2

- Guard Interval(Bitrate_Mbit/s)
: 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256

- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

► DVB-C

- Symbolrate : 4.0Msymbols/s to 7.2Msymbols/s

- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM

► DVB-S

- symbol rate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s

- viterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10

4 Scart Jack (1EA) PAL, SECAM

Scart 1 Jack is Full Scart and support RF-OUT (analog),
EU only

5

Component & AV
Common port (1EA)

Video Input RCA (PAL, SECAM, NTSC) 4 System : PAL, SECAM, NTSC, PAL60

Component Input(Y/Cb/Cr, Y/Pb/Pr)

6 HDMI Input (1EA) HDMI-DTV Support HDCP

7 Audio Input (1EA) Component & AV Component & AV’s audio input is used by common port.

8 USB (1EA)

EMF, DivX HD,
For SVC (download)

JPEG, MP3, DivX HD

9 DVB

DVB-T

CI : UK, Finland, Denmark, Norway, Sweden, Russia, Spain,
Ireland, Luxemburg, Belgium, Netherland
CI+ : France(Canal+), Italy(DGTVi)

DVB-C

CI : Switzerland, Austria, Slovenia, Hungary, Bulgaria
CI+ : Switzerland(UPC,Cablecom), Netherland(Ziggo),
Germany(KDG,CWB), Finland(labwise)

DVB-S CI + : Germany (Astra HD+)

10 Earphone Out (1EA)

Antenna, AV,Component,
HDMI1, USB

- 8 -

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5. External Input Support format

5.1. Video resolutions (2D)

5.1.1. Component input(Y, CB/PB, CR/PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1 720*576 15.625 50.00 13.5 SDTV ,DVD 576I

2

720*480 15.73 60.00 13.5135 SDTV ,DVD 480I

3 720*480 15.73 59.94 13.50 SDTV ,DVD 480I

4 720*576 31.25 50.00 27.00 SDTV 576P

5 720*480 31.50 60.00 27.027 SDTV 480P

6 720*480 31.47 59.94 27.00 SDTV 480P

7 1280*720 37.50 50.00 74.25 HDTV 720P

8 1280*720 45.00 60.00 74.25 HDTV 720P

9 1280*720 44.96 59.94 74.176 HDTV 720P

10 1920*1080 28.125 50.00 74.25 HDTV 1080I

11 1920*1080 33.75 60.00 74.25 HDTV 1080I

12 1920*1080 33.72 59.94 74.176 HDTV 1080I

13 1920*1080 56.25 50.00 148.50 HDTV 1080P

14 1920*1080 67.50 60.00 148.50 HDTV 1080P

15 1920*1080 67.432 59.94 148.352 HDTV 1080P

16 1920*1080 27.00 24.00 74.25 HDTV 1080P

17 1920*1080 26.97 23.94 74.176 HDTV 1080P

18 1920*1080 33.75 30.00 74.25 HDTV 1080P

19 1920*1080 33.71 29.97 74.176 HDTV 1080P

- 9 -

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5.1.2. HDMI Input(PC/DTV)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

PC(DVI) DDC

1 640*350 31.46 70.09 25.17 EGA X

2 720*400 31.46 70.08 28.32 DOS O

3 640*480 31.46 59.94 25.17 VESA(VGA) O

4 800*600 37.87 60.31 40.00 VESA(SVGA) O

5 1024*768 48.36 60.00 65.00 VESA(XGA) O

6 1152*864 54.34 60.05 80.00 VESA O

7 1360*768 47.71 60.01 85.50 VESA (WXGA) O

8 1280*1024 63.98 60.02 108.0 VESA (SXGA) O FHD only

9 1920*1080 67.50 60.00 148.5 HDTV 1080P O FHD only

DTV

1 640*480 31.46 59.94 25.125 SDTV 480P

2 640*480 31.50 60.00 25.125 SDTV 480P

3 720*480 15.73 59.94 13.500 SDTV 480I

Don’t insert in manual

spec. out

4 720*480 15.75 60.00 13.514 SDTV 480I

5 720*576 15.62 50.00 13.500 SDTV 576I(DVB)

6 720*480 31.47 59.94 27.00 SDTV 480P

7 720*480 31.50 60.00 27.027 SDTV 480P

8 720*576 31.25 50.00 27.00 SDTV 576P(DVB)

9 1280*720 37.50 50.00 74.25 HDTV 720P(DVB)

10 1280*720 45.00 60.00 74.25 HDTV 720P

11 1280*720 44.96 59.94 74.176 HDTV 720P

12 1920*1080 28.12 50.00 74.25 HDTV 1080I(DVB)

13 1920*1080 33.75 60.00 74.25 HDTV 1080I

14 1920*1080 33.72 59.94 74.176 HDTV 1080I

15 1920*1080 56.25 50.00 148.50 HDTV 1080P(DVB)

16 1920*1080 67.50 60.00 148.50 HDTV 1080P

17 1920*1080 67.43 59.94 148.35 HDTV 1080P

18 1920*1080 27.00 24.00 74.25 HDTV 1080P

19 1920*1080 26.97 23.97 74.175 HDTV 1080P

20 1920*1080 33.75 30.00 74.25 HDTV 1080P

21 1920*1080 33.71 29.97 74.175 HDTV 1080P

- 10 -

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ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with
LD5CX chassis.

2. Designation

(1) The adjustment is according to the order which is designated

and which must be followed, according to the plan

which

can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation : Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 220 V, 60 Hz
(6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),

DDC Adjustment Jig, Service remote control.

(7) Push the "IN STOP" key - For memory initialization.

3. Main PCB check process

▪ APC - After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program "Mstar ISP Utility" and then click

"Config" tab.
(2) Set as below, and then click "Auto Detect" and check "OK"

message.

If "Error" is displayed, check connection between computer,
jig, and set.

(3) Click "Read" tab, and then load download file(XXXX.bin)

by clicking "Read".

(4) Click "Connect" tab. If "Can't" is displayed, check connection

between computer, jig, and set.

(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.

* USB DOWNLOAD (*.epk file download)

(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.

- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting.

(3) Show the message "UPDATING".

(4) Updating is starting.

(5) Updating Completed, The TV will restart automatically in 5

seconds.

(6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If downloading version is more high than your TV have, TV

can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a DTV/
ATV test on production line.

(1)

filexxx.bin

(4)

(5)

(6)

(7)...........OK

filexxx.bin

(2)

(3)

Please Check the Speed :
To use speed between
from 200KHz to 400KHz

Case1 : Software version up

1. After downloading S/W by USB , TV set will reboot
automatically.

2. Push “In-stop” key.

3. Push “Power on” key.

4. Function inspection

5. After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push

“In-stop” key at rst.

2. Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

3. After function inspection, Push “In-stop” key.

- 11 -

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* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control.
(2) Select "Adjust Check" and push "OK" key.
(3) Punch in the number. (Each of model has their number)
(4) Completed selecting Tool option.

3.1. ADC Process(Optional)

* If ADC processes as OTP, There is no need to proceed

internal ADC.

(1) Enter Service Mode by pushing "ADJ" key,

(2) Enter Internal ADC mode by pushing "►" key at "8. ADC

Calibration".

<Caution> Using "P-ONLY" key of the Adjustment remote

control, power on TV.

* ADC Calibration Protocol (RS232)

Adjust Sequence

▪ aa 00 00 [Enter Adjust Mode]
▪ xb 00 40 [Component Input]
▪ ad 00 10 [Adjust 480i & 1080p Comp]
▪ aa 00 90 End Adjust mode

* Required equipment : Adjustment R/C.

3.2. EDID Download

▪ After enter Service Mode by pushing "ADJ" key.
▪ Enter EDID D/L menu.
▪ Enter "START" by pushing "OK" key.

<Caution> Never connect HDMI cable when EDID downloaded.

3.3. EDID data

(1) HDMI

1) HD HDMI EDID data (2D Model)

2) FHD HDMI EDID data (2D Model)

NO Item CMD 1 CMD 2 Data 0

Enter Adjust
MODE

Adjust
‘Mode In’

A A 0 0

When transfer the ‘Mode In’,
Carry the command.

ADC adjust

ADC
Adjust

A D 1 0

Automatically adjustment
(The use of a internal pattern)

0 1 2 3 4 5 6 7 8 9 A B C D E F
00 00 FF FF FF FF FF FF 00 1E 6D a b
10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26
20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 01 01
30 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70
40 36 00 40 84 63 00 00 1E 64 19 00 40 41 00 26 30
50 18 88 36 00 40 84 63 00 00 18 00 00 00 FD 00 3A
60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d
70 d 01 e
80 02 03 22 F1 4E 10 1F 04 93 05 14 03 02 12 20 21
90 22 15 01 26 15 07 50 09 57 07 f
A0 f 01 1D 80 18 71 1C 16 20 58 2C 25 00 A0 5A
B0 00 00 00 9E 01 1D 00 72 51 D0 1E 20 6E 28 55 00
C0 20 C2 31 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E
D0 96 00 A0 5A 00 00 00 18 02 3A 80 18 71 38 2D 40
E0 58 2C 45 00 A0 5A 00 00 00 1E 00 00 00 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

0 1 2 3 4 5 6 7 8 9 A B C D E F
00 00 FF FF FF FF FF FF 00 1E 6D a b
10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26
20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80
30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 A0 5A 00 00 00 1E 66 21 50 B0 51 00 1B 30
50 40 70 36 00 A0 5A 00 00 00 1E 00 00 00 FD 00 3A
60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d
70 d 01 e
80 02 03 22 F1 4E 10 9F 04 13 05 14 03 02 12 20 21
90 22 15 01 26 15 07 50 09 57 07 f
A0 f 01 1D 80 18 71 1C 16 20 58 2C 25 00 20 C2
B0 31 00 00 9E 01 1D 00 72 51 D0 1E 20 6E 28 55 00
C0 20 C2 31 00 00 1E 02 3A 80 18 71 38 2D 40 58 2C
D0 45 00 A0 5A 00 00 00 1E 01 1D 00 BC 52 D0 1E 20
E0 B8 28 55 40 C4 8E 21 00 00 1E 00 00 00 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

- 12 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

- Detail EDID Options are below
a. Product ID

b. Serial No: Controlled on production line.
c. Month, Year: Week : '01' -> '01', Year : '2015' -> '19' fix
d. Model Name(Hex): Refer to the ASCII Code Table
cf) TV set’s model name in EDID data is below.

e. Checksum: Changeable by total EDID data.

- 2D Model

f. Vendor Specific

- 2D Model (HD/FHD)

3.4. Function Check

- Check display and sound

■ Check Input and Signal items.(cf. work instructions)

1) TV

2) AV (SCART / CVBS)

3) COMPONENT (480i)

4) HDMI
* Display and Sound check is executed by Remote control.

<Caution>
Not to push the INSTOP key after completion if the function
inspection.

4. Total Assembly line process

4.1. White Balance adjustment

▪ W/B Equipment condition

CA210 : LED -> CH14, Test signal: Inner pattern(80IRE)

▪ Above 5 minutes H/run in the inner pattern. (“power on” key

of adjust remote control)

▪ If it is executed W/B adjustment in 2~3 minutes H/run, it is

adjusted by Target data.

▪ W/B information

* Connecting picture of the measuring instrument

(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to

auto controller or push Adjustment R/C P-ONLY → Enter the

mode of White-Balance, the pattern will come out.

MODEL NAME HEX EDID Table DDC Function

HD/FHD Model 0001 01 00 Analog/Digital

Model name MODEL NAME(HEX)

LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)

EDID C/S data

HD FHD

HDMI HDMI

Check sum

(Hex)

Block 0 74 40
Block 1 5B (HDMI) 25 (HDMI)

Mode Temp Coordinate spec Target

Chassis

or Model

Color
Tempera­ture

Cool 13,000K

X=0.271(±0.002)
Y=0.270 (±0.002)

X=0.278
Y=0.280

ALL Model

Me­dium

9,300K

X=0.286 (±0.002)
Y=0.289 (±0.002)

X=0.293
Y=0.299

Warm 6,500K

X=0.313 (±0.002)
Y=0.329 (±0.002)

X=0.320
Y=0.339

Lumi­nance
(cd/m^2)

Min 60

cool med warm

x y x y x y

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

INPUT MODEL NAME(HEX)

HDMI1 67 03 0C 00 10 00 80 1E

Model information W/B information

Chassis

or Model

Module Panel

Backlight

Type

Using W/B table

LD5CX All All Direct LED O

Full White Pattern

CA-210

COLOR
ANALYZER
TYPE : CA-210

RS-232C Communication

- 13 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

* Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (Illumination is less than 10ux).

(2) Adhere closely the Color analyzer(CA210) to the module

less than 10 cm distance, keep it with the surface of the
Module and Color analyzer's prove vertically.(90° +/-

2.5°).

(3) Aging time

- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.

- Using 'no signal' or 'POWER ONLY' or the others, check
the back light on.

▪ Auto adjustment Map(using RS-232C to USB cable)

RS-232C COMMAND

[CMD ID DATA]

Wb 00 00 White Balance Start
Wb 00 ff White Balance End

<Caution>

Color Temperature : Cool, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)

* Manual W/B process using adjust Remote control.

▪ After enter Service Mode by pushing "ADJ" key,
▪ Enter White Balance by pushing "►" key at "10. White

Balance".

* CASE Cool Mode

First adjust the coordinate far away from the target
value(x, y).B.

1) x, y > target

2) x, y < target

3) x >target, y < target

4) x < target, y > target

- Every 4 case have to fit y value by adjusting B Gain
and then fit x value by adjusting R-Gain.

- In this case, increasing/decreasing of B Gain and R
Gain can be adjusted.

How to adjust

1) In case G gain more than 172

Adjust R Gain and B Gain less than 192

2) If the G gain value be adjusted down to 172

One of the R/B Gain is 254

3) If G Gain is 172 , More than one of R/B Gain is to be

between 192~254

* CASE Medium / Warm

First adjust the coordinate far away from the target
value(x, y).

1) x, y > target

i) Decrease the R, G.

2) x, y < target

i) First decrease the B gain,
ii) Decrease the one of the others.

3) x > target, y < target

i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R

4) x < target, y > target

i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G

* After you finished all adjustments, Press "In-start" key and

compare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is not
same, then correct it same with BOM and unplug AC cable.
For correct it to the model's module from factory Jig model.

* Push the "IN STOP" key after completing the function

inspection. And Mechanical Power Switch must be set
“ON”.

RS-232C COMMAND

[CMD ID DATA]

MIN

CENTER

(DEFAULT)

MAX

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 254

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 254

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

- 14 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

4.2. Outgoing condition Configuration

■ When pressing IN-STOP key by SVC remote control, Red

LED are blinked alternatively. And then automatically turn
off. (Must not AC power OFF during blinking)

5. GND and HI-POT Test

5.1. HI-POT auto-check preparation

- Check the POWER cable and SIGNAL cable insertion condition

5.2. HI-POT auto-check

(1) Pallet moves in the station.
(POWER CORD / AV CORD is tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next
process automatically.

5.3. Checkpoint

(1) Test voltage

- Touchable Metal : 3 KV / min at 100 mA

- SIGNAL : 3KV / min at 100 mA

(2) TEST time: 1 second. (case : mass production )
(3) TEST POINT

- Touchable Metal => LIVE & NEUTRAL : Touchable Metal.

- SIGNAL => LIVE & NEUTRAL : SIGNAL.

6. Model name & Serial number D/L

▪ Press "Power on" key of service remote control.

(Baud rate : 115200 bps)

▪ Connect RS232 Signal Cable to USB Jack.
▪ Write Serial number
▪ Must check the serial number at the Diagnostics of SET UP menu.

(Refer to below).

6.1. Signal Table

CMD : A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 +...+ Data_n
Delay : 20ms

6.2. Command Set

* Description

FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write : Model Name and Serial Number write in EEPROM,.

6.3. Method & notice

(1) Serial number D/L is using of scan equipment.
(2) Setting of scan equipment operated by Manufacturing

Technology Group.

(3) Serial number D/L must be conformed when it is produced in

production line, because serial number D/L is mandatory by
D-book 4.0.

* Manual Download(Model Name and Serial Number)

If the TV set is downloaded by OTA or Service man, sometimes
model name or serial number is initialized.(Not always)
There is impossible to download by bar code scan, so It need
Manual download.

1) Press the "Instart" key of Adjustment remote control.

2) Go to the menu "7.Model Number D/L" like below photo.

3) Input the Factory model name or Serial number like photo.

4) Check the model name Instart menu.

→ Factory name displayed.

5) Check the Diagnostics.(DTV country only)

→ Buyer model displayed.

CMD LENGTH ADH ADL DATA_1 . . . Data_n CS DELAY

No. Adjust mode CMD(hex) LENGTH(hex) Description

1

EEPROM

WRITE

A0h 84h+n n-bytes Write (n = 1~16)

- 15 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

7. CI+ key download

7.1. Download method

7.1.1. Communication Prot connection

Connection: PCBA(USB Port) → USB to Serial Adapter(UC-

232A) → RS-232C cable → PC(RS-232C port)

* Caution: LJ21* chassis support only UC-232A driver.
(only use this one.)

(2) CI+ Key Download

▪ Set CI+ Key path Directory at Start Mac & CI+ Download

Programme

▪ Com 1,2,3,4 and 115200(Baudrate)

▪ Port connection button click(1)
▪ Start CI+ Key Download, Push the (4)
▪ Check the OK or NG (5)

GP4_LOW

- 16 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

BLOCK DIAGRAM

- 17 -

LGE Internal Use Only

Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes

800

900

910

500

540

120

400

200

A2

A10

Set + Stand

LV1

701

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

THERMAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

POWER

150112

4

L15.5_ECI_M1A

Q403
MMBT3904(NXP)

TR_NXP

E

B

C

PANEL_VCC

R442
10K

Q404
MMBT3904(NXP)

TR_NXP

E

B

C

R441

10K

+3.5V_ST

R448

2.2K

R444
10K

+12V

L410

BLM18PG121SN1D

POWER_ON/OFF_1

+3.3V_Normal

C429

0.1uF
16V

PANEL_CTL

C425

0.1uF
25V

OPT

R451

5.6K

R452

5.6K

C430
22uF
10V

C428

2.2uF
10V

ZD402

5V

TVS_SEMTECH

L408

UBW2012-121F

120OHM

L409

BLM18PG121SN1D

+3.3V_Normal

L411

CB2012PK501T

10uF

C426

10V

+1.5V_DDR

10uF

C431

10V

ZD403

2.5V

BRAZIL_ESD

R447
22K

R449
1K
1/16W
1%

R450
200
1/16W
1%

IC404

AZ1117EH-ADJTRG1

ADJ/GND

OUTIN

R453

0

Q405

SSM3J332R

S

G

D

Q406
SSM3J332R

FET_TOSHIBA

S

G

D

C423
22uF
16V

C432
1uF
16V

C403

4700pF

50V

OPT

+5V_Normal

+5V_USB

USB1_CTL

USB1_OCD

R422
15K

C418

47pF
50V

+5V_Normal

ZD401

2.5V

+1.10V_VDDC

C408

2200pF

50V

OPT

C417

3300pF

50V

C405
10uF
25V

C421

0.047uF
25V

L404

CB2012PK501T

C409

2200pF

50V

OPT

C416

22pF

50V

C411
82pF
50V

OPT

C424
22uF
16V

+12V

R403

10K

C419 22pF

50V

C412
10uF

6.3V

C406
10uF
25V

C410

0.047uF
25V

+3.3V_Normal

C420

3300pF

50V

R408
100K

C407
1uF
10V

R409

91K

+5V_Normal

ZD402-*1

TVS_KEC

Q403-*1
2N3904S

TR_KEC

E

B

C

Q404-*1
2N3904S

TR_KEC

E

B

C

R418

20K

R414

10K

C413
22uF

10V

C414
22uF

10V

ZD407

5.1v

OPT

R445

33K

R446
120K

Q406-*1

AO3435

FET_AOS

G

D

S

C427

0.22uF
25V

R411

4.7K
1%

R413

5.1K
1%

SN1406035RGER

IC400

1

SS2

3

EN2

7

SW_OUT

9

VIN2

10

PGND2

11

LX2

12

BST2

13

COMP2

14

FB2

15

RSET

16

AGND

17

FB1

18

COMP1

19

BST120LX121PGND122VIN123V7V24SS1

5

SW_EN

8

SW_IN

6

NFAULT

4

ROSC/SYNC

2

EN1

25

[EP]

R417

39K

1%

R416

5.1K
1%

R472

3.3K

USB1_CTL_Pull_Down

R473
30K

OPT

+19V

+19V

R479
20K

R475
68

+3.5V_ST

IC402

MP2315GJ

3

SW

2

IN

4

GND

1

AAM

5

BST

6

EN/SYNC

7

VCC

8

FB

C470
10uF
25V

C475

0.1uF
50V

C474

0.1uF
25V

C472

0.1uF
25V

C473
10uF

25V

C480
10uF

16V

C479

0.1uF
25V

C483

0.1uF
25V

JK400

KJA-DC-1-0032

1

1

2

2

4

4

C482
10uF

10V

C481
10uF

16V

C485

0.1uF
25V

D470

5V

C477

0.47uF
16V

OPT

C478

0.1uF
25V

C484
10uF

10V

POWER_ON/OFF_1

IC403

MP2315GJ

3

SW

2

IN

4

GND

1

AAM

5

BST

6

EN/SYNC

7

VCC

8

FB

R477
68

C471
68uF
35V

R471
47K

R478
100K

ZD405

15V

OPT

C476

0.1uF
50V

BOOST_EN

C486
10uF

16V

C487
22uF
10V

RL_ON

+3.5V_ST

R490

10K

OPT

R489
10K

OPT

R476
47K

OPT

R480
10K

R443

4.7K

+3.5V_ST

C400

0.1uF
16V

R410

10K

POWER_DET

L405

4.7uH

L406

4.7uH

L471

4.7uH
D471
20V

Surge Protection

R485
56K

R486

2K
1%

R487

1.2K
1%

R488

1K
1%

R481
56K

R482

11K

1%

R483

3.3K
1%

R484

1K

1%

R470
100K

L470

4.7uH

C488
68uF
35V

C489
22uF
10V

ZD408

5V

OPT
C490
1uF
10V

OPT

R415

100

1%

+12V

C491
470pF
50V

R491

5.1

R492

51K

R493

33K

C492

2.2uF
25V

Q407
SSM3J332R

S

G

D

L472

CIS21J121

OPT

BOOST_EN

+12V to PANEL_VCC

+3.5V_ST to +3.3V_Normal

+3.5V_Normal to +1.5V_DDR

FROM ADAPTOR 19V

POWER

R2

R1

1.3A

Vout=1.25*(1+R2/R1)+Iadj*R2

+19V to +3.5V_STANDBY

Vout=0.6(R1/R2)+0.6

+5V_Normal & +1.10V_VDDC

R2

R1

Vout=0.6(R1/R2)+0.6

R1

R2

Check the pull down
when AC Power On with HDD

3A

2013.08.07

5.6B->5V
READY->APPLY

To improve CST Issue

2013.12.21 by GH.Song

20130528 cJ.LIM

19V TO PANEL VCC(12V) DCDC CONVERTER

20130528 cJ.LIM

3A

NEW

NEW

X5R => X7R

3.5V_ST POWER_DET

Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

THERMAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LED_DRIVER

150112L15.5_ECI_M1A

5

R530
100K

OPT

R521
100

R525
270K

1/8W
1%

R545

220K

1%

R551

0.1

1W

1%

R543

1.5K
1%

R542
39K
1%

R546

1.5K1%

R540
100

C501
10uF
25V

R548

30K

1%

R544

3.3

1/16W

R539
100

L501

33uH

R522
120K

1/8W
1%

C529

0.1uF
25V

+19V

C523
220pF

100V

C525 1uF

25V

C522
1000pF
50V

R523
3K

INV_CTL

C526
220pF

100V

OPT

+3.3V_Normal

R550
100

PWM_DIM

IC501

DT1641AS

3

NC_1

2

OVP

4

PGND_1

1

EN

6

PDIM

5

PGND_2

7

RISET

8

LS8

9

LS7

10

LS6

11

LS5

12

NC_2

13

LGND

14

LS4

15

LS3

16

LS2

17

LS1

18

RT

19

COMP

20

RSS

21

NDRV

22

CS

23

VREF

24

VIN

25

[EP]GND

R535
100

R534
10K

R536
100

BLU_CURRENT_CTL

R549
100

C502

0.1uF
50V
OPT

R519
10K

OPT

R537
100

R547
100

R531

100K

1%

R528
1K

1%

+19V

ZD500
33V

R541
100

C518
100pF
50V

R520

10K

C521
1000pF
50V

R538
100

R524
100K

C500
47uF
25V

L502
33uH

C528

4700pF

50V

TR501
MMBT3904(NXP)

E

B

C

P500

SMAW200-04

1

2

3

4

C519
1uF
100V
43inch

C516
33uF

100V

Single_43inch

C517
33uF

100V

R532
15K

1%

32inch

R533

3.6K
1%

32inch

R529
30K
1%

32inch

R529-*1
13K
1%

43inch

R532-*1
12K
1%

43inch

R533-*1
10K
1%

43inch

C510
1uF
25V

D502

100V

BR210

R552
100K

TR502
AOD478

S

D

G

C520
1uF
100V

OPT

C519-*1

4.7uF
50V

32inch

R5530R554

0

C530
1uF
100V
43inch

C530-*1
0

32inch

TOTAL LED DRIVER BLOCK

VOUT#2

REDUCE INDUCTOR TEMP ISSUE

To Improve EMI Issue

Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

150112

USB_S1

7

L15.5_ECI_M1A

D700
RCLAMP0502BA

OPT

SIDE_USB1_DM

SIDE_USB1_DP

C700
22uF

10V

USB_HDD_CAP1_22uF

ZD700

5V

OPT

SD05

C701

5pF
50V

OPT

C702

5pF
50V

OPT

C703
22uF
10V

USB_HDD_CAP2_22uF

+5V_USB

C700-*1

10uF
10V

USB_HDD_CAP1_10uF

C703-*1

10uF
10V

USB_HDD_CAP2_10uF

R700

2.2

R701

2.2

JK700

US-04A-VSD

1

2

3

4

5

C704
22uF
10V

OPT

USB

Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

150123

HDMI_R1 9

L15.5_ECI_M1A

D2+_HDMI4

VA805

ESD_HDMI_VARISTAR

HDMI_CEC

HPD4

R804
100

D0+_HDMI4

VA811

ESD_HDMI

VA808

ESD_HDMI

D801

KDS184

HDMI_DIODE_KEC

A2CA1

VA806

ESD_HDMI_VARISTAR

D0-_HDMI4

D1-_HDMI4

R812

1.8K

DDC_SDA_4

VA809

ESD_HDMI

DDC_SDA_4

CK-_HDMI4

CEC_REMOTE_S7

D1+_HDMI4

5V_DET_HDMI_4

R814

33

DDC_SCL_4

DDC_SCL_4

R807

2.7K

R813

3.3K

D805

IP4294CZ10-TBR

ESD_HDMI_TMDS

1

8

2

7

3

6

4
5

9

10

5V_HDMI_4

D801-*1
MMBD6100

HDMI_DIODE_SUZHOU

A2CA1

D806

IP4294CZ10-TBR

ESD_HDMI_TMDS

1

8

2

7

3

6

4
5

9

10

D2-_HDMI4

HDMI_CEC

+5V_Normal

CK+_HDMI4

VA810

ESD_HDMI

AR803

5.1

5V_HDMI_4

R806

2.7K

HDMI_ARC

JK801

EAG59023302

14

NC

13

CE_REMOTE

5

D1_GND

20

GND

12

CK-

11

CK_GND

2

D2_GND

19

HP_DET

18

5V

10

CK+

4

D1+

1

D2+

17

GND

9

D0-

8

D0_GND

3

D2-

16

DDC_DATA

7

D0+

6

D1-

15

DDC_CLK

AR804

5.1

AR801
100

VA805-*1
1uF
10V

ESD_HDMI_CAP

VA806-*1
1uF
10V

ESD_HDMI_CAP

HDMI_ARC

HDMI jack burnt problem improvement

This GND Pattern should be very narrow







HDMI (REAR 1)

HDMI_1

CEC

Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

MAIN3_DDR

2014/06/13

12

L14_CA_M1A

A-MA13
A-MA14

A-MA7

A-MA10

A-MA1

A-MA8

A-MA3

A-MA0

A-MA4

A-MA6

A-MA11

A-MA9

A-MA5

A-MA2

A-MA12

A-MBA0
A-MBA1
A-MBA2

A-MCKE

A-MCK

A-MCKB

A-MCASB

A-MWEB

A-MRASB

A-MODT

A-MRESETB

A-MDMU

A-MDML

A-MDQSU

A-MDQSUB

A-MDQSL

A-MDQSLB

A-MDQL4

A-MDQL0

A-MDQL3

A-MDQL7

A-MDQL5

A-MDQL2

A-MDQL6

A-MDQL1

A-MDQU1

A-MDQU3

A-MDQU0

A-MDQU4
A-MDQU5

A-MDQU2

A-MDQU6
A-MDQU7

R1109

240

1%

A/B_DDR3_CS

IC101-*1

LGE2133(128M)

M1A_128M_UO4

B_DDR3_A[0]

E11

B_DDR3_A[1]

F12

B_DDR3_A[2]

D10

B_DDR3_A[3]

B10

B_DDR3_A[4]

E15

B_DDR3_A[5]

B11

B_DDR3_A[6]

F14

B_DDR3_A[7]

C11

B_DDR3_A[8]

D14

B_DDR3_A[9]

A12

B_DDR3_A[10]

F16

B_DDR3_A[11]

D13

B_DDR3_A[12]

D15

B_DDR3_A[13]

C12

B_DDR3_A[14]

E13

B_DDR3_BA[0]

A9

B_DDR3_BA[1]

D16

B_DDR3_BA[2]

A10

B_DDR3_MCLK

C13

B_DDR3_MCLKZ

B13

B_DDR3_MCLKE

E17

B_DDR3_ODT

B8

B_DDR3_RASZ

C8

B_DDR3_CASZ

B9

B_DDR3_WEZ

D11

B_RESET

F10

B_DDR3_CS0

D12

B_DDR3_DQSL

A19

B_DDR3_DQSU

B18

B_DDR3_DQML

C16

B_DDR3_DQMU

D21

B_DDR3_DQSBL

C18

B_DDR3_DQSBU

C17

B_DDR3_DQL[0]

A20

B_DDR3_DQL[1]

A16

B_DDR3_DQL[2]

C19

B_DDR3_DQL[3]

C15

B_DDR3_DQL[4]

C20

B_DDR3_DQL[5]

C14

B_DDR3_DQL[6]

B21

B_DDR3_DQL[7]

B15

B_DDR3_DQU[0]

F18

B_DDR3_DQU[1]

D19

B_DDR3_DQU[2]

D17

B_DDR3_DQU[3]

E21

B_DDR3_DQU[4]

E19

B_DDR3_DQU[5]

D20

B_DDR3_DQU[6]

D18

B_DDR3_DQU[7]

F20

ZQ

E9

IC101

LGE2134(256M)

M1A_256M_UO4

B_DDR3_A[0]

E11

B_DDR3_A[1]

F12

B_DDR3_A[2]

D10

B_DDR3_A[3]

B10

B_DDR3_A[4]

E15

B_DDR3_A[5]

B11

B_DDR3_A[6]

F14

B_DDR3_A[7]

C11

B_DDR3_A[8]

D14

B_DDR3_A[9]

A12

B_DDR3_A[10]

F16

B_DDR3_A[11]

D13

B_DDR3_A[12]

D15

B_DDR3_A[13]

C12

B_DDR3_A[14]

E13

B_DDR3_BA[0]

A9

B_DDR3_BA[1]

D16

B_DDR3_BA[2]

A10

B_DDR3_MCLK

C13

B_DDR3_MCLKZ

B13

B_DDR3_MCLKE

E17

B_DDR3_ODT

B8

B_DDR3_RASZ

C8

B_DDR3_CASZ

B9

B_DDR3_WEZ

D11

B_RESET

F10

B_DDR3_CS0

D12

B_DDR3_DQSL

A19

B_DDR3_DQSU

B18

B_DDR3_DQML

C16

B_DDR3_DQMU

D21

B_DDR3_DQSBL

C18

B_DDR3_DQSBU

C17

B_DDR3_DQL[0]

A20

B_DDR3_DQL[1]

A16

B_DDR3_DQL[2]

C19

B_DDR3_DQL[3]

C15

B_DDR3_DQL[4]

C20

B_DDR3_DQL[5]

C14

B_DDR3_DQL[6]

B21

B_DDR3_DQL[7]

B15

B_DDR3_DQU[0]

F18

B_DDR3_DQU[1]

D19

B_DDR3_DQU[2]

D17

B_DDR3_DQU[3]

E21

B_DDR3_DQU[4]

E19

B_DDR3_DQU[5]

D20

B_DDR3_DQU[6]

D18

B_DDR3_DQU[7]

F20

ZQ

E9

IC101-*2

LGE2136(256M)

M1A_256M_AVS+

B_DDR3_A[0]

E11

B_DDR3_A[1]

F12

B_DDR3_A[2]

D10

B_DDR3_A[3]

B10

B_DDR3_A[4]

E15

B_DDR3_A[5]

B11

B_DDR3_A[6]

F14

B_DDR3_A[7]

C11

B_DDR3_A[8]

D14

B_DDR3_A[9]

A12

B_DDR3_A[10]

F16

B_DDR3_A[11]

D13

B_DDR3_A[12]

D15

B_DDR3_A[13]

C12

B_DDR3_A[14]

E13

B_DDR3_BA[0]

A9

B_DDR3_BA[1]

D16

B_DDR3_BA[2]

A10

B_DDR3_MCLK

C13

B_DDR3_MCLKZ

B13

B_DDR3_MCLKE

E17

B_DDR3_ODT

B8

B_DDR3_RASZ

C8

B_DDR3_CASZ

B9

B_DDR3_WEZ

D11

B_RESET

F10

B_DDR3_CS0

D12

B_DDR3_DQSL

A19

B_DDR3_DQSU

B18

B_DDR3_DQML

C16

B_DDR3_DQMU

D21

B_DDR3_DQSBL

C18

B_DDR3_DQSBU

C17

B_DDR3_DQL[0]

A20

B_DDR3_DQL[1]

A16

B_DDR3_DQL[2]

C19

B_DDR3_DQL[3]

C15

B_DDR3_DQL[4]

C20

B_DDR3_DQL[5]

C14

B_DDR3_DQL[6]

B21

B_DDR3_DQL[7]

B15

B_DDR3_DQU[0]

F18

B_DDR3_DQU[1]

D19

B_DDR3_DQU[2]

D17

B_DDR3_DQU[3]

E21

B_DDR3_DQU[4]

E19

B_DDR3_DQU[5]

D20

B_DDR3_DQU[6]

D18

B_DDR3_DQU[7]

F20

ZQ

E9

IC101-*3

LGE2135(128M)

M1A_128M_AVS+

B_DDR3_A[0]

E11

B_DDR3_A[1]

F12

B_DDR3_A[2]

D10

B_DDR3_A[3]

B10

B_DDR3_A[4]

E15

B_DDR3_A[5]

B11

B_DDR3_A[6]

F14

B_DDR3_A[7]

C11

B_DDR3_A[8]

D14

B_DDR3_A[9]

A12

B_DDR3_A[10]

F16

B_DDR3_A[11]

D13

B_DDR3_A[12]

D15

B_DDR3_A[13]

C12

B_DDR3_A[14]

E13

B_DDR3_BA[0]

A9

B_DDR3_BA[1]

D16

B_DDR3_BA[2]

A10

B_DDR3_MCLK

C13

B_DDR3_MCLKZ

B13

B_DDR3_MCLKE

E17

B_DDR3_ODT

B8

B_DDR3_RASZ

C8

B_DDR3_CASZ

B9

B_DDR3_WEZ

D11

B_RESET

F10

B_DDR3_CS0

D12

B_DDR3_DQSL

A19

B_DDR3_DQSU

B18

B_DDR3_DQML

C16

B_DDR3_DQMU

D21

B_DDR3_DQSBL

C18

B_DDR3_DQSBU

C17

B_DDR3_DQL[0]

A20

B_DDR3_DQL[1]

A16

B_DDR3_DQL[2]

C19

B_DDR3_DQL[3]

C15

B_DDR3_DQL[4]

C20

B_DDR3_DQL[5]

C14

B_DDR3_DQL[6]

B21

B_DDR3_DQL[7]

B15

B_DDR3_DQU[0]

F18

B_DDR3_DQU[1]

D19

B_DDR3_DQU[2]

D17

B_DDR3_DQU[3]

E21

B_DDR3_DQU[4]

E19

B_DDR3_DQU[5]

D20

B_DDR3_DQU[6]

D18

B_DDR3_DQU[7]

F20

ZQ

E9

A-MA13

A-MBA1

A-MDQL4

A-MDQU5

A-MA9

A-MDML

A-MDQL1

A-MA3

A-MWEB

A-MA14

A-MBA2

A-MDQL0

A-MDQU2

A-MA5

A-MDQSU

A-MDQU1

A-MA0

A-MRASB

A-MDQL7

A-MA7

A/B_DDR3_CS

A-MCKE

A-MDQL3

A-MDQU6

A-MA2

A-MDQSUB

A-MDQU3

A-MA4

A-MODT

A-MDQL5

A-MA10

A-MCK

A-MDQU7

A-MA12

A-MDQSL

A-MDQU0

A-MA6

A-MRESETB

A-MDQL2

A-MA1

A-MCKB

A-MBA0

A-MDQSLB

A-MDQU4

A-MA11

A-MDMU

A-MDQL6

A-MA8

A-MCASB

Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only