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LED LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91U
MODEL : 32LV3100 32LV3100-TA
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL62461538 (1109-REV00)
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Only for training and service purposes
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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING ........................................................................... 14
BLOCK DIAGRAM.................................................................................. 17
EXPLODED VIEW .................................................................................. 18
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
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Only for training and service purposes
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω
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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
4. Electrical specification
4.1. Model Specification
1. Application range
This spec sheet is applied to LCD TV used LP91U chassis.
2. Specification
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC(77 ºF ± 9 ºF), CST: 40 ºC ± 5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage(100-240 V, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
No. Item Specification Remark
1. Market NON EU
2. Broadcasting system PAL/SECAM B/G/D/K,
PAL I/II, NTSC-M
3. Available Channel BAND PAL NTSC China(DK) Australia(BG)
VHF/UHF E2-C69 2~78 C1~C62 C1~C75
CATV S21-S47 1~71 S1~S41 S2~S44
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC Rear 1EA
6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear 1EA
7. RGB Input RGB-PC, S/W Upgrade Rear 1EA
8. HDMI Input 3EA HDMI-DTV, Only PCM MODE 32LV2130, 32/42LK410 : Rear 2EA, Side 1EA
2EA 22/26LV2130 : Rear 1EA
9. Audio Input (4EA) PC Audio(1EA), Component(1EA), AV (1EA) L/R Input
10. RS-232C Remote control, Commercial control Rear 1EA
11. USB Input (1EA) Divx, MP3, JPEG Side 1EA
12. Audio outut Audio output Rear 1EA
Page 7
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5. Component Video Input (Y, PB, PR)
No
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
No
Specification
Proposed Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280*1024 63.668 59.895 109.00 SXGA Only FHD Model
9 1920*1080 66.587 59.934 138.50 WUXGA(Reduced Blanking)
6. RGB
(Analog PC, RGB-DTV - NOT SUPPORT)
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7. HDMI input (PC)
(Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
8. HDMI input (DTV)
No
Specification
Proposed Remarks
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
Page 9
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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP91U
chassis.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
4) The input voltage of the receiver must keep 100-220 V,
50/60 Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option
(3) Download the EDID
- EDID data is automatically download when adjusting the
Tool Option2
(4) ADC Calibration - RGB / Component
(5) Check SW Version.
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack.
(2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened.
2) Click the “Connect” button and confirm “Dialog Box”.
3) Click the “Config” button and Change speed.
I2C Speed setting : 350 Khz ~ 400 Khz
4) Read and write bin file.
Click “(1)Read” tab, and then load download file
(XXXX.bin) by clicking “Read”.
1
Filexxx.bin
Page 10
5) Click “(2)Auto” tab and set as below.
6) Click “(3)Run”.
7) After downloading, you can see the “(4)Pass” message.
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the USB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”.
4) After Finished the Download, Automatically DC Off -> On.
5) If the TV is Turn on, Check the updated SW Version and Tool
option.
4.2. Input tool option.
Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because being
different with some setting value depend on module
maker, inch and market
(2) Equipment : adjustment remote control.
(3). Adjustment method
- The input methods are same as other chassis.(Use INSTART Key on the Adjust Remote control.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value.
Caution : Don’t press “IN-STOP” key after completing the
function inspection.
4.3. EDID Download method
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID. If not possible, recommend that
connect the MSPG equipment.
There are two methods of downloading the EDID data.
4.3.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2 seconds.
4.3.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, HDMI EDID data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(
G)
3) Press the right direction key(
G) at Start.
4) After about a few seconds, appear “OK”, then complete.
4.3.3. RS-232C command Method
(1) Command : AE 00 10
* Caution
Don’t connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of EDID could be
failed.
- 10 -
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1
Filexxx.bin
Page 11
4.3.4. EDID data
(1) Analog(RGB): 128bytes>
(2) HDMI 1 : 256Bytes
(3) HDMI 2 : 256Bytes
4.4. ADC Calibration
4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60 Hz 100 % Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : Component” by using
D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear.
4.4.2. ADC Calibration - RGB
4.4.2.1. Method of Using External pattern
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60 Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65)
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : RGB” by using
D/E(CH +/-)
and press ENTER(
A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
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LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
OK
OK
0123456789ABCDEF
0 00FFFFFFFFFFFF00 1E6D01 000101 01 01
10 01 15 01 03 08 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B A1 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88
40 35 00 BC 88 21 00 00 1C 0E 1F 00 80 51 00 1E 30
50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 00 55
0123456789ABCDEF
0 00 FFFFFFFFFFFF001E6D01 00 01010101
10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C2
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 2A
0123456789ABCDEF
0 00 FFFFFFFFFFFF001E6D01 00 01010101
10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C2
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 20 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 1A
Page 12
4.4.2.1. Method of Using Internal pattern
(1) Apply model
All model
(2) Process
1) Change the Input to RGB mode.
2) Press ADJ key on R/C for adjustment.
3) Enter Password number. Password is “0 0 0 0”.
4) Select “0. ADC calibration : RGB” by using
D/E(CH +/-)
and press ENTER(
A).
5) ADC adjustment is executed automatically .
6) When ADC adjustment is finished, this OSD appear.
* Caution : No need to connect external input cable.
* Caution : Adjustment result is applied after SET Off/On
4.5. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-control.
2) SW Version check
Check “SW VER : V3.xx”
5. PCB assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s Language and
signal Condition.
(2) Equipment : Adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use INSTART Key on the Adjustment remote control.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value.
5.2. Adjustment of White Balance
(For Automatic Adjustment)
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm
- Required Equipment
1) Remote controller for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product
(should be used in th calibrated ch by CS-1000)
LCD TV : CH-9
White LED TV: CH-14
RGB LED(MNT) : CH-6
3) Auto W/B adjustment instrument(only for Auto adjustment)
5.2.1 Adjustment of White Balance (For automatic adjustment)
* LP91U Support RS-232C & I2C Interface For ADC/DDC
Adjustment.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heatrun pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode.
- Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance
- Enter the white balance adjustment mode with aging
command. (F3, 00, 00)
(4) Release the adjust mode of white balance
- Enter the white balance adjustment mode with aging
command.(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode.(For LCD)
- 12 -
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
OK
Page 13
5.2.2. Adjustment of White Balance (for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85 % white pattern)
5) Push the ADJ key -> Enter “0000” (Password)
6) Select “3. W/B ADJUST”
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using
F/G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool/ Medium/ Warm) : Fix the
one of R/G/B gain and change the others
11) When adjustment is completed, Enter “COPY ALL”.
12) Exit adjustment mode using EXIT key on R/C.
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
1) All Edge LED(except LGD), lamp over 26 inch
2) 22inch TN Edge LED(11Y Asia model: 22LV2310), lamp
under 22.
3) W/B table in process of time which must be applied for
LGD edge LED module(Target color coordinate is
different by aging time)
- To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : Select Vivid and change Dynamic Contrast :
Off, Dynamic Colour : Off -> Picture Mode change ->
Vivid(User)
(If you miss the upper condition, the coordinates of W/B can
be lower than the spec.
- 13 -
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Coordinate
Mode
xy
Temp uv∆
Cool 0.269 ± 0.002 0.273 ± 0.002 13,000 K 0.000
Medium 0.285 ± 0.002 0.293 ± 0.002 9,300 K 0.000
Warm 0.313 ± 0.002 0.329 ± 0.002 6,500 K 0.003
Coordinate
Mode
xy
Temp uv∆
Cool 0.285 ± 0.002 0.293 ± 0.002 9,300 K 0.000
Medium 0.295 ± 0.002 0.305 ± 0.002 8,000 K 0.000
Warm 0.313 ± 0.002 0.329 ± 0.002 6,500 K 0.003
Aging Time Cool Medium Warm
GP2R (Min.) X Y X Y X Y
269 273 285 293 313 329
1 0-2 279 288 295 308 319 338
2 3-5 278 286 294 306 318 336
3 6-9 277 285 293 305 317 335
4 10-19 276 283 292 303 316 333
5 20-35 274 280 290 300 314 330
6 36-49 272 277 288 297 312 327
7 50-79 271 275 287 295 311 325
8 80-149 270 274 286 294 310 324
9 Over 150 269 273 285 293 309 323
Page 14
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 14 -
TROUBLESHOOTING
No power
(LED indicator off)
Check 24V, 12V, 3.5V
of Power B/D
Check short of Main B/D
or Change Power B/D
Pass
Check Output of
IC1001, IC1002, IC1003,
IC1005, IC1007
Check P403 Connector
Change LED Assembly
:
[A] PROCESS(for non-adapter models)
Fail
Fail
Pass
Pass
Check LED Assembly
Change IC1002, IC1008, Q1003
Pass
Check short of
IC1001, IC1002, IC1003,
IC1005, IC1007
Fail
Re-soldering or Change defect part
Fail
No Raster
[B]: Process
Check LED status
On Display Unit
Repeat [A]/[A-1] Process
Pass
Fail
Check PANEL_VCC
of LVDS wafer
Check Output of Q1003
Fail
Change Inverter Connector
Or Inverter
Fail
Pass
Fail
Pass
Change LVDS cable
Fail
Check LVDS Cable
Pass
Check Panel Link Cable
Or Module
Change Panel Link Cable
Or Module
Check Inverter Connector
Or Inverter
Pass
Page 15
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
No Raster on PC Signal
Check Input source Cable
And Jack
Pass
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC201
Fail
Re-soldering or
Change the defect part,
Check RGB EDID Data
Repeat [A]/[A-1], & [B] Process
Pass
Check the Input/Output
Of J202
Fail
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source
Cable And Jack
Pass
Re-soldering or
Change the defect part
Check the Input/Output
Of IC800
Fail
Pass
Re-soldering or
Change the defect part
Repeat [A]/[A-1], & [B] Process
Check The Input/Output
Of JK101
Fail
Pass
No Raster on HDMI Signal
Check Input source
Cable And Jack
Pass
Check the Input/Output
of JK301, JK302, JK303
Fail
Re-soldering or
Change the defect part
Pass
Pass
Check the Input/Output
of IC300, IC301, IC303
Fail
Re-soldering or
Change the defect part
Check HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/Output
of IC800
Fail
Re-soldering or
Change the defect part
Repeat [A]/[A-1], & [B] Process
Page 16
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 16 -
No Sound
Check The Input Sourse
Check The Input/
Output of IC501
Re-soldering or
Change the defect partFail
Pass
Pass
Check The Speaker
Change Speaker
Fail
Check The Speaker Wire
Pass
Change The Source Input
Fail
No Raster On AV Video Signal No Signal On TV(RF) Signal
Check Input source
Cable And Jack
Pass
Check Input source
Cable and Jack
Pass
Check The Input/
Output of JK103
Re-soldering or
Change the defect part
Pass
Fail
Pass
Repeat [A]/[A-1], & [B] Process
Pass
Check the Input/
Output of IC800
Fail
Re-soldering or
Change the defect part
Pass
Check The Input/
Output of TU600
Of TU500
Re-soldering or
Change the defect part
Pass
Fail
Pass
Check the Input/
Output of IC800
Fail
Re-soldering or
Change the defect part
Repeat [A]/[A-1], & [B] Process
Page 17
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
BLOCK DIAGRAM
EEPROM
R1EX24002
RGB-PC
(JK202)
Tuner
(TU600)
Compon ent
(JK101)
AV_LIN/RIN : 500mVrms
SPK_L
SPK_R
AV_VIN : 1Vpp
NTP7100
COMP_Y/Pb/Pr
HDMI_DATA0
TU_MAIN
AV_VIN
COMP_LIN/RIN
L_CH
R_CH
AV_LIN/RIN
PC-SOUND
(JK203)
I2S_MCLK
I2S_SDO
I2S_WS
I2S_SCK
TMDS
EEPROM
(AT24C256C)
Serial Flash
(MX25L64)
EEPROM
HDCP
(24WC08)
EEP_SCL/SDA
EEP_SCL/SDA
TXCE2––
TXCE3––
TXCLKE––
TXCE1––
TXCE0––
TXCO1––
TXCO3––
TXCO2––
TXCO0––
TXCLKO––
M_SCL/SDA
Main scaler
Matrix
(LGE4767A )
(IC800)
IC302
TU600
IC802
IC803
IC801
IC501
M_SCL/SDA
SIDE
REAR
HDMI3
(JK303)
USB
(JK204)
RS-232C
(JK200)
HDMI1
(JK301)
HDMI2
(JK302)
EEPROM
R1EX24002
IC301
EEPROM
R1EX24002
IC300
DDC_SCL/SDA1
DDC_SCL/SDA2
DDC_SCL/SDA3
Contr oll er
MAX3232CDR
IC200
RXD/TXD
EEPROM
R1EX24002
IC201
DSUB_SCL/S DA
SPI_CZ/DO
SPI_CLK/DI
HDMI_DATA1
HDMI_DATA2
USB DN/DP
PC_R/G/B
PC_VS/HS
TXD/RXD
PC_AUD_L/R
TXCO4––
TXCE4––
P402
P405
HD LVDS c onn ector
DDR2 SDRAM
(512M Byte )
IC900
DDR2_CKE
DDR2_WEZ
DDR2_DQS0 ––
DDR2_MCLK
DDR2_BA0/1
DDR2_DQS1––
DDR2_ODT
DDR2_DQM0/1
51P FHD LVDS conn ector
P401
P404
30P FHD LVDS conn ector
Audi o out_L/ R
COMPONENT_L/R : 500mVrms
COMPONENT_Y/Pb/Pr : 1/0.7Vpp
Audi o out_L/ R : 500mVrms
AV
(JK103)
Audi o out
(JK102)
OP Amp
AS324MTR
IC502
MNT_L/R_AMP
Audi o Amp
TPA3124
IC2100
Hotel opt ion for China
MAIN_SIF
LED drov er
(MAX16814)
IC100
P7701
5P conn ector
PWM_DIM
WLED_ENABLE
(INV_CTL)
12P/15P
connec tor
P400(15P)
P403(12P)
SUB_SCL/SD A, LED_R
IR, KEY1/2
Only for 22
TN module
Page 18
- 18 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LV1
400
540
530
521
710
700
900
910
810
A2
A21
A5
A10
120
300
200
500
510
511
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Page 19
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
REAR AV
PPJ233-01
JK103
5A
[YL]E-LUG
4A
[YL]O-SPRING
3A
[YL]CONTACT
4B
[WH]C-LUG
3C
[RD]CONTACT
4C
[RD]O-SPRING
5C
[RD]E-LUG
COMPONENT / AV IN / AUDIO OUT
ZD104
SD05
ZD105
SD05
D104
30V
D105
30V
R110
75
R111
220K
R112
220K
R115
10K
R116
10K
R119
12K
R120
12K
CVBS_V_IN
CVBS_L_IN
CVBS_R_IN
AUDIO_OUT
PPJ241-02
JK102
FIX_TER
6
[RD]R_OUT
4
[WH]L_OUT
3
[WH]GND
5
ZD10 6
30V
ZD10 7
R103
0
EXT_SPK
R123
C103
5600pF
50V
C104
5600pF
30V
50V
R122
0
C
B
E
Q103
MMBT3904(NXP)
R125
0
C
B
E
Q105
MMBT3904(NXP)
R102
0
EXT_SPK
1K
AUDIO_OUT
R124
1K
AUDIO_OUT
EXT_SPK_R
C101 10uF
AUDIO_OUT
Q104
MMBT3904(NXP)
C
B
E
C102 10uF
AUDIO_OUT
Q106
C
MMBT3904(NXP)
B
E
EXT_SPK_L
16V
POP NOISE
16V
POP NOISE
MNT_R_OUT
MUTE_AUDIO_OUT
MNT_L_OUT
MUTE_AUDIO_OUT
COMPONENT
PPJ234-01
JK101
6A
[GN]E-LUG
5A
[GN]O-SPRING
4A
[GN]CONTACT
7B
[BL]E-LUG-S
5B
[BL]O-SPRING
7C
[RD]E-LUG-S
5C
[RD]O-SPRING_1
5D
[WH]O-SPRING
4E
[RD]CONTACT
5E
[RD]O-SPRING_2
6E
[RD]E-LUG
ZD100
SD05
D101
30V
D100
30V
ZD102
SD05
ZD103
SD05
ZD101
SD05
R104
220K
R107
75
R109
75
R100
220K
R108
75
10K
R114
10K
R113
R121
75
R118
12K
R117
12K
COMP_Y_IN
COMP_PB_IN
COMP_PR_IN
COMP_L_IN
COMP_R_IN
JP108
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
’11 ATV(H6R)
INPUT1
10/12/29
1 12
Page 20
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
RS-232C
C1+
V+
C1-
C2+
C2-
V-
DOUT2
RIN2
MAX3232CDR
1
2
3
4
5
6
7
8
IC200
C200
0.1uF
16V
C201
0.1uF
16V
C202
0.1uF
16V
C203
0.1uF
16V
16
15
14
13
12
11
10
9
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
+3.5V_MST
C204
0.1uF
16V
R202
100
R203
100
D200
30V
D201
30V
+3.5V_MST
R204
R205
4.7K
4.7K
IR_OUT
RXD
TXD
JK200
SPG09-DB-009
1
6
2
7
3
8
4
9
5
10
PC
JK202
SPG09-DB-010
6630TGA004Q
6
1
7
2
8
3
9
4
10
5
SHILED16
11
12
13
14
15
RED_GND
GND_2
RED
GREEN_GND
DDC_DATA
GREEN
BLUE_GND
H_SYNC
BLUE
NC
V_SYNC
GND_1
SYNC_GND
DDC_CLOCK
DDC_GND
D207
30V
D208
30V
D210
30V
R211
75
R212
75
R213
75
PC_R_IN
PC_G_IN
PC_B_IN
R200
0
ZD200
SD05
ZD201
SD05
D204
30V
D209
30V
R214
4.7K
R215
4.7K
R207
68
R208
68
DSUB_SDA
C213
68pF
50V
C211
68pF
50V
DSUB_SCL
PC_HS
PC_VS
USB
3AU04S-305-ZC-(LG)
JK204
USB DO WN S TREA M
+5V_MULTI
PC EDID
IC201-*2
AT24C02C-SSHM-T
A0
1
A1
2
A2
3
GND
4
RGB_EEPROM_ATMEL
VCC
8
WP
7
SCL
6
SDA
5
IC201-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
RGB_EEPROM_RENESAS
IC201
CAT24C02WI-GT3
R219
VCC
8
WP
7
SCL
6
SDA
5
A0
1
A1
2
A2
3
VSS
4
RGB_EEPROM_CATAL
VCC
8
WP
7
SCL
6
SDA
5
R216
100
R217
100
R218
100
4.7K
READY
R220
4.7K
R221
4.7K
ENKMC2838-T112
C
C205
0.01uF
D211
A1
A2
DDC_WP
DSUB_SCL
DSUB_SDA
PC SOUND
JK203
PEJ027-01
** 1A Design
It’s possibel to 27~47ohm
Close to SIDE_USB
C210
C212
10uF
220uF
6.3V
16V
1234
USB_DN
USB_DP
READY
READY
ZD205
ZD204
30V
5
30V
C214
100uF
16V
L201
500
+3.5V_MULTI
READY
R209
1K
R237
OUT_2
OUT_1
0
NC
FLG
IC202
AP2191SG-13
8
7
6
5
READY
D213
C
AC
A
READY
READY
R210
4.7K
R238
510
READY
C208
0.1uF
50V
GND
1
IN_1
2
IN_2
3
EN
4
READY
L200
120OHM
+5V_USB
READY
C209
10uF
16V
E_SPRING
3
T_TERMINAL1
6A
B_TERMINAL1
7A
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
D202
30V
CDS3C30GTH
D203
30V
CDS3C30GTH
R231
220K
R232
220K
R233
10K
R234
10K
R235
12K
R236
12K
PC_AUD_R_IN
PC_AUD_L_IN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
READY
’11 ATV(H6R)
INPUT2
10/12/29
2 12
Page 21
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
OPTION
SW_HPD : USE SW HPD (Default)
MST_HPD : USE MST HPD
HPD_MST_2
2SC3875S
MMBT3904(NXP)
R301
10K
SHIELD
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
YKF45-7058V
JK302
Q301
C
B
E
HPD
+5V_POWER
DDC/CEC_GND
SDA
SCL
NC
CEC
CLKCLK_SHIELD
CLK+
DATA0DATA0_SHIELD
DATA0+
DATA1DATA1_SHIELD
DATA1+
DATA2DATA2_SHIELD
DATA2+
+5V_HDMI_2
R303
1K
JP301
JP300
HDMI2_EEPROM_CATAL
IC301
CAT24C02WI-GT3
A0
1
A1
2
A2
3
VSS
4
CEC
TMDS2_RXC-
TMDS2_RXC+
TMDS2_RX0-
TMDS2_RX0+
TMDS2_RX1-
TMDS2_RX1+
TMDS2_RX2-
TMDS2_RX2+
+5V_MULTI
+5V_HDMI_2
+5V_MULTI
+5V_HDMI_1
A1CA2
D301
KDS184S
HPD_MST_1
VCC
8
WP
7
6
5
R327 100
SCL
R304 100
SDA
R305 100
R309
10K
R311
10K
C301
0.01uF
DDC_WP
R300
10K
SHIELD
20
DDC_SDA2
DDC_SCL2
HDMI2_EEPROM_RENESAS
IC301-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
VCC
8
WP
7
SCL
6
SDA
5
HDMI2_EEPROM_ATMEL
IC301-*2
AT24C02C-SSHM-T
A0
1
A1
2
A2
3
GND
4
VCC
8
WP
7
SCL
6
SDA
5
B
HPD
19
+5V_POWER
18
DDC/CEC_GND
17
SDA
16
SCL
15
NC
14
CEC
13
CLK-
12
CLK_SHIELD
11
CLK+
10
DATA0-
9
DATA0_SHIELD
8
DATA0+
7
DATA1-
6
DATA1_SHIELD
5
DATA1+
4
DATA2-
3
DATA2_SHIELD
2
DATA2+
1
C
Q300
MMBT3904(NXP)
2SC3875S
E
+5V_HDMI_1
R302
1K
HDMI1_EEPROM_CATAL
IC300
CAT24C02WI-GT3
A0
1
A1
2
A2
3
VSS
4
CEC
TMDS1_RXC-
TMDS1_RXC+
TMDS1_RX0-
TMDS1_RX0+
TMDS1_RX1-
TMDS1_RX1+
TMDS1_RX2-
TMDS1_RX2+
A1CA2
D300
KDS184S
VCC
8
WP
R331 100
7
SCL
R306 100
6
SDA
R307 100
5
JP302
JP303
HDMI1_EEPROM_RENESAS
A0
1
A1
2
A2
3
VSS
4
C302
R308
R310
0.01uF
10K
10K
IC300-*1
R1EX24002ASAS0A
DDC_WP
DDC_SDA1
DDC_SCL1
HDMI1_EEPROM_ATMEL
IC300-*2
AT24C02C-SSHM-T
VCC
8
WP
7
SCL
6
SDA
5
A0
1
A1
2
A2
3
GND
4
VCC
8
WP
7
SCL
6
SDA
5
JK301
HPD_MST_3
R312
10K
+5V_MULTI
+5V_HDMI_3
+5V_HDMI_3
R314
C
MMBT3904(NXP)
2SC3875S
B
Q302
E
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
1K
JP304
JP305
CEC
TMDS3_RXC-
TMDS3_RXC+
TMDS3_RX0-
TMDS3_RX0+
TMDS3_RX1-
TMDS3_RX1+
TMDS3_RX2-
TMDS3_RX2+
HDMI3_EEPROM_CATAL
IC302
CAT24C02WI-GT3
A0
1
A1
2
A2
3
VSS
4
VCC
8
WP
R329 100
7
SCL
R317 100
6
SDA
5
R318
100
A0
A1
A2
VSS
R319
10K
HDMI3_EEPROM_RENESAS
IC302-*1
R1EX24002ASAS0A
1
2
3
4
8
7
6
5
R320
10K
VCC
WP
SCL
SDA
A1CA2
D302
KDS184S
C300
0.01uF
25V
HDMI3_EEPROM_ATMEL
IC302-*2
AT24C02C-SSHM-T
A0
1
A1
2
A2
3
GND
4
DDC_WP
DDC_SDA3
DDC_SCL3
VCC
8
WP
7
SCL
6
SDA
5
Q303
BSS83
READY
G
+3.3V_MST
R315
68K
READY
R316
56K
R313
0
READY
CEC_C
CEC
D303
BAT54_SUZHO
30V
D
READY
B
S
D304
CDS3C30GTH
30V READY
RSD-105156-100
JK303
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
’11 ATV(H6R)
HDMI
10/12/29
3 12
Page 22
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
P403
12507WR-12L
10Y_SUB
1
2
3
4
5
6
7
8
9
10
11
12
13
IR
P400
12507WR-15L
11Y_SUB
16
.
I2C_S/T
L400
500-ohm
I2C_S/T
L401
500-ohm
ZD400
ZD401
5.6B
5.6B
I2C_S/T
I2C_S/T
L404 120-ohm
L405 120-ohm
C403
C400
470pF
470pF
50V
50V
READY
1EYEQ_SCL
2EYEQ_SDA
3GND
4KEY1
5KEY2
63.5V_ST
7GND
8LED_B
9IR
10GND
113.3V
12LED_R
13GND
14S/T_SCL
15S/T_SDA
R414
READY
R415
0
0
ZD402
5.6B
C412
1000pF
50V
READY
C410
1000pF
50V
C411
0.1uF
16V
READY
READY
C402
47pF
50V
READY
L408
120-ohm
C409
0.1uF
16V
BLM18PG121SN1D
L407
120-ohm
C405
100pF
PWM_LED
50V
PWM_LED
L403
120-ohm
+3.3V_MULTI
SUB_SCL
SUB_SDA
+3.5V_MST
L406
120-ohm
+3.3V_MULTI
PWM_LED
Q400
MMBT3904(NXP)
READY
C406
0.1uF
50V
C401
100pF
50V
PWM_LED
R400
10K
PWM_LED
C
B
E
L402
120-ohm
PWM_LED
R406
10K
READY
C407
0.1uF
READY
R404
0
R405
10K
PWM_LED
IR_OUT
R407
10K
IR_OUT
R401
47K
MMBT3904(NXP)
+3.3V_MST
+3.5V_MST
IR_OUT
C
MMBT3904(NXP)
B
E
Q401
Q402
PWM_LED
R409
10K
READY
C408
0.1uF
IR_OUT
R410
10K
+3.5V_MST
R403
10K
PWM_LED
C
B
E
READY
R402
0
IR_OUT
R412
1K
B
R408
PWM_LED
C
E
10K
+3.5V_MST
IR_OUT
R413
22
IR_OUT
MMBT3904(NXP)
Q403
+3.5V_MST
R411
4.7K
PWM_LED
KEY1
KEY2
SUB_SCL
IR
IR OUT
IR_OUT
LED_R
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
’11 ATV(H6R)
IR
10/12/29
4 12
Page 23
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
R537 10K
SW_RESET
MULTI_PW_SW
READY
R536
47K
READY
R539
READY
R538
0
0
B
+3.3V_MST
R540
10K
C
Q500
MMBT3904(NXP)
E
R541 100
C500
1000pF
+3.3V_MULTI
C540
0.1uF
16V
AMP_RESET
AP1117E18G-13
IN
+1.8V_AMP
I2S_SDO
I2S_WS
I2S_SCK
M_SDA
M_SCL
IC500
Vd=1.4V
3
2
OUT
L501
BLM18PG121SN1D
READY
C501
10uF
10V
ADJ/GND
1
+1.8V_AMP
BLM18PG121SN1D
AMP_RESET
L502
C502
0.1uF
16V
I2S_MCLK
R500
1
C541
10uF
10V
1000pF
READY
C503
10uF
10V
R503 100
R504 100
R505 100
R506 33
R507 33
+1.8V_AMP
C542
0.1uF
16V
C506
50V
C504
100pF
50V
C505
0.1uF
16V
C509
0.1uF
C508
1000pF
50V
R508
3.3K
C507
18pF
50V
+3.3V_MULTI
L504
BLM18PG121SN1D
TP502
C510
18pF
50V
C546
22pF
50V
READY
120 mA
C51 2
1uF 25V
+1.8V_AMP
READY
C511
10uF
10V
C544
22pF
50V
READY
C514
22000pF
BST1A
VDR1A
/RESET
DGND_1
GND_IO
CLK_I
VDD_IO
DGND_PLL
AGND_PLL
AVDD_PLL
DVDD_PLL
C513
0.1uF
C545
22pF
50V
READY
+24V_AMP
D501
C527
0.1uF
50V
R517
10K
READY
1N4148W
100V
READY
D502
1N4148W
100V
READY
D503
1N4148W
100V
READY
D504
1N4148W
100V
READY
C528
10uF
35V
READY
R535
3.3
READY
C525
22000pF
READY
Q501
READY
50V
R515
10K
C547
0.01uF
50V
+24V_AMP
C526
0.1uF
50V
MULTI_PW_SW
+3.5V_MST
C
E
B
C515
0.1uF
50V
50V
PGND1B_2
OUT1B_1
OUT1B_2
PVDD1B_1
PVDD1B_2
PVDD1A_1
PVDD1A_2
OUT1A_1
OUT1A_2
PGND1A_1
PGND1A_2
EP_PAD
46
47
48
49
50
51
52
53
54
55
56
1
THERMAL
2
57
3
AD
4
5
IC501
6
7
8
EAN60969603
9
10
LF
NTP-7100
11
12
13
GND
14
15
16
17
18
22
25
26
WCK19BCK20SDA21SCL
DVDD
SDATA
DGND_2
16V
VDR2B27BST2B
/FAULT
MONITOR023MONITOR124MONITOR2
C51 7
1uF
25V
C516
0
1000pF
50V
EXT_SPK
R512
SPK_OUT_MUTE
0.1uF
50V
C518
22000pF
50V
C520
1uF
25V
VDR1B44BST1B45PGND1B_1
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
PGND2B_1
10uF
35V
NC
VDR2A
BST2A
PGND2A_2
PGND2A_1
OUT2A_2
OUT2A_1
PVDD2A_2
PVDD2A_1
PVDD2B_2
PVDD2B_1
OUT2B_2
OUT2B_1
PGND2B_2
R514 100
C52 2
1uF25V
C524
22000pF
50V
R513
0
READY
MMBT3904(NXP)
C521
C519
R519
12
C529
390pF
50V
C530
390pF
50V
R520
12
R521
12
C531
390pF
50V
C532
390pF
50V
R522
12
MULTI_PW_SW
R526
R524
12
R525
12
R523
12
12
L506
10.0uH
NRS6045T100MMGK
10.0uH
L507
NRS6045T100MMGK
NRS6045T100MMGK
L508
10.0uH
L509
10.0uH
NRS6045T100MMGK
C534
0.47uF
50V
C535
0.47uF
50V
C536
0.1uF
50V
C537
0.1uF
50V
C538
0.1uF
50V
C539
0.1uF
50V
R527
4.7K
R528
4.7K
R529
4.7K
R530
4.7K
SPK_L+
SPK_L-
SPK_R+
SPK_R-
SPK_L+
SPK_L-
SPK_R+
SPK_R-
SPEAKER_L
WAFER-ANGLE
4
3
2
1
P501
SPEAKER_R
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MNT_L_OUT
MNT_R_OUT
AMP :GAIN X 4
P_12V
C550
0.1uF
16V
AUDIO_OUT
C551
0.1uF
16V
AUDIO_OUT
Q510
MMBT3904(NXP)
AUDIO_OUT
C
B
E
R550
4.7K
AUDIO_OUT
MNT_L_AMP
MNT_R_AMP
P_12V
Q511
MMBT3904(NXP)
AUDIO_OUT
C
B
E
R55 1
4.7 K
AUDIO_OUT
R552 1K
AUDIO_OUT
C552
6800pF
50V
AUDIO_OUT
R553
AUDIO_OUT
C553
6800pF
50V
AUDIO_OUT
R555
1K
10K
R554
AUDIO_OUT
C554 33pF 50V
AUDIO_OUT
5.6K
AUDIO_OUT
R556 5.6K
AUDIO_OUT
33pF
C555
AUDIO_OUT
R557
10K
AUDIO_OUT
P_12V
50V
AUDIO_OUT BLOCK
R558
6.8K
AUDIO_OUT
C556
0.01uF
50V
AUDIO_OUT
R559
6.8K
AUDIO_OUT
IC502
AS324MTR-E1
1 OUT1
2 INPUT1-
3 INPUT1+
4 VCC
5 INPUT2+
6 INPUT2-
7 OUT2 8OUT3
AUDIO_OUT
’11 ATV(H6R)
Audio amp
14OUT4
13INPUT4-
12INPUT4+
11GND
10INPUT3+
9INPUT3-
10/12/29
5 12
Page 24
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
* Replacement item
- EBL60720102 : TAFJ-Z001D(P)
- EBL60720101 : TAFJ-Z001D
TU600
TAFJ-Z001D(P)
NC_1
1
NC_2
2
+B[5V]
3
RF_AGC
4
MOPLL_AS
5
Near the pin
C608
C601
10uF
0.01uF
16V
50V
READY
L600
120- ohm
READY
C605
100uF
16V
READY
C606
100uF
16V
R600
0
+5V_TUNER
13
SHIELD
6
7
8
9
10
11
12
SCL
SDA
NC_3
SIF
NC_4
VIDEO
GND
C602
27pF
50V
C600
27pF
50V
MAIN_SIF
READY
L602
10uH
READY
C607
82pF
50V
R604
47
R605
47
R602
4.7K
M_SCL
M_SDA
C603
0.1uF
50V
+5V_TUNER
E
B
R601
0
R606
220
R607
220
ISA1530AC1
Q602
C
READY
C604
50V
TV_MAIN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
’11 ATV(H6R)
TUNER
10/12/11
6 12
Page 25
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
SERIAL FLASH 64M
IC802-*1
W25Q64BVSFIG
HOLD[IO3]
1
16
VCC
2
15
NC_1
3
14
NC_2
4
13
NC_3
5
12
NC_4
6
11
CS
7
10
DO[IO1]
8
9
SPI_WINBOND
SPI_CZ
SPI_DO
EEPROM
A0
A1
A2
GND
HDCP EEPROM
R8004
4.7K
+3.3V_MULTI
CLK
C807
DIO[IO0]
0.01uF
NC_8
NC_7
NC_6
NC_5
GND
WP[IO2]
+3.3V_MULTI
R877
4.7K
IC801
AT24C256C-SSHL-T
VCC
1
2
3
4
8
WP
7
SCL
6
SDA
5
256K_ATMEL
IC803
CAT24WC08W-T
A0
1
A1
2
A2
3
VSS
4
HDCP_CATALYST
+3.3V_MULTI
IC802
MX25L6445EMI-10G
1 NC_1/SIO3
2 VCC
3 NC_2
4 NC_3
5 NC_4
6 NC_5
7 CS#
8 SO/SIO1 9WP#/SIO2
SPI_MACRONIX
C803
0.01uF
R8027
4.7K
R812 22
R813 22
+3.3V_MULTI
VCC
8
WP
7
SCL
R8005
6
SDA
R8006 22
5
16SCLK
15SI/SIO0
14NC_9
13NC_8
+3.3V_MULTI
12NC_7
11NC_6
10GND
R8028
4.7K
CAT24C08WI-GT3-H-RECV(TV)
R817
4.7K
22
R878
4.7K
C
B
E
Q805
MMBT3904(NXP)
READY
IC801-*1
M24256-BRMN6TP
E0
1
E1
2
E2
3
VSS
4
256K_ST
EEP_SCL
EEP_SDA
IC803-*1
NC_1
1
NC_2
2
A2
3
VSS
4
HDCP_ONSEMI
EEP_SCL
EEP_SDA
SPI_CLK
SPI_DI
R828
10K
READY
VCC
8
WC
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
R896 4.7K
HD_TACT_LAMP
R896-*1 4.7K
HD_SOFT_LAMP
R896-*2 4.7K
HD_SOFT_LED
R896-*3 4.7K
FHD_TACT_LAMP_8BIT
R896-*4 4.7K
FHD_TACT_LAMP_10BIT
R896-*5 4.7K
FHD_SOFT_LAMP_8BIT
*H/W OPTION
HD_TACT_LAMP
HD_SOFT_LAMP
HD_SOFT_LED
FHD_TACT_LAMP_8BIT
FHD_TACT_LAMP_10BITX4.7K
FHD_SOFT_LAMP_8BIT
FHD_SOFT_LAMP_10BIT
FHD_SOFT_LED_8BIT
DDC_WP
+3.3V_MULTI
C866
0.1uF
10uF
C804/C805/C806:Close to IC
as close as possible
FHD_TACT_LAMP_8BIT
R898-*1 4.7K
FHD_TACT_LAMP_10BIT
R898-*2 4.7K
FHD_SOFT_LAMP_8BIT
R898-*3 4.7K
FHD_SOFT_LAMP_10BIT
R898-*4 4.7K
FHD_SOFT_LED_8BIT
R898-*5 4.7K
FHD_SOFT_LED_10BIT
CIS21J121
5A_BEAD_SS
5A_BEAD_MAG
L800
C867
PC_B_IN
PC_G_IN
PC_R_IN
COMP_PB_IN
COMP_Y_IN
COMP_PR_IN
CVBS_V_IN
R898 4.7K
4.7K
4.7K
4.7K
4.7K
4.7K
4.7K
X
L800-*1
120-ohm
TV_MAIN
MAIN_SIF
RL_ON
P_24V
P_12V
+3.5V_MST
RESET
LARGE_INCH
R8037
0
R800 0
PD_24V
R8001 0
PD_12V
C812
4.7uF 10V
READY
C871
4.7uF
10V
R8041
11K 1%
READY
SW800
JTP-1127WEM
D803
KDS181
LARGE_INCH
R8007
33K
MMBT3904(NXP)
1
3
2 4
VCC
C841
0.22uF
16V
READY
LARGE_INCH
Q804
R861
1K
R8036
20K
2.2uF 10V
READY
IC804
KIA7427F
1
READY
C
B
E
ISA1530AC1
Q800
C
B
KDS181
D801
R887
33K
E
R885
150R860 1K
C870
47uF
25V
LIFE_1000H
22LV2130-TD Must be applied 2000H
REASON : CAP LIFE for CST TEST
R888
100
C814
0.1uF
50V
C839
READY
R807
OUT
3
2
GND
R808
4.7K
READY
0
R886
2K
C870-*1
47uF
25V
LIFE_2000H
R8000
10K
D802
KDS181
R853
1K
READY
C8000
2.2uF
16V
+3.5V_MST
B
R855
10K
C
MMBT3904(NXP)
Q803
E
MNT_L_AMP
MNT_R_AMP
POWER_DET
MULTI_PW_SW
SYS_RESET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R8010R898 R8011R896
X
X
X
4.7K
4.7K
4.7KX 4.7KFHD_SOFT_LED_10BIT X
C833 0.1uF
C815 0.1uF
C819 0.1uF
C838 0.1uF
C810 1uF
AUDIO_OUT OPTION BLOCK
R8010 4.7K
HD_TACT_LAMP
R8010-*1 4.7K
HD_SOFT_LAMP
R8010-*2 4.7K
FHD_TACT_LAMP_8BIT
R8010-*3 4.7K
FHD_TACT_LAMP_10BIT
R8010-*4 4.7K
FHD_SOFT_LAMP_10BIT
R8010-*5 4.7K
FHD_SOFT_LED_8BIT
4.7K
X
4.7K
4.7K
X
4.7K
4.7K
X4.7K
4.7K
4.7K
X
4.7K4.7K
X
4.7K
4.7K
4.7K
TMDS2_RXCTMDS2_RXC+
TMDS2_RX0-
TMDS2_RX0+
HPD_MST_2
TMDS2_RX1-
HDMI_2
TMDS2_RX1+
TMDS2_RX2-
TMDS2_RX2+
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+
TMDS1_RX1-
HDMI_1
TMDS1_RX1+
TMDS1_RX2TMDS1_RX2+
HPD_MST_1
R814 47
R803 470
R816 47
R818 47
R838 47
R833 47
R836 47
R832 47
R834 47
R835 470
R837 47
R897 47
R831 47
R857 47
R830 47
R875 47
R876 47
R8008 22K
C854 0.01uF
R8009 22K
C855 0.01uF
+1.2V_VDDC_MST
R8011 4.7K
HD_SOFT_LAMP
R8011-*1 4.7K
HD_SOFT_LED
R8011-*2 4.7K
FHD_TACT_LAMP_10BIT
R8011-*3 4.7K
FHD_SOFT_LAMP_8BIT
R8011-*4 4.7K
FHD_SOFT_LED_8BIT
R8011-*5 4.7K
FHD_SOFT_LED_10BIT
R851 5.6
R854 5.6
R856 5.6
R858 5.6
R859 5.6
R862 5.6
R869 5.6
R871 5.6
R872 5.6
R873 5.6
R874 5.6
R879 5.6
R880 5.6
R890 5.6
R891 5.6
R892 5.6
R840 390
C804 0.1uF
C805 0.1uF
C806 0.1uF
C843 0.047uF
C846 1000pF
C845 0.047uF
C847 0.047uF
0.047uF
C825
C827 0.047uF
C829 0.047uF
C826 0.047uF
C828 0.047uF
C835 1000pF
C830 0.047uF
C831 0.047uF
C834 0.047uF
C836 0.047uF
C837 0.047uF
C868 0.1uF
C869 0.1uF
R882 100
R881 100
READY
R846 100
READY
R847 100
+3.3V_MULTI+3.3V_MULTI
SYS_RESET
CEC_C
255CEC
256HWRESET
1 RXBCKN
2 RXBCKP
3 RXB0N
4 RXB0P
5 HOTPLUGB
6 RXB1N
7 RXB1P
8 AVDD_33_1
9 RXB2N
10 RXB2P
11 RXACKN
12 RXACKP
13 RXA0N
14 RXA0P
15 AVDD_33_2
16 RXA1N
17 RXA1P
18 GND_1
19 RXA2N
20 RXA2P
21 HOTPLUGA
22 REXT
23 VCLAMP
24 REFP
25 REFM
26 BIN1P
27 SOGIN1
28 GIN1P
29 RIN1P
30 BINM
31 BIN0P
32 GINM
33 GIN0P
34 SOGIN0
35 RINM
36 RIN0P
37 AVDD_33_3
38 GND_2
39 BIN2P
40 GIN2P
41 SOGIN2
42 RIN2P
43 CVBS6
44 CVBS5
45 CVBS4
46 CVBS3
47 CVBS2
48 CVBS1
49 VCOM1
50 CVBS0
51 VCOM0
52 AVDD_33_4
53 CVBSOUT
54 GND_3
55 SIF0P
56 SIF0M
57 VDDC_1
58 AUL5
59 AUR5
60 AUVRM
61 AUOUTL2
62 AUOUTR2
63 AUOUTL1
64 AUOUTR1
65 AUL0
66 AUR0
C823 2.2uF
C824 2.2uF
CVBS_R_IN
CVBS_L_IN
R8003
10K
DDR2_A[0-12]
+3.3V_MST
C811
0.1uF
R8020
10K
POWER_SW
+3.3V_MST
Closed IC
C851
0.1uF
+3.5V_MST
I2S_OUT
PC_VS
PC_HS
R8034 0
R8035 0
253HSYNC1
254VSYNC1
251HSYNC0
252VSYNC0
IR
R8002 0
R895 100
249GPIO140
250IRIN
RXD
DSUB_SDA
R849 100
247GPIO138
248GPIO139
LED_R
TXD
R8012 100
R850 100
244XIN
245GPIO134
246GPIO135
C817 20pF
X801
R839
C816 20pF
12MHz
1M
243XOUT
KEY2
KEY1
R824 100
R825 100
240SAR2
241SAR3
242AVDD_MPLL
239SAR1
238SAR0
READY
READY
R8017 0
R8016 0
236USB0_DM
237USB0_DP
TXD
RXD
R8021100
R8022100
232UART1_RX/GPIO86
233UART1_TX/GPIO87
234GND_17
235GND_18
RL_ON
EEP_SDA
EEP_SCL
I2S_SCK
I2S_SDO
225GND_16
226VDDC_7
227I2S_OUT_BCK
228I2S_OUT_SD
229SPDIFO
230UART2_RX/I2CM_SDA
231UART2_TX/I2CM_SCK
I2S_WS
I2S_MCLK
R829 100
C883 0.1uF
222I2S_OUT_MCK
223I2S_OUT_WS
224VDDP_5
ERROR_OUT
219I2S_IN_WS/GPIO67
220I2S_IN_BCK/GPIO68
221I2S_IN_SD
IC800
LGE4767A (Matrix SD Divx_ Non RM_NON SRS)
DIVX
67 AUL1
68 AUR1
69 AUL2
70 AUR2
71 AUL3
72 AUR3
73 AUCOM
74 AUL4
75 AUR4
76 GND_4
77 AUVRP
78 AUVAG
79 AVDD_AU
80 GND_5
81 VDDC_2
82 DDCA_CK
83 DDCA_DA
84 DDCDA_CK
85 DDCDA_DA
86 DDCDB_CK
87 DDCDB_DA
88 GPIO20
89 VDDP_1
90 VDDC_3
91 UART2_RX
92 UART2_TX
93 DDCDC_CK
94 RXCCKN
95 RXCCKP
96 DDCDC_DA
97 RXC0N
98 RXC0P
99 GND_6
100 RXC1N
101 RXC1P
102 AVDD_DM
READY
C873 2.2uF
C874 2.2uF
C802 2.2uF
COMP_R_IN
COMP_L_IN
READY
C808 0.1uF
C821 2.2uF
C822 2.2uF
C875 2.2uF
PC_AUD_R_IN
PC_AUD_L_IN
+3.3V_MST
C813 0.1uF
C818 1000pF
C809 10uF 16V
Close to IC
with width trace
C840 0.01uF
5A_BEAD_MAG
L801
120-ohm
C820 4.7uF
R894 0
R899 0
R8024 100
R8023 100
DDC_SCL1
DDC_SDA1
DSUB_SDA
DSUB_SCL
L801-*1
CIS21J121
5A_BEAD_SS
R8014 4.7K
NON_FHD_22INCH
R8025 100
R8026 100
DDC_SCL2
DDC_SDA2
0
R806
R870 0
C882 0.1uF
M_SDA
+3.3V_MULTI
R8013 4.7K
FHD_22INCH
R8033
0
READY
POWER_DET
HDMI3_SIDE
HDMI3_SIDE
100
R801 5.6
R8039
DDC_SCL3
TMDS3_RXC-
M_SCL
HDMI3_SIDE
HDMI3_SIDE
HDMI3_SIDE
HDMI3_SIDE
100
R8040
R820 5.6
R821 5.6
R805 5.6
DDC_SDA3
TMDS3_RXC+
TMDS3_RX0-
HDMI_3
R8634.7K
R8644.7K
HDMI3_SIDE
HDMI3_SIDE
C876 0.01uF
R822 5.6
R823 5.6
TMDS3_RX1+
TMDS3_RX0+
TMDS3_RX1-
+3.3V_MULTI
DDR2_A[3]
DDR2_A[7]
DDR2_CKE
AR812
R852 56
215A_MADR[7]
216A_MADR[3]
217A_MCLKE
218VDDC_6
103 RXC2N
104 RXC2P
105 HOTPLUGC
106 USB1_DM
HDMI3_SIDE
HDMI3_SIDE
R848 5.6
R841 5.6
R826 0
USB_DN
HPD_MST_3
TMDS3_RX2-
TMDS3_RX2+
DDR2_A[5]
DDR2_A[9]
DDR2_A[10]
DDR2_A[12]
56
AR813
211AVDD_DDR_6
212A_MADR[5]
213A_MADR[9]
214A_MADR[12]
107 USB1_DP
108 SCK
109 SDI
AR818
33
R827 0
USB_DP
SPI_DI
SPI_CLK
USB PART
DDR2_A[1]
DDR2_BA0
56
209A_MADR[1]
210A_MADR[10]
110 SDO
111 SCZ
112 PWM0
SPI_CZ
SPI_DO
DDR2_A[11]
DDR2_BA1
DDR2_WEZ
AR814
56
206A_WEZ
207A_BADR[1]
208A_BADR[0]
113 PWM1
114 PWM2
115 PWM3
A_DIM
PWM_DIM
DDR2_A[6]
DDR2_A[8]
202GND_15
203A_MADR[6]
204A_MADR[8]
205A_MADR[11]
116 LVA4P
117 LVA4M
118 LVA3P
119 LVA3M
DDR2_A[2]
DDR2_A[0]
DDR2_A[4]
AR815
56
199A_MADR[0]
200A_MADR[2]
201A_MADR[4]
120 LVACKP
121 LVACKM
122 LVA2P
+1.8V_DDR
DDR2_CASZ
DDR2_RASZ
DDR2_ODT
R867 1K
+3.3V_MULTI
AR800
56
C844 0.1uF
C863 0.1uF
L802
120-ohm
R868 1K
5A_BEAD_MAG
+1.8V_DDR
193GND_14
194AVDD_MEMPLL
195MVREF
196A_ODT
197A_RASZ
198A_CASZ
192B_MCLKZ
191B_MCLK
190B_MDATA[5]
189B_MDATA[2]
188B_MDATA[0]
187B_MDATA[7]
186AVDD_DDR_5
185B_MDATA[13]
184B_MDATA[10]
183GND_13
182B_MDATA[8]
181B_MDATA[15]
180AVDD_DDR_4
179B_DDR2_DQSB[1]
178B_DDR2_DQS[1]
177GND_12
176VDDP_4
175AVDD_DDR_3
174B_DDR2_DQSB[0]
173B_DDR2_DQS[0]
172GND_11
171B_DDR2_DQM[0]
170B_DDR2_DQM[1]
169AVDD_DDR_2
168B_MDATA[14]
167B_MDATA[9]
166GND_10
165B_MDATA[12]
164B_MDATA[11]
163AVDD_DDR_1
162B_MDATA[6]
161B_MDATA[1]
160GND_9
159B_MDATA[3]
158B_MDATA[4]
157VDDC_5
156VDDP_3
155GPIO58
154GPIO57
153GPIO56
152GPIO55
151GPIO54
150GPIO53
149GPIO52
148GPIO51
147GND_8
146GPIO152/I2C_OUT_SD3
145GPIO151/I2C_OUT_SD2
144GPIO150/I2C_OUT_MUTE
143VDDC_4
142GND_7
141AVDD_LPLL
140LVB0M
139LVB0P
138LVB1M
137LVB1P
136LVB2M
135LVB2P
134LVBCKM
133LVBCKP
132LVB3M
131LVB3P
130LVB4M
129LVB4P
123 LVA2M
124 LVA1P
125 LVA1M
126 LVA0P
127 LVA0M
128 VDDP_2
+3.3V_MULTI
R811
R883
1K
1K
READY
R884
R889
1K
1K
READY
[MODE SELECTION]
L802-*1
CIS21J121
5A_BEAD_SS
+1.2V_VDDC_MST
R843 33
R844 33
C853 0.1uF
C849 0.1uF
C848 0.1uF
R8038 1K
C850 0.01uF
C842 0.1uF
’11 ATV(H6R)
Mstar
DDR2_MCLKZ
DDR2_MCLK
DDR2_D[5]
AR805
DDR2_D[2]
56
DDR2_D[0]
DDR2_D[7]
DDR2_D[13]
AR806
DDR2_D[10]
56
DDR2_D[8]
DDR2_D[15]
DDR2_DQS1M
DDR2_DQS1P
DDR2_DQS0M
DDR2_DQS0P
DDR2_DQM0
DDR2_DQM1
DDR2_D[14]
AR809
DDR2_D[9]
56
DDR2_D[12]
DDR2_D[11]
DDR2_D[6]
AR810
DDR2_D[1]
56
DDR2_D[3]
DDR2_D[4]
MUTE_AUDIO_OUT
SUB_SCL
SUB_SDA
PANEL_ON
INV_CTL
SW_RESET
DDC_WP
Close to IC as close as possible
+1.2V_VDDC_MST
C859
C857
0.01uF
0.01uF
C877
0.01uF
C878
0.01uF
C879
0.01uF
+1.8V_DDR
C864
0.01uF
C858
0.01uF
C860
0.01uF
C862
0.01uF
C865
0.01uF
DDR2_D[0-15]
READY
R809 4.7K
R810
R865 10K
R866 10K
R819 3.3K
TXCO4TXCO4+
TXCO3TXCO3+
TXCLKOTXCLKO+
TXCO2TXCO2+
TXCO1TXCO1+
TXCO0TXCO0+
TXCE4TXCE4+
TXCE3TXCE3+
TXCLKETXCLKE+
TXCE2TXCE2+
TXCE1TXCE1+
TXCE0TXCE0+
LGE4767A (Matrix SD Divx_ Non RM_NON SRS_TSMC)
1K
+3.3V_MST
+3.3V_MULTI
+3.5V_MST
+3.3V_MULTI
IC800-*1
DIVX_REPLACEMENT
AVDD_DDR_6
A_MADR[5]
A_MADR[9]
A_MADR[12]
A_MADR[7]
A_MADR[3]
A_MCLKE
VDDC_6
I2S_IN_WS/GPIO67
I2S_IN_BCK/GPIO68
I2S_IN_SD
I2S_OUT_MCK
I2S_OUT_WS
VDDP_5
GND_16
VDDC_7
I2S_OUT_BCK
I2S_OUT_SD
SPDIFO
UART2_RX/I2CM_SDA
UART2_TX/I2CM_SCK
UART1_RX/GPIO86
UART1_TX/GPIO87
GND_17
GND_18
USB0_DM
USB0_DP
SAR0
SAR1
SAR2
SAR3
AVDD_MPLL
XOUT
XIN
GPIO134
GPIO135
GPIO138
GPIO139
GPIO140
IRIN
HSYNC0
VSYNC0
HSYNC1
VSYNC1
CEC
HWRESET
RXBCKN
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
256
1
RXBCKP
2
RXB0N
3
RXB0P
4
HOTPLUGB
5
RXB1N
6
RXB1P
7
AVDD_33_1
8
RXB2N
9
RXB2P
10
RXACKN
11
RXACKP
12
RXA0N
13
RXA0P
14
AVDD_33_2
15
RXA1N
16
RXA1P
17
GND_1
18
RXA2N
19
RXA2P
20
HOTPLUGA
21
REXT
22
VCLAMP
23
REFP
24
REFM
25
BIN1P
26
SOGIN1
27
GIN1P
28
RIN1P
29
BINM
30
BIN0P
31
GINM
32
GIN0P
33
SOGIN0
34
RINM
35
RIN0P
36
AVDD_33_3
37
GND_2
38
BIN2P
39
GIN2P
40
SOGIN2
41
RIN2P
42
CVBS6
43
CVBS5
44
CVBS4
45
CVBS3
46
CVBS2
47
CVBS1
48
VCOM1
49
CVBS0
50
VCOM0
51
AVDD_33_4
52
CVBSOUT
53
GND_3
54
SIF0P
55
SIF0M
56
VDDC_1
57
AUL5
58
AUR5
59
AUVRM
60
AUOUTL2
61
AUOUTR2
62
AUOUTL1
63
AUOUTR1
64
65
73
74
76
79
80
81
82
84
88
91
94
96
97
100
101
102
103
104
105
106
107
108
109
110
SCK
SDI
SDO
AUL066AUR067AUL168AUR169AUL270AUR271AUL372AUR3
AUL475AUR4
AUCOM
GND_477AUVRP78AUVAG
GND_5
RXC0N98RXC0P99GND_6
RXC1N
RXC1P
RXC2N
RXC2P
VDDC_2
GPIO2089VDDP_190VDDC_3
RXCCKN95RXCCKP
AVDD_AU
DDCA_CK83DDCA_DA
AVDD_DM
USB1_DM
USB1_DP
DDCDA_CK85DDCDA_DA86DDCDB_CK87DDCDB_DA
UART2_RX92UART2_TX93DDCDC_CK
DDCDC_DA
HOTPLUGC
GND_14
AVDD_MEMPLL
MVREF
A_ODT
A_RASZ
A_CASZ
A_MADR[0]
A_MADR[2]
A_MADR[4]
GND_15
A_MADR[6]
A_MADR[8]
A_MADR[11]
A_WEZ
A_BADR[1]
A_BADR[0]
A_MADR[1]
A_MADR[10]
B_MCLKZ
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
192
B_MCLK
191
B_MDATA[5]
190
B_MDATA[2]
189
B_MDATA[0]
188
B_MDATA[7]
187
AVDD_DDR_5
186
B_MDATA[13]
185
B_MDATA[10]
184
GND_13
183
B_MDATA[8]
182
B_MDATA[15]
181
AVDD_DDR_4
180
B_DDR2_DQSB[1]
179
B_DDR2_DQS[1]
178
GND_12
177
VDDP_4
176
AVDD_DDR_3
175
B_DDR2_DQSB[0]
174
B_DDR2_DQS[0]
173
GND_11
172
B_DDR2_DQM[0]
171
B_DDR2_DQM[1]
170
AVDD_DDR_2
169
B_MDATA[14]
168
B_MDATA[9]
167
GND_10
166
B_MDATA[12]
165
B_MDATA[11]
164
AVDD_DDR_1
163
B_MDATA[6]
162
B_MDATA[1]
161
GND_9
160
B_MDATA[3]
159
B_MDATA[4]
158
VDDC_5
157
VDDP_3
156
GPIO58
155
GPIO57
154
GPIO56
153
GPIO55
152
GPIO54
151
GPIO53
150
GPIO52
149
GPIO51
148
GND_8
147
GPIO152/I2C_OUT_SD3
146
GPIO151/I2C_OUT_SD2
145
GPIO150/I2C_OUT_MUTE
144
VDDC_4
143
GND_7
142
AVDD_LPLL
141
LVB0M
140
LVB0P
139
LVB1M
138
LVB1P
137
LVB2M
136
LVB2P
135
LVBCKM
134
LVBCKP
133
LVB3M
132
LVB3P
131
LVB4M
130
LVB4P
129
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
SCZ
PWM0
PWM1
PWM2
PWM3
LVA4P
LVA4M
LVA3P
LVA3M
LVA2P
LVA2M
LVA1P
LVA1M
LVA0P
LVA0M
LVACKP
LVACKM
VDDP_2
10/12/29
7 12
Page 26
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
DDR2
VREF
A10/AP
LDQS
UDQS
LDQS
UDQS
NC_4
NC_5
NC_6
NC_1
NC_2
NC_3
VSSDL
VDDL
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A11
A12
BA0
BA1
CLK
CLK
CKE
ODT
CS
RAS
CAS
WE
LDM
UDM
IC900-*1
W9725G6JB-25
J2
M8
M3
M7
N2
N8
N3
N7
P2
P8
P3
M2
P7
R2
L2
L3
J8
K8
K2
K9
L8
K7
L7
K3
F7
B7
F3
B3
E8
A8
L1
R3
R7
A2
E2
R8
J7
J1
DDR_WINBOND
DDR2_D[0-15]
+1.8V_DDR
1K
R907
C904
1K
0.01uF
R908
DDR2_A[0-12]
DQ0
G8
DQ1
G2
DQ2
H7
DQ3
H3
DQ4
H1
DQ5
H9
DQ6
F1
DQ7
F9
DQ8
C8
DQ9
C2
DQ10
D7
DQ11
D3
DQ12
D1
DQ13
D9
DQ14
B1
DQ15
B9
VDD_5
A1
VDD_4
E1
VDD_3
J9
VDD_2
M9
VDD_1
R1
Close to DDR2 IC
DDR2_BA0
DDR2_BA1
DDR2_MCLK
DDR2_MCLKZ
DDR2_CKE
C905
1000pF
V_REF
C918
0.1uF
DDR2_A[0]
DDR2_A[1]
DDR2_A[2]
DDR2_A[3]
DDR2_A[4]
DDR2_A[5]
DDR2_A[6]
DDR2_A[7]
DDR2_A[8]
DDR2_A[9]
DDR2_A[10]
DDR2_A[11]
DDR2_A[12]
C920
2.2uF
16V
DDR2_ODT
VDDQ_10
A9
VDDQ_9
C1
VDDQ_8
C3
VDDQ_7
C7
VDDQ_6
C9
VDDQ_5
E9
VDDQ_4
G1
VDDQ_3
G3
VDDQ_2
G7
VDDQ_1
G9
VSS_5
A3
VSS_4
E3
VSS_3
J3
VSS_2
N1
VSS_1
P9
VSSQ_10
B2
VSSQ_9
B8
VSSQ_8
A7
VSSQ_7
D2
VSSQ_6
D8
VSSQ_5
E7
VSSQ_4
F2
VSSQ_3
F8
VSSQ_2
H2
VSSQ_1
H8
DDR2_RASZ
DDR2_CASZ
DDR2_WEZ
DDR2_DQS0P
DDR2_DQS1P
DDR2_DQM0
DDR2_DQM1
DDR2_DQS0M
DDR2_DQS1M
+1.8V_DDR
C900
0.01uF
50V
R900
56
R902
56
R904
56
R906
150
READY
R901
56
R903
56
R905
56
V_REF
C919
10uF
10V
DDR2_D[0-15]
VREF
A10/AP
A11
A12
BA0
BA1
CKE
ODT
RAS
CAS
LDQS
UDQS
LDM
UDM
LDQS
UDQS
NC_4
NC_5
NC_6
NC_1
NC_2
NC_3
VSSDL
VDDL
IC900
K4T51163QI-HCF7
J2
A0
M8
A1
M3
A2
M7
A3
N2
A4
N8
A5
N3
A6
N7
A7
P2
A8
P8
A9
P3
M2
P7
R2
L2
L3
CK
J8
CK
K8
K2
K9
CS
L8
K7
L7
WE
K3
F7
B7
F3
B3
E8
A8
L1
R3
R7
A2
E2
R8
J7
J1
G8
G2
H7
H3
H1
H9
F1
F9
C8
C2
D7
D3
D1
D9
B1
B9
A1
E1
J9
M9
R1
A9
C1
C3
C7
C9
E9
G1
G3
G7
G9
A3
E3
J3
N1
P9
B2
B8
A7
D2
D8
E7
F2
F8
H2
H8
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
VDD_5
VDD_4
VDD_3
VDD_2
VDD_1
VDDQ_10
VDDQ_9
VDDQ_8
VDDQ_7
VDDQ_6
VDDQ_5
VDDQ_4
VDDQ_3
VDDQ_2
VDDQ_1
VSS_5
VSS_4
VSS_3
VSS_2
VSS_1
VSSQ_10
VSSQ_9
VSSQ_8
VSSQ_7
VSSQ_6
VSSQ_5
VSSQ_4
VSSQ_3
VSSQ_2
VSSQ_1
DDR2_D[0]
DDR2_D[1]
DDR2_D[2]
DDR2_D[3]
DDR2_D[4]
DDR2_D[5]
DDR2_D[6]
DDR2_D[7]
DDR2_D[8]
DDR2_D[9]
DDR2_D[10]
DDR2_D[11]
DDR2_D[12]
DDR2_D[13]
DDR2_D[14]
DDR2_D[15]
+1.8V_DDR
Close to DDR2 IC
+1.8V_DDR
C901
0.01uF
C902
0.01uF
C903
0.01uF
C906
0.01uF
C907
0.01uF
C908
0.01uF
C909
0.01uF
C910
0.01uF
C911
0.01uF
C912
0.01uF
C913
0.01uF
C914
0.01uF
C915
0.01uF
C916
0.01uF
C917
0.01uF
DDR_SS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR2 MEMORY
’11 ATV(H6R)
DDR
10/12/29
8 12
Page 27
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
+3.5V_MST
R1001
4.7K
B
C1057
0.1uF
NON_ADAPTER
C1076
0.1uF
NON_ADAPTER
R1076
22
C1088
3.3uF
50V
R1077
200K
1/8W
1%
C1065
2.2uF
10V
C
Q1000
MMBT3904(NXP)
E
NON_ADAPTER_SS
NON_ADAPTER_MAG
16V
16V
P_24V_ADAPTER
C1078
0.1uF
50V
ADAPTER
ADAPTER_NON_LED_DRIVER
C1079
0.1uF
50V
R1096
0
READY
EP_GND
VIN_2
VIN_1
22LV2130-TD Must be applied 2000H
REASON : CAP LIFE for CST TEST
R1003
RL_ON
10K
+3.5V_MST
C1045
100uF
16V
NON_ADAPTER
P_12V
C1075
100uF
16V
NON_ADAPTER
ADAPTER
JK1000
JPD003N-M432-4F
ADAPTER_NON_LED_DRIVER
P1004
SM14B-SRSS-TB
15
24V
SW
GND
24V
1
24V
2
24V
3
24V
4
24V
5
GND
6
GND
7
GND
8
GND
9
GND
10
ERROR_OUT
11
INV_ON
12
NC
13
PWM_DIM
14
GND
+3.5V_MST
Switching noise reducing [MPS recommend]
P_24V
C1087
0.1uF
50V
*ST 3.5V->3.3V
+3.3V_MST
READY
C1053
ZD1000
0.01uF
3.6V
50V
Q1005
MMBT3904(NXP)
C
R1000
4.7K
R1002 0
L1004-*1
CIS21J121
L1004
120-ohm
L1012
120-ohm
NON_ADAPTER_MAG
L1012-*1
CIS21J121
NON_ADAPTER_SS
+24V_LED_driver
C1080
0.01uF
50V
ADAPTER_NON_LED_DRIVER
R1082
100K
C1092
0.1uF
IC1008
MP4460DQ-LF-Z
BST
10
11
9
8
FREQ
7
$0.21
GND
6
C1052
10uF
16V
LIFE_1000H
E
B
READY
R1004
100K
READY
C1011
0.1uF
16V
READY
C1000
0.1uF
16V
READY
ERROR_OUT_26INCH
INV_CTL_26INCH
PWM_DIM_26INCH
50V
SW_1
1
THERMAL
SW_2
2
EN
3
COMP
4
FB
5
C1052-*1
10uF
16V
LIFE_2000H
R1039 0
close to pin
D1001
MBRA340T3G
C1093
220pF 50V
+3.5V_MST
FROM LIPS & POWER B/D
RL_ON2
NORMAL_EXPEPT_32
P1001
FW20020-24S
PWR ON
24V
GND
GND
3.5V
3.5V
GND
GND
12V
12V
12V
GND/P.DIM2
POWER_23_GND
R1089
R1086
68K R1091
READY
L1011
120-ohm
1%
R1041
12K
1%
R1042
10K
NORMAL_32
P1002
FM20020-24
24V
2
1
2
1
1
2
24V
3
4
3
4
4
3
GND
5
6
5
6
6
5
GND
7
8
7
8
8
7
3.5V
10
10
10
9
9
9
3.5V
12
11
12
11
11
12
GND
13
14
14
13
13
14
GND/V-sync
15
16
15
16
16
15
INV ON
17
18
17
18
18
17
A.DIM
20
20
20
19
19
19
P.DIM1
21 22
21 22
21
22
Err OUT
23 24
23 24
23
24
25
25
SLIM_32~52
P1003
SMAW200-H24S2
R1083
0
POWER_24_GND
PWM_DIM_26INCH
PWM_DIM_LED_DRIVER
ERROR_OUT_26INCH
* Option block : ADAPTER
0CZZB00110A : 22uF 20% 10V X7R 3216
EAE58111001 : 22uF 20% 16V X5R 3216
EAE62281601 : 22uF 20% 10V X5R 2012
L1018
3.6uH
NR8040T3R6N
18K
C1067
2.2uF
10V
READY
C1066
100pF
50V
R1085
470K
R1090
30K
1/10W
1%
VIN_1
VIN_2
VOUT_1
VOUT_2
C1096
22uF
16V
IC1005
MP20045DQ-LF-Z
1
2
THERMAL
3
4
NON_ADAPTER_MAG
NON_ADAPTER_SS
POWER_18_INV_CTL
POWER_24_INV_CTL
R1015 0
POWER_16_GND
POWER_20_PWM_DIM
POWER_22_PWM_DIM
POWER_24_PWM_DIM
ADAPTER_NON_LED_DRIVER
POWER_20_ERROR_OUT
POWER_24_ERROR_OUT
ADAPTER_NON_LED_DRIVER
Placed on SMD-TOP
C2001
C1098
10uF
22uF
10V
16V
READY
105K
1/10W
1%
EP[GND]
EN
8
PG
9
7
GND
6
FB
5
P_24V_ADAPTER
L1014
120-ohm
ADAPTER_MAG
L1003
120-ohm
L1003-*1
CIS21J121
ADAPTER_NON_LED_DRIVER
R1029
100
R1030
100
R1031 0
POWER_18_A_DIM
R1032 0
POWER_22_A_DIM
R1033 0
POWER_20_A_DIM
0R1034
0R1023
0R1017
0R1098
0R1010
LED_DRIVER
100R1035
100R1036
R1099 100
+24V_AMP
P_24V
C1099
0.1uF
50V
R1093
10K
POWER_SW
R1092
10K
RL_ON2
READY
+3.5V_MST
C1073
0.1uF
50V
R1061
4.7K
R1062
100K
L1014-*1
CIS21J121
ADAPTER_SS
C1043
C1058
68uF
0.1uF
35V
50V
+3.5V_MULTI
R1097
100
INV_CTL_26INCH
+3.5V_MULTI
AO3407A Vgs : 10.8V(24V input)
AO3407A Vgs : 8.3V(15V input)
C1074
R1094
2.2uF
22K
50V
R1095
C
B
E
C
R1072
6.8K
READY
E
C1044
2.2uF
R1040
4.7K
READY
G
27K
Q1010
MMBT3904(NXP)
R1046
1K
NON_LED_DRIVER
NON_LED_DRIVER
MMBT3904(NXP)
NON_LED_DRIVER
R1074
C1008
0.1uF
16V
READY
+12V/+15V
RL_ON2
**DC-DC CONVERTER
*12V -> 5V_MULTI
P_24V
+24V_AMP
L1015
120-ohm
NON_ADAPTER_MAG
L1015-*1
CIS21J121
NON_ADAPTER_SS
+3.5V_MST
R1071
READY
10K
R1047
10K
B
Q1006
10K
R1038 1K
ERROR_OUT
R1075
10K
READY
R1060
6.2K
INV_CTL
A_DIM
PWM_DIM
* Option block : ADAPTER
Q1011
S
AO3407A
L1021
3.3uH
CPI2520NHL3R3ME 2520
C1085
0.01uF
L1000
500
50V
C1089
3.3uF
50V
R1056
22K
READY
C1001
10uF
25V
C1090
3.3uF
50V
R1059
1%
120K
C1002
10uF
25V
C1086
3.3uF
50V
C1091
0.1uF
50V
R1
R1079
6.8K
1%
R1080
1.6K
1%
C1003
0.1uF
50V
C1012
0.01uF
50V
R1005
0
P_12V
D
P_24V
[Pinmap for EEFL]
PIN
16
20(13)
22(14)
24(11)
23
LIPS CMI(PSU)
GND
INV_ON18(12)
INV_ON
VBR-A
PWM_DIM
ERR_OUT
PWM_DIM
ERR_OUT
GND
GND
NC
NC
AUO(PSU)
GND
INV_ON
PWM_DIM
ERR_OUT
IPS(PSU)
GND
INV_ON
NC
PWM_DIM
ERR_OUT
NC
[Pinmap for Edge LED]
PIN
18(12) INV_ON
LPB
INV_ON
20(13)
22(14) PWM_DIM
24(11)
PWM_DIM PWM_DIM
ERR_OUT
23
CMI(PSU)
NC
GND
INV_ON
NC
ERR_OUT
NC
AUO(PSU)
IPS(PSU)
GND GND16
INV_ON
NC
PWM_DIM
ERR_OUT
NC
NC NC
ERR_OUT ERR_OUT
[Power for EEFL] [Power for LED]
LGD OS
32"
37"
47"
’1O LIPS
’1O LIPS
’1O LIPS
’11 PSU
’11 PSU
’11 PSU
X
32"
37"
42"
47"
+24V_LED Driver
* Option block : ADAPTER
C1083
R1037
2.2uF
C1082
0.1uF
50V
B
22K
50V
G
R1022
27K
C
AO3407A Vgs : 10.8V
Q1007
MMBT3904(NXP)
E
* Option block : ADAPTER
L1019
4.7uH
C1004
100pF
50V
Placed on SMD-TOP
C1097
10uF
25V
C1006
C1071
10uF
10uF
16V
16V
+24V_AMP
Close to AMP IC
MP8670DN-LF-Z
IN
EN/SYNC
FB
R2
GND
PGND
1
VIN
2
AGND
3
FB
4
C1046
68uF
35V
READY
IC1009
8
7
$0.37
6
5
IC1003
AOZ1073AIL
3A
P_24V
ADAPTER_MAG
L1016
MLB-201209-0120P-N2
ADAPTER_SS
L1016-*1
CIS21J121
R1006
RL_ON2
SW
1
BST
2
VCC
3
BG
4
LX_2
8
LX_1
7
EN
6
R1014
COMP
5
9.1K
R1087
22
R1088
C1050
2200pF
0
C1095
1uF 25V
C1094
1uF 50V
G
S_3
S_2
S_1
SI4124DY-T1-GE3(VISHAY)
close to IC1009
NR8040T3R6N
L1001
3.6uH
+3.5V_MULTI
R1013
10K
C1034
0.1uF
16V
10K
SP-7850_4.7
Q1009
4
5
D_1
3
6
D_2
2
7
D_3
1
8
D_4
V0 = 0.8*(1+(R1/R2))
R1007
5%
51K
R1
R1009
5%
1.5K
R1008
10K
R2
1%
NC
NC
NCNC
NC
’11 LPB42"
’11 LPB
+24V_LED_driver
S
Q1008
AO3407A
D
C1084
0.01uF
50V
real output : 12.3V
C1051
10uF
25V
C1072
C1020
0.1uF
10uF
16V
16V
LGD(PSU)
GND
INV_ON
VBR-A
PWM_DIM
ERR_OUT
LGD(PSU)
GND
INV_ON
PWM_DIM
’11 PSU
P_12V
C1081
0.1uF
50V
+5V_MULTI
C1007
0.1uF
50V
NC
NC
’11 PSU
’11 PSU
**5V_MULTI->3.3V->1.2V
IC1001
BD9130EFJ-E2
+3.5V_MULTI
C1059
10uF
16V
C1017
10uF
16V
R1043
12K
C1060
560pF
50V
ADJ
VCC
ITH
GND
1
2
3
4
MAX 2A
V0 = 0.8*(1+(R2/R1))
READY
L1010
C1062
10uF
6.3V
120-ohm
closed IC1007
READY
ZD1002
3.6V
READY
C1028
100uF
16V
C1054
0.1uF
50V
+3.3V_MULTI
C1063
0.1uF
50V
OSLGD
C1016
10uF
10V
EN
8
PVCC
7
SW
6
PGND
5
IN
C1015
0.1uF
50V
+3.5V_MST
C1068
1%
2.2uF
R1063
10V
12K
1%
R1064
10K
R1044
10K
READY
R1078
3.3
READY
C1055
2200pF
50V
IC1002
AP1117EG-13
3
C1070
2.2uF
10V
READY
C1069
100pF
50V
R1084
470K
L1002
2.2uH
MAX 1A
1
ADJ/GND
2
VIN_1
VIN_2
VOUT_1
VOUT_2
OUT
R1045
R2
C1014
C1013
0.1uF
10uF
16V
16V
V0 = 1.25*(1+(R2/R1))
OUT:1.85V
R1054
R1
120
R1055
56
R2
IC1007
MP20045DQ-LF-Z
1
9
2
THERMAL
3
4
C1018
10uF
16V
R1016
1
C1022
10uF
6.3V
8
7
6
5
R1
EP[GND]
EN
PG
GND
FB
2K
R1053
3.3K
C1023
0.1uF
50V
+1.2V_VDDC_MST
READY
OUT:1.27V
C1036
1uF
25V
L1013
READY
120-ohm
C1037
5A_BEAD_MAG
1uF
25V
L1013-*1
CIS21J121
5A_BEAD_SS
+3.5V_MULTI
READY
R1066
4.7K
READY
R1073
47K
R1067
100K
DDR2, Vref
+1.8V_DDR
C1077
10uF
6.3V
R1081
10K
POWER_SW
**Switch 12V:P12V
**Switch 3.5V:3.5.V_MULTI
Close to Q1003
AOZ1073AIL
1
2
3A
3
FB
4
R1020
10K
IC1006
P_12V
PANEL_12V_MAG
L1006
120-ohm
READY
C1027
68uF
35V
R1048
B
10K
+3.5V_MST
R1070
22K
R1068
B
10K
LX_2
8
LX_1
7
EN
6
COMP
5
L1005-*1
CIS21J121
PANEL_5V_SS
C1056
R1049
1uF
33K
25V
PANEL_12V
R1065
33K
PANEL_5V
C
R1065-*1
10K
Q1001
MMBT3904(NXP)
E
C1048
1uF
25V
R1069
1.6K
C
MMBT3904(NXP)
Q1004
E
R1058
9.1K
C1024
2200pF
L1006-*1
CIS21J121
PANEL_12V_SS
Q1003
AO4813
EBK60706901
READY
C1035
100pF
50V
D2_2
8
D2_1
7
D1_2
6
D1_1
5
OUT:6.8V
C1025
C1026
10uF
10uF
16V
16V
S2
1
G2
2
S1
3
G1
4
V0 = 0.8*(1+(R1/R2))
NR8040T3R6N
L1009
3.6uH
+3.5V_MULTI
R1057
10K
C1064
0.1uF
16V
R1011
1%
24K
R1
R1012
5%
51K
R1018
10K
R2
1%
C1029
10uF
16V
C1005
0.1uF
50V
C1019
10uF
16V
C1033
0.1uF
16V
CIS21J121
5A_BEAD_SS
L1007-*1
L1007
120-ohm
5A_BEAD_MAG
C1021
0.01uF
50V
READY
C1038
1uF
25V
R1050
2.2K
C1039
0.1uF
50V
R1051
2.2K
READY
100uF
16V
C1040
0.1uF
50V
IC1000
IC1004
AP1117EG-13
R1052
2.2K
READYC1061
ZD1001
3.6V
1
AP1117EG-13
2OUT 3 IN
IN
1
ADJ/GND
2OUT 3
PANEL_VCC
C1009-*1
47uF
16V
CMI_TN
C1009
100uF
16V
NON_CMI_TN
+3.5V_MULTI
ADJ/GND
R1026
330
R1025
110
+5V_TUNER
C1047
0.1uF
16V
R1027
330
R1019
110
READY
C1049
0.1uF
16V
C1010
0.01uF
50V
C1042
100uF
16V
+5V_USB
C1041
100uF
16V
+5V_MULTI
PANEL_5V_MAG
L1005
120-ohm
PANEL_ON
POWER_SW
**DC-DC CONVERTER
**12V->TUNER 5V
P_12V
C1032
0.1uF
50V
PGND
VIN
AGND
L1008
500
C1030
10uF
25V
C1031
10uF
25V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
’11 ATV(H6R)
Power
10/12/29
9 12
Page 28
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
+3.3V_MULTI
+3.5V_MST
R1123
10K
R1124
10K
READY
R1122
10K
MMBT3904(NXP)
Q1102
INV_CTL
3.3K -> 1K (threshold voltage up)
R1121
1K
R1118
6.8K
WLED_ENABLE
C
B
READY
E
+24V_LED_driver
WLED_ENABLE
ERROR_OUT
TN_module_LED_DRIVER_CIRCUIT
D10001
PDS5100H-13
D
Q10001
AP18T10GH
G
S
C10011
R10017
1000pF
0.1
1%
must be modifed
R10011-*2
59K
1/16W1%
CMI_TN
R10013-*2
59K
1/16W1%
CMI_TN
READY
C10022
10uF
100V
READY
R10001
100
1/10W
R10004
100K
1/10W
R10002
10K
1/10W
READY
C10001
2.2uF
50V
C10003
100pF
50V
R10005
100
1/10W
READY
C10002
2.2uF
50V
R10007
4.7
1/10W
R10006
390
1/10W
C10007
0.33uF
50V
C10021
0.1uF
50V
C10008
0.1uF
50V
2010.06.30. hwson
for thermal Issue
Operating Freq.
F=7.35x10^9/RT
C10005
0.1uF
50V
close to IC100
C104 : 10uF --> 2.2nF
C106 : 0.68uF --> 0.33uF
R111 : 470 --> 390
2010.02.07 for PQ/19V_LED
C10006
2200pF
50V
R113/R114
R10008
16K 1%
R10009
51K 1%
READY
L10001
close to IC100
C10009
1uF
10V
COMP
R10011
47K
1/10W
1%
AUO_TN
33uH
C10010
1000pF
50V
READY
must be modifed
[EP]PGND/LEDGND
IN
1
THERMAL
EN
2
3
MAX16814
RT
4
FLT
5
6
OVP
R10013
51K
1/10W
5%
AUO_TN
R10010
10K
1/8W
R10014
7.5K
1/8W
R10012
5.1
READY
NDRV
DRV20VCC
18
19
21
IC100
7
8
SETI9SGND
RSDT
R10015
3.3
1/10W
5%
R10016
3K
1/8W
R120 : 6.8K --> 3K
R121 : 0.03 --> 0.1
2010.06.30 HWSON
PGND
OUT4
16CS17
15
OUT3
14
LEDGND
13
OUT2
12
OUT1
11
10
DIM
R10011-*1
27K
1/10W
1%
LGD_TN
R10013-*1
27K
1/10W
1%
LGD_TN
50V
R10018
560K
1/10W
C10012
2.2uF
100V
OVP setting
R10019
16K
1/10W 5%
18.5_AUO_TN
C10013
1000pF
50V
C10014
10uF
100V
R10019-*1
11K
1/10W 5%
21.5_AUO_LGD_TN
C10015
1000pF
50V
C10016
10uF
100V
READY
C10017
1000pF
50V
C10018
2.2uF
100V
ESD protection solution
C10020
2.2uF
100V
READY
R10019-*2
18K
1/10W 1%
18.5_CMI_TN
C10019
1000pF
50V
R10019-*3
13K
1/10W 5%
21.5_CMI_TN
5%
READY
1/10W
CMI & AUO TN
CMI_AUO_TN
R10020
0
1/10W
CMI_AUO_TN
5%
0
0
5%
1/10W
R10022
R10023
LGD TN
R10021
0
1/10W
5%
READY
wafer modify & resister add
P7701
12507WR-06L
1
2
3
4
5
6
7
R10003
PWM_DIM_LED_DRIVER
100
1/10W
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C10004
100pF
50V
ILED=1500/RSETI
Module
AUO_18.5_HD AUO_18.5 560Kohm
AUO_21.5_FHD
CMI_18.5_HD
CMI_21.5_FHD
60mA_Typ
63mA_Max
110mA_Typ
120mA_Max
50mA_Typ
56mA_Max
R10011
47Kohm
27Kohm
R10013
51Kohm
27Kohm
59Kohm 59Kohm
Remark
61.35mA
111.11mA
50.85mA
OVP setting
Module
AUO_21.5
CMI_18.5
Vs spec
34V_Typ
36V_Max
52.8V_Typ
57.6V_Max
51.2V_Typ
56V_Max
33V_Typ
34V_Max
44.8V_Typ
47.6V_Max
OVP=1.23x(1+R1/R2)
R10018ILED spec
560Kohm
560Kohm
560KohmCMI_21.5
R10019
16Kohm
11Kohm
11KohmLGD_21.5_FHD LGD_21.5
18Kohm560Kohm
13Kohm
Remark
44.28V
63.85V
63.85V
39.5V
54.26V
’11 ATV(H6R)
LED DRIVER
min Typ Max
18.5 AUO
21.5 AUO
21.5 LGD
30 34 36
52.848 57.6
51.2- 56
3328
21.5 CMI 39.2 44.8
10/12/29
10 12
3418.5 CMI
47.6
Page 29
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
LVDS WAFER
[51Pin LVDS Connector]
(For FHD 60Hz_Large)
WAFER_FHD_51P
P401
FI-RE51S-HF-J-R1500
[51]
1
[50]
2
[49]
3
[48]
4
[47]
5
[46]
6
[45]
7
[44]
8
[43]
9
[42]
10
[41]
11
[40]
12
[39]
13
[38]
14
[37]
15
[36]
16
[35]
17
[34]
18
[33]
19
[32]
20
[31]
21
[30]
22
[29]
23
[28]
24
[27]
25
[26]
26
[25]
27
[24]
28
[23]
29
[22]
30
[21]
31
[20]
32
[19]
33
[18]
34
[17]
35
[16]
36
[15]
37
[14]
38
[13]
39
[12]
40
[11]
41
[10]
42
[09]
43
[08]
44
[07]
45
[06]
46
[05]
47
[04]
48
[03]
49
[02]
50
[01]
51
52
.
R444 0
FHD_51P_IPS
C413
10uF
16V
READY
PANEL_VCC
L409
120-ohm
FHD_51P
C414
C415
1000pF
0.1uF
50V
16V
READY
FHD_51P
R434 10K
FHD_51P_BIT_SEL_LOW
TXCE0+
TXCE0-
TXCE1+
TXCE1-
TXCE2+
TXCE2-
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
TXCE4+
TXCE4-
TXCO0+
TXCO0-
TXCO1+
TXCO1-
TXCO2+
TXCO2-
TXCLKO+
TXCLKO-
TXCO3+
TXCO3-
TXCO4+
TXCO4-
[30Pin LVDS Connector]
(For FHD 60Hz_22"TN)
P404
FF10001-30
WAFER_FHD_22_TN
[30]
1
[29]
2
[28]
3
[27]
4
[26]
5
[25]
6
[24]
7
[23]
8
[22]
9
[21]
10
[20]
11
[19]
12
[18]
13
[17]
14
[16]
15
[15]
16
[14]
17
[13]
18
[12]
19
[11]
20
[10]
21
[09]
22
[08]
23
[07]
24
[06]
25
[05]
26
[04]
27
[03]
28
[02]
29
[01]
30
31
.
C419
10uF
16V
READY
C420
1000pF
50V
READY
TXCO3-
TXCO3+
TXCLKO-
TXCLKO+
TXCO2-
TXCO2+
TXCO1-
TXCO1+
TXCO0-
TXCO0+
TXCE3-
TXCE3+
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
PANEL_VCC
120-ohm
C421
0.1uF
16V
L412
FHD_22_TN
FHD_22_TN
[30Pin LVDS Connector]
(For HD 60Hz_Large)
P402
FF10001-30
WAFER_HD_LARGE
[30]
1
R449 0 READY
[29]
2
[28]
3
[27]
4
[26]
5
[25]
6
[24]
7
[23]
8
[22]
9
[21]
10
[20]
11
[19]
12
[18]
13
[17]
14
[16]
15
[15]
16
[14]
17
[13]
18
[12]
19
[11]
20
R418 0 READY
[10]
21
[09]
22
[08]
R417 0 HD_LARGE
23
[07]
24
[06]
25
[05]
26
[04]
27
[03]
28
[02]
29
[01]
30
31
.
C416
10uF
16V
READY
PANEL_VCC
C417
1000pF
50V
READY
TXCE3-
TXCE3+
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
L410
120-ohm
HD_LARGE
C418
0.1uF
16V
HD_LARGE
+3.3V_MULTI
READY
R420
4.7K
READY
R421
10K
[30Pin LVDS Connector]
(For HD 60Hz_19"/22")
P405
FF10001-30
WAFER_HD_19_22
[30]
1
[29]
2
[28]
3
[27]
4
[26]
5
[25]
6
[24]
7
[23]
8
[22]
9
[21]
10
[20]
11
[19]
12
[18]
13
[17]
14
[16]
15
[15]
16
[14]
17
[13]
18
[12]
19
[11]
20
[10]
21
[09]
22
[08]
23
[07]
24
[06]
25
[05]
26
[04]
27
[03]
28
[02]
29
[01]
30
31
.
JEIDA
LGD H L/NC
CMI
AUO
IPS TBD
TBD
VESA
L/NCH
L
H/NC
C422
10uF
16V
READY
C423
1000pF
50V
READY
TXCE3-
TXCE3+
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
PANEL_VCC
L413
120-ohm
HD_19_22
C424
0.1uF
16V
HD_19_22
LVDS_SEL
+3.3V_MULTI
R447
4.7K
READY
R448
10K
READY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GAS1
MDS62110204
5.5T_GAS
GAS2
MDS62110204
5.5T_GAS
’11 ATV(H6R)
SMD GASKET
GAS1-*1
MDS62110206
6.5T_GAS
GAS2-*1
MDS62110206
6.5T_GAS
LVDS
GAS1-*2
MDS62110205
7.5T_GAS
GAS2-*2
MDS62110205
7.5T_GAS
GAS1-*3
MDS62110209
8.5T_GAS
GAS2-*3
MDS62110209
8.5T_GAS
GAS1-*4
MDS61887710
9.5T_GAS
GAS2-*4
MDS61887710
9.5T_GAS
GAS1-*5
MDS61887708
12.5T_GAS
GAS2-*5
MDS61887708
12.5T_GAS
10/12/22
11 12
Page 30
EAX64049202
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91U
SW_RESET
SPK_OUT_MUTE
Hotel option for China(External speaker out)
EXT_SPEAKER_AMP
+24V_AMP
EXT_SPK
L2101
CB3216UA121
EXT_SPK
EXT_SPK
C2104
1uF
C2105
1uF
EXT_SPK
C2106
0.1uF
50V
EXT_SPK
CB3216UA121
L2100
EXT_SPK
PVCCL_1
SD
PVCCL_2
MUTE
LIN
RIN
BYPASS
AGND_1
AGND_2
PVCCR_1
VCLAMP
PVCCR_2
C2107
0.1uF
50V
IC2100
TPA3124D2PWPR
1
EXT_SPK
2
3
4
5
6
7
8
9
10
11
12
EXT_SPK
PGNDL_2
24
PGNDL_1
23
22
21
20
19
18
17
16
15
14
13
LOUT
BSL
AVCC_2
AVCC_1
GAIN0
GAIN1
BSR
ROUT
PGNDR_2
PGNDR_1
EXT_SPK
EXT_SPK
C2109
0.22uF
25V
C2108
0.22uF
25V
EXT_SPK
C2110
0.1uF
50V
C2111
10uF
35V
EXT_SPK
EXT_SPK
READY
R2106
10K
R2107
10K
EXT_SPK
L2102
22.0uH
EXT_SPK
L2103
22.0uH
READY
R2108
10K
R2109
10K
EXT_SPK
R2110
4.7K
EXT_SPK
R2111
4.7K
EXT_SPK
C2112
2.2uF
50V
EXT_SPK
EXT_SPK
C2113
2.2uF
50V
C2114
2.2uF
50V
EXT_SPK
C2115
2.2uF
50V
100uF
EXT_SPK
C2116
100uF
16V
EXT_SPK
C2117
16V
EXT_SPK
10K
R2113
10K
R2112
EXT_SPK_L
EXT_SPK
EXT_SPK_R
EXT_SPK
READY
R2114
0
4.7K
R2115
EXT_SPK
READY
R2102
100
1K
R2103
EXT_SPK
B
+24V_AMP
B
R2116
10K
EXT_SPK
C
EXT_SPK
Q2101
MMBT3904(NXP)
E
R2104
10K
EXT_SPK
C
EXT_SPK
Q2100
MMBT3904(NXP)
E
MNT_L_AMP
MNT_R_AMP
EXT_SPK
C2100
1uF
16V
C2101
1uF
16V
EXT_SPK
C2102
10uF
35V
EXT_SPK
C2103
22uF
35V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
’11 ATV(H6R)
Hotel opt(CHINA)
10/12/29
12 12
Page 31
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