LG 32LN5650 Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LB31J

MODEL : 32LN5650 32LN5650-TA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL67697801 (1303-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 8

BLOCK DIAGRAM ................................................................................. 14

EXPLODED VIEW .................................................................................. 15

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this service manual. CAUTION: Do not connect the test xture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some eld-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LED TV used LB31J chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.

5) The receiver must be operated for about5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

No. Item Specication Remarks

1. Market

2. Broadcasting system

3. Channel Storage ATV - 135EA, DTV - 1000EA

4. Receiving system

5. Video(Composite Input) PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60

6. Component Input Y/Cb/Cr, Y/Pb/Pr

7. HDMI Input

8. SPDIF out SPDIF out Only LB31B, LB31F chassis

9 USB Input For My Media(Movie/Photo/Music List) and SVC

10 Headphone

Asia, Oceania, Africa, Middle East (PAL/DVB Market)

1) PAL/SECAM-B/G/D/K

2) PAL-I

3) NTSC-M

4) DVB-T

Analog : Upper Heterodyne Digital : COFDM(DVB-T)

HDMI1-DTV/DVI HDMI2-DTV/DVI

► DVB-T

- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

Only for training and service purposes

- 6 -

5. Component Video Input (Y, Cb/Pb, Cr/Pr)

No. Resolution H-freq(kHz) V-freq(Hz) Porposed

1 720×480 15.73 60.00 SDTV, DVD 480i

2 720×480 15.63 59.94 SDTV, DVD 480i

3 720×480 31.47 59.94 480p

4 720×480 31.50 60.00 480p

5 720×576 15.625 50.00 SDTV, DVD 625 Line

6 720×576 31.25 50.00 HDTV 576p

7 1280×720 45.00 50.00 HDTV 720p

8 1280×720 44.96 59.94 HDTV 720p

9 1280×720 45.00 60.00 HDTV 720p

10 1920×1080 31.25 50.00 HDTV 1080i

11 1920×1080 33.75 60.00 HDTV 1080i

12 1920×1080 33.72 59.94 HDTV 1080i

13 1920×1080 56.250 50 HDTV 1080p

14 1920×1080 67.5 60 HDTV 1080p

6. HDMI Input : Refer to adjust specification about EDID data.

6.1. DTV mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

1. 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P

2. 720*576 31.25 50 54 SDTV 576P

3. 1280*720 37.500 50 74.25 HDTV 720P

4. 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P

5. 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I

6. 1920*1080 28.125 50.00 74.25 HDTV 1080I

7. 1920*1080 26.97 / 27 23.97 / 24 74.17/74.25 HDTV 1080P

8. 1920*1080 33.716/33.75 29.976/30.00 74.25 HDTV 1080P

9. 1920*1080 56.250 50 148.5 HDTV 1080P

10. 1920*1080 67.43 / 67.5 59.94 / 60 148.35/148.50 HDTV 1080P

6.2. PC mode

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 640*350 @70Hz 31.468 70.09 25.17 EGA

2. 720*400 @70Hz 31.469 70.08 28.321 DOS

3. 640*480 @60Hz 31.469 59.940 25.175 VESA(VGA)

4. 800*600 @60Hz 37.879 60.31 40.000 VESA(SVGA)

5. 1024*768 @60Hz 48.363 60.00 65.000 VESA(XGA)

6 1152*864 @60Hz 54.348 60.053 80.002 VESA

7. 1280*1024 @60Hz 63.981 60.020 108 VESA(SXGA) FHD only(Support to HDMI-PC)

8. 1360*768 @60Hz 47.712 60.015 85.5 VESA(WXGA)

9. 1920*1080 @60Hz 67.5 60.0 148.5

- 7 -

Only for training and service purposes

WUXGA (Reduced blanking)

FHD only(Support to HDMI-PC)

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with LB31J chassis.

2. Designation

(1) Th e ad justm ent is accord ing to the order whic h is

designated and which must be followed, according to the

plan which can be changed only on agreeing. (2) Power adjustment : Free Voltage. (3) Magnetic Field Condition: Nil. (4) Input signal Unit: Product Specification Standard. (5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25 °C ± 5 °C Relative humidity : 65 ± 10 % Input voltage : 100-220 V~, 60 Hz

(6) Adjustment equipments

: Color Analyzer(CA-210 or CA-110), Service remote control.

(7) Push the “IN STOP" key - For memory initialization.

Case1 : Software version up

1. After downloading S/W by USB , TV set will reboot automatically.

2. Push “In-stop” key.

3. Push “Power on” key.

4. Function inspection

5. After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line

1. When TV set is entering on the assembly line, Push “In-stop” key at rst.

2. Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

3. After function inspection, Push “In-stop” key.

(4) Click "Connect" tab. If "Can't" is displayed, check connection

between computer, jig, and set.

(2)

(3)

Please Check the Speed : To use speed between from 200KHz to 400KHz

(5) Click "Auto" tab and set as below. (6) Click "Run". (7) After downloading, check "OK" message.

(4)

filexxx.bin

(5)

(7)...........OK

(6)

3. Main PCB check process

▪ APC - After Manual-Insert, executing APC

* Boot file Download

(1) Execute ISP program "Mstar ISP Utility" and then click

"Config" tab.

(2) Set as below, and then click "Auto Detect" and check "OK"

message. If "Error" is displayed, check connection between computer, jig, and set.

(3) Click "Read" tab, and then load download file(XXXX.bin)

by clicking "Read"

(1)

filexxx.bin

* USB DOWNLOAD(*.epk file download)

(1) Put the USB Stick to the USB socket. (2) Automatically detecting update file in USB Stick.

- If version of update file in USB Stick is lower, it will not work. But version of update file is higher, USB data will be detected automatically.

Only for training and service purposes

- 8 -

(3) Show the message "Copying files from memory".

(4) Updating is starting.

4. ADC Process

4.1. ADC

- Enter Service Mode by pushing "ADJ" key,

- Enter Internal ADC mode by pushing "►" key at "8. ADC Calibration".

<Caution> Using "P-ONLY" key of the Adjustment remote

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration ►

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L

13. Sub B/C

14. Ext. Input Adjust

control, power on TV.

ADC Calibration

ADC Comp 480i

ADC Comp 1080p

ADC Type

Start

Reset

OPT

NG

(5) Updating Completed, The TV will restart automatically. (6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If updated version is higher than what TV has, the TV can

lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ATV test on production line.

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number) (4) Completed selecting Tool option.

*

RS-232C Connection Method.

Connection : PCBA (USB Port) → USB to Serial Adapter (UC-232A) → RS-232C cable → PC(RS-232C port)

● Product name of USB to Serial Adapter is UC-232A.

* ADC Calibration Protocol (RS232)

NO Item CMD 1 CMD 2 Data 0

Enter Adjust MODE

ADC adjust ADC Adjust A D 1 0

Adjust ‘Mode In’

A A 0 0

When transfer the ‘Mode In’, Carry the command.

Automatically adjustment (The use of a internal pattern)

Adjust Sequence ▪ aa 00 00 [Enter Adjust Mode] ▪ xb 00 40 [Component1 Input (480i)] ▪ ad 00 10 [Adjust 480i Comp1] ▪ aa 00 90 End Adjust mode * Required equipment : Adjustment remote control.

4.2. Function Check

4.2.1. Check display and sound

■ Check Input and Signal items.

(1) TV (2) AV (CVBS) (3) COMPONENT (480i) (4) HDMI * Display and Sound check is executed by Remote control.

<Caution> Not to push the "INSTOP" key after completion if

the function inspection.

Only for training and service purposes

- 9 -

5. Total Assembly line process

5.1. Adjustment Preparation

▪ W/B Equipment condition

CA210: CH14, Test signal: Inner pattern(80IRE)-LED Module

▪ Above 5 minutes H/run in the inner pattern. ("power on" key

of Adjustment remote control)

* Connecting picture of the measuring instrument

(On Automatic control) Inside Pattern is used when W/B is controlled. Connect to auto controller or push Adjustment Remote control POWER ON → Enter the mode of White-Balance, the pattern will come out.

* The spec of color temperature and coordinate.

Mode Color Temp Color coordinate Remark

Cool (C50) 13,000 K

Medium(0) 9,300 K

Warm(W50) 6,500 K

X=0.271 (±0.002) Y=0.270 (±0.002)

X=0.285 (±0.002) Y=0.293 (±0.002)

X=0.313 (±0.002) Y=0.329 (±0.002)

- Inner pattern for W/B adjust

- External white pattern

(80IRE, 204gray)

▪ W/B Table in process of aging time

- LGD / CMI Module

Normal Line

Aging time Cool Medium Warm

color coordinate x y x y x y

Target 271 270 285 293 313 329 1 0-2 281 287 295 310 320 342 2 3-5 280 285 294 308 319 340 3 6-9 278 284 292 307 317 339 4 10-19 276 281 290 304 315 336 5 20-35 275 277 289 300 314 332 6 36-49 274 274 288 297 313 329 7 50-79 273 272 287 295 312 327 8 80-119 272 271 286 294 311 326 9 Over 120 271 270 285 293 310 325

aging chamber

Aging time Cool Medium Warm

color coordinate x y x y x y

Target 271 270 285 293 313 329 1 0-5 280 285 294 308 319 340 2 6-10 276 280 290 303 315 335 3 11-20 272 275 286 298 311 330 4 21-30 269 272 283 295 308 327 5 31-40 267 268 281 291 306 323 6 41-50 266 265 280 288 305 320 7 51-80 265 263 279 286 304 318 8 81-119 264 261 278 284 303 316 9 Over 120 264 260 278 283 303 315

- AUO/ COST/ SHARP/ BOE Module which cool spec is 13000K

cool med Warm

x y x y x y

spec 271 270 285 293 313 329

target 276 289 299 317 335 340

Full White Pattern

RS-232C Communication

CA-210

COLOR ANALYZER TYPE : CA-210

* Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (Illumination is less than 10 lux).

(2) Adhere closely the Color analyzer(CA210) to the module

less than 10 cm distance, keep it with the surface of the Module and Color analyzer's prove vertically.(80° ~ 100°).

(3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.

- Using 'no signal' or 'POWER ONLY' or the others, check the back light on.

▪ Auto adjustment Map(RS-232C)

RS-232C COMMAND [CMD ID DATA] Wb 00 00 White Balance Start Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

MIN

Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0.(When R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)

CENTER

(DEFAULT)

MAX

Only for training and service purposes

- 10 -

* Manual W/B process using adjust Remote control.

■ Color analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000.

■ Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting.

■ After enter Service Mode by pushing “ADJ” key,

■ Enter White Balance by pushing “►” key at “9. White Balance”.

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 10 Point WB

11. Test Pattern

12 EDID D/L

13. Sub B/C

14. Ext. Input Adjust

■ For manual adjustment, it is also possible by the following sequence.

(1) Set TV in Adj. mode using “P-ONLY” key on remote

controller and then operate heat run longer than 15 minutes.(If not executed this step, the condition for W/B

may be different.) (2) Push “Exit” key. (3) Enter White Balance mode by pushing the ADJ key and

select “9. White Balance”. When KEY (►) is pressed,

206 Gray internal pattern will be displayed. (4) Zero Calibrate the probe of Color Analyzer, then place it

on the center of LCD module within 10 cm of the surface (5) Sele ct eac h it ems (R ed/Gr een/Blu e Ga in) us ing

▲/▼(CH +/-) key on Remote control. (6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C. (7) Adjust three modes all (Cool / Medium / Warm)

- For All model w/o LS345 Fix the one of R/G/B gain and change the others

- For G-FIX model Cool Mode

1) Fix the one of R/G/B gain to 192 (default data) and

decrease the others. (If G gain is adjusted over 172 and R and B gain less than 192 , Adjust is O.K.)

2) If G gain is less than 172, Increase G gain by up to

172, and then increase R gain and G gain same amount of increasing G gain.

3) If R gain or B gain is over 255, readjust G gain less

than 172, Conform to R gain is 255 or B gain is 255 Medium / Warm Mode - Fix the one of R/G/B gain to 192 (default data) and decrease the others.

(8) When adjustment is completed, exit adjustment mode

using EXIT key on Remote control.

Whit Balance

Color Temp. ◄ ►

R-Gain

G-Gain

B-Gain

R-Cut

G-Cut

B-Cut

Test-Pattern

Backlight

Reset To Set

Cool

172

192

64

ON

100

* CASE Cool

First adjust the coordinate far away from the target value(x, y).

1) x, y > target i) Decrease the R, G.

2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others.

3) x > target, y < target i) First decrease B, so make y a little more than the

target.

ii) Adjust x value by decreasing the R.

4) x < target, y > target i) First decrease B, so make x a little more than the

target.

ii) Adjust x value by decreasing the G.

* After You finish all adjustments, Press “In-start” button

and compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable.

If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.

* Push the “IN STOP" key after completing the function

inspection.

5.2. DDC EDID Write (HDMI 256Byte)

■ Connect HDMI Signal Cable to HDMI Jack.

■ Write EDID DATA to EEPROM(24C02) by using DDC2B protocol.

■ Check whether written EDID data is correct or not.

* For SVC main Assembly, EDID have to be downloaded to

Insert Process in advance.

5.3. EDID DATA

1) All Data : HEXA Value

2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***: Year : Controlled ****: Check sum

- Auto Download

■ After enter Service Mode by pushing “ADJ” key,

■ Enter EDID D/L mode.

■ Enter “START” by pushing “OK” key.

EZ ADJUST

0. Tool Option1

1. Tool Option2

2. Tool Option3

3. Tool Option4

4. Tool Option5

5. Tool Option Commercial

6. Country Group

7. Area Option

8. ADC Calibration

9. White Balance

10. 10 Point WB

11. Test Pattern

12. EDID D/L ►

13. Sub B/C

14. Ext. Input Adjust

EDID D/L

HDMI1 NG

HDMI2 NG

Reset

Start

EDID D/L

HDMI1 OK

HDMI2 OK

Reset

Start

Only for training and service purposes

- 11 -

[Caution] * Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

5.4. Outgoing condition Configuration

■ When pressing IN-STOP key by Service remote control, Red LED are blinked alternatively. And then automatically turn off. (Must not AC power OFF during blinking)

* Edid data and Model option download (RS232)

NO Item CMD 1 CMD 2 Data 0

Enter download Mode

EDID data and Model option download

No. Item Condition Hex Data

1 Manufacturer ID GSM 1E6D

2 Version Digital : 1 01

3 Revision Digital : 3 03

(1) 2D HD HDMI EDID DATA

0 0 ff ff ff ff ff ff 00 1E 6D a b 10 c 01 03 80 A0 5A 78 0A EE 91 A3 54 4C 99 26 20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 01 01 30 01 01 01 01 01 01 66 21 50 B0 51 00 1B 30 40 70 40 36 00 40 84 63 00 00 1E 64 19 00 40 40 00 26 30 50 18 88 03 06 40 84 63 00 00 18 00 00 00 FD 00 3A 60 3E 1E 53 10 00 0A 20 20 20 20 20 20 d 70 d 01 e 80 02 03 22 F1 4E 10 1F 04 93 05 14 03 02 12 20 21 90 22 15 01 26 15 07 50 09 57 07 f A0 80 1E 01 1D 80 18 71 1C 16 20 58 2C 25 00 A0 5A B0 00 00 00 9E 01 1d 00 72 51 D0 1E 20 6E 28 55 00 C0 20 C2 31 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E D0 96 00 A0 5A 00 00 00 18 02 3A 80 18 71 38 2D 40 E0 58 2C 45 00 A0 5A 00 00 00 1E 00 00 00 00 00 00 F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 e

(2) Detail EDID Options are below

Model Name HEX EDID Table DDC Function

HD/FHD Model 0001 01 00 Analog/Digital

MODEL NAME MODEL NAME(HEX)

LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)

Download ‘Mode In’

ADC Adjust A E 00 10

0 1 2 3 4 5 6 7 8 9 A B C D E F

A A 0 0

When transfer the ‘Mode In’, Carry the command.

Automatically adjustment (The use of a internal pattern)

a. Product ID

b. Serial No: Controlled on production line. c. Month, Year: Controlled on production line:

ex) Week : '01' -> '01'

Year : '2012' -> '16' fix

d. Model Name(Hex):

cf) TV set’s model name in EDID data is below.

e. Checksum: Changeable by total EDID data.

EDID C/S data

Check Sum

(Hex)

Block 0 A3 A3

Block 1

HD(Non DTS) HD(DTS)

HDMI HDMI

52 (HDMI1) 52 (HDMI1) 42 (HDMI2) 42 (HDMI2)

5.5. GND and HI-POT Test

5.5.1. GND & HI-POT auto-check preparation

- Check the POWER CABLE and SIGNAL CABE insertion condition.

5.5.2. GND & HI-POT auto-check

(1) Pallet moves in the station.(POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process(Hi-pot test). (Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process automatically.

5.5.3. Checkpoint

(1) Test voltage

1) 3 Poles

- GND: 1.5KV/min at 100 mA

- SIGNAL: 3KV/min at 100 mA

2) 2 Poles

- SIGNAL: 3 KV/min at 100 mA (2) TEST time: 1 second (3) TEST POINT

1) 3 Poles

- GND Test = POWER CORD GND and SIGNAL

CABLE GND.

- Hi-pot Test = POWER CORD GND and LIVE &

NEUTRAL.

2) 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL. (4) LEAKAGE CURRENT: At 0.5mArms

6. Local Dimming Function Check

Step1) Turn on TV. Step2) Press “P-only” key, enter to power only mode and

escape the “P-only” Mode by pressing “Exit” key. Step3) Press “Tilt” key, entrance to Local Dimming mode. Step4) At the Local Dimming mode, module Edge Backlight

moving Top to bottom Back light of module moving. Step5) confirm the Local Dimming mode. Step6) Press “Exit” key.

f. Vendor Specific

Input Model name(HEX) HDMI1 67030C001000 HDMI2 67030C002000

Only for training and service purposes

- 12 -

7. 3D function test

(Pattern Generator MSHG-600, MSPG-6100[Support HDMI1.4]) * HDMI mode No. 872 , pattern No.83 (1) Please input 3D test pattern like below.

(2) When 3D OSD appear automatically, then select OK button.

(3) Don't wear a 3D Glasses, check the picture like below.

8. EYE-Q function check

Step1) Turn on TV Step 2) Press EYE key of Adj. R/C. Step 3) Cover the Eye Q sensor on the front of the using your

hand and wait for 6 seconds.

Step 4) Confirm that R/G/B value is lower than 10 of the “Raw

Data(Sensor data, Back light)”. If after 6 seconds, R/ G/ B value is not lower than 10, replace Eye Q sensor

Step 5) Remove your hand from the Eye Q sensor and wait

for 6 seconds.

Step 6) Confirm that “ok” pop up. If change is not seen, replace

Eye Q sensor.

Only for training and service purposes

- 13 -

BLOCK DIAGRAM

SPK_L

IC802

IC102

OCP IC

MHL _CD_SENSE,

AVDD5V_MH L, VBUS_EN

IC1201

(1Gbit)

NAND FLASH

PCM_A[0-7],…

(2Gbit)

DDR3 SDRAM

AUD_LRCH,

AUD_MASTER_CLK,

A-MDQL[0-7], A-MDQU[0-7], …

B-MD QL[0-7], B-MDQU [0-7],…

AUD_LRCK, AUD_SCK

SPK_R

STA380

(IC3401)

AUD_LRCH,

AMP_SCL/SDA

AUD_MASTER_CLK,

AUD_LRCK, AUD_SCK

Main SOC

Woofer_L

Woofer_R

P600

(P1101)

8P

STA380

AMP_SCL/SDA

STA380

(IC3402)

AUD_LRCH,

AMP_SCL/SDA

AUD_MASTER_CLK,

AUD_LRCK, AUD_SCK

(IC101)

S7LR_M1

STA380

(IC3403)

(IC3404)

,

AUD_LRCH,

AMP_SCL/SDA

AUD_MASTER_CLK,

AUD_LRCK, AUD_SCK

KEY1/2, LED_R /BUZZ , IR

30P HD LVDS wafer

connector

RXA0+/-~RXA4+/-, RXACK+/-

RXB0+/ -~RXB4+/-, RXB CK+/-

(LGE2121-MS)

USB1_OC D/CTL

(IC401)

DDC _SCL/SDA_4

DCDC + OCP IC

SIDE_U SB1_DM/D P

+5V_USB

USB

(JK700)

USB

(JK1500)

MHL _CD_SENSE

CK+/ -, D0+/-, D1+/-, D2+/-_H DMI4

(JK803)

HDM I_SIDE (MHL )

SIDE

DDC _SCL/SDA_2

CK+/ -, D0+/-, D1+/-, D2+/-_H DMI2

COMP2_R /L_IN, COMP2_Pr +/Pb +, AV_CVBS_D ET

HDM I1

(JK801)

REAR

AV2_R/L_I N

AV2_CVBS_IN

COMP2_Y+, AV_CVBS_I N

AV

(JK1701)

AV Compon ent

(JK1701)

TU_SC L / SDA

IF_P/ N_MSTAR, TU _CVBS, TU_SI F

Tun er

(TU3702)

SPI_SCK /SDI/SD O/CS

IC1300

Serial Flash

I2C_SC L/SDA

IC104

(8Mbit)

(256Kbit)

System EEPROM

Only for training and service purposes

- 14 -

125

400

521

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

540

IMPORTANT SAFETY NOTICE

120

123

LV1

125

530

510

122

910

900

200

500

501

A10

Set + Stand

300

A9

Stand Base+Stand Body

Only for training and service purposes

301

- 15 -

A2

TP for NON-EU models(except EU and China)

LGE Internal Use Only

TP for CI slot

/PCM_REG

/PCM_OE

/PCM_WE

/PCM_IORD PCM_A[11]

/PCM_IOWR CI_TS_DATA[1]

/PCM_CE

/PCM_IRQA

/PCM_CD

/PCM_WAIT

PCM_RST

PCM_5V_CTL

CI_DET

TP for S2

PCM_D[0]

PCM_D[2]

PCM_D[3]

PCM_D[4]

PCM_D[5]

PCM_D[6]

PCM_D[7]

PCM_A[8]

PCM_A[9]

PCM_A[10]

PCM_A[12]

PCM_A[13]

PCM_A[14]

TP for FE_TS_DATA

CI_TS_CLK

CI_TS_VAL

CI_TS_SYNC

CI_TS_DATA[2]

CI_TS_DATA[3]

CI_TS_DATA[4]

CI_TS_DATA[5]

CI_TS_DATA[6]

CI_TS_DATA[7]

TP for SCART

SCART1_MUTE

SC1_IDPCM_D[1]

SC1_FB

SC1_SOG_INCI_TS_DATA[0]

DTV/MNT_VOUT

SCART1_Lout

SCART1_Rout

SC1_CVBS_IN

SC1_R+/COMP1_Pr+

SC1_G+/COMP1_Y+

SC1_B+/COMP1_Pb+

SC1/COMP1_DET

SC1/COMP1_L_IN

SC1/COMP1_R_IN

TP for Headphone

HP_LOUT

HP_ROUT

SIDE_HP_MUTE

HP_DET

S2_RESET

FE_TS_DATA[1]

FE_TS_DATA[2]

FE_TS_DATA[3]

FE_TS_DATA[4]

FE_TS_DATA[5]

FE_TS_DATA[6]

FE_TS_DATA[7]

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC4_S7LRM

TP_NON_EN

2012.07.02 3

L13 POWER BLOCK (POWER DETECT 2)

LGE Internal Use Only

FROM LIPS & POWER B/D

+3.5V_ST

MMBT3906(NXP)

Q402

3

1

2

MLB-201209-0120P-N2

L409

BEAD_SAMSUNG

L404

CIC21J501NE

L407

MLB-201209-0120P-N2

L405

MLB-201209-0120P-N2

BEAD_SAMSUNG

L402

CIC21J501NE

BEAD_SAMWHA

L402-*1

CB2012PK501T

OPT

R411

33K

PWR ON

3.5V

3.5V GND 24V GND 12V 12V GND

P401

SMAW200-H18S1

1 3 5 7

10

9 11

12

13

14

15

16

17

18

19

.

DRV ON

2

PDIM#1

4

PDIM#2

6

GND

8

24V GND 12V N.C GND

RL_ON

BEAD_SAMWHA

L408-*1

CB2012PK501T

+3.5V_ST

+24V

+12V

+3.5V_ST

R461 10K

OPT

R401

10K

R462

10K

3.5V_DIODE D401 5V

BEAD_SAMSUNG CIC21J501NE

L408

C406 0.1uF

C418 0.1uF

BEAD_SAMSUNG CIC21J501NE

L421

C404 0.1uF

BEAD_SAMWHA

L421-*1

CB2012PK501T

B

16V

50V

16V

R416 10K

R406

4.7K

C

Q401 MMBT3904(NXP)

E

+3.5V_POWER

BEAD_SAMWHA

L404-*1

CB2012PK501T

+3.3V_Normal

R419

1K R415 100

C

E

MMBT3904(NXP)

R412 3.9K

PWM_DIM_PULL_DOWN

*For 55LN54 Power ON Noise

R408 100

PWM2_2CH_POWER

Q405

+3.5V_ST --> 3.375V --> 3.46V

PANEL_POWER

+12V

BEAD_CSG

L412-*1

L412 120

C438

0.1uF 25V

OPT

R489 10K

UBW2012-121F

R430 10K

R439

33K

R440

5.6K

B

C

Q407 MMBT3904(NXP)

E

C443 10uF

16V

Q409

AO3407A

S

D

G

R405

5.6K

PANEL_VCC

R407

5.6K

BEAD_SAMSUNG

CIS21J121

+3.5V_ST

R426 10K

R421 10K

B

INV_CTL

PANEL_CTL

001:AL22

+1.5V_DDR

PWM_DIM PWM1

+3.5V_ST

C461 10uF

10V

L420 BLM18PG121SN1D

+3.3V_Normal

AP7173-SPG-13 HF(DIODES)

R433 10K

IC407

IN

1

PG

2

THERMAL

VCC

3

1.5A

EN

4

[EP]

OUT

8

FB

9

7

SS

6

GND

5

C467 560pF 50V

R1

R457

4.3K

1/16W 1%

R2

R456

4.7K 1/16W 1%

BEAD_SAMWHA

L410-*1

CB2012PK501T

C472 22uF 10V

L410

CIC21J501NE

BEAD_SAMSUNG

C476

0.1uF 16V

+1.5V_DDR

D403 5V OPT

Power_DET

PD_+12V

R448

2.7K

PD_+12V

R447

C411

1.2K

0.1uF 16V

+24V

PD_+24V

R482

8.2K 1%

PD_+24V

PD_+24V C412

0.1uF 16V

R403

1.5K 1%

+3.3V_Normal

+12V

1%

+3.5V_ST

PD_+3.5V

R434

10K

+3.5V_ST

R450

0

5%

PWR_DET_ON_SEMI

NCP803SN293

VCC

3

PD_+24V_PWR_DET_ON_SEMI

NCP803SN293

VCC

3

R438 22K

+24V --> 3.78V --> 3.92V (3.79V) +12V --> 3.58V --> 3.82V (3.68V)

R402-*1 100

+3.5V_SOC_RESET

RESET_IC_SOC_RESET

R402 300

PD_+24V

R480 100

AO3435 Q403

D

S

G

+3.5V_ST

R463

RESET_IC_SOC_RESET

10K

BLM18PG121SN1D

C425

0.1uF 16V

R488 100K

IC408

GND

PD_+24V

R404

100K

IC409

GND

1

C423

2.2uF 10V

RESET

2

POWER_DET_RESET

RESET

2

FET_2.5V_AOS

C474

0.1uF

L403

POWER_DET

+3.3V_Normal

IC408-*1

APX803D29

RESET

PWR_DET_ON_DIODES

RESET

PD_+24V_PWR_DET_DIODES

C437 22uF 10V

2

1

IC409-*1

APX803D29

2

1

5V

3

GND

3

GND

D405

VCC

+5V_Normal & +5V_USB

L401-*1

CIC21J501NE

BEAD_SAMSAUNG

+12V

L401

BEAD_SAMWHA

CB2012PK501T

R410

100K

CHANGE TO 16V/X5R

C405 10uF 16V

4.7uF 10V

C419

Vout=0.8*(1+R1/R2)

L406

R491

0

BST

13

14

15

16

THERMAL

1

SS

3.6uH

10FB11LX12

IC401 TPS65281RGV

17

3

2

ROSC

COMP4RLIM

R409 2K

C410 3300pF 50V

C413

0.047uF 25V

PGND

VIN

V7V

[EP]

EN

C426 100pF 50V

OPT

SW_IN

9

C420 22uF 16V

R413 16K

8

7

6

5

C421 22uF 16V

SW_OUT

AGND

FAULT

EN_SW

R445

R436 15K

PH_3

PH_2

PH_1

SS/TR

B

C441

0.1uF 16V

R432

C488 3300pF

330K1/16W 5%

2.2K

C

Q400 MMBT3904(NXP)

E

C448

3300pF

50V

L415

3.6uH

C453 22uF 10V

C456 22uF 10V

R1

R2

FET_2.5V_DIODE

DMP2130L Q403-*1

S

G

R442 30K 1/16W 1%

R441 75K 1/16W 1%

D

+1.10V_VDDC

C439

50V 100pF

C444

0.1uF 16V

D404 5V OPT

Vout=0.8*(1+R1/R2)=1.5319

POWER_ON/OFF_1

R443 10K

+2.5V_Normal

C490

0.1uF 16V

IC402

TJ1118S-2.5

IN

OUT

2

3

1

GND

CAP_10uF_X5R

CHANGE TO 10UF/10V/X5R

V0 = 0.8*(1+(R1/R2))

IC410

MP20051

[EP]GND

IN_2

8

IN_1

THERMAL

9

7

NC

6

EN

5

C403

10uF

10V

85C

C403-*1

10uF 10V

CAP_10uF_X7R

OUT_1

1

OUT_2

2

FB

3

GND

4

+3.3V_Normal

+5V_Normal

R1

R452 33K

1%

C424 330pF

R453

OPT

27K

1%

C417 10uF

10V

85C

50V

R2

R454

11K 1%

CAP_10uF_X5R

CHANGE TO 10UF/10V/X5R

+5V_Normal

C417-*1

10uF 10V

CAP_10uF_X7R

+3.3V_Normal

R414 10K

+5V_USB

R417

4.7K OPT

C422

0.1uF 16V

OPT

USB1_OCD

USB1_CTL

+3.5V_ST -> 3.3V_TU

+3.5V_POWER

C489 10uF

6.3V

R492

POWER_ON/OFF_1

10K

C440

0.1uF 16V

+2.5V_Normal

D402 5V OPT

R2 1%

R493

1.5K

R1 1%

R494

4.7K

+3.3V_TU

L3703

CIS21J121

R495

C491 10uF

6.3V

1

C3723 22uF

6.3V

CHANGE TO

6.3V 2012 X5R

C3725

0.1uF 16V

S7LR core 1.15V volt

BEAD_SAMWHA

L413-*1

CB2012PK501T

+3.5V_ST

BEAD_SAMSUNG

L413 CIC21J501NE

C430 10uF

10V

+3.3V_Normal

VIN_1

VIN_2

GND_1

GND_2

Vout=0.827*(1+R1/R2)

R428 10K

EP[GND]

VIN_3

1

THERMAL

2

3

TPS54319TRE

4

5

AGND

15EN16

17

IC403

6

VSENSE

3A

C447

0.33uF 16V

7

COMP

BOOT14PWRGD

13

12

11

10

8

RT/CLK

9

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC4_S7LRM

Power_PD2

2012/09/19

4

USB (SIDE)

LGE Internal Use Only

JK700

1234

USB DOWN STR EAM

3AU 04S-3 05-Z C-(LG )

5

C700 22uF 10V

D700 RCLAMP0502BA

OPT

+5V_USB

SIDE_USB1_DM

SIDE_USB1_DP

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC4_S7LRM

USB

12/06/20

7

HDMI (REAR 1 / SIDE 1 MHL)

LGE Internal Use Only

HDMI_1

SHIELD

20

EAG59023302

JK801

CEC

HDMI_CEC

5V_HDMI_2

R822

2.7K

+5V_Normal

R823

2.7K

19

18

17

16

15

14

13

12

11 10

9

8

7

6

5

4

3

2

1

A2CA1 MMBD6100 D822

CK+

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

5V_HDMI_2

R826

1K

R803

1.8K

VA801

ESD_HDMI1_VARISTOR

R820 100

DDC_SDA_2

DDC_SCL_2

5V_DET_HDMI_2

VA802

3.3K

ESD_HDMI

R801

D801

ESD_HDMI1_VARISTOR

CEC_REMOTE_S7

5V_HDMI_4

R824

2.7K

HDMI-2

+5V_Normal

A2CA1 MMBD6100 D824 HDMI-2

R825

2.7K HDMI-2

MMBT3904(NXP)

Q801

R805 0

HDMI1_ARC

VA801-*1 1uF 10V

ESD_HDMI1_CAP

D801-*1 1uF 10V

ESD_HDMI1_CAP

+3.5V_ST

DDC_SDA_4

DDC_SCL_4

C

E

ESD_HDMI

A2CA1

MMBD6100 D825

HDMI-2

R807

10K

B

VA803

R817

10K

VA804 ESD_HDMI

1 2 3 4 5

ESD_HDMI_SEMTECH

1 2 3 4 5

ESD_HDMI_SEMTECH

R832 100

R833 100

D826 RCLAMP0524PA

10 9 8 7 6

D827 RCLAMP0524PA

10 9 8 7 6

TMDS_CH1-

TMDS_CH1+

GND_1

TMDS_CH2-

TMDS_CH2+

TMDS_CH1-

TMDS_CH1+

GND_1

TMDS_CH2-

TMDS_CH2+

D826-*1

IP4283CZ10-TBA

1

2

3

4

5

ESD_HDMI_NXP

D828-*1

IP4283CZ10-TBA

1

2

3

4

5

ESD_HDMI_NXP

SIDE_HDMI (MHL)

5V_HDMI_4

GND

BODY_SHIELD

HDMI-2

20

HPD2

DDC_SDA_2

DDC_SCL_2

HDMI_ARC HDMI_CEC

CK-_HDMI2 CK+_HDMI2

D0-_HDMI2 D0+_HDMI2

D1-_HDMI2 D1+_HDMI2

D2-_HDMI2 D2+_HDMI2

19

18

17

16

15

14

13

12

11

10

EAG62611204

9

8

7

6

5

4

3

2

1

HP_DET

5V

GND

DDC_DATA

DDC_CLK

NC

CE_REMOTE

CK-

CK_GND

CK+

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

HDMI-2

R819

1.8K

VA805 ESD_HDMI

JK803

D827-*1

IP4283CZ10-TBA

TMDS_CH1-

NC_4

10

TMDS_CH1+

NC_3

9

GND_1

GND_2

8

TMDS_CH2-

NC_2

7

TMDS_CH2+

NC_1

6

10

9

8

7

6

NC_4

NC_3

GND_2

NC_2

NC_1

ESD_HDMI_NXP

IP4283CZ10-TBA

TMDS_CH1-

TMDS_CH1+

GND_1

TMDS_CH2-

TMDS_CH2+

ESD_HDMI_NXP

1

2

3

4

5

D829-*1

1

2

3

4

5

NC_4

10

NC_3

9

GND_2

8

NC_2

7

NC_1

6

NC_4

10

NC_3

9

GND_2

8

NC_2

7

NC_1

6

MHL OCP

AVDD5V_MHL

R809

10

HDMI-2

5V_HDMI_4

OCP_DIODE_ONSEMI

C809

10uF

10V

HDMI-2

OCP_DIODE_TSC

D800-*1

SS23L

D800

MBR230LSFT1G

30V

100K OPT

R808

30V

+3.3V_Normal

R806

/MHL_OCP_DET

R804 0

HDMI-2

10K

HDMI-2

OPT

D811

OUT_3

OUT_2

OUT_1

R818

OC

5V_DET_HDMI_4

VA806 ESD_HDMI

3.3K

D812

5.6V

HDMI-2

IC802

BD82020FVJ

8

7

6

5

R810 0

HDMI-2

OPT

R830 100

HDMI-2

GND

1

IN_1

2

IN_2

3

EN

4

HDMI-2

VA807

ESD_HDMI

1 2 3 4 5

ESD_HDMI_SEMTECH

1 2 3 4 5

ESD_HDMI_SEMTECH

C801

0.047uF 25V HDMI-2

+5V_Normal

HDMI-2

R827

20K

D828 RCLAMP0524PA

10 9 8 7 6

D829 RCLAMP0524PA

10 9 8 7 6

+3.5V_ST

R811

OPT

B

C802

0.1uF HDMI-2

HDMI-2

C

Q804

B

R813

10K

HDMI-2

C

E

R834 100

R835 100

VA808 ESD_HDMI

10K

R812 10K

C

Q802

OPT

E

R802 0

HDMI-2

R821 10K

E

B

Q805

HDMI-2

B

OPT

+3.3V_Normal

R814

2.7K

HDMI-2

C

E

Q803

OPT

C

B

Q806

HDMI-2

R831 300K

R815

10K

HDMI-2

R816

10K

HDMI-2

HPD4

DDC_SDA_4

DDC_SCL_4

HDMI_CEC

CK-_HDMI4 CK+_HDMI4

D0-_HDMI4 D0+_HDMI4

D1-_HDMI4 D1+_HDMI4

D2-_HDMI4 D2+_HDMI4

MHL_CD_SENSE

/VBUS_EN

(Active Low)

MHL_OCP_EN

(Active High)

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC4_S7LRM

2012/11/07

HDMI_R1_S1 8

Headphone

LGE Internal Use Only

*Option : HEAD_PHONE

SIDE_HP_MUTE

R1505 1K

HEAD_PHONE_POP

B

Q1500

MMBT3904(NXP)

HEAD_PHONE_POP

R1500

C

3.3K

HEAD_PHONE_POP

E

+3.5V_ST

B

HP_LOUT

E HEAD_PHONE_POP

Q1501 MMBT3906(NXP)

C

HP_ROUT

HEAD_PHONE

C1500 10uF 16V

HEAD_PHONE

C1501 10uF 16V

OPT C1502 1000pF 50V

OPT C1503 1000pF 50V

HEAD_PHONE

R1501 1K

HEAD_PHONE_POP

HEAD_PHONE

R1502

1K

HEAD_PHONE_POP

Q1502 MMBT3904(NXP)

Q1503 MMBT3904(NXP)

C

B

E

C

B

E

B

E

Q1504 MMBT3904(NXP)

HEAD_PHONE_POP C

HP_DET

E

Q1505 MMBT3904(NXP) HEAD_PHONE_POP

C

+3.3V_Normal

R1504 10K

R1503 1K

HEAD_PHONE

JK1500

KJA-PH-0-0177 5GND

4L

3DETECT

1R

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC4_S7LRM

2012/06/20

HEADPHONE 15

GLOBAL tuner block except EU and China

LGE Internal Use Only

RF_SWITCH_CTL

Pull-up can’t be applied because of MODEL_OPT_2

TU3700

TU3702 TDSH-G501D(B)

TUNER_ISOLATOR_DVB_1INPUT_H

NC

1

RESET

2

SCL

3

SDA

4

+B1[3.3V]

5

SIF

6

+B2[1.8V]

7

CVBS

8

IF_AGC

9

DIF[P]

10

DIF[N]

11

B1

A2

B2

A1

A2

close to TUNER

R3705 0

C3701

0.1uF 16V

OPT

TDSS-G201D

B1

TUNER_OPT

12

SHIELD

1

2

3

4

5

6

7

8

9

10

11

A1

NC_1

RESET

SCL

SDA

+B1[3.3V]

NC_2

0.1uF 16V

+B2[1.8V]

NC_3

IF_AGC

DIF[P]

DIF[N]

A1

TU_GND_A

C3702

OPT

close to TUNER

R3732 100

+3.3V_TU

R3733 100K

C3710

0.1uF 16V

HALF_NIM/IF_FILTER

R3760-*1 10

R3761 0

HALF_NIM/IF_NON_FILTER

R3760 0

HALF_NIM/IF_NON_FILTER

Close to the tuner

TUNER_RESET

HALF_NIM/IF_FILTER

R3761-*1 10

C3711 18pF 50V

C3713 18pF 50V

R3735 33

R3736 33

LNA_CTRL_1

LNA_CTRL_2

+3.3V_TU

R3740

1.8K

TU_IIC_ATSC_1.8K

OPT C3742 20pF 50V

OPT C3743 20pF 50V

R3741

1.8K TU_IIC_ATSC_1.8K

IF_P_MSTAR

IF_N_MSTAR

1. should be guarded by ground

2. No via on both of them

3. Signal Width >= 12mils Signal to Signal Width = 12mils Ground Width >= 24mils

R3740-*1 1K TU_IIC_NON_ATSC_1K

R3741-*1 1K TU_IIC_NON_ATSC_1K

TU_SCL

TU_SDA

R3758 82

OPT

R3784 0

OPT

+3.3V_TU

TU_SIF

TU_CVBS

BR_RESET_DEMOD

FE_TS_SYNC

FE_TS_VAL_ERR

FE_TS_CLK

FE_TS_DATA[0]

FE_AGC_SPEED_CTL IF_AGC_SEL

FE_BOOSTER_CTL LNA2_CTL

DEMOD_SCL

DEMOD_SDA

GND seperation for ASIS tuner

TU_GND_A

R3714

R3715

NON_ASIA

0

NON_ASIA

TUNER MULTI-OPTION

TU3700-*1 TDSS-H501F(B)

TUNER_ATSC

1

2

3

4

5

6

7

8

9

10

X

11

A1

B1

12

SHIELD

NC_1

RESET

SCL

SDA

+B1[3.3V]

NC_2

+B2[1.8]

NC_3

IF_AGC

DIF[P]

DIF[N]

A1

TU_GND_A

TW_FE_LNA FILTER_SETTING

Frequence

54MHz~350MHz

350Hz~450MHz

450Hz~870MHz

CTRL_1 CTRL_2

1

0

1

Filter_Type

LPF

Through

HPF

C3737 100pF 50V

C3738

0.1uF 16V

+1.8V_TU

C3716

0.1uF 16V

close to the tuner pin, add,09029

R3704 100

should be guarded by ground

+3.3V_TU

C3717

0.1uF 16V

C3707 100pF 50V

IF_AGC_MAIN

IC3703

AP1117E18G-13

3

IN1ADJ/GND

OUT 2

C3708

0.1uF 16V

+1.8V_TU

C3740

0.1uF 16V

R3766 1

C3741 10uF

10V

85C

C3741-*1

10uF 10V

CAP_X7R_MP

CAP_10uF_X5R CHANGE TO

10UF 10V X5R

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

NC4_S7LRM

TUNER_NON_EU

2012.06.21 14