Page 1
LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91J
MODEL : 32LK310/310Y 32LK310/310Y-TA
MODEL : 32LK311 32LK311-TB
MODEL : 32LK313 32LK313-TD
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL62461524 (1110-REV01)
Page 2
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION .................................................................9
TROUBLE SHOOTING ............................................................................14
BLOCK DIAGRAM...................................................................................17
EXPLODED VIEW .................................................................................. 18
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
Page 3
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω
Page 4
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Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
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- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
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- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
4. Electrical specification
4.1. Model Specification
1. Application range
This spec sheet is applied to LCD TV used LP91J chassis.
2. Specification
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC(77 ºF ± 9 ºF), CST: 40 ºC ± 5 ºC
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage
: Standard input voltage(100-240 V@50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
No Item Specification Remark
1. Market NON EU
2. Broadcasting system PAL/SECAM B/G/D/K,
PAL I/II, NTSC-M
3. Available Channel BAND PAL NTSC China(DK) Australia(BG)
VHF/UHF E2-C69 2~78 C1~C62 C1~C75
CATV S21_S47 1~71 S1~S41 S2~S44
4. Receiving system Upper Heterodyne
5. Video Input PAL, SECAM, NTSC 22LK310/311 : Rear 1EA,
26/32LK310/311 : Rear 1EA, Side 1EA
6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear
7. RGB Input RGB-PC, S/W Upgrade Rear
8. HDMI Input HDMI-DTV, Only PCM MODE 26/32LK310/311 Rear 2EA
22LK310/311 Rear 1EA
9. Audio Input (4EA) PC Audio, Component, AV (2EA) L/R Input (22LK310/311: AV Audio Input 1EA)
10. RS-232C Remote control, Commercial control Rear
11. USB Input (1EA) Divx, MP3, JPEG Only Side
Page 7
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5. Component Video Input (Y, PB, PR)
No
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50 Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50 Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50 Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50 Hz
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
No
Specification
Proposed Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
6. RGB
(Analog PC, RGB-DTV - NOT SUPPORT)
Page 8
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Only for training and service purposes
7. HDMI input - PC
(Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
8. HDMI input (DTV)
No
Specification
Proposed Remarks
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
Page 9
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- 9 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP91J
chassis.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
4) The input voltage of the receiver must keep 100-220 V,
50/60 Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration - RGB / Component
(4) Check SW Version.
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
(2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened
2) Click the “Connect” button and confirm “Dialog Box”
3) Click the “Config.” button and Change speed I2C Speed
setting : 350 Khz ~ 400 Khz
4) Read and write bin file.
Click “(1)Read” tab, and then load download file
(XXXX.bin) by clicking “Read”.
1
Filexxx.bin
Page 10
5) Click “(2)Auto” tab and set as below.
6) Click “(3)Run”.
7) After downloading, you can see the “(4)Pass” message.
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the USB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”
4) After Finished the Download, Automatically DC Off -> On
5) If the TV is Turn on, Check the updated SW Version and
tool option.
4.2. Input tool option.
Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because being
different with some setting value depend on module
maker, inch and market
(2) Equipment : adjustment remote control.
(3). Adjustment method
- The input methods are same as other chassis.(Use INSTART Key on the Adjust Remote control.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value
Caution : Don’t Press “IN-STOP” key after completing the
function inspection.
4.3. EDID Download method
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID. If not possible, recommend that
connect the MSPG equipment.
There are two methods of downloading the EDID data
4.3.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2 seconds.
4.3.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, HDMI EDID data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(
G)
3) Press the right direction key(
G) at Start.
4) After about a few seconds, appear “OK”, then complete.
4.3.3. RS-232C command Method
(1) Command : AE 00 10
* Caution
Don’t connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of EDID could be
failed.
- 10 -
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1
Filexxx.bin
Page 11
4.3.4. EDID data
(1) Analog(RGB): 128bytes>
(2) HDMI 1 : 256Bytes
(3) HDMI 2 : 256Bytes
4.4. ADC Calibration
4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60 Hz 100 % Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : Component” by using
D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear.
4.4.2. ADC Calibration - RGB
4.4.2.1. Method of Using External pattern
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60 Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : RGB” by using
D/E(CH +/-)
and press ENTER(
A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
- 11 -
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
OK
OK
0123456789ABCDEF
0 00FFFFFFFFFFFF00 1E6D01 000101 01 01
10 01 15 01 03 08 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B A1 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88
40 35 00 BC 88 21 00 00 1C 0E 1F 00 80 51 00 1E 30
50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 00 55
0123456789ABCDEF
0 00 FFFFFFFFFFFF001E6D01 00 01010101
10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C2
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 2A
0123456789ABCDEF
0 00 FFFFFFFFFFFF001E6D01 00 01010101
10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C2
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 20 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 1A
Page 12
4.4.2.1. Method of Using Internal pattern
(1) Apply model
22/26/32LK310/311
(2) Process
1) Change the Input to RGB mode..
2) Press ADJ key on R/C for adjustment.
3) Enter Password number. Password is “0 0 0 0”.
4) Select “0. ADC calibration : RGB” by using
D/E(CH +/-)
and press ENTER(
A).
5) ADC adjustment is executed automatically .
6) When ADC adjustment is finished, this OSD appear.
* Caution : No need to connect external input cable.
* Caution : Adjustment result is applied after SET Off/On
4.5. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-control.
2) SW Version check
Check “SW VER : V3.xx”
5. PCB assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Country’s Language and
signal Condition.
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use INSTART Key on the Adjust Remote control.)
Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.
5.2. Adjustment of White Balance
(For Automatic Adjustment)
- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm
- Required Equipment
1) Remote controller for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product LCD TV( ch : 9 ),
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for Auto adjustment)
5.2.1 Adjustment of White Balance (For automatic adjustment)
* LP91J Support RS-232C & I2C Interface For ADC/DDC
Adjustment.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heatrun pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, 00)
(4) Release the adjust mode of white balance
- Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
- 12 -
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
OK
MODEL : 32L K310
SW VER : V3.04
Mode : Home Use UTT 6
ADC CAL. RGB : NG
RGB: OK HDMI1 : NG
Comp onent SD : OK HDMI2 : NG
Comp onent HD : OK
Tool Option 1 816
Tool Option 2 4181
Area Op tion 40
Opti on 1 0
Opti on 2 0
Syst em Control
Syst em Contro l 2
Power Off Hist ory
Davin ci/Aut o Test
Area Option ETC
Lang. Group NTSC-ALL
MODEL : 32L K310
SW VER : V3.04
Mode : Home Use UTT 6
ADC CAL. RGB : NG
RGB: OK HDMI1 : NG
Comp onent SD : OK HDMI2 : NG
Comp onent HD : OK
Tool Option 1 816
Tool Option 2 4181
Area Op tion 40
Opti on 1 0
Opti on 2 0
Syst em Control
Syst em Contro l 2
Power Off Hist ory
Davin ci/Aut o Test
Area Option ETC
Lang. Group NTSC-ALL
Page 13
5.2.2. Adjustment of White Balance (for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter “0000” (Password)
6) Select “3. W/B ADJUST”
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using
F/G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool/ Medium/ Warm) : Fix the
one of R/G/B gain and change the others
11) When adjustment is completed, Enter “COPY ALL”.
12) Exit adjustment mode using EXIT key on R/C.
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
- 22LK310/311(Small size inch’s color coordinate is different
from others, so use below table)
- To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : Select Vivid and change Dynamic Contrast :
Off, Dynamic Colour : Off -> Picture Mode change ->
Vivid(User)
(If you miss the upper condition, the coordinates of W/B can
be lower than the spec.
- 13 -
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Coordinate
Mode
xy
Temp uv∆
Cool 0.269 ± 0.002 0.273 ± 0.002 13,000 K 0.000
Medium 0.285 ± 0.002 0.293 ± 0.002 9,300 K 0.000
Warm 0.313 ± 0.002 0.329 ± 0.002 6,500 K 0.003
Coordinate
Mode
xy
Temp uv∆
Cool 0.285 ± 0.002 0.293 ± 0.002 9,300 K 0.000
Medium 0.295 ± 0.002 0.305 ± 0.002 8,000 K 0.000
Warm 0.313 ± 0.002 0.329 ± 0.002 6,500 K 0.003
Page 14
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 14 -
TROUBLESHOOTING
No power
(LED indicator off)
Check 24V, 12V, 3.5V
of Power B/D
Check short of Main B/D
or Change Power B/D
Pass
Check Output of
IC1001, IC1003, IC1007
Check P400 Connector
Change LED Assembly
:
[A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assembly
Change IC1002, IC1008, Q1003
Pass
Check short of IC1001,
IC1003, IC1007
Fail
Re-soldering or Change defect
part of IC1001, IC1003, IC1007
Fail
No Raster
[B]: Process
Check LED status
On Display Unit
Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802
Fail
Change Inverter Connector
Or Inverter
Fail
Pass
Fail
Pass
Change LVDS cable
Fail
Check LVDS Cable
Pass
Check Panel Link Cable
Or Module
Change Panel Link Cable
Or Module
Check Inverter Connector
Or Inverter
Pass
Page 15
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
No Raster on PC Signal
Check Input source Cable
And Jack
Pass
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC201
Fail
Re-soldering or
Change the defect part,
Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/Output
Of J202
Fail
Pass
Check the Input/Output
Of IC800
Fail
Re-soldering or
Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source
Cable And Jack
Pass
Re-soldering or
Change the defect part
Check the Input/Output
Of IC800
Fail
Pass
Re-soldering or
Change the defect part
Repeat [A], & [B] Process
Check The Input/Output
Of JK101
Fail
Pass
No Raster on HDMI Signal
Check Input source
Cable And Jack
Pass
Check the Input/Output
of JK301, JK302
Fail
Re-soldering or
Change the defect part
Pass
Pass
Check the Input/Output
of IC300, IC301
Fail
Re-soldering or
Change the defect part
Check HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/Output
of IC800
Fail
Re-soldering or
Change the defect part
Repeat [A], & [B] Process
Page 16
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 16 -
No Sound
Check The Input Sourse
Check The Input/Output
Of IC600
Re-soldering or
Change the defect partFail
Pass
Pass
Check The Speaker
Change Speaker
Fail
Check The Speaker Wire
Pass
Change The Source Input
Fail
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source
Cable And Jack
Pass
Check Input source
Cable And Jack
Pass
Check The Input/Output
of JK102
Re-soldering or
Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Pass
Check the Input/Output
of IC800
Fail
Re-soldering or
Change the defect part
Pass
Check The Input/Output
Of TU500
Re-soldering or
Change the defect part
Pass
Fail
Pass
Check the Input/Output
of IC800
Fail
Re-soldering or
Change the defect part
Repeat [A], & [B] Process
Page 17
LGE Internal Use OnlyCopyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
BLOCK DIAGRAM
RGB-PC
(JK202)
TUNER
(TU500)
COMPONENT / AV1
Audio out (JK102)
AV2
(JK201)
AV_LIN/RIN : 500mVrm s
SPK_L
SPK_R
COMPONENT_L/R : 500m Vrms
AV_VIN : 1Vpp
NTP3200L
COMP_Y/Pb/Pr
IR & LED (P201)
HDMI_DATA0
TU_MAIN
COMPONENT_Y/Pb/Pr : 1/0.7Vpp
AV_VIN
COMP_LIN/RIN
L_CH
R_CH
AV_LIN/RIN
PC-SOUND
(JK203)
I2S_MCLK
I2S_SDO
I2S_WS
I2S_SCK
TMDS
LIPS
RL_ON/IDISP_EN
PANEL_STATUS
E-DIM
OPC_OUT
EEPROM
(24LC256)
Serial Flash
(MX25L64)
EEPROM
HDCP
(24WC08)
EEP_SCL/SDA
EEP_SCL/SDA
TXCE2–
TXCE3–
TXCLK E–
TXCE1–
TXCE0
TXCO1–
TXCO3–
TXCO2–
TXCO0–
TXCLK O–
M_SCL/SDA
MAIN SCLAER
Matri x
(LGE4767A)
(IC800)
EEPROM
24C02
IC302
TU500
IC802
IC803
IC801
IC600
P402
P403
M_SCL/SDA
SIDE
REAR
HDMI3
(JK303)
USB
(JK204)
RS-232C
(JK200)
USB(SVC)
(JK205)
HDMI1
(JK301)
HDMI2
(JK302)
EEPROM
24C02
IC301
EEPROM
24C02
IC300
EEPROM
24C02
IC300
DDC_SCL1/SDA 1
DDC_SCL2/SDA 2
DDC_SCL3/SDA 3
Cont rol ler
ST3232CDR
IC200
RXD/TXD
EEPROM
24C02
IC201
DSUB_SCL /SDA
P401
SPI_CZ/DO
SPI_CLK/DI
HDMI_DATA1
HDMI_DATA2
USB DN/DP
PC_R/G/B
PC_VS/HS
TXD/RXD
PC_AUD_L/R
TXCO4–
TXCE4–
FHD LVDS connector
HD LVDS conn ector
DDR2 SDRAM
(512M Byte)
IC900
DDR2_CKE
DDR2_WEZ
DDR2_DQS0 –
DDR2_MCLK
DDR2_BA0/1
DDR2_DQS1 –
DDR2_ODT
DDR2_DQM0/1
SIDE_VIN
SIDE_LIN/RIN
Page 18
- 18 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
300
500
510
120
A10
200
800
530
550
810
900
910
540
521
400
A21
A2
A5
LV1
Option
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Page 19
EAX64045802
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91J
COMPONENT / AV IN / AV AUDIO OUT
NON_AUDIO_OUT
JK101
PPJ238-01
4H
5G
5F
7F
5E
7E
4D
5D
6C
[RD1]E-LUG
5C
[RD1]O-SPRING
4C
[RD1]CONTACT
5B
[WH1]O-SPRING
4A
[YL1]CONTACT
5A
[YL1]O-SPRING
6A
[YL1]E-LUG
6H
[RD2]E-LUG
5H
[RD2]O-SPRING_2
[RD2]CONTACT
[WH2]O-SPRING
[RD2]O-SPRING_1
[RD2]E-LUG-S
[BL2]O-SPRING
[BL2]E-LUG-S
[GN2]CONTACT
[GN2]O-SPRING
AUDIO_OUT
JK102
PPJ239-03
6H
[RD1]E-LUG
5H
[RD1]O-SPRING_2
4H
[RD1]CONTACT_2
5G
[WH1]O-SPRING_2
4F
[YL1]CONTACT_1
5F
[YL1]O-SPRING_1
7F
[YL1]E-LUG-S
5E
[RD1]O-SPRING_1
7E
[RD1]E-LUG-S
5D
[WH1]O-SPRING
6D
[WH1]E-LUG
6N
[RD2]E-LUG
5N
[RD2]O-SPRING_2
4N
[RD2]CONTACT
5M
[WH2]O-SPRING
5L
[RD2]O-SPRING_1
ZD10 6
30V
ZD10 7
30V
D105
30V
D104
30V
ZD104
SD05
ZD105
SD05
D100
30V
D101
30V
C103
5600pF
50V
C104
5600pF
50V
R112
220K
R111
220K
R110
75
R100
220K
R104
220K
R116
10K
R115
10K
R113
10K
R114
10K
C
E
C
E
R122
R125
0
B
Q103
RT1C3904-T112
R124
1K
0
B
Q105
RT1C3904-T112
R120
12K
R119
12K
CVBS_RIN
CVBS_LIN
CVBS_VIN
R123
1K
C
E
C
E
Q104
RT1C3904-T112
B
Q106
RT1C3904-T112
B
C101 10uF
16V
C102 10uF
16V
MUTE_LINE
POP NOISE
MUTE_LINE
POP NOISE
MNT_ROUT
MNT_LOUT
AUDIO_OUT OPTION BLOCK
R117
12K
R118
12K
R121
75
COMP2_R
JP102
COMP2_L
GAIN X 4
P_12V_SMALL_15V
JP101
E
B
C
ISA1530AC1
Q101
R101
220
R102
402
READY
R105
470
RT1C3904-T112
Q102
C
B
E
R103
68
R106
47
MNT_VOUT_T
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
6D
[GN2]E-LUG
7L
[RD2]E-LUG-S
5K
[BL2]O-SPRING
7K
[BL2]E-LUG-S
4J
[GN2]CONTACT
5J
[GN2]O-SPRING
6J
[GN2]E-LUG
ZD100
SD05
ZD101
SD05
ZD102
SD05
ZD103
SD05
R107
75
R108
75
R109
75
COMP2_PR
COMP2_PB
COMP2_Y
LK310
INPUT1
2010/11/22
1 9
Page 20
EAX64045802
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91J
RS-232C
C203
0.1uF
16V
C1+
1
C200
0.1uF
16V
C201
0.1uF
16V
C202
0.1uF
16V
V+
C1-
C2+
C2-
V-
T2OUT
R2IN
2
3
4
5
6
7
8
SIDE AV
IC200
ST3232CDR
VCC
16
GND
15
T1OUT
14
R1IN
13
R1OUT
12
T1IN
11
T2IN
10
R2OUT
9
SIDE_AV
JK201
PPJ235-01
+3.5V_MST
5C
4C
3C
4B
3A
4A
R202
100
D200
30V
R203
100
D201
30V
+3.5V_MST
R204
R205
4.7K
4.7K
[RD]E-LUG
[RD]O-SPRING
[RD]CONTACT
[WH]O-SPRING
[YL]CONTACT
[YL]O-SPRING
IR_OUT
RXD
TXD
D205
30V
SIDE_AV
D206
30V
SIDE_AV
SIDE_AV
ZD202
5.6B
ZD203
5.6B
SIDE_AV
READY
R222
220K
READY
R223
220K
R227
75
SIDE_AV
SIDE_AV
R225
10K
SIDE_AV
R224
10K
R228
12K
SIDE_AV
R226
12K
SIDE_AV
JK200
SPG09-DB-009
1
6
2
7
3
8
4
9
5
10
SIDE_RIN
SIDE_LIN
SIDE_V
PC
JK202
SPG09-DB-010
6630TGA004Q
6
1
7
2
8
3
9
4
10
5
SHILED16
PC EDID
RGB_EEPROM_RENESAS
IC201-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
VCC
8
WP
7
SCL
6
SDA
5
PC SOUND
RED_GND
11
12
13
14
15
RGB_EEPROM_CATAL
CAT24C02WI-GT3
A0
A1
A2
VSS
GND_2
RED
GREEN_GND
DDC_DATA
GREEN
BLUE_GND
H_SYNC
BLUE
NC
V_SYNC
GND_1
SYNC_GND
DDC_CLOCK
DDC_GND
IC201
1
2
3
4
R213
75
PC_R
PC_G
PC_B
R200
0
ZD200
SD05
ZD201
SD05
D204
30V
D209
30V
R214
4.7K
R215
4.7K
R207
68
R208
68
DSUB_SDA
C213
68pF
50V
C211
68pF
50V
DSUB_SCL
PC_HS
PC_VS
D207
30V
D208
30V
R211
75
R212
75
D210
30V
+5V_MULTI
ENKMC2838-T112
D211
A1
C
A2
C205
R221
R220
R216
100
R217
100
R218
100
R219
4.7K
READY
4.7K
4.7K
0.01uF
DDC_WP
DSUB_SCL
DSUB_SDA
VCC
8
WP
7
SCL
6
SDA
5
5A
[YL]E-LUG
** 1A Design
It’s possibel to 27~47ohm
USB
REAR_USB
R229
USB_DL_N
R230
USB_DL_P
REAR_USB
0
0
SIDE_USB
KJA-UB-4-0004
JK204
1234
USB DOW N S TREA M
5
Close to SIDE_USB
C210
10uF
6.3V
READY
READY
ZD204
ZD205
30V
30V
USB_DN
USB_DP
220uF
16V
C214
100uF
16V
USB_DL_N
USB_DL_P
L201
500C212
REAR_USB
JK205
KJA-UB-0-0037
1
2
3
4
5
+3.5V_MULTI
OCP_READY
R209
1K
Non_OCP
R237
OUT_2
OUT_1
0
NC
FLG
IC202
AP2191SG-13
8
7
6
5
1
2
3
4
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
OCP_READY
D213
AC
GND
OCP_READY
IN_1
IN_2
EN
JK203
PEJ027-01
+5V_USB
C
A
OCP_READY
R238
510
OCP_READY
L200
120OHM
OCP_READY
R210
4.7K
OCP_READY
C208
0.1uF
50V
OCP_READY
C209
10uF
16V
E_SPRING
3
T_TERMINAL1
6A
B_TERMINAL1
7A
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
D202
30V
CDS3C30GTH
D203
30V
CDS3C30GTH
R233
10K
R231
220K
R234
10K
R232
220K
LK310
INPUT2
PC_AUD_R
R235
12K
PC_AUD_L
R236
12K
2010/11/22
2 9
Page 21
EAX64045802
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91J
HPD_MST_2
HPD_MST_3
2SC3875S
RT1C3904-T112
R301
10K
SHIELD
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
YKF45-7058V
JK302
R312
B
10K
JACK_GND
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Q301
C
B
E
HPD
+5V_POWER
DDC/CEC_GND
SDA
SCL
NC
CEC
CLKCLK_SHIELD
CLK+
DATA0DATA0_SHIELD
DATA0+
DATA1DATA1_SHIELD
DATA1+
DATA2DATA2_SHIELD
DATA2+
C
RT1C3904-T112
2SC3875S
Q302
E
HPD
+5V_POWER
DDC/CEC_GND
SDA
SCL
NC
CEC
CLKCLK_SHIELD
CLK+
DATA0DATA0_SHIELD
DATA0+
DATA1DATA1_SHIELD
DATA1+
DATA2DATA2_SHIELD
DATA2+
+5V_HDMI_2
R303
1K
JP301
JP300
+5V_HDMI_3
R314
1K
JP304
JP305
CEC
TMDS3_RXC-
TMDS3_RXC+
TMDS3_RX0-
TMDS3_RX0+
TMDS3_RX1-
TMDS3_RX1+
TMDS3_RX2-
TMDS3_RX2+
HDMI2_EEPROM_CATAL
IC301
CAT24C02WI-GT3
A0
1
A1
2
A2
3
VSS
4
CEC
TMDS2_RXC-
TMDS2_RXC+
TMDS2_RX0-
TMDS2_RX0+
TMDS2_RX1-
TMDS2_RX1+
TMDS2_RX2-
TMDS2_RX2+
HDMI3_EEPROM_CATAL
IC302
CAT24C02WI-GT3
A0
1
A1
2
A2
3
VSS
4
HDMI2_EEPROM_RENESAS
IC301-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
VCC
8
WP
7
SCL
6
SDA
5
HDMI3_EEPROM_RENESAS
IC302-*1
R1EX24002ASAS0A
A0
1
A1
2
A2
3
VSS
4
VCC
8
WP
R329 100
7
SCL
R317 100
6
SDA
R318
5
8
7
6
5
R327 100
R304 100
R305 100
8
7
6
5
100
OPTION
HDMI1_EEPROM_RENESAS
A0
A1
A2
VSS
IC300
IC300-*1
R1EX24002ASAS0A
1
2
3
4
VCC
8
WP
R331 100
7
SCL
R306 100
6
SDA
R307 100
5
JP302
JP303
VCC
WP
SCL
SDA
VCC
WP
SCL
SDA
R319
10K
+5V_MULTI
+5V_HDMI_2
A2
C301
0.01uF
R309
R311
10K
10K
+5V_MULTI
+5V_HDMI_3
A1CA2
D302
KDS184S
C300
0.01uF
R320
25V
10K
A1
D301
KDS184S
C
DDC_WP
DDC_SDA2
DDC_SCL2
HPD_MST_1
R300
10K
SHIELD
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
JK301
YKF45-7058V
Q300
C
B
RT1C3904-T112
2SC3875S
E
HPD
+5V_POWER
DDC/CEC_GND
SDA
SCL
NC
CEC
CLKCLK_SHIELD
CLK+
DATA0DATA0_SHIELD
DATA0+
DATA1-
DATA1_SHIELD
DATA1+
DATA2DATA2_SHIELD
DATA2+
+5V_HDMI_1
R302
1K
HDMI1_EEPROM_CATAL
CAT24C02WI-GT3
A0
1
A1
2
A2
3
VSS
4
CEC
TMDS1_RXC-
TMDS1_RXC+
TMDS1_RX0-
TMDS1_RX0+
TMDS1_RX1-
TMDS1_RX1+
TMDS1_RX2-
TMDS1_RX2+
SW_HPD : USE SW HPD (Default)
MST_HPD : USE MST HPD
VCC
8
WP
7
SCL
6
SDA
5
+5V_MULTI
+5V_HDMI_1
R308
R310
10K
10K
A1CA2
D300
KDS184S
C302
0.01uF
DDC_WP
DDC_SDA1
DDC_SCL1
DDC_WP
+3.3V_MST
R315
DDC_SDA3
DDC_SCL3
Q303
BSS83
READY
G
D
B
S
68K
READY
D303
MMBD301LT1G
30V
READY
R313
0
D304
CDS3C30GTH
30V READY
R316
56K
READY
CEC_C
CEC
KJA-ET-0-0032
JK303
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LK310
HDMI
2010/11/22
3 9
Page 22
EAX64045802
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91J
PANEL WAFER
IR
P400
12507WR-12L
13
.
SCL
1
SDA
2
GND
3
KEY1
4
KEY2
5
5V_ST
6
GND
7
LED_B/LG_LOGO
8
IR
9
GND
10
ST_3.3V
11
LED_R/BUZZ
12
FHD BRIDING
ZD400
5.6B
FHD BRIDING
ZD401
5.6B
ZD402
5.6B
NON_19_22INCH
C400
470pF
50V
L400
L401
NON_19_22INCH
READY
C402
47pF
50V
C401
100pF
50V
FHD BRIDING
500-ohm
FHD BRIDING
500-ohm
NON_19_22INCH
L404 120ohm
NON_19_22INCH
L405 120ohm
C403
470pF
50V
C404
47uF
16V
C405
100pF
50V
L403
120ohm
L402
120ohm
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
+5V_+12V_LCD
R435 0
NON CMO 42FHD
R436 0
NON CMO 42FHD
R426 0
AUO/SHARP 42FHD
R427 0
AUO/SHARP 42FHD
R437 0
NON CMO 42FHD
R428 0
AUO/SHARP 42FHD
R429 0
AUO/SHARP 42FHD
R438 0
NON CMO 42FHD
R431 0
SHARP 42FHD
R444 0
NON AUO 42FHD
TXCE0+
TXCE0-
TXCE1+
TXCE1-
TXCE2+
TXCE2-
TXCLKE+
TXCLKE-
TXCE3+
TXCE3TXCE4+
TXCE4-
TXCO0+
TXCO0TXCO1+
TXCO1-
TXCO2+
TXCO2-
TXCLKO+
TXCLKO-
TXCO3+
TXCO3TXCO4+
TXCO4-
+3.3V_MULTI_MST
SHARP 42FHD
R442
4.7K
AUO FHD
R443
0
+3.3V_MULTI_MST
READY
R433
4.7K
NON CMO FHD
R434
0
READY
R439 0
L406
120-ohm
L407
120ohm
+3.5V_MST
2SC3052
READY
C406
0.1uF
50V
SUB_SCL
SUB_SDA
+3.3V_MULTI_MST
R400
10K
C
B
Q400
E
IR-OUT
R401
47K
+3.5V_MST
R403
10K
C
Q402
E
2SC3052
READY
R402
0
READY
R404
0
R405
10K
+3.5V_MST
IR-OUT
R407
10K
B
B
+3.3V_MST
R406
4.7K
26_32INCH
C407
0.1uF
IR-OUT
C
2SC3052
E
Q401
R408
10K
R409
4.7K
26_32INCH
C408
0.1uF
IR-OUT
R410
10K
IR-OUT
R412
10K
B
+3.5V_MST
R411
4.7K
+3.5V_MST
C
IR-OUT
2SC3052
E
Q403
KEY1
KEY2
SUB_SCL
IR
IR-OUT
R413
22
LED_R
IR_OUT
FHD
51P_FFC_WAFER_FHD
P401
TF05-51S
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
CONTROL KEY
19_22INCH
P404
KEY1
KEY2
19_22INCH
L408
L409
19_22INCH
19_22INCH
C409
100pF
50V
19_22INCH
C410
100pF
50V
KEY1
KEY2
GND
12507WR-03L
1
2
3
4
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-
P402
FF10001-30
26_32INCH_HD_WAFER
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
+3.3V_MULTI_MST
READY
R440
4.7K
READY
R441
0
R444 R431 R442
51 47 46 45 44 43 42 41 28
SHARP 32INCH FHD
IPS 32INCH FHD
O X X
O X X
SHARP 32INCH FHD
HD_normal
R425 0
HD_NOT AUO_IPS
R414
0
HD_normal
R415
0
R443 R421
R420 R416 R417 R418
X
VESA
X
VESA
SMALL_NC5
SMALL_NC1
SMALL_NC2
SMALL_OPC_OUT
TXCE3-
TXCE3+
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
OPC_ENABLE
R418 0
LVDS_SEL
R419 0
+5V_+12V_LCD
SMALL_OPC_EN
SMALL_NC3
SMALL_NC4
OPC_ENABLE
R417 0
OPC_ENABLE
R416 0
X X X
R423
External VBR
R438 R429
O
X XX O X X O
+3.3V_MULTI_MST
VESA
R420
4.7K
JEIDA
R421
0
+3.3V_MULTI_MST
OPC_ENABLE
R422
470
OPC_OUTPUT
OPC_OUT
READY
R423
0
E-DIM
R434
R428
R437
R433 R42712R426
27 26
25
O
O O O O
R434
R434
X X O O
26inch AUO : OPEN
26inch SHARP : Pull down
OPC_ENABLE
RT1C3904-T112
OPC_ENABLE
Q404
R424
C
E B
1K
R4369R435
11 10
O O
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-
P403
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
+5V_+12V_LCD
19_22INCH
NON_Small CMO
R432
0
TXCE3TXCE3+
TXCLKETXCLKE+
TXCE2TXCE2+
TXCE1TXCE1+
TXCE0TXCE0+
SMALL_NC5
SMALL_NC1
SMALL_NC2
SMALL_OPC_OUT
SMALL_OPC_EN
SMALL_NC3
SMALL_NC4
OPC_EABLE
OPC_EN
FF10001-30
**OPC_ENABLE : USE LGD Module
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LK310
LVDS,CTR KEY
2010/11/22
4 9
Page 23
EAX64045802
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91J
PAL_TUNER
TU500
TAFJ-Z001D
NC_1
1
NC_2
2
+B[5V]
3
RF_AGC
4
MOPLL_AS
5
Near the pin
C508
C501
10uF
0.01uF
16V
50V
READY
L500
120- ohm
READY
C505
100uF
16V
READY
C506
100uF
16V
R500
0
+5V_TUNER
TU500-*1
TAFJ-H001F
13
SHIELD
6
7
8
9
10
11
12
SCL
SDA
NC_3
SIF
NC_4
VIDEO
GND
C502
27pF
50V
C500
27pF
50V
MAIN_SIF
READY
L502
10uH
READY
C507
82pF
50V
R504
47
R505
47
R502
4.7K
M_SCL
M_SDA
C503
0.1uF
50V
+5V_TUNER
E
B
R501
0
R506
220
R507
220
ISA1530AC1
Q502
C
READY
C504
50V
TV_MAIN
13
SHIELD
1
2
3
4
5
6
7
8
9
10
11
12
NC_1
NC_2
+B[5V]
RF_AGC
MOPLL_AS
SCL
SDA
NC_3
SIF
NC_4
VIDEO
GND
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LK310
2010/11/22
TUNER 5 9
Page 24
EAX64045802
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91J
+1.8V
SW_RESET
MULTI_PW_SW
L606
120-ohm
MLB-201209-0120P-N2
0LCML00003B
L605
120-ohm
MLB-201209-0120P-N2
0LCML00003B
+3.3V_MST
R630
10K
C
B
R629 10K
READY
R624
READY
R631
47K
READY
R627
0
Q603
RT1C3904-T112
E
0
I2S_MCLK
+1.8V_AVDD
C601
100pF
+1.8V_AVDD
+1.8V_DVDD
+1.8V_AVDD
+1.8V_DVDD
R601 100
C606
1000pF
C603
1000pF
R600
3.3K
C608
1uF
+3.3V_MULTI_MST
C605
0.1uF
C602
C600
0.1uF
10uF
16V
C604
10uF
16V
TEST0/GND
C607
0.1uF
50V
+1.8V_DVDD
C611 22000pF
BST1A
VDR1A
RESET
AD
DVSS_1
VSS_IO
CLK_I
VDD_IO
DGND_PLL
AGND_PLL
LF
AVDD_PLL
DVDD_PLL
C609
10uF 16V
[EP]GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
C610
0.1uF
PVDD1A_2
OUT1A_1
OUT1A_2
PGND1A_1
PGND1A_2
53
54
55
56
THERMAL
57
Main AMP
15
16
17
18
WCK19BCK20SDA21SCL
DVDD
SDATA
DVSS_2
100
100
R677
R676
I2S_WS
I2S_SDO
C615
C642
0.1uF
10uF
50V
35V
PVDD1A_1
PVDD1B_1
PVDD1B_2
51
52
49
50
IC600
NTP-3200L
22
MONITOR_0
MONITOR_1
R602
R603
100
100
100
R678
M_SCL
M_SDA
I2S_SCK
C639
C638
33pF
33pF
50V
READY
50V
READY
C617
0.1uF
50V
OUT1B_1
OUT1B_2
47
48
23
24
MONITOR_2
C612
R604
68uF
3.3
35V
C613
0.01uF
50V
C616
22000pF
BST1B
PGND1B_1
PGND1B_2
44
45
46
25
FAULT26VDR2B27BST2B
C614
1uF
R673 0
C651
1000pF
50V
C640
68uF
35V
R608
12
C619
390pF
C621
390pF
R610
12
C618
1uF
VDR1B
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
PGND2B_1
+16V_NTP
R611
12
L603
AD-9060
2S
2F
1S 1F
EAP61008401
R638
12
NC
VDR2A
BST2A
C624
1uF
PGND2A_2
PGND2A_1
C625
22000pF
OUT2A_2
OUT2A_1
PVDD2A_2
+16V_NTP
PVDD2A_1
PVDD2B_2
PVDD2B_1
C626
0.1uF
OUT2B_2
OUT2B_1
PGND2B_2
C623 22000pF
MULTI_PW_SW
C632
0.47uF
C629
0.1uF
C637
0.1uF
C669
0.1uF
R658
12
C630
390pF
C634
390pF
R621
12
C672
0.01uF
R663
4.7K
R626
3.3
R625
3.3
R623
4.7K
C671
0.01uF
MLB-201209-0120P-N2
R653
12
L607
AD-9060
2S
1S 1F
EAP61008401
R654
12
L608
MLB-201209-0120P-N2
L609
2F
C673
0.47uF
SPK_L+
SPK_L-
C644
0.1uF
C643
0.1uF
MLB-201209-0120P-N2
C648
R628
0.01uF
4.7K
R671
3.3
R635
3.3
R667
4.7K
C647
0.01uF
L610
L611
MLB-201209-0120P-N2
SPK_R+
SPK_R-
MNT_LOUT
MNT_ROUT
SPK_RSPK_R+
SPK_LSPK_L+
AMP :GAIN X 4
+12V_AUDIO
C620
0.1uF
16V
C631
0.1uF
16V
Q601
RT1C3904-T112
C
B
E
R605
4.7K
MNT_L_AMP
MNT_R_AMP
+12V_AUDIO
Q602
RT1C3904-T112
C
B
E
R616
4.7K
C622
6800pF
50V
C633
6800pF
50V
R617
1K
R606
1K
R607
10K
C627 33pF
50V
R612
5.6K
R613
5.6K
C635 33pF
50V
R614
10K
+12V_AUDIO
R609
6.8K
C628
0.01uF
50V
R615
6.8K
P600
SMAW250-H04R
1
2
3
4
AUDIO_OUT_OP AMP_BCD
IC601-*1
AS324MTR-E1
OUT1
IN1-
IN1+
IN2+
IN2-
OUT2
1
2
3
VCC
4
5
6
7
OUT4
14
IN4-
13
IN4+
12
GND
11
IN3+
10
IN3-
9
OUT3
8
AUDIO_OUT_OP AMP_AUK
IC601
1 OUT1
S324
2 INPUT1-
3 INPUT1+
4 VCC
5 INPUT2+
6 INPUT2-
7 OUT2 8OUT3
14OUT4
13INPUT4-
12INPUT4+
11GND
10INPUT3+
9INPUT3-
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUDIO_OUT OPTION BLOCK
LK310
AUDIO
2010/11/22
6 9
Page 25
EAX64045802
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91J
SERIAL FLASH 64M
SPI_CZ
SPI_DO
EEPROM
A0
A1
A2
GND
HDCP EEPROM
R8004
4.7K
RL_ON
P_24V_SMALL_15V
P_12V_SMALL_15V
+3.5V_MST
RESET
+3.3V_MULTI_MST
C807
0.01uF
+3.3V_MULTI_MST
R877
4.7K
MAIN_EEPROM_ATMEL
IC801
AT24C256C-SSHL-T
1
2
3
4
IC803
CAT24WC08W-T
A0
1
A1
2
A2
3
VSS
4
26_32INCH
R8037
0
READY
C871
4.7uF
10V
READY
R800
0
R8001
0
SW800
JTP-1127WEM
C812
4.7uF 10V
D803
KDS181
VCC
8
WP
7
SCL
6
SDA
5
26_32INCH
R8007
33K
RT1C3904-T112
1
3
2 4
VCC
READY
C841
0.22uF
16V
MX25L6445EMI-10G
1 NC_1/SIO3
2 VCC
3 NC_2
4 NC_3
5 NC_4
6 NC_5
7 CS#
8 SO/SIO1 9WP#/SIO2
+3.3V_MULTI_MST
C803
0.01uF
R812 22
R813 22
VCC
8
WP
7
SCL
6
SDA
5
C
B
26_32INCH
E
Q804
ISA1530AC1
R861
1K
KDS181
D801
R8036
20K
R887
33K
READY
C839
2.2uF 10V
IC804
KIA7427F
OUT
3
1
READY
2
GND
IC802
16SCLK
15SI/SIO0
14NC_9
13NC_8
12NC_7
11NC_6
10GND
R8028
R8027
4.7K
4.7K
+3.3V_MULTI_MST
R817
4.7K
22
R8005
R8006 22
R886
2K
B
C814
50V
C
E
READY
R807
0
R8000
10K
Q800
R888
100
READY
R808
4.7K
R885
150R860 1K
C870
47uF
25V
0.1uF
+3.3V_MULTI_MST
R878
4.7K
R828
C
B
E
READY
Q805
RT1C3904-T112
READY
EEP_SCL
EEP_SDA
EEP_SCL
EEP_SDA
D802
KDS181
R853
1K
READY
C8000
2.2uF
16V
SPI_CLK
SPI_DI
DDC_WP
10K
+3.5V_MST
R855
10K
C
B
RT1C3904-T112
Q803
E
R896 4.7K
R898 4.7K
Small_HD
Non_Small_FHD
R898-*1
R896-*1
Non_Small_HD
R896-*2
Small_FHD
R896-*3
LGD Joker
R896-*4
26" FHD
R896-*5
O/S Joker
*H/W OPTION
Small HD
Small FHD (22")
Non Small HD
LGD Joker
26" FHD 4.7K
Non Small FHD
Apollo
100HZ
** Small HD : 19/22/26 Inch
** Non Small FHD : Normal(non 100Hz) FHD Model
** LGD Joker : LF Series (10BIT FHD, LED ON/OFF)
** O/S Joker : LF Series (8BIT FHD, LED ON/OFF)
** Small FHD (22"): 8BIT,LED ON/OFF
** 26" FHD : 10BIT,LED ON/OFF
4.7K
4.7K
100Hz
R898-*2
4.7K
4.7K
Apollo
R898-*3
4.7K
4.7K
LGD Joker
4.7K
R898-*4
4.7K
26" FHD
R898-*5
4.7K
4.7K
O/S Joker
R898
R896
X
4.7K
X
X
4.7K
4.7K
4.7K
4.7K 4.7K
4.7K
4.7K X
X 4.7K
X
4.7K
X
4.7K
+3.3V_MULTI_MST
C866
10uF
0.1uF
C833 0.1uF
120-ohm
L800
C867
C815 0.1uF
PC_B
PC_G
C819 0.1uF
C804/C805/C806:Close to IC
as close as possible
PC_R
C838 0.1uF
COMP2_PB
COMP2_Y
COMP2_PR
CVBS_VIN
SIDE_V
TV_MAIN
C810 1uF
MNT_VOUT_T
MAIN_SIF
SIDE_LIN
SIDE_RIN
MNT_L_AMP
MNT_R_AMP
POWER_DET
MULTI_PW_SW
SYS_RESET
R80104.7K
Small_HD
R8010-*1
Apollo
R8010-*2
4.7K
Non_Small_FHD
R8010-*3
4.7K
Small_FHD
R8010-*4
LGD Joker
R8010-*5
4.7K
26" FHD
R8010
R8011
4.7K4.7K
X
4.7K
4.7K
4.7K
X
4.7K X
4.7K
XO/S Joker 4.7K
4.7K
4.7K
4.7K
4.7K
X
R8008 22K
R8009 22K
AUDIO_OUT OPTION BLOCK
+3.3V_MULTI_MST+3.3V_MULTI_MST
R80114.7K
Small_FHD
R8011-*1
4.7K
4.7K
100Hz
R8011-*2
4.7K
Apollo
R8011-*3
4.7K
Non_Small_HD
R8011-*4
4.7K
4.7K
26" FHD
R8011-*5
4.7K
O/S Joker
TMDS2_RXCTMDS2_RXC+
TMDS2_RX0TMDS2_RX0+
HPD_MST_2
TMDS2_RX1-
HDMI_2
TMDS2_RX1+
TMDS2_RX2TMDS2_RX2+
TMDS1_RXCTMDS1_RXC+
TMDS1_RX0TMDS1_RX0+
TMDS1_RX1-
HDMI_1
TMDS1_RX1+
TMDS1_RX2TMDS1_RX2+
HPD_MST_1
R814 47
R803 470
R816 47
R818 47
R838 47
R833 47
R836 47
R832 47
R834 47
R835 470
R837 47
R804 47
R815 47
R897 47
R802 47
R831 47
R857 47
R830 47
R875 47
R876 47
C854 0.01uF
C855 0.01uF
+1.2V_VDDC_MST
R851 10
R854 10
R856 10
R858 10
R859 10
R862 10
R869 10
R871 10
R872 10
R873 10
R874 10
R879 10
R880 10
R890 10
R891 10
R892 10
R840 390
C804 0.1uF
C805 0.1uF
C806 0.1uF
C843 0.047uF
C846 1000pF
C845 0.047uF
C847 0.047uF
0.047uF
C825
C827 0.047uF
C829 0.047uF
C826 0.047uF
C828 0.047uF
C835 1000pF
C830 0.047uF
C800 0.047uF
C801 0.047uF
C831 0.047uF
C832 0.047uF
C834 0.047uF
C836 0.047uF
C837 0.047uF
C868 0.1uF
C869 0.1uF
C856 2.2uF
C861 2.2uF
R882 100
R881 100
R846 100
R847 100
+3.3V_MST
SYS_RESET
255CEC
256HWRESET
1 RXBCKN
2 RXBCKP
3 RXB0N
4 RXB0P
5 HOTPLUGB
6 RXB1N
7 RXB1P
8 AVDD_33_1
9 RXB2N
10 RXB2P
11 RXACKN
12 RXACKP
13 RXA0N
14 RXA0P
15 AVDD_33_2
16 RXA1N
17 RXA1P
18 GND_1
19 RXA2N
20 RXA2P
21 HOTPLUGA
22 REXT
23 VCLAMP
24 REFP
25 REFM
26 BIN1P
27 SOGIN1
28 GIN1P
29 RIN1P
30 BINM
31 BIN0P
32 GINM
33 GIN0P
34 SOGIN0
35 RINM
36 RIN0P
37 AVDD_33_3
38 GND_2
39 BIN2P
40 GIN2P
41 SOGIN2
42 RIN2P
43 CVBS6
44 CVBS5
45 CVBS4
46 CVBS3
47 CVBS2
48 CVBS1
49 VCOM1
50 CVBS0
51 VCOM0
52 AVDD_33_4
53 CVBSOUT
54 GND_3
55 SIF0P
56 SIF0M
57 VDDC_1
58 AUL5
59 AUR5
60 AUVRM
61 AUOUTL2
62 AUOUTR2
63 AUOUTL1
64 AUOUTR1
65 AUL0
66 AUR0
C823 2.2uF
C824 2.2uF
CVBS_LIN
C811
0.1uF
PC_VS
CEC_C
PC_HS
R8034 0
R8035 0
253HSYNC1
254VSYNC1
67 AUL1
68 AUR1
CVBS_RIN
R8020
10K
251HSYNC0
252VSYNC0
69 AUL2
70 AUR2
C873 2.2uF
C802 2.2uF
COMP2_R
COMP2_L
POWER_SW
LED_R
RXD
DSUB_SDA
IR
TXD
R8012 100
R8002 0
R850 100
R849 100
R895 100
245GPIO134
246GPIO135
247GPIO138
248GPIO139
249GPIO140
250IRIN
71 AUL3
72 AUR3
73 AUCOM
74 AUL4
75 AUR4
76 GND_4
C808 0.1uF
C821 2.2uF
C822 2.2uF
C874 2.2uF
C875 2.2uF
PC_AUD_L
PC_AUD_R
C809 10uF 16V
Close to IC
with width trace
+3.3V_MST
C851
0.1uF
KEY2
KEY1
C817 20pF
C816 20pF
X801
12MHz
R839
1M
R824 100
R825 100
240SAR2
241SAR3
242AVDD_MPLL
243XOUT
244XIN
77 AUVRP
78 AUVAG
79 AVDD_AU
80 GND_5
81 VDDC_2
C840 0.01uF
L801
120-ohm
+3.3V_MST
C813 0.1uF
C818 1000pF
C820 4.7uF
Closed IC
R8016 0
237USB0_DP
238SAR0
239SAR1
82 DDCA_CK
83 DDCA_DA
84 DDCDA_CK
R894 0
R899 0
R8023 100
DSUB_SDA
DSUB_SCL
READY
READY
R8017 0
235GND_18
236USB0_DM
85 DDCDA_DA
86 DDCDB_CK
R8024 100
R8025 100
DDC_SCL1
DDC_SDA1
DDC_SCL2
+3.5V_MST
R8003
10K
I2S_OUT
TXD
RXD
RL_ON
EEP_SCL
EEP_SDA
I2S_SCK
I2S_SDO
R8021100
R8022100
226VDDC_7
227I2S_OUT_BCK
228I2S_OUT_SD
229SPDIFO
230UART2_RX/I2CM_SDA
231UART2_TX/I2CM_SCK
232UART1_RX/GPIO86
233UART1_TX/GPIO87
234GND_17
LGE4765A (Matrix basic_NON_SRS)
87 DDCDB_DA
88 GPIO20
89 VDDP_1
90 VDDC_3
91 UART2_RX
92 UART2_TX
93 DDCDC_CK
94 RXCCKN
95 RXCCKP
HDMI3_SIDE
HDMI3_SIDE
0
R806
R870 0
M_SCL
M_SDA
100
R801 10
R8039
DDC_SCL3
TMDS3_RXC-
R8634.7K
R8644.7K
HDMI3_SIDE
R805 10
READY
R8033 0
C882 0.1uF
R8026 100
DDC_SDA2
POWER_DET
DDR2_A[0-12]
I2S_WS
I2S_MCLK
PANEL_STATUS
R829 100
C883 0.1uF
218VDDC_6
219I2S_IN_WS/GPIO67
220I2S_IN_BCK/GPIO68
221I2S_IN_SD
222I2S_OUT_MCK
223I2S_OUT_WS
224VDDP_5
225GND_16
IC800
96 DDCDC_DA
97 RXC0N
98 RXC0P
99 GND_6
100 RXC1N
101 RXC1P
102 AVDD_DM
103 RXC2N
HDMI3_SIDE
HDMI3_SIDE
HDMI3_SIDE
HDMI3_SIDE
HDMI3_SIDE
HDMI3_SIDE
100
C876 0.01uF
R820 10
R822 10
R841 10
R821 10
R8040
R823 10
DDC_SDA3
TMDS3_RX0-
TMDS3_RX0+
TMDS3_RXC+
TMDS3_RX1-
TMDS3_RX1+
HDMI_3
+3.3V_MULTI_MST
DDR2_A[3]
DDR2_A[7]
DDR2_A[12]
DDR2_CKE
AR812
R852 56
215A_MADR[7]
216A_MADR[3]
217A_MCLKE
104 RXC2P
105 HOTPLUGC
106 USB1_DM
HDMI3_SIDE
R848 10
R826 0
USB_DN
HPD_MST_3
TMDS3_RX2+
TMDS3_RX2-
DDR2_A[5]
DDR2_A[9]
DDR2_A[10]
56
AR813
211AVDD_DDR_6
212A_MADR[5]
213A_MADR[9]
214A_MADR[12]
107 USB1_DP
108 SCK
109 SDI
110 SDO
AR818
33
R827 0
SPI_DO
USB_DP
SPI_DI
SPI_CLK
USB PART
DDR2_A[1]
DDR2_BA0
56
208A_BADR[0]
209A_MADR[1]
210A_MADR[10]
111 SCZ
112 PWM0
113 PWM1
SPI_CZ
DDR2_A[8]
DDR2_A[11]
DDR2_BA1
DDR2_WEZ
AR814
56
205A_MADR[11]
206A_WEZ
207A_BADR[1]
114 PWM2
115 PWM3
116 LVA4P
E-DIM
I-DIM
DDR2_A[6]
DDR2_A[4]
AR815
202GND_15
203A_MADR[6]
204A_MADR[8]
117 LVA4M
118 LVA3P
119 LVA3M
DDR2_A[2]
DDR2_A[0]
56
199A_MADR[0]
200A_MADR[2]
201A_MADR[4]
120 LVACKP
121 LVACKM
122 LVA2P
+1.8V_DDR
DDR2_CASZ
DDR2_RASZ
DDR2_ODT
R867 1K
+3.3V_MULTI_MST
AR800
56
C863 0.1uF
C844 0.1uF
L802
120-ohm
R868 1K
+1.8V_DDR
193GND_14
194AVDD_MEMPLL
195MVREF
196A_ODT
197A_RASZ
198A_CASZ
192B_MCLKZ
191B_MCLK
190B_MDATA[5]
189B_MDATA[2]
188B_MDATA[0]
187B_MDATA[7]
186AVDD_DDR_5
185B_MDATA[13]
184B_MDATA[10]
183GND_13
182B_MDATA[8]
181B_MDATA[15]
180AVDD_DDR_4
179B_DDR2_DQSB[1]
178B_DDR2_DQS[1]
177GND_12
176VDDP_4
175AVDD_DDR_3
174B_DDR2_DQSB[0]
173B_DDR2_DQS[0]
172GND_11
171B_DDR2_DQM[0]
170B_DDR2_DQM[1]
169AVDD_DDR_2
168B_MDATA[14]
167B_MDATA[9]
166GND_10
165B_MDATA[12]
164B_MDATA[11]
163AVDD_DDR_1
162B_MDATA[6]
161B_MDATA[1]
160GND_9
159B_MDATA[3]
158B_MDATA[4]
157VDDC_5
156VDDP_3
155GPIO58
154GPIO57
153GPIO56
152GPIO55
151GPIO54
150GPIO53
149GPIO52
148GPIO51
147GND_8
146GPIO152/I2C_OUT_SD3
145GPIO151/I2C_OUT_SD2
144GPIO150/I2C_OUT_MUTE
143VDDC_4
142GND_7
141AVDD_LPLL
140LVB0M
139LVB0P
138LVB1M
137LVB1P
136LVB2M
135LVB2P
134LVBCKM
133LVBCKP
132LVB3M
131LVB3P
130LVB4M
129LVB4P
123 LVA2M
124 LVA1P
125 LVA1M
126 LVA0P
127 LVA0M
128 VDDP_2
+3.3V_MULTI_MST
R811
R883
1K
1K
READY
R889
R884
1K
1K
READY
[MODE SELECTION]
R843 33
R844 33
C853 0.1uF
C849 0.1uF
C848 0.1uF
R8038 1K AUDIO_OUT
C850 0.01uF
C842 0.1uF
+1.2V_VDDC_MST
DDR2_MCLKZ
DDR2_MCLK
DDR2_D[5]
AR805
DDR2_D[2]
56
DDR2_D[0]
DDR2_D[7]
DDR2_D[13]
AR806
DDR2_D[10]
56
DDR2_D[8]
DDR2_D[15]
DDR2_DQS1M
DDR2_DQS1P
DDR2_DQS0M
DDR2_DQS0P
DDR2_DQM0
DDR2_DQM1
DDR2_D[14]
AR809
DDR2_D[9]
56
DDR2_D[12]
DDR2_D[11]
DDR2_D[6]
AR810
DDR2_D[1]
56
DDR2_D[3]
DDR2_D[4]
MUTE_LINE
SUB_SCL
SUB_SDA
OLP
PANEL_ON
R819 3.3K
DISP_EN/VAVS_ON
SW_RESET
DDC_WP
OPC_EN
Close to IC as close as possible
+1.2V_VDDC_MST
C857
0.01uF
C859
0.01uF
C877
0.01uF
C878
0.01uF
C879
0.01uF
+1.8V_DDR
C864
C858
0.01uF
0.01uF
C860
0.01uF
C862
0.01uF
C865
0.01uF
DDR2_D[0-15]
READY
R809 4.7K
R810
R865 4.7K
R866 4.7K
R845 4.7K
READY
R893 4.7K
AVDD_33_1
AVDD_33_2
HOTPLUGA
AVDD_33_3
AVDD_33_4
CVBSOUT
AUOUTL2
AUOUTR2
AUOUTL1
AUOUTR1
+3.3V_MST
1K
AUDIO_OUT
+3.3V_MULTI_MST
TXCO4TXCO4+
TXCO3-
TXCO3+
TXCLKOTXCLKO+
TXCO2-
TXCO2+
TXCO1-
TXCO1+
TXCO0-
TXCO0+
TXCE4-
TXCE4+
Only Divx
IC800-*1
GND_15
A_MADR[6]
A_MADR[8]
A_MADR[11]
A_WEZ
A_BADR[1]
A_BADR[0]
A_MADR[1]
A_MADR[10]
AVDD_DDR_6
A_MADR[5]
A_MADR[9]
A_MADR[12]
A_MADR[7]
A_MADR[3]
A_MCLKE
VDDC_6
I2S_IN_WS/GPIO67
I2S_IN_BCK/GPIO68
I2S_IN_SD
I2S_OUT_MCK
I2S_OUT_WS
VDDP_5
GND_16
VDDC_7
I2S_OUT_BCK
I2S_OUT_SD
SPDIFO
UART2_RX/I2CM_SDA
UART2_TX/I2CM_SCK
UART1_RX/GPIO86
UART1_TX/GPIO87
GND_17
GND_18
USB0_DM
USB0_DP
SAR0
SAR1
SAR2
SAR3
AVDD_MPLL
XOUT
XIN
GPIO134
GPIO135
GPIO138
GPIO139
GPIO140
IRIN
HSYNC0
VSYNC0
HSYNC1
VSYNC1
CEC
HWRESET
RXBCKN
1
RXBCKP
2
RXB0N
3
RXB0P
4
HOTPLUGB
5
RXB1N
6
RXB1P
7
8
RXB2N
9
RXB2P
10
RXACKN
11
RXACKP
12
RXA0N
13
RXA0P
14
15
RXA1N
16
RXA1P
17
GND_1
18
RXA2N
19
RXA2P
20
21
REXT
22
VCLAMP
23
REFP
24
REFM
25
BIN1P
26
SOGIN1
27
GIN1P
28
RIN1P
29
BINM
30
BIN0P
31
GINM
32
GIN0P
33
SOGIN0
34
RINM
35
RIN0P
36
37
GND_2
38
BIN2P
39
GIN2P
40
SOGIN2
41
RIN2P
42
CVBS6
43
CVBS5
44
CVBS4
45
CVBS3
46
CVBS2
47
CVBS1
48
VCOM1
49
CVBS0
50
VCOM0
51
52
53
GND_3
54
SIF0P
55
SIF0M
56
VDDC_1
57
AUL5
58
AUR5
59
AUVRM
60
61
62
63
64
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
256
65
73
74
76
79
80
81
82
84
88
91
94
96
97
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
SCK
SDI
SDO
SCZ
AUL066AUR067AUL168AUR169AUL270AUR271AUL372AUR3
AUL475AUR4
PWM0
PWM1
PWM2
PWM3
AUCOM
GND_477AUVRP78AUVAG
GND_5
RXC0N98RXC0P99GND_6
RXC1N
RXC1P
RXC2N
RXC2P
LVA4P
LVA4M
LVA3P
LVA3M
VDDC_2
GPIO2089VDDP_190VDDC_3
RXCCKN95RXCCKP
AVDD_AU
DDCA_CK83DDCA_DA
AVDD_DM
USB1_DM
USB1_DP
DDCDA_CK85DDCDA_DA86DDCDB_CK87DDCDB_DA
UART2_RX92UART2_TX93DDCDC_CK
DDCDC_DA
HOTPLUGC
TXCE3-
TXCE3+
TXCLKETXCLKE+
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
GND_14
AVDD_MEMPLL
MVREF
A_ODT
A_RASZ
A_CASZ
A_MADR[0]
A_MADR[2]
A_MADR[4]
B_MCLKZ
193
194
195
196
197
198
199
200
201
192
B_MCLK
191
B_MDATA[5]
190
B_MDATA[2]
189
B_MDATA[0]
188
B_MDATA[7]
187
AVDD_DDR_5
186
B_MDATA[13]
185
B_MDATA[10]
184
GND_13
183
B_MDATA[8]
182
B_MDATA[15]
181
AVDD_DDR_4
180
B_DDR2_DQSB[1]
179
B_DDR2_DQS[1]
178
GND_12
177
VDDP_4
176
AVDD_DDR_3
175
B_DDR2_DQSB[0]
174
B_DDR2_DQS[0]
173
GND_11
172
B_DDR2_DQM[0]
171
B_DDR2_DQM[1]
170
AVDD_DDR_2
169
B_MDATA[14]
168
B_MDATA[9]
167
GND_10
166
B_MDATA[12]
165
B_MDATA[11]
164
AVDD_DDR_1
163
B_MDATA[6]
162
B_MDATA[1]
161
GND_9
160
B_MDATA[3]
159
B_MDATA[4]
158
VDDC_5
157
VDDP_3
156
GPIO58
155
GPIO57
154
GPIO56
153
GPIO55
152
GPIO54
151
GPIO53
150
GPIO52
149
GPIO51
148
GND_8
147
GPIO152/I2C_OUT_SD3
146
GPIO151/I2C_OUT_SD2
145
GPIO150/I2C_OUT_MUTE
144
VDDC_4
143
GND_7
142
AVDD_LPLL
141
LVB0M
140
LVB0P
139
LVB1M
138
LVB1P
137
LVB2M
136
LVB2P
135
LVBCKM
134
LVBCKP
133
LVB3M
132
LVB3P
131
LVB4M
130
LVB4P
129
120
121
122
123
124
125
126
127
128
LVA2P
LVA2M
LVA1P
LVA1M
LVA0P
LVA0M
LVACKP
LVACKM
VDDP_2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LK310
2010/11/22
7 9MSTAR
Page 26
EAX64045802
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
LP91J
DDR2
DDR2_D[0-15]
DDR2_A[0-12]
+1.8V_DDR
1K
R907
1K
R908
Close to DDR2 IC
C904
0.01uF
DDR2_BA0
DDR2_BA1
DDR2_MCLK
DDR2_MCLKZ
DDR2_CKE
DDR2_ODT
DDR2_RASZ
DDR2_CASZ
DDR2_WEZ
DDR2_DQS0P
DDR2_DQS1P
DDR2_DQM0
DDR2_DQM1
DDR2_DQS0M
DDR2_DQS1M
+1.8V_DDR
C905
1000pF
V_REF
C918
0.1uF
DDR2_A[0]
DDR2_A[1]
DDR2_A[2]
DDR2_A[3]
DDR2_A[4]
DDR2_A[5]
DDR2_A[6]
DDR2_A[7]
DDR2_A[8]
DDR2_A[9]
DDR2_A[10]
DDR2_A[11]
DDR2_A[12]
C900
0.01uF
50V
C920
2.2uF
16V
R900
56
R902
56
R904
56
R906
READY
R901
R903
56
R905
56
150
56
C919
10uF
10V
V_REF
A10/AP
DDR2_D[0-15]
IC900
K4T51163QI-HCF7
VREF
J2
A0
M8
A1
M3
A2
M7
A3
N2
A4
N8
A5
N3
A6
N7
A7
P2
A8
P8
A9
P3
M2
A11
P7
A12
R2
BA0
L2
BA1
L3
CK
J8
CK
K8
CKE
K2
ODT
K9
CS
L8
RAS
K7
CAS
L7
WE
K3
LDQS
F7
UDQS
B7
LDM
F3
UDM
B3
LDQS
E8
UDQS
A8
NC_4
L1
NC_5
R3
NC_6
R7
NC_1
A2
NC_2
E2
NC_3
R8
VSSDL
J7
VDDL
J1
DQ0
G8
DQ1
G2
DQ2
H7
DQ3
H3
DQ4
H1
DQ5
H9
DQ6
F1
DQ7
F9
DQ8
C8
DQ9
C2
DQ10
D7
DQ11
D3
DQ12
D1
DQ13
D9
DQ14
B1
DQ15
B9
VDD_5
A1
VDD_4
E1
VDD_3
J9
VDD_2
M9
VDD_1
R1
VDDQ_10
A9
VDDQ_9
C1
VDDQ_8
C3
VDDQ_7
C7
VDDQ_6
C9
VDDQ_5
E9
VDDQ_4
G1
VDDQ_3
G3
VDDQ_2
G7
VDDQ_1
G9
VSS_5
A3
VSS_4
E3
VSS_3
J3
VSS_2
N1
VSS_1
P9
VSSQ_10
B2
VSSQ_9
B8
VSSQ_8
A7
VSSQ_7
D2
VSSQ_6
D8
VSSQ_5
E7
VSSQ_4
F2
VSSQ_3
F8
VSSQ_2
H2
VSSQ_1
H8
DDR2_D[0]
DDR2_D[1]
DDR2_D[2]
DDR2_D[3]
DDR2_D[4]
DDR2_D[5]
DDR2_D[6]
DDR2_D[7]
DDR2_D[8]
DDR2_D[9]
DDR2_D[10]
DDR2_D[11]
DDR2_D[12]
DDR2_D[13]
DDR2_D[14]
DDR2_D[15]
+1.8V_DDR
Close to DDR2 IC
+1.8V_DDR
C901
0.01uF
C902
0.01uF
C903
0.01uF
C906
0.01uF
C907
0.01uF
C908
0.01uF
C909
0.01uF
C910
0.01uF
C911
0.01uF
C912
0.01uF
C913
0.01uF
C914
0.01uF
C915
0.01uF
C916
0.01uF
C917
0.01uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR2 MEMORY
LK310
2010/11/22
DDR2 8 9
Page 27
RL_ON
Copyright © 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
EAX64045802
LP91J
+3.5V_MST
26_32INCH
R1003
10K
LED Block
+3.5V_MST
R1002
10K
26_32INCH
2SC3875S
Q1005
123
26_32INCH
R1000
26_32INCH
4.7K
R1001
4.7K
3
26_32INCH
2
2SC3875S
1
Q1000
P_24V_SMALL_15V
P_3.5V
P_12V_SMALL_15V
+3.5V_MULTI
R1005
1.2K
LD1002
SAM2333
<OS MODULE PIN MAP>
18
20
22
24
READY
R1004
0
**DC-DC CONVERTER
*12V -> 5V_MULTI
19_22INCH
R1010
0
26_32INCH
P1000
FW20020-24S
19_22INCH
P1001
SMAW200-12
READY
R1006
100K
LGDPIN No
INV_ON
V4:VBR-A
V5:VBR-A
PWM_DIM
Err_out
A-DIM
Err_out
PWM_DIM
INV_ON
Power on
GND/P-Dim2
AUOCMO(09)
INV_ON
Err_out
NC
1
24V
3
GND
5
GND
7
3.5V
9
3.5V
11
GND
13
GND
15
12V
17
12V
19
12V
21
23
SHARP
INV_ON
NC
PWM_DIM
GNDPWM_DIM
1
2
3
4
5
6
7
8
9
10
11
12
IPS
INV_ON
Err_out
NC
PWM_DIM
15V
24V
2
15V
24V
4
GND
GND
6
GND
GND
8
3.5V
3.5V
10
3.5V
3.5V
12
GND
GND
14
OLP
GND
16
INVERTER_ON
INV ON
18
PWM_Dim
A-Dim
20
A_Dim
P-Dim
22
NC
Error out
24
SMALL
INV_ON
PWM_DIM
A-DIM
NC
*ST 3.5V->3.3V
+3.5V_MST
+3.3V_MST
READY
C1053
ZD1000
0.01uF
3.6V
50V
P_12V_SMALL_15V
L1000
500
C1001
10uF
25V
C1065
2.2uF
10V
C1002
10uF
25V
READY
L1011
120-ohm
C1052
10uF
16V
V0 = 0.8*(1+(R1/R2))
PGND
VIN
C1003
0.1uF
50V
AGND
FB
1
2
3
4
C1067
2.2uF
10V
1%
READY
R1041
C1066
12K
100pF
50V
1%
R1042
R8044
10K
470K
IC1003
AOZ1073AIL
3A
8
7
6
5
LX_2
LX_1
EN
COMP
26_32INCH
VIN_1
VIN_2
VOUT_1
VOUT_2
R1014
9.1K
R1071
0
R1015
NON_19_22INCH
MP20045DQ-LF-Z
1
2
3
4
C1050
2200pF
P_24V_SMALL_15V
P_12V_SMALL_15V
P_24V_SMALL_15V
P_24V_SMALL_15V
P_3.5V
0
R1072
0
19_22INCH
BIG_NON_AUO
R1021
0
BIG_AUO/IPS
R1017
OPT
0
C1008
0.1uF
R1083
16V
0
SHARP HD
IC1005
8
9
7
THERMAL
6
5
NR8040T3R6N
L1001
3.6uH
+3.5V_MULTI
R1013
10K
C1034
0.1uF
16V
R2
P_3.5V
19_22INCH
R1028 0
EXCEPT_BIGCMO
R1029 100
BIG_CMO
R1030
100
BIG_CMO
R1031 0
19_22INCH
R1032 0
BIG_LGD
R1033 0
BIG_AUO
R1034
0
READY
R1084
0
BIG_LGD/SHARP FHD
R1035
0
R1023
0
OPT
C1012
1uF
25V
EP[GND]
EN
PG
GND
FB
R1007
5%
51K
R1
R1009
5%
1.5K
R1008
10K
1%
C1004
100pF
50V
R1061
R1062
+3.5V_MULTI
OLP
OPT
R1037
6.8K
READY
R1082
0
NON_OPC
R1038
R1039
4.7K
100K
C1006
10uF
16V
L1003
500
L1004
120-ohm
AUDIO_OUT
L1012
120-ohm
R1046
3.3K
2SC3052
C
Q1002
B
E
C1044
2.2uF
10V
+3.3V_MULTI_MST
READY
R1040
4.7K
NON_OPC
1K
R1060
6.2K
HD_OPC
HD_OPC
R1075
1K
6.2K
C1020
C1071
10uF
10uF
16V
16V
C1043
68uF
35V
C1045
10uF
16V
AUDIO_OUT
C1075
47uF
25V
R1047
10K
R1080
10K
PANEL_STATUS
E-DIM
OPC_OUT
C1072
0.1uF
16V
C1046
0.01uF
50V
C1057
0.01uF
50V
AUDIO_OUT
C1076
0.01uF
50V
DISP_EN/VAVS_ON
I-DIM
+5V_MULTI
C1007
0.1uF
50V
C1058
0.1uF
50V
C1011
0.01uF
50V
+16V_NTP
+3.5V_MST
+12V_AUDIO
**5V_MULTI->3.3V->1.2V
IC1001
BD9130EFJ-E2
+3.5V_MULTI
+3.5V_MST
C1059
10uF
16V
C1054
0.1uF
50V
C1017
10uF
16V
ADJ
1
VCC
2
ITH
3
R1043
GND
12K
C1060
560pF
50V
4
MAX 2A
V0 = 0.8*(1+(R2/R1))
READY
L1010
120-ohm
EN
R1044
8
7
6
5
PVCC
SW
PGND
C1068
2.2uF
10V
10K
READY
R1078
3.3
READY
C1055
2200pF
50V
R1063
R1064
1%
12K
1%
10K
L1002
2.2uH
C1070
2.2uF
10V
READY
C1069
100pF
50V
R8043
470K
C1014
0.1uF
16V
C1013
10uF
16V
VIN_1
VIN_2
VOUT_1
VOUT_2
C1018
10uF
16V
IC1007
MP20045DQ-LF-Z
1
9
2
THERMAL
3
4
OUT:1.27V
C1023
0.1uF
50V
1
IC1008
AP1117EG-13
3
MAX 1A
1
ADJ/GND
READY
ZD1002
3.6V
2
READY
C1036
1uF
25V
OUT
C1062
10uF
6.3V
READY
C1037
1uF
25V
R1
R2
R1045
R2
2K
R1053
R1
3.3K
IC1002
8
7
6
5
C1016
10uF
10V
EP[GND]
EN
PG
GND
FB
AP1117EG-13
IN
3
C1015
0.1uF
50V
+3.5V_MULTI
READY
R1066
4.7K
READY
R1073
47K
R1067
100K
MAX 1A
1
2
ADJ/GND
R1081
10K
OUT
OUT:1.85V
V0 = 1.25*(1+(R2/R1))
R1054
120
R1055
56
IN
R1016
C1022
10uF
6.3V
R1
R2
POWER_SW
closed IC1007
READY
C1028
100uF
16V
L1013
120-ohm
READY
R1076
0
OUT:1.85V
R1077
R1022
120
1
C1051
10uF
6.3V
R1079
56
C1063
0.1uF
50V
+1.2V_VDDC_MST
+1.8V_DDR
C1077
DDR2, Vref
10uF
6.3V
+1.8V
NTP,AUDIO DSP
READY
C1073
C1074
0.1uF
1uF
50V
25V
+3.3V_MULTI_MST
+1.8V
NTP,AUDIO DSP
**Switch 12V:P12V **Switch 3.5V:3.5.V_MULTI
+5V_MULTI P_12V_SMALL_15V
19_22INCH
26_32INCH
L1005
L1006
120-ohm
120-ohm
C1056
B
R1070
B
P_3.5V
22K
R1049
1uF
33K
25V
26_32INCH
R1065
19_22INCH
33K
R1065-*1
10K
C
RT1C3904-T112
E
C1048
1uF
25V
R1069
1.6K
C
RT1C3904-T112
Q1004
E
V0 = 0.8*(1+(R1/R2))
READY
C1027
68uF
35V
Close to Q1003
PANEL_ON
POWER_SW
R1048
10K Q1001
R1020
10K
R1068
10K
**DC-DC CONVERTER
**12V->TUNER 5V
IC1006
C1032
0.1uF
50V
PGND
VIN
AGND
FB
AOZ1073AIL
1
2
3
4
3A
LX_2
8
LX_1
7
EN
6
R1058
COMP
5
9.1K
P_12V_SMALL_15V
L1008
500
C1030
10uF
25V
C1031
10uF
25V
S2
G2
S1
G1
C1024
2200pF
Q1003
AO4813
EBK60706901
1
2
3
4
NR8040T3R6N
L1009
3.6uH
R1057
10K
C1064
0.1uF
16V
8
7
6
5
+3.5V_MULTI
R1
R2
D2_2
D2_1
D1_2
D1_1
1%
5%
R1011
24K
R1012
51K
R1018
10K
1%
OPT
C1035
100pF
50V
C1005
0.1uF
50V
C1019
10uF
16V
OUT:6.8V
120-ohm
C1025
10uF
16V
L1007
C1021
0.01uF
50V
C1026
10uF
16V
READY
100uF
16V
R1050
2.2K
C1029
10uF
16V
R1051
READYC1061
ZD1001
3.6V
C1033
0.1uF
16V
2.2K
READY
C1038
1uF
25V
R1052
2.2K
C1039
0.1uF
50V
C1009
100uF
16V
C1040
0.1uF
50V
C1010
0.01uF
50V
IC1000
AP1117EG-13
2OUT 3 IN
IN
IC1004
AP1117EG-13
2OUT 3
1
1
ADJ/GND
ADJ/GND
R1019
R1025
110
110
+5V_+12V_LCD
+3.5V_MULTI
R1026
330
C1042
C1047
100uF
0.1uF
16V
16V
R1027
330
READY
C1041
C1049
100uF
0.1uF
16V
16V
+5V_TUNER
+5V_USB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LK310
POWER
2010/11/22
9 9
Page 28
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