LG 32LG7000, 32LG7000-ZA Service Manual

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LD88D

MODEL : 32LG7000 32LG7000-ZA

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

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LGE Internal Use Only

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION ...............................................................10

TROUBLE SHOOTING ...........................................................................14

BLOCK DIAGRAM...................................................................................23

EXPLODED VIEW .................................................................................. 33

SVC. SHEET ...............................................................................................

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LGE Internal Use Only

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

LGE Internal Use Only

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500

°F to 600°F)

b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500

°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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LGE Internal Use Only

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

LGE Internal Use Only

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SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This specification is applied to LD88D chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

(1) Temperature : 25 ± 5°C(77 ± 9°F), CST : 40 ± 5°C (2) Humidity : 65% ± 10% (3) Power : Standard input voltage (100-240V~, 50/60Hz)

* Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

(1) Performance : LGE TV test method followed (2) Demanded other specification

Safety : CE, IEC Specification EMC : CE, IEC

No. Item Specification Remark

1 Display Screen Device 31.5 inch Color TFT-LCD Module(AUO) LCD

2 Aspect Ratio 16:9

3 LCD Module Pixel Format: 1920 horiz. By 1080 vert. pixels

RGB stripe arrangement

4 Operating Environment 1) Temp. : 0 ~ 40 deg

2) Humidity : 20 ~ 80% LGE SPEC

5 Storage Environment 3) Temp. : -20 ~ 60 deg

4) Humidity : 10 ~ 90 %

6 Input Voltage AC100-240V~, 50/60Hz Maker LG

3 General Specification(LCD Module)

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LGE Internal Use Only

4. Model Specification

No. Item Specification Remark

1 Market Austria, Belgium, Bulgaria, Croatia, Czech, Denmark, Finland, 25 Country -> 27 country

France, Germany, Greece, Hungary, Italy, Luxembourg, UK

Morocco, Netherlands, Norway, Poland, Portugal, Romania,

Russia, Serbia,Slovenia, Spain, Sweden, Switzerland, Turkey,

2 Broadcasting system 1) PAL/SECAM BG EU (PAL Market)

2) PAL/SECAM DK

3) PAL I/II

4) SECAM L/L’

5) DVB T

3 Receiving system Analog : Upper Heterodyne

Digital : COFDM

4 Scart Jack (2EA) PAL, SECAM Scart 1 Jack is Full scart and support

RF-OUT(Analog)

Scart 2 jack is Half scart and support

MNT-OUT.

5 Video Input (1EA) PAL, SECAM, NTSC Side AV

6 S-Video Input (1EA) PAL, SECAM, NTSC Side AV

7 Component Input (1EA) Y/Cb/Cr, Y/ Pb/Pr

8 RGB Input RGB-PC Analog (D-Sub 15Pin)

9 HDMI Input (4EA) HDMI-PC HDMI1/DVI, HDMI2, HDMI3, HDMI4

HDMI-DTV All HDMI inputs support V1.3 of HDMI

10 Audio Input (3 EA) RGB/DVI Audio, Component, AV L/R Input

11 SPDIF Out(1 EA) SPDIF Out

12 USB For SVC, S/W Download, X-Studio Side(X-Studio Only Series)

13 Bluetooth Bluetooth Phone(JPEG), Headset 32/37/42/47/52LG7000 models

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LGE Internal Use Only

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4 720*480 31.47 59.94 27.000 SDTV 480P

5 720*480 31.50 60.00 27.027 SDTV 480P

6 720*576 31.25 50.00 27.000 SDTV 576P 50Hz

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 1280*720 45.00 60.00 74.250 HDTV 720P

9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10 1920*1080 33.72 59.94 74.176 HDTV 1080I

11 1920*1080 33.75 60.00 74.250 HDTV 1080I

12 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

13 1920*1080 56.25 50 HDTV 1080P

14 1920*1080 67.5 60 HDTV 1080P

5. Component Video Input (Y, P

B, PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed Remark

1. 720*400 31.468 70.08 28.32

2. 640*480 31.469 59.94 25.17 VESA

3. 800*600 37.879 60.31 40.00 VESA

4. 1024*768 48.363 60.00 65.00 VESA(XGA)

5. 1280*768 47.78 59.87 80.125 VESA(WXGA)

6 1360*768 47.72 59.80 84.625 VESA(WXGA)

7 1280*1024 63.98 60.02 108. SXGA FULL HD only

8 1400*1050 65.317 59.979 121.75 SXGA FULL HD only

9. 1920*1080 66.587 59.934 138.5 WUXGA

6. RGB input (Analog PC)

LGE Internal Use Only

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No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed Remark

1. 720*400 31.468 70.08 28.32

2. 640*480 31.469 59.94 25.17 VESA

3. 800*600 37.879 60.31 40.00 VESA

4. 1024*768 48.363 60.00 65.00 VESA(XGA)

5. 1280*768 47.78 59.87 80.125 VESA(WXGA)

6 1360*768 47.72 59.80 84.625 VESA(WXGA)

7 1280*1024 63.98 60.02 108. SXGA FULL HD only

8 1400*1050 65.317 59.979 121.75 SXGA FULL HD only

9. 1920*1080 66.587 59.934 138.5 WUXGA

7. HDMI DTV

8. HDMI PC

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1 640*480 31.649 59.94 25.175 SDTV 480p 60Hz

2 640*480 31.469 60 25.20 SDTV 480p 60Hz

3 720*480 31.47 59.94 27.00 SDTV 480p 60Hz

4 720*480 31.50 60 27.027 SDTV 480p 60Hz

5 720*576 31.25 50.00 27.00 SDTV 576p 50Hz

6 1280*720 37.50 50.00 74.176 HDTV 720p 50Hz

7 1280*720 44.96 59.94 74.176 HDTV 720p 60Hz

8 1280*720 45.00 60 74.250 HDTV 720p 60Hz

9 1920*1080 28.125 50.00 74.250 HDTV 1080i 50Hz

10 1920*1080 33.72 59.94 74.176 HDTV 1080i 60Hz

11 1920*1080 33.75 60 74.250 HDTV 1080i 60Hz

12 1920*1080 27.00 24.00 74.25 HDTV 1080p 24Hz

13 1920*1080 33.750 30 74.25 HDTV 1080p 30Hz

14 1920*1080 56.25 50.00 148.50 HDTV 1080p 50Hz

15 1920*1080 67.433 59.94 148.352 HDTV 1080p 60Hz

16 1920*1080 67.50 60 148.50 HDTV 1080p 60Hz

LGE Internal Use Only

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ADJUSTMENT INSTRUCTION

1. Application Range

This spec. sheet is applied to all of the LD88D chassis manufactured at LG TV Plant all over the world.

2. Specification.

(1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation

transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of

25±5°C of temperature and 65±10% of relative humidity if

there is no specific designation. (4) The input voltage of the receiver must keep 100-240V,

50/60Hz. (5) The receiver must be operated for about 15 minutes prior

to the adjustment.

- After RGB Full White in HEAT-RUN Mode, the receiver must be operated prior to the adjustment.

- Enter into HEAT-RUN MODE

1) Press the “POWER ON” KEY on Adjustment R/C.

2) Press the “ADJ KEY” on Adjustment R/C.

3) Select “3. Test Pattern” by using

D/E(CH +/-) and

press ENTER(

4) Select “White” by using

F/G(VOL +/-) and press

ENTER(

* Set is activated HEAT run without signal generator in this

mode.

* Single color pattern ( RED / BLUE / GREEN ) of HEAT

RUN MODE uses to check panel.

* Caution : If you turn on a still pattern more than 20

minutes (Especially digital pattern, cross hatch pattern), an after image may be occur in the black level part of the screen.

3. PCB assembly adjustment method

Caution: Using ‘power on’ button of the Adjustment R/C ,

power on TV.

* ADC Calibration Protocol (RS232)

* EDID data and Model option download (RS232)

** Note 1 & Note 2

- Baud rate : 115200 bps

- RS232 Host : PC

- echo : none

3.1. ADC adjustment

* Adjustment can be done using only internal ADC, so input

signal is not necessary.

* Required equipment : Adjustment R/C.

1) Press ADJ key on adjustment R/C.

2) Select “1. ADC calibration” by using

D/E(CH +/-) and press

ENTER(

3) Select “Start” by using

F/G(VOL +/-) and press ENTER(A)

4) ADC adjustment is executed automatically.

3.2 PCMCIA CARD Checking Method

You must adjust DTV 29 Channel and insert PCMCIA CARD to socket.

1) If PCMCIA CARD works normally, normal signals display on screen. But it works abnormally, “No CA module” words display on screen.

* Caution: Set up “RF mode” before launching products.

Item CMD1 CMD2 Data0

Enter Adjust ‘Mode In’ A D 0 0 When transfer the ‘Mode In’,

Adjust Mode Carry the command.

ADC adjust ADC Adjust A D 1 0 Automatically adjustment

(The use of a internal pattern)

Adjust ‘Mode Out’ A D 9 0

Adjustment A D 9 9 To check ADC Adjustment

Confirmation on Assembly line.

RF input AV / Component / RGB input

NO SIGNAL or White noise NO SIGNAL

NO Item CMD1 CMD2 Data0

Enter Download A E 0 0 When transfer the ‘Mode

download ‘Mode In’ In’, Carry the command.

MODE

Edid data and Download A E *Note1 *Note2 Automatically download

Model option (The use of a internal Data)

download

Adjust ‘Mode Out’ A E 9 0

Adjustment A E 9 9 To check download

Confirmation on assembly line

Model Option Note 1 Note 2

32LG7000-ZA 5 6

37LG7000-ZA 5 7

42LG7000-ZA 5 8

47LG7000-ZA 5 9

52LG7000-ZA 5 A

4. EDID (The Extended Display Identification DATA)

* When company internal production(total assembly), EDID

data must scan in DDC line.

4.1. EDID Download

Before downloading EDID Data, check the RGB/HDMI cable is disconnected.

1) Press ADJ key on Adjustment R/C.

2) Select “5.EDID D/L” by using

D/E(CH +/-) and press

ENTER(

3) Select “Start” by using

F/G(VOL +/-) and press ENTER(A)

4) EDID DownLoad is executed if word “NG” is changed to “OK” about all HDMI ports.

4.2. EDID Data

(1) HDMI1

ⓐ Product ID

: ex) Monthly : ‘09’ -> ‘09’

Year: ‘2006’ -> ‘10’

ⓓ Model Name(Hex):

ⓔ Checksum: Changeable by total EDID data. ⓕ Port No.

10:HDMI1, 20:HDMI2, 30:HDMI3, 40:HDMI4

(2) RGB

ⓐ Product ID

: ex) Monthly : ‘09’ -> ‘09’

Year: ‘2006’ -> ‘10’

ⓓ Model Name(Hex):

ⓔ Checksum: Changeable by total EDID data

- 11 -

LGE Internal Use Only

0x00 0x010x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D0x0E 0x0F

0x20 11 49 4B A1 08 00 31 40 45 40 61 40 81 80 90 40

0x30 D1 C0 01 01 01 01 1A 36 80 A0 70 38 1F 40 30 20

0x40 35 00 E8 26 32 00 00 1A 1B 21 50 A0 51 00 1E 30

0x50 48 88 35 00 BC 86 21 00 00 1C 00 00 00 FD 00 39

0x60 4B 1F 54 12 00 0A 20 20 20 20 20 20 0x70 ⓓ 01 ⓔ

0x80 02 03 23 F1 4E 81 02 03 15 12 13 04 14 05 20 21 0x90 22 1F 10 23 09 57 07 83 01 00 00 67 03 0C 00 ⓕ

0xA0 00 B8 2D 01 1D 00 80 51 D0 1C 20 40 80 35 00 BC

0xB0 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96

0xC0 00 13 8E 21 00 00 18 02 3A 80 18 71 38 2D 40 58

0xD0 2C 45 00 06 44 21 00 00 1E 01 1D 80 18 71 1C 16

0xE0 20 58 2C 25 00 C4 8E 21 00 00 9E 4E 1F 00 80 51 0xF0 00 1E 30 40 80 37 00 BC 88 21 00 00 18 00 00 ⓔ

MODEL NAME PRODUCT ID HEX EDID Table

32LG7000 30302 765E 5E76

37LG7000 30264 7638 3876

42LG7000 40360 9DA8 A89D

47LG7000 40362 9DAA AA9D

52LG7000 50202 C41A 1AC4

MODEL NAME MODEL NAME(HEX)

32LG7000 00 00 00 FC 00 33 32 4C 47 37 30 30 30 0A 20 20 20 20

37LG7000 00 00 00 FC 00 33 37 4C 47 37 30 30 30 0A 20 20 20 20

42LG7000 00 00 00 FC 00 34 32 4C 47 37 30 30 30 0A 20 20 20 20

47LG7000 00 00 00 FC 00 34 37 4C 47 37 30 30 30 0A 20 20 20 20

52LG7000 00 00 00 FC 00 35 32 4C 47 37 30 30 30 0A 20 20 20 20

0x00 0x010x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D0x0E 0x0F

0x02 11 49 4B A1 08 00 31 40 45 40 61 40 D1 C0 90 40

0x03 81 80 01 01 01 01 1A 36 80 A0 70 38 1F 40 30 20

0x04 35 00 E8 26 32 00 00 1A 1B 21 50 A0 51 00 1E 30

0x05 48 88 35 00 BC 86 21 00 00 1C 00 00 00 FD 00 39

0x06 4B 1F 54 12 00 0A 20 20 20 20 20 20 0x07 ⓓ 00 ⓔ

MODEL NAME PRODUCT ID HEX EDID Table

32LG7000 30301 765D 5D76

37LG7000 30263 7637 3776

42LG7000 40359 9DA7 A79D

47LG7000 40361 9DA9 A99D

52LG7000 50201 C419 19C4

MODEL NAME MODEL NAME(HEX)

32LG7000 00 00 FC 00 33 32 4C 47 37 30 30 30 2D 0A 20 20 20 20

37LG7000 00 00 FC 00 33 37 4C 47 37 30 30 30 2D 0A 20 20 20 20

42LG7000 00 00 FC 00 34 32 4C 47 37 30 30 30 2D 0A 20 20 20 20

47LG7000 00 00 FC 00 34 37 4C 47 37 30 30 30 2D 0A 20 20 20 20

52LG7000 00 00 00 FC 00 35 32 4C 47 37 30 30 30 0A 20 20 20 20

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LG 32LG7000, 32LG7000-ZA Service Manual

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Frequently Asked Questions

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