LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
Page 4
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Application range
This spec sheet is applied LCD TV with LA01D chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25±5ºC, (77°±9ºF), CST: 40±5°C
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
- Wireless : WirelessHD Specification (Option)
ModelMarketAppliance
42/47/55LE7300
North America Safety : UL1492, CSA C22.2.No.1,
32/37/42/LE5300
EMC : FCC Class B, IEC Class B
47/55LE5300 Wireless HD: Option
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
ADJUSTMENT INSTRUCTION
1. Application range
• This spec. sheet applies to LA01D Chassis applied LCD TV
all models manufactured in TV factory
2. Specification
2.1 Because this is not a hot chassis, it is not necessary
to use an isolation transformer. However, the use of
isolation transformer will help protect test instrument.
2.2 Adjustment must be done in the correct order.
2.3 The adjustment must be performed in the
circumstance of 25 ± 5 °C of temperature and 65 ± 10
% of relative humidity if there is no specific
designation.
2.4 The input voltage of the receiver must keep
100~240V, 50/60Hz.
2.5 The receiver must be operated for about 5 minutes
prior to the adjustment when module is in the
circumstance of over 15
In case of keeping module is in the circumstance of
0°C, it should be placed in the circumstance of above
15°C for 2 hours
In case of keeping module is in the circumstance of
below -20°C, it should be placed in the circumstance of
above 15°C for 3 hours,.
Caution) When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is
strong. Digital pattern 13ch and/or Cross hatch
pattern 09ch), there can some afterimage in the
black level area.
3. Adjustment items
3.1 Board Level Adjustment
•Adjust 480i Comp1(ADC)
•EDID/DDC download
Above adjustment items can be also performed in Final
Assembly if needed. Both Board-level and Final assembly
adjustment items can be check using In-Star Menu 1.ADJUST
CHECK. Component 1080p and RGB-PC Adjust will be
calculated by 480i adjust value.
3.2 Final assembly adjustment
•White Balance adjustment
•RS-232C functionality check
•Factory Option setting per destination
•Ship-out mode setting (In-Stop)
3.3 Etc
•Ship-out mode
•Service Option Default
•USB Download(S/W Update, Option, Service only)
•ISP Download (Optional)
4. Automatic Adjustment
4.1. ADC Adjustment
(1) Overview
ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate
RGB deviation.
- Using RS-232, adjust items listed in 3.1 in the other
shown in “4.1.3.3”
2) Adj. protocol
Ref.) ADC Adj. RS232C Protocol_Ver1.0
3) Adj. order
- aa 00 00 [Enter ADC adj. mode]
- xb 00 40 [Change input source to Component1(480i)]
- ad 00 10 [Adjust 480i Comp1]
- xb 00 60 [Change input source to RGB(1024*768)]
- ad 00 10 [Adjust 1024*768 RGB]
- ad 00 90 End adj.
ProtocolCommandSet ACK
Enter adj. mode aa 00 00a 00 OK00x
Source changexb 00 40b 00 OK40x (Adjust 480i Comp1 )
xb 00 60 b 00 OK60x (Adjust 1024*768 RGB)
Begin adj.ad 00 10
Return adj. resultOKx (Case of Success)
NGx (Case of Fail)
Read adj. data(main)(main)
ad 00 20 000000000000000000000000007c007b006dx
(sub)(Sub)
ad 00 21000000070000000000000000007c00830077x
Confirm adj.ad 00 99NG 03 00x (Fail)
NG 03 01x (Fail)
NG 03 02x (Fail)
OK 03 03x (Success)
End adj.aa 00 90a 00 OK90x
NOItem CMD 1 CMD 2 Data 0
Enter Adjust A A 00When transfer the ‘Mode In’,
Adjust MODE ‘Mode In’Carry the command.
ADC adjust ADC Adjust A D 1 0Automatically adjustment
(The use of a internal pattern)
Page 12
- 12 -
5. EDID/DDC Download
(1) Overview
It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
(2) Equipment
• Adjust remocon.
• Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
(3) Download method
1) Press Adj. key on the Adj. R/C,
2) Select 10. PCM EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If
Download is failure, NG is displayed.
5) If Download is failure, Re-try downloads.
•Caution) When EDID Download, must remove RGB/HDMI
Cable.
5.1 EDID DATA
HDMI1-EDID
Block 0
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
- How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic
Range. In order to prevent saturation of
Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is
lowered to find the desired value.
- Adj. condition : normal temperature
1) Surrounding Temperature: 25 ± 5 ºC
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20 % ~ 80 %
(2) Equipment
1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model:217, Pattern:78)
-> Only when internal pattern is not available
• Color Analyzer Matrix should be calibrated using CS-1000
(3) Adj. Command (Protocol)
1) RS-232C Command used during auto-adj.
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.
wb 00 ff -> End white balance auto adj.
(4) Adj. method
• Auto adj. method
1) Set TV in adj. mode using POWER ON key
2) Zero calibrate probe then place it on the center of the
Display
3) Connect Cable(RS-232C)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sing), check adj. status pre
mode (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
* W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if
need
• Manual adj. method
1) Set TV in Adj. mode using POWER ON
2) Zero Calibrate the probe of Color Analyzer, then place
it on the center of LCD module within 10cm of the
surface..
3) Press ADJ key -> EZ adjust using adj. R/C > 6. WhiteBalance then press the cursor to the right (KEY
G).
(When KEY(
G) is pressed 216 Gray internal pattern
will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at
192, and the rest will be lowered to meet the desired
value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes
of color temperature.
- If internal pattern is not available, use RF input. In EZ
Adj. menu 6.White Balance, you can select one of 2
Test-pattern: ON, OFF. Default is inner(ON). By
selecting OFF, you can adjust using RF signal in 216
Gray pattern.
* Adj. condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
- LCD: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module
surface (80 °~ 100 °)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked
using no signal or Full-white pattern.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Colo r Analyzer
Comp ut er
Pattern Ge n e r ator
RS-232C
RS-232C
RS-232C
Probe
Signal Source
* If TV internal pattern is used, not needed
Connection Diagram of Automatic Adjustment
RS-232C COMMAND
Meaning
[CMDIDDATA]
wb0000Begin White Balance adj.
wb00ffEnd White Balance adj.(Internal pattern disappeared)
Page 14
- 14 -
(5) Reference (White Balance Adj. coordinate and color
temperature)
• Luminance: 216 Gray
• Standard color coordinate and temperature using CS1000
• Standard color coordinate and temperature using CS-210
(CH9)
•Standard color coordinate and temperature using CA-
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
7. USB S/W Download (option)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work.
But your downloaded version is High, USB data is
automatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote controller.
2) Select "Tool Option 1" and Push “OK” button.
3) Punch in the number. (Each model has their number.)
Page 16
400
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
521
IMPORTANT SAFETY NOTICE
710
800
LV2
LV1
200
530
540
840
880
830
310
810820
910
900
A10
A9
A5
A21
A2
120
500
300
Only for training and service purposes
- 16 -
511
510
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Page 17
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
/PF_WP
R/B
RE
CE
CLE
ALE
WE
WP
NAND FLASH MEMORY
+3.5V_ST
IC102-*1
HY27US08121B-TPCB
512MBIT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
/PF_CE0
H : Serial Flash
L : NAND Flash
/PF_CE1
H : 16 bit
L : 8 bit
R103
OPT
R101
3.3K
3.3K
R102
/F_RB
/PF_OE
/PF_CE0
+3.3V_Normal
10K
OPT
R104
0
B
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
/PF_CE1
C
Q101
KRC103S
E
NC_28
NC_27
NC_26
NC_25
I/O7
I/O6
I/O5
I/O4
NC_24
NC_23
PRE
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
PF_ALE
/PF_WE
OPT
R105
1K
OPT
R106
1K
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
VDD_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
1K
R107
R1081K
RB
R
E
CL
AL
W
WP
+3.3V_Normal
R109 3.9K
C101
OPT
0.1uF
NAND01GW3B2CN6E
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
IC102-*2
1GBIT
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
R/B
RE
CE
CLE
ALE
WE
WP
HY27UF082G2B-TPCB
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VDD_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
IC102
2GBIT
+3.3V_Normal
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
S7M_NON_DIVX & MS10
IC101-*2
LGE107 (S7M Non Divx/RM)
AE1
FRC_DDR3_A0/DDR2_NC
AF16
FRC_DDR3_A1/DDR2_A6
AF1
FRC_DDR3_A2/DDR2_A7
AE3
FRC_DDR3_A3/DDR2_A1
AD14
FRC_DDR3_A4/DDR2_CASZ
AD3
FRC_DDR3_A5/DDR2_A10
AF15
FRC_DDR3_A6/DDR2_A0
AF2
FRC_DDR3_A7/DDR2_A5
AE15
FRC_DDR3_A8/DDR2_A2
AD2
FRC_DDR3_A9/DDR2_A9
AD16
FRC_DDR3_A10/DDR2_A11
AD15
FRC_DDR3_A11/DDR2_A4
AE16
FRC_DDR3_A12/DDR2_A8
BCKP/TCON13/GREEN[1]
BCKM/TCON12/GREEN[0]
AF3
FRC_DDR3_BA0/DDR2_BA2
AF14
FRC_DDR3_BA1/DDR2_ODT
AD1
FRC_DDR3_BA2/DDR2_A12
AD13
FRC_DDR3_MCLK/DDR2_MCLK
AE14
FRC_DDR3_CKE/DDR2_RASZ
AE13
FRC_DDR3_MCLKZ/DDR2_MCLKZ
AE4
FRC_DDR3_ODT/DDR2_BA1
AD5
FRC_DDR3_RASZ/DDR2_WEZ
AF4
FRC_DDR3_CASZ/DDR2_CKE
AD4
FRC_DDR3_WEZ/DDR2_BA0
AE2
FRC_DDR3_RESETB/DDR2_A3
AF8
FRC_DDR3_DQSL/DDR2_DQS0
AD9
FRC_DDR3_DQSLB/DDR2_DQSB0
AE9
FRC_DDR3_DQSU/DDR2_DQS1
AF9
FRC_DDR3_DQSUB/DDR2_DQSB1
AE11
FRC_DDR3_DML/DDR2_DQ7
AF6
FRC_DDR3_DMU/DDR2_DQ11
AE6
FRC_DDR3_DQL0/DDR2_DQ6
AF11
FRC_DDR3_DQL1/DDR2_DQ0
AD6
FRC_DDR3_DQL2/DDR2_DQ1
AD12
FRC_DDR3_DQL3/DDR2_DQ2
AE5
FRC_DDR3_DQL4/DDR2_DQ4
AF12
FRC_DDR3_DQL5/DDR2_NC
AF5
FRC_DDR3_DQL6/DDR2_DQ3
AE12
FRC_DDR3_DQL7/DDR2_DQ5
AE10
FRC_DDR3_DQU0/DDR2_DQ8
AF7
FRC_DDR3_DQU1/DDR2_DQ14
AD11
FRC_DDR3_DQU2/DDR2_DQ13
AD7
FRC_DDR3_DQU3/DDR2_DQ12
AD10
FRC_DDR3_DQU4/DDR2_DQ15
GPIO0/TCON15/HSYNC/VDD_ODD
AE7
FRC_DDR3_DQU5/DDR2_DQ9
GPIO1/TCON14/VSYNC/VDD_EVEN
AF10
FRC_DDR3_DQU6/DDR2_DQ10
GPIO2/TCON7/LDE/GCLK4
AD8
FRC_DDR3_DQU7/DDR2_DQM1
GPIO3/TCON6/LCK/GCLK2
AE8
FRC_DDR3_NC/DDR2_DQM0
Y11
FRC_REXT
Y19
FRC_TESTPIN
<T3 CHIP Config(AUD_LRCH)>
Boot from SPI flash : 1’b0
Boot from NOR flash : 1’b1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LOW
NO FRC
50/60Hz LVDS
LVDS
DDR_256MB
HD
W2
VIFP
W1
VIFM
V2
IP
V1
IM
Y2
Y1
U3
QP
V3
QM
Y5
Y4
U1
U2
R3
T3
T2
T1
G14
G13
B7
A7
AF17
AE17
F14
F13
F15
D20
E20
D19
F18
E18
D18
E19
N1
P3
P1
P2
P4
P5
R6
T6
U5
V5
U6
V6
U4
W3
W4
V4
Y3
W5
R4
T5
R5
T4
P7
VRM
R7
VAG
P6
VRP
R1
R2
E21
E22
D21
F21
E23
D22
F22
D23
F23
F8
G8
K8
A4
Y17
NO_FRC : LOW LOW
U3_INTERNAL : HIGH LOW
U3_EXTERNAL : HIGH HIGH
PWIZ TCON with LG FRC : HIGH HIGH
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
DDR3(FRC)
Ver. 1.4
3
Page 20
RL_ON
+3.5V_ST
C401
100uF
16V
+12V/+15V
C402
100uF
16V
R401
C
10K
B
E
MLB-201209-0120P-N2
C406
0.1uF
16V
L402
MLB-201209-0120P-N2
C404
0.1uF
16V
Q401
2SC3052
L404
<OS MODULE PIN MAP>
PIN No
LGD(PSU)
or LIPS
INV_ON
18
VBR-A
20
22
PWM_DIM
Err_out
24
GND
23
FROM LIPS & POWER B/D
+3.5V_ST
RT1P141C-T112
Q402
R406
4.7K
C407
0.1uF
16V
A-DIM
PWM_DIM
INV_ON
C408
0.1uF
16V
CMO
NC
GND
3
1
R476
0
2
POWER_23_GND
NORMAL_EXPEPT_32
R478
AUO
INV_ON
Err_out
PWM_DIM
INV_ON
52/60:ERROR
26/32HD:NC
26/32/52:PWM
NC
26/32/52:GND
GNDGNDGND
OLP
P403
FW20020-24S
PWR ON
24V
GND
GND
3.5V
3.5V
GND
GND
12V
12V
12V
GND/P.DIM2
C412
0.1uF
16V
0
POWER_23_SCAN_BLK2
C484
1uF
25V
SCAN_BLK2
SHARP
(PSU) (PSU)(PSU)(PSU)
60:NC
60:PWM
1
1
1
3
3
3
5
5
5
7
7
7
9
9
9
11
11
11
13
13
13
15
15
15
17
17
17
19
19
19
21
2122
2122
23
2324
2324
25
25
SLIM_32~52
P401
SMAW200-H24S2
OPT
OPT
IPS-@
INV_ON
Err_out
NC
PWM_DIM
NORMAL_32
P404
FM20020-24
2
2
2
4
4
4
6
6
6
8
8
8
10
10
10
12
12
12
14
14
14
16
16
16
18
18
18
20
20
20
22
24
24V
24V
GND
GND
3.5V
3.5V
GND
GND/V-sync
INV ON
A.DIM
P.DIM1
Err OUT
L407
MLB-201209-0120P-N2
POWER_16_V_SYNC
POWER_18_INV_CTL
R4120
POWER_16_GND
POWER_24_INV_CTL
R475
0
POWER_24_GND
POWER_24_PWM_DIM
POWER_22_PWM_DIM
C418
0.1uF
50V
R477
0
R415
100
R425
100
POWER_20_PWM_DIM
R479
0R472
0
0R471
C416
OPT
0.1uF
16V
POWER_20_ERROR_OUT
POWER_24_ERROR_OUT
R420
V_SYNC
+3.3V_Normal
C
R418
6.8K
OPT
E
R484
0
OPT
C419
1uF
25V
100R437
100
+24V
C426
68uF
35V
R419
1K
R421
10K
B
Q405
2SC3052
POWER_18_A_DIM
R451
POWER_22_A_DIM
R485 0
POWER_20_A_DIM
R453
C419-*1
3.9K
PWM_PULL-DOWN
R422 0
OPT
R470
+3.5V_ST
R426
10K
10K
OPT
0
0
SCAN_BLK1/OPC_OUT
OPT
0
+3.3V_Normal
OPT
R486
4.7K
OPT
INV_CTL
R427
A_DIM
PWM_DIM
ERROR_OUT
OPC_OUT
+12V/+15V
L412
PANEL_CTL
1:AK10
Placed on SMD-TOP
C461
C IN
22uF
10V
+3.5V_ST
+3.3V_Normal
OPT
R430
10K
R429
47K
B
CIC21J501NE
L420
R449
11K
1/10W
5%
VIN
C432
0.1uF
16V
R435
22K
C438
0.1uF
16V
R439
B
R440
33K
5.6K
C
E
R431
22K
C
Q406
2SC3052
E
C436
0.01uF
25V
S7M DDR 1.5V
C463
100pF
50V
Replaced Part
IC407
MP2212DN
R2
GND
IC402
AZ2940D-2.5TRE1
3
1
Vd=550mV
2
GND
FB
1
2
3A
IN
3
BS
4
VOUT
R452
10
R473
R4550
1/10W
1%
1
8
7
6
5
C403
10uF
10V
EN/SYNC
SW_2
SW_1
VCC
C442
10uF
16V
OPT
Q407
2SC3052
R457
10K
Close to IC
10V
1%
C465
1uF
C443
4.7uF
16V
Q409
AO3407A
S
G
OPT
R1
10K
R464
L423
3.6uH
NR8040T3R6N
C467
0.1uF
50V
+2.5V/+1.8V
+2.5V_Normal
C440
0.1uF
16V
C451
1uF
25V
D
New item
PANEL_POWER
C455
0.1uF
16V
PANEL_DISCHARGE_RES
PANEL_DISCHARGE_RES
1074 mA
Vout=0.8*(1+R1/R2)
+1.5V_DDR
POWER_ON/OFF1
C472
22uF
10V
Placed on SMD-TOP
300 mA
C476
0.1uF
R405
2.2K
PANEL_VCC
R407
2.2K
ST_3.5V--> 3.375V
20V-->3.51V
24V-->3.64V
12V-->3.58V
18.5V-->3.5V
+24V
POWER_+24V
POWER_+24V
+12V/+15V
R482
R403
24K
4.3K
1%
1%
POWER_+20V
POWER_+20V
L416
C457
C459
10uF
10uF
25V
25V
Vout=(1+R1/R2)*0.8
+12V/+15V
L417
C458
C460
10uF
10uF
25V
25V
Vout=0.8*(1+R1/R2)
+24V
R482-*1
24K
R403-*1
5.1K
R446
1%
5%
30K
+12V/+15V
OPT
R448
1%
R447
R482-*2
24K
POWER_+18.5V
R403-*2
POWER_+18.5V
Only for 32/37LED MODEL
12K
5.1K
5.6K
1%
PD_+12V
1/16W
5%
1%
1%
PD_+12V
+3.5V_ST
R4501K1%
R447-*1
27K
VCC
PD_+3.5V
1%
PD_+3.5V
R404
100K
IC409
NCP803SN293
3
GND
+3.3V_Normal
IC405
AOZ1073AIL
PGND
AGND
1
VIN
2
3A
3
FB
4
LX_2
8
LX_1
7
POWER_ON/OFF2_2
EN
6
R456
COMP
5
9.1K
R454
+5V_Normal
IC406
AOZ1072AI
PGND
VIN
AGND
1
2
3
FB
4
2A
8
7
6
5
+3.5V_ST -> 3.375V
R488
100K
IC408
NCP803SN293
VCC
3
1
GND
PD_+12V
RESET
2
1
PD_+12V
L421
3.6uH
NR8040T3R6N
10K
2200pF
C464
LX_2
LX_1
EN
R459
10K
COMP
12K
R458
+3.5V_ST
R463
10K
OPT
R402
100
RESET
2
PD_+12V
R480
100
Power_DET
1934 mA
1%
R460
27K
4.7K
R461
C423
100pF
R462
10K
L422
3.6uH
NR8040T3R6N
POWER_ON/OFF2_2
2200pF
C466
C469
R1
22uF
1%
16V
OPT
50V
1%
R2
MAX 1A
5%
R465
51K
R1
1%
1.5K
R466
OPT
C427
100pF
50V
1%
R2
R467
10K
C474
0.1uF
CIC21J501NE
C473
0.1uF
16V
C471
22uF
16V
POWER_DET
+3.3V_Normal
L424
C485
0.1uF
16V
+5V_Normal
C477
0.1uF
16V
+12V/+15V
C405
10uF
25V
L401
+5V_USB
IC401
MP8706EN-C247-LF-Z
IN
1
SW_1
2
SW_2
3A
BST
3
4
L406
3.6uH
NR8040T3R6N
C410
0.1uF
R487
22
8
7
6
5
GND
VCC
FB
EN/SYNC
C414
1uF
50V
R410
10K
POWER_ON/OFF2_1
R411
10K
+5V_USB
OPT
C482
100pF
50V
MAX 2000mA
OPT
1%
R416
33K
C429
100pF
R1
50V
1%
R417
6.2K
R2
C420
22uF
16V
C424
0.1uF
16V
+5V_USB
Vout=(1+R1/R2)*0.8
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
T-CON
Ver. 2.1
7
Page 23
HDMI_1
SHIELD
$0.253
EAG59023302
HDMI_1_withoutFringe
JK802
HDMI EEPROM
5V_HDMI_1
+5V_Normal
A1CA2
ENKMC2838-T112
R874
10K
R884
4.7K
5V_HDMI_2
10K
R873
R885
4.7K
5V_HDMI_3
R872
R886
4.7K
R888
4.7K
A2
10K
+5V_Normal
R889
4.7K
D821
A1
ENKMC2838-T112
D822
C
+5V_Normal
A1CA2
ENKMC2838-T112
D823
R890
4.7K
EDID_WP
DDC_SCL_1
DDC_SDA_1
EDID_WP
DDC_SCL_2
DDC_SDA_2
EDID_WP
DDC_SCL_3
DDC_SDA_3
5V_HDMI_1
20
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
R896
1K
R804
1.8K
D802
5V_DET_HDMI_1
3.3K
R802
C802
0.1uF
16V
JP803
JP804
R825
R826
R824
R847
R846
R845
R844
R843
R842
R850
R848
C
Q802
2SC3052
22
22
100
0
0
0
0
0
0
0
0
R830
B
10K
E
HPD1
DDC_SDA_1
DDC_SCL_1
HDMI_CEC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
SHIELD
YKF45-7054V
20
19
18
17
16
15
14
13
12
11
10
9
EAG59023301
8
7
6
5
4
3
2
HDMI_1_withFringe
1
JK802-*1
HPD
+5V_POWER
DDC/CEC_GND
SDA
SCL
NC
CEC
CLK-
CLK_SHIELD
CLK+
DATA0-
DATA0_SHIELD
DATA0+
DATA1-
DATA1_SHIELD
DATA1+
DATA2-
DATA2_SHIELD
DATA2+
HDMI_3
SHIELD
$0.253
HDMI_3
5V_HDMI_3
20
19
18
17
16
15
14
13
12
11
10
EAG59023302
9
8
7
6
5
4
3
2
1
JK804
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R894
1K
R838
1.8K
D812
5V_DET_HDMI_3
3.3K
R836
C804
0.1uF
16V
JP807
JP808
R859
R851
R860
R852
R816
R821
R814
R819
R818
R820
R812
C
Q804
2SC3052
22
22
100
0
0
0
0
0
0
0
0
R864
B
10K
E
HPD3
DDC_SDA_3
DDC_SCL_3
HDMI_CEC
CK-_HDMI3
CK+_HDMI3
D0-_HDMI3
D0+_HDMI3
D1-_HDMI3
D1+_HDMI3
D2-_HDMI3
D2+_HDMI3
HDMI_1
IC801
AT24C02BN-10SU-1.8
A0
1
$0.055
A1
2
A2
3
GND
4
HDMI_2
AT24C02BN-10SU-1.8
A0
1
$0.055
A1
2
A2
3
GND
4
AT24C02BN-10SU-1.8
A0
1
$0.055
A1
2
A2
3
GND
4
IC802
HDMI_3
IC803
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
JP809
R876 22
R875 22
JP810
R878 22
R877 22
JP811
C806
0.1uF
0.1uF
R879 22
R880 22
C807
C808
0.1uF
HDMI_2
SHIELD
20
$0.253
HDMI_2
EAG59023302
JK801
5V_HDMI_2
R895
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
1K
R803
1.8K
D801
5V_DET_HDMI_2
R801
3.3K
C801
0.1uF
16V
JP802
JP801
R805 22
R806
R815 100
R831
R834
R822
R832
R827
R829
R823
R833
C
R828
Q801
2SC3052
22
0
0
0
0
0
0
0
0
10K
B
E
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDE_HDMI
JACK_GND
20
$0.253
19
18
17
16
15
14
13
12
11
10
EAG42463001
9
HDMI_SIDE
8
7
6
5
4
3
2
1
JK803
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_4
R897
1K
R837
1.8K
D811
5V_DET_HDMI_4
R835
3.3K
JP806
C803
0.1uF
16V
JP805
R839 22
R840
R841
R810
R807
R817
R809
R813
R811
R849
R808
+5V_Normal
5V_HDMI_4
A2
A1
R871
10K
R887
4.7K
+3.5V_ST
ENKMC2838-T112
D824
C
R891
4.7K
R857
68K
OPT
CEC_ON/OFF
R853
68K
Ver. 1.2
8
R858
0
EDID_WP
DDC_SCL_4
DDC_SDA_4
CEC_REMOTE_S7
CEC_REMOTE_NEC
C
Q803
2SC3052
22
100
0
0
0
0
0
0
0
0
R862
B
10K
E
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
For CEC
HDMI_CEC
OPT
D803
AVRL161A1R1NT
GND
OPT
D826
AVRL161A1R1NT
GND
HDMI_SIDE
IC804
AT24C02BN-10SU-1.8
A0
1
$0.055
A1
2
A2
3
GND
4
D804
D825
VCC
8
WP
7
SCL
6
SDA
5
68K
R854
68K
R892
R855
OPT
R883
0
SBD
G
OPT
0
SBD
G
JP812
R881 22
R882 22
Q806
BSS83
Q805
BSS83
C809
0.1uF
+3.3V_Normal
R856
10K
C805
0.1uF
16V
GND
R893
10K
C810
0.1uF
16V
GND
GP2_Saturn7M
HDMI
Page 24
COMMON AREA
New Item Development
EARPHONE BLOCK
EXCEPT_CHINA_HOTEL_OPT
HP_LOUT
2:X19
HP_ROUT
2:X19
C1118
10uF
C1115
16V
1000pF
50V
OPT
EXCEPT_CHINA_HOTEL_OPT
C1119
10uF
16V
C1116
1000pF
50V
OPT
R1125
1K
R1128
1K
Q1101
MMBT3904-(F)
Q1102
MMBT3904-(F)
C
B
E
C
B
E
MMBT3904-(F)
B
MMBT3904-(F)
B
E
Q1104
C
HP_DET
E
Q1103
C
+3.3V_Normal
R1130
10K
R1155
1K
JK3301
KJA-PH-0-0177
5GND
4L
3DETECT
1R
SPK_R+_HOTEL
2:X19
SPK_R-_HOTEL
2:X19
C
Q1105
ISA1530AC1
E
B
R1129
3.3K
+3.5V_ST
C
E
B
Q1106
2SC3052
SIDE_HP_MUTE
PC AUDIO
JK1102
PEJ027-01
3
6A
7A
4
5
7B
6B
E_SPRING
T_TERMINAL1
B_TERMINAL1
R_SPRING
T_SPRING
B_TERMINAL2
T_TERMINAL2
D1101
AMOTECH
5.6V
OPT
D1102
AMOTECH
5.6V
OPT
C1107
100pF
50V
C1108
100pF
50V
R1102
470K
R1103
470K
R1107
15K
R1108
15K
R1110
10K
10K
R1112
0
R1111
R1113
0
PC_R_IN
PC_L_IN
2:S16
2:S16
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF_OUT
2:X18
OPT
4.7K
R1152
A
B
GND
IC1104
NL17SZ00DFT2G
OPT
1
2
3
D1116
5.6V
OPT
+5V_Normal
EDID_WP
RGB_DDC_SCL
RGB_DDC_SDA
+3.3V_Normal
R1146
10K
D1117
5.6V
R1147
1K
DSUB_DET
+3.3V_Normal
VCC
5
C1117
0.1uF
16V
OPT
R1126
Y
4
22
OPT
R1127
0
C1131
0.1uF
16V
VINPUT
C1121
100pF
50V
GND
Fiber Optic
1
VCC
2
JK1103
JST1223-001
3
4
FIX_POLE
RGB PC
DSUB_VSYNC
DSUB_HSYNC
DSUB_B+
DSUB_B-
DSUB_G+
DSUB_G-
DSUB_R+
DSUB_R-
R1133
75
0
R1135
75
0
R1137
75
0
C1122
68pF
50V
OPT
R1134
R1136
R1138
AT24C02BN-10SU-1.8
A0
1
A1
2
A2
3
GND
4
IC1105
C1123
OPT
C1124
OPT
C1125
OPT
R1148
0
OPT
OPT
OPT
D1115
ENKMC2838-T112
A1
C
A2
4.7K
R1150
0
C1128
18pF
50V
D1113
30V
R1140
4.7K
R1141
22
D1114
5.6V
OPT
R1142
10K
C1129
0.1uF
16V
R1143
22
R1139
VCC
8
WP
7
SCL
6
SDA
5
C1127
18pF
50V
C1126
D1109
68pF
30V
50V
OPT
D1110
30V
D1111
30V
D1112
30V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RED2GREEN3BLUE4GND_15DDC_GND
RED_GND7GREEN_GND8BLUE_GND9NC10SYNC_GND
GND_212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK
11
SPG09-DB-010
6
1
JK1104
GP2_Saturn7M
COMMON AREA
SHILED
16
Ver. 1.0
9
Page 25
RS232C
C1101 0.33uF
C1102
0.1uF
C1103
0.1uF
C1104
0.1uF
C1105
0.1uF
DOUT2
RIN2
C1+
C1-
C2+
C2-
V+
V-
IC1101
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
10
5
9
8
7
6
SPG09-DB-009
JK1101
4
3
2
1
S7_RXD1
NEC_RXD
S7_TXD1
NEC_TXD
R1123
100
R1124
100
OPT
R1122
0
JP1121
JP1122
IR_OUT
+3.5V_ST
D1107
CDS3C30GTH
30V
C1106
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
+3.5V_ST
4.7K
OPT
R1109
4.7K
OPT
R1114
D1108
CDS3C30GTH
30V
R1157 0
R1156
R1154
R1153
0
0
0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RS232C 9PIN
Ver. 1.0GP2_Saturn7M
10
Page 26
Wireless power
+24V
WIRELESS_PWR_EN
WIRELESS
0
S7_TXD
R2601
R2620
WIRELESS
0
WIRELESS_DL_RX
WIRELESS_TX
WIRELESS READY MODEL
R2618
IC2601
1
2
3
4
5
6
7
8
R2605
27K
B
WIRELESS
OPT
R2604
C2602
22K
2.2uF
S
G
Q2602
AO3407A
WIRELESS
C
Q2601
E
0
VDD
16
Y
15
X
14
X1
13
X0
12
A
11
B
10
C
9
R2606
D
C2603
0.01uF
+3.5V_ST
OPT
0
S7_TXD1
S7_RXD1
R2615
WIRELESS
R2619
0
50V
WIRELESS
R2607
0
1/4W
3216
+3.3V_Normal
0
S7_RXD
WIRELESS_DETECT
WIRELESS_SCL
WIRELESS_SDA
WIRELESS_RX
WIRELESS_TX
OPT
R2608
0
C2604
0.1uF
WIRELESS_DL_TX
WIRELESS_RX
+3.5V_ST
IR_PASS
OPT
OPT
OPT
C2601
0.1uF
50V
R2603
10K
WIRELESS
MC14053BDR2G
Y1
Y0
Z1
Z
Z0
INH
VEE
VSS
4.7K
47K
R2609
R2610
+3.3V_Normal
R2612
10K
R2617 1K
WIRELESS_SW_CTRL
JK2601
KJA-PH-3-0168
VCC[24V/20V/17V]_1
VCC[24V/20V/17V]_2
VCC[24V/20V/17V]_3
VCC[24V/20V/17V]_4
VCC[24V/20V/17V]_5
VCC[24V/20V/17V]_6
TP2601
TP2602
DETECT
INTERRUPT
GND_1
RESET
GND_2
I2C_SCL
I2C_SDA
GND_3
UART_RX
UART_TX
GND_4
GND_5
GND_6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
IR
18
19
20
21
SHIELD
RS232C & Wireless
WIRELESS_SW_CTRL
HIGH
LOW
SELECT PIN
X1/Y1/Z1
X0/Y0/Z0
From wireless_I2C to micom I2C
OPT
R2602
WIRELESS_PWR_EN
AMP_SDA
AMP_SCL
10K
B
OPT
E
C
Q2603
ISA1530AC1
D
Q2604
FDV301N
WIRELESS
STATUS
WIRELESS Dongle connect --> WIRELESS RS232
WIRELESS Dongle Dis_con --> S7 RS232
+3.3V_Normal
OPT
G
OPT
S
G
OPT
D
Q2605
FDV301N
R2611 0
R2613
WIRELESS
10K
R2614
WIRELESS_SDA
S
0
WIRELESS_SCL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Page 28
32_FHD
VGHVGL
R620-*1
22K
1%
TCON_32_FHD
R622-*1
11K
1%
TCON_32_FHD
R621-*1
220K
1%
TCON_32_FHD
R637-*1
51K
1%
TCON_32_FHD
R643-*1
270K
1%
TCON_32_FHD
37_FHD
VGHVGL
R620-*2
47K
1%
TCON_37_FHD
R622-*2
12K
1%
TCON_37_FHD
R621-*2
220K
1%
TCON_37_FHD
R637-*2
20K
1%
TCON_37_FHD
R643-*2
150K
1%
TCON_37_FHD
42_FHD_60_LAMP
VGHVGL
SHEET7
SHEET7
42_FHD
VGH
R620-*3
56K
1%
TCON_42_FHD
R622-*3
11K
1%
TCON_42_FHD
(Without 60Hz Lamp)
R621-*3
220K
1%
TCON_42_FHD
VGL
R637-*3
27K
1%
TCON_42_FHD
R643-*3
150K
1%
TCON_42_FHD
VDD
R635-*1
150K
1%
TCON_32_FHD
R636-*1
27K
1%
TCON_32_FHD
R640 OPEN
R641-*1
24K
1%
TCON_32_FHD
HVDD
R609-*1
510K
1%
TCON_32_FHD
R610-*1
150K
1%
TCON_32_FHD
R611-*1
200K
1%
TCON_32_FHD
VDD
R635-*2
910K
1%
TCON_37_FHD
R636-*2
56K
1%
TCON_37_FHD
R640-*2
470K
1%
TCON_37_FHD
R641-*2
56K
1%
TCON_37_FHD
HVDD
R609-*2
470K
1%
TCON_37_FHD
R610-*2
91K
1%
TCON_37_FHD
R611 OPEN
VCOM FEED BACKVCOM FEED BACKVCOM FEED BACK
R601-*1
1K
1%
TCON_32_FHD
R652-*1
1K
1%
TCON_32_FHD
R602-*1
1K
1%
TCON_32_FHD
47_FHD_60_LAMP
VGH
R620-*4
30K
1%
TCON_47_FHD_60_LAMP
R622-*4
11K
1%
TCON_47_FHD_60_LAMP
VDD
R635-*4
180K
1%
TCON_47_FHD_60_LAMP
R636-*4
68K
1%
TCON_47_FHD_60_LAMP
R621-*4
220K
1%
TCON_47_FHD_60_LAMP
R640 OPEN
R641-*4
20K
1%
TCON_47_FHD_60_LAMP
VGL
R637-*4
51K
1%
TCON_47_FHD_60_LAMP
R643-*4
270K
1%
TCON_47_FHD_60_LAMP
HVDD
R609-*4
510K
1%
TCON_47_FHD_60_LAMP
R610-*4
150K
1%
TCON_47_FHD_60_LAMP
R611-*4
220K
1%
TCON_47_FHD_60_LAMP
R601-*2
1K
1%
TCON_37_FHD
R652-*2
1.5K
5%
TCON_37_FHD
47_FHD
VGH
R620-*5
51K
1%
TCON_47_FHD
R622-*5
11K
1%
TCON_47_FHD
VDD
R635-*5
180K
1%
TCON_47_FHD
R636-*5
75K
1%
TCON_47_FHD
R602-*2
1K
1%
TCON_37_FHD
(Without 60Hz Lamp)
R621-*5
220K
1%
TCON_47_FHD
R640 OPEN
R641-*5
20K
1%
TCON_47_FHD
VGL
R637-*5
51K
1%
TCON_47_FHD
R643-*5
270K
1%
TCON_47_FHD
HVDD
R609-*5
510K
1%
TCON_47_FHD
R610-*5
150K
1%
TCON_47_FHD
R611-*5
220K
1%
TCON_47_FHD
VDD
SHEET7
VCOM FEED BACK
R601 OPEN
R652-*4
1K
1%
TCON_42_FHD_60_LAMP
55_FHD
VGH
R620-*6
510K
1%
TCON_55_FHD
R622-*6
27K
1%
TCON_55_FHD
R635-*6
150K
1%
TCON_55_FHD
R636-*6
75K
1%
TCON_55_FHD
R602-*4
1K
1%
TCON_42_FHD_60_LAMP
R621-*6
68K
1%
TCON_55_FHD
R640 OPEN
R641-*6
15K
1%
TCON_55_FHD
HVDD
SHEET7
VGL
R637-*6
27K
1%
TCON_55_FHD
R643-*6
150K
1%
TCON_55_FHD
HVDDVDD
R609-*6
180K
1%
TCON_55_FHD
R610-*6
68K
1%
TCON_55_FHD
R611-*6
56K
1%
TCON_55_FHD
VDD
R635-*3
150K
1%
TCON_42_FHD
R636-*3
75K
1%
TCON_42_FHD
R601 OPEN
R652-*3
1K
1%
TCON_42_FHD
R640 OPEN
R641-*3
15K
1%
TCON_42_FHD
R602-*3
1K
1%
TCON_42_FHD
HVDD
R609-*3
510K
1%
TCON_42_FHD
R610-*3
150K
1%
TCON_42_FHD
R611-*3
200K
1%
TCON_42_FHD
VCOM FEED BACK
SHEET7
VCOM FEED BACK
R601-*5
1K
1%
TCON_47_FHD
R652-*5
1K
1%
TCON_47_FHD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
DDR3(256MB)
Ver. 1.0
21
Page 30
/FLASH_WP
R1401
OPT
R1402
0
0
+3.3V_Normal
R1403
10K
C
Q1401
B
KRC103S
E
/SPI_CS
SPI_SDO
+3.3V_Normal
R1404
4.7K
S_FLASH
IC1401
MX25L8005M2I-15G
CS#
1
SO
2
WP#
3
GND
4
+3.3V_Normal
R1405
33
C1401
0.1uF
SPI_SCK
SPI_SDI
VCC
8
HOLD#
7
SCLK
6
SI
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
S-Flash(1MB)
Ver. 1.2
23
Page 31
LGIT CAN H/N TUNER for US&KOR&BRAZIL&TAIWAN&AUS
RF_S/W_CTL
1
BST_CTL
2
+B1[5V]
3
NC_1[RF_AGC]
4
NC_2
5
SCLT
6
SDAT
7
NC_3
8
SIF
9
NC_4
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
IF/AGC
16
DIF_1[N]
17
DIF_2[P]
18
19
SHIELD
TU5001-*1
TDTR-T035F
NTSC_2INPUT_H_LGIT
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
TU5001-*2
TDVJ-H031F
NTSC_1INPUT_V_LGIT
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
TU5001-*3
TDVJ-H001F
NTSC_1INPUT_H_LGIT
NTSC_1INPUT_H_SANYO
TU5001-*4
UDA45AL
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
DVB_1INPUT_H_LGIT
TU5001
TDTJ-S001D
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC[IF_TP]
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
R5002
0
RF_S/W_OPT
R5001
0
RF_AGC_OPT
R5003
0
+1.2V/+1.8V_TU
C5001
100pF
50V
C5002
0.1uF
16V
RF_S/W_OPT
+5V_TU
C5003
0.1uF
16V
OPTION : RF S/W
RF_SWITCH_CTL
Pull-up can’t be applied
because of MODEL_OPT_2
+3.3V_TU
C5006
C5007
100pF
0.1uF
50V
16V
R5009
100
NON_DEMOD_OPT
0
R5035
+3.3V_TU
R5011
100K
C5010
0.1uF
16V
NON_BR_TU_I2C
TUNER_RESET
NON_DEMOD_OPT
0
R5034
Q5001
ISA1530AC1
BOOSTER_OPT
C5011
0.01uF
25V
BOOSTER_OPT
C5012
18pF
50V
NON_BR_TU_I2C
+5V_TU
L5001
MLB-201209-0120P-N2
BOOSTER_OPT
R5014
0
BOOSTER_OPT
E
B
C
NON_BR_TU_I2C
NON_BR_TU_I2C
C5013
18pF
50V
IF_N_MSTAR
IF_P_MSTAR
R5017
2.2K
BOOSTER_OPT
NON_BR_TU_I2C
33
R5015
33
R5016
Q5002
2SC3052
BOOSTER_OPT
+3.3V_TU
R5018
1.2K
R5019
10K
BOOSTER_OPT
C
BOOSTER_OPT
B
E
NON_BR_TU_I2C
R5020
1.2K
R5006 100
DEMOD_OPT
R5007 100
DEMOD_OPT
OPTION : BOOSTER
R5021
10K
TU_SCL
TU_SDA
LNA2_CTL
The pull-up/down of LNA2_CTL
is depended on MODLE_OPT_1.
GPIO must be added for FE_BOOSTER_CTL
Option name:BR_TU_I2C
BRAZIL model use I2C Standard Mode
BR_TU_I2C
R5018-*1
3.3K
BR_TU_I2C
R5015-*1
100
1/16W
5%
BR_TU_I2C
C5012-*1
47pF
50V
C5016
0.1uF
16V
OPT
Close to the tuner
R5022
1K
BR_TU_I2C
R5020-*1
3.3K
BR_TU_I2C
R5016-*1
100
1/16W
5%
BR_TU_I2C
C5013-*1
47pF
50V
should be guarded by ground
IF_N_EXT
IF_P_EXT
IF_AGC
C5025
0.1uF 16V
R5024
C5026
0
0.1uF
16V
RF_AGC_OPT
RF_AGC_OPT
Q5003
2SC3052
C5027
10uF
10V
RF_AGC_OPT
C
B
E
R5025
4.7K
R5026
1K
OPT
TU_CVBS_BYPASS
R5027
1K
OPT
R5028
10K
RF_AGC_OPT
+5V_TU
R5029
470
B
+5V_TU
R5030
220
NON_TU_CVBS_BYPASS
R5039
0
B
OPTION : RF AGC
IF_AGC_SEL
R5032
E
C
E
Q5005
C
82
ISA1530AC1
Q5004
R5031
220
NON_TU_CVBS_BYPASS
ISA1530AC1
GPIO must be added.
TU_SIF
TU_CVBS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.3V_TU
C5031
0.1uF
16V
IC5001
AZ1117H-ADJTRE1(EH11A)
INPUT
3
2
OUTPUT
1
ADJ/GND
R5038
1.2K
R5036
10
+1.2V/+1.8V_TU
R5033
1
C5029
10uF
10V
C5028
0.1uF
16V
60mA
200mA
+5V_TU
C5018
22uF
16V
OPT
C5017
22uF
16V
OPT
C5019
22uF
16V
+3.3V_TU
C5020
22uF
16V
+5V_Normal
L5002
BLM18PG121SN1D
C5021
0.1uF
16V
+3.3V_Normal
L5003
BLM18PG121SN1D
C5022
0.1uF
16V
*Change History.
C5023
0.1uF
16V
C5024
0.1uF
16V
GP2_Saturn7M
ATSC_CAN TUNER
Ver 1.0 --> 1.1:Change of chip type, 091019, w.s.jeong
Ver 1.1 --> 1.2:Change of chip type, Add of Tuner P/N for NTSC_1INPUT
1.De-reting
1) R5029,R5030,R5031 : 1005 Type ==> 1608 Type(w.s.Jeong_1019)
2) R5030,R5031 : 200/1608 Type ==> 220/2012 Type(w.s.Jeong_1116)
2.ADD of TUNER P/N (w.s.Jeong_1116)
CONTROL_ATTEN
This was being applied to the only china demod,
so this has to be deleted in both main and ISDB sheet.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
AUDIO[NTP]
Ver. 1.1
38
Page 34
NOT USING B/T
BT_ON/OFF
BT_DM
BT_DP
BT_LOUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7MVer. 1.0
PCMCI
46
Page 36
NON ETHERNET
TP2101
TP2102
TP2103
TP2104
TP2105
TP2106
TP2107
TP2108
TP2109
TP2110
TP2111
EPHY_RXD0
EPHY_RXD1
EPHY_TXD1
EPHY_TXD0
EPHY_REFCLK
EPHY_CRS_DV
EPHY_MDIO
ET_RXER
/RST_PHY
EPHY_MDC
EPHY_EN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NON ETHERNET
Ver. 1.0GP2_Saturn7M
48
Page 37
NON Motion Remocon Region
TP2501
TP2502
TP2503
TP2504
M_REMOTE_RX
M_REMOTE_TX
RF_RESET
RF_ENABLE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
NON M REMOCON
Ver. 1.0
50
Page 38
NON CHINA HOTEL
AMP_MUTE_HOTEL
SPK_R+_HOTEL
SPK_R-_HOTEL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
NON CHINA HOTEL
Ver. 1.0
52
Page 39
SIDEAV_DET
SIDEAV_CVBS_IN
SIDEAV_L_IN
SIDEAV_R_IN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
NON SIDE AV
Ver. 1.0
53
Page 40
/PIF_SPI_CS
R6001 0
CHB_CVBS_IN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
NON CHB
Ver. 1.0
68
Page 41
D9800
5.6V
+3.3V_Normal
R9802
10K
C9800
100pF
50V
SIGN4272
OPT
R9803
1K
AV_CVBS_DET
D9806
5.6V
D9807
5.6V
R9810
470K
R9813
470K
R9815
SIGN4271
10K
C9805
1000pF
50V
C9806
1000pF
50V
R9816
10K
R9820
12K
R9821
12K
AV_R_IN
AV_L_IN
JK9800
PPJ238-01
[RD1]E-LUG
6C
[RD1]O-SPRING
5C
[RD1]CONTACT
4C
[WH1]O-SPRING
5B
[YL1]CONTACT
4A
[YL1]O-SPRING
5A
[YL1]E-LUG
6A
[RD2]E-LUG
6H
[RD2]O-SPRING_2
5H
[RD2]CONTACT
4H
[WH2]O-SPRING
5G
[RD2]O-SPRING_1
5F
[RD2]E-LUG-S
7F
[BL2]O-SPRING
5E
[BL2]E-LUG-S
7E
[GN2]CONTACT
4D
[GN2]O-SPRING
5D
R9800
10K
+3.3V_Normal
R9801
1K
D9801
5.6V
COMP2_DET
D9805
5.6V
D9803
30V
D9804
30V
D9809
30V
D9808
5.6V
R9806
0
R9805
0
R9812
75
R9811
470K
R9807
75
R9809
75
R9814
470K
SIGN4269
C9804
1000pF
50V
C9802
10pF
50V
C9803
10pF
50V
OPT
C9807
10pF
50V
SIGN4270
C9808
1000pF
50V
OPT
OPT
R9817
10K
R9818
10K
R9819
12K
R9822
12K
AV_CVBS_IN
COMP2_R_IN
COMP2_L_IN
COMP2_Pr+
COMP2_Pr-
COMP2_Pb+
COMP2_Pb-
[GN2]E-LUG
6D
SMALL_US_KR_EM_JACK PACK_HONGSU_090818
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D9802
30V
R9804
0
R9808
SCART OPTION BLOCK
SC1_CVBS_IN
TP9801
TP9802
TP9803
TP9804
TP9805
TP9806
TP9807
TP9808
TP9809
75
SC1_FB
SC1_ID
SC_RE1
SC_RE2
SCART1_MUTE
SC1_SOG_IN
SCART1_Lout
SCART1_Rout
DTV/MNT_VOUT
OPT
C9801
10pF
50V
COMP2_Y+
COMP2_Y-
Component2 OPTION BLOCK
TP9810
TP9811
TP9812
TP9813
TP9814
TP9815
TP9816
TP9817
TP9818
GP2_Saturn7MVer. 1.0
US_REAR_COMP_AV_SMALL
SC1_R+/COMP1_Pr+
SC1_R-/COMP1_Pr-
SC1_G+/COMP1_Y+
SC1_G-/COMP1_Y-
SC1_B+/COMP1_Pb+
SC1_B-/COMP1_Pb-
SC1/COMP1_L_IN
SC1/COMP1_R_IN
SC1/COMP1_DET
98
Page 42
SIDE_GENDER_3 SIL
(LA/TA/MA/SA)
SIDE CVBS PHONE JACK
(New Item Development)
JK9901
KJA-PH-1-0177
SIDE_CVBS
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
SIDE_CVBS
ADUC30S03010L_AMODIODE
SIDE_CVBS
ADMC5M03200L_AMODIODE
SIDE_CVBS
ADMC5M03200L_AMODIODE
SIDE_CVBS
ADMC5M03200L_AMODIODE
D9901
30V
D9902
5.6V
D9903
5.6V
D9904
5.6V
SIDE_CVBS
R9907
75
SIDE_CVBS
SIDE_CVBS
SIDE_CVBS
R9906
470K
R9905
470K
C9901
100pF
BLM18PG121SN1D
BLM18PG121SN1D
SIDE_CVBS
L9903
BLM18PG121SN1D
+3.3V_Normal
SIDE_CVBS
10K
R9911
SIDE_CVBS
L9902
SIDE_CVBS
L9901
SIDE_CVBS
C9906
100pF
50V
SIDE_CVBS
C9905
100pF
50V
SIDE_CVBS
R9915
1K
SIDE_CVBS
R99 14
10K
SIDE_CVBS
R99 13
10K
C9907
100pF
OPT
SIDE_CVBS
R9917
12K
SIDE_CVBS
R9916
12K
SIDEAV_CVBS_IN
SIDEAV_DET
SIDEAV_L_IN
SIDEAV_R_IN
SIDE COMPONENT PHONE JACK
(New Item Developmen)
JK9902
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
SIDE_COMP
+3.3V_Normal
D9907
30V
SIDE_COMP
D9905
30V
SIDE_COMP
D9906
30V
SIDE_COMP
R9903
R9902
R9901
R9904
10K
SIDE_COMP
D9908
5.6V
SIDE_COMP
0
SIDE_COMP
0
SIDE_COMP
0
SIDE_COMP
SIDE_COMP
SIDE_COMP
SIDE_COMP
SIDE_COMP
R9910
75
75
R99 09
75
R99 08
R9912
1K
OPT
C9904
10pF
50V
10pF
C9903
OPT
10pF
C9902
OPT
SC1/COMP1_DET
SC1_G-/COMP1_Y-
SC1_G+/COMP1_Y+
50V
50V
SC1_B-/COMP1_Pb-
SC1_B+/COMP1_Pb+
SC1_R-/COMP1_Pr-
SC1_R+/COMP1_Pr+
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
SIDE_GENDER (3 SIL)
LA/TA/MA/SA
Ver. 1.1
101
Page 43
IR & EYE & KEY & LED (LA01D N.AMERICA)
+3.5V_ST
R2405
R2404
10K
10K
1%
IR
COMMERCIAL
IR_OUT
Commercial
R2428
R2403
22
Commercial_EU
22
R2406
Commercial_EU
Q2401
2SC3052
Commercial_US
R2425
Q2406
2SC3052
+3.5V_ST
47K
R2422
0
+3.5V_ST
47K
C
B
E
R2427
0
OPT
R2407
C
10K
B
E
Commercial_EU
R2430
10K
R2408
Commercial
Q2402
2SC3052
Commercial
R2429
Q2405
2SC3052
+3.5V_ST
47K
+3.5V_ST
47K
C
B
E
C
B
E
R2409
47K
Commercial
R2431
47K
KEY1
KEY2
R2426
3.3K
+3.5V_ST
OPT
1%
R2401
100
R2402
100
L2401
BLM18PG121SN1D
L2402
BLM18PG121SN1D
+3.5V_ST
C2401
0.1uF
BLM18PG121SN1D
LED_R/BUZZ
L2403
C2402
0.1uF
C2403
0.1uF
EYEQ/TOUCH_KEY
R2411
50V
R2434
4.7K
LE7300
C
LE7300
E
100
EYEQ/TOUCH_KEY
100
R2412
R2413 1.5K
NON_LE7300
L2405
BLM18PG121SN1D
LE7300
R2410
100
C2407
100pF
50V
Q2400
2SC3052
C2408
1000pF
50V
OPT
C2409
1000pF
50V
OPT
D2405
5.6B
R2414
0
5.6B
D2403
5.6B
D2404
OPT
R2416
10K
C2410
0.1uF
16V
OPT
NON_LE7300
LE7300
3.5V_ST
5V_Normal
3.3_NORMAL
ST_LED
KEY1
KEY2
LED_B
LER_R
SCL
SDA
GND
GND
IR
GND
P2401
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
.
NEC_EEPROM_SCL
LED_B/LG_LOGO
L2404
BLM18PG121SN1D
C2405
0.1uF
16V
R2433
1.5K
NON_LE7300
R2432
4.7K
LE7300
NEC_EEPROM_SDA
+3.5V_ST
C2406
1000pF
+3.5V_ST
B
D2402
5.6V
AMOTECH
D2401
5.6V
AMOTECH
C2404
1000pF
50V
16V
+3.3V_Normal
+3.5V_ST
R2423
10K
OPT
R2424
120K
OPT
WIRELESS
IR_PASS
IF AGC
DEMOD
DEMOD_RESET
DEMOD_SCL
DEMOD_SDA
IF_P_EXT
IF_N_EXT
R2417
WIRELESS
Locate the Zener Diode to wafer closly
+3.5V_ST
R2420
47K
WIRELESS
22
R2418
C
Q2404
B
R2415
0
2SC3052
WIRELESS
WIRELESS
E
+3.5V_ST
R2419
47K
WIRELESS
10K
Q2403
2SC3052
WIRELESS
IF_AGC_MAINIF_AGC
R2421
47K
C
B
WIRELESS
E
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LA01D SUB INTERFACE
IR & KEY & LED102
09/12/18
Page 44
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