LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω
Page 4
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Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
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Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
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Only for training and service purposes
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to LCD TV used LT01D chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature : 25 ºC ± 5 ºC
(77
± 9 ºF), CST : 40 ± 5 ºC
2) Relative Humidity : 65 ± 10 %
3) Power Voltage : Standard input voltage (100-240V~60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE / ICE specification
EMI: CE / ICE
4. Electrical Spec.
No.Item SpecificationRemark
1Display Screen Device 32 inch wide color display module
2Aspect Ratio16:9
3LCD Module 32” TFT WUXGA EDGE LED
4Storage Environment Temp. : -20 ~ 60 deg
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 9 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV with
LT01D chassis.
2. Designation
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25±5ºC
Relative humidity : 65±10%
Input voltage : 220V, 60Hz
6) Adjustment equipments: Color Analyzer (CA-210 or CA-
7) Push The “IN STOP KEY” - For memory initialization.
3. Main PCB check process
* APC - After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message.
If “Error” is displayed, Check connection between
computer, jig, and set..
(3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”.
(4) Click “Connect” tab. If “Can’t” is displayed, check
connection between computer, jig, and set.
(5) Click “Auto” tab and set as below
(6) Click “Run”.
(7) After downloading, check “OK” message.
filexxx.bin
(7)
(5)
(8) ……….OK
(6)
(1) (3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
(4)
filexxx.bin
Case1 : Software version up
1. After downloading S/W by USB, TV set will reboot
automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “I n-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at first.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
Page 10
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Only for training and service purposes
- 10 -
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn’t work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool
option. (refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In this case, you have to
channel recover. If all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
1. Push "IN-START" key in service remote controller.
2. Select "Tool Option 1" and Push “OK” button.
3. Punch in the number. (Each model has their number.)
4. Completed selecting Tool option.
3.1. ADC Process
(1) ADC
• Enter Service Mode by pushing “ ADJ” key
• Enter Internal ADC mode by pushing “G” key at “6. ADC
Calibration”
*
Caution: Using ‘power on’ button of the Adj. R/C, power on TV.
* ADC Calibration Protocol (RS232)
- Adjust Sequence
• aa 00 00[Enter Adjust Mode]
• xb 00 40[Component1 Input (480i)]
• ad 00 10[Adjust 480i Comp1]
• xb 00 60 [RGB Input (1024x768)]
• ad 00 10[Adjust 1024x768 RGB]
• aa 00 90[End Adjust Mode]
* Required equipment : Adjustment R/C
3.2. Function Check
(1) Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (CVBS)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In
* Display and sound check is executed by remote control.
Do not remove the memory card from the pc
Do not plug off!
No.ItemCMD1 CMD2 Data0
1 Enter Adjust Mode A A 00
2 ADC AdjustA D 00
Page 11
- 11 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. Total Assembly line process
4.1. Adjustment Preparation
· W/B Equipment condition
CA210 : CH 9, Test signal : Inner pattern (85IRE)
· Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
· In casw of Edge LED module, the color coordinates is
changing by aing, so you have to use the below table.
4.1.1. Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER ON -> Enter
the mode of White-Balance, the pattern will come out
4.1.2. Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10ux).
2) Adhere closely the Color Analyzer (CA210) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 15minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
4.1.3. Auto adjustment Map (RS-232C)
**Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range of
Module)
4.2. Manual W/B process using adj. R/C
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “G”
* After done all adjustments, Press “In-start” button and compare
Tool option and Area option
value with its BOM, if it is correctly same then unplug the AC
cable.
If it is not same, then correct it same with BOM and unplug AC
cable.
For correct it to the model’s module from factory JIG model.
* Push The “IN STOP KEY” after completing the function
inspection.
Cool 13,000k ºKX=0.269(±0.002)All
Y=0.273(±0.002)<Test Signal>
Medium 9,300kºKX=0.285(±0.002)Inner pattern
Y=0.293(±0.002)(216gray,85IRE)
Warm6,500kºKX=0.313(±0.002)
Y=0.329(±0.002)
Cool 9,300k ºKX=0.285(±0.002)Only 22LD350
Y=0.293(±0.002)<Test Signal>
Medium 8,000kºKX=0.295(±0.002)Inner pattern
Y=0.305(±0.002)(216gray,85IRE)
Warm6,500kºKX=0.313(±0.002)
Y=0.329(±0.002)
Full White Pattern
COLOR
ANALYZER
TYPE: CA-210
RS-232C Communication
CA-210
RS-232C COMMAND MINCENTERMAX
[CMD ID DATA](DEFAULT)
CoolMidWarmCoolMid Warm
R Gainjg Ja jd 00172 192 192255
G Gain jh Jbje 00172 192 192255
B Gain ji Jc jf00192 192 172 255
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.3. DDC EDID Write (RGB 128Byte )
· Connect D-sub Signal Cable to D-Sub Jack.
· Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
· Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4.4 DDC EDID Write (HDMI 256Byte)
· Connect HDMI Signal Cable to HDMI Jack.
· Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
· Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4.5 EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
- Auto Download
- Manual Download
* Caution
1) Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
2) Nerver connect HDMI & D-sub Cable at the same time.
3) Use the proper cables below for EDID Writing.
4) Download HDMI1, HDMI2 separately because each data is
different.
EZ ADJUT
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Country Group
5. ADC Calibration
6. White Balance
7. Test Pattern
8. EDID D/L
9. Sub B/C
EDID D/L
HDMI1
HDMI2
HDMI3
RGB
NG
NG
NG
NG
Reset
Start
EDID D/L
HDMI1
HDMI2
HDMI3
RGB
OK
OK
OK
OK
Reset
Start
D-sub to D-sub
DVI-D to HDMI or HDMI to HDMI
For HDMI EDIDFor Analog EDID
Item
Manufacturer ID
Version
Revision
Condition
GSM
Digital : 1
Digital : 3
Data(Hex)
1E6D
01
03
Page 13
- 13 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
(1) FHD RGB EDID Data (CS : 1D)
(2) FHD HDMI EDID Data (CS : D739)
(3) FHD HDM2 EDID Data (CS : D739)
(4) HD RGB EDID Data (CS : 93)
(5) HD HDMI1 EDID Data (CS : 7AD5)
(6) HD HDMI2 EDID Data (CS : 7AD5)
(7) HD HDMI3 EDID Data (CS : 7AB5)
(8) ASCII Code
Page 14
- 14 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.6. V-COM Adjust(Only LGD(M+S) Module)
- Why need Vcom adjustment?
A The Vcom (Common Voltage) is a Reference Voltage of
Liquid Crystal Driving.
-> Liquid Crystal need for Polarity Change with every frame.
- Adjust sequence
· Press the PIP key of th ADJ remote control.(This PIP key is
hot key to enter the VCOM adjusting mode)
(Or After enter Service Mode by pushing “ADJ” key, then
Enter V-Com Adjust mode by pushing “
G” key at “10. V-
Com”
· As pushing the right or the left key on the remote control,
and find the V-COM value which is no or minimized the
Flicker. (If there is no flicker at default value, Press the exit
key and finish the VCOM adjustment.)
· Push the “OK” key to store value. Then the message
“Saving OK” is pop.
· Press the exit key to finish VCOM adjustment.
(Visual Adjust and control the Voltage level)
· V-COM default value is different from module.
1) 32LD450 : 417
2) 37LD450 : 432
3) 42LD450 : 433
4.7. Outgoing condition Configuration
- When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then Automatically turn off.
(Must not AC power OFF during blinking)
4.8. Internal pressure
Confirm whether is normal or not when between power
board’s ac block and GND is impacted on 1.5 kV(dc) or 2.2
kV(dc) for one second.
Row Li ne
Column Line
CLC
CST
Panel
S
Y
S
T
E
M
Gat e Driv e IC
Source D r ive I C
Circuit Block
Tim i ng
Cont r o lle r
Pow er
Blo ck
V
COM
Gamma
Ref erence V oltage
Gamm a Reference
Volta ge
Data (R,G ,B) & C ont rol s ignal
Control si gnal
Data (R,G,B ) &
Control si gnal
In terf ace
TFT
Pow er I n put
Power Input
Da ta I n put
Da ta I n put
V
COM
Liquid
Crystal
V
COM
Page 15
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Only for training and service purposes
- 15 -
300
400
301
501501
560
302
500
310
510
120
A2
LV1
A21
A10
A5
A9
810
800
200
530
540
521
820
880
710
LV2
900
910
920
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Page 16
/PF_WP
NC_1
1
NC_2
2
NC_3
3
NC_4
4
NC_5
5
NC_6
6
R/B
7
RE
8
CE
9
NC_7
10
NC_8
11
VCC_1
12
VSS_1
13
NC_9
14
NC_10
15
CLE
16
ALE
17
WE
18
WP
19
NC_11
20
NC_12
21
NC_13
22
NC_14
23
NC_15
24
S7M_NON_DIVX & MS10
IC101-*2
LGE107 (S7M Non Divx/RM)
AE1
FRC_DDR3_A0/DDR2_NC
AF16
FRC_DDR3_A1/DDR2_A6
AF1
FRC_DDR3_A2/DDR2_A7
AE3
FRC_DDR3_A3/DDR2_A1
AD14
FRC_DDR3_A4/DDR2_CASZ
AD3
FRC_DDR3_A5/DDR2_A10
AF15
FRC_DDR3_A6/DDR2_A0
AF2
FRC_DDR3_A7/DDR2_A5
AE15
FRC_DDR3_A8/DDR2_A2
AD2
FRC_DDR3_A9/DDR2_A9
AD16
FRC_DDR3_A10/DDR2_A11
AD15
FRC_DDR3_A11/DDR2_A4
AE16
FRC_DDR3_A12/DDR2_A8
AF3
FRC_DDR3_BA0/DDR2_BA2
AF14
FRC_DDR3_BA1/DDR2_ODT
AD1
FRC_DDR3_BA2/DDR2_A12
AD13
FRC_DDR3_MCLK/DDR2_MCLK
AE14
FRC_DDR3_CKE/DDR2_RASZ
AE13
FRC_DDR3_MCLKZ/DDR2_MCLKZ
AE4
FRC_DDR3_ODT/DDR2_BA1
AD5
FRC_DDR3_RASZ/DDR2_WEZ
AF4
FRC_DDR3_CASZ/DDR2_CKE
AD4
FRC_DDR3_WEZ/DDR2_BA0
AE2
FRC_DDR3_RESETB/DDR2_A3
AF8
FRC_DDR3_DQSL/DDR2_DQS0
AD9
FRC_DDR3_DQSLB/DDR2_DQSB0
AE9
FRC_DDR3_DQSU/DDR2_DQS1
AF9
FRC_DDR3_DQSUB/DDR2_DQSB1
AE11
FRC_DDR3_DML/DDR2_DQ7
AF6
FRC_DDR3_DMU/DDR2_DQ11
AE6
FRC_DDR3_DQL0/DDR2_DQ6
AF11
FRC_DDR3_DQL1/DDR2_DQ0
AD6
FRC_DDR3_DQL2/DDR2_DQ1
AD12
FRC_DDR3_DQL3/DDR2_DQ2
AE5
FRC_DDR3_DQL4/DDR2_DQ4
AF12
FRC_DDR3_DQL5/DDR2_NC
AF5
FRC_DDR3_DQL6/DDR2_DQ3
AE12
FRC_DDR3_DQL7/DDR2_DQ5
AE10
FRC_DDR3_DQU0/DDR2_DQ8
AF7
FRC_DDR3_DQU1/DDR2_DQ14
AD11
FRC_DDR3_DQU2/DDR2_DQ13
AD7
FRC_DDR3_DQU3/DDR2_DQ12
AD10
FRC_DDR3_DQU4/DDR2_DQ15
AE7
FRC_DDR3_DQU5/DDR2_DQ9
AF10
FRC_DDR3_DQU6/DDR2_DQ10
AD8
FRC_DDR3_DQU7/DDR2_DQM1
AE8
FRC_DDR3_NC/DDR2_DQM0
Y11
FRC_REXT
Y19
FRC_TESTPIN
NAND FLASH MEMORY
/PF_CE0
H : Serial Flash
L : NAND Flash
/PF_CE1
H : 16 bit
L : 8 bit
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LOW
NO FRC
50/60Hz LVDS
LVDS
DDR_256MB
HD
W2
VIFP
W1
VIFM
V2
IP
V1
IM
Y2
Y1
U3
QP
V3
QM
Y5
Y4
U1
U2
R3
T3
T2
T1
G14
G13
B7
A7
AF17
AE17
F14
F13
F15
D20
E20
D19
F18
E18
D18
E19
N1
P3
P1
P2
P4
P5
R6
T6
U5
V5
U6
V6
U4
W3
W4
V4
Y3
W5
R4
T5
R5
T4
P7
VRM
R7
VAG
P6
VRP
R1
R2
E21
E22
D21
F21
E23
D22
F22
D23
F23
F8
G8
K8
A4
Y17
NO_FRC : LOW LOW
U3_INTERNAL : HIGH LOW
U3_EXTERNAL : HIGH HIGH
PWIZ TCON with LG FRC : HIGH HIGH
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
DDR3(FRC)
Ver. 1.4
3
Page 19
FROM LIPS & POWER B/D
+3.5V_ST
RT1P141C-T112
Q402
R406
RL_ON
C401
100uF
16V
+12V/+15V
C402
100uF
16V
+3.5V_ST
R401
10K
B
MLB-201209-0120P-N2
C406
0.1uF
16V
L402
MLB-201209-0120P-N2
C404
0.1uF
16V
C
E
Q401
2SC3052
L404
C407
0.1uF
16V
4.7K
C408
0.1uF
16V
<MODULE PIN MAP>
LGD(PSU)
PIN No
or LIPS
16
GND
INV_ON
18
VBR-A
20
22
PWM_DIM
Err_out
24
GND
23
<LED MODULE PIN MAP -> latest update 20100618>
PIN No
LGD LPB/
OS LPB
16
INV_ON
18
20
22
PWM_DIM
err_out
24
--> NC
23
CMO10"Lamp
(PSU)
GND
A-DIM
NC
PWM_DIM
INV_ON
GND
32LE5300-TA
CMO10"LED
(PSU)
NCNC
NC
INV_ON
err_out
NC
--> NC
NC
PWM_DIM
NC
NC
LGD edge led error-out use or not? checking is necessary...
+12V/+15V
L401
C405
10uF
25V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MODEL OPTION
PIN NO.11HIGH
MODEL_OPT_0
LOWLOWLOW
HIGHHIGH
HIGH
HIGH
B/L_LED
8
PWM_BUZZ/IIC_LED
30
TOUCH_KEYTACT_KEY
31GPIO_LED
MODEL_OPT_1
LOW
HIGH
HIGH
HIGH
HIGH
MODEL_OPT_2
HIGH
LOWLOW
LOW
LOWPIN NAME
B/L_LAMP
PWM_LED
NON_GPIO_LED
MODEL_OPT_3
LOW
LOW
LOW
LOW
LOW
HIGH
LD350/450/550
19/22/26LE3300(5500)
32/37/42/47/55LE5300(10)
LD420
LE7300
TBD
P17/TI50/TO50
P31/INTP2/OCD1A
M_REMOTE
NON_M_REMOTE
R10 62 2 2
R10 61 2 2
RF_ENABLE
P16/TOH1/INTP5
22
R10 69
OCD1A
POWER_DET
LED_B/LG_LOGO
IR
22
R10 68
LED_R/BUZZ
NEC_ISP_Rx
P11/SL10/RXD0
P10/SCK10/TXD0
22
22
R10 41
R10 37
22
R10 36
NEC_RXD
NEC_ISP_Tx
NEC_TXD
POWER_ON/OFF2_2
R1044 10K
R1045 10K
R1083 10K
OPT
OPT
+3.5V_ST
OPT
C1009 1uF
GP2_Saturn7M
MICOM
Ver. 1.4
5
Page 21
CONTROL
IR & LED
+3.5V_ST
EYEQ/TOUCH_KEY
R2411
LED_R/BUZZ
50V
100
EYEQ/TOUCH_KEY
100
R2412
R2413 1.5K
R2410
100
C2407
100pF
50V
C2408
1000pF
50V
OPT
C2409
1000pF
50V
OPT
C2410
0.1uF
D2405
5.6B
R2414
1.5K
P2401
5.6B
D2403
5.6B
D2404
JP2407
JP2408
OPT
16V
JP2411
OPT
R2416
10K
12507WR-12L
1
2
3
4
5
6
7
JP2409
JP2410
8
9
10
11
12
13
LED_B/LG_LOGO
L2404
BLM18PG121SN1D
C2405
0.1uF
16V
NEC_EEPROM_SCL
NEC_EEPROM_SDA
C2406
1000pF
R2405
R2404
10K
10K
1%
1%
R2401
100
KEY1
R2402
100
KEY2
+3.5V_ST
R2425
Q2406
2SC3052
47K
R2430
C
B
E
R2427
0
OPT
R2428
IR
22
+3.5V_ST
R2431
47K
R2426
3.3K
+3.5V_ST
OPT
COMMERCIAL
IR_OUT
Commercial
R2403
22
Commercial_EU
Commercial_EU
Q2401
2SC3052
R2429
47K
10K
C
B
Q2405
E
2SC3052
BLM18PG121SN1D
BLM18PG121SN1D
+3.5V_ST
R2406
47K
C
B
E
Commercial_EU
R2422
0
Commercial_US
L2401
L2402
+3.5V_ST
R2407
10K
C2401
0.1uF
R2408
Commercial
Q2402
2SC3052
Commercial
C2402
0.1uF
L2403
BLM18PG121SN1D
C2403
0.1uF
+3.5V_ST
47K
C
B
Commercial
E
16V
R2409
47K
D2401
5.6V
AMOTECH
D2402
AMOTECH
C2404
1000pF
50V
+3.3V_Normal
5.6V
Zener Diode is
WIRELESS
IR_PASS
R2417
WIRELESS
+3.5V_ST
R2420
47K
WIRELESS
22
R2418
C
Q2404
B
2SC3052
WIRELESS
WIRELESS
E
+3.5V_ST
R2419
47K
WIRELESS
10K
Q2403
2SC3052
WIRELESS
R2421
47K
C
B
WIRELESS
E
close to wafer
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
T-CON
Ver. 2.1
7
Page 23
HDMI_1
$0.253
HDMI_1
EAG59023302
HDMI_2
SHIELD
20
$0.253
HDMI_2
EAG59023302
JK801
SHIELD
20
JK802
19
18
17
16
15
14
13
12
11
10
HDMI EEPROM
5V_HDMI_1
R874
10K
R884
4.7K
5V_HDMI_2
10K
R873
R885
4.7K
5V_HDMI_3
R872
R886
4.7K
5V_HDMI_4
R871
R887
4.7K
A2
R888
4.7K
A2
10K
10K
+5V_Normal
C
+5V_Normal
C
R889
4.7K
+5V_Normal
A2
R890
4.7K
+5V_Normal
A2
R891
4.7K
A1
ENKMC2838-T112
D821
A1
ENKMC2838-T112
D822
A1
ENKMC2838-T112
D823
C
A1
ENKMC2838-T112
D824
C
EDID_WP
DDC_SCL_1
DDC_SDA_1
EDID_WP
DDC_SCL_2
DDC_SDA_2
EDID_WP
DDC_SCL_3
DDC_SDA_3
EDID_WP
DDC_SCL_4
DDC_SDA_4
5V_HDMI_1
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
5V_HDMI_2
CK+
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
R896
1K
R804
1.8K
R895
1K
R803
1.8K
D802
D801
5V_DET_HDMI_1
3.3K
R802
5V_DET_HDMI_2
R801
3.3K
C802
0.1uF
16V
C801
0.1uF
16V
JP803
JP804
JP802
JP801
R825
R826
R824
R847
R846
R845
R844
R843
R842
R850
R848
R805 22
R806
R815 100
R831
R834
R822
R832
R827
R829
R823
R833
HDMI_3
C
Q802
2SC3052
22
22
100
0
0
0
0
0
0
0
0
R830
B
10K
E
HPD1
DDC_SDA_1
DDC_SCL_1
HDMI_CEC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
$0.253
HDMI_3
5V_HDMI_3
SHIELD
20
19
18
17
16
15
14
13
12
11
10
EAG59023302
9
8
7
6
5
4
3
2
1
JK804
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R894
1K
R838
1.8K
D812
5V_DET_HDMI_3
3.3K
R836
C804
0.1uF
16V
JP807
JP808
R859
R851
R860
R852
R816
R821
R814
R819
R818
R820
R812
C
Q804
2SC3052
22
22
100
0
0
0
0
0
0
0
0
R864
B
10K
E
HPD3
DDC_SDA_3
DDC_SCL_3
HDMI_CEC
CK-_HDMI3
CK+_HDMI3
D0-_HDMI3
D0+_HDMI3
D1-_HDMI3
D1+_HDMI3
D2-_HDMI3
D2+_HDMI3
HDMI_1
IC801
AT24C02BN-10SU-1.8
A0
1
$0.055
A1
2
A2
3
GND
4
HDMI_2
AT24C02BN-10SU-1.8
A0
1
$0.055
A1
2
A2
3
GND
4
IC802
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
JP809
R876 22
R875 22
JP810
R878 22
R877 22
C806
0.1uF
C807
0.1uF
SIDE_HDMI
5V_HDMI_4
C
R828
Q801
2SC3052
22
0
0
0
0
0
0
0
0
10K
B
E
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
JACK_GND
20
$0.253
EAG42463001
HDMI_SIDE
JK803
R897
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
1K
R837
1.8K
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
D811
5V_DET_HDMI_4
R835
3.3K
JP806
C803
0.1uF
16V
JP805
R839 22
R840
R841
R810
R807
R817
R809
R813
R811
R849
R808
HDMI_3
C
Q803
2SC3052
22
100
0
0
0
0
0
0
0
0
R862
B
10K
E
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
IC803
AT24C02BN-10SU-1.8
A0
1
$0.055
A1
2
A2
3
GND
4
HDMI_SIDE
IC804
AT24C02BN-10SU-1.8
A0
1
$0.055
A1
2
A2
3
GND
4
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
JP811
R879 22
R880 22
JP812
R881 22
R882 22
C808
0.1uF
C809
0.1uF
HDMI_1_withFringe
JK802-*1
YKF45-7054V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
SHIELD
DATA2+
DATA2_SHIELD
DATA2-
DATA1+
DATA1_SHIELD
DATA1-
DATA0+
DATA0_SHIELD
DATA0-
CLK+
CLK_SHIELD
CLK-
CEC
NC
SCL
SDA
DDC/CEC_GND
+5V_POWER
HPD
HDMI_2_withFringe
JK801-*1
YKF45-7054V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
SHIELD
DATA2+
DATA2_SHIELD
DATA2-
DATA1+
DATA1_SHIELD
DATA1-
DATA0+
DATA0_SHIELD
DATA0-
CLK+
CLK_SHIELD
CLK-
CEC
NC
SCL
SDA
DDC/CEC_GND
+5V_POWER
HPD
HDMI_3_withFringe
JK804-*1
YKF45-7054V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
SHIELD
DATA2+
DATA2_SHIELD
DATA2-
DATA1+
DATA1_SHIELD
DATA1-
DATA0+
DATA0_SHIELD
DATA0-
CLK+
CLK_SHIELD
CLK-
CEC
NC
SCL
SDA
DDC/CEC_GND
+5V_POWER
HPD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
For CEC
HDMI_CEC
D804
OPT
D803
AVRL161A1R1NT
GND
D825
OPT
D826
AVRL161A1R1NT
GND
GP2_Saturn7M
HDMI
68K
R854
R855
68K
R892
OPT
0
R883
SBD
G
0
OPT
SBD
G
Q806
BSS83
BSS83
Q805
+3.3V_Normal
R856
10K
C805
0.1uF
16V
GND
R893
10K
C810
0.1uF
16V
GND
+3.5V_ST
R857
68K
OPT
R858
CEC_ON/OFF
R853
68K
Ver. 1.2
8
0
CEC_REMOTE_S7
CEC_REMOTE_NEC
Page 24
COMMON AREA
New Item Development
EARPHONE BLOCK
HP_LOUT
2:X19
HP_ROUT
2:X19
EXCEPT_CHINA_HOTEL_OPT
C1118
10uF
C1115
16V
1000pF
50V
OPT
EXCEPT_CHINA_HOTEL_OPT
C1119
10uF
16V
C1116
1000pF
50V
OPT
R1125
1K
R1128
1K
Q1101
MMBT3904-(F)
Q1102
MMBT3904-(F)
C
B
E
C
B
E
MMBT3904-(F)
B
MMBT3904-(F)
B
E
Q1104
C
HP_DET
E
Q1103
C
+3.3V_Normal
R1130
10K
R1155
1K
JK3301
KJA-PH-0-0177
5GND
4L
3DETECT
1R
SPK_R+_HOTEL
2:X19
SPK_R-_HOTEL
2:X19
C
Q1105
ISA1530AC1
E
B
R1129
3.3K
+3.5V_ST
C
E
B
Q1106
2SC3052
SIDE_HP_MUTE
PC AUDIO
JK1102
PEJ027-01
E_SPRING
3
T_TERMINAL1
6A
B_TERMINAL1
7A
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
D1101
AMOTECH
5.6V
OPT
D1102
AMOTECH
5.6V
OPT
C1107
100pF
50V
C1108
100pF
50V
R1102
470K
R1103
470K
R1107
15K
R1108
15K
R1110
10K
R1111
10K
R1112
0
R1113
0
PC_R_IN
PC_L_IN
2:S16
2:S16
SPDIF OPTIC JACK
5.15 Mstar Circuit Application
SPDIF_OUT
2:X18
OPT
4.7K
R1152
A
B
GND
IC1104
NL17SZ00DFT2G
OPT
1
2
3
D1116
5.6V
OPT
+5V_Normal
EDID_WP
RGB_DDC_SCL
RGB_DDC_SDA
+3.3V_Normal
R1146
10K
D1117
5.6V
R1147
1K
DSUB_DET
+3.3V_Normal
VCC
5
C1117
0.1uF
16V
OPT
R1126
Y
4
22
OPT
R1127
0
C1131
0.1uF
16V
VINPUT
C1121
100pF
50V
GND
Fiber Optic
1
VCC
2
JK1103
JST1223-001
3
4
FIX_POLE
RGB PC
DSUB_VSYNC
DSUB_HSYNC
DSUB_B+
DSUB_B-
DSUB_G+
DSUB_G-
DSUB_R+
DSUB_R-
R1133
75
0
R1135
75
0
R1137
75
0
OPT
R1134
R1136
R1138
C1122
68pF
50V
IC1105
AT24C02BN-10SU-1.8
A0
1
A1
2
A2
3
GND
4
C1123
OPT
OPT
C1124
OPT
C1125
OPT
R1148
0
OPT
OPT
D1115
ENKMC2838-T112
A1
C
A2
4.7K
R1150
0
C1128
18pF
50V
D1113
30V
R1140
4.7K
R1141
22
D1114
5.6V
OPT
R1142
10K
C1129
0.1uF
16V
R1143
22
R1139
VCC
8
WP
7
SCL
6
SDA
5
C1127
18pF
50V
C1126
D1109
68pF
30V
50V
OPT
D1110
30V
D1111
30V
D1112
30V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RED2GREEN3BLUE4GND_15DDC_GND
RED_GND7GREEN_GND8BLUE_GND9NC10SYNC_GND
GND_212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK
11
SPG09-DB-010
6
1
JK1104
GP2_Saturn7M
COMMON AREA
SHILED
16
Ver. 1.0
9
Page 25
RS232C
C1101 0.33uF
C1102
0.1uF
C1103
0.1uF
C1104
0.1uF
C1105
0.1uF
DOUT2
RIN2
C1+
C1-
C2+
C2-
V+
V-
IC1101
MAX3232CDR
1
2
3
4
5
6
7
8
EAN41348201
10
5
9
8
7
6
SPG09-DB-009
JK1101
4
3
2
1
S7_RXD1
NEC_RXD
S7_TXD1
NEC_TXD
R1123
100
R1124
100
OPT
R1122
0
JP1121
JP1122
IR_OUT
+3.5V_ST
D1107
CDS3C30GTH
30V
C1106
0.1uF
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
+3.5V_ST
4.7K
OPT
R1109
4.7K
OPT
R1114
D1108
CDS3C30GTH
30V
R1157 0
R1156
R1154
R1153
0
0
0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RS232C 9PIN
Ver. 1.0GP2_Saturn7M
10
Page 26
WIRELESS_DL_RX
WIRELESS_TX
S7_TXD
WIRELESS READY MODEL
Wireless power
+24V
R2618
IC2601
1
2
3
4
5
6
7
8
R2605
27K
B
WIRELESS
OPT
R2604
22K
C
Q2601
E
0
16
15
14
13
12
11
10
9
WIRELESS_PWR_EN
WIRELESS
R2601
R2620
WIRELESS
C2601
0.1uF
50V
R2603
10K
WIRELESS
0
MC14053BDR2G
Y1
Y0
Z1
Z
Z0
INH
VEE
VSS
0
C2602
2.2uF
G
Q2602
AO3407A
WIRELESS
VDD
Y
X
X1
X0
A
B
C
R2606
S
D
+3.5V_ST
OPT
0
S7_TXD1
S7_RXD1
R2615
WIRELESS
R2619
0
C2603
0.01uF
50V
WIRELESS
R2607
0
1/4W
3216
+3.3V_Normal
0
S7_RXD
WIRELESS_DETECT
WIRELESS_SCL
WIRELESS_SDA
WIRELESS_RX
WIRELESS_TX
OPT
R2608
0
C2604
0.1uF
WIRELESS_DL_TX
WIRELESS_RX
+3.5V_ST
IR_PASS
OPT
OPT
OPT
4.7K
47K
R2609
R2610
+3.3V_Normal
R2612
10K
R2617 1K
WIRELESS_SW_CTRL
JK2601
KJA-PH-3-0168
VCC[24V/20V/17V]_1
VCC[24V/20V/17V]_2
VCC[24V/20V/17V]_3
VCC[24V/20V/17V]_4
VCC[24V/20V/17V]_5
VCC[24V/20V/17V]_6
TP2601
TP2602
DETECT
INTERRUPT
GND_1
RESET
GND_2
I2C_SCL
I2C_SDA
GND_3
UART_RX
UART_TX
GND_4
GND_5
GND_6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
IR
18
19
20
21
SHIELD
RS232C & Wireless
WIRELESS_SW_CTRL
HIGH
LOW
SELECT PIN
X1/Y1/Z1
X0/Y0/Z0
From wireless_I2C to micom I2C
OPT
R2602
WIRELESS_PWR_EN
AMP_SDA
AMP_SCL
10K
B
OPT
E
C
Q2603
ISA1530AC1
D
Q2604
FDV301N
WIRELESS
STATUS
WIRELESS Dongle connect --> WIRELESS RS232
WIRELESS Dongle Dis_con --> S7 RS232
+3.3V_Normal
OPT
G
OPT
S
G
OPT
D
Q2605
FDV301N
R2611 0
R2613
0
WIRELESS
10K
S
R2614
WIRELESS_SDA
WIRELESS_SCL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Page 28
32_FHD
VGHVGL
R620-*1
22K
1%
TCON_32_FHD
R622-*1
11K
1%
TCON_32_FHD
R621-*1
220K
1%
TCON_32_FHD
R637-*1
51K
1%
TCON_32_FHD
R643-*1
270K
1%
TCON_32_FHD
37_FHD
VGHVGL
R620-*2
47K
1%
TCON_37_FHD
R622-*2
12K
1%
TCON_37_FHD
R621-*2
220K
1%
TCON_37_FHD
R637-*2
20K
1%
TCON_37_FHD
R643-*2
150K
1%
TCON_37_FHD
42_FHD_60_LAMP
VGHVGL
SHEET7
SHEET7
42_FHD
VGH
R620-*3
56K
1%
TCON_42_FHD
R622-*3
11K
1%
TCON_42_FHD
(Without 60Hz Lamp)
R621-*3
220K
1%
TCON_42_FHD
VGL
R637-*3
27K
1%
TCON_42_FHD
R643-*3
150K
1%
TCON_42_FHD
VDD
R635-*1
150K
1%
TCON_32_FHD
R636-*1
27K
1%
TCON_32_FHD
R640 OPEN
R641-*1
24K
1%
TCON_32_FHD
HVDD
R609-*1
510K
1%
TCON_32_FHD
R610-*1
150K
1%
TCON_32_FHD
R611-*1
200K
1%
TCON_32_FHD
VDD
R635-*2
910K
1%
TCON_37_FHD
R636-*2
56K
1%
TCON_37_FHD
R640-*2
470K
1%
TCON_37_FHD
R641-*2
56K
1%
TCON_37_FHD
HVDD
R609-*2
470K
1%
TCON_37_FHD
R610-*2
91K
1%
TCON_37_FHD
R611 OPEN
VCOM FEED BACKVCOM FEED BACKVCOM FEED BACK
R601-*1
1K
1%
TCON_32_FHD
R652-*1
1K
1%
TCON_32_FHD
R602-*1
1K
1%
TCON_32_FHD
47_FHD_60_LAMP
VGH
R620-*4
30K
1%
TCON_47_FHD_60_LAMP
R622-*4
11K
1%
TCON_47_FHD_60_LAMP
VDD
R635-*4
180K
1%
TCON_47_FHD_60_LAMP
R636-*4
68K
1%
TCON_47_FHD_60_LAMP
R621-*4
220K
1%
TCON_47_FHD_60_LAMP
R640 OPEN
R641-*4
20K
1%
TCON_47_FHD_60_LAMP
VGL
R637-*4
51K
1%
TCON_47_FHD_60_LAMP
R643-*4
270K
1%
TCON_47_FHD_60_LAMP
HVDD
R609-*4
510K
1%
TCON_47_FHD_60_LAMP
R610-*4
150K
1%
TCON_47_FHD_60_LAMP
R611-*4
220K
1%
TCON_47_FHD_60_LAMP
R601-*2
1K
1%
TCON_37_FHD
R652-*2
1.5K
5%
TCON_37_FHD
47_FHD
VGH
R620-*5
51K
1%
TCON_47_FHD
R622-*5
11K
1%
TCON_47_FHD
VDD
R635-*5
180K
1%
TCON_47_FHD
R636-*5
75K
1%
TCON_47_FHD
R602-*2
1K
1%
TCON_37_FHD
(Without 60Hz Lamp)
R621-*5
220K
1%
TCON_47_FHD
R640 OPEN
R641-*5
20K
1%
TCON_47_FHD
VGL
R637-*5
51K
1%
TCON_47_FHD
R643-*5
270K
1%
TCON_47_FHD
HVDD
R609-*5
510K
1%
TCON_47_FHD
R610-*5
150K
1%
TCON_47_FHD
R611-*5
220K
1%
TCON_47_FHD
VDD
SHEET7
VCOM FEED BACK
R601 OPEN
R652-*4
1K
1%
TCON_42_FHD_60_LAMP
55_FHD
VGH
R620-*6
510K
1%
TCON_55_FHD
R622-*6
27K
1%
TCON_55_FHD
R635-*6
150K
1%
TCON_55_FHD
R636-*6
75K
1%
TCON_55_FHD
R602-*4
1K
1%
TCON_42_FHD_60_LAMP
R621-*6
68K
1%
TCON_55_FHD
R640 OPEN
R641-*6
15K
1%
TCON_55_FHD
HVDD
SHEET7
VGL
R637-*6
27K
1%
TCON_55_FHD
R643-*6
150K
1%
TCON_55_FHD
HVDDVDD
R609-*6
180K
1%
TCON_55_FHD
R610-*6
68K
1%
TCON_55_FHD
R611-*6
56K
1%
TCON_55_FHD
VDD
R635-*3
150K
1%
TCON_42_FHD
R636-*3
75K
1%
TCON_42_FHD
R601 OPEN
R652-*3
1K
1%
TCON_42_FHD
R640 OPEN
R641-*3
15K
1%
TCON_42_FHD
R602-*3
1K
1%
TCON_42_FHD
HVDD
R609-*3
510K
1%
TCON_42_FHD
R610-*3
150K
1%
TCON_42_FHD
R611-*3
200K
1%
TCON_42_FHD
VCOM FEED BACK
SHEET7
VCOM FEED BACK
R601-*5
1K
1%
TCON_47_FHD
R652-*5
1K
1%
TCON_47_FHD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
DDR3(256MB)
Ver. 1.0
21
Page 30
/FLASH_WP
R1401
OPT
R1402
0
0
+3.3V_Normal
R1403
10K
C
Q1401
B
KRC103S
E
/SPI_CS
SPI_SDO
+3.3V_Normal
R1404
4.7K
S_FLASH
IC1401
MX25L8005M2I-15G
CS#
1
SO
2
WP#
3
GND
4
+3.3V_Normal
R1405
33
C1401
0.1uF
SPI_SCK
SPI_SDI
VCC
8
HOLD#
7
SCLK
6
SI
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
S-Flash(1MB)
Ver. 1.2
23
Page 31
LGIT CAN H/N TUNER for US&KOR&BRAZIL&TAIWAN&AUS
RF_S/W_CTL
1
BST_CTL
2
+B1[5V]
3
NC_1[RF_AGC]
4
NC_2
5
SCLT
6
SDAT
7
NC_3
8
SIF
9
NC_4
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
IF/AGC
16
DIF_1[N]
17
DIF_2[P]
18
19
SHIELD
TU5001-*1
TDTR-T035F
NTSC_2INPUT_H_LGIT
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
TU5001-*2
TDVJ-H031F
NTSC_1INPUT_V_LGIT
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
TU5001-*3
TDVJ-H001F
NTSC_1INPUT_H_LGIT
NTSC_1INPUT_H_SANYO
TU5001-*4
UDA45AL
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
DVB_1INPUT_H_LGIT
TU5001
TDTJ-S001D
ANT_PWR[OPT]
1
BST_CNTL
2
+B
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC[IF_TP]
8
SIF
9
NC
10
VIDEO
11
GND
12
1.2V
13
3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
R5002
0
RF_S/W_OPT
R5001
0
RF_AGC_OPT
R5003
0
+1.2V/+1.8V_TU
C5001
100pF
50V
C5002
0.1uF
16V
RF_S/W_OPT
+5V_TU
C5003
0.1uF
16V
OPTION : RF S/W
RF_SWITCH_CTL
Pull-up can’t be applied
because of MODEL_OPT_2
+3.3V_TU
C5006
C5007
100pF
0.1uF
50V
16V
R5009
100
NON_DEMOD_OPT
0
R5035
+3.3V_TU
R5011
100K
C5010
0.1uF
16V
NON_BR_TU_I2C
TUNER_RESET
NON_DEMOD_OPT
R5034
Q5001
ISA1530AC1
BOOSTER_OPT
0
+5V_TU
C5011
0.01uF
25V
BOOSTER_OPT
C5012
18pF
50V
NON_BR_TU_I2C
L5001
MLB-201209-0120P-N2
BOOSTER_OPT
R5014
0
BOOSTER_OPT
E
B
C
33
NON_BR_TU_I2C
33
NON_BR_TU_I2C
C5013
18pF
50V
IF_N_MSTAR
IF_P_MSTAR
R5017
2.2K
BOOSTER_OPT
BOOSTER_OPT
NON_BR_TU_I2C
R5018
1.2K
R5015
R5016
Q5002
2SC3052
+3.3V_TU
R5019
10K
BOOSTER_OPT
C
BOOSTER_OPT
B
E
NON_BR_TU_I2C
R5020
1.2K
R5006 100
DEMOD_OPT
R5007 100
DEMOD_OPT
OPTION : BOOSTER
R5021
10K
TU_SCL
TU_SDA
LNA2_CTL
The pull-up/down of LNA2_CTL
is depended on MODLE_OPT_1.
GPIO must be added for FE_BOOSTER_CTL
Option name:BR_TU_I2C
BRAZIL model use I2C Standard Mode
BR_TU_I2C
R5018-*1
3.3K
BR_TU_I2C
R5015-*1
100
1/16W
5%
BR_TU_I2C
C5012-*1
47pF
50V
C5016
0.1uF
16V
OPT
Close to the tuner
R5022
1K
BR_TU_I2C
R5020-*1
3.3K
BR_TU_I2C
R5016-*1
100
1/16W
5%
BR_TU_I2C
C5013-*1
47pF
50V
should be guarded by ground
IF_N_EXT
IF_P_EXT
IF_AGC
C5025
0.1uF 16V
R5024
C5026
0.1uF
16V
RF_AGC_OPT
0
Q5003
2SC3052
RF_AGC_OPT
C5027
10uF
10V
RF_AGC_OPT
C
E
R5025
4.7K
R5026
1K
OPT
TU_CVBS_BYPASS
R5027
1K
OPT
R5028
10K
B
RF_AGC_OPT
+5V_TU
R5029
470
B
+5V_TU
R5030
220
NON_TU_CVBS_BYPASS
R5039
B
OPTION : RF AGC
E
ISA1530AC1
Q5004
C
R5031
220
0
E
NON_TU_CVBS_BYPASS
Q5005
ISA1530AC1
C
IF_AGC_SEL
R5032
82
GPIO must be added.
TU_SIF
TU_CVBS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.3V_TU
C5031
0.1uF
16V
IC5001
AZ1117H-ADJTRE1(EH11A)
INPUT
3
2
OUTPUT
1
ADJ/GND
R5038
1.2K
R5036
10
+1.2V/+1.8V_TU
R5033
1
C5029
10uF
10V
C5028
0.1uF
16V
60mA
200mA
+5V_TU
C5018
22uF
16V
TAIWAN_ASIA
+3.3V_TU
C5017
22uF
16V
OPT
BLM18PG121SN1D
C5019
22uF
16V
BLM18PG121SN1D
C5020
22uF
16V
+5V_Normal
L5002
C5021
0.1uF
16V
+3.3V_Normal
L5003
C5022
0.1uF
16V
*Change History.
C5023
0.1uF
16V
C5024
0.1uF
16V
GP2_Saturn7M
ATSC_CAN TUNER
Ver 1.0 --> 1.1:Change of chip type, 091019, w.s.jeong
Ver 1.1 --> 1.2:Change of chip type, Add of Tuner P/N for NTSC_1INPUT
1.De-reting
1) R5029,R5030,R5031 : 1005 Type ==> 1608 Type(w.s.Jeong_1019)
2) R5030,R5031 : 200/1608 Type ==> 220/2012 Type(w.s.Jeong_1116)
2.ADD of TUNER P/N (w.s.Jeong_1116)
CONTROL_ATTEN
This was being applied to the only china demod,
so this has to be deleted in both main and ISDB sheet.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
*In case of Side Gender Model,
you must not select this option
D3808
30V
R3810 0
REAR_COMP2
D3807
5.6V
D3806
5.6V
D3803
30V
D3805
30V
D3804
30V
SC1/COMP1_DET
D3812
5.6V
D3810
5.6V
R3817
75
R3815
75
REAR_COMP2
R3818
75
REAR_COMP2
R3808
0
R3807
0
R3806
0
+3.3V_Normal
R3822
10K
D3813
5.6V
R3821
470K
R3820
470K
OPT
C3810
10pF
50V
OPT
C3808
10pF
50V
C3813
0.47uF
OPT
OPT
C3806
10pF
50V
R3819
470K
R3816
470K
R3812
75
R3813
75
R3814
75
AV_CVBS_DET
25V
OPT
C3802
10pF
50V
OPT
C3804
10pF
50V
C3803
10pF
50V
R3827
1K
C3807
1000pF
50V
C3805
1000pF
50V
OPT
R3852
4.7K
OPT
C3811
1000pF
50V
R3823
10K
C3809
1000pF
50V
R3826
10K
R3825
10K
R3824
10K
R3851
R3830
12K
R3848
0
REAR_COMP2
R3860
REAR_COMP2
OPT
3.6K
R3853
OPT
R3854
82
R3861
0
REAR_COMP2
R3829
12K
R3828
12K
R3831
12K
82
0
B
OPT
R3833
0
OPT
R3835
0
SC1_B+/COMP1_Pb+
SC1_B-/COMP1_Pb-
+5V_Normal
R3857
OPT
0
C
Q3802
2SC3052
E
R3855
270
R3858
0
OPT
B
+5V_Normal
R3859
0
OPT
C
Q3803
2SC3052
E
R3838
0
R3856
270
COMP2_R_IN
RESULT
COMP2_DET
AV_R_IN
SC1/COMP1_R_IN
AV_L_IN
SC1/COMP1_L_IN
AV_CVBS_IN
SC1_R+/COMP1_Pr+
SC1_R-/COMP1_Pr-
AV_CVBS_IN2
SC1_G+/COMP1_Y+
OPT
SC1_G-/COMP1_Y-
COMP2_L_IN
COMP2_Pr+
COMP2_Pr-
COMP2_Pb+
COMP2_Pb-
COMP2_Y+
COMP2_Y-
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7MVer. 1.0
PCMCI
46
Page 39
NON ETHERNET
TP2101
TP2102
TP2103
TP2104
TP2105
TP2106
TP2107
TP2108
TP2109
TP2110
TP2111
EPHY_RXD0
EPHY_RXD1
EPHY_TXD1
EPHY_TXD0
EPHY_REFCLK
EPHY_CRS_DV
EPHY_MDIO
ET_RXER
/RST_PHY
EPHY_MDC
EPHY_EN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NON ETHERNET
Ver. 1.0GP2_Saturn7M
48
Page 40
NON Motion Remocon Region
TP2501
TP2502
TP2503
TP2504
M_REMOTE_RX
M_REMOTE_TX
RF_RESET
RF_ENABLE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
NON M REMOCON
Ver. 1.0
50
Page 41
NON CHINA HOTEL
AMP_MUTE_HOTEL
SPK_R+_HOTEL
SPK_R-_HOTEL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
NON CHINA HOTEL
Ver. 1.0
52
Page 42
/PIF_SPI_CS
R6001 0
CHB_CVBS_IN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
GP2_Saturn7M
SIDE_GENDER (3 SIL)
LA/TA/MA/SA
Ver. 1.1
101
Page 45
Page 46
1. Power-up boot check
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check stand-by Voltage.
P401 9~12pin : +3.5V_ST
ok
Check Micom Voltage
IC1002 pin 48 : +3.5V
ok
Check X1002 clock
32 KHz
ok
Check P401 PWR_ON.
1pin : 3.3V
ok
Check Multi Voltage
P401 2 pin : 20V, 17 pin : 12V
ok
No
No
No
No
Check Power connector
Replace L404
Replace X1002
Re-download Micom software.
Replace Power Board
okNo
Main B/D 3.5V Line
Short Check
ok
Replace Power board.
No
Replace Micom(IC1002)or Main board
Check IC402/3/5/7 Output Voltage
IC402 : 2.5V
IC403 : 1.26V
IC405 : 3.3V
IC407 : 1.5V
ok
Check X201 Clock
24 MHz
ok
Check LVDS Power Voltage
Q409 : 12V
ok
Check Mstar LVDS Output
ok
Check Inverter Control
P401 18 pin : High
No
Replace IC402/ 3 / 5 / 7
No
Replace X201
No
Replace Q409
No
Replace Mstar(IC101) or Main Board
No
Check Power Board or Module
ok
Change Module
Page 47
2. Digital TV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check RF Cable & Signal
ok
Check Tuner 5V Power
L5002
ok
Check Tuner 3.3V Power
L5003
ok
Check Tuner 1.2V Power
IC5001 2 pin : 1.2V
ok
Check IF_P/N Signal
TU5001 17/18 Pin
ok
Check Mstar LVDS Output
No
No
No
No
No
No
Check IC401
Replace IC401
ok
Replace L5002
Replace L5003
Replace IC5001.
Bad Tuner. Replace Tuner.
Replace Mstar(IC101) or Main Board.
Page 48
3. Analog TV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check RF Cable & Signal
ok
Check Tuner 5V Power
L5002
ok
Check Tuner 3.3V Power
L5003
ok
Check Tuner 1.2V Power
IC5001 2 pin : 1.2V
ok
Check CVBS Signal
TU5001 11 Pin
ok
Check Mstar LVDS Output
No
No
No
No
No
No
Check IC401
Replace IC401
ok
Replace L5002
Replace L5003
Replace IC5001.
Bad Tuner. Replace Tuner.
Replace Mstar(IC101) or Main Board.
Page 49
4. AV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
ok
Check AV Cable for damage
for damage or open conductor
ok
Check JK3801
CVBS Signal Line
R3817,R3811
No
ok
No
Check CVBS_DET Signal
ok
No
Check Mstar LVDS Output
5. Component Video
Check input signal format.
Is it supported?
ok
Check Component Cable
for damage or open conductor.
Replace Jack
Replace R3802 or R3803
Replace Mstar(IC101) or Main Board.
ok
Check JK3801
Y/PB/PR signal Line
No
ok
No
Check COMP_DET Signal
ok
No
Check Mstar LVDS Output
Replace Jack
Replace R3804 or R3805
Replace Mstar(IC101) or Main Board.
Page 50
6. RGB Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
ok
Check RGB Cable conductors
for damage or open conductor
ok
Check EDID & EEPROM
IC1105 I2C Signal
R1141, R1143(SDA,SCL)
ok
Check JK1104
H/V_Sync/R/G/B Signal Line
ok
Check DSUB_DET
ok
Check Mstar LVDS Output
No
Replace the defective IC or re-download EDID data
No
Replace Jack
No
Replace R1146 or R1147
No
Replace Mstar(IC101) or Main Board.
Page 51
7. HDMI Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
ok
Check HDMI Cable conductors
for damage or open conductor.