Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec sheet is applied all of the LED TV with LT43B,
chassis.
2. Designation
(1) Th e adju stment is ac cordi ng to the order which is
designated and which must be followed, according to the
plan whic al Unit: Product Specification Standard.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run).
Temperature : at 25 ºC±5
Relative humidity : 65 ± 10%
Input voltage : 100~220V, 50/60Hz
(6) Adjustment equipments : Color Analyzer (CA-210 or
CA-110), SVC remote controller
(7) Push The “IN STOP KEY” – For memory initialization.
Case1 : Software version up
1) After downloading S/W by USB , TV set will reboot
automatically
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
* After downloading, have to adjust Tool
Option again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push "OK" button.
(3) Punch in the number. (Each model has their number.)
(4) Completed selecting Tool option.
BLU
Tool op-
Tool op-
Tool op-
Tool op-
Tool op-
ModelModule
32LB550D-DFLGD /
42LB550T-DFLGDPOLA232440161291418455298273
49LB550T-DFLGDPOLA2440161291418455298273
32LB561B-DCLGD /
32LB560D-DA
32LB561D-DC
32LB5610-DC
39LB5600-DAINXPOLA20542406161291314452234273
39LB560T-DAINXPOLA20542406161291314452226273
42LB5610-DCLGD /
42LB561T-DCLGD /
47LB5610-DCLGDPOLA82406161291313652226273
47LB561T-DCLGDPOLA82406161291314452226273
50LB5610-DCINXPOLA20572406161291313652226273
50LB561T-DCINXPOLA20572406161291314452226273
55LB5610-DCLGDPOLA102406161291313652226273
55LB561T-DCLGDPOLA102406161291314452226273
60LB5610-DCSharpPOLA13136
32LB620D-
DD/DJ
42LB620T-DDLGDPOLA2406161291314452226273
49LB620T-DDLGDPOLA2406161291314452226273
55LB620T-DDLGDPOLA2406161291314452226273
Type
tion1
tion2
tion3
tion4
20 /
POLA
SHARP
BOE /
POLA
Sharp
LGD /
BOE /
POLA
Sharp
LGDPOLA42406161291313652226273
POLA
AUO
POLA
AUO
LGDPOLA2406161291314452226273
24401612914184
6164
4 /
6148 /
24401612914184
12292
4 /
12292 /
2406161291313652226273
6148
7 /
2406161291313655298273
4103
7 /
2406161291314452226273
4103
tion5
55298 /
51202
55298 /
51202 /
51202
Tool op-
tion6
273
273
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In thi s case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
Only for training and service purposes
* RS-232C Connection Method
Connection : PCBA (USB Port) -> USB to Se ri al Ada pter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
▪ Product name of USB to Serial Adapter is UC-232A.
※ Caution: LT43* chassis support only UC-232A driver. (only use
CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of
LED back light
■ Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
► The spec of color temperature and coordinate
ModelModeColor TempColor coordinateRemark
Cool (C50)13,000k
Medium (0)9,300k
All
Warm (W50)6,500k
► CA210 : CH 14, Test signal : Inner pattern (80IRE)
- Standard color coordinate and temperature using CA-1000 (by
H/R time)
▪ L14 LGD, INX Module
March to December & Global
Normal line (LB5500, LB5600)
H/R Time(Min)
271270285293313329
10-2281 285 295308323344
23-5280 284 294307322343
36-9279 282 293305321341
410-19277 279 291302319338
520-35275 275 289298317334
636-49273 273 287296315332
750-79272 272 286295314331
880-119271 270 285293313329
9Over 120271 270 285293313329
▪ Aging chamber line (LB5500, LB5600)
H/R Time(Min)
271270285293313329
10-5280 285 294308319340
26-10276 280 290 303 315 335
311-20272 275 286 298 311 330
421-30269 272 283 295 308 327
531-40267 268 281 291 306 323
641-50266 265 280 288 305 320
751-80265 263 279 286 304 318
881-119264 261 278 284 303 316
9Over 120264 260 278 283 303 315
x = 0.271 (±0.002)
y = 0.270 (±0.002)
x = 0.286 (±0.002)
y = 0.289 (±0.002)
x = 0.313 (±0.002)
y = 0.329 (±0.002)
CoolMediumWarm
xyxxyx
CoolMediumWarm
xyxxyx
※ Test signal
- Inner pattern for W/B adjust
- External white pattern
(80IRE, 204gray)
※ Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER-ON -> Enter
the mode of White-Balance, the pattern will come out.
● Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
● Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
*Manual W/B process using adjusts Remote control.(TBD)
■ Color analy zer(C A100+, CA210 ) sh ould be use d in the
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■Enter White Balance by pushing “►” key at “8. White Balance”.
■ For manual adjustment, it is also possible by the following
sequence.
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface
(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 206 Gray internal pattern will be displayed.
(4) Adjust Cool modes
(i). Fix the one of R/G/B gain to 192 (default data) and decrease
the others
(If G gain is adjusted over 172 and R and B gain less than
192, increase G gain to 192 and increase R gain and B gain
same amount of increasing G gain.)
(ii). If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain.
(iii). If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255 or B
gain is 255
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
※ CASE Cool
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
How to adjust
(1) . If G gain is adjusted over 172 and R gain and B gain less
than 192, increase G gain to 192 and increase R gain and B
gain DAme amount of increasing G gain
(2) If G gain is less than 172 , increase G gain by up to 172,
and then increase R gain and B gain DAme amount of
increasing G gain.
(3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
▪ After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is
correctly same then unplug the AC cable. If it is not same, then
correct it same with BOM and unplug AC cable. For correct it to
the model’s module from factory JIG model.
▪ Push the “IN STO P KE Y” after completing the func tion
inspection.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu
8. White Balance, you can select one of 2 Test-pattern: ON,
OFF. Default is inner (ON). By selecting OFF, you can adjust
using RF signal in 206 Gray pattern.
■ When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.5. GND & Hi-pot test
4.5.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition
4.5.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
4.5.3. Checkpoint
(1) Test voltage
① 3 Poles
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
② 2 Poles
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
① 3 Poles
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi- po t Test = POWER COR D GND a nd L IV E &
NEUTRAL.
② 2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
5. Local Dimming Function Check
(Not require)
Step1) Turn on TV.
Step2) Press “P-only” key, enter to power only mode and
escape the “P-only” Mode by pressing “Exit” key
Step3) Press “Tilt” key, entrance to Local Dimming mode.
Step4) At the Local Dimming mode, module Edge Backlight
moving Top to bottom Back light of module moving
Step5) confirm the Local Dimming mode
Step6) Press “Exit” key
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TP for CI slot
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORDPCM_A[11]
/PCM_IOWRCI_TS_DATA[1]
/PCM_CE
/PCM_IRQA
/PCM_CD
/PCM_WAIT
PCM_RST
PCM_5V_CTL
/CI_DET
TP for S2
PCM_D[0]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[12]
PCM_A[13]
PCM_A[14]
TP for FE_TS_DATA
CI_TS_CLK
CI_TS_VAL
CI_TS_SYNC
CI_TS_DATA[0]
CI_TS_DATA[2]
CI_TS_DATA[3]
CI_TS_DATA[4]
CI_TS_DATA[5]
CI_TS_DATA[6]
CI_TS_DATA[7]
TP for SCART
SCART1_MUTE
SC1_IDPCM_D[1]
SC1_FB
DTV/MNT_VOUT
SCART1_Lout
SCART1_Rout
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for Headphone
HP_LOUT
HP_ROUT
SIDE_HP_MUTE
HP_DET
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC5_L14
TP_NON_EN
2013.05.09
3
L14 POWER BLOCK (POWER DETECT 2)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
FROM LIPS or POWER B/D
+3.5V_ST
OPT
R400
10K
R402
R401
10K
C407
10uF
2012
10V
10K
+3.5V_POWER_DET
L400
CB2012PK501T
C400
+24V_CAP
C432
4.7uF
3216
+12V_CAP
C433
4.7uF
3216
RL_ON
+3.5V_ST
+24V
+12V
1005
16V
1uF
10V
OPT
50V
B
+3.5V_ST
R406
10K
R404
4.7K
C
Q400
MMBT3904(NXP)
E
R456
ZD400
5V
MLB-201209-0120P-N2
C401
0.1uF
50V
MLB-201209-0120P-N2
C402
0.1uF
16V
MMBT3906(NXP)
1
OPT
0
L401
CB2012PK501T
L402
L403
Q401
2
R455
3
0
ZD404
+1.5V_DDR
+3.3V_Normal
L409
BLM18PG121SN1D
C426
10uF
AZ1117EH-ADJTRG1
10V
1.3A
OPT
R412
33K
+3.3V_Normal
R420
1K
5V
PWR ON
3.5V
3.5V
GND
24V
GND
12V
12V
GND
P401
SMAW200-H18S5
1
3
5
7
10
9
11
12
13
14
15
16
17
18
19
.
DRV ON
2
PDIM#1
4
3.5V
6
PDMI#2
8
24V
GND
12V
NC
GND
R419
100
PWM_DIM_PULL_DOWN
Vout=1.25*(1+R2/R1)+Iadj*R2
+1.5V_DDR
R1
R2
L411
CB2012PK501T
R453
0
C431
10uF
10V
ZD403
2.5V
IC404
ADJ/GND
OUTIN
R449
1K
1/16W
1%
R450
200
1/16W
1%
C
B
E
Q402
MMBT3904(NXP)
R424
3.9K
+3.5V_ST
R426
10K
R425
10K
PWM2_2CH_POWER
R423
100
OPT
R467
1K
INV_CTL
PWM_DIM
PWM1
C415
0.1uF
C413
0.1uF
OPT
R457
8.2K
16V
OPT
16V
+24V
1%
R427
R428
5.1K
R430
2.7K
R431
1.2K
OPT
27K
1%
1%
1%
OPT
1%
+12V
+24V
+3.5V_POWER_DET
OPT
R432
0
5%
+3.5V_POWER_DET
OPT
R458
0
5%
Ready - Dual Power Det
* Notice
- Applying all inch models for LCD L14
- Dual Power Det is used
for detecting two kinds of voltage
+1.10V_VDDC
+1.10V_VDDC
ZD401
2.5V
+3.5V_ST
OPT
C424
0.1uF
16V
C437
0.1uF
CB2012PK501T
OPT
C436
10uF
10V
16V
C420
C421
22uF
22uF
10V
10V
VCC
VCC
APX803D29
3
APX803D29
3
L406
C423
50V
270pF
GND
GND
R435
100K
IC401
OPT
R436
100K
OPT
IC402
C414
10uF
10V
2
1
2
1
0.1uF
R43 9
20K
1%
R44 0
47K
1%
PD_+3.5V
R454-*1
300
5%
PD_+12V
R454
RESET
RESET
100 5%
POWER_DET_RESET
OPT
R437
100 5%
Detect Valtage
Power Detect +3.5V
Power Detect +12V
Power Detect +24V
C435
16V
C417
L407
0.1uF
3.6uH
16V
R1
R2
+3.5V_ST
OPT
R438
4.7K
C422
0.1uF
Power_DET
POWER_DET
Power Detect activity
Now is
Use Circuit Designator
R432, R454-*1, R438
OR430, R431, R454
R457, R454
IC403
TPS5432DDAR
BOOT
VIN
PH
GND
1
2
3
4
3A
9
THERMAL
8
7
6
5
[EP]GND
SS
EN
COMP
VSENSE
C418
0.01uF
R433
2.7K
C419
0.039uF
50V
1%
Vout=0.808*(1+R1/R2)
C434
390pF
50V
+3.3V_Normal
R429
10K
C416
0.33uF
16V
PANEL_VCC
PANEL_CTL
+3.3V_Normal
POWER_ON/OFF_1
L408
UBW2012-121F
120OHM
OPT
C425
0.1uF
25V
R441
10K
+3.5V_ST
R443
10K
R444
10K
+12V
B
R447
22K
R448
2.2K
R442
10K
C
Q404
MMBT3904(NXP)
E
C428
2.2uF
10V
R445
R446
12K
B
33K
C427
10uF
16V
C
Q403
MMBT3904(NXP)
E
FET_2.5V_DIODE
Q406-*1
DMP2130L
S
FET_2.5V_AOS
Q406
AO3435
S
PANEL_VCC
Q405
DMP2130L
D
S
R451
R452
5.6K
L410
C430
22uF
10V
5.6K
+3.3V_Normal
ZD402
5V
G
D
G
BLM18PG121SN1D
D
C429
G
0.1uF
16V
+5V_Normal & +5V_USB with OCP
C403
100pF
R408
OPT
R405
4.7K
4.7K
/VBUS_EN
(Active Low)
MHL_OCP_EN
(Active High)
+3.3V_Normal
MHL_SW_TR
MHL_SW_TR
R461
10K
MHL_SW_TR
MHL_SW_TR
R462
10K
Q407
R463
2.7K
B
C
MHL_SW_TR
E
MHL_SW_TR
Q409
MHL_SW_TR
R464
10K
MHL_SW_TR
Q408
E
B
R465
10K
B
+3.3V_Normal
OPT
R403
4.7K
MHL_5V_EN
USB1_CTL
C
MHL_5V_EN
R466
20K
C
E
R410
OPT
100K
50V
C404
4700pF
50V
OPT
R459
0
+3.3V_Normal
R407
10K
R409
10K
COMP
ROSC
EN_SW2
EN_SW1
[EP]GND
V7V
EN
1
2
SS
3
4
TPS65282REGR
5
6
FAULT2
+12V
C405
10uF
PGOOD
23
24
THERMAL
25
IC400
4A
7
8
FAULT1
SW_OUT2
USB1_OCD
/MHL_OCP_DET
VIN_122VIN_2
9
RLIM11AGND
C406
10uF
16V
21
10
R415
15K
5%
OPT
R416
100K
PGND_1
PGND_2
19
20
12
SW_OUT1
MBR230LSFT1G
C411
82pF
50V
+5V_Normal
C412
22uF
16V
C409
L405
0.047uF
4.7uH
25V
BST
18
LX_2
17
LX_1
16
FB
15
SW_IN_2
14
SW_IN_1
13
+5V_USB
5V_HDMI_4
D401
30V
C408
10uF
10V
C410
10uF
10V
AVDD5V_MHL
R418
10
R422
3.3K
R421
R1
R2
18K
1%
1%
Vout=0.8*(1+R1/R2)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_M1A
Power_PD2
2013.10.28
4
USB (SIDE)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
JK700
1234
USB DOWN STR EAM
3AU 04S-3 05-Z C-(LG )
5
OPT
C701
5pF
50V
OPT
C702
5pF
50V
ZD700
SD05
5V
OPT
+5V_USB
C700
22uF
10V
OPT
D700
RCLAMP0502BA
C703
22uF
10V
USB_HDD_CAP
SIDE_USB1_DM
SIDE_USB1_DP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_M1A
USB_S1
13/04/30
7
HDMI (REAR 1 / SIDE 1 MHL)
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
SHIELD
20
19
18
17
16
15
14
13
12
11
CK+
10
EAG59023302
JK800
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_2
R803
1K
R802
1.8K
VA800
ESD_HDMI1_VARISTOR
5V_DET_HDMI_2
ESD_HDMI1
R805
3.3K
VA801
ESD_HDMI1_VARISTOR
VA800-*1
1uF
10V
ESD_HDMI1_CAP
VA801-*1
1uF
10V
ESD_HDMI1_CAP
VA802
MMBT3904(NXP)
Q800
C
E
VA803
ESD_HDMI1
R808
10K
B
R809
10K
R810 100
R811 100
VA804
ESD_HDMI1
D803
1
2
3
4
5
ESD_HDMI1_IP4294
IP4294CZ10-TBR
D804
1
2
3
4
5
ESD_HDMI1_IP4294
IP4294CZ10-TBR
10
9
8
7
6
10
9
8
7
6
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
HDMI_2 MHL
VA805
ESD_HDMI2
GND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
BODY_SHIELD
20
19
HOT_PLUG_DETECT
18
VDD[+5V]
17
DDC/CEC_GND
16
SDA
15
SCL
14
RESERVED
13
CEC
12
TMDS_CLK-
11
TMDS_CLK_SHIELD
10
TMDS_CLK+
9
TMDS_DATA0-
8
TMDS_DATA0_SHIELD
7
TMDS_DATA0+
6
TMDS_DATA1-
5
TMDS_DATA1_SHIELD
4
TMDS_DATA1+
3
TMDS_DATA2-
2
TMDS_DATA2_SHIELD
1
TMDS_DATA2+
JK801-*1
DAADR019A
HDMI-2_EMI_FOOSUNG
EAG62611204
JK801
HDMI-2
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_4
R812
1.8K
HDMI-2
5V_DET_HDMI_4
ESD_HDMI2
VA806
R813
3.3K
HDMI-2
VA807
5.6V
OPT
ESD_HDMI2
VA808
ESD_HDMI2
VA809
HDMI-2
R814
33
HDMI-2
R815100
R816100
HDMI-2
VA810
ESD_HDMI2
VA811
ESD_HDMI2
1
2
3
4
5
ESD_HDMI2_IP4294
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI2_IP4294
IP4294CZ10-TBR
C800
0.047uF
25V
HDMI-2
D805
D806
10
9
8
7
6
10
9
8
7
6
R817
300K
MHL Spec
HDMI-2
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
MHL_CD_SENSE
CEC
R804
A2CA1
MMBD6100
D800
100
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE_S7
5V_HDMI_4
R806
2.7K
+5V_Normal
A2CA1
MMBD6100
D801
R807
2.7K
+3.5V_ST
DDC_SDA_4
DDC_SCL_4
A2CA1
MMBD6100
D802
HDMI_CEC
5V_HDMI_2
R800
2.7K
+5V_Normal
R801
2.7K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D803-*1
TMDS_CH1-
1
2
GND_1
3
4
5
D803-*2
1
2
3
4
5
10
9
8
7
6
10
9
8
7
6
TMDS_CH1+
TMDS_CH2-
TMDS_CH2+
ESD_HDMI1_IP4283
IP4283CZ10-TBA
ESD_HDMI1_SEMTECH
RCLAMP0524PA
NC_4
NC_3
GND_2
NC_2
NC_1
D804-*1
TMDS_CH1-
1
2
GND_1
3
4
5
D804-*2
1
2
3
4
5
10
10
9
8
7
6
TMDS_CH1+
TMDS_CH2-
TMDS_CH2+
ESD_HDMI1_IP4283
IP4283CZ10-TBA
ESD_HDMI1_SEMTECH
RCLAMP0524PA
D805-*1
NC_4
NC_3
9
GND_2
8
NC_2
7
NC_1
6
TMDS_CH1-
1
2
GND_1
3
4
5
D805-*2
1
2
3
4
5
10
10
9
8
7
6
TMDS_CH1+
TMDS_CH2-
TMDS_CH2+
ESD_HDMI2_IP4283
IP4283CZ10-TBA
ESD_HDMI2_SEMTECH
RCLAMP0524PA
NC_4
NC_3
9
GND_2
8
NC_2
7
NC_1
6
D806-*1
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+
5
ESD_HDMI2_IP4283
IP4283CZ10-TBA
D806-*2
1
2
3
4
5
ESD_HDMI2_SEMTECH
RCLAMP0524PA
L14_M1A
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
10
9
8
7
6
2013/08/15
HDMI_R1_S18
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