Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This specification sheet is applied to all of the LED TV with
LB43T chassis.
2. Designation
(1) Th e ad justm ent is accord ing to the order whic h is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 100-220 V~, 50/60 Hz
(6) Adjustment equipments
: Color Analyzer(CA-210 or CA-110), Service remote control.
(7) Push the “IN STOP" key - For memory initialization.
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at rst.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
(4) Click "Connect" tab. If "Can't" is displayed, check connection
between computer, jig and set.
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
(4)
filexxx.bin
(5)
(7)...........OK
(6)
3. Main PCB check process
▪ APC - After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
(2) Set as below, and then click "Auto Detect" and check "OK"
message.
If "Error" is displayed, check connection between computer,
jig, and set.
(3) Click "Read" tab, and then load download file(XXXX.bin)
by clicking "Read"
(1)
filexxx.bin
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If version of update file in USB Stick is lower, it will not
work. But version of update file is higher, USB data will be
detected automatically.
- Enter Internal ADC mode by pushing "►" key at "8. ADC
Calibration".
<Caution> Using "P-ONLY" key of the Adjustment remote
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option Commercial
6. Country Group
7. Area Option
8. ADC Calibration ►
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L
13. Sub B/C
14. Ext. Input Adjust
control, power on TV.
ADC Calibration
ADC Comp 480i
ADC Comp 1080p
ADC Type ◄ ►
Start
Reset
OPT
NG
NG
(5) Updating Completed, the TV will restart automatically.
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If updated version is higher than what TV has, the TV can
lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a
DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
(4) Completed selecting Tool option.
*
RS-232C Connection Method.
Connection : PCBA (USB Port) → USB to Serial Adapter
(UC-232A) → RS-232C cable → PC(RS-232C port)
● Product name of USB to Serial Adapter is UC-232A.
* ADC Calibration Protocol (RS232)
NOItemCMD 1 CMD 2 Data 0
Enter
Adjust MODE
ADC adjustADC AdjustAD1 0
Adjust
‘Mode In’
AA0 0
When transfer the ‘Mode In’,
Carry the command.
Automatically adjustment
(The use of a internal pattern)
Adjust Sequence
▪ aa 00 00 [Enter Adjust Mode]
▪ xb 00 40 [Component1 Input (480i)]
▪ ad 00 10 [Adjust 480i Comp1]
▪ aa 00 90 End Adjust mode
* Required equipment : Adjustment remote control.
4.2. Function Check
4.2.1. Check display and sound
■ Check Input and Signal items.
(1) TV
(2) AV (CVBS)
(3) COMPONENT (480i)
(4) HDMI
* Display and Sound check is executed by Remote control.
<Caution> Not to push the "INSTOP" key after completion if
CA210: CH14, Test signal: Inner pattern(80IRE)-LED Module
▪ Above 5 minutes H/run in the inner pattern. ("power on" key
of Adjustment remote control)
* Connecting picture of the measuring instrument
(On Automatic control)
Inside Pattern is used when W/B is controlled. Connect to
auto controller or push Adjustment Remote control POWER
ON → Enter the mode of White-Balance, the pattern will
come out.
- AUO/INX/COST/SHARP/BOE Module which cool spec is
13000 K
CoolMediumWarm
xyxyxy
spec271270286289313329
target278280293299320339
Full White Pattern
RS-232C Communication
CA-210
COLOR
ANALYZER
TYPE : CA-210
* Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10 lux).
(2) Adhere closely the Color analyzer(CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color analyzer's prove vertically.(80° ~ 100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
▪ Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
CoolMidWarmCool Mid Warm
R Gain jgJajd00172192 192192
G Gain jhJbje00172192 192192
B Gain jiJcjf00192192 172192
R Cut646464128
G Cut646464128
B Cut646464128
MIN
<Caution>
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.(When R/G/B Gain are all
C0, it is the FULL Dynamic Range of Module)
Automatically adjustment
(The use of a internal pattern)
No.ItemConditionHex Data
1Manufacturer IDGSM1E6D
2VersionDigital : 101
3RevisionDigital : 303
012 345678 9A B C D EF
012 345678 9A B C D EF
a. Product ID
b. Serial No: Controlled on production line.
c. Month, Year: Controlled on production line:
ex) Week : '01' -> '01'
Year : '2014' -> '18' fix
d. Model Name(Hex): Refer to the ASCII Code Table.
Cf) model name in EDID data is below.
e. Checksum: Changeable by total EDID data.
EDID C/S data
Check Sum
(Hex)
Block 0417575
Block 1
FHD-8BITHD2D(DTS) HD
HDMIHDMIHDMI
25 (HDMI1)5B (HDMI1)52 (HDMI1)
15 (HDMI2)4B (HDMI2)42 (HDMI2)
f. Vendor Specific
- FHD/HD 8bit Model
InputModel name(HEX)
HDMI167030C001000
HDMI267030C002000
5.4. Outgoing condition Configuration
■ When pressing IN-STOP key by Service remote control,
Red LED are blinked alternatively. And then automatically
turn off. (Must not AC power OFF during blinking)
5.5. GND and HI-POT Test
5.5.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition.
(2) You can’t use Tuner Ground & Tuner signal line at all
models (applied Isolator inner tuner)
5.5.2. GND & HI-POT auto-check
(1) Pallet moves in the station.(POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process(Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
5.5.3. Checkpoint
(1) Test voltage
1) 3 Poles
- GND: 1.5 KV/min at 100 mA
- SIGNAL: 3 KV/min at 100 mA
2) 2 Poles
- SIGNAL: 3 KV/min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT
1) 3 Poles
- GND Test = POWER CORD GND and SIGNAL
CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE &
NEUTRAL.
2) 2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
- Dual Power Det is used
for detecting two kinds of voltage
+1.10V_VDDC
+1.10V_VDDC
ZD401
2.5V
+3.5V_ST
OPT
C424
0.1uF
16V
C437
0.1uF
CB2012PK501T
OPT
C436
10uF
10V
16V
C420
C421
22uF
22uF
10V
10V
VCC
VCC
APX803D29
3
APX803D29
3
L406
C423
50V
270pF
GND
GND
R435
100K
IC401
OPT
R436
100K
OPT
IC402
C414
10uF
10V
2
1
2
1
0.1uF
R43 9
20K
1%
R44 0
47K
1%
PD_+3.5V
R454-*1
300
5%
PD_+12V
R454
RESET
RESET
100 5%
POWER_DET_RESET
OPT
R437
100 5%
Detect Valtage
Power Detect +3.5V
Power Detect +12V
Power Detect +24V
C435
16V
C417
L407
0.1uF
3.6uH
16V
R1
R2
+3.5V_ST
OPT
R438
4.7K
C422
0.1uF
Power_DET
POWER_DET
Power Detect activity
Now is
Use Circuit Designator
R432, R454-*1, R438
OR430, R431, R454
R457, R454
IC403
TPS5432DDAR
BOOT
VIN
PH
GND
1
2
3
4
3A
9
THERMAL
8
7
6
5
[EP]GND
SS
EN
COMP
VSENSE
C418
0.01uF
R433
2.7K
C419
0.039uF
50V
1%
Vout=0.808*(1+R1/R2)
C434
390pF
50V
+3.3V_Normal
R429
10K
C416
0.33uF
16V
PANEL_VCC
PANEL_CTL
+3.3V_Normal
POWER_ON/OFF_1
L408
UBW2012-121F
120OHM
OPT
C425
0.1uF
25V
R441
10K
+3.5V_ST
R443
10K
R444
10K
+12V
B
R447
22K
R448
2.2K
R442
10K
C
Q404
MMBT3904(NXP)
E
C428
2.2uF
10V
R445
R446
12K
B
33K
C427
10uF
16V
C
Q403
MMBT3904(NXP)
E
FET_2.5V_DIODE
Q406-*1
DMP2130L
S
FET_2.5V_AOS
Q406
AO3435
S
PANEL_VCC
Q405
DMP2130L
D
S
R451
R452
5.6K
L410
C430
22uF
10V
5.6K
+3.3V_Normal
ZD402
5V
G
D
G
BLM18PG121SN1D
D
C429
G
0.1uF
16V
+5V_Normal & +5V_USB with OCP
OPT
C403
100pF
50V
R408
OPT
R405
4.7K
4.7K
/VBUS_EN
(Active Low)
MHL_OCP_EN
(Active High)
+3.3V_Normal
MHL_SW_TR
MHL_SW_TR
R461
10K
MHL_SW_TR
MHL_SW_TR
R462
10K
Q407
B
R463
2.7K
C
MHL_SW_TR
E
MHL_SW_TR
Q409
MHL_SW_TR
R464
10K
MHL_SW_TR
Q408
E
B
R465
10K
B
+3.3V_Normal
OPT
R403
4.7K
MHL_5V_EN
USB1_CTL
C
MHL_5V_EN
R466
20K
C
E
R410
100K
C404
4700pF
50V
OPT
R459
0
+3.3V_Normal
R407
R409
10K
10K
COMP
ROSC
EN_SW2
EN_SW1
[EP]GND
V7V
EN
1
2
SS
3
4
TPS65282REGR
5
6
FAULT2
+12V
C405
10uF
VIN_223PGOOD
24
THERMAL
25
IC400
4A
7
8
FAULT1
SW_OUT2
USB1_OCD
/MHL_OCP_DET
22
9
C406
10uF
16V
PGND_2
VIN_1
21
10
RLIM11AGND
R415
15K
5%
OPT
R416
100K
PGND_1
19
20
18
17
16
15
14
13
12
SW_OUT1
D401
MBR230LSFT1G
C409
L405
0.047uF
4.7uH
25V
BST
LX_2
LX_1
FB
SW_IN_2
SW_IN_1
C410
5V_HDMI_4
10uF
10V
AVDD5V_MHL
R418
10
+5V_USB
30V
C408
10uF
10V
Vout=0.8*(1+R1/R2)
R422
3.3K
R421
R1
R2
+5V_Normal
C411
82pF
50V
C412
22uF
16V
18K
1%
1%
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EU pin assign is different from NON EU.
Because of position of HD wafer.
V-COM I2C
+3.3V_Normal
VCOM_I2C_PULL_UP
R1115
2K
URSA/VCOM_SCL
URSA/VCOM_SDA
VCOM_SCL
VCOM_SDA
VCOM_I2C_PULL_UP
R1114
VCOM_I2C
R1105
0
R1106
0
VCOM_I2C
2K
PANEL_VCC
120OHM
MO_HD
MO_HD
L1101
UBW2012-121F
C1101
0.1uF
16V
URSA/VCOM_SCL
URSA/VCOM_SDA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC5_S7LR(M1A)
1_DDR
2013/05/20
12
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