Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transfo rmer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Good Earth Ground
such as WATER PIPE,
To Instrument's
exposed
METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unl ess sp ecified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
This spec. sheet applies to LM91X Chassis applied TV all
models manufactured in TV factory
2. Specication
1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specic designation.
4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz.
5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15. In case of keeping module is in the circumstance of 0
°C, it should be placed in the circumstance of above 15
°C for 2 hours. In case of keeping module is in the circumstance of below -20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.
[Caution]
When still image is displayed for a period of 20 minutes or
longer (Especially where W/B scale is strong. Digital pattern
13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area.
3. Main PCBA Adjustments
3.1. ADC Calibration
- An ADC calibration is automatically adjusted from DFT-Jig
- If it needs to adjust manually, refer to appendix.
NOItemCMD 1CMD 2Data 0
Enter
Adjust MODE
ADC
adjust
Adjust
‘Mode In’
ADC
adjust
AA00When transfer the
AD10Automatically adjustment
‘Mode In’,
Carry the command.
3.2.3. Download method
- The EDID data is automatically saved.
3.2.4. EDID DATA
- 29MT45A(RGB-PC)
** RGB-PC : 128Bytes
0123456789ABCDEF
000 FF FF FF FF FF FF 00 1E 6D C8 59 01 01 01 01
10 01 17 01 03 68 34 1D 78 EA 53 4D A3 56 4F 9E 26
▪ W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel's W/B deviation
(2) How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is xed at 192, and the other two is lowered to nd
the desired value.
(3) Adjustment condition : normal temperature
1) Surrounding Temperature : 25 °C ± 5 °C
2) Warm-up time: About 5 Min
3) Surrounding Humidity : 20 % ~ 80 %
4) Before White balance adjustment, Keep power on
status, don’t power off
* Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should
be within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during
5 Minutes.
2) In case of LCD, Back-light on should be checked
1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration
before adjustment.
3) Connect RS-232C Cable
4) Select mode in ADJ Program and begin a adjustment.
5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium,
Warm)
6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and n-
ish as end command “wb 00 ff”, and Adj. offset if need.
* LED White balance table
If Model is Polaris Model, G-gain x is applied.
(1) Cool Mode
1) Purpose : Especially G-gain x adjust leads to the lu-
minance enhancement. Adjust the color temperature
to reduce the deviation of the module color temperature.
2) Principle : To adjust the white balance without the
saturation, Adjust the G gain more than 172 ( If R
gain or G gain is more than 255 , G gain can adjust
less than 172 ) and change the others ( R/B Gain ).
1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
2) Principle : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to 192 (default
data) and decrease the others.
3)Adjustment mode : Two modes – Medium / Warm
4.1.6 Reference
(White Balance Adj. coordinate and color temperature)
1) Luminance: 204 Gray, 80IRE
2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
4.1.7. Reference
(White Balance Adj. coordinate and color temperature)
* The spec of color temperature and coordinate.
Color
Temperature
Luminance
(cd/m²)
*Note : x,y coordinates are drifted about 0.007 after 30 mins
heat-run. So checking color coordinate within 5-min at total
assembly line, consider x,y coordinates might be up to 0.007
than x,y target of each color temperature.
Cool9,300k°K X=0.274 (±0.03)
Medium8,000k°K X=0.290 (±0.03)
Warm6,500k°K X=0.318 (±0.03)
CoolMin : 80Typ : 110<Test Signal>
MediumMin : 80Typ : 110
WarmMin : 70Typ : 110
Y=0.278 (±0.03)
Y=0.298 (±0.03)
Y=0.334 (±0.03)
<Test Signal>
- Inner pattern
for W/B adjust
- External white
pattern
(80IRE, 204gray)
Inner pattern
(204gray,80IRE)
5. Tool Option selection
▪ Method : Press "ADJ" key on the Adjustment remote control,
then select Tool option.
6. Ship-out mode check(In-stop)
▪ After nal inspection, press "IN-STOP" key of the Adjustment
remote control and check that the unit goes to Stand-by
mode.
7. GND and Hi-pot
7.1. GND & HI-POT auto-check preparation
1) Check the POWER CABLE and SIGNAL CABE insertion
condition
7.2. GND & HI-POT auto-check
1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)
2) Connect the AV JACK Tester.
3) Controller (GWS103-4) on.
4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
2) Automatically detecting update le in USB Stick.
- If your downloaded program version in USB Stick is Low, it
didn't work. But your downloaded version is High, USB data
is automatically detecting.(Download Version High & Power
only mode, Set is automatically Download)
3) Show the message "Copying les from memory".
4) Updating is starting.
5) Updating Completed, The TV will restart automatically.
6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number)
10. Optional adjustments
10.1. Manual ADC Calibration
■ Enter ‘EZ ADJUST’ mode by pressing ‘ADJ’ key.
■ Enter Internal ADC calibration mode by pressing ‘►’ or ‘OK’
key at ‘ADC Calibration’
lGhkq|z{G
WUG{GvXGG G
XUG{GvYGG G
YUG{GvZGG G
ZUG{Gv[GG G
[UG{Gv\GG G
\UGjGnGG G
]UGhGvGG G
^UGhkjGjGG ඖG
_UG~GiGG G
`UGXWGwG~iGG G
XWUG{GwGG G
XXUGlkpkGkVsGG G
XYUGzGiVjG
XZUG{GzGzG
X[UGlUpGhG
G
G G
→ Caution : Using ‘P-ONLY’ button of the Factory SVC remo-
con when turns TV on.
10.2. Manual White balance Adjustment
10.2.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface.(80°~
100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using no signal or Full-white pattern.
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.
(3) Press ADJ key → EZ adjust using adj. R/C → White Bal-
ance then press the cursor to the right (KEY►). When
KEY(►) is pressed 216 Gray internal pattern will be
displayed.
(4) One of R Gain / G Gain / B Gain should be xed at 192,
and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj.
menu 6.White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
29MN33A
JK102
PPJ243-01
COMPONENT
[RD1]E-LUG
6B
[RD1]C-SPRING
5B
[RD1]CONTACT
4B
[WH1]C-SPRING
5A
[WH1]E-LUG
6A
[RD3]E-LUG
6G
[RD3]C-SPRING
5G
[RD3]CONTACT
4G
[WH2]C-SPRING
5F
[RD2]C-SPRING
5E
[RD2]E-LUG-S
7E
[BL]C-SPRING
5D
[GN]CONTACT
4C
[GN]C-SPRING
5C
JP108
JP107
ROUT
LOUT
RIN
LIN
COMPONENT
ZD105
SD05
ZD106
SD05
COMPONENT
COMPONENT
ZD103
SD05
ZD104
SD05
COMPONENT
COMPONENT/AV_IN/OUT
COMPONENT
R145
75
COMPONENT
R146
75
COMMON_R
COMMON_B
CONTROL Key
IR & LED
LED_B
+3.5V_ST
R126
10K
READY
R127
10K
B
KEY1
KEY2
EEP_SCL
EEP_SDA
C
Q120
MMBT3904(NXP)
E
IR
+3.5V_ST
R122
100
R123
100
R124
100
READY
R125
100
+3.5V_ST
R120
3.3K
C125
4.7uF
10V
C120
0.1uF
16V
R130
100
R121
3.3K
C122
READY
D124
5.6V
50V
100pF
20V
D126
C121
0.1uF
20V
D120
C123
READY
16V
50V
100pF
C124
1000pF
50V
20V
D127
C126
4.7uF
10V
D121
P120
12507WR-12L
1
JP120
2
JP121
3
JP122
20V
20V
D123
JP123
JP124
JP125
JP126
JP127
JP128
JP129
4
5
6
7
8
9
10
11
12
13
JP130
JP131
JK101
PPJ234-03
[GN]E-LUG
6C
33A
[YL]E-LUG
6E
[YL]O-SPRING
5E
[YL]CONTACT
4E
[WH2]O-SPRING
5D
[RD2]CONTACT
4C
[RD2]O-SPRING
5C
[RD2]E-LUG-S
7C
[WH1]O-SPRING
5B
[WH1]E-LUG-S
7B
[RD1]CONTACT
4A
[RD1]O-SPRING
5A
[RD1]E-LUG
6A
12.12.19. ESD(Add zenerDiode)
12.12.18 : ESD(Add to zener diode)
ZD101
SD05
JP101
ZD102
SD05
D103
20V
JP103
LIN
JP102
D102
20V
RIN
JP104
C103
D104
5600pF
20V
50V
READY
LOUT
JP105
C105
D105
5600pF
20V
50V
READY
ROUT
R105
220K
R102
220K
C
E
C
E
R101
75
R106
10K
R103
10K
B
Q101
MMBT3904(NXP)
B
Q103
MMBT3904(NXP)
R108
1K
R109
1K
R112
3.9K
R113
3.9K
R107
12K
R104
12K
C102
1000pF
50V
C101
1000pF
50V
C10 4
10u F
10V
C10 6
10u F
10V
AV_IN/OUT
COMMON_VIN
AUDIO_LIN
EMS Improve(12.12.28)
READY -> 1000PF
AUDIO_RIN
MNT_LOUT
MUTE_AOUT
POP NOISE
MNT_ROUT
MUTE_AOUT
POP NOISE
P101
10031HR-30
31
LVDS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
JP110
R110
10K
R111
10K
READY
READY
C112
10uF
16V
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
+3.3V_M
PANEL_VCC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT1
MN33A
INPUT1/LVDS
2012/12/19
1 7
Page 26
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
29MN33A
JK201
SPG09-DB-010
6
1
7
2
8
3
9
4
10
5
16
1.RED
2.GRN
3.BLU
4.NC
5.ST-DET
7.GNC
8.B_GND
9.G_GND
10.R_GND
11.GND
12.SDA
13.HSYNC
14.VSYNC
15.SCL
11
12
13
14
15
SHILED
RGB
RED_GND
GND_2
RED
GREEN_GND
DDC_DATA
GREEN
BLUE_GND
H_SYNC
BLUE
NC
V_SYNC
GND_1
SYNC_GND
DDC_CLOCK
DDC_GND
JP226
JP227
Change the Doide from EAH39491601 to EAF61771401
D201,D202,D203
2013.11.26
RGB
RGB
D201
JP220
JP221
JP222
JP223
JP224
JP225
READY
C201
JP228
68pF
50V
READY
C202
68pF
D205
D204
Change the Doide from EAH39491601 to EAF61771401
D204,D205,D206,D207,D208
2013.11.26
50V
D202
D206
RGB
HDMI1
R231
C
R230
10K
B
Q230
HPD
19
+5V_POWER
18
DDC/CEC_GND
17
SDA
16
SCL
15
NC
14
CEC
13
CLK-
12
CLK_SHIELD
11
CLK+
10
DATA0-
9
DATA0_SHIELD
8
DATA0+
7
DATA1-
6
DATA1_SHIELD
5
DATA1+
4
DATA2-
3
DATA2_SHIELD
2
DATA2+
1
MMBT3904(NXP)
E
RGB
RGB
R20 2
75
R20 3
75
R20 1
75
RGB
D203
D208
D207
RGB
RGB
RGB
GND_R
RGB
R208
10K
COMMON_R
DSUB_G
DSUB_HSYNC
COMMON_B
DSUB_VSYNC
DSUB_DET
DSUB_SCL
DSUB_SDA
GND_G
GND_B
C203 68pF
R21 2 22K
R21 3 22K
C204 68pF
RGB
RGB
+5V_USB
RGB
R210
4.7K
R209
4.7K
RGB
READY
C205
18pF
50V
R204
33
RGB
R205
RGB
R206
R207
33
READY
18pF
33
33
+3.5V_ST
C206
50V
HDMI1_HPD
SHIELD
20
JK203
1K
Change the Doide from EAH39491601 to EAF61771401
D200,D231
2013.11.26
HDMI1_DET
D231
Change the Doide from EAH39491601 to EAF61771401
D232,D233
2013.11.26
D232
D200
READY
R234
4.7K
READY
RCLAMP0544T.TCT
6.5VTO11.0V
18
D234
R235
10K
JP204
JP205
27
36
45
9
18
27
36
45
D235
RCLAMP0544T.TCT
6.5VTO11.0V
READY
9
D233
+5V_USB
R232
2.7K
R233
2.7K
HDMI1_CKHDMI1_CK+
HDMI1_D0HDMI1_D0+
HDMI1_D1HDMI1_D1+
HDMI1_D2HDMI1_D2+
HDMI1_SDA
HDMI1_SCL
USB
Close to SIDE_USB
1234
USB DOWN STREAM
JK701
3AU04S-305-ZC-(LG)
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT2
JP211
JP208
JP209
JP210
USB_DN
USB_DP
READY
READY
ZD221
ZD220
Change the Doide from EAH39491601 to EAF61771401
D220,D221
2013.11.26
C221
22uF
6.3V
+5V_USB
MN33A
INPUT2
2012/12/19
2 7
Page 27
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUDIO
MN33A
AUDIO
2012/12/19
3 7
Page 28
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
29MN33A
IF
B1
B1
B2
B2
0
READY
0
PAL_ISOLATOR
TU401
TDSH-G501D(B)
1
2
3
4
5
6
7
8
9
10
11
A1
A2
A2
READY
R401
R402
NC
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
IF_AGC
DIF[P]
DIF[N]
A1
B1
B1
NTSC
TU402
TDSS-H501F(B)
1
2
3
4
5
6
7
8
9
10
11
A1
12
SHIELD
NC_1
RESET
SCL
SDA
+B1[3.3V]
NC_2
+B2[1.8]
NC_3
IF_AGC
DIF[P]
DIF[N]
A1
PAL_NON_ISOLATOR
B1
B1
TU402-*1
TDSS-G501D(B)
12
SHIELD
10
11
A1
1
2
3
4
5
6
7
8
9
NC_1
RESET
SCL
SDA
3.3V
NC_2
1.8V
NC_3
IF_AGC
DLIF_[P]
DLIF_[N]
A1
R403
100
Near the pin
C405
0.1uF
16V
R411
1
C408
0.1u F
16V
R413-*1
0
PAL
R413
PAL
R414
10
Close to the tuner
+3.3V_TU
C404
22uF
6.3V
NTSC
10
NTSC
R414-*1
0
R404
100K
C401
0.1uF
16V
C402
47pF
50V
C403
47pF
50V
C407
10uF
10V
TUNER_RESET
+3.3V_TU
R408
R407
2.2K
2.2K
C410
0.1uF
16V
TUNER_SCL
TUNER_SDA
R409
1
1/10W
R410
1
1/10W
L402
BLM18PG121SN1D
R412
100
should be guarded by ground
+1.8V_M
IF_AGC
IF_P
IF_N
+3.3V_TU
C411
0.1uF
16V
Size change,0929
L401
BLM18PG121SN1D
C412
10uF
10V
+3.3V_M
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER & IR
MN33A
TUNER & IR
2012/12/19
4 7
Page 29
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MAIN SOC
C532
0.1uF
+3.3V_ST
13.01.14
C533
0.1uF
R513
100
+3.3V_ST
C534
0.1uF
C536
33pF
IF_P
READY
C551
220pF
50V
L521
100NH
READY
XTALO40XTALI
AVDD3P3_DMPLL
R514
100
C535
0.1uF
+3.3V_M
C537
33pF
Close to MSTAR
IF_N
R517
10K
IFAGC
R524
0
IF_AGC
VSS
C542
0.1uF
+1.8V_M
C541
0.022uF
16V
Close to MSTAR
VIFP44VIFM
AVDD3P3_DADC
GPIO56
GPIO6053GPIO61
AVDD_DDR
GPIO55/I2S_OUT_WS
GPIO58/I2S_OUT_SD
GPIO57/I2S_OUT_BCK
I2S_SCK
I2S_WS
I2S_SDO
TUNER_RESET
C543
0.1uF
VDDP
33
33
R52 1
R52 0
TUNER_SCL
TUNER_SDA
LVA4P57LVA4M58LVA3P59LVA3M
VDDC_1
C544
0.1uF
+1.2V_VDDC
+3.3V_ST
RXA3+
RXA3+
LVACLKP
RXA3-
RXACK+
RXA3-
RXACK+
LVA2P64LVA2M
LVACLKM
AVDD_MOD_2
RXA2+
RXACK-
RXA2+
RXACK-
C545
0.1uF
+3.3V_ST
RXA2-
RXA2-
JP501
JP502
JP503
JP504
C560
0.1uF
VCC
IC504
APX803D29
3
1
GND
R561
10K
RESET
2
R562
470
C561
4.7uF
C562
4.7uF
10V
10V
R563
POWER_DET
R564
0
C563
62K
0.1uF
16V
MN33A
MAIN SOC5 7
HW_RESET
2012/12/19
Page 30
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LED DRIVER
3
2
1
VOUT#2
JP601
JP602
C629
33uF
100V
33uF
100V
C630
R648
1/8W
R649
1/8W
C627
1M
1uF
100V
1%
C628
1M
1uF
100V
1%
MN33A
LED_Driver
2012/09/12
6 7
Page 31
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
29MN33A
19V TO ST3.3V DCDC CONVERTER
KJA-DC-1-0032
+19V
JK700
JP701
4
4
2
2
1
1
JP702
19V TO PANEL VCC(12V/5V) DCDC CONVERTER
R720
47K
C721
C720
10uF
0.1uF
25V
25V
19V TO USB 5V DCDC CONVERTER
2013.08.09
APPLY -> READY
DCM -> CCM
READY
R770
47K
+19V
C771
C770
0.1uF
10uF
25V
25V
+19V
AAM
IN
SW
GND
AAM
IN
SW
GND
IC702
MP2315GJ
1
2
NEW
3
3A
4
IC709
MP2315GJ
1
2
NEW
3
3A
4
C701
68uF
35V
+3.3V_M
8
7
6
5
8
7
6
5
C703
10uF
25V
READY
R710
10K
FB
VCC
EN/SYNC
BST
FB
VCC
EN/SYNC
BST
R701
47K
C704
0.1uF
25V
READY
R716
7.5K
20130528 cJ.LIM
R721
68
C722
0.1uF
50V
20130528 cJ.LIM
R772
68
C772
0.1uF
50V
AAM
IN
SW
GND
B
READY
R722
20K
READY
R773
20K
IC701
MP2315GJ
1
2
NEW
3
3A
4
READY
READY
C715
R711
0.1uF
33K
25V
READY
R713
5.6K
C
Q713
MMBT3904(NXP)
E
READY
READY
C724
0.47uF
16V
C723
0.1uF
25V
C777
1uF
10V
C773
0.1uF
25V
R723
4.7K
R771
20K
8
7
6
5
L720
15uH
L770
10uH
C725
10uF
C774
10uF
FB
VCC
EN/SYNC
BST
20130528 cJ.LIM
POWER_SW
16V
+3.3V_M
10V
C726
10uF
C775
10uF
R823
0
S
16V
10V
R703
68
C705
0.1uF
50V
G
Q712
AO3407A
READY
C727
0.1uF
25V
C776
0.1uF
25V
R702
100K
R704
20K
C706
0.1uF
25V
L702
10uH
C707
22uF
6.3V
20130528 cJ.LIM
C708
10uF
R705
33K
+3.5V_ST
R70 6
C709
0.1uF
5.1 K
25V
10V
R70 7
R70 8
1%
27K
1%
10K
1%
5V
ZD702
2013.08.07
5.6B->5V
READY->APPLY
** 3.5V_ST -> 1.26V VDDC
+3.5V_ST
C740
10uF
10V
R744
10K
V0 = 0.8*(1+(R2/R1))
AP7173-SPG-13 HF(DIODES)
IC704
IN
1
PG
2
VCC
3
EN
4
9
THERMAL
8
7
6
5
[EP]
OUT
FB
SS
GND
C746
560pF
50V
R741
4.7K
1%
R1
1%
R740
2.7K
+1.2V_VDDC
C742
10uF
10V
OUT:1.26V
** 3.3V_M -> 1.8V_M
IC711
+3.3V_M
C743
10uF
R714
470
D
R715
470
D711
READY
18V
C714
47uF
25V
+18V
10V
** +3.5V_ST -> 3.3V_M
+3.5V_ST
C750
0.1uF
16V
R750
10K
R747
10K
R761
R762
22K
22K
B
B
C
Q721
MMBT3904(NXP)
E
R724
33K
R774
33K
R72 5
R72 6
100 K
R72 7
10K
1%
R77 5
R77 6
R77 7
POWER_SW
P_12V
43K
1%
1%
READY
15V
ZD701
** Switch Panel-Vcc
P_12V
PANEL_ON
+5V_USB
47K
1%
33K
1%
15K
1%
5.6B
ZD700
READY
IN
C744
0.1uF
16V
C753
R748
4.7uF
33K
10V
R749
2.2K
C
Q711
MMBT3904(NXP)
E
FET Multi_DIODES_A
ZXMP3F30FHTA
C760
1uF
25V
AP1117E18G-13
3
2
OUT
C745
10uF
10V
Q710
AO3435
S
G
BOOST_EN
Q720-*1
D
S
G
FET Multi_AOS_A
ADJ/GND
1
D
FET Multi_NXP
Q720-*3
PMV48XP
S
G
FET Multi_AOS_B
Q720-*2
AO3407B
S
G
Q720
AO3407A
S
G
D
D
D
+1.8V_M
FET Multi_DIODES_B
Q720-*4
DMP2130L
D
S
G
C761
R765
0.1uF
3.3K
16V
C754
10uF
10V
READY
R766
4.7K
+3.3V_M
PANEL_VCC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
POWER
MN33A
2012/07/03
7 7POWER
Page 32
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