LG 29MT45A Schematic

Page 1
Internal Use Only
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LED TV
SERVICE MANUAL
CHASSIS :
MODEL :
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LM91X
29MT45A 29MT45A-PMP
MFL68127212 (1402-REV00)
Printed in KoreaP/NO :
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CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 8
TROUBLE SHOOTING ........................................................................... 12
BLOCK DIAGRAM .................................................................................. 23
EXPLODED VIEW .................................................................................. 24
SCHEMATIC CIRCUIT DIAGRAM ..............................................................
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AC Volt-meter
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transfo rmer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of th e circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Good Earth Ground such as WATER PIPE,
To Instrument's exposed METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
0.15µF
1.5 Kohm/10W
CONDUIT etc.
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SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unl ess sp ecified othe rwise in this service manua l, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components com monly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" compon ents. The following techniques should be used to help reduce the incide nce of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter natively, obtain and wear a comme rcially availab le discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most re pla cem ent ES dev ice s are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carp eted floor can ge ner ate st atic electricit y sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 ˚F to 600 ˚F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only un til the solder fl ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
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IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern si de of the circuit board. (Use this techniq ue onl y on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break an d loc ate the nearest component that is dir ect ly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.
Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
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SPECIFICATION
NOTE : Specications and others are subject to change without notice for improvement.
1. Application Range
This spec sheet is applied all of the TV used LM91X chassis.
2. Specication
Each part is tested as below without special appointment
1) Temperature : 25 ˚C ± 5 ˚C (77 ˚F ± 9 ˚F), CST : 40 ˚C ± 5 ˚C
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage : Standard input voltage (100 V - 240 V ~, 50 / 60 Hz)
· Standard Voltage of each products is marked by models
4) Specication and performance of each parts are followed each drawing and specication by part number in accord­ance with BOM.
5) The receiver must be operated for about 5 minutes prior to the adjustment.
3.Test method
1) Performance : LGE TV test method followed
2) Demanded other specication
- Safety : CE,IEC specication
- EMC : CE,IEC specication
4. General specication
4.1. RGB-PC
No. Item Specication Remarks 1 Supported Sync. Type Separate Sync.(RGB), SOG
2 Operating Frequency Analog
3 Operating Frequency Analog
4 Operating Environment
5 Storage Environment
Temp : 10 °C ~ 35 °C Humidity : 20 % ~ 80 %
Temp : -10 °C ~ 60 °C non condensing Humidity : 5 % ~ 90 % non condensing
4.2. TV
No. Item Specication Remarks 1 Market Central and South America 2 Broadcasting system NTSC, PAL-M, PAL-N
BAND Available Channel
3 Available Channel
4 Receiving system Upper Heterodyne 5 Video Input PAL, SECAM, NTSC Rear (1EA) 6 RGB Input RGB-PC(Analog (D-SUB 15Pin) Rear (1EA) 7 USB Input MP3, JPEG, Movie Rear (1EA) 8 AV Audio Output RF/AV/HDMI Audio Output Rear (1EA) 9 HDMI Input HDMI-DTV Rear (1EA) 10 Audio Input (1EA) AV&RGB-PC L/R Input(1EA)
VHF UHF CATV
Horizontal 30 ~ 69 kHz Vertical 56 ~ 61 Hz Max 1366 × 768 @ 60 Hz Recommend 1366 × 768 @ 60 Hz
02~13 14~69 02~125
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5. RGB Input ( PC )
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640*480 31.469 59.94 25.175
2 800*600 37.879 60.317 40.0
3 1024*768 48.363 60.0 65.0
4 1280*720 47.77 59.85 74.5
5 1152*864 54.34 60.05 80
6 1366*768 47.71 59.79 85.5
6. HDMI Input (DTV)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
Spec. out but display.2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720*480 31.47 59.94 27 SDTV 480P
5 720*480 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1280*720 37.5 50.00 74.25 HDTV 720P
10 1920*1080 28.125 50.00 74.25 HDTV 1080I
11 1920*1080 33.72 59.94 74.176 HDTV 1080I
12 1920*1080 33.75 60.00 74.25 HDTV 1080I
13 1920*1080 56.25 50.00 148.5 HDTV 1080P
14 1920*1080 67.432 59.94 148.350 HDTV 1080P
15 1920*1080 67.5 60.00 148.5 HDTV 1080P
16 1920*1080 27 24.00 74.25 HDTV 1080P
17 1920*1080 33.75 30.00 74.25 HDTV 1080P
18 1920*1080 26.97 23.97 74.25 HDTV 1080P
19 1920*1080 33.716 29.976 74.25 HDTV 1080P
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Page 8
ADJUSTMENT INSTRUCTION
1. Application Range
This spec. sheet applies to LM91X Chassis applied TV all models manufactured in TV factory
2. Specication
1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of 25 °C ± 5 °C of temperature and 65 % ± 10 % of relative humidity if there is no specic designation.
4) The input voltage of the receiver must keep AC 100-240 V~, 50/60 Hz.
5) The receiver must be operated for about 5 minutes prior to the adjustment when module is in the circumstance of over
15. In case of keeping module is in the circumstance of 0 °C, it should be placed in the circumstance of above 15 °C for 2 hours. In case of keeping module is in the circum­stance of below -20 °C, it should be placed in the circum­stance of above 15 °C for 3 hours.
[Caution] When still image is displayed for a period of 20 minutes or longer (Especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some after­image in the black level area.
3. Main PCBA Adjustments
3.1. ADC Calibration
- An ADC calibration is automatically adjusted from DFT-Jig
- If it needs to adjust manually, refer to appendix.
NO Item CMD 1CMD 2Data 0
Enter
Adjust MODE
ADC
adjust
Adjust
‘Mode In’
ADC
adjust
A A 0 0 When transfer the
A D 1 0 Automatically adjustment
‘Mode In’,
Carry the command.
3.2.3. Download method
- The EDID data is automatically saved.
3.2.4. EDID DATA
- 29MT45A(RGB-PC)
** RGB-PC : 128Bytes
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D C8 59 01 01 01 01
10 01 17 01 03 68 34 1D 78 EA 53 4D A3 56 4F 9E 26
20 0F 47 4A A1 08 00 01 40 45 40 61 40 71 40 81 00
30 81 C0 01 01 01 01 66 21 56 AA 51 00 1E 30 46 8F
40 33 00 3F 43 21 00 00 1E 00 00 00 FD 00 38 3D 1E
50 45 09 00 0A 20 20 20 20 20 20 00 00 00 FC 00 32
60 44 20 48 44 20 4C 47 20 54 56 0A 20 00 00 00 FF
70 00 0A 20 20 20 20 20 20 20 20 20 20 20 20 00 67
- 29MT45A(HDMI)
** HDMI : 256Bytes
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D CA 59 01 01 01 01
10 01 17 01 03 80 34 1D 78 EA 53 4D A3 56 4F 9E 26
20 0F 47 4A 21 08 00 81 80 81 C0 71 40 B3 00 81 40
30 90 40 95 00 A9 C0 66 21 56 AA 51 00 1E 30 46 8F
40 33 00 09 25 21 00 00 1A 02 3A 80 18 71 38 2D 40
50 58 2C 45 00 09 25 21 00 00 1E 00 00 00 FD 00 38
60 3D 1E 45 0F 00 0A 20 20 20 20 20 20 00 00 00 FC
70 00 32 44 20 48 44 20 4C 47 20 54 56 0A 20 01 30
80 02 03 21 F1 4F 84 05 03 02 20 22 10 11 13 12 14
90 1F 07 16 01 26 11 07 50 09 7F 07 65 03 0C 00 10
A0 00 02 3A 80 18 71 38 2D 40 58 2C 45 00 09 25 21
B0 00 00 1A 01 1D 80 18 71 1C 16 20 58 2C 25 00 09
C0 25 21 00 00 9E 01 1D 00 72 51 D0 1E 20 6E 28 55
D0 00 09 25 21 00 00 1E 01 1D 80 D0 72 1C 16 20 10
E0 2C 25 80 09 25 21 00 00 9E 02 3A 80 D0 72 38 2D
F0 40 10 2C 45 20 09 25 21 00 00 1E 00 00 00 00 6F
* ADC Calibration Protocol (RS-232)
Adjust Sequence ▪aa 00 00 [Enter Adjust Mode] ▪xb 00 60 [RGB Input (1024*768)] ▪ad 00 10 [Adjust 1024*768 RGB] ▪aa 00 90 End Adjust mode
3.2. EDID Download
3.2.1. Overview
- It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.
3.2.2. Equipment
- Since EDID data is embedded, EDID download JIG, HDMI
cable and D-sub cable are not need.
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4. Final Assembly Adjustment
4.1. White Balance Adjustment
4.1.1. Overview
▪ W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel's W/B deviation (2) How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is xed at 192, and the other two is lowered to nd the desired value.
(3) Adjustment condition : normal temperature
1) Surrounding Temperature : 25 °C ± 5 °C
2) Warm-up time: About 5 Min
3) Surrounding Humidity : 20 % ~ 80 %
4) Before White balance adjustment, Keep power on
status, don’t power off * Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should
be within 10cm and perpendicular of the module surface (80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during
5 Minutes.
2) In case of LCD, Back-light on should be checked
using no signal or Full-white pattern.
4.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/204-
Gray(Model: 217, Pattern: 49) * Color Analyzer Matrix should be calibrated using CS-1000
4.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMD ID DATA
wb 00 00 Begin White Balance adjustment
wb 00 ff
End White Balance adjustment (internal pattern disappears )
(2) Adjustment Map
Command
(lower caseASCII)
CMD1 CMD2 MIN MAX
Cool
Medium
Warm
Adj. item
R Gain j g 00 C0
G Gain j h 00 C0
B Gain j i 00 C0
R Cut
G Cut
B Cut
R Gain j a 00 C0
G Gain j b 00 C0
B Gain j c 00 C0
R Cut
G Cut
B Cut
R Gain j d 00 C0
G Gain j e 00 C0
B Gain j f 00 C0
R Cut
G Cut
Explantion
Data Range
(Hex.)
Default
(Decimal)
4.1.3. Equipment connection
Co lor Ana ly ze r
Pro be
DFT JIG
RRGB Cabl e S -23 2C
Signal S ourc e
* If TV internal pattern is used, not needed
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Co m pu ter
Patt er n G en erat or
RS-23 2C
RS-23 2C
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Page 10
4.1.5. Adj. method
*Auto WB calibration
1) Set TV in ADJ mode using P-ONLY key (or POWER ON
key)
2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration
before adjustment.
3) Connect RS-232C Cable
4) Select mode in ADJ Program and begin a adjustment.
5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium, Warm)
6) Remove probe and RS-232C cable. ▪ W/B Adj. must begin as start command “wb 00 00” , and n-
ish as end command “wb 00 ff”, and Adj. offset if need.
* LED White balance table If Model is Polaris Model, G-gain x is applied. (1) Cool Mode
1) Purpose : Especially G-gain x adjust leads to the lu-
minance enhancement. Adjust the color temperature to reduce the deviation of the module color tempera­ture.
2) Principle : To adjust the white balance without the
saturation, Adjust the G gain more than 172 ( If R gain or G gain is more than 255 , G gain can adjust less than 172 ) and change the others ( R/B Gain ).
3) Adjustment mode : mode – Cool (2) Medium / Warm Mode
1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
2) Principle : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others.
3)Adjustment mode : Two modes – Medium / Warm
4.1.6 Reference
(White Balance Adj. coordinate and color temperature)
1) Luminance: 204 Gray, 80IRE
2) Standard color coordinate and temperature using CS-1000
(over 26 inch)
4.1.7. Reference
(White Balance Adj. coordinate and color temperature)
* The spec of color temperature and coordinate.
Color Temperature
Luminance (cd/m²)
*Note : x,y coordinates are drifted about 0.007 after 30 mins heat-run. So checking color coordinate within 5-min at total assembly line, consider x,y coordinates might be up to 0.007 than x,y target of each color temperature.
Cool 9,300k °K X=0.274 (±0.03)
Medium 8,000k °K X=0.290 (±0.03)
Warm 6,500k °K X=0.318 (±0.03)
Cool Min : 80 Typ : 110 <Test Signal>
Medium Min : 80 Typ : 110
Warm Min : 70 Typ : 110
Y=0.278 (±0.03)
Y=0.298 (±0.03)
Y=0.334 (±0.03)
<Test Signal>
- Inner pattern for W/B adjust
- External white pattern
(80IRE, 204gray)
Inner pattern (204gray,80IRE)
5. Tool Option selection
▪ Method : Press "ADJ" key on the Adjustment remote control,
then select Tool option.
6. Ship-out mode check(In-stop)
▪ After nal inspection, press "IN-STOP" key of the Adjustment
remote control and check that the unit goes to Stand-by mode.
7. GND and Hi-pot
7.1. GND & HI-POT auto-check preparation
1) Check the POWER CABLE and SIGNAL CABE insertion condition
7.2. GND & HI-POT auto-check
1) Pallet moves in the station. (POWER CORD / AV CORD is tightly inserted)
2) Connect the AV JACK Tester.
3) Controller (GWS103-4) on.
4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
7.3. Checkpoint
1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
2) TEST time: 1 second
3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CA-
BLE GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEU-
TRAL.
4) LEAKAGE CURRENT: At 0.5mArms
8. Audio
Measurement condition:
1) RF input: Mono, 1 KHz sine wave signal, 100 % Modulation
2) CVBS, Component: 1 KHz sine wave signal 0.5 Vrms
3) RGB PC: 1 KHz sine wave signal 0.7 Vrms
No. Item Min Typ Max Unit Remark
Audio practical max Output, L/R
1
(Distortion=10% max Output)
4.5 5.0 6.0WVrms
(1) Measurement condition
- EQ/AVL/Clear Voice: Off (2) Speaker(8Ω Impedance)
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 10 -
LGE Internal Use Only
Page 11
9. USB S/W Download(Service only)
1) Put the USB Stick to the USB socket.
2) Automatically detecting update le in USB Stick.
- If your downloaded program version in USB Stick is Low, it didn't work. But your downloaded version is High, USB data is automatically detecting.(Download Version High & Power only mode, Set is automatically Download)
3) Show the message "Copying les from memory".
4) Updating is starting.
5) Updating Completed, The TV will restart automatically.
6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ ATV test on production line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote control.
2) Select "Tool Option 1" and push "OK" key.
3) Punch in the number. (Each model has their number)
10. Optional adjustments
10.1. Manual ADC Calibration
■ Enter ‘EZ ADJUST’ mode by pressing ‘ADJ’ key.
■ Enter Internal ADC calibration mode by pressing ‘►’ or ‘OK’ key at ‘ADC Calibration’
lGhkq|z{G
WUG{GvXG G G
XUG{GvYG G G
YUG{GvZG G G
ZUG{Gv[G G G
[UG{Gv\G G G
\UGjGnG G G
]UGhGvG G G
^UGhkjGjG G ඖG
_UG~GiG G G
`UGXWGwG~iG G G
XWUG{GwG G G
XXUGlkpkGkVsG G G
XYUGzGiVjG
XZUG{GzGzG
X[UGlUpGhG
G
G G
→ Caution : Using ‘P-ONLY’ button of the Factory SVC remo-
con when turns TV on.
10.2. Manual White balance Adjustment
10.2.1. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface.(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5 Minutes.
2) In case of LCD, Back-light on should be checked us­ing no signal or Full-white pattern.
10.2.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is
needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/216-Gray (Model: 217, Pattern: 78)
hkjGjG
h
kjGjG[_WG vrG
hkjGjGXW_WG vrG
hkjGyniG vrG
G zG yG
G
G
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
10.2.3. Adjustment
(1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface. (3) Press ADJ key → EZ adjust using adj. R/C → White Bal-
ance then press the cursor to the right (KEY►). When
KEY(►) is pressed 216 Gray internal pattern will be
displayed. (4) One of R Gain / G Gain / B Gain should be xed at 192,
and the rest will be lowered to meet the desired value. (5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu 6.White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner(ON). By selecting OFF, you can adjust using RF signal in 216 Gray pattern.
- 11 -
LGE Internal Use Only
Page 12
1. NO POWER-Main PCBA
Is Adapter
Output VOLTAGE 19.4V
through of JK700?
NO POWER
Is 3.3V at C708?
Check waveform of X501
YES
NO
YES
NO
YES
check open or short at Line.
or change Adapter.
check the Lines of IC701,
If there is any problem at Line,
Change IC701
NO
Check Line short or open between
IC501 and X501,
Change IC501 or change X501
1
2
4
Is 1.8V at C745?
is 1.25V at C742?
3
YES
check the Lines of IC711,IC704
If there is any problem at Line,
Change IC704,IC706.
NO
Insert F/W
is 3.3V at 1pin of P120?
when push power key,
Is 0v at 2pin of P120?
Change control
Or check Line short or open of P120
5
is there any waver at 11pin of P120,
when use remote controller?
6
NO
YES
change IR board
Or check Line short or open of P120
NO
4
X501
TROUBLE SHOOTING
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 12 -
LGE Internal Use Only
Page 13
2. No raster (Power LED blue, black screen)
Is 19.4V at JK700?
NO RASTER
(Screen is not displayed)
Insert the F/W back
or REPLACE LCD MODULE
Is 1.8V at L501?
Is 1.25V at L500?
Is 1.25V at 4pin of IC704?
Is 1.8V at 2pin of IC711?
YES
NO
YES
NO
YES
Check Line short or open between
IC711/IC704 and IC501,
If there is any problem at Line,
Change IC711/IC704 or change IC501
NO
check open or short at Line and wafer
between IC704,IC711 and IC600.
If there is any problem at Line,
Change IC704,IC711 or IC501
1
2
is 3V at 1pin of IC600?
YES
It is not over 3V at 1pin of IC600.
Change Q601.
Or check Line short or open between
R602 and 95pin of IC501.
Change IC 501.
4
3
NO
check open or short at Line.
or change Adapter
is 12V at 1pin of P101?
If is not under 1.5V at R722,
change Q721 or check open and short
of Line among Q720 and Q721.
If is under 11V at L110,
Check open and short
Of line between L110 and P101.
7
NO
Put into LVDS cable completely?
LVDS cable have damage?
NO
If LVDS cable isn’t insulted enough,
Insult LVDS cable until locking hook.
If LVDS cable have damage,
Change LVDS cable
6
YES
YES
is 2V at 3pin of IC901?
It is not over 2V at 3Pin of IC901.
Change IC901.
5
NO
YES
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 13 -
LGE Internal Use Only
Page 14
3. Abnormal/No screen (All input)-Main PCBA
Put into LVDS cable completely?
LVDS cable have damage?
Abnormal/No screen
(all input)
Check waveform at signal
line of P101 (Clock:9,10
Data: 6,7,12,13,15,16,18,19)
YES
NO
YES
NO
YES
If LVDS cable isn’t insulted enough,
Insult LVDS cable until locking hook.
If LVDS cable have damage,
Change LVDS cable
1
Change module
WAVEFORMS
3
Is 12V at 1pin of P101?
If is not under 1.5V at R722,
change Q721 or check open and short
of Line among Q720 and Q721.
If is under 11V at L110,
Check open and short
Of line between L110 and P101.
2
3
NO
Check open and short
Of line between Q720 and P101.
Or Check LVDS cable have damage.
Another is change IC501.
6,7,12,13,15,16,18,19 Pin of 1201
(Data Line)
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 14 -
LGE Internal Use Only
Page 15
4. Abnormal screen (TV)-Main PCBA
Put into RF cable completely?
Abnormal screen (TV)
YES
NO
NO
insult RF cable tight and then
Cable nut screw tight.
1
Change Main PCBA
WAVEFORMS
Is 1.8V at 7pin of TU401?
2
Is I2C waveform
At 3,4pin of TU401?
3
4
Is IF waveform at 43
,44 pin of IC501?
NO
NO
3
3Pin of TU401 (SCL)
4Pin of TU401 (SDA)
4
43,44pin of IC501
If 1.7V is not at plus pin of TU401, check
It is over 3V at 2pin of IC401,
if it is not, Check Line between TU401
and IC401 is open or short.
Another is change IC401 or TU401
Check Line between TU401 and IC501
is open or short, Another is change
IC501 or TU401
Check Line between TU401 and IC501
is open or short, Another is change
IC501 or TU401
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
LGE Internal Use Only
Page 16
5. Abnormal screen (AV)-Main PCBA
Put into AV cable completely?
Abnormal screen (AV)
YES
NO
NO
Insult AV cable tight
1
Change IC501
WAVEFORMS
Is Input signal timing
and format in spec?
Change Timing to 480I, 576I
Or change format CVBS
2
Is waveform at R505
3
Check Line between JK101 and IC501
is open or short, Another is
change AV cable
NO
YES
YES
R505 (CVBS)
3
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 16 -
LGE Internal Use Only
Page 17
6. Abnormal screen (RGB PC)-Main PCBA
Put into RGB
cable completely?
Abnormal screen (RGB PC)
YES
NO
NO
insult RGB cable tight
1
Change IC501
WAVEFORMS
Is Input signal timing
and format in spec?
Change Timing according to
product spec, Or change format to RGB
2
Is waveform at R501
R502, R504
3
Check Line between JK201 and IC501
is open or short, Another is
Change RGB cable
NO
YES
YES
3
R502(G)
R604(R)
R601(B)
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 17 -
LGE Internal Use Only
Page 18
7. Abnormal screen (HDMI)-Main PCBA
Put into HDMI
cable completely?
Abnormal screen (HDMI)
YES
NO
NO
insulted HDMI cable
1
Change IC501
Is Input signal timing
and format in spec?
Change Timing according to product spec, change format
under 8 bit in Ycbcr, Ypbpr, RGB
2
Is waveform at 10,12pin
of JK204?
3
Check Line between JK204 and IC501
is open or short, Another is
Change HDMI cable
NO
YES
YES
Is waveform at 1,3,4,6,7,9pin
Of JK204?
YES
4
Check Line between JK204 and IC501
is open or short, Another is
Change HDMI cable
NO
Can read EDID and
HDCP key though
16,15pin of JK204
Check Line between JK204 and IC501
is open or short, Another is
Change HDMI cable
YES
Is 5V at 19pin of JK204?
Check Line between JK204 and IC501
is open or short, Another is
Change IC501 or HDMI cable
5
YES
6
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 18 -
LGE Internal Use Only
Page 19
8. No sound (all source )-Main PCBA
Does wire connect P301 with speaker?
NO sound (All source)
YES
NO
YES
NO
YES
Connect wire between P301 and speaker.
1
Change speaker and wire
Is 19.4V at 19,20,31,32pin
of IC301 ?
If 8V is not plus at L703, check
of JK700 is open.
If is not Check Line between L703
and IC301 is open or short.
.Another is change IC301
2
NO
Is 3.3V at 40pin of IC301?
If 3V is not plus 30pin of IC301,
check It is over 3V at L301
if it is not, Check Line between L301
and IC301 is open or short.
Another is change IC701,IC301
NO
3
4
YES
Is I2C waveform at
10,11pin of IC301?
Check Line between IC301 and IC501
is open or short, Another is change
IC301 or IC501.
NO
5
Is I2S waveform at
R301,R302,R303,R304?
6
Check Line between IC301 and IC501
is open or short, Another is change
IC301 or IC501.
YES
Is there any waveform P301?
Check Line between IC301 and P301
is open or short. And then check resistance
of speaker is under 4ohm.
Another is change IC301
NO
4
10pin of IC301
11pin of IC301
5
R301(SDO)
R302(WS) R303(SCK)
5
R304(MCLK)
6
1pin of P301(Audio out)
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 19 -
LGE Internal Use Only
Page 20
9. Abnormal sound (TV)-Main PCBA
Put into RF cable completely?
Abnormal sound (TV)
YES
NO
insult RF cable tight and then
Cable nut screw tight.
1
2
3
4
NO
Change Main PCBA
WAVEFORMS
Is 1.8V at 7pin of TU401?
Is I2C waveform
At 3,4pin of TU401?
Is IF waveform at 43
,44 pin of IC501?
NO
NO
3
3Pin of TU401 (SCL)
4Pin of TU401 (SDA)
4
43,44pin of IC501
If 1.7V is not at plus pin of TU401, check
It is over 3V at 2pin of IC401,
if it is not, Check Line between TU401
and IC401 is open or short.
Another is change IC401 or TU401
Check Line between TU401 and IC501
is open or short, Another is change
IC501 or TU401
Check Line between TU401 and IC501
is open or short, Another is change
IC501 or TU401
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 20 -
LGE Internal Use Only
Page 21
10. Abnormal sound (AV)-Main PCBA
Put into AV cable completely?
Abnormal sound (AV)
YES
NO
Insult AV cable tight
1
Change IC501
WAVEFORMS
Is waveform at C520,C521
2
Check Line between JK101 and IC501
is open or short, Another is
change AV cable
NO
YES
C520,C521(audio in)
2
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 21 -
LGE Internal Use Only
Page 22
11. Abnormal sound (HDMI)-Main PCBA
Abnormal sound (HDMI)
Put into HDMI
cable completely?
YES
NO
NO
insulted HDMI cable
1
Change IC501
Is Input signal timing
and format in spec?
Change Timing according to
product spec, change format
under 8 bit in Ycbcr, Ypbpr, RGB
2
Is waveform at 10,12pin
of JK204?
3
Check Line between JK204 and IC501
is open or short, Another is
Change HDMI cable
NO
YES
YES
Is waveform at 1,3,4,6,7,9pin
Of JK204?
YES
4
Check Line between JK204 and IC501
is open or short, Another is
Change HDMI cable
NO
Can read EDID and
HDCP key though
16,15pin of JK204
Check Line between JK204 and IC501
is open or short, Another is
Change HDMI cable
YES
Is 5V at 19pin of JK204?
Check Line between JK204 and IC501
is open or short, Another is
Change IC501 or HDMI cable
5
YES
6
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 22 -
LGE Internal Use Only
Page 23
BLOCK DIAGRAM
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 23 -
LGE Internal Use Only
Page 24
535
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
910
900
400
LV1
A2
200
300
540
820
120
800
511
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 24 -
302
510
501
LGE Internal Use Only
Page 25
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
29MN33A
JK102
PPJ243-01
COMPONENT
[RD1]E-LUG
6B
[RD1]C-SPRING
5B
[RD1]CONTACT
4B
[WH1]C-SPRING
5A
[WH1]E-LUG
6A
[RD3]E-LUG
6G
[RD3]C-SPRING
5G
[RD3]CONTACT
4G
[WH2]C-SPRING
5F
[RD2]C-SPRING
5E
[RD2]E-LUG-S
7E
[BL]C-SPRING
5D
[GN]CONTACT
4C
[GN]C-SPRING
5C
JP108
JP107
ROUT
LOUT
RIN
LIN
COMPONENT
ZD105
SD05
ZD106
SD05
COMPONENT
COMPONENT
ZD103
SD05
ZD104
SD05
COMPONENT
COMPONENT/AV_IN/OUT
COMPONENT
R145
75
COMPONENT
R146
75
COMMON_R
COMMON_B
CONTROL Key
IR & LED
LED_B
+3.5V_ST
R126 10K
READY R127
10K
B
KEY1
KEY2
EEP_SCL
EEP_SDA
C
Q120 MMBT3904(NXP)
E
IR
+3.5V_ST
R122 100
R123 100
R124 100
READY R125 100
+3.5V_ST
R120
3.3K
C125
4.7uF 10V
C120
0.1uF 16V
R130 100
R121
3.3K
C122
READY
D124
5.6V
50V
100pF
20V
D126
C121
0.1uF
20V
D120
C123
READY
16V
50V
100pF
C124 1000pF 50V
20V
D127
C126
4.7uF 10V
D121
P120
12507WR-12L
1
JP120
2
JP121
3
JP122
20V
20V
D123
JP123
JP124
JP125
JP126
JP127
JP128
JP129
4
5
6
7
8
9
10
11
12
13
JP130
JP131
JK101
PPJ234-03
[GN]E-LUG
6C
33A
[YL]E-LUG
6E
[YL]O-SPRING
5E
[YL]CONTACT
4E
[WH2]O-SPRING
5D
[RD2]CONTACT
4C
[RD2]O-SPRING
5C
[RD2]E-LUG-S
7C
[WH1]O-SPRING
5B
[WH1]E-LUG-S
7B
[RD1]CONTACT
4A
[RD1]O-SPRING
5A
[RD1]E-LUG
6A
12.12.19. ESD(Add zenerDiode)
12.12.18 : ESD(Add to zener diode)
ZD101 SD05
JP101
ZD102 SD05
D103
20V
JP103
LIN
JP102
D102 20V
RIN
JP104
C103
D104
5600pF
20V
50V
READY
LOUT
JP105
C105
D105
5600pF
20V
50V
READY
ROUT
R105 220K
R102 220K
C E
C E
R101 75
R106
10K
R103
10K
B
Q101
MMBT3904(NXP)
B
Q103
MMBT3904(NXP)
R108
1K
R109
1K
R112
3.9K
R113
3.9K
R107 12K
R104
12K
C102 1000pF 50V
C101 1000pF 50V
C10 4
10u F
10V
C10 6 10u F
10V
AV_IN/OUT
COMMON_VIN
AUDIO_LIN
EMS Improve(12.12.28)
READY -> 1000PF
AUDIO_RIN
MNT_LOUT
MUTE_AOUT
POP NOISE
MNT_ROUT
MUTE_AOUT
POP NOISE
P101
10031HR-30
31
LVDS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
JP110
R110 10K
R111
10K
READY
READY C112 10uF 16V
RXA3+ RXA3-
RXACK+ RXACK-
RXA2+ RXA2-
RXA1+ RXA1-
RXA0+ RXA0-
+3.3V_M
PANEL_VCC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT1
MN33A
INPUT1/LVDS
2012/12/19
1 7
Page 26
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
29MN33A
JK201 SPG09-DB-010
6
1
7
2
8
3
9
4
10
5
16
1.RED
2.GRN
3.BLU
4.NC
5.ST-DET
7.GNC
8.B_GND
9.G_GND
10.R_GND
11.GND
12.SDA
13.HSYNC
14.VSYNC
15.SCL
11
12
13
14
15
SHILED
RGB
RED_GND GND_2 RED GREEN_GND DDC_DATA GREEN BLUE_GND H_SYNC BLUE NC V_SYNC GND_1 SYNC_GND DDC_CLOCK DDC_GND
JP226
JP227
Change the Doide from EAH39491601 to EAF61771401 D201,D202,D203
2013.11.26
RGB
RGB
D201
JP220
JP221
JP222
JP223
JP224
JP225
READY
C201
JP228
68pF 50V
READY
C202
68pF
D205
D204
Change the Doide from EAH39491601 to EAF61771401 D204,D205,D206,D207,D208
2013.11.26
50V
D202
D206
RGB
HDMI1
R231
C
R230 10K
B
Q230
HPD
19
+5V_POWER
18
DDC/CEC_GND
17
SDA
16
SCL
15
NC
14
CEC
13
CLK-
12
CLK_SHIELD
11
CLK+
10
DATA0-
9
DATA0_SHIELD
8
DATA0+
7
DATA1-
6
DATA1_SHIELD
5
DATA1+
4
DATA2-
3
DATA2_SHIELD
2
DATA2+
1
MMBT3904(NXP)
E
RGB
RGB
R20 2
75
R20 3
75
R20 1
75
RGB
D203
D208
D207
RGB
RGB
RGB
GND_R
RGB R208
10K
COMMON_R
DSUB_G
DSUB_HSYNC
COMMON_B
DSUB_VSYNC
DSUB_DET
DSUB_SCL
DSUB_SDA
GND_G
GND_B
C203 68pF
R21 2 22K
R21 3 22K
C204 68pF
RGB
RGB
+5V_USB
RGB
R210
4.7K
R209
4.7K
RGB
READY C205 18pF
50V
R204 33
RGB
R205
RGB
R206
R207 33
READY
18pF
33
33
+3.5V_ST
C206
50V
HDMI1_HPD
SHIELD
20
JK203
1K
Change the Doide from EAH39491601 to EAF61771401 D200,D231
2013.11.26
HDMI1_DET
D231
Change the Doide from EAH39491601 to EAF61771401 D232,D233
2013.11.26
D232
D200
READY
R234
4.7K
READY
RCLAMP0544T.TCT
6.5VTO11.0V
1 8
D234
R235 10K
JP204
JP205
2 7 3 6 4 5
9
1 8 2 7 3 6 4 5
D235
RCLAMP0544T.TCT
6.5VTO11.0V
READY
9
D233
+5V_USB
R232
2.7K
R233
2.7K
HDMI1_CK­HDMI1_CK+ HDMI1_D0­HDMI1_D0+
HDMI1_D1­HDMI1_D1+ HDMI1_D2­HDMI1_D2+
HDMI1_SDA HDMI1_SCL
USB
Close to SIDE_USB
1234
USB DOWN STREAM
JK701
3AU04S-305-ZC-(LG)
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INPUT2
JP211
JP208
JP209
JP210
USB_DN
USB_DP
READY
READY
ZD221
ZD220
Change the Doide from EAH39491601 to EAF61771401 D220,D221
2013.11.26
C221 22uF
6.3V
+5V_USB
MN33A
INPUT2
2012/12/19
2 7
Page 27
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
29MN33A
I2S_SDO
I2S_WS
I2S_SCK
AUAMP_SDA
AUAMP_SCL
+3.3V_M
R308
4.7K
R309
4.7K
READY
C305 33pF 50V
READY C302
0.1uF 25V
READY C306 33pF 50V
+3.3V_M
C303 1uF 10V
R301 100
R302 100
R303 100
C301
0.1uF 16V
SW_RESET
I2S_MCLK
C321 10uF 10V
AGND_PLL
VDD_PLL
DGND_PLL
GND DGND DVDD
SDATA
WCK
BCK
SDA
C320
1000pF
50V
R304 100
VDD_IO
[EP]GND
40
1 2
THERMAL
3 4 5 6 7 8 9 10
11
SCL
AD38CLK_I
GND_IO
39
41
12
13
FAULT
MONITOR_0
MONITOR_1
50V
C319
BST1A
RESET
35
36
37
IC301
NTP7513
0x54
14
15
16
BST2B
MONITOR_2
C308
22000pF
50V
22000pF
OUT1A
PGND1A
33
34
17
18
OUT2B
PGND2B
PVDD1B
PVDD1A
31
32
30 29 28 27 26 25 24 23 22 21
19
PVDD2B20PVDD2A
+19V
C318
0.1uF 25V
OUT1B PGND1B BST1B VDR1 VCC5 AGND VDR2 BST2A PGND2A OUT2A
C317 10uF 25V
+19V
309
C
0.1 uF 25V
C310 10uF 25V
C348 10uF 25V
C349 10uF 25V
C315 22000pF 50V
C311 22000pF 50V
C31 2 1uF 10V
1uF 10V
C31 3
R313
12
C325 390pF
50V C326
390pF
50V
R315
12
R317
12
C327 390pF
50V
C328 390pF 50V
R319
12
C314 1uF 10V
R314
12
R316
12
R318
12
R320
L303 10uH
C329
0.47uF
L304 10uH
L305 10uH
L306
12
10uH
50V
C333
0.47uF 50V
C330
0.1uF 50V
C331
0.1uF 50V
C334
0.1uF 50V
C335
0.1uF 50V
R322
4.7K
R323
4.7K
R324
4.7K
R325
4.7K
SPK_L+
SPEAKER_L
SPK_L-
SPK_L+ SPK_L­SPK_R+ SPK_R-
SPK_R+
SPEAKER_R
SPK_R-
JP304
JP303
JP302
JP301
SPK_L+
SPK_L-
SPK_R+
SPK_R-
4
3
2
1 .
SMAW250-H04R
P301
POWER_DET
AUDIO_OUT AMP : GAIN X 4
IC341
AS324MTR-E1
MNT_LOUT
MNT_ROUT
C341
0.1uF 25V
C346
0.1uF 25V
+18V
Q341 MMBT3904(NXP)
C
B
E
R341
4.7K
MNT_L_AMP
MNT_R_AMP
+18V
Q342 MMBT3904(NXP)
C
B
E
R34 8
4.7 K
R342 1K
C342
0.0068uF 50V
R349
C347
0.0068uF 50V
1K
10K
R343
33pF 50V
C343
R345 5.6K
R346 5.6K
33pF
C345
R347
10K
+18V
50V
R344
6.8K
C344
0.1uF 25V
R350
6.8K
1 OUT1
2 INPUT1-
3 INPUT1+
4 VCC
5 INPUT2+
6 INPUT2-
7 OUT2 8OUT3
14OUT4
13INPUT4-
12INPUT4+
11GND
10INPUT3+
9INPUT3-
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUDIO
MN33A
AUDIO
2012/12/19
3 7
Page 28
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
29MN33A
IF
B1
B1
B2
B2
0
READY 0
PAL_ISOLATOR
TU401 TDSH-G501D(B)
1
2
3
4
5
6
7
8
9
10
11
A1
A2
A2
READY
R401
R402
NC
RESET
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
IF_AGC
DIF[P]
DIF[N]
A1
B1
B1
NTSC TU402
TDSS-H501F(B)
1
2
3
4
5
6
7
8
9
10
11
A1
12
SHIELD
NC_1
RESET
SCL
SDA
+B1[3.3V]
NC_2
+B2[1.8]
NC_3
IF_AGC
DIF[P]
DIF[N]
A1
PAL_NON_ISOLATOR
B1
B1
TU402-*1 TDSS-G501D(B)
12
SHIELD
10
11
A1
1
2
3
4
5
6
7
8
9
NC_1
RESET
SCL
SDA
3.3V
NC_2
1.8V
NC_3
IF_AGC
DLIF_[P]
DLIF_[N]
A1
R403 100
Near the pin
C405
0.1uF 16V
R411
1
C408
0.1u F 16V
R413-*1 0
PAL
R413
PAL
R414
10
Close to the tuner
+3.3V_TU
C404 22uF
6.3V
NTSC
10
NTSC R414-*1 0
R404 100K
C401
0.1uF 16V
C402 47pF 50V
C403 47pF 50V
C407 10uF 10V
TUNER_RESET
+3.3V_TU
R408
R407
2.2K
2.2K
C410
0.1uF 16V
TUNER_SCL
TUNER_SDA
R409
1
1/10W
R410
1
1/10W
L402
BLM18PG121SN1D
R412 100
should be guarded by ground
+1.8V_M
IF_AGC
IF_P
IF_N
+3.3V_TU
C411
0.1uF 16V
Size change,0929
L401
BLM18PG121SN1D
C412 10uF 10V
+3.3V_M
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TUNER & IR
MN33A
TUNER & IR
2012/12/19
4 7
Page 29
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
29MN33A
HDMI1_SCL
HDMI1_D2-
HDMI1_D2+
+3.3V_ST
C505
0.1uF
+3.3V_ST
DSUB_HSYNC
COMMON_B
DSUB_G
COMPONENT
R515
0
COMMON_R
C522
220pF
C523 220pF
DSUB_VSYNC
R506
33
R510 220K
R511 220K
C513
0.047uF
COMMON_VIN
MNT_L_AMP
MNT_R_AMP
C512
4.7uF
R523
470
R502
33
AUDIO_LIN
AUDIO_RIN
+1.2V_VDDC
10V
C509 1000pF
C510
0.047uF
C507
0.1uF
R501
33
R504
C550
0.047uF
33
+3.3V_ST
L506
120-ohm
C520 2.2uF
C521 2.2uF
R508
100
R509
100
R500
33
C506
0.1uF
AVDD3P3_ADC
C508
0.047uF
R503
68
R507
68
C515
0.1uF
C516 10uF 16V
DDCDD_CK
RX2N_D RX2P_D
HOTPLUG_A
RXCKN_A RXCKP_A
RX0N_A RX0P_A
AVDD_MOD_1
RX1N_A RX1P_A
DDCDA_DA
RX2N_A RX2P_A
DDCDA_CK
HSYNC1
BIN1P
SOGIN1
GIN1P
C511
GIN1M
0.047uF
RIN1P
VSYNC1
CVBS1 CVBS0
C514
0.047uF
VCOM
CVBSOUT1
AVDD_AU33
AUREF
C517
0.1uF
LINEIN_L1 LINEIN_R1 LINEIN_L3 LINEIN_R3 LINEOUTL3 LINEOUTR3
ARC VDD
VAG
[EP]
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
HDMI1_D1-
HDMI1_D1+
RX1N_D
RX1P_D
127
128
HDMI1_SDA
HDMI1_D0-
HDMI1_D0+
33
R505
RX0N_D
RX0P_D
DDCDD_DA
124
125
126
HDMI1_CK+
HDMI1_CK-
HOTPLUG_D
RXCKN_D
RXCKP_D
121
122
123
HDMI1_HPD
GND
120
HWRESET
HW_RESET
C553
0.1uF
CEC
118
119
MUTE_AOUT
IR
R518
100
R546
100
GPIO70
IRIN
117
4.7K
116
THERMAL
129
IC501
LGE6841 (ATV_13)
39
41
42
43
45
46
47
48
49
50
51
SW_RESET
AUAMP_SCL
+3.3V_ST
R519
AUAMP_SDA
I2S_MCLK
KEY2
KEY1
R542
R54 4
33
R54 3
33
R541
100
R545 100
SAR3/GPIO72
GPIO68
GPIO69/I2S_OUT_MCK
113
114
115
52
54
100
SAR0/GPIO75
SAR1/GPIO74
SAR2/GPIO73
110
111
112
55
56
LED_B
DSUB_SDA
+1.8V_M
C549
R540
R537
1K
22
DDCA_DA
GPIO67
107
108
60
R536
22
DDCA_CK
106
61
0.1uF
AVDD_DDR_2
109
PWM_DIM
BLU_CURRENT_CTL
DSUB_SCL
C552
2.2uF
READY
1K
R535
READY
R531 10K
R534
1K
R533
0
TESTPIN
PWM0/GPIO26
PWM1/GPIO25
103
104
105
102 101 100
99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65
62
63
GPIO64 GPIO63 AVDD_MOD_4 USB0_DP USB0_DM SPI_CZ SPI_DO SPI_DI SPI_CK PWM3/GPIO25 PWM2/GPIO24 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 INT/GPIO65 VDDC_2 LVB0M LVB0P LVB1M LVB1P AVDD_MOD_3 LVB2M LVB2P LVBCKM LVBCKP LVB3M LVB3P LVB4M LVB4P LVA0M LVA0P LVA1M LVA1P
*H/W OPTION
HW_OPT
READY
R522
100
C548
0.1uF
R549
READY
33
READY
R547
10K
R527
10K
R529
100
R526 33
R525 33
R516
100
+1.2V_VDDC
C547
0.1uF
RXA0-
RXA0-
RXA0+
RXA0+
RXA1-
RXA1-
RXA1+
RXA1+
INV_ON
+3.3V_ST
C546
0.1uF
HD
LOW
+3.3V_M
FHD
R550
4.7K
HD
R551
4.7K
+3.3V_ST
USB_DP
USB_DN
SPI_CZ
SPI_DO
SPI_DI
SPI_CLK
FLASH_WP
HDMI1_DET
POWER_SW
PANEL_ON
HW_OPT1
DSUB_DET
EEP_SDA
EEP_SCL
POWER_DET
HW_OPT1
FHD
HIGH
+3.5V_ST
FLASH_WP
H/W RESET
MSTAR Vcc
+1.2V_VDDC
+1.8V_M
+3.5V_ST
EEPROM(256K)
SERIAL FLASH(8MB)
10K
R581
SPI_CZ
SPI_DO
C501 10uF
10V
L502
BLM18PG121SN1D
IC503
R1EX24256BSAS0A
A0
1
A1
2
A2
3
VSS
4
R571
FLASH_WINBOND
100
DO[IO1]
R572
100
WP[IO2]
R576
100
GND
ST 3.3V
C504 10uF
10V
EEPROM_RENESAS
W25Q64FVSSIG
CS
1
2
3
4
ST 1.26V
C503 22uF
6.3V
+3.5V_ST
VCC
8
7
6
5
IC502
C572
0.1uF
WP
SCL
SDA
C573 22pF
READY
VCC
8
%HOLD[IO3]
7
CLK
6
DI[IO0]
5
DDR 1.8V
+3.3V_ST
16V
C574
22pF
READY
+3.5V_ST
R574
100 R575
100
C576
0.1uF 16V
READY
R569
4.7K
C575
0.1uF 16V
R577
4.7K
IC502-*1
MX25L6406EM2I-12G
FLASH_MXIC
CS
1
SO/SIO1
2
WP
3
GND
4
SPI_CLK
SPI_DI
EEPROM_ST
E0
E1
E2
VSS
IC503-*1
M24256-BRMN6TP
1
2
3
4
8
7
6
5
VCC
8
WC
7
SCL
6
SDA
5
EEP_SCL EEP_SDA
VCC
HOLD
SCLK
SI/SIO0
R512
1M
X501
24MHz
C530
15pF
C531 15pF
C536,C537 : 390pF->33pF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MAIN SOC
C532
0.1uF
+3.3V_ST
13.01.14
C533
0.1uF
R513
100
+3.3V_ST
C534
0.1uF
C536 33pF
IF_P
READY
C551
220pF
50V
L521 100NH READY
XTALO40XTALI
AVDD3P3_DMPLL
R514 100
C535
0.1uF
+3.3V_M
C537 33pF
Close to MSTAR
IF_N
R517 10K
IFAGC
R524
0
IF_AGC
VSS
C542
0.1uF
+1.8V_M
C541
0.022uF 16V
Close to MSTAR
VIFP44VIFM
AVDD3P3_DADC
GPIO56
GPIO6053GPIO61
AVDD_DDR
GPIO55/I2S_OUT_WS
GPIO58/I2S_OUT_SD
GPIO57/I2S_OUT_BCK
I2S_SCK
I2S_WS
I2S_SDO
TUNER_RESET
C543
0.1uF
VDDP
33
33
R52 1
R52 0
TUNER_SCL
TUNER_SDA
LVA4P57LVA4M58LVA3P59LVA3M
VDDC_1
C544
0.1uF
+1.2V_VDDC
+3.3V_ST
RXA3+
RXA3+
LVACLKP
RXA3-
RXACK+
RXA3-
RXACK+
LVA2P64LVA2M
LVACLKM
AVDD_MOD_2
RXA2+
RXACK-
RXA2+
RXACK-
C545
0.1uF
+3.3V_ST
RXA2-
RXA2-
JP501
JP502
JP503
JP504
C560
0.1uF
VCC
IC504
APX803D29
3
1
GND
R561
10K
RESET
2
R562
470
C561
4.7uF
C562
4.7uF
10V
10V
R563
POWER_DET
R564
0
C563
62K
0.1uF 16V
MN33A
MAIN SOC 5 7
HW_RESET
2012/12/19
Page 30
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
29MN33A
TOTAL LED DRIVER BLOCK
REDUCE INDUCTOR TEMP ISSUE
+19V
BOOST_EN
C901
47uF
25V
R903 1K
C902 10uF 25V
C903
0.1uF 50V
READY
C904
0.033uF 50V
R904
18K 1%
R905 1K
1%
C906
470pF
50V
R906 10K
1/16W
C905 100pF
50V
C907
0.22uF
16V
DIS/EN
COMP
RC
SS
FB
IC901
TPS40210DGQR
1
2
THERMAL
3
4
5
11
R909 220K
1/16W
L602
R605
100K
1%
C614 1000pF 50V
10K
33V
CMI_OLD
R624
30K
1%
CMI_OLD
R625
2K
1%
C601 1000pF 50V
R647
ZD602
L601 33uH
NC_1
PGND_1
PGND_2
PDIM
RISET
NC_2
OVP
LS8
LS7
LS6
LS5
EN
33uH
DT1641AS
1
2
3
4
5
6
7
8
9
10
11
12
IC600
25
THERMAL
+19V
[EP]GND
VIN
24
C622 1uF
VREF
23
CS
22
NDRV
21
RSS
20
COMP
19
RT
18
LS1
17
LS2
16
LS3
15
LS4
14
LGND
13
25V
2014.01.07 BS.HAN R630
5.6
1/16W
R634
R632
30K
1%
220K
C623
4700pF
50V
R635
1.5K 1%
R631
39K 1%
R633
1.5K 1%
1%
C625
0.1uF 25V
L901 33uH
R911 30K
1/16W
[EP]
VDD
10
BP
9
GDRV
8
ISNS
7
GND
6
C908
1uF 25V
C909
0.1uF 50V
C910
330pF
50V
121211 1K -> 3.9K 220p -> 330p
D901 BR210
100V
C911 33uF 100V
READY C918 250V 560pF
READY
READY
R918
R917
20
20
D
Q902 AOD478
G
S
1W
R915
0.1
R916
0.1
READY
VOUT = VREF*(1+51K/680) = 0.7 *(1+51K/680) = 53.2V
R919
3.9K 1%
R913
3.3
R914
3.9K 1%
REDUCE RIPPLE CURRENT
C912
33uF
100V
1W
C913 1uF 50V
C914 1uF 50V
R920 100K 1/8W
R921
100K
1/8W
R912
51K
R907 680 1/8W 1%
1/16W
1%
VOUT#1=53.2V
READY
R601
10K
INV_ON
PWM_DIM
BLU_CURRENT_CTL
R602
+5V_USB
R603
R604
3K
1K
C
E
CMI_NEW
R628-*1
8.2K 1%
R622
100K
1%
Q601 MMBT3904(NXP)
R600 270K
1/8W 1%
C611
100pF
READY
R623 100K
CMI_NEW R624-*1
CMI_NEW
R625-*1
CMI_OLD
R628
6.2K 1%
50V
20K 1%
560
1%
10K
B
R626 120K
1/8W 1%
R621 100
UF3D(SUZHOU GRANDE)
NEW_02
D
G
S
R637
0.1 1% 1W
D603
Q603 SMN09L20D
D
G
S
Old_01
Q603-*1 SMK630D
FIRST BOOST UP
P601
SMAW200-03
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LED DRIVER
3
2
1
VOUT#2
JP601
JP602
C629 33uF 100V
33uF 100V
C630
R648 1/8W
R649 1/8W
C627
1M
1uF 100V
1%
C628
1M
1uF 100V
1%
MN33A
LED_Driver
2012/09/12
6 7
Page 31
EAX65327301
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
29MN33A
19V TO ST3.3V DCDC CONVERTER
KJA-DC-1-0032
+19V
JK700
JP701
4
4
2
2
1
1
JP702
19V TO PANEL VCC(12V/5V) DCDC CONVERTER
R720 47K
C721
C720 10uF
0.1uF
25V
25V
19V TO USB 5V DCDC CONVERTER
2013.08.09 APPLY -> READY DCM -> CCM
READY R770
47K
+19V
C771
C770
0.1uF
10uF 25V
25V
+19V
AAM
IN
SW
GND
AAM
IN
SW
GND
IC702
MP2315GJ
1
2
NEW
3
3A
4
IC709
MP2315GJ
1
2
NEW
3
3A
4
C701
68uF 35V
+3.3V_M
8
7
6
5
8
7
6
5
C703 10uF 25V
READY R710
10K
FB
VCC
EN/SYNC
BST
FB
VCC
EN/SYNC
BST
R701 47K
C704
0.1uF 25V
READY R716
7.5K
20130528 cJ.LIM
R721 68
C722
0.1uF 50V
20130528 cJ.LIM
R772 68
C772
0.1uF 50V
AAM
IN
SW
GND
B
READY
R722 20K
READY
R773 20K
IC701
MP2315GJ
1
2
NEW
3
3A
4
READY
READY
C715
R711
0.1uF
33K
25V
READY R713
5.6K
C
Q713 MMBT3904(NXP)
E
READY
READY
C724
0.47uF 16V
C723
0.1uF 25V
C777 1uF 10V
C773
0.1uF 25V
R723
4.7K
R771 20K
8
7
6
5
L720 15uH
L770 10uH
C725 10uF
C774 10uF
FB
VCC
EN/SYNC
BST
20130528 cJ.LIM
POWER_SW
16V
+3.3V_M
10V
C726 10uF
C775 10uF
R823 0
S
16V
10V
R703 68
C705
0.1uF 50V
G
Q712
AO3407A
READY
C727
0.1uF 25V
C776
0.1uF 25V
R702 100K
R704 20K
C706
0.1uF 25V
L702 10uH
C707 22uF
6.3V
20130528 cJ.LIM
C708 10uF
R705 33K
+3.5V_ST
R70 6
C709
0.1uF
5.1 K
25V
10V
R70 7
R70 8
1%
27K
1%
10K
1%
5V
ZD702
2013.08.07
5.6B->5V READY->APPLY
** 3.5V_ST -> 1.26V VDDC
+3.5V_ST
C740 10uF
10V
R744
10K
V0 = 0.8*(1+(R2/R1))
AP7173-SPG-13 HF(DIODES)
IC704
IN
1
PG
2
VCC
3
EN
4
9
THERMAL
8
7
6
5
[EP]
OUT
FB
SS
GND
C746
560pF
50V
R741
4.7K
1%
R1 1%
R740
2.7K
+1.2V_VDDC
C742 10uF 10V
OUT:1.26V
** 3.3V_M -> 1.8V_M
IC711
+3.3V_M
C743 10uF
R714 470
D
R715 470
D711
READY
18V
C714 47uF 25V
+18V
10V
** +3.5V_ST -> 3.3V_M
+3.5V_ST
C750
0.1uF 16V
R750
10K
R747 10K
R761
R762
22K
22K
B
B
C
Q721 MMBT3904(NXP)
E
R724 33K
R774 33K
R72 5
R72 6
100 K
R72 7
10K 1%
R77 5
R77 6
R77 7
POWER_SW
P_12V
43K 1%
1%
READY
15V
ZD701
** Switch Panel-Vcc
P_12V
PANEL_ON
+5V_USB
47K
1%
33K
1%
15K
1%
5.6B
ZD700
READY
IN
C744
0.1uF 16V
C753
R748
4.7uF
33K
10V
R749
2.2K
C
Q711 MMBT3904(NXP)
E
FET Multi_DIODES_A
ZXMP3F30FHTA
C760 1uF 25V
AP1117E18G-13
3
2
OUT
C745 10uF 10V
Q710
AO3435
S
G
BOOST_EN
Q720-*1
D
S
G
FET Multi_AOS_A
ADJ/GND 1
D
FET Multi_NXP
Q720-*3 PMV48XP
S
G
FET Multi_AOS_B
Q720-*2
AO3407B
S
G
Q720
AO3407A
S
G
D
D
D
+1.8V_M
FET Multi_DIODES_B
Q720-*4
DMP2130L
D
S
G
C761
R765
0.1uF
3.3K
16V
C754 10uF 10V
READY R766
4.7K
+3.3V_M
PANEL_VCC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
POWER
MN33A
2012/07/03
7 7POWER
Page 32
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