Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transfo rmer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Good Earth Ground
such as WATER PIPE,
To Instrument's
exposed
METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unl ess sp ecified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
6) Updating Completed, The TV will restart automatically.
7) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV
have, TV can lost all channel data. In this case, you
have to channel recover. if all channel data is cleared,
you didn’t have a DTV/ATV test on production line.
- 9 -
LGE Internal Use Only
Page 10
3.1. EDID Process
3.2.1. EDID download
1) Press "Power only" key of service remote control.
2) Press the ADJ KEY on R/C and enter EZ ADJUST
3) Enter EDID D/L mode by pushing "►" key at "EDID D/L".
4) EDID download is executed automatically.
5) Press EXIT key on R/C.
G
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→ Caution: - Never connect HDMI & D-sub Cable when
- Download HDMI
* Edid data and Model option download (USB)
NOItemCMD 1CMD 2Data 0
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download EDID.
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3.1.2. RGB EDID Data
- All models (Product ID : 22984/HEXA: 59C8)
*(week), **(year), ***(Check sum) : Adjustable Data
1) Press "Power on" key of service remote control.
2) Connect RS232 Signal Cable to RS-232 Jack.
3) Check the 'Tool Option' (Refer to the BOM Comments or
Adjustment spec)
4) Check the ‘ADC’ is ok.
4.2. Model name & Serial number Download
4.2.1. Model name & Serial number D/L
1) Press "Power on" key of service remote control.
2) Connect RS232 Signal Cable to RS-232 Jack.
3) Write Serial number by use RS-232.
4) Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
4.2.2. Method & notice
1) Serial number D/L is using of scan equipment.
2) Setting of scan equipment operated by Manufacturing
Technology Group.
3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
4.3. Function Check
4.3.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (CVBS)
3) COMPONENT (480i)
4) RGB (PC : 1366 x 768 @ 60 Hz)
5) HDMI (PC : 1366 x 768 @ 60 Hz)
6) PC Audio In
* Display and Sound check is executed by Remote controller
→ Caution : Not to push the INSTOP KEY after completion if
the function inspection.
4.3.2. PIP Check
1) Press "Power on" key of service remote control.
2) Input RGB & TV(ATV or DTV) signal.
3) Set Input mode to RGB.
4) Press ‘PIP" key of ADJ remote controller
5) Check TV Video & Audio signal of Sub picture.
* Manual Download (Model Name and Serial
Number)
If the TV set is downloaded By OTA or Service man, Sometimes model name or serial number is initialized.( Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the 'Instart' key of ADJ remote controller.
2) Go to the menu 'Model Number D/L' like below photo.
3) Input the Factory model name(ex 24MN33D) or Serial
number like photo.
4) Check the model name Instart menu → Factory name
displayed (ex GP4-LOW)
5) Check the Diagnostics (DTV country only) → Buyer model
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
RGB_Gains are xed data for each model.
Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
* Total Assembly line should be check whether the color
coordinate(x,y) data refer to below table were meet or not.
*Note : x,y coordinates are drifted about 0.007 after 30 mins
Color
Temperature
Luminance
(cd/m²)
*Note : Manual W/B process using adjusts Remote control.
1) After enter Service Mode by pushing "ADJ" key,
2) Enter "White Balance" by pushing "►" key at "White Bal-
Cool13,000k°K X=0.276 (±0.03)
Medium9,300k°K X=0.290 (±0.03)
Warm6,500k°K X=0.318 (±0.03)
CoolMin : 80Typ : 110<Test Signal>
MediumMin : 80Typ : 110
WarmMin : 70Typ : 110
Y=0.275 (±0.03)
Y=0.298 (±0.03)
Y=0.334 (±0.03)
<Test Signal>
Inner pattern
(204gray,80IRE)
Inner pattern
(204gray,80IRE)
heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.
ance".
4.5. DPM Operation check
■ Measurement Condition: 100~240V@ 50/60Hz
1) Set Input to RGB-PC and connect D-sub cable to set –
RGB Mode. Set Input to HDMI(with Input Label set to PC)
and connect HDMI cable to set – HDMI Mode
2) Cut off H sync or V sync of signal.
3) Check DPM operation refer to the below table.
Operating ConditionSync
Power S/W On Sleep mode -
RGB,HDMI
(H/V)
Off/OffOffAmber1
VideoLED
(SET)
Wattage
4.6. Model Name & SW Version & Adjust
check.
* Press the ‘Instart’ key of ADJ remote controller
4.6.1. Model Name& SW Version Check
1) Check ‘Model Name’.
2) Check ‘S/W Version’ (Refer to the IC Ver. in the BOM)
4.6.2. Adjust Check
1) Check ‘Country Group’
2) Check ‘Area Option’
3) Check ‘Tool Option’ (Refer to the BOM Comments)
4) Check ‘Adjust ADC[Comp&RGB]’ is OK.
5) Check ‘EDID[RGB&HDMI]’ is OK.
* After check all, Press the 'EXIT' key of ADJ remote controller
to go out SVC menu.
(W)
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~GiG
* When doing Adjustment, Please make circumstance as
below.
4.7. Outgoing condition Conguration
* After all function test., press IN-STOP Key by SVC Remote
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
29MN33
TP_EU
EAX64998104
2012.11.18
3 12
Page 25
DSUB RGB
OPTION:DSUB_block
121128
ESD improve
OPT->APPLY
2:E18
DSUB_VSYNC
DSUB_HSYNC
2:E18
L401
DSUB_B+
DSUB_G+
DSUB_R+
11.10.31
To Improve EMI
Hotel_Model(RS232C apply)
NON_Hotel_Model(RS232C Bypass)
PM_TXD
PM_RXD
NON_Hotel_Model(RS232C Bypass)
VA427
VA428
20V
20V
OPT
OPT
BLM15BD121SN1
R441
C419
75
47pF
50V
C420
47pF
50V
C422
0.33uF
16V
Hotel_Model(RS232C apply)
C423
0.33uF
16V
V-
RIN 2
DOU T2
6
8
7
IC401
MAX3232CDR
Hotel_Model(RS232C apply)
11
10
9
DIN 1
DIN 2
ROU T2
JP413
M5_ GND
5
VA400
20V
L402
BLM15BD121SN1
R442
75
L403
BLM15BD121SN1
C421
R443
47pF
75
50V
To Improve Ringing issue
LOW capacitance Part apply
Hotel_Model(RS232C apply)
C2-
C2+
5
12
R459
0
R460
0
R461
C1-
4
3
13
14
RIN 1
ROU T1
DOU T1
R462
100
100
JP412
M3_ DETEC T
1 M1
3
4 M4
VA401
20V
5.5V
VA403
VA402
11.10.27
+3.3V_ST
C424
0.33uF
16V
C425
0.1uF
16V
Hotel_Model(RS232C apply)
C1+
V+
1
2
16
15
VCC
GND
Hotel_Model(RS232C apply)
VA422
20V
VA423
20V
JP416
6 M6
121128
ESD improve
OPT->APPLY
R445 0
R444 0
5.5V
VA406
C426
0.1uF
16V
(OPT)IR_OUT
R463
0
JP400
JP401
R446 0
C401
18pF
5.5V
+3.3V_ST
OPT
R449
121128
ESD improve
OPT->APPLY
JP409
DDC_G ND
15
SHILE D
16
5
0
VA417
20V
JP410
+5V_Normal
R451
+3.3V_ST
VA418
20V
121128
ESD improve
OPT->APPLY
0
R452
47K
R435
10K
OPT
R454
0
B
RGB_DDC_SCL
RGB_DDC_SDA
OPT
R457
OPT
R458
OPT
12.07.02
R455
BY.Hwang
0
R418
47K
C
Q400
MMBT3904(NXP)
E
121226
use to keep DET LOW
0
PM_RXD
0
PM_TXD
DSUB_DET
D416
MMBD6100
A2
C
A1
R448
R447
10K
10K
121128
JP408
DDC_D ATA
BLUE_ GND
GREEN
12
8
2
JK406
SPG09-DB-010
20V
H_SYN C
VA415
BLUE
13
3
V_SYN C
NC
14
9
4
ESD improve
OPT->APPLY
DDC_C LOCK
SYNC_ GND
GND_1
10
OPT
OPT
C403
18pF
50V
50V
JP407
JP405
JP406
GND_2
GREEN _GND
RED_G ND
RED
11
7
6
1
RS232C
+3.3V_ST
IR_OUT
P1104
12507WS-04L
1
2
3
4
5
PC AUDIO(SIDE)
6 M6
1 M1
3 M3_DETECT
4 M4
KJA-PH-1-0177
5 M5_GND
JK401
ETHERNET
(Sub)ETHERNET(T2_UK/BR_GINGA)
JK402
XRJV-01V-0-D12-080
1
2
3
4
5
6
7
8
9
9
Jack Shield (HDMI1,RGB)
VA407
JP411
20V
OPT
JP404
VA419
20V
JP403
VA420
20V
JP402
+3.3V_Normal
ETHERNET(T2_UK/BR_GINGA)
R411
0
ETHERNET(T2_UK/BR_GINGA)
C410
0.01uF
50V
JackShield(for NonCKD)
M1
MGJ63348201
C414
220pF
50V
C413
220pF
50V
OPT
VA404
12.08.10
47K->470K
R465
470K
OPT
R464
470K
OPT
OPT
5.5V
VA405
JackShield(for CKD)
M1-*1
MGJ63348202
+3.3V_Normal
R468
470K
R466
15K
R467
15K
OPT
5.5V
VA409
5.5V
OPT
R469
10K
R470
10K
VA426
R471
1K
PC_AUDIO_DET
PC_R_IN
PC_L_IN
EPHY_TP
EPHY_TN
EPHY_RP
EPHY_RN
5.5V
USB(SIDE)
3AU04S-305-ZC-(LG)
JK403
1234
USB DOWN STR EAM
5
(Main)ETHERNET(T2_UK/BR_GINGA)
JK402-*1
RJ45VT-01SN002
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
JP429
JP428
JP427
C400
0.1uF
VA424
20V
121128
ESD improve
OPT->APPLY
C404
10uF
10V
OPT
VA425
121128
ESD improve
OPT->APPLY
IC400
AP2191DSG
GND
NC
1
8
IN_1
OUT_2
2
7
IN_2
OUT_1
3
6
EN
FLG
4
5
111026
20V
ESD diode deletion
EAH39491601 2EA
120103
ESD diode addition
EAF61530301 2EA
USB_DM
USB_DP
USB_CTL
1:AL8
1:AL7
R472
10K
R473
47
+5V_USB
USB_OCD
C405
0.1uF
KJA-PH-1-0177
JK404
Hotel_Model(RS232C apply)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
29MN33
INTERFACE
EAX64998104
2012.11.18
4 13
Page 26
HDMI
HDMI
SHIELD
20
19
18
17
16
15
14
13
12
11
10
EAG61491201
9
8
7
6
5
4
3
2
1
JK501
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_2
R528
1K
+3.3V_ST
R500
47K
OPT
VA505
OPT
VA511
20V
R5270
(OPT)HDMI2_ARC
OPT
VA507
20V
R503
R501
10K
B
OPT
VA512
20V
OPT
VA508
20V
(OPT)ESD_HDMI_SEMTECH(DEV)
(OPT)ESD_HDMI_SEMTECH(DEV)
47K
C
Q501
MMBT3904(NXP)
E
HDMI_ARC
HDMI_CEC
1
2
3
4
5
1
2
3
4
5
MMBT3904(NXP)
D504
RCLAMP0524PA
10
9
8
7
6
D505
RCLAMP0524PA
10
9
8
7
6
5V_DET_HDMI_2
C
Q505
E
VA502
20V
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
OPT
R509
10K
R529
10K
B
DDC_SDA_2
DDC_SCL_2
VA503
20V
120715
Added for ESD prevention
120825
OPT->APPLY
D504-*1
IP4283CZ10-TBA
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+
5
ESD_HDMI_NXP
HPD2
10
For CEC
R520
+5V_Normal
A1
A2
MMBD6100
D502
C
R522
2.7K
100
HDMI_CEC
5V_HDMI_2
R521
2.7K
D505-*1
IP4283CZ10-TBA
GND_1
1
2
3
4
5
ESD_HDMI_NXP
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
NC_4
TMDS_CH1-
NC_3
TMDS_CH1+
9
GND_2
8
NC_2
TMDS_CH2-
7
TMDS_CH2+
NC_1
6
CEC_REMOTE_S7
DDC_SDA_2
DDC_SCL_2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX64998104
29MN33
HDMI5 12
2012.11.18
Page 27
IR/LED and Control
LED_RED
R600
10K
R601
10K
LED_AMBER
B
C
Q600
MMBT3904(NXP)
E
R602
10K
R603
10K
B
C
Q601
MMBT3904(NXP)
E
IR
KEY2
KEY1
KEY_SCL
KEY_SDA
+3.3V_ST
R604270
1/10W1%
Amber LED:9.5mA
(IR Port protection against ESD)
121118
100ohm->200ohm
R4044
200
+3.3V_ST
+3.3V_ST
R610330
1/10W1%
Red LED:7.8mA
121118
R604,R610
2012->1608
30V
50V
D600
C600
0.1uF
50V
C601
1000pF
30V
D601
+3.3V_ST
R616
3.3K
R614
100
R615
100
OPT
50V
C602
100pF
BLM18PG121SN1D
R617
3.3K
50V
OPT
C603
100pF
L600
30V
D602
OPT
30V
D603
OPT
JP600
JP601
JP602
JP605
JP604
JP603
JP607
JP606
JP608
JP609
JP610
JP611
P600
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
Module
+12V_PANEL_POWER
C605
0.1uF
50V
C606
10uF
25V
LVA_3P
LVA_3M
LVA_CKP
LVA_CKM
LVA_2P
LVA_2M
LVA_1P
LVA_1M
LVA_0P
LVA_0M
C607
1000pF
50V
P601
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
4.7K
4.7K
R624
4.7K
R625
4.7K
R626
R627
IR_OUT(Ready)
+3.3V_ST
(OPT)IR_OUT
R619
IR_OUT
MMBT3904(NXP)
R618
22
(OPT)IR_OUT
Q602
(OPT)IR_OUT
10K
C
E
(OPT)IR_OUT
OPT
R620
0
B
C604
1000pF
MMBT3904(NXP)
+3.3V_ST
(OPT)IR_OUT
R621
10K
Q603
(OPT)IR_OUT
R622
10K
(OPT)IR_OUT
C
B
E
R623
47K
(OPT)IR_OUT
IR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_Normal
R1913
10K
74LVC1G32GW
1B5 VCC
2A
3GND
R1914
100
IC1903
AP2151WG-7
5
4
+3.3V_CI
C1908
0.1uF
16V
GND
1
2
3
IC1901
4 Y
IN
EN
+3.3V_CI
R1917
10K
R1915
47
OUT
GND
FLG
R1918
47
C1910
1uF
25V
+5V_CI_ON
L1902
BLM18PG121SN1D
R1922
100K
CI_DET
/PCM_CD
CI_DATA[0-7]
CI_DATA[0-7]
CI_ADDR[8]
CI_ADDR[9]
CI_ADDR[10]
CI_ADDR[11]
CI_ADDR[12]
CI_ADDR[13]
CI_ADDR[14]
CI_OE
CI_WE
CI_IORD
CI_IOWR
CI_DATA[0]
CI_DATA[1]
CI_DATA[2]
CI_DATA[3]
CI_DATA[4]
CI_DATA[5]
CI_DATA[6]
CI_DATA[7]
REG
AR1907 33
AR1908 33
AR1912 33
AR1913 33
AR1909 33
PCM_D[0]
PCM_D[1]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[12]
PCM_A[13]
PCM_A[14]
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORD
/PCM_IOWR
PCM_A[10]
PCM_A[11]
PCM_D[0-7]
PCM_D[0-7]
EAX64998104
29MN33
PCMCI
2012.11.18
19 13
Page 32
GLOBAL tuner block except T2/S2
Pull-up can’t be applied
because of MODEL_OPT_2
TU3703-*1
TDSN-B601F(C)
(BR_CKD)SI2178_BR_2INPUT_H
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
28
27
A1
SHIELD
B1
B1
RF_S/W_CTL
RESET_TUNER
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
NC_1
NC_2
NC_3
+B3[3.3V]
+B4[1.23V]
RESET_DEMOD
GND
ERROR
SYNC
VALID
MCLK
DATA
NC_4
NC_5
NC_6
NC_7
NC_8
NC_9
NC_10
A1
LNA_CTRL_1
LNA_CTRL_2
GND seperation for ASIS tuner
TU_GND_A
R4042
R4041
0
0
(OPT)TW_FE_LNA
R3796
2.2K
(OPT)TW_FE_LNA
R3797
2.2K
LNA_CTRL_1
LNA_CTRL_2
close to TUNER
C3752
C3753
0.1uF
0.1uF
16V
16V
(OPT)TW_FE_LNA
(OPT)TW_FE_LNA
TU3704
TDSN-T701F
(OPT)SI2178_TW_LNA_2INPUT_H
RF_S/W_CTL
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBS
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
NC_1
12
NC_2
13
NC_3
14
GND
15
NC_4
16
NC_5
17
NC_6
18
NC_7
19
NC_8
20
NC_9
21
NC_10
22
NC_11
23
NC_12
24
NC_13
25
57
58
B1
59
SHIELD
NC_14
26
NC_15
27
A1B1
A1
TU_GND_A
TU3703
TDSN-B601F(B)
(BR)SI2178_BR_2INPUT_H
B1
B1
28
SHIELD
RF_S/W_CTL
1
RESET_TUNER
2
SCL
3
SDA
4
+B1[3.3V]
5
SIF
6
+B2[1.8V]
7
CVBS
8
NC_1
9
NC_2
10
NC_3
11
+B3[3.3V]
12
+B4[1.23V]
13
RESET_DEMOD
14
GND
15
ERROR
16
SYNC
17
VALID
18
MCLK
19
DATA
20
NC_4
21
NC_5
22
NC_6
23
NC_7
24
NC_8
25
NC_9
26
NC_10
27
A1
A1
R3705
0
121118
C3701 : RF_SW_OPT
(BR)RF_SW_OPT
(BR)RF_SW_OPT
121118
SS Bead -> SUNLORD Bead
R3705 : 1k -> 0 ohm
C3701
0.1uF
16V
close to TUNER
+1.23V_TUNER
R3798
1K
(BR)FULL_NIM
(BR)FULL_NIM
C3754
0.1uF
16V
close to TUNER
TU_GND_A
L3706
120OHM
(BR)FULL_NIM
C3718
0.1uF
16V
(BR)FULL_NIM
(BR)FULL_NIM
TU3700
TDSS-G501D(B)
(EU/ASIA)SI2156_DVB_1INPUT_H
B1
B1
BR_RESET_DEMOD
R3799
10K
(OPT)(BR)FULL_NIM_D_DEMODE_0
(OPT)(BR)FULL_NIM_D_DEMODE_0
R3801
0
(OPT)(BR)FULL_NIM_D_DEMODE_0
R3802
0
(OPT)(BR)FULL_NIM_D_DEMODE_0
R3803
0
R3804
0
RF_SWITCH_CTL
12
1
2
3
4
5
6
7
8
9
10
11
A1
SHIELD
12.08.14
diagonal noise improve
NC_1
RESET
SCL
SDA
3.3V
NC_2
1.8V
C3702
0.1uF 16V
(BR)FULL_NIM
NC_3
IF_AGC
DLIF_[P]
DLIF_[N]
A1
TU_GND_A
R3801-1*
47
(BR)FULL_NIM_D_DEMODE_47
R3802-1*
47
(BR)FULL_NIM_D_DEMODE_47
R3803-*1
47
(BR)FULL_NIM_D_DEMODE_47
R3804-*1
47
(BR)FULL_NIM_D_DEMODE_47
OPT
C3703
0.1uF
16V
close to TUNER
+3.3V_TU
R3733
100K
R3732
100
C3710
0.1uF
16V
Close to the tuner
FE_TS_SYNC
FE_TS_VAL_ERR
FE_TS_CLK
FE_TS_DATA[0]
R376110
(NON_BR)HALF_NIM
R376010
(NON_BR)HALF_NIM
TUNER_RESET
121118
Apply TU_I2C_FILTER
(18pF->20pF)
R3762
2K
OPT
C3737
C3738
100pF
0.1uF
50V
16V
(OPT)TU_I2C_FILTER
(OPT)TU_I2C_FILTER
C3711
20pF
50V
C3750
5pF
50V
OPT
+1.8V_TUNER
R3735-*1
R3736-*1
C3751
5pF
50V
OPT
C3705
100uF
16V
OPT
TU_I2C_NON_FILTER
R3735
R3736
TU_I2C_NON_FILTER
C3713
20pF
50V
R3780
3.3
OPT
C3716
0.1uF
16V
(NON_BR)HALF_NIM
(KR)TU_IIC_ATSC_1.8K
33
33
C3742
20pF
50V
R37840
R3781
3.3
R3782
OPT
2K
OPT
close to the tuner pin, add,09029
C3704 100
(NON_BR)HALF_NIM
should be guarded by ground
R3741-*3
2.2K
(BR)TU_IIC_2.2K
R3740-*3
2.2K
(BR)TU_IIC_2.2K
R3741-*2
1.2K
(US)TU_IIC_ATSC_1.2K
R3740-*2
1.2K
(US)TU_IIC_ATSC_1.2K
R3740-*1
1K
+3.3V_TU
R3740
1.8K
R37830
(BR)FULL_NIM
(BR)FULL_NIM
C3743
20pF
50V
(ASIA)TU_IIC_NON_ATSC_1K
R3741-*1
1K
(ASIA)TU_IIC_NON_ATSC_1K
R3741
1.8K
(KR)TU_IIC_ATSC_1.8K
121118
Apply TU_I2C_FILTER
IF_P_MSTAR
IF_N_MSTAR
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
L3707
UBW2012-121F
(NON_EU)3.3V_TU
C3707
C3739
100pF
10uF
50V
10V
OPT
IF_AGC_MAIN
R3775
0
(BR)TU_NON_BUFFER_SIF
R3753
TU_SCL
TU_SDA
R37560
(OPT)(BR)TU_NON_BUFFER_VIDEO
R37490
(BR)TU_BUFFER_VIDEO
(EU)3.3V_TU
L3707-*10
4.7K
(OPT)(BR)TU_BUFFER_SIF
(BR)TU_BUFFER_VIDEO
R3750
1K
OPT
1/8W
+3.3V_TU
C3708
C3706
0.1uF
100uF
16V
16V
OPT
+3.3V_TU
B
+3.3V_TU
R3751
220
B
E
C
FE_AGC_SPEED_CTL
IF_AGC_SEL
FE_BOOSTER_CTL
LNA2_CTL
(OPT)(BR)TU_BUFFER_SIF
R3774
470
(BR)FULL_NIM
R3758
82
E
Q3705
MMBT3906(NXP)
(OPT)(BR)TU_BUFFER_SIF
C
R3752
220
(BR)TU_BUFFER_VIDEO
Q3703
MMBT3906(NXP)
(BR)TU_BUFFER_VIDEO
TU_SIF
TU_CVBS
TUNER MULTI-OPTION
TU3700-*2
TDSS-H501F(B)
(US/KR)SI2158_ATSC_1INPUT_H
NC_1
1
RESET
2
SCL
3
SDA
4
+B1[3.3V]
5
NC_2
6
+B2[1.8]
7
NC_3
8
IF_AGC
9
DIF[P]
10
DIF[N]
11
X
B1
A1
A1
12
SHIELD
TU3704-*1
TDSN-T601F
(OPT)SI2176_TW_2INPUT_H
B1
28
SHIELD
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
A1A1B1
1
2
3
4
5
6
7
8
9
RF_S/W_CTL
RESET_TUNER
SCL
SDA
+B1[3.3V]
SIF
+B2[1.8V]
CVBS
IF_AGC
DIF[P]
DIF[N]
NC_1
NC_2
NC_3
GND
NC_4
NC_5
NC_6
NC_7
NC_8
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
TW_FE_LNA FILTER_SETTING
Frequence
54MHz~350MHz
350Hz~450MHz
450Hz~870MHz
CTRL_1
1
0
0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CTRL_2
0
0
1
Filter_Type
LPF
Through
HPF
+3.3V_TU
60mA
29MN33
GLOBAL TUNER
C3723
22uF
10V
121118
SS Bead -> SUNLORD Bead
Size change,0929
2012 SIZE
L3703
UBW2012-121F
C3725
0.1uF
16V
Add,0929
C3715
22uF
10V
EAX64998104
+3.3V_TUNER
C3727
0.1uF
16V
2012.11.18
26 12
Page 33
SCART / COMPONENT&CVBS
COMPONENT&CVBS
[GN]E-LUG
6A
[GN]O-SPRING
5A
[GN]CONTACT
4A
[BL]E-LUG-S
7B
[BL]O-SPRING
5B
[RD]E-LUG-S
7C
[RD]O-SPRING_1
5C
[RD]CONTACT_1
4C
5D
[WH]O-SPRING
4E
[RD]CONTACT_2
5E
[RD]O-SPRING_2
6E
JK2800
[RD]E-LUG
PPJ234-05
FULL SCART
AV_DET
22
COM_GND
21
SYNC_IN
SYNC_OUT
SYNC_GND2
SYNC_GND1
RGB_IO
R_OUT
RGB_GND
R_GND
D2B_OUT
G_OUT
D2B_IN
G_GND
ID
B_OUT
AUDIO_L_IN
B_GND
AUDIO_GND
AUDIO_L_OUT
AUDIO_R_IN
AUDIO_R_OUT
JP2800
JP2801
JP2802
JP2803
JP2804
JP2805
JP2806
JP2807
JP2808
JP2809
SCART JACK
JK2801
PSC008-01
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
JP2810
JP2811
JP2814
JP2815
JP2812
JP2813
121017
ZD2801
Change
5.6B
ZD2800
5.6B
121017
Change
121017
Change
D2815
D2816
5.6V
121229
OPT -> APPLY for ESD
121219
OPT->APPLY
120927
OPT->APPLY
120927
OPT->APPLY
OPT
D2817
5.6V
ZD2803
5.6B
ZD2802
5.6B
(OPT)COMP_ADC_FILTER_L(AUDIO)
R2825
470K
5.6V
R2826
470K
SCART JACK
ZD2805
5.6B
ZD2804
5.6B
SCART JACK
D2802
20V
SCART JACK
D2803
20V
SCART JACK
D2804
20V
D2805
20V
SCART JACK
120927
OPT->APPLY
OPT
D2806
20V
OPT
D2808
20V
OPT
D2807
20V
OPT
D2800
20V
(OPT)COMP_ADC_FILTER
R2822
75
R28 24
75
R28 23
75
CM2012FR10KT
C2837
1000pF
50V
(OPT)COMP_ADC_FILTER_L(AUDIO)
L2812
CM2012FR10KT
C2838
1000pF
50V
OPT:
COMP_ADC_FILTER(AUDIO)
OPT
D2809
20V
SCART JACK
R2806
75
SCART JACK
R2802
75
SCART JACK
R2803
75
SCART JACK
R2804
470K
SCART JACK
R2805
470K
C2829
47pF
50V
(OPT)COMP_ADC_FILTER
C2827
47pF
50V
(OPT)COMP_ADC_FILTER
C2825
47pF
50V
L2811
C2810
47pF
OPT
SCART JACK
(OPT)SCART_ADC_FILTER
(OPT)SCART_ADC_FILTER
(OPT)SCART_ADC_FILTER
50V
C2811
47pF
50V
R2807
75
(OPT)COMP_ADC_FILTER(AUDIO)
D2810
20V
(OPT)COMP_ADC_FILTER_L
CM2012FR10KT
(OPT)COMP_ADC_FILTER_L
CM2012FR10KT
(OPT)COMP_ADC_FILTER_L
CM2012FR10KT
R2832
10K
R2831
10K
SCART JACK
C2800
47pF
50V
(OPT)SCART_ADC_FILTER_L
(OPT)SCART_ADC_FILTER_L
(OPT)SCART_ADC_FILTER_L
(OPT)SCART_ADC_FILTER_L(AUDIO)
CM2012FR10KT
C2839
1000pF
50V
(OPT)SCART_ADC_FILTER_L(AUDIO)
C2841
1000pF
50V
COMP_NON_ADC_FILTER
L2807
(OPT)COMP_ADC_FILTER
C2830
47pF
50V
COMP_NON_ADC_FILTER
L2806
(OPT)COMP_ADC_FILTER
C2828
47pF
50V
COMP_NON_ADC_FILTER
L2805
(OPT)COMP_ADC_FILTER
C2826
47pF
50V
R2834
12K
COMP_NON_ADC_FILTER(AUDIO)
L2811-*1
0
R2833
12K
COMP_NON_ADC_FILTER(AUDIO)
L2812-*1
0
+3.3V_Normal
SCART JACK
SCART JACK
R2808
4.7K
SCART JACK
R2809
OPT
C2802
220pF
50V
L2808
CM2012FR10KT
C2831
47pF
50V
CM2012FR10KT
C2833
47pF
50V
CM2012FR10KT
C2835
47pF
50V
CM2012FR10KT
121019
ADC_FILTER(AUDIO) ADD
(OPT)SCART_ADC_FILTER
C2832
47pF
50V
L2809
(OPT)SCART_ADC_FILTER
C2834
47pF
50V
L2810
(OPT)SCART_ADC_FILTER
C2836
47pF
50V
L2813
SCART_NON_ADC_FILTER(AUDIO)
(OPT)SCART_ADC_FILTER(AUDIO)
L2814
SCART_NON_ADC_FILTER(AUDIO)
(OPT)SCART_ADC_FILTER(AUDIO)
C2803
1000pF
50V
130124
OPT->APPLY for EMS S2a
C2804
1000pF
50V
L2807-*1
0
L2806-*1
0
L2805-*1
0
COMP_L_IN
COMP_R_IN
R2810
1K
0
SCART JACK
R2815
SCART JACK
R2811
75
SCART_NON_ADC_FILTER
L2808-*1
0
SCART_NON_ADC_FILTER
L2809-*1
0
SCART_NON_ADC_FILTER
L2810-*1
0
L2813-*1
0
C2840
47pF
50V
L2814-*1
0
C2842
47pF
50V
OPT
C2807
4700pF
OPT
C2808
4700pF
R2837
10K
+3.3V_Normal
SCART1_DET
SC1_SOG_IN
SC1_CVBS_IN
SCART JACK
R2816
75
22
C2805
330pF
50V
OPT
C2806
330pF
50V
+3.3V_Normal
C2813
0.1uF
R2841
10K
OPT
D2818
5.6V
SC1_FB
SCART JACK
R2812
10K
OPT
SCART JACK
R2813
10K
R2838
1K
16V
R2842
1K
SC1_R+
SC1_G+
SC1_B+
DTV/MNT_L_OUT
DTV/MNT_R_OUT
SCART JACK
D2811
20V
SCART JACK
R2818
12K
SCART JACK
R2819
12K
SCART JACK
R2814
15K
COMP_Y+/AV_CVBS_IN
AV_CVBS_DET
COMP_Pb+
COMP_Pr+
COMP_DET
121118
Change FET -> OP AMP
+3.3V_Normal
SCART JACK
R2817
3.9K
SC1_L_IN
SC1_R_IN
SCART AMP
+5V_USB
C2817
VCC
OUT2
IN2-
IN2+
Q2804
1
(OPT)EU_SCART mute
2
0.1uF
50V
R2855
10K
R2849
5.6K
(OPT)EU_SCART mute
C2816
0.1uF
JP2816
JP2817
130114
33K->5.1K
R2853
5.1K
C2824
33pF
R2843
220K
CLOSE TO MSTAR
(OPT)EU_SCART mute
D2819
MMBD6100
A2
C
A1
JP2818
JP2819
R2850
470K
C2819
330pF
+3.3V_ST
R2844
R2846
2.2K
C2822
10uF
16V
SCART1_Rout
10K
SCART1_MUTE
SB_MUTE
DTV/MNT_R_OUT
IC2800
AZ4580MTR-E1
OUT1
1
IN1-
2
IN1+
3
VEE
4
8
7
6
5
DTV/MNT_L_OUT
SCART1_Lout
C2821
10uF
16V
330pF
C2820
R2847
2.2K
R2851
470K
220K
R2845
130114
33K->5.1K
R2852
5.1K
C2823
33pF
R2848
5.6K
R2854
10K
CLOSE TO MSTAR
[SCART AUDIO MUTE]
Q2802
Q2803
(OPT)EU_SCART mute
R2839
2K
(OPT)EU_SCART mute
R2840
2K
(OPT)EU_SCART mute
MMBT3906(NXP)
3
DTV/MNT_L_OUT
DTV/MNT_R_OUT
(OPT)EU_SCART mute
MMBT3904(NXP)
(OPT)EU_SCART mute
MMBT3904(NXP)
SCART JACK
IC2801
MM1756DURE
VCC
6
PS
5
OUT
4
1
2
3
SC1_ID
IN
GND
BIAS
C2812
0.1uF
SCART JACK
C2815
4.7uF
SCART JACK
C2814
0.1uF
SCART JACK
DTV/MNT_VOUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
3
2
1
VOUT#2
JP1102
REDUCE RIPPLE CURRENT
C1129
33uF
100V
C1130
33uF
100V
R1148
1/8W
R1149
1/8W
C1124
1M
33uF
100V
1%
C1126
33uF
1M
100V
1%
33V
ZD1102
R1145
1M
1/8W
1%
R1146
1M
1/8W
1%
C1127
0.1uF
250V
C1128
0.1uF
250V
EAX64998104
29MN33
LED DRIVER29 13
2012.11.18
Page 35
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