Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transfo rmer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Good Earth Ground
such as WATER PIPE,
To Instrument's
exposed
METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unl ess sp ecified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
6) Updating Completed, The TV will restart automatically.
7) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV
have, TV can lost all channel data. In this case, you
have to channel recover. if all channel data is cleared,
you didn’t have a DTV/ATV test on production line.
- 9 -
LGE Internal Use Only
Page 10
3.1. EDID Process
3.1.1. EDID download
1) Press "Power only" key of service remote control.
2) Press the ADJ KEY on R/C and enter EZ ADJUST
3) Enter EDID D/L mode by pushing "►" key at "EDID D/L".
4) EDID download is executed automatically.
5) Press EXIT key on R/C.
G
WUG{GvXGG G
XUG{GvYGG G
YUG{GvZGG G
ZUG{Gv[GG G
[UG{Gv\GG G
\UG{Gv]G
]UGjGnG
^UGhkjGjGG G
_UG~GiGG G
`UGXWGwG~iGGG G
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XXUGlkpkGkVsGඖ G
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XZUG{GzGzG
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GG G
→ Caution: - Never connect HDMI & D-sub Cable when
- Download HDMI
* Edid data and Model option download (USB)
NOItemCMD 1CMD 2Data 0
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download EDID.
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3.1.2. RGB EDID Data
- Product ID : 22984/HEXA: 59C8
*(week), **(year), ***(Check sum) : Adjustable Data
1) Press "Power on" key of service remote control.
2) Connect RS232 Signal Cable to RS-232 Jack.
3) Check the 'Tool Option' (Refer to the BOM Comments or
Adjustment spec)
4) Check the ‘ADC’ is ok.
4.2. Model name & Serial number Download
4.2.1. Model name & Serial number D/L
1) Press "Power on" key of service remote control.
2) Connect RS232 Signal Cable to RS-232 Jack.
3) Write Serial number by use RS-232.
4) Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
4.2.2. Method & notice
1) Serial number D/L is using of scan equipment.
2) Setting of scan equipment operated by Manufacturing
Technology Group.
3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
4.3. Function Check
4.3.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (CVBS)
3) COMPONENT (480i)
4) RGB (PC : 1366 x 768 @ 60 Hz)
5) HDMI (PC : 1366 x 768 @ 60 Hz)
* Display and Sound check is executed by Remote controller
→ Caution : Not to push the INSTOP KEY after completion if
the function inspection.
4.3.2. PIP Check
1) Press "Power on" key of service remote control.
2) Input RGB & TV(ATV or DTV) signal.
3) Set Input mode to RGB.
4) Press ‘PIP" key of ADJ remote controller
5) Check TV Video & Audio signal of Sub picture.
* Manual Download (Model Name and Serial
Number)
If the TV set is downloaded By OTA or Service man, Sometimes model name or serial number is initialized.( Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the 'Instart' key of ADJ remote controller.
2) Go to the menu 'Model Number D/L' like below photo.
3) Input the Factory model name(ex 24MN33D) or Serial
number like photo.
4) Check the model name Instart menu → Factory name
displayed (ex GP4-LOW)
5) Check the Diagnostics (DTV country only) → Buyer model
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
RGB_Gains are xed data for each model.
Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
* Total Assembly line should be check whether the color
coordinate(x,y) data refer to below table were meet or not.
Color
Temperature
Luminance
(cd/m²)
*Note : x,y coordinates are drifted about 0.007 after 30 mins
*Note : Manual W/B process using adjusts Remote control.
1) After enter Service Mode by pushing "ADJ" key,
2) Enter "White Balance" by pushing "►" key at "White Bal-
G
WUG{GvXGG G
XUG{GvYGG G
YUG{GvZGG G
ZUG{Gv[GG G
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\UG{Gv]G
]UGjGnG
^UGhkjGjGG G
_UG~GiGඖG G
`UGXWGwG~iGGG G
XWUG{GwGGGG G
XXUGlkpkGkVsGG G
XYUGzGiVjG
XZUG{GzGzG
X[UGlUGpGhG
X\UGzwrGsGhG
X]UzwkpmGsGhG
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Cool13,000k°K X=0.276 (±0.03)
Medium9,300k°K X=0.290 (±0.03)
Warm6,500k°K X=0.318 (±0.03)
CoolMin : 80Typ : 110<Test Signal>
MediumMin : 80Typ : 110
WarmMin : 70Typ : 110
Y=0.275 (±0.03)
Y=0.298 (±0.03)
Y=0.334 (±0.03)
<Test Signal>
Inner pattern
(204gray,80IRE)
Inner pattern
(204gray,80IRE)
heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.
ance".
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yTjGG][G G
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{TwGGvuG G
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4.5. DPM Operation check
■ Measurement Condition: 100~240V@ 50/60Hz
1) Set Input to RGB-PC and connect D-sub cable to set –
RGB Mode. Set Input to HDMI(with Input Label set to PC)
and connect HDMI cable to set – HDMI Mode
2) Cut off H sync or V sync of signal.
3) Check DPM operation refer to the below table.
Operating ConditionSync
Power S/W On Sleep mode -
RGB,HDMI
(H/V)
Off/OffOffAmber1
VideoLED
(SET)
Wattage
4.6. Model Name & SW Version & Adjust
check.
* Press the ‘Instart’ key of ADJ remote controller
4.6.1. Model Name& SW Version Check
1) Check ‘Model Name’.
2) Check ‘S/W Version’ (Refer to the IC Ver. in the BOM)
4.6.2. Adjust Check
1) Check ‘Country Group’
2) Check ‘Area Option’
3) Check ‘Tool Option’ (Refer to the BOM Comments)
4) Check ‘Adjust ADC[Comp&RGB]’ is OK.
5) Check ‘EDID[RGB&HDMI]’ is OK.
* After check all, Press the 'EXIT' key of ADJ remote controller
to go out SVC menu.
(W)
* When doing Adjustment, Please make circumstance as
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX65374703_29"_Brazil
NC4_S7LRM
MAIN1_NON_EU
2013.05.28
1 12
Page 23
MODEL OPTION
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX65374701_29"_Brazil
NC4_S7LRM
MAIN2_NON_EU
2013.05.06
2 12
Page 24
DSUB RGB
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2:E18
2:E18
DSUB_B+
DSUB_G+
DSUB_R+
11.10.31
To Improve EMI
121128
ESD improve
OPT->APPLY
DSUB_VSYNC
DSUB_HSYNC
75
R400
VA400
20V
R401
75
R402
75
To Improve Ringing issue
LOW capacitance Part apply
11.10.27
VA401
VA402
JP409
15
+5V_Normal
RGB_DDC_SCL
RGB_DDC_SDA
+3.3V_ST
VA417
20V
R418
R435
10K
B
47K
C
Q400
MMBT3904(NXP)
E
DSUB_DET
R434
47K
VA418
20V
121128
ESD improve
OPT->APPLY
JP410
SHILE D
16
D416
MMBD6100
A2
C
A1
R413
R408
10K
10K
VA415
20V
121128
ESD improve
JP400
JP401
5.5V
JP406
OPT->APPLY
JP407
JP405
GND_2
RED2GREEN3BLUE4GND_15DDC_G ND
GREEN _GND
RED_G ND
11
7
6
1
20V
121128
ESD improve
OPT->APPLY
5.5V
5.5V
VA403
VA406
JP408
DDC_D ATA
BLUE_ GND
12
8
JK400
SPG09-DB-010
121128
ESD improve
OPT->APPLY
DDC_C LOCK
V_SYN C
H_SYN C
NC10SYNC_ GND
14
13
9
USB(SIDE)
3AU04S-305-ZC-(LG)
JK402
1234
USB DOWN STR EAM
5
JP429
JP428
JP427
C400
0.1uF
VA424
121128
ESD improve
OPT->APPLY
IC400
AP2191DSG
NC
GND
8
1
OUT_2
IN_1
7
2
OUT_1
IN_2
6
3
FLG
EN
5
4
20V
VA425
121128
ESD improve
OPT->APPLY
20V
111026
ESD diode deletion
EAH39491601 2EA
120103
ESD diode addition
EAF61530301 2EA
USB_DM
USB_DP
USB_CTL
1:AL8
1:AL7
R417
10K
+5V_Normal
R419
47
C405
0.1uF
USB_OCD
RS232C(SIDE)
PM_TXD
PM_RXD
R414
100
R415
100
JP430
JP431
+3.3V_ST
P400
12507WS-04L
1
2
3
4
5
120918
JIG GND Point addition
JP_GND2
JP_GND3
JP_GND4JP_GND1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX65374701_29"_Brazil
NC4_S7LRM
INTERFACE
2013.05.06
4 12
Page 25
HDMI
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
CEC
HDMI_CEC
R520
100
CEC_REMOTE_S7
5V_HDMI_2
+5V_Normal
A2CA1
MMBD6100
D502
HDMI_2 With MHL
5V_HDMI_2
+3.3V_ST
OPT
VA505
R500
R522
2.7K
120915
47K->2.7K
DDC_SDA_2
DDC_SCL_2
R521
2.7K
R503
47K
47K
R501
10K
B
C
Q501
MMBT3904(NXP)
E
5V_DET_HDMI_2
SHIELD
20
19
18
17
16
15
14
13
12
11
10
EAG61491201
9
8
7
6
5
4
3
2
1
JK501
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
R528
1K
120825
ESD component addition
OPT
VA513
20V
OPT
VA510
20V
VA514
20V
10
9
8
7
6
10
9
8
7
6
MMBT3904(NXP)
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
OPT
(OPT)ESD_HDMI_SEMTECH(DEV)
D506
RCLAMP0524PA
1
2
3
4
5
(OPT)ESD_HDMI_SEMTECH(DEV)
D507
RCLAMP0524PA
1
2
3
4
5
C
Q505
B
E
120715
Added for ESD prevention
120825
OPT->APPLY
R529
10K
VA502
20V
TMDS_CH1-
TMDS_CH1+
TMDS_CH2-
TMDS_CH2+
D506-*1
IP4283CZ10-TBA
1
2
GND_1
3
4
5
ESD_HDMI_NXP
VA503
20V
DDC_SDA_2
DDC_SCL_2
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
TMDS_CH1-
TMDS_CH1+
TMDS_CH2-
TMDS_CH2+
IP4283CZ10-TBA
GND_1
ESD_HDMI_NXP
1
2
3
4
5
HPD2
D507-*1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NC_4
10
NC_3
9
GND_2
8
NC_2
7
NC_1
6
EAX65374701_29"_Brazil
NC4_S7LRM
HDMI5 12
2013.05.06
Page 26
IR/LED and Control
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Amber LED(Non M73):5.9mA
LED_RED
R600
10K
R677
OPT
LED_AMBER
10K
B
C
Q600
MMBT3904(NXP)
E
R602
10K
OPT
R678
10K
(IR Port protection against ESD)
IR
C
B
Q601
MMBT3904(NXP)
E
+3.3V_ST
+3.3V_ST
R604270
1/10W
1%
121018
100ohm->200ohm
KEY2
KEY1
KEY_SCL
KEY_SDA
+3.3V_ST
Red LED(Non M73):4.8mA
121118
R604,R610
2012->1608
R630
200
R610330
1/10W
1%
0424
50V
C601
1000pF
20V
D601
+3.3V_ST
R616
3.3K
R614
100
R615
100
R617
3.3K
12.07.17
Change D601~3
JP600
JP601
JP602
JP605
JP604
JP603
JP607
JP606
JP608
JP609
JP610
JP611
P600
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
Module
PIN22
0~0.7V
2.7~3.3V
+12V_PANEL_POWER
111116
100uF Ecap
Deletion
EAE38362801
VESA
JEDIA
PIN22(29"CMI)
0~0.7V
2.7~3.3V
PIN23
GND
NC
C605
0.1uF
16V
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
JEDIA
VESA
LGD
CMI
4.7K/10W*4ea 5.6/10W*2ea
5.6K
R624
P601
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
5.6K
R625
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX65374701_29"_Brazil
NC4_S7LRM
MODULE&CONTROL
JP612
2013.05.06
6 12
Page 27
AUDIO AMP
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
121118
R737 3K for SCART MUTE DEL
3K:
With SCART MUTE BLOCK
12K:
Without SCART MUTE BLOCK
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX65374701_29"_Brazil
NC4_S7LRM
AUDIO AMP7 12
2013.05.06
Page 28
KJA-DC-1-0032
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11.11.07
6604->6601
19V TO 5V DCDC CONVERTER
MULTI_ON
POWER_ON/OFF1
+19V
8
7
6
5
FB
VCC
EN/SYNC
BST
FB
VCC
EN/SYNC
BST
MULTI_ON
R807
68
C810
0.1uF
50V
R808
68
C811
0.1uF
50V
R810
10K
OPT
R811
20K
R812
100K
OPT
R813
20K
C814
0.1uF
16V
C815
0.1uF
16V
L802
10uH
R817
33K
L803
10uH
R818
33K
C818
10uF
16V
C819
22uF
6.3V
C820
10uF
16V
C821
10uF
OPT
+12V
R81 9
43K
C823
0.1uF
16V
C824
0.1uF
10V
16V
R82 0
100 K
R82 1
R82 5
5.1 K
R82 6
R82 7
1%
1%
10K
1%
+3.3V_ST
1%
27K
1%
10K
1%
IC801
AAM
IN
SW
GND
AAM
GND
IN
SW
MP2315GJ
1
2
NEW
3
3A
4
IC802
MP2315GJ
1
2
NEW
3
3A
4
8
7
6
5
C801
10uF
25V
+19V
OPT
C802
10uF
25V
C803
2.2uF
25V
C804
2.2uF
25V
JP801JK801
4
2
1
JP802
OPT
C851
68uF
35V
5/24 changed by Ryu rsqt Shin M.C
C807
0.1uF
50V
C808
0.1uF
50V
R804
47K
R805
47K
R828
100K1%
4.7K
POWER_ON/OFF1
R829
OPT
C828
0.47uF
IC806
16V
OPT
C827
2.2uF
25V
R830
100K
C829
0.1uF
50V
R832
47K
B
AAM
IN
SW
GND
+3.3V_ST
R835
22K
R833
100
C
Q803
MMBT3904(NXP)
E
MP2315GJ
1
2
NEW
3
3A
4
8
7
6
5
FB
VCC
EN/SYNC
BST
PMV48XP
Q804
C834
1uF
10V
R844
33K
L804
10uH
C839
OPT
0.1uF
R841
16V
20K
R840
68
C835
0.1uF
50V
+3.3V_Normal
S
G
D
C838
0.1uF
16V
C841
10uF
10V
C842
10uF
10V
C843
10uF
0.1uF
10V
IC808
AP2114H-2.5TRG1
VOUTVIN
GND
C845
16V
R84 6
R84 7
R84 8
47K
1%
33K
1%
15K
1%
+5V_Normal
+2.5V_Normal
C846
4.7uF
10V
OPT
0424
PANEL POWER CONTROL
+12V
22K
R802
R803
2.7K
R888
C
Q801
B
MMBT3904(NXP)
E
10K
PANEL_CTL
R801
4.7K
C805
1uF
25V
C806
2.2uF
25V
Q802
AO3407A
G
C809
0.1uF
50V
19V to 1.15V (M1 Core)
IC803
MP2315GJ
R806
47K
AAM
1
IN
2
NEW
SW
3
GND
3A
4
8
7
6
5
FB
VCC
EN/SYNC
BST
C813
0.1uF
+3.3V_Normal
R815
10K
50V
+3.3V_ST
R809
68
C812
0.1uF
50V
R814
20K
R816
82K
C816
0.1uF
16V
L801
10uH
C817
22uF
6.3V
C822
10uF
OPT
+1.15V_VDDC
R82 2
4.7 K
C825
0.1uF
10V
16V
R82 3
R82 4
1%
0
5%
10K
1%
3.3V TO 1.5V LDO
+3.3V_Normal
R834
10K
+1.8V_TUNER
C833
10uF
10V
NC_1
EN2
VIN3
NC4
IC807
TJ4220GDP-ADJ
1
9
2
THERMAL
3
4
8
7
6
5
[EP]GND
GND
ADJ/SENSE
VOUT
NC_2
C840
0.01uF
25V
0424
R842
R843
+1.5V_DDR
1%
10K
R845
1%
1K
1%
10K
C844
10uF
10V
OPT
0424
+3.3V_Normal
IC805
AP1117E18G-13
ADJ/GND
3IN1
2
C847
10uF
10V
OUT
IC809
TJ4220GDP-ADJ
NC_1
1
EN2
2
VIN3
3
NC4
4
+12V_PANEL_POWER
S
D
0424
OPT
R849
0
D801
SMAB34
40V
R831
9
THERMAL
C830
10uF
10V
1
8
7
6
5
C831
1uF
10V
[EP]GND
GND
ADJ/SENSE
0424
VOUT
NC_2
C848
0.01uF
25V
R1
R838
R839
2.7K
1%
30K
1%
R836
R2
+1.23V_TUNER
1%
1%
13K
4.7K
R837
C849
10uF
10V
OPT
04240424
C850
0.1uF
50V
OPT
Vo=0.8*(1+R2/R1)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX65374701_29"_Brazil
NC4_S7LRM
POWER
2013.05.28
8 12
Page 29
TOTAL LED DRIVER BLOCK
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX65374701_29"_Brazil
NC4_S7LRM
LED DRIVER
2013.05.28
11 12
Page 30
+1.5V_DDR
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L2606
UBW2012-121F
C2619
0.1uF
16V
0424
+3.3V_Normal
C2629
C2625
0.1uF
22uF
16V
6.3V
R26650
R2660
220
OPT
B
R2666
220
OPT
E
Q2660
MMBT3906(NXP)
OPT
C
TU_CVBS
EAX65374701_29"_Brazil
NC4_S7LRM
TUNER_NON_EU
2013.05.28
26 12
Page 32
COMPONENT&CVBS
Copyright ⓒ 2013 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
COMPONENT&CVBS
[GN]E-LUG
6A
PPJ234-05
JK2800
[GN]O-SPRING
5A
[GN]CONTACT
4A
[BL]E-LUG-S
7B
[BL]O-SPRING
5B
[RD]E-LUG-S
7C
[RD]O-SPRING_1
5C
[RD]CONTACT_1
4C
5D
[WH]O-SPRING
4E
[RD]CONTACT_2
5E
[RD]O-SPRING_2
6E
[RD]E-LUG
JP2810
JP2811
JP2814
JP2815
JP2812
JP2813
121017
Change
121128
Change
121017
Change
D2815
20V
OPT
D2818
D2816
5.6V
20V
121229
OPT -> APPLY for ESD
OPT
D2817
5.6V
5.6B
ZD2806
5.6B
ZD2807
5.6B
ZD2802
5.6B
ZD2803
5.6B
ZD2804
5.6B
ZD2805
R2825
470K
OPT
R2826
470K
OPT
R2822
R28 24
75
R28 23
75
75
R2832
C2837
1000pF
50V
OPT
C2838
1000pF
50V
OPT
10K
R2831
10K
R2834
12K
R2833
12K
COMP_L_IN
COMP_R_IN
+3.3V_Normal
R2837
10K
+3.3V_Normal
R2841
OPT
C2889
0.1uF
16V
OPT
C2888
0.1uF
16V
10K
R2838
R2842
1K
1K
COMP_Y+/AV_CVBS_IN
AV_CVBS_DET
COMP_Pb+
COMP_Pr+
COMP_DET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX65374701_29"_Brazil
NC4_S7LRM
COMP28 12
2013.05.06
Page 33
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