Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This document is applied to LJ31A / LD31R chassis LED TV
which is manufactu red in TV( or Mo nit or) Factory or is
produced on the basis of this data.
2. Designation
1) Th e adjust ment is a ccordin g to th e order w hich is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 110-240 V, 50/60 Hz
6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),
DDC Adjustment Jig equipment, Service remote control.
7) Push The "IN STOP KEY" – For memory initialization
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at rst.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”.
(4)
filexxx.bin
5) Click “Auto” tab and set as below.
6) Click “Run”.
7) After downloading, check “OK” message.
(5)
(5)
(7) ……….OK
* USB DOWNLOAD(*.epk file download)
1) Make New folder named “LG_DTV” and put ISP file(*.epk)
in the folder.
2) Put the USB Stick to the USB socket.
3) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work.
- Bu t your downloaded version is High, USB data is
automatically detecting
4) Show the message "Copying files from memory"
5) Updating is starting.
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot le Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig,
and set.
3) Click “Connect” tab. If display “Can’t”, Check connect
computer, jig, and set.
(1) (3)
Please Check the Speed :
Use the speed under
OK
Only for training and service purposes
200KHz.
6) Upd at in g Co mpleted, T he M ul ti-vision will re st ar t
automatically.
7) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1. Push "ADJ" key in service remote control.
2. Select "Tool Option 1" and push "OK" key.
3. Punch in the number. (Each model has their number.)
(1) Press "Power only" key of service remote control.
(2) Press the ADJ KEY on R/C and enter EZ ADJUST
(3) Enter EDID D/L mode by pushing "►" key at "11. EDID D/L".
(4) EDID download is executed automatically.
(5) Press EXIT key on service remote control.
<Caution>
- Never connect HDMI & D-sub Cable when download EDID.
- Download HDMI
* Edid data and Model option download (USB)
NOItemCMD 1 CMD 2 Data 0
Enter download
MODE
EDID data and
Model option
download
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option6
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L ►
14. Touch Sensitivity Setting
15. Ext. Input Adjust
16. SPK Lipsync Adjust
17.SPDIF Lipsync Adjust
Download
‘Mode In’
DownloadAE00 10 Automatically download
AA0 0 When transfer the ‘Mode
EDID D/L
HDMI OK
RGB OK
Reset
Start
In’, Carry the command.
(The use of a internal Data)
3.2. Function Check
3.2.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) RGB(PC : 1366 x 768 @ 60Hz)
5) HDMI(PC : 1366 x 768 @ 60Hz)
6) PC Audio In
* Display and Sound check is executed by Remote control
<Caution> Not to push the INSTOP key after completion if the
function inspection.
4. Total Assembly line process
4.1. Tool option & ADC Check
(1) Press "Power on" key of service remote control.
(2) Connect USB Port → USB to Serial Adapter (UC-232A) →
RS-232C cable → PC(RS-232C port)
(3) Write Model Name & Serial Number by use USB Port.
(4) Must check the serial number at the Customer Support
menu. (Refer to below.)
3.1.2. RGB EDID Data
(1) All models without 29MN33D(Product ID: 22984/HEXA: 59C8)
*(week), **(year), ***(Check sum) : Adjustable Data
1) Press "Power on" key of service remote control.
2) Connect RS232 Signal Cable to RS-232 Jack.
3) Write Model Name & Serial Number by use RS-232.
4) Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below.)
4.2.2. Method & notice
(1) Model Name & Serial Number D/L is using of scan equipment.
(2) Setting of scan equipment operated by Manufacturing
Technology Group.
(3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0.
*Manual Download (Model Name and Serial Number)
If the TV set is downloaded By OTA or Service man,
Sometimes model name or serial number is initialized. (Not
always) There is impossible to download by bar code scan,
so It need Manual download.
1) Press the 'Instart' key of ADJ remote control.
2) Go to the menu '6.Model Number D/L' like below photo.
3) Input the Factory model name(ex 24LN4500) or Serial
number like photo.
4) Check the model name Instart menu → Factory name
displayed (ex 24LN4500)
5) Check the Diagnostics (DTV country only) → Buyer
■ Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) RGB(PC : 1366 x 768 @ 60Hz)
5) HDMI(PC : 1366 x 768 @ 60Hz)
6) PC Audio In
* Display and Sound check is executed by Remote control
* Caution : Not to push the INSTOP KEY after completion if
the function inspection.
4.3.2. PIP Check
(1) Press “Power on” key of service remote control.
(2) Input RGB & TV(ATV or DTV) signal.
(3) Set Input mode to RGB.
(4) Press ‘PIP” key of ADJ remote control
(5) Check TV Video & Audio signal of Sub picture.
4.3.3. HDMI MHL function Inspection(HDMI2 port only)
(1) Insert HDMI cable for MHL function JIG connected to
HDMI2 port of the SET.
(2) Check that LED of JIG is green light and check that set
screen is correctly worked.
(3) If NG situation or other HDMI jack connection, LED of JIG
is red light and screen is not displayed.
4.4. White balance adjustment
- Equipment
(1) Color Analyzer: CA-210 (LED Module : CH 14)
(2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
(3) Adjust Remote control
RGB Gains are fixed data for each model.
Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
→ Total Assembly line should be check whether the color
coordinate(x,y) data refer to below table were meet or not.
- Cool Panel
Cool13,000K
Color
Temperature
Medium9,300K
Warm6,500K
Luminance
(cd/m²)
CoolMin : 80K Typ : 110
Medium Min : 80K Typ : 110
WarmMin : 70 K Typ : 110
* Note : x,y coordinates are drifted about 0.007 after 30 mins
heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.
* Note : Manual W/B process using adjusts Remote control.
1) After enter Service Mode by pushing "ADJ" key,
2) Enter "White Balance" by pushing "►" key at "White
Balance".
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option6
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12 EDID D/L
13. Sub B/C
14. Touch Sensitivity Setting
15. Ext. Input Adjust
16. SPK Lipsync Adjust
17.SPDIF Lipsync Adjust
* When doing Adjustment, Please make circumstance as
■ Measurement Condition: 100-240V@ 50/60Hz
(1) Set Input to RGB-PC and connect D-sub cable to set -
RGB Mode.
Set Input to HDMI(with Input Label set to PC) and connect
HDMI cable to set - HDMI Mode
(2) Cut off H sync or V sync of signal.
(3) Check DPM operation refer to the below table.
Operating ConditionSync(H/V) Video LED(SET) Wattage(W)
Power S/W On
■ HDMI DPM Operating condition
- Input Label: HDMI (PC&DVI Mode)
Sleep mode -
RGB, HDMI
DPMXO
Off/OffOffAmber1
MHL CableHDMI & HDMI to DVI Cable
4.6. Model name & SW version & Adjust check
* Press the ‘Instart’ key of ADJ remote control.
4.6.1. Model Name& SW Version Check
(1) Check ‘Model Name’.
(2) Check ‘S/W Version’ (Refer to the IC Ver. in the BOM)
4.6.2. Adjust Check
(1) Check ‘Country Group’
(2) Check ‘Area Option’
(3) Check ‘Tool Option’ (Refer to the BOM Comments)
(4) Check ‘Adjust ADC[Comp&RGB]’ is OK.
(5) Check ‘EDID[RGB&HDMI]’ is OK.
* After check all, Press the 'EXIT' key of ADJ remote control to
go out SVC menu.
4.7. Outgoing condition Configuration
* After all function test, press IN-STOP key by SVC Remote
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
11.10.27
To Improve Ringing issue
LOW capacitance Part apply
PM_TXD
PM_RXD
VA408
20V
OPT
VA401
20V
121128
ESD improve
OPT->APPLY
JP400
JP401
R429 0
R427 0
R426 0
5.5V
5.5V
VA402
VA403
VA406
Hotel_Model(RS232C apply)
C402
0.33uF
16V
Hotel_Model(RS232C apply)
RIN 2
DOU T2
6V-5
8
7
IC401
MAX3232CDR
Hotel_Model(RS232C apply)
11
9
10
DIN 1
DIN 2
ROU T2
NON_Hotel_Model(RS232C Bypass)
NON_Hotel_Model(RS232C Bypass)
VA410
20V
OPT
JP412
R408
10K
OPT
OPT
C401
C403
18pF
18pF
50V
50V
121128
ESD improve
OPT->APPLY
JP407
JP405
JP406
5.5V
Hotel_Model(RS232C apply)
C406
0.33uF
16V
C2-
C2+
4
3
12
13
14
RIN 1
ROU T1
R410
0
R412
0
R415
100
R414
100
JP413
D416
MMBD6100
A2
C
A1
R413
10K
20V
JP408
H_SYN C
DDC_D ATA
BLUE_ GND
GND_2
RED2GREEN3BLUE4GND_15DDC_G ND
GREEN _GND
RED_G ND
13
12
11
8
7
6
1
JK400
SPG09-DB-010
C407
0.33uF
16V
C408
0.1uF
16V
Hotel_Model(RS232C apply)
C1-2V+
1
15
GND16VCC
DOU T1
VA411
20V
VA412
20V
JP414
+3.3V_ST
0
OPT
R420
VA415
121128
ESD improve
OPT->APPLY
VA417
20V
JP409
R431
0
OPT
DDC_C LOCK
V_SYN C
NC10SYNC_ GND
JP410
15
14
SHILE D
16
9
+3.3V_ST
C1+
Hotel_Model(RS232C apply)
C409
0.1uF
16V
(OPT)IR_OUT
R416
0
+5V_Normal
R421
+3.3V_ST
VA418
20V
121128
ESD improve
OPT->APPLY
0
R434
47K
IR_OUT
OPT
R403
R435
10K
PC AUDIO(SIDE)
+3.3V_Normal
R407
12.08.10
470K
47K->470K
RGB_DDC_SCL
RGB_DDC_SDA
OPT
R405
0
0
PM_RXD
PM_TXD
DSUB_DET
OPT
R406
OPT
12.07.02
R404
B
0
R418
47K
C
Q400
MMBT3904(NXP)
E
BY.Hwang
0
KJA-PH-1-0177
JK401
6 M6
1 M1
3 M3_DETECT
4 M4
5 M5_GND
JP411
JP402
JP404
JP403
VA407
OPT
VA419
VA420
20V
R444
15K
C414
220pF
20V
50V
C413
220pF
20V
50V
R442
470K
OPT
R445
15K
R441
470K
OPT
R446
10K
R447
10K
R409
1K
PC_AUDIO_DET
PC_R_IN
PC_L_IN
USB(SIDE)
3AU04S-305-ZC-(LG)
JK402
1234
USB DOWN STR EAM
5
JP429
JP428
JP427
C400
0.1uF
VA424
121128
ESD improve
OPT->APPLY
IC400
AP2191DSG
NC
GND
8
1
OUT_2
IN_1
7
2
OUT_1
IN_2
6
FLG
5
3
EN
4
USB_DM
USB_DP
111026
ESD diode deletion
EAH39491601 2EA
120103
ESD diode addition
EAF61530301 2EA
USB_CTL
1:AL8
1:AL7
C404
10uF
10V
OPT
20V
VA425
121128
ESD improve
OPT->APPLY
20V
R417
10K
R419
47
+5V_USB
USB_OCD
C405
0.1uF
ETHERNET
111026
+3.3V_ST
P400
12507WS-04L
1
2
3
4
5
MAIN(ETHERNET)
JK403-*1
RJ45VT-01SN002
1
2
3
4
5
6
7
8
9
9
LAN Jack deletion
111117
LAN Jack Addition for T2
SUB(ETHERNET_XMULTIPLE(MP))
JK403
XRJV-01V-0-D12-080
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
9
9
C410
0.01uF
50V
LAN JACK
+3.3V_Normal
R411
0
LAN JACK
LAN JACK
LAN JACK
ZD400
5.6B
5.6B
ZD401
EPHY_TP
EPHY_TN
EPHY_RP
EPHY_RN
5.5V
OPT
VA405
5.5V
OPT
VA409
5.5V
OPT
VA426
5.5V
OPT
VA404
Jack Shield (HDMI1, HDMI2, RGB)
JackShield(for NonCKD)
M1
MGJ63348201
120918
JIG GND Point addition
JP_GND3
JP_GND1
JP_GND2
JP_GND4
JackShield(for CKD)
M1-*1
MGJ63348202
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
121118
R737 3K for SCART MUTE DEL
3K:
With SCART MUTE BLOCK
12K:
Without SCART MUTE BLOCK
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
121118
SS BEAD->SUNLORD BEAD
L3707
C3707
100pF
50V
IF_AGC_MAIN
R3741-*3
2.2K
BR(TU_IIC_2.2K)
R3740-*3
2.2K
BR(TU_IIC_2.2K)
R3740-*1
1K
ASIA(TU_IIC_NON_ATSC_1K)
R3741-*1
1K
ASIA(TU_IIC_NON_ATSC_1K)
R3775
0
BR(TU_NON_BUFFER_SIF)
TU_SCL
(OPT)TU_BUFFER_SIF
TU_SDA
+3.3V_TU
BR(TU_BUFFER_VIDEO)
0
R3750
1K
OPT
+3.3V_TU
C3708
0.1uF
16V
C3706
100uF
16V
OPT
R3753
4.7K
R3751
220
B
E
C
+3.3V_TU
R3774
470
(OPT)TU_BUFFER_SIF
E
Q3705
MMBT3906(NXP)
(OPT)TU_BUFFER_SIF
B
C
R3752
220
BR(TU_BUFFER_VIDEO)
Q3703
MMBT3906(NXP)
BR(TU_BUFFER_VIDEO)
R3758
82
BR
TU_SIF
TU_CVBS
121118
TU3700-*1 TDSS-H101F DEL
TU3700-*2 TDSS-G501D ->TU3700-*1
TUNER MULTI-OPTION
ASIA,M33 (WO AD)
TU3700-*1
TDSS-G501D(B)
(ASIA_M33)SI2176_ATSC_1INPUT_H
NC_1
1
RESET
2
SCL
3
SDA
4
3.3V
5
NC_2
6
1.8V
7
NC_3
8
IF_AGC
9
DLIF_[P]
10
DLIF_[N]
11
B1
B1
A1
A1
12
SHIELD
TAIWAN (WITH AD)
TU3704-*1
TDSN-T601F
(OPT)SI2178_TW_2INPUT_H
B1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX65077302
NC4_S7LRM
COMP28 12
2012.11.18
Page 30
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